NLU1GT126 Non-Inverting 3-State Buffer, TTL Level LSTTL−Compatible Inputs The NLU1GT126 MiniGatet is an advanced CMOS high−speed non−inverting buffer in ultra−small footprint. The NLU1GT126 requires the 3−state control input (OE) to be set Low to place the output in the high impedance state. The device input is compatible with TTL−type input thresholds and the output has a full 5.0 V CMOS level output swing. The NLU1GT126 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. http://onsemi.com MARKING DIAGRAMS • • • • High Speed: tPD = 3.8 ns (Typ) @ VCC = 5.0 V Low Power Dissipation: ICC = 2 mA (Max) at TA = 25°C TTL−Compatible Input: VIL = 0.8 V; VIH = 2.0 V CMOS−Compatible Output: VOH > 0.8 VCC; VOL < 0.1 VCC @ Load Power Down Protection Provided on inputs Balanced Propagation Delays Ultra−Small Packages These are Pb−Free Devices OE 1 6 9M ULLGA6 1.0 x 1.0 CASE 613AD 9M ULLGA6 1.2 x 1.0 CASE 613AE 9M ULLGA6 1.45 x 1.0 CASE 613AF 9M UDFN6 1.0 x 1.0 CASE 517BX XM UDFN6 1.45 x 1.0 CASE 517AQ XM 1 Features • • • • UDFN6 1.2 x 1.0 CASE 517AA 1 1 1 VCC 1 IN A GND 5 2 3 NC 4 1 OUT Y 9 M = Device Marking = Date Code Figure 1. Pinout (Top View) OE IN A ORDERING INFORMATION OUT Y Figure 2. Logic Symbol FUNCTION TABLE Input Output A OE Y L H X H H L L H Z © Semiconductor Components Industries, LLC, 2012 July, 2012 − Rev. 3 See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. PIN ASSIGNMENT 1 OE 2 IN A 3 GND 4 OUT Y 5 NC 6 VCC 1 Publication Order Number: NLU1GT126/D NLU1GT126 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V DC Output Voltage −0.5 to +7.0 V VIN < GND −20 mA VOUT < GND ±20 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±12.5 mA ICC DC Supply Current Per Supply Pin ±25 mA IGND DC Ground Current per Ground Pin ±25 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL Moisture Sensitivity FR Flammability Rating ILATCHUP Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Latchup Performance Above VCC and Below GND at 125°C (Note 2) mA ±500 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Positive DC Supply Voltage VIN Digital Input Voltage VOUT Output Voltage TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V http://onsemi.com 2 Min Max Unit 1.65 5.5 V 0 5.5 V 0 5.5 V −55 +125 °C 0 0 100 20 ns/V NLU1GT126 DC ELECTRICAL CHARACTERISTICS TA = 25 5C Symbol Parameter Conditions VCC (V) Min 1.4 2.0 VIH Low−Level Input Voltage 3.0 4.5 to 5.5 VIL Low−Level Input Voltage 3.0 4.5 to 5.5 VOH High−Level Output Voltage VOL Low−Level Output Voltage Typ Max TA = +855C TA = −555C to +1255C Min Min 1.4 2.0 0.53 0.8 VIN = VIH or VIL IOH = −50 mA 3.0 4.5 2.9 4.4 VIN = VIH or VIL IOH = −4 mA IOH = −8 mA 3.0 4.5 2.58 3.94 VIN = VIH or VIL IOL = 50 mA 3.0 4.5 VIN = VIH or VIL IOL = 4 mA IOL = 8 mA Max 3.0 4.5 0 0 Max 1.4 2.0 0.53 0.8 V 0.53 0.8 2.9 4.4 2.9 4.4 2.48 3.80 2.34 3.66 Unit V V 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V IIN Input Leakage Current 0 v VIN v 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA ICC Quiescent Supply Current 0 v VIN v VCC 5.5 1.0 20 40 mA ICCT Quiescent Supply Current VIN = 3.4 V Other Input: VCC or GND 5.5 1.35 1.50 1.65 mA IOPD Output Leakage Current VOUT = 5.5 V 0 0.5 5.0 10 mA IOZ 3−State Leakage Current VIN = VIH or VIL VOUT = VCC or GND 0 ±0.25 ±2.5 ±2.5 mA TA = +855C TA = −555C to +1255C Min AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) VCC (V) Test Condition 3.0 to 3.6 TA = 25 5C Max Unit 9.5 13 12 16 ns 1.0 1.0 6.5 8.5 8.5 10.5 8.0 11.5 1.0 1.0 9.5 13 11.5 15 3.6 5.1 5.1 7.1 1.0 1.0 6.0 8.0 7.5 9.5 CL = 15 pF CL = 50 pF 6.5 8.0 9.7 13.2 1.0 1.0 11.5 15 14.5 18.5 CL = 15 pF CL = 50 pF 4.8 7.0 6.8 8.8 1.0 1.0 8.0 10 10 12 Input Capacitance 4 10 10 10 COUT 3−State Output Capacitance (Output in High Impedance State) 6 pF CPD Power Dissipation Capacitance (Note 3) 14 pF Symbol tPLH, tPHL tPZL, tPZH tPLZ, tPHZ CIN Parameter Propagation Delay, A to Y (Figures 3 and 5) Output Enable Time, OE to Y (Figures 4 and 6) Output Disable Time, OE to Y (Figures 4 and 6) Min Typ Max Min Max CL = 15 pF CL = 50 pF 5.6 8.1 8.0 11.5 1.0 1.0 4.5 to 5.5 CL = 15 pF CL = 50 pF 3.8 5.3 5.5 7.5 3.0 to 3.6 CL = 15 pF CL = 50 pF 5.4 7.9 4.5 to 5.5 CL = 15 pF CL = 50 pF 3.0 to 3.6 4.5 to 5.5 5.0 ns ns pF 3. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. http://onsemi.com 3 NLU1GT126 SWITCHING WAVEFORMS OE VCC 50% A tPHL tPLH VCC 50% GND tPZL GND HIGH IMPEDANCE 50% VCC Y 50% VCC tPLZ VOL + 0.3V tPZH tPHZ Y Figure 3. Switching Waveforms HIGH IMPEDANCE Figure 4. TEST POINT TEST POINT OUTPUT DEVICE UNDER TEST VOH − 0.3V 50% VCC Y OUTPUT DEVICE UNDER TEST CL * *Includes all probe and jig capacitance 1 kW CL * CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH. *Includes all probe and jig capacitance Figure 5. Test Circuit Figure 6. Test Circuit INPUT Figure 7. Input Equivalent Circuit ORDERING INFORMATION Package Shipping† UDFN6, 1.2 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLU1GT126AMX1TCG ULLGA6, 1.45 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLU1GT126BMX1TCG ULLGA6, 1.2 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLU1GT126CMX1TCG ULLGA6, 1.0 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel NLU1GT126AMUTCG UDFN6, 1.45 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLU1GT126CMUTCG UDFN6, 1.0 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel Device NLU1GT126MUTCG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NLU1GT126 PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA ISSUE C EDGE OF PACKAGE PIN ONE REFERENCE 2X 0.10 C ÉÉ ÉÉ ÉÉ L1 E DETAIL A Bottom View (Optional) TOP VIEW 2X EXPOSED Cu 0.10 C (A3) 0.10 C A1 A 10X 0.08 C ÉÉÉ ÉÉÉ A3 DETAIL B Side View (Optional) 5X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 MOUNTING FOOTPRINT* 6X 6X 0.42 C A1 DIM A A1 A3 b D E e L L1 L2 MOLD CMPD SEATING PLANE SIDE VIEW 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D 0.22 L 3 L2 6X b 0.10 C A B 0.05 C 6 0.40 PITCH 4 e NOTE 3 1.07 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW http://onsemi.com 5 NLU1GT126 PACKAGE DIMENSIONS UDFN6 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D PIN ONE REFERENCE 0.10 C L1 ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS DETAIL B A1 SIDE VIEW MOLD CMPD OPTIONAL CONSTRUCTIONS A 0.05 C DIM A A1 A2 b D E e L L1 DETAIL B 0.05 C 6X A2 6X C 6X SEATING PLANE 0.30 PACKAGE OUTLINE L 1.24 3 1 DETAIL A 6X 0.53 4 BOTTOM VIEW MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT e 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C L L 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NLU1GT126 PACKAGE DIMENSIONS UDFN6 1.0x1.0, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉÉ ÉÉÉ ÉÉÉ E 0.10 C 2X 0.10 C DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 5X e 5X 0.48 L 6X 0.22 3 1 L1 1.18 6 4 BOTTOM VIEW 6X b 0.10 M C A B 0.05 M C 0.53 1 PKG OUTLINE NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NLU1GT126 PACKAGE DIMENSIONS ULLGA6 1.0x1.0, 0.35P CASE 613AD ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW C A1 e 5X L MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 5X 0.48 NOTE 4 3 1 6X 0.22 1.18 L1 0.53 6 4 6X b 0.35 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 1 PKG OUTLINE 0.05 C NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 NLU1GT126 PACKAGE DIMENSIONS ULLGA6 1.2x1.0, 0.4P CASE 613AE ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW C A1 e 5X L MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.35 0.45 5X 0.49 NOTE 4 3 1 1.24 L1 0.53 6 4 6X b 0.10 C A B BOTTOM VIEW 6X 0.26 0.05 C NOTE 3 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 NLU1GT126 PACKAGE DIMENSIONS ULLGA6 1.45x1.0, 0.5P CASE 613AF ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉ ÉÉÉ ÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW 5X C A1 e 5X L MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 0.49 NOTE 4 3 1 1.24 L1 0.53 6 4 BOTTOM VIEW 6X 0.30 6X b 0.10 C A B 0.05 C NOTE 3 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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