Burr-Brown OPA827I Low-noise, high-precision, jfet-input, operational amplifier Datasheet

 OP
A8
27
OPA827
OPA2827
OP
A2
827
SBOS376C – NOVEMBER 2006 – REVISED AUGUST 2007
Low-Noise, High-Precision, JFET-Input,
OPERATIONAL AMPLIFIER
FEATURES
OFFSET: 250μV (max)
DRIFT: 1μV/°C
LOW NOISE: 4.5nV/√Hz at 1kHz
BANDWIDTH: 18MHz
SLEW RATE: 22V/μs
BIAS CURRENT: 3pA
QUIESCENT CURRENT: 4.5mA/Ch
WIDE SUPPLY RANGE: ±4V to ±18V
SINGLE PACKAGES: MSOP-8, SO-8
DUAL PACKAGES: SO-8 PowerPAD
The OPA827 series of JFET operational amplifiers
combines outstanding dc precision with excellent ac
performance. It offers 100μV of offset, very low drift
(1μV/°C) over temperature, low bias currents, and
very low flicker noise of 400nVPP (0.1Hz to 10Hz). It
operates over a very wide supply voltage range of
±4V to ±18V on a low 4.5mA supply current. A dual
version is also available for the OPA827 family.
Excellent ac characteristics, such as 18MHz gain
bandwidth (GBW) and 22V/μs slew rate, and
precision dc characteristics make the OPA827 series
well-suited for a wide range of applications such as
16to
18-bit
data
acquisition
systems,
transimpedance (I/V-conversion) amplifiers, filters,
precision ±10V front ends, and professional audio
applications.
APPLICATIONS
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PRECISION ±10V INPUT FRONT-ENDS
TRANSIMPEDANCE AMPLIFIERS
INTEGRATORS
ACTIVE FILTERS
A/D CONVERTER DRIVERS
DAC OUTPUT BUFFERS
HIGH-PERFORMANCE AUDIO
PROCESS CONTROL
TEST EQUIPMENT
MEDICAL EQUIPMENT
The single version (OPA827) is available in both
MSOP-8 and standard SO-8 surface-mount
packages. The dual version (OPA2827) is available
in the SO-8 PowerPAD for increased power
dissipation capability. All versions are specified from
–40°C to +125°C.
+15V
2.2mF
100nF
100pF
500W
ADS8505
200W
VIN
500W
REF
VIN
100pF
OPA827
33.2kW
2.2mF
AGND1
2.2mF
CAP
100nF
2.2mF
DGND
AGND2
-15V
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCT PREVIEW information concerns products in the
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.
Copyright © 2006–2007, Texas Instruments Incorporated
PRODUCT PREVIEW
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DESCRIPTION
OPA827
OPA2827
www.ti.com
SBOS376C – NOVEMBER 2006 – REVISED AUGUST 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION (1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
Standard Grade
OPA827A
OPA2827A
SO-8
D
OPA827A
MSOP-8
DGK
TBD
SO-8 PowerPAD
DDA
TBD
High Grade
OPA827I
OPA2827I
(1)
SO-8
D
OPA827
MSOP-8
DGK
TBD
SO-8 PowerPAD
DDA
TBD
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
PRODUCT PREVIEW
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range (unless otherwise noted)
Supply Voltage
VALUE
UNIT
±20
V
Signal Input Terminals
Voltage (2)
(V–) –0.7 to (V+) +0.7
V
Current (2)
±10
mA
Differential Input Voltage
TBD
Output Short-Circuit (3)
Operating Temperature
–55 to +125
°C
Storage Temperature
–65 to +150
°C
Junction Temperature
+150
°C
(1)
(2)
(3)
2
V
Continuous
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.7V beyond the supply rails should
be current-limited to 10mA or less.
Short-circuit to ground, one amplifier per package.
Submit Documentation Feedback
OPA827
OPA2827
www.ti.com
SBOS376C – NOVEMBER 2006 – REVISED AUGUST 2007
PIN ASSIGNMENTS
OPA827
SO-8, MSOP-8
(TOP VIEW)
NC
(1)
OPA2827
SO-8 PowerPAD
(TOP VIEW)
Out A
1
-In A
2
+In A
3
V-
4
(1)
1
8
NC
-IN
2
7
V+
+IN
3
6
OUT
V-
4
5
NC
(1)
Exposed
Thermal
Die Pad
on
Underside.
(Must be
connected
to V-)
8
V+
7
Out B
6
-In B
5
+In B
Pad
PRODUCT PREVIEW
(1) NC denotes no internal connection.
Submit Documentation Feedback
3
OPA827
OPA2827
www.ti.com
SBOS376C – NOVEMBER 2006 – REVISED AUGUST 2007
ELECTRICAL CHARACTERISTICS: VS = ±4V to ±18V
BOLDFACE limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted.
Standard Grade
OPA827A, OPA2827A
PARAMETER
CONDITIONS
MIN
TYP
MAX
TBD
1
High Grade
OPA827I, OPA2827I (1)
MIN
TYP
MAX
UNIT
250
TBD
TBD
μV
3.5
TBD
TBD
OFFSET VOLTAGE
Input Offset Voltage
Drift
VOS
VCM = 0V, VS = ±15V
dVOS/dT
±0.2
vs Time
vs Power Supply
PSRR
VS = ±4V to ±18V, VCM = 0V
±0.2
TBD
10
VS = ±4V to ±18V, VCM = 0V
Over Temperature
TBD
30
Channel Separation, dc
TBD
μV/°C
μV/month
TBD
μV/V
TBD
μV/V
μV/V
TBD
INPUT BIAS CURRENT
Input Bias Current
Input Offset Current
±3
TBD
±3
TBD
pA
TBD
TBD
TBD
TBD
pA
±3
TBD
±3
TBD
pA
IB
Over Temperature
IOS
NOISE
Input Voltage Noise:
en
VS = ±18V, VCM = 0V
0.4
0.4
μVPP
f = 1kHz
en
VS = ±18V, VCM = 0V
4.5
4.5
nV/√Hz
f = 10kHz
en
VS = ±18V, VCM = 0V
4.5
4.5
nV/√Hz
in
VS = ±18V, VCM = 0V
TBD
TBD
fA/√Hz
PRODUCT PREVIEW
f = 0.1Hz to 10Hz
Input Voltage Noise Density:
Input Current Noise Density:
f = 1kHz
INPUT VOLTAGE RANGE
Common-Mode Voltage
Range
Common-Mode Rejection
Ratio
VCM
CMRR
(V–)+2.5
(V–)+2.5V < VCM < (V+)–2.5V
(V+)–2.5
108
Over Temperature
(V–)+2.5
(V+)–2.5
TBD
V
dB
TBD
TBD
dB
1013 TBD
1013 TBD
INPUT IMPEDANCE
Differential
13
Common-Mode
10
1013
7
7
Ω pF
Ω pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain
AOL
Over Temperature
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Settling Time, 0.1%
4
120
TBD
TBD
dB
RL = 2kΩ,
(V–)+2.75V <VO <(V+)–2.1V
108
TBD
TBD
TBD
dB
CL = 100pF
SR
tS
Overload Recovery Time
(1)
114
GBW
0.01% (16-bit)
Total Harmonic Distortion +
Noise
RL = 2kΩ,
(V–)+2.75V <VO <(V+)–2.1V
THD+N
18
18
MHz
G = +1
22
22
V/μs
4V Step, G = +1
TBD
TBD
ns
4V Step, G = +1
TBD
TBD
ns
VIN • Gain > VS
TBD
TBD
μs
G = +1, f = 1kHz
TBD
TBD
%
Shaded cells indicate different specifications from low-grade version of device.
Submit Documentation Feedback
OPA827
OPA2827
www.ti.com
SBOS376C – NOVEMBER 2006 – REVISED AUGUST 2007
ELECTRICAL CHARACTERISTICS: VS = ±4V to ±18V (continued)
BOLDFACE limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted.
Standard Grade
OPA827A, OPA2827A
PARAMETER
CONDITIONS
MIN
RL = 2kΩ, AOL > 114dB
RL = 2kΩ, AOL > 108dB
TYP
High Grade
OPA827I, OPA2827I (1)
MAX
MIN
(V–)+2.75
(V+)–2.1
(V–)+2.75
(V+)–2.1
TYP
MAX
UNIT
(V–)+2.75
(V+)–2.1
V
(V–)+2.75
(V+)–2.1
OUTPUT
Voltage Output Swing from Rail
Over Temperature
Output Current
Short-Circuit Current
Capacitive Load Drive
IOUT
|VS – VOUT| < 1.5V
30
V
30
mA
ISC
±40
±40
mA
CLOAD
TBD
TBD
pF
POWER SUPPLY
Specified Voltage
VS
Quiescent Current
(per amplifier)
IQ
±4
IOUT = 0V
±18
4.5
Over Temperature
±4
TBD
4.5
TBD
±18
V
TBD
mA
TBD
mA
Specified Rangex (1)x
–40
+125
–40
+125
°C
Operating Range
–55
+125
–55
+125
°C
Thermal Resistance
(1)
PRODUCT PREVIEW
TEMPERATURE RANGE
ΘJA
SO-8, MSOP-8
150
150
°C/W
SO-8 PowerPAD
TBD
TBD
°C/W
Shaded cells indicate different specifications from low-grade version of device.
Submit Documentation Feedback
5
PACKAGE OPTION ADDENDUM
www.ti.com
16-Jul-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
OPA827AID
PREVIEW
SOIC
D
8
75
TBD
Call TI
Call TI
POPA827AID
PREVIEW
SOIC
D
8
1500
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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