TI1 MSP430BT5190IZQWR Mixed-signal microcontroller Datasheet

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MSP430BT5190
SLAS703B – APRIL 2010 – REVISED AUGUST 2015
MSP430BT5190 Mixed-Signal Microcontroller
1 Device Overview
1.1
Features
1
• Designed for Use With CC2560 TI Bluetooth®
Based Solutions (1)
• Commercially Licensed Mindtree™ Ethermind
Bluetooth Stack for MSP430
– Bluetooth v2.1 + Enhanced Data Rate (EDR)
Compliant
– Serial Port Profile (SPP)
– Sample Applications
• Low Supply Voltage Range:
3.6 V Down to 1.8 V
• Ultra-Low Power Consumption
– Active Mode (AM):
All System Clocks Active
230 µA/MHz at 8 MHz, 3 V, Flash Program
Execution (Typical)
110 µA/MHz at 8 MHz, 3 V, RAM Program
Execution (Typical)
– Standby Mode (LPM3):
Real-Time Clock (RTC) With Crystal, Watchdog,
and Supply Supervisor Operational, Full RAM
Retention, Fast Wake-Up:
1.7 µA at 2.2 V, 2.1 µA at 3 V (Typical)
Low-Power Oscillator (VLO), General-Purpose
Counter, Watchdog, and Supply Supervisor
Operational, Full RAM Retention, Fast Wakeup:
1.2 µA at 3 V (Typical)
– Off Mode (LPM4):
Full RAM Retention, Supply Supervisor
Operational, Fast Wakeup:
1.2 µA at 3 V (Typical)
– Shutdown Mode (LPM4.5):
0.1 µA at 3 V (Typical)
• Wake up From Standby Mode in Less Than 5 µs
• 16-Bit RISC Architecture
• Flexible Power-Management System
– Fully Integrated LDO With Programmable
Regulated Core Supply Voltage
– Supply Voltage Supervision, Monitoring, and
Brownout
(1)
The Bluetooth word mark and logos are owned by Bluetooth
SIG, Inc., and any use of such marks by TI is under license.
1.2
•
•
•
• Unified Clock System
– FLL Control Loop for Frequency Stabilization
– Low-Power Low-Frequency Internal Clock
Source (VLO)
– Low-Frequency Trimmed Internal Reference
Source (REFO)
– 32-kHz Crystals
– High-Frequency Crystals up to 32 MHz
• 16-Bit Timer TA0, Timer_A With Five
Capture/Compare Registers
• 16-Bit Timer TA1, Timer_A With Three
Capture/Compare Registers
• 16-Bit Timer TB0, Timer_B With Seven
Capture/Compare Shadow Registers
• Up to Four Universal Serial Communication
Interfaces (USCIs)
– USCI_A0, USCI_A1, USCI_A2, and USCI_A3
Each Support:
• Enhanced UART Supports Automatic BaudRate Detection
• IrDA Encoder and Decoder
• Synchronous SPI
– USCI_B0, USCI_B1, USCI_B2, and USCI_B3
Each Support:
• I2C
• Synchronous SPI
• 12-Bit Analog-to-Digital Converter (ADC)
– Internal Reference
– 14 External Channels, 2 Internal Channels
• Hardware Multiplier Supports 32-Bit Operations
• Serial Onboard Programming, No External
Programming Voltage Needed
• 3-Channel Internal DMA
• Basic Timer With RTC Feature
• For Complete Module Descriptions, See the
MSP430x5xx and MSP430x6xx Family User's
Guide (SLAU208)
Applications
Remote Controls
Thermostats
Smart Meters
•
•
Blood Glucose Meters
Pulseoximeters
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
MSP430BT5190
SLAS703B – APRIL 2010 – REVISED AUGUST 2015
1.3
www.ti.com
Description
The TI MSP430™ family of ultra-low-power microcontrollers consists of several devices featuring different
sets of peripherals targeted for various applications. The architecture, combined with extensive low-power
modes, is optimized to achieve extended battery life in portable measurement applications. The device
features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to
maximum code efficiency. The digitally controlled oscillator (DCO) allows the device to wake up from lowpower modes to active mode in less than 5 µs.
MSP430BT5190 is a microcontroller configuration with three 16-bit timers, a high-performance 12-bit ADC,
four USCIs, a hardware multiplier, DMA, an RTC module with alarm capabilities, and 87 I/O pins.
The MSP430BT5190 microcontroller is designed for commercial use with TI’s CC2560 based Bluetooth
solutions in conjunction with Mindtree’s Ethermind Bluetooth stack and SPP. This
MSP430BT5190+CC2560 Bluetooth platform is ideal for applications that need a wireless serial link for
cable replacement, such as remote controls, thermostats, smart meters, blood glucose meters,
pulseoximeters, and many others.
Device Information (1)
PART NUMBER
MSP430BT5190IZQW
MicroStar Junior™ BGA (113)
7 mm × 7 mm
LQFP (100)
14 mm × 14 mm
MSP430BT5190IPZ
(1)
(2)
1.4
BODY SIZE (2)
PACKAGE
For the most current part, package, and ordering information, see the Package Option Addendum in
Section 8, or see the TI website at www.ti.com.
The sizes shown here are approximations. For the package dimensions with tolerances, see the
Mechanical Data in Section 8.
Functional Block Diagram
Figure 1-1 shows the functional block diagram.
XIN XOUT
DVCC DVSS
AVCC AVSS
RST/NMI
P1.x
XT2IN
XT2OUT
Unified
Clock
System
ACLK
SMCLK
256KB
16KB
Flash
RAM
MCLK
CPUXV2
and
Working
Registers
Power
Management
SYS
LDO
SVM/SVS
Brownout
Watchdog
PA
P2.x
I/O Ports
P1/P2
2×8 I/Os
Interrupt
Capability
PA
1×16 I/Os
P3.x
PB
P4.x
P5.x
PC
P6.x
P7.x
PD
P8.x
PE
P9.x P10.x
PF
P11.x
I/O Ports
P3/P4
2×8 I/Os
I/O Ports
P5/P6
2×8 I/Os
I/O Ports
P7/P8
2×8 I/Os
I/O Ports
P9/P10
2×8 I/Os
I/O Ports
P11
1×3 I/Os
PB
1×16 I/Os
PC
1×16 I/Os
PD
1×16 I/Os
PE
1×16 I/Os
PF
1×3 I/Os
MAB
DMA
MDB
3 Channel
EEM
(L: 8+2)
JTAG/
SBW
Interface
MPY32
TA0
TA1
TB0
Timer_A
5 CC
Registers
Timer_A
3 CC
Registers
Timer_B
7 CC
Registers
RTC_A
CRC16
USCI0,1,2,3
ADC12_A
USCI_Ax:
UART,
IrDA, SPI
12 Bit
200 KSPS
UCSI_Bx:
SPI, I2C
REF
16 Channels
(14 ext/2 int)
Autoscan
Figure 1-1. Functional Block Diagram
2
Device Overview
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Table of Contents
1
2
3
4
5
Device Overview ......................................... 1
5.27
Wake-up Times From Low-Power Modes and
Reset ................................................ 28
1.1
Features .............................................. 1
1.2
Applications ........................................... 1
5.28
Timer_A
1.3
Description ............................................ 2
1.4
Functional Block Diagram ............................ 2
5.29
5.30
Revision History ......................................... 4
Device Characteristics .................................. 5
Terminal Configuration and Functions .............. 6
Timer_B ............................................. 29
USCI (UART Mode), Recommended Operating
Conditions ........................................... 29
5.31
5.32
4.1
Pin Diagrams ......................................... 6
USCI (UART Mode) ................................. 29
USCI (SPI Master Mode), Recommended Operating
Conditions ........................................... 30
Signal Descriptions ................................... 8
5.33
USCI (SPI Master Mode)............................ 30
4.2
5.34
USCI (SPI Slave Mode) ............................. 32
5.35
5.36
USCI (I2C Mode) .................................... 34
12-Bit ADC, Power Supply and Input Range
Conditions ........................................... 35
5.37
12-Bit ADC, Timing Parameters
5.38
12-Bit ADC, Linearity Parameters................... 35
5.39
12-Bit ADC, Temperature Sensor and Built-In VMID
36
...........................
5.41 REF, Built-In Reference .............................
5.42 Flash Memory .......................................
5.43 JTAG and Spy-Bi-Wire Interface ....................
Detailed Description ...................................
6.1
CPU .................................................
6.2
Operating Modes ....................................
6.3
Interrupt Vector Addresses..........................
6.4
Memory Organization ...............................
6.5
Bootstrap Loader (BSL) .............................
6.6
JTAG Operation .....................................
6.7
Flash Memory .......................................
6.8
RAM .................................................
6.9
Peripherals ..........................................
6.10 Input/Output Schematics ............................
6.11 Device Descriptors (TLV) ...........................
Device and Documentation Support ...............
7.1
Device Support ......................................
7.2
Documentation Support .............................
7.3
Community Resources ..............................
7.4
Trademarks..........................................
7.5
Electrostatic Discharge Caution .....................
7.6
Export Control Notice ...............................
7.7
Glossary .............................................
37
Specifications ........................................... 13
........................
........................................
Recommended Operating Conditions ...............
5.1
Absolute Maximum Ratings
13
5.2
ESD Ratings
13
5.3
5.4
13
Active Mode Supply Current Into VCC Excluding
External Current ..................................... 14
Low-Power Mode Supply Currents (Into VCC)
Excluding External Current.......................... 15
5.5
5.6
Thermal Characteristics ............................. 15
5.7
Schmitt-Trigger Inputs – General-Purpose I/O...... 16
5.8
Inputs – Ports P1 and P2
5.9
5.10
Leakage Current – General-Purpose I/O ........... 16
Outputs – General-Purpose I/O (Full Drive
Strength) ............................................ 17
Outputs – General-Purpose I/O (Reduced Drive
Strength) ............................................ 17
5.11
5.12
5.13
5.14
5.15
5.16
5.17
5.18
5.19
...........................
16
.....
Crystal Oscillator, XT1, High-Frequency Mode ....
Crystal Oscillator, XT2 ..............................
Crystal Oscillator, XT1, Low-Frequency Mode
20
21
22
Internal Very-Low-Power Low-Frequency Oscillator
(VLO) ................................................ 23
Internal Reference, Low-Frequency Oscillator
(REFO) .............................................. 23
DCO Frequency ..................................... 24
5.21
PMM, Brown-Out Reset (BOR)
5.23
5.24
5.25
5.26
6
Output Frequency – General-Purpose I/O .......... 17
Typical Characteristics – Outputs, Reduced Drive
Strength (PxDS.y = 0) ............................... 18
Typical Characteristics – Outputs, Full Drive
Strength (PxDS.y = 1) ............................... 19
5.20
5.22
5.40
.....................
PMM, Core Voltage .................................
PMM, SVS High Side ...............................
PMM, SVM High Side ...............................
PMM, SVS Low Side ................................
PMM, SVM Low Side ...............................
7
25
25
26
27
28
8
.............................................
....................
REF, External Reference
29
35
37
38
39
40
40
41
42
43
44
44
45
45
46
67
91
94
94
97
97
97
97
97
97
Mechanical, Packaging, and Orderable
Information .............................................. 98
28
Table of Contents
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3
MSP430BT5190
SLAS703B – APRIL 2010 – REVISED AUGUST 2015
www.ti.com
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from August 5, 2013 to August 6, 2015
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
4
Page
Document format and organization changes throughout, including addition of section numbering ....................... 1
Added Device Information table .................................................................................................... 2
Moved functional block diagram to Figure 1-1, Functional Block Diagram.................................................... 2
Added Section 3, Device Characteristics, and moved Table 3-1 to it ......................................................... 5
Added signal names to ZQW pinout ............................................................................................... 7
Added Section 5, Specifications, and moved all electrical and timing specifications to it ................................. 13
Added Section 5.2, ESD Ratings.................................................................................................. 13
Added note to CVCORE ............................................................................................................... 13
Moved Section 5.6, Thermal Characteristics .................................................................................... 15
Changed the TYP value of CL,eff with Test Conditions of "XTS = 0, XCAPx = 0" from 2 pF to 1 pF ..................... 20
Corrected spelling of MRG bits in symbol and description for fMCLK,MRG parameter ........................................ 38
Corrected spelling of NMIIFG in Table 6-6, System Module Interrupt Vector Registers ................................... 48
Changed P5.3 schematic (added P5SEL.2 and XT2BYPASS inputs with AND and OR gates) ......................... 77
Changed P5SEL.3 column from X to 0 for "P5.3 (I/O)" rows .................................................................. 77
Changed P7.1 schematic (added P7SEL.1 input and OR gate) .............................................................. 82
Changed P7SEL.1 column from X to 0 for "P7.1 (I/O)" rows .................................................................. 82
Added Section 7 and moved Tools Support, Device Nomenclature, ESD Caution, and Trademarks sections to it ... 94
Added Section 8 .................................................................................................................... 98
Revision History
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SLAS703B – APRIL 2010 – REVISED AUGUST 2015
3 Device Characteristics
Table 3-1 summarizes the device characteristics.
Table 3-1. Device Characteristics (1) (2)
USCI
DEVICE
FLASH
(KB)
SRAM
(KB)
MSP430BT5190
256
16
(1)
(2)
(3)
(4)
Timer_A
5, 3
(3)
Timer_B
7
(4)
CHANNEL A: CHANNEL B:
UART, IrDA,
SPI, I2C
SPI
4
4
ADC12_A
(Ch)
I/O
PACKAGE
14 ext, 2 int
87
100 PZ,
113 ZQW
For the most current part, package, and ordering information, see the Package Option Addendum in Section 8, or see the TI website at
www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Each number in the sequence represents an instantiation of Timer_A with its associated number of capture/compare registers and PWM
output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_A, the first
instantiation having 3 and the second instantiation having 5 capture/compare registers and PWM output generators, respectively.
Each number in the sequence represents an instantiation of Timer_B with its associated number of capture/compare registers and PWM
output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_B, the first
instantiation having 3 and the second instantiation having 5 capture/compare registers and PWM output generators, respectively.
Device Characteristics
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5
MSP430BT5190
SLAS703B – APRIL 2010 – REVISED AUGUST 2015
www.ti.com
4 Terminal Configuration and Functions
4.1
Pin Diagrams
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
P9.7
P9.6
P9.5/UCA2RXDUCA2SOMI
P9.4/UCA2TXD/UCA2SIMO
P9.3/UCB2CLK/UCA2STE
P9.2/UCB2SOMI/UCB2SCL
P9.1/UCB2SIMO/UCB2SDA
P9.0/UCB2STE/UCA2CLK
P8.7
P8.6/TA1.1
P8.5/TA1.0
DVCC2
DVSS2
VCORE
P8.4/TA0.4
P8.3/TA0.3
P8.2/TA0.2
P8.1/TA0.1
P8.0/TA0.0
P7.3/TA1.2
P7.2/TB0OUTH/SVMOUT
P5.7/UCA1RXD/UCA1SOMI
P5.6/UCA1TXD/UCA1SIMO
P5.5/UCB1CLK/UCA1STE
P5.4/UCB1SOMI/UCB1SCL
P2.1/TA1.0
P2.2/TA1.1
P2.3/TA1.2
P2.4/RTCCLK
P2.5
P2.6/ACLK
P2.7/ADC12CLK/DMAE0
P3.0/UCB0STE/UCA0CLK
P3.1/UCB0SIMO/UCB0SDA
P3.2/UCB0SOMI/UCB0SCL
P3.3/UCB0CLK/UCA0STE
DVSS3
DVCC3
P3.4/UCA0TXD/UCA0SIMO
P3.5/UCA0RXD/UCA0SOMI
P3.6/UCB1STE/UCA1CLK
P3.7/UCB1SIMO/UCB1SDA
P4.0/TB0.0
P4.1/TB0.1
P4.2/TB0.2
P4.3/TB0.3
P4.4/TB0.4
P4.5/TB0.5
P4.6/TB0.6
P4.7/TB0CLK/SMCLK
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
P6.4/A4
P6.5/A5
P6.6/A6
P6.7/A7
P7.4/A12
P7.5/A13
P7.6/A14
P7.7/A15
P5.0/A8/VREF+/VeREF+
P5.1/A9/VREF−/VeREF−
AVCC
AVSS
P7.0/XIN
P7.1/XOUT
DVSS1
DVCC1
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/SMCLK
P1.7
P2.0/TA1CLK/MCLK
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
P6.3/A3
P6.2/A2
P6.1/A1
P6.0/A0
RST/NMI/SBWTDIO
PJ.3/TCK
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
TEST/SBWTCK
P5.3/XT2OUT
P5.2/XT2IN
DVSS4
DVCC4
P11.2/SMCLK
P11.1/MCLK
P11.0/ACLK
P10.7
P10.6
P10.5/UCA3RXDUCA3SOMI
P10.4/UCA3TXD/UCA3SIMO
P10.3/UCB3CLK/UCA3STE
P10.2/UCB3SOMI/UCB3SCL
P10.1/UCB3SIMO/UCB3SDA
P10.0/UCB3STE/UCA3CLK
Figure 4-1 shows the pinout of the 100-pin PZ package.
Figure 4-1. 100-Pin PZ Package (Top View)
6
Terminal Configuration and Functions
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Figure 4-2 shows the pinout of the 113-pin ZQW package.
P6.4
P6.2
RST
PJ.1
P5.3
P5.2
P11.2
P11.0
P10.6
P10.4
P10.1
P9.7
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
P6.6
P6.3
P6.1
PJ.3
PJ.0
DVSS4
DVCC4
P10.7
P10.5
P10.3
P9.6
P9.5
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
P7.5
P6.7
Reserved
P9.4
P9.2
C1
C2
C3
C11
C12
P5.0
P7.6
P6.0
PJ.2
TEST
P11.1
P10.2
P10.0
P9.0
P8.7
D1
D2
D4
D5
D6
D7
D8
D9
D11
D12
P5.1
AVCC
P6.5
Reserved
Reserved
Reserved
Reserved
P9.3
P8.6
DVCC2
E1
E2
E4
E5
E6
E7
E8
E9
E11
E12
P7.0
AVSS
P7.4
Reserved
Reserved
P9.1
P8.5
DVSS2
F1
F2
F4
F5
F8
F9
F11
F12
P7.1
DVSS1
P7.7
Reserved
Reserved
P8.3
P8.4
VCORE
G1
G2
G4
G5
G8
G9
G11
G12
P1.0
DVCC1
P1.1
Reserved
Reserved
Reserved
A8
P8.0
P8.1
P8.2
H1
H2
H4
H5
H6
H7
H8
H9
H11
H12
P1.3
P1.4
P1.2
P2.7
P3.2
P3.5
P4.0
P5.5
P7.2
P7.3
J1
J2
J4
J5
J6
J7
J8
J9
J11
J12
P1.5
P1.6
P5.6
P5.7
K1
K2
K11
K12
P1.7
P2.1
P2.3
P2.5
P3.0
P3.3
P3.4
P3.7
P4.2
P4.3
P4.5
P5.4
L1
L2
L3
L4
L5
L6
L7
L8
L9
L10
L11
L12
P2.0
P2.2
P2.4
P2.6
P3.1
DVSS3
DVCC3
P3.6
P4.1
P4.4
P4.6
P4.7
M1
M2
M3
M4
M5
M6
M7
M8
M9
M10
M11
M12
Figure 4-2. 113-Pin ZQW Package (Top View)
Terminal Configuration and Functions
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4.2
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Signal Descriptions
Table 4-1 describes the signals.
Table 4-1. Terminal Functions
TERMINAL
NAME
I/O (1)
NO.
DESCRIPTION
PZ
ZQW
P6.4/A4
1
A1
I/O
General-purpose digital I/O
Analog input A4 – ADC
P6.5/A5
2
E4
I/O
General-purpose digital I/O
Analog input A5 – ADC
P6.6/A6
3
B1
I/O
General-purpose digital I/O
Analog input A6 – ADC
P6.7/A7
4
C2
I/O
General-purpose digital I/O
Analog input A7 – ADC
P7.4/A12
5
F4
I/O
General-purpose digital I/O
Analog input A12 –ADC
P7.5/A13
6
C1
I/O
General-purpose digital I/O
Analog input A13 – ADC
P7.6/A14
7
D2
I/O
General-purpose digital I/O
Analog input A14 – ADC
P7.7/A15
8
G4
I/O
General-purpose digital I/O
Analog input A15 – ADC
I/O
General-purpose digital I/O
Analog input A8 – ADC
Output of reference voltage to the ADC
Input for an external reference voltage to the ADC
I/O
General-purpose digital I/O
Analog input A9 – ADC
Negative terminal for the ADC reference voltage for both sources, the internal
reference voltage, or an external applied reference voltage
P5.0/A8/VREF+/VeREF+
9
D1
P5.1/A9/VREF-/VeREF-
10
E1
AVCC
11
E2
Analog power supply
AVSS
12
F2
Analog ground supply
P7.0/XIN
13
F1
I/O
General-purpose digital I/O
Input terminal for crystal oscillator XT1
P7.1/XOUT
14
G1
I/O
General-purpose digital I/O
Output terminal of crystal oscillator XT1
DVSS1
15
G2
Digital ground supply
DVCC1
16
H2
Digital power supply
P1.0/TA0CLK/ACLK
17
H1
I/O
General-purpose digital I/O with port interrupt
TA0 clock signal TACLK input
ACLK output (divided by 1, 2, 4, 8, 16, or 32)
P1.1/TA0.0
18
H4
I/O
General-purpose digital I/O with port interrupt
TA0 CCR0 capture: CCI0A input, compare: Out0 output
BSL transmit output
P1.2/TA0.1
19
J4
I/O
General-purpose digital I/O with port interrupt
TA0 CCR1 capture: CCI1A input, compare: Out1 output
BSL receive input
P1.3/TA0.2
20
J1
I/O
General-purpose digital I/O with port interrupt
TA0 CCR2 capture: CCI2A input, compare: Out2 output
P1.4/TA0.3
21
J2
I/O
General-purpose digital I/O with port interrupt
TA0 CCR3 capture: CCI3A input compare: Out3 output
P1.5/TA0.4
22
K1
I/O
General-purpose digital I/O with port interrupt
TA0 CCR4 capture: CCI4A input, compare: Out4 output
P1.6/SMCLK
23
K2
I/O
General-purpose digital I/O with port interrupt
SMCLK output
P1.7
24
L1
I/O
General-purpose digital I/O with port interrupt
(1)
8
I = input, O = output, N/A = not available on this package offering
Terminal Configuration and Functions
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Table 4-1. Terminal Functions (continued)
TERMINAL
NAME
I/O (1)
NO.
DESCRIPTION
PZ
ZQW
P2.0/TA1CLK/MCLK
25
M1
I/O
General-purpose digital I/O with port interrupt
TA1 clock signal TA1CLK input
MCLK output
P2.1/TA1.0
26
L2
I/O
General-purpose digital I/O with port interrupt
TA1 CCR0 capture: CCI0A input, compare: Out0 output
P2.2/TA1.1
27
M2
I/O
General-purpose digital I/O with port interrupt
TA1 CCR1 capture: CCI1A input, compare: Out1 output
P2.3/TA1.2
28
L3
I/O
General-purpose digital I/O with port interrupt
TA1 CCR2 capture: CCI2A input, compare: Out2 output
P2.4/RTCCLK
29
M3
I/O
General-purpose digital I/O with port interrupt
RTCCLK output
P2.5
30
L4
I/O
General-purpose digital I/O with port interrupt
P2.6/ACLK
31
M4
I/O
General-purpose digital I/O with port interrupt
ACLK output (divided by 1, 2, 4, 8, 16, or 32)
P2.7/ADC12CLK/DMAE0
32
J5
I/O
General-purpose digital I/O with port interrupt
Conversion clock output ADC
DMA external trigger input
P3.0/UCB0STE/UCA0CLK
33
L5
I/O
General-purpose digital I/O
Slave transmit enable – USCI_B0 SPI mode
Clock signal input – USCI_A0 SPI slave mode
Clock signal output – USCI_A0 SPI master mode
P3.1/UCB0SIMO/UCB0SDA
34
M5
I/O
General-purpose digital I/O
Slave in, master out – USCI_B0 SPI mode
I2C data – USCI_B0 I2C mode
P3.2/UCB0SOMI/UCB0SCL
35
J6
I/O
General-purpose digital I/O
Slave out, master in – USCI_B0 SPI mode
I2C clock – USCI_B0 I2C mode
I/O
General-purpose digital I/O
Clock signal input – USCI_B0 SPI slave mode
Clock signal output – USCI_B0 SPI master mode
Slave transmit enable – USCI_A0 SPI mode
P3.3/UCB0CLK/UCA0STE
36
L6
DVSS3
37
M6
Digital ground supply
DVCC3
38
M7
Digital power supply
P3.4/UCA0TXD/UCA0SIMO
39
L7
I/O
General-purpose digital I/O
Transmit data – USCI_A0 UART mode
Slave in, master out – USCI_A0 SPI mode
P3.5/UCA0RXD/UCA0SOMI
40
J7
I/O
General-purpose digital I/O
Receive data – USCI_A0 UART mode
Slave out, master in – USCI_A0 SPI mode
P3.6/UCB1STE/UCA1CLK
41
M8
I/O
General-purpose digital I/O
Slave transmit enable – USCI_B1 SPI mode
Clock signal input – USCI_A1 SPI slave mode
Clock signal output – USCI_A1 SPI master mode
P3.7/UCB1SIMO/UCB1SDA
42
L8
I/O
General-purpose digital I/O
Slave in, master out – USCI_B1 SPI mode
I2C data – USCI_B1 I2C mode
P4.0/TB0.0
43
J8
I/O
General-purpose digital I/O
TB0 capture CCR0: CCI0A/CCI0B input, compare: Out0 output
P4.1/TB0.1
44
M9
I/O
General-purpose digital I/O
TB0 capture CCR1: CCI1A/CCI1B input, compare: Out1 output
P4.2/TB0.2
45
L9
I/O
General-purpose digital I/O
TB0 capture CCR2: CCI2A/CCI2B input, compare: Out2 output
P4.3/TB0.3
46
L10
I/O
General-purpose digital I/O
TB0 capture CCR3: CCI3A/CCI3B input, compare: Out3 output
P4.4/TB0.4
47
M10
I/O
General-purpose digital I/O
TB0 capture CCR4: CCI4A/CCI4B input, compare: Out4 output
Terminal Configuration and Functions
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Table 4-1. Terminal Functions (continued)
TERMINAL
NAME
I/O (1)
NO.
DESCRIPTION
PZ
ZQW
P4.5/TB0.5
48
L11
I/O
General-purpose digital I/O
TB0 capture CCR5: CCI5A/CCI5B input, compare: Out5 output
P4.6/TB0.6
49
M11
I/O
General-purpose digital I/O
TB0 capture CCR6: CCI6A/CCI6B input, compare: Out6 output
P4.7/TB0CLK/SMCLK
50
M12
I/O
General-purpose digital I/O
TB0 clock input
SMCLK output
P5.4/UCB1SOMI/UCB1SCL
51
L12
I/O
General-purpose digital I/O
Slave out, master in – USCI_B1 SPI mode
I2C clock – USCI_B1 I2C mode
P5.5/UCB1CLK/UCA1STE
52
J9
I/O
General-purpose digital I/O
Clock signal input – USCI_B1 SPI slave mode
Clock signal output – USCI_B1 SPI master mode
Slave transmit enable – USCI_A1 SPI mode
P5.6/UCA1TXD/UCA1SIMO
53
K11
I/O
General-purpose digital I/O
Transmit data – USCI_A1 UART mode
Slave in, master out – USCI_A1 SPI mode
P5.7/UCA1RXD/UCA1SOMI
54
K12
I/O
General-purpose digital I/O
Receive data – USCI_A1 UART mode
Slave out, master in – USCI_A1 SPI mode
P7.2/TB0OUTH/SVMOUT
55
J11
I/O
General-purpose digital I/O
Switch all PWM outputs high impedance – Timer TB0
SVM output
P7.3/TA1.2
56
J12
I/O
General-purpose digital I/O
TA1 CCR2 capture: CCI2B input, compare: Out2 output
P8.0/TA0.0
57
H9
I/O
General-purpose digital I/O
TA0 CCR0 capture: CCI0B input, compare: Out0 output
P8.1/TA0.1
58
H11
I/O
General-purpose digital I/O
TA0 CCR1 capture: CCI1B input, compare: Out1 output
P8.2/TA0.2
59
H12
I/O
General-purpose digital I/O
TA0 CCR2 capture: CCI2B input, compare: Out2 output
P8.3/TA0.3
60
G9
I/O
General-purpose digital I/O
TA0 CCR3 capture: CCI3B input, compare: Out3 output
P8.4/TA0.4
61
G11
I/O
General-purpose digital I/O
TA0 CCR4 capture: CCI4B input, compare: Out4 output
VCORE (2)
62
G12
Regulated core power supply output (internal use only, no external current loading)
DVSS2
63
F12
Digital ground supply
DVCC2
64
E12
Digital power supply
P8.5/TA1.0
65
F11
I/O
General-purpose digital I/O
TA1 CCR0 capture: CCI0B input, compare: Out0 output
P8.6/TA1.1
66
E11
I/O
General-purpose digital I/O
TA1 CCR1 capture: CCI1B input, compare: Out1 output
P8.7
67
D12
I/O
General-purpose digital I/O
P9.0/UCB2STE/UCA2CLK
68
D11
I/O
General-purpose digital I/O
Slave transmit enable – USCI_B2 SPI mode
Clock signal input – USCI_A2 SPI slave mode
Clock signal output – USCI_A2 SPI master mode
P9.1/UCB2SIMO/UCB2SDA
69
F9
I/O
General-purpose digital I/O
Slave in, master out – USCI_B2 SPI mode
I2C data – USCI_B2 I2C mode
P9.2/UCB2SOMI/UCB2SCL
70
C12
I/O
General-purpose digital I/O
Slave out, master in – USCI_B2 SPI mode
I2C clock – USCI_B2 I2C mode
(2)
10
VCORE is for internal use only. No external current loading is possible. VCORE should only be connected to the recommended
capacitor value, CVCORE.
Terminal Configuration and Functions
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Table 4-1. Terminal Functions (continued)
TERMINAL
NAME
I/O (1)
NO.
DESCRIPTION
PZ
ZQW
P9.3/UCB2CLK/UCA2STE
71
E9
I/O
General-purpose digital I/O
Clock signal input – USCI_B2 SPI slave mode
Clock signal output – USCI_B2 SPI master mode
Slave transmit enable – USCI_A2 SPI mode
P9.4/UCA2TXD/UCA2SIMO
72
C11
I/O
General-purpose digital I/O
Transmit data – USCI_A2 UART mode
Slave in, master out – USCI_A2 SPI mode
P9.5/UCA2RXD/UCA2SOMI
73
B12
I/O
General-purpose digital I/O
Receive data – USCI_A2 UART mode
Slave out, master in – USCI_A2 SPI mode
P9.6
74
B11
I/O
General-purpose digital I/O
P9.7
75
A12
I/O
General-purpose digital I/O
P10.0/UCB3STE/UCA3CLK
76
D9
I/O
General-purpose digital I/O
Slave transmit enable – USCI_B3 SPI mode
Clock signal input – USCI_A3 SPI slave mode
Clock signal output – USCI_A3 SPI master mode
P10.1/UCB3SIMO/UCB3SDA
77
A11
I/O
General-purpose digital I/O
Slave in, master out – USCI_B3 SPI mode
I2C data – USCI_B3 I2C mode
P10.2/UCB3SOMI/UCB3SCL
78
D8
I/O
General-purpose digital I/O
Slave out, master in – USCI_B3 SPI mode
I2C clock – USCI_B3 I2C mode
P10.3/UCB3CLK/UCA3STE
79
B10
I/O
General-purpose digital I/O
Clock signal input – USCI_B3 SPI slave mode
Clock signal output – USCI_B3 SPI master mode
Slave transmit enable – USCI_A3 SPI mode
P10.4/UCA3TXD/UCA3SIMO
80
A10
I/O
General-purpose digital I/O
Transmit data – USCI_A3 UART mode
Slave in, master out – USCI_A3 SPI mode
P10.5/UCA3RXD/UCA3SOMI
81
B9
I/O
General-purpose digital I/O
Receive data – USCI_A3 UART mode
Slave out, master in – USCI_A3 SPI mode
P10.6
82
A9
I/O
General-purpose digital I/O
P10.7
83
B8
I/O
General-purpose digital I/O
P11.0/ACLK
84
A8
I/O
General-purpose digital I/O
ACLK output (divided by 1, 2, 4, 8, 16, or 32)
P11.1/MCLK
85
D7
I/O
General-purpose digital I/O
MCLK output
P11.2/SMCLK
86
A7
I/O
General-purpose digital I/O
SMCLK output
DVCC4
87
B7
Digital power supply
DVSS4
88
B6
Digital ground supply
P5.2/XT2IN
89
A6
I/O
General-purpose digital I/O
Input terminal for crystal oscillator XT2
P5.3/XT2OUT
90
A5
I/O
General-purpose digital I/O
Output terminal of crystal oscillator XT2
TEST/SBWTCK (3)
91
D6
I
PJ.0/TDO (4)
92
B5
I/O
General-purpose digital I/O
JTAG test data output port
PJ.1/TDI/TCLK (4)
93
A4
I/O
General-purpose digital I/O
JTAG test data input or test clock input
(3)
(4)
Test mode pin – Selects four wire JTAG operation.
Spy-Bi-Wire input clock when Spy-Bi-Wire operation activated
See Section 6.5 and Section 6.6 for use with BSL and JTAG functions, respectively.
See Section 6.6 for use with JTAG function.
Terminal Configuration and Functions
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Table 4-1. Terminal Functions (continued)
TERMINAL
NAME
I/O (1)
NO.
DESCRIPTION
PZ
ZQW
(4)
94
D5
I/O
General-purpose digital I/O
JTAG test mode select
PJ.3/TCK (4)
95
B4
I/O
General-purpose digital I/O
JTAG test clock
RST/NMI/SBWTDIO (3)
96
A3
I/O
Reset input active low (5)
Nonmaskable interrupt input
Spy-Bi-Wire data input/output when Spy-Bi-Wire operation activated.
P6.0/A0
97
D4
I/O
General-purpose digital I/O
Analog input A0 – ADC
P6.1/A1
98
B3
I/O
General-purpose digital I/O
Analog input A1 – ADC
P6.2/A2
99
A2
I/O
General-purpose digital I/O
Analog input A2 – ADC
P6.3/A3
100
B2
I/O
General-purpose digital I/O
Analog input A3 – ADC
N/A
G5,
E8,
F8,
G8,
H8,
E7,
H7,
E6,
H6,
E5,
F5,
H5,
C3
PJ.2/TMS
Reserved
(5)
12
Reserved. Connect to ground.
When this pin is configured as reset, the internal pullup resistor is enabled by default.
Terminal Configuration and Functions
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5 Specifications
Absolute Maximum Ratings (1)
5.1
over operating free-air temperature range (unless otherwise noted)
Voltage applied at VCC to VSS
Voltage applied to any pin (excluding VCORE)
(2)
MIN
MAX
–0.3
4.1
–0.3
VCC + 0.3
Diode current at any device pin
Storage temperature range, Tstg
(3)
–55
(2)
(3)
105
°C
95
°C
ESD Ratings
VALUE
V(ESD)
(2)
V
mA
Stresses beyond those listed under Absolute Maximum Ratingsmay cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to VSS. VCORE is for internal device use only. No external DC loading or voltage should be applied.
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
5.2
(1)
V
±2
Maximum junction temperature, TJ
(1)
UNIT
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±1000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±250
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as
±1000 V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±250 V
may actually have higher performance.
5.3
Recommended Operating Conditions
Typical values are specified at VCC = 3.3 V and TA = 25°C (unless otherwise noted)
MIN
VCC
Supply voltage during program execution and flash programming
(AVCC = DVCC1/2/3/4 = DVCC) (1) (2)
VSS
Supply voltage (AVSS = DVSS1/2/3/4 = DVSS)
TA
Operating free-air temperature
I version
–40
TJ
Operating junction temperature
I version
–40
CVCORE
Recommended capacitor at VCORE (3)
CDVCC/CV
Capacitor ratio of DVCC to VCORE
NOM
1.8
MAX
UNIT
3.6
V
85
°C
0
V
85
470
°C
nF
10
CORE
fSYSTEM
(1)
(2)
(3)
(4)
(5)
Processor frequency (maximum MCLK
frequency) (4) (5) (see Figure 5-1)
PMMCOREVx = 0, 1.8 V ≤ VCC ≤ 3.6 V
0
8.0
PMMCOREVx = 1, 2.0 V ≤ VCC ≤ 3.6 V
0
12.0
PMMCOREVx = 2, 2.2 V ≤ VCC ≤ 3.6 V
0
20.0
PMMCOREVx = 3, 2.4 V ≤ VCC ≤ 3.6 V
0
25.0
MHz
TI recommends powering AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power up and operation.
The minimum supply voltage is defined by the supervisor SVS levels when it is enabled. See the Section 5.23 threshold parameters for
the exact values and further details.
A capacitor tolerance of ±20% or better is required.
The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse duration of the
specified maximum frequency.
Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet.
Specifications
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25
System Frequency - MHz
3
20
2
2, 3
1
1, 2
1, 2, 3
0, 1
0, 1, 2
0, 1, 2, 3
12
8
0
0
1.8
2.2
2.0
2.4
3.6
Supply Voltage - V
The numbers within the fields denote the supported PMMCOREVx settings.
Figure 5-1. Frequency vs Supply Voltage
5.4
Active Mode Supply Current Into VCC Excluding External Current
over recommended operating free-air temperature (unless otherwise noted) (1)
(2) (3)
FREQUENCY (fDCO = fMCLK = fSMCLK)
PARAMETER
IAM,
IAM,
(1)
(2)
(3)
14
Flash
RAM
EXECUTION
MEMORY
Flash
RAM
VCC
3V
3V
PMMCOREVx
1 MHz
8 MHz
12 MHz
MAX
TYP
MAX
0
0.29
0.33
1.84
2.08
1
0.32
2.08
3.10
2
0.33
2.24
3.50
6.37
3
0.35
3.70
6.75
0
0.17
1
0.18
1.00
1.47
2
0.19
1.13
1.68
2.82
3
0.20
1.20
1.78
3.00
2.36
0.19
0.88
TYP
MAX
20 MHz
TYP
TYP
MAX
25 MHz
TYP
UNIT
MAX
mA
8.90
9.60
0.99
mA
4.50
4.90
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
Characterized with program executing typical data processing.
fACLK = 32786 Hz, fDCO = fMCLK = fSMCLK at specified frequency.
XTS = CPUOFF = SCG0 = SCG1 = OSCOFF= SMCLKOFF = 0.
Specifications
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5.5
SLAS703B – APRIL 2010 – REVISED AUGUST 2015
Low-Power Mode Supply Currents (Into VCC) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
VCC
PMMCOREVx
–40°C
TYP
25°C
MAX
TYP
60°C
MAX
TYP
(2)
85°C
MAX
TYP
MAX
ILPM0,1MHz
Low-power
mode 0 (3) (4)
2.2 V
0
69
93
69
93
69
93
69
93
3V
3
73
100
73
100
73
100
73
100
ILPM2
Low-power
mode 2 (5) (4)
2.2 V
0
11
15.5
11
15.5
11
15.5
11
15.5
3V
3
11.7
17.5
11.7
17.5
11.7
17.5
11.7
17.5
0
1.4
1.7
2.6
6.6
1
1.5
1.8
2.9
9.9
2
1.5
2.0
3.3
10.1
0
1.8
2.1
1
1.8
2.3
2
1.9
2.4
3
2.0
2.3
2.6
0
1.0
1.2
1.42
1
1.0
2
2.2 V
ILPM3,XT1LF
Low-power mode 3,
crystal mode (6) (4)
3V
ILPM3,VLO
ILPM4
ILPM4.5
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
5.6
Low-power mode 3,
VLO mode (7) (4)
3V
Low-power
mode 4 (8) (4)
Low-power mode 4.5
3V
(9)
2.8
7.1
3.1
10.5
3.5
10.6
3.9
11.8
14.8
2.0
5.8
12.9
1.3
2.3
6.0
1.1
1.4
2.8
6.2
3
1.2
1.4
1.62
3.0
6.2
13.9
0
1.1
1.2
1.35
1.9
5.7
12.9
1
1.2
1.2
2.2
5.9
2
1.3
1.3
2.6
6.1
3
1.3
1.3
1.52
2.9
6.2
13.9
0.10
0.10
0.13
0.20
0.50
1.14
3V
2.4
13.6
µA
µA
µA
µA
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
Current for watchdog timer clocked by SMCLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0), fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz
Current for brownout, high side supervisor (SVSH) normal mode included. Low-side supervisor and monitors disabled (SVSL, SVML).
High side monitor disabled (SVMH). RAM retention enabled.
Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2), fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 0 MHz, DCO setting =
1 MHz operation, DCO bias generator enabled.
Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3), fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz
Current for watchdog timer and RTC clocked by ACLK included. ACLK = VLO.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3), fACLK = fVLO, fMCLK = fSMCLK = fDCO = 0 MHz
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4), fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
Internal regulator disabled. No data retention.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1, PMMREGOFF = 1 (LPM4.5), fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
Thermal Characteristics
Low-K board (JESD51-3)
Junction-to-ambient thermal resistance, still air
High-K board (JESD51-7)
θJC
µA
µA
VALUE
θJA
UNIT
Junction-to-case thermal resistance
QFP (PZ)
BGA (ZQW)
QFP (PZ)
60
40.8
BGA (ZQW)
42
QFP (PZ)
8.9
BGA (ZQW)
8
Specifications
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UNIT
50.1
°C/W
°C/W
15
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Schmitt-Trigger Inputs – General-Purpose I/O (1)
5.7
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input voltage hysteresis (VIT+ – VIT–)
RPull
Pullup or pulldown resistor (2)
For pullup: VIN = VSS
For pulldown: VIN = VCC
CI
Input capacitance
VIN = VSS or VCC
(1)
(2)
VCC
MIN
1.8 V
0.80
1.40
3V
1.50
2.10
1.8 V
0.45
1.00
3V
0.75
1.65
1.8 V
0.3
0.85
3V
0.4
1.0
20
TYP
35
MAX
UNIT
V
V
V
50
kΩ
5
pF
Same parametrics apply to clock input pin when crystal bypass mode is used on XT1 (XIN) or XT2 (XT2IN).
Also applies to RST pin when the pullup or pulldown resistor is enabled.
Inputs – Ports P1 and P2 (1)
5.8
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
t(int)
(1)
(2)
PARAMETER
TEST CONDITIONS
VCC
External interrupt timing (2)
Port P1, P2: P1.x to P2.x, external trigger pulse duration
to set interrupt flag
2.2 V, 3 V
MIN
MAX
UNIT
20
ns
Some devices may contain additional ports with interrupts. See the block diagram and terminal function descriptions.
An external signal sets the interrupt flag every time the minimum interrupt pulse duration t(int) is met. It may be set by trigger signals
shorter than t(int).
5.9
Leakage Current – General-Purpose I/O
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Ilkg(Px.y)
(1)
(2)
16
High-impedance leakage current
TEST CONDITIONS
(1) (2)
VCC
1.8 V, 3 V
MIN
MAX
UNIT
±50
nA
The leakage current is measured with VSS or VCC applied to the corresponding pins, unless otherwise noted.
The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup or pulldown resistor is
disabled.
Specifications
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5.10 Outputs – General-Purpose I/O (Full Drive Strength)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
I(OHmax) = –3 mA
VOH
I(OHmax) = –10 mA (2)
High-level output voltage
I(OHmax) = –5 mA (1)
I(OHmax) = –15 mA (2)
I(OLmax) = 3 mA
VOL
(2)
3V
MAX
VCC – 0.25
VCC
VCC – 0.60
VCC
VCC – 0.25
VCC
VCC – 0.60
VCC
VSS
VSS + 0.25
VSS
VSS + 0.60
VSS
VSS + 0.25
VSS
VSS + 0.60
1.8 V
I(OLmax) = 5 mA (1)
3V
I(OLmax) = 15 mA (2)
(1)
1.8 V
MIN
(1)
I(OLmax) = 10 mA (2)
Low-level output voltage
VCC
(1)
UNIT
V
V
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop
specified.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±100 mA to hold the maximum voltage
drop specified.
5.11 Outputs – General-Purpose I/O (Reduced Drive Strength)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
I(OHmax) = –1 mA (2)
VOH
1.8 V
I(OHmax) = –3 mA (3)
High-level output voltage
I(OHmax) = –2 mA
(2)
3V
I(OHmax) = –6 mA (3)
I(OLmax) = 1 mA (2)
VOL
I(OLmax) = 2 mA (2)
(3)
MAX
VCC
VCC – 0.60
VCC
VCC – 0.25
VCC
VCC – 0.60
VCC
VSS
VSS + 0.25
VSS
VSS + 0.60
VSS
VSS + 0.25
VSS
VSS + 0.60
3V
I(OLmax) = 6 mA (3)
(1)
(2)
MIN
VCC – 0.25
1.8 V
I(OLmax) = 3 mA (3)
Low-level output voltage
VCC
UNIT
V
V
Selecting reduced drive strength may reduce EMI.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±48 mA to hold the maximum voltage drop
specified.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±100 mA to hold the maximum voltage
drop specified.
5.12 Output Frequency – General-Purpose I/O
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fPx.y
fPort_CLK
(1)
(2)
TEST CONDITIONS
Port output frequency
(with load)
P1.6/SMCLK
Clock output frequency
P1.0/TA0CLK/ACLK
P1.6/SMCLK
P2.0/TA1CLK/MCLK
CL = 20 pF (2)
(1) (2)
MIN
MAX
VCC = 1.8 V
PMMCOREVx = 0
16
VCC = 3 V
PMMCOREVx = 3
25
VCC = 1.8 V
PMMCOREVx = 0
16
VCC = 3 V
PMMCOREVx = 3
25
UNIT
MHz
MHz
A resistive divider with 2 × R1 between VCC and VSS is used as load. The output is connected to the center tap of the divider. For full
drive strength, R1 = 550 Ω. For reduced drive strength, R1 = 1.6 kΩ. CL = 20 pF is connected to the output to VSS.
The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
Specifications
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5.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
8.0
VCC = 3.0 V
Px.y
IOL – Typical Low-Level Output Current – mA
IOL – Typical Low-Level Output Current – mA
25.0
TA = 25°C
20.0
TA = 85°C
15.0
10.0
5.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VOL – Low-Level Output Voltage – V
Figure 5-2. Typical Low-Level Output Current vs Low-Level
Output Voltage
IOH – Typical High-Level Output Current – mA
IOH – Typical High-Level Output Current – mA
-5.0
-10.0
TA = 85°C
TA = 25°C
3.0
2.0
1.0
0.5
1.0
1.5
2.0
VCC = 1.8 V
Px.y
-1.0
-2.0
-3.0
-4.0
TA = 85°C
-5.0
-6.0
TA = 25°C
-7.0
-8.0
-25.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VOH – High-Level Output Voltage – V
Figure 5-4. Typical High-Level Output Current vs High-Level
Output Voltage
18
4.0
0.0
VCC = 3.0 V
Px.y
-20.0
5.0
VOL – Low-Level Output Voltage – V
Figure 5-3. Typical Low-Level Output Current vs Low-Level
Output Voltage
0.0
-15.0
TA = 85°C
6.0
0.0
0.0
3.5
TA = 25°C
VCC = 1.8 V
Px.y
7.0
0.0
0.5
1.0
1.5
2.0
VOH – High-Level Output Voltage – V
Figure 5-5. Typical High-Level Output Current vs High-Level
Output Voltage
Specifications
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5.14 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TA = 25°C
VCC = 3.0 V
Px.y
55.0
50.0
IOL – Typical Low-Level Output Current – mA
IOL – Typical Low-Level Output Current – mA
60.0
TA = 85°C
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
IOH – Typical High-Level Output Current – mA
IOH – Typical High-Level Output Current – mA
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
-45.0
TA = 85°C
-55.0
TA = 25°C
-60.0
0.0
TA = 85°C
16
12
8
4
0.5
1.0
1.5
2.0
0
VCC = 3.0 V
Px.y
-50.0
TA = 25°C
20
VOL – Low-Level Output Voltage – V
Figure 5-7. Typical Low-Level Output Current vs Low-Level
Output Voltage
0.0
-5.0
VCC = 1.8 V
Px.y
0
0.0
3.5
VOL – Low-Level Output Voltage – V
Figure 5-6. Typical Low-Level Output Current vs Low-Level
Output Voltage
24
0.5
VCC = 1.8 V
Px.y
-4
-8
-12
TA = 85°C
-16
TA = 25°C
-20
1.0
1.5
2.0
2.5
3.0
3.5
VOH – High-Level Output Voltage – V
Figure 5-8. Typical High-Level Output Current vs High-Level
Output Voltage
0.0
0.5
1.0
1.5
2.0
VOH – High-Level Output Voltage – V
Figure 5-9. Typical High-Level Output Current vs High-Level
Output Voltage
Specifications
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5.15 Crystal Oscillator, XT1, Low-Frequency Mode (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
TA = 25°C
ΔIDVCC.LF
Differential XT1 oscillator crystal
current consumption from lowest
drive setting, LF mode
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 2,
TA = 25°C
0.170
32768
XTS = 0, XT1BYPASS = 0
fXT1,LF,SW
XT1 oscillator logic-level squarewave input frequency, LF mode
XTS = 0, XT1BYPASS = 1 (2)
OALF
3V
0.290
XT1 oscillator crystal frequency,
LF mode
(3)
10
CL,eff
fFault,LF
tSTART,LF
210
XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
fXT1,LF = 32768 Hz, CL,eff = 12 pF
300
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
20
XTS = 0, XCAPx = 2
8.5
XTS = 0, XCAPx = 3
12.0
Oscillator fault frequency,
LF mode (7)
XTS = 0 (8)
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
TA = 25°C, CL,eff = 6 pF
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C, CL,eff = 12 pF
µA
Hz
50
kHz
1
5.5
Duty cycle, LF mode
UNIT
kΩ
XTS = 0, XCAPx = 1
XTS = 0, Measured at ACLK,
fXT1,LF = 32768 Hz
Start-up time, LF mode
32.768
XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
fXT1,LF = 32768 Hz, CL,eff = 6 pF
XTS = 0, XCAPx = 0 (6)
Integrated effective load
capacitance, LF mode (5)
MAX
0.075
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C
fXT1,LF0
Oscillation allowance for
LF crystals (4)
TYP
pF
30%
70%
10
10000
Hz
1000
3V
ms
500
To improve EMI on the XT1 oscillator, the following guidelines should be observed.
• Keep the trace between the device and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
• Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
• Use assembly materials and techniques that avoid any parasitic load on the oscillator XIN and XOUT pins.
• If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
When XT1BYPASS is set, XT1 circuits are automatically powered down. The input signal must be a digital square wave with the
parametrics defined in the Schmitt-Trigger Inputs section.
Maximum frequency of operation of the entire device cannot be exceeded.
Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the
XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following
guidelines, but should be evaluated based on the actual crystal selected for the application:
• For XT1DRIVEx = 0, CL,eff ≤ 6 pF.
• For XT1DRIVEx = 1, 6 pF ≤ CL,eff ≤ 9 pF.
• For XT1DRIVEx = 2, 6 pF ≤ CL,eff ≤ 10 pF.
• For XT1DRIVEx = 3, CL,eff ≥ 6 pF.
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, TI recommends verifying the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies between the MIN and MAX might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
Specifications
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5.16 Crystal Oscillator, XT1, High-Frequency Mode (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
IDVCC.HF
XT1 oscillator crystal current,
HF mode
TEST CONDITIONS
VCC
MIN
TYP
fOSC = 4 MHz,
XTS = 1, XOSCOFF = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
TA = 25°C
200
fOSC = 12 MHz,
XTS = 1, XOSCOFF = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
TA = 25°C
260
fOSC = 20 MHz,
XTS = 1, XOSCOFF = 0,
XT1BYPASS = 0, XT1DRIVEx = 2,
TA = 25°C
MAX
3V
UNIT
µA
325
fOSC = 32 MHz,
XTS = 1, XOSCOFF = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C
450
fXT1,HF0
XT1 oscillator crystal frequency,
HF mode 0
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 0 (2)
4
8
MHz
fXT1,HF1
XT1 oscillator crystal frequency,
HF mode 1
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 1 (2)
8
16
MHz
fXT1,HF2
XT1 oscillator crystal frequency,
HF mode 2
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 2 (2)
16
24
MHz
fXT1,HF3
XT1 oscillator crystal frequency,
HF mode 3
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 3 (2)
24
32
MHz
fXT1,HF,SW
XT1 oscillator logic-level squarewave input frequency, HF mode,
bypass mode
XTS = 1,
XT1BYPASS = 1 (3)
1.5
32
MHz
OAHF
tSTART,HF
(1)
(2)
(3)
(4)
Oscillation allowance for
HF crystals (4)
Start-up time, HF mode
(2)
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 0,
fXT1,HF = 6 MHz, CL,eff = 15 pF
450
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 1,
fXT1,HF = 12 MHz, CL,eff = 15 pF
320
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 2,
fXT1,HF = 20 MHz, CL,eff = 15 pF
200
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 3,
fXT1,HF = 32 MHz, CL,eff = 15 pF
200
fOSC = 6 MHz, XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 0,
TA = 25°C, CL,eff = 15 pF
0.5
fOSC = 20 MHz, XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 2,
TA = 25°C, CL,eff = 15 pF
Ω
3V
ms
0.3
To improve EMI on the XT1 oscillator the following guidelines should be observed.
• Keep the traces between the device and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
• Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
• Use assembly materials and techniques that avoid any parasitic load on the oscillator XIN and XOUT pins.
• If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device
operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation.
When XT1BYPASS is set, XT1 circuits are automatically powered down. The input signal must be a digital square wave with the
parametrics defined in the Schmitt-Trigger Inputs section.
Oscillation allowance is based on a safety factor of 5 for recommended crystals.
Specifications
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Crystal Oscillator, XT1, High-Frequency Mode(1) (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Integrated effective load
capacitance, HF mode (5)
CL,eff
fFault,HF
(5)
(6)
(7)
(8)
TEST CONDITIONS
(6)
VCC
MIN
XTS = 1
TYP
MAX
UNIT
1
Duty cycle, HF mode
XTS = 1, Measured at ACLK,
fXT1,HF2 = 20 MHz
Oscillator fault frequency,
HF mode (7)
XTS = 1 (8)
40%
50%
30
pF
60%
300
kHz
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, TI recommends verifying the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies between the MIN and MAX might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
5.17 Crystal Oscillator, XT2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
IDVCC.XT2
XT2 oscillator crystal current
consumption
TEST CONDITIONS
VCC
MIN
(2)
TYP
fOSC = 4 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 0,
TA = 25°C
200
fOSC = 12 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 1,
TA = 25°C
260
fOSC = 20 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 2,
TA = 25°C
MAX
3V
UNIT
µA
325
fOSC = 32 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 3,
TA = 25°C
450
fXT2,HF0
XT2 oscillator crystal frequency,
mode 0
XT2DRIVEx = 0, XT2BYPASS = 0 (3)
4
8
MHz
fXT2,HF1
XT2 oscillator crystal frequency,
mode 1
XT2DRIVEx = 1, XT2BYPASS = 0 (3)
8
16
MHz
fXT2,HF2
XT2 oscillator crystal frequency,
mode 2
XT2DRIVEx = 2, XT2BYPASS = 0 (3)
16
24
MHz
fXT2,HF3
XT2 oscillator crystal frequency,
mode 3
XT2DRIVEx = 3, XT2BYPASS = 0 (3)
24
32
MHz
fXT2,HF,SW
XT2 oscillator logic-level squarewave input frequency, bypass
mode
XT2BYPASS = 1 (4)
1.5
32
MHz
(1)
(2)
(3)
(4)
22
(3)
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
To improve EMI on the XT2 oscillator the following guidelines should be observed.
• Keep the traces between the device and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
• Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
• Use assembly materials and techniques that avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
• If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device
operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation.
When XT2BYPASS is set, XT2 circuits are automatically powered down. The input signal must be a digital square wave with the
parametrics defined in the Schmitt-Trigger Inputs section.
Specifications
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SLAS703B – APRIL 2010 – REVISED AUGUST 2015
Crystal Oscillator, XT2 (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (2)
PARAMETER
OAHF
tSTART,HF
CL,eff
TEST CONDITIONS
Oscillation allowance for
HF crystals (5)
fFault,HF
(7)
(8)
Oscillator fault frequency
TYP
XT2DRIVEx = 1, XT2BYPASS = 0,
fXT2,HF1 = 12 MHz, CL,eff = 15 pF
320
XT2DRIVEx = 2, XT2BYPASS = 0,
fXT2,HF2 = 20 MHz, CL,eff = 15 pF
200
XT2DRIVEx = 3, XT2BYPASS = 0,
fXT2,HF3 = 32 MHz, CL,eff = 15 pF
200
UNIT
0.5
3V
ms
0.3
1
(1)
Measured at ACLK, fXT2,HF2 = 20 MHz
(7)
MAX
Ω
fOSC = 20 MHz
XT2BYPASS = 0, XT2DRIVEx = 2,
TA = 25°C, CL,eff = 15 pF
Duty cycle
(5)
(6)
MIN
450
fOSC = 6 MHz
XT2BYPASS = 0, XT2DRIVEx = 0,
TA = 25°C, CL,eff = 15 pF
Start-up time
Integrated effective load
capacitance, HF mode (6)
VCC
XT2DRIVEx = 0, XT2BYPASS = 0,
fXT2,HF0 = 6 MHz, CL,eff = 15 pF
XT2BYPASS = 1
40%
(8)
pF
50%
60%
30
300
kHz
Oscillation allowance is based on a safety factor of 5 for recommended crystals.
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, TI recommends verifying the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies between the MIN and MAX might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
5.18 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
6
9.4
14
UNIT
fVLO
VLO frequency
Measured at ACLK
1.8 V to 3.6 V
dfVLO/dT
VLO frequency temperature drift
Measured at ACLK (1)
1.8 V to 3.6 V
0.5
%/°C
Measured at ACLK (2)
1.8 V to 3.6 V
4
%/V
Measured at ACLK
1.8 V to 3.6 V
dfVLO/dVCC VLO frequency supply voltage drift
Duty cycle
(1)
(2)
40%
50%
kHz
60%
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)
5.19 Internal Reference, Low-Frequency Oscillator (REFO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
IREFO
fREFO
TEST CONDITIONS
VCC
MIN
TYP
REFO oscillator current consumption TA = 25°C
1.8 V to 3.6 V
3
REFO frequency calibrated
Measured at ACLK
1.8 V to 3.6 V
32768
Full temperature range
1.8 V to 3.6 V
REFO absolute tolerance calibrated
TA = 25°C
3V
µA
Hz
±1.5%
REFO frequency temperature drift
Measured at ACLK (1)
1.8 V to 3.6 V
0.01
dfREFO/dVCC
REFO frequency supply voltage drift
Measured at ACLK (2)
1.8 V to 3.6 V
1.0
Duty cycle
Measured at ACLK
1.8 V to 3.6 V
REFO start-up time
40%/60% duty cycle
1.8 V to 3.6 V
tSTART
UNIT
±3.5%
dfREFO/dT
(1)
(2)
MAX
40%
50%
%/°C
%/V
60%
25
µs
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)
Specifications
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5.20 DCO Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
(1)
MIN
TYP
MAX
UNIT
fDCO(0,0)
DCO frequency (0, 0)
DCORSELx = 0, DCOx = 0, MODx = 0
0.07
0.20
MHz
fDCO(0,31)
DCO frequency (0, 31) (1)
DCORSELx = 0, DCOx = 31, MODx = 0
0.70
1.70
MHz
fDCO(1,0)
DCO frequency (1, 0) (1)
DCORSELx = 1, DCOx = 0, MODx = 0
0.15
0.36
MHz
fDCO(1,31)
DCO frequency (1, 31) (1)
DCORSELx = 1, DCOx = 31, MODx = 0
1.47
3.45
MHz
(1)
fDCO(2,0)
DCO frequency (2, 0)
DCORSELx = 2, DCOx = 0, MODx = 0
0.32
0.75
MHz
fDCO(2,31)
DCO frequency (2, 31) (1)
DCORSELx = 2, DCOx = 31, MODx = 0
3.17
7.38
MHz
fDCO(3,0)
DCO frequency (3, 0) (1)
DCORSELx = 3, DCOx = 0, MODx = 0
0.64
1.51
MHz
(1)
fDCO(3,31)
DCO frequency (3, 31)
DCORSELx = 3, DCOx = 31, MODx = 0
6.07
14.0
MHz
fDCO(4,0)
DCO frequency (4, 0) (1)
DCORSELx = 4, DCOx = 0, MODx = 0
1.3
3.2
MHz
fDCO(4,31)
DCO frequency (4, 31) (1)
DCORSELx = 4, DCOx = 31, MODx = 0
12.3
28.2
MHz
(1)
fDCO(5,0)
DCO frequency (5, 0)
DCORSELx = 5, DCOx = 0, MODx = 0
2.5
6.0
MHz
fDCO(5,31)
DCO frequency (5, 31) (1)
DCORSELx = 5, DCOx = 31, MODx = 0
23.7
54.1
MHz
fDCO(6,0)
DCO frequency (6, 0) (1)
DCORSELx = 6, DCOx = 0, MODx = 0
4.6
10.7
MHz
fDCO(6,31)
DCO frequency (6, 31) (1)
DCORSELx = 6, DCOx = 31, MODx = 0
39.0
88.0
MHz
(1)
fDCO(7,0)
DCO frequency (7, 0)
DCORSELx = 7, DCOx = 0, MODx = 0
8.5
19.6
MHz
fDCO(7,31)
DCO frequency (7, 31) (1)
DCORSELx = 7, DCOx = 31, MODx = 0
60
135
MHz
SDCORSEL
Frequency step between range
DCORSEL and DCORSEL + 1
SRSEL = fDCO(DCORSEL+1,DCO)/fDCO(DCORSEL,DCO)
1.2
2.3
ratio
SDCO
Frequency step between tap DCO
and DCO + 1
SDCO = fDCO(DCORSEL,DCO+1)/fDCO(DCORSEL,DCO)
1.02
1.12
ratio
Duty cycle
Measured at SMCLK
40%
dfDCO/dT
DCO frequency temperature drift
dfDCO/dVCC
DCO frequency voltage drift (3)
(1)
(2)
(3)
(2)
50%
60%
fDCO = 1 MHz
0.1
%/°C
fDCO = 1 MHz
1.9
%/V
When selecting the proper DCO frequency range (DCORSELx), the target DCO frequency, fDCO, should be set to reside within the
range of fDCO(n, 0),MAX ≤ fDCO ≤ fDCO(n, 31),MIN, where fDCO(n, 0),MAX represents the maximum frequency specified for the DCO frequency,
range n, tap 0 (DCOx = 0) and fDCO(n,31),MIN represents the minimum frequency specified for the DCO frequency, range n, tap 31
(DCOx = 31). This ensures that the target DCO frequency resides within the range selected. It should also be noted that if the actual
fDCO frequency for the selected range causes the FLL or the application to select tap 0 or 31, the DCO fault flag is set to report that the
selected range is at its minimum or maximum tap setting.
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)
Typical DCO Frequency, VCC = 3.0 V, TA = 25°C
100
fDCO – MHz
10
DCOx = 31
1
0.1
DCOx = 0
0
1
2
3
4
5
6
7
DCORSEL
Figure 5-10. Typical DCO Frequency
24
Specifications
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5.21 PMM, Brown-Out Reset (BOR)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V(DVCC_BOR_IT–)
BORH on voltage,
DVCC falling level
| dDVCC/dt | < 3 V/s
V(DVCC_BOR_IT+)
BORH off voltage,
DVCC rising level
| dDVCC/dt | < 3 V/s
V(DVCC_BOR_hys)
BORH hysteresis
tRESET
Pulse duration required at RST/NMI pin
to accept a reset
MIN
0.80
TYP
1.30
60
MAX
UNIT
1.45
V
1.50
V
250
mV
2
µs
5.22 PMM, Core Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VCORE3(AM)
Core voltage, active mode, PMMCOREV = 3
2.4 V ≤ DVCC ≤ 3.6 V
1.90
V
VCORE2(AM)
Core voltage, active mode, PMMCOREV = 2
2.2 V ≤ DVCC ≤ 3.6 V
1.80
V
VCORE1(AM)
Core voltage, active mode, PMMCOREV = 1
2.0 V ≤ DVCC ≤ 3.6 V
1.60
V
VCORE0(AM)
Core voltage, active mode, PMMCOREV = 0
1.8 V ≤ DVCC ≤ 3.6 V
1.40
V
VCORE3(LPM)
Core voltage, low-current mode, PMMCOREV = 3
2.4 V ≤ DVCC ≤ 3.6 V
1.94
V
VCORE2(LPM)
Core voltage, low-current mode, PMMCOREV = 2
2.2 V ≤ DVCC ≤ 3.6 V
1.84
V
VCORE1(LPM)
Core voltage, low-current mode, PMMCOREV = 1
2.0 V ≤ DVCC ≤ 3.6 V
1.64
V
VCORE0(LPM)
Core voltage, low-current mode, PMMCOREV = 0
1.8 V ≤ DVCC ≤ 3.6 V
1.44
V
Specifications
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5.23 PMM, SVS High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVSHE = 0, DVCC = 3.6 V
I(SVSH)
SVS current consumption
V(SVSH_IT+)
tpd(SVSH)
t(SVSH)
26
SVSH off voltage level (1)
SVSH propagation delay
SVSH on or off delay time
dVDVCC/dt
(1)
SVSH on voltage level (1)
MAX
0
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 0
1.5
µA
SVSHE = 1, SVSHRVL = 0
1.57
1.68
1.78
SVSHE = 1, SVSHRVL = 1
1.79
1.88
1.98
SVSHE = 1, SVSHRVL = 2
1.98
2.08
2.21
SVSHE = 1, SVSHRVL = 3
2.10
2.18
2.31
SVSHE = 1, SVSMHRRL = 0
1.62
1.74
1.85
SVSHE = 1, SVSMHRRL = 1
1.88
1.94
2.07
SVSHE = 1, SVSMHRRL = 2
2.07
2.14
2.28
SVSHE = 1, SVSMHRRL = 3
2.20
2.30
2.42
SVSHE = 1, SVSMHRRL = 4
2.32
2.40
2.55
SVSHE = 1, SVSMHRRL = 5
2.52
2.70
2.88
SVSHE = 1, SVSMHRRL = 6
2.90
3.10
3.23
SVSHE = 1, SVSMHRRL = 7
2.90
3.10
3.23
SVSHE = 1, dVDVCC/dt = 10 mV/µs,
SVSHFP = 1
2.5
SVSHE = 1, dVDVCC/dt = 1 mV/µs,
SVSHFP = 0
20
V
V
µs
SVSHE = 0 → 1, dVDVCC/dt = 10 mV/µs,
SVSHFP = 1
12.5
SVSHE = 0 → 1, dVDVCC/dt = 1 mV/µs,
SVSHFP = 0
100
DVCC rise time
UNIT
nA
200
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 1
V(SVSH_IT–)
TYP
µs
0
1000
V/s
The SVSH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208) on recommended settings and use.
Specifications
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5.24 PMM, SVM High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVMHE = 0, DVCC = 3.6 V
I(SVMH)
SVMH current consumption
SVMH on or off voltage level
tpd(SVMH)
t(SVMH)
(1)
SVMH propagation delay
SVMH on or off delay time
1.5
µA
SVMHE = 1, SVSMHRRL = 0
1.62
1.74
1.85
SVMHE = 1, SVSMHRRL = 1
1.88
1.94
2.07
SVMHE = 1, SVSMHRRL = 2
2.07
2.14
2.28
SVMHE = 1, SVSMHRRL = 3
2.20
2.30
2.42
SVMHE = 1, SVSMHRRL = 4
2.32
2.40
2.55
SVMHE = 1, SVSMHRRL = 5
2.52
2.70
2.88
SVMHE = 1, SVSMHRRL = 6
2.90
3.10
3.23
SVMHE = 1, SVSMHRRL = 7
2.90
3.10
3.23
SVMHE = 1, SVMHOVPE = 1
UNIT
nA
200
SVMHE = 1, DVCC = 3.6 V, SVMHFP = 1
V(SVMH)
MAX
0
SVMHE= 1, DVCC = 3.6 V, SVMHFP = 0
(1)
TYP
V
3.75
SVMHE = 1, dVDVCC/dt = 10 mV/µs,
SVMHFP = 1
2.5
SVMHE = 1, dVDVCC/dt = 1 mV/µs,
SVMHFP = 0
20
µs
SVMHE = 0 → 1, dVDVCC/dt = 10 mV/µs,
SVMHFP = 1
12.5
SVMHE = 0 → 1, dVDVCC/dt = 1 mV/µs,
SVMHFP = 0
100
µs
The SVMH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208) on recommended settings and use.
Specifications
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5.25 PMM, SVS Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
SVSLE = 0, PMMCOREV = 2
I(SVSL)
SVSL current consumption
tpd(SVSL)
t(SVSL)
SVSL propagation delay
SVSL on or off delay time
MAX
UNIT
0
SVSLE = 1, PMMCOREV = 2, SVSLFP = 0
200
SVSLE = 1, PMMCOREV = 2, SVSLFP = 1
1.5
SVSLE = 1, dVCORE/dt = 10 mV/µs,
SVSLFP = 1
2.5
SVSLE = 1, dVCORE/dt = 1 mV/µs,
SVSLFP = 0
20
nA
µA
µs
SVSLE = 0 → 1, dVCORE/dt = 10 mV/µs,
SVSLFP = 1
12.5
SVSLE = 0 → 1, dVCORE/dt = 1 mV/µs,
SVSLFP = 0
100
µs
5.26 PMM, SVM Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
SVMLE = 0, PMMCOREV = 2
I(SVML)
SVML current consumption
tpd(SVML)
t(SVML)
SVML propagation delay
SVML on or off delay time
MAX
UNIT
0
SVMLE= 1, PMMCOREV = 2, SVMLFP = 0
200
SVMLE= 1, PMMCOREV = 2, SVMLFP = 1
1.5
SVMLE = 1, dVCORE/dt = 10 mV/µs,
SVMLFP = 1
2.5
SVMLE = 1, dVCORE/dt = 1 mV/µs,
SVMLFP = 0
20
nA
µA
µs
SVMLE = 0 → 1, dVCORE/dt = 10 mV/µs,
SVMLFP = 1
12.5
SVMLE = 0 → 1, dVCORE/dt = 1 mV/µs,
SVMLFP = 0
100
µs
5.27 Wake-up Times From Low-Power Modes and Reset
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
tWAKE-UPFAST
tWAKE-UPSLOW
tWAKE-UPLPM5
tWAKE-UPRESET
(1)
(2)
(3)
28
TEST CONDITIONS
Wake-up time from LPM2, LPM3, or LPM4
to active mode (1)
PMMCOREV = SVSMLRRL = n
(where n = 0, 1, 2, or 3),
SVSLFP = 1
PMMCOREV = SVSMLRRL = n
Wake-up time from LPM2, LPM3 or LPM4 to
(where n = 0, 1, 2, or 3),
active mode (2)
SVSLFP = 0
MIN
TYP MAX UNIT
fMCLK ≥ 4.0 MHz
5
fMCLK < 4.0 MHz
6
µs
150
165
µs
Wake-up time from LPM4.5 to active
mode (3)
2
3
ms
Wake-up time from RST or BOR event to
active mode (3)
2
3
ms
This value represents the time from the wake-up event to the first active edge of MCLK. The wakeup time depends on the performance
mode of the low-side supervisor (SVSL) and low-side monitor (SVML). Fastest wakeup times are possible with SVSL and SVML in full
performance mode or disabled when operating in AM, LPM0, and LPM1. Various options are available for SVSL and SVML while
operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx
and MSP430x6xx Family User's Guide (SLAU208).
This value represents the time from the wake-up event to the first active edge of MCLK. The wakeup time depends on the performance
mode of the low-side supervisor (SVSL) and low-side monitor (SVML). In this case, the SVSL and SVML are in normal mode (low
current) mode when operating in AM, LPM0, and LPM1. Various options are available for SVSL and SVML while operating in LPM2,
LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx and MSP430x6xx
Family User's Guide (SLAU208).
This value represents the time from the wake-up event to the reset vector execution.
Specifications
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5.28 Timer_A
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
fTA
Timer_A input clock frequency
Internal: SMCLK, ACLK
External: TACLK
Duty cycle = 50% ±10%
1.8 V, 3 V
tTA,cap
Timer_A capture timing
All capture inputs, Minimum pulse
duration required for capture
1.8 V, 3 V
MIN
TYP
MAX
UNIT
25
MHz
20
ns
5.29 Timer_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fTB
Timer_B input clock frequency
Internal: SMCLK, ACLK
External: TBCLK
Duty cycle = 50% ±10%
tTB,cap
Timer_B capture timing
All capture inputs, Minimum pulse
duration required for capture
VCC
1.8 V, 3 V
1.8 V, 3 V
MIN
TYP
MAX
UNIT
25
MHz
20
ns
5.30 USCI (UART Mode), Recommended Operating Conditions
PARAMETER
fUSCI
USCI input clock frequency
fBITCLK
BITCLK clock frequency
(equals baud rate in MBaud)
CONDITIONS
VCC
MIN
TYP
Internal: SMCLK, ACLK
External: UCLK
Duty cycle = 50% ±10%
MAX
UNIT
fSYSTEM
MHz
1
MHz
MAX
UNIT
5.31 USCI (UART Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
tτ
(1)
TEST CONDITIONS
UART receive deglitch time (1)
VCC
MIN
2.2 V
50
TYP
600
3V
50
600
ns
Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are
correctly recognized, their duration should exceed the maximum specification of the deglitch time.
Specifications
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5.32 USCI (SPI Master Mode), Recommended Operating Conditions
PARAMETER
fUSCI
USCI input clock frequency
CONDITIONS
VCC
MIN
Internal: SMCLK, ACLK
Duty cycle = 50% ±10%
MAX
UNIT
fSYSTEM
MHz
MAX
UNIT
fSYSTEM
MHz
5.33 USCI (SPI Master Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
(see Figure 5-11 and Figure 5-12)
PARAMETER
fUSCI
USCI input clock frequency
TEST CONDITIONS
PMMCOREV = 0
tSU,MI
SOMI input data setup time
PMMCOREV = 3
PMMCOREV = 0
tHD,MI
SOMI input data hold time
PMMCOREV = 3
tVALID,MO
SIMO output data valid time (2)
(2)
(3)
30
1.8 V
55
3V
38
2.4 V
30
3V
25
1.8 V
0
3V
0
2.4 V
0
3V
0
ns
ns
UCLK edge to SIMO valid,
CL = 20 pF, PMMCOREV = 0
20
3V
18
UCLK edge to SIMO valid,
CL = 20 pF, PMMCOREV = 3
2.4 V
16
3V
15
SIMO output data hold time (3)
CL = 20 pF, PMMCOREV = 3
(1)
MIN
1.8 V
CL = 20 pF, PMMCOREV = 0
tHD,MO
VCC
SMCLK, ACLK
Duty cycle = 50% ±10%
1.8 V
ns
–10
3V
–8
2.4 V
–10
3V
–8
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(USCI) + tSU,SI(Slave), tSU,MI(USCI) + tVALID,SO(Slave)).
For the slave parameters tSU,SI(Slave) and tVALID,SO(Slave), refer to the SPI parameters of the attached slave.
Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. See the timing diagrams
in Figure 5-11 and Figure 5-12.
Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data
on the SIMO output can become invalid before the output changing clock edge observed on UCLK. See the timing diagrams in Figure 511 and Figure 5-12.
Specifications
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1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
tHD,MO
tVALID,MO
SIMO
Figure 5-11. SPI Master Mode, CKPH = 0
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
tHD,MO
tVALID,MO
SIMO
Figure 5-12. SPI Master Mode, CKPH = 1
Specifications
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5.34 USCI (SPI Slave Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
(see Figure 5-13 and Figure 5-14)
PARAMETER
TEST CONDITIONS
PMMCOREV = 0
tSTE,LEAD
STE lead time, STE low to clock
PMMCOREV = 3
PMMCOREV = 0
tSTE,LAG
STE lag time, Last clock to STE high
PMMCOREV = 3
PMMCOREV = 0
tSTE,ACC
STE access time, STE low to SOMI data out
PMMCOREV = 3
PMMCOREV = 0
STE disable time, STE high to SOMI high
impedance
tSTE,DIS
PMMCOREV = 3
SIMO input data setup time
PMMCOREV = 3
PMMCOREV = 0
tHD,SI
SIMO input data hold time
PMMCOREV = 3
tVALID,SO
tHD,SO
(1)
(2)
(3)
32
SOMI output data valid time (2)
SOMI output data hold time (3)
MIN
11
3V
8
2.4 V
7
3V
6
1.8 V
3
3V
3
2.4 V
3
3V
3
MAX
UNIT
ns
ns
1.8 V
66
3V
50
2.4 V
36
3V
30
1.8 V
30
3V
23
2.4 V
16
3V
PMMCOREV = 0
tSU,SI
VCC
1.8 V
ns
ns
13
1.8 V
5
3V
5
2.4 V
2
3V
2
1.8 V
5
3V
5
2.4 V
5
3V
5
ns
ns
UCLK edge to SOMI valid,
CL = 20 pF,
PMMCOREV = 0
1.8 V
76
3V
60
UCLK edge to SOMI valid,
CL = 20 pF,
PMMCOREV = 3
2.4 V
44
3V
40
CL = 20 pF,
PMMCOREV = 0
1.8 V
18
3V
12
CL = 20 pF,
PMMCOREV = 3
2.4 V
10
3V
8
ns
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(Master) + tSU,SI(USCI), tSU,MI(Master) + tVALID,SO(USCI)).
For the master parameters tSU,MI(Master) and tVALID,MO(Master), refer to the SPI parameters of the attached slave.
Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. See the timing diagrams
in Figure 5-13 and Figure 5-14.
Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. See the timing diagrams in Figure 5-13
and Figure 5-14.
Specifications
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tSTE,LEAD
tSTE,LAG
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tSU,SI
tLO/HI
tHD,SI
SIMO
tHD,SO
tVALID,SO
tSTE,ACC
tSTE,DIS
SOMI
Figure 5-13. SPI Slave Mode, CKPH = 0
tSTE,LAG
tSTE,LEAD
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tHD,SI
tSU,SI
SIMO
tSTE,ACC
tHD,MO
tVALID,SO
tSTE,DIS
SOMI
Figure 5-14. SPI Slave Mode, CKPH = 1
Specifications
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5.35 USCI (I2C Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5-15)
PARAMETER
TEST CONDITIONS
VCC
MIN
Internal: SMCLK, ACLK
External: UCLK
Duty cycle = 50% ±10%
MAX
UNIT
fSYSTEM
MHz
400
kHz
fUSCI
USCI input clock frequency
fSCL
SCL clock frequency
tHD,STA
Hold time (repeated) START
tSU,STA
Setup time for a repeated START
tHD,DAT
Data hold time
2.2 V, 3 V
0
ns
tSU,DAT
Data setup time
2.2 V, 3 V
250
ns
2.2 V, 3 V
fSCL ≤ 100 kHz
2.2 V, 3 V
fSCL > 100 kHz
fSCL ≤ 100 kHz
2.2 V, 3 V
fSCL > 100 kHz
fSCL ≤ 100 kHz
tSU,STO
Setup time for STOP
tSP
Pulse duration of spikes suppressed by input filter
2.2 V, 3 V
fSCL > 100 kHz
tSU,STA
tHD,STA
0
4.0
µs
0.6
4.7
µs
0.6
4.0
µs
0.6
2.2 V
50
600
3V
50
600
tHD,STA
ns
tBUF
SDA
tLOW
tHIGH
tSP
SCL
tSU,DAT
tSU,STO
tHD,DAT
Figure 5-15. I2C Mode Timing
34
Specifications
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5.36 12-Bit ADC, Power Supply and Input Range Conditions
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
AVCC
Analog supply voltage,
full performance
AVCC and DVCC are connected together,
AVSS and DVSS are connected together,
V(AVSS) = V(DVSS) = 0 V
V(Ax)
Analog input voltage range (2)
All ADC12 analog input pins Ax
IADC12_A
Operating supply current into
AVCC terminal (3)
fADC12CLK = 5.0 MHz, ADC12ON = 1,
REFON = 0, SHT0 = 0, SHT1 = 0, ADC12DIV = 0
2.2 V
125
155
3V
150
220
CI
Input capacitance
Only one terminal Ax can be selected at one time
2.2 V
20
25
pF
Input MUX ON resistance
0 V ≤ VAx ≤ AVCC
200
1900
Ω
RI
(1)
(2)
(3)
2.2
3.6
V
0
AVCC
V
10
µA
The leakage current is specified by the digital I/O input leakage.
The analog input voltage range must be within the selected reference voltage range VR+ to VR– for valid conversion results. If the
reference voltage is supplied by an external source or if the internal reference voltage is used and REFOUT = 1, then decoupling
capacitors are required. See Section 5.40 and Section 5.41.
The internal reference supply current is not included in current consumption parameter IADC12_A.
5.37 12-Bit ADC, Timing Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fADC12CLK
fADC12OSC
tCONVERT
tSample
(1)
(2)
(3)
Internal ADC12
oscillator (1)
Conversion time
Sampling time
VCC
MIN
TYP
MAX
UNIT
For specified performance of ADC12 linearity
parameters
TEST CONDITIONS
2.2 V, 3 V
0.45
4.8
5.4
MHz
ADC12DIV = 0, fADC12CLK = fADC12OSC
2.2 V, 3 V
4.2
4.8
5.4
MHz
REFON = 0, Internal oscillator,
fADC12OSC = 4.2 MHz to 5.4 MHz
2.2 V, 3 V
2.4
µs
External fADC12CLK from ACLK, MCLK or SMCLK,
ADC12SSEL ≠ 0
RS = 400 Ω, RI = 1000 Ω, CI = 20 pF,
τ = [RS + RI] × CI (3)
3.1
(2)
2.2 V, 3 V
1000
ns
The ADC12OSC is sourced directly from MODOSC inside the UCS.
13 × ADC12DIV × 1/fADC12CLK
Approximately 10 Tau (τ) are needed to get an error of less than ±0.5 LSB:
tSample = ln(2n+1) x (RS + RI) × CI + 800 ns, where n = ADC resolution = 12, RS = external source resistance
5.38 12-Bit ADC, Linearity Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
EI
Integral linearity error
(INL)
1.4 V ≤ (VeREF+ – VREF–/VeREF–)min ≤ 1.6 V
ED
Differential
linearity error (DNL)
(VeREF+ – VREF–/VeREF–)min ≤ (VeREF+ – VREF–/VeREF–),
CVREF+ = 20 pF
2.2 V, 3 V
EO
Offset error
(VeREF+ – VREF–/VeREF–)min ≤ (VeREF+ – VREF–/VeREF–),
Internal impedance of source RS < 100 Ω, CVREF+ = 20 pF
2.2 V, 3 V
EG
Gain error
(VeREF+ – VREF–/VeREF–)min ≤ (VeREF+ – VREF–/VeREF–),
CVREF+ = 20 pF
ET
Total unadjusted error
(VeREF+ – VREF–/VeREF–)min ≤ (VeREF+ – VREF–/VeREF–),
CVREF+ = 20 pF
1.6 V < (VeREF+ – VREF–/VeREF–)min ≤ VAVCC
MIN
TYP
MAX
±2
2.2 V, 3 V
±1.7
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LSB
±1.0
LSB
±1.0
±2.0
LSB
2.2 V, 3 V
±1.0
±2.0
LSB
2.2 V, 3 V
±1.4
±3.5
LSB
Specifications
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UNIT
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5.39 12-Bit ADC, Temperature Sensor and Built-In VMID (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VSENSOR
See
TEST CONDITIONS
ADC12ON = 1, INCH = 0Ah,
TA = 0°C
(2)
TCSENSOR
tSENSOR(sample)
ADC12ON = 1, INCH = 0Ah
Sample time required if
channel 10 is selected (3)
ADC12ON = 1, INCH = 0Ah,
Error of conversion result ≤ 1 LSB
AVCC divider at channel 11,
VAVCC factor
ADC12ON = 1, INCH = 0Bh
AVCC divider at channel 11
ADC12ON = 1, INCH = 0Bh
Sample time required if
channel 11 is selected (4)
ADC12ON = 1, INCH = 0Bh,
Error of conversion result ≤ 1 LSB
VMID
tVMID(sample)
(1)
(2)
(3)
(4)
VCC
MIN
TYP
2.2 V
680
3V
680
2.2 V
2.25
3V
2.25
2.2 V
100
3V
100
MAX
UNIT
mV
mV/°C
µs
0.48
0.5
0.52 VAVCC
2.2 V
1.06
1.1
1.14
3V
1.44
1.5
1.56
2.2 V, 3 V
1000
V
ns
The temperature sensor is provided by the REF module. See the REF module parametric, IREF+, regarding the current consumption of
the temperature sensor.
The temperature sensor offset can be significant. TI recommends a single-point calibration to minimize the offset error of the built-in
temperature sensor. The TLV structure contains calibration values for 30°C ±3°C and 85°C ±3°C for each of the available reference
voltage levels. The sensor voltage can be computed as VSENSE = TCSENSOR × (Temperature,°C) + VSENSOR, where TCSENSOR and
VSENSOR can be computed from the calibration values for higher accuracy. See also the MSP430x5xx and MSP430x6xx Family User's
Guide (SLAU208).
The typical equivalent impedance of the sensor is 51 kΩ. The sample time required includes the sensor-on time tSENSOR(on).
The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.
Typical Temperature Sensor Voltage (mV)
1000
950
900
850
800
750
700
650
600
550
500
-40 -30 -20 -10 0
10 20 30 40 50 60 70 80
Ambient Temperature (°C)
Figure 5-16. Typical Temperature Sensor Voltage
36
Specifications
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5.40 REF, External Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
(2)
VCC
MIN
TYP
MAX
UNIT
VeREF+
Positive external reference voltage input
VeREF+ > VREF–/VeREF–
1.4
AVCC
V
VREF–/VeREF–
Negative external reference voltage input
VeREF+ > VREF–/VeREF– (3)
0
1.2
V
(VeREF+ –
VREF–/VeREF–)
Differential external reference voltage
input
(4)
1.4
AVCC
V
IVeREF+,
IVREF–/VeREF–
CVREF+/(1)
(2)
(3)
(4)
(5)
VeREF+ > VREF–/VeREF–
Static input current
Capacitance at VREF+ or VREF- terminal
1.4 V ≤ VeREF+ ≤ VAVCC ,
VeREF– = 0 V
fADC12CLK = 5
MHz,ADC12SHTx = 1h,
Conversion rate 200 ksps
2.2 V, 3 V
1.4 V ≤ VeREF+ ≤ VAVCC ,
VeREF– = 0 V
fADC12CLK = 5
MHz,ADC12SHTx = 8h,
Conversion rate 20 ksps
2.2 V, 3 V
See
±8.5
±26
µA
±1
(5)
10
µF
The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance, Ci, is also
the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the
recommendations on analog-source impedance to allow the charge to settle for 12-bit accuracy.
The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced
accuracy requirements.
The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced
accuracy requirements.
The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with
reduced accuracy requirements.
Two decoupling capacitors, 10 µF and 100 nF, should be connected to VREF to decouple the dynamic current required for an external
reference source if it is used for the ADC12_A. See also the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208).
5.41 REF, Built-In Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
VREF+
AVCC(min)
Positive built-in reference
voltage output
AVCC minimum voltage,
Positive built-in reference
active
IREF+
Operating supply current into
AVCC terminal (2) (3)
IL(VREF+)
Load-current regulation,
VREF+ terminal (4)
(1)
(2)
(3)
(4)
TEST CONDITIONS
TYP
MAX
3V
2.50
±1.5%
REFVSEL = {1} for 2.0 V,
REFON = REFOUT = 1, IVREF+= 0 A
3V
1.98
±1.5%
REFVSEL = {0} for 1.5 V,
REFON = REFOUT = 1, IVREF+= 0 A
2.2 V, 3
V
1.49
±1.5%
REFVSEL = {2} for 2.5 V,
REFON = REFOUT = 1, IVREF+= 0 A
VCC
MIN
REFVSEL = {0} for 1.5 V, reduced
performance
1.8
REFVSEL = {0} for 1.5 V
2.2
REFVSEL = {1} for 2.0 V
2.3
REFVSEL = {2} for 2.5 V
2.8
UNIT
V
V
REFON = 1, REFOUT = 0, REFBURST = 0
3V
100
140
µA
REFON = 1, REFOUT = 1, REFBURST = 0
3V
0.9
1.5
mA
REFVSEL = {0, 1, 2},
IVREF+ = +10 µA/–1000 µA,
AVCC = AVCC (min) for each reference level,
REFVSEL = (0, 1, 2}, REFON = REFOUT = 1
2500
µV/mA
The reference is supplied to the ADC by the REF module and is buffered locally inside the ADC. The ADC uses two internal buffers, one
smaller and one larger for driving the VREF+ terminal. When REFOUT = 1, the reference is available at the VREF+ terminal, as well as,
used as the reference for the conversion and utilizes the larger buffer. When REFOUT = 0, the reference is only used as the reference
for the conversion and utilizes the smaller buffer.
The internal reference current is supplied from terminal AVCC. Consumption is independent of the ADC12ON control bit, unless a
conversion is active. REFOUT = 0 represents the current contribution of the smaller buffer. REFOUT = 1 represents the current
contribution of the larger buffer without external load.
The temperature sensor is provided by the REF module. Its current is supplied from terminal AVCC and is equivalent to IREF+ with
REFON =1 and REFOUT = 0.
Contribution only due to the reference and buffer including package. This does not include resistance due to other factors such as PCB
traces.
Specifications
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REF, Built-In Reference (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
MAX
UNIT
100
pF
30
50
ppm/°C
AVCC = AVCC (min) - AVCC(max),
TA = 25°C,
REFVSEL = (0, 1, 2}, REFON = 1,
REFOUT = 0 or 1
120
300
µV/V
AVCC = AVCC (min) - AVCC(max),
TA = 25°C,
f = 1 kHz, ΔVpp = 100 mV,
REFVSEL = (0, 1, 2}, REFON = 1,
REFOUT = 0 or 1
6.4
AVCC = AVCC (min) - AVCC(max),
REFVSEL = (0, 1, 2}, REFOUT = 0,
REFON = 0 → 1
75
CVREF+/-
Capacitance at VREF+ and
VREF- terminals
REFON = REFOUT = 1
TCREF+
Temperature coefficient of
built-in reference (6)
IVREF+ = 0 A,
REFVSEL = (0, 1, 2}, REFON = 1,
REFOUT = 0 or 1
Power supply rejection ratio
PSRR_DC
(DC)
Power supply rejection ratio
(AC)
PSRR_AC
Settling time of reference
voltage (7)
tSETTLE
(5)
(6)
(7)
VCC
(5)
MIN
TYP
20
mV/V
µs
AVCC = AVCC (min) - AVCC(max),
CVREF = CVREF(max),
REFVSEL = (0, 1, 2}, REFOUT = 1,
REFON = 0 → 1
75
Two decoupling capacitors, 10 µF and 100 nF, should be connected to VREF to decouple the dynamic current required for an external
reference source if it is used for the ADC12_A. See also the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208).
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C)/(85°C – (–40°C)).
The condition is that the error in a conversion started after tREFON is less than ±0.5 LSB. The settling time depends on the external
capacitive load when REFOUT = 1.
5.42 Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
DVCC(PGM/ERASE) Program and erase supply voltage
MIN
TYP
1.8
MAX
3.6
UNIT
V
IPGM
Average supply current from DVCC during program
3
5
mA
IERASE
Average supply current from DVCC during erase
6
11
mA
IMERASE, IBANK
Average supply current from DVCC during mass erase or bank
erase
6
11
mA
tCPT
Cumulative program time
See
(1)
tRetention
16
104
Program and erase endurance
Data retention duration
TJ = 25°C
105
ms
cycles
100
years
Word or byte program time
See
(2)
64
85
µs
0
Block program time for first byte or word
See
(2)
49
65
µs
tBlock,
1–(N–1)
Block program time for each additional byte or word, except for last
byte or word
See
(2)
37
49
µs
tBlock,
N
Block program time for last byte or word
See
(2)
55
73
µs
See
(2)
23
32
ms
0
1
MHz
tWord
tBlock,
tErase
Erase time for segment, mass erase, and bank erase when
available
fMCLK,MRG
MCLK frequency in marginal read mode
(FCTL4.MRG0 = 1 or FCTL4. MRG1 = 1)
(1)
(2)
38
The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming
methods: individual word or byte write and block write modes.
These values are hardwired into the state machine of the flash controller.
Specifications
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5.43 JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
MIN
TYP
MAX
UNIT
fSBW
Spy-Bi-Wire input frequency
2.2 V, 3 V
0
20
MHz
tSBW,Low
Spy-Bi-Wire low clock pulse length
2.2 V, 3 V
0.025
15
µs
tSBW, En
Spy-Bi-Wire enable time (TEST high to acceptance of first clock edge) (1)
2.2 V, 3 V
1
µs
tSBW,Rst
Spy-Bi-Wire return to normal operation time
fTCK
TCK input frequency, 4-wire JTAG (2)
Rinternal
Internal pulldown resistance on TEST
(1)
(2)
15
100
2.2 V
0
5
MHz
3V
0
10
MHz
2.2 V, 3 V
45
80
kΩ
60
µs
Tools that access the Spy-Bi-Wire interface must wait for the tSBW,En time after pulling the TEST/SBWTCK pin high before applying the
first SBWTCK clock edge.
fTCK may be restricted to meet the timing requirements of the module selected.
Specifications
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6 Detailed Description
6.1
CPU
The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All
operations, other than program-flow instructions, are performed as register operations in conjunction with
seven addressing modes for source operand and four addressing modes for destination operand.
The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-toregister operation execution time is one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as program counter, stack pointer, status register, and
constant generator, respectively. The remaining registers are general-purpose registers.
Peripherals are connected to the CPU using data, address, and control buses, and can be handled with all
instructions.
The instruction set consists of the original 51 instructions with three formats and seven address modes
and additional instructions for the expanded address range. Each instruction can operate on word and
byte data.
Program Counter
PC/R0
Stack Pointer
SP/R1
Status Register
Constant Generator
40
SR/CG1/R2
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
General-Purpose Register
R10
General-Purpose Register
R11
General-Purpose Register
R12
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
Detailed Description
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6.2
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Operating Modes
The MSP430 has one active mode and six software selectable low-power modes of operation. An interrupt
event can wake up the device from any of the low-power modes, service the request, and restore back to
the low-power mode on return from the interrupt program.
The following operating modes can be configured by software:
• Active mode (AM)
– All clocks are active
• Low-power mode 0 (LPM0)
– CPU is disabled
– ACLK and SMCLK remain active
– MCLK is disabled
– FLL loop control remains active
• Low-power mode 1 (LPM1)
– CPU is disabled
– FLL loop control is disabled
– ACLK and SMCLK remain active
– MCLK is disabled
• Low-power mode 2 (LPM2)
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO DC generator remains enabled
– ACLK remains active
• Low-power mode 3 (LPM3)
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO DC generator is disabled
– ACLK remains active
• Low-power mode 4 (LPM4)
– CPU is disabled
– ACLK is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO DC generator is disabled
– Crystal oscillator is stopped
– Complete data retention
• Low-power mode 4.5 (LPM4.5)
– Internal regulator disabled
– No data retention
– Wake-up signal from RST, digital I/O
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Interrupt Vector Addresses
The interrupt vectors and the power-up start address are in the address range 0FFFFh to 0FF80h. The
vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.
Table 6-1. Interrupt Sources, Flags, and Vectors
SYSTEM
INTERRUPT
WORD
ADDRESS
PRIORITY
Reset
0FFFEh
63, highest
SVMLIFG, SVMHIFG, DLYLIFG, DLYHIFG,
VLRLIFG, VLRHIFG, VMAIFG, JMBNIFG,
JMBOUTIFG (SYSSNIV) (1)
(Non)maskable
0FFFCh
62
User NMI
NMI
Oscillator Fault
Flash Memory Access Violation
NMIIFG, OFIFG, ACCVIFG (SYSUNIV) (1)
(Non)maskable
0FFFAh
61
TB0
TBCCR0 CCIFG0
Maskable
0FFF8h
60
INTERRUPT SOURCE
System Reset
Power-Up
External Reset
Watchdog Time-out, Password
Violation
Flash Memory Password Violation
PMM Password Violation
System NMI
PMM
Vacant Memory Access
JTAG Mailbox
INTERRUPT FLAG
WDTIFG, KEYV (SYSRSTIV) (1)
(2)
(2)
(3)
TB0
TBCCR1 CCIFG1 ... TBCCR6 CCIFG6,
TBIFG (TBIV) (1) (3)
Maskable
0FFF6h
59
Watchdog Timer_A Interval Timer
Mode
WDTIFG
Maskable
0FFF4h
58
Maskable
0FFF2h
57
Maskable
0FFF0h
56
Maskable
0FFEEh
55
USCI_A0 Receive or Transmit
USCI_B0 Receive or Transmit
ADC12_A
TA0
TA0
USCI_A2 Receive or Transmit
USCI_B2 Receive or Transmit
DMA
TA0CCR0 CCIFG0
(3)
(3)
Maskable
0FFECh
54
TA0CCR1 CCIFG1 ... TA0CCR4 CCIFG4,
TA0IFG (TA0IV) (1) (3)
Maskable
0FFEAh
53
UCA2RXIFG, UCA2TXIFG (UCA2IV) (1)
Maskable
0FFE8h
52
Maskable
0FFE6h
51
Maskable
0FFE4h
50
Maskable
0FFE2h
49
Maskable
0FFE0h
48
UCB2RXIFG, UCB2TXIFG (UCB2IV)
(3)
(1) (3)
DMA0IFG, DMA1IFG, DMA2IFG (DMAIV) (1)
TA1
TA1CCR1 CCIFG1 ... TA1CCR2 CCIFG2,
TA1IFG (TA1IV) (1) (3)
P1IFG.0 to P1IFG.7 (P1IV)
(3)
(1) (3)
Maskable
0FFDEh
47
(3)
Maskable
0FFDCh
46
(1) (3)
UCA1RXIFG, UCA1TXIFG (UCA1IV) (1)
USCI_B1 Receive or Transmit
UCB1RXIFG, UCB1TXIFG (UCB1IV)
Maskable
0FFDAh
45
USCI_A3 Receive or Transmit
UCA3RXIFG, UCA3TXIFG (UCA3IV) (1)
(3)
Maskable
0FFD8h
44
USCI_B3 Receive or Transmit
UCB3RXIFG, UCB3TXIFG (UCB3IV) (1)
(3)
Maskable
0FFD6h
43
Maskable
0FFD4h
42
Maskable
0FFD2h
41
0FFD0h
40
I/O Port P2
RTC_A
Reserved
42
ADC12IFG0 ... ADC12IFG15 (ADC12IV) (1)
TA1CCR0 CCIFG0 (3)
I/O Port P1
(3)
(4)
UCB0RXIFG, UCB0TXIFG (UCAB0IV)
(3)
(1) (3)
TA1
USCI_A1 Receive or Transmit
(1)
(2)
UCA0RXIFG, UCA0TXIFG (UCA0IV) (1)
P2IFG.0 to P2IFG.7 (P2IV)
(1) (3)
RTCRDYIFG, RTCTEVIFG, RTCAIFG,
RT0PSIFG, RT1PSIFG (RTCIV) (1) (3)
Reserved
(4)
⋮
⋮
0FF80h
0, lowest
Multiple source flags
A reset is generated if the CPU tries to fetch instructions from within peripheral space or vacant memory space.
(Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable cannot disable it.
Interrupt flags are located in the module.
Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To maintain
compatibility with other devices, TI recommends reserving these locations.
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Memory Organization
Table 6-2 lists the memory locations and sizes for the device.
Table 6-2. Memory Organization
MSP430BT5190
Memory (flash)
Main: interrupt vector
Main: code memory
Main: code memory
Total Size
Flash
Flash
256KB
00FFFFh–00FF80h
045BFFh–005C00h
Bank D
64KB
03FFFFh–030000h
Bank C
64KB
02FFFFh–020000h
Bank B
64KB
01FFFFh–010000h
Bank A
64KB
045BFFh–040000h
00FFFFh–005C00h
Size
Sector 3
4KB
005BFFh–004C00h
Sector 2
4KB
004BFFh–003C00h
Sector 1
4KB
003BFFh–002C00h
Sector 0
4KB
002BFFh–001C00h
Info A
128 B
0019FFh–001980h
Info B
128 B
00197Fh–001900h
Info C
128 B
0018FFh–001880h
Info D
128 B
00187Fh–001800h
BSL 3
512 B
0017FFh–001600h
BSL 2
512 B
0015FFh–001400h
BSL 1
512 B
0013FFh–001200h
BSL 0
512 B
0011FFh–001000h
Size
4KB
000FFFh–000000h
RAM
Information memory (flash)
Bootstrap loader (BSL) memory (Flash)
Peripherals
16KB
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Bootstrap Loader (BSL)
The BSL enables users to program the flash memory or RAM using a UART serial interface. Access to the
device memory through the BSL is protected by an user-defined password. Usage of the BSL requires
four pins as shown in Table 6-3. BSL entry requires a specific entry sequence on the RST/NMI/SBWTDIO
and TEST/SBWTCK pins. For further details on interfacing to development tools and device programmers,
see the MSP430 Hardware Tools User's Guide (SLAU278). For a complete description of the features of
the BSL and its implementation, see the MSP430 Programming Via the Bootstrap Loader User's Guide
(SLAU319).
Table 6-3. BSL Pin Requirements and Functions
6.6
6.6.1
DEVICE SIGNAL
BSL FUNCTION
RST/NMI/SBWTDIO
Entry sequence signal
TEST/SBWTCK
Entry sequence signal
P1.1
Data transmit
P1.2
Data receive
VCC
Power supply
VSS
Ground supply
JTAG Operation
JTAG Standard Interface
The MSP430 family supports the standard JTAG interface which requires four signals for sending and
receiving data. The JTAG signals are shared with general-purpose I/O. The TEST/SBWTCK pin is used to
enable the JTAG signals. In addition to these signals, the RST/NMI/SBWTDIO is required to interface with
MSP430 development tools and device programmers. The JTAG pin requirements are shown in Table 64. For further details on interfacing to development tools and device programmers, see the MSP430
Hardware Tools User's Guide (SLAU278). For a complete description of the features of the JTAG interface
and its implementation, see MSP430 Programming Via the JTAG Interface (SLAU320).
Table 6-4. JTAG Pin Requirements and Functions
44
DEVICE SIGNAL
DIRECTION
FUNCTION
PJ.3/TCK
IN
JTAG clock input
PJ.2/TMS
IN
JTAG state control
PJ.1/TDI/TCLK
IN
JTAG data input; TCLK input
PJ.0/TDO
OUT
JTAG data output
TEST/SBWTCK
IN
Enable JTAG pins
RST/NMI/SBWTDIO
IN
External reset
VCC
Power supply
VSS
Ground supply
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Spy-Bi-Wire Interface
In addition to the standard JTAG interface, the MSP430 family supports the two wire Spy-Bi-Wire
interface. Spy-Bi-Wire can be used to interface with MSP430 development tools and device programmers.
The Spy-Bi-Wire interface pin requirements are shown in Table 6-5. For further details on interfacing to
development tools and device programmers, see the MSP430 Hardware Tools User's Guide (SLAU278).
For a complete description of the features of the JTAG interface and its implementation, see MSP430
Programming Via the JTAG Interface (SLAU320).
Table 6-5. Spy-Bi-Wire Pin Requirements and Functions
6.7
DEVICE SIGNAL
DIRECTION
FUNCTION
TEST/SBWTCK
IN
Spy-Bi-Wire clock input
RST/NMI/SBWTDIO
IN, OUT
Spy-Bi-Wire data input/output
VCC
Power supply
VSS
Ground supply
Flash Memory
The flash memory can be programmed through the JTAG port, Spy-Bi-Wire (SBW), the BSL, or in-system
by the CPU. The CPU can perform single-byte, single-word, and long-word writes to the flash memory.
Features of the flash memory include:
• Flash memory has n segments of main memory and four segments of information memory (A to D) of
128 bytes each. Each segment in main memory is 512 bytes in size.
• Segments 0 to n may be erased in one step, or each segment may be individually erased.
• Segments A to D can be erased individually. Segments A to D are also called information memory.
• Segment A can be locked separately.
6.8
RAM
The RAM is made up of n sectors. Each sector can be completely powered down to save leakage;
however, all data is lost. Features of the RAM include:
• RAM has n sectors. The size of a sector can be found in Memory Organization.
• Each sector 0 to n can be complete disabled; however, data retention is lost.
• Each sector 0 to n automatically enters low-power retention mode when possible.
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Peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using
all instructions. For complete module descriptions, see the MSP430x5xx and MSP430x6xx Family User's
Guide (SLAU208).
6.9.1
Digital I/O
There are up to ten 8-bit I/O ports implemented: For 100-pin options, P1 through P10 are complete. P11
contains three individual I/O ports. For 80-pin options, P1 through P7 are complete. P8 contains seven
individual I/O ports. P9 through P11 do not exist. Port PJ contains four individual I/O ports, common to all
devices.
• All individual I/O bits are independently programmable.
• Any combination of input, output, and interrupt conditions is possible.
• Pullup or pulldown on all ports is programmable.
• Drive strength on all ports is programmable.
• Edge-selectable interrupt and LPM4.5 wakeup input capability is available for all bits of ports P1 and
P2.
• Read and write access to port-control registers is supported by all instructions.
• Ports can be accessed byte-wise (P1 through P11) or word-wise in pairs (PA through PF).
6.9.2
Oscillator and System Clock
The clock system is supported by the Unified Clock System (UCS) module that includes support for a 32kHz watch crystal oscillator (XT1 LF mode), an internal very-low-power low-frequency oscillator (VLO), an
internal trimmed low-frequency oscillator (REFO), an integrated internal digitally controlled oscillator
(DCO), and a high-frequency crystal oscillator (XT1 HF mode or XT2). The UCS module is designed to
meet the requirements of both low system cost and low power consumption. The UCS module features
digital frequency locked loop (FLL) hardware that, in conjunction with a digital modulator, stabilizes the
DCO frequency to a programmable multiple of the selected FLL reference frequency. The internal DCO
provides a fast turnon clock source and stabilizes in less than 5 µs. The UCS module provides the
following clock signals:
• Auxiliary clock (ACLK), sourced from a 32-kHz watch crystal, a high-frequency crystal, the internal lowfrequency oscillator (VLO), the trimmed low-frequency oscillator (REFO), or the internal digitally
controlled oscillator DCO.
• Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources made
available to ACLK.
• Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be
sourced by same sources made available to ACLK.
• ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, ACLK/8, ACLK/16, ACLK/32.
6.9.3
Power-Management Module (PMM)
The PMM includes an integrated voltage regulator that supplies the core voltage to the device and
contains programmable output levels to provide for power optimization. The PMM also includes supply
voltage supervisor (SVS) and supply voltage monitoring (SVM) circuitry, as well as brownout protection.
The brownout circuit is implemented to provide the proper internal reset signal to the device during poweron and power-off. The SVS and SVM circuitry detects if the supply voltage drops below a user-selectable
level and supports both supply voltage supervision (the device is automatically reset) and supply voltage
monitoring (the device is not automatically reset). SVS and SVM circuitry is available on the primary
supply and core supply.
46
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Hardware Multiplier (MPY)
The multiplication operation is supported by a dedicated peripheral module. The module performs
operations with 32-, 24-, 16-, and 8-bit operands. The module supports signed and unsigned multiplication
as well as signed and unsigned multiply-and-accumulate operations.
6.9.5
Real-Time Clock (RTC_A)
The RTC_A module can be used as a general-purpose 32-bit counter (counter mode) or as an integrated
real-time clock (RTC) (calendar mode). In counter mode, the RTC_A also includes two independent 8-bit
timers that can be cascaded to form a 16-bit timer/counter. Both timers can be read and written by
software. Calendar mode integrates an internal calendar which compensates for months with less than
31 days and includes leap year correction. The RTC_A also supports flexible alarm functions and offsetcalibration hardware.
6.9.6
Watchdog Timer (WDT_A)
The primary function of the WDT_A module is to perform a controlled system restart after a software
problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog function
is not needed in an application, the module can be configured as an interval timer and can generate
interrupts at selected time intervals.
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System Module (SYS)
The SYS module handles many of the system functions within the device. These include power-on reset
and power-up clear handling, NMI source selection and management, reset interrupt vector generators,
bootstrap loader entry mechanisms, and configuration management (device descriptors). It also includes a
data exchange mechanism through JTAG called a JTAG mailbox that can be used in the application.
Table 6-6. System Module Interrupt Vector Registers
INTERRUPT VECTOR
REGISTER
ADDRESS
INTERRUPT EVENT
VALUE
SYSRSTIV, System Reset
019Eh
No interrupt pending
00h
Brownout (BOR)
02h
RST/NMI (POR)
04h
PMMSWBOR (BOR)
06h
SYSSNIV, System NMI
SYSUNIV, User NMI
48
019Ch
019Ah
Wakeup from LPMx.5
08h
Security violation (BOR)
0Ah
SVSL (POR)
0Ch
SVSH (POR)
0Eh
SVML_OVP (POR)
10h
SVMH_OVP (POR)
12h
PMMSWPOR (POR)
14h
WDT time-out (PUC)
16h
WDT password violation (PUC)
18h
KEYV flash password violation (PUC)
1Ah
Reserved
1Ch
Peripheral area fetch (PUC)
1Eh
PMM password violation (PUC)
20h
Reserved
22h to 3Eh
No interrupt pending
00h
SVMLIFG
02h
SVMHIFG
04h
SVSMLDLYIFG
06h
SVSMHDLYIFG
08h
VMAIFG
0Ah
JMBINIFG
0Ch
JMBOUTIFG
0Eh
SVMLVLRIFG
10h
SVMHVLRIFG
12h
Reserved
14h to 1Eh
No interrupt pending
00h
NMIIFG
02h
OFIFG
04h
ACCVIFG
06h
Reserved
08h
Reserved
0Ah to 1Eh
Detailed Description
PRIORITY
Highest
Lowest
Highest
Lowest
Highest
Lowest
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DMA Controller
The DMA controller allows movement of data from one memory address to another without CPU
intervention. For example, the DMA controller can be used to move data from the ADC12_A conversion
memory to RAM. Using the DMA controller can increase the throughput of peripheral modules. The DMA
controller reduces system power consumption by allowing the CPU to remain in sleep mode, without
having to awaken to move data to or from a peripheral.
Table 6-7. DMA Trigger Assignments (1)
TRIGGER
(1)
CHANNEL
0
1
2
0
DMAREQ
DMAREQ
DMAREQ
1
TA0CCR0 CCIFG
TA0CCR0 CCIFG
TA0CCR0 CCIFG
2
TA0CCR2 CCIFG
TA0CCR2 CCIFG
TA0CCR2 CCIFG
3
TA1CCR0 CCIFG
TA1CCR0 CCIFG
TA1CCR0 CCIFG
4
TA1CCR2 CCIFG
TA1CCR2 CCIFG
TA1CCR2 CCIFG
5
TB0CCR0 CCIFG
TB0CCR0 CCIFG
TB0CCR0 CCIFG
6
TB0CCR2 CCIFG
TB0CCR2 CCIFG
TB0CCR2 CCIFG
7
Reserved
Reserved
Reserved
8
Reserved
Reserved
Reserved
9
Reserved
Reserved
Reserved
10
Reserved
Reserved
Reserved
11
Reserved
Reserved
Reserved
12
Reserved
Reserved
Reserved
13
Reserved
Reserved
Reserved
14
Reserved
Reserved
Reserved
15
Reserved
Reserved
Reserved
16
UCA0RXIFG
UCA0RXIFG
UCA0RXIFG
17
UCA0TXIFG
UCA0TXIFG
UCA0TXIFG
18
UCB0RXIFG
UCB0RXIFG
UCB0RXIFG
19
UCB0TXIFG
UCB0TXIFG
UCB0TXIFG
20
UCA1RXIFG
UCA1RXIFG
UCA1RXIFG
21
UCA1TXIFG
UCA1TXIFG
UCA1TXIFG
22
UCB1RXIFG
UCB1RXIFG
UCB1RXIFG
23
UCB1TXIFG
UCB1TXIFG
UCB1TXIFG
24
ADC12IFGx
ADC12IFGx
ADC12IFGx
25
Reserved
Reserved
Reserved
26
Reserved
Reserved
Reserved
27
Reserved
Reserved
Reserved
28
Reserved
Reserved
Reserved
29
MPY ready
MPY ready
MPY ready
30
DMA2IFG
DMA0IFG
DMA1IFG
31
DMAE0
DMAE0
DMAE0
Reserved DMA triggers may be used by other devices in the family. Reserved DMA triggers do not
cause any DMA trigger event when selected.
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Universal Serial Communication Interface (USCI)
The USCI modules are used for serial data communication. The USCI module supports synchronous
communication protocols such as SPI (3-pin or 4-pin) and I2C, and asynchronous communication
protocols such as UART, enhanced UART with automatic baud-rate detection, and IrDA. Each USCI
module contains two portions, A and B.
The USCI_An module provides support for SPI (3-pin or 4-pin), UART, enhanced UART, or IrDA.
The USCI_Bn module provides support for SPI (3-pin or 4-pin) or I2C.
The MSP430BT5190 includes four complete USCI modules (n = 0 to 3).
6.9.10 TA0
TA0 is a 16-bit timer/counter (Timer_A type) with five capture/compare registers. TA0 can support multiple
capture/compare registers, PWM outputs, and interval timing. It also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the
capture/compare registers.
Table 6-8. TA0 Signal Connections
INPUT PIN
NUMBER
PZ, ZQW
17, H1-P1.0
DEVICE INPUT
SIGNAL
MODULE
INPUT SIGNAL
TA0CLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
17, H1-P1.0
TA0CLK
TACLK
18, H4-P1.1
TA0.0
CCI0A
57, H9-P8.0
TA0.0
CCI0B
DVSS
50
GND
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
OUTPUT PIN NUMBER
PZ, ZQW
18, H4-P1.1
57, H9-P8.0
CCR0
TA0
TA0.0
ADC12 (internal)
ADC12SHSx = {1}
DVCC
VCC
19, J4-P1.2
TA0.1
CCI1A
19, J4-P1.2
58, H11-P8.1
TA0.1
CCI1B
58, H11-P8.1
DVSS
GND
CCR1
TA1
TA0.1
DVCC
VCC
20, J1-P1.3
TA0.2
CCI2A
20, J1-P1.3
59, H12-P8.2
TA0.2
CCI2B
59, H12-P8.2
DVSS
GND
CCR2
TA2
TA0.2
DVCC
VCC
21, J2-P1.4
TA0.3
CCI3A
60, G9-P8.3
TA0.3
CCI3B
DVSS
GND
DVCC
VCC
22, K1-P1.5
TA0.4
CCI4A
22, K1-P1.5
61, G11-P8.4
TA0.4
CCI4B
61, G11-P8.4
DVSS
GND
DVCC
VCC
21, J2-P1.4
CCR3
CCR4
TA3
TA4
Detailed Description
TA0.3
TA0.4
60, G9-P8.3
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6.9.11 TA1
TA1 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. TA1 can support
multiple capture/compare registers, PWM outputs, and interval timing. It also has extensive interrupt
capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the
capture/compare registers.
Table 6-9. TA1 Signal Connections
INPUT PIN
NUMBER
PZ, ZQW
25, M1-P2.0
DEVICE INPUT
SIGNAL
MODULE INPUT
SIGNAL
TA1CLK
TACLK
MODULE BLOCK
MODULE
DEVICE OUTPUT
OUTPUT SIGNAL
SIGNAL
OUTPUT PIN
NUMBER
PZ, ZQW
ACLK
ACLK
SMCLK
SMCLK
25, M1-P2.0
TA1CLK
TACLK
26, L2-P2.1
TA1.0
CCI0A
26, L2-P2.1
65, F11-P8.5
TA1.0
CCI0B
65, F11-P8.5
DVSS
GND
Timer
CCR0
NA
TA0
NA
TA1.0
DVCC
VCC
27, M2-P2.2
TA1.1
CCI1A
27, M2-P2.2
66, E11-P8.6
TA1.1
CCI1B
66, E11-P8.6
DVSS
GND
DVCC
VCC
28, L3-P2.3
TA1.2
CCI2A
56, J12-P7.3
TA1.2
CCI2B
DVSS
GND
DVCC
VCC
CCR1
TA1
TA1.1
28, L3-P2.3
CCR2
TA2
TA1.2
56, J12-P7.3
Detailed Description
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6.9.12 TB0
TB0 is a 16-bit timer/counter (Timer_B type) with seven capture/compare registers. TB0 can support
multiple capture/compare registers, PWM outputs, and interval timing. It also has extensive interrupt
capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the
capture/compare registers.
Table 6-10. TB0 Signal Connections
INPUT PIN
NUMBER
PZ, ZQW
50, M12-P4.7
MODULE
INPUT SIGNAL
TB0CLK
TBCLK
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
OUTPUT PIN NUMBER
PZ, ZQW
ACLK
ACLK
SMCLK
SMCLK
50, M12-P4.7
TB0CLK
TBCLK
43, J8-P4.0
TB0.0
CCI0A
43, J8-P4.0
TB0.0
CCI0B
ADC12 (internal)
ADC12SHSx = {2}
DVSS
GND
43, J8-P4.0
DVCC
VCC
44, M9-P4.1
TB0.1
CCI1A
44, M9-P4.1
TB0.1
CCI1B
DVSS
GND
DVCC
VCC
45, L9-P4.2
TB0.2
CCI2A
45, L9-P4.2
TB0.2
CCI2B
DVSS
GND
DVCC
VCC
46, L10-P4.3
TB0.3
CCI3A
46, L10-P4.3
TB0.3
CCI3B
DVSS
GND
DVCC
VCC
47, M10-P4.4
TB0.4
CCI4A
47, M10-P4.4
TB0.4
CCI4B
DVSS
GND
DVCC
VCC
48, L11-P4.5
TB0.5
CCI5A
48, L11-P4.5
TB0.5
CCI5B
DVSS
GND
DVCC
VCC
49, M11-P4.6
52
DEVICE INPUT
SIGNAL
TB0.6
CCI6A
ACLK (internal)
CCI6B
DVSS
GND
DVCC
VCC
CCR0
TB0
TB0.0
44, M9-P4.1
CCR1
TB1
TB0.1
ADC12 (internal)
ADC12SHSx = {3}
45, L9-P4.2
CCR2
TB2
TB0.2
46, L10-P4.3
CCR3
TB3
TB0.3
47, M10-P4.4
CCR4
TB4
TB0.4
48, L11-P4.5
CCR5
TB5
TB0.5
49, M11-P4.6
CCR6
TB6
Detailed Description
TB0.6
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6.9.13 ADC12_A
The ADC12_A module supports fast 12-bit analog-to-digital conversions. The module implements a 12-bit
SAR core, sample select control, reference generator, and a 16-word conversion-and-control buffer. The
conversion-and-control buffer allows up to 16 independent ADC samples to be converted and stored
without any CPU intervention.
6.9.14 CRC16
The CRC16 module produces a signature based on a sequence of entered data values and can be used
for data checking purposes. The CRC16 module signature is based on the CRC-CCITT standard.
6.9.15 REF Voltage Reference
The reference module (REF) is responsible for generation of all critical reference voltages that can be
used by the various analog peripherals in the device.
6.9.16 Embedded Emulation Module (EEM) (L Version)
The EEM supports real-time in-system debugging. The L version of the EEM has the following features:
• Eight hardware triggers or breakpoints on memory access
• Two hardware triggers or breakpoints on CPU register write access
• Up to ten hardware triggers can be combined to form complex triggers or breakpoints
• Two cycle counters
• Sequencer
• State storage
• Clock control on module level
Detailed Description
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6.9.17 Peripheral File Map
Table 6-11 lists the base address for the registers of each module.
Table 6-11. Peripheral Map
54
MODULE NAME
BASE ADDRESS
OFFSET ADDRESS
RANGE
Special Functions (see Table 6-12)
0100h
000h-01Fh
PMM (see Table 6-13)
0120h
000h-010h
Flash Control (see Table 6-14)
0140h
000h-00Fh
CRC16 (see Table 6-15)
0150h
000h-007h
RAM Control (see Table 6-16)
0158h
000h-001h
Watchdog (see Table 6-17)
015Ch
000h-001h
UCS (see Table 6-18)
0160h
000h-01Fh
SYS (see Table 6-19)
0180h
000h-01Fh
Shared Reference (see Table 6-20)
01B0h
000h-001h
Port P1, P2 (see Table 6-21)
0200h
000h-01Fh
Port P3, P4 (see Table 6-22)
0220h
000h-00Bh
Port P5, P6 (see Table 6-23)
0240h
000h-00Bh
Port P7, P8 (see Table 6-24)
0260h
000h-00Bh
Port P9, P10 (see Table 6-25)
0280h
000h-00Bh
Port P11 (see Table 6-26)
02A0h
000h-00Ah
Port PJ (see Table 6-27)
0320h
000h-01Fh
TA0 (see Table 6-28)
0340h
000h-02Eh
TA1 (see Table 6-29)
0380h
000h-02Eh
TB0 (see Table 6-30)
03C0h
000h-02Eh
Real-Time Clock (RTC_A) (see Table 6-31)
04A0h
000h-01Bh
32-Bit Hardware Multiplier (see Table 6-32)
04C0h
000h-02Fh
DMA General Control (see Table 6-33)
0500h
000h-00Fh
DMA Channel 0 (see Table 6-33)
0510h
000h-00Ah
DMA Channel 1 (see Table 6-33)
0520h
000h-00Ah
DMA Channel 2 (see Table 6-33)
0530h
000h-00Ah
USCI_A0 (see Table 6-34)
05C0h
000h-01Fh
USCI_B0 (see Table 6-35)
05E0h
000h-01Fh
USCI_A1 (see Table 6-36)
0600h
000h-01Fh
USCI_B1 (see Table 6-37)
0620h
000h-01Fh
USCI_A2 (see Table 6-38)
0640h
000h-01Fh
USCI_B2 (see Table 6-39)
0660h
000h-01Fh
USCI_A3 (see Table 6-40)
0680h
000h-01Fh
USCI_B3 (see Table 6-41)
06A0h
000h-01Fh
ADC12_A (see Table 6-42)
0700h
000h-03Eh
Detailed Description
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Table 6-12. Special Function Registers (Base Address: 0100h)
REGISTER DESCRIPTION
REGISTER
OFFSET
SFR interrupt enable
SFRIE1
00h
SFR interrupt flag
SFRIFG1
02h
SFR reset pin control
SFRRPCR
04h
Table 6-13. PMM Registers (Base Address: 0120h)
REGISTER DESCRIPTION
REGISTER
OFFSET
PMM Control 0
PMMCTL0
00h
PMM control 1
PMMCTL1
02h
SVS high side control
SVSMHCTL
04h
SVS low side control
SVSMLCTL
06h
PMM interrupt flags
PMMIFG
0Ch
PMM interrupt enable
PMMIE
0Eh
PMM power mode 5 control
PM5CTL0
10h
Table 6-14. Flash Control Registers (Base Address: 0140h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Flash control 1
FCTL1
00h
Flash control 3
FCTL3
04h
Flash control 4
FCTL4
06h
Table 6-15. CRC16 Registers (Base Address: 0150h)
REGISTER DESCRIPTION
REGISTER
OFFSET
CRC data input
CRC16DI
00h
CRC data input reverse byte
CRCDIRB
02h
CRC initialization and result
CRCINIRES
04h
CRC result reverse byte
CRCRESR
06h
Table 6-16. RAM Control Registers (Base Address: 0158h)
REGISTER DESCRIPTION
RAM control 0
REGISTER
RCCTL0
OFFSET
00h
Table 6-17. Watchdog Registers (Base Address: 015Ch)
REGISTER DESCRIPTION
Watchdog timer control
REGISTER
WDTCTL
OFFSET
00h
Table 6-18. UCS Registers (Base Address: 0160h)
REGISTER DESCRIPTION
REGISTER
OFFSET
UCS control 0
UCSCTL0
00h
UCS control 1
UCSCTL1
02h
UCS control 2
UCSCTL2
04h
UCS control 3
UCSCTL3
06h
UCS control 4
UCSCTL4
08h
UCS control 5
UCSCTL5
0Ah
UCS control 6
UCSCTL6
0Ch
UCS control 7
UCSCTL7
0Eh
Detailed Description
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Table 6-18. UCS Registers (Base Address: 0160h) (continued)
REGISTER DESCRIPTION
UCS control 8
REGISTER
UCSCTL8
OFFSET
10h
Table 6-19. SYS Registers (Base Address: 0180h)
REGISTER DESCRIPTION
REGISTER
OFFSET
System control
SYSCTL
00h
Bootstrap loader configuration area
SYSBSLC
02h
JTAG mailbox control
SYSJMBC
06h
JTAG mailbox input 0
SYSJMBI0
08h
JTAG mailbox input 1
SYSJMBI1
0Ah
JTAG mailbox output 0
SYSJMBO0
0Ch
JTAG mailbox output 1
SYSJMBO1
0Eh
Bus Error vector generator
SYSBERRIV
18h
User NMI vector generator
SYSUNIV
1Ah
System NMI vector generator
SYSSNIV
1Ch
Reset vector generator
SYSRSTIV
1Eh
Table 6-20. Shared Reference Registers (Base Address: 01B0h)
REGISTER DESCRIPTION
Shared reference control
REGISTER
REFCTL
OFFSET
00h
Table 6-21. Port P1, P2 Registers (Base Address: 0200h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P1 input
P1IN
00h
Port P1 output
P1OUT
02h
Port P1 direction
P1DIR
04h
Port P1 pullup/pulldown enable
P1REN
06h
Port P1 drive strength
P1DS
08h
Port P1 selection
P1SEL
0Ah
Port P1 interrupt vector word
P1IV
0Eh
Port P1 interrupt edge select
P1IES
18h
Port P1 interrupt enable
P1IE
1Ah
Port P1 interrupt flag
P1IFG
1Ch
Port P2 input
P2IN
01h
Port P2 output
P2OUT
03h
Port P2 direction
P2DIR
05h
Port P2 pullup/pulldown enable
P2REN
07h
Port P2 drive strength
P2DS
09h
Port P2 selection
P2SEL
0Bh
Port P2 interrupt vector word
P2IV
1Eh
Port P2 interrupt edge select
P2IES
19h
Port P2 interrupt enable
P2IE
1Bh
Port P2 interrupt flag
P2IFG
1Dh
56
Detailed Description
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Table 6-22. Port P3, P4 Registers (Base Address: 0220h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P3 input
P3IN
00h
Port P3 output
P3OUT
02h
Port P3 direction
P3DIR
04h
Port P3 pullup/pulldown enable
P3REN
06h
Port P3 drive strength
P3DS
08h
Port P3 selection
P3SEL
0Ah
Port P4 input
P4IN
01h
Port P4 output
P4OUT
03h
Port P4 direction
P4DIR
05h
Port P4 pullup/pulldown enable
P4REN
07h
Port P4 drive strength
P4DS
09h
Port P4 selection
P4SEL
0Bh
Table 6-23. Port P5, P6 Registers (Base Address: 0240h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P5 input
P5IN
00h
Port P5 output
P5OUT
02h
Port P5 direction
P5DIR
04h
Port P5 pullup/pulldown enable
P5REN
06h
Port P5 drive strength
P5DS
08h
Port P5 selection
P5SEL
0Ah
Port P6 input
P6IN
01h
Port P6 output
P6OUT
03h
Port P6 direction
P6DIR
05h
Port P6 pullup/pulldown enable
P6REN
07h
Port P6 drive strength
P6DS
09h
Port P6 selection
P6SEL
0Bh
Table 6-24. Port P7, P8 Registers (Base Address: 0260h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P7 input
P7IN
00h
Port P7 output
P7OUT
02h
Port P7 direction
P7DIR
04h
Port P7 pullup/pulldown enable
P7REN
06h
Port P7 drive strength
P7DS
08h
Port P7 selection
P7SEL
0Ah
Port P8 input
P8IN
01h
Port P8 output
P8OUT
03h
Port P8 direction
P8DIR
05h
Port P8 pullup/pulldown enable
P8REN
07h
Port P8 drive strength
P8DS
09h
Port P8 selection
P8SEL
0Bh
Detailed Description
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Table 6-25. Port P9, P10 Registers (Base Address: 0280h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P9 input
P9IN
00h
Port P9 output
P9OUT
02h
Port P9 direction
P9DIR
04h
Port P9 pullup/pulldown enable
P9REN
06h
Port P9 drive strength
P9DS
08h
Port P9 selection
P9SEL
0Ah
Port P10 input
P10IN
01h
Port P10 output
P10OUT
03h
Port P10 direction
P10DIR
05h
Port P10 pullup/pulldown enable
P10REN
07h
Port P10 drive strength
P10DS
09h
Port P10 selection
P10SEL
0Bh
Table 6-26. Port P11 Registers (Base Address: 02A0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P11 input
P11IN
00h
Port P11 output
P11OUT
02h
Port P11 direction
P11DIR
04h
Port P11 pullup/pulldown enable
P11REN
06h
Port P11 drive strength
P11DS
08h
Port P11 selection
P11SEL
0Ah
Table 6-27. Port J Registers (Base Address: 0320h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port PJ input
PJIN
00h
Port PJ output
PJOUT
02h
Port PJ direction
PJDIR
04h
Port PJ pullup/pulldown enable
PJREN
06h
Port PJ drive strength
PJDS
08h
58
Detailed Description
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Table 6-28. TA0 Registers (Base Address: 0340h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA0 control
TA0CTL
00h
Capture/compare control 0
TA0CCTL0
02h
Capture/compare control 1
TA0CCTL1
04h
Capture/compare control 2
TA0CCTL2
06h
Capture/compare control 3
TA0CCTL3
08h
Capture/compare control 4
TA0CCTL4
0Ah
TA0 counter register
TA0R
10h
Capture/compare register 0
TA0CCR0
12h
Capture/compare register 1
TA0CCR1
14h
Capture/compare register 2
TA0CCR2
16h
Capture/compare register 3
TA0CCR3
18h
Capture/compare register 4
TA0CCR4
1Ah
TA0 expansion register 0
TA0EX0
20h
TA0 interrupt vector
TA0IV
2Eh
Table 6-29. TA1 Registers (Base Address: 0380h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA1 control
TA1CTL
00h
Capture/compare control 0
TA1CCTL0
02h
Capture/compare control 1
TA1CCTL1
04h
Capture/compare control 2
TA1CCTL2
06h
TA1 counter register
TA1R
10h
Capture/compare register 0
TA1CCR0
12h
Capture/compare register 1
TA1CCR1
14h
Capture/compare register 2
TA1CCR2
16h
TA1 expansion register 0
TA1EX0
20h
TA1 interrupt vector
TA1IV
2Eh
Detailed Description
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Table 6-30. TB0 Registers (Base Address: 03C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TB0 control
TB0CTL
00h
Capture/compare control 0
TB0CCTL0
02h
Capture/compare control 1
TB0CCTL1
04h
Capture/compare control 2
TB0CCTL2
06h
Capture/compare control 3
TB0CCTL3
08h
Capture/compare control 4
TB0CCTL4
0Ah
Capture/compare control 5
TB0CCTL5
0Ch
Capture/compare control 6
TB0CCTL6
0Eh
TB0 register
TB0R
10h
Capture/compare register 0
TB0CCR0
12h
Capture/compare register 1
TB0CCR1
14h
Capture/compare register 2
TB0CCR2
16h
Capture/compare register 3
TB0CCR3
18h
Capture/compare register 4
TB0CCR4
1Ah
Capture/compare register 5
TB0CCR5
1Ch
Capture/compare register 6
TB0CCR6
1Eh
TB0 expansion register 0
TB0EX0
20h
TB0 interrupt vector
TB0IV
2Eh
Table 6-31. Real-Time Clock Registers (Base Address: 04A0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
RTC control 0
RTCCTL0
00h
RTC control 1
RTCCTL1
01h
RTC control 2
RTCCTL2
02h
RTC control 3
RTCCTL3
03h
RTC prescaler 0 control
RTCPS0CTL
08h
RTC prescaler 1 control
RTCPS1CTL
0Ah
RTC prescaler 0
RTCPS0
0Ch
RTC prescaler 1
RTCPS1
0Dh
RTC interrupt vector word
RTCIV
0Eh
RTC seconds/counter register 1
RTCSEC/RTCNT1
10h
RTC minutes/counter register 2
RTCMIN/RTCNT2
11h
RTC hours/counter register 3
RTCHOUR/RTCNT3
12h
RTC day of week/counter register 4
RTCDOW/RTCNT4
13h
RTC days
RTCDAY
14h
RTC month
RTCMON
15h
RTC year low
RTCYEARL
16h
RTC year high
RTCYEARH
17h
RTC alarm minutes
RTCAMIN
18h
RTC alarm hours
RTCAHOUR
19h
RTC alarm day of week
RTCADOW
1Ah
RTC alarm days
RTCADAY
1Bh
60
Detailed Description
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Table 6-32. 32-Bit Hardware Multiplier Registers (Base Address: 04C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
16-bit operand 1 – multiply
MPY
00h
16-bit operand 1 – signed multiply
MPYS
02h
16-bit operand 1 – multiply accumulate
MAC
04h
16-bit operand 1 – signed multiply accumulate
MACS
06h
16-bit operand 2
OP2
08h
16 × 16 result low word
RESLO
0Ah
16 × 16 result high word
RESHI
0Ch
16 × 16 sum extension register
SUMEXT
0Eh
32-bit operand 1 – multiply low word
MPY32L
10h
32-bit operand 1 – multiply high word
MPY32H
12h
32-bit operand 1 – signed multiply low word
MPYS32L
14h
32-bit operand 1 – signed multiply high word
MPYS32H
16h
32-bit operand 1 – multiply accumulate low word
MAC32L
18h
32-bit operand 1 – multiply accumulate high word
MAC32H
1Ah
32-bit operand 1 – signed multiply accumulate low word
MACS32L
1Ch
32-bit operand 1 – signed multiply accumulate high word
MACS32H
1Eh
32-bit operand 2 – low word
OP2L
20h
32-bit operand 2 – high word
OP2H
22h
32 × 32 result 0 – least significant word
RES0
24h
32 × 32 result 1
RES1
26h
32 × 32 result 2
RES2
28h
32 × 32 result 3 – most significant word
RES3
2Ah
MPY32 control register 0
MPY32CTL0
2Ch
Detailed Description
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Table 6-33. DMA Registers (Base Address DMA General Control: 0500h,
DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h)
REGISTER DESCRIPTION
REGISTER
OFFSET
DMA channel 0 control
DMA0CTL
00h
DMA channel 0 source address low
DMA0SAL
02h
DMA channel 0 source address high
DMA0SAH
04h
DMA channel 0 destination address low
DMA0DAL
06h
DMA channel 0 destination address high
DMA0DAH
08h
DMA channel 0 transfer size
DMA0SZ
0Ah
DMA channel 1 control
DMA1CTL
00h
DMA channel 1 source address low
DMA1SAL
02h
DMA channel 1 source address high
DMA1SAH
04h
DMA channel 1 destination address low
DMA1DAL
06h
DMA channel 1 destination address high
DMA1DAH
08h
DMA channel 1 transfer size
DMA1SZ
0Ah
DMA channel 2 control
DMA2CTL
00h
DMA channel 2 source address low
DMA2SAL
02h
DMA channel 2 source address high
DMA2SAH
04h
DMA channel 2 destination address low
DMA2DAL
06h
DMA channel 2 destination address high
DMA2DAH
08h
DMA channel 2 transfer size
DMA2SZ
0Ah
DMA module control 0
DMACTL0
00h
DMA module control 1
DMACTL1
02h
DMA module control 2
DMACTL2
04h
DMA module control 3
DMACTL3
06h
DMA module control 4
DMACTL4
08h
DMA interrupt vector
DMAIV
0Eh
Table 6-34. USCI_A0 Registers (Base Address: 05C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 1
UCA0CTL1
00h
USCI control 0
UCA0CTL0
01h
USCI baud rate 0
UCA0BR0
06h
USCI baud rate 1
UCA0BR1
07h
USCI modulation control
UCA0MCTL
08h
USCI status
UCA0STAT
0Ah
USCI receive buffer
UCA0RXBUF
0Ch
USCI transmit buffer
UCA0TXBUF
0Eh
USCI LIN control
UCA0ABCTL
10h
USCI IrDA transmit control
UCA0IRTCTL
12h
USCI IrDA receive control
UCA0IRRCTL
13h
USCI interrupt enable
UCA0IE
1Ch
USCI interrupt flags
UCA0IFG
1Dh
USCI interrupt vector word
UCA0IV
1Eh
62
Detailed Description
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Table 6-35. USCI_B0 Registers (Base Address: 05E0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 1
UCB0CTL1
00h
USCI synchronous control 0
UCB0CTL0
01h
USCI synchronous bit rate 0
UCB0BR0
06h
USCI synchronous bit rate 1
UCB0BR1
07h
USCI synchronous status
UCB0STAT
0Ah
USCI synchronous receive buffer
UCB0RXBUF
0Ch
USCI synchronous transmit buffer
UCB0TXBUF
0Eh
USCI I2C own address
UCB0I2COA
10h
USCI I2C slave address
UCB0I2CSA
12h
USCI interrupt enable
UCB0IE
1Ch
USCI interrupt flags
UCB0IFG
1Dh
USCI interrupt vector word
UCB0IV
1Eh
Table 6-36. USCI_A1 Registers (Base Address: 0600h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 1
UCA1CTL1
00h
USCI control 0
UCA1CTL0
01h
USCI baud rate 0
UCA1BR0
06h
USCI baud rate 1
UCA1BR1
07h
USCI modulation control
UCA1MCTL
08h
USCI status
UCA1STAT
0Ah
USCI receive buffer
UCA1RXBUF
0Ch
USCI transmit buffer
UCA1TXBUF
0Eh
USCI LIN control
UCA1ABCTL
10h
USCI IrDA transmit control
UCA1IRTCTL
12h
USCI IrDA receive control
UCA1IRRCTL
13h
USCI interrupt enable
UCA1IE
1Ch
USCI interrupt flags
UCA1IFG
1Dh
USCI interrupt vector word
UCA1IV
1Eh
Detailed Description
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Table 6-37. USCI_B1 Registers (Base Address: 0620h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 1
UCB1CTL1
00h
USCI synchronous control 0
UCB1CTL0
01h
USCI synchronous bit rate 0
UCB1BR0
06h
USCI synchronous bit rate 1
UCB1BR1
07h
USCI synchronous status
UCB1STAT
0Ah
USCI synchronous receive buffer
UCB1RXBUF
0Ch
USCI synchronous transmit buffer
UCB1TXBUF
0Eh
USCI I2C own address
UCB1I2COA
10h
USCI I2C slave address
UCB1I2CSA
12h
USCI interrupt enable
UCB1IE
1Ch
USCI interrupt flags
UCB1IFG
1Dh
USCI interrupt vector word
UCB1IV
1Eh
Table 6-38. USCI_A2 Registers (Base Address: 0640h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 1
UCA2CTL1
00h
USCI control 0
UCA2CTL0
01h
USCI baud rate 0
UCA2BR0
06h
USCI baud rate 1
UCA2BR1
07h
USCI modulation control
UCA2MCTL
08h
USCI status
UCA2STAT
0Ah
USCI receive buffer
UCA2RXBUF
0Ch
USCI transmit buffer
UCA2TXBUF
0Eh
USCI LIN control
UCA2ABCTL
10h
USCI IrDA transmit control
UCA2IRTCTL
12h
USCI IrDA receive control
UCA2IRRCTL
13h
USCI interrupt enable
UCA2IE
1Ch
USCI interrupt flags
UCA2IFG
1Dh
USCI interrupt vector word
UCA2IV
1Eh
Table 6-39. USCI_B2 Registers (Base Address: 0660h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 1
UCB2CTL1
00h
USCI synchronous control 0
UCB2CTL0
01h
USCI synchronous bit rate 0
UCB2BR0
06h
USCI synchronous bit rate 1
UCB2BR1
07h
USCI synchronous status
UCB2STAT
0Ah
USCI synchronous receive buffer
UCB2RXBUF
0Ch
USCI synchronous transmit buffer
UCB2TXBUF
0Eh
USCI I2C own address
UCB2I2COA
10h
USCI I2C slave address
UCB2I2CSA
12h
USCI interrupt enable
UCB2IE
1Ch
USCI interrupt flags
UCB2IFG
1Dh
USCI interrupt vector word
UCB2IV
1Eh
64
Detailed Description
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Table 6-40. USCI_A3 Registers (Base Address: 0680h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 1
UCA3CTL1
00h
USCI control 0
UCA3CTL0
01h
USCI baud rate 0
UCA3BR0
06h
USCI baud rate 1
UCA3BR1
07h
USCI modulation control
UCA3MCTL
08h
USCI status
UCA3STAT
0Ah
USCI receive buffer
UCA3RXBUF
0Ch
USCI transmit buffer
UCA3TXBUF
0Eh
USCI LIN control
UCA3ABCTL
10h
USCI IrDA transmit control
UCA3IRTCTL
12h
USCI IrDA receive control
UCA3IRRCTL
13h
USCI interrupt enable
UCA3IE
1Ch
USCI interrupt flags
UCA3IFG
1Dh
USCI interrupt vector word
UCA3IV
1Eh
Table 6-41. USCI_B3 Registers (Base Address: 06A0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 1
UCB3CTL1
00h
USCI synchronous control 0
UCB3CTL0
01h
USCI synchronous bit rate 0
UCB3BR0
06h
USCI synchronous bit rate 1
UCB3BR1
07h
USCI synchronous status
UCB3STAT
0Ah
USCI synchronous receive buffer
UCB3RXBUF
0Ch
USCI synchronous transmit buffer
UCB3TXBUF
0Eh
USCI I2C own address
UCB3I2COA
10h
USCI I2C slave address
UCB3I2CSA
12h
USCI interrupt enable
UCB3IE
1Ch
USCI interrupt flags
UCB3IFG
1Dh
USCI interrupt vector word
UCB3IV
1Eh
Detailed Description
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Table 6-42. ADC12_A Registers (Base Address: 0700h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Control register 0
ADC12CTL0
00h
Control register 1
ADC12CTL1
02h
Control register 2
ADC12CTL2
04h
Interrupt-flag register
ADC12IFG
0Ah
Interrupt-enable register
ADC12IE
0Ch
Interrupt-vector-word register
ADC12IV
0Eh
ADC memory-control register 0
ADC12MCTL0
10h
ADC memory-control register 1
ADC12MCTL1
11h
ADC memory-control register 2
ADC12MCTL2
12h
ADC memory-control register 3
ADC12MCTL3
13h
ADC memory-control register 4
ADC12MCTL4
14h
ADC memory-control register 5
ADC12MCTL5
15h
ADC memory-control register 6
ADC12MCTL6
16h
ADC memory-control register 7
ADC12MCTL7
17h
ADC memory-control register 8
ADC12MCTL8
18h
ADC memory-control register 9
ADC12MCTL9
19h
ADC memory-control register 10
ADC12MCTL10
1Ah
ADC memory-control register 11
ADC12MCTL11
1Bh
ADC memory-control register 12
ADC12MCTL12
1Ch
ADC memory-control register 13
ADC12MCTL13
1Dh
ADC memory-control register 14
ADC12MCTL14
1Eh
ADC memory-control register 15
ADC12MCTL15
1Fh
Conversion memory 0
ADC12MEM0
20h
Conversion memory 1
ADC12MEM1
22h
Conversion memory 2
ADC12MEM2
24h
Conversion memory 3
ADC12MEM3
26h
Conversion memory 4
ADC12MEM4
28h
Conversion memory 5
ADC12MEM5
2Ah
Conversion memory 6
ADC12MEM6
2Ch
Conversion memory 7
ADC12MEM7
2Eh
Conversion memory 8
ADC12MEM8
30h
Conversion memory 9
ADC12MEM9
32h
Conversion memory 10
ADC12MEM10
34h
Conversion memory 11
ADC12MEM11
36h
Conversion memory 12
ADC12MEM12
38h
Conversion memory 13
ADC12MEM13
3Ah
Conversion memory 14
ADC12MEM14
3Ch
Conversion memory 15
ADC12MEM15
3Eh
66
Detailed Description
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6.10 Input/Output Schematics
6.10.1 Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
Pad Logic
P1REN.x
P1DIR.x
0
0
Module X OUT
1
0
DVCC
1
P1DS.x
0: Low drive
1: High drive
P1SEL.x
P1IN.x
EN
Module X IN
1
Direction
0: Input
1: Output
1
P1OUT.x
DVSS
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/SMCLK
P1.7
D
P1IE.x
EN
P1IRQ.x
Q
P1IFG.x
P1SEL.x
P1IES.x
Set
Interrupt
Edge
Select
Detailed Description
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Table 6-43. Port P1 (P1.0 to P1.7) Pin Functions
PIN NAME (P1.x)
P1.0/TA0CLK/ACLK
x
0
FUNCTION
P1.0 (I/O)
TA0.TA0CLK
ACLK
P1.1/TA0.0
1
P1.1 (I/O)
TA0.CCI0A
TA0.0
P1.2/TA0.1
2
P1.2 (I/O)
TA0.CCI1A
TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/SMCLK
3
4
5
6
68
7
P1DIR.x
P1SEL.x
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
TA0.CCI2A
0
1
TA0.2
1
1
P1.3 (I/O)
P1.4 (I/O)
I: 0; O: 1
0
TA0.CCI3A
0
1
TA0.3
1
1
P1.5 (I/O)
I: 0; O: 1
0
TA0.CCI4A
0
1
TA0.4
1
1
I: 0; O: 1
0
1
1
I: 0; O: 1
0
P1.6 (I/O)
SMCLK
P1.7
CONTROL BITS OR SIGNALS
P1.7 (I/O)
Detailed Description
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6.10.2 Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger
Pad Logic
P2REN.x
P2DIR.x
0
0
Module X OUT
1
0
DVCC
1
P2DS.x
0: Low drive
1: High drive
P2SEL.x
P2IN.x
EN
Module X IN
1
Direction
0: Input
1: Output
1
P2OUT.x
DVSS
P2.0/TA1CLK/MCLK
P2.1/TA1.0
P2.2/TA1.1
P2.3/TA1.2
P2.4/RTCCLK
P2.5
P2.6/ACLK
P2.7/ADC12CLK/DMAE0
D
P2IE.x
EN
P2IRQ.x
Q
P2IFG.x
P2SEL.x
P2IES.x
Set
Interrupt
Edge
Select
Detailed Description
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Table 6-44. Port P2 (P2.0 to P2.7) Pin Functions
PIN NAME (P2.x)
P2.0/TA1CLK/MCLK
x
0
FUNCTION
P2DIR.x
P2SEL.x
P2.0 (I/O)
I: 0; O: 1
0
TA1CLK
0
1
MCLK
P2.1/TA1.0
1
P2.1 (I/O)
TA1.CCI0A
TA1.0
P2.2/TA1.1
2
P2.2 (I/O)
TA1.CCI1A
TA1.1
P2.3/TA1.2
P2.4/RTCCLK
3
4
CONTROL BITS OR SIGNALS
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
TA1.CCI2A
0
1
TA1.2
1
1
P2.4 (I/O)
I: 0; O: 1
0
RTCCLK
1
1
P2.3 (I/O)
P2.5
5
P2.5 (I/O
I: 0; O: 1
0
P2.6/ACLK
6
P2.6 (I/O)
I: 0; O: 1
0
1
1
I: 0; O: 1
0
DMAE0
0
1
ADC12CLK
1
1
ACLK
P2.7/ADC12CLK/DMAE0
70
7
P2.7 (I/O)
Detailed Description
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6.10.3 Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger
Pad Logic
P3REN.x
P3DIR.x
0
0
Module X OUT
1
0
DVCC
1
P3DS.x
0: Low drive
1: High drive
P3SEL.x
P3IN.x
EN
Module X IN
1
Direction
0: Input
1: Output
1
P3OUT.x
DVSS
P3.0/UB0STE/UCA0CLK
P3.1/UCB0SIMO/UCB0SDA
P3.2/UCB0SOMI/UCB0SCL
P3.3/USC0CLK/UCA0STE
P3.4/UCA0TXD/UCA0SIMO
P3.5/UCA0RXD/UCA0SOMI
P3.6/UCB1STE/UCA1CLK
P3.7/UCB1SIMO/UCB1SDA
D
Table 6-45. Port P3 (P3.0 to P3.7) Pin Functions
PIN NAME (P3.x)
P3.0/UCB0STE/UCA0CLK
x
0
FUNCTION
P3.0 (I/O)
UCB0STE/UCA0CLK
P3.1/UCB0SIMO/UCB0SDA
1
(2) (3)
P3.1 (I/O)
UCB0SIMO/UCB0SDA (2)
P3.2/UCB0SOMI/UCB0SCL
2
P3.2 (I/O)
UCB0SOMI/UCB0SCL (2)
P3.3/UCB0CLK/UCA0STE
3
(4)
(4)
P3.3 (I/O)
UCB0CLK/UCA0STE (2)
P3.4/UCA0TXD/UCA0SIMO
4
P3.4 (I/O)
UCA0TXD/UCA0SIMO (2)
P3.5/UCA0RXD/UCA0SOMI
5
P3.5 (I/O)
UCA0RXD/UCA0SOMI
P3.6/UCB1STE/UCA1CLK
6
(2)
P3.6 (I/O)
UCB1STE/UCA1CLK (2)
P3.7/UCB1SIMO/UCB1SDA
7
(5)
P3.7 (I/O)
UCB1SIMO/UCB1SDA (2)
(1)
(2)
(3)
(4)
(5)
(4)
CONTROL BITS OR SIGNALS (1)
P3DIR.x
P3SEL.x
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
X = Don't care
The pin direction is controlled by the USCI module.
UCA0CLK function takes precedence over UCB0STE function. If the pin is required as UCA0CLK input or output, USCI B0 is forced to
3-wire SPI mode if 4-wire SPI mode is selected.
If the I2C functionality is selected, the output drives only the logical 0 to VSS level.
UCA1CLK function takes precedence over UCB1STE function. If the pin is required as UCA1CLK input or output, USCI B1 is forced to
3-wire SPI mode if 4-wire SPI mode is selected.
Detailed Description
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6.10.4 Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
Pad Logic
P4REN.x
P4DIR.x
0
0
Module X OUT
1
0
DVCC
1
P4DS.x
0: Low drive
1: High drive
P4SEL.x
P4IN.x
EN
Module X IN
72
1
Direction
0: Input
1: Output
1
P4OUT.x
DVSS
P4.0/TB0.0
P4.1/TB0.1
P4.2/TB0.2
P4.3/TB0.3
P4.4/TB0.4
P4.5/TB0.5
P4.6/TB0.6
P4.7/TB0CLK/SMCLK
D
Detailed Description
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Table 6-46. Port P4 (P4.0 to P4.7) Pin Functions
PIN NAME (P4.x)
P4.0/TB0.0
x
0
FUNCTION
4.0 (I/O)
TB0.CCI0A and TB0.CCI0B
TB0.0
P4.1/TB0.1
1
(1)
4.1 (I/O)
TB0.CCI1A and TB0.CCI1B
TB0.1
P4.2/TB0.2
2
(1)
4.2 (I/O)
TB0.CCI2A and TB0.CCI2B
TB0.2
P4.3/TB0.3
P4.4/TB0.5
P4.5/TB0.5
P4.6/TB0.6
P4.7/TB0CLK/SMCLK
(1)
3
4
5
6
7
(1)
CONTROL BITS OR SIGNALS
P4DIR.x
P4SEL.x
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
TB0.CCI3A and TB0.CCI3B
0
1
TB0.3 (1)
1
1
4.4 (I/O)
4.3 (I/O)
I: 0; O: 1
0
TB0.CCI4A and TB0.CCI4B
0
1
TB0.4 (1)
1
1
4.5 (I/O)
I: 0; O: 1
0
TB0.CCI5A and TB0.CCI5B
0
1
TB0.5 (1)
1
1
4.6 (I/O)
I: 0; O: 1
0
TB0.CCI6A and TB0.CCI6B
0
1
TB0.6 (1)
1
1
4.7 (I/O)
I: 0; O: 1
0
TB0CLK
0
1
SMCLK
1
1
Setting TBOUTH causes all Timer_B configured outputs to be set to high impedance.
Detailed Description
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6.10.5 Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
Pad Logic
To ADC12
INCHx = y
To/From
ADC12 Reference
P5REN.x
P5DIR.x
DVSS
0
DVCC
1
1
0
1
P5OUT.x
0
Module X OUT
1
P5DS.x
0: Low drive
1: High drive
P5SEL.x
P5.0/A8/VREF+/VeREF+
P5.1/A9/VREF–/VeREF–
P5IN.x
EN
Module X IN
74
Bus
Keeper
D
Detailed Description
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Table 6-47. Port P5 (P5.0 and P5.1) Pin Functions
PIN NAME (P5.x)
P5.0/A8/VREF+/VeREF+
x
0
FUNCTION
P5.0 (I/O) (2)
A8/VeREF+ (3)
A8/VREF+
P5.1/A9/VREF–/VeREF–
1
(4)
P5.1 (I/O) (2)
A9/VeREF– (5)
A9/VREF–
(1)
(2)
(3)
(4)
(5)
(6)
(6)
CONTROL BITS OR SIGNALS (1)
P5DIR.x
P5SEL.x
REFOUT
I: 0; O: 1
0
X
X
1
0
X
1
1
I: 0; O: 1
0
X
X
1
0
X
1
1
X = Don't care
Default condition
Setting the P5SEL.0 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. An external voltage can be applied to VeREF+ and used as the reference for the ADC12_A. Channel A8, when selected
with the INCHx bits, is connected to the VREF+/VeREF+ pin.
Setting the P5SEL.0 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. The ADC12_A, VREF+ reference is available at the pin. Channel A8, when selected with the INCHx bits, is connected to
the VREF+/VeREF+ pin.
Setting the P5SEL.1 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. An external voltage can be applied to VeREF- and used as the reference for the ADC12_A. Channel A9, when selected
with the INCHx bits, is connected to the VREF-/VeREF- pin.
Setting the P5SEL.1 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. The ADC12_A, VREF– reference is available at the pin. Channel A9, when selected with the INCHx bits, is connected to
the VREF-/VeREF- pin.
Detailed Description
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6.10.6 Port P5, P5.2, Input/Output With Schmitt Trigger
Pad Logic
To XT2
P5REN.2
P5DIR.2
DVSS
0
DVCC
1
1
0
1
P5OUT.2
0
Module X OUT
1
P5DS.2
0: Low drive
1: High drive
P5SEL.2
P5.2/XT2IN
P5IN.2
EN
Module X IN
76
Bus
Keeper
D
Detailed Description
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6.10.7 Port P5, P5.3, Input/Output With Schmitt Trigger
Pad Logic
To XT2
P5REN.3
P5DIR.3
DVSS
0
DVCC
1
1
0
1
P5OUT.3
0
Module X OUT
1
P5SEL.2
P5.3/XT2OUT
P5DS.3
0: Low drive
1: High drive
XT2BYPASS
P5SEL.3
P5IN.3
Bus
Keeper
EN
Module X IN
D
Table 6-48. Port P5 (P5.2 and P5.3) Pin Functions
PIN NAME (P5.x)
P5.2/XT2IN
x
2
FUNCTION
P5DIR.x
P5SEL.2
P5SEL.3
XT2BYPASS
I: 0; O: 1
0
X
X
X
1
X
0
X
1
X
1
I: 0; O: 1
0
0
X
XT2OUT crystal mode (3)
X
1
X
0
P5.3 (I/O) (3)
X
1
0
1
P5.2 (I/O)
XT2IN crystal mode
(2)
XT2IN bypass mode (2)
P5.3/XT2OUT
(1)
(2)
(3)
3
CONTROL BITS OR SIGNALS (1)
P5.3 (I/O)
X = Don't care
Setting P5SEL.2 causes the general-purpose I/O to be disabled. Pending the setting of XT2BYPASS, P5.2 is configured for crystal
mode or bypass mode.
Setting P5SEL.2 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.3 can be used as
general-purpose I/O.
Detailed Description
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6.10.8 Port P5, P5.4 to P5.7, Input/Output With Schmitt Trigger
Pad Logic
P5REN.x
P5DIR.x
0
0
Module X OUT
1
0
DVCC
1
1
Direction
0: Input
1: Output
1
P5OUT.x
DVSS
P5DS.x
0: Low drive
1: High drive
P5SEL.x
P5.4/UCB1SOMI/UCB1SCL
P5.5/UCB1CLK/UCA1STE
P5.6/UCA1TXD/UCA1SIMO
P5.7/UCA1RXD/UCA1SOMI
P5IN.x
EN
Module X IN
D
Table 6-49. Port P5 (P5.4 to P5.7) Pin Functions
PIN NAME (P5.x)
x
P5.4/UCB1SOMI/UCB1SCL
4
FUNCTION
P5.4 (I/O)
UCB1SOMI/UCB1SCL
P5.5/UCB1CLK/UCA1STE
5
(2) (3)
P5.5 (I/O)
UCB1CLK/UCA1STE (2) (4)
P5.6/UCA1TXD/UCA1SIMO
6
P5.6 (I/O)
UCA1TXD/UCA1SIMO (2)
P5.7/UCA1RXD/UCA1SOMI
7
P5.7 (I/O)
UCA1RXD/UCA1SOMI (2)
(1)
(2)
(3)
(4)
78
CONTROL BITS OR SIGNALS (1)
P5DIR.x
P5SEL.x
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
X = Don't care
The pin direction is controlled by the USCI module.
If the I2C functionality is selected, the output drives only the logical 0 to VSS level.
UCB1CLK function takes precedence over UCA1STE function. If the pin is required as UCB1CLK input or output, USCI A1 is forced to
3-wire SPI mode if 4-wire SPI mode is selected.
Detailed Description
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6.10.9 Port P6, P6.0 to P6.7, Input/Output With Schmitt Trigger
Pad Logic
To ADC12
INCHx = y
P6REN.x
P6DIR.x
DVSS
0
DVCC
1
1
0
1
P6OUT.x
0
Module X OUT
1
P6DS.x
0: Low drive
1: High drive
P6SEL.x
P6IN.x
EN
Module X IN
Bus
Keeper
P6.0/A0
P6.1/A1
P6.2/A2
P6.3/A3
P6.4/A4
P6.5/A5
P6.6/A6
P6.7/A7
D
Detailed Description
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Table 6-50. Port P6 (P6.0 to P6.7) Pin Functions
PIN NAME (P6.x)
P6.0/A0
x
0
FUNCTION
P6.0 (I/O)
A0 (2)
P6.1/A1
1
P6.1 (I/O)
A1 (2)
P6.2/A2
2
3
4
5
6
7
(3)
80
(3)
P6.7 (I/O)
A7 (2)
(1)
(2)
(2) (3)
P6.6 (I/O)
A6 (2)
P6.7/A7
(3)
P6.5 (I/O)
A5 (1)
P6.6/A6
(3)
P6.4 (I/O)
A4 (2)
P6.5/A5
(3)
P6.3 (I/O)
A3 (2)
P6.4/A4
(3)
P6.2 (I/O)
A2 (2)
P6.3/A3
(3)
(3)
CONTROL BITS OR SIGNALS (1)
P6DIR.x
P6SEL.x
INCHx
I: 0; O: 1
0
X
X
X
0
I: 0; O: 1
0
X
X
X
1
I: 0; O: 1
0
X
X
X
2
I: 0; O: 1
0
X
X
X
3
I: 0; O: 1
0
X
X
X
4
I: 0; O: 1
0
X
X
X
5
I: 0; O: 1
0
X
X
X
6
I: 0; O: 1
0
X
X
X
7
X = Don't care
Setting the P6SEL.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals.
The ADC12_A channel Ax is connected internally to AVSS if not selected by the respective INCHx bits.
Detailed Description
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6.10.10 Port P7, P7.0, Input/Output With Schmitt Trigger
Pad Logic
To XT1
P7REN.0
P7DIR.0
DVSS
0
DVCC
1
1
0
1
P7OUT.0
0
Module X OUT
1
P7DS.0
0: Low drive
1: High drive
P7SEL.0
P7.0/XIN
P7IN.0
EN
Module X IN
Bus
Keeper
D
Detailed Description
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6.10.11 Port P7, P7.1, Input/Output With Schmitt Trigger
Pad Logic
To XT1
P7REN.1
P7DIR.1
DVSS
0
DVCC
1
1
0
1
P7OUT.1
0
Module X OUT
1
P7SEL.0
P7.1/XOUT
P7DS.1
0: Low drive
1: High drive
XT1BYPASS
P7SEL.1
P7IN.1
Bus
Keeper
EN
Module X IN
D
Table 6-51. Port P7 (P7.0 and P7.1) Pin Functions
PIN NAME (P7.x)
P7.0/XIN
x
0
FUNCTION
P7.0 (I/O)
XIN crystal mode (2)
XIN bypass mode
P7.1/XOUT
1
(3)
82
P7DIR.x
P7SEL.0
P7SEL.1
XT1BYPASS
I: 0; O: 1
0
X
X
X
1
X
0
X
1
X
1
I: 0; O: 1
0
0
X
XOUT crystal mode (3)
X
1
X
0
(3)
X
1
0
1
P7.1 (I/O)
P7.1 (I/O)
(1)
(2)
(2)
CONTROL BITS OR SIGNALS (1)
X = Don't care
Setting P7SEL.0 causes the general-purpose I/O to be disabled. Pending the setting of XT1BYPASS, P7.0 is configured for crystal
mode or bypass mode.
Setting P7SEL.0 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P7.1 can be used as
general-purpose I/O.
Detailed Description
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6.10.12 Port P7, P7.2 and P7.3, Input/Output With Schmitt Trigger
Pad Logic
P7REN.x
P7DIR.x
0
0
Module X OUT
1
0
DVCC
1
1
Direction
0: Input
1: Output
1
P7OUT.x
DVSS
P7.2/TB0OUTH/SVMOUT
P7.3/TA1.2
P7DS.x
0: Low drive
1: High drive
P7SEL.x
P7IN.x
EN
Module X IN
D
Table 6-52. Port P7 (P7.2 and P7.3) Pin Functions
PIN NAME (P7.x)
P7.2/TB0OUTH/SVMOUT
P7.3/TA1.2
x
2
3
FUNCTION
CONTROL BITS OR SIGNALS
P7DIR.x
P7SEL.x
P7.2 (I/O)
I: 0; O: 1
0
TB0OUTH
0
1
SVMOUT
1
1
P7.3 (I/O)
I: 0; O: 1
0
TA1.CCI2B
0
1
TA1.2
1
1
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6.10.13 Port P7, P7.4 to P7.7, Input/Output With Schmitt Trigger
Pad Logic
To ADC12
INCHx = y
P7REN.x
P7DIR.x
DVSS
0
DVCC
1
1
0
1
P7OUT.x
0
Module X OUT
1
P7.4/A12
P7.5/A13
P7.6/A14
P7.7/A15
P7DS.x
0: Low drive
1: High drive
P7SEL.x
P7IN.x
Bus
Keeper
EN
D
Module X IN
Table 6-53. Port P7 (P7.4 to P7.7) Pin Functions
PIN NAME (P7.x)
P7.4/A12
x
4
FUNCTION
P7.4 (I/O)
A12 (2)
P7.5/A13
5
P7.5 (I/O)
A13
P7.6/A14
6
(2) (3)
P7.6 (I/O)
A14 (2)
P7.7/A15
7
(3)
84
(3)
P7.7 (I/O)
A15 (2)
(1)
(2)
(3)
(3)
CONTROL BITS OR SIGNALS (1)
P7DIR.x
P7SEL.x
I: 0; O: 1
0
INCHx
X
X
X
12
I: 0; O: 1
0
X
13
X
X
I: 0; O: 1
0
X
X
X
14
I: 0; O: 1
0
X
X
X
15
X = Don't care
Setting the P7SEL.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals.
The ADC12_A channel Ax is connected internally to AVSS if not selected by the respective INCHx bits.
Detailed Description
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6.10.14 Port P8, P8.0 to P8.7, Input/Output With Schmitt Trigger
Pad Logic
P8REN.x
P8DIR.x
0
0
Module X OUT
1
0
DVCC
1
1
Direction
0: Input
1: Output
1
P8OUT.x
DVSS
P8.0/TA0.0
P8.1/TA0.1
P8.2/TA0.2
P8.3/TA0.3
P8.4/TA0.4
P8.5/TA1.0
P8.6/TA1.1
P8.7
P8DS.x
0: Low drive
1: High drive
P8SEL.x
P8IN.x
EN
D
Module X IN
Table 6-54. Port P8 (P8.0 to P8.7) Pin Functions
PIN NAME (P8.x)
P8.0/TA0.0
x
0
FUNCTION
P8.0 (I/O)
TA0.CCI0B
TA0.0
P8.1/TA0.1
1
P8.1 (I/O)
TA0.CCI1B
TA0.1
P8.2/TA0.2
P8.3/TA0.3
P8.4/TA0.4
P8.5/TA1.0
P8.6/TA1.1
P8.7
2
3
4
5
6
7
CONTROL BITS OR SIGNALS
P8DIR.x
P8SEL.x
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
TA0.CCI2B
0
1
TA0.2
1
1
P8.2 (I/O)
P8.3 (I/O)
I: 0; O: 1
0
TA0.CCI3B
0
1
TA0.3
1
1
P8.4 (I/O)
I: 0; O: 1
0
TA0.CCI4B
0
1
TA0.4
1
1
P8.5 (I/O)
I: 0; O: 1
0
TA1.CCI0B
0
1
TA1.0
1
1
I: 0; O: 1
0
TA1.CCI1B
0
1
TA1.1
1
1
I: 0; O: 1
0
P8.6 (I/O)
P8.7 (I/O)
Detailed Description
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6.10.15 Port P9, P9.0 to P9.7, Input/Output With Schmitt Trigger
Pad Logic
P9REN.x
P9DIR.x
0
0
Module X OUT
1
0
1
P9DS.x
0: Low drive
1: High drive
P9SEL.x
P9IN.x
EN
Module X IN
1
Direction
0: Input
1: Output
1
P9OUT.x
DVSS
DVCC
P9.0/UCB2STE/UCA2CLK
P9.1/UCB2SIMO/UCB2SDA
P9.2/UCB2SOMI/UCB2SCL
P9.3/UCB2CLK/UCA2STE
P9.4/UCA2TXD/UCA2SIMO
P9.5/UCA2RXD/UCA2SOMI
P9.6
P9.7
D
Table 6-55. Port P9 (P9.0 to P9.7) Pin Functions
PIN NAME (P9.x)
P9.0/UCB2STE/UCA2CLK
x
0
FUNCTION
P9.0 (I/O)
UCB2STE/UCA2CLK
P9.1/UCB2SIMO/UCB2SDA
1
(2) (3)
P9.1 (I/O)
UCB2SIMO/UCB2SDA (2)
P9.2/UCB2SOMI/UCB2SCL
2
P9.2 (I/O)
UCB2SOMI/UCB2SCL (2)
P9.3/UCB2CLK/UCA2STE
3
(4)
(4)
P9.3 (I/O)
UCB2CLK/UCA2STE (2) (5)
P9.4/UCA2TXD/UCA2SIMO
4
P9.4 (I/O)
UCA2TXD/UCA2SIMO (2)
P9.5/UCA2RXD/UCA2SOMI
5
P9.5 (I/O)
UCA2RXD/UCA2SOMI
(2)
CONTROL BITS OR SIGNALS (1)
P9DIR.x
P9SEL.x
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
P9.6
6
P9.6 (I/O)
I: 0; O: 1
0
P9.7
7
P9.7 (I/O)
I: 0; O: 1
0
(1)
(2)
(3)
(4)
(5)
86
X = Don't care
The pin direction is controlled by the USCI module.
UCA2CLK function takes precedence over UCB2STE function. If the pin is required as UCA2CLK input or output, USCI B2 is forced to
3-wire SPI mode if 4-wire SPI mode is selected.
If the I2C functionality is selected, the output drives only the logical 0 to VSS level.
UCB2CLK function takes precedence over UCA2STE function. If the pin is required as UCB2CLK input or output, USCI A2 is forced to
3-wire SPI mode if 4-wire SPI mode is selected.
Detailed Description
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6.10.16 Port P10, P10.0 to P10.7, Input/Output With Schmitt Trigger
Pad Logic
P10REN.x
P10DIR.x
0
0
Module X OUT
1
0
DVCC
1
1
Direction
0: Input
1: Output
1
P10OUT.x
DVSS
P10DS.x
0: Low drive
1: High drive
P10SEL.x
P10IN.x
EN
Module X IN
P10.0/UCB3STE/UCA3CLK
P10.1/UCB3SIMO/UCB3SDA
P10.2/UCB3SOMI/UCB3SCL
P10.3/UCB3CLK/UCA3STE
P10.4/UCA3TXD/UCA3SIMO
P10.5/UCA3RXD/UCA3SOMI
P10.6
P10.7
D
Table 6-56. Port P10 (P10.0 to P10.7) Pin Functions
PIN NAME (P10.x)
P10.0/UCB3STE/UCA3CLK
x
0
FUNCTION
P10.0 (I/O)
UCB3STE/UCA3CLK (2)
P10.1/UCB3SIMO/UCB3SDA
1
P10.1 (I/O)
UCB3SIMO/UCB3SDA
P10.2/UCB3SOMI/UCB3SCL
2
(3)
(2) (4)
P10.2 (I/O)
UCB3SOMI/UCB3SCL (2)
P10.3/UCB3CLK/UCA3STE
3
(4)
P10.3 (I/O)
UCB3CLK/UCA3STE (2)
P10.4/UCA3TXD/UCA3SIMO
4
P10.4 (I/O)
UCA3TXD/UCA3SIMO
P10.5/UCA3RXD/UCA3SOMI
5
(2)
P10.5 (I/O)
UCA3RXD/UCA3SOMI (2)
P10.6
6
P10.6 (I/O)
Reserved
P10.7
(1)
(2)
(3)
(4)
(5)
7
(5)
CONTROL BITS OR SIGNALS (1)
P10DIR.x
P10SEL.x
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
P10.7 (I/O)
I: 0; O: 1
0
Reserved (5)
x
1
X = Don't care
The pin direction is controlled by the USCI module.
UCA3CLK function takes precedence over UCB3STE function. If the pin is required as UCA3CLK input or output, USCI B3 is forced to
3-wire SPI mode if 4-wire SPI mode is selected.
If the I2C functionality is selected, the output drives only the logical 0 to VSS level.
The secondary function on these pins are reserved for factory test purposes. Application should keep the P10SEL.x of these ports
cleared to prevent potential conflicts with the application.
Detailed Description
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6.10.17 Port P11, P11.0 to P11.2, Input/Output With Schmitt Trigger
Pad Logic
P11REN.x
P11DIR.x
0
0
Module X OUT
1
0
DVCC
1
1
Direction
0: Input
1: Output
1
P11OUT.x
DVSS
P11.0/ACLK
P11.1/MCLK
P11.2/SMCLK
P11DS.x
0: Low drive
1: High drive
P11SEL.x
P11IN.x
EN
D
Module X IN
Table 6-57. Port P11 (P11.0 to P11.2) Pin Functions
PIN NAME (P11.x)
P11.0/ACLK
x
0
FUNCTION
P11.0 (I/O)
ACLK
P11.1/MCLK
1
P11.1 (I/O)
MCLK
P11.2/SMCLK
2
P11.2 (I/O)
SMCLK
88
Detailed Description
CONTROL BITS OR SIGNALS
P11DIR.x
P11SEL.x
I: 0; O: 1
0
1
1
I: 0; O: 1
0
1
1
I: 0; O: 1
0
1
1
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6.10.18 Port J, J.0 JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
Pad Logic
PJREN.0
PJDIR.0
0
DVCC
1
PJOUT.0
0
From JTAG
1
DVSS
0
DVCC
1
1
PJ.0/TDO
PJDS.0
0: Low drive
1: High drive
From JTAG
PJIN.0
EN
D
6.10.19 Port J, J.1 to J.3 JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt
Trigger or Output
Pad Logic
PJREN.x
PJDIR.x
0
DVSS
1
PJOUT.x
0
From JTAG
1
DVSS
0
DVCC
1
PJDS.x
0: Low drive
1: High drive
From JTAG
1
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
PJIN.x
EN
To JTAG
D
Detailed Description
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Table 6-58. Port PJ (PJ.0 to PJ.3) Pin Functions
PIN NAME (PJ.x)
x
CONTROL BITS OR
SIGNALS (1)
FUNCTION
PJDIR.x
PJ.0/TDO
0
PJ.0 (I/O) (2)
I: 0; O: 1
TDO (3)
PJ.1/TDI/TCLK
1
X
PJ.1 (I/O) (2)
TDI/TCLK (3)
PJ.2/TMS
2
PJ.2 (I/O)
TMS (3)
PJ.3/TCK
3
90
(4)
X
(2)
I: 0; O: 1
(4)
X
PJ.3 (I/O) (2)
TCK (3)
(1)
(2)
(3)
(4)
I: 0; O: 1
I: 0; O: 1
(4)
X
X = Don't care
Default condition
The pin direction is controlled by the JTAG module.
In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are do not care.
Detailed Description
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6.11 Device Descriptors (TLV)
Table 6-59 shows the complete contents of the device descriptor tag-length-value (TLV) structure.
Table 6-59. Device Descriptor Table (1)
Info Block
Die Record
ADC12 Calibration
REF Calibration
Peripheral Descriptor
(1)
DESCRIPTION
ADDRESS
SIZE
(bytes)
MSP430BT5190
Info length
01A00h
1
06h
CRC length
01A01h
1
06h
CRC value
01A02h
2
per unit
Device ID
01A04h
1
05h
VALUE
Device ID
01A05h
1
80h
Hardware revision
01A06h
1
per unit
Firmware revision
01A07h
1
per unit
Die Record Tag
01A08h
1
08h
Die Record length
01A09h
1
0Ah
Lot/Wafer ID
01A0Ah
4
per unit
Die X position
01A0Eh
2
per unit
Die Y position
01A10h
2
per unit
Test results
01A12h
2
per unit
ADC12 Calibration Tag
01A14h
1
11h
ADC12 Calibration length
01A15h
1
10h
ADC Gain Factor
01A16h
2
per unit
ADC Offset
01A18h
2
per unit
ADC 1.5-V Reference
Temp. Sensor 30°C
01A1Ah
2
per unit
ADC 1.5-V Reference
Temp. Sensor 85°C
01A1Ch
2
per unit
ADC 2.0-V Reference
Temp. Sensor 30°C
01A1Eh
2
per unit
ADC 2.0-V Reference
Temp. Sensor 85°C
01A20h
2
per unit
ADC 2.5-V Reference
Temp. Sensor 30°C
01A22h
2
per unit
ADC 2.5-V Reference
Temp. Sensor 85°C
01A24h
2
per unit
12h
REF Calibration Tag
01A26h
1
REF Calibration length
01A27h
1
06h
REF 1.5-V Reference
01A28h
2
per unit
REF 2.0-V Reference
01A2Ah
2
per unit
REF 2.5-V Reference
01A2Ch
2
per unit
Peripheral Descriptor Tag
01A2Eh
1
02h
Peripheral Descriptor Length
01A2Fh
1
61h
Memory 1
2
08h
8Ah
Memory 2
2
0Ch
86h
Memory 3
2
0Eh
30h
Memory 4
2
2Eh
98h
Memory 5
0/1
NA
NA = Not applicable
Detailed Description
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Table 6-59. Device Descriptor Table(1) (continued)
DESCRIPTION
92
ADDRESS
SIZE
(bytes)
MSP430BT5190
VALUE
Delimiter
1
00h
Peripheral count
1
21h
MSP430CPUXV2
2
00h
23h
SBW
2
00h
0Fh
EEM-8
2
00h
05h
TI BSL
2
00h
FCh
Package
2
00h
1Fh
SFR
2
10h
41h
PMM
2
02h
30h
FCTL
2
02h
38h
CRC16-straight
2
01h
3Ch
CRC16-bit reversed
2
00h
3Dh
RAMCTL
2
00h
44h
WDT_A
2
00h
40h
UCS
2
01h
48h
SYS
2
02h
42h
REF
2
03h
A0h
Port 1/2
2
05h
51h
Port 3/4
2
02h
52h
Port 5/6
2
02h
53h
Port 7/8
2
02h
54h
Port 9/10
2
02h
55h
Port 11/12
2
02h
56h
JTAG
2
08h
5Fh
TA0
2
02h
62h
TA1
2
04h
61h
TB0
2
04h
67h
RTC
2
0Eh
68h
Detailed Description
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Table 6-59. Device Descriptor Table(1) (continued)
DESCRIPTION
Interrupts
ADDRESS
SIZE
(bytes)
MSP430BT5190
VALUE
MPY32
2
02h
85h
DMA-3
2
04h
47h
USCI_A/B
2
0Ch
90h
USCI_A/B
2
04h
90h
USCI_A/B
2
04h
90h
USCI_A/B
2
04h
90h
ADC12_A
2
08h
D1h
TB0.CCIFG0
1
64h
TB0.CCIFG1..6
1
65h
WDTIFG
1
40h
USCI_A0
1
90h
USCI_B0
1
91h
ADC12_A
1
D0h
TA0.CCIFG0
1
60h
TA0.CCIFG1..4
1
61h
USCI_A2
1
94h
USCI_B2
1
95h
DMA
1
46h
TA1.CCIFG0
1
62h
TA1.CCIFG1..2
1
63h
P1
1
50h
USCI_A1
1
92h
USCI_B1
1
93h
USCI_A3
1
96h
USCI_B3
1
97h
P2
1
51h
RTC_A
1
68h
Delimiter
1
00h
Detailed Description
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7 Device and Documentation Support
7.1
Device Support
7.1.1
Getting Started and Next Steps
For an introduction to the MSP430™ family of devices and the tools and libraries that are available to help
with your development, visit the Getting Started page.
7.1.2
Development Tools Support
All MSP430™ microcontrollers are supported by a wide variety of software and hardware development
tools. Tools are available from TI and various third parties. See them all at www.ti.com/msp430tools.
7.1.2.1
Hardware Features
See the Code Composer Studio for MSP430 User's Guide (SLAU157) for details on the available features.
MSP430
Architecture
4-Wire
JTAG
2-Wire
JTAG
Breakpoints
(N)
Range
Breakpoints
Clock
Control
State
Sequencer
Trace
Buffer
LPMx.5
Debugging
Support
MSP430Xv2
Yes
Yes
8
Yes
Yes
Yes
Yes
No
7.1.2.2
Recommended Hardware Options
7.1.2.2.1 Experimenter Boards
Experimenter Boards and Evaluation kits are available for some MSP430 devices. These kits feature
additional hardware components and connectivity for full system evaluation and prototyping. See
www.ti.com/msp430tools for details.
7.1.2.2.2 Debugging and Programming Tools
Hardware programming and debugging tools are available from TI and from its third party suppliers. See
the full list of available tools at www.ti.com/msp430tools.
7.1.2.2.3 Production Programmers
The production programmers expedite loading firmware to devices by programming several devices
simultaneously.
Part Number
MSP-GANG
7.1.2.3
PC Port
Serial and USB
Features
Provider
Program up to eight devices at a time. Works with a PC or as a
stand-alone device.
Texas Instruments
Recommended Software Options
7.1.2.3.1 Integrated Development Environments
Software development tools are available from TI or from third parties. Open source solutions are also
available.
This device is supported by Code Composer Studio™ IDE (CCS).
7.1.2.3.2 MSP430Ware
MSP430Ware is a collection of code examples, data sheets, and other design resources for all MSP430
devices delivered in a convenient package. In addition to providing a complete collection of existing
MSP430 design resources, MSP430Ware also includes a high-level API called MSP430 Driver Library.
This library makes it easy to program MSP430 hardware. MSP430Ware is available as a component of
CCS or as a stand-alone package.
94
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7.1.2.3.3 TI-RTOS
TI-RTOS is an advanced real-time operating system for the MSP430 microcontrollers. It features
preemptive deterministic multitasking, hardware abstraction, memory management, and real-time analysis.
TI-RTOS is available free of charge and is provided with full source code.
7.1.2.3.4 Command-Line Programmer
MSP430 Flasher is an open-source, shell-based interface for programming MSP430 microcontrollers
through a FET programmer or eZ430 using JTAG or Spy-Bi-Wire (SBW) communication. MSP430 Flasher
can be used to download binary files (.txt or .hex) files directly to the MSP430 microcontroller without the
need for an IDE.
7.1.3
Device and Development Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
MSP430 MCU devices and support tools. Each MSP430 MCU commercial family member has one of
three prefixes: MSP, PMS, or XMS (for example, MSP430F5438A). TI recommends two of three possible
prefix designators for its support tools: MSP and MSPX. These prefixes represent evolutionary stages of
product development from engineering prototypes (with XMS for devices and MSPX for tools) through fully
qualified production devices and tools (with MSP for devices and MSP for tools).
Device development evolutionary flow:
XMS – Experimental device that is not necessarily representative of the electrical specifications for the
final device
PMS – Final silicon die that conforms to the electrical specifications for the device but has not completed
quality and reliability verification
MSP – Fully qualified production device
Support tool development evolutionary flow:
MSPX – Development-support product that has not yet completed TI's internal qualification testing.
MSP – Fully-qualified development-support product
XMS and PMS devices and MSPX development-support tools are shipped against the following
disclaimer:
"Developmental product is intended for internal evaluation purposes."
MSP devices and MSP development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (XMS and PMS) have a greater failure rate than the standard
production devices. TI recommends that these devices not be used in any production system because
their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, PZP) and temperature range (for example, T). Figure 7-1 provides a legend
for reading the complete device name for any family member.
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MSP 430 F 5 438 A I ZQW T XX
Processor Family
Optional: Additional Features
430 MCU Platform
Optional: Tape and Reel
Device Type
Packaging
Series
Feature Set
Processor Family
430 MCU Platform
Optional: Temperature Range
Optional: A = Revision
CC = Embedded RF Radio
MSP = Mixed-Signal Processor
XMS = Experimental Silicon
PMS = Prototype Device
TI’s Low-Power Microcontroller Platform
Device Type
Memory Type
C = ROM
F = Flash
FR = FRAM
G = Flash or FRAM (Value Line)
L = No Nonvolatile Memory
Specialized Application
AFE = Analog Front End
BT = Preprogrammed with Bluetooth
BQ = Contactless Power
CG = ROM Medical
FE = Flash Energy Meter
FG = Flash Medical
FW = Flash Electronic Flow Meter
Series
1 Series = Up to 8 MHz
2 Series = Up to 16 MHz
3 Series = Legacy
4 Series = Up to 16 MHz with LCD
5 Series = Up to 25 MHz
6 Series = Up to 25 MHz with LCD
0 = Low-Voltage Series
Feature Set
Various Levels of Integration Within a Series
Optional: A = Revision
N/A
Optional: Temperature Range S = 0°C to 50°C
C = 0°C to 70°C
I = –40°C to 85°C
T = –40°C to 105°C
Packaging
http://www.ti.com/packaging
Optional: Tape and Reel
T = Small Reel
R = Large Reel
No Markings = Tube or Tray
Optional: Additional Features -EP = Enhanced Product (–40°C to 105°C)
-HT = Extreme Temperature Parts (–55°C to 150°C)
-Q1 = Automotive Q100 Qualified
Figure 7-1. Device Nomenclature
96
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7.2
SLAS703B – APRIL 2010 – REVISED AUGUST 2015
Documentation Support
The following documents describe the MSP430BT5190 device. Copies of these documents are available
on the Internet at www.ti.com.
7.3
SLAU208
MSP430x5xx and MSP430x6xx Family User's Guide. Detailed information on the modules
and peripherals available in this device family.
SLAZ071
MSP430BT5190 Device Erratasheet. Describes the known exceptions to the functional
specifications for all silicon revisions of this device.
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Community
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At
e2e.ti.com, you can ask questions, share knowledge, explore ideas, and help solve problems with fellow
engineers.
TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki. Established to help developers get started with embedded
processors from Texas Instruments and to foster innovation and growth of general knowledge about the
hardware and software surrounding these devices.
7.4
Trademarks
MSP430, MicroStar Junior, Code Composer Studio, E2E are trademarks of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
Mindtree is a trademark of Mindtree Ltd.
All other trademarks are the property of their respective owners.
7.5
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
7.6
Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from disclosing party under
nondisclosure obligations (if any), or any direct product of such technology, to any destination to which
such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior
authorization from U.S. Department of Commerce and other competent Government authorities to the
extent required by those laws.
7.7
Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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8 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
98
Mechanical, Packaging, and Orderable Information
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PACKAGE OPTION ADDENDUM
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12-Jun-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MSP430BT5190IPZ
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430BT5190
MSP430BT5190IPZR
ACTIVE
LQFP
PZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430BT5190
MSP430BT5190IZQWR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430BT5190
MSP430BT5190IZQWT
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430BT5190
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jun-2015
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Feb-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
MSP430BT5190IPZR
Package Package Pins
Type Drawing
LQFP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
PZ
100
1000
330.0
24.4
17.0
17.0
2.1
20.0
24.0
Q2
MSP430BT5190IZQWR
BGA MI
CROSTA
R JUNI
OR
ZQW
113
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q1
MSP430BT5190IZQWT
BGA MI
CROSTA
R JUNI
OR
ZQW
113
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Feb-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MSP430BT5190IPZR
LQFP
PZ
100
1000
367.0
367.0
45.0
MSP430BT5190IZQWR
BGA MICROSTAR
JUNIOR
ZQW
113
2500
336.6
336.6
28.6
MSP430BT5190IZQWT
BGA MICROSTAR
JUNIOR
ZQW
113
250
213.0
191.0
55.0
Pack Materials-Page 2
MECHANICAL DATA
MTQF013A – OCTOBER 1994 – REVISED DECEMBER 1996
PZ (S-PQFP-G100)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
75
0,08 M
51
76
50
100
26
1
0,13 NOM
25
12,00 TYP
Gage Plane
14,20
SQ
13,80
16,20
SQ
15,80
0,05 MIN
1,45
1,35
0,25
0°– 7°
0,75
0,45
Seating Plane
0,08
1,60 MAX
4040149 /B 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
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regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
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