TI OPA363AID 1.8v, 7mhz, 90db cmrr, single-supply, rail-to-rail i/o operational amplifier Datasheet

OPA363, OPA2363
OPA364, OPA2364, OPA4364
www.ti.com
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
1.8V, 7MHz, 90dB CMRR,
Single-Supply, Rail-to-Rail I/O
Operational Amplifier
Check for Samples: OPA363, OPA2363, OPA364, OPA2364, OPA4364
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
•
The OPA363 and OPA364 families are highperformance CMOS operational amplifiers optimized
for very low voltage, single-supply operation. These
miniature, low-cost amplifiers are designed to operate
on single supplies from 1.8V (±0.9V) to 5.5V
(±2.75V). Applications include sensor amplification
and signal conditioning in battery-powered systems.
1
2
1.8V Operation
MicroSize Packages
Bandwidth: 7MHz
CMRR: 90dB (typical)
Slew Rate: 5V/μs
Low Offset: 500μV (max)
Quiescent Current: 750μA/Channel (max)
Shutdown Mode: < 1µA/Channel
The OPA363 and OPA364 families offer excellent
CMRR without the crossover associated with
traditional complimentary input stages. This results in
excellent performance for driving Analog-to-Digital
(A/D) converters without degradation of differential
linearity and THD. The input commonmode range
includes both the negative and positive supplies. The
output voltage swing is within 10mV of the rails.
APPLICATIONS
•
•
•
•
•
Signal Conditioning
Data Acquisition
Process Control
Active Filters
Test Equipment
OPA363
SOT23-5
SOT23-6
OPA364
The OPA363 family includes a shutdown mode.
Under logic control, the amplifiers can be switched
from normal operation to a standby current that is
less than 1μA.
OPA2363
X
MSOP-10
X
X
X
X
TSSOP-14
X
SO-14
UQFN-16
OPA4364
X
MSOP-8
SO-8
OPA2364
X
The single version is available in the MicroSize
SOT23-5 (SOT23-6 for shutdown) and SO-8. The
dual version is available in MSOP-8, MSOP-10,
UQFN-16. and SO-8 packages. Quad packages are
available in TSSOP-14 and SO-14 packages. All
versions are specified for operation from –40°C to
+125°C.
X
X
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2013, Texas Instruments Incorporated
OPA363, OPA2363
OPA364, OPA2364, OPA4364
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE AND ORDERING INFORMATION (1)
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range, unless otherwise noted.
Supply voltage
Voltage (2)
Signal input terminals
UNIT
+5.5
V
–0.5 to (V+) + 0.5
V
±10
mA
Output short-circuit (3)
Continuous
mA
Operating temperature, TA
–40 to +150
°C
Storage temperature, Tstg
–65 to +150
°C
Junction temperature, TJ
+150
°C
(1)
(2)
(3)
Current
(2)
VALUE
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should
be current limited to 10mA or less.
Short-circuit to ground, one amplifier per package.
ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to VS/2, VOUT = VS/2, and VCM = VS/2, unless otherwise noted.
OPAx363, OPAx364
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
500
μV
OFFSET VOLTAGE
Input Offset Voltage, OPA363I, OPA364I
VOS
VS = +5V
OPA2363I, OPA2364I
OPA363AI, OPA364AI, OPA2363AI, OPA2364AI,
OPA4364AI
Drift
1
dVOS/dT
vs Power Supply
PSRR
900
μV
2.5
mV
μV/°C
3
VS = 1.8V to 5.5V, VCM = 0
80
Channel Separation, dc
330
μV/V
μV/V
1
INPUT BIAS CURRENT
Input Bias Current
IB
±1
over Temperature
±10
pA
See Typical Characteristics
Input Offset Current
IOS
±1
±10
pA
Input Voltage Noise, f = 0.1Hz to 10Hz
en
10
µVPP
Input Voltage Noise Density, f = 10kHz
en
17
nV/√Hz
Input Current Noise Density, f = 10kHz
in
0.6
fA/√Hz
NOISE
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
VCM
Common-Mode Rejection Ratio
2
CMRR
Submit Documentation Feedback
(V–) – 0.1
(V−) – 0.1V < VCM < (V+) + 0.1V
74
(V+) + 0.1
90
V
dB
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: OPA363 OPA2363 OPA364 OPA2364 OPA4364
OPA363, OPA2363
OPA364, OPA2364, OPA4364
www.ti.com
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V (continued)
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to VS/2, VOUT = VS/2, and VCM = VS/2, unless otherwise noted.
OPAx363, OPAx364
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
INPUT CAPACITANCE
Differential
2
pF
Common-Mode
3
pF
100
dB
OPEN-LOOP GAIN
Open-Loop Voltage Gain
RL = 10kΩ, 100mV < VO < (V+) – 100mV
AOL
94
OPA4364AI
over Temperature
VS = 1.8V to 5.5V
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
dB
86
dB
CL = 100pF
GBW
SR
Settling Time, 0.1%
tS
0.01%
Overload Recovery Time
Total Harmonic Distortion + Noise
90
THD+N
7
MHz
G = +1
5
V/μs
VS = +5V, 4V Step, G = +1
1
µs
VS = +5V, 4V Step, G = +1
1.5
µs
VIN · Gain > VS
0.8
µs
VS = +5V, G = +1, f = 20Hz to 20kHz
0.002
%
RL = 10kΩ
10
OUTPUT
Voltage Output Swing
Over Temperature
Short-Circuit Current
Capacitive Load Drive
RL = 10kΩ
20
V
20
V
ISC
See Typical Characteristics
CLOAD
See Typical Characteristics
SHUTDOWN (for OPAx363)
tOFF
1
tON (1)
20
Vl (shutdown)
µs
µs
(V–) + 0.8
Vh (amplifier is active)
0.75 (V+)
IQSD
V
5.5
V
0.9
µA
5.5
V
µA
POWER SUPPLY
Specified Voltage Range
VS
1.8
Operating Voltage Range
1.8 to 5.5
Quiescent Current (per amplifier)
IQ
V
VS = +1.8V
650
750
VS = +3.6V
850
1000
µA
VS = +5.5V
1.1
1.4
mA
TEMPERATURE RANGE
Specified Range
–40
+125
°C
Operating Range
–40
+150
°C
–65
+150
°C
Storage Range
Thermal Resistance
(1)
θJA
SOT23-5, SOT23-6
200
°C/W
MSOP-8, MSOP-10, SO-8
150
°C/W
TSSOP-14, SO-14
100
°C/W
Part is considered enabled when input offset voltage returns to specified range.
Copyright © 2002–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: OPA363 OPA2363 OPA364 OPA2364 OPA4364
3
OPA363, OPA2363
OPA364, OPA2364, OPA4364
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
www.ti.com
PIN CONFIGURATION
OPA363(1): DBV PACKAGE
SOT23-6
(TOP VIEW)
OPA364(1): DBV PACKAGE
SOT23-5
(TOP VIEW)
VOUT 1
V+
+In 3
4
-In
+IN B
15
14
13
NC
1
12
NC
NC
2
11
Enable B
NC
3
10
Enable A
NC
4
9
NC
A41
V- 2
5
16
5
6
7
8
V-
-In
-IN B
4
+IN A
Enable
OUT B
5
-IN A
+In 3
V+
V+
A40
V- 2
6
OUT A
VOUT 1
OPA2363: RSV PACKAGE
UQFN-16
(TOP VIEW)
OPA2364: DGK, D PACKAGES
MSOP-8, SO-8
(TOP VIEW)
OPA363: D PACKAGE
SO-8
(TOP VIEW)
Out A
1
8
V+
NC 1
8
Enable
-In A
2
7
Out B
-In 2
7
V+
+In A
3
6
-In B
+In 3
6
VOUT
V-
4
5
+In B
V- 4
5
NC
OPA4364: D, PW PACKAGES
SO-14, TSSOP-14
(TOP VIEW)
OPA364: D PACKAGE
SO-8
(TOP VIEW)
NC 1
8
NC
-In 2
7
V+
+In 3
6
VOUT
V- 4
5
NC
14
VOUT D
13
-In D
3
12
+In D
V+
4
11
V-
+In B
5
10
+In C
VOUT A
1
-In A
2
+In A
A
B
OPA2363: DGS PACKAGE
MSOP-10
(TOP VIEW)
D
C
-In B
6
9
-In C
VOUT B
7
8
VOUT C
(1)
Orient according to marking.
NOTE: NC = No internal connection.
VOUT A
1
-In A
2
+In A
3
10
+V
9
VOUT B
8
-In B
A
B
4
-V
4
7
+In B
Enable A
5
6
Enable B
Submit Documentation Feedback
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: OPA363 OPA2363 OPA364 OPA2364 OPA4364
OPA363, OPA2363
OPA364, OPA2364, OPA4364
www.ti.com
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
TYPICAL CHARACTERISTICS
At TA = +25°C, RL = 10kΩ connected to VS/2, VOUT = VS/2, and VCM = VS/2, unless otherwise noted.
OPEN-LOOP GAIN AND PHASE
vs FREQUENCY
120
COMMON-MODE REJECTION RATIO
vs FREQUENCY
0
100
-30
80
-60
60
-90
40
-120
20
-150
0
-180
100
90
70
CMRR (dB)
Phase (°)
Voltage Gain (dB)
80
60
50
40
30
20
10
-20
0
10
100
1k
10k
100k
1M
10M
100M
10
100
1k
Frequency (Hz)
10k
Figure 1.
1M
10M
Figure 2.
POWER-SUPPLY REJECTION RATIO
vs FREQUENCY
100
100k
Frequency (Hz)
QUIESCENT CURRENT
vs SUPPLY VOLTAGE
1.4
Per Amplifier
Quiescent Current (mA)
PSRR (dB)
80
60
40
20
1.2
1.0
0.8
0.6
0.4
0
1
10
100
1k
10k
100k
1M
1.5
10M
2.0
2.5
3.0
Figure 3.
TOTAL HARMONIC DISTORTION + NOISE RATIO
vs FREQUENCY
VOUT = -10dBv
G = 10, RL = 2kW
VS = 1.8V
THD+N (%)
0.1
G = 1, RL = 2kW
VS = 1.8V
G = 1,
RL = 2kW
VS = 5V
0.0001
100
4.5
5.0
5.5
6.0
TOTAL HARMONIC DISTORTION + NOISE RATIO
vs FREQUENCY
(VS = 5V, VOUT = 1Vrms)
0.1
0.001
10
1
G = 10, RL = 2kW
VS = 5V
G = 10, RL = 10kW
VS = 1.8V, 5V
0.01
4.0
Figure 4.
THD+N (%)
1
3.5
Supply Voltage (V)
Frequency (Hz)
1k
G = 1,
RL = 10kW
VS = 1.8V, 5V
G = 10, RL = 2kW
0.01
G = 10, RL = 10kW
0.001
G = 1, RL = 2kW
G = 1, RL = 10kW
0.0001
10k
100k
10
100
1k
Frequency (Hz)
Frequency (Hz)
Figure 5.
Figure 6.
Copyright © 2002–2013, Texas Instruments Incorporated
10k
Submit Documentation Feedback
Product Folder Links: OPA363 OPA2363 OPA364 OPA2364 OPA4364
100k
5
OPA363, OPA2363
OPA364, OPA2364, OPA4364
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, RL = 10kΩ connected to VS/2, VOUT = VS/2, and VCM = VS/2, unless otherwise noted.
INPUT VOLTAGE NOISE SPECTRAL DENSITY
vs FREQUENCY
120
Short-Circuit Current (mA)
Input Voltage Noise (nV/ÖHz)
1000
SHORT-CIRCUIT CURRENT
vs SUPPLY VOLTAGE
100
10
100
+ISC
80
60
40
-ISC
20
0
10
100
1k
10k
100k
1.5
2.0
2.5
Frequency (Hz)
3
2
Output Voltage (V)
Input Bias Current (pA)
TA = -40°C
TA = +25°C
TA = +125°C
-2
VS = ±1.65V
VS = ±2.5V
±30 ±40 ±50
±60
±70
0
-2
VCM = +5.1V
-4
-6
-8
VCM = -0.1V
-10
-0.5
±80 ±90 ±100
0.5
Output Current (mA)
4.5
INPUT OFFSET CURRENT
vs TEMPERATURE
INPUT BIAS CURRENT
vs TEMPERATURE
10k
Input Bias Current (pA)
Input Offset Current (pA)
3.5
Figure 10.
100
10
1
0
25
50
Temperature (°C)
Figure 11.
6
2.5
Figure 9.
1k
-25
1.5
Submit Documentation Feedback
5.5
Common-Mode Voltage (V)
10k
-50
5.5
4
VS = ±1.65V
-1
±20
5.0
INPUT BIAS CURRENT
vs INPUT COMMON-MODE VOLTAGE
VS = ±0.9V
±10
4.5
OUTPUT VOLTAGE SWING
vs OUTPUT CURRENT
1
0
4.0
Figure 8.
2
-3
3.5
Figure 7.
VS = ±2.5V
0
3.0
Supply Voltage (V)
75
100
125
1k
100
10
1
-50
-25
0
25
50
75
100
125
Temperature (°C)
Figure 12.
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: OPA363 OPA2363 OPA364 OPA2364 OPA4364
OPA363, OPA2363
OPA364, OPA2364, OPA4364
www.ti.com
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, RL = 10kΩ connected to VS/2, VOUT = VS/2, and VCM = VS/2, unless otherwise noted.
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
SETTLING TIME
vs CLOSED-LOOP GAIN
100
60
40
30
20
0.01%
Settling Time (ms)
Overshoot (%)
50
G = +1
10
0.1%
1
10
G = +10
0.1
0
100
1k
1
100
Closed-Loop Gain (V/V)
Figure 13.
Figure 14.
OFFSET DRIFT DISTRIBUTION
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
16
20
Typical Production
Distribution of
Packaged Units
Percent of Amplifiers (%)
14
Percent of Amplifiers (%)
10
Load Capacitance (pF)
15
10
5
12
OPA36xAI
10
8
6
4
2
0
0
0
1
2
3
4
5
6
7
8
9
> 10
-2.5
-2.0
-1.0
0
1.0
2.0
2.5
Offset Voltage (mV)
Offset Voltage Drift (mV/°C)
Figure 15.
Figure 16.
OUTPUT ENABLE CHARACTERISTIC
(VS = 5V, VOUT = 20kHz Sinusoid)
CHANNEL SEPARATION vs FREQUENCY
130
VENABLE
Channel Separation (dB)
VOUT
120
110
100
90
80
70
60
50
40
50ms/div
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
Figure 17.
Copyright © 2002–2013, Texas Instruments Incorporated
Figure 18.
Submit Documentation Feedback
Product Folder Links: OPA363 OPA2363 OPA364 OPA2364 OPA4364
7
OPA363, OPA2363
OPA364, OPA2364, OPA4364
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, RL = 10kΩ connected to VS/2, VOUT = VS/2, and VCM = VS/2, unless otherwise noted.
LARGE-SIGNAL STEP RESPONSE
(CL = 100pF)
1V/div
50mV/div
SMALL-SIGNAL STEP RESPONSE
(CL = 100pF)
250ns/div
1ms/div
Figure 19.
Figure 20.
APPLICATION INFORMATION
The OPA363 and OPA364 series op amps are rail-to-rail operational amplifiers with excellent CMRR, low noise,
low offset, and wide bandwidth on supply voltages as low as ±0.9V. The OPA363 features an additional pin for
shutdown/ enable function. These families do not exhibit phase reversal and are unity-gain stable. Specified over
the industrial temperature range of –40°C to +125°C, the OPA363 and OPA364 families offer precision
performance for a wide range of applications.
RAIL-TO-RAIL INPUT
The OPA363 and OPA364 feature excellent rail-to-rail operation, with supply voltages as low as ±0.9V. The input
common-mode voltage range of the OPA363 and OPA364 family extends 100mV beyond supply rails. The
unique input topology of the OPA363 and OPA364 eliminates the input offset transition region typical of most railto-rail complimentary stage operational amplifiers, allowing the OPA363 and OPA364 to provide superior
common-mode performance over the entire common-mode input range, as seen in Figure 21. This feature
prevents degradation of the differential linearity error and THD when driving A/D converters. A simplified
schematic of the OPA363 and OPA364 is shown in Figure 22.
1.0
OPA363 and OPA364
0.5
0
VOS (mV)
-0.5
-1.0
-1.5
-2.0
Competitors
-2.5
-3.0
-3.5
-0.2
0
0.2
0.4
0.6
0.8
1.0 1.2
1.4
1.6
1.8
2.0
Common-Mode Voltage (V)
Figure 21. OPA363 and OPA364 have Linear Offset Over Entire Common-Mode Range
8
Submit Documentation Feedback
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: OPA363 OPA2363 OPA364 OPA2364 OPA4364
OPA363, OPA2363
OPA364, OPA2364, OPA4364
www.ti.com
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
VS
Regulated
Charge Pump
VOUT = VCC +1.8V
VCC + 1.8V
IBIAS
Patent Pending
Very Low Ripple
Topology
IBIAS
VOUT
IBIAS
VIN-
VIN+
IBIAS
Figure 22. Simplified Schematic.
Copyright © 2002–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: OPA363 OPA2363 OPA364 OPA2364 OPA4364
9
OPA363, OPA2363
OPA364, OPA2364, OPA4364
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
www.ti.com
OPERATING VOLTAGE
The OPA363 and OPA364 series op amp parameters are fully specified from +1.8V to +5.5V. Single 0.1μF
bypass capacitors should be placed across supply pins and as close to the part as possible. Supply voltages
higher than 5.5V (absolute maximum) may cause permanent damage to the amplifier. Many specifications apply
from –40°C to +125°C. Parameters that vary significantly with operating voltages or temperature are shown in
the Typical Characteristics.
ENABLE FUNCTION
The shutdown (enable) function of the OPA363 is referenced to the negative supply voltage of the operational
amplifier. A logic level HIGH enables the op amp. A valid logic HIGH is defined as voltage greater than 75% of
the positive supply applied to the enable pin. The valid logic HIGH signal can be as much as 5.5V above the
negative supply, independent of the positive supply voltage. A valid logic LOW is defined as less than 0.8V
above the negative supply pin. If dual or split power supplies are used, care should be taken to ensure logic input
signals are properly referred to the negative supply voltage. This pin should be connected to a valid high or low
voltage or driven, not left open circuit.
The logic input is a high-impedance CMOS input. Dual op amps are provided separate logic inputs. For batteryoperated applications, this feature may be used to greatly reduce the average current and extend battery life.
The enable time is 20μs; disable time is 1μs. When disabled, the output assumes a high-impedance state. This
allows the OPA363 to be operated as a “gated” amplifier, or to have its output multiplexed onto a common
analog output bus.
CAPACITIVE LOAD
The OPA363 and OPA364 series op amps can drive a wide range of capacitive loads. However, all op amps
under certain conditions may become unstable. Op amp configuration, gain, and load value are just a few of the
factors to consider when determining stability. An op amp in unity-gain configuration is the most susceptible to
the effects of capacitive load. The capacitive load reacts with the output resistance of the op amp to create a
pole in the small-signal response, which degrades the phase margin.
In unity gain, the OPA363 and OPA364 series op amps perform well with a pure capacitive load up to
approximately 1000pF. The ESR (Equivalent Series Resistance) of the loading capacitor may be sufficient to
allow the OPA363 and OPA364 to directly drive very large capacitive loads (> 1μF). Increasing gain enhances
the amplifier’s ability to drive more capacitance; see Figure 13.
One method of improving capacitive load drive in the unity-gain configuration is to insert a 10Ω to 20Ω resistor in
series with the output, as shown in Figure 23. This significantly reduces ringing with large capacitive loads.
However, if there is a resistive load in parallel with the capacitive load, it creates a voltage divider introducing a
dc error at the output and slightly reduces output swing. This error may be insignificant. For instance, with RL =
10kΩ and RS = 20Ω, there is only about a 0.2% error at the output.
V+
RS
OPAx363
OPAx364
VIN
VOUT
10W to
20W
RL
CL
Figure 23. Improving Capacitive Load Drive
10
Submit Documentation Feedback
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: OPA363 OPA2363 OPA364 OPA2364 OPA4364
OPA363, OPA2363
OPA364, OPA2364, OPA4364
www.ti.com
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
INPUT AND ESD PROTECTION
All OPA363 and OPA364 pins are static protected with internal ESD protection diodes tied to the supplies. These
diodes will provide overdrive protection if the current is externally limited to 10mA, as stated in the absolute
maximum ratings and shown in Figure 24.
V+
IOVERLOAD
10mA max
VOUT
OPAx363
VIN
5kW
Figure 24. Input Current Protection
ACHIEVING OUTPUT SWING TO THE OP AMP’S NEGATIVE RAIL
Some applications require an accurate output voltage swing from 0V to a positive full-scale voltage. A good
single supply op amp may be able to swing within a few mV of single supply ground, but as the output is driven
toward 0V, the output stage of the amplifier will prevent the output from reaching the negative supply rail of the
amplifier.
The output of the OPA363 or OPA364 can be made to swing to ground, or slightly below, on a single supply
power source. To do so requires use of another resistor and an additional, more negative power supply than the
op amp’s negative supply. A pulldown resistor may be connected between the output and the additional negative
supply to pull the output down below the value that the output would otherwise achieve as shown in Figure 25.
V+ = +5V
OPA363
OPA364
VOUT
VIN
500mA
Op Amp
Negative
Supply
Grounded
RP = 10kW
-V = -5V
(Additional
Negative Supply)
Figure 25. OPA363 and OPA364 Swing to Ground
This technique will not work with all op amps. The output stage of the OPA363 and OPA364 allows the output
voltage to be pulled below that of most op amps, if approximately 500μA is maintained through the output stage.
To calculate the appropriate value load resistor and negative supply, RL = –V/500μA. The OPA363 and OPA364
have been characterized to perform well under the described conditions, maintaining excellent accuracy down to
0V and as low as –10mV. Limiting and nonlinearity occur below –10mV, with linearity returning as the output is
again driven above –10mV.
Copyright © 2002–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: OPA363 OPA2363 OPA364 OPA2364 OPA4364
11
OPA363, OPA2363
OPA364, OPA2364, OPA4364
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
www.ti.com
BUFFERED REFERENCE VOLTAGE
Many single-supply applications require a mid-supply reference voltage. The OPA363 and OPA364 offer
excellent capacitive load drive capability, and can be configured to provide a 0.9V reference voltage, as can be
seen in Figure 26. For appropriate loading considerations, see the CAPACITIVE LOAD section.
V+
V+
R1
10kW
OPAx363
OPAx364
0.9V
CL = 1mF
R2
10kW
Figure 26. The OPA363 and OPA364 Provide a Stable Reference Voltage
DIRECTLY DRIVING THE ADS8324 AND THE MSP430
The OPA363 and OPA364 series op amps are optimized for driving medium speed (up to 100kHz) sampling A/D
converters. However, they also offer excellent performance for higher speed converters. The no crossover input
stage of the OPA363 and OPA364 directly drive A/D converters without degradation of differential linearity and
THD. They provide an effective means of buffering the A/D converters input capacitance and resulting charge
injection while providing signal gain. Figure 27 and Figure 28 show the OPA363 and OPA364 configured to drive
the ADS8324 and the 12-bit A/D converter on the MSP430.
V+ = 1.8V
V+ = 1.8V
100W
OPA363
OPA364
ADS8324
VIN
1nF
Figure 27. The OPA363 and OPA364 Directly Drive the ADS8324
V+
V+
100W
OPA363
OPA364
VIN
MSP430
1nF
Figure 28. Driving the 12-Bit A/D Converter on the MSP430
12
Submit Documentation Feedback
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: OPA363 OPA2363 OPA364 OPA2364 OPA4364
OPA363, OPA2363
OPA364, OPA2364, OPA4364
www.ti.com
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
AUDIO APPLICATIONS
The OPA363 and OPA364 op amp family has linear offset voltage over the entire input common-mode range.
Combined with low-noise, this feature makes the OPA363 and OPA364 suitable for audio applications. Single
supply 1.8V operation allows the OPA2363 and OPA2364 to be optimal candidates for dual stereo-headphone
drivers and microphone pre-amplifiers in portable stereo equipment, see Figure 29 and Figure 30.
20kW
V+
1mF
20kW
One of Right or Left Channel
20kW
20kW
1/2
OPA2363
V+
10kW
V-
One of Right or Left
Headphone Out
1/2
TPS6100
47pF
V-
10kW
Internally
Biased
V-
Figure 29. OPA2363 Configured as Half of a Dual Stereo Headphone Driver
49kW
Clean 3.3V Supply
3.3V
4kW
OPAx363
OPAx364
Electret
Microphone
6kW
VOUT
5kW
1mF
Figure 30. Microphone Preamplifier
Copyright © 2002–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: OPA363 OPA2363 OPA364 OPA2364 OPA4364
13
OPA363, OPA2363
OPA364, OPA2364, OPA4364
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
www.ti.com
ACTIVE FILTERING
Low harmonic distortion and noise specifications plus high gain and slew rate make the OPA363 and OPA364
optimal candidates for active filtering. Figure 31 shows the OPA2363 configured as a low-distortion, 3rd-order
GIC (General Immittance Converter) filter. Figure 32 shows the implementation of a Sallen-Key, 3-pole, low-pass
Bessel filter.
VIN
R1
R3
3.92kW
1.33kW
2
OPA363
R11
3.92kW
R12
3.92kW
7
1/2
OPA2363
2
VOUT
C4
1000pF
3
6
6
3
1/2
OPA2363
1
C13
1000pF
5
R14
3.48kW
C15
1000pF
Figure 31. The OPA2363 as a 3rd-Order, 40kHz, Low-Pass GIC Filter
220pF
1.8kW
19.5kW
150kW
VIN = 1Vrms
3.3nF
47pF
OPA363
VOUT
Figure 32. The OPA363 or OPA364 Configured as a 3-Pole, 20kHz, Sallen-Key Filter
14
Submit Documentation Feedback
Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: OPA363 OPA2363 OPA364 OPA2364 OPA4364
OPA363, OPA2363
OPA364, OPA2364, OPA4364
www.ti.com
SBOS259C – SEPTEMBER 2002 – REVISED MAY 2013
REVISION HISTORY
NOTE: Page numbers for previous versions may differ from page numbers in the current version.
Changes from Revision B (February 2003) to Revision C
Page
•
Converted data sheet to current format ................................................................................................................................ 1
•
Added RSV package (UQFN-16) to data sheet .................................................................................................................... 1
Copyright © 2002–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: OPA363 OPA2363 OPA364 OPA2364 OPA4364
15
PACKAGE OPTION ADDENDUM
www.ti.com
26-Jun-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
OPA2363AIDGSR
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHK
OPA2363AIDGSRG4
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHK
OPA2363AIDGST
ACTIVE
VSSOP
DGS
10
250
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHK
OPA2363AIDGSTG4
ACTIVE
VSSOP
DGS
10
250
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHK
OPA2363AIRSVR
ACTIVE
UQFN
RSV
16
3000
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 125
SIN
OPA2363IDGSR
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHK
OPA2363IDGSRG4
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHK
OPA2363IDGST
ACTIVE
VSSOP
DGS
10
250
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHK
OPA2363IDGSTG4
ACTIVE
VSSOP
DGS
10
250
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHK
OPA2364AID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
2364
A
OPA2364AIDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
2364
A
OPA2364AIDGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHL
OPA2364AIDGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHL
OPA2364AIDGKT
ACTIVE
VSSOP
DGK
8
250
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHL
OPA2364AIDGKTG4
ACTIVE
VSSOP
DGK
8
250
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHL
OPA2364AIDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
-40 to 125
OPA
2364
A
CU NIPDAU
CU NIPDAU
Addendum-Page 1
Level-2-260C-1 YEAR
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-Jun-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
OPA2364AIDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
2364
A
OPA2364ID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
2364
OPA2364IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
2364
OPA2364IDGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHL
OPA2364IDGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHL
OPA2364IDGKT
ACTIVE
VSSOP
DGK
8
250
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHL
OPA2364IDGKTG4
ACTIVE
VSSOP
DGK
8
250
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 125
BHL
OPA2364IDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
2364
OPA2364IDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
2364
OPA363AID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
363
A
OPA363AIDBVR
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A40
OPA363AIDBVRG4
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A40
OPA363AIDBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A40
OPA363AIDBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A40
OPA363AIDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
363
A
OPA363ID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
363
OPA363IDBVR
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A40
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-Jun-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
OPA363IDBVRG4
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A40
OPA363IDBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A40
OPA363IDBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A40
OPA363IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
363
OPA364AID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
364
A
OPA364AIDBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A41
OPA364AIDBVRG4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A41
OPA364AIDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A41
OPA364AIDBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A41
OPA364AIDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
364
A
OPA364AIDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
364
A
OPA364AIDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
364
A
OPA364ID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
364
OPA364IDBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A41
OPA364IDBVRG4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A41
OPA364IDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A41
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-Jun-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
OPA364IDBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
A41
OPA364IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
364
OPA364IDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
364
OPA364IDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
364
OPA4364AID
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA4364A
OPA4364AIDG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA4364A
OPA4364AIDR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA4364A
OPA4364AIDRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA4364A
OPA4364AIPWR
ACTIVE
TSSOP
PW
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
4364A
OPA4364AIPWRG4
ACTIVE
TSSOP
PW
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
4364A
OPA4364AIPWT
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
4364A
OPA4364AIPWTG4
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
4364A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 4
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-Jun-2013
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA4364 :
• Automotive: OPA4364-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jul-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
OPA2363AIDGSR
VSSOP
DGS
10
OPA2363AIDGST
VSSOP
DGS
OPA2363AIRSVR
UQFN
RSV
OPA2363IDGSR
VSSOP
OPA2363IDGST
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
10
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
16
3000
177.8
12.4
2.0
2.8
0.7
4.0
12.0
Q1
DGS
10
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
VSSOP
DGS
10
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2364AIDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2364AIDGKT
VSSOP
DGK
8
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2364AIDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA2364IDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2364IDGKT
VSSOP
DGK
8
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2364IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA363AIDBVR
SOT-23
DBV
6
3000
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
OPA363AIDBVT
SOT-23
DBV
6
250
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
OPA363IDBVR
SOT-23
DBV
6
3000
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
OPA363IDBVT
SOT-23
DBV
6
250
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
OPA364AIDBVR
SOT-23
DBV
5
3000
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
OPA364AIDBVT
SOT-23
DBV
5
250
180.0
8.4
3.2
3.1
1.39
4.0
8.0
Q3
OPA364AIDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jul-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
OPA364IDBVR
SOT-23
DBV
5
3000
180.0
8.4
OPA364IDBVT
SOT-23
DBV
5
250
180.0
8.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.2
3.1
1.39
4.0
8.0
Q3
3.2
3.1
1.39
4.0
8.0
Q3
OPA364IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA4364AIDR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
OPA4364AIPWR
TSSOP
PW
14
2500
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
OPA4364AIPWT
TSSOP
PW
14
250
180.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA2363AIDGSR
VSSOP
DGS
10
2500
367.0
367.0
35.0
OPA2363AIDGST
VSSOP
DGS
10
250
210.0
185.0
35.0
OPA2363AIRSVR
UQFN
RSV
16
3000
202.0
201.0
28.0
OPA2363IDGSR
VSSOP
DGS
10
2500
367.0
367.0
35.0
OPA2363IDGST
VSSOP
DGS
10
250
210.0
185.0
35.0
OPA2364AIDGKR
VSSOP
DGK
8
2500
367.0
367.0
35.0
OPA2364AIDGKT
VSSOP
DGK
8
250
210.0
185.0
35.0
OPA2364AIDR
SOIC
D
8
2500
367.0
367.0
35.0
OPA2364IDGKR
VSSOP
DGK
8
2500
367.0
367.0
35.0
OPA2364IDGKT
VSSOP
DGK
8
250
210.0
185.0
35.0
OPA2364IDR
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jul-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA363AIDBVR
SOT-23
DBV
6
3000
210.0
185.0
35.0
OPA363AIDBVT
SOT-23
DBV
6
250
210.0
185.0
35.0
OPA363IDBVR
SOT-23
DBV
6
3000
210.0
185.0
35.0
OPA363IDBVT
SOT-23
DBV
6
250
210.0
185.0
35.0
OPA364AIDBVR
SOT-23
DBV
5
3000
210.0
185.0
35.0
OPA364AIDBVT
SOT-23
DBV
5
250
210.0
185.0
35.0
OPA364AIDR
SOIC
D
8
2500
367.0
367.0
35.0
OPA364IDBVR
SOT-23
DBV
5
3000
210.0
185.0
35.0
OPA364IDBVT
SOT-23
DBV
5
250
210.0
185.0
35.0
OPA364IDR
SOIC
D
8
2500
367.0
367.0
35.0
OPA4364AIDR
SOIC
D
14
2500
367.0
367.0
38.0
OPA4364AIPWR
TSSOP
PW
14
2500
367.0
367.0
35.0
OPA4364AIPWT
TSSOP
PW
14
250
210.0
185.0
35.0
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Similar pages