Fairchild MOC3051TM 6-pin dip random-phase optoisolators triac drivers (600 volt peak) Datasheet

6-PIN DIP RANDOM-PHASE
OPTOISOLATORS TRIAC DRIVERS
(600 VOLT PEAK)
MOC3051-M
MOC3052-M
PACKAGE
SCHEMATIC
ANODE 1
6 MAIN TERM.
6
6
5 NC*
CATHODE 2
1
N/C 3
1
4 MAIN TERM.
*DO NOT CONNECT
(TRIAC SUBSTRATE)
6
1
DESCRIPTION
The MOC3051-M and MOC3052-M consist of a AlGaAs infrared emitting diode optically coupled to a non-zero-crossing silicon
bilateral AC switch (triac). These devices isolate low voltage logic from 115 and 240 Vac lines to provide random phase control of
high current triacs or thyristors. These devices feature greatly enhanced static dv/dt capability to ensure stable switching performance of inductive loads.
FEATURES
•
•
•
•
•
Excellent IFT stability—IR emitting diode has low degradation
High isolation voltage—minimum 7500 peak VAC
Underwriters Laboratory (UL) recognized—File #E90700
600V peak blocking voltage
VDE recognized (File #94766)
- Ordering option V (e.g. MOC3052V-M)
APPLICATIONS
•
•
•
•
•
•
•
•
Solenoid/valve controls
Lamp ballasts
Static AC power switch
Interfacing microprocessors to 115 and 240 Vac peripherals
Solid state relay
Incandescent lamp dimmers
Temperature controls
Motor controls
© 2005 Fairchild Semiconductor Corporation
Page 1 of 11
6/15/05
6-PIN DIP RANDOM-PHASE
OPTOISOLATORS TRIAC DRIVERS
(600 VOLT PEAK)
MOC3051-M
MOC3052-M
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Parameters
Symbol
Device
Value
Units
Storage Temperature
TSTG
All
-40 to +150
°C
Operating Temperature
TOPR
All
-40 to +85
°C
Lead Solder Temperature
TSOL
All
260 for 10 sec
°C
TJ
All
-40 to +100
°C
VISO
All
7500
Vac(pk)
PD
All
330
mW
4.4
mW/°C
Continuous Forward Current
IF
All
60
mA
Reverse Voltage
VR
All
3
V
PD
All
Off-State Output Terminal Voltage
VDRM
All
Peak Repetitive Surge Current (PW = 100 ms, 120 pps)
ITSM
All
TOTAL DEVICE
Junction Temperature Range
Isolation Surge Voltage(3) (peak AC voltage, 60Hz, 1 sec duration)
Total Device Power Dissipation @ 25°C
Derate above 25°C
EMITTER
Total Power Dissipation 25°C Ambient
Derate above 25°C
100
mW
1.33
mW/°C
600
V
DETECTOR
Total Power Dissipation @ 25°C Ambient
PD
Derate above 25°C
© 2005 Fairchild Semiconductor Corporation
Page 2 of 11
All
1
A
300
mW
4
mW/°C
6/15/05
6-PIN DIP RANDOM-PHASE
OPTOISOLATORS TRIAC DRIVERS
(600 VOLT PEAK)
MOC3051-M
MOC3052-M
ELECTRICAL CHARACTERISTICS (TA = 25°C Unless otherwise specified)
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameters
Test Conditions
Symbol Device
Min
Typ*
Max
Units
EMITTER
IF = 10 mA
VF
All
1.15
1.5
V
VR = 3 V
IR
All
0.05
100
µA
Peak Blocking Current, Either Direction
VDRM, IF = 0 (note 1)
IDRM
All
10
100
nA
Peak On-State Voltage, Either Direction
ITM = 100 mA peak, IF = 0
VTM
All
1.7
2.5
V
Critical Rate of Rise of Off-State Voltage
IF = 0 (figure 7, @400V)
dv/dt
All
Input Forward Voltage
Reverse Leakage Current
DETECTOR
1000
V/µs
TRANSFER CHARACTERISTICS (TA = 25°C Unless otherwise specified.)
DC Characteristics
Test Conditions
Symbol
LED Trigger Current,
either direction
Main terminal
Voltage = 3V (note 2)
IFT
Holding Current, Either Direction
IH
Device
Min
Typ*
Max
MOC3051-M
15
MOC3052-M
10
All
280
Units
mA
µA
*Typical values at TA = 25°C
Note
1. Test voltage must be applied within dv/dt rating.
2. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies
between max 15 mA for MOC3051, 10 mA for MOC3052 and absolute max IF (60 mA).
3. Isolation surge votlage, VISO, is an internal device breakdown rating. For this text, pins 1 and 2 are common, and pins 4, 5 and
6 are common.
© 2005 Fairchild Semiconductor Corporation
Page 3 of 11
6/15/05
6-PIN DIP RANDOM-PHASE
OPTOISOLATORS TRIAC DRIVERS
(600 VOLT PEAK)
MOC3051-M
MOC3052-M
Figure. 2 On-State Characteristics
800
1.7
600
ON-STATE CURRENT - ITM (mA)
VF - FORWARD VOLTAGE (V)
Figure. 1 LED Forward Voltage vs. Forward Current
1.8
1.6
1.5
1.4
TA = -55oC
1.3
TA = 25oC
1.2
400
200
0
-200
-400
TA = 100oC
-600
1.1
-800
-3
1.0
1
10
-2
100
-1
0
1
2
3
ON-STATE VOLTAGE - VTM (V)
IF - LED FORWARD CURRENT (mA)
Figure. 4 LED Current Required to Trigger vs. LED Pulse Width
Figure. 3 Trigger Current vs. Ambient Temperature
IFT, NORMALIZED LED TRIGGER CURRENT
1.4
TRIGGER CURRENT - I FT (NORMALIZED)
1.3
1.2
1.1
1.0
0.9
25
NORMALIZED TO:
PWin ≥ 100 µs
20
15
10
5
0
1
2
5
10
20
50
100
0.8
PWin, LED TRIGGER PULSE WIDTH (µs)
0.7
NORMALIZED TO TA = 25°C
0.6
-40
-20
0
20
40
60
80
100
AMBIENT TEMPERATURE - TA (oC)
IF versus Temperature (normalized)
This graph (figure 3) shows the increase of the trigger current
when the device is expected to operate at an ambient temperature below 25°C. Multiply the normalized IFT shown this graph
with the data sheet guaranteed IFT.
Example:
TA = -40°C, IFT = 10 mA
IFT @ -40°C = 10 mA x 1.4 = 14 mA
IFT in the graph IFT versus (PW) is normalized in respect to the
minimum specified IFT for static condition, which is specified in
the device characteristic. The normalized IFT has to be multiplied with the devices guaranteed static trigger current.
Phase Control Considerations
LED Trigger Current versus PW (normalized)
Random Phase Triac drivers are designed to be phase controllable. They may be triggered at any phase angle within the AC
© 2005 Fairchild Semiconductor Corporation
sine wave. Phase control may be accomplished by an AC line
zero cross detector and a variable pulse delay generator which
is synchronized to the zero cross detector. The same task can
be accomplished by a microprocessor which is synchronized
to the AC zero crossing. The phase controlled trigger current
may be a very short pulse which saves energy delivered to the
input LED. LED trigger pulse currents shorter than 100 µs must
have an increased amplitude as shown on Figure 4. This graph
shows the dependency of the trigger current IFT versus the
pulse width can be seen on the chart delay t(d) versus the LED
trigger current.
Example:
Guaranteed IFT = 10 mA, Trigger pulse width PW = 3 µs
IFT (pulsed) = 10 mA x 5 = 50 mA
Page 4 of 11
6/15/05
6-PIN DIP RANDOM-PHASE
OPTOISOLATORS TRIAC DRIVERS
(600 VOLT PEAK)
MOC3051-M
MOC3052-M
Minimum LED Off Time in Phase Control
Applications
AC SINE
In Phase control applications one intends to be able to control
each AC sine half wave from 0 to 180 degrees. Turn on at zero
degrees means full power and turn on at 180 degree means
zero power. This is not quite possible in reality because triac
driver and triac have a fixed turn on time when activated at
zero degrees. At a phase control angle close to 180 degrees
the driver’s turn on pulse at the trailing edge of the AC sine
wave must be limited to end 200 ms before AC zero cross as
shown in Figure 5. This assures that the triac driver has time
to switch off. Shorter times may cause loss of control at the
following half cycle.
180°
0ϒ
LED PW
LED CURRENT
LED TURN OFF MIN 200 µs
Figure 5. Minimum Time for LED Turn–Off to Zero
Cross of AC Trailing Edge
Figure. 7 Leakage Current, I DRM vs. Temperature
10000
IDRM, LEAKAGE CURRENT (nA)
Figure. 6 Holding Current, I H vs. Temperature
IH, HOLDING CURRENT (mA)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
1000
100
10
1
0.1
0
- 40 - 30 - 20 -10
0
10
20
30
40
50
60
70
80
0.1
-40
TA , AMBIENT TEMPERATURE (oC)
-20
0
20
40
60
80
100
TA , AMBIENT TEMPERATURE (oC)
IFT versus dv/dt
IFT, LED TRIGGER CURRENT (NORMALIZED)
Figure. 8 LED Trigger Current, I FT vs. dv/dt
1.5
1.4
NORMALIZED TO:
IFT at 3 V
1.3
1.2
1.1
Triac drivers with good noise immunity (dv/dt static) have internal noise rejection circuits which prevent false triggering of the
device in the event of fast raising line voltage transients. Inductive loads generate a commutating dv/dt that may activate the
triac drivers noise suppression circuits. This prevents the
device from turning on at its specified trigger current. It will in
this case go into the mode of “half waving” of the load. Half
waving of the load may destroy the power triac and the load.
1
Figure 8 shows the dependency of the triac drivers IFT versus
the reapplied voltage rise with a Vp of 400 V. This dv/dt condition simulates a worst case commutating dv/dt amplitude.
0.9
0.8
0.7
0.6
0.5
0.001
0.01
0.1
1
10
dv/dt (V/ µs)
© 2005 Fairchild Semiconductor Corporation
100
1000
10000
It can be seen that the IFT does not change until a commutating dv/dt reaches 1000 V/ms. The data sheet specified IFT is
therefore applicable for all practical inductive loads and load
factors.
Page 5 of 11
6/15/05
6-PIN DIP RANDOM-PHASE
OPTOISOLATORS TRIAC DRIVERS
(600 VOLT PEAK)
MOC3051-M
MOC3052-M
t(delay), t(f) versus IFT
Figure 9. Delay Time, t(d), and Fall Time, t(f),
vs. LED Trigger Current
The triac driver’s turn on switching speed consists of a turn on
delay time t(d) and a fall time t(f). Figure 9 shows that the delay
time depends on the LED trigger current, while the actual
trigger transition time t(f) stays constant with about one micro
second.
t(delay) AND t(fall) (µ s)
100
t(d)
10
t(f)
1
0.1
10
The delay time is important in very short pulsed operation
because it demands a higher trigger current at very short
trigger pulses. This dependency is shown in the graph IFT
versus LED PW.
20
30
40
50
The turn on transition time t(f) combined with the power triac’s
turn on time is important to the power dissipation of this
device.
60
I FT, LED TRIGGER CURRENT (mA)
SCOPE
ZERO CROSS
DETECTOR
IFT
115 VAC
VTM
EXT. SYNC
+400
Vdc
FUNCTION
GENERATOR
t(d)
RTEST
t(f)
R = 1 kΩ
Vout
PULSE
INPUT
APPLIED VOLTAGE
WAVEFORM
MERCURY
WETTED
RELAY
CTEST
D.U.T.
ISOL. TRANSF.
10 kΩ
X100
SCOPE
PROBE
τRC
Figure 10. Static dv/dt Test Circuit
© 2005 Fairchild Semiconductor Corporation
DUT
100 Ω
1. The mercury wetted relay provides a high speed repeated
pulse to the D.U.T.
252 V
dv/dt =
IFT
AC
Vmax = 400 V
0 VOLTS
VTM
PHASE CTRL.
PW CTRL.
PERIOD CTRL.
Vo AMPL. CTRL.
0.63 V
τRC
=
2
τ
2. 100x scope probes are used, to allow high speeds and
voltages.
3. The worst-case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current, then
removing the current. The variable RTEST allows the dv/dt to
be gradually increased until the D.U.T. continues to trigger
in response to the applied voltage pulse, even after the LED
current has been removed. The dv/dt is then decreased
until the D.U.T. stops triggering. τRC is measured at this
point and recorded.
Page 6 of 11
6/15/05
6-PIN DIP RANDOM-PHASE
OPTOISOLATORS TRIAC DRIVERS
(600 VOLT PEAK)
MOC3051-M
MOC3052-M
APPLICATIONS GUIDE
VCC
TRIAC DRIVER
RLED
POWER TRIAC
Basic Triac Driver Circuit
The new random phase triac driver family MOC3052-M and
MOC3051-M are very immune to static dv/dt which allows
snubberless operations in all applications where external
generated noise in the AC line is below its guaranteed dv/dt
withstand capability. For these applications a snubber circuit is
not necessary when a noise insensitive power triac is used.
Figure 11 shows the circuit diagram. The triac driver is directly
connected to the triac main terminal 2 and a series Resistor R
which limits the current to the triac driver. Current limiting
resistor R must have a minimum value which restricts the
current into the driver to maximum 1A.
AC LINE
R
CONTROL
Q
LOAD
RLED = (VCC - V F LED - V sat Q)/IFT
R = Vp AC line/ITSM
RET.
Figure 11. Basic Driver Circuit
R = Vp AC/ITM max rep. = Vp AC/1A
The power dissipation of this current limiting resistor and the
triac driver is very small because the power triac carries the
load current as soon as the current through driver and current
limiting resistor reaches the trigger current of the power triac.
The switching transition times for the driver is only one micro
second and for power triacs typical four micro seconds.
VCC
RLED
TRIAC DRIVER
POWER TRIAC
RS
R
AC LINE
MOV
CS
CONTROL
LOAD
Triac Driver Circuit for Noisy Environments
RET.
When the transient rate of rise and amplitude are expected to
exceed the power triacs and triac drivers maximum ratings a
snubber circuit as shown in Figure 12 is recommended. Fast
transients are slowed by the R-C snubber and excessive
amplitudes are clipped by the Metal Oxide Varistor MOV.
Typical Snubber values RS = 33 Ω, CS = 0.01 µF
MOV (Metal Oxide Varistor) protects triac and
driver from transient overvoltages >VDRM max.
Figure 12. Triac Driver Circuit for Noisy Environments
Triac Driver Circuit for Extremely Noisy Environments, as
specified in the noise standards IEEE472 and IEC255-4.
Industrial control applications do specify a maximum transient
noise dv/dt and peak voltage which is superimposed onto the
AC line voltage. In order to pass this environment noise test a
modified snubber network as shown in Figure 13 is recommended.
POWER TRIAC
VCC
RLED
TRIAC DRIVER
R
RS
MOV
AC LINE
CS
CONTROL
LOAD
RET.
Recommended snubber to pass IEEE472 and IEC255-4 noise tests
RS = 47 W, CS = 0.01 mF
Figure 13. Triac Driver Circuit for Extremely Noisy
Environments
© 2005 Fairchild Semiconductor Corporation
Page 7 of 11
6/15/05
6-PIN DIP RANDOM-PHASE
OPTOISOLATORS TRIAC DRIVERS
(600 VOLT PEAK)
MOC3051-M
MOC3052-M
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
0.350 (8.89)
0.320 (8.13)
Pin 1 ID
Pin 1 ID
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
Seating Plane
Seating Plane
0.260 (6.60)
0.240 (6.10)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.070 (1.77)
0.040 (1.02)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.008 (0.20)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
15°
0.390 (9.90)
0.332 (8.43)
0.100 [2.54]
0.035 (0.88)
0.012 (0.30)
0.020 (0.50)
0.016 (0.41)
0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.350 (8.89)
0.320 (8.13)
Pin 1 ID
0.070 (1.78)
0.260 (6.60)
0.240 (6.10)
Seating Plane
0.060 (1.52)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.200 (5.08)
0.115 (2.93)
0.030 (0.76)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.012 (0.30)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
NOTE
All dimensions are in inches (millimeters)
© 2005 Fairchild Semiconductor Corporation
Page 8 of 11
6/15/05
6-PIN DIP RANDOM-PHASE
OPTOISOLATORS TRIAC DRIVERS
(600 VOLT PEAK)
MOC3051-M
MOC3052-M
ORDERING INFORMATION
Option
Order Entry Identifier
S
Description
S
Surface Mount Lead Bend
SD
SR2
W
T
0.4" Lead Spacing
300
V
VDE 0884
300W
Surface Mount; Tape and reel
TV
VDE 0884, 0.4" Lead Spacing
3S
SR2V
VDE 0884, Surface Mount
3SD
SR2V
VDE 0884, Surface Mount, Tape & Reel
MARKING INFORMATION
1
MOC3051
2
X YY Q
6
V
3
4
5
Definitions
1
Fairchild logo
2
Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
One digit year code, e.g., ‘3’
5
Two digit work week ranging from ‘01’ to ‘53’
6
Assembly package code
*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are marked with
date code ‘325’ or earlier are marked in portrait format.
© 2005 Fairchild Semiconductor Corporation
Page 9 of 11
6/15/05
6-PIN DIP RANDOM-PHASE
OPTOISOLATORS TRIAC DRIVERS
(600 VOLT PEAK)
MOC3051-M
MOC3052-M
Carrier Tape Specifications
12.0 ± 0.1
4.5 ± 0.20
2.0 ± 0.05
0.30 ± 0.05
Ø1.5 MIN
4.0 ± 0.1
1.75 ± 0.10
11.5 ± 1.0
21.0 ± 0.1
9.1 ± 0.20
Ø1.5 ± 0.1/-0
10.1 ± 0.20
0.1 MAX
24.0 ± 0.3
User Direction of Feed
Reflow Profile (White Package, -M Suffix)
300
260°C
280
260
>245°C = 42 Sec
240
220
200
180
°C
Time above
183°C = 90 Sec
160
140
120
1.822°C/Sec Ramp up rate
100
80
60
40
33 Sec
20
0
0
60
120
180
270
360
Time (s)
© 2005 Fairchild Semiconductor Corporation
Page 10 of 11
6/15/05
6-PIN DIP RANDOM-PHASE
OPTOISOLATORS TRIAC DRIVERS
(600 VOLT PEAK)
MOC3051-M
MOC3052-M
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
© 2005 Fairchild Semiconductor Corporation
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
Page 11 of 11
6/15/05
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