MX28F2000P 2M-BIT [256K x 8] CMOS FLASH MEMORY FEATURES • 262,144 bytes by 8-bit organization • Fast access time: 70/90/120 ns • Low power consumption – 50mA maximum active current – 100uA maximum standby current • Programming and erasing voltage 12V ± 5% • Command register architecture – Byte Programming (15us typical) – Auto chip erase 5 seconds typical (including preprogramming time) – Block Erase • Optimized high density blocked architecture – Four 4-KB blocks (Top) – Fourteen 16-KB blocks – Four 4-KB blocks (Bottom) • Auto Erase (chip & block) and Auto Program – DATA polling – Toggle bit • 10,000 minimum erase/program cycles • Latch-up protected to 100mA from -1 to VCC+1V • Advanced CMOS Flash memory technology • Compatible with JEDEC-standard byte-wide 32-pin EPROM pinouts • Package type: – 32-pin plastic DIP – 32-pin PLCC – 32-pin TSOP (Type 1) GENERAL DESCRIPTION The MX28F2000P is a 2-mega bit Flash memory organized as 256K bytes of 8 bits each. MXIC's Flash memories offer the most cost-effective and reliable read/write non-volatile random access memory. The MX28F2000P is packaged in 32-pin PDIP, PLCC and TSOP. It is designed to be reprogrammed and erased in-system or in-standard EPROM programmers. MXIC Flash technology reliably stores memory contents even after 10,000 erase and program cycles. The MXIC cell is designed to optimize the erase and programming mechanisms. In addition, the combination of advanced tunnel oxide processing and low internal electric fields for erase and programming operations produces reliable cycling. The MX28F2000P uses a 12.0V ± 5% VPP supply to perform the Auto Program/Erase algorithms. The standard MX28F2000P offers access times as fast as 70 ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention, the MX28F2000P has separate chip enable (CE) and output enable (OE ) controls. The highest degree of latch-up protection is achieved with MXIC's proprietary non-epi process. Latch-up protection is proved for stresses up to 100 milliamps on address and data pin from -1V to VCC + 1V. MXIC's Flash memories augment EPROM functionality with in-circuit electrical erasure and programming. The MX28F2000P uses a command register to manage this functionality, while maintaining a standard 32-pin pinout. The command register allows for 100% TTL level control inputs and fixed power supply levels during erase and programming, while maintaining maximum EPROM compatibility. P/N: PM0380 1 REV. 1.5, OCT 29, 1998 MX28F2000P MX28F2000P Block Address and Block Structure A17~A0 3FFFFH 3F000H 3EFFFH 3E000H 3DFFFH 3D000H 3CFFFH 3C000H 3BFFFH 38000H 37FFFH 34000H 33FFFH 30000H 2FFFFH 2C 2B 28 27 24 23 0 F 0 F 0 F 0 F 0 F 0 F 0H FH 0H FH 0H FH 20000H 1FFFFH 1C000H 1BFFFH 1 1 1 1 8 7 4 3 0 F 0 F 0 F 0 F 0H FH 0H FH 10000H 0FFFFH 0C000H 0BFFFH 08000H 07FFFH 04000H 03FFFH 03000H 02FFFH 02000H 01FFFH 01000H 00FFFH 00000H P/N: PM0380 4-K byte 4-K byte 4-K byte 4-K byte 16-K byte 16-K byte 16-K byte 16-K byte 16-K byte 16-K byte 16-K byte 16-K byte 16-K byte 16-K byte 16-K byte 16-K byte 16-K byte 16-K byte 4-K byte 4-K byte 4-K byte 4-K byte 2 REV. 1.5, OCT 29, 1998 MX28F2000P PIN CONFIGURATIONS 32 PDIP TSOP (TYPE 1) VPP A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND VCC WE A17 A14 A13 A8 A9 A11 OE A10 CE Q7 Q6 Q5 Q4 Q3 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 MX28F2000P 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A11 A9 A8 A13 A14 A17 WE VCC VPP A16 A15 A12 A7 A6 A5 A4 MX28F2000P 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE Q7 Q6 Q5 Q4 Q3 GND Q2 Q1 Q0 A0 A1 A2 A3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A11 A9 A8 A13 A14 A17 WE VCC VPP A16 A15 A12 A7 A6 A5 A4 A7 32 A17 1 WE A16 4 VCC 5 A15 A12 32 PLCC VPP (NORMAL TYPE) 30 29 A14 A6 A13 A5 A8 A4 A3 A9 MX28F2000P 9 25 A11 A2 OE A1 A10 A0 CE 21 20 Q5 Q4 Q3 VSS Q2 17 Q7 Q6 13 14 Q1 Q0 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE Q7 Q6 Q5 Q4 Q3 GND Q2 Q1 Q0 A0 A1 A2 A3 MX28F2000P (REVERSE TYPE) PIN DESCRIPTION: P/N: PM0380 3 SYMBOL PIN NAME A0~A17 Address Input Q0~Q7 Data Input/Output CE Chip Enable Input OE Output Enable Input WE Write enable Pin VPP Program Supply Voltage VCC Power Supply Pin (+5V) GND Ground Pin REV. 1.5, OCT 29, 1998 MX28F2000P BLOCK DIAGRAM CE OE CONTROL INPUT WE LOGIC LATCH A0-A17 BUFFER Y-DECODER AND HIGH VOLTAGE X-DECODER ADDRESS PROGRAM/ERASE MODE LOGIC STATE REGISTER MX28F2000P FLASH ARRAY Y-PASS GATE SENSE AMPLIFIER PGM DATA HV ARRAY SOURCE HV COMMAND DATA DECODER COMMAND DATA LATCH PROGRAM DATA LATCH Q0-Q7 P/N: PM0380 I/O BUFFER 4 REV. 1.5, OCT 29, 1998 MX28F2000P AUTOMATIC PROGRAMMING AUTOMATIC ERASE ALGORITHM The MX28F2000P is byte programmable using the Automatic Programming algorithm. The Automatic Programming algorithm does not require the system to time out or verify the data programmed. The typical room temperature chip programming time of the MX28F2000P is less than 5 seconds. MXIC's Automatic Erase algorithm requires the user to only write an erase set-up command and erase command. The device will automatically pre-program and verify the entire array. Then the device automatically times the erase pulse width, provides the erase verify, and counts the number of sequences. A status bit similar to DATA polling and a status bit toggling between consecutive read cycles, provide feedback to the user as to the status of the erase operation. AUTOMATIC CHIP ERASE Commands are written to the command register using standard microprocessor write timings. Register contents serve as inputs to an internal state-machine which controls the erase and programming circuitry. During write cycles, the command register internally latches address and data needed for the programming and erase operations. For system design simplification, the MX28F2000P is designed to support either WE or CE controlled writes. During a system write cycle, addresses are latched on the falling edge of WE or CE whichever occurs last. Data is latched on the rising edge of WE or CE whichever occur first. To simplify the following discussion, the WE pin is used as the write cycle control pin throughout the rest of this text. All setup and hold times are with respect to the WE signal. The device may be erased using the Automatic Erase algorithm. The Automatic Erase algorithm automatically programs the entire array prior to electrical erase. The timing and verification of electrical erase are controlled internal to the device. AUTOMATIC BLOCK ERASE The MX28F2000P is block(s) erasable using MXIC's Auto Block Erase algorithm. Block erase modes allow blocks of the array to be erased in one erase cycle. The Automatic Block Erase algorithm automatically programs the specified block(s) prior to electrical erase. The timing and verification of electrical erase are controlled internal to the device. MXIC's Flash technology combines years of EPROM experience to produce the highest levels of quality, reliability, and cost effectiveness. The MX28F2000P electrically erases all bits simultaneously using Fowler-Nordheim tunneling. The bytes are programmed one byte at a time using the EPROM programming mechanism of hot electron injection. AUTOMATIC PROGRAMMING ALGORITHM MXIC's Automatic Programming algorithm requires the user to only write a program set-up command and a program command (program data and address). The device automatically times the programming pulse width, provides the program verify, and counts the number of sequences. A status bit similar to DATA polling and a status bit toggling between consecutive read cycles, provide feedback to the user as to the status of the programming operation. P/N: PM0380 5 REV. 1.5, OCT 29, 1998 MX28F2000P TABLE 1. COMMAND DEFINITIONS COMMAND BUS CYCLES FIRST BUS CYCLE SECOND BUS CYCLE OPERATION ADDRESS DATA OPERATION ADDRESS DATA Read Memory 1 Write X 00H Read Identified codes 2 Write X 90H Read IA ID Setup auto erase/ auto erase (chip) 2 Write X 30H Write X 30H Setup auto erase/ auto erase (block) 2 Write X 20H Write EA D0H Setup auto program/ program 2 Write X 40H Write PA PD Setup Erase/ Erase (chip) 2 Write X 20H Write X 20H Setup Erase/ Erase (block) 2 Write X 60H Write EA 60H Erase verify 2 Write EVA A0H Read X EVD Reset 2 Write X FFH Write X FFH Note: IA = Identifier address EA = Block of memory location to be erased PA = Address of memory location to be programmed ID = Data read from location IA during device identification PD = Data to be programmed at location PA EVA = Address of memory location to be read during erase verify. EVD = Data read from location EVA during erase verify. Auto modes have the build-in enchanced features. Please use the auto erase mode whenever it is. P/N: PM0380 6 REV. 1.5, OCT 29, 1998 MX28F2000P COMMAND DEFINITIONS When low voltage is applied to the VPP pin, the contents of the command register default to 00H, enabling read-only operation. Placing high voltage on the VPP pin enables read/write operations. Device operations are selected by writing specific data patterns into the command register. Table 1 defines these MX28F2000P register commands. Table 2 defines the bus operations of MX28F2000P. TABLE 2. MX28F2000P BUS OPERATIONS OPERATION READ-ONLY READ/WRITE VPP(1) A0 A9 CE OE WE DQ0-DQ7 Read VPPL A0 A9 VIL VIL VIH Data Out Output Disable VPPL X X VIL VIH VIH Tri-State Standby VPPL X X VIH X X Tri-State Read Silicon ID (Mfr)(2) VPPL VIL VID(3) VIL VIL VIH Data = C2H Read Silicon ID (Device)(2) VPPL VIH VID(3) VIL VIL VIH Data = 2AH Read VPPH A0 A9 VIL VIL VIH Data Out(4) Standby(5) VPPH X X VIH X X Tri-State Write VPPH A0 A9 VIL VIH VIL Data In(6) NOTES: 1. VPPL may be grounded, a no-connect with a resistor tied to ground, or < VCC + 2.0V. VPPH is the programming voltage specified for the device. When VPP = VPPL, memory contents can be read but not written or erased. 2. Manufacturer and device codes may also be accessed via a command register write sequence. Refer to Table 1. All other addresses don't care. P/N: PM0380 3. VID is the Silicon-ID-Read high voltage.(11.5V to 13v) 4. Read operations with VPP = VPPH may access array data or Silicon ID codes. 5. With VPP at high voltage, the standby current equals ICC + IPP (standby). 6. Refer to Table 1 for valid Data-In during a write operation. 7. X can be VIL or VIH. 7 REV. 1.5, OCT 29, 1998 MX28F2000P contain an all-zero pattern, a self-timed chip erase and verify begin. The erase and verify operations are complete when the data on DQ7 is "1" at which time the device returns to the Read mode. The system is not required to provide any control or timing during these operations. READ COMMAND While VPP is high, for erasure and programming, memory contents can also be accessed via the read command. The read operation is initiated by writing 00H into the command register. Microprocessor read cycles retrieve array data. The device remains enabled for reads until the command register contents are altered. When using the Automatic Chip Erase algorithm, note that the erase automatically terminates when adequate erase margin has been achieved for the memory array(no erase verify command is required). The margin voltages are internally generated in the same manner as when the standard erase verify command is used. The default contents of the register upon VPP powerup is 00H. This default value ensures that no spurious alteration of memory contents occurs during the VPP power transition. Where the VPP supply is hard-wired to the MX28F2000P, the device powers up and remains enabled for reads until the command register contents are changed. The Automatic set-up erase command is a commandonly operation that stages the device for automatic electrical erasure of all bytes in the array. Automatic set-up erase is performed by writing 30H to the command register. SILICON-ID-READ COMMAND To command automatic chip erase, the command 30H must be written again to the command register. The automatic chip erase begins on the rising edge of the WE and terminates when the data on DQ7 is "1" and the data on DQ6 stops toggling for two consecutive read cycles, at which time the device returns to the Read mode. Flash-memories are intended for use in applications where the local CPU alters memory contents. As such, manufacturer- and device-codes must be accessible while the device resides in the target system. PROM programmers typically access signature codes by raising A9 to a high voltage. However, multiplexing high voltage onto address lines is not a desired systemdesign practice. The MX28F2000P contains a Silicon-ID-Read operation to supplement traditional PROM-programming methodology. The operation is initiated by writing 90H into the command register. Following the command write, a read cycle from address 0000H retrieves the manufacturer code of C2H. A read cycle from address 0001H returns the device code of 2AH. SET-UP AUTOMATIC BLOCK ERASE/ERASE COMMANDS The automatic block erase does not require the device to be entirely pre-programmed prior to executing the Automatic set-up block erase command and Automatic block erase command. Upon executing the Automatic block erase command, the device automatically will program and verify the block(s) memory for an all-zero data pattern. The system is not required to provide any controls or timing during these operations. SET-UP AUTOMATIC CHIP ERASE/ERASE COMMANDS When the block(s) is automatically verified to contain an all-zero pattern, a self-timed block erase and verify begin. The erase and verify operations are complete when the data on DQ7 is "1" and the data on DQ6 stops toggling for two consecutive read cycles, at which time the device returns to the Read mode. The system is not required to provide any control or timing during these operations. The automatic chip erase does not require the device to be entirely pre-programmed prior to excuting the Automatic set-up erase command and Automatic chip erase command. Upon executing the Automatic chip erase command, the device automatically will program and verify the entire memory for an all-zero data pattern. When the device is automatically verified to P/N: PM0380 8 REV. 1.5, OCT 29, 1998 MX28F2000P When using the Automatic Block Erase algorithm, note that the erase automatically terminates when adequate erase margin has been achieved for the memory array (no erase verify command is required). The margin voltages are internally generated in the same manner as when the standard erase verify command is used. RESET COMMAND A reset command is provided as a means to safely abort the erase- or program-command sequences. Following either set-up command (erase or program) with two consecutive writes of FFH will safely abort the operation. Memory contents will not be altered. Should program-fail or erase-fail happen, two consecutive writes of FFH will reset the device to abort the operation. A valid command must then be written to place the device in the desired state. The Automatic set-up block erase command is a command only operation that stages the device for automatic electrical erasure of selected blocks in the array. Automatic set-up block erase is performed by writing 20H to the command register. To enter automatic block erase, the user must write the command D0H to the command register. Block addresses are loaded into internal register on the 2nd falling edge of WE. Each successive block load cycles, started by the falling edge of WE, must begin within 30us from the rising edge of the preceding WE. Otherwise, the loading period ends and internal auto block erase cycle starts. When the data on DQ7 is "1" and the data on DQ6 stops toggling for two consecutive read cycles, at which time auto erase ends and the device returns to the Read mode. WRITE OPERATON STATUS TOGGLE BIT-DQ6 The MX28F2000P features a "Toggle Bit" as a method to indicate to the host sytem that the Auto Program/ Erase algorithms are either in progress or completed. While the Automatic Program or Erase algorithm is in progress, successive attempts to read data from the device will result in DQ6 toggling between one and zero. Once the Automatic Program or Erase algorithm is completed, DQ6 will stop toggling and valid data will be read. The toggle bit is valid after the rising edge of the second WE pulse of the two write pulse sequences. Refer to page 2 for detailed block address. SET-UP AUTOMATIC PROGRAM/PROGRAM COMMANDS The Automatic Set-up Program is a command-only operation that stages the device for automatic programming. Automatic Set-up Program is performed by writing 40H to the command register. DATA POLLING-DQ7 The MX28F2000P also features Data Polling as a method to indicate to the host system that the Automatic Program or Erase algorithms are either in progress or completed. Once the Automatic Set-up Program operation is performed, the next WE pulse causes a transition to an active programming operation. Addresses are internally latched on the falling edge of the WE pulse. Data is internally latched on the rising edge of the WE pulse. The rising edge of WE also begins the programming operation. The system is not required to provide further controls or timings. The device will automatically provide an adequate internally generated program pulse and verify margin. The automatic programming operation is completed when the data read on DQ6 stops toggling for two consecutive read cycles and the data on DQ7 and DQ6 are equivalent to data written to these two bits, at which time the device returns to the Read mode (no program verify command is required). P/N: PM0380 While the Automatic Programming algorithm is in operation, an attempt to read the device will produce the complement data of the data last written to DQ7. Upon completion of the Automatic Program algorithm an attempt to read the device will produce the true data last written to DQ7. The Data Polling feature is valid after the rising edge of the second WE pulse of the two write pulse sequences. 9 REV. 1.5, OCT 29, 1998 MX28F2000P While the Automatic Erase algorithm is in operation, DQ7 will read "0" until the erase operation is completed. Upon completion of the erase operation, the data on DQ7 will read "1". The Data Polling feature is valid after the rising edge of the second WE pulse of two write pulse sequences. The Data Polling feature is active during Automatic Program/Erase algorithms. POWER-UP SEQUENCE The MX28F2000P powers up in the Read only mode. In addition, the memory contents may only be altered after successful completion of a two-step command sequence. Power up sequence is not required. SYSTEM CONSIDERATIONS During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between VCC and GND, and between VPP and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on FLASH memory arrays, a 4.7uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array. P/N: PM0380 10 REV. 1.5, OCT 29, 1998 MX28F2000P NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is stress rating only and functional operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. NOTICE: Specifications contained within the following tables are subject to change. ABSOLUTE MAXIMUM RATINGS RATING VALUE Ambient Operating Temperature 0oC to 70oC Storage Temperature -65oC to 125oC Applied Input Voltage -0.5V to 7.0V Applied Output Voltage -0.5V to 7.0V VCC to Ground Potential -0.5V to 7.0V A9 & VPP -0.5V to 13.5V CAPACITANCE TA = 25oC, f = 1.0 MHz SYMBOL PARAMETER CIN COUT MIN. TYP MAX. UNIT CONDITIONS Input Capacitance 14 pF VIN = 0V Output Capacitance 16 pF VOUT = 0V READ OPERATION DC CHARACTERISTICS TA = 0oC TO 70oC, VCC = 5V ± 10%, VPP = GND to VCC SYMBOL ILI PARAMETER Input Leakage Current ILO Output Leakage Current IPP1 VPP Current ISB1 Standby VCC current MIN. TYP 1 ISB2 ICC1 1 Operating VCC current ICC2 MAX. 10 UNIT uA CONDITIONS VIN = GND to VCC 10 uA VOUT = GND to VCC 100 uA VPP = 5.5V 1 mA CE = VIH 100 uA CE = VCC + 0.3V 30 mA IOUT = 0mA, f=1MHz 50 mA IOUT = 0mA, f=11MHz VIL Input Low Voltage -0.3(NOTE 1) 0.8 V VIH Input High Voltage 2.4 VCC + 0.3 V VOL Output Low Voltage 0.45 V IOL = 2.1mA VOH Output High Voltage V IOH = -400uA 2.4 NOTES: 1. VIL min. = -1.0V for pulse width < 50 ns. VIL min. = -2.0V for pulse width < 20 ns. 2. VIH max. = VCC + 1.5V for pulse width < 20 ns If VIH is over the specified maximum value, read operation cannot be guaranteed. P/N: PM0380 11 REV. 1.5, OCT 29, 1998 MX28F2000P AC CHARACTERISTICS TA = 0oC to 70oC, VCC = 5V ± 10%, VPP = GND to VCC 28F2000P-70 SYMBOL PARAMETER tACC MIN. 28F2000P-90 28F2000P-12 MAX. MIN. MAX. MIN. MAX. UNIT CONDITIONS Address to Output Delay 70 90 120 ns CE=OE=VIL tCE CE to Output Delay 70 90 120 ns OE=VIL tOE OE to Output Delay 40 40 50 ns CE=VIL tDF OE High to Output Float (Note1) 0 30 ns CE=VIL tOH Address to Output hold 0 ns CE=OE=VIL 20 0 20 0 0 0 TEST CONDITIONS: NOTE: • Input pulse levels: 0.45V/2.4V 1. tDF is defined as the time at which the output achieves the • Input rise and fall times: < 10ns open circuit condition and data is no longer driven. • Output load: 1 TTL gate + 100pF (Including scope and jig) • Reference levels for measuring timing: 0.8V, 2.0V READ TIMING WAVEFORMS ADDRESS WE CE ACTIVE MODE STANDBY MODE STANDBY MODE tCE OE tDF tOE tACC DATA OUT P/N: PM0380 tOH DATA OUT VALID 12 REV. 1.5, OCT 29, 1998 MX28F2000P COMMAND PROGRAMMING/DATA PROGRAMMING/ERASE OPERATION DC CHARACTERISTICS TA = 0oC to 70oC, VCC = 5V ± 10%, VPP = 12.0V ± 5% SYMBOL PARAMETER ILI MIN. TYP MAX. UNIT CONDITIONS Input Leakage Current 10 uA VIN=GND to VCC ILO Output Leakage Current 10 uA VOUT=GND to VCC ISB1 Standby VCC current 1 mA CE=VIH 100 uA CE=VCC ± 0.3V 30 mA IOUT=0mA, f=1MHz ICC2 50 mA IOUT=0mA, F=11MHz ICC3 (Program) 50 mA In Programming ICC4 (Erase) 50 mA In Erase ICC5 (Program Verify) 50 mA In Program Verify ICC6 (Erase Verify) 50 mA In Erase Verify 100 uA VPP=12.6V IPP2 (Program) 50 mA In Programming IPP3 (Erase) 50 mA In Erase IPP4 (Program Verify) 50 mA In Program Verify IPP5 (Erase Verify) 50 mA In Erase Verify -0.3 (Note 5) 0.8 V 2.4 VCC+0.3V V ISB2 ICC1 (Read) IPP1 (Read) VIL 1 Operating VCC Current VPP Current Input Voltage VIH (Note 6) VOL Output Voltage VOH 0.45 2.4 V IOL=2.1mA V IOH=-400uA NOTES: 1. VCC must be applied before VPP and removed after VPP. 5. VIL min. = -0.6V for pulse width < 20ns. 2. VPP must not exceed 14V including overshoot. 6. If VIH is over the specified maximum value, programming 3. An influence may be had upon device reliability if the device operation cannot be guranteed. is installed or removed while VPP=12V. 7. All currents are in RMS unless otherwise noted.(Sampled, not 4. Do not alter VPP either VIL to 12V or 12V to VIL when 100% tested.) CE=VIL. P/N: PM0380 13 REV. 1.5, OCT 29, 1998 MX28F2000P AC CHARACTERISTICS TA = 0oC to 70oC, VCC = 5V ± 10%, VPP =12V ± 5% 28F2000P-70 28F2000P-90 28F2000P-12 SYMBOL PARAMETER MIN. MIN. MIN. tVPS VPP setup time 100 100 100 ns tOES OE setup time 100 100 100 ns tCWC Command programming cycle 70 90 120 ns tCEP WE programming pulse width 45 45 50 ns tCEPH1 WE programming pluse width High 20 20 20 ns tCEPH2 WE programming pluse width High 100 100 100 ns tAS Address setup time 0 0 0 ns tAH Address hold time 45 45 50 ns tAH1 Address hold time for DATA POLLING 0 0 0 ns tDS Data setup time 45 45 50 ns tDH Data hold time 10 10 10 ns tCESP CE setup time before DATA polling/toggle bit 100 100 100 ns tCES CE setup time 0 0 0 ns tCESC CE setup time before command write 100 100 100 ns tCESV CE setup time before verify 6 6 6 us tVPH VPP hold time 100 100 100 ns tDF Output disable time (Note 3) tDPA DATA polling/toggle bit access time 70 tAETC Total erase time in auto chip erase 5(TYP.) 5(TYP.) 5(TYP.) s tAETB Total erase time in auto block erase 5(TYP.) 5(TYP.) 5(TYP.) s tAVT Total programming time in auto verify 15 300 15 300 15 300 us tBALC Block address load cycle 0.3 30 0.3 30 0.3 30 us tBAL Block address load time 100 100 100 us tCH CE Hold Time 0 0 0 ns tCS CE setup to WE going low 0 0 0 ns MAX. 20 MAX. MAX. UNIT CONTIONS 20 30 ns 90 120 ns NOTES: 1. CE and OE must be fixed high during VPP transition from 5V to 12V or from 12V to 5V. 2. Refer to read operation when VPP=VCC about read operation while VPP 12V. 3. tDF defined as the time at which the output achieves the open circuit condition and data is no longer driven. P/N: PM0380 14 REV. 1.5, OCT 29, 1998 MX28F2000P SWITCHING TEST CIRCUITS DEVICE UNDER TEST 1.8K ohm +5V DIODES = IN3064 OR EQUIVALENT CL 6.2K ohm CL = 100 pF including jig capacitance SWITCHING TEST WAVEFORMS 2.4 V 2.0V 2.0V TEST POINTS 0.8V 0.8V 0.45 V OUTPUT INPUT AC TESTING: Inputs are driven at 2.4V for a logic "1" and 0.45V for a logic "0". Input pulse rise and fall times are <20ns. P/N: PM0380 15 REV. 1.5, OCT 29, 1998 MX28F2000P AUTOMATIC PROGRAMMING TIMING WAVEFORM One byte data is programmed. Verify in fast algorithm and additional programming by external control are not required because these operations are excuted automatically by internal control circuit. Programming completion can be verified by DATA polling and toggle bit checking after automatic verify starts. Device outputs DATA during programming and DATA after programming on Q7. Q0 to Q5 (Q6 is for toggle bit; see toggle bit, DATA polling, timing waveform) are in high impedance. Setup auto program/ Auto program & DATA polling program command Vcc 5V 12V Vpp 0V tVPH tVPS Address valid A0 ~ A17 tAS WE tAH1 tAVT tCWC CE tOES tCEP tCEPH1 tCEP tCESC tCESP tCES OE tDS tDH tDS tDH Q7 Command in Data in Q0~Q5 Command in Data in tDF tDPA DATA DATA polling DATA DATA Command #40H P/N: PM0380 16 REV. 1.5, OCT 29, 1998 MX28F2000P AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART START Apply VppH Write Set up auto program Command (40H) Write Auto program Command(A/D) Toggle Bit Checking DQ6 not Toggled NO YES NO Verify Byte Ok YES NO Reset Last Byte YES Auto Program Completed P/N: PM0380 17 Auto Program Failed REV. 1.5, OCT 29, 1998 MX28F2000P AUTOMATIC CHIP ERASE TIMING WAVEFORM All data in chip are erased. External erase verify is not required because data is erased automatically by internal control circuit. Erasure completion can be verified by DATA polling and toggle bit checking after automatic erase starts. Device outputs 0 during erasure and 1 after erasure on Q7. Q0 to Q5 (Q6 is for toggle bit; see toggle bit, DATA polling, timing waveform) are in high impedance. Setup auto chip erase/ erase command Auto chip erase & DATA polling Vcc 5V 12V tVPH Vpp 0V tVPS A0 ~ A17 WE tAETC tCWC CE tOES tCEP tCEPH1 tCEP tCESP tCES tCESC OE tDS tDH tDH Q7 Command in Command in Q0~Q5 Command in Command in Command #30H P/N: PM0380 tDS tDPA tDF DATA polling Command #30H 18 REV. 1.5, OCT 29, 1998 MX28F2000P AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART START Apply VppH Write Set up auto chip Erase Command (30H) Write Auto chip Erase Command(30H) Toggle Bit Checking DQ6 not Toggled No YES DATA Polling DQ7 = 1 No Reset YES Auto Chip Erase Completed P/N: PM0380 Auto Chip Erase Failed 19 REV. 1.5, OCT 29, 1998 MX28F2000P AUTOMATIC BLOCK ERASE TIMING WAVEFORM Block data indicated by A12 to A17 are erased. External erase verify is not required because data are erased automatically by internal control circuit. Erasure completion can be verified by DATA polling and toggle bit checking after automatic erase starts. Device outputs 0 during erasure and 1 after erasure on Q7. Q0 to Q5 (Q6 is for toggle bit; see toggle bit, DATA polling, timing waveform) are in high impedance. Auto block erase & DATA polling Setup auto block erase/erase command Vcc 5V 12V Vpp 0V tVPH tVPS A0 ~ A11 Block address 0 A12 ~ A17 Block address 1 Block address # tAH1 tCH CE tCS tAS tCWC WE tOES tAH tBALC tBAL tAETB tCESC tCEPH1 tCEP tCEP tCEPH2 OE tDS tDH tDS tDH Q7 Command in Command in Q0~Q5 Command in Command in tDPA tDF DATA polling Command #20H Command #D0H *Refer to page 2 for detailed block address. P/N: PM0380 20 REV. 1.5, OCT 29, 1998 MX28F2000P AUTOMATIC BLOCK ERASE ALGORITHM FLOWCHART START Apply VppH Write Set up auto block Erase Command (20H) Write Auto block Erase Command(D0H) to Load Block Address Load Block Address Last Block to Erase NO YES Wait 200 us NO Toggle Bit Checking DQ6 not Toggled YES NO DATA Polling DQ7 = 1 Reset YES Auto Block Erase Completed Auto Block Erase Failed P/N: PM0380 21 REV. 1.5, OCT 29, 1998 MX28F2000P COMPATIBLE CHIP ERASE TIMING WAVEFORM All data in chip are erased. Control verification and additional erasure externally according tocompatible chip erase flowchart. Setup chip erase/ Chip erase erase command Erase Verify Vcc 5V 12V Vpp 0V tVPH tVPS Verify Address A0 ~ A17 tAS tAH WE tCESV tET tCWC CE tOES tCEP tCEP tCEPH1 tCEP tCESC tCES OE tDS tDH tDS tDH tDS tVA tDF Q7 Command in Command in Command in Data valid Q0~Q6 Command in Command in Command in Data valid Command #20H Command #20H P/N: PM0380 tDH Command #A0H 22 REV. 1.5, OCT 29, 1998 MX28F2000P COMPATIBLE BLOCK ERASE page2) without any voltage stress to the device nor deterioration in reliability of data. This device can be applied to the compatible block erase algorithm shown in the following flowchart. This algorithm allows to obtain faster erase time by the block (refer to COMPATIBLE BLOCK ERASE FLOWCHART START For selected block(s), All bits PGM"0" N=0 BLOCK ERASE FLOW N = N+1 FAIL NO N = 1024? ERSVFY FLOW YES ALL BITS VERIFIED BLOCK ERASE FAIL APPLY VPP = VCC END BLOCK ERASE COMPLETE BLOCK ERASE FLOW START Apply VPP = VPPH WRITE SETUP BLOCK ERASE COMMAND ( 60H ) WRITE BLOCK ERASE COMMAND ( LOAD FIRST SECTOR ADDRESS , 60H ) LOAD OTHER SECTORS' ADDRESS IF NECESSARY ( LOAD OTHER SECTOR ADDRESS ) WAIT 10 ms END P/N: PM0380 23 REV. 1.5, OCT 29, 1998 MX28F2000P ERASE VERIFY FLOW START APPLY VPP = VPPH ADDRESS = FIRST ADDRESS OF ERASED BLOCKS OR LAST VERIFY FAILED ADDRESS WRITE ERASE VERIFY COMMAND ( A0H ) WAIT 6 us ERSVFY FFH ? INCREMENT ADDRESS NO YES NO LAST ADDRESS ? YES ERASE VERIFY COMPLETE P/N: PM0380 24 GO TO ERASE FLOW AGAIN OR ABORT REV. 1.5, OCT 29, 1998 MX28F2000P COMPATIBLE BLOCK ERASE TIMING WAVEFORM Indicated block data are erased. Control verification and additional erasure externally according to compatible block erase flowchart. Block erase Setup block erase/erase command Erase Verify Vcc 5V 12V Vpp 0V tVPH tVPS Verify address A0 ~ A13 Block address 0 A14 ~ A17 Block address 1 Verify address Block address # tAS tAH tAS tAH WE tCWC tBALC tBAL tCESV tET CE tOES tCEP tCEPH1 tCEP tCEPH2 tCESC tCEP tCES OE tDS tDH tDS tDH Q7 Command in Command in Command in Data valid Q0~Q6 Command in Command in Command in Data valid tDS Command #60H Command #60H P/N: PM0380 tDH tVA tDF Command #A0H 25 REV. 1.5, OCT 29, 1998 MX28F2000P VPP HIGH READ TIMING WAVEFORM Vcc 5V 12V Vpp 0V tVPS tVPH A0 - A17 Address valid tCWC WE tACC tCESC CE tOES tOES tCEPH1 tCEP tCE OE tDF tDH tDS Q0-Q7 tOE tOH Data out valid Command in 00H VPP LOW ID CODE READ TIMING WAVEFORM VID VIH A9 VIL A0 A1 - A8 A10-A17 tACC WE tACC VIH CE tCE OE tDF tOE Q0 - Q7 tOH tOH Manufacturer code Device code C2H P/N: PM0380 2AH 26 REV. 1.5, OCT 29, 1998 MX28F2000P VPP HIGH ID CODE READ TIMING WAVEFORM Vcc 5V 12V Vpp 0V tVPS tVPH A0 Address Valid 0 or 1 A1 - A16 tCWC WE tACC tCESC CE tOES tOES tCEP tCEPH2 tCE OE tDF tDH tDS Q0-Q7 tOE tOH Command in Data out valid 90H C2H or 2AH RESET TIMING WAVEFORM Vcc 5V 12V Vpp 0V tVPS A0 - A17 tCWC WE CE tOES tCEP tCEPH1 tCEP OE tDS tDH Command in tDS tDH Command in Q0-Q7 FFH P/N: PM0380 FFH 27 REV. 1.5, OCT 29, 1998 MX28F2000P TOGGLE BIT, DATA POLLING TIMING WAVEFORM Toggle bit appears in Q6, when program/erase is opperating. DATA polling appears in Q7 during programming or erase. HIGH WE Vpp 12V CE OE Q6 DURING P/E HIGH-Z Q7 DURING P HIGH-Z Q7 DURING E HIGH-Z TOGGLE BIT DATA DATA POLLING Q0~Q5 P/N: PM0380 DATA DATA DATA DATA PROGRAM/ERASE COMPLETE DATA POLLING HIGH-Z DATA 28 REV. 1.5, OCT 29, 1998 MX28F2000P ORDERING INFORMATION PLASTIC PACKAGE PART NO. ACCESS TIME OPERATING STANDBY PACKAGE ERASE/PROGRAM CURRENT CURRENT CYCLE (ns) MAX.(mA) MAX.(uA) MIN.(time) MX28F2000PPC-70C4 70 50 100 32 Pin DIP 10,000 MX28F2000PPC-90C4 90 50 100 32 Pin DIP 10,000 MX28F2000PPC-12C4 120 50 100 32 Pin DIP 10,000 MX28F2000PQC-70C4 70 50 100 32 Pin PLCC 10,000 MX28F2000PQC-90C4 90 50 100 32 Pin PLCC 10,000 MX28F2000PQC-12C4 120 50 100 32 Pin PLCC 10,000 MX28F2000PTC-70C4 70 50 100 32 Pin TSOP 10,000 (Normal Type) MX28F2000PTC-90C4 90 50 100 32 Pin TSOP 10,000 (Normal Type) MX28F2000PTC-12C4 120 50 100 32 Pin TSOP 10,000 (Normal Type) MX28F2000PRC-70C4 70 50 100 32 Pin TSOP 10,000 (Reverse Type) MX28F2000PRC-90C4 90 50 100 32 Pin TSOP 10,000 (Reverse Type) MX28F2000PRC-12C4 120 50 100 32 Pin TSOP 10,000 (Reverse Type) P/N: PM0380 29 REV. 1.5, OCT 29, 1998 MX28F2000P PACKAGE INFORMATION 32-PIN PLASTIC DIP ITEM MILLIMETERS INCHES A 42.13 max. 1.660 max. B 1.90 [REF] .075 [REF] C 2.54 [TP] .100 [TP] D .46 [Typ.] .050 [Typ.] E 38.07 1.500 F 1.27 [Typ.] .050 [Typ.] G 3.30 ± .25 .130 ± .010 H .51 [REF] .020 [REF] I 3.94 ± .25 1.55 ± .010 J 5.33 max. .210 max. K 15.22 ± .25 .600 ± .101 L 13.97 ± .25 .550 ± .010 M .25 [Typ.] .010 [Typ.] 32 17 1 16 A K L F D NOTE: Each lead certerline is located within .25mm[.01 inch] of its true position [TP] at a maximum at maximum material condition. C I J H G M B 0~15¡ E 32-PIN PLASTIC LEADED CHIP CARRIER (PLCC) A ITEM MILLIMETERS INCHES A 12.44 ± .13 .490 ± .005 B 11.50 ± .13 .453 ± .005 C 14.04 ± .13 .553 ± .005 D 14.98 ± .13 .590 ± .005 E 1.93 .076 F 3.30 ± .25 .130 ± .010 G 2.03 ± .13 .080 ± .005 H .51 ± .13 .020 ± .005 I 1.27 [Typ.] .050 [Typ.] J .71 [REF] .028 [REF] K .46 [REF] .018 [REF] L 10.40/12.94 .410/.510 (W) (W) (L) (L) M .89R .035R N .25[Typ.] .010[Typ.] B 1 4 32 30 5 29 9 25 13 C D 21 14 20 17 E F G NOTE: Each lead certerline is located within .25mm[.01 inch] of its true position [TP] at a maximum at maximum material condition. N H M I J K L P/N: PM0380 30 REV. 1.5, OCT 29, 1998 MX28F2000P 32-PIN PLASTIC TSOP ITEM MILLIMETERS INCHES A 20.0 ± .20 .078 ± .006 A B 18.40 ± .10 .724 ± .004 B C 8.20 max. .323 max. D 0.15 [Typ.] .006 [Typ.] E .80 [Typ.] .031 [Typ.] F .20 ± .10 .008 ± .004 G .30 ± .10 .012 ± .004 H .50 [Typ.] .020 [Typ.] I .45 max. .018 max. J 0 ~ .20 0 ~ .008 K 1.00 ± .10 .039 ± .004 L 1.27 max. .050 max. M .50 .020 N 0 ~5° .500 C O N M K L D E F G H I J NOTE: Each lead certerline is located within .25mm[.01 inch] of its true position [TP] at a maximum at maximum material condition. P/N: PM0380 31 REV. 1.5, OCT 29, 1998 MX28F2000P Note. Revision History Revision # 1.3 1.4 1.5 P/N: PM0380 Description Command description of dummy mode a added, TSOP pin configuration diagram rotated 180°, the flow chart of block erase corrected, fast acces time 150ns removed. The speed performanes is featured up to 70ns as the new update of fast access time To corret typing error 32 Page Date P1,14,29 Sep/18/98 P12,14,16, OCT/29/98 27,29 REV. 1.5, OCT 29, 1998 MX28F2000P MACRONIX INTERNATIONAL CO., LTD. HEADQUARTERS: TEL:+886-3-578-8888 FAX:+886-3-578-8887 EUROPE OFFICE: TEL:+32-2-456-8020 FAX:+32-2-456-8021 JAPAN OFFICE: TEL:+81-44-246-9100 FAX:+81-44-246-9105 SINGAPORE OFFICE: TEL:+65-747-2309 FAX:+65-748-4090 TAIPEI OFFICE: TEL:+886-3-509-3300 FAX:+886-3-509-2200 MACRONIX AMERICA, INC. TEL:+1-408-453-8088 FAX:+1-408-453-8488 CHICAGO OFFICE: TEL:+1-847-963-1900 FAX:+1-847-963-1909 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the rignt to change product and specifications without notice. 33