Material Content Data Sheet Sales Product Name BSC0902NSI Issued MA# MA001013830 Package PG-TDSON-8-6 14. August 2015 Weight* 118.18 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper gold carbon black epoxy resin silicondioxide tin silver silver tin lead iron phosphorus copper iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7439-89-6 7723-14-0 7440-50-8 7439-89-6 7723-14-0 7440-50-8 0.393 0.33 0.038 0.03 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.33 3322 3322 320 0.011 0.01 37.762 31.96 32.00 319521 96 319937 0.046 0.04 0.04 385 385 0.088 0.07 745 6.251 5.29 37.683 31.89 37.25 318854 372493 1.470 1.24 1.24 12437 12437 0.166 0.14 0.14 1401 1401 0.016 0.01 0.012 0.01 0.592 0.50 0.011 0.01 0.003 0.00 11.320 9.58 0.022 0.02 0.007 0.01 22.292 18.86 52894 131 105 0.52 5012 29 9.59 95785 2. 3. 57 18.89 188621 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 95910 189 Important Remarks: 1. 5248 96 188867 1000000