Philips Semiconductors Product specification Rectifier diodes ultrafast, rugged BYV40E series FEATURES SYMBOL QUICK REFERENCE DATA VR = 150 V/ 200 V • Low forward volt drop • Fast switching • Soft recovery characteristic • Reverse surge capability • High thermal cycling performance • low profile surface mounting package VF ≤ 0.7 V a2 3 a1 1 IO(AV) = 1.5 A k 2 IRRM = 0.1 A trr ≤ 25 ns GENERAL DESCRIPTION PINNING Dual, common cathode, ultra-fast, epitaxial rectifier diodes intended for use as output rectifiers in high frequency switched mode power supplies. PIN The BYV40E series is supplied in the SOT223 surface mounting package. SOT223 DESCRIPTION 1 anode 1 2 cathode 3 anode 2 tab cathode 4 2 1 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER VRRM VRWM VR Peak repetitive reverse voltage Crest working reverse voltage Continuous reverse voltage IO(AV) Average rectified output current (both diodes conducting)1 Repetitive peak forward current per diode Non-repetitive peak forward current per diode CONDITIONS MIN. BYV40E IFRM IFSM IRRM IRSM Tstg Tj Tsp ≤ 120˚C square wave; δ = 0.5; Tsp ≤ 132˚C t = 25 µs; δ = 0.5; Tsp ≤ 132 ˚C tp = 10 ms tp = 8.3 ms sinusoidal; Tj = 150˚C prior to surge; with reapplied VRWM(max) Repetitive peak reverse current tp = 2 µs; δ = 0.001 per diode Non-repetitive peak reverse tp = 100 µs current per diode Storage temperature Operating junction temperature - MAX. -150 150 150 150 UNIT -200 200 200 200 V V V - 1.5 A - 1.5 A - 6 6.6 A A - 0.1 A - 0.1 A -65 - 150 150 ˚C ˚C 1 Neglecting switching and reverse current losses September 1998 1 Rev 1.300 Philips Semiconductors Product specification Rectifier diodes ultrafast, rugged BYV40E series ESD LIMITING VALUE SYMBOL PARAMETER CONDITIONS VC Electrostatic discharge capacitor voltage Human body model; C = 250 pF; R = 1.5 kΩ MIN. MAX. UNIT - 8 kV THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-sp Thermal resistance junction to solder point Thermal resistance junction to ambient Rth j-a MIN. TYP. MAX. UNIT one or both diodes conducting - - 15 K/W pcb mounted; minimum footprint pcb mounted; pad area as in fig:11 - 156 70 - K/W K/W MIN. TYP. MAX. UNIT - 0.50 0.82 100 5 - 0.7 1.0 300 10 11 25 V V µA µA nC ns - 10 3 20 - ns V ELECTRICAL CHARACTERISTICS characteristics are per diode at Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS VF Forward voltage IR Reverse current Qs trr1 Reverse recovery charge Reverse recovery time trr2 Vfr Reverse recovery time Forward recovery voltage IF = 0.5 A; Tj = 150˚C IF = 1.5 A VR = VRWM; Tj = 100 ˚C VR = VRWM IF = 2 A; VR ≥ 30 V; -dIF/dt = 20 A/µs IF = 1 A; VR ≥ 30 V; -dIF/dt = 100 A/µs IF = 0.5 A to IR = 1 A; Irec = 0.25 A IF = 2 A; dIF/dt = 20 A/µs September 1998 2 Rev 1.300 Philips Semiconductors Product specification Rectifier diodes ultrafast, rugged I dI F BYV40E series 0.5A F dt IF t 0A rr time Q 10% s I rec = 0.25A IR 100% trr2 I I R rrm I = 1A R Fig.1. Definition of trr1, Qs and Irrm I Fig.4. Definition of trr2 PF / W 1 F Tsp(max) / C BYV40 135 Vo = 0.66 V Rs = 0.08 Ohms D = 1.0 0.8 138 0.5 0.6 141 time 0.2 VF 0.4 144 0.1 I V tp D= T tp 0.2 fr 0 0 0.2 0.4 0.6 0.8 IF(AV) / A time Fig.2. Definition of Vfr 1 0.7 PF / W 150 1.4 Tsp(max) / C BYV40 Vo = 0.66 V Rs = 0.08 Ohms 0.6 a = 1.57 0.5 D.U.T. 139.5 141 142.5 1.9 2.2 Voltage Pulse Source 0.4 to ’scope 145.5 4 0.2 147 0.1 148.5 0 Fig.3. Circuit schematic for trr2 144 2.8 0.3 September 1998 1.2 Fig.5. Maximum forward dissipation PF = f(IF(AV)) per diode; square current waveform where IF(AV) =IF(RMS) x √D. R Current shunt t T VF 147 0 0.1 0.2 0.3 0.4 0.5 IF(AV) / A 0.6 0.7 150 0.8 Fig.6. Maximum forward dissipation PF = f(IF(AV)) per diode; sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). 3 Rev 1.300 Philips Semiconductors Product specification Rectifier diodes ultrafast, rugged BYV40E series Qs / nC trr / ns 1000 100 IF = 2A 100 IF=2A 1A 10 IF=1A 10 1 1 10 dIF/dt (A/us) 1 100 1 Fig.7. Maximum trr at Tj = 25 ˚C; per diode 10 dIF/dt(A/us) 100 Fig.9. Maximum Qs at Tj = 25 ˚C; per diode IF / A 100 3 Transient thermal impedance, Zth j-sp (K/W) Tj=25C 10 Tj=150C 2 1 TYP MAX 1 PD 0.1 0 0 0.5 VF / V 1.0 0.01 1us 1.5 Fig.8. Typical and maximum forward characteristic IF = f(VF); parameter Tj September 1998 tp D= T 10us 100us 1ms 10ms pulse width, tp (s) 100ms tp T t 1s 10s BYV40E Fig.10. Transient thermal impedance; per diode; Zth j-sp = f(tp). 4 Rev 1.300 Philips Semiconductors Product specification Rectifier diodes ultrafast, rugged BYV40E series MECHANICAL DATA Dimensions in mm 6.7 6.3 Net Mass: 0.11 g B 3.1 2.9 0.32 0.24 0.2 4 A A 0.10 0.02 16 max M 7.3 6.7 3.7 3.3 13 2 1 10 max 1.8 max 1.05 0.80 2.3 0.60 0.85 4.6 3 0.1 M B (4x) Fig.11. SOT223 surface mounting package. Notes 1. For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2. Epoxy meets UL94 V0 at 1/8". September 1998 5 Rev 1.300 Philips Semiconductors Product specification Rectifier diodes ultrafast, rugged BYV40E series DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1998 6 Rev 1.300