MIC4420/4429 Micrel, Inc. MIC4420/4429 6A-Peak Low-Side MOSFET Driver Bipolar/CMOS/DMOS Process General Description Features MIC4420, MIC4429 and MIC429 MOSFET drivers are tough, efficient, and easy to use. The MIC4429 and MIC429 are inverting drivers, while the MIC4420 is a non-inverting driver. • CMOS Construction • Latch-Up Protected: Will Withstand >500mA Reverse Output Current • Logic Input Withstands Negative Swing of Up to 5V • Matched Rise and Fall Times ................................ 25ns • High Peak Output Current ............................... 6A Peak • Wide Operating Range ............................... 4.5V to 18V • High Capacitive Load Drive ............................10,000pF • Low Delay Time .............................................. 55ns Typ • Logic High Input for Any Voltage From 2.4V to VS • Low Equivalent Input Capacitance (typ) ..................6pF • Low Supply Current ...............450µA With Logic 1 Input • Low Output Impedance ......................................... 2.5Ω • Output Voltage Swing Within 25mV of Ground or VS They are capable of 6A (peak) output and can drive the largest MOSFETs with an improved safe operating margin. The MIC4420/4429/429 accepts any logic input from 2.4V to VS without external speed-up capacitors or resistor networks. Proprietary circuits allow the input to swing negative by as much as 5V without damaging the part. Additional circuits protect against damage from electrostatic discharge. MIC4420/4429/429 drivers can replace three or more discrete components, reducing PCB area requirements, simplifying product design, and reducing assembly cost. Modern BiCMOS/DMOS construction guarantees freedom from latch-up. The rail-to-rail swing capability insures adequate gate voltage to the MOSFET during power up/down sequencing. Applications • • • • Switch Mode Power Supplies Motor Controls Pulse Transformer Driver Class-D Switching Amplifiers Note: See MIC4120/4129 for high power and narrow pulse applications. Functional Diagram VS 0.1mA MIC4429 IN V E R T I N G 0.4mA OUT IN 2kΩ MIC4420 NONINVERTING GND Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com July 2005 1 M9999-072205 MIC4420/4429 Micrel, Inc. Ordering Information Part No. Standard Pb-Free MIC4420CN MIC4420ZN MIC4420BN MIC4420YN MIC4420CM MIC4420ZM MIC4420BM MIC4420YM MIC4420BMM MIC4420YMM MIC4420CT MIC4420ZT MIC4429CN MIC4429ZN MIC4429BN MIC4429YN MIC4429CM MIC4429ZM MIC4429BM MIC4429YM MIC4429BMM MIC4429YMM MIC4429CT MIC4429ZT Temperature Range 0°C to +70°C –40°C to +85°C 0°C to +70°C –40°C to +85°C –40°C to +85°C 0°C to +70°C 0°C to +70°C –40°C to +85°C 0°C to +70°C –40°C to +85°C –40°C to +85°C 0°C to +70°C Package 8-Pin PDIP 8-Pin PDIP 8-Pin SOIC 8-Pin SOIC 8-Pin MSOP 5-Pin TO-220 8-Pin PDIP 8-Pin PDIP 8-Pin SOIC 8-Pin SOIC 8-Pin MSOP 5-Pin TO-220 Configuration Non-Inverting Non-Inverting Non-Inverting Non-Inverting Non-Inverting Non-Inverting Inverting Inverting Inverting Inverting Inverting Inverting Pin Configurations 8 VS VS 1 IN 2 7 OUT NC 3 6 OUT GND 4 5 GND Plastic DIP (N) SOIC (M) MSOP (MM) 5 4 3 2 1 OUT GND VS GND IN TO-220-5 (T) Pin Description Pin Number TO-220-5 Pin Number DIP, SOIC, MSOP Pin Name Pin Function 1 2 IN 2, 4 4, 5 GND 3, TAB 1, 8 6, 7 VS Supply Input: Duplicate pins must be externally connected together. 5 OUT 3 NC Not connected. M9999-072205 Control Input Ground: Duplicate pins must be externally connected together. Output: Duplicate pins must be externally connected together. 2 July 2005 MIC4420/4429 Micrel, Inc. Absolute Maximum Ratings (Notes 1, 2 and 3) Operating Ratings Supply Voltage ...........................................................20V Input Voltage ............................... VS + 0.3V to GND – 5V Input Current (VIN > VS) .......................................... 50mA Power Dissipation, TA ≤ 25°C PDIP ....................................................................960W SOIC ...............................................................1040mW 5-Pin TO-220 ...........................................................2W Power Dissipation, TC ≤ 25°C 5-Pin TO-220 ......................................................12.5W Derating Factors (to Ambient) PDIP .............................................................7.7mW/°C SOIC .............................................................8.3mW/°C 5-Pin TO-220 .................................................17mW/°C Storage Temperature............................. –65°C to +150°C Lead Temperature (10 sec.) ................................... 300°C Supply Voltage .............................................. 4.5V to 18V Junction Temperature ............................................. 150°C Ambient Temperature C Version ................................................. 0°C to +70°C B Version ............................................. –40°C to +85°C Package Thermal Resistance 5-pin TO-220 (θJC) ............................................10°C/W 8-pin MSOP (θJA) ...........................................250°C/W Electrical Characteristics: Symbol (TA = 25°C with 4.5V ≤ VS ≤ 18V unless otherwise specified. Note 4.) Parameter Conditions Min Typ 2.4 1.4 Max Units INPUT VIH Logic 1 Input Voltage VIL Logic 0 Input Voltage IIN Input Current 0 V ≤ VIN ≤ VS VOH High Output Voltage See Figure 1 VIN Input Voltage Range OUTPUT VOL 1.1 –5 V 0.8 VS + 0.3 –10 10 VS–0.025 V V µA V Low Output Voltage See Figure 1 0.025 V RO Output Resistance, Output Low IOUT = 10 mA, VS = 18 V 1.7 2.8 Ω RO Output Resistance, Output High IOUT = 10 mA, VS = 18 V 1.5 2.5 Ω IPK Peak Output Current VS = 18 V (See Figure 6) IR Latch-Up Protection Withstand Reverse Current 6 A >500 mA SWITCHING TIME (Note 3) tR tF tD1 Rise Time Fall Time Delay Time tD2 Delay Time IS Power Supply Current VS Operating Input Voltage Test Figure 1, CL = 2500 pF 12 35 ns 13 35 ns Test Figure 1 18 75 ns Test Figure 1 48 75 ns 0.45 90 1.5 150 mA µA 18 V Test Figure 1, CL = 2500 pF POWER SUPPLY July 2005 VIN = 3 V VIN = 0 V 4.5 3 M9999-072205 MIC4420/4429 Micrel, Inc. Electrical Characteristics: (TA = –55°C to +125°C with 4.5V ≤ VS ≤ 18V unless otherwise specified.) Symbol Parameter Conditions Min Typ Max Units INPUT VIH Logic 1 Input Voltage 2.4 VIL Logic 0 Input Voltage IIN Input Current 0V ≤ VIN ≤ VS VOH High Output Voltage Figure 1 VIN Input Voltage Range –5 OUTPUT VOL V 0.8 V VS + 0.3 –10 10 VS–0.025 V µA V Low Output Voltage Figure 1 0.025 V RO Output Resistance, Output Low IOUT = 10mA, VS = 18V 3 5 Ω RO Output Resistance, Output High IOUT = 10mA, VS = 18V 2.3 5 Ω Figure 1, CL = 2500pF 32 60 ns 34 60 ns Figure 1 50 100 ns Figure 1 65 100 ns VIN = 3V VIN = 0V 0.45 0.06 3.0 0.4 mA mA 18 V SWITCHING TIME (Note 3) tR Rise Time tF Fall Time tD1 Figure 1, CL = 2500pF Delay Time tD2 Delay Time IS Power Supply Current POWER SUPPLY VS Operating Input Voltage Note 1: Note 2: 4.5 Functional operation above the absolute maximum stress ratings is not implied. Static-sensitive device. Store only in conductive containers. Handling personnel and equipment should be grounded to prevent damage from static discharge. Switching times guaranteed by design. Specification for packaged product only. Note 3: Note 4: Test Circuits VS = 18V VS = 18V 0.1µF 0.1µF IN OUT 2500pF MIC4429 INPUT 5V 90% tD1 tP W tF tD2 0.1µF 0.1µF IN OUT 2500pF MIC4420 2.5V tP W ≥ 0.5µs 10% 0V VS 90% 1.0µF INPUT tR 5V 90% 2.5V tP W ≥ 0.5µs 10% 0V VS 90% 1.0µF tD1 tP W tR tD2 tF O U TPU T O U TPU T 10% 0V 10% 0V Figure 1. Inverting Driver Switching Time M9999-072205 Figure 2. Noninverting Driver Switching Time 4 July 2005 MIC4420/4429 Micrel, Inc. Typical Characteristic Curves Rise Time vs. Supply Voltage 50 5 7 9 11 VS (V) 13 0 15 50 50 40 40 30 30 VS = 12V 10 TIME (ns) VS = 5V 20 C L = 4700 pF 20 10 Rise Time vs. Capacitive Load TIME (ns) 30 15 t FALL t RISE 10 C L = 2200 pF C L = 2200 pF 10 0 C L = 2200 pF VS = 18V 20 TIME (ns) C L = 4700 pF 20 25 C L = 10,000 pF TIME (ns) TIME (ns) 30 Rise and Fall Times vs. Temperature 40 C L = 10,000 pF 40 Fall Time vs. Supply Voltage 50 VS = 18V 5 5 7 9 11 VS (V) 13 0 –60 15 Fall Time vs. Capacitive Load 60 –20 20 60 100 TEMPERATURE (°C) 20 VS = 5V VS = 12V VS = 18V 10 140 Delay Time vs. Supply Voltage 50 DELAY TIME (ns) 60 tD2 40 30 20 tD1 10 Propagation Delay Time vs. Temperature TIME (ns) 84 40 30 20 10 –60 t D1 C L = 2200 pF V S = 18V July 2005 –20 20 60 100 TEMPERATURE (°C) 0 10,000 3000 CAPACITIVE LOAD (pF) VS = 15V 56 42 500 kHz 200 kHz 14 20 kHz 140 0 0 6 1000 70 28 4 100 1000 CAPACITIVE LOAD (pF) 5 8 10 12 14 16 SUPPLY VOLTAGE (V) 18 Supply Current vs. Frequency Supply Current vs. Capacitive Load t D2 50 5 1000 10,000 IS – SUPPLY CURRENT (mA) 60 3000 CAPACITIVE LOAD (pF) SUPPLY CURRENT (mA) 5 1000 10,000 CL = 2200 pF 18V 10V 100 5V 10 0 0 100 1000 FREQUENCY (kHz) 10,000 M9999-072205 MIC4420/4429 Micrel, Inc. Typical Characteristic Curves (Cont.) Quiescent Power Supply Voltage vs. Supply Current 900 800 600 SUPPLY CURRENT (A) SUPPLY CURRENT (A) 1000 Quiescent Power Supply Current vs. Temperature LOGIC “1” INPUT 400 200 0 LOGIC “0” INPUT 0 4 8 12 16 SUPPLY VOLTAGE (V) 800 700 600 500 400 –60 20 ROUT (W) 2 ROUT (W) 50 mA 7 5 9 11 VS (V) 13 50 mA 1 15 Effect of Input Amplitude on Propagation Delay 200 10 mA 7 5 0 INPUT 3.0V INPUT 5.0V M9999-072205 INPUT 8V AND 10V 5 6 7 8 13 15 PER TRANSITION -8 CROSSOVER AREA (A•s) x 10 DELAY (ns) INPUT 2.4V 40 11 VS (V) Crossover Area vs. Supply Voltage 160 80 9 2.0 LOAD = 2200 pF 120 140 100 mA 1.5 3 2 20 60 100 TEMPERATURE (°C) 2.5 100 mA 10 mA –20 Low-State Output Resistance High-State Output Resistance 5 4 LOGIC “1” INPUT VS = 18V 1.5 1.0 0.5 0 9 10 11 12 13 14 15 VS (V) 5 6 7 8 9 10 11 12 13 14 15 SUPPLY VOLTAGE V (V) S 6 July 2005 MIC4420/4429 Micrel, Inc. Applications Information Grounding Supply Bypassing The high current capability of the MIC4420/4429 demands careful PC board layout for best performance Since the MIC4429 is an inverting driver, any ground lead impedance will appear as negative feedback which can degrade switching speed. Feedback is especially noticeable with slow-rise time inputs. The MIC4429 input structure includes 300mV of hysteresis to ensure clean transitions and freedom from oscillation, but attention to layout is still recommended. Charging and discharging large capacitive loads quickly requires large currents. For example, charging a 2500pF load to 18V in 25ns requires a 1.8 A current from the device power supply. The MIC4420/4429 has double bonding on the supply pins, the ground pins and output pins This reduces parasitic lead inductance. Low inductance enables large currents to be switched rapidly. It also reduces internal ringing that can cause voltage breakdown when the driver is operated at or near the maximum rated voltage. Internal ringing can also cause output oscillation due to feedback. This feedback is added to the input signal since it is referenced to the same ground. To guarantee low supply impedance over a wide frequency range, a parallel capacitor combination is recommended for supply bypassing. Low inductance ceramic disk capacitors with short lead lengths (< 0.5 inch) should be used. A 1µF low ESR film capacitor in parallel with two 0.1 µF low ESR ceramic capacitors, (such as AVX RAM GUARD®), provides adequate bypassing. Connect one ceramic capacitor directly between pins 1 and 4. Connect the second ceramic capacitor directly between pins 8 and 5. +15 Figure 3 shows the feedback effect in detail. As the MIC4429 input begins to go positive, the output goes negative and several amperes of current flow in the ground lead. As little as 0.05Ω of PC trace resistance can produce hundreds of millivolts at the MIC4429 ground pins. If the driving logic is referenced to power ground, the effective logic input level is reduced and oscillation may result. To insure optimum performance, separate ground traces should be provided for the logic and power connections. Connecting the logic ground directly to the MIC4429 GND pins will ensure full logic drive to the input and ensure fast output switching. Both of the MIC4429 GND pins should, however, still be connected to power ground. (x2) 1N4448 5.6 kΩ 560 Ω 0.1µF 50V + 1 2 0.1µF WIMA MKS2 8 MIC4429 4 5 1µF 50V MKS2 6, 7 BYV 10 (x 2) + 220 µF 50V + 35 µF 50V UNIT E D CHE MCON S X E Figure 3. Self-Contained Voltage Doubler July 2005 7 M9999-072205 MIC4420/4429 Micrel, Inc. Input Stage The input voltage level of the 4429 changes the quiescent supply current. The N channel MOSFET input stage transistor drives a 450µA current source load. With a logic “1” input, the maximum quiescent supply current is 450µA. Logic “0” input level signals reduce quiescent current to 55µA maximum. The MIC4420/4429 input is designed to provide 300mV of hysteresis. This provides clean transitions, reduces noise sensitivity, and minimizes output stage current spiking when changing states. Input voltage threshold level is approximately 1.5V, making the device TTL compatible over the 4 .5V to 18V operating supply voltage range. Input current is less than 10µA over this range. The MIC4429 can be directly driven by the TL494, SG1526/1527, SG1524, TSC170, MIC38HC42 and similar switch mode power supply integrated circuits. By offloading the power-driving duties to the MIC4420/4429, the power supply controller can operate at lower dissipation. This can improve performance and reliability. The input can be greater than the +VS supply, however, current will flow into the input lead. The propagation delay for TD2 will increase to as much as 400ns at room temperature. The input currents can be as high as 30mA p-p (6.4mARMS) with the input, 6 V greater than the supply voltage. No damage will occur to MIC4420/4429 however, and it will not latch. The input appears as a 7pF capacitance, and does not change even if the input is driven from an AC source. Care should be taken so that the input does not go more than 5 volts below the negative rail. Power Dissipation CMOS circuits usually permit the user to ignore power dissipation. Logic families such as 4000 and 74C have outputs which can only supply a few milliamperes of current, and even shorting outputs to ground will not force enough current to destroy the device. The MIC4420/4429 on the other hand, can source or sink several amperes and drive large capacitive loads at high frequency. The package power dissipation limit can easily be exceeded. Therefore, some 1 8 MIC4429 0.1µF LOGIC GROUND 4 Given the power dissipation in the device, and the thermal resistance of the package, junction operating temperature for any ambient is easy to calculate. For example, the thermal resistance of the 8-pin MSOP package, from the data sheet, is 250°C/W. In a 25°C ambient, then, using a maximum junction temperature of 150°C, this package will dissipate 500mW. Accurate power dissipation numbers can be obtained by summing the three sources of power dissipation in the device: • Load Power Dissipation (PL) • Quiescent power dissipation (PQ) • Transition power dissipation (PT) Calculation of load power dissipation differs depending on whether the load is capacitive, resistive or inductive. Resistive Load Power Dissipation Dissipation caused by a resistive load can be calculated as: PL = I2 RO D where: I = the current drawn by the load RO = the output resistance of the driver when the output is high, at the power supply voltage used. (See data sheet) D = fraction of time the load is conducting (duty cycle) Operating Frequency WIMA MKS-2 1 µF 0V The supply current vs frequency and supply current vs capacitive load characteristic curves aid in determining power dissipation calculations. Table 1 lists the maximum safe operating frequency for several power supply voltages when driving a 2500pF load. More accurate power dissipation figures can be obtained by summing the three dissipation sources. Table 1: MIC4429 Maximum +18 V 5.0V attention should be given to power dissipation when driving low impedance loads and/or operating at high frequency. 6, 7 5 TE K C U R R E N T P ROB E 6 3 0 2 0.1µF VS 18V 15V 10V 18 V 0V 2,500 pF POLYCARBONATE Conditions: 6 AMPS 300 mV Max Frequency 500kHz 700kHz 1.6MHz 1. DIP Package (θJA = 130°C/W) 2. TA = 25°C 3. CL = 2500pF PC TRACE RESISTANCE = 0.05Ω POWER GROUND Figure 4. Switching Time Degradation Due to Negative Feedback M9999-072205 8 July 2005 MIC4420/4429 Capacitive Load Power Dissipation Micrel, Inc. where: IH = IL = D= VS = Dissipation caused by a capacitive load is simply the energy placed in, or removed from, the load capacitance by the driver. The energy stored in a capacitor is described by the equation: E = 1/2 C V2 As this energy is lost in the driver each time the load is charged or discharged, for power dissipation calculations the 1/2 is removed. This equation also shows that it is good practice not to place more voltage on the capacitor than is necessary, as dissipation increases as the square of the voltage applied to the capacitor. For a driver with a capacitive load: PL = f C (VS)2 where: f = Operating Frequency C = Load Capacitance VS =Driver Supply Voltage Inductive Load Power Dissipation quiescent current with input high quiescent current with input low fraction of time input is high (duty cycle) power supply voltage Transition Power Dissipation Transition power is dissipated in the driver each time its output changes state, because during the transition, for a very brief interval, both the N- and P-channel MOSFETs in the output totem-pole are ON simultaneously, and a current is conducted through them from V+S to ground. The transition power dissipation is approximately: PT = 2 f VS (A•s) where (A•s) is a time-current factor derived from the typical characteristic curves. Total power (PD) then, as previously described is: PD = PL + PQ +PT Definitions CL = Load Capacitance in Farads. For inductive loads the situation is more complicated. For the part of the cycle in which the driver is actively forcing current into the inductor, the situation is the same as it is in the resistive case: D = Duty Cycle expressed as the fraction of time the input to the driver is high. f = Operating Frequency of the driver in Hertz PL1 = I2 RO D IH = Power supply current drawn by a driver when both inputs are high and neither output is loaded. However, in this instance the RO required may be either the on resistance of the driver when its output is in the high state, or its on resistance when the driver is in the low state, depending on how the inductor is connected, and this is still only half the story. For the part of the cycle when the inductor is forcing current through the driver, dissipation is best described as IL = Power supply current drawn by a driver when both inputs are low and neither output is loaded. ID = Output current from a driver in Amps. PD = Total power dissipated in a driver in Watts. PL2 = I VD (1-D) PL = Power dissipated in the driver due to the driver’s load in Watts. where VD is the forward drop of the clamp diode in the driver (generally around 0.7V). The two parts of the load dissipation must be summed in to produce PL PQ = Power dissipated in a quiescent driver in Watts. PL = PL1 + PL2 PT = Power dissipated in a driver when the output changes states (“shoot-through current”) in Watts. NOTE: The “shoot-through” current from a dual transition (once up, once down) for both drivers is shown by the "Typical Characteristic Curve : Crossover Area vs. Supply Voltage and is in ampere-seconds. This figure must be multiplied by the number of repetitions per second (frequency) to find Watts. Quiescent Power Dissipation Quiescent power dissipation (PQ, as described in the input section) depends on whether the input is high or low. A low input will result in a maximum current drain (per driver) of ≤0.2mA; a logic high will result in a current drain of ≤2.0mA. Quiescent power can therefore be found from: PQ = VS [D IH + (1-D) IL] RO = Output resistance of a driver in Ohms. VS = Power supply voltage to the IC in Volts. July 2005 9 M9999-072205 MIC4420/4429 Micrel, Inc. +18 V WIMA MK22 1 µF 5.0V 1 2 0V 0.1µF 8 MIC4429 4 TE K C U R R E N T PROBE 6302 6, 7 5 0.1µF 18 V 0V 10,000 pF PO L YC AR BO N AT E Figure 5. Peak Output Current Test Circuit M9999-072205 10 July 2005 MIC4420/4429 Micrel, Inc. Package Information PIN 1 DIMENSIONS: INCH (MM) 0.380 (9.65) 0.370 (9.40) 0.255 (6.48) 0.245 (6.22) 0.135 (3.43) 0.125 (3.18) 0.300 (7.62) 0.013 (0.330) 0.010 (0.254) 0.018 (0.57) 0.100 (2.54) 0.130 (3.30) 0.0375 (0.952) 0.380 (9.65) 0.320 (8.13) 8-Pin Plastic DIP (N) 8-Pin SOIC (M) July 2005 11 M9999-072205 MIC4420/4429 Micrel, Inc. 0.112 (2.84) 0.187 (4.74) INCH (MM) 0.116 (2.95) 0.038 (0.97) 0.032 (0.81) 0.007 (0.18) 0.005 (0.13) 0.012 (0.30) R 0.012 (0.03) 0.0256 (0.65) TYP 5° 0° MIN 0.004 (0.10) 0.012 (0.03) R 0.035 (0.89) 0.021 (0.53) 8-Pin MSOP (MM) 0.150 D ±0.005 (3.81 D ±0.13) 0.177 ±0.008 (4.50 ±0.20) 0.400 ±0.015 (10.16 ±0.38) 0.108 ±0.005 (2.74 ±0.13) 0.050 ±0.005 (1.27 ±0.13) 0.241 ±0.017 (6.12 ±0.43) 0.578 ±0.018 (14.68 ±0.46) SEATING PLANE 7° Typ. 0.550 ±0.010 (13.97 ±0.25) 0.067 ±0.005 (1.70 ±0.127) 0.032 ±0.005 (0.81 ±0.13) 0.268 REF (6.81 REF) 0.018 ±0.008 (0.46 ±0.20) Dimensions: 0.103 ±0.013 (2.62 ±0.33) inch (mm) 5-Lead TO-220 (T) MICREL INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2001 Micrel, Inc. M9999-072205 12 July 2005