AP9567GH/J-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
P-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Lower On-resistance
D
▼ Simple Drive Requirement
▼ Fast Switching Characteristic
▼ RoHS Compliant & Halogen-Free
BVDSS
-40V
RDS(ON)
50mΩ
ID
G
-22A
S
Description
AP9567 series are from Advanced Power innovated design and silicon
process technology to achieve the lowest possible on-resistance and
fast switching performance. It provides the designer with an extreme
efficient device for use in a wide range of power applications.
The TO-252 package is widely preferred for all commercial-industrial
surface mount applications using infrared reflow technique and suited
for high current application due to the low connection resistance. The
through-hole version (AP9567GJ) are available for low-profile
applications.
G
D
S
TO-252(H)
G
D
S
TO-251(J)
Absolute Maximum Ratings@Tj=25oC(unless otherwise specified)
Parameter
Symbol
Rating
Units
VDS
Drain-Source Voltage
-40
V
VGS
Gate-Source Voltage
+25
V
ID@TC=25℃
Drain Current, VGS @ 10V
-22
A
ID@TC=100℃
Drain Current, VGS @ 10V
-14
A
-50
A
1
IDM
Pulsed Drain Current
PD@TC=25℃
Total Power Dissipation
34.7
W
Linear Derating Factor
0.28
W/℃
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Rthj-c
Parameter
Maximum Thermal Resistance, Junction-case
Rthj-a
Maximum Thermal Resistance, Junction-ambient (PCB mount)
Rthj-a
Maximum Thermal Resistance, Junction-ambient
Data and specifications subject to change without notice
3
Value
Units
3.6
℃/W
62.5
℃/W
110
℃/W
1
201501274
AP9567GH/J-HF
o
Electrical Characteristics@Tj=25 C(unless otherwise specified)
Symbol
Parameter
Test Conditions
VGS=0V, ID=-250uA
Min.
Typ.
Max. Units
-40
-
-
V
BVDSS
Drain-Source Breakdown Voltage
ΔBVDSS/ΔTj
Breakdown Voltage Temperature Coefficient Reference to 25℃, ID=-1mA
-
-0.03
-
V/℃
RDS(ON)
Static Drain-Source On-Resistance 2
VGS=-10V, ID=-15A
-
-
50
mΩ
VGS=-4.5V, ID=-8A
-
-
70
mΩ
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=-250uA
-1
-
-3
V
gfs
Forward Transconductance
VDS=-10V, ID=-15A
-
15
-
S
IDSS
Drain-Source Leakage Current
VDS=-40V, VGS=0V
-
-
-1
uA
Drain-Source Leakage Current (T j=125 C) VDS=-32V, VGS=0V
-
-
-250
uA
Gate-Source Leakage
VGS=+25V, VDS=0V
-
-
+100
nA
ID=-15A
-
12
19
nC
o
IGSS
2
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=-32V
-
2.5
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=-4.5V
-
7
-
nC
2
td(on)
Turn-on Delay Time
VDS=-20V
-
7
-
ns
tr
Rise Time
ID=-15A
-
30
-
ns
td(off)
Turn-off Delay Time
RG=1Ω
-
23
-
ns
tf
Fall Time
VGS=-10V
-
8
-
ns
Ciss
Input Capacitance
VGS=0V
-
880
1400
pF
Coss
Output Capacitance
VDS=-25V
-
140
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
110
-
pF
Rg
Gate Resistance
f=1.0MHz
-
5
8
Ω
Min.
Typ.
IS=-15A, VGS=0V
-
-
-1.2
V
Source-Drain Diode
Symbol
VSD
Parameter
Forward On Voltage
2
2
Test Conditions
Max. Units
trr
Reverse Recovery Time
IS=-10A, VGS=0V,
-
26
-
ns
Qrr
Reverse Recovery Charge
dI/dt=-100A/µs
-
22
-
nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
2
3.Surface mounted on 1 in copper pad of FR4 board
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP9567GH/J-HF
50
60
-10V
-7.0V
-6.0V
-5.0V
T C = 25 C
-ID , Drain Current (A)
50
40
40
V G = - 4.0V
30
-10V
-7.0V
-6.0V
-5.0V
T C = 150 o C
-ID , Drain Current (A)
o
20
30
V G =-4.0V
20
10
10
0
0
0
2
4
6
8
0
-V DS , Drain-to-Source Voltage (V)
2
4
6
8
-V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
64
1.8
I D = -8 A
I D =-15A
V G =-10V
T C =25 o C
60
Normalized RDS(ON)
RDS(ON) (mΩ )
1.5
56
52
48
1.2
0.9
44
0.6
40
2
4
6
8
-50
10
0
50
100
150
T j , Junction Temperature ( o C)
-V GS , Gate-to-Source Voltage (V)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
16
1.4
1.2
T j =150 o C
Normalized VGS(th)
-IS(A)
12
T j =25 o C
8
1
0.8
4
0.6
0
0.4
0
0.2
0.4
0.6
0.8
1
1.2
-V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.4
-50
0
50
100
150
o
T j , Junction Temperature ( C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP9567GH/J-HF
V DS =-32V
I D =-15A
8
1200
C (pF)
-VGS , Gate to Source Voltage (V)
f=1.0MHz
1600
10
6
C iss
800
4
400
2
C oss
C rss
0
0
0
5
10
15
20
25
1
5
9
13
17
21
25
29
-V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
100us
-ID (A)
10
1ms
10ms
100ms
1s
DC
1
T c =25 o C
Single Pulse
0.1
Normalized Thermal Response (Rthjc)
Duty factor=0.5
Operation in this area
limited by RDS(ON)
0.2
0.1
0.1
0.05
PDM
0.02
t
T
0.01
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01
0.1
1
10
100
0.00001
0.0001
-V DS , Drain-to-Source Voltage (V)
0.001
0.01
0.1
1
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
40
VG
V DS =-5V
-ID , Drain Current (A)
30
QG
T j =25 o C
-4.5V
T j =150 o C
QGS
20
QGD
10
Charge
Q
0
0
2
4
6
8
-V GS , Gate-to-Source Voltage (V)
Fig 11. Transfer Characteristics
Fig 12. Gate Charge Waveform
4
AP9567GH/J-HF
MARKING INFORMATION
TO-251
9567GJ
Part Number
meet Rohs requirement
for low voltage MOSFET only
Package Code
YWWSSS
Date Code (YWWSSS)
Y：Last Digit Of The Year
WW：Week
SSS：Sequence
TO-252
9567GH
Part Number
meet Rohs requirement
for low voltage MOSFET only
Package Code
YWWSSS
Date Code (YWWSSS)
Y：Last Digit Of The Year
WW：Week
SSS：Sequence
5