MGCHIP MDD1051RH Single n-channel trench mosfet 150v, 28a, 46m(ohm) Datasheet

Single N-channel Trench MOSFET 150V, 28A, 46mΩ
ㄹ
Features
General Description



The MDD1051 uses advanced MagnaChip’s MOSFET
Technology, which provides high performance in on-state
resistance, fast switching performance and excellent
quality. MDD1051 is suitable device for Synchronous
Rectification For Server and general purpose applications.


VDS = 150V
ID = 28A @VGS = 10V
RDS(ON) (MAX)
< 46.0mΩ @VGS = 10V
100% UIL Tested
100% Rg Tested
D
G
S
Absolute Maximum Ratings (Ta = 25oC)
Characteristics
Drain-Source Voltage
Gate-Source Voltage
Symbol
Rating
Unit
VDSS
150
V
VGSS
±20
V
o
TC=25 C (Silicon Limited)
Continuous Drain Current (1)
28
ID
o
TC=100 C
18
Pulsed Drain Current
IDM
110
TC=25oC
Power Dissipation
A
70
PD
o
W
TC=100 C
28
Single Pulse Avalanche Energy (2)
Junction and Storage Temperature Range
EAS
50.0
TJ, Tstg
-55~150
mJ
o
C
Thermal Characteristics
Characteristics
Thermal Resistance, Junction-to-Ambient
Symbol
(1)
Thermal Resistance, Junction-to-Case
Apr. 2014. Version 1.0
1
Rating
RθJA
50
RθJC
1.8
Unit
o
C/W
MagnaChip Semiconductor Ltd.
MDD1051 – Single N-Channel Trench MOSFET 150V
MDD1051
Part Number
Temp. Range
MDD1051RH
o
-55~150 C
Package
Packing
Rohs Status
D-PAK
Tape & Reel
Halogen Free
Electrical Characteristics (TJ =25oC)
Characteristics
Symbol
Test Condition
Min
Typ
Max
Unit
Static Characteristics
Drain-Source Breakdown Voltage
BVDSS
ID = 250μA, VGS = 0V
150
-
-
Gate Threshold Voltage
VGS(th)
VDS = VGS, ID = 250μA
1.2
2.2
3.2
Drain Cut-Off Current
IDSS
VDS = 120V, VGS = 0V
-
-
1.0
Gate Leakage Current
IGSS
VGS = ±20V, VDS = 0V
-
-
±0.1
RDS(ON)
VGS = 10V, ID = 20A
-
37.0
46.0
mΩ
gfs
VDS = 10V, ID = 20A
-
30
-
S
-
19.6
-
-
5.2
-
Drain-Source ON Resistance
Forward Transconductance
V
μA
Dynamic Characteristics
Total Gate Charge
Qg(10V)
VDS = 75V, ID = 20A,
VGS = 10V
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
-
5.2
-
Input Capacitance
Ciss
-
1270
-
-
30
-
Reverse Transfer Capacitance
Crss
VDS = 40V, VGS = 0V,
f = 1.0MHz
nC
pF
Output Capacitance
Coss
-
385
-
Turn-On Delay Time
td(on)
-
15
-
-
10
-
-
20
-
-
5
-
-
0.80
1.3
-
73.0
-
ns
-
245.0
-
nC
Rise Time
Turn-Off Delay Time
Fall Time
tr
td(off)
VGS = 10V, VDS = 75V,
ID = 20A , RG = 3.0Ω
tf
ns
Drain-Source Body Diode Characteristics
Source-Drain Diode Forward Voltage
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
IS = 20A, VGS = 0V
IF = 20A, dl/dt = 100A/μs
V
Note :
1.
2.
Surface mounted FR-4 board by JEDEC (jesd51-7). Continuous current at TC=25℃ is silicon limited
EAS is tested at starting Tj = 25℃ , L = 1.0mH, IAS =10.0A, VDD = 50V, VGS = 10V
Apr. 2014. Version 1.0
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MagnaChip Semiconductor Ltd.
MDD1051 – Single N-Channel Trench MOSFET 150V
Ordering Information
60
VGS = 10V
6.0V
40
ID, Drain Current [A]
8.0V
Drain-Source On-Resistance [mΩ]
45
35
4.5V
30
25
4.0V
20
15
10
3.5V
55
50
45
40
VGS = 10V
35
30
25
5
3.0V
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
20
5.0
0
5
10
15
VDS, Drain-Source Voltage [V]
25
30
35
40
45
50
Fig.2 On-Resistance Variation with
Drain Current and Gate Voltage
Fig.1 On-Region Characteristics
200
2.4
※ Notes :
2.2
※ Notes :
180
1. VGS = 10 V
2. ID = 10.0 A
2.0
RDS(ON) [mΩ ],
Drain-Source On-Resistance
RDS(ON), (Normalized)
Drain-Source On-Resistance
20
ID, Drain Current [A]
1.8
1.6
1.4
1.2
1.0
0.8
0.6
ID = 10.0A
160
140
120
100
80
TJ = 25
60
℃
40
20
0.4
0.2
-50
0
-25
0
25
50
75
100
125
2
150
3
4
5
6
7
8
9
10
VGS, Gate to Source Volatge [V]
o
TJ, Junction Temperature [ C]
Fig.3 On-Resistance Variation with
Temperature
Fig.4 On-Resistance Variation with
Gate to Source Voltage
50
※ Notes :
45
※ Notes :
VGS = 0V
IDR, Reverse Drain Current [A]
VDS = 10V
ID, Drain Current [A]
40
35
30
TJ=25
℃
25
20
15
10
1
10
TJ=25
℃
0
10
5
0
0
1
2
3
4
5
6
0.3
7
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
VSD, Source-Drain voltage [V]
VGS, Gate-Source Voltage [V]
Fig.5 Transfer Characteristics
Apr. 2014. Version 1.0
0.4
Fig.6 Body Diode Forward Voltage
Variation with Source Current and
Temperature
3
MagnaChip Semiconductor Ltd.
MDD1051 – Single N-Channel Trench MOSFET 150V
50
※ Note : ID = 20A
1400
VDS = 75V
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
Ciss
VGS, Gate-Source Voltage [V]
8
Capacitance [pF]
1200
6
4
1000
800
Coss
600
400
※ Notes ;
2
200
1. VGS = 0 V
2. f = 1 MHz
Crss
0
0
0
2
4
6
8
10
12
14
16
18
0
20
5
10
15
20
25
30
VDS, Drain-Source Voltage [V]
QG, Total Gate Charge [nC]
Fig.7 Gate Charge Characteristics
Fig.8 Capacitance Characteristics
30
10
27
2
24
10
1
10 ms
Operation in This Area
is Limited by R DS(on)
10
ID, Drain Current [A]
ID, Drain Current [A]
1 ms
100 ms
0
1s
10s
DC
Single Pulse
TJ=Max rated
TC=25
21
18
15
12
9
6
3
℃
10
-1
10
-1
10
0
10
1
2
10
10
0
25
3
50
75
100
125
150
TC, Case Temperature [ ]
VDS, Drain-Source Voltage [V]
℃
Fig.10 Maximum Drain Current vs.
Case Temperature
Fig.9 Maximum Safe Operating Area
1
10
0.2
10
0.1
0.05
0.02
-1
10
0.01
Zθ
JC
, Thermal Response
D=0.5
0
-2
single pulse
10
※ Notes :
Duty Factor, D=t 1/t2
PEAK TJ = PDM * Zθ JC* Rθ JC(t) + TC
-3
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
3
10
t1, Rectangular Pulse Duration [sec]
Fig.11 Transient Thermal Response
Curve
Apr. 2014. Version 1.0
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MagnaChip Semiconductor Ltd.
MDD1051 – Single N-Channel Trench MOSFET 150V
1600
10
MDD1051 – Single N-Channel Trench MOSFET 150V
Package Dimension
D-PAK (TO-252)
Dimensions are in millimeters, unless otherwise specified
Apr. 2014. Version 1.0
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MagnaChip Semiconductor Ltd.
MDD1051 – Single N-Channel Trench MOSFET 150V
DISCLAIMER:
The Products are not designed for use in hostile environments, including, without limitation, aircraft, nuclear power
generation, medical appliances, and devices or systems in which malfunction of any Product can reasonably be
expected to result in a personal injury. Seller’s customers using or selling Seller’s products for use in such
applications do so at their own risk and agree to fully defend and indemnify Seller.
MagnaChip reserves the right to change the specifications and circuitry without notice at any time. MagnaChip does not consider responsibility
for use of any circuitry other than circuitry entirely included in a MagnaChip product.
is a registered trademark of MagnaChip
Semiconductor Ltd.
Apr. 2014. Version 1.0
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MagnaChip Semiconductor Ltd.
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