Freescale MC9328MX21VK 266 mhz i.mx family of microprocessor Datasheet

Document Number: MC9328MX21
Rev. 3.4, 07/2010
Freescale Semiconductor
Data Sheet: Technical Data
MC9328MX21
Package Information
MC9328MX21
(MAPBGA–289)
266 MHz
1
Introduction
Freescale’s i.MX family of microprocessors has
demonstrated leadership in the portable handheld
market. Building on the success of the MX (Media
Extensions) series, the i.MX21 (MC9328MX21)
provides a leap in performance with an ARM926EJ-S™
microprocessor core that provides accelerated Java
support in addition to highly integrated system functions.
The i.MX21 device specifically addresses the needs of
the smartphone and portable product markets with
intelligent integrated peripherals, advanced processor
core, and power management capabilities.
Ordering Information: See Table 1 on page 3
Contents
1.
2.
3.
4.
5.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Pin Assignment and Package Information . . . . . . . . . . . 96
Document Revision History . . . . . . . . . . . . . . . . . . . . . . 99
The i.MX21 features the advanced and power-efficient
ARM926EJ-S core operating at speeds up to 266 MHz
and is part of a growing family of Smart Speed products
that offer high performance processing optimized for
lowest power consumption. On-chip modules such as a
video accelerator module, LCD controller, USB On-TheGo, 1-Wire® interface, CMOS sensor interface, and
synchronous serial interfaces offer designers a rich suite
of peripherals that can enhance many products seeking to
provide a rich multimedia experience.
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the
design of its products.
© Freescale Semiconductor, Inc., 2005–2008. All rights reserved.
Introduction
For cost sensitive applications, the NAND Flash controller allows the use of low-cost NAND Flash
devices to be used as primary or secondary non-volatile storage. The on-chip error correction code (ECC)
and parity checking circuitry of the NAND Flash controller frees the CPU for other tasks. WLAN,
Bluetooth and expansion options are provided through PCMCIA/CF, USB, and MMC/SD host controllers.
The device is packaged in a 289-pin MAPBGA.
System Control
JTAG/Multi-
Connectivity
i.MX21
CSPI x 3
SSI x 2
System
Clock Manage-
Standard System I/O
Timers x
PWM
WDOG
RT
I2 C
Audio Mux
ARM9 Platform
UART x
ARM926EJ-
MAX
I Cache
MM
D
Bus Con-
Internal Con-
Memory Con-
GPI
DMAC
Human Interface
CSI
LCD Controller
SLCD ControlKey-
1-WIRE
IrDA
USB OTG/ 2
Memory Expansion
MMC/SD x 2
PCMCIA/
Enhanced Multimedia Accelerator
(eMMA)
Memory Interface
Pre- and Post- Process-
SDRAM
C
EIM/BMI
Video Accelera-
NFC
Figure 1. i.MX21 Functional Block Diagram
1.1
Conventions
This document uses the following conventions:
• OVERBAR is used to indicate a signal that is active when pulled low: for example, RESET.
• Logic level one is a voltage that corresponds to Boolean true (1) state.
• Logic level zero is a voltage that corresponds to Boolean false (0) state.
• To set a bit or bits means to establish logic level one.
• To clear a bit or bits means to establish logic level zero.
MC9328MX21 Technical Data, Rev. 3.4
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Freescale Semiconductor
Introduction
•
•
•
•
•
•
1.2
A signal is an electronic construct whose state conveys or changes in state convey information.
A pin is an external physical connection. The same pin can be used to connect a number of signals.
Asserted means that a discrete signal is in active logic state.
— Active low signals change from logic level one to logic level zero.
— Active high signals change from logic level zero to logic level one.
Negated means that an asserted discrete signal changes logic state.
— Active low signals change from logic level zero to logic level one.
— Active high signals change from logic level one to logic level zero.
LSB means least significant bit or bits, and MSB means most significant bit or bits. References to
low and high bytes or words are spelled out.
Numbers preceded by a percent sign (%) are binary. Numbers preceded by a dollar sign ($) or 0x
are hexadecimal.
Target Applications
The i.MX21 is targeted for advanced information appliances, smart phones, Web browsers, digital MP3
audio players, handheld computers based on the popular Palm OS platform, and messaging applications.
1.3
Reference Documentation
The following documents are required for a complete description of the i.MX21 and are necessary to
design properly with the device. Especially for those not familiar with the ARM926EJ-S processor the
following documents are helpful when used in conjunction with this manual.
ARM Architecture Reference Manual (ARM Ltd., order number ARM DDI 0100)
ARM7TDMI Data Sheet (ARM Ltd., order number ARM DDI 0029)
ARM920T Technical Reference Manual (ARM Ltd., order number ARM DDI 0151C)
MC9328MX21 Product Brief (order number MC9328MX21P)
MC9328MX21 Reference Manual (order number MC9328MX21RM)
The Freescale manuals are available on the Freescale Semiconductor Web site at http://
www.freescale.com. These documents may be downloaded directly from the Freescale Web site, or printed
versions may be ordered. The ARM Ltd. documentation is available from http://www.arm.com.
1.4
Ordering Information
Table 1 provides ordering information for the device.
Table 1. Ordering Information1
Part Order Number
Package Size
Package Type
Operating Range
MC9328MX21VK!
289-lead MAPBGA
0.65mm, 14mm x 14mm
Lead-free
0°C–70°C
MC9328MX21VM!
289-lead MAPBGA
0.8mm, 17mm x 17mm
Lead-free
0°C–70°C
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
3
Table 1. Ordering Information1 (Continued)
Part Order Number
Introduction
Package Size
Package Type
Operating Range
MC9328MX21DVK!
289-lead MAPBGA
0.65mm, 14mm x 14mm
Lead-free
-30°C–70°C
MC9328MX21DVM!
289-lead MAPBGA
0.8mm, 17mm x 17mm
Lead-free
-30°C–70°C
MC9328MX21CVK!
289-lead MAPBGA
0.65mm, 14mm x 14mm
Lead-free
-40°C–85°C
MC9328MX21CVM!
289-lead MAPBGA
0.8mm, 17mm x 17mm
Lead-free
-40°C–85°C
MC9328MX21CJM
289-lead MAPBGA
0.8mm, 17mm x 17mm
Lead-free
-40°C–85°C
1.5
Features
The i.MX21 boasts a robust array of features that can support a wide variety of applications. Below is a
brief description of i.MX21 features.
• ARM926EJ-S Core Complex
• enhanced Multimedia Accelerator (eMMA)
• Display and Video Modules
— LCD Controller (LCDC)
— Smart LCD Controller (SLCDC)
— CMOS Sensor Interface (CSI)
• Bus Master Interface (BMI)
• Wireless Connectivity
— Fast Infra-Red Interface (FIRI)
• Wired Connectivity
— USB On-The-Go (USBOTG) Controller
— Four Universal Asynchronous Receiver/Transmitters (UARTx)
— Three Configurable Serial Peripheral Interfaces (CSPIx) for High Speed Data Transfer
— Inter-IC (I2C) Bus Module
— Two Synchronous Serial Interfaces (SSI) with Inter-IC Sound (I2S)
— Digital Audio Mux
— One-Wire Controller
— Keypad Interface
• Memory Expansion and I/O Card Support
— Two Multimedia Card and Secure Digital (MMC/SD) Host Controller Modules
MC9328MX21 Technical Data, Rev. 3.4
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Signal Descriptions
•
•
2
Memory Interface
— External Interface Module (EIM)
— SDRAM Controller (SDRAMC)
— NAND Flash Controller (NFC)
— PCMCIA/CF Interface
Standard System Resources
— Clock Generation Module (CGM) and Power Control Module
— Three General-Purpose 32-Bit Counters/Timers
— Watchdog Timer
— Real-Time Clock/Sampling Timer (RTC)
— Pulse-Width Modulator (PWM) Module
— Direct Memory Access Controller (DMAC)
— General-Purpose I/O (GPIO) Ports
— Debug Capability
Signal Descriptions
Table 2 identifies and describes the i.MX21 signals. Pin assignment is provided in Section 4, “Pin
Assignment and Package Information” and in the “Signal Multiplexing Scheme” table within the reference
manual.
The connections of the pins in Table 2 depends solely upon the user application, however there are a few
factory test signals that are not used in a normal application. Following is a list of these signals and how
they are to be terminated for proper operation of the i.MX21 processor:
• CLKMODE[1:0]: To ensure proper operation, leave these signals as no connects.
• OSC26M_TEST: To ensure proper operation, leave this signal as no connect.
• EXT_48M: To ensure proper operation, connect this signal to ground.
• EXT_266M: To ensure proper operation, connect this signal to ground.
• TEST_WB[2:0]: These signals are also multiplexed with GPIO PORT E as well as alternate
keypad signals. If not utilizing these signals for GPIO functionality or for their other multiplexed
function, then configure as GPIO input with pull up enabled, and leave as a no connect.
• TEST_WB[4:3]: To ensure proper operation, leave these signals as no connects.
Table 2. i.MX21 Signal Descriptions
Signal Name
Function/Notes
External Bus/Chip Select (EIM)
A [25:0]
Address bus signals
D [31:0]
Data bus signals
EB0
MSB Byte Strobe—Active low external enable byte signal that controls D [31:24], shared with SDRAM
DQM0.
MC9328MX21 Technical Data, Rev. 3.4
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5
Signal Descriptions
Table 2. i.MX21 Signal Descriptions (Continued)
Signal Name
Function/Notes
EB1
Byte Strobe—Active low external enable byte signal that controls D [23:16], shared with SDRAM DQM1.
EB2
Byte Strobe—Active low external enable byte signal that controls D [15:8], shared with SDRAM DQM2
and PCMCIA PC_REG.
EB3
LSB Byte Strobe—Active low external enable byte signal that controls D [7:0], shared with SDRAM
DQM3 and PCMCIA PC_IORD.
OE
Memory Output Enable—Active low output enables external data bus, shared with PCMCIA PC_IOWR.
CS [5:0]
Chip Select—The chip select signals CS [3:2] are multiplexed with CSD [1:0] and are selected by the
Function Multiplexing Control Register (FMCR) in the System Control chapter. By default CSD [1:0] is
selected. DTACK is multiplexed with CS4.
ECB
Active low input signal sent by flash device to the EIM whenever the flash device must terminate an ongoing burst sequence and initiate a new (long first access) burst sequence.
LBA
Active low signal sent by flash device causing the external burst device to latch the starting burst
address.
BCLK
RW
DTACK
Clock signal sent to external synchronous memories (such as burst flash) during burst mode.
RW signal—Indicates whether external access is a read (high) or write (low) cycle. This signal is also
shared with the PCMCIA PC_WE.
DTACK signal—External input data acknowledge signal, multiplexed with CS4.
Bootstrap
BOOT [3:0]
System Boot Mode Select—The operational system boot mode upon system reset is determined by the
settings of these pins. To hardwire these inputs low, terminate with a 1 KΩ resister to ground. For a logic
high, terminate with a 1 KΩ resistor to VDDA. Do not change the state of these inputs after power-up.
Boot 3 should always be tied to logic low.
SDRAM Controller
SDBA [4:0]
SDRAM non-interleave mode bank address signals. These signals are multiplexed with address signals
A[20:16].
SDIBA [3:0]
SDRAM interleave addressing mode bank address signals. These signals are multiplexed with address
signals A[24:21].
MA [11:0]
SDRAM address signals. MA[9:0] are multiplexed with address signals A[10:1].
DQM [3:0]
SDRAM data qualifier mask multiplexed with EB[3:0]. DQM3 corresponds to D[31:24], DQM2
corresponds to D[23:16], DQM1 corresponds to D[15:8], and DQM0 corresponds to D[7:0].
CSD0
SDRAM Chip Select signal. This signal is multiplexed with the CS2 signal. This signal is selectable by
programming the Function Multiplexing Control Register in the System Control chapter.
CSD1
SDRAM Chip Select signal. This signal is multiplexed with the CS3 signal. This signal is selectable by
programming the Function Multiplexing Control Register in the System Control chapter.
RAS
SDRAM Row Address Select signal.
CAS
SDRAM Column Address Select signal
SDWE
SDRAM Write Enable signal
SDCKE0
SDRAM Clock Enable 0
SDCKE1
SDRAM Clock Enable 1
SDCLK
SDRAM Clock
MC9328MX21 Technical Data, Rev. 3.4
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Freescale Semiconductor
Signal Descriptions
Table 2. i.MX21 Signal Descriptions (Continued)
Signal Name
Function/Notes
Clocks and Resets
EXTAL26M
Crystal input (26MHz), or a 16 MHz to 32 MHz oscillator (or square-wave) input when the internal
oscillator circuit is shut down. When using an external signal source, feed this input with a square wave
signal switching from GND to VDDA.
XTAL26M
Oscillator output to external crystal. When using an external signal source, float this output.
EXTAL32K
32 kHz or 32.768 kHz crystal input. When using an external signal source, feed this input with a square
wave signal switching from GND to QVDD5.
XTAL32K
CLKO
Oscillator output to external crystal. When using an external signal source, float this output.
Clock Out signal selected from internal clock signals. Please refer to clock controller for internal clock
selection.
EXT_48M
This is a special factory test signal. To ensure proper operation, connect this signal to ground.
EXT_266M
This is a special factory test signal. To ensure proper operation, connect this signal to ground.
RESET_IN
Master Reset—External active low Schmitt trigger input signal. When this signal goes active, all modules
(except the reset module, SDRAMC module, and the clock control module) are reset.
RESET_OUT
Reset Out—Internal active low output signal from the Watchdog Timer module and is asserted from the
following sources: Power-on reset, External reset (RESET_IN), and Watchdog time-out.
POR
Power On Reset—Active low Schmitt trigger input signal. The POR signal is normally generated by an
external RC circuit designed to detect a power-up event.
CLKMODE[1:0]
These are special factory test signals. To ensure proper operation, leave these signals as no connects.
OSC26M_TEST
This is a special factory test signal. To ensure proper operation, leave this signal as a no connect.
TEST_WB[2:0]
These are special factory test signals. However, these signals are also multiplexed with GPIO PORT E
as well as alternate keypad signals. If not using these signals for GPIO functions or for other multiplexed
functions, then configure as GPIO input with pull-up enabled, and leave as a no connect.
TEST_WB[4:3]
These are special factory test signals. To ensure proper operation, leave these signals as no connects.
WKGD
Battery indicator input used to qualify the walk-up process. Also multiplexed with TIN.
JTAG
For termination recommendations, see the Table “JTAG pinouts” in the Multi-ICE® User Guide from ARM® Limited.
TRST
Test Reset Pin—External active low signal used to asynchronously initialize the JTAG controller.
TDO
Serial Output for test instructions and data. Changes on the falling edge of TCK.
TDI
Serial Input for test instructions and data. Sampled on the rising edge of TCK.
TCK
Test Clock to synchronize test logic and control register access through the JTAG port.
TMS
Test Mode Select to sequence the JTAG test controller’s state machine. Sampled on the rising edge of
TCK.
JTAG_CTRL
JTAG Controller select signal—JTAG_CTRL is sampled during the rising edge of TRST. Must be pulled
to logic high for proper JTAG interface to debugger. Pulling JTAG_CRTL low is for internal test purposes
only.
RTCK
JTAG Return Clock used to enhance stability of JTAG debug interface devices. This signal is multiplexed
with 1-Wire, therefore using 1-Wire renders RTCK unusable and vice versa.
CMOS Sensor Interface
CSI_D [7:0]
Sensor port data
CSI_MCLK
Sensor port master clock
MC9328MX21 Technical Data, Rev. 3.4
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Signal Descriptions
Table 2. i.MX21 Signal Descriptions (Continued)
Signal Name
Function/Notes
CSI_VSYNC
Sensor port vertical sync
CSI_HSYNC
Sensor port horizontal sync
CSI_PIXCLK
Sensor port data latch clock
LCD Controller
LD [17:0]
LCD Data Bus—All LCD signals are driven low after reset and when LCD is off. LD[15:0] signals are
multiplexed with SLCDC1_DAT[15:0] from SLCDC1 and BMI_D[15:0]. LD[17] signal is multiplexed with
BMI_WRITE of BMI. LD[16] is multiplexed with BMI_READ_REQ of BMI and EXT_DMAGRANT.
FLM_VSYNC
(or simply referred
to as VSYNC)
Frame Sync or Vsync—This signal also serves as the clock signal output for gate
driver (dedicated signal SPS for Sharp panel HR-TFT). This signal is multiplexed with BMI_RXF_FULL
and BMI_WAIT of the BMI.
LP_HSYNC (or simply Line Pulse or HSync
referred to as HSYNC)
LSCLK
OE_ACD
CONTRAST
SPL_SPR
Shift Clock. This signal is multiplexed with the BMI_CLK_CS from BMI.
Alternate Crystal Direction/Output Enable.
This signal is used to control the LCD bias voltage as contrast control. This signal is multiplexed with the
BMI_READ from BMI.
Sampling start signal for left and right scanning. This signal is multiplexed with the SLCDC1_CLK.
PS
Control signal output for source driver (Sharp panel dedicated signal). This signal is multiplexed with the
SLCDC1_CS.
CLS
Start signal output for gate driver. This signal is invert version of PS (Sharp panel dedicated signal). This
signal is multiplexed with the SLCDC1_RS.
REV
Signal for common electrode driving signal preparation (Sharp panel dedicated signal). This signal is
multiplexed with SLCDC1_D0.
Smart LCD Controller
SLCDC1_CLK
SLCDC Clock output signal. This signal is multiplexed and available at 2 alternate locations. These are
SPL_SPR and SD2_CLK signals of LCDC and SD2, respectively.
SLCDC1_CS
SLCDC Chip Select output signal. This signal is multiplexed and available at 2 alternate signal locations.
These are PS and SD2_CMD signals of LCDC and SD2, respectively.
SLCDC1_RS
SLCDC Register Select output signal. This signal is multiplexed and available at 2 alternate signal
locations. These are CLS and SD2_D3 signals of LCDC and SD2, respectively.
SLCDC1_D0
SLCDC serial data output signal. This signal is multiplexed and available at 2 alternate signal locations.
These are and REV and SD2_D2 signals of LCDC and SD2, respectively. This signal is inactive when a
parallel data interface is used.
SLCDC1_DAT[15:0]
SLCDC Data output signals for connection to a parallel SLCD panel interface. These signals are
multiplexed with LD[15:0] while an alternate 8-bit SLCD muxing is available on LD[15:8]. Further
alternate muxing of these signals are available on some of the USB OTG and USBH1 signals.
SLCDC2_CLK
SLCDC Clock input signal for pass through to SLCD device. This signal is multiplexed with SSI3_CLK
signal from SSI3.
SLCDC2_CS
SLCDC Chip Select input signal for pass through to SLCD device. This signal is multiplexed with
SSI3_TXD signal from SSI3.
SLCDC2_RS
SLCDC Register Select input signal for pass through to SLCD device. This signal is multiplexed with
SSI3_RXD signal from SSI3.
MC9328MX21 Technical Data, Rev. 3.4
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Signal Descriptions
Table 2. i.MX21 Signal Descriptions (Continued)
Signal Name
Function/Notes
SLCDC2_D0
SLCD Data input signal for pass through to SLCD device. This signal is multiplexed with SSI3_FS signal
from SSI3.
Bus Master Interface (BMI)
BMI_D[15:0]
BMI_CLK_CS
BMI bidirectional data bus. Bus width is programmable between 8-bit or 16-bit.These signals are
multiplexed with LD[15:0] and SLCDC_DAT[15:0].
BMI bidirectional clock or chip select signal.This signal is multiplexed with LSCLK of LCDC.
BMI_WRITE
BMI bidirectional signal to indicate read or write access. This is an input signal when the BMI is a slave
and an output signal when BMI is the master of the interface. BMI_WRITE is asserted for write and
negated for read.This signal is muxed with LD[17] of LCDC.
BMI_READ
BMI output signal to enable data read from external slave device. This signal is not used and driven high
when BMI is slave.This signal is multiplexed with CONTRAST signal of LCDC.
BMI_READ_REQ
BMI Read request output signal to external bus master. This signal is active when the data in the TXFIFO
is larger or equal to the data transfer size of a single external BMI access.This signal is muxed with
LD[16] of LCDC.
BMI_RXF_FULL
BMI Receive FIFO full active high output signal to reflect if the RxFIFO reaches water mark value.This
signal is muxed with VSYNC of the LCDC.
BMI_WAIT
BMI Wait—Active low signal to wait for data ready (read cycle) or accepted (write_cycle). Also
multiplexed with VSYNC.
External DMA
EXT_DMAREQ
EXT_DMAGRANT
External DMA Request input signal. This signal is multiplexed with CSPI1_RDY.
External DMA Grant output signal. This signal is multiplexed with LD[16] of LCDC and CSPI1_SS1 of
CSPI1.
NAND Flash Controller
NF_CLE
NAND Flash Command Latch Enable output signal. Multiplexed with PC_POE of PCMCIA.
NF_CE
NAND Flash Chip Enable output signal. This signal is multiplexed with PC_CE1 of PCMCIA.
NF_WP
NAND Flash Write Protect output signal. This signal is multiplexed with PC_CE2 of PCMCIA.
NF_ALE
NAND Flash Address Latch Enable output signal. This signal is multiplexed with PC_OE of PCMCIA.
NF_RE
NAND Flash Read Enable output signal. This signal is multiplexed with PC_RW of PCMCIA.
NF_WE
NAND Flash Write Enable output signal. This signal is multiplexed with and PC_BVD2 of PCMCIA.
NF_RB
NAND Flash Ready Busy input signal. This signal is multiplexed with PC_RST of PCMCIA.
NF_IO[15:0]
NAND Flash Data input and output signals. NF_IO[15:7] signals are multiplexed with A[25:21] and
A[15:13]. NF_IO[7:0] signals are multiplexed with several PCMCIA signals.
PCMCIA Controller
PC_A[25:0]
PCMCIA Address signals. These signals are multiplexed with A[25:0].
PC_D[15:0]
PCMCIA Data input and output signals. These signals are multiplexed with D[15:0].
PC_CD1
PCMCIA Card Detect1 input signal. This signal is multiplexed with NFIO[7] signal of NF.
PC_CD2
PCMCIA Card Detect2 input signal. This signal is multiplexed with NFIO[6] signal of NF.
PC_WAIT
PCMCIA Wait input signal to extend current access. This signal is multiplexed with NFIO[5] signal of NF.
PC_READY
PCMCIA Ready input signal indicates card is ready for access. Multiplexed with NFIO[4] signal of NF.
MC9328MX21 Technical Data, Rev. 3.4
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Signal Descriptions
Table 2. i.MX21 Signal Descriptions (Continued)
Signal Name
Function/Notes
PC_RST
PCMCIA Reset output signal. This signal is multiplexed with NFRB signal of NF.
PC_OE
PCMCIA Memory Read Enable output signal asserted during common or attribute memory read cycles.
This signal is multiplexed with NFALE signal of NF.
PC_WE
PCMCIA Memory Write Enable output signal asserted during common or attribute memory cycles. This
signal is shared with RW of the EIM.
PC_VS1
PCMCIA Voltage Sense1 input signal. This signal is multiplexed with NFIO[2] signal of NF.
PC_VS2
PCMCIA Voltage Sense2 input signal. This signal is multiplexed with NFIO[1] signal of NF.
PC_BVD1
PCMCIA Battery Voltage Detect1 input signal. This signal is multiplexed with NFIO[0] signal of NF.
PC_BVD2
PCMCIA Battery Voltage Detect2 input signal. This signal is multiplexed with NF_WE signal of NF.
PC_SPKOUT
PCMCIA Speaker Out output signal. This signal is multiplexed with PWMO signal.
PC_REG
PCMCIA Register Select output signal. This signal is shared with EB2 of EIM.
PC_CE1
PCMCIA Card Enable1 output signal. This signal is multiplexed with NFCE signal of NF.
PC_CE2
PCMCIA Card Enable2 output signal. This signal is multiplexed with NFWP signal of NF.
PC_IORD
PCMCIA IO Read output signal. This signal is shared with EB3 of EIM.
PC_IOWR
PCMCIA IO Write output signal. This signal is shared with OE signal of EIM.
PC_WP
PCMCIA Write Protect input signal. This signal is multiplexed with NFIO[3] signal of NF.
PC_POE
PCMCIA Output Enable signal to enable voltage translation buffers and transceivers. This signal is
multiplexed with NFCLE signal of NF.
PC_RW
PCMCIA Read Write output signal to control external transceiver direction. Asserted high for read
access and negated low for write access. This signal is multiplexed with NFRE signal of NF.
PC_PWRON
PCMCIA input signal to indicate that the card power has been applied and stabilized.
CSPI
CSPI1_MOSI
Master Out/Slave In signal
CSPI1_MISO
Master In/Slave Out signal
CSPI1_SS[2:0]
Slave Select (Selectable polarity) signal. CSPI1_SS2 is also multiplexed with USBG_RXDAT and
CSPI1_SS1 is multiplexed with EXT_DMAGRANT.
CSPI1_SCLK
Serial Clock signal
CSPI1_RDY
Serial Data Ready signal. Also multiplexed with EXT_DMAREQ.
CSPI2_MOSI
Master Out/Slave In signal. This signal is multiplexed with USBH2_TXDP signal of USB OTG.
CSPI2_MISO
Master In/Slave Out signal. This signal is multiplexed with USBH2_TXDM signal of USB OTG.
CSPI2_SS[2:0]
Slave Select (Selectable polarity) signals. These signals are multiplexed with USBH2_FS,
USBH2_RXDP and USBH2_RXDM signal of USB OTG
CSPI2_SCLK
Serial Clock signal. This signal is multiplexed with USBH2_OE signal of USB OTG
CSPI3_MOSI
Master Out/Slave In signal. This signal is multiplexed with SD1_CMD.
CSPI3_MISO
Master In/Slave Out signal. This signal is multiplexed with SD1_D0.
CSPI3_SS
Slave Select (Selectable polarity) signal multiplexed with SD1_D3.
CSPI3_SCLK
Serial Clock signal. This signal is multiplexed with SD1_CLK.
MC9328MX21 Technical Data, Rev. 3.4
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Freescale Semiconductor
Signal Descriptions
Table 2. i.MX21 Signal Descriptions (Continued)
Signal Name
Function/Notes
General Purpose Timers
TIN
Timer Input Capture or Timer Input Clock—The signal on this input is applied to all 3 timers
simultaneously. This signal is muxed with the Walk-up Guard Mode WKGD signal in the PLL, Clock, and
Reset Controller module.
TOUT1
(or simply TOUT)
Timer Output signal from General Purpose Timer1 (GPT1). This signal is multiplexed with SYS_CLK1
and SYS_CLK2 signal of SSI1 and SSI2. The pin name of this signal is simply TOUT.
TOUT2
Timer Output signal from General Purpose Timer1 (GPT2). This signal is multiplexed with PWMO.
TOUT3
Timer Output signal from General Purpose Timer1 (GPT3). This signal is multiplexed with PWMO.
USB On-The-Go
USB_BYP
USB Bypass input active low signal. This signal can only be used for USB function, not for GPIO.
USB_PWR
USB Power output signal
USB_OC
USB Over current input signal. This signal can only be used for USB function, not for GPIO.
USBG_RXDP
USB OTG Receive Data Plus input signal. This signal is muxed with SLCDC1_DAT15.
USBG_RXDM
USB OTG Receive Data Minus input signal. This signal is muxed with SLCDC1_DAT14.
USBG_TXDP
USB OTG Transmit Data Plus output signal. This signal is muxed with SLCDC1_DAT13.
USBG_TXDM
USB OTG Transmit Data Minus output signal. This signal is muxed with SLCDC1_DAT12.
USBG_RXDAT
USB OTG Transceiver differential data receive signal. Multiplexed with CSPI1_SS2.
USBG_OE
USB OTG Output Enable signal. This signal is muxed with SLCDC1_DAT11.
USBG_ON
USB OTG Transceiver ON output signal. This signal is muxed with SLCDC1_DAT9.
USBG_FS
USB OTG Full Speed output signal. This signal is multiplexed with external transceiver USBG_TXR_INT
signal of USB OTG. This signal is muxed with SLCDC1_DAT10.
USBH1_RXDP
USB Host1 Receive Data Plus input signal. This signal is multiplexed with UART4_RXD and
SLCDC1_DAT6. It also provides an alternative multiplex for UART4_RTS, where this signal is selectable
by programming the Function Multiplexing Control Register in the System Control chapter.
USBH1_RXDM
USB Host1 Receive Data Minus input signal. This signal is muxed with SLCDC1_DAT5. It also provides
an alternative multiplex for UART4_CTS.
USBH1_TXDP
USB Host1 Transmit Data Plus output signal. This signal is multiplexed with UART4_CTS and
SLCDC1_DAT4. It also provides an alternative multiplex for UART4_RXD, where this signal is selectable
by programming the Function Multiplexing Control Register in the System Control chapter.
USBH1_TXDM
USB Host1 Transmit Data Minus output signal. Multiplexed with UART4_TXD and SLCDC1_DAT3.
USBH1_RXDAT
USB Host1 Transceiver differential data receive signal. Multiplexed with USBH1_FS.
USBH1_OE
USB Host1 Output Enable signal. This signal is muxed with SLCDC1_DAT2.
USBH1_FS
USB Host1 Full Speed output signal. Multiplexed with UART4_RTS and SLCDC1_DAT1 and
USBH1_RXDAT.
USBH_ON
USB Host transceiver ON output signal. This signal is muxed with SLCDC1_DAT0.
USBH2_RXDP
USB Host2 Receive Data Plus input signal. This signal is multiplexed with CSPI2_SS[1] of CSPI2.
USBH2_RXDM
USB Host2 Receive Data Minus input signal. This signal is multiplexed with CSPI2_SS[2] of CSPI2.
USBH2_TXDP
USB Host2 Transmit Data Plus output signal. This signal is multiplexed with CSPI2_MOSI of CSPI2.
USBH2_TXDM
USB Host2 Transmit Data Minus output signal. This signal is multiplexed with CSPI2_MISO of CSPI2.
USBH2_OE
USB Host2 Output Enable signal. This signal is multiplexed with CSPI2_SCLK of CSPI2.
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
11
Signal Descriptions
Table 2. i.MX21 Signal Descriptions (Continued)
Signal Name
Function/Notes
USBH2_FS
USB Host2 Full Speed output signal. This signal is multiplexed with CSPI2_SS[0] of CSPI2.
USBG_SCL
USB OTG I2C Clock input/output signal. This signal is multiplexed with SLCDC1_DAT8.
USBG_SDA
USB OTG I2C Data input/output signal. This signal is multiplexed with SLCDC1_DAT7.
USBG_TXR_INT
USB OTG transceiver interrupt input. Multiplexed with USBG_FS.
Secure Digital Interface
SD1_CMD
SD Command bidirectional signal—If the system designer does not want to make use of the internal pullup, via the Pull-up enable register, a 4.7k–69k external pull-up resistor must be added. This signal is
multiplexed with CSPI3_MOSI.
SD1_CLK
SD Output Clock. This signal is multiplexed with CSPI3_SCLK.
SD1_D[3:0]
SD Data bidirectional signals—If the system designer does not want to make use of the internal pull-up,
via the Pull-up enable register, a 50k–69k external pull-up resistor must be added. SD1_D[3] is muxed
with CSPI3_SS while SD1_D[0] is muxed with CSPI3_MISO.
SD2_CMD
SD Command bidirectional signal. This signal is multiplexed with SLCDC1_CS signal from SLCDC1.
SD2_CLK
SD Output Clock signal. This signal is multiplexed with SLCDC1_CLK signal from SLCDC1.
SD2_D[3:0]
SD Data bidirectional signals. SD2_D[3:2] are multiplexed with SLCDC1_RS and SLCDC_D0 signals
from SLCDC1.
UARTs – IrDA/Auto-Bauding
UART1_RXD
Receive Data input signal
UART1_TXD
Transmit Data output signal
UART1_RTS
Request to Send input signal
UART1_CTS
Clear to Send output signal
UART2_RXD
Receive Data input signal. This signal is multiplexed with KP_ROW6 signal from KPP.
UART2_TXD
Transmit Data output signal. This signal is multiplexed with KP_COL6 signal from KPP.
UART2_RTS
Request to Send input signal. This signal is multiplexed with KP_ROW7 signal from KPP.
UART2_CTS
Clear to Send output signal. This signal is multiplexed with KP_COL7 signal from KPP.
UART3_RXD
Receive Data input signal. This signal is multiplexed with IR_RXD from FIRI.
UART3_TXD
Transmit Data output signal. This signal is multiplexed with IR_TXD from FIRI.
UART3_RTS
Request to Send input signal
UART3_CTS
Clear to Send output signal
UART4_RXD
Receive Data input signal which is multiplexed with USBH1_RXDP and USBH1_TXDP.
UART4_TXD
Transmit Data output signal which is multiplexed with USBH1_TXDM.
UART4_RTS
Request to Send input signal which is multiplexed with USBH1_FS and USBH1_RXDP.
UART4_CTS
Clear to Send output signal which is multiplexed with USBH1_TXDP and USBH1_RXDM.
Serial Audio Port – SSI (configurable to I2S protocol and AC97)
SSI1_CLK
Serial clock signal which is output in master or input in slave
SSI1_TXD
Transmit serial data
SSI1_RXD
Receive serial data
SSI1_FS
Frame Sync signal which is output in master and input in slave
MC9328MX21 Technical Data, Rev. 3.4
12
Freescale Semiconductor
Signal Descriptions
Table 2. i.MX21 Signal Descriptions (Continued)
Signal Name
Function/Notes
SYS_CLK1
SSI1 master clock. Multiplexed with TOUT.
SSI2_CLK
Serial clock signal which is output in master or input in slave.
SSI2_TXD
Transmit serial data signal
SSI2_RXD
Receive serial data
SSI2_FS
Frame Sync signal which is output in master and input in slave.
SYS_CLK2
SSI2 master clock. Multiplexed with TOUT.
SSI3_CLK
Serial clock signal which is output in master or input in slave. Multiplexed with SLCDC2_CLK
SSI3_TXD
Transmit serial data signal which is multiplexed with SLCDC2_CS
SSI3_RXD
Receive serial data which is multiplexed with SLCDC2_RS
SSI3_FS
Frame Sync signal which is output in master and input in slave. Multiplexed with SLCDC2_D0.
SAP_CLK
Serial clock signal which is output in master or input in slave.
SAP_TXD
Transmit serial data
SAP_RXD
Receive serial data
SAP_FS
Frame Sync signal which is output in master and input in slave.
I2C
I2C_CLK
I2C Clock
I2C_DATA
I2C Data
1-Wire
OWIRE
1-Wire input and output signal. This signal is multiplexed with JTAG RTCK.
PWM
PWMO
PWM Output. This signal is multiplexed with PC_SPKOUT of PCMCIA, as well as TOUT2 and TOUT3
of the General Purpose Timer module.
General Purpose Input/Output
PF[16]
Dedicated GPIO. When unused, program this signal as an input with the on-chip pull-up resistor
enabled.
Keypad
KP_COL[7:0]
Keypad Column selection signals. KP_COL[7:6] are multiplexed with UART2_CTS and UART2_TXD
respectively. Alternatively, KP_COL6 is also available on the internal factory test signal TEST_WB2. The
Function Multiplexing Control Register in the System Control chapter must be used in conjunction with
programming the GPIO multiplexing (to select the alternate signal multiplexing) to choose which signal
KP_COL6 is available.
KP_ROW[7:0]
Keypad Row selection signals. KP_ROW[7:6] are multiplexed with UART2_RTS and UART2_RXD
signals respectively. Alternatively, KP_ROW7 and KP_ROW6 are available on the internal factory test
signals TEST_WB0 and TEST_WB1 respectively. The Function Multiplexing Control Register in the
System Control chapter must be used in conjunction with programming the GPIO multiplexing (to select
the alternate signal multiplexing) to choose which signals KP_ROW6 and KP_ROW7 are available.
Noisy Supply Pins
NVDD
Noisy Supply for the I/O pins. There are six (6) I/O voltages, NVDD1 through NVDD6.
NVSS
Noisy Ground for the I/O pins
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
13
Specifications
Table 2. i.MX21 Signal Descriptions (Continued)
Signal Name
Function/Notes
Supply Pins – Analog Modules
VDDA
Supply for analog blocks
QVSS (internally
connected to AVSS)
Quiet GND for analog blocks (QVSS and AVSS are synonymous)
Internal Power Supplies
QVDD
Power supply pins for silicon internal circuitry
QVSS
Quiet GND pins for silicon internal circuitry
QVDDX
3
Power supply pin for the ARM core. Externally connect directly to QVDD
Specifications
This section contains the electrical specifications and timing diagrams for the i.MX21 processor.
3.1
Maximum Ratings
Table 3 provides the maximum ratings.
CAUTION
Stresses beyond those listed under “Maximum Ratings,” (Table 3) may cause
permanent damage to the device. These are stress ratings only. Functional operation
of the device at these or any other conditions beyond those indicated under
“266 MHz Recommended Operating Range” (Table 4) is not implied. Exposure to
maximum-rated conditions for extended periods may affect device reliability.
Table 3. Maximum Ratings
Ref. Num
1
2
3
Parameter
Supply Voltage
Input Voltage Range
Storage Temperature Range
Symbol
Min
Max
Units
QVDD max, QVDDXmax
-0.3
2.1
V
NVDDmax, VDDAmax
-0.3
3.3
VImax
Tstorage
-0.3
-55
VDD +
V
0.31
150
V
oC
1. VDD is the supply voltage associated with the input. See Signal Multiplexing Scheme table in the reference manual.
3.2
Recommended Operating Range
Table 4 provides the recommended operating ranges. The device has multiple pairs of VDD and VSS
power supply and return pins. QVDD, QVDDx, and QVSS pins are used for internal logic. All other VDD
and VSS pins are for the I/O pads voltage supply, and each pair of VDD and VSS provides power to the
enclosed I/O pads. This design allows different peripheral supply voltage levels in a system.
Because VDDA pins are supply voltages to the analog pads, it is recommended to isolate and noise-filter
the VDDA pins from other VDD pins.
MC9328MX21 Technical Data, Rev. 3.4
14
Freescale Semiconductor
Specifications
For more information about I/O pads grouping per VDD, please refer to Table 4.
Table 4. 266 MHz Recommended Operating Range
Rating
Operating temperature range
Symbol
Minimum
Maximum
Unit
VK, VM
TA
0
70
°C
DVK, DVM
TA
-30
70
°C
CVK, CVM
TA
- 40
85
°C
NVDDx
1.70
3.30
V
QVDD, QVDDx
1.45
1.65
V
VDDA
1.70
3.30
V
Part No. Suffix
I/O supply voltage NVDD 1–6
Internal supply voltage (Core = 266 MHz)
Analog supply voltage
3.3
DC Electrical Characteristics
Table 5 contains the DC characteristics of the i.MX21.
Table 5. DC Characteristics
Symbol
Test Conditions
Min
Typ1
Max
High-level input voltage
VIH
–
0.7NVDD
–
NVDD
Low-level Input voltage
VIL
–
O
–
0.3NVDD
High-level output voltage
VOH
IOH = spec’ed Drive
0.8NVDD
–
–
V
Low-level output voltage
VOL
IOL = spec’ed Drive
–
–
0.2NVDD
V
High-level output current, slow I/O
IOH_S
Vout=0.8NVDD
DSCR2 = 000
DSCR = 001
DSCR = 011
DSCR = 111
-2
-4
-8
-12
–
–
mA
High-level output current, fast I/O
IOH_F
Vout=0.8NVDD1
DSCR2 = 000
DSCR = 001
DSCR = 011
DSCR = 111
-3.5
-4.5
-5.5
-6.5
–
–
mA
Low-level output current, slow I/O
IOL_S
Vout=0.2NVDD
DSCR2 = 000
DSCR = 001
DSCR = 011
DSCR = 111
2
4
8
12
–
–
mA
Low-level output current, fast I/O
IOL_F
Vout=0.2NVDD1
DSCR2 = 000
DSCR = 001
DSCR = 011
DSCR = 111
3.5
4.5
5.5
6.5
–
–
mA
Schmitt trigger Positive–input threshold
VT +
–
–
–
2.15
V
Schmitt trigger Negative–input threshold
VT -
0.75
–
–
V
Hysteresis
VHYS
–
0.3
–
V
Parameter
–
Units
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
15
Specifications
Table 5. DC Characteristics (Continued)
Parameter
Symbol
Test Conditions
Min
Typ1
Max
Units
Input leakage current (no pull-up or pulldown)
Iin
Vin = 0 or NVDD
–
–
±1
μA
I/O leakage current
IOZ
VI/O = NVDD or 0
I/O = High impedance
state
–
–
±5
μA
1. Data labeled Typical is not guaranteed, but is intended as an indication of the IC's potential performance.
2. For DSCR definition refer to the System Control chapter in the reference manual.
Table 6 shows the input and output capacitance for the device.
Table 6. Input/Output Capacitance
Parameter
Symbol
Min
Typ
Max
Units
Input capacitance
Ci
–
–
5
pF
Output capacitance
Co
–
–
5
pF
Table 7 shows the power consumption for the device.
Table 7. Power Consumption
ID
Parameter
Conditions
Symbol
1
Run Current
QVDD = QVDDX = 1.65 V, NVDD1 = 1.8 V.
NVDD2 through NVDD6 = VDDA = 3.1V.
Core = 266 MHz, System = 133 MHz.
MPEG4 Playback (QVGA) from MMC/SD card, 30fps,
44.1kHz audio.
IQVDD + IQVDDX
120
–
mA
INVDD1
8
–
mA
INVDD2 through INVDD6 + IVDDA
6.6
–
mA
QVDD = QVDDX = 1.65V, TA1
–
3.0
mA
QVDD = QVDDX = 1.65V, 25°
–
700
μA
QVDD = QVDDX = 1.55V, 25°
320
–
μA
2
Sleep Current Standby current with Well Biasing System enabled.
Well Bias Control Register (WBCR) must be set as
follows:
WBCR:
CRM_WBS bits = 01
CRM_WBFA bit = 1
CRM_WBM bits = 001
CRM_SPA_SEL bit = 1
FMCR bit = 1
Typ Max Units
ISTBY
For WBCR definition refer to System Control Chapter
in the reference manual.
1. TA = 70°C for suffixes VK, VM, DVK, DVM, and SVK. TA = 85°C for suffixes CVK, CVM, and SCVK.
3.4
AC Electrical Characteristics
The AC characteristics consist of output delays, input setup and hold times, and signal skew times. All
signals are specified relative to an appropriate edge of other signals. All timing specifications are specified
at a system operating frequency (HCLK) from 0 MHz to 133 MHz (core operating frequency 266 MHz)
with an operating supply voltage from VDD min to VDD max under an operating temperature from TL to TH.
MC9328MX21 Technical Data, Rev. 3.4
16
Freescale Semiconductor
Specifications
All timing is measured at 30 pF loading with the exception of fast I/O signals as discussed below. Refer
to the reference manual’s System Control Chapter for details on drive strength settings.
Table 8 provides the maximum loading guidelines that can be tolerated on a memory I/O signal (also
known as Fast I/O) to achieve 133 MHz operation. These critical signals include the SDRAM Clock
(SDCLK), Data Bus signals (D[31:0]), lower order address signals such as A0-A10, MA10, MA11, and
other signals required to meet 133 MHz timing.
The values shown in Table 8 apply over the recommended operating temperature range. Care must be
taken to minimize parasitic capacitance of associated printed circuit board traces.
Table 8. Loading Guidelines for Fast IO Signals to Achieve 133 MHz Operation
Drive Strength Setting (DSCR2–DSCR12)
Maximum I/O Loading at 1.8 V
Maximum I/O Loading at 3.0 V
000: 3.5 mA
9 pF
12 pF
001: 4.5 mA
12 pF
16 pF
011: 5.5 mA
15 pF
21 pF
111: 6.5 mA
19 pF
26 pF
Table 9. 32k/26M Oscillator Signal Timing
Parameter
Minimum
RMS
Maximum
Unit
EXTAL32k input jitter (peak to peak) for both System PLL and MCUPLL
–
5
20
ns
EXTAL32k input jitter (peak to peak) for MCUPLL only
–
5
100
ns
800
–
–
ms
EXTAL32k startup time
Table 10. CLKO Rise/Fall Time (at 30pF Loaded)
3.5
Best Case
Typical
Worst Case
Units
Rise Time
0.80
1.00
1.40
ns
Fall Time
0.74
1.08
1.67
ns
DPLL Timing Specifications
Parameters of the DPLL are given in Table 11. In this table, Tref is a reference clock period after the
predivider and Tdck is the output double clock period.
Table 11. DPLL Specifications
Parameter
Test Conditions
Minimum
Typical
Maximum
Unit
Reference clock frequency range
Vcc = 1.5V
16
–
320
MHz
Pre-divider output clock frequency
range
Vcc = 1.5V
16
–
32
MHz
Double clock frequency range
Vcc = 1.5V
220
–
560
MHz
–
1
–
16
–
Includes both integer and fractional parts
5
–
15
–
Pre-divider factor (PD)
Total multiplication factor (MF)
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
17
Specifications
Table 11. DPLL Specifications (Continued)
Parameter
MF integer part
MF numerator
Test Conditions
Minimum
Typical
Maximum
Unit
–
5
–
15
–
0
–
1022
–
1
–
1023
–
Should be less than the denominator
MF denominator
–
Frequency lock-in time after
full reset
FOL mode for non-integer MF
(does not include pre-multi lock-in time)
350
400
450
Tref
Frequency lock-in time after
partial reset
FOL mode for non-integer MF
(does not include pre-multi lock-in time)
220
280
330
Tref
Phase lock-in time after
full reset
FPL mode and integer MF
(does not include pre-multi lock-in time)
480
530
580
Tref
Phase lock-in time after
partial reset
FPL mode and integer MF
(does not include pre-multi lock-in time)
360
410
460
Tref
–
0.02
0.03
2•Tdck
Frequency jitter (p-p)
–
Phase jitter (p-p)
Integer MF, FPL mode, Vcc=1.7V
–
1.0
1.5
ns
Power dissipation
FOL mode, integer MF,
fdck = 560 MHz, Vcc = 1.5V
–
1.5
–
mW
(Avg)
3.6
Reset Module
The timing relationships of the Reset module with the POR and RESET_IN are shown in Figure 2 and
Figure 3. Be aware that NVDD must ramp up to at least 1.7V for NVDD1 and 2.7V for NVDD2-6 before
QVDD is powered up to prevent forward biasing.
POR
1
Can be adjusted depending on the crystal
start-up time 32kHz or 32.768kHz
RESET_POR
2
Exact 300ms
3
7 cycles @ CLK32
RESET_DRAM
4
HRESET
14 cycles @ CLK32
RESET_OUT
CLK32
HCLK
Figure 2. Timing Relationship with POR
MC9328MX21 Technical Data, Rev. 3.4
18
Freescale Semiconductor
Specifications
5
RESET_IN
14 cycles @ CLK32
HRESET
4
RESET_OUT
6
CLK32
HCLK
Figure 3. Timing Relationship with RESET_IN
Table 12. Reset Module Timing Parameters
1.8 V ± 0.10 V 3.0 V ± 0.30 V
Ref
No.
Parameter
Unit
Min
Max
Min
Max
1
Width of input POWER_ON_RESET
800
–
800
–
ms
2
Width of internal POWER_ON_RESET
(CLK32 at 32 kHz)
300
300
300
300
ms
3
7k to 32k-cycle stretcher for SDRAM reset
7
7
7
7
Cycles of CLK32
4
14k to 32k-cycle stretcher for internal system reset HRESERT
and output reset at pin RESET_OUT
14
14
14
14
Cycles of CLK32
5
Width of external hard-reset RESET_IN
4
–
4
–
Cycles of CLK32
6
4k to 32k-cycle qualifier
4
4
4
4
Cycles of CLK32
3.7
External DMA Request and Grant
The External DMA request is an active low signal to be used by devices external to i.MX21 processor to
request the DMAC for data transfer.
After assertion of External DMA request the DMA burst will start when the channel on which the External
request is the source (as per the RSSR settings) becomes the current highest priority channel. The external
device using the External DMA request should keep its request asserted until it is serviced by the DMAC.
One External DMA request will initiate one DMA burst.
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
19
Specifications
The output External Grant signal from the DMAC is an active-low signal.When the following conditions
are true, the External DMA Grant signal is asserted with the initiation of the DMA burst.
• The DMA channel for which the DMA burst is ongoing has request source as external DMA
Request
(as per source select register setting).
• REN and CEN bit of this channel are set.
• External DMA Request is asserted.
After the grant is asserted, the External DMA request will not be sampled until completion of the DMA
burst. As the external request is synchronized, the request synchronization will not be done during this
period. The priority of the external request becomes low for the next consecutive burst, if another DMA
request signal is asserted.
Worst case—that is, the smallest burst (1 byte read/write) timing diagrams are shown in Figure 4 and
Figure 5. Minimum and maximum timings for the External request and External grant signals are present
in Table 13.
Figure 4 shows the minimum time for which the External Grant signal remains asserted when an External
DMA request is de-asserted immediately after sensing grant signal active.
Ext_DMAReq
Ext_DMAGrant
tmin_assert
Figure 4. Assertion of DMA External Grant Signal
Figure 5 shows the safe maximum time for which External DMA request can be kept asserted, after
sensing grant signal active such that a new burst is not initiated.
Ext_DMAReq
Ext_DMAGrant
tmax_req_assert
Data read from
External device
tmax_read
Data written to
External device
tmax_write
NOTE: Assuming in worst case the data is read/written from/to External device as per the above waveform.
Figure 5. Safe Maximum Timings for External Request De-Assertion
MC9328MX21 Technical Data, Rev. 3.4
20
Freescale Semiconductor
Specifications
Table 13. DMA External Request and Grant Timing Parameters
3.0 V
Parameter
tmin_assert
1.8 V
Description
Minimum assertion time of External Grant
signal
tmax_req_assert Maximum External request assertion time
after assertion of Grant signal
Unit
WCS
BCS
WCS
BCS
8 hclk + 8.6
8 hclk + 2.74
8 hclk + 7.17
8 hclk + 3.25
ns
9 hclk - 20.66
9 hclk - 6.7
9 hclk - 17.96
9 hclk - 8.16
ns
tmax_read
Maximum External request assertion time
after first read completion
8 hclk - 6.21
8 hclk - 0.77
8 hclk - 5.84
8 hclk - 0.66
ns
tmax_write
Maximum External request assertion time
after completion of first write
3 hclk - 15.87
3 hclk - 8.83
3 hclk - 15.9
3 hclk - 9.12
ns
3.8
3.8.1
3.8.1.1
BMI Interface Timing Diagram
Connecting BMI to ATI MMD Devices
ATI MMD Devices Drive the BMI_CLK/CS
In this mode MMD_MODE_SEL bit is set and MMD_CLKOUT bit is cleared. BMI_WRITE and
BMI_CLK/CS are input signals to BMI driving by ATI MMD chip set. Output signal BMI_READ_REQ
can be used as interrupt signal to inform MMD that data is ready in BMI TxFIFO for read access. MMD
can write data to BMI RxFIFO anytime as CPU or DMA can move data out from RxFIFO much faster
than the BMI interface. Overflow interrupt is generated if RxFIFO overflow is detected. Once this
happens, the new coming data is ignored.
3.8.1.1.1
MMD Read BMI Timing
Figure 6 shows the MMD read BMI timing when the MMD drives clock.
On each rising edge of BMI_CLK/CS BMI checks the BMI_WRITE logic level to determine if the current
cycle is a read cycle. It puts data into the data bus and enables the data out on the rising edge of BMI_CLK/
CS if BMI_WRITE is logic high. The BMI_READ_REQ is negated one hclk cycle after the BMI_CLK/
CS rising edge of last data read. The MMD cannot issues read command when BMI_READ_REQ is low
(no data in TxFIFO).
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
21
Specifications
1T
BMI_CLK/CS
Trh
Tdh
BMI_READ_REQ
Tds
BMI_D[15:0]
TxD1
BMI_WRITE
TxD2
Last TxD
Ts
Figure 6. MMD (ATI) Drives Clock, MMD Read BMI Timing
(MMD_MODE_SEL=1, MASTER_MODE_SEL=0,MMD_CLKOUT=0)
Table 14. MMD Read BMI Timing Table when MMD Drives Clock
Item
Symbol
Minimum
Typical
Maximum
Unit
Clock period
1T
33.3
–
–
ns
write setup time
Ts
11
–
–
ns
read_req hold time
Trh
6
–
24
ns
transfer data setup time
Tds
6
–
14
ns
transfer data hold time
Tdh
6
-
14
ns
Note: All the timings assume that the hclk is running at 133 MHz.
Note: The MIN period of the 1T is assumed that MMD latch data at falling edge.
Note: If the MMD latch data at next rising edge, the ideally max clock can be as much as double, but because the BMI data pads
are slow pads and it max frequency can only up to 18MHz, the max clock frequency can only up to 36 MHz.
3.8.1.1.2
MMD Write BMI Timing
Figure 7 shows the MMD write BMI timing when MMD drives clock. On each falling edge of BMI_CLK/
CS BMI checks the BMI_WRITE logic level to determine if the current cycle is a write cycle. If the BMI_
WRITE is logic low, it latches data into the RxFIFO on each falling edge of BMI_CLK/CS signal.
MC9328MX21 Technical Data, Rev. 3.4
22
Freescale Semiconductor
Specifications
BMI_CLK/CS
BMI_READ_REQ
Can be asserted any time
BMI_D[15:0]
RxD1
Can be asserted any time
RxD2
Last RxD
Tds
BMI_WRITE
Th
Ts
Figure 7. MMD (ATI) Drives Clock, MMD Write BMI Timing
(MMD_MODE_SEL=1, MASTER_MODE_SEL=0, MMD_CLKOUT=0)
Table 15. MMD Write BMI Timing
Item
Symbol
Minimum
Typical
Maximum
Unit
write setup time
Ts
11
–
–
ns
Th
0
–
–
ns
Tds
5
–
–
ns
write old ime
h
t
receive data setup time
Note: All timings assume that the hclk is running at 133 MHz.
Note: At this mode, the maximum frequency of the BMI_CLK/CS can be up to 36 MHz (doubles as maximum data pad speed).
3.8.1.2
BMI Drives the BMI_CLK/CS
In this mode MMD_MODE_SEL and MMD_CLKOUT are both set. The software must know which
mode it is now (READ or WRITE). When the BMI_WRITE is high, BMI drives BMI_CLK/CS out if the
TxFIFO is not emptied. When BMI_WRITE is low, user can write a 1 to READ bit of control register1 to
issue a write cycle (MMD write BMI).
3.8.1.3
MMD Read BMI Timing
Figure 13 shows the MMD read BMI timing when BMI drives the BMI_CLK/CS. When the BMI_WRITE
is high, the BMI drives BMI_CLK/CS out if data is written to TxFIFO (BMI_READ_REQ become high),
BMI puts data into data bus and enable data out on the rising edge of BMI_CLK/CS. The MMD devices
can latch the data on each falling edge of BMI_CLK/CS.
It is recommended that the MMD do not change the BMI_WRITE signal from high to low when the
BMI_READ_REQ is asserted. If user writes data to the TxFIFO when the BMI_WRITE is low, the BMI
will drive BMI_CLK/CS out once the BMI_WRITE is changed from low to high.
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
23
Specifications
1T
BMI_CLK/CS
BMI_READ_REQ
BMI_D[15:0]
Trh
Tdh
Tds
TxD1
TxD2
Last TxD
BMI_WRITE
DMA or CPU write data to TxFIFO
Figure 8. BMI Drives Clock, MMD Read BMI Timing
(MASTER_MODE_SEL=0, MMD_MODE_SEL=1, MMD_CLKOUT=1)
Table 16. MMD Read BMI Timing Table when BMI Drives Clock
Item
Symbol
Minimum
Typical
Maximum
Unit
Transfer data setup time
Tds
2
–
8
ns
Transfer data hold time
Tdh
2
–
8
ns
Read_req hold time
Trh
2
–
18
ns
Note: In this mode, the max frequency of the BMI_CLK/CS can be up to 36MHz (double as max data pad speed).
Note: The BMI_CLK/CS can only be divided by 2,4,8,16 from HCLK.
3.8.1.4
MMD Write BMI Timing
Figure 9 shows the MMD write BMI timing when BMI drives BMI_CLK/CS.
When the BMI_WRITE signal is asserted, the BMI can write a 1 to READ bit of control register to issue
a WRITE cycle. This bit is cleared automatically when the WRITE operation is completed. In a WRITE
burst the MMD will write COUNT+1 data to the BMI. The user can issue another WRITE operation if the
MMD still has data to write after the first operation completed.
The BMI can latch the data either at falling edge or the next rising edge of the BMI_CLK/CS according to
the DATA_LATCH bit. When the DATA_LATCH bit is set, the BMI latch data at the next rising edge and
latch the last data using the internal clock.
BMI_WRITE signal can not be negated when the WRITE operation is proceeding.
MC9328MX21 Technical Data, Rev. 3.4
24
Freescale Semiconductor
Specifications
Total has COUNT+1 clocks in one burst
BMI_CLK/CS
BMI_READ_REQ
Can be asserted any time
BMI_D[15:0]
RxD1
RxD2
Last RxD
Tds2
Tds1
BMI_WRITE
Can be asserted any time
A 1 is written to READ bit of control register
Figure 9. BMI Drives Clock, MMD Write BMI Timing
(MASTER_MODE_SEL=0, MMD_MODE_SEL=1, MMD_CLKOUT=1)
Table 17. MMD Write BMI Timing Table when BMI Drives Clock
Item
Symbol
Minimum
Typical
Maximum
Unit
Receive data setup time1
Tds1
14
–
–
ns
Receive data setup time2
Tds2
14
–
–
ns
Note: The BMI_CLK/CS can only be up to 30MHz if BMI latch data at the falling edge and can be up to 36MHz (double as max
data pad speed) if BMI latch data at the next rising edge.
Note: Tds1 is the receive data setup time when BMI latch data at the falling edge.
Note: Tds2 is the receive data setup time when BMI latch data at the next rising edge.
3.8.2
Connecting BMI to External Bus Master Devices
In this mode both MASTER_SEL bit and MMD_MODE_SEL bit are cleared and the MMD_CLKOUT
bit is no useful. BMI_WRITE and BMI_CLK/CS are input signals driving by the external bus master. The
Output signal BMI_READ_REQ can be used as an interrupt signal to inform external bus master that data
is ready in the BMI TxFIFO for a read access. The external bus master can write data to the BMI RxFIFO
anytime since the CPU or DMA can move data out from RxFIFO much faster than the BMI interface. An
overflow interrupt is generated if RxFIFO overflow is detected. Once this happens, the new coming data
is ignored.
Each falling edge of BMI_CLK/CS will determine if the current cycle is read or write cycle. It drives data
and enables data out if BMI_WRITE is logic high. The D_EN signal remains active only while BMI_CLK/
CS is logic low and BMI_WRITE is logic high.
Each rising edge of BMI_CLK/CS will determine if data should be latched to RxFIFO from the data bus.
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
25
Specifications
BMI_CLK/CS
BMI_READ_REQ
Ttds
BMI_D[15:0]
Ts
TxD
Ts
RxD
BMI_WRITE
Read
BMI
Trh
Trdh
Ttdh
Write
BMI
Last TxD
Th
Read
BMI
Figure 10. Memory Interface Slave Mode, External Bus Master Read/Write to BMI Timing
(MMD_MODE_SEL=0, MASTER_MODE_SEL=0)
Table 18. External Bus Master Read/Write to BMI Timing Table
Item
Symbol
Minimum
Typical
Maximum
Unit
Write setup time
Ts
11
–
–
ns
Write hold time
Th
0
–
–
ns
Receive data hold time
Trdh
3
–
–
ns
Transfer data setup time
Ttds
6
–
14
ns
Transfer data hold time
Ttdh
6
–
14
ns
Read_req hold time
Trh
6
–
24
ns
Note: All the timings are assumed that the hclk is running at 133 MHz.
3.8.3
Connecting BMI to External Bus Slave Devices
In this mode the BMI_WRITE, BMI_READ and BMI_CLK/CS are output signals driving by the BMI
module. The output signal BMI_READ_REQ is still driving active-in on a write cycle, but it can be
ignored in this case. Instead, it is used to trigger internal logic to generate the read or write signals. Data
write cycles are continuously generated when TxFIFO is not emptied.
To issue a read cycle, the user can write a value of 1 to the READ bit of control register. This bit is cleared
automatically when the read operation is completed. A read cycle reads COUNT+1 data from the external
bus slave. The user can write a 1 to the READ bit while there is still data in the TxFIFO, but the read cycle
will not start until all data in the TxFIFO is emptied. If the read cycle begins, the write operation also
cannot begin until this read cycle complete.
In this master mode operation, Int_Clk is derived from HCLK through an integer divider DIV of BMI
control register and it is used to control the read/write cycle timing by generate WRITE and CLK/CS
signals.
MC9328MX21 Technical Data, Rev. 3.4
26
Freescale Semiconductor
Specifications
3.8.3.1
Memory Interface Master Mode Without WAIT Signal
The WAIT control bit (BMICTLR1[29]) is used in this mode. When this bit is cleared (default), the
BMI_WAIT signal is ignored and the CS cycle is terminated by Wait State (WS) control bits. Figure 11
shows the BMI timing when the WAIT bit is cleared.
1+ws
1+ws
1+ws
1+ws
Int_Clk
(reference only)
Int_write
(reference only)
BMI_CLK/CS
BMI_READ_REQ
BMI_D[15:0]
TxD1
TxD2
Last TxD
RxD1
RxD2
Tdh
BMI_WRITE
BMI_READ
BMI write
BMI write
BMI write
A 1 is written to READ bit of control reg1
DMA or CPU write data to TxFIFO
On the next Int_Clk BMI issues a write cycle
BMI_READ_REQ is still logic high, BMI issues next write cycle
Figure 11. Memory Interface Master Mode, BMI Read/Write to External Slave Device Timing without Wait
Signal (MMD_MODE_SEL=0, MASTER_MODE_SEL=1)
3.8.3.2
Memory Interface Master Mode with WAIT Signal
When the WAIT control bit is set, the BMI_WAIT signal is used and the CS cycle is terminated upon
sampling a logic high BMI_WAIT signal. Figure 12 shows the BMI write timing when the WAIT bit is set.
When the BMI_WRITE is asserted, the BMI will detect the BMI_WAIT signal on every falling edge of
the Int_Clk. When it detected the high level of the BMI_WAIT, the BMI_WRITE will be negated after
1+WS Int_Clk period. If the BMI_WAIT is always high or already high before BMI_WRITE is asserted,
this timing will same as without WAIT signal. So the BMI_WRITE will be asserted at least for 1+WS
Int_Clk period.
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
27
Specifications
1+ws
1+ws
Int_Clk
(reference only)
BMI_CLK/CS
BMI_D[15:0]
TXD_a
TXD_b
BMI_READ
BMI_WRITE
BMI_WAIT
Figure 12. Memory Interface Master Mode, BMI Write to External Slave Device Timing with Wait Signal
(MMD_MODE_SEL=0, MASTER_MODE_SEL=1,WAIT=1)
Figure 13 shows the BMI read timing when the WAIT bit is set. As write timing, when the BMI_READ is
asserted, the BMI will detect the BMI_WAIT signal on every falling edge of the Int_Clk. When it detected
the high level of the BMI_WAIT, the BMI_READ will be negated after 1+WS Int_Clk period. If the
BMI_WAIT is always high or already high before BMI_READ is asserted, this timing will same as
without WAIT signal. So the BMI_READ will be asserted at least for 1+WS Int_Clk period.
1+ws
1+ws
Int_Clk
(reference only)
BMI_CLK/CS
BMI_D[15:0]
RXD_a
RXD_b
BMI_WRITE
BMI_READ
BMI_WAIT
Figure 13. Memory Interface Master Mode, BMI Read to External Slave Device Timing with Wait Signal
(MMD_MODE_SEL=0, MASTER_MODE_SEL=1,WAIT=1)
3.9
CSPI Timing Diagrams
To use the internal transmit (TX) and receive (RX) data FIFOs when the CSPI1 module is configured as a
master, two control signals are used for data transfer rate control: the SS signal (output) and the SPI_RDY
signal (input). The SPI 1 Sample Period Control Register (PERIODREG1) and the SPI 2 Sample Period
Control Register (PERIODREG2) can also be programmed to a fixed data transfer rate for either CSPI1
or CSPI2. When the CSPI1 module is configured as a slave, the user can configure the SPI 1 Control
Register (CONTROLREG1) to match the external CSPI master’s timing. In this configuration, SS
MC9328MX21 Technical Data, Rev. 3.4
28
Freescale Semiconductor
Specifications
becomes an input signal, and is used to latch data into or load data out to the internal data shift registers,
as well as to increment the data FIFO.
2
SS
1
SPIRDY
5
3
4
SCLK, MOSI, MISO
Figure 14. Master CSPI Timing Diagram Using SPI_RDY Edge Trigger
SS
SPIRDY
SCLK, MOSI, MISO
Figure 15. Master CSPI Timing Diagram Using SPI_RDY Level Trigger
SS (output)
SCLK, MOSI, MISO
Figure 16. Master CSPI Timing Diagram Ignore SPI_RDY Level Trigger
SS (input)
SCLK, MOSI, MISO
Figure 17. Slave CSPI Timing Diagram FIFO Advanced by BIT COUNT
SS (input)
6
7
SCLK, MOSI, MISO
Figure 18. Slave CSPI Timing Diagram FIFO Advanced by SS Rising Edge
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
29
Specifications
Table 19. Timing Parameters for Figure 14 through Figure 18
Ref No.
Parameter
Minimum
Maximum
Unit
2T 1
–
ns
3·Tsclk 2
–
ns
2·Tsclk
–
ns
0
–
ns
Tsclk + WAIT 3
–
ns
1
SPI_RDY to SS output low
2
SS output low to first SCLK edge
3
Last SCLK edge to SS output high
4
SS output high to SPI_RDY low
5
SS output pulse width
6
SS input low to first SCLK edge
T
–
ns
7
SS input pulse width
T
–
ns
1. T = CSPI system clock period (PERCLK2).
2. Tsclk = Period of SCLK.
3. WAIT = Number of bit clocks (SCLK) or 32.768 kHz clocks per Sample Period Control
Register.
3.10
LCD Controller
This section includes timing diagrams for the LCD controller. For detailed timing diagrams of the LCD
controller with various display configurations, refer to the LCD controller chapter of the i.MX21 Reference
Manual.
T1
LSCLK
LD[17:0]
T2
T3
Figure 19. SCLK to LD Timing Diagram
Table 20. LCDC SCLK Timing Parameters
3.0 ± 0.3V
Symbol
Parameter
Unit
Minimum
Maximum
T1
SCLK period
23
2000
ns
T2
Pixel data setup time
11
–
ns
T3
Pixel data up time
11
–
ns
The pixel clock is equal to LCDC_CLK / (PCD + 1).
When it is in CSTN, TFT or monochrome mode with bus width = 1, SCLK is equal to the pixel clock.
When it is in monochrome with other bus width settings, SCLK is equal to the pixel clock divided by bus width.
The polarity of SCLK and LD can also be programmed.
Maximum frequency of SCLK is HCLK / 3 for TFT and CSTN, otherwise LD output will be incorrect.
MC9328MX21 Technical Data, Rev. 3.4
30
Freescale Semiconductor
Specifications
Display region
Non-display region
T3
T1
VSYN
T4
T2
HSYN
OE
LD[17:0]
Line Y
Line 1
T6
T5
XMAX
Line Y
T7
HSYN
SCLK
OE
LD[15:0]
(0,1)
(0,2)
(0,X-1)
Figure 20. 4/8/12/16/18 Bit/Pixel TFT Color Mode Panel Timing
Table 21. 4/8/12/16/18 Bit/Pixel TFT Color Mode Panel Timing
Symbol
Description
Minimum
Value
Unit
T5+T6+T7-1
(VWAIT1·T2)+T5+T6+T7-1
Ts
–
XMAX+T5+T6+T7
Ts
T2
VWIDTH·T2
Ts
T1
End of OE to beginning of VSYN
T2
HSYN period
T3
VSYN pulse width
T4
End of VSYN to beginning of OE
1
(VWAIT2·T2)+1
Ts
T5
HSYN pulse width
1
HWIDTH+1
Ts
T6
End of HSYN to beginning to OE
3
HWAIT2+3
Ts
T7
End of OE to beginning of HSYN
1
HWAIT1+1
Ts
Note:
• Ts is the SCLK period.
• VSYN, HSYN and OE can be programmed as active high or active low. In Figure 20, all 3 signals are active low.
• SCLK can be programmed to be deactivated during the VSYN pulse or the OE deasserted period. In Figure 20, SCLK is
always active.
• XMAX is defined in number of pixels in one line.
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
31
Specifications
XMAX
SCLK
LD
D1
D320
SPL_SPR
D320
T1
T3
T2
HSYN
CLS
D2
T2
T4
T4
T5
T6
PS
T7
T7
REV
Figure 21. Sharp TFT Panel Timing
Table 22. Sharp TFT Panel Timing
Symbol
Description
Minimum
Value
Unit
T1
SPL/SPR pulse width
–
1
Ts
T2
End of LD of line to beginning of HSYN
1
HWAIT1+1
Ts
T3
End of HSYN to beginning of LD of line
4
HWAIT2 + 4
Ts
T4
CLS rise delay from end of LD of line
3
CLS_RISE_DELAY+1
Ts
T5
CLS pulse width
1
CLS_HI_WIDTH+1
Ts
T6
PS rise delay from CLS negation
0
PS_RISE_DELAY
Ts
T7
REV toggle delay from last LD of line
1
REV_TOGGLE_DELAY+1
Ts
Note:
•
Falling of SPL/SPR aligns with first LD of line.
•
Falling of PS aligns with rising edge of CLS.
•
REV toggles in every HSYN period.
MC9328MX21 Technical Data, Rev. 3.4
32
Freescale Semiconductor
Specifications
T1
T1
VSYN
T3
T2
T4
XMAX
T2
HSYN
SCLK
Ts
LD[15:0]
Figure 22. Non-TFT Mode Panel Timing
Table 23. Non-TFT Mode Panel Timing
Symbol
Description
Minimum
Value
Unit
T1
HSYN to VSYN delay
2
HWAIT2+2
Tpix
T2
HSYN pulse width
1
HWIDTH+1
Tpix
T3
VSYN to SCLK
–
0
T4
SCLK to HSYN
1
HWAIT1+1
≤ T3 ≤ Ts
–
Tpix
Note:
• Ts is the SCLK period while Tpix is the pixel clock period.
• VSYN, HSYN and SCLK can be programmed as active high or active low. In Figure 67, all these 3 signals are
active high.
• When it is in CSTN mode or monochrome mode with bus width = 1, T3 = Tpix = Ts.
• When it is in monochrome mode with bus width = 2, 4, and 8, T3 = 1, 2 and 4 Tpix respectively.
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
33
Specifications
3.11
Smart LCD Controller
T2
T3
T1
LCD_CS
LCD_CLK (LCD_DATA[6])
T4
SDATA (LCD_DATA[7])
T5
T7
MSB
LSB
T6
RS=0 ≥ command data, RS=1≥ display data
RS
SCKPOL = 1, CSPOL = 0
T2
T3
T1
LCD_CS
LCD_CLK (LCD_DATA[6])
T4
SDATA (LCD_DATA[7])
T5
T7
MSB
LSB
T6
RS=0 ≥ command data, RS=1≥ display data
RS
SCKPOL = 0, CSPOL = 0
T2
T3
LCD_CS
T1
LCD_CLK (LCD_DATA[6])
T4
SDATA (LCD_DATA[7])
T5
T7
MSB
LSB
T6
RS=0 ≥ command data, RS=1≥ display data
RS
SCKPOL = 1, CSPOL = 1
T2
T3
LCD_CS
T1
LCD_CLK (LCD_DATA[6])
T4
SDATA (LCD_DATA[7])
T5
MSB
T7
LSB
T6
RS
RS=0 ≥ command data, RS=1≥ display data
SCKPOL = 0, CSPOL = 1
Figure 23. SLCDC Serial Transfer Timing
MC9328MX21 Technical Data, Rev. 3.4
34
Freescale Semiconductor
Specifications
Table 24. SLCDC Serial Transfer Timing
Symbol
Description
Minimum
Maximum
Unit
T1
Pixel clock period
42
962
ns
T2
Chip select setup time
5
–
ns
T3
Chip select hold time
5
–
ns
T4
Data setup time
5
–
ns
T4
Data hold time
5
–
ns
T6
Register select setup time
5
–
ns
T7
Register select hold time
5
–
ns
Minimum
Maximum
Unit
LCD_CLK
T4
T5
LCD_RS
T1
LCD_CS
T2
T3
command data
LCD_DATA[15:0]
display data
CSPOL = 0
LCD_CLK
T4
T5
LCD_RS
T1
LCD_CS
T2
T3
command data
LCD_DATA[15:0]
display data
CSPOL = 1
Figure 24. SLCDC Parallel Transfers Timing
Table 25. SLCDC Parallel Transfers Timing
Symbol
Description
T1
Pixel clock period
23
962
ns
T2
Data setup time
5
–
ns
T3
Data hold time
5
–
ns
T4
Register select setup time
5
–
ns
T5
Register select hold time
5
–
ns
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
35
Specifications
3.12
Multimedia Card/Secure Digital Host Controller
The DMA interface block controls all data routing between the external data bus (DMA access), internal
MMC/SD module data bus, and internal system FIFO access through a dedicated state machine that
monitors the status of FIFO content (empty or full), FIFO address, and byte/block counters for the MMC/
SD module (inner system) and the application (user programming).
3a
1
2
4b
3b
Bus Clock
4a
5b
5a
CMD_DAT Input
Valid Data
Valid Data
7
CMD_DAT Output
Valid Data
Valid Data
6b
6a
Figure 25. Chip-Select Read Cycle Timing Diagram
Table 26. SDHC Bus Timing Parameters
1.8 V ± 0.1 V
Ref
No.
Parameter
1
CLK frequency at Data transfer Mode (PP)1—10/30 cards
2
CLK frequency at Identification Mode
3a
Clock high time1—10/30 cards
time1—10/30
3b
Clock low
4a
Clock fall time1—10/30 cards
time1—10/30
cards
4b
Clock rise
5a
Input hold time3—10/30 cards
cards
3
3.0 V ± 0.3 V
Unit
2
Min
Max
Min
Max
0
25/5
0
25/5
MHz
0
400
0
400
kHz
6/33
–
10/50
–
ns
15/75
–
10/50
–
ns
–
10/50 (5.00)3
–
10/50
ns
–
(6.67)3
–
10/50
ns
14/67
5.7/5.7
–
5/5
–
ns
5b
Input setup time —10/30 cards
5.7/5.7
–
5/5
–
ns
6a
Output hold time3—10/30 cards
5.7/5.7
–
5/5
–
ns
5.7/5.7
–
5/5
–
ns
0
16
0
14
ns
time3—10/30
6b
Output setup
7
Output delay time3
cards
1. CL ≤ 100 pF / 250 pF (10/30 cards)
2. CL ≤ 250 pF (21 cards)
3. CL ≤ 25 pF (1 card)
MC9328MX21 Technical Data, Rev. 3.4
36
Freescale Semiconductor
Specifications
3.12.1
Command Response Timing on MMC/SD Bus
The card identification and card operation conditions timing are processed in open-drain mode. The card
response to the host command starts after exactly NID clock cycles. For the card address assignment,
SET_RCA is also processed in the open-drain mode. The minimum delay between the host command and
card response is NCR clock cycles as illustrated in Figure 26. The symbols for Figure 26 through
Figure 30 are defined in Table 27.
Table 27. State Signal Parameters for Figure 26 through Figure 30
Card Active
Host Active
Symbol
Definition
Symbol
Definition
Z
High impedance state
S
Start bit (0)
D
Data bits
T
Transmitter bit
(Host = 1, Card = 0)
*
Repetition
P
One-cycle pull-up (1)
CRC
Cyclic redundancy check bits (7 bits)
E
End bit (1)
NID cycles
Host Command
CMD S T
Content
CRC E Z
CID/OCR
******
ZST
Content
ZZZ
Identification Timing
NCR cycles
Host Command
CMD S T
Content
CRC E Z
CID/OCR
******
ZST
Content
ZZZ
SET_RCA Timing
Figure 26. Timing Diagrams at Identification Mode
After a card receives its RCA, it switches to data transfer mode. As shown on the first diagram in
Figure 27, SD_CMD lines in this mode are driven with push-pull drivers. The command is followed by a
period of two Z bits (allowing time for direction switching on the bus) and then by P bits pushed up by the
responding card. The other two diagrams show the separating periods NRC and NCC.
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
37
Specifications
NCR cycles
Host Command
CMD S T
Content
Response
CRC E Z Z P
******
PST
Content
CRC E Z Z Z
Command response timing (data transfer mode)
NRC cycles
Response
CMD S T
Content
Host Command
CRC E Z
******
Z ST
Content
CRC E Z Z Z
Timing response end to next CMD start (data transfer mode)
NCC cycles
Host Command
CMD S T
Content
CRC E Z
Host Command
******
Z ST
Content
CRC E Z Z Z
Timing of command sequences (all modes)
Figure 27. Timing Diagrams at Data Transfer Mode
Figure 28 shows basic read operation timing. In a read operation, the sequence starts with a single block
read command (which specifies the start address in the argument field). The response is sent on the
SD_CMD lines as usual. Data transmission from the card starts after the access time delay NAC , beginning
from the last bit of the read command. If the system is in multiple block read mode, the card sends a
continuous flow of data blocks with distance NAC until the card sees a stop transmission command. The
data stops two clock cycles after the end bit of the stop command.
MC9328MX21 Technical Data, Rev. 3.4
38
Freescale Semiconductor
Specifications
NCR cycles
Host Command
CMD S T
CRC E Z Z P ****** P S T
Content
DAT
Response
Z****Z
Content
Z Z P ****** P S D D D D
CRC E Z
*****
Read Data
NAC cycles
Timing of single block read
NCR cycles
Host Command
CMD S T
DAT
Content
Response
CRC E Z Z P ****** P S T
Z****Z
******
ZZP
Content
P S DDDD
CRC E Z
*****
Read Data
NAC cycles
*****
P
P S DDDD
NAC cycles
*****
Read Data
Timing of multiple block read
NCR cycles
Host Command
CMD S T
Response
CRC E Z Z P ****** P S T
Content
Content
CRC E Z
NST
DAT D D D D
*****
DDDDE Z Z Z
Valid Read Data
*****
Timing of stop command
(CMD12, data transfer mode)
Figure 28. Timing Diagrams at Data Read
Figure 29 shows the basic write operation timing. As with the read operation, after the card response, the
data transfer starts after NWR cycles. The data is suffixed with CRC check bits to allow the card to check
for transmission errors. The card sends back the CRC check result as a CC status token on the data line. If
there was a transmission error, the card sends a negative CRC status (101); otherwise, a positive CRC
status (010) is returned. The card expects a continuous flow of data blocks if it is configured to multiple
block mode, with the flow terminated by a stop transmission command.
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
39
40
Z****Z
Z****Z
CRC E Z Z P
NWR cycles
CRC status
Timing of the multiple block write command
NWR cycles
Write Data
Content
DAT Z Z P P S
CRC E Z Z X X X X X X X X Z P P S
EZ PPS
Content
Content
Status
PST
DAT Z Z P P S
CRC E Z Z S
******
ES
L*L
EZ
PPP
Status
ES
L*L
EZ
PPP
CRC status
CRC status
Busy
Busy
CRC E Z Z X X X X X X X X X X X X X X X X Z
Status
CRC E Z Z X X X X X X X X X X X X X X X X Z
Write Data
Content
******
CRC E Z Z S
Write Data
Content
Content
CRC E Z Z S
NWR cycles
Z Z Z PPS
Z Z Z PPS
CRC E Z Z P
Content
Response
******
Timing of the block write command
Content
NCR cycles
CMD E Z Z P
DAT
DAT
CMD S T
Host Command
Specifications
Figure 29. Timing Diagrams at Data Write
The stop transmission command may occur when the card is in different states. Figure 30 shows the
different scenarios on the bus.
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
Parameter
Freescale Semiconductor
Content
CRC E Z Z P
Symbol
DAT Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z S L
DAT S L
DAT D D D D D D D Z Z S CRC E Z Z S L
Write Data
PST
******
Content
******
******
******
ST
Content
CRC E
Host Command
Minimum
Stop transmission received after last data block.
Card becomes busy programming.
EZ Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z
Stop transmission received after last data block.
Card becomes busy programming.
EZ Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z
Stop transmission during CRC status transfer
from the card.
EZ Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z
Stop transmission during data transfer
from the host.
EZ Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z
CRC E Z Z Z
Card Response
Busy (Card is programming)
******
NCR cycles
DAT D D D D D D D D D D D D D E Z Z S L
CMD S T
Host Command
Specifications
Figure 30. Stop Transmission During Different Scenarios
Table 28. Timing Values for Figure 26 through Figure 30
Maximum
Unit
MMC/SD bus clock, CLK (All values are referred to minimum (VIH) and maximum (VIL)
Command response cycle
NCR
2
64
Clock cycles
Identification response cycle
NID
5
5
Clock cycles
Access time delay cycle
NAC
2
TAAC + NSAC
Clock cycles
MC9328MX21 Technical Data, Rev. 3.4
41
Specifications
Table 28. Timing Values for Figure 26 through Figure 30 (Continued)
Parameter
Symbol
Minimum
Maximum
Unit
Command read cycle
NRC
8
–
Clock cycles
Command-command cycle
NCC
8
–
Clock cycles
Command write cycle
NWR
2
–
Clock cycles
Stop transmission cycle
NST
2
2
Clock cycles
TAAC: Data read access time -1 defined in CSD register bit[119:112]
NSAC: Data read access time -2 in CLK cycles (NSAC·100) defined in CSD register bit[111:104]
3.12.2
SDIO-IRQ and ReadWait Service Handling
In SDIO, there is a 1-bit or 4-bit interrupt response from the SDIO peripheral card. In 1-bit mode, the
interrupt response is simply that the SD_DAT[1] line is held low. The SD_DAT[1] line is not used as data
in this mode. The memory controller generates an interrupt according to this low and the system interrupt
continues until the source is removed (SD_DAT[1] returns to its high level).
In 4-bit mode, the interrupt is less simple. The interrupt triggers at a particular period called the Interrupt
Period during the data access, and the controller must sample SD_DAT[1] during this short period to
determine the IRQ status of the attached card. The interrupt period only happens at the boundary of each
block (512 bytes).
CMD
Content
ST
DAT[1]
For 4-bit
CRC E Z Z P S
Interrupt Period
Response
S
******
EZZZ
Block Data
E
IRQ
ZZZ
Block Data
S
E
IRQ
LH
DAT[1]
For 1-bit
Interrupt Period
Figure 31. SDIO IRQ Timing Diagram
ReadWait is another feature in SDIO that allows the user to submit commands during the data transfer. In
this mode, the block temporarily pauses the data transfer operation counter and related status, yet keeps
the clock running, and allows the user to submit commands as normal. After all commands are submitted,
the user can switch back to the data transfer operation and all counter and status values are resumed as
access continues.
CMD
P S T CMD52
******
CRC E Z Z Z
******
DAT[1] S
For 4-bit
Block Data
EZZL H
S
Block Data
E
DAT[2] S
For 4-bit
Block Data
EZ Z L L L L L L L L L L L L L L L L L L L L L HZS
Block Data
E
Figure 32. SDIO ReadWait Timing Diagram
MC9328MX21 Technical Data, Rev. 3.4
42
Freescale Semiconductor
Specifications
3.13
3.13.1
External Memory Interface (EMI) Electricals
NAND-Flash Controller (NFC) Interface
Figure 33, Figure 34, Figure 35, and Figure 36 depict the relative timing requirements among different
signals of the NFC at module level, and Table 29 lists the timing parameters. The NAND Flash Controller
(NFC) timing parameters are based on the internal NFC clock generated by the Clock Controller module,
where time T is the period of the NFC clock in ns. Per the i.MX21 Reference Manual, specifically the
Phase-Locked (PLL), Clock, and Reset Controller chapter, the NFC clock is derived from the same clock
which drives the CPU clock (FCLK) that is fed through the NFCDIV block to generate the NFC clock.
The relationship between the NFC clock and the external timing parameters of the NFC is provided in
Table 29.
Table 29 also provides two examples of external timing parameters with NFC clock frequencies of
22.17 MHz and 33.25 MHz. For example, assuming a 266 MHz FCLK (CPU clock), NFCDIV should be
set to divide-by-12 to generate a 22.17 MHz NFC clock and divide-by-8 to generate a 33.25 MHz NFC
clock. The user should compare the parameters of the selected NAND Flash memory with the NFC
external timing parameters to determine the proper NFC clock. The maximum NFC clock allowed is
66 MHz. It should also be noted that the default NFC clock on power up is 16.63 MHz.
NFCLE
NF1
NF2
NF3
NF4
NFCE
NF5
NFWE
NFALE
NF6
NF7
NF9
NF8
NFIO[7:0]
command
Figure 33. Command Latch Cycle Timing DIagram
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
43
Specifications
NFCLE
NF1
NFCE
NF4
NF3
NF5
NFWE
NF6
NF7
NFALE
NF8
NFIO[7:0]
NF9
Address
Address
Time it takes for SW to issue the next address command
Figure 34. Address Latch Cycle Timing DIagram
NFCLE
NF1
NF3
NFCE
NF4
NF10
NFWE
NFALE
NF5
NF11
NF8
NF9
NF6
NFIO[15:0]
Data to Flash
Figure 35. Write Data Latch Timing DIagram
NFCLE
NFCE
NF14
NF3
NF13
NFRE
NF16
NFRB
NFIO[15:0]
NF12
NF15
NF17
Data from Flash
Figure 36. Read Data Latch Timing Diagram
MC9328MX21 Technical Data, Rev. 3.4
44
Freescale Semiconductor
Specifications
Table 29. NFC Target Timing Parameters1,2
ID
Parameter
Symbol
Relationship to NFC
Clock Period
(T)
NFC Clock
22.17 MHz
T = 45 ns
NFC Clock
33.25 MHz
T = 30 ns
Min
Max
Min
Max
Min
Max
Unit
NF1
NFCLE Setup Time
tCLS
T
–
45
–
30
–
ns
NF2
NFCLE Hold Time
tCLH
T
–
45
–
30
–
ns
NF3
NFCE Setup Time
tCS
T
–
45
–
30
–
ns
NF4
NFCE Hold Time
tCH
T
–
45
–
30
–
ns
NF5
NF_WP Pulse Width
tWP
T
–
45
–
30
–
ns
NF6
NFALE Setup Time
tALS
T
–
45
–
30
–
ns
NF7
NFALE Hold Time
tALH
T
–
45
–
30
–
ns
NF8
Data Setup Time
tDS
T
–
45
–
30
–
ns
NF9
Data Hold Time
tDH
T
–
45
–
30
–
ns
NF10 Write Cycle Time
tWC
2T
–
90
–
60
–
ns
NF11 NFWE Hold Time
tWH
T
–
45
–
30
–
ns
NF12 Ready to NFRE Low
tRR
4T
–
180
–
120
–
ns
NF13 NFRE Pulse Width
tRP
1.5T
–
67.5
–
45
–
ns
NF14 READ Cycle Time
tRC
2T
–
90
–
60
–
ns
NF15 NFRE High Hold Time
tREH
0.5T
–
22.5
–
15
–
ns
NF16 Data Setup on READ
tDSR
15
–
15
–
15
–
ns
NF17 Data Hold on READ
tDHR
0
–
0
–
0
–
ns
1. High is defined as 80% of signal value and low is defined as 20% of signal value. All timings are listed according to this NFC
clock frequency (multiples of NFC clock period) except NF16, which is not NFC clock related.
2. The read data is generated by the NAND Flash device and sampled with the internal NFC clock.
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
45
Specifications
3.14
Pulse-Width Modulator
The PWM can be programmed to select one of two clock signals as its source frequency. The selected
clock signal is passed through a divider and a prescaler before being input to the counter. The output is
available at the pulse-width modulator output (PWMO) external pin.
1
2a
3b
System Clock
2b
4b
3a
4a
PWM Output
Figure 37. PWM Output Timing Diagram
Table 30. PWM Output Timing Parameters
1.8 V ± 0.1 V
Ref No.
3.0 V ± 0.3 V
Parameter
Unit
Minimum
Maximum
Minimum
Maximum
0
45
0
45
MHz
1
System CLK frequency
2a
Clock high time
12.29
–
12.29
–
ns
2b
Clock low time
9.91
–
9.91
–
ns
3a
Clock fall time
–
0.5
–
0.5
ns
3b
Clock ise time
–
0.5
–
0.5
ns
4a
Output delay time
9.37
–
3.61
–
ns
4b
Output setup time
8.71
–
3.03
–
ns
r
MC9328MX21 Technical Data, Rev. 3.4
46
Freescale Semiconductor
Specifications
3.15
SDRAM Memory Controller
The following figures (Figure 38 through Figure 41) and their associated tables specify the timings related
to the SDRAMC module in the i.MX21.
1
SDCLK
3S
2
3
CS
RAS
3H
3S
3S
3H
CAS
3S
3H
3H
WE
4S
ADDR
4H
ROW/BA
COL/BA
5
8
DQ
6
Data
7
3S
DQM
3H
Note: CKE is high during the read/write cycle.
Figure 38. SDRAM Read Cycle Timing Diagram
Table 31. SDRAM Read Cycle Timing Parameter
1.8 V ± 0.1 V
Ref
No.
3.0 V ± 0.3 V
Parameter
Unit
Minimum
Maximum
Minimum
Maximum
1
SDRAM clock high-level width
3.00
–
3
–
ns
2
SDRAM clock low-level width
3.00
–
3
–
ns
3
SDRAM clock cycle time
7.5
–
7.5
–
ns
3S
CS, RAS, CAS, WE, DQM setup time
4.78
–
3
–
ns
3H
CS, RAS, CAS, WE, DQM hold time
3.03
–
2
–
ns
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
47
Specifications
Table 31. SDRAM Read Cycle Timing Parameter (Continued)
1.8 V ± 0.1 V
Ref
No.
3.0 V ± 0.3 V
Parameter
Unit
Minimum
Maximum
Minimum
Maximum
4S
Address setup time
3.67
–
2
–
ns
4H
Address hold time
2.95
–
2
–
ns
5
SDRAM access time (CL = 3)
–
5.4
–
5.4
ns
5
SDRAM access time (CL = 2)
–
6.0
–
6.0
ns
5
SDRAM access time (CL = 1)
–
–
–
–
ns
6
Data out hold time
2
–
2
–
ns
7
Data out high-impedance time (CL = 3)
–
tHZ1
–
tHZ1
ns
1
–
1
ns
7
Data out high-impedance time (CL = 2)
–
tHZ
7
Data out high-impedance time (CL = 1)
–
–
8
Active to read/write command period (RC = 1)
tRCD2
tHZ
–
–
tRCD
2
–
ns
–
ns
1. tHZ = SDRAM data out high-impedance time, external SDRAM memory device dependent parameter.
2. tRCD = SDRAM clock cycle time. The tRCD setting can be found in the i.MX21 reference manual.
SDCLK
1
3
2
CS
RAS
6
CAS
WE
4
ADDR
5
/ BA
7
COL/BA
ROW/BA
8
DQ
9
DATA
DQM
Figure 39. SDRAM Write Cycle Timing Diagram
MC9328MX21 Technical Data, Rev. 3.4
48
Freescale Semiconductor
Specifications
Table 32. SDRAM Write Cycle Timing Parameter
1.8 V ± 0.1 V
Ref
No.
3.0 V ± 0.3 V
Parameter
Unit
Minimum
Maximum
Minimum
Maximum
1
SDRAM clock high-level width
3.00
–
3
–
ns
2
SDRAM clock low-level width
3.00
–
3
–
ns
3
SDRAM clock cycle time
7.5
–
7.5
–
ns
4
Address setup time
3.67
–
2
–
ns
5
Address hold time
2.95
–
2
–
ns
6
Precharge cycle period1
tRP2
–
tRP2
–
ns
7
Active to read/write command delay
tRCD2
–
tRCD2
–
ns
8
Data setup time
3.41
–
2
–
ns
9
Data hold time
2.45
–
2
–
ns
1. Precharge cycle timing is included in the write timing diagram.
2. tRP and tRCD = SDRAM clock cycle time. These settings can be found in the i.MX21 reference manual.
SDCLK
1
3
2
CS
RAS
6
CAS
7
7
WE
4
ADDR
5
BA
ROW/BA
DQ
DQM
Figure 40. SDRAM Refresh Timing Diagram
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
49
Specifications
Table 33. SDRAM Refresh Timing Parameters
1.8 V ± 0.1 V
Ref
No.
3.0 V ± 0.3 V
Parameter
Unit
Minimum
Maximum
Minimum
Maximum
1
SDRAM clock high-level width
3.00
–
3
–
ns
2
SDRAM clock low-level width
3.00
–
3
–
ns
3
SDRAM clock cycle time
7.5
–
7.5
–
ns
4
Address setup time
3.67
–
2
–
ns
5
Address hold time
2.95
–
2
–
ns
6
Precharge cycle period
tRP1
–
tRP1
–
ns
7
Auto precharge command period
tRC1
–
tRC1
–
ns
1. tRP and tRC = SDRAM clock cycle time. These settings can be found in the i.MX21 reference manual.
SDCLK
CS
RAS
CAS
WE
ADDR
BA
DQ
DQM
CKE
Figure 41. SDRAM Self-Refresh Cycle Timing Diagram
MC9328MX21 Technical Data, Rev. 3.4
50
Freescale Semiconductor
Specifications
3.16
Synchronous Serial Interface
The transmit and receive sections of the SSI can be synchronous or asynchronous. In synchronous mode,
the transmitter and the receiver use a common clock and frame synchronization signal. In asynchronous
mode, the transmitter and receiver each have their own clock and frame synchronization signals.
Continuous or gated clock mode can be selected. In continuous mode, the clock runs continuously. In gated
clock mode, the clock functions only during transmission. The internal and external clock timing diagrams
are shown in Figure 42 through Figure 45.
Normal or network mode can also be selected. In normal mode, the SSI functions with one data word of
I/O per frame. In network mode, a frame can contain between 2 and 32 data words. Network mode is
typically used in star or ring-time division multiplex networks with other processors or codecs, allowing
interface to time division multiplexed networks without additional logic. Use of the gated clock is not
allowed in network mode. These distinctions result in the basic operating modes that allow the SSI to
communicate with a wide variety of devices.
The SSI can be connected to 4 set of ports, SAP, SSI1, SSI2 and SSI3.
1
CK Output
2
4
FS (bl) Output
6
8
FS (wl) Output
12
10
11
STXD Output
31
32
SRXD Input
Note: SRXD input in synchronous mode only.
Figure 42. SSI Transmitter Internal Clock Timing Diagram
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
51
Specifications
1
CK Output
3
5
FS (bl) Output
7
9
FS (wl) Output
13
14
SRXD Input
Figure 43. SSI Receiver Internal Clock Timing Diagram
15
16
17
CK Input
18
20
FS (bl) Input
24
22
FS (wl) Input
27
26
28
STXD Output
33
34
SRXD Input
Note: SRXD Input in Synchronous mode only
Figure 44. SSI Transmitter External Clock Timing Diagram
16
15
17
CK Input
19
21
FS (bl) Input
25
23
FS (wl) Input
29
30
SRXD Input
Figure 45. SSI Receiver External Clock Timing Diagram
MC9328MX21 Technical Data, Rev. 3.4
52
Freescale Semiconductor
Specifications
Table 34. SSI to SAP Ports Timing Parameters
1.8 V ± 0.1 V
Ref
No.
3.0 V ± 0.3 V
Parameter
Unit
Minimum
Maximum
Minimum
Maximum
–
90.91
–
ns
Internal Clock Operation1 (SAP Ports)
1
(Tx/Rx) CK clock period1 90.
2
(Tx) CK high to FS (bl) high
-3.30
-1.16
-2.98
-1.10
ns
3
(Rx) CK high to FS (bl) high
-3.93
-1.34
-4.18
-1.43
ns
4
(Tx) CK high to FS (bl) low
-3.30
-1.16
-2.98
-1.10
ns
5
(Rx) CK high to FS (bl) low
-3.93
-1.34
-4.18
-1.43
ns
6
(Tx) CK high to FS (wl) high
-3.30
-1.16
-2.98
-1.10
ns
7
(Rx) CK high to FS (wl) high
-3.93
-1.34
-4.18
-1.43
ns
8
(Tx) CK high to FS (wl) low
-3.30
-1.16
-2.98
-1.10
ns
9
(Rx) CK high to FS (wl) low
-3.93
-1.34
-4.18
-1.43
ns
10
(Tx) CK high to STXD valid from high impedance
-2.44
-0.60
-2.65
-0.98
ns
11a
(Tx) CK high to STXD high
-2.44
-0.60
-2.65
-0.98
ns
11b
(Tx) CK high to STXD low
-2.44
-0.60
-2.65
-0.98
ns
12
(Tx) CK high to STXD high impedance
-2.67
-0.99
-2.65
-0.98
ns
13
SRXD setup time before (Rx) CK low
23.68
–
22.09
–
ns
14
SRXD hold time after (Rx) CK low
0
–
0
–
ns
91
External Clock Operation (SAP Ports)
1
15
(Tx/Rx) CK clock period 90.
91
–
90.91
–
ns
16
(Tx/Rx) CK clock high period
36.36
–
36.36
–
ns
17
(Tx/Rx) CK clock low period
36.36
–
36.36
–
ns
18
(Tx) CK high to FS (bl) high
10.24
19.50
7.16
8.65
ns
19
(Rx) CK high to FS (bl) high
10.89
21.27
7.63
9.12
ns
20
(Tx) CK high to FS (bl) low
10.24
19.50
7.16
8.65
ns
21
(Rx) CK high to FS (bl) low
10.89
21.27
7.63
9.12
ns
22
(Tx) CK high to FS (wl) high
10.24
19.50
7.16
8.65
ns
23
(Rx) CK high to FS (wl) high
10.89
21.27
7.63
9.12
ns
24
(Tx) CK high to FS (wl) low
10.24
19.50
7.16
8.65
ns
25
(Rx) CK high to FS (wl) low
10.89
21.27
7.63
9.12
ns
26
(Tx) CK high to STXD valid from high impedance
12.08
19.36
7.71
9.20
ns
27a
(Tx) CK high to STXD high
10.80
19.36
7.71
9.20
ns
27b
(Tx) CK high to STXD low
10.80
19.36
7.71
9.20
ns
28
(Tx) CK high to STXD high impedance
12.08
19.36
7.71
9.20
ns
29
SRXD setup time before (Rx) CK low
0.37
–
0.42
–
ns
30
SRXD hole time after (Rx) CK low
0
–
0
–
ns
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
53
Specifications
Table 34. SSI to SAP Ports Timing Parameters (Continued)
Ref
No.
1.8 V ± 0.1 V
3.0 V ± 0.3 V
Parameter
Unit
Minimum
Maximum
Minimum
Maximum
Synchronous Internal Clock Operation (SAP Ports)
31
SRXD setup before (Tx) CK falling
32
SRXD hold after (Tx) CK falling
23.00
–
21.41
–
ns
0
–
0
–
ns
Synchronous External Clock Operation (SAP Ports)
33
SRXD setup before (Tx) CK falling
34
SRXD hold after (Tx) CK falling
1.20
–
0.88
–
ns
0
–
0
–
ns
1. All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting
the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures.
Table 35. SSI to SSI1 Ports Timing Parameters
Ref
No.
1.8 V ± 0.1 V
3.0 V ± 0.3 V
Parameter
Unit
Minimum
Maximum
Minimum
Maximum
Internal Clock Operation1 (SSI1 Ports)
1
(Tx/Rx) CK clock period1 9
0.91
–
90.91
–
ns
2
(Tx) CK high to FS (bl) high
-0.68
-0.15
-0.68
-0.15
ns
3
(Rx) CK high to FS (bl) high
-0.96
-0.27
-0.96
-0.27
ns
4
(Tx) CK high to FS (bl) low
-0.68
-0.15
-0.68
-0.15
ns
5
(Rx) CK high to FS (bl) low
-0.96
-0.27
-0.96
-0.27
ns
6
(Tx) CK high to FS (wl) high
-0.68
-0.15
-0.68
-0.15
ns
7
(Rx) CK high to FS (wl) high
-0.96
-0.27
-0.96
-0.27
ns
8
(Tx) CK high to FS (wl) low
-0.68
-0.15
-0.68
-0.15
ns
9
(Rx) CK high to FS (wl) low
-0.96
-0.27
-0.96
-0.27
ns
10
(Tx) CK high to STXD valid from high impedance
-1.68
-0.36
-1.68
-0.36
ns
11a
(Tx) CK high to STXD high
-1.68
-0.36
-1.68
-0.36
ns
11b
(Tx) CK high to STXD low
-1.68
-0.36
-1.68
-0.36
ns
12
(Tx) CK high to STXD high impedance
-1.58
-0.31
-1.58
-0.31
ns
13
SRXD setup time before (Rx) CK low
20.41
–
20.41
–
ns
14
SRXD hold time after (Rx) CK low
0
–
0
–
ns
External Clock Operation (SSI1 Ports)
15
(Tx/Rx) CK clock period1 9
16
0.91
–
90.91
–
ns
(Tx/Rx) CK clock high period
36.36
–
36.36
–
ns
17
(Tx/Rx) CK clock low period
36.36
–
36.36
–
ns
18
(Tx) CK high to FS (bl) high
10.22
17.63
8.82
16.24
ns
19
(Rx) CK high to FS (bl) high
10.79
19.67
9.39
18.28
ns
MC9328MX21 Technical Data, Rev. 3.4
54
Freescale Semiconductor
Specifications
Table 35. SSI to SSI1 Ports Timing Parameters (Continued)
1.8 V ± 0.1 V
Ref
No.
3.0 V ± 0.3 V
Parameter
Unit
Minimum
Maximum
Minimum
Maximum
20
(Tx) CK high to FS (bl) low
10.22
17.63
8.82
16.24
ns
21
(Rx) CK high to FS (bl) low
10.79
19.67
9.39
18.28
ns
22
(Tx) CK high to FS (wl) high
10.22
17.63
8.82
16.24
ns
23
(Rx) CK high to FS (wl) high
10.79
19.67
9.39
18.28
ns
24
(Tx) CK high to FS (wl) low
10.22
17.63
8.82
16.24
ns
25
(Rx) CK high to FS (wl) low
10.79
19.67
9.39
18.28
ns
26
(Tx) CK high to STXD valid from high impedance
10.05
15.75
8.66
14.36
ns
27a
(Tx) CK high to STXD high
10.00
15.63
8.61
14.24
ns
27b
(Tx) CK high to STXD low
10.00
15.63
8.61
14.24
ns
28
(Tx) CK high to STXD high impedance
10.05
15.75
8.66
14.36
ns
29
SRXD setup time before (Rx) CK low
0.78
–
0.47
–
ns
30
SRXD hole time after (Rx) CK low
0
–
0
–
ns
Synchronous Internal Clock Operation (SSI1 Ports)
31
SRXD setup before (Tx) CK falling
32
SRXD hold after (Tx) CK falling
19.90
–
19.90
–
ns
0
–
0
–
ns
Synchronous External Clock Operation (SSI1 Ports)
33
SRXD setup before (Tx) CK falling
34
SRXD hold after (Tx) CK falling
2.59
–
2.28
–
ns
0
–
0
–
ns
1. All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting
the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures.
Table 36. SSI to SSI2 Ports Timing Parameters
1.8 V ± 0.1 V
Ref
No.
3.0 V ± 0.3 V
Parameter
Unit
Minimum
Maximum
Minimum
Maximum
Internal Clock Operation1 (SSI2 Ports)
1
(Tx/Rx) CK clock period1 90
.91
–
90.91
–
ns
2
(Tx) CK high to FS (bl) high
0.01
0.15
0.01
0.15
ns
3
(Rx) CK high to FS (bl) high
-0.21
0.05
-0.21
0.05
ns
4
(Tx) CK high to FS (bl) low
0.01
0.15
0.01
0.15
ns
5
(Rx) CK high to FS (bl) low
-0.21
0.05
-0.21
0.05
ns
6
(Tx) CK high to FS (wl) high
0.01
0.15
0.01
0.15
ns
7
(Rx) CK high to FS (wl) high
-0.21
0.05
-0.21
0.05
ns
8
(Tx) CK high to FS (wl) low
0.01
0.15
0.01
0.15
ns
9
(Rx) CK high to FS (wl) low
-0.21
0.05
-0.21
0.05
ns
10
(Tx) CK high to STXD valid from high impedance
0.34
0.72
0.34
0.72
ns
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
55
Specifications
Table 36. SSI to SSI2 Ports Timing Parameters (Continued)
Ref
No.
1.8 V ± 0.1 V
3.0 V ± 0.3 V
Parameter
Unit
Minimum
Maximum
Minimum
Maximum
11a
(Tx) CK high to STXD high
0.34
0.72
0.34
0.72
ns
11b
(Tx) CK high to STXD low
0.34
0.72
0.34
0.72
ns
12
(Tx) CK high to STXD high impedance
0.34
0.48
0.34
0.48
ns
13
SRXD setup time before (Rx) CK low
21.50
–
21.50
–
ns
14
SRXD hold time after (Rx) CK low
0
–
0
–
ns
External Clock Operation (SSI2 Ports)
15
(Tx/Rx) CK clock period1 90
.91
–
90.91
–
ns
16
(Tx/Rx) CK clock high period
36.36
–
36.36
–
ns
17
(Tx/Rx) CK clock low period
36.36
–
36.36
–
ns
18
(Tx) CK high to FS (bl) high
10.40
17.37
8.67
15.88
ns
19
(Rx) CK high to FS (bl) high
11.00
19.70
9.28
18.21
ns
20
(Tx) CK high to FS (bl) low
10.40
17.37
8.67
15.88
ns
21
(Rx) CK high to FS (bl) low
11.00
19.70
9.28
18.21
ns
22
(Tx) CK high to FS (wl) high
10.40
17.37
8.67
15.88
ns
23
(Rx) CK high to FS (wl) high
11.00
19.70
9.28
18.21
ns
24
(Tx) CK high to FS (wl) low
10.40
17.37
8.67
15.88
ns
25
(Rx) CK high to FS (wl) low
11.00
19.70
9.28
18.21
ns
26
(Tx) CK high to STXD valid from high impedance
9.59
17.08
7.86
15.59
ns
27a
(Tx) CK high to STXD high
9.59
17.08
7.86
15.59
ns
27b
(Tx) CK high to STXD low
9.59
17.08
7.86
15.59
ns
28
(Tx) CK high to STXD high impedance
9.59
16.84
7.86
15.35
ns
29
SRXD setup time before (Rx) CK low
2.52
–
2.52
–
ns
30
SRXD hole time after (Rx) CK low
0
–
0
–
ns
Synchronous Internal Clock Operation (SSI2 Ports)
31
SRXD setup before (Tx) CK falling
32
SRXD hold after (Tx) CK falling
20.78
–
20.78
–
ns
0
–
0
–
ns
Synchronous External Clock Operation (SSI2 Ports)
33
SRXD setup before (Tx) CK falling
34
SRXD hold after (Tx) CK falling
4.42
–
4.42
–
ns
0
–
0
–
ns
1. All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting
the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures.
MC9328MX21 Technical Data, Rev. 3.4
56
Freescale Semiconductor
Specifications
Table 37. SSI to SSI3 Ports Timing Parameters
1.8 V ± 0.1 V
Ref
No.
3.0 V ± 0.3 V
Parameter
Unit
Minimum
Maximum
Minimum
Maximum
–
90.91
–
ns
Internal Clock Operation1 (SSI3 Ports)
1
(Tx/Rx) CK clock period1 90.
2
(Tx) CK high to FS (bl) high
-2.09
-0.66
-2.09
-0.66
ns
3
(Rx) CK high to FS (bl) high
-2.74
-0.84
-2.74
-0.84
ns
4
(Tx) CK high to FS (bl) low
-2.09
-0.66
-2.09
-0.66
ns
5
(Rx) CK high to FS (bl) low
-2.74
-0.84
-2.74
-0.84
ns
6
(Tx) CK high to FS (wl) high
-2.09
-0.66
-2.09
-0.66
ns
7
(Rx) CK high to FS (wl) high
-2.74
-0.84
-2.74
-0.84
ns
8
(Tx) CK high to FS (wl) low
-2.09
-0.66
-2.09
-0.66
ns
9
(Rx) CK high to FS (wl) low
-2.74
-0.84
-2.74
-0.84
ns
10
(Tx) CK high to STXD valid from high impedance
-1.73
-0.26
-1.73
-0.26
ns
11a
(Tx) CK high to STXD high
-2.87
-0.80
-2.87
-0.80
ns
11b
(Tx) CK high to STXD low
-2.87
-0.80
-2.87
-0.80
ns
12
(Tx) CK high to STXD high impedance
-1.73
-0.26
-1.73
-0.26
ns
13
SRXD setup time before (Rx) CK low
22.77
–
22.77
–
ns
14
SRXD old ime after
h Rx)
t CK low (
0
–
0
–
ns
91
External Clock Operation (SSI3 Ports)
15
(Tx/Rx) CK clock period1 90.
91
–
90.91
–
ns
16
(Tx/Rx) CK clock high period
36.36
–
36.36
–
ns
17
(Tx/Rx) CK clock low period
36.36
–
36.36
–
ns
18
(Tx) CK high to FS (bl) high
9.62
17.10
7.90
15.61
ns
19
(Rx) CK high to FS (bl) high
10.30
19.54
8.58
18.05
ns
20
(Tx) CK high to FS (bl) low
9.62
17.10
7.90
15.61
ns
21
(Rx) CK high to FS (bl) low
10.30
19.54
8.58
18.05
ns
22
(Tx) CK high to FS (wl) high
9.62
17.10
7.90
15.61
ns
23
(Rx) CK high to FS (wl) high
10.30
19.54
8.58
18.05
ns
24
(Tx) CK high to FS (wl) low
9.62
17.10
7.90
15.61
ns
25
(Rx) CK high to FS (wl) low
10.30
19.54
8.58
18.05
ns
26
(Tx) CK high to STXD valid from high impedance
9.02
16.46
7.29
14.97
ns
27a
(Tx) CK high to STXD high
8.48
15.32
6.75
13.83
ns
27b
(Tx) CK high to STXD low
8.48
15.32
6.75
13.83
ns
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
57
Specifications
Table 37. SSI to SSI3 Ports Timing Parameters (Continued)
1.8 V ± 0.1 V
Ref
No.
3.0 V ± 0.3 V
Parameter
Unit
Minimum
Maximum
Minimum
Maximum
28
(Tx) CK high to STXD high impedance
9.02
16.46
7.29
14.97
ns
29
SRXD setup time before (Rx) CK low
1.49
–
1.49
–
ns
30
SRXD hole time after (Rx) CK low
0
–
0
–
ns
Synchronous Internal Clock Operation (SSI3 Ports)
31
SRXD setup before (Tx) CK falling
32
SRXD old fter Tx)
h
Kafalling
(
C
21.99
–
21.99
–
ns
0
–
0
–
ns
Synchronous External Clock Operation (SSI3 Ports)
33
SRXD setup before (Tx) CK falling
34
SRXD old fter Tx)
h
Kafalling
(
C
3.80
–
3.80
–
ns
0
–
0
–
ns
1. All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting
the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures.
3.17
1-Wire Interface Timing
3.17.1
Reset Sequence with Reset Pulse Presence Pulse
To begin any communications with the DS2502, it is required that an initialization procedure be issued. A
reset pulse must be generated and then a presence pulse must be detected. The minimum reset pulse length
is 480 us. The bus master (one-wire) will generate this pulse, then after the DS2502 detects a rising edge
on the one-wire bus, it will wait 15-60 us before it will transmit back a presence pulse. The presence pulse
will exist for 60-240 us.
The timing diagram for this sequence is shown in Figure 46.
Reset and Presence Pulses
Set RPP
511 us
DS2502
waits
15-60us
AutoClear RPP
Control Bit
DS2502 Tx
“presence pulse”
60-240us
one-wire
BUS
512us
68us
One-Wire samples (set PST)
Figure 46. 1-Wire Initialization
The reset pulse begins the initialization sequence and it is initiated when the RPP control register bit is set.
When the presence pulse is detected, this bit will be cleared. The presence pulse is used by the bus master
to determine if at least one DS2502 is connected. Software will determine if more than one DS2502 exists.
The one-wire will sample for the DS2502 presence pulse. The presence pulse is latched in the one-wire
MC9328MX21 Technical Data, Rev. 3.4
58
Freescale Semiconductor
Specifications
control register PST. When the PST bit is set to a one, it means that a DS2502 is present; if the bit is set to
a zero, then no device was found.
3.17.2
Write 0
The Write 0 function simply writes a zero bit to the DS2502. The sequence takes 117 us. The one-wire bus
is held low for 100us.
AutoClear WR0
Set WR0
Write 0 Slot 128us
17us
100us
one-wire
BUS
Figure 47. Write 0 Timing
The Write 0 pulse sequence is initiated when the WR0 control bit register is set. When the write is
complete, the WR0 register will be auto cleared.
3.17.3
Write 1/Read Data
The Write 1 and Read timing is identical. The time slot is first driven low. According to the DS2502
documentation, the DS2502 has a delay circuit which is used to synchronize the DS2502 with the bus
master (one-wire). This delay circuit is triggered by the falling edge of the data line and is used to decide
when the DS2502 should sample the line. In the case of a write 1 or read 1, after a delay, a 1 will be
transmitted / received. When a read 0 slot is issued, the delay circuit will hold the data line low to override
the 1 generated by the bus master (one-wire).
For the Write 1 or Read, the control register WR1/RD is set and auto-cleared when the sequence has been
completed. After a Read, the control register RDST bit is set to the value of the read.
Set WR1/RD
Auto Clear WR1/RD
Write “1” Slot 117us
5us
Figure 48. Write 1 Timing
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
59
Specifications
Set WR1/RD
Read Timing
Auto Clear WR1/RD Set WR1/RD
Read “0” Slot 117us
Auto Clear WR1/RD
Read “1” Slot 117us
60us
one-wire
BUS
5us
13us
5us
One-Wire samples
(set RDST)
13us
One-Wire samples
(set RDST)
Figure 49. Read Timing
The precision of the generated clock is very important to get a proper behavior of the one-wire module.
This module is based on a state machine which undertakes actions at defined times.
Table 38. System Timing Requirements
Times
Values
(Microsec)
Minimum
(Microsec)
Maximum
(microsec)
Absolute
Precision
Relative
Precision
RSTL
511
480
–
31
0.0645
PST
68
60
75
7
0.1
RSTH
512
480
–
32
0.0645
LOW0
100
60
120
20
0.2
LOWR
5
1
15
4
0.8
READ_sample
13
–
15
2
0.15
The most stringent constraint is 0.0645 as a relative time imprecision.
The time relative precision is directly derived from the frequency of the derivative clock (f):
Time relative precision = 1/f -1 = divider/clock (MHz) - 1
The Figure 39 gathers relative time precision for different main clock frequencies.
Table 39. System Clock Requirements
Main Clock Frequency (MHz)
13
16.8
19.44
Clock divide ratio
13
17
19
Generated frequency (MHz)
1
0.9882
1.023
Relative time imprecision
0
0.0117
0.023
This shows that the user should take care of the main clock frequency when using the one-wire module. If
the main clock is an exact integer multiple of 1 MHz, then the generated frequency will be exactly 1 MHz.
NOTE
A main clock frequency below 10 MHz might cause a misbehavior of the module.
MC9328MX21 Technical Data, Rev. 3.4
60
Freescale Semiconductor
Specifications
3.18
USB On-The-Go
Four types of data transfer modes exist for the USB module: control transfers, bulk transfers, isochronous
transfers and interrupt transfers. From the perspective of the USB module, the interrupt transfer type is
identical to the bulk data transfer mode, and no additional hardware is supplied to support it. This section
covers the transfer modes and how they work from the ground up.
Data moves across the USB in packets. Groups of packets are combined to form data transfers. The same
packet transfer mechanism applies to bulk, interrupt, and control transfers. Isochronous data is also moved
in the form of packets, but because isochronous pipes are given a fixed portion of the USB bandwidth at
all times, there is no end-of-transfer.
USB_ON
(Output)
1
t TXDM_OEB 4
t OEB_TXDP
USB_OE
(Output)
tPERIOD
6
3
tTXDP_OEB
USB_TXDP
(Output)
USB_TXDM
(Output)
tOEB_TXDM
2
tFEOPT
5
USB_VP
(Input)
USB_VM
(Input)
Figure 50. USB Timing Diagram for Data Transfer to USB Transceiver (TX)
Table 40. USB Timing Parameters for Data Transfer to USB Transceiver (TX)
3.0 V ± 0.3 V
Ref
No.
Parameter
Unit
Minimum
Maximum
1
tOEB_TXDP; USBD_OE active to USBD_TXDP low
83.14
83.47
ns
2
tOEB_TXDM; USBD_OE active to USBD_TXDM high
81.55
81.98
ns
3
tTXDP_OEB; USBD_TXDP high to USBD_OE deactivated
83.54
83.8
ns
4
tTXDM_OEB; USBD_TXDM low to USBD_OE deactivated (includes SE0)
248.9
249.13
ns
5
tFEOPT; SE0 interval of EOP
160
175
ns
6
tPERIOD; Data transfer rate
11.97
12.03
Mb/s
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
61
Specifications
USB_ON
(Output)
USB_OE
(Output)
USB_TXDP
(Output)
USB_TXDM
(Output)
1
tFEOPR
USB_RXDP
(Input)
USB_RXDM
(Input)
Figure 51. USB Timing Diagram for Data Transfer from USB Transceiver (RX)
Table 41. USB Timing Parameters for Data Transfer from USB Transceiver (RX)
3.0 V ± 0.3 V
Ref No.
1
Parameter
Unit
Minimum
Maximum
82
–
tFEOPR; Receiver SE0 interval of EOP
ns
The USBOTG I2C communication protocol consists of six components: START, Data Source/Recipient,
Data Direction, Slave Acknowledge, Data, Data Acknowledge, and STOP.
USBG_SDA
5
3
4
USBG_SCL
1
2
6
Figure 52. USB Timing Diagram for Data Transfer from USB Transceiver (I2C)
Table 42. USB Timing Parameters for Data Transfer from USB Transceiver (I2C)
1.8 V ± 0.1 V
Ref No.
Parameter
Unit
Minimum
Maximum
188
–
ns
1
Hold time (repeated) START condition
2
Data hold time
0
188
ns
3
Data setup time
88
–
ns
4
HIGH period of the SCL clock
500
–
ns
5
LOW period of the SCL clock
500
–
ns
6
Setup time for STOP condition
185
–
ns
MC9328MX21 Technical Data, Rev. 3.4
62
Freescale Semiconductor
Specifications
3.19
External Interface Module (EIM)
The External Interface Module (EIM) handles the interface to devices external to the i.MX21, including
generation of chip-selects for external peripherals and memory. The timing diagram for the EIM is shown
in Figure 53, and Table 43 defines the parameters of signals.
(HCLK) Bus Clock
1a
1b
2a
2b
3a
3b
Address
Chip-select
Read (Write)
4a
OE (rising edge)
4c
OE (falling edge)
5b
5c
EB (falling edge)
LBA (negated rising edge)
4d
5a
EB (rising edge)
LBA (negated falling edge)
4b
5d
6a
6b
6a
6c
7a
7b
11
Burst Clock (rising edge)
7c
7d
Burst Clock (falling edge)
8b
Read Data
9a
8a
9b
Write Data (negated falling)
9a
9c
Write Data (negated rising)
DTACK
10a
10a
Figure 53. EIM Bus Timing Diagram
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
63
Specifications
Table 43. EIM Bus Timing Parameters
1.8 V ± 0.1 V
Ref No.
1.8 V ±
0.1 V
3.0 V ± 0.3 V
Parameter
Min
Typical
Max
Min
Typical
Max
Unit
1a
Clock fall to address valid
3.97
6.02
9.89
3.83
5.89
9.79
ns
1b
Clock fall to address invalid
3.93
6.00
9.86
3.81
5.86
9.76
ns
2a
Clock fall to chip-select valid
3.47
5.59
8.62
3.30
5.09
8.45
ns
2b
Clock fall to chip-select invalid
3.39
5.09
8.27
3.15
4.85
8.03
ns
3a
Clock fall to Read (Write) Valid
3.51
5.56
8.79
3.39
5.39
8.51
ns
3b
Clock fall to Read (Write) Invalid
3.59
5.37
9.14
3.36
5.20
8.50
ns
4a
Clock1
3.62
5.49
8.98
3.46
5.33
9.02
ns
4b
Clock1 rise to Output Enable Invalid
3.70
5.61
9.26
3.46
5.37
8.81
ns
4c
Clock1
3.60
5.48
8.77
3.44
5.30
8.88
ns
4d
Clock1 fall to Output Enable Invalid
3.69
5.62
9.12
3.42
5.36
8.60
ns
5a
Clock1
3.69
5.46
8.71
3.46
5.25
8.54
ns
5b
Clock1 rise to Enable Bytes Invalid
4.64
5.47
8.70
3.46
5.25
8.54
ns
5c
Clock1
3.52
5.06
8.39
3.41
5.18
8.36
ns
5d
Clock1 fall to Enable Bytes Invalid
3.50
5.05
8.27
3.41
5.18
8.36
ns
6a
Clock1
3.65
5.28
8.69
3.30
5.23
8.81
ns
6b
Clock1 fall to Load Burst Address Invalid
3.65
5.67
9.36
3.41
5.43
9.13
ns
6c
Clock1
3.66
5.69
9.48
3.33
5.47
9.25
ns
7a
Clock1 rise to Burst Clock rise
3.50
5.22
8.42
3.26
4.99
8.19
ns
7b
Clock1rise
to Burst Clock fall
3.49
5.19
8.30
3.31
5.03
8.17
ns
7c
Clock1 fall to Burst Clock rise
3.50
5.22
8.39
3.26
4.98
8.15
ns
7d
Clock1
3.49
5.19
8.29
3.31
5.02
8.12
ns
8a
Read Data setup time
4.54
–
–
4.54
–
–
ns
8b
Read Data hold time
0.5
–
–
0.5
–
–
ns
9a
Clock1 rise to Write Data Valid
4.13
5.86
9.16
3.95
6.36
10.31
ns
9b
Clock1
4.10
5.79
9.15
4.04
6.27
9.16
ns
9c
Clock1 rise to Write Data Invalid
4.02
5.81
9.37
4.22
5.29
9.24
ns
10a
DTACK setup time
2.65
4.63
8.40
2.64
4.61
8.41
ns
11
Burst Clock (BCLK) cycle time
15
–
–
15
–
–
ns
rise to Output Enable Valid
fall to Output Enable Valid
rise to Enable Bytes Valid
fall to Enable Bytes Valid
fall to Load Burst Address Valid
rise to Load Burst Address Invalid
fall to Burst Clock fall
fall to Write Data Invalid
1. Clock refers to the system clock signal, HCLK, generated from the System DPLL
MC9328MX21 Technical Data, Rev. 3.4
64
Freescale Semiconductor
Specifications
3.19.1
EIM External Bus Timing Diagrams
The following timing diagrams show the timing of accesses to memory or a peripheral.
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[0]
htrans
Seq/Nonseq
hwrite
Read
haddr
V1
hready
weim_hrdata
Last Valid Data
V1
weim_hready
BCLK
A[24:0]
Last Valid Address
V1
CS[0]
R/W
Read
LBA
OE
EB (EBC=0)
EB (EBC=1)
DATA_IN
V1
Figure 54. WSC = 1, A.HALF/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
65
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[0]
htrans
Nonseq
hwrite
Write
haddr
V1
hready
hwdata
Last Valid Data
weim_hrdata
Write Data (V1)
Unknown
Last Valid Data
weim_hready
BCLK
A[24:0]
V1
Last Valid Address
CS[0]
Write
R/W
LBA
OE
EB
D[31:0]
Last Valid Data
Write Data (V1)
Figure 55. WSC = 1, WEA = 1, WEN = 1, A.HALF/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
66
Freescale Semiconductor
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[0]
htrans
Nonseq
hwrite
Read
haddr
V1
hready
weim_hrdata
Last Valid Data
V1 Word
weim_hready
BCLK
A[24:0]
Last Valid Addr
Address V1
Address V1 + 2
CS[0]
R/W
Read
LBA
OE
EB (EBC=0)
EB (EBC=1)
DATA_IN
1/2 Half Word
2/2 Half Word
Figure 56. WSC = 1, OEA = 1, A.WORD/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
67
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[0]
htrans
Nonseq
hwrite
Write
haddr
V1
hready
hwdata
Last Valid Data
Write Data (V1 Word)
weim_hrdata
Last Valid Data
weim_hready
BCLK
A[24:0]
Last Valid Addr
Address V1
Address V1 + 2
CS[0]
R/W
Write
LBA
OE
EB
D[31:0]
1/2 Half Word
2/2 Half Word
Figure 57. WSC = 1, WEA = 1, WEN = 1, A.WORD/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
68
Freescale Semiconductor
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[3]
htrans
Nonseq
hwrite
Read
haddr
V1
hready
weim_hrdata
Last Valid Data
V1 Word
weim_hready
BCLK
A[24:0] Last Valid Addr
Address V1
Address V1 + 2
CS[3]
R/W
Read
LBA
OE
EB (EBC=0)
EB (EBC=1)
DATA_IN
1/2 Half Word
2/2 Half Word
Figure 58. WSC = 3, OEA = 2, A.WORD/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
69
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[3]
htrans
Nonseq
hwrite
Write
haddr
V1
hready
hwdata
Last Valid
Data
Write Data (V1 Word)
weim_hrdata
Last Valid Data
weim_hready
BCLK
A[24:0] Last Valid Addr
Address V1
Address V1 + 2
CS[3]
Write
R/W
LBA
OE
EB
D[31:0]
Last Valid Data
1/2 Half Word
2/2 Half Word
Figure 59. WSC = 3, WEA = 1, WEN = 3, A.WORD/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
70
Freescale Semiconductor
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[2]
htrans
Nonseq
hwrite
Read
haddr
V1
hready
weim_hrdata
Last Valid Data
V1 Word
weim_hready
BCLK
A[24:0]
Last Valid Addr
Address V1
Address V1 + 2
CS[2]
R/W
Read
LBA
OE
EB (EBC=0)
EB (EBC=1)
DATA_IN
1/2 Half Word
2/2 Half Word
Figure 60. WSC = 3, OEA = 4, A.WORD/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
71
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[2]
htrans
Nonseq
hwrite
Write
haddr
V1
hready
hwdata
Last Valid
Data
Write Data (V1 Word)
weim_hrdata
Last Valid Data
weim_hready
BCLK
A[24:0]
Last Valid Addr
Address V1
Address V1 + 2
CS[2]
R/W
Write
LBA
OE
EB
D[31:0]
Last Valid Data
1/2 Half Word
2/2 Half Word
Figure 61. WSC = 3, WEA = 2, WEN = 3, A.WORD/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
72
Freescale Semiconductor
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[2]
htrans
Nonseq
hwrite
Read
haddr
V1
hready
weim_hrdata
Last Valid Data
V1 Word
weim_hready
BCLK
A[24:0]
Last Valid Addr
Address V1
Address V1 + 2
CS[2]
R/W
Read
LBA
OE
EB (EBC=0)
EB (EBC=1)
DATA_IN
1/2 Half Word
2/2 Half Word
Figure 62. WSC = 3, OEN = 2, A.WORD/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
73
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[2]
htrans
Nonseq
hwrite
Read
haddr
V1
hready
weim_hrdata
V1 Word
Last Valid Data
weim_hready
BCLK
A[24:0]
Last Valid Addr
Address V1
Address V1 + 2
CS[2]
R/W
Read
LBA
OE
EB (EBC=0)
EB (EBC=1)
DATA_IN
1/2 Half Word
2/2 Half Word
Figure 63. WSC = 3, OEA = 2, OEN = 2, A.WORD/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
74
Freescale Semiconductor
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[2]
htrans
Nonseq
hwrite
Write
haddr
V1
hready
hwdata
Last Valid
Data
Write Data (V1 Word)
weim_hrdata
Unknown
Last Valid Data
weim_hready
BCLK
A[24:0]
Last Valid Addr
Address V1
Address V1 + 2
CS[2]
R/W
Write
LBA
OE
EB
D[31:0]
Last Valid Data
1/2 Half Word
2/2 Half Word
Figure 64. WSC = 2, WWS = 1, WEA = 1, WEN = 2, A.WORD/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
75
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[2]
htrans
Nonseq
hwrite
Write
haddr
V1
hready
hwdata
Last Valid
Data
Write Data (V1 Word)
weim_hrdata
Unknown
Last Valid Data
weim_hready
BCLK
A[24:0]
Last Valid Addr
Address V1
Address V1 + 2
CS[2]
R/W
Write
LBA
OE
EB
D[31:0]
Last Valid Data
1/2 Half Word
2/2 Half Word
Figure 65. WSC = 1, WWS = 2, WEA = 1, WEN = 2, A.WORD/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
76
Freescale Semiconductor
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[2]
htrans
Nonseq
Nonseq
hwrite
Read
Write
haddr
V1
V8
hready
hwdata
weim_hrdata
Last Valid Data
Write Data
Last Valid Data
Read Data
weim_hready
BCLK
A[24:0]
Last Valid Addr
Address V1
Address V8
CS[2]
R/W
Write
Read
LBA
OE
EB (EBC=0)
EB (EBC=1)
DATA_IN
D[31:0]
Read Data
Last Valid Data
Write Data
Figure 66. WSC = 2, WWS = 2, WEA = 1, WEN = 2, A.HALF/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
77
Specifications
Note: Signals listed with lower case letters are internal to the device.
Read
Idle
Write
hclk
hselm_weim_cs[2]
htrans
Nonseq
Nonseq
hwrite
Read
Write
haddr
V1
V8
hready
hwdata
weim_hrdata
Write Data
Last Valid Data
Last Valid Data
Read Data
weim_hready
BCLK
A[24:0]
Last Valid Addr
Address V1
Address V8
CS[2]
R/W
Read
Write
LBA
OE
EB (EBC=0)
EB (EBC=1)
DATA_IN
D[31:0]
Read Data
Last Valid Data
Write Data
Figure 67. WSC = 2, WWS = 1, WEA = 1, WEN = 2, EDC = 1, A.HALF/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
78
Freescale Semiconductor
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[4]
htrans
Nonseq
hwrite
Write
haddr
V1
hready
hwdata
Last Valid
Data
Write Data (Word)
weim_hrdata
Last Valid Data
weim_hready
BCLK
A[24:0]
Last Valid Addr
Address V1
Address V1 + 2
CS[3:0]
R/W
Write
LBA
OE
EB
D[31:0]
Last Valid Data
Write Data (1/2 Half Word)
Write Data (2/2 Half Word)
Figure 68. WSC = 2, CSA = 1, WWS = 1, A.WORD/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
79
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[4]
htrans
Nonseq
Nonseq
hwrite
Read
Write
haddr
V1
V8
hready
hwdata
weim_hrdata
Last Valid Data
Write Data
Last Valid Data
Read Data
weim_hready
BCLK
A[24:0]
Last Valid Addr
Address V1
Address V8
CS[4]
R/W
Write
Read
LBA
OE
EB (EBC=0)
EB (EBC=1)
DATA_IN
D[31:0]
Read Data
Last Valid Data
Write Data
Figure 69. WSC = 3, CSA = 1, A.HALF/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
80
Freescale Semiconductor
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[4]
htrans
Nonseq
hwrite
Read
Read
haddr
V1
V2
Idle
Seq
hready
weim_hrdata
Read Data (V1)
Last Valid Data
Read Data (V2)
weim_hready
BCLK
A[24:0]
Address V1
Last Valid Addr
Address V2
CNC
CS[4]
R/W
Read
LBA
OE
EB (EBC=0)
EB (EBC=1)
DATA_IN
Read Data
(V1)
Read Data
(V2)
Figure 70. WSC = 2, OEA = 2, CNC = 3, BCM = 1, A.HALF/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
81
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[4]
htrans
Nonseq
hwrite
Read
Write
haddr
V1
V8
Idle
Nonseq
hready
hwdata
weim_hrdata
Last Valid Data
Write Data
Last Valid Data
Read Data
weim_hready
BCLK
A[24:0]
Address V1
Last Valid Addr
CNC
CS[4]
R/W
Address V8
Read
Write
LBA
OE
EB (EBC=0)
EB (EBC=1)
DATA_IN
D[31:0]
Read Data
Last Valid Data
Write Data
Figure 71. WSC = 2, OEA = 2, WEA = 1, WEN = 2, CNC = 3, A.HALF/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
82
Freescale Semiconductor
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[2]
htrans
Nonseq
Nonseq
hwrite
Read
Read
haddr
V1
V5
Idle
hready
weim_hrdata
weim_hready
BCLK
A[24:0]
Last Valid Addr
Address V1
Address V5
CS[2]
R/W
Read
LBA
OE
EB (EBC=0)
EB (EBC=1)
ECB
DATA_IN
V1 Word V2 Word
V5 Word V6 Word
Figure 72. WSC = 3, SYNC = 1, A.HALF/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
83
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[2]
htrans
Nonseq
Seq
Seq
Seq
hwrite
Read
Read
Read
Read
haddr
V1
V2
V3
V4
Idle
hready
weim_hrdata
Last Valid Data
V1 Word
V2 Word
V3 Word
V4 Word
weim_hready
BCLK
A[24:0] Last Valid Addr
Address V1
CS[2]
Read
R/W
LBA
OE
EB (EBC=0)
EB (EBC=1)
ECB
DATA_IN
V1 Word
V2 Word
V3 Word
V4 Word
Figure 73. WSC = 2, SYNC = 1, DOL = [1/0], A.WORD/E.WORD
MC9328MX21 Technical Data, Rev. 3.4
84
Freescale Semiconductor
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[2]
htrans
Nonseq
Seq
hwrite
Read
Read
haddr
V1
V2
Idle
hready
weim_hrdata
Last Valid Data
V1 Word
V2 Word
weim_hready
BCLK
A[24:0]
Last Valid Addr
Address V1
Address V2
CS[2]
Read
R/W
LBA
OE
EB (EBC=0)
EB (EBC=1)
ECB
DATA_IN
V1 1/2
V1 2/2
V2 1/2
V2 2/2
Figure 74. WSC = 2, SYNC = 1, DOL = [1/0], A.WORD/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
85
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[2]
htrans
Non
seq
Seq
hwrite
Read
Read
haddr
V1
V2
Idle
hready
weim_hrdata
Last Valid Data
V1 Word
V2 Word
weim_hready
BCLK
A[24:0]
Last Valid
Addr
Address V1
CS[2]
R/W
Read
LBA
OE
EB (EBC=0)
EB (EBC=1)
ECB
DATA_IN
V1 1/2
V1 2/2
V2 1/2
V2 2/2
Figure 75. WSC = 7, OEA = 8, SYNC = 1, DOL = 1, BCD = 1, BCS = 2, A.WORD/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
86
Freescale Semiconductor
Specifications
Note: Signals listed with lower case letters are internal to the device.
hclk
hselm_weim_cs[2]
htrans
Non
seq
Seq
hwrite
Read
Read
haddr
V1
V2
Idle
hready
weim_hrdata
Last Valid Data
V1 Word
V2 Word
weim_hready
BCLK
A[24:0]
Last Valid
Addr
Address V1
CS[2]
R/W
Read
LBA
OE
EB (EBC=0)
EB (EBC=1)
ECB
DATA_IN
V1 1/2
V1 2/2
V2 1/2
V2 2/2
Figure 76. WSC = 7, OEA = 8, SYNC = 1, DOL = 1, BCD = 1, BCS = 1, A.WORD/E.HALF
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
87
Specifications
3.20
DTACK Mode Memory Access Timing Diagrams
When enabled, the DTACK input signal is used to externally terminate a data transfer. For DTACK
enabled operations, a bus time-out monitor generates a bus error when an external bus cycle is not
terminated by the DTACK input signal after 1024 HCLK clock cycles have elapsed, where HCLK is the
internal system clock driven from the PLL module. For a 133 MHz HCLK setting, this time equates to
7.7 μs. Refer to the Section 3.5, “DPLL Timing Specifications” for more information on how to generate
different HCLK frequencies.
There are two modes of operation for the DTACK input signal: rising edge detection or level sensitive
detection with a programmable insensitivity time. DTACK is only used during external asynchronous data
transfers, thus the SYNC bit in the chip select control registers must be cleared.
During edge detection mode, the EIM will terminate an external data transfer following the detection of
the DTACK signal’s rising edge, so long as it occurs within the 1024 HCLK cycle time. Edge detection
mode is used for devices that follow the PCMCIA standard. Note that DTACK rising edge detection mode
can only be used for CS[5] operations. To configure CS[5] for DTACK rising edge detection, the following
bits must be programmed in the Chip Select 5 Control Register and EIM Configuration Register:
• WSC bit field set to 0x3F and CSA (or CSN) set to 1 or greater in the Chip Select 5 Control
Register
• AGE bit set in the EIM Configuration Register
Other bits such as DSZ, OEA, OEN, and so on, may be set according to system and timing requirements
of the external device. The requirement of setting CSA or CSN is required to allow the EIM to wait for the
rising edge of DTACK during back-to-back external transfers, such as during DMA transfers or an internal
32-bit access through an external 16-bit data port.
During level sensitive detection, the EIM will first hold off sampling the DTACK signal for at least 2
HCLK cycles, and up to 5 HCLK cycles as programmed by the DCT bits in the Chip Select Control
Register. After this insensitivity time, the EIM will sample DTACK and if it detects that DTACK is logic
high, it will continue the data transfer at the programmed number of wait states. However, if the EIM
detects that DTACK is logic low, it will wait until DTACK goes to logic high to continue the access, so
long as this occurs within the 1024 HCLK cycle time. If at anytime during an external data transfer
DTACK goes to logic low, the EIM will wait until DTACK returns to logic high to resume the data transfer.
Level detection is often used for asynchronous devices such graphic controller chips. Level detection may
be used with any chip select except CS[4] as it is multiplexed with the DTACK signal. To configure a chip
select for DTACK level sensitive detection, the following bits must be programmed in the Chip Select
Control Register and EIM Configuration Register:
• EW bit set, WSC set to > 1, and CSN set to < 3 in the Chip Select Control Register
• BCD/DCT set to desired “insensitivity time” in the Chip Select Control Register. The “insensitivity
time” is dictated by the external device’s timing requirements.
• AGE bit cleared in the EIM Configuration Register
Other bits such as DSZ, OEA, OEN, and so on, may be set according to system and timing requirements
of the external device.
The waveforms in the following section provide examples of the DTACK signal operation.
MC9328MX21 Technical Data, Rev. 3.4
88
Freescale Semiconductor
Specifications
DTACK Example Waveforms: Internal ARM AHB Word Accesses to
Word-Width (32-bit) Memory
Internal Signal
3.20.1
HCLK
BCLK
ADDR
Last Valid
Addr
V1
CS[5]
RW
Read
LBA
OE
EB (EBC=0)
EB (EBC=1)
DTACK
DATA_IN
V1 Data
Figure 77. DTACK Edge Triggered Read Access, WSC=3F, OEA=8, OEN=5, AGE=1.
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
89
Specifications
Internal Signal
HCLK
BCLK
ADDR
Address V1
Last Valid Addr
V1+4
V1+8
CS[0]
Read
RW
LBA
OE
EB (EBC=0)
EB (EBC=1)
DCT
DTACK
DATA_IN
V1 Word
V1+4 Word
V1+8 Word
Figure 78. DTACK Level Sensitive Sequential Read Accesses, WSC=2, EW=1, DCT=1, AGE=0 (Example of
DTACK Remaining High)
MC9328MX21 Technical Data, Rev. 3.4
90
Freescale Semiconductor
Specifications
Internal Signal
HCLK
BCLK
Address V1
ADDR Last Valid Addr
V1+4
V1+8
CS[0]
RWA
RWN
Write
RW
LBA
OE
EB
DCT
DTACK
DATA_OUT
V1 Word
V1+4 Word
V1+8 W
Figure 79. DTACK Level Sensitive Sequential Write Accesses, WSC=2, EW=1, RWA=1, RWN=1, DCT=1,
AGE=0 (Example of DTACK Asserting)
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
91
Specifications
I2C Module
3.21
The I2C communication protocol consists of seven elements: START, Data Source/Recipient, Data
Direction, Slave Acknowledge, Data, Data Acknowledge, and STOP.
SDA
3
5
4
SCL
1
6
2
2
Figure 80. Definition of Bus Timing for I C
Table 44. I2C Bus Timing Parameters
1.8 V ± 0.1 V
Ref
No.
3.0 V ± 0.3 V
Parameter
Unit
SCL Clock Frequency
Minimum
Maximum
Minimum
Maximum
0
100
0
100
kHz
114.8
–
111.1
–
ns
1
Hold time (repeated) START condition
2
Data hold time
0
69.7
0
72.3
ns
3
Data setup time
3.1
–
1.76
–
ns
4
HIGH period of the SCL clock
69.7
–
68.3
–
ns
5
LOW period of the SCL clock
336.4
–
335.1
–
ns
6
Setup time for STOP condition
110.5
–
111.1
–
ns
3.22
CMOS Sensor Interface
The CSI module consists of a control register to configure the interface timing, a control register for
statistic data generation, a status register, interface logic, a 32 × 32 image data receive FIFO, and a 16 × 32
statistic data FIFO.
3.22.1
Gated Clock Mode
Figure 81 shows the timing diagram when the CMOS sensor output data is configured for negative edge
and the CSI is programmed to received data on the positive edge. Figure 82 shows the timing diagram
when the CMOS sensor output data is configured for positive edge and the CSI is programmed to received
data in negative edge. The parameters for the timing diagrams are listed in Table 45. The formula for
calculating the pixel clock rise and fall time is located in Section 3.22.3, “Calculation of Pixel Clock Rise/
Fall Time.”
MC9328MX21 Technical Data, Rev. 3.4
92
Freescale Semiconductor
Specifications
1
VSYNC
7
HSYNC
5
6
2
PIXCLK
Valid Data
DATA[7:0]
3
Valid Data
Valid Data
4
Figure 81. Sensor Output Data on Pixel Clock Falling Edge
CSI Latches Data on Pixel Clock Rising Edge
1
VSYNC
7
HSYNC
5
2
6
PIXCLK
Valid Data
DATA[7:0]
3
Valid Data
Valid Data
4
Figure 82. Sensor Output Data on Pixel Clock Rising Edge
CSI Latches Data on Pixel Clock Falling Edge
Table 45. Gated Clock Mode Timing Parameters
Number
Parameter
Minimum
Maximum
Unit
1
csi_vsync to csi_hsync
9 * THCLK
–
ns
2
csi_hsync to csi_pixclk
3
(TP/2) - 3
ns
3
csi_d setup time
1
–
ns
4
csi_d hold time
1
–
ns
5
csi_pixclk high time
THCLK
–
ns
6
csi_pixclk low time
THCLK
–
ns
7
csi_pixclk frequency
0
HCLK / 2
MHz
HCLK = AHB System Clock, THCLK = Period for HCLK, TP = Period of CSI_PIXCLK
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
93
Specifications
The limitation on pixel clock rise time/fall time is not specified. It should be calculated from the hold time
and setup time based on the following assumptions:
Rising-edge latch data
max rise time allowed = (positive duty cycle - hold time)
max fall time allowed = (negative duty cycle - setup time)
In most of case, duty cycle is 50 / 50, therefore
max rise time = (period / 2 - hold time)
max fall time = (period / 2 - setup time)
For example: Given pixel clock period = 10ns, duty cycle = 50 / 50, hold time = 1ns, setup time = 1ns.
positive duty cycle = 10 / 2 = 5ns
≥ max rise time allowed = 5 - 1 = 4ns
negative duty cycle = 10 / 2 = 5ns
≥ max fall time allowed = 5 - 1 = 4ns
Falling-edge latch data
max fall time allowed = (negative duty cycle - hold time)
max rise time allowed = (positive duty cycle - setup time)
3.22.2
Non-Gated Clock Mode
Figure 83 shows the timing diagram when the CMOS sensor output data is configured for negative edge
and the CSI is programmed to received data on the positive edge. Figure 84 shows the timing diagram
when the CMOS sensor output data is configured for positive edge and the CSI is programmed to received
data in negative edge. The parameters for the timing diagrams are listed in Table 46. The formula for
calculating the pixel clock rise and fall time is located in Section 3.22.3, “Calculation of Pixel Clock Rise/
Fall Time.”
1
VSYNC
6
4
5
PIXCLK
DATA[7:0]
Valid Data
2
Valid Data
Valid Data
3
Figure 83. Sensor Output Data on Pixel Clock Falling Edge
CSI Latches Data on Pixel Clock Rising Edge
MC9328MX21 Technical Data, Rev. 3.4
94
Freescale Semiconductor
Specifications
1
VSYNC
6
4
5
PIXCLK
Valid Data
DATA[7:0]
2
Valid Data
Valid Data
3
Figure 84. Sensor Output Data on Pixel Clock Rising Edge
CSI Latches Data on Pixel Clock Falling Edge
Table 46. Non-Gated Clock Mode Parameters1
Number
Parameter
Minimum
Maximum
Unit
9 * THCLK
–
ns
1
csi_vsync to csi_pixclk
2
csi_d setup time
1
–
ns
3
csi_d hold time
1
–
ns
4
csi_pixclk high time
THCLK
–
ns
5
csi_pixclk low time
THCLK
–
ns
6
csi_pixclk frequency
0
HCLK / 2
MHz
1. HCLK = AHB System Clock, THCLK = Period of HCLK
3.22.3
Calculation of Pixel Clock Rise/Fall Time
The limitation on pixel clock rise time/fall time is not specified. It should be calculated from the hold time
and setup time based on the following assumptions:
Rising-edge latch data
• max rise time allowed = (positive duty cycle - hold time)
• max fall time allowed = (negative duty cycle - setup time)
In most of case, duty cycle is 50 / 50, therefore:
• max rise time = (period / 2 - hold time)
• max fall time = (period / 2 - setup time)
For example: Given pixel clock period = 10ns, duty cycle = 50 / 50, hold time = 1ns, setup time = 1ns.
positive duty cycle = 10 / 2 = 5ns
≥ max rise time allowed = 5 - 1 = 4ns
negative duty cycle = 10 / 2 = 5ns
≥ max fall time allowed = 5 - 1 = 4ns
Falling-edge latch data
• max fall time allowed = (negative duty cycle - hold time)
• max rise time allowed = (positive duty cycle - setup time)
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
95
Freescale Semiconductor
4
Pin Assignment and Package Information
Table 47. i.MX21 Pin Assignment
1
2
3
4
5
6
OE_
ACD
7
8
9
10
SD2_D2
CSI_
D0
CSI_
PIXCLK
CSI_
VSYNC
11
12
13
USBH1_ USBH1_ USBG_
OE
FS
FS
15
16
17
18
19
TOUT
SAP_
TXDAT
SSI1_
CLK
SSI2_
RXDAT
SSI2_TXDAT
SSI3_
FS
SAP_
FS
SSI1_
FS
SSI2_
FS
SSI3_
TXDAT
I2C_DATA
CSPI2_
SS2
TIN
SSI1_
TXDAT
SSI3_
RXDAT
SSI3_
CLK
I2C_CLK
CSPI2_
SS1
USBG_
RXDP
SAP_
RXDAT
SSI1_
RXDAT
SSI2_
CLK
CSPI2_SS0
CSPI2_
SCLK
SAP_
CLK
CSPI2_
MISO
CSPI1_SS2
CSPI2_
MOSI
CSPI1_
SS1
CSPI1_
MISO
KP_ROW0
CSPI1_
SS0
A
LD9
LD12
LD14
REV
HSYNC
B
LD7
LD5
LD11
LD16
PS
CON
SD2_D0
TRAST
SD2_
CMD
CSI_
D4
CSI_D6
USB_
PWR
USBG_
SCL
C
LD1
LD3
LD6
LD10
LD17
VSYNC SD2_D3
CSI_
D1
CSI_
MCLK
CSI_
HSYNC
USB_
OC
USBH1_ USBG_
RXDM
RXDM
D
LD2
LD0
LD13
CLS
QVDD
SD2_
CLK
CSI_
D2
CSI_D7
E
LD8
LD4
LD15
SPL_
SPR
F
A24_
NFIO14
D31
A25_
LSCLK
NFIO15
G
A22_
NFIO12
D29
A23_
NFIO13
D30
NVDD6
NVSS6
CSI_D3
USB_
BYP
USBH_
ON
USBG_
SDA
USBG_
TXDP
KP_
ROW1
KP_
ROW3
UART2_CTS
KP_
ROW4
H
A20
D27
A21_
NFIO11
D28
NVDD1
NVSS5
CSI_D5
CSPI1_
SCLK
CSPI1_
RDY
USBH1_ USBG_
TXDP
OE
TEST_
WB4
TEST_
WB2
TEST_WB3
PWMO
J
A19
A18
D25
D26
NVDD1 NVDD5
NVDD4
KP_
ROW5
KP_
ROW2
CSPI1_
MOSI
TEST_
WB0
KP_COL0
TEST_
WB1
K
A16
A17
D23
D24
NVSS1
NVSS4
QVDDX
UART1_
RXD
TDO
QVDD
QVSS
KP_
COL3
KP_COL5
KP_COL4
KP_
COL2
L
A14_
NFIO9
A15_
NFIO10
D21
D22
NVSS1
NVDD3
QVDD
QVSS
NFIO2
NFWP
UART1_
TXD
UART2_
TXD
UART3_
RTS
UART3_CTS
UART3_
TXD
M
D19
A13_
NFIO8
D20
D18
NVDD2 NVDD3
NVSS3
QVSS
NFIO7
NFRB
EXT_
48M
UART2_
RXD
UART3_
RXD
UART1_RTS
UART1_
CTS
N
A11
A12
D17
D16
NVSS1
NVSS1
NVDD1
NVDD1
SD1_
D0
TCK
SD1_D1
RTCK
P
A9
A10
D15
D14
SD1_
D2
SD1_
CMD
TDI
TMS
R
A7
A8
D13
D12
SD1_
CLK
EXT_
266M
NVSS2
TRST
T
A5
A6
EB3
D10
CS3
CS1
BCLK
MA11
RAS
CAS
NFIO5
NFIO3
NFWE
RESET_
IN
NFCE
BOOT1
SD1_D3
CLKMODE1
CLK
MODE0
U
D11
EB1
EB2
OE
CS4
D6
ECB
D3
MA10
PC_
PWRON
PF16
NFIO4
NFIO1
NFALE
NFCLE
POR
BOOT2
BOOT3
XTAL32K
V
A4
EB0
D9
D8
CS5
D5
CS0
RW
D1
JTAG_
CTRL
SDWE
CLKO
NFIO6
QVSS
RESET_
BOOT0
OUT
OSC26M_
TEST
VDDA
EXTAL
32K
W
A3
A2
D7
A1
CS2
A0
D4
D2
D0
SDCLK
SDCKE1
NFIO0
NFRE
QVDD
EXTAL
26M
XTAL26M
QVDD
QVSS
QVSS
SD2_D1
LBA
NVSS3 SDCKE0
USBG_
TXDM
USBH1_ USBH1_ USBG_
TXDM
RXDP
ON
UART2_
KP_COL1
RTS
QVSS
96
Pin Assignment and Package Information
MC9328MX21 Technical Data, Rev. 3.4
14
Pin Assignment and Package Information
4.1
MAPBGA Package Dimensions
Figure 85 illustrates the MAPBGA 14 mm × 14 mm × 1.41 mm package, which has 0.65 mm ball pitch.
Figure 85. i.MX21 MAPBGA Mechanical Drawing
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
97
Pin Assignment and Package Information
4.2
MAPBGA Package Dimensions
Figure 86 illustrates the MAPBGA 17 mm × 17 mm × 1.45 mm package, which has 0.8 mm spacing
between the pads.
Figure 86. i.MX21 MAPBGA Mechanical Drawing
MC9328MX21 Technical Data, Rev. 3.4
98
Freescale Semiconductor
Document Revision History
5
Document Revision History
Table 48 provides the document changes for the MC9328MX21 Rev. 3.4.
Table 48. Document Revision History
Location
Table 30 on page 46
Description of Change
Updated the table by removing the table footnote
Table 1 on page 3
Added VM and CVM devices.
Table 7 on page 16
Updated Sleep Current values.
Table 1 on page 4
Added a part number MC9328MX21CJM and a footnote.
MC9328MX21 Technical Data, Rev. 3.4
Freescale Semiconductor
99
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Document Number: MC9328MX21
Rev. 3.4
07/2010
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