STMicroelectronics M34C02-W-RDW1G 2 kbit serial iâ²c bus eeprom for dimm serial presence detect Datasheet

M34C02-W
M34C02-L M34C02-R
2 Kbit Serial I²C Bus EEPROM
for DIMM serial presence detect
Feature summary
■
Software Data Protection for lower 128 Bytes
■
Two Wire I2C Serial Interface
■
400kHz Transfer Rates
■
Single Supply Voltage:
– 2.5 to 5.5V for M34C02-W
– 2.2 to 5.5V for M34C02-L
– 1.8 to 5.5V for M34C02-R
■
Byte and Page Write (up to 16 bytes)
■
Random and Sequential Read modes
■
Self-Timed Programming Cycle
■
Automatic Address Incrementing
■
Enhanced ESD/Latch-Up Protection
■
More than 1 million Write cycles
■
More than 40 Year Data Retention
■
Packages
– ECOPACK® (RoHS compliant)
April 2006
TSSOP8 (DW)
169 mil width
UFDFPN8 (MB)
2x3mm² (MLP)
Rev 9
1/31
www.st.com
1
Contents
M34C02-W, M34C02-L, M34C02-R
Contents
1
Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2
Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3
Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4
Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.5
Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.5.1
3
2/31
Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1
Start Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.2
Stop Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3
Acknowledge Bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.4
Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.5
Memory Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.6
Setting the Software Write-Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.7
Write Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.7.1
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.7.2
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.7.3
Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . 16
Read Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.8.1
Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.8.2
Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.8.3
Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.8.4
Acknowledge in Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Use within a DRAM DIMM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.1
5
2.5.3
Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.8
4
2.5.2
Operating supply voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Internal device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Programming the M34C02-W, M34C02-L and M34C02-R . . . . . . . . . . . . 19
Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
M34C02-W, M34C02-L, M34C02-R
Contents
6
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8
Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
9
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3/31
List of tables
M34C02-W, M34C02-L, M34C02-R
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
4/31
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Device Select Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
DRAM DIMM Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Operating Conditions (M34C02-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Operating Conditions (M34C02-L) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Operating Conditions (M34C02-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Input Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
DC Characteristics (M34C02-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
DC Characteristics (M34C02-L) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
DC Characteristics (M34C02-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
AC Characteristics M34C02-W, M34C02-L, M34C02-R) . . . . . . . . . . . . . . . . . . . . . . . . . . 25
UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead
2x3mm², Package Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
TSSOP8 – 8 lead Thin Shrink Small Outline, package mechanical data . . . . . . . . . . . . . . 28
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
M34C02-W, M34C02-L, M34C02-R
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
TSSOP and MLP connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Chip Enable input connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Maximum RP value versus bus parasitic capacitance (C) for an I²C Bus . . . . . . . . . . . . . . 9
I2C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Setting the Write Protection Register (WC = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Result of setting the write protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Write mode sequences in a non write-protected area . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Serial presence detect block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
AC Measurement I/O Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead
2x3mm², Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
TSSOP8 – 8 lead Thin Shrink Small Outline, package outline . . . . . . . . . . . . . . . . . . . . . . 28
5/31
Summary description
1
M34C02-W, M34C02-L, M34C02-R
Summary description
The M34C02-W, M34C02-L and M34C02-R are 2Kbit serial EEPROM memory able to lock
permanently the data in its first half (from location 00h to 7Fh). This facility has been
designed specifically for use in DRAM DIMMs (dual interline memory modules) with Serial
Presence Detect. All the information concerning the DRAM module configuration (such as
its access speed, its size, its organization) can be kept write protected in the first half of the
memory.
This bottom half of the memory area can be write-protected using a specially designed
software write protection mechanism. By sending the device a specific sequence, the first
128 Bytes of the memory become permanently write protected. Care must be taken when
using this sequence as its effect cannot be reversed. In addition, the device allows the entire
memory area to be write protected, using the WC input (for example by tieing this input to
VCC).
These I2C-compatible electrically erasable programmable memory (EEPROM) devices are
organized as 256x8 bits.
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. ECOPACK® packages are Lead-free and RoHS compliant.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
I2C uses a two wire serial interface, comprising a bi-directional data line and a clock line.
The device carries a built-in 4-bit Device Type Identifier code (1010) in accordance with the
I2C bus definition to access the memory area and a second Device Type Identifier Code
(0110) to access the Protection Register. These codes are used together with three chip
enable inputs (E2, E1, E0) so that up to eight 2Kbit devices may be attached to the I²C bus
and selected individually.
The device behaves as a slave device in the I2C protocol, with all memory operations
synchronized by the serial clock. Read and Write operations are initiated by a START
condition, generated by the bus master. The START condition is followed by a Device Select
Code and RW bit (as described in Table 2), terminated by an acknowledge bit.
When writing data to the memory, the memory inserts an acknowledge bit during the 9th bit
time, following the bus master’s 8-bit transmission. When data is read by the bus master, the
bus master acknowledges the receipt of the data byte in the same way. Data transfers are
terminated by a STOP condition after an Ack for WRITE, and after a NoAck for READ.
6/31
M34C02-W, M34C02-L, M34C02-R
Figure 1.
Summary description
Logic diagram
VCC
3
E0-E2
SDA
M34C02-W
M34C02-L
M34C02-R
SCL
WC
VSS
AI01931b
Figure 2.
TSSOP and MLP connections (top view)
M34C02-W
M34C02-L
M34C02-R
E0
E1
E2
VSS
1
2
3
4
8
7
6
5
VCC
WC
SCL
SDA
AI01932d
1. See Section 8: Package mechanical for package dimensions, and how to identify pin-1.
Table 1.
Signal names
E0, E1, E2
Chip Enable
SDA
Serial Data
SCL
Serial Clock
WC
Write Control
VCC
Supply Voltage
VSS
Ground
7/31
Signal description
M34C02-W, M34C02-L, M34C02-R
2
Signal description
2.1
Serial Clock (SCL)
This input signal is used to strobe all data in and out of the device. In applications where this
signal is used by slave devices to synchronize the bus to a slower clock, the bus master
must have an open drain output, and a pull-up resistor can be connected from Serial Clock
(SCL) to VCC. (Figure 4 indicates how the value of the pull-up resistor can be calculated). In
most applications, though, this method of synchronization is not employed, and so the pullup resistor is not necessary, provided that the bus master has a push-pull (rather than open
drain) output.
2.2
Serial Data (SDA)
This bi-directional signal is used to transfer data in or out of the device. It is an open drain
output that may be wire-OR’ed with other open drain or open collector signals on the bus. A
pull up resistor must be connected from Serial Data (SDA) to VCC. (Figure 4 indicates how
the value of the pull-up resistor can be calculated).
2.3
Chip Enable (E0, E1, E2)
These input signals are used to set the value that is to be looked for on the three least
significant bits (b3, b2, b1) of the 7-bit Device Select Code. These inputs must be tied to
VCC or VSS to establish the Device Select Code.
Figure 3.
Chip Enable input connection
VCC
VCC
M34C02-W
M34C02-L
M34C02-R
M34C02-W
M34C02-L
M34C02-R
Ei
Ei
VSS
2.4
VSS
Ai12819
Write Control (WC)
This input signal is provided for protecting the contents of the whole memory from
inadvertent write operations. Write Control (WC) is used to enable (when driven Low) or
disable (when driven High) write instructions to the entire memory area or to the Protection
Register.
When Write Control (WC) is tied Low or left unconnected, the write protection of the first half
of the memory is determined by the status of the Protection Register.
8/31
M34C02-W, M34C02-L, M34C02-R
Signal description
2.5
Supply voltage (VCC)
2.5.1
Operating supply voltage VCC
Prior to selecting the memory and issuing instructions to it, a valid and stable VCC voltage
within the specified [VCC(min), VCC(max)] range must be applied (see Table 6, Table 7 and
Table 8). In order to secure a stable DC supply voltage, it is recommended to decouple the
VCC line with a suitable capacitor (usually of the order of 10nF to 100nF) close to the
VCC/VSS package pins.
This voltage must remain stable and valid until the end of the transmission of the instruction
and, for a Write instruction, until the completion of the internal write cycle (tW).
2.5.2
Internal device reset
In order to prevent inadvertent Write operations during Power-up, a Power On Reset (POR)
circuit is included. At Power-up (continuous rise of VCC), the device will not respond to any
instruction until VCC has reached the Power On Reset threshold voltage (this threshold is
lower than the minimum VCC operating voltage defined in Table 6, Table 7 and Table 8).
When VCC has passed the POR threshold, the device is reset and in the Standby Power
mode.
Power-down
At Power-down (where VCC decreases continuously), as soon as VCC drops from the normal
operating voltage to below the Power On Reset threshold voltage, the device stops
responding to any instruction sent to it.
During Power-down, the device must be deselected and in Standby Power mode (that is
there should be no internal Write cycle in progress).
Figure 4.
Maximum RP value versus bus parasitic capacitance (C) for an I²C Bus
VCC
20
16
Maximum RP value (kΩ)
2.5.3
RP
12
RP
SDA
MASTER
8
fc = 100kHz
4
fc = 400kHz
C
SCL
C
0
10
100
1000
C (pF)
AI01665b
9/31
Signal description
M34C02-W, M34C02-L, M34C02-R
Figure 5.
I2C bus protocol
SCL
SDA
SDA
Input
START
Condition
SCL
1
SDA
MSB
2
SDA
Change
STOP
Condition
3
7
8
9
ACK
START
Condition
SCL
1
SDA
MSB
2
3
7
8
9
ACK
STOP
Condition
AI00792B
Table 2.
Device Select Code
Device Type Identifier(1)
Chip Enable Address(2)
b7
b6
b5
b4
b3
b2
b1
b0
Memory Area Select Code
(two arrays)
1
0
1
0
E2
E1
E0
RW
Protection Register Select
Code
0
1
1
0
E2
E1
E0
RW
1. The most significant bit, b7, is sent first.
2. E0, E1 and E2 are compared against the respective external pins on the memory device.
10/31
RW
M34C02-W, M34C02-L, M34C02-R
3
Device operation
Device operation
The device supports the I2C protocol. This is summarized in Figure 5. Any device that sends
data on to the bus is defined to be a transmitter, and any device that reads the data to be a
receiver. The device that controls the data transfer is known as the bus master, and the
other as the slave device. A data transfer can only be initiated by the bus master, which will
also provide the serial clock for synchronization. The memory device is always a slave in all
communication.
3.1
Start Condition
Start is identified by a falling edge of Serial Data (SDA) while Serial Clock (SCL) is stable in
the High state. A Start condition must precede any data transfer command. The device
continuously monitors (except during a Write cycle) Serial Data (SDA) and Serial Clock
(SCL) for a Start condition, and will not respond unless one is given.
3.2
Stop Condition
Stop is identified by a rising edge of Serial Data (SDA) while Serial Clock (SCL) is stable
and driven High. A Stop condition terminates communication between the device and the
bus master. A Read command that is followed by NoAck can be followed by a Stop condition
to force the device into the Stand-by mode. A Stop condition at the end of a Write command
triggers the internal EEPROM Write cycle.
3.3
Acknowledge Bit (ACK)
The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter,
whether it be bus master or slave device, releases Serial Data (SDA) after sending eight bits
of data. During the 9th clock pulse period, the receiver pulls Serial Data (SDA) Low to
acknowledge the receipt of the eight data bits.
3.4
Data Input
During data input, the device samples Serial Data (SDA) on the rising edge of Serial Clock
(SCL). For correct device operation, Serial Data (SDA) must be stable during the rising edge
of Serial Clock (SCL), and the Serial Data (SDA) signal must change only when Serial Clock
(SCL) is driven Low.
11/31
Device operation
3.5
M34C02-W, M34C02-L, M34C02-R
Memory Addressing
To start communication between the bus master and the slave device, the bus master must
initiate a Start condition. Following this, the bus master sends the Device Select Code,
shown in Table 2 (on Serial Data (SDA), most significant bit first).
The Device Select Code consists of a 4-bit Device Type Identifier, and a 3-bit Chip Enable
“Address” (E2, E1, E0). To address the memory array, the 4-bit Device Type Identifier is
1010b; to address the Protection Register, it is 0110b.
Up to eight memory devices can be connected on a single I2C bus. Each one is given a
unique 3-bit code on the Chip Enable (E0, E1, E2) inputs. When the Device Select Code is
received, the device only responds if the Chip Enable Address is the same as the value on
the Chip Enable (E0, E1, E2) inputs.
The 8th bit is the Read/Write bit (RW). This bit is set to 1 for Read and 0 for Write operations.
If a match occurs on the Device Select code, the corresponding device gives an
acknowledgment on Serial Data (SDA) during the 9th bit time. If the device does not match
the Device Select code, it deselects itself from the bus, and goes into Stand-by mode.
Table 3.
Operating Modes
Mode
RW bit
WC(1)
Bytes
Current Address Read
1
X
1
Random Address
Read
0
X
1
X
Sequential Read
1
X
≥1
Byte Write
0
VIL
1
START, Device Select, RW = 0
Page Write
0
VIL
≤16
START, Device Select, RW = 0
Initial Sequence
START, Device Select, RW = 1
START, Device Select, RW = 0, Address
1
reSTART, Device Select, RW = 1
Similar to Current or Random Address Read
1. X = VIH or VIL.
BUS ACTIVITY
MASTER
CONTROL
BYTE
WORD
ADDRESS
STOP
Setting the Write Protection Register (WC = 0)
START
Figure 6.
DATA
SDA LINE
BUS ACTIVITY
ACK
ACK
ACK
VALUE
VALUE
(DON'T CARE) (DON'T CARE)
AI01935B
12/31
M34C02-W, M34C02-L, M34C02-R
3.6
Device operation
Setting the Software Write-Protection
The M34C02-W has a hardware write-protection feature, using the Write Control (WC)
signal. This signal can be driven High or Low, and must be held constant for the whole
instruction sequence. When Write Control (WC) is held Low, the whole memory array
(addresses 00h to FFh) is write protected. When Write Control (WC) is held High, the write
protection of the memory array is dependent on whether software write-protection has been
set.
Software write-protection allows the bottom half of the memory area (addresses 00h to 7Fh)
to be permanently write protected irrespective of subsequent states of the Write Control
(WC) signal.
The write protection feature is activated by writing once to the Protection Register. The
Protection Register is accessed with the device select code set to 0110b (as shown in
Table 2), and the E2, E1 and E0 bits set according to the states being applied on the E2, E1
and E0 signals. As for any other write command, Write Control (WC) needs to be held Low.
Address and data bytes must be sent with this command, but their values are all ignored,
and are treated as Don’t Care. Once the Protection Register has been written, the write
protection of the first 128 Bytes of the memory is enabled, and it is not possible to unprotect
these 128 Bytes, even if the device is powered off and on, and regardless the state of Write
Control (WC).
When the Protection Register has been written, the M34C02-W no longer responds to the
device type identifier 0110b in either read or write mode.
Figure 7.
Result of setting the write protection
FFh
Standard
Array
Memory
Area
FFh
Standard
Array
80h
7Fh
Standard
Array
00h
Default EEPROM memory area
state before write access
to the Protect Register
Write
Protected
Array
80h
7Fh
00h
State of the EEPROM memory
area after write access
to the Protect Register
AI01936C
13/31
Device operation
3.7
M34C02-W, M34C02-L, M34C02-R
Write Operations
Following a Start condition the bus master sends a Device Select Code with the RW bit
reset to 0. The device acknowledges this, as shown in Figure 8, and waits for an address
byte. The device responds to the address byte with an acknowledge bit, and then waits for
the data byte.
When the bus master generates a Stop condition immediately after the Ack bit (in the “10th
bit” time slot), either at the end of a Byte Write or a Page Write, the internal memory Write
cycle is triggered. A Stop condition at any other time slot does not trigger the internal Write
cycle.
During the internal Write cycle, Serial Data (SDA) and Serial Clock (SCL) are ignored, and
the device does not respond to any requests.
3.7.1
Byte Write
After the Device Select Code and the address byte, the bus master sends one data byte. If
the addressed location is hardware write-protected, the device replies to the data byte with
NoAck, and the location is not modified. If, instead, the addressed location is not Writeprotected, the device replies with Ack. The bus master terminates the transfer by generating
a Stop condition, as shown in Figure 8.
3.7.2
Page Write
The Page Write mode allows up to 16 bytes to be written in a single Write cycle, provided
that they are all located in the same page in the memory: that is, the most significant
memory address bits are the same. If more bytes are sent than will fit up to the end of the
page, a condition known as ‘roll-over’ occurs. This should be avoided, as data starts to
become overwritten in an implementation dependent way.
The bus master sends from 1 to 16 bytes of data, each of which is acknowledged by the
device if Write Control (WC) is Low. If the addressed location is hardware write-protected,
the device replies to the data byte with NoAck, and the locations are not modified. After each
byte is transferred, the internal byte address counter (the 4 least significant address bits
only) is incremented. The transfer is terminated by the bus master generating a Stop
condition.
14/31
M34C02-W, M34C02-L, M34C02-R
Figure 8.
Device operation
Write mode sequences in a non write-protected area
ACK
BYTE ADDR
DATA IN
R/W
ACK
DEV SEL
START
ACK
BYTE ADDR
ACK
DATA IN 1
DATA IN 2
R/W
ACK
ACK
DATA IN N
STOP
PAGE WRITE
ACK
STOP
DEV SEL
START
BYTE WRITE
ACK
AI01941
15/31
Device operation
3.7.3
M34C02-W, M34C02-L, M34C02-R
Minimizing system delays by polling on ACK
During the internal Write cycle, the device disconnects itself from the bus, and writes a copy
of the data from its internal latches to the memory cells. The maximum Write time (tw) is
shown in Table 14 and Table 16, but the typical time is shorter. To make use of this, a polling
sequence can be used by the bus master.
The sequence, as shown in Figure 9, is:
●
Initial condition: a Write cycle is in progress.
●
Step 1: the bus master issues a Start condition followed by a Device Select Code (the
first byte of the new instruction).
●
Step 2: if the device is busy with the internal Write cycle, no Ack will be returned and
the bus master goes back to Step 1. If the device has terminated the internal Write
cycle, it responds with an Ack, indicating that the device is ready to receive the second
part of the instruction (the first byte of this instruction having been sent during Step 1).
Figure 9.
Write cycle polling flowchart using ACK
WRITE Cycle
in Progress
START Condition
DEVICE SELECT
with RW = 0
NO
First byte of instruction
with RW = 0 already
decoded by the device
ACK
Returned
YES
NO
Next
Operation is
Addressing the
Memory
YES
Send Address
and Receive ACK
ReSTART
STOP
NO
START
Condition
YES
DATA for the
WRITE Operation
DEVICE SELECT
with RW = 1
Continue the
WRITE Operation
Continue the
Random READ Operation
AI01847C
16/31
M34C02-W, M34C02-L, M34C02-R
3.8
Device operation
Read Operations
Read operations are performed independently of whether hardware or software protection
has been set.
The device has an internal address counter which is incremented each time a byte is read.
3.8.1
Random Address Read
A dummy Write is first performed to load the address into this address counter (as shown in
Figure 10) but without sending a Stop condition. Then, the bus master sends another Start
condition, and repeats the Device Select Code, with the RW bit set to 1. The device
acknowledges this, and outputs the contents of the addressed byte. The bus master must
not acknowledge the byte, and terminates the transfer with a Stop condition.
3.8.2
Current Address Read
For the Current Address Read operation, following a Start condition, the bus master only
sends a Device Select Code with the RW bit set to 1. The device acknowledges this, and
outputs the byte addressed by the internal address counter. The counter is then
incremented. The bus master terminates the transfer with a Stop condition, as shown in
Figure 10, without acknowledging the byte.
3.8.3
Sequential Read
This operation can be used after a Current Address Read or a Random Address Read. The
bus master does acknowledge the data byte output, and sends additional clock pulses so
that the device continues to output the next byte in sequence. To terminate the stream of
bytes, the bus master must not acknowledge the last byte, and must generate a Stop
condition, as shown in Figure 10.
The output data comes from consecutive addresses, with the internal address counter
automatically incremented after each byte output. After the last memory address, the
address counter ‘rolls-over’, and the device continues to output data from memory address
00h.
3.8.4
Acknowledge in Read Mode
For all Read commands, the device waits, after each byte read, for an acknowledgment
during the 9th bit time. If the bus master does not drive Serial Data (SDA) Low during this
time, the device terminates the data transfer and switches to its Stand-by mode.
17/31
Device operation
M34C02-W, M34C02-L, M34C02-R
Figure 10. Read mode sequences
ACK
DATA OUT
STOP
START
DEV SEL
NO ACK
R/W
ACK
START
DEV SEL *
ACK
BYTE ADDR
R/W
ACK
START
DEV SEL
DATA OUT
R/W
ACK
ACK
DATA OUT 1
NO ACK
DATA OUT N
R/W
ACK
START
DEV SEL *
ACK
BYTE ADDR
R/W
ACK
ACK
DEV SEL *
START
SEQUENTIAL
RANDOM
READ
DEV SEL *
NO ACK
STOP
SEQUENTIAL
CURRENT
READ
ACK
START
RANDOM
ADDRESS
READ
STOP
CURRENT
ADDRESS
READ
ACK
DATA OUT 1
R/W
NO ACK
STOP
DATA OUT N
AI01942
1. The seven most significant bits of the Device Select Code of a Random Read (in the 1st and 3rd bytes)
must be identical.
18/31
M34C02-W, M34C02-L, M34C02-R
4
Use within a DRAM DIMM
Use within a DRAM DIMM
In the application, the M34C02-W, M34C02-L and M34C02-R are soldered directly in the
printed circuit module. The 3 Chip Enable inputs (pins 1, 2 and 3) are wired at VCC or VSS
through the DIMM socket (see Table 4). The pull-up resistors needed for normal behavior of
the I2C bus are connected on the I2C bus of the mother-board (as shown in Figure 11).
The Write Control (WC) of the M34C02-W, M34C02-L and M34C02-R can be left
unconnected. However, connecting it to VSS is recommended, to maintain full read and write
access.
4.1
Programming the M34C02-W, M34C02-L and M34C02-R
When the device is delivered, full read and write access is given to the whole memory array.
It is recommended that the first step is to use the test equipment to write the module
information (such as its access speed, its size, its organization) to the first half of the
memory, starting from the first memory location. When the data has been validated, the test
equipment can send a Write command to the Protection Register, using the device select
code ’01100000b’ followed by an address and data byte (made up of Don’t Care values) as
shown in Figure 6. The first 128 bytes of the memory area are then write-protected, and the
M34C02-W, M34C02-L and M34C02-R will no longer respond to the specific device select
code ’0110000xb’. It is not possible to reverse this sequence.
Table 4.
DRAM DIMM Connections
DIMM Position
E2
E1
E0
0
VSS
VSS
VSS
1
VSS
VSS
VCC
2
VSS
VCC
VSS
3
VSS
VCC
VCC
4
VCC
VSS
VSS
5
VCC
VSS
VCC
6
VCC
VCC
VSS
7
VCC
VCC
VCC
19/31
Initial delivery state
5
M34C02-W, M34C02-L, M34C02-R
Initial delivery state
The device is delivered with all bits in the memory array set to 1 (each Byte contains FFh).
Figure 11. Serial presence detect block diagram
R = 4.7kΩ
DIMM Position 7
E2
E1
E0
SCL SDA
E0
SCL SDA
VCC
DIMM Position 6
E2
E1
VCC
VSS
DIMM Position 5
E2
E1
E0
SCL SDA
VCC VSS VCC
DIMM Position 4
E2
E1
VCC
E0
SCL SDA
VSS
DIMM Position 3
E2
E1
VSS
E0
SCL SDA
VCC
DIMM Position 2
E2
E1
E0
SCL SDA
VSS VCC VSS
DIMM Position 1
E2
E1
VSS
E0
SCL SDA
VCC
DIMM Position 0
E2
E1
E0
SCL SDA
VSS
SCL line
AI01937
SDA line
From the motherboard
I2C master controller
1. E0, E1 and E2 are wired at each DIMM socket in a binary sequence for a maximum of 8 devices.
2. Common clock and common data are shared across all the devices.
3. Pull-up resistors are required on all SDA and SCL bus lines (typically 4.7 kΩ) because these lines are open
drain when used as outputs.
20/31
M34C02-W, M34C02-L, M34C02-R
6
Maximum rating
Maximum rating
Stressing the device above the rating listed in the Absolute Maximum Ratings" table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 5.
Absolute maximum ratings
Symbol
TA
TSTG
TLEAD
Parameter
Min.
Max.
Unit
Ambient Operating Temperature
–40
90
°C
Storage Temperature
–65
150
°C
Lead Temperature during
Soldering(1)
See
(1)
°C
VIO
Input or Output Voltage
–0.50
6.5
V
VCC
Supply Voltage
–0.50
6.5
V
VESD
Electrostatic Discharge Voltage (Human Body
model)(2)
–4000
4000
V
1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK®
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU.
2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 Ω, R2=500 Ω)
21/31
DC and AC parameters
7
M34C02-W, M34C02-L, M34C02-R
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC Characteristic tables that
follow are derived from tests performed under the Measurement Conditions summarized in
the relevant tables. Designers should check that the operating conditions in their circuit
match the measurement conditions when relying on the quoted parameters.
Table 6.
Operating Conditions (M34C02-W)
Symbol
VCC
TA
Table 7.
Parameter
Min.
Max.
Unit
Supply Voltage
2.5
5.5
V
Ambient Operating Temperature
–40
85
°C
Min.
Max.
Unit
Supply Voltage
2.2
5.5
V
Ambient Operating Temperature
–40
85
°C
Min.
Max.
Unit
Supply Voltage
1.8
5.5
V
Ambient Operating Temperature
–40
85
°C
Min.
Max.
Unit
Operating Conditions (M34C02-L)
Symbol
VCC
TA
Table 8.
Parameter
Operating Conditions (M34C02-R)
Symbol
VCC
TA
Table 9.
Parameter
AC Measurement Conditions
Symbol
CL
Parameter
Load Capacitance
100
Input Rise and Fall Times
50
ns
Input Levels
0.2VCC to 0.8VCC
V
Input and Output Timing Reference Levels
0.3VCC to 0.7VCC
V
Figure 12. AC Measurement I/O Waveform
Input Levels
0.8VCC
0.2VCC
Input and Output
Timing Reference Levels
0.7VCC
0.3VCC
AI00825B
22/31
pF
M34C02-W, M34C02-L, M34C02-R
Table 10.
Symbol
DC and AC parameters
Input Parameters
Parameter(1),(2)
Test Condition
Min.
Max.
Unit
CIN
Input Capacitance (SDA)
8
pF
CIN
Input Capacitance (other pins)
6
pF
70
kΩ
ZWCL
WC Input Impedance
VIN < 0.3 V
15
ZWCH
WC Input Impedance
VIN > 0.7VCC
500
Pulse width ignored
(Input Filter on SCL and SDA)
Single glitch
tNS
kΩ
100
ns
1. TA = 25°C, f = 400kHz
2. Sampled only, not 100% tested.
Table 11.
DC Characteristics (M34C02-W)
Symbol
Parameter
Test Condition
(in addition to those in Table 6)
ILI
Input Leakage Current
(SCL, SDA, E0, E1,and E2)
ILO
Output Leakage Current
ICC
Min.
Max.
Unit
VIN = VSS or VCC
±2
µA
VOUT = VSS or VCC, SDA in Hi-Z
±2
µA
VCC=5V, fc=400kHz
(rise/fall time < 30ns)
2
mA
VCC =2.5V, fc=400kHz
(rise/fall time < 30ns)
1
mA
VIN = VSS or VCC,
for 2.5V < VCC = < 5.5V
1
µA
–0.45
0.3VCC
V
0.7VCC
VCC+1
V
0.4
V
Supply Current
ICC1
Stand-by Supply Current
VIL
Input Low Voltage (1)
VIH
Input High Voltage
(1)
VOL
Output Low Voltage
IOL = 2.1mA when VCC = 2.5V or
IOL = 3mA when VCC = 5.5V
1. The voltage source driving only E0, E1 and E2 inputs must provide an impedance of less than
1kOhm.
23/31
DC and AC parameters
Table 12.
Symbol
DC Characteristics (M34C02-L)
Parameter
ILI
Input Leakage Current
(SCL, SDA)
ILO
Output Leakage Current
ICC
24/31
M34C02-W, M34C02-L, M34C02-R
Supply Current
Test Condition
(in addition to those in Table 7)
Min.
Max.
Unit
VIN = VSS or VCC
±2
µA
VOUT = VSS or VCC, SDA in Hi-Z
±2
µA
VCC =5V, fc=400kHz
(rise/fall time < 30ns)
2
mA
VCC =2.5V, fc=400kHz
(rise/fall time < 30ns)
1
mA
VCC =2.2V, fc=400kHz
(rise/fall time < 30ns)
1
mA
VIN = VSS or VCC , VCC = 5 V
1
µA
VIN = VSS or VCC , 2.2V ≤VCC < 2.5V
0.5
µA
ICC1
Stand-by Supply Current
–0.3
0.3VCC
V
VIL
Input Low Voltage
(E2, E1, E0, SCL, SDA)
Input Low Voltage (WC)
–0.3
0.5
V
VIH
Input High Voltage
(E2, E1, E0, SCL, SDA, WC)
VOL
Output Low Voltage
0.7VCC VCC+1
V
IOL = 3mA, VCC = 5V
0.4
V
IOL = 2.1mA, 2.2V ≤VCC < 2.5V
0.4
V
M34C02-W, M34C02-L, M34C02-R
Table 13.
DC and AC parameters
DC Characteristics (M34C02-R)
Symbol
Parameter
Test Condition (in addition to
those in Table 8)
ILI
Input Leakage Current
(SCL, SDA, E0, E1 and E2)
ILO
Output Leakage Current
ICC
Max.
Unit
VIN = VSS or VCC
±2
µA
VOUT = VSS or VCC, SDA in Hi-Z
±2
µA
VCC =5V, fc=400kHz
(rise/fall time < 30ns)
2
mA
VCC =2.5V, fc=400kHz
(rise/fall time < 30ns)
1
mA
VCC =1.8V, fc=400kHz
(rise/fall time < 30ns)
1
mA
VIN = VSS or VCC , VCC = 5V
1
µA
VIN = VSS or VCC , 1.8V ≤VCC < 2.5V
0.5
µA
Supply Current
ICC1
Stand-by Supply Current
VIL
Input Low Voltage(1)
VIH
Input High Voltage (1)
Output Low Voltage
VOL
Min.
2.5V ≤VCC ≤5.5V
– 0.3
0.3VCC
V
1.8V ≤VCC < 2.5V
– 0.3
0.25VCC
V
0.7VCC
VCC+1
V
IOL = 3mA, VCC = 5V
0.4
V
IOL = 2.1mA, 2.2V ≤VCC < 2.5V
0.4
V
IOL = 0.15mA, VCC = 1.8V
0.2
V
1. The voltage source driving only E0, E1 and E2 inputs must provide an impedance of less than 1kΩ.
Table 14.
AC Characteristics M34C02-W, M34C02-L, M34C02-R)
Test conditions specified in Table 9 and Table 6 or Table 7
Symbol
Alt.
fC
fSCL
Clock Frequency
tCHCL
tHIGH
Clock Pulse Width High
600
ns
tCLCH
tLOW
Clock Pulse Width Low
1300
ns
tDL1DL2
(1)
tF
Parameter
SDA Fall Time
tDXCX
tSU:DAT Data In Set Up Time
tCLDX
tHD:DAT Data In Hold Time
Min.
20
Max.
Unit
400
kHz
300
ns
100
ns
0
ns
ns
tCLQX
tDH
Data Out Hold Time
200
tCLQV(2)
tCHDX(3)
tAA
Clock Low to Next Data Valid (Access Time)
200
900
ns
tSU:STA Start Condition Set Up Time
600
ns
tDLCL
tHD:STA Start Condition Hold Time
600
ns
tCHDH
tSU:STO Stop Condition Set Up Time
600
ns
1300
ns
tDHDL
tBUF
Time between Stop Condition and Next Start Condition
tW
tWR
Write Time
10
ms
1. Sampled only, not 100% tested.
2. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the
falling or rising edge of SDA.
3. For a reSTART condition, or following a Write cycle.
25/31
DC and AC parameters
M34C02-W, M34C02-L, M34C02-R
Figure 13. AC Waveforms
tCHCL
tCLCH
SCL
tDLCL
SDA In
tCHDX
tCLDX
START
Condition
SDA
Input
SDA tDXCX
Change
tCHDH tDHDL
START
STOP
Condition Condition
SCL
SDA In
tCHDH
STOP
Condition
tCHDX
tW
Write Cycle
START
Condition
SCL
tCLQV
SDA Out
tCLQX
Data Valid
AI00795C
26/31
M34C02-W, M34C02-L, M34C02-R
8
Package mechanical
Package mechanical
Figure 14. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead
2x3mm², Package Outline
e
D
b
L1
L3
E
E2
L
A
D2
ddd
A1
UFDFPN-01
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
Table 15.
UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead
2x3mm², Package Mechanical Data
millimeters
inches
Symbol
A
Typ.
Min.
Max.
Typ.
Min.
Max.
0.55
0.50
0.60
0.022
0.020
0.024
0.00
0.05
0.000
0.002
0.20
0.30
0.008
0.012
0.061
0.065
A1
b
0.25
D
2.00
D2
0.079
1.55
ddd
E
0.010
1.65
0.05
3.00
E2
0.002
0.118
0.15
0.25
0.006
0.010
e
0.50
–
–
0.020
–
–
L
0.45
0.40
0.50
0.018
0.016
0.020
L1
0.15
0.006
L3
0.30
0.012
N
8
8
27/31
Package mechanical
M34C02-W, M34C02-L, M34C02-R
Figure 15. TSSOP8 – 8 lead Thin Shrink Small Outline, package outline
D
8
5
c
E1
1
E
4
α
A1
A
L
A2
L1
CP
b
e
TSSOP8AM
1. Drawing is not to scale.
Table 16.
TSSOP8 – 8 lead Thin Shrink Small Outline, package mechanical data
millimeters
inches
Symbol
Typ.
Min.
A
0.050
0.150
0.800
1.050
b
0.190
c
0.090
A2
Typ.
Min.
1.200
A1
1.000
CP
Max.
0.0472
0.0020
0.0059
0.0315
0.0413
0.300
0.0075
0.0118
0.200
0.0035
0.0079
0.0394
0.100
0.0039
D
3.000
2.900
3.100
0.1181
0.1142
0.1220
e
0.650
–
–
0.0256
–
–
E
6.400
6.200
6.600
0.2520
0.2441
0.2598
E1
4.400
4.300
4.500
0.1732
0.1693
0.1772
L
0.600
0.450
0.750
0.0236
0.0177
0.0295
L1
1.000
0°
8°
α
28/31
Max.
0.0394
0°
8°
M34C02-W, M34C02-L, M34C02-R
9
Part numbering
Part numbering
Table 17.
Ordering information scheme
Example:
M34C02-W –
W MB 6 T P
Device Type
M34 = ASSP I2C serial access EEPROM
Device Function
02 = 2 Kbit (256 x 8)
Operating Voltage
W = VCC = 2.5 to 5.5V (400kHz)
L = VCC = 2.2 to 5.5V (400kHz)
R = VCC = 1.8 to 5.5V (400kHz)
Package
MB = UDFDFPN8 (MLP8)
DW = TSSOP8 (169 mil width)
Device Grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
1 = Temperature range 0 to 70 °C.
Device tested with standard test flow
Option
blank = Standard Packing
T = Tape and Reel Packing
Plating Technology
P or G = ECOPACK® (RoHS compliant)
For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact your nearest ST Sales Office.
The category of second Level Interconnect is marked on the package and on the inner box
label, in compliance with JEDEC Standard JESD97. The maximum ratings related to
soldering conditions are also marked on the inner box label.
29/31
Revision history
10
Revision history
Table 18.
Document revision history
Date
Revision
Description of Revision
27-Dec-1999
2.0
Adjustments to the formatting. 0 to 70°C temperature range removed from
DC and AC tables.
No change to description of device, or parameters
07-Dec-2000
2.1
New definition of lead soldering temperature absolute rating for certain
packages
13-Mar-2001
2.2
-R voltage range added
18-Jul-2002
2.3
TSSOP8 (3x3mm² body size) package (MSOP8) added
22-May-2002
2.4
VFDFPN8 package (MLP8) added
21-Jul-2003
3.0
Document reformatted. -F voltage range added.
17-Mar-2004
4.0
Table of Contents added. MLP package changed. Absolute Maximum
Ratings for VIO(min) and VCC(min) changed. Soldering temperature
information clarified for RoHS compliant devices. Device grade information
clarified
14-Apr-2004
5.0
Typos corrected in Ordering Information example
26-Aug-2004
6.0
Device Grade clarified. Product List summary table added
30-Nov-2004
7.0
SO8 package removed.
8.0
M34C02-R operating frequency upgraded to 400 kHz. Modified
Section 1.1: Device Internal Reset, Figure 4: Maximum RP value versus
bus parasitic capacitance (C) for an I²C Bus, Table 10: Input Parameters,
ICC1 values in Table 11: DC Characteristics (M34C02-W), Table 13: DC
Characteristics (M34C02-R), Table 15: DC Characteristics (M34C02-W-F)
and moved M34C02-R to Table 14: AC Characteristics M34C02-W,
M34C02-L, M34C02-R). Added Figure 3: Chip Enable input connection.
Added EcoPack® and Ambient Operating Temperature information.
9
BN and DS (PDIP and TSSOP8) packages removed..
M34C02-F part number removed.
Test Conditions modified for ICC1 and VOL in Table 11: DC Characteristics
(M34C02-W).
Device Internal Reset removed and replaced by Section 2.5: Supply
voltage (VCC).
Blank option removed below Plating Technology in Table 17.
14-Oct-2005
11-Apr-2006
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M34C02-W, M34C02-L, M34C02-R
M34C02-W, M34C02-L, M34C02-R
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