DS90C383 DS90C383/DS90CF384 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link-65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link-65 MHz Literature Number: SNLS124A DS90C383/DS90CF384 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link—65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link—65 MHz General Description Features The DS90C383 transmitter converts 28 bits of LVCMOS/ LVTTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. The DS90CF384 receiver converts the LVDS data streams back into 28 bits of LVCMOS/ LVTTL data. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughputs is 227 Mbytes/sec. The transmitter is offered with programmable edge data strobes for convenient interface with a variety of graphics controllers. The transmitter can be programmed for Rising edge strobe or Falling edge strobe through a dedicated pin. A Rising edge transmitter will inter-operate with a Falling edge receiver (DS90CF384) without any translation logic. Both devices are also offered in a 64 ball, 0.8mm fine pitch ball grid array (FBGA) package which provides a 44 % reduction in PCB footprint compared to the TSSOP package. This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces. n 20 to 65 MHz shift clock support n Programmable transmitter (DS90C383) strobe select (Rising or Falling edge strobe) n Single 3.3V supply n Chipset (Tx + Rx) power consumption < 250 mW (typ) n Power-down mode ( < 0.5 mW total) n Single pixel per clock XGA (1024x768) ready n Supports VGA, SVGA, XGA and higher addressability. n Up to 227 Megabytes/sec bandwidth n Up to 1.8 Gbps throughput n Narrow bus reduces cable size and cost n 290 mV swing LVDS devices for low EMI n PLL requires no external components n Low profile 56-lead TSSOP package. n Also available in a 64 ball, 0.8mm fine pitch ball grid array (FBGA) package n Falling edge data strobe Receiver n Compatible with TIA/EIA-644 LVDS standard n ESD rating > 7 kV n Operating Temperature: −40˚C to +85˚C Block Diagrams Typical Application DS012887-2 TRI-STATE ® is a registered trademark of National Semiconductor Corporation. © 2000 National Semiconductor Corporation DS012887 www.national.com DS90C383/DS90CF384 +3.3V Programmable LVDS 24-Bit-Color Flat Panel Display (FPD) Link—65 MHz November 2000 DS90C383/DS90CF384 Block Diagrams (Continued) DS90C383 DS012887-1 Order Number DS90C383MTD or DS90C383SLC See NS Package Number MTD56 or SLC64A DS90CF384 DS012887-24 Order Number DS90CF384MTD or DS90CF384SLC See NS Package Number MTD56 or SLC64A www.national.com 2 DS90CF384MTD 12.4 mW/˚C above Maximum Package Power Dissipation Capacity 25˚C SLC64A Package: DS90C383SLC DS90CF384SLC Package Derating: DS90C383SLC 10.2 mW/˚C above DS90CF384SLC 10.2 mW/˚C above If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) −0.3V to +4V CMOS/TTL Input Voltage −0.3V to (VCC + 0.3V) CMOS/TTL Output Voltage −0.3V to (VCC + 0.3V) LVDS Receiver Input Voltage −0.3V to (VCC + 0.3V) LVDS Driver Output Voltage −0.3V to (VCC + 0.3V) LVDS Output Short Circuit Duration Continuous Junction Temperature +150˚C Storage Temperature −65˚C to +150˚C Lead Temperature (Soldering, 4 sec for TSSOP) +260˚C Solder Reflow Temperature (20 sec for FBGA) +220˚C Maximum Package Power Dissipation Capacity 25˚C MTD56 (TSSOP) Package: DS90C383MTD 1.63 W DS90CF384MTD 1.61 W Package Derating: DS90C383MTD 12.5 mW/˚C above +25˚C ESD Rating (HBM, 1.5 kΩ, 100 pF) +25˚C 2.0 W 2.0 W +25˚C +25˚C > 7 kV Recommended Operating Conditions Supply Voltage (VCC) Operating Free Air Temperature (TA) Receiver Input Range Supply Noise Voltage (VCC) Min 3.0 Nom 3.3 Max 3.6 Units V −40 0 +25 +85 2.4 100 ˚C V mVPP Max Units Electrical Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions Min Typ LVCMOS/LVTTL DC SPECIFICATIONS VIH High Level Input Voltage 2.0 VCC V VIL Low Level Input Voltage GND 0.8 V VOH High Level Output Voltage IOH = −0.4 mA VOL Low Level Output Voltage IOL = 2 mA 0.06 0.3 V 2.7 3.3 V VCL Input Clamp Voltage ICL = −18 mA −0.79 −1.5 V IIN Input Current VIN = VCC, GND, 2.5V or 0.4V ± 5.1 ± 10 µA IOS Output Short Circuit Current VOUT = 0V −60 −120 mA 345 450 mV 35 mV LVDS DC SPECIFICATIONS VOD Differential Output Voltage ∆VOD Change in VOD between RL = 100Ω 250 complimentary output states VOS Offset Voltage (Note 4) ∆VOS Change in VOS between 1.125 1.25 1.375 V 35 mV −3.5 −5 mA ±1 ± 10 µA +100 mV complimentary output states IOS Output Short Circuit Current VOUT = 0V, RL = 100Ω IOZ Output TRI-STATE ® Current Power Down = 0V, VTH Differential Input High Threshold VCM = +1.2V VTL Differential Input Low Threshold IIN Input Current VOUT = 0V or VCC −100 mV VIN = +2.4V, VCC = 3.6V VIN = 0V, VCC = 3.6V ± 10 ± 10 µA µA TRANSMITTER SUPPLY CURRENT ICCTW Transmitter Supply Current RL = 100Ω, CL = 5 pF, f = 32.5 MHz 31 45 mA Worst Case Worst Case Pattern f = 37.5 MHz 32 50 mA 3 www.national.com DS90C383/DS90CF384 Absolute Maximum Ratings (Note 1) DS90C383/DS90CF384 Electrical Characteristics (Continued) Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions Min Typ Max Units TRANSMITTER SUPPLY CURRENT ICCTG Transmitter Supply Current 16 Grayscale ICCTZ (Figures 1, 3 ), TA = −40˚C to +85˚C f = 65 MHz 42 55 mA RL = 100Ω, CL = 5 pF, f = 32.5 MHz 23 35 mA 16 Grayscale Pattern f = 37.5 MHz 28 40 mA (Figures 2, 3 ), TA = −40˚C to +85˚C f = 65 MHz 31 45 mA 10 55 µA Transmitter Supply Current Power Down = Low Power Down Driver Outputs in TRI-STATE ® under Power Down Mode RECEIVER SUPPLY CURRENT ICCRW ICCRG ICCRZ Receiver Supply Current C f = 32.5 MHz 49 65 mA Worst Case Worst Case Pattern f = 37.5 MHz 53 70 mA (Figures 1, 4 ), TA = −40˚C to +85˚C f = 65 MHz 78 105 mA Receiver Supply Current, C f = 32.5 MHz 28 45 mA 16 Grayscale 16 Grayscale Pattern f = 37.5 MHz 30 47 mA (Figures 2, 4 ), TA = −40˚C to +85˚C f = 65 MHz 43 60 mA 10 55 µA Receiver Supply Current Power Down L L = 8 pF, = 8 pF, Power Down = Low Receiver Outputs Stay Low during Power Down Mode Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation. Note 2: Typical values are given for VCC = 3.3V and TA = +25C. Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise specified (except VOD and ∆VOD). Note 4: VOS previously referred as VCM. Transmitter Switching Characteristics Over recommended operating supply and −40˚C to +85˚C ranges unless otherwise specified Symbol Parameter Min Typ Max Units LLHT LVDS Low-to-High Transition Time (Figure 3 ) 0.75 1.5 ns LHLT LVDS High-to-Low Transition Time (Figure 3 ) 0.75 1.5 ns TCIT TxCLK IN Transition Time (Figure 5 ) TCCS TxOUT Channel-to-Channel Skew (Figure 6 ) 5 250 ns ps TPPos0 Transmitter Output Pulse Position for Bit 0 (Figure 17 ) −0.4 0 0.3 ns TPPos1 Transmitter Output Pulse Position for Bit 1 1.8 2.2 2.5 ns TPPos2 Transmitter Output Pulse Position for Bit 2 4.0 4.4 4.7 ns TPPos3 Transmitter Output Pulse Position for Bit 3 6.2 6.6 6.9 ns TPPos4 Transmitter Output Pulse Position for Bit 4 8.4 8.8 9.1 ns TPPos5 Transmitter Output Pulse Position for Bit 5 10.6 11 11.3 ns TPPos6 Transmitter Output Pulse Position for Bit 6 12.8 13.2 13.5 ns TCIP TxCLK IN Period (Figure 7) 15 T 50 ns TCIH TxCLK IN High Time (Figure 7) 0.35T 0.5T 0.65T ns TCIL TxCLK IN Low Time (Figure 7) 0.35T 0.5T 0.65T ns TSTC TxIN Setup to TxCLK IN (Figure 7 ) THTC TxIN Hold to TxCLK IN (Figure 7 ) TCCD TxCLK IN to TxCLK OUT Delay 25˚C, VCC = 3.3V (Figure 9 ) www.national.com f = 65 MHz f = 65 MHz 4 2.5 ns 0 ns 3.0 3.7 5.5 ns (Continued) Over recommended operating supply and −40˚C to +85˚C ranges unless otherwise specified Max Units TPLLS Symbol Transmitter Phase Lock Loop Set (Figure 11 ) Parameter Min Typ 10 ms TPDD Transmitter Power Down Delay (Figure 15 ) 100 ns Typ Max Units 2.2 5.0 ns Receiver Switching Characteristics Over recommended operating supply and −40˚C to +85˚C ranges unless otherwise specified Symbol Parameter CLHT CMOS/TTL Low-to-High Transition Time (Figure 4 ) CHLT CMOS/TTL High-to-Low Transition Time (Figure 4 ) RSPos0 Receiver Input Strobe Position for Bit 0 (Figure 18 ) RSPos1 Min 2.2 5.0 ns 0.7 1.1 1.4 ns Receiver Input Strobe Position for Bit 1 2.9 3.3 3.6 ns RSPos2 Receiver Input Strobe Position for Bit 2 5.1 5.5 5.8 ns RSPos3 Receiver Input Strobe Position for Bit 3 7.3 7.7 8.0 ns RSPos4 Receiver Input Strobe Position for Bit 4 9.5 9.9 10.2 ns RSPos5 Receiver Input Strobe Position for Bit 5 11.7 12.1 12.4 ns RSPos6 Receiver Input Strobe Position for Bit 6 13.9 14.3 14.6 RSKM RxIN Skew Margin (Note 5) (Figure 19 ) RCOP RxCLK OUT Period (Figure 8) f = 65 MHz f = 65 MHz 400 15 ns ps T 50 ns RCOH RxCLK OUT High Time (Figure 8 ) 7.3 8.6 ns RCOL RxCLK OUT Low Time (Figure 8) 3.45 4.9 ns RSRC RxOUT Setup to RxCLK OUT (Figure 8 ) 2.5 6.9 ns RHRC RxOUT Hold to RxCLK OUT (Figure 8 ) 2.5 5.7 ns RCCD RxCLK IN to RxCLK OUT Delay 25˚C, VCC = 3.3V (Figure 10 ) 5.0 7.1 9.0 ns RPLLS Receiver Phase Lock Loop Set (Figure 12 ) 10 ms RPDD Receiver Power Down Delay (Figure 16 ) 1 µs f = 65 MHz Note 5: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account the transmitter pulse positions (min and max) and the receiver input setup and hold time (internal data sampling window-RSPOS). This margin allows for LVDS interconnect skew, inter-symbol interference (both dependent on type/length of cable), and clock jitter (less than 250 ps). AC Timing Diagrams DS012887-3 FIGURE 1. “Worst Case” Test Pattern 5 www.national.com DS90C383/DS90CF384 Transmitter Switching Characteristics DS90C383/DS90CF384 AC Timing Diagrams (Continued) DS012887-4 FIGURE 2. “16 Grayscale” Test Pattern (Notes 6, 7, 8, 9) Note 6: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O. Note 7: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed to produce groups of 16 vertical stripes across the display. Note 8: Figures 1, 2 show a falling edge data strobe (TxCLK IN/RxCLK OUT). Note 9: Recommended pin to signal mapping. Customer may choose to define differently. DS012887-5 FIGURE 3. DS90C383 (Transmitter) LVDS Output Load and Transition Times DS012887-6 FIGURE 4. DS90CF384 (Receiver) CMOS/TTL Output Load and Transition Times www.national.com 6 DS90C383/DS90CF384 AC Timing Diagrams (Continued) DS012887-7 FIGURE 5. DS90C383 (Transmitter) Input Clock Transition Time DS012887-8 Measurements at Vdiff = 0V TCCS measured between earliest and latest LVDS edges. TxCLK Differential Low V High Edge FIGURE 6. DS90C383 (Transmitter) Channel-to-Channel Skew DS012887-9 FIGURE 7. DS90C383 (Transmitter) Setup/Hold and High/Low Times (Falling Edge Strobe) DS012887-10 FIGURE 8. DS90CF384 (Receiver) Setup/Hold and High/Low Times 7 www.national.com DS90C383/DS90CF384 AC Timing Diagrams (Continued) DS012887-11 FIGURE 9. DS90C383 (Transmitter) Clock In to Clock Out Delay (Falling Edge Strobe) DS012887-12 FIGURE 10. DS90CF384 (Receiver) Clock In to Clock Out Delay DS012887-13 FIGURE 11. DS90C383 (Transmitter) Phase Lock Loop Set Time DS012887-14 FIGURE 12. DS90CF384 (Receiver) Phase Lock Loop Set Time www.national.com 8 DS90C383/DS90CF384 AC Timing Diagrams (Continued) DS012887-15 FIGURE 13. Seven Bits of LVDS in Once Clock Cycle DS012887-16 FIGURE 14. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs DS012887-17 FIGURE 15. Transmitter Power Down Delay 9 www.national.com DS90C383/DS90CF384 AC Timing Diagrams (Continued) DS012887-18 FIGURE 16. Receiver Power Down Delay DS012887-26 FIGURE 17. Transmitter LVDS Output Pulse Position Measurement www.national.com 10 DS90C383/DS90CF384 AC Timing Diagrams (Continued) DS012887-25 FIGURE 18. Receiver LVDS Input Strobe Position 11 www.national.com DS90C383/DS90CF384 AC Timing Diagrams (Continued) DS012887-21 C — Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and max Tppos — Transmitter output pulse position (min and max) RSKM = Cable Skew (type, length) + Source Clock Jitter (cycle to cycle) (Note 10) + ISI (Inter-symbol interference) (Note 11) Cable Skew — typically 10 ps–40 ps per foot, media dependent Note 10: Cycle-to-cycle jitter is less than 250 ps at 65 MHZ Note 11: ISI is dependent on interconnect length; may be zero FIGURE 19. Receiver LVDS Input Skew Margin Applications Information The DS90C383 and DS90CF384 are backward compatible with the existing 5V FPD Link transmitter/receiver pair (DS90CR583, DS90CR584, DS90CF583 and DS90CF584). To upgrade from a 5V to a 3.3V system the following must be addressed: 1. Change 5V power supply to 3.3V. Provide this supply to the VCC, LVDS VCC and PLL VCC of both the transmitter and receiver devices. This change may enable the removal of a 5V supply from the system, and power may be supplied from an existing 3V power source. 2. The DS90C383 (transmitter) incorporates a rise/fall strobe select pin. This select function is on pin 17, formerly a VCC connection on the 5V products. When the rise/fall strobe select pin is connected to VCC, the part is configured with a rising edge strobe. In a system currently using a 5V rising edge strobe transmitter (DS90CR583), no layout changes are required to accommodate the new rise/fall select pin on the 3.3V transmitter. The VCC signal may remain at pin 17, and the device will be configured with a rising edge strobe. When converting from a 5V falling edge transmitter (DS90CF583) to the 3V transmitter a minimal board layout change is necessary. The 3.3V transmitter will not be configured with a falling edge strobe if VCC remains connected to the select pin. To guarantee the 3.3V transmitter functions with a falling edge strobe pin 17 should be connected to ground OR left unconnected. When not connected (left open) and internal pull-down resistor ties pin 17 to ground, thus configuring the transmitter with a falling edge strobe. 3. The DS90C383 transmitter input and control inputs accept 3.3V TTL/CMOS levels. They are not 5V tolerant. www.national.com 12 I/O No. TxIN Pin Name I 28 Description TxOUT+ O 4 Positive LVDS differentiaI data output. TxOUT− O 4 Negative LVDS differential data output. FPSHIFT IN I 1 TTL Ievel clock input. The falling edge acts as data strobe. Pin name TxCLK IN. R_FB I 1 Programmable strobe select. RTxCLK OUT+ O 1 Positive LVDS differential clock output. TxCLK OUT− O 1 Negative LVDS differential clock output. PWR DOWN I 1 TTL level input. When asserted (low input) TRI-STATES the outputs, ensuring low current at power down. TTL level input. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines — FPLINE, FPFRAME and DRDY (also referred to as HSYNC, VSYNC, Data Enable). VCC I 3 Power supply pins for TTL inputs. GND I 4 Ground pins for TTL inputs. PLL VCC I 1 Power supply pin for PLL. PLL GND I 2 Ground pins for PLL. LVDS VCC I 1 Power supply pin for LVDS outputs. LVDS GND I 3 Ground pins for LVDS outputs. DS90C383SLC SLC64A (FBGA) Package Pin Summary — FPD Link Transmitter Pin Name I/O No. Description TxIN I 28 TTL level input. TxOUT+ O 4 Positive LVDS differential data output. TxOUT− O 4 Negative LVDS differential data output. TxCLKIN I 1 TTL IeveI clock input. The rising edge acts as data strobe. Pin name TxCLK IN. TxCLK OUT+ O 1 Positive LVDS differential clock output. TxCLK OUT− O 1 Negative LVDS differential clock output. PWR DWN I 1 TTL level input. Assertion (low input) TRI-STATES the outputs, ensuring low current at power down. R_FB I 1 Programmable strobe select. HIGH = rising edge, LOW = falling edge. VCC I 3 Power supply pins for TTL inputs. GND I 5 Ground pins for TTL inputs. PLL VCC I 1 Power supply pin for PLL. PLL GND I 2 Ground pins for PLL. LVDS VCC I 2 Power supply pin for LVDS outputs. LVDS GND I NC 4 Ground pins for LVDS outputs. 6 Pins not connected. DS90C383SLC SLC64A (FBGA) Package Pin Description — FPD Link Transmitter By Pin By Pin Type Pin Pin Name Type Pin Pin Name A1 TxIN27 I D3 GND G A2 TxOUT0- O E4 GND G A3 TxOUT0+ O E8 GND G A4 LVDS VCC P G1 GND G A5 LVDS VCC P G6 GND G A6 TxCLKOUT- O B3 LVDS GND G 13 Type www.national.com DS90C383/DS90CF384 DS90C383 TSSOP Package Pin Description — FPD Link Transmitter DS90C383/DS90CF384 DS90C383SLC SLC64A (FBGA) Package Pin Description — FPD Link Transmitter (Continued) By Pin By Pin Type A7 TxCLKOUT+ O B4 LVDS GND A8 TxOUT3+ O B7 LVDS GND G B1 TxIN1 I D5 LVDS GND G B2 TxIN0 I C6 PLL GND G B3 LVDS GND G D6 PLL GND G B4 LVDS GND G D7 PWR DWN I B5 TxOUT2- O G5 R_FB I B6 TxOUT3- O C8 TxCLKIN I B7 LVDS GND G B2 TxIN0 I B8 NC B1 TxIN1 I C1 TxIN3 D2 TxIN2 I C2 NC C1 TxIN3 I C3 NC D1 TxIN4 I C4 TxOUT1- O F1 TxIN5 I C5 TxOUT2+ O E2 TxIN6 I C6 PLL GND G E3 TxIN7 I C7 PLL VCC P G2 TxIN8 I C8 TxCLKIN I H1 TxIN9 I D1 TxIN4 I G3 TxIN10 I D2 TxIN2 I H3 TxIN11 I D3 GND G F4 TxIN12 I D4 TxOUT1+ O G4 TxIN13 I D5 LVDS GND G H4 TxIN14 I D6 PLL GND G H5 TxIN15 I I G D7 PWD DWN I E5 TxIN16 I D8 TxIN26 I F5 TxIN17 I E1 VCC P H6 TxIN18 I E2 TxIN6 I H7 TxIN19 I E3 TxIN7 I H8 TxIN20 I E4 GND G G7 TxIN21 I E5 TxIN16 I F7 TxIN22 I E6 VCC P G8 TxIN23 I E7 TxIN24 I E7 TxIN24 I E8 GND G F8 TxIN25 I F1 TxIN5 I D8 TxIN26 I F2 NC A1 TxIN27 I F3 NC A6 TxCLKOUT- O F4 TxIN12 I A7 TxCLKOUT+ O F5 TxIN17 I A2 TxOUT0- O F6 NC A3 TxOUT0+ O F7 TxIN22 I C4 TxOUT1- O F8 TxIN25 I D4 TxOUT1+ O G1 GND G B5 TxOUT2- O G2 TxIN8 I C5 TxOUT2+ O G3 TxIN10 I B6 TxOUT3- O G4 TxIN13 I A8 TxOUT3+ O G5 R_FB I A4 LVDS VCC P G6 GND G A5 LVDS VCC P www.national.com 14 By Pin By Pin Type G7 TxIN21 I C7 PLL VCC P G8 TxIN23 I E1 VCC P H1 TxIN9 I E6 VCC P H2 VCC P H2 VCC P H3 TxIN11 I B8 NC H4 TxIN14 I C2 NC H5 TxIN15 I C3 NC H6 TxIN18 I F2 NC H7 TxIN19 I F3 NC H8 TxIN20 I F6 NC G : Ground I : Input O : Output P : Power NC : No Connect DS90CF384 MTD56 TSSOP Package Pin Description — FPD Link Receiver Pin Name RxIN+ I/O No. I 4 Positive LVDS differentiaI data inputs. Description Negative LVDS differential data inputs. RxIN− I 4 RxOUT O 28 RxCLK IN+ I 1 Positive LVDS differential clock input. RxCLK IN− I 1 Negative LVDS differential clock input. FPSHIFT OUT O 1 TTL Ievel clock output. The falling edge acts as data strobe. Pin name RxCLK OUT. PWR DOWN I 1 TTL level input. When asserted (low input) the receiver outputs are low. VCC I 4 Power supply pins for TTL outputs. GND I 5 Ground pins for TTL outputs. PLL VCC I 1 Power supply for PLL. PLL GND I 2 Ground pin for PLL. LVDS VCC I 1 Power supply pin for LVDS inputs. LVDS GND I 3 Ground pins for LVDS inputs. TTL level data outputs. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines — FPLINE, FPFRAME, DRDY (also referred to as HSYNC, VSYNC, Data Enable). DS90CF384 64 ball FBGA Package Pin Description — FPD Link Receiver Pin Name RxIN+ I/O No. I 4 Positive LVDS differentiaI data inputs. Description Negative LVDS differential data inputs. RxIN− I 4 RxOUT O 28 RxCLK IN+ I 1 Positive LVDS differential clock input. RxCLK IN− I 1 Negative LVDS differential clock input. FPSHIFT OUT O 1 TTL Ievel clock output. The falling edge acts as data strobe. Pin name RxCLK OUT. PWR DOWN I 1 TTL level input. When asserted (low input) the receiver outputs are low. TTL level data outputs. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines — FPLINE, FPFRAME, DRDY (also referred to as HSYNC, VSYNC, Data Enable). VCC I 4 Power supply pins for TTL outputs. GND I 5 Ground pins for TTL outputs. PLL VCC I 1 Power supply for PLL. PLL GND I 2 Ground pin for PLL. LVDS VCC I 2 Power supply pin for LVDS inputs. 15 www.national.com DS90C383/DS90CF384 DS90C383SLC SLC64A (FBGA) Package Pin Description — FPD Link Transmitter (Continued) DS90C383/DS90CF384 DS90CF384 64 ball FBGA Package Pin Description — FPD Link Receiver (Continued) Pin Name LVDS GND I/O No. I NC Description 4 Ground pins for LVDS inputs. 6 Pins not connected. DS90CF384 64 ball, FBGA Package Pin Definition — FPD Link Receiver By Pin By Pin Type Pin Pin Name Type Pin Pin Name A1 RxOUT17 O A4 GND Type G A2 VCC P B1 GND G A3 RxOUT15 O B6 GND G A4 GND G D8 GND G A5 RxOUT12 O E3 GND G A6 RxOUT8 O E5 LVDS GND G A7 RxOUT7 O G3 LVDS GND G A8 RxOUT6 O G7 LVDS GND G B1 GND G H5 LVDS GND G B2 NC F6 PLL GND G B3 RxOUT16 O G8 PLL GND G B4 RxOUT11 O E6 PWR DWN I B5 VCC P H6 RxCLKIN- I B6 GND G H7 RxCLKIN+ I B7 RxOUT5 O H2 RxIN0- I B8 RxOUT3 O H3 RxIN0+ I C1 RxOUT21 O C2 NC C3 RxOUT18 O G5 RxIN2- I C4 RxOUT14 O F5 RxIN2+ I C5 RxOUT9 O G6 RxIN3- I C6 RxOUT4 O H8 RxIN3+ I C7 NC E7 RxCLKOUT O C8 RxOUT1 O E8 RxOUT0 O D1 VCC P C8 RxOUT1 O D2 RxOUT20 O D7 RxOUT2 O D3 RxOUT19 O B8 RxOUT3 O D4 RxOUT13 O C6 RxOUT4 O D5 RxOUT10 O B7 RxOUT5 O D6 VCC P A8 RxOUT6 O D7 RxOUT2 O A7 RxOUT7 O D8 GND G A6 RxOUT8 O E1 RxOUT22 O C5 RxOUT9 O E2 RxOUT24 O D5 RxOUT10 O E3 GND G B4 RxOUT11 O F4 RxIN1- I G4 RxIN1+ I E4 LVDS VCC P A5 RxOUT12 O E5 LVDS GND G D4 RxOUT13 O E6 PWR DWN I C4 RxOUT14 O E7 RxCLKOUT O A3 RxOUT15 O E8 RxOUT0 O B3 RxOUT16 O F1 RxOUT23 O A1 RxOUT17 O www.national.com 16 (Continued) By Pin F2 RxOUT26 F3 NC F4 RxIN1- By Pin Type O C3 RxOUT18 O D3 RxOUT19 O I D2 RxOUT20 O F5 RxIN2+ I C1 RxOUT21 O F6 PLL GND G E1 RxOUT22 O F7 PLL VCC P F1 RxOUT23 O F8 NC E2 RxOUT24 O G1 RxOUT25 G2 NC G3 LVDS GND G G4 RxIN1+ G5 RxIN2- G6 RxIN3- G7 LVDS GND G A2 VCC P G8 PLL GND G B5 VCC P H1 RxOUT27 O D1 VCC P H2 RxIN0- I D6 VCC P O G1 RxOUT25 O F2 RxOUT26 O H1 RxOUT27 O I E4 LVDS VCC P I H4 LVDS VCC P I F7 PLL VCC P H3 RxIN0+ I B2 NC H4 LVDS VCC P C2 NC H5 LVDS GND G C7 NC H6 RxCLKIN- I F3 NC H7 RxCLKIN+ I F8 NC H8 RxIN3+ I G2 NC G : Ground I : Input O : Output P : Power NC : Not Connect 17 www.national.com DS90C383/DS90CF384 DS90CF384 64 ball, FBGA Package Pin Definition — FPD Link Receiver DS90C383/DS90CF384 Pin Diagrams for TSSOP Packages DS90CF384MTD DS90C383MTD DS012887-22 DS012887-23 TABLE 1. Programmable Transmitter Pin www.national.com Condition Strobe Status R_FB R_FB = VCC Rising edge strobe R_FB R_FB = GND Falling edge strobe 18 DS90C383/DS90CF384 Physical Dimensions inches (millimeters) unless otherwise noted 56-Lead Molded Thin Shrink Small Outline Package, JEDEC Dimensions show in millimeters Order Number DS90C383MTD, DS90CF384MTD NS Package Number MTD56 19 www.national.com DS90C383/DS90CF384 +3.3V Programmable LVDS 24-Bit-Color Flat Panel Display (FPD) Link—65 MHz Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 64 ball, 0.8mm fine pitch ball grid array (FBGA) Package Dimensions show in millimeters only Order Number DS90CF384SLC or DS90C383SLC NS Package Number SLC64A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: [email protected] www.national.com National Semiconductor Europe Fax: +49 (0) 180-530 85 86 Email: [email protected] Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: [email protected] National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated