± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001 D Remote Terminal ADSL Line Driver D D D D D High Speed − Ideal for Both Full Rate ADSL and G.Lite − Compatible With 1:1 Transformer Ratio Low 2.7 pA/√Hz Noninverting Current Noise − Reduces Noise Feedback Through Hybrid Into Downstream Channel Wide Supply Voltage Range ± 5 V to ± 15 V − Ideal for ± 12-V Operation Wide Output Swing − 42 Vpp Differential Output Voltage, RL = 200 Ω, ± 12-V Supply High Output Current − 175 mA (typ) D D D D D THS6052 SOIC (D) AND SOIC PowerPAD (DDA) PACKAGE (TOP VIEW) D1 OUT D1 IN− D1 IN+ VCC− 1 8 2 7 3 6 4 5 − 110 MHz (−3 dB, G=8, ± 12 V) − 1500 V/µs Slew Rate (G = 8, ± 12 V) Low Distortion, Single-Ended, G = 8 − −83 dBc (250 kHz, 2 Vpp, 100-Ω load) Low Power Shutdown (THS6053) − 300-µA Total Standby Current Thermal Shutdown and Short Circuit Protection Standard SOIC, SOIC PowerPAD, and TSSOP PowerPAD Package Evaluation Module Available THS6053 SOIC (D) AND TSSOP PowerPAD (PWP) PACKAGE (TOP VIEW) D1 OUT D1 IN− D1 IN+ VCC− N/C GND N/C VCC+ D2 OUT D2 IN− D2 IN+ 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC+ D2 OUT D2 IN− D2 IN+ N/C SHUTDOWN N/C description The THS6052/3 is a high-speed line driver ideal for driving signals from the remote terminal to the central office in asymmetrical digital subscriber line (ADSL) applications. It can operate from ±12-V supply voltages while drawing only 5.2 mA of supply current per channel. It offers low –83 dBc total harmonic distortion driving a 100-Ω load (2 Vpp). The THS6052/3 offers a high 42-Vpp differential output swing across a 200-Ω load from a ±12-V supply. The THS6053 features a low-power shutdown mode, consuming only 300 µA quiescent current per channel. The THS6052/3 is packaged in a standard SOIC, SOIC PowerPAD, and TSSOP PowerPAD packages. +12 V THS6052 Driver 1 + _ VI+ 1:1 750 Ω 210 Ω VI− + _ RELATED PRODUCTS 50 Ω THS6052 Driver 2 50 Ω DEVICE 15.4 dBm Delivered to Telephone Line DESCRIPTION THS6042/3 350-mA, ±12 ADSL CPE line driver 100 Ω THS6092/3 275-mA, +12 V ADSL CPE line driver OPA2677 380-mA, +12 V ADSL CPE line driver THS6062 Low noise ADSL receiver 0.68 µF −12 V 750 Ω Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. Copyright 2001, Texas Instruments Incorporated ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $ ! $+! !# $! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' % $$!) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 ± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001 AVAILABLE OPTION PACKAGED DEVICE EVALUATION MODULES TA SOIC-8 (D) SOIC-8 PowerPAD (DDA) SOIC-14 (D) TSSOP-14 (PWP) 0°C to 70°C THS6052CD THS6052CDDA THS6053CD THS6053CPWP THS6052EVM THS6053EVM −40°C to 85°C THS6052ID THS6052IDDA THS6053ID THS6053IPWP — absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VCC+ to VCC− . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 V Input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± VCC Output current (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 mA Differential input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 4 V Maximum junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Total power dissipation at (or below) 25°C free-air temperature . . . . . . . . . . . See Dissipation Ratings Table Operating free-air temperature, TA: Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C Storage temperature, Tstg : Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The THS6052 and THS6053 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package. DISSIPATION RATING TABLE TA = 25°C TJ = 150°C POWER RATING PACKAGE θJA θJC D-8 38.3°C/W‡ 9.2°C/W‡ 1.32 W D-14 95°C/W‡ 45.8°C/W‡ 66.6°C/W‡ 26.9°C/W‡ 1.88 W PWP 37.5°C/W 1.4°C/W DDA 2.73 W 3.3 W ‡ This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test PCB, the ΘJA is168°C/W for the D−8 package and 122.3°C/W for the D−14 package. recommended operating conditions MIN Supply voltage, VCC+ to VCC− 2 MAX ±5 ±15 Single supply 10 30 0 70 −40 85 C-suffix Operating free-air temperature, TA NOM Dual supply I-suffix POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT V °C ± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001 electrical characteristics over recommended operating free-air temperature range, TA = 25°C, VCC = ±12 V, RFEEDBACK = 750 Ω, RL = 100 Ω (unless otherwise noted) dynamic performance PARAMETER TEST CONDITIONS G= 1, RF = 1 kΩ RL = 50 Ω BW G= 2, RF = 680 Ω G= 8, RF = 330 Ω Small-signal bandwidth (− 3 dB) G= 1, RF = 1 kΩ RL = 100 Ω G= 2, RF = 680 Ω G= 8, RF = 330 Ω MIN TYP VCC = ± 5 V 110 VCC = ±12 V 120 90 VCC = ± 5 V 150 VCC = ±12 V 170 110 650 VCC = ±15 V VCC = ±12 V VCC = ±15 V VCC = ±12 V 950 1500 VCC = ±15 V NOTE 2: Slew rate is defined from the 25% to the 75% output levels. VCC = ±15 V 1700 Slew rate (see Note 2), G=8 VO = 16 VPP MHz 135 VCC = ±5 V, ±12 V VCC = ± 5 V VCC = ±12 V SR UNIT 100 VCC = ±5 V, ±12 V VCC = ± 5 V VCC = ±12 V VO = 4 VPP MAX 850 V/µs noise/distortion performance PARAMETER THD TEST CONDITIONS Total harmonic distortion (single-ended configuration) Vn Input voltage noise In Input current noise XT Gain = 8, RL = 100 Ω, VCC = ±12 12 V, f = 250 kHz VO(pp) = 16 V −78 RL = 50 Ω, f = 250 kHz VO(pp) = 2 V −74 VO(pp) = 6 V −72 Gain = 8, VCC = ±5 5 V, f = 250 kHz, G = 2, VCC = ±5 V, VCC = ±12 V, VCC = ±15 V VCC = ±12 V, RL= 100 Ω f = 250 kHz, G = 2, VCC = ±5 V, RL= 50 Ω f = 10 kHz, −Input Crosstalk TYP −83 VCC = ±5 V, f = 10 kHz , ±12 V +Input MIN VO(pp) = 2 V POST OFFICE BOX 655303 2.1 MAX UNIT dBc nV/√Hz 2.7 pA/√Hz 10.7 VO = 2 Vp-p −79 VO = 2 Vp-p −71 dBc • DALLAS, TEXAS 75265 3 ± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001 electrical characteristics over recommended operating free-air temperature range, TA = 25°C, VCC = ±12 V, RFEEDBACK = 750 Ω, RL = 100 Ω (unless otherwise noted) (continued) dc performance PARAMETER TEST CONDITIONS Input offset voltage VOS VCC = ±12 V, VCC = ±6 V Differential offset voltage Offset drift − Input bias current IIB VCC = ±12 V, VCC = ±6 6V + Input bias current MAX TA = 25°C TA = full range 5 10 TA = 25°C TA = full range 3 UNIT 15 6 mV 8 TA = full range TA = 25°C 30 5 TA = full range TA = 25°C 2 µV/°C 10 12 5 6 5 TA = full range RL = 1 kΩ, VCC = ±12 V, VCC = ±6 V Open loop transimpedance TYP TA = full range TA = 25°C Differential input bias current ZOL MIN A µA 10 12 1 MΩ input characteristics PARAMETER TEST CONDITIONS VICR Input common-mode voltage range VCC = ±12 V VCC = ± 6 V CMRR Common-mode rejection ratio VCC = ±12 V, VCC = ±6 V RI Input resistance CI Input capacitance TA = 25°C TA = full range MIN TYP ±9.7 ±10.1 ± 3.8 ±4.2 59 66 MAX UNIT V dB 57 + Input 1.5 MΩ − Input 15 Ω 2 pF output characteristics PARAMETER TEST CONDITIONS RL = 50 Ω, VO Output voltage swing Single ended RL = 100 Ω RL = 25 Ω, IO Output current ISC Short-circuit current RL = 0 Ω, Output resistance Open loop 4 RL = 10 Ω, POST OFFICE BOX 655303 VCC = ± 6 V VCC = ±12 V MIN TYP ±4.2 ±4.6 ±10.1 ±10.5 VCC = ±6 V VCC = ±12 V ±4.4 ±4.8 150 175 VCC = ±6 V VCC = ±12 V 150 175 • DALLAS, TEXAS 75265 MAX UNIT V mA 250 mA 14 Ω ± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001 electrical characteristics over recommended operating free-air temperature range, TA = 25°C, VCC = ±12 V, RFEEDBACK = 750 Ω, RL = 100 Ω (unless otherwise noted) (continued) power supply PARAMETER TEST CONDITIONS Dual supply VCC ICC PSRR Operating range Single supply MIN TYP MAX ± 4.5 ± 16.5 9 33 VCC = ±12 V TA = 25°C TA = full range 5.2 7 VCC = ±6 V TA = 25°C TA = full range 4.5 6.5 VCC = ±12 V TA = 25°C TA = full range −64 −62 −61 − VCC = ±6 V TA = 25°C TA = full range −60 −70 Quiescent current (each driver) Power supply rejection ratio UNIT V 8 mA 7.5 dB −58 shutdown characteristics (THS6053 only) PARAMETER TEST CONDITIONS VIL(SHDN) Shutdown pin voltage for power up VCC = ±6 V, ±12 V GND = 0 V, (GND Pin as Reference) VIH(SHDN) Shutdown pin voltage for power down VCC = ±6 V, ±12 V, GND = 0 V, (GND Pin as Reference) ICC(SHDN) tDIS Total quiescent current when in shutdown state tEN IIL(SHDN) Enable time (see Note 3) IIH(SHDN) Shutdown pin input bias current for power down Disable time (see Note 3) Shutdown pin input bias current for power up MIN TYP 0.8 2 UNIT V V VGND = 0 V, VCC = ±6 V, ±12 V VCC = ±12 V 0.3 VCC = ±12 V VCC = ±6 V, ±12 V 0.4 VCC = ±6 V, ±12 V, V(SHND) = 3.3 V MAX 0.7 mA µs 0.1 µs 40 100 µA 50 100 µA NOTE 3: Disable/enable time is defined as the time from when the shutdown signal is applied to the SHDN pin to when the supply current has reached half of its final value. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 ± SLOS293D − JUNE 2000 − REVISED DECEMBER 2001 APPLICATION INFORMATION +12 V THS6052 Driver 1 VI+ 0.1 µF + 6.8 µF 50 Ω + _ 1:1 750 Ω 100 Ω Telephone Line 1 µF 210 Ω 499 Ω +12 V 0.68 µF 1 kΩ THS6052 Driver 2 VI− 0.1 µF 50 Ω + _ 499 Ω − + THS6062 Receiver 1 750 Ω 0.1 µF VO+ 499 Ω 6.8 µF + −12 V 1 kΩ 499 Ω − + VO− THS6062 Receiver 2 −12 V 0.01 µF Figure 1. THS6052 ADSL Application With 1:1 Transformer Ratio 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Mar-2015 PACKAGING INFORMATION Orderable Device Status (1) THS6052CD THS6052CDDA THS6052ID ACTIVE Package Type Package Pins Package Drawing Qty SOIC ACTIVE SO PowerPAD ACTIVE SOIC Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 6052C DDA 8 75 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 6052C D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 6052I DDA 8 75 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 6052I 6052I THS6052IDDA ACTIVE SO PowerPAD THS6052IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 THS6053CPWPR ACTIVE HTSSOP PWP 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 HS6053C THS6053ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 THS6053I THS6053IPWP ACTIVE HTSSOP PWP 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 HS6053I THS6053IPWPR ACTIVE HTSSOP PWP 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 HS6053I (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Mar-2015 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) THS6053CPWPR HTSSOP PWP 14 2000 330.0 12.4 THS6053IPWPR HTSSOP PWP 14 2000 330.0 12.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.9 5.6 1.6 8.0 12.0 Q1 6.9 5.6 1.6 8.0 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) THS6053CPWPR HTSSOP PWP 14 2000 367.0 367.0 38.0 THS6053IPWPR HTSSOP PWP 14 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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