NEW Memory Stick® Connectors CB1 Series Card Push Insert/Push Eject <CB1G Series> ● Card ejection distance of 10 mm ● Mounting height of 3.5 mm ● Mounting area: Smaller design is 78% of former size ■Outline Receptacle connectors for use with the new generation of digital media devices requiring “Memory Stick® ” type of consumer removable memory card. Several variations are available: Miniature, Low Profile and with or without ejection mechanism. Button Touch Ejection <CB1F Series> ■Features 1. Indication of Incorrect Card Insertion The connector will not allow the card to be complete inserted from the wrong end or reversed. The card will stop about 7mm before complete insertion position, visually indicating incorrect insertion. 2. Protection of the Contacts Incorrect insertion of the card will not damage the contacts. The card can be easily withdrawn and reinserted correctly. ● Card ejection with tactile button operation ● Card ejection distance of 10 mm ● Equipped with card ejection switch 3. Excellent Card Handling The type that is equipped with an ejection mechanism provides a long ejection of the card which offers excellent card handling qualities. Without Card Ejection <CB1D Series> *Memory Stick is a registered trademark of the Sony Corporation. ● Miniaturized, low profile design ● Improved installation to the equipment is permitted using (M1.7) tapping screws ● Can be equipped with an ejection mechanism depending on the design of the equipment side portion Note: Please position the card ejection button at the side of the equipment. 2003.12 1 ■Product Specifications Current rating 0.5A Operating temperature range -20ç to +85ç(Note) Voltage rating 125V AC Storage temperature range -40ç to +85ç Rating Operating humidity range Relative humidity 96% max. Item Specification 1. Insulation resistance (No condensation) Conditions 1000 M ohms min. 500 V DC 2. Withstanding voltage No flashover or insulation breakdown 500 V AC / one minute 3. Contact resistance 100 m ohms max. 100mA DC 4. Vibration No electrical discontinuity of 1 µs or more Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis 5. Humidity Contact resistance: 40 m ohms max. from initial value Insulation resistance: 100 M ohms min. 96 hours at temperature of 40ç±2ç and humidity of 90% to 95% 6. Temperature cycle Contact resistance: 40 m ohms max. from initial value Insulation resistance: 100 M ohms min. Temperature: -55ç/+5ç to +35ç/+85ç/+5ç to +35ç Duration: 30/5/30/5(Minutes) 5 cycles 7. Durability (mating/unmating) Contact resistance: 40m ohms max. from initial value 12000 cycles at 400 to 600 cycles per hour 8. Resistance to soldering heat No deformation of any component. No affect on contacts Reflow: At the recommended temperature profile Manual soldering: 300ç for 3 seconds Note :Includes temperature rise caused by current flow. ■Materials Part Material Insulator Heat resistant glass reinforced therm oplastic compound Contacts Phosphor bronze Metal hold down Finish Phosphor bronze or stainless steel Remarks Color: Black UL94V-0 Contact area: Gold plated Termination area: Tin-Iead plated or tinned copper plated Contact area: Nickel plating Termination area: Tin-Iead plated or tinned copper plated CB1E,CB1F,CB1G Series is without the termination area. ---------- Cover Stainless steel or cupper alloy ---------- The CB1E Series has termination area with tin-lead plated. Eject mechanism components Stainless steel Heat resistant glass reinforced therm oplastic compound ---------- UL94V-0 ■Ordering information CB 1 E - 10 S - 1.5 H - PEJC - * 1 2 1 Series name 2 Series No. 3 Ejector type 3 4 5 6 : CB :1 } :C E With eject mechanism F G D Without eject mechanism A 4 Number of contacts : 10 5 Connector type S : Receptacle } 2 7 8 9 6 Contact pitch : 1.5 mm 7 Surface mount 8 Eject mechanism codes: PEJC : Card Push insert/Push eject EJL : Left button eject EJR : Right button eject 9 Suffix Card pushed for ejection 29.4 26.8 (5.525) BPCB mounting pattern Memory stick card outline 3.85 (3.25) 1.9±0.1 4±0.1 26.6±0.1 (19.8) 1.9±0.1 1.9±0.1 CL No. CL689-0037-5 33 Part No. CB1G-10S-1.5H-PEJC2 26.8±0.1 26.2 3.2 (21) (31) Card ejected Card fully inserted ■Low Profile, Push Insert-Push Eject 0.9±0.05 P=1.5±0.03 0.6 P=1.5 13.5 9.3±0.05 3.5 CONTACT No.1 9.3 BPCB mounting pattern Card fully inserted 27.75 22.75 Memory stick card outline 11.975 (5.525) 3.85 (2) (0.8) 4.5 16.5±0.03 1.5±0.03 10.9±00.3 18.3 34.9 11.15±0.03 10.9 .05 +00 0.6±0.05 0.9±0.05 0.6 CONTACT No.1 0.4 3 4.2 P=1.5 13.5 32.5 37 P=1.5±0.05 13.5±0.05 3.5 3±0.05 4.2±0.05 5.3±0.1 1.3 2-Ø 3.4±0.1 39.8 18.3±00.3 5 (13) 1 0. 0 + 0. - CL689-0028-4 .2 CB1F-10S-1.5H-TEJL-PA Ø3 CL No. 32.5±00.3 4- .4 Ø2 4- Part No. Eject stroke (3.25) (23) Card ejected ■Button Touch Eject Ø0.55 11.15 1.5 Ø1.2 16.5 ■Without Card Ejection BPCB mounting pattern 24.7 13.5 4.15 5.8 6.95 CB1D-10S-1.5H CL689-0021-5 3.55 2.65±0.03 .3 +0 0 .0 .8 6.1±0.05 1±0.1 1±0.1 P=1.5±0.05 13.5±0.05 5.8±0.05 0.6 24.5 CL No. 0.3 1 0. + 0 Ø1 2±0.1 P=1.5 2±0.1 5.5 0.6 1.45 1.4 CONTACT No.1 1.05±0.05 4.15±0.05 6.1±0.05 0 .05 .3 Ø1 Part No. 18.7±0.03 .3 +0 Ø1 19.5 Ø1 5 3.5 Ø1.2 4.15 18.7 3 ■Push Insert-Push Eject Card ejected (19.5) (13.3) Card fully inserted Card pushed for ejection (12) BPCB mounting pattern 30.4 26.8 (5.525) Memory stick card outline (3.25) 0.9±0.05 P=1.5±0.03 CONTACT No.1 0.6 P=1.5 13.5 (19.5) Card ejected Card fully inserted (13.3) Card pushed for ejection (12) (3.5) 9.3 30.4 26.8 13.4 (5.525) BPCB mounting pattern 8.85 3.85 Memory stick (3.25) card outline 24±0.03 15.1 3.2 10.5±0.1 8.6±0.1 CL689-0034-7 24 40.8 CB1EBG-10S-1.5H-PEJC2 0.9±0.05 P=1.5±0.03 8.1 9.3±0.05 CONTACT No.1 3.5 9.3 29.4 26.8 8.3 (5.525) BPCB mounting pattern Memory stick card outline 3.85 (3.25) 26.8±0.1 1.9±0.1 4±0.1 1.9±0.1 (12) 0.9±0.05 P=1.5±0.03 0.6 P=1.5 13.5 4 4±0.1 10.5±0.1 8.6±0.1 CL No. CL689-0035-0 10.1 Part No. CB1EBH-10S-1.5H-PEJC2 24 40.8 23.8 3.2 24±0.03 3.6 (19.5) Card ejected (13.3) Card fully inserted Card pushed for ejection 0.6 P=1.5 13.5 ● With square window 2.4±0.1 26.8±0.1 4±0.1 2.4±0.1 10.1 CL No. 9.3±0.05 4±0.1 ● With "U" cut-out Part No. 2.4±0.1 4±0.1 24±0.03 10.5±0.1 3.2 40.8 24 CL No. CL689-0026-9 10.1 Part No. CB1EB-10S-1.5H-PEJC2 26.8±0.1 4±0.1 2.4±0.1 8.6±0.1 ● Normal type CONTACT No.1 3.5 9.3 9.3±0.05 Card ejected ■Left Ejection 23.1 4.45 21.8 3.65 Memory stick card outline 16.45 4.05 (3.3) 5.2 3.5 Eject stroke (6) 8.75 0.1 Ø1 47.95 26.45 CL No. CL689-0006-1-56 53.45 Part No. CB1C-10S-1.5H-EJL(56) 51.45 .8 BPCB mounting pattern 10.5 5.55 .05 +00 .3 1 2-Ø 6.55 48MAX 3±0.1 10.5±0.03 2 4.55 13.5 5.5 0.9±0.1 P= 1.5±0.05 0.6 P=1.5 CONTACT No.1 4.95±0.05 2.4±0.1 0.4±0.05 29.9 .2 Ø1 2- 4.65±0.05 3.45 Front edge of the printed circuit board 3.2±0.1 13.5±0.05 4.55±0.05 9.25 Memory stick card outline 17.35 Card ejected ■Right Ejection 4.4 23 21.8 3.65 CL689-0007-4-59 41MAX 2.4±0.1 4.95±0.05 0.4±0.05 3±0.1 13.5±0.05 53.45 5.55 2 0.6 31.2 2 0.9±0.1 P=1.5±0.05 5 .0 +0 0 3 1. Ø 2- . Ø1 10.5±0.03 2- 4.65±0.05 Front edge of the printed circuit board 3.45 BPCB mounting pattern 10.5 4.55 P=1.5 CONTACT No.1 13.5 5.5 CB1C-10S-1.5H-EJR(59) 47.15 CL No. 23.4 Part No. 43.95 Ø2 . 3 8.6 Eject stroke (3.3) 3.2 (6) 4.05 3.2±0.1 4.55±0.05 5 ■With flange, for screw attachment BPCB mounting pattern 33.45 16.5 13.5 1.5 P=1.5 30.05±0.05 4.725 30.05 4.725±0.05 e) ol P=1.5±0.05 (h 8 2Ø1 . 2 0. + 0 0.5 13.5±0.05 5.25 .2 Ø2 CONTACT No.1 + 0 0 .2 26.3 0.6 16.5±0.05 .2 Ø2 6.3±0.1 6.6±0.1 7.4±0.1 4.9±0.1 4.4±0.05 11.6±0.1 2.75±0.1 .1 +0 0 e) ol (h 2 0.9±0.05 .1 Ø2 2- CL No. CL689-0001-8-57 1.2 20.3 18.6 2.9 1.9 4.4 e) ol (h Part No. CB1A-10S-1.5H(57) 3.8±0.1 4.1±0.1 1.7 5.3 1.5 3.3±0.1 19.25 3.8±0.1 Ø2 ■Without flange BPCB mounting pattern 16.5 13.5 P=1.5 16.5±0.05 13.5±0.05 26.3 6.3±0.1 6.6±0.1 3.8±0.1 4.1±0.1 11.6±0.1 4.9±0.1 18.6 2 5.3 26.7 3.3±0.1 CL689-0002-0-57 1.2 CB1AA-10S-1.5H(57) 2.75±0.1 e) ol (h CL No. 1 0. + 0 Part No. 0.9±0.05 .1 Ø2 2- 20.3 7.4±0.1 0.5 P=1.5±0.05 5.25 0.6 CONTACT No.1 3.8±0.1 1.5 19.25 Ø2 BMemory Stick card insertion direction BMemory Stick fully inserted dimensions 21.45 4.4 2.8 9.5 40.5 1.35 6 ■Packaging specification (Tray packaging) ● Part Number: CB1G-10S-1.5H-PEJC2(1 tray: 40 pieces) ● Part Number: CB1F-10S-1.5H-TEJL-PA(1 tray: 20 pieces) 330 -10 30.1±0.2 320±0.5 252±0.3 P=36±0.2 43±0.2 A ● Part Number: CB1D-10S-1.5H(1 tray: 50 pieces) ● Part Number: CB1EB*-10S-1.5H-PEJC2(1 tray: 25 pieces) 330 -10 330 -10 27.5±0.2 320±0.5 255.5±0.3 19±0.2 32.25±0.2 CB1F(TEJL1) 2 0 PI CS 225 -1 0 PS CB1G SERIES 0 225 -1 215±0.5 160±0.3 P=40±0.2 A A 40PICS PS 320±0.5 195±0.3 P=65±0.2 A 100±0.2 215±0.5 160±0.3 P=40±0.2 30.1±0.2 330 -10 P=36.5±0.2 B 320±0.5 220±0.3 55±0.2 P=55±0.2 A A CB1C(L1) 330 -10 320±0.5 222±0.3 55±0.2 P=74±0.2 CB1E(PEJC1) B B CB1C(R1) 225 -10 215±0.5 156±0.3 P=52±0.2 225 -10 215±0.5 160±0.3 P=40±0.2 A ● Part Number: CB1C-10S-1.5H-EJR(59)(1 tray: 20 pieces) 20PICS 29.5±0.2 A 25PICS 0 330 -10 320±0.5 253.2±0.3 P=63.3±0.2 33.4±0.2 215±0.5 160±0.3 P=40±0.2 225 -1 ● Part Number: CB1C-10S-1.5H-EJL(56)(1 tray: 20 pieces) 27.5±0.2 225 -10 215±0.5 177±0.3 P=29.5±0.2 PS B 20PICS ● Part Number: CB1A*-10S-1.5H(57)(1 tray: 50 pieces) 330 -10 320±0.5 276.5±0.3 P=39.5±0.2 C C CB1A(1) 225 -10 215±0.5 177±0.3 P=29.5±0.2 19±0.2 21.75±0.2 7 BUsage Precautions 1.Care should be taken to correctly insert/withdraw the Memory Stick® card. Following correct insertion/withdrawal procedures will prevent device or connector damage. When handling the CB1C series connectors, hold it in the areas indicated by the arrows, as illustrated below. CB1A Series CB1C Series Contacts Recommended holding area Recommended holding area Contacts, metal hold-down and ejection components areas Metal hold-down 2.Follow the recommended insertion angles, as illustrated below. <Memory Stick Allowable Insertion Angles> CB1A Series CB1C Series Outline of the Memory Stick card ±1°MAX ±2°MA X 0°±0 ±1°M AX Outline of the Memory Stick card °MAX .22° ±0. 2°M 15 ±0.5 Initial insertion (15 mm max.) 8 Complete insertion (from 15 mm to full insertion) AX 3.When inserting or withdrawing cards from the CB1C Series, the side contacts on both sides will protrude outward by 0.6 mm. Care should be taken that they will not be restricted or touch other components. side contact (0.6) 4. Application of an excessive external force to the push rod may prevent the ejection or insertion of the card. Do not apply any load in a direction other than the push direction. Do not twist or bend ! Push direction Do not pull ! Push rod 9 ■Recommended Temperature Profile 300ç IR Reflow Conditions Preheating : 150ç 30 to 90 sec. 240ç max. Soldering : 235±5ç 10 sec. max. 220ç min. 10 to 20 sec. 220ç 200ç Soldering 150ç Preheating 100ç 0ç 0S 50S 100S 150S <Recommended Conditions> Reflow system : IR reflow Solder : Paste type 63 Sn/37 Pb (Flux content 9 wt%) Test board : Glass epoxy 60mm x 100mm x 1.6 mm Metal mask thickness : 0.15 mm Recommended temperature. The temperature may be slightly changed according to the solder paste type and volume used. 10 200S