Order this document by MPXT5006D/D SEMICONDUCTOR TECHNICAL DATA #!# !""$! "! # !#$! "# INTEGRATED PRESSURE SENSOR 0 to 6 kPa (0 to 0.87 psi) 0.2 to 4.7 V OUTPUT !# The MPXT5006D series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin–film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features • Temperature Compensated over 10° to 60°C • Ideally Suited for Microprocessor or Microcontroller–Based Systems • Available in Gauge Configurations TOP PISTON FIT — SNAP PORT CASE 473B–01, STYLE 1 VS 3 THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 X–ducer SENSING ELEMENT GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY 1 Vout 2 TOP PISTON FIT PACKAGE CASE 473A–01, STYLE 3 GND Figure 1. Fully Integrated Pressure Sensor Schematic PIN NUMBER MAXIMUM RATINGS(1) Parametrics Symbol Value Unit Overpressure(2) (P1 > P2) Pmax 10 kPa Burst Pressure(2) (P1 > P2) Pburst 60 kPa Tstg – 30 to +100 °C TA +10 to +60 °C Storage Temperature Operating Temperature 1 Vout 3 VS 2 Gnd 4 N/C NOTE: Pin 4 is an internal device connection. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the Lead. 1. TC = 25°C unless otherwise noted. 2. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Senseon and X–ducer are trademarks of Motorola, Inc. Sensor Motorola Motorola, Inc. 1997 Device Data 1 OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Pressure Range Min Typ Max Unit POP 0 — 6.0 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current IS — — 10 mAdc Full Scale Span(2) (RL = 51kΩ) VFSS 4.5 4.6 4.7 V Offset(3)(5) (RL = 51kΩ) Voff 0.100 0.225 0.430 V V/P — 766 — mV/kPa — — — ± 3.0 %VFSS Sensitivity Accuracy(4)(5) (10 to 60°C) NOTES: 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • Offset Stability: Output deviation, after 1000 temperature cycles, 30 to 100°C, and 1.5 million pressure cycles, with minimum rated pressure applied. • TcSpan: Output deviation over the temperature range of 10 to 60°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXT5006D, external mechanical stresses and mounting position can affect the zero pressure output reading. To obtain the 3% FSS accuracy, the device output must be “autozeroed’’ after installation. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device’s output during normal operations. * Nominal Transfer Value: Vout = VS*[(0.1533*P) + 0.045] ± 3% VFSS VS = 5.0 V ± 0.25 Vdc (See Note 5 in Operating Characteristics) Figure 2. Transfer Function Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. 2 Motorola Sensor Device Data ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear–stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 3 illustrates the differential or gauge configuration in the basic chip carrier (Case 473). A fluorosilicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXT5006D series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long–term reliability. Internal reliability and qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 4 shows a typical decoupling circuit for interfacing the output of the MPXT5006D to the A/D microprocessor. Proper decoupling of the power supply is recommended. Figure 5 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over 10°C to 60°C. (Device output may be nonlinear outside of the rated pressure range.) PRESSURE (P1) / VACUUM (P2) SIDE IDENTIFICATION Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel STAINLESS STEEL METAL COVER which protects the die from the environment. The Motorola pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. FLUOROSILICONE DIE COAT P1 WIRE BONDS CONSTRAINED VENTED DIE EPOXY CASE MPXT5006D OUTPUT (PIN 1) A/D 50 pF 51 k P2 µ PROCESSOR RTV DIE BOND EXTERNAL LEAD CONNECTIONS Figure 4. Typical Decoupling Filter for Sensor to Microprocessor Interface Figure 3. Cross–Sectional Diagram (Not to Scale) OUTPUT (V) 5.0 TRANSFER FUNCTION: 4.5 Vout = VS*[(0.1533*P) + 0.045] ± 3% VFSS 4.0 VS = 5.0 Vdc TEMP = 10 to 60°C 3.5 3.0 TYPICAL 2.5 2.0 MAX 1.5 MIN 1.0 0.5 0 0 3 DIFFERENTIAL PRESSURE (kPa) 6 Figure 5. Output versus Pressure Differential (See Note 5 in Operating Characteristics) Motorola Sensor Device Data 3 PACKAGE DIMENSIONS C G D S U H J K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –H– IS CENTER OF TINE TO CENTER OF LEAD. DIMENSION –J– IS LEAD THICKNESS. N 4 3 2 1 DIM A B C D G H J K M N P R S U V W X Y B P X W Y M R V A STYLE 1: PIN 1. 2. 3. 4. CASE 473B–01 ISSUE O –A– G –B– 4 S 5 DETAIL X DETAIL X P R U C –T– L M SEATING PLANE F 8 PL 0.25 (0.010) M T B J MILLIMETERS MIN MAX 26.29 27.05 20.65 21.16 15.06 15.82 0.66 0.86 2.29 2.79 0.68 1.50 0.20 0.30 3.30 3.56 30 _ 40 _ 18.67 19.43 32.64 33.40 12.95 13.72 30.35 31.11 2.67 3.43 6.22 6.48 4.39 4.65 4.95 5.21 6.10 6.60 VOUT GROUND VCC N/C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_TYPICAL DRAFT. 6. DIMENSION P TO CENTER OF LEAD WHEN FORMED PARALLEL. 8 1 INCHES MIN MAX 1.035 1.065 0.813 0.833 0.593 0.623 0.026 0.034 0.090 0.110 0.027 0.059 0.008 0.012 0.130 0.150 30 _ 40 _ 0.735 0.765 1.285 1.315 0.510 0.540 1.195 1.225 0.105 0.135 0.245 0.255 0.173 0.183 0.195 0.205 0.240 0.260 CASE 473A–01 ISSUE A S A S DIM A B C F G J L M P R S U INCHES MIN MAX 0.658 0.668 0.658 0.668 0.329 0.357 0.026 0.034 0.100 BSC 0.009 0.011 0.138 0.150 0_ 15 _ 0.738 0.748 0.503 0.523 0.002 0.020 0.135 0.145 STYLE 3: PIN 1. 2. 3. 4. 5. 6. 7. 8. MILLIMETERS MIN MAX 16.71 16.97 16.71 16.97 8.36 9.07 0.660 0.864 2.54 BSC 0.23 0.28 3.81 3.51 0_ 15_ 18.75 19.00 12.78 13.28 0.05 0.51 3.43 3.68 VOUT GROUND VSUPPLY N/C N/C N/C N/C N/C Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4–32–1, Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. 81–3–5487–8488 Customer Focus Center: 1–800–521–6274 Mfax: [email protected] – TOUCHTONE 1–602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, Motorola Fax Back System – US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 – http://sps.motorola.com/mfax/ HOME PAGE: http://motorola.com/sps/ 4 ◊ Motorola Sensor MPXT5006D/D Device Data