Datasheet Low Duty LCD Segment Driver for Automotive application BU91796MUF-M MAX 80 Segments (SEG20×COM4) General Description Key Specifications BU91796MUF-M is a 1/4 duty general-purpose LCD driver that can be used for automotive applications and can drive up to 80 LCD Segments. It can support operating temperature of up to +105°C and qualified for AEC-Q100 Grade2, as required for automotive applications. Wettable flank QFN package is suitable for small footprint applications and provides significant advantages in inspectability and solder joint reliability. Features ■ ■ ■ ■ ■ ■ Supply Voltage Range: +2.5V to +6.0V Operating Temperature Range: -40°C to +105°C Max Segments: 80Segments Display Duty: 1/4 Bias: 1/2, 1/3 selectable Interface: 2wire Serial Interface Special Characteristics ■ ■ (Note) ESD(HBM): Latch-up current: Package AEC-Q100 Qualified Integrated RAM for Display Data (DDRAM): 20 x 4 bit (Max 80 Segment) LCD Drive Output: 4 Common Output, Max 20 Segment Output Integrated Buffer AMP for LCD Driving Integrated Oscillator Circuit No External Components Low Power Consumption Design ±2000V ±100mA W (Typ.) x D (Typ.) x H (Max.) (Note) Grade 2 Applications etc. Instrument Clusters Climate Controls Car Audios / Radios Metering White Goods Healthcare Products Battery Operated Applications VQFN32FV5050 5.0mm x 5.0mm x 1.0mm Typical Application Circuit VDD C > 0.1uF VDD VLCD COM0 COM1 COM2 COM3 SDA SCL Controller SEG0 SEG1 ・・ ・・ ・ ・・ SEG19 OSCIN TEST 1 TEST 2 VSS Insert Capacitors between VDD and VSS Segment LCD ・・ ・ ・・ ・・ Internal Clock Mode Figure 1. Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 ○This product has no designed protection against radioactive rays. 1/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) LCD BIAS SELECTOR Common Counter ＋ － Blink Timing Generator Power On Reset SEG18 SEG17 SEG16 SEG15 SEG14 20 19 18 17 16 SEG13 26 15 SEG12 VLCD 27 14 SEG11 VDD 28 13 SEG10 EXT-PAD VSS 29 12 SEG9 TEST1 30 11 SEG8 TEST2 31 10 SEG7 OSCIN 32 9 SEG6 2 3 4 5 6 7 8 SEG1 SEG2 SEG3 SEG4 SEG5 1 Serial Interface SDA OSCILLATOR 21 25 COM3 DDRAM Command Data Decoder Command Register COM0 COM2 VLCD OSCIN SEG19 Segment Driver SEG0 ＋ － Common Driver 22 LCD voltage generator 23 SEG 0 …… SEG19 COM1 COM 0 ……COM3 VDD 24 Block Diagram / Pin Configuration / Pin Description IF FILTER SCL VSS TEST1 SDA TEST2 SCL Figure 2. Block Diagram Figure 3. Pin Configuration (TOP VIEW) Table 1. Pin Description Pin Name Pin No. I/O TEST1 30 I TEST2 31 I OSCIN 32 I SDA 2 I/O SCL 1 VSS Handling when unused Function Test input (ROHM use only) Must be connected to VSS VSS POR enable setting (Note1) VDD: POR disenable VSS: POR enable External clock input External clock and Internal clock can be selected by command Must be connected to VSS when using internal oscillator VSS VSS Serial data in-out terminal - I Serial clock terminal - 29 - GND - VDD 28 - Power supply - VLCD 27 - Power supply for LCD driving - SEG0-19 3-22 O SEGMENT output for LCD driving OPEN COM0-3 23-26 O COMMON output for LCD driving OPEN EXT-PAD - (Note2) - Substrate OPEN/VSS (Note1) This function is guaranteed by design, not tested in production process. Software Reset is necessary to initialize IC in case of TEST2=VDD. (Note2) To radiate heat, Contact a board with the EXT-PAD which is located at the bottom side of VQFN32FV5050 package. Supply VSS level or Open state as the input condition for this PAD. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Absolute Maximum Ratings (VSS=0V) Symbol Ratings Unit Maximum Voltage1 Parameter VDD -0.5 to +7.0 V Power Supply Maximum Voltage2 VLCD -0.5 to VDD V LCD Drive Voltage 0.70 (Note1) Power Dissipation Pd Input Voltage Range Operational Temperature Range Storage Temperature Range VIN -0.5 to VDD+0.5 V Topr -40 to +105 °C Tstg -55 to +125 °C Remarks W (Note1) Derate by 7.0mW/°C when operating above Ta=25°C (when mounted in ROHM‟s standard board). Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=-40°C to +105°C, VSS=0V) Parameter Symbol Ratings Min Typ Max Unit Remarks Power Supply Voltage1 VDD 2.5 - 6.0 V Power Supply Power Supply Voltage2 VLCD 0 - VDD-2.4 V LCD Drive Voltage, VDD-VLCD 2.4V Electrical Characteristics DC Characteristics (VDD=2.5V to 6.0V, VLCD=0V, VSS=0V, Ta=-40°C to +105°C, unless otherwise specified) Limits Parameter Symbol Unit Conditions Min Typ Max “H” Level Input Voltage VIH 0.7VDD - VDD V SDA,SCL,OSCIN “L” Level Input Voltage VIL VSS - 0.3VDD V SDA,SCL,OSCIN “H” Level Input Current IIH - - 1 µA SDA,SCL,OSCIN “L” Level Input Current IIL -1 - - µA SDA,SCL,OSCIN, TEST2 VOL_SDA 0 - 0.4 V Iload = 3mA SEG RON - 3 - kΩ COM RON - 3 - kΩ VLCD Supply Voltage VLCD 0 - VDD-2.4 V VDD-VLCD2.4V Standby Current IDD1 - - 5 µA Display off, Oscillation off Power Consumption IDD2 - 12.5 30 µA VDD=3.3V, VLCD=0V, Ta=25°C Power save mode1, FR=71Hz 1/3 bias, Frame inverse SDA “L” Level Output Voltage LCD Driver On Resistance (Note2) , TEST2 Iload=±10µA (Note2) For external clock mode only. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Electrical Characteristics – continued Oscillation Characteristics (VDD=2.5V to 6.0V, VLCD=0V, VSS=0V, Ta=-40°C to +105°C, unless otherwise specified) Limits Parameter Symbol Unit Conditions Min Typ Max FR = 80Hz setting, Frame Frequency1 fCLK1 56 80 112 Hz VDD=2.5V to 6.0V, Ta=-40°C to +105°C Frame Frequency2 fCLK2 70 80 90 Hz FR = 80Hz setting, VDD=3.3V, Ta=25°C Frame Frequency3 fCLK3 77.5 87.5 97.5 Hz Frame Frequency4 fCLK4 67.5 87.5 108 Hz External Clock Rise Time tr - - 0.3 µs External Clock Fall Time tf - - 0.3 µs External Frequency fEXCLK 15 - 300 KHz External Clock Duty tdty 30 50 70 % (Note) <Frame frequency calculation at external clock mode> DISCTL 80HZ setting: Frame frequency [Hz] = external clock [Hz] DISCTL 71HZ setting: Frame frequency [Hz] = external clock [Hz] DISCTL 64HZ setting: Frame frequency [Hz] = external clock [Hz] DISCTL 53HZ setting: Frame frequency [Hz] = external clock [Hz] FR = 80Hz setting, VDD=5.0V, Ta=25°C FR = 80Hz setting, VDD=5.0V, Ta=-40°C to +105°C External clock mode (OSCIN) (Note) / 512 / 576 / 648 / 768 【Reference Data】 110 Frame Frequency [Hz] 100 VDD = 6.0V VDD = 5.0V 90 VDD = 3.3V 80 VDD = 2.7V 70 60 50 -40 -20 0 20 40 60 80 100 Temperature [°C] Figure 4. Typical Temperature Characteristics www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Electrical Characteristics - continued MPU interface Characteristics (VDD=2.5V to 6.0V, VLCD=0V, VSS=0V, Ta=-40°C to +105°C, unless otherwise specified) Limits Parameter Symbol Unit Conditions Min Typ Max Input Rise Time tr - - 0.3 µs Input Fall Time tf - - 0.3 µs SCL Cycle Time tSCYC 2.5 - - µs “H” SCL Pulse Width tSHW 0.6 - - µs “L” SCL Pulse Width tSLW 1.3 - - µs SDA Setup Time tSDS 100 - - ns SDA Hold Time tSDH 100 - - ns Buss Free Time tBUF 1.3 - - µs tHD;STA 0.6 - - µs START Condition Setup Time tSU;STA 0.6 - - µs STOP Condition Setup Time tSU;STO 0.6 - - µs START Condition Hold Time SDA tBUF tf tS LW tSCYC SCL tHD; STA tr tSDH tS HW tSDS SDA tSU; STO tSU; STA Figure 5. Interface Timing I/O Equivalence Circuit VDD VDD VLCD VSS VSS SDA SCL VSS VSS VDD VDD TEST1 TEST2 VSS VSS VDD VDD OSCIN SEG/COM VSS VSS Figure 6 I/O Equivalence Circuit www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Application Example VDD VDD VLCD COM COM COM COM 0 1 2 3 SDA SCL Controller SEG 0 SEG 1 ・ ・ ・ ・ ・ ・ ・ OSCIN TEST 1 TEST 2 VSS SEG 19 Segment LCD ・ ・ ・ ・ ・ ・ ・ Internal Clock Mode VDD VDD VLCD Controller COM 0 COM 1 COM 2 COM 3 SDA SCL SEG 0 SEG 1 ・ ・・ ・ ・ ・ ・ SEG 19 OSCIN TEST 1 TEST 2 VSS Segment LCD ・ ・ ・ ・ ・ ・ ・ External Clock Mode Figure 7. Example of Application Circuit www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Functional Descriptions Command /Data Transfer Method BU91796MUF-M is controlled by 2wire signal (SDA, SCL). SDA SCL START condition STOP condition Figure 8. 2 wire Command/Data Transfer Format It is necessary to generate START and STOP condition when sending command or display data through this 2 wire serial interface. Slave address S 0 1 1 1 1 1 0 0 A Command A C Display Data A P 0 Command or data judgment bit START condition STOP condition Acknowledge Figure 9. Interface Protcol The following procedure shows how to transfer command and display data. (1) Generate “START condition”. (2) Issue Slave address. (3) Transfer command and display data. (4) Generate “STOP condition” Acknowledge (ACK) Data format is comprised of 8 bits, Acknowledge bit is returned after sending 8-bit data. After the transfer of 8-bit data (Slave Address, Command, Display Data), release the SDA line at the falling edge of the 8th clock. The SDA line is then pulled “Low” until the falling edge of the 9th clock SCL. (Output cannot be pulled “High” because of open drain NMOS). If acknowledge function is not required, keep SDA line at “Low” level from 8th falling edge to 9th falling edge of SCL. SDA 1-7 8 9 1-7 8 9 1-7 8 9 SCL S START condition P SLAVE ADDRESS ACK DATA ACK DATA ACK STOP condition Figure 10. Acknowledge Timing www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Command Transfer Method Issue Slave Address (“01111100”) after generating “START condition”. st The 1 byte after Slave Address always becomes command input. MSB (“command or data judge bit”) of command decide to next data is command or display data. When set “command or data judge bit”=„1‟, next byte will be command. When set “command or data judge bit”=„0‟, next byte data is display data. S Slave address A 1 Command A 1 Command A 1 Command A 0 Command A Display Data … P It cannot accept input command once it enters into display data transfer state. In order to input command again it is necessary to generate “START condition”. If “START condition” or “STOP condition” is sent in the middle of command transmission, command will be cancelled. If Slave address is continuously sent following “START condition”, it remains in command input state. “Slave address” must be sent right after the “START condition”. When Slave Address cannot be recognized in the first data transmission, no Acknowledge bit is generated and next transmission will be invalid. When data is invalid status, if “START condition” is transmitted again, it will return to valid status. Consider the MPU interface characteristic such as Input rise time and Setup/Hold time when transferring command and data (Refer to MPU Interface). Write Display and Transfer Method BU91796MUF-M has Display Data RAM (DDRAM) of 20×4=80bit. The relationship between data input and display data, DDRAM data and address are as follows; Slave address S 01111100 Command A 0 0000000 A a b c d e f g h A i j k l m n o p A … P Display Data 8-bit data is stored in DDRAM. ADSET command specifies the address to be written, and address is automatically incremented in every 4-bit data. Data can be continuously written in DDRAM by transmitting data continuously. When RAM data is written successively, after writing RAM data to 13h (SEG19), the address is returned to 00h (SEG0) by the auto-increment function BIT 01 02 03 0 a e i m COM0 1 b f j n COM1 2 c g k o COM2 3 d h l p SEG0 SEG1 SEG2 SEG3 04 DDRAM address 05 06 07 00 ・・・ 11h 12h 13h COM3 SEG4 SEG5 SEG6 SEG7 SEG17 SEG18 SEG19 Display data is written to DDRAM every 4-bit data. No need to wait for ACK bit to complete data transfer. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Oscillator The clock signals for logic and analog circuit can be generated from internal oscillator or external clock. If internal oscillator circuit is used, OSCIN must be connected to VSS level. When using external clock mode, input external clock from OSCIN terminal after ICSET command setting. OSCIN OSCIN BU91796 Clock BU91796 VSS VSS Figure 11. Internal Clock Mode Figure 12. External Clock Mode LCD Driver Bias Circuit BU91796MUF-M generates LCD driving voltage with on-chip Buffer AMP. And it can drive LCD at low power consumption. 1/3 or 1/2 Bias can be set by MODESET command. Line or frame inversion can be set by DISCTL command. Refer to the “LCD driving waveform” for each LCD bias setting. Blink Timing Generator BU91796MUF-M has Blink function. Blink mode is asserted by BLKCTL command. The Blink frequency varies depending on fCLK characteristics at internal clock mode. Refer to Oscillation Characteristics for fCLK. Reset Initialize Condition Initial condition after executing Software Reset is as follows. ・Display is OFF. ・DDRAM address is initialized (DDRAM Data is not initialized). Refer to Command Description for initial value of registers. Command / Function List Description List of Command / Function No. Command Function 1 Set IC Operation (ICSET) Software reset, internal/external clock setting 2 Display Control (DISCTL) Frame frequency, power save mode setting 3 Address Set (ADSET) DDRAM address setting (00h to 13h) 4 Mode Set (MODESET) Display on/off, 1/2bias or 1/3bias setting 5 Blink Control (BLKCTL) Blink off/0.5s/1s/2s blink setting 6 All Pixel Control (APCTL) All pixels on/off during DISPON www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Detailed Command Description D7 (MSB) is a command or data judgment bit. Refer to Command and data transfer method. C: 0: Next byte is RAM write data. 1: Next byte is command. Set IC Operation (ICSET) MSB D7 C D6 1 D5 1 D4 0 D3 1 D2 * D1 P1 LSB D0 P0 ( * : Don‟t care) Set software reset execution. Setup P1 No operation 0 Software Reset Execute 1 When “Software Reset” is executed, BU91796MUF-M is reset to initial condition. (Refer to Reset initialize condition) Don‟t set Software Reset (P1) with P0 at the same time. Set oscillator mode Setup Internal clock P0 Reset initialize condition 0 ○ External clock 1 Internal clock mode: OSCIN must be connected to VSS level. External clock mode: Input external clock from OSCIN terminal.. <Frame frequency Calculation at external clock mode> DISCTL 80Hz setting: Frame frequency [Hz] = external clock [Hz] / 512 DISCTL 71Hz setting: Frame frequency [Hz] = external clock [Hz] / 576 DISCTL 64Hz setting: Frame frequency [Hz] = external clock [Hz] / 648 DISCTL 53Hz setting: Frame frequency [Hz] = external clock [Hz] / 768 Command ICSET OSCIN_EN ( Internal signal ) ( Internal clock mode External clock mode Internal oscillation ( Internal signal ) External clock ( OSCIN ) Figure 13. OSC MODE Switch Timing www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Display Control (DISCTL) MSB D7 C D6 0 D5 1 D4 P4 D3 P3 Set Power save mode FR. Setup D2 P2 D1 P1 LSB D0 P0 P4 P3 Reset initialize condition Normal mode (80Hz) 0 0 ○ Power save mode 1 (71Hz) 0 1 Power save mode 2 (64Hz) 1 0 Power save mode 3 (50Hz) 1 1 Power consumption is reduced in the following order: Normal mode > Power save mode1 > Power save mode 2 > Power save mode 3. Set LCD drive waveform. Setup P2 Reset initialize condition Line inversion 0 ○ Frame inversion 1 Power consumption is reduced in the following order: Line inversion > Frame inversion Typically, when driving large capacitance LCD, Line inversion will increase the influence of crosstalk. Regarding driving waveform, refer to LCD driving waveform. Set Power save mode SR. Setup P1 P0 Power save mode 1 0 0 Power save mode 2 0 1 Normal mode 1 0 Reset initialize condition ○ High power mode 1 1 Power consumption is increased in the following order: Power save mode 1 < Power save mode 2 < Normal mode < High power mode Use VDD- VLCD ≥ 3.0V in High power mode condition. (Reference current consumption data) Setup Current consumption Power save mode 1 ×0.5 Power save mode 2 ×0.67 Normal mode ×1.0 High power mode ×1.8 The data above is for reference only. Actual consumption depends on Panel load. Address Set (ADSET) MSB D7 C D6 0 D5 0 D4 P4 D3 P3 D2 P2 D1 P1 LSB D0 P0 The range of address can be set from 00000 to 10011(bin). Don‟t set out of range address, otherwise address will be set 00000. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Mode Set (MODESET) MSB D7 C D6 1 D5 0 D4 * D3 P3 D2 P2 LSB D0 * D1 * (* : Don‟t care) Set display ON and OFF. Setup P3 Reset initialize condition Display OFF (DISPOFF) 0 ○ Display ON (DISPON) 1 Display OFF : Regardless of DDRAM data, all SEGMENT and COMMON output will be stopped after 1frame of data write. Display OFF mode will be disabled after Display ON command. Display ON : SEGMENT and COMMON output will be active and start to read the display data from DDRAM. Set bias level Setup P2 Reset initialize condition 1/3 Bias 0 ○ 1/2 Bias 1 Refer to LCD driving waveform. Blink Control (BLKCTL) MSB D7 D6 D5 D4 D3 D2 D1 LSB D0 C 1 1 1 0 * P1 P0 ( * : Don‟t care) Set blink mode. Blink mode (Hz) P1 P0 Reset initialize condition OFF 0 0 ○ 0.5 0 1 1 1 0 2 1 1 The Blink frequency varies depending on fCLK characteristics at internal clock mode. Refer to Oscillation Characteristics for fCLK. All Pixel Control (APCTL) MSB D7 C D6 1 D5 1 D4 1 LSB D0 P0 D3 1 D2 1 D1 P1 P1 Reset initialize condition Normal 0 ○ All pixel ON (APON) 1 All display set ON, OFF Setup Setup P0 Reset initialize condition Normal 0 ○ All pixel OFF (APOFF) 1 All pixels ON: All pixels are ON regardless of DDRAM data. All pixels OFF: All pixels are OFF regardless of DDRAM data. This command is valid in Display on status. The data of DDRAM is not changed by this command. If set both P1 and P0 =”1”, APOFF will be selected. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) LCD Driving Waveform (1/3bias) Line Inversion Frame Inversion SEGn SEG n+1 SEG n+2 SEG n+3 SEGn SEG n+1 SEG n+2 SEG n+3 COM0 stateA COM0 stateA COM1 stateB COM1 stateB COM2 COM2 COM3 COM3 1frame VDD 1frame VDD COM0 COM0 VLCD VLCD VDD VDD COM1 COM1 VLCD VLCD VDD VDD COM2 COM2 VLCD VLCD VDD VDD COM3 COM3 VLCD VLCD VDD VDD SEGn SEGn VLCD VLCD VDD VDD SEGn+1 SEGn+1 VLCD VLCD VDD VDD SEGn+2 SEGn+2 VLCD VLCD VDD VDD SEGn+3 SEGn+3 VLCD VLCD stateA (COM0-SEGn) stateA (COM0-SEGn) (VDD-VLCD) (VDD-VLCD) 2/3 (VDD-VLCD) 1/3 (VDD-VLCD) 0 -1/3 (VDD-VLCD) -2/3 (VDD-VLCD) - (VDD-VLCD) 2/3 (VDD-VLCD) 1/3 (VDD-VLCD) 0 -1/3 (VDD-VLCD) -2/3 (VDD-VLCD) - (VDD-VLCD) stateB (COM1-SEGn) stateB (COM1-SEGn) (VDD-VLCD) (VDD-VLCD) 2/3 (VDD-VLCD) 2/3 (VDD-VLCD) 1/3 (VDD-VLCD) 1/3 (VDD-VLCD) 0 0 -1/3 (VDD-VLCD) -1/3 (VDD-VLCD) -2/3 (VDD-VLCD) -2/3 (VDD-VLCD) - (VDD-VLCD) -(VDD-VLCD) Figure 14. LCD Waveform at Line Inversion (1/3bias) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 15. LCD Waveform at Frame Inversion (1/3bias) 13/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) (1/2bias) Line Inversion Frame Inversion SEGn SEG n+1 SEG n+2 SEG n+3 SEGn SEG n+1 SEG n+2 SEG n+3 COM0 stateA COM0 stateA COM1 stateB COM1 stateB COM2 COM2 COM3 COM3 VDD 1frame 1frame VDD COM0 COM0 VLCD VLCD VDD VDD COM1 COM1 VLCD VLCD VDD VDD COM2 COM2 VLCD VLCD VDD VDD COM3 COM3 VLCD VLCD VDD VDD SEGn SEGn VLCD VLCD VDD VDD SEGn+1 SEGn+1 VLCD VLCD VDD VDD SEGn+2 SEGn+2 VLCD VLCD VDD SEGn+3 VDD SEGn+3 VLCD stateA (COM0-SEGn) (VDD-VLCD) 1/2 (VDD-VLCD) VLCD stateA (COM0-SEGn) (VDD-VLCD) 1/2 (VDD-VLCD) 0 0 -1/2 (VDD-VLCD) -1/2 (VDD-VLCD) -(VDD-VLCD) -(VDD-VLCD) stateB (COM1-SEGn) (VDD-VLCD) stateB (COM1-SEGn) (VDD-VLCD) 1/2 (VDD-VLCD) 1/2 (VDD-VLCD) 0 0 -1/2 (VDD-VLCD) -1/2 (VDD-VLCD) -(VDD-VLCD) -(VDD-VLCD) Figure 16. LCD Waveform in Line Inversion (1/2bias) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 17. LCD Waveform in Frame Inversion (1/2bias) 14/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Example of Display Data If LCD layout pattern is like Figure 18 and Figure 19, and display pattern is like Figure 20, Display data will be shown as below. COM0 COM1 COM2 COM3 Figure 18. Example COM Line Pattern SEG1 SEG3 SEG2 SEG5 SEG7 SEG4 SEG6 SEG8 SEG9 SEG10 Figure 19. Example SEG Line Pattern Figure 20. Example Display Pattern <DDRAM data mapping in Figure 20 display pattern> S E G 0 S E G 1 S E G 2 S E G 3 S E G 4 S E G 5 S E G 6 S E G 7 S E G 8 S E G 9 S E G 10 S E G 11 S E G 12 S E G 13 S E G 14 S E G 15 S E G 16 S E G 17 S E G 18 S E G 19 COM0 D0 0 1 1 0 1 1 1 1 0 1 0 0 0 0 0 0 0 0 0 0 COM1 D1 0 0 1 1 1 0 0 1 1 1 1 0 0 0 0 0 0 0 0 0 COM2 D2 0 0 0 1 0 1 0 0 1 1 1 0 0 0 0 0 0 0 0 0 COM3 D3 0 0 1 1 0 0 0 1 0 1 0 0 0 0 0 0 0 0 0 0 Address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Initialize Sequence Follow the Power-on sequence below to initialize condition. Power on ↓ STOP condition ↓ START condition ↓ Issue slave address ↓ Execute Software Reset by sending ICSET command. After Power-on and before sending initialize sequence, each register value, DDRAM address and DDRAM data are random. Start Sequence Start Sequence Example1 Input 1 Power on 2 3 4 5 6 7 8 9 10 D6 D5 D4 D3 D2 D1 D0 Descriptions VDD=0→5V (Tr: Min 1ms to Max 500ms) Initialize IC Stop condition Start condition 0 1 1 1 1 1 0 0 Issue slave address 1 1 1 0 1 * 1 0 Software Reset 1 1 1 1 0 * 0 0 Blink OFF 1 0 1 0 0 1 0 0 80Hz, Frame inv., Power save mode1 1 1 1 0 1 * 0 1 External clock input 0 0 0 0 0 0 0 0 RAM address set * * * * * * * * * * * * * * * * address address 00h to 01h 02h to 03h * * * * * * * * address 12h to 13h … 11 ↓ wait 100µs ↓ Stop ↓ Start ↓ Slave address ↓ ICSET ↓ BLKCTL ↓ DISCTL ↓ ICSET ↓ ADSET ↓ Display Data Display Data D7 … No. 12 13 14 15 16 (*: don‟t care) Display Data ↓ Stop ↓ Start ↓ Slave address ↓ MODESET ↓ Stop www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Stop condition Start condition 0 1 1 1 1 1 0 0 Issue slave address 1 1 0 * 1 0 * * Display ON, 1/3bias Stop condition 16/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M MAX 80 segments (SEG20×COM4) Datasheet Start Sequence Example2 Initialize Initialize Sequence DISPON DISPON Sequence RAM Write RAM Write Sequence DISPOFF DISPOFF Sequence BU91796MUF-M is initialized with Start Sequence, starts to display with “DISPON Sequence”, updates display data with “RAM Write Sequence” and stops the display with “DISPOFF Sequence”. Execute “DISPON Sequence” in order to restart display. Initialize Sequence Input DATA Description D7 D6 D5 D4 D3 D2 D1 D0 Power on wait 100us STOP START Slave address ICSET MODESET ADSET Display data … 0 1 1 1 1 1 0 0 1 1 1 0 1 0 1 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 * * * * * * * * Execute Software Reset Display OFF RAM address set Display data STOP DISPON Sequence Input DATA Description D7 D6 D5 D4 D3 D2 D1 D0 START Slave address ICSET DISCTL BLKCTL APCTL MODESET 0 1 1 1 1 1 0 0 1 1 1 0 1 0 0 0 1 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 1 1 0 0 1 1 0 0 1 0 0 0 Execute internal OSC mode Set Display Control Set BLKCTL Set APCTL Display ON STOP RAM Write Sequence Input DATA Description D7 D6 D5 D4 D3 D2 D1 D0 START Slave address ICSET DISCTL BLKCTL APCTL MODESET ADSET Display Data … STOP 0 1 1 1 1 1 0 0 1 1 1 0 1 0 0 0 1 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 1 0 1 0 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 * * * * * * * * Execute internal OSC mode Set Display Control Set BLKCTL Set APCTL Display ON RAM address set Display data DISPOFF Sequence Input DATA Description D7 D6 D5 D4 D3 D2 D1 D0 START Slave address ICSET MODESET STOP 0 1 1 1 1 1 0 0 1 1 1 0 1 0 0 0 1 1 0 0 0 0 0 0 Execute internal OSC mode Display OFF Abnormal operation may occur in BU91796MUF-M due to the effect of noise or other external factor. To avoid this phenomenon, it is highly recommended to input command according to sequence described above during initialization, display ON/OFF and refresh of RAM data. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Cautions in Power ON/OFF BU91796MUF-M has “P.O.R” (Power-On Reset) circuit and Software Reset function. Keep the following recommended Power-On conditions in order to power up properly. Set power up conditions to meet the recommended tR, tF, tOFF, and Vbot specification below in order to ensure P.O.R operation. Set pin TEST2=”L” to enable POR circuit. VDD tF tR tOFF Vbot Recommended condition of tR, tF, tOFF, Vbot (Ta=25°C) (Note) (Note) (Note) (Note) tR tF tOFF Vbot 1ms 1ms Less than Min 20ms to 500ms to 500ms 0.1V (Note) This function is guaranteed by design, not tested in production process. Figure 21. Power ON/OFF Waveform If it is difficult to keep above conditions, execute the following sequence as quickly as possible after Power-On. Setting TEST2="H" disables the POR circuit, in such case, execute the following sequence. Note however that it cannot accept command while supply is unstable or below the minimum supply range. Note also that software reset is not a complete alternative to POR function. 1. Generate STOP Condition VDD SDA SCL STOP condition Figure 22. Stop Condition 2. Generate START Condition. VDD SDA SCL START condition Figure 23. Start Condition 3. Issue Slave Address 4. Execute Software Reset (ICSET) Command www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC‟s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC‟s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M MAX 80 segments (SEG20×COM4) Datasheet Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Data transmission To refrain from data transmission is strongly recommended while power supply is rising up or falling down to prevent from the occurrence of disturbances on transmission and reception. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M Datasheet MAX 80 segments (SEG20×COM4) Ordering Information B U 9 1 7 9 Part Number 6 M U F - Package MUF : VQFN32FV5050 ME2 Product Rank M: for Automotive Packaging and forming specification E2: Embossed tape and reel Lineup Package VQFN32FV5050 Reel of 2500 Orderable Part Number BU91796MUF-ME2 Marking Diagram VQFN32FV5050 (TOP VIEW) Part Number Marking 9 1 7 9 6 LOT Number 1PIN MARK www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M MAX 80 segments (SEG20×COM4) Datasheet Physical Dimension Tape and Reel Information Package Name www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 VQFN32FV5050 22/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 BU91796MUF-M MAX 80 segments (SEG20×COM4) Datasheet Revision History Date 8. Feb. 2016 Revision 001 Changes First release www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 23/23 TSZ02201-0P4P0D301020-1-2 8.Feb.2016 Rev.001 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BU91796MUF-M - Web Page Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BU91796MUF-M VQFN32FV5050 2500 2500 Taping inquiry Yes