Freescale MPC860SRZQ50D4R2 Hardware specification Datasheet

Freescale Semiconductor
MPC860EC
Rev. 7, 09/2004
Technical Data
MPC860 Family
Hardware Specifications
This hardware specification contains detailed information on
power considerations, DC/AC electrical characteristics, and AC
timing specifications for the MPC860 family.
1
Overview
The MPC860 Power Quad Integrated Communications Controller
(PowerQUICC™) is a versatile one-chip integrated
microprocessor and peripheral combination designed for a variety
of controller applications. It particularly excels in
communications and networking systems. The PowerQUICC unit
is referred to as the MPC860 in this hardware specification.
The MPC860 implements the PowerPC architecture and contains
a superset of Freescale’s MC68360 Quad Integrated
Communications Controller (QUICC™), referred to here as the
QUICC, RISC Communications Proccessor Module (CPM). The
CPM from the MC68360 QUICC has been enhanced by the
addition of the inter-integrated controller (I2C) channel. The
memory controller has been enhanced, enabling the MPC860 to
support any type of memory, including high-performance
memories and new types of DRAMs. A PCMCIA socket
controller supports up to two sockets. A real-time clock has also
been integrated.
Table 1 shows the functionality supported by the members of the
MPC860 family.
© Freescale Semiconductor, Inc., 2004. All rights reserved.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Maximum Tolerated Ratings . . . . . . . . . . . . . . . . . . . 5
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . 6
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal Calculation and Measurement . . . . . . . . . . . 9
Layout Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Bus Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 12
IEEE 1149.1 Electrical Specifications . . . . . . . . . . . 41
CPM Electrical Characteristics . . . . . . . . . . . . . . . . . 43
UTOPIA AC Electrical Specifications . . . . . . . . . . . 67
FEC Electrical Characteristics . . . . . . . . . . . . . . . . . 68
Mechanical Data and Ordering Information . . . . . . . 71
Document Revision History . . . . . . . . . . . . . . . . . . . 77
Features
Table 1. MPC860 Family Functionality
Cache (Kbytes)
Ethernet
ATM
SCC
Reference 1
—
—
2
1
Up to 2
1
Yes
2
1
8
Up to 2
1
Yes
2
1
4
4
Up to 4
—
—
4
1
MPC860SR
4
4
Up to 4
—
Yes
4
1
MPC860T
4
4
Up to 4
1
Yes
4
1
MPC860P
16
8
Up to 4
1
Yes
4
1
MPC855T
4
4
1
1
Yes
1
2
Part
Instruction
Cache
Data Cache
10T
10/100
MPC860DE
4
4
Up to 2
MPC860DT
4
4
MPC860DP
16
MPC860EN
1
2
Supporting documentation for these devices refers to the following:
1. MPC860 PowerQUICC Family User’s Manual (MPC860UM, Rev. 3)
2. MPC855T User’s Manual (MPC855TUM/D, Rev. 1)
Features
The following list summarizes the key MPC860 features:
•
•
•
•
•
Embedded single-issue, 32-bit PowerPCTM core (implementing the PowerPC architecture) with
thirty-two 32-bit general-purpose registers (GPRs)
— The core performs branch prediction with conditional prefetch without conditional execution.
— 4- or 8-Kbyte data cache and 4- or 16-Kbyte instruction cache (see Table 1)
– 16-Kbyte instruction caches are four-way, set-associative with 256 sets; 4-Kbyte instruction caches
are two-way, set-associative with 128 sets.
– 8-Kbyte data caches are two-way, set-associative with 256 sets; 4-Kbyte data caches are two-way,
set-associative with 128 sets.
– Cache coherency for both instruction and data caches is maintained on 128-bit (4-word) cache
blocks.
– Caches are physically addressed, implement a least recently used (LRU) replacement algorithm, and
are lockable on a cache block basis.
— MMUs with 32-entry TLB, fully-associative instruction, and data TLBs
— MMUs support multiple page sizes of 4-, 16-, and 512-Kbytes, and 8-Mbytes; 16 virtual address spaces
and 16 protection groups
— Advanced on-chip-emulation debug mode
Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits)
32 address lines
Operates at up to 80 MHz
Memory controller (eight banks)
— Contains complete dynamic RAM (DRAM) controller
MPC860 Family Hardware Specifications, Rev. 7
2
Freescale Semiconductor
Features
•
•
•
•
•
— Each bank can be a chip select or RAS to support a DRAM bank.
— Up to 15 wait states programmable per memory bank
— Glueless interface to DRAM, SIMMS, SRAM, EPROM, Flash EPROM, and other memory devices
— DRAM controller programmable to support most size and speed memory interfaces
— Four CAS lines, four WE lines, and one OE line
— Boot chip-select available at reset (options for 8-, 16-, or 32-bit memory)
— Variable block sizes (32 Kbyte to 256 Mbyte)
— Selectable write protection
— On-chip bus arbitration logic
General-purpose timers
— Four 16-bit timers or two 32-bit timers
— Gate mode can enable/disable counting
— Interrupt can be masked on reference match and event capture.
System integration unit (SIU)
— Bus monitor
— Software watchdog
— Periodic interrupt timer (PIT)
— Low-power stop mode
— Clock synthesizer
— Decrementer, time base, and real-time clock (RTC) from the PowerPC architecture
— Reset controller
— IEEE 1149.1 test access port (JTAG)
Interrupts
— Seven external interrupt request (IRQ) lines
— 12 port pins with interrupt capability
— 23 internal interrupt sources
— Programmable priority between SCCs
— Programmable highest priority request
10/100 Mbps Ethernet support, fully compliant with the IEEE 802.3u Standard (not available when using
ATM over UTOPIA interface)
ATM support compliant with ATM forum UNI 4.0 specification
— Cell processing up to 50–70 Mbps at 50-MHz system clock
— Cell multiplexing/demultiplexing
— Support of AAL5 and AAL0 protocols on a per-VC basis. AAL0 support enables OAM and software
implementation of other protocols.
— ATM pace control (APC) scheduler, providing direct support for constant bit rate (CBR) and
unspecified bit rate (UBR) and providing control mechanisms enabling software support of available
bit rate (ABR)
— Physical interface support for UTOPIA (10/100-Mbps is not supported with this interface) and
byte-aligned serial (for example, T1/E1/ADSL)
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
3
Features
•
•
•
•
•
•
— UTOPIA-mode ATM supports level-1 master with cell-level handshake, multi-PHY (up to four physical
layer devices), connection to 25-, 51-, or 155-Mbps framers, and UTOPIA/system clock ratios of 1/2 or
1/3.
— Serial-mode ATM connection supports transmission convergence (TC) function for T1/E1/ADSL lines,
cell delineation, cell payload scrambling/descrambling, automatic idle/unassigned cell
insertion/stripping, header error control (HEC) generation, checking, and statistics.
Communications processor module (CPM)
— RISC communications processor (CP)
— Communication-specific commands (for example, GRACEFUL STOP TRANSMIT, ENTER HUNT MODE, and
RESTART TRANSMIT)
— Supports continuous mode transmission and reception on all serial channels
— Up to 8 Kbytes of dual-port RAM
— 16 serial DMA (SDMA) channels
— Three parallel I/O registers with open-drain capability
Four baud-rate generators (BRGs)
— Independent (can be tied to any SCC or SMC)
— Allows changes during operation
— Autobaud support option
Four serial communications controllers (SCCs)
— Ethernet/IEEE 802.3 optional on SCC1–4, supporting full 10-Mbps operation (available only on
specially programmed devices)
— HDLC/SDLC (all channels supported at 2 Mbps)
— HDLC bus (implements an HDLC-based local area network (LAN))
— Asynchronous HDLC to support point-to-point protocol (PPP)
— AppleTalk
— Universal asynchronous receiver transmitter (UART)
— Synchronous UART
— Serial infrared (IrDA)
— Binary synchronous communication (BISYNC)
— Totally transparent (bit streams)
— Totally transparent (frame-based with optional cyclic redundancy check (CRC))
Two SMCs (serial management channels)
— UART
— Transparent
— General circuit interface (GCI) controller
— Can be connected to the time-division multiplexed (TDM) channels
One SPI (serial peripheral interface)
— Supports master and slave modes
— Supports multimaster operation on the same bus
One I2C (inter-integrated circuit) port
— Supports master and slave modes
MPC860 Family Hardware Specifications, Rev. 7
4
Freescale Semiconductor
Maximum Tolerated Ratings
•
•
•
•
•
•
•
3
— Multiple-master environment support
Time-slot assigner (TSA)
— Allows SCCs and SMCs to run in multiplexed and/or non-multiplexed operation
— Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user defined
— 1- or 8-bit resolution
— Allows independent transmit and receive routing, frame synchronization, and clocking
— Allows dynamic changes
— Can be internally connected to six serial channels (four SCCs and two SMCs)
Parallel interface port (PIP)
— Centronics interface support
— Supports fast connection between compatible ports on the MPC860 or the MC68360
PCMCIA interface
— Master (socket) interface, release 2.1 compliant
— Supports two independent PCMCIA sockets
— Supports eight memory or I/O windows
Low power support
— Full on—all units fully powered
— Doze—core functional units disabled except time base decrementer, PLL, memory controller, RTC, and
CPM in low-power standby
— Sleep—all units disabled except RTC and PIT, PLL active for fast wake up
— Deep sleep—all units disabled including PLL except RTC and PIT
— Power down mode—all units powered down except PLL, RTC, PIT, time base, and decrementer
Debug interface
— Eight comparators: four operate on instruction address, two operate on data address, and two operate on
data
— Supports conditions: = ≠ < >
— Each watchpoint can generate a break-point internally.
3.3-V operation with 5-V TTL compatibility except EXTAL and EXTCLK
357-pin ball grid array (BGA) package
Maximum Tolerated Ratings
This section provides the maximum tolerated voltage and temperature ranges for the MPC860. Table 2 provides the
maximum ratings.
This device contains circuitry protecting against damage due to high-static voltage or electrical fields; however, it
is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages
to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic
voltage level (for example, either GND or Vdd).
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
5
Thermal Characteristics
Table 2. Maximum Tolerated Ratings
(GND = 0 V)
Rating
Supply voltage 1
Input voltage 2
Temperature 3 (standard)
3
Temperature (extended)
Storage temperature range
Symbol
Value
Unit
VDDH
–0.3 to 4.0
V
VDDL
–0.3 to 4.0
V
KAPWR
–0.3 to 4.0
V
VDDSYN
–0.3 to 4.0
V
Vin
GND – 0.3 to
VDDH
V
TA(min)
0
°C
Tj(max)
95
°C
TA(min)
–40
°C
Tj(max)
95
°C
Tstg
–55 to 150
°C
1
The power supply of the device must start its ramp from 0.0 V.
Functional operating conditions are provided with the DC electrical specifications in Table 6. Absolute maximum
ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage to the device.
Caution: All inputs that tolerate 5 V cannot be more than 2.5 V greater than the supply voltage. This restriction applies
to power-up and normal operation (that is, if the MPC860 is unpowered, voltage greater than 2.5 V must not be
applied to its inputs).
3 Minimum temperatures are guaranteed as ambient temperature, T . Maximum temperatures are guaranteed as
A
junction temperature, Tj.
2
4
Thermal Characteristics
Table 3. Package Description
Package Designator
Package Code (Case No.)
Package Description
ZP
5050 (1103-01)
PBGA 357 25*25*0.9P1.27
ZQ / VR
5058 (1103D-02)
PBGA 357 25*25*1.2P1.27
Table 4 shows the thermal characteristics for the MPC860.
MPC860 Family Hardware Specifications, Rev. 7
6
Freescale Semiconductor
Power Dissipation
Table 4. MPC860 Thermal Resistance Data
Rating
ZP
MPC860P
ZQ / VR
MPC860P
Unit
0.85
1.15
mm
34
34
°C/W
RθJMA 3
22
22
Single-layer board (1s)
RθJMA
3
27
27
Four-layer board (2s2p)
RθJMA3
18
18
RθJB
14
13
RθJC
6
8
ΨJT
2
2
Environment
Symbol
Mold Compound Thickness
Junction-to-ambient
1
Natural convection
Single-layer board (1s)
Four-layer board (2s2p)
Airflow (200 ft/min)
Junction-to-board
4
Junction-to-case 5
Junction-to-package top
1
2
3
4
5
6
6
Natural convection
2
RθJA
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad
packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from
the junction to the exposed pad without contact resistance.
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2.
5
Power Dissipation
Table 5 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1,
where CPU frequency is twice the bus speed.
Table 5. Power Dissipation (PD)
Frequency (MHz)
Typical 1
Maximum 2
Unit
D.4
(1:1 mode)
50
656
735
mW
66
TBD
TBD
mW
D.4
(2:1 mode)
66
722
762
mW
80
851
909
mW
Die Revision
1
2
Typical power dissipation is measured at 3.3 V.
Maximum power dissipation is measured at 3.5 V.
NOTE
Values in Table 5 represent VDDL-based power dissipation and do not include I/O
power dissipation over VDDH. I/O power dissipation varies widely by application
due to buffer current, depending on external circuitry.
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
7
DC Characteristics
6
DC Characteristics
Table 6 provides the DC electrical characteristics for the MPC860.
Table 6. DC Electrical Specifications
Characteristic
Symbol
Min
Max
Unit
VDDH, VDDL, VDDSYN
3.0
3.6
V
KAPWR
(power-down mode)
2.0
3.6
V
KAPWR
(all other operating modes)
VDDH – 0.4
VDDH
V
VDDH, VDDL, KAPWR,
VDDSYN
3.135
3.465
V
KAPWR
(power-down mode)
2.0
3.6
V
KAPWR
(all other operating modes)
VDDH – 0.4
VDDH
V
Input high voltage (all inputs except EXTAL and
EXTCLK)
VIH
2.0
5.5
V
Input low voltage 1
VIL
GND
0.8
V
VIHC
0.7 × (VDDH)
VDDH + 0.3
V
Input leakage current, Vin = 5.5 V (except TMS,
TRST, DSCK, and DSDI pins)
Iin
—
100
µA
Input leakage current, Vin = 3.6 V (except TMS,
TRST, DSCK, and DSDI pins)
IIn
—
10
µA
Input leakage current, Vin = 0 V (except TMS,
TRST, DSCK, and DSDI pins)
IIn
—
10
µA
Input capacitance 2
Cin
—
20
pF
Output high voltage, IOH = –2.0 mA, VDDH = 3.0 V
(except XTAL, XFC, and open-drain pins)
VOH
2.4
—
V
Output low voltage
IOL = 2.0 mA, CLKOUT
IOL = 3.2 mA 3
IOL = 5.3 mA 4
IOL = 7.0 mA, TXD1/PA14, TXD2/PA12
IOL = 8.9 mA, TS, TA, TEA, BI, BB,
HRESET, SRESET
VOL
—
0.5
V
Operating voltage at 40 MHz or less
Operating voltage greater than 40 MHz
EXTAL, EXTCLK input high voltage
1
VIL(max) for the I2C interface is 0.8 V rather than the 1.5 V as specified in the I2C standard.
2 Input capacitance is periodically sampled.
MPC860 Family Hardware Specifications, Rev. 7
8
Freescale Semiconductor
Thermal Calculation and Measurement
3
A(0:31), TSIZ0/REG, TSIZ1, D(0:31), DP(0:3)/IRQ(3:6), RD/WR, BURST, RSV/IRQ2, IP_B(0:1)/IWP(0:1)/
VFLS(0:1), IP_B2/IOIS16_B/AT2, IP_B3/IWP2/VF2, IP_B4/LWP0/VF0, IP_B5/LWP1/VF1, IP_B6/DSDI/AT0,
IP_B7/PTR/AT3, RXD1 /PA15, RXD2/PA13, L1TXDB/PA11, L1RXDB/PA10, L1TXDA/PA9, L1RXDA/PA8,
TIN1/L1RCLKA/BRGO1/CLK1/PA7, BRGCLK1/TOUT1/CLK2/PA6, TIN2/L1TCLKA/BRGO2/CLK3/PA5,
TOUT2/CLK4/PA4, TIN3/BRGO3/CLK5/PA3, BRGCLK2/L1RCLKB/TOUT3/CLK6/PA2, TIN4/BRGO4/CLK7/
PA1, L1TCLKB/TOUT4/CLK8/PA0, REJCT1/SPISEL/PB31, SPICLK/PB30, SPIMOSI/PB29, BRGO4/SPIMISO/
PB28, BRGO1/I2CSDA/PB27, BRGO2/I2CSCL/PB26, SMTXD1/PB25, SMRXD1/PB24, SMSYN1/SDACK1/
PB23, SMSYN2/SDACK2/PB22, SMTXD2/L1CLKOB/PB21, SMRXD2/L1CLKOA/PB20, L1ST1/RTS1/PB19,
L1ST2/RTS2/PB18, L1ST3/L1RQB/PB17, L1ST4/L1RQA/PB16, BRGO3/PB15, RSTRT1/PB14, L1ST1/RTS1/
DREQ0/PC15, L1ST2/RTS2/DREQ1/PC14, L1ST3/L1RQB/PC13, L1ST4/L1RQA/PC12, CTS1/PC11,
TGATE1/CD1/PC10, CTS2/PC9, TGATE2/CD2/PC8, SDACK2/L1TSYNCB/PC7, L1RSYNCB/PC6, SDACK1/
L1TSYNCA/PC5, L1RSYNCA/PC4, PD15, PD14, PD13, PD12, PD11, PD10, PD9, PD8, PD5, PD6, PD7, PD4, PD3,
MII_MDC, MII_TX_ER, MII_EN, MII_MDIO, MII_TXD[0:3]
4
BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:5), CS(6)/CE(1)_B, CS(7)/CE(2)_B, WE0/BS_B0/IORD,
WE1/BS_B1/IOWR, WE2/BS_B2/PCOE, WE3/BS_B3/PCWE, BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/
GPL_B1, GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A, CE1_A,
CE2_A, ALE_B/DSCK/AT1, OP(0:1), OP2/MODCK1/STS, OP3/MODCK2/DSDO, BADDR(28:30)
7
Thermal Calculation and Measurement
For the following discussions, PD = (VDD × IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers.
7.1 Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (ºC)
RθJA = package junction-to-ambient thermal resistance (ºC/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value which provides a quick and easy estimation
of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor
of two (in the quantity TJ – TA) are possible.
7.2 Estimation with Junction-to-Case Thermal Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal resistance
and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (ºC/W)
RθJC = junction-to-case thermal resistance (ºC/W)
RθCA = case-to-ambient thermal resistance (ºC/W)
RθJC is device related and cannot be influenced by the user. The user adjusts the thermal environment to affect the
case-to-ambient thermal resistance, RθCA. For instance, the user can change the air flow around the device, add a
heat sink, change the mounting arrangement on the printed circuit board, or change the thermal dissipation on the
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
9
Thermal Calculation and Measurement
printed circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks
where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most
packages, a better model is required.
7.3 Estimation with Junction-to-Board Thermal Resistance
Junction Temperature Rise Above
Ambient Divided by Package Power
A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two-resistor model
consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case thermal resistance
covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the top of the
package. The junction-to-board thermal resistance describes the thermal performance when most of the heat is
conducted to the printed circuit board. It has been observed that the thermal performance of most plastic packages,
especially PBGA packages, is strongly dependent on the board temperature; see Figure 1.
Board Temperature Rise Above Ambient Divided by Package Power
Figure 1. Effect of Board Temperature Rise on Thermal Behavior
If the board temperature is known, an estimate of the junction temperature in the environment can be made using
the following equation:
TJ = TB + (RθJB × PD)
where:
RθJB = junction-to-board thermal resistance (ºC/W)
TB = board temperature (ºC)
PD = power dissipation in package
If the board temperature is known and the heat loss from the package case to the air can be ignored, acceptable
predictions of junction temperature can be made. For this method to work, the board and board mounting must be
similar to the test board used to determine the junction-to-board thermal resistance, namely a 2s2p (board with a
power and a ground plane) and by attaching the thermal balls to the ground plane.
MPC860 Family Hardware Specifications, Rev. 7
10
Freescale Semiconductor
Layout Practices
7.4 Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple two-resistor
model can be used with the thermal simulation of the application [2], or a more accurate and complex model of the
package can be used in the thermal simulation.
7.5 Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the thermal
characterization parameter (ΨJT) can be used to determine the junction temperature with a measurement of the
temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
ΨJT = thermal characterization parameter
TT = thermocouple temperature on top of package
PD = power dissipation in package
The thermal characterization parameter is measured per JEDEC JESD51-2 specification using a 40 gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the
thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and
over 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to
avoid measurement errors caused by cooling effects of the thermocouple wire.
7.6 References
Semiconductor Equipment and Materials International
805 East Middlefield Rd.
Mountain View, CA 94043
(415) 964-5111
MIL-SPEC and EIA/JESD (JEDEC) Specifications
(Available from Global Engineering Documents)
800-854-7179 or
303-397-7956
JEDEC Specifications
http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive
Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its
Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.
8
Layout Practices
Each VDD pin on the MPC860 should be provided with a low-impedance path to the board’s supply. Each GND pin
should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct groups of
logic on the chip. The VDD power supply should be bypassed to ground using at least four 0.1 µF-bypass capacitors
located as close as possible to the four sides of the package. The capacitor leads and associated printed circuit traces
connecting to chip VDD and GND should be kept to less than half an inch per capacitor lead. A four-layer board
employing two inner layers as VCC and GND planes is recommended.
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
11
Bus Signal Timing
All output pins on the MPC860 have fast rise and fall times. Printed circuit (PC) trace interconnection length should
be minimized in order to minimize undershoot and reflections caused by these fast output switching times. This
recommendation particularly applies to the address and data buses. Maximum PC trace lengths of 6 inches are
recommended. Capacitance calculations should consider all device loads as well as parasitic capacitances due to the
PC traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher
capacitive loads because these loads create higher transient currents in the VCC and GND circuits. Pull up all unused
inputs or signals that will be inputs during reset. Special care should be taken to minimize the noise levels on the
PLL supply pins.
9
Bus Signal Timing
Table 7 provides the bus operation timing for the MPC860 at 33, 40, 50, and 66 MHz.
The maximum bus speed supported by the MPC860 is 66 MHz. Higher-speed parts must be operated in half-speed
bus mode (for example, an MPC860 used at 80 MHz must be configured for a 40 MHz bus).
The timing for the MPC860 bus shown assumes a 50-pF load for maximum delays and a 0-pF load for minimum
delays.
Table 7. Bus Operation Timings
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B1
CLKOUT period
30.30
30.30
25.00
30.30
20.00
30.30
15.15
30.30
ns
B1a
EXTCLK to CLKOUT phase skew
(EXTCLK > 15 MHz and MF <= 2)
–0.90
0.90
–0.90
0.90
–0.90
0.90
–0.90
0.90
ns
B1b
EXTCLK to CLKOUT phase skew
(EXTCLK > 10 MHz and MF < 10)
–2.30
2.30
–2.30
2.30
–2.30
2.30
–2.30
2.30
ns
B1c
CLKOUT phase jitter (EXTCLK >
15 MHz and MF <= 2) 1
–0.60
0.60
–0.60
0.60
–0.60
0.60
–0.60
0.60
ns
B1d
CLKOUT phase jitter1
–2.00
2.00
–2.00
2.00
–2.00
2.00
–2.00
2.00
ns
B1e
CLKOUT frequency jitter (MF < 10) 1
—
0.50
—
0.50
—
0.50
—
0.50
%
B1f
CLKOUT frequency jitter (10 < MF
< 500) 1
—
2.00
—
2.00
—
2.00
—
2.00
%
B1g
CLKOUT frequency jitter (MF > 500)
—
3.00
—
3.00
—
3.00
—
3.00
%
—
0.50
—
0.50
—
0.50
—
0.50
%
1
B1h
Frequency jitter on EXTCLK 2
B2
CLKOUT pulse width low
12.12
—
10.00
—
8.00
—
6.06
—
ns
B3
CLKOUT width high
12.12
—
10.00
—
8.00
—
6.06
—
ns
B4
time 3
—
4.00
—
4.00
—
4.00
—
4.00
ns
—
4.00
—
4.00
—
4.00
—
4.00
ns
7.58
—
6.25
—
5.00
—
3.80
—
ns
B533
B7
CLKOUT rise
CLKOUT fall time3
CLKOUT to A(0:31), BADDR(28:30),
RD/WR, BURST, D(0:31), DP(0:3)
invalid
MPC860 Family Hardware Specifications, Rev. 7
12
Freescale Semiconductor
Bus Signal Timing
Table 7. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B7a
CLKOUT to TSIZ(0:1), REG, RSV,
AT(0:3), BDIP, PTR invalid
7.58
—
6.25
—
5.00
—
3.80
—
ns
B7b
CLKOUT to BR, BG, FRZ,
VFLS(0:1), VF(0:2) IWP(0:2),
LWP(0:1), STS invalid 4
7.58
—
6.25
—
5.00
—
3.80
—
ns
B8
CLKOUT to A(0:31), BADDR(28:30)
RD/WR, BURST, D(0:31), DP(0:3)
valid
7.58
14.33
6.25
13.00
5.00
11.75
3.80
10.04
ns
B8a
CLKOUT to TSIZ(0:1), REG, RSV,
AT(0:3) BDIP, PTR valid
7.58
14.33
6.25
13.00
5.00
11.75
3.80
10.04
ns
B8b
CLKOUT to BR, BG, VFLS(0:1),
VF(0:2), IWP(0:2), FRZ, LWP(0:1),
STS valid 4
7.58
14.33
6.25
13.00
5.00
11.75
3.80
10.04
ns
B9
CLKOUT to A(0:31), BADDR(28:30),
RD/WR, BURST, D(0:31), DP(0:3),
TSIZ(0:1), REG, RSV, AT(0:3), PTR
High-Z
7.58
14.33
6.25
13.00
5.00
11.75
3.80
10.04
ns
B11
CLKOUT to TS, BB assertion
7.58
13.58
6.25
12.25
5.00
11.00
3.80
11.29
ns
B11a
CLKOUT to TA, BI assertion (when
driven by the memory controller or
PCMCIA interface)
2.50
9.25
2.50
9.25
2.50
9.25
2.50
9.75
ns
B12
CLKOUT to TS, BB negation
7.58
14.33
6.25
13.00
5.00
11.75
3.80
8.54
ns
B12a CLKOUT to TA, BI negation (when
driven by the memory controller or
PCMCIA interface)
2.50
11.00
2.50
11.00
2.50
11.00
2.50
9.00
ns
B13
CLKOUT to TS, BB High-Z
7.58
21.58
6.25
20.25
5.00
19.00
3.80
14.04
ns
B13a CLKOUT to TA, BI High-Z (when
driven by the memory controller or
PCMCIA interface)
2.50
15.00
2.50
15.00
2.50
15.00
2.50
15.00
ns
B14
CLKOUT to TEA assertion
2.50
10.00
2.50
10.00
2.50
10.00
2.50
9.00
ns
B15
CLKOUT to TEA High-Z
2.50
15.00
2.50
15.00
2.50
15.00
2.50
15.00
ns
B16
TA, BI valid to CLKOUT (setup time)
9.75
—
9.75
—
9.75
—
6.00
—
ns
B16a TEA, KR, RETRY, CR valid to
CLKOUT (setup time)
10.00
—
10.00
—
10.00
—
4.50
—
ns
B16b BB, BG, BR, valid to CLKOUT (setup
time) 5
8.50
—
8.50
—
8.50
—
4.00
—
ns
B17
1.00
—
1.00
—
1.00
—
2.00
—
ns
2.00
—
2.00
—
2.00
—
2.00
—
ns
CLKOUT to TA, TEA, BI, BB, BG, BR
valid (hold time)
B17a CLKOUT to KR, RETRY, CR valid
(hold time)
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
13
Bus Signal Timing
Table 7. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B18
D(0:31), DP(0:3) valid to CLKOUT
rising edge (setup time) 6
6.00
—
6.00
—
6.00
—
6.00
—
ns
B19
CLKOUT rising edge to D(0:31),
DP(0:3) valid (hold time) 6
1.00
—
1.00
—
1.00
—
2.00
—
ns
B20
D(0:31), DP(0:3) valid to CLKOUT
falling edge (setup time) 7
4.00
—
4.00
—
4.00
—
4.00
—
ns
B21
CLKOUT falling edge to D(0:31),
DP(0:3) valid (hold time) 7
2.00
—
2.00
—
2.00
—
2.00
—
ns
B22
CLKOUT rising edge to CS asserted
GPCM ACS = 00
7.58
14.33
6.25
13.00
5.00
11.75
3.80
10.04
ns
B22a CLKOUT falling edge to CS asserted
GPCM ACS = 10, TRLX = 0
—
8.00
—
8.00
—
8.00
—
8.00
ns
B22b CLKOUT falling edge to CS asserted
GPCM ACS = 11, TRLX = 0,
EBDF = 0
7.58
14.33
6.25
13.00
5.00
11.75
3.80
10.54
ns
B22c CLKOUT falling edge to CS asserted
GPCM ACS = 11, TRLX = 0,
EBDF = 1
10.86
17.99
8.88
16.00
7.00
14.13
5.18
12.31
ns
B23
CLKOUT rising edge to CS negated
GPCM read access, GPCM write
access ACS = 00, TRLX = 0, and
CSNT = 0
2.00
8.00
2.00
8.00
2.00
8.00
2.00
8.00
ns
B24
A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 10,
TRLX = 0
5.58
—
4.25
—
3.00
—
1.79
—
ns
B24a A(0:31) and BADDR(28:30) to CS
13.15
asserted GPCM ACS = 11, TRLX = 0
—
10.50
—
8.00
—
5.58
—
ns
B25
CLKOUT rising edge to OE, WE(0:3)
asserted
—
9.00
—
9.00
—
9.00
—
9.00
ns
B26
CLKOUT rising edge to OE negated
2.00
9.00
2.00
9.00
2.00
9.00
2.00
9.00
ns
B27
A(0:31) and BADDR(28:30) to CS
35.88
asserted GPCM ACS = 10, TRLX = 1
—
29.25
—
23.00
—
16.94
—
ns
B27a A(0:31) and BADDR(28:30) to CS
43.45
asserted GPCM ACS = 11, TRLX = 1
—
35.50
—
28.00
—
20.73
—
ns
—
9.00
—
9.00
—
9.00
—
9.00
ns
7.58
14.33
6.25
13.00
5.00
11.75
3.80
10.54
ns
B28
CLKOUT rising edge to WE(0:3)
negated GPCM write access
CSNT = 0
B28a CLKOUT falling edge to WE(0:3)
negated GPCM write access
TRLX = 0, 1, CSNT = 1, EBDF = 0
MPC860 Family Hardware Specifications, Rev. 7
14
Freescale Semiconductor
Bus Signal Timing
Table 7. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B28b CLKOUT falling edge to CS negated
GPCM write access TRLX = 0, 1,
CSNT = 1, ACS = 10, or ACS = 11,
EBDF = 0
—
14.33
—
13.00
—
11.75
—
10.54
ns
B28c CLKOUT falling edge to WE(0:3)
negated GPCM write access
TRLX = 0, 1, CSNT = 1 write access
TRLX = 0, CSNT = 1, EBDF = 1
10.86
17.99
8.88
16.00
7.00
14.13
5.18
12.31
ns
B28d CLKOUT falling edge to CS negated
GPCM write access TRLX = 0, 1,
CSNT = 1, ACS = 10, or ACS = 11,
EBDF = 1
—
17.99
—
16.00
—
14.13
—
12.31
ns
WE(0:3) negated to D(0:31), DP(0:3)
High-Z GPCM write access
CSNT = 0, EBDF = 0
5.58
—
4.25
—
3.00
—
1.79
—
ns
B29a WE(0:3) negated to D(0:31), DP(0:3)
High-Z GPCM write access,
TRLX = 0, CSNT = 1, EBDF = 0
13.15
—
10.5
—
8.00
—
5.58
—
ns
B29b CS negated to D(0:31), DP(0:3),
High-Z GPCM write access,
ACS = 00, TRLX = 0, 1, and CSNT =
0
5.58
—
4.25
—
3.00
—
1.79
—
ns
B29c CS negated to D(0:31), DP(0:3)
High-Z GPCM write access,
TRLX = 0, CSNT = 1, ACS = 10, or
ACS = 11, EBDF = 0
13.15
—
10.5
—
8.00
—
5.58
—
ns
B29d WE(0:3) negated to D(0:31), DP(0:3)
High-Z GPCM write access,
TRLX = 1, CSNT = 1, EBDF = 0
43.45
—
35.5
—
28.00
—
20.73
—
ns
B29e CS negated to D(0:31), DP(0:3)
High-Z GPCM write access,
TRLX = 1, CSNT = 1, ACS = 10, or
ACS = 11, EBDF = 0
43.45
—
35.5
—
28.00
—
29.73
—
ns
B29f
8.86
—
6.88
—
5.00
—
3.18
—
ns
B29g CS negated to D(0:31), DP(0:3)
High-Z GPCM write access,
TRLX = 0, CSNT = 1, ACS = 10, or
ACS = 11, EBDF = 1
8.86
—
6.88
—
5.00
—
3.18
—
ns
B29h WE(0:3) negated to D(0:31), DP(0:3)
High-Z GPCM write access,
TRLX = 1, CSNT = 1, EBDF = 1
38.67
—
31.38
—
24.50
—
17.83
—
ns
B29
WE(0:3) negated to D(0:31), DP(0:3)
High-Z GPCM write access,
TRLX = 0, CSNT = 1, EBDF = 1
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
15
Table 7. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
B29i
CS negated to D(0:31), DP(0:3)
High-Z GPCM write access,
How to Reach
Us:
= 1, CSNT = 1, ACS = 10, or
TRLX
= 11, EBDF = 1
ACS
Home Page:
Unit
Min
Max
Min
Max
Min
Max
Min
Max
38.67
—
31.38
—
24.50
—
17.83
—
ns
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MPC860EC
Rev. 7
09/2004
information in this document.
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© Freescale Semiconductor, Inc. 2004.
Bus Signal Timing
Table 7. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
5.58
—
4.25
—
3.00
—
1.79
—
ns
B30a WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM, write
access, TRLX = 0, CSNT = 1,
CS negated to A(0:31) invalid GPCM
write access, TRLX = 0, CSNT =1
ACS = 10, or ACS = 11, EBDF = 0
13.15
—
10.50
—
8.00
—
5.58
—
ns
B30b WE(0:3) negated to A(0:31),
invalid GPCM BADDR(28:30) invalid
GPCM write access, TRLX = 1,
CSNT = 1. CS negated to A(0:31),
Invalid GPCM, write access,
TRLX = 1, CSNT = 1, ACS = 10, or
ACS = 11, EBDF = 0
43.45
—
35.50
—
28.00
—
20.73
—
ns
B30c WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM write
access, TRLX = 0, CSNT = 1.
CS negated to A(0:31) invalid GPCM
write access, TRLX = 0, CSNT = 1,
ACS = 10, ACS = 11, EBDF = 1
8.36
—
6.38
—
4.50
—
2.68
—
ns
B30d WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM write
access, TRLX = 1, CSNT =1.
CS negated to A(0:31) invalid GPCM
write access TRLX = 1, CSNT = 1,
ACS = 10, or ACS = 11, EBDF = 1
38.67
—
31.38
—
24.50
—
17.83
—
ns
B31
CLKOUT falling edge to CS
valid—as requested by control bit
CST4 in the corresponding word in
UPM
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B31a CLKOUT falling edge to CS
valid—as requested by control bit
CST1 in the corresponding word in
UPM
7.58
14.33
6.25
13.00
5.00
11.75
3.80
10.54
ns
B31b CLKOUT rising edge to CS valid—as
requested by control bit CST2 in the
corresponding word in UPM
1.50
8.00
1.50
8.00
1.50
8.00
1.50
8.00
ns
B31c CLKOUT rising edge to CS valid—as
requested by control bit CST3 in the
corresponding word in UPM
7.58
14.33
6.25
13.00
5.00
11.75
3.80
10.04
ns
B30
CS, WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM write
access 8
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
17
Bus Signal Timing
Table 7. Bus Operation Timings (continued)
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B31d CLKOUT falling edge to CS
valid—as requested by control bit
CST1 in the corresponding word in
UPM, EBDF = 1
13.26
17.99
11.28
16.00
9.40
14.13
7.58
12.31
ns
B32
CLKOUT falling edge to BS
valid—as requested by control bit
BST4 in the corresponding word in
UPM
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B32a CLKOUT falling edge to BS
valid—as requested by control bit
BST1 in the corresponding word in
UPM, EBDF = 0
7.58
14.33
6.25
13.00
5.00
11.75
3.80
10.54
ns
B32b CLKOUT rising edge to BS valid—as
requested by control bit BST2 in the
corresponding word in UPM
1.50
8.00
1.50
8.00
1.50
8.00
1.50
8.00
ns
B32c CLKOUT rising edge to BS valid—as
requested by control bit BST3 in the
corresponding word in UPM
7.58
14.33
6.25
13.00
5.00
11.75
3.80
10.54
ns
B32d CLKOUT falling edge to BS
valid—as requested by control bit
BST1 in the corresponding word in
UPM, EBDF = 1
13.26
17.99
11.28
16.00
9.40
14.13
7.58
12.31
ns
B33
CLKOUT falling edge to GPL
valid—as requested by control bit
GxT4 in the corresponding word in
UPM
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B33a CLKOUT rising edge to GPL
valid—as requested by control bit
GxT3 in the corresponding word in
UPM
7.58
14.33
6.25
13.00
5.00
11.75
3.80
10.54
ns
B34
A(0:31), BADDR(28:30), and D(0:31)
to CS valid—as requested by control
bit CST4 in the corresponding word
in UPM
5.58
—
4.25
—
3.00
—
1.79
—
ns
B34a A(0:31), BADDR(28:30), and D(0:31)
to CS valid—as requested by control
bit CST1 in the corresponding word
in UPM
13.15
—
10.50
—
8.00
—
5.58
—
ns
B34b A(0:31), BADDR(28:30), and D(0:31)
to CS valid—as requested by control
bit CST2 in the corresponding word
in UPM
20.73
—
16.75
—
13.00
—
9.36
—
ns
MPC860 Family Hardware Specifications, Rev. 7
18
Freescale Semiconductor
Bus Signal Timing
Table 7. Bus Operation Timings (continued)
33 MHz
Num
2
3
4
5
6
7
50 MHz
66 MHz
Unit
Min
Max
Min
Max
Min
Max
Min
Max
5.58
—
4.25
—
3.00
—
1.79
—
ns
B35a A(0:31), BADDR(28:30), and D(0:31)
to BS valid—as requested by control
bit BST1 in the corresponding word
in UPM
13.15
—
10.50
—
8.00
—
5.58
—
ns
B35b A(0:31), BADDR(28:30), and D(0:31)
to BS valid—as requested by control
bit BST2 in the corresponding word
in UPM
20.73
—
16.75
—
13.00
—
9.36
—
ns
B36
A(0:31), BADDR(28:30), and D(0:31)
to GPL valid—as requested by
control bit GxT4 in the corresponding
word in UPM
5.58
—
4.25
—
3.00
—
1.79
—
ns
B37
UPWAIT valid to CLKOUT falling
edge 9
6.00
—
6.00
—
6.00
—
6.00
—
ns
B38
CLKOUT falling edge to UPWAIT
valid 9
1.00
—
1.00
—
1.00
—
1.00
—
ns
B39
AS valid to CLKOUT rising edge 10
7.00
—
7.00
—
7.00
—
7.00
—
ns
B40
A(0:31), TSIZ(0:1), RD/WR, BURST,
valid to CLKOUT rising edge
7.00
—
7.00
—
7.00
—
7.00
—
ns
B41
TS valid to CLKOUT rising edge
(setup time)
7.00
—
7.00
—
7.00
—
7.00
—
ns
B42
CLKOUT rising edge to TS valid
(hold time)
2.00
—
2.00
—
2.00
—
2.00
—
ns
B43
AS negation to memory controller
signals negation
—
TBD
—
TBD
—
TBD
—
TBD
ns
B35
1
40 MHz
Characteristic
A(0:31), BADDR(28:30) to CS
valid—as requested by control bit
BST4 in the corresponding word in
UPM
Phase and frequency jitter performance results are only valid if the input jitter is less than the prescribed value.
If the rate of change of the frequency of EXTAL is slow (that is, it does not jump between the minimum and maximum
values in one cycle) or the frequency of the jitter is fast (that is, it does not stay at an extreme value for a long time)
then the maximum allowed jitter on EXTAL can be up to 2%.
The timings specified in B4 and B5 are based on full strength clock.
The timing for BR output is relevant when the MPC860 is selected to work with external bus arbiter. The timing for
BG output is relevant when the MPC860 is selected to work with internal bus arbiter.
The timing required for BR input is relevant when the MPC860 is selected to work with internal bus arbiter. The timing
for BG input is relevant when the MPC860 is selected to work with external bus arbiter.
The D(0:31) and DP(0:3) input timings B18 and B19 refer to the rising edge of the CLKOUT in which the TA input
signal is asserted.
The D(0:31) and DP(0:3) input timings B20 and B21 refer to the falling edge of the CLKOUT. This timing is valid only
for read accesses controlled by chip-selects under control of the UPM in the memory controller, for data beats where
DLT3 = 1 in the UPM RAM words. (This is only the case where data is latched on the falling edge of CLKOUT.)
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
19
Bus Signal Timing
8
The timing B30 refers to CS when ACS = 00 and to WE(0:3) when CSNT = 0.
The signal UPWAIT is considered asynchronous to the CLKOUT and synchronized internally. The timings specified
in B37 and B38 are specified to enable the freeze of the UPM output signals as described in Figure 17.
10
The AS signal is considered asynchronous to the CLKOUT. The timing B39 is specified in order to allow the behavior
specified in Figure 20.
9
Figure 2 is the control timing diagram.
CLKOUT
2.0 V
2.0 V
0.8 V
0.8 V
A
B
Outputs
2.0 V
0.8 V
2.0 V
0.8 V
A
B
2.0 V
0.8 V
Outputs
2.0 V
0.8 V
D
C
2.0 V
0.8 V
Inputs
2.0 V
0.8 V
D
C
2.0 V
0.8 V
Inputs
A
Maximum output delay specification
B
Minimum output hold time
C
Minimum input setup time specification
D
Minimum input hold time specification
2.0 V
0.8 V
Figure 2. Control Timing
Figure 3 provides the timing for the external clock.
MPC860 Family Hardware Specifications, Rev. 7
20
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B1
B3
B1
B4
B2
B5
Figure 3. External Clock Timing
Figure 4 provides the timing for the synchronous output signals.
CLKOUT
B8
B7
B9
Output
Signals
B8a
B7a
B9
Output
Signals
B8b
B7b
Output
Signals
Figure 4. Synchronous Output Signals Timing
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
21
Bus Signal Timing
Figure 5 provides the timing for the synchronous active pull-up and open-drain output signals.
CLKOUT
B13
B11
B12
TS, BB
B13a
B11a
B12a
TA, BI
B14
B15
TEA
Figure 5. Synchronous Active Pull-Up Resistor and Open-Drain Outputs Signals Timing
Figure 6 provides the timing for the synchronous input signals.
CLKOUT
B16
B17
TA, BI
B16a
B17a
TEA, KR,
RETRY, CR
B16b
B17
BB, BG, BR
Figure 6. Synchronous Input Signals Timing
Figure 7 provides normal case timing for input data. It also applies to normal read accesses under the control of the
UPM in the memory controller.
MPC860 Family Hardware Specifications, Rev. 7
22
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B16
B17
TA
B18
B19
D[0:31],
DP[0:3]
Figure 7. Input Data Timing in Normal Case
Figure 8 provides the timing for the input data controlled by the UPM for data beats where DLT3 = 1 in the UPM
RAM words. (This is only the case where data is latched on the falling edge of CLKOUT.)
CLKOUT
TA
B20
B21
D[0:31],
DP[0:3]
Figure 8. Input Data Timing when Controlled by UPM in the Memory Controller
and DLT3 = 1
Figure 9 through Figure 12 provide the timing for the external bus read controlled by various GPCM factors.
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
23
Bus Signal Timing
CLKOUT
B11
B12
TS
B8
A[0:31]
B22
B23
CSx
B25
B26
OE
B28
WE[0:3]
B19
B18
D[0:31],
DP[0:3]
Figure 9. External Bus Read Timing (GPCM Controlled—ACS = 00)
MPC860 Family Hardware Specifications, Rev. 7
24
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B11
B12
TS
B8
A[0:31]
B23
B22a
CSx
B24
B25
B26
OE
B18
B19
D[0:31],
DP[0:3]
Figure 10. External Bus Read Timing (GPCM Controlled—TRLX = 0, ACS = 10)
CLKOUT
B11
B12
TS
B8
B22b
A[0:31]
B23
B22c
CSx
B24a
B25
B26
OE
B18
B19
D[0:31],
DP[0:3]
Figure 11. External Bus Read Timing (GPCM Controlled—TRLX = 0, ACS = 11)
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
25
Bus Signal Timing
CLKOUT
B11
B12
TS
B8
A[0:31]
B23
B22a
CSx
B27
OE
B26
B27a
B22b B22c
B18
B19
D[0:31],
DP[0:3]
Figure 12. External Bus Read Timing (GPCM Controlled—TRLX = 0 or 1, ACS = 10, ACS = 11)
Figure 13 through Figure 15 provide the timing for the external bus write controlled by various GPCM factors.
MPC860 Family Hardware Specifications, Rev. 7
26
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B11
B12
TS
B8
B30
A[0:31]
B22
B23
CSx
B25
B28
WE[0:3]
B26
B29b
OE
B29
B8
B9
D[0:31],
DP[0:3]
Figure 13. External Bus Write Timing (GPCM Controlled—TRLX = 0 or 1, CSNT = 0)
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
27
Bus Signal Timing
CLKOUT
B11
B12
TS
B8
B30a B30c
A[0:31]
B22
B23
B28b B28d
CSx
B25
B29c B29g
WE[0:3]
B26
B29a B29f
OE
B28a B28c
B8
B9
D[0:31],
DP[0:3]
Figure 14. External Bus Write Timing (GPCM Controlled—TRLX = 0 or 1, CSNT = 1)
MPC860 Family Hardware Specifications, Rev. 7
28
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B11
B12
TS
B8
B30b B30d
A[0:31]
B22
B23
B28b B28d
CSx
B25
B29e B29i
WE[0:3]
B26
B29d B29h
OE
B29b
B8
B28a B28c
B9
D[0:31],
DP[0:3]
Figure 15. External Bus Write Timing (GPCM Controlled—TRLX = 0 or 1, CSNT = 1)
Figure 16 provides the timing for the external bus controlled by the UPM.
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
29
Bus Signal Timing
CLKOUT
B8
A[0:31]
B31a
B31d
B31
B31c
B31b
CSx
B34
B34a
B34b
B32a B32d
B32
B32c
B32b
BS_A[0:3],
BS_B[0:3]
B35 B36
B35a
B33a
B35b
B33
GPL_A[0:5],
GPL_B[0:5]
Figure 16. External Bus Timing (UPM Controlled Signals)
Figure 17 provides the timing for the asynchronous asserted UPWAIT signal controlled by the UPM.
MPC860 Family Hardware Specifications, Rev. 7
30
Freescale Semiconductor
Bus Signal Timing
CLKOUT
B37
UPWAIT
B38
CSx
BS_A[0:3],
BS_B[0:3]
GPL_A[0:5],
GPL_B[0:5]
Figure 17. Asynchronous UPWAIT Asserted Detection in UPM Handled Cycles Timing
Figure 18 provides the timing for the asynchronous negated UPWAIT signal controlled by the UPM.
CLKOUT
B37
UPWAIT
B38
CSx
BS_A[0:3],
BS_B[0:3]
GPL_A[0:5],
GPL_B[0:5]
Figure 18. Asynchronous UPWAIT Negated Detection in UPM Handled Cycles Timing
Figure 19 provides the timing for the synchronous external master access controlled by the GPCM.
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
31
Bus Signal Timing
CLKOUT
B41
B42
TS
B40
A[0:31],
TSIZ[0:1],
R/W, BURST
B22
CSx
Figure 19. Synchronous External Master Access Timing (GPCM Handled ACS = 00)
Figure 20 provides the timing for the asynchronous external master memory access controlled by the GPCM.
CLKOUT
B39
AS
B40
A[0:31],
TSIZ[0:1],
R/W
B22
CSx
Figure 20. Asynchronous External Master Memory Access Timing
(GPCM Controlled—ACS = 00)
Figure 21 provides the timing for the asynchronous external master control signals negation.
AS
B43
CSx, WE[0:3],
OE, GPLx,
BS[0:3]
Figure 21. Asynchronous External Master—Control Signals Negation Timing
MPC860 Family Hardware Specifications, Rev. 7
32
Freescale Semiconductor
Bus Signal Timing
Table 8 provides interrupt timing for the MPC860.
Table 8. Interrupt Timing
All Frequencies
Characteristic 1
Num
1
Unit
Min
Max
I39
IRQx valid to CLKOUT rising edge (setup time)
6.00
—
ns
I40
IRQx hold time after CLKOUT
2.00
—
ns
I41
IRQx pulse width low
3.00
—
ns
I42
IRQx pulse width high
3.00
—
ns
I43
IRQx edge-to-edge time
4 × TCLOCKOUT
—
—
The timings I39 and I40 describe the testing conditions under which the IRQ lines are tested when being defined as
level-sensitive. The IRQ lines are synchronized internally and do not have to be asserted or negated with reference
to the CLKOUT.
The timings I41, I42, and I43 are specified to allow the correct function of the IRQ lines detection circuitry and have
no direct relation with the total system interrupt latency that the MPC860 is able to support.
Figure 22 provides the interrupt detection timing for the external level-sensitive lines.
CLKOUT
I39
I40
IRQx
Figure 22. Interrupt Detection Timing for External Level Sensitive Lines
Figure 23 provides the interrupt detection timing for the external edge-sensitive lines.
CLKOUT
I41
I42
IRQx
I43
I43
Figure 23. Interrupt Detection Timing for External Edge Sensitive Lines
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
33
Bus Signal Timing
Table 9 shows the PCMCIA timing for the MPC860.
Table 9. PCMCIA Timing
33 MHz
Num
1
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
P44
A(0:31), REG valid to PCMCIA
Strobe asserted 1
20.73
—
16.75
—
13.00
—
9.36
—
ns
P45
A(0:31), REG valid to ALE negation 1 28.30
—
23.00
—
18.00
—
13.15
—
ns
P46
CLKOUT to REG valid
7.58
15.58
6.25
14.25
5.00
13.00
3.79
11.84
ns
P47
CLKOUT to REG invalid
8.58
—
7.25
—
6.00
—
4.84
—
ns
P48
CLKOUT to CE1, CE2 asserted
7.58
15.58
6.25
14.25
5.00
13.00
3.79
11.84
ns
P49
CLKOUT to CE1, CE2 negated
7.58
15.58
6.25
14.25
5.00
13.00
3.79
11.84
ns
P50
CLKOUT to PCOE, IORD, PCWE,
IOWR assert time
—
11.00
11.00
—
11.00
—
11.00
ns
P51
CLKOUT to PCOE, IORD, PCWE,
IOWR negate time
2.00
11.00
2.00
11.00
2.00
11.00
2.00
11.00
ns
P52
CLKOUT to ALE assert time
7.58
15.58
6.25
14.25
5.00
13.00
3.79
10.04
ns
P53
CLKOUT to ALE negate time
—
15.58
14.25
—
13.00
—
11.84
ns
P54
PCWE, IOWR negated to D(0:31)
invalid 1
5.58
—
4.25
—
3.00
—
1.79
—
ns
P55
WAITA and WAITB valid to CLKOUT
rising edge 1
8.00
—
8.00
—
8.00
—
8.00
—
ns
P56
CLKOUT rising edge to WAITA and
WAITB invalid 1
2.00
—
2.00
—
2.00
—
2.00
—
ns
PSST = 1. Otherwise add PSST times cycle time.
PSHT = 0. Otherwise add PSHT times cycle time.
These synchronous timings define when the WAITx signals are detected in order to freeze (or relieve) the
PCMCIA current cycle. The WAITx assertion will be effective only if it is detected 2 cycles before the PSL
timer expiration. See Chapter 16, “PCMCIA Interface,” in the MPC860 PowerQUICC User’s Manual.
Figure 24 provides the PCMCIA access cycle timing for the external bus read.
MPC860 Family Hardware Specifications, Rev. 7
34
Freescale Semiconductor
Bus Signal Timing
CLKOUT
TS
P44
A[0:31]
P46
P45
P47
REG
P48
P49
CE1/CE2
P50
P51
P53
P52
PCOE, IORD
P52
ALE
B18
B19
D[0:31]
Figure 24. PCMCIA Access Cycle Timing External Bus Read
Figure 25 provides the PCMCIA access cycle timing for the external bus write.
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
35
Bus Signal Timing
CLKOUT
TS
P44
A[0:31]
P46
P45
P47
REG
P48
P49
CE1/CE2
P50
P51
P53
P52
B8
B9
P54
PCWE, IOWR
P52
ALE
D[0:31]
Figure 25. PCMCIA Access Cycle Timing External Bus Write
Figure 26 provides the PCMCIA WAIT signal detection timing.
CLKOUT
P55
P56
WAITx
Figure 26. PCMCIA WAIT Signal Detection Timing
Table 10 shows the PCMCIA port timing for the MPC860.
MPC860 Family Hardware Specifications, Rev. 7
36
Freescale Semiconductor
Bus Signal Timing
Table 10. PCMCIA Port Timing
33 MHz
Num
1
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
—
19.00
—
19.00
—
19.00
—
19.00
ns
P57
CLKOUT to OPx valid
P58
HRESET negated to OPx drive 1
25.73
—
21.75
—
18.00
—
14.36
—
ns
P59
IP_Xx valid to CLKOUT rising edge
5.00
—
5.00
—
5.00
—
5.00
—
ns
P60
CLKOUT rising edge to IP_Xx
invalid
1.00
—
1.00
—
1.00
—
1.00
—
ns
OP2 and OP3 only
Figure 27 provides the PCMCIA output port timing for the MPC860.
CLKOUT
P57
Output
Signals
HRESET
P58
OP2, OP3
Figure 27. PCMCIA Output Port Timing
Figure 28 provides the PCMCIA output port timing for the MPC860.
CLKOUT
P59
P60
Input
Signals
Figure 28. PCMCIA Input Port Timing
Table 11 shows the debug port timing for the MPC860.
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
37
Bus Signal Timing
Table 11. Debug Port Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
3 × TCLOCKOUT
—
—
P61
DSCK cycle time
P62
DSCK clock pulse width
1.25 × TCLOCKOUT
—
—
P63
DSCK rise and fall times
0.00
3.00
ns
P64
DSDI input data setup time
8.00
—
ns
P65
DSDI data hold time
5.00
—
ns
P66
DSCK low to DSDO data valid
0.00
15.00
ns
P67
DSCK low to DSDO invalid
0.00
2.00
ns
Figure 29 provides the input timing for the debug port clock.
DSCK
D61
D62
D61
D62
D63
D63
Figure 29. Debug Port Clock Input Timing
Figure 30 provides the timing for the debug port.
DSCK
D64
D65
DSDI
D66
D67
DSDO
Figure 30. Debug Port Timings
MPC860 Family Hardware Specifications, Rev. 7
38
Freescale Semiconductor
Bus Signal Timing
Table 12 shows the reset timing for the MPC860.
Table 12. Reset Timing
33 MHz
Num
40 MHz
50 MHz
66 MHz
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
R69
CLKOUT to HRESET high
impedance
—
20.00
—
20.00
—
20.00
—
20.00
ns
R70
CLKOUT to SRESET high
impedance
—
20.00
—
20.00
—
20.00
—
20.00
ns
R71
RSTCONF pulse width
515.1
5
—
425.0
0
340.0
0
—
257.5
8
—
ns
R72
—
—
—
—
—
—
—
—
—
R73
Configuration data to HRESET rising
edge setup time
504.5
5
—
425.0
0
—
350.0
0
—
277.2
7
—
ns
R74
Configuration data to RSTCONF
rising edge setup time
350.0
0
—
350.0
0
—
350.0
0
—
350.0
0
—
ns
R75
Configuration data hold time after
RSTCONF negation
0.00
—
0.00
—
0.00
—
0.00
—
ns
R76
Configuration data hold time after
HRESET negation
0.00
—
0.00
—
0.00
—
0.00
—
ns
R77
HRESET and RSTCONF asserted to
data out drive
—
25.00
25.00
—
25.00
—
25.00
ns
R78
RSTCONF negated to data out high
impedance
—
25.00
—
25.00
—
25.00
—
25.00
ns
R79
CLKOUT of last rising edge before
chip three-state HRESET to data out
high impedance
—
25.00
—
25.00
—
25.00
—
25.00
ns
R80
DSDI, DSCK setup
90.91
—
75.00
—
60.00
—
45.45
—
ns
R81
DSDI, DSCK hold time
0.00
—
0.00
—
0.00
—
0.00
—
ns
R82
SRESET negated to CLKOUT rising
edge for DSDI and DSCK sample
242.4
2
—
200.0
0
—
160.0
0
—
121.2
1
—
ns
Figure 31 shows the reset timing for the data bus configuration.
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
39
Bus Signal Timing
HRESET
R71
R76
RSTCONF
R73
R74
R75
D[0:31] (IN)
Figure 31. Reset Timing—Configuration from Data Bus
Figure 32 provides the reset timing for the data bus weak drive during configuration.
CLKOUT
R69
HRESET
R79
RSTCONF
R77
R78
D[0:31] (OUT)
(Weak)
Figure 32. Reset Timing—Data Bus Weak Drive During Configuration
Figure 33 provides the reset timing for the debug port configuration.
MPC860 Family Hardware Specifications, Rev. 7
40
Freescale Semiconductor
IEEE 1149.1 Electrical Specifications
CLKOUT
R70
R82
SRESET
R80
R80
R81
R81
DSCK, DSDI
Figure 33. Reset Timing—Debug Port Configuration
10 IEEE 1149.1 Electrical Specifications
Table 13 provides the JTAG timings for the MPC860 shown in Figure 34 through Figure 37.
Table 13. JTAG Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
J82
TCK cycle time
100.00
—
ns
J83
TCK clock pulse width measured at 1.5 V
40.00
—
ns
J84
TCK rise and fall times
0.00
10.00
ns
J85
TMS, TDI data setup time
5.00
—
ns
J86
TMS, TDI data hold time
25.00
—
ns
J87
TCK low to TDO data valid
—
27.00
ns
J88
TCK low to TDO data invalid
0.00
—
ns
J89
TCK low to TDO high impedance
—
20.00
ns
J90
TRST assert time
100.00
—
ns
J91
TRST setup time to TCK low
40.00
—
ns
J92
TCK falling edge to output valid
—
50.00
ns
J93
TCK falling edge to output valid out of high impedance
—
50.00
ns
J94
TCK falling edge to output high impedance
—
50.00
ns
J95
Boundary scan input valid to TCK rising edge
50.00
—
ns
J96
TCK rising edge to boundary scan input invalid
50.00
—
ns
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
41
IEEE 1149.1 Electrical Specifications
TCK
J82
J83
J82
J83
J84
J84
Figure 34. JTAG Test Clock Input Timing
TCK
J85
J86
TMS, TDI
J87
J88
J89
TDO
Figure 35. JTAG Test Access Port Timing Diagram
TCK
J91
J90
TRST
Figure 36. JTAG TRST Timing Diagram
TCK
J92
J94
Output
Signals
J93
Output
Signals
J95
J96
Output
Signals
Figure 37. Boundary Scan (JTAG) Timing Diagram
MPC860 Family Hardware Specifications, Rev. 7
42
Freescale Semiconductor
CPM Electrical Characteristics
11 CPM Electrical Characteristics
This section provides the AC and DC electrical specifications for the communications processor module (CPM) of
the MPC860.
11.1 PIP/PIO AC Electrical Specifications
Table 14 provides the PIP/PIO AC timings as shown in Figure 38 through Figure 42.
Table 14. PIP/PIO Timing
All Frequencies
Num
1
Characteristic
Unit
Min
Max
21
Data-in setup time to STBI low
0
—
ns
22
Data-in hold time to STBI high
2.5 – t3 1
—
CLK
23
STBI pulse width
1.5
—
CLK
24
STBO pulse width
1 CLK – 5 ns
—
ns
25
Data-out setup time to STBO low
2
—
CLK
26
Data-out hold time from STBO high
5
—
CLK
27
STBI low to STBO low (Rx interlock)
—
2
CLK
28
STBI low to STBO high (Tx interlock)
2
—
CLK
29
Data-in setup time to clock high
15
—
ns
30
Data-in hold time from clock high
7.5
—
ns
31
Clock low to data-out valid (CPU writes data, control, or direction)
—
25
ns
t3 = Specification 23.
DATA-IN
21
22
23
STBI
27
24
STBO
Figure 38. PIP Rx (Interlock Mode) Timing Diagram
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
43
CPM Electrical Characteristics
DATA-OUT
25
26
24
STBO
(Output)
28
23
STBI
(Input)
Figure 39. PIP Tx (Interlock Mode) Timing Diagram
DATA-IN
21
22
23
STBI
(Input)
24
STBO
(Output)
Figure 40. PIP Rx (Pulse Mode) Timing Diagram
DATA-OUT
25
26
24
STBO
(Output)
23
STBI
(Input)
Figure 41. PIP TX (Pulse Mode) Timing Diagram
MPC860 Family Hardware Specifications, Rev. 7
44
Freescale Semiconductor
CPM Electrical Characteristics
CLKO
29
30
DATA-IN
31
DATA-OUT
Figure 42. Parallel I/O Data-In/Data-Out Timing Diagram
11.2 Port C Interrupt AC Electrical Specifications
Table 15 provides the timings for port C interrupts.
Table 15. Port C Interrupt Timing
≥ 33.34 MHz 1
Num
Characteristic
Unit
Min
Max
35
Port C interrupt pulse width low (edge-triggered mode)
55
—
ns
36
Port C interrupt minimum time between active edges
55
—
ns
1
External bus frequency of greater than or equal to 33.34 MHz.
Figure 43 shows the port C interrupt detection timing.
36
Port C
(Input)
35
Figure 43. Port C Interrupt Detection Timing
11.3 IDMA Controller AC Electrical Specifications
Table 16 provides the IDMA controller timings as shown in Figure 44 through Figure 47.
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
45
CPM Electrical Characteristics
Table 16. IDMA Controller Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
40
DREQ setup time to clock high
7
—
ns
41
DREQ hold time from clock high
3
—
ns
42
SDACK assertion delay from clock high
—
12
ns
43
SDACK negation delay from clock low
—
12
ns
44
SDACK negation delay from TA low
—
20
ns
45
SDACK negation delay from clock high
—
15
ns
46
TA assertion to falling edge of the clock setup time (applies to
external TA)
7
—
ns
CLKO
(Output)
41
40
DREQ
(Input)
Figure 44. IDMA External Requests Timing Diagram
MPC860 Family Hardware Specifications, Rev. 7
46
Freescale Semiconductor
CPM Electrical Characteristics
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
43
DATA
46
TA
(Input)
SDACK
Figure 45. SDACK Timing Diagram—Peripheral Write, Externally-Generated TA
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
44
DATA
TA
(Output)
SDACK
Figure 46. SDACK Timing Diagram—Peripheral Write, Internally-Generated TA
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
47
CPM Electrical Characteristics
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
45
DATA
TA
(Output)
SDACK
Figure 47. SDACK Timing Diagram—Peripheral Read, Internally-Generated TA
11.4 Baud Rate Generator AC Electrical Specifications
Table 17 provides the baud rate generator timings as shown in Figure 48.
Table 17. Baud Rate Generator Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
50
BRGO rise and fall time
—
10
ns
51
BRGO duty cycle
40
60
%
52
BRGO cycle
40
—
ns
50
50
BRGOX
51
51
52
Figure 48. Baud Rate Generator Timing Diagram
MPC860 Family Hardware Specifications, Rev. 7
48
Freescale Semiconductor
CPM Electrical Characteristics
11.5 Timer AC Electrical Specifications
Table 18 provides the general-purpose timer timings as shown in Figure 49.
Table 18. Timer Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
61
TIN/TGATE rise and fall time
10
—
ns
62
TIN/TGATE low time
1
—
CLK
63
TIN/TGATE high time
2
—
CLK
64
TIN/TGATE cycle time
3
—
CLK
65
CLKO low to TOUT valid
3
25
ns
CLKO
60
61
63
62
TIN/TGATE
(Input)
61
64
65
TOUT
(Output)
Figure 49. CPM General-Purpose Timers Timing Diagram
11.6 Serial Interface AC Electrical Specifications
Table 19 provides the serial interface timings as shown in Figure 50 through Figure 54.
Table 19. SI Timing
All Frequencies
Num
Characteristic
Unit
70
L1RCLK, L1TCLK frequency (DSC = 0) 1, 2
71
L1RCLK, L1TCLK width low (DSC = 0) 2
3
Min
Max
—
SYNCCLK/2.5
MHz
P + 10
—
ns
P + 10
—
ns
—
15.00
ns
71a
L1RCLK, L1TCLK width high (DSC = 0)
72
L1TXD, L1ST(1–4), L1RQ, L1CLKO rise/fall time
73
L1RSYNC, L1TSYNC valid to L1CLK edge (SYNC setup time)
20.00
—
ns
74
L1CLK edge to L1RSYNC, L1TSYNC, invalid (SYNC hold time)
35.00
—
ns
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
49
CPM Electrical Characteristics
Table 19. SI Timing (continued)
All Frequencies
Num
Characteristic
Unit
Min
Max
—
15.00
ns
75
L1RSYNC, L1TSYNC rise/fall time
76
L1RXD valid to L1CLK edge (L1RXD setup time)
17.00
—
ns
77
L1CLK edge to L1RXD invalid (L1RXD hold time)
13.00
—
ns
78
L1CLK edge to L1ST(1–4) valid 4
10.00
45.00
ns
78A
L1SYNC valid to L1ST(1–4) valid
10.00
45.00
ns
79
L1CLK edge to L1ST(1–4) invalid
10.00
45.00
ns
80
L1CLK edge to L1TXD valid
10.00
55.00
ns
L1TSYNC valid to L1TXD valid 4
10.00
55.00
ns
81
L1CLK edge to L1TXD high impedance
0.00
42.00
ns
82
L1RCLK, L1TCLK frequency (DSC =1)
—
16.00 or
SYNCCLK/2
MHz
83
L1RCLK, L1TCLK width low (DSC =1)
P + 10
—
ns
P + 10
—
ns
—
30.00
ns
1.00
—
L1TCL
K
80A
1)3
83a
L1RCLK, L1TCLK width high (DSC =
84
L1CLK edge to L1CLKO valid (DSC = 1)
L1TSYNC4
85
L1RQ valid before falling edge of
86
L1GR setup time2
42.00
—
ns
87
L1GR hold time
42.00
—
ns
88
L1CLK edge to L1SYNC valid (FSD = 00) CNT = 0000, BYT = 0,
DSC = 0)
—
0.00
ns
1
The ratio SYNCCLK/L1RCLK must be greater than 2.5/1.
These specs are valid for IDL mode only.
3 Where P = 1/CLKOUT. Thus, for a 25-MHz CLKO1 rate, P = 40 ns.
4 These strobes and TxD on the first bit of the frame become valid after L1CLK edge or L1SYNC, whichever comes
later.
2
MPC860 Family Hardware Specifications, Rev. 7
50
Freescale Semiconductor
CPM Electrical Characteristics
L1RCLK
(FE=0, CE=0)
(Input)
71
70
71a
72
L1RCLK
(FE=1, CE=1)
(Input)
RFSD=1
75
L1RSYNC
(Input)
73
74
L1RXD
(Input)
77
BIT0
76
78
79
L1ST(4-1)
(Output)
Figure 50. SI Receive Timing Diagram with Normal Clocking (DSC = 0)
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
51
CPM Electrical Characteristics
L1RCLK
(FE=1, CE=1)
(Input)
72
83a
82
L1RCLK
(FE=0, CE=0)
(Input)
RFSD=1
75
L1RSYNC
(Input)
73
74
L1RXD
(Input)
77
BIT0
76
78
79
L1ST(4-1)
(Output)
84
L1CLKO
(Output)
Figure 51. SI Receive Timing with Double-Speed Clocking (DSC = 1)
MPC860 Family Hardware Specifications, Rev. 7
52
Freescale Semiconductor
CPM Electrical Characteristics
L1TCLK
(FE=0, CE=0)
(Input)
71
70
72
L1TCLK
(FE=1, CE=1)
(Input)
73
TFSD=0
75
L1TSYNC
(Input)
74
81
80a
L1TXD
(Output)
BIT0
80
78
79
L1ST(4-1)
(Output)
Figure 52. SI Transmit Timing Diagram (DSC = 0)
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
53
CPM Electrical Characteristics
L1RCLK
(FE=0, CE=0)
(Input)
72
83a
82
L1RCLK
(FE=1, CE=1)
(Input)
TFSD=0
75
L1RSYNC
(Input)
73
74
L1TXD
(Output)
81
BIT0
80
78a
79
L1ST(4-1)
(Output)
78
84
L1CLKO
(Output)
Figure 53. SI Transmit Timing with Double Speed Clocking (DSC = 1)
MPC860 Family Hardware Specifications, Rev. 7
54
Freescale Semiconductor
Freescale Semiconductor
L1GR
(Input)
L1RQ
(Output)
L1ST(4-1)
(Output)
L1RXD
(Input)
L1TXD
(Output)
L1RSYNC
(Input)
L1RCLK
(Input)
80
77
74
2
3
5
72
B15 B14 B13
71
71
4
86
85
76
6
87
B17 B16 B15 B14 B13
B17 B16
73
1
8
78
B12 B11 B10
B12 B11 B10
7
9
D1
D1
10
A
A
12
14
15
16
17
18
B25 B24 B23 B22 B21 B20
13
B27 B26 B25 B24 B23 B22 B21 B20
81
B27 B26
11
19
D2
D2
20
M
M
CPM Electrical Characteristics
Figure 54. IDL Timing
MPC860 Family Hardware Specifications, Rev. 7
55
CPM Electrical Characteristics
11.7 SCC in NMSI Mode Electrical Specifications
Table 20 provides the NMSI external clock timing.
Table 20. NMSI External Clock Timing
All Frequencies
Num
1
2
Characteristic
Unit
Min
Max
1/SYNCCLK
—
ns
1/SYNCCLK + 5
—
ns
—
15.00
ns
100
RCLK1 and TCLK1 width high 1
101
RCLK1 and TCLK1 width low
102
RCLK1 and TCLK1 rise/fall time
103
TXD1 active delay (from TCLK1 falling edge)
0.00
50.00
ns
104
RTS1 active/inactive delay (from TCLK1 falling edge)
0.00
50.00
ns
105
CTS1 setup time to TCLK1 rising edge
5.00
—
ns
106
RXD1 setup time to RCLK1 rising edge
5.00
—
ns
5.00
—
ns
5.00
—
ns
edge 2
107
RXD1 hold time from RCLK1 rising
108
CD1 setup Time to RCLK1 rising edge
The ratios SYNCCLK/RCLK1 and SYNCCLK/TCLK1 must be greater than or equal to 2.25/1.
Also applies to CD and CTS hold time when they are used as external sync signals.
Table 21 provides the NMSI internal clock timing.
Table 21. NMSI Internal Clock Timing
All Frequencies
Num
1
2
Characteristic
Unit
Min
Max
100
RCLK1 and TCLK1 frequency 1
0.00
SYNCCLK/3
MHz
102
RCLK1 and TCLK1 rise/fall time
—
—
ns
103
TXD1 active delay (from TCLK1 falling edge)
0.00
30.00
ns
104
RTS1 active/inactive delay (from TCLK1 falling edge)
0.00
30.00
ns
105
CTS1 setup time to TCLK1 rising edge
40.00
—
ns
106
RXD1 setup time to RCLK1 rising edge
40.00
—
ns
107
RXD1 hold time from RCLK1 rising edge 2
0.00
—
ns
108
CD1 setup time to RCLK1 rising edge
40.00
—
ns
The ratios SYNCCLK/RCLK1 and SYNCCLK/TCLK1 must be greater than or equal to 3/1.
Also applies to CD and CTS hold time when they are used as external sync signals.
Figure 55 through Figure 57 show the NMSI timings.
MPC860 Family Hardware Specifications, Rev. 7
56
Freescale Semiconductor
CPM Electrical Characteristics
RCLK1
102
102
101
106
100
RxD1
(Input)
107
108
CD1
(Input)
107
CD1
(SYNC Input)
Figure 55. SCC NMSI Receive Timing Diagram
TCLK1
102
102
101
100
TxD1
(Output)
103
105
RTS1
(Output)
104
104
CTS1
(Input)
107
CTS1
(SYNC Input)
Figure 56. SCC NMSI Transmit Timing Diagram
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
57
CPM Electrical Characteristics
TCLK1
102
102
101
100
TxD1
(Output)
103
RTS1
(Output)
104
107
104
105
CTS1
(Echo Input)
Figure 57. HDLC Bus Timing Diagram
11.8 Ethernet Electrical Specifications
Table 22 provides the Ethernet timings as shown in Figure 58 through Figure 62.
Table 22. Ethernet Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
120
CLSN width high
40
—
ns
121
RCLK1 rise/fall time
—
15
ns
122
RCLK1 width low
40
—
ns
123
RCLK1 clock period 1
80
120
ns
124
RXD1 setup time
20
—
ns
125
RXD1 hold time
5
—
ns
126
RENA active delay (from RCLK1 rising edge of the last data bit)
10
—
ns
127
RENA width low
100
—
ns
128
TCLK1 rise/fall time
—
15
ns
129
TCLK1 width low
40
—
ns
99
101
ns
period1
130
TCLK1 clock
131
TXD1 active delay (from TCLK1 rising edge)
10
50
ns
132
TXD1 inactive delay (from TCLK1 rising edge)
10
50
ns
133
TENA active delay (from TCLK1 rising edge)
10
50
ns
MPC860 Family Hardware Specifications, Rev. 7
58
Freescale Semiconductor
CPM Electrical Characteristics
Table 22. Ethernet Timing (continued)
All Frequencies
Num
1
2
Characteristic
Unit
Min
Max
134
TENA inactive delay (from TCLK1 rising edge)
10
50
ns
135
RSTRT active delay (from TCLK1 falling edge)
10
50
ns
136
RSTRT inactive delay (from TCLK1 falling edge)
10
50
ns
137
REJECT width low
1
—
CLK
138
CLKO1 low to SDACK
asserted 2
—
20
ns
139
CLKO1 low to SDACK negated 2
—
20
ns
The ratios SYNCCLK/RCLK1 and SYNCCLK/TCLK1 must be greater than or equal to 2/1.
SDACK is asserted whenever the SDMA writes the incoming frame DA into memory.
CLSN(CTS1)
(Input)
120
Figure 58. Ethernet Collision Timing Diagram
RCLK1
121
121
124
123
RxD1
(Input)
Last Bit
125
126
127
RENA(CD1)
(Input)
Figure 59. Ethernet Receive Timing Diagram
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
59
CPM Electrical Characteristics
TCLK1
128
128
131
129
121
TxD1
(Output)
132
133
134
TENA(RTS1)
(Input)
RENA(CD1)
(Input)
(NOTE 2)
NOTES:
1. Transmit clock invert (TCI) bit in GSMR is set.
2. If RENA is deasserted before TENA, or RENA is not asserted at all during transmit, then the
CSL bit is set in the buffer descriptor at the end of the frame transmission.
Figure 60. Ethernet Transmit Timing Diagram
RCLK1
RxD1
(Input)
0
1
1
BIT1
Start Frame De-
BIT2
136
125
RSTRT
(Output)
Figure 61. CAM Interface Receive Start Timing Diagram
REJECT
137
Figure 62. CAM Interface REJECT Timing Diagram
MPC860 Family Hardware Specifications, Rev. 7
60
Freescale Semiconductor
CPM Electrical Characteristics
11.9 SMC Transparent AC Electrical Specifications
Table 23 provides the SMC transparent timings as shown in Figure 63.
Table 23. SMC Transparent Timing
All Frequencies
Num
1
Characteristic
Unit
Min
Max
150
SMCLK clock period 1
100
—
ns
151
SMCLK width low
50
—
ns
151A
SMCLK width high
50
—
ns
152
SMCLK rise/fall time
—
15
ns
153
SMTXD active delay (from SMCLK falling edge)
10
50
ns
154
SMRXD/SMSYNC setup time
20
—
ns
155
RXD1/SMSYNC hold time
5
—
ns
SYNCCLK must be at least twice as fast as SMCLK.
SMCLK
152
152
151
151
150
SMTXD
(Output)
NOTE
154
153
155
SMSYNC
154
155
SMRXD
(Input)
NOTE:
1. This delay is equal to an integer number of character-length clocks.
Figure 63. SMC Transparent Timing Diagram
11.10SPI Master AC Electrical Specifications
Table 24 provides the SPI master timings as shown in Figure 64 and Figure 65.
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
61
CPM Electrical Characteristics
Table 24. SPI Master Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
160
MASTER cycle time
4
1024
tcyc
161
MASTER clock (SCK) high or low time
2
512
tcyc
162
MASTER data setup time (inputs)
50
—
ns
163
Master data hold time (inputs)
0
—
ns
164
Master data valid (after SCK edge)
—
20
ns
165
Master data hold time (outputs)
0
—
ns
166
Rise time output
—
15
ns
167
Fall time output
—
15
ns
SPICLK
(CI=0)
(Output)
161
167
161
166
160
SPICLK
(CI=1)
(Output)
163
167
162
SPIMISO
(Input)
msb
166
Data
165
lsb
164
167
SPIMOSI
(Output)
msb
msb
166
Data
lsb
msb
Figure 64. SPI Master (CP = 0) Timing Diagram
MPC860 Family Hardware Specifications, Rev. 7
62
Freescale Semiconductor
CPM Electrical Characteristics
SPICLK
(CI=0)
(Output)
161
167
166
161
160
SPICLK
(CI=1)
(Output)
163
167
162
SPIMISO
(Input)
166
msb
Data
165
lsb
164
167
SPIMOSI
(Output)
msb
166
msb
Data
lsb
msb
Figure 65. SPI Master (CP = 1) Timing Diagram
11.11SPI Slave AC Electrical Specifications
Table 25 provides the SPI slave timings as shown in Figure 66 and Figure 67.
Table 25. SPI Slave Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
170
Slave cycle time
2
—
tcyc
171
Slave enable lead time
15
—
ns
172
Slave enable lag time
15
—
ns
173
Slave clock (SPICLK) high or low time
1
—
tcyc
174
Slave sequential transfer delay (does not require deselect)
1
—
tcyc
175
Slave data setup time (inputs)
20
—
ns
176
Slave data hold time (inputs)
20
—
ns
177
Slave access time
—
50
ns
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
63
CPM Electrical Characteristics
SPISEL
(Input)
172
171
174
SPICLK
(CI=0)
(Input)
173
182
173
181
170
SPICLK
(CI=1)
(Input)
177
181
182
180
SPIMISO
(Output)
msb
178
Data
175
msb
Undef
msb
179
176
SPIMOSI
(Input)
lsb
181 182
Data
lsb
msb
Figure 66. SPI Slave (CP = 0) Timing Diagram
MPC860 Family Hardware Specifications, Rev. 7
64
Freescale Semiconductor
CPM Electrical Characteristics
SPISEL
(Input)
172
171
174
170
SPICLK
(CI=0)
(Input)
173
182
181
173
181
SPICLK
(CI=1)
(Input)
177
182
180
SPIMISO
(Output)
msb
Undef
175
Data
178
msb
lsb
179
176
SPIMOSI
(Input)
msb
181 182
Data
msb
lsb
Figure 67. SPI Slave (CP = 1) Timing Diagram
11.12I2C AC Electrical Specifications
Table 26 provides the I2C (SCL < 100 kHz) timings.
Table 26. I2C Timing (SCL < 100 kHZ)
All Frequencies
Num
Characteristic
Unit
Min
Max
0
100
kHz
200
SCL clock frequency (slave)
200
SCL clock frequency (master) 1
1.5
100
kHz
202
Bus free time between transmissions
4.7
—
µs
203
Low period of SCL
4.7
—
µs
204
High period of SCL
4.0
—
µs
205
Start condition setup time
4.7
—
µs
206
Start condition hold time
4.0
—
µs
207
Data hold time
0
—
µs
208
Data setup time
250
—
ns
209
SDL/SCL rise time
—
1
µs
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
65
CPM Electrical Characteristics
Table 26. I2C Timing (SCL < 100 kHZ) (continued)
All Frequencies
Num
1
Characteristic
Unit
Min
Max
210
SDL/SCL fall time
—
300
ns
211
Stop condition setup time
4.7
—
µs
SCL frequency is given by SCL = BRGCLK_frequency / ((BRG register + 3 × pre_scaler × 2).
The ratio SYNCCLK/(BRGCLK / pre_scaler) must be greater than or equal to 4/1.
Table 27 provides the I2C (SCL > 100 kHz) timings.
Table 27. . I2C Timing (SCL > 100 kHZ)
All Frequencies
Num
1
Characteristic
Expression
Unit
Min
Max
200
SCL clock frequency (slave)
fSCL
0
BRGCLK/48
Hz
200
SCL clock frequency (master) 1
fSCL
BRGCLK/16512
BRGCLK/48
Hz
202
Bus free time between transmissions
1/(2.2 * fSCL)
—
s
203
Low period of SCL
1/(2.2 * fSCL)
—
s
204
High period of SCL
1/(2.2 * fSCL)
—
s
205
Start condition setup time
1/(2.2 * fSCL)
—
s
206
Start condition hold time
1/(2.2 * fSCL)
—
s
207
Data hold time
0
—
s
208
Data setup time
1/(40 * fSCL)
—
s
209
SDL/SCL rise time
—
1/(10 * fSCL)
s
210
SDL/SCL fall time
—
1/(33 * fSCL)
s
211
Stop condition setup time
1/2(2.2 * fSCL)
—
s
SCL frequency is given by SCL = BRGCLK_frequency / ((BRG register + 3) × pre_scaler × 2).
The ratio SYNCCLK/(BRGCLK / pre_scaler) must be greater than or equal to 4/1.
Figure 68 shows the I2C bus timing.
SDA
202
203
205
204
208
207
SCL
206
209
210
211
Figure 68. I2C Bus Timing Diagram
MPC860 Family Hardware Specifications, Rev. 7
66
Freescale Semiconductor
UTOPIA AC Electrical Specifications
12 UTOPIA AC Electrical Specifications
Table 28 shows the AC electrical specifications for the UTOPIA interface.
Table 28. UTOPIA AC Electrical Specifications
Num
U1
U1a
Signal Characteristic
Direction
Min
Max
Unit
Output
—
3.5
ns
Duty cycle
50
50
%
Frequency
—
50
MHz
—
3.5
ns
Duty cycle
40
60
%
Frequency
—
50
MHz
Output
2
16
ns
UtpClk rise/fall time (Internal clock option)
UtpClk rise/fall time (external clock option)
Input
U2
RxEnb and TxEnb active delay
U3
UTPB, SOC, Rxclav and Txclav setup time
Input
8
—
ns
U4
UTPB, SOC, Rxclav and Txclav hold time
Input
1
—
ns
U5
UTPB, SOC active delay (and PHREQ and PHSEL active delay
in MPHY mode)
Output
2
16
ns
Figure 69 shows signal timings during UTOPIA receive operations.
U1
U1
UtpClk
U5
PHREQn
U3
3
RxClav
RxEnb
U4
4
HighZ at MPHY
HighZ at MPHY
U2
2
UTPB
SOC
U3
3
U4
4
Figure 69. UTOPIA Receive Timing
Figure 70 shows signal timings during UTOPIA transmit operations.
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
67
FEC Electrical Characteristics
U1
U1
1
UtpClk
U5
5
PHSELn
U3
3
U4
4
TxClav
HighZ at MPHY
HighZ at MPHY
U2
2
TxEnb
UTPB
SOC
U5
5
Figure 70. UTOPIA Transmit Timing
13 FEC Electrical Characteristics
This section provides the AC electrical specifications for the Fast Ethernet controller (FEC). Note that the timing
specifications for the MII signals are independent of system clock frequency (part speed designation). Also, MII
signals use TTL signal levels compatible with devices operating at either 5.0 V or 3.3 V.
13.1 MII Receive Signal Timing (MII_RXD[3:0], MII_RX_DV,
MII_RX_ER, MII_RX_CLK)
The receiver functions correctly up to a MII_RX_CLK maximum frequency of 25 MHz +1%. There is no minimum
frequency requirement. In addition, the processor clock frequency must exceed the MII_RX_CLK frequency – 1%.
Table 29 provides information on the MII receive signal timing.
Table 29. MII Receive Signal Timing
Num
Characteristic
Min
Max
Unit
M1
MII_RXD[3:0], MII_RX_DV, MII_RX_ER to MII_RX_CLK setup
5
—
ns
M2
MII_RX_CLK to MII_RXD[3:0], MII_RX_DV, MII_RX_ER hold
5
—
ns
M3
MII_RX_CLK pulse width high
35%
65%
MII_RX_CL
K period
M4
MII_RX_CLK pulse width low
35%
65%
MII_RX_CL
K period
Figure 71 shows MII receive signal timing.
MPC860 Family Hardware Specifications, Rev. 7
68
Freescale Semiconductor
FEC Electrical Characteristics
M3
MII_RX_CLK (Input)
M4
MII_RXD[3:0] (Inputs)
MII_RX_DV
MII_RX_ER
M1
M2
Figure 71. MII Receive Signal Timing Diagram
13.2 MII Transmit Signal Timing (MII_TXD[3:0], MII_TX_EN,
MII_TX_ER, MII_TX_CLK)
The transmitter functions correctly up to a MII_TX_CLK maximum frequency of 25 MHz +1%. There is no
minimum frequency requirement. In addition, the processor clock frequency must exceed the MII_TX_CLK
frequency – 1%.
Table 30 provides information on the MII transmit signal timing.
Table 30. MII Transmit Signal Timing
Num
Characteristic
Min
Max
Unit
ns
M5
MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER invalid
5
—
M6
MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER valid
—
25
M7
MII_TX_CLK pulse width high
35
65%
MII_TX_CLK
period
M8
MII_TX_CLK pulse width low
35%
65%
MII_TX_CLK
period
Figure 72 shows the MII transmit signal timing diagram.
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
69
FEC Electrical Characteristics
M7
MII_TX_CLK (Input)
M5
M8
MII_TXD[3:0] (Outputs)
MII_TX_EN
MII_TX_ER
M6
Figure 72. MII Transmit Signal Timing Diagram
13.3 MII Async Inputs Signal Timing (MII_CRS, MII_COL)
Table 31 provides information on the MII async inputs signal timing.
Table 31. MII Async Inputs Signal Timing
Num
M9
Characteristic
Min
Max
Unit
MII_CRS, MII_COL minimum pulse width
1.5
—
MII_TX_CLK
period
Figure 73 shows the MII asynchronous inputs signal timing diagram.
MII_CRS, MII_COL
M9
Figure 73. MII Async Inputs Timing Diagram
13.4 MII Serial Management Channel Timing (MII_MDIO, MII_MDC)
Table 32 provides information on the MII serial management channel signal timing. The FEC functions correctly
with a maximum MDC frequency in excess of 2.5 MHz. The exact upper bound is under investigation.
Table 32. MII Serial Management Channel Timing
Num
Characteristic
Min
Max
Unit
M10
MII_MDC falling edge to MII_MDIO output invalid (minimum
propagation delay)
0
—
ns
M11
MII_MDC falling edge to MII_MDIO output valid (max prop delay)
—
25
ns
M12
MII_MDIO (input) to MII_MDC rising edge setup
10
—
ns
MPC860 Family Hardware Specifications, Rev. 7
70
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 32. MII Serial Management Channel Timing
Num
Characteristic
Min
Max
Unit
0
—
ns
M13
MII_MDIO (input) to MII_MDC rising edge hold
M14
MII_MDC pulse width high
40%
60%
MII_MDC
period
M15
MII_MDC pulse width low
40%
60%
MII_MDC
period
Figure 74 shows the MII serial management channel timing diagram.
M14
MM15
MII_MDC (Output)
M10
MII_MDIO (Output)
M11
MII_MDIO (Input)
M12
M13
Figure 74. MII Serial Management Channel Timing Diagram
14 Mechanical Data and Ordering Information
Table 33 provides information on the MPC860 Revision D.4 derivative devices.
Table 33. MPC860 Family Revision D.4 Derivatives
Device
Number of
SCCs 1
Ethernet Support 2 Multichannel
(Mbps)
HDLC Support
ATM
Support
MPC855T
1
10/100
Yes
Yes
MPC860DE
2
10
N/A
N/A
MPC860DT
10/100
Yes
Yes
MPC860DP
10/100
Yes
Yes
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
71
Mechanical Data and Ordering Information
Table 33. MPC860 Family Revision D.4 Derivatives (continued)
Number of
SCCs 1
Device
MPC860EN
Ethernet Support 2 Multichannel
(Mbps)
HDLC Support
4
ATM
Support
10
N/A
N/A
10
Yes
Yes
MPC860T
10/100
Yes
Yes
MPC860P
10/100
Yes
Yes
MPC860SR
1
2
Serial communications controller (SCC)
Up to 4 channels at 40 MHz or 2 channels at 25 MHz
Table 34 identifies the packages and operating frequencies available for the MPC860.
Table 34. MPC860 Family Package/Frequency Availability
Package Type
Ball grid array
ZP suffix — Leaded
ZQ suffix — Leaded
VR suffix — Lead-Free are available as needed
Freq (MHz) /
Temp (Tj)
50
0° to 95°C
66
0° to 95°C
Package
Order Number
ZP/ZQ 1
MPC855TZQ50D4
MPC860DEZQ50D4
MPC860DTZQ50D4
MPC860ENZQ50D4
MPC860SRZQ50D4
MPC860TZQ50D4
MPC860DPZQ50D4
MPC860PZQ50D4
Tape and Reel
MPC855TZQ50D4R2
MPC860DEZQ50D4R2
MPC860ENZQ50D4R2
MPC860SRZQ50D4R2
MPC860TZQ50D4R2
MPC860DPZQ50D4R2
Sample
KMPC855TZQ50D4
KMPC860DEZQ50D4
KMPC860DTZQ50D4
KMPC860TZQ50D4
KMPC860SRZQ50D4
ZP/ZQ 1
MPC855TZQ66D4
MPC860DEZQ66D4
MPC860DTZQ66D4
MPC860ENZQ66D4
MPC860SRZQ66D4
MPC860TZQ66D4
MPC860DPZQ66D4
MPC860PZQ66D4
Tape and Reel
MPC860SRZQ66D4R2
MPC860PZQ66D4R2
MPC860 Family Hardware Specifications, Rev. 7
72
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 34. MPC860 Family Package/Frequency Availability (continued)
Package Type
Freq (MHz) /
Temp (Tj)
80
0° to 95°C
Ball grid array (CZP suffix)
CZP suffix — Leaded
CZQ suffix — Leaded
CVR suffix — Lead-Free are available as needed
50
–40° to 95°C
66
–40° to 95°C
1
Package
Order Number
Sample
KMPC855TZQ66D4
KMPC860SRZQ66D4
KMPC860TZQ66D4
KMPC860ENZQ66D4
KMPC860PZQ66D4
ZP/ZQ 1
MPC855TZQ80D4
MPC860DEZQ80D4
MPC860DTZQ80D4
MPC860ENZQ80D4
MPC860SRZQ80D4
MPC860TZQ80D4
MPC860DPZQ80D4
MPC860PZQ80D4
Tape and Reel
MPC860PZQ80D4R2
Sample
KMPC855TZQ80D4
KMPC860DEZQ80D4
KMPC860DTZQ80D4
KMPC860ENZQ80D4
KMPC860SRZQ80D4
KMPC860TZQ80D4
KMPC860DPZQ80D4
KMPC860PZQ80D4
ZP/ZQ 1
MPC855TCZQ50D4
MPC860DECZQ50D4
MPC860DTCZQ50D4
MPC860ENCZQ50D4
MPC860SRCZQ50D4
MPC860TCZQ50D4
MPC860DPCZQ50D4
MPC860PCZQ50D4
Tape and Reel
MPC855TCZQ50D4R2
ZP/ZQ
1
MPC855TCZQ66D4
MPC860ENCZQ66D4
MPC860SRCZQ66D4
MPC860TCZQ66D4
MPC860DPCZQ66D4
MPC860PCZQ66D4
The ZP package is no longer recommended for use. The ZQ package replaces the ZP package.
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
73
Mechanical Data and Ordering Information
14.1 Pin Assignments
Figure 75 shows the top view pinout of the PBGA package. For additional information, see the MPC860
PowerQUICC User’s Manual, or the MPC855T User’s Manual.
NOTE: This is the top view of the device.
W
PD10
PD8
PD3
PD9
PD6
PA0
PB14 PD15
PD4
PA1
PC5
PC4
PD11
PC6
PA2
PB15
PD12
PA4
PB17
PA3
VDDL
PB19
PA5
PB18
PB16
HRESET TEXP EXTCLK EXTAL
PA7
PC8
PA6
PC7
MODCK2 BADDR28 BADDR29 VDDL
PB22
PC9
PA8
PB20
PC10
PA9
PB23
PB21
PC11
PB24
PA10
PB25
IRQ7
D0
D4
D1
D2
D3
D5
VDDL
D6
D7
D29
DP2 CLKOUT IPA3
M_Tx_EN IRQ0 D13
D27
D10
D14
D18
D20
D24
D28
DP1
DP3
DP0
N/C VSSSYN1
D23
D11
D16
D19
D21
D26
D30
IPA5
IPA4
IPA2
N/C VSSSYN
D17
D9
D15
D22
D25
D31
IPA6
IPA0
IPA1
IPA7
XFC VDDSYN
V
PD14
PD13
U
PD5
IRQ1
D8
T
PD7
VDDH D12
R
VDDH WAIT_B WAIT_A PORESET KAPWR
VDDH
P
GND
VDDL RSTCONF SRESET XTAL
GND
N
M
L
OP0
AS
OP1 MODCK1
K
GND
BADDR30 IPB6 ALEA
IRQ4
J
IPB5
IPB1
IPB2
ALEB
M_COL IRQ2
IPB0
IPB7
BR
IRQ6
IPB4
IPB3
VDDL
TS
CS3
BI
H
VDDL M_MDIO TDI
TCK
TRST
TMS
TDO
PA11
PB26
PC12
PA12 VDDL
PB27
PC13
PA13
PB29
PB28
PC14
PA14
PC15
A8
N/C
N/C
A15
A19
A25
PB30
PA15
PB31
A3
A9
A12
A16
A20
A24
A26
TSIZ1 BSA1
A0
A1
A4
A6
A10
A13
A17
A21
A23
A22
TSIZ0 BSA3 M_CRS WE2 GPLA2 CS5
A2
A5
A7
A11
A14
A27
A29
A30
A28
A31
18
17
16
15
14
13
12
11
10
9
G
GND
GND
F
VDDH
VDDH
IRQ3 BURST
E
BG
BB
D
A18
BSA0 GPLA0
N/C
CS6
CS2 GPLA5 BDIP
TEA
C
WE0 GPLA1 GPLA3 CS7
CS0
TA
GPLA4
CE1A
WR
GPLB4
B
A
19
VDDL BSA2
8
7
WE1
WE3
CS4
CE2A
CS1
6
5
4
3
2
1
Figure 75. Pinout of the PBGA Package
14.2 Mechanical Dimensions of the PBGA Package
Figure 76 shows the mechanical dimensions of the ZP PBGA package.
MPC860 Family Hardware Specifications, Rev. 7
74
Freescale Semiconductor
Mechanical Data and Ordering Information
4X
0.2
D
C
0.2 C
A
0.25 C
0.35 C
E2
E
D2
B
TOP VIEW
A2
A3
A1
A
D1
SIDE VIEW
18X e
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
E1
DIM
A
1 3 5 7 9 11 13 15 17 19
2 4 6 8 10 12 14 16 18
A1
357X
b
0.3 M C A B
BOTTOM VIEW
0.15 M C
A2
A3
b
D
D1
D2
e
NOTE
1.
2.
3.
Dimensions and tolerance per ASME Y14.5M, 1994
E
E1
E2
MILLIMETERS
MIN
MAX
--2.05
0.50
0.70
0.95
1.35
0.70
0.90
0.60
0.90
25.00 BSC
22.86 BSC
22.40
22.60
1.27 BSC
25.00 BSC
22.86 BSC
22.40
22.60
Dimensions in millimeters
Dimension b is the maximum solder ball diameter
Figure 76. Mechanical Dimensions and Bottom Surface Nomenclature
of the ZP PBGA Package
Figure 77 shows the mechanical dimensions of the ZQ PBGA package.
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
75
Mechanical Data and Ordering Information
NOTE
1.
2.
3.
All Dimensions in millimeters
Dimensions and tolerance per ASME Y14.5M, 1994
Maximum Solder Ball Diameter measured parallel to Datum A
Figure 77. Mechanical Dimensions and Bottom Surface Nomenclature
of the ZQ PBGA Package
MPC860 Family Hardware Specifications, Rev. 7
76
Freescale Semiconductor
Document Revision History
15 Document Revision History
Table 35 lists significant changes between revisions of this hardware specification.
Table 35. Document Revision History
Revision
Date
Changes
5.1
11/2001
• Revised template format, removed references to MAC functionality, changed Table 7
B23 max value @ 66 MHz from 2ns to 8ns, added this revision history table
6
10/2002
• Added the MPC855T. Corrected Figure 25 on page 36.
6.1
11/2002
• Corrected UTOPIA RXenb* and TXenb* timing values
• Changed incorrect usage of Vcc to Vdd
• Corrected dual port RAM to 8 Kbytes
6.2
8/2003
• Changed B28a through B28d and B29d to show that TRLX can be 0 or 1
• Changed reference documentation to reflect the Rev 2 MPC860 PowerQUICC Family
Users Manual
• Nontechnical reformatting
6.3
9/2003
• •Added Section 11.2 on the Port C interrupt pins
• •Nontechnical reformatting
7.0
9/2004
• Added a tablefootnote to Table 6 DC Electrical Specifications about meeting the VIL
Max of the I2C Standard
• Replaced the thermal characteristics in Table 4 by the ZQ package
• Add the new parts to the Ordering and Availablity Chart in Table 34
• Added the mechanical spec of the ZQ package in Figure 77
• Removed all of the old revisions from Table 5
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
77
Document Revision History
THIS PAGE INTENTIONALLY LEFT BLANK
MPC860 Family Hardware Specifications, Rev. 7
78
Freescale Semiconductor
Document Revision History
THIS PAGE INTENTIONALLY LEFT BLANK
MPC860 Family Hardware Specifications, Rev. 7
Freescale Semiconductor
79
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