ON MC14024BFELG 7−stage ripple counter Datasheet

MC14024B
7−Stage Ripple Counter
The MC14024B is a 7−stage ripple counter with short propagation
delays and high maximum clock rates. The Reset input has standard
noise immunity, however the Clock input has increased noise
immunity due to Hysteresis. The output of each counter stage is
buffered.
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Features
•
•
•
•
•
•
MARKING
DIAGRAMS
Diode Protection on All Inputs
Output Transitions Occur on the Falling Edge of the Clock Pulse
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low−power TTL Loads or One Low−power
Schottky TTL Load Over the Rated Temperature Range
Pin−for−Pin Replacement for CD4024B
Pb−Free Packages are Available
14
PDIP−14
P SUFFIX
CASE 646
MC14024BCP
AWLYYWWG
1
14
SOIC−14
D SUFFIX
CASE 751A
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
Value
Unit
−0.5 to +18.0
V
−0.5 to VDD + 0.5
V
Input or Output Current
(DC or Transient) per Pin
± 10
mA
PD
Power Dissipation, per Package
(Note 1)
500
mW
TA
Ambient Temperature Range
−55 to +125
°C
Tstg
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature
(8−Second Soldering)
260
°C
VDD
Vin, Vout
Iin, Iout
Parameter
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
14024BG
AWLYWW
1
14
SOEIAJ−14
F SUFFIX
CASE 965
MC14024B
ALYWG
1
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
© Semiconductor Components Industries, LLC, 2006
October, 2006 − Rev. 7
1
Publication Order Number:
MC14024B/D
MC14024B
TRUTH TABLE
Clock
Reset
State
0
0
No Change
0
1
All Outputs Low
1
0
No Change
1
1
All Outputs Low
0
No Change
1
All Outputs Low
0
Advance One Count
1
All Outputs Low
PIN ASSIGNMENT
CLOCK
1
14
VDD
RESET
2
13
NC
Q7
3
12
Q1
Q6
4
11
Q2
Q5
5
10
NC
Q4
6
9
Q3
VSS
7
8
NC
LOGIC DIAGRAM
CLOCK
1
2
C
Q
C
Q
C
Q
C
Q
R
Q
R
Q
R
Q
R
Q
RESET
VDD = PIN 14
VSS = PIN 7
NC = NO CONNECTION
12
Q1
11
Q2
4
Q6
3
Q7
Q3 = PIN 9
Q4 = PIN 6
Q5 = PIN 5
ORDERING INFORMATION
Device
Package
MC14024BCP
PDIP−14
MC14024BCPG
PDIP−14
(Pb−Free)
MC14024BD
SOIC−14
MC14024BDG
SOIC−14
(Pb−Free)
MC14024BDR2
SOIC−14
MC14024BDR2G
SOIC−14
(Pb−Free)
MC14024BFEL
SOEIAJ−14
MC14024BFELG
SOEIAJ−14
(Pb−Free)
Shipping †
25 Units / Rail
55 Units / Rail
2500 / Tape & Reel
2000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
MC14024B
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
− 55_C
Characteristic
Symbol
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ
(Note 2)
Max
Min
Max
Unit
Output Voltage
Vin = VDD or 0
“0” Level
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
Vin = 0 or VDD
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
(VO = 0.5 or 4.5 Vdc) “1” Level
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIH
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
−
−
−
−
– 2.4
– 0.51
− 1.3
− 3.4
– 4.2
– 0.88
– 2.25
− 8.8
−
−
−
−
– 1.7
− 0.36
– 0.9
− 2.4
−
−
−
−
IOL
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
Input Current
Iin
15
−
± 0.1
−
± 0.00001
± 0.1
−
± 1.0
mAdc
Input Capacitance
(Vin = 0)
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
−
−
−
5.0
10
20
−
−
−
0.005
0.010
0.015
5.0
10
20
−
−
−
150
300
600
mAdc
IT
5.0
10
15
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Source
Sink
Total Supply Current (Notes 3 & 4)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IOH
Vdc
Vdc
mAdc
IT = (0.31 mA/kHz) f + IDD
IT = (0.60 mA/kHz) f + IDD
IT = (1.89 mA/kHz) f + IDD
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL − 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD − VSS) in volts, f in kHz is input frequency, and k = 0.001.
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3
mAdc
MC14024B
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SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time
Clock to Q1
tPLH, tPHL = (1.7 ns/pF) CL + 295 ns
tPLH, tPHL = (0.66 ns/pF) CL + 117 ns
tPLH, tPHL = (0.5 ns/pF) CL + 85 ns
Clock to Q7
tPLH, tPHL = (1.7 ns/pF) CL + 915 ns
tPLH, tPHL = (0.66 ns/pF) CL + 367 ns
tPLH, tPHL = (0.5 ns/pF) CL + 275 ns
Reset to Qn
tPLH, tPHL = (1.7 ns/pF) CL + 415 ns
tPLH, tPHL = (0.66 ns/pF) CL + 217 ns
tPLH, tPHL = (0.5 ns/pF) CL + 155 ns
tPLH,
tPHL
Clock Pulse Width
VDD
Min
Typ
(Note 6)
Max
5.0
10
15
−
−
−
100
50
40
200
100
80
Unit
ns
ns
5.0
10
15
−
−
−
380
150
110
600
230
175
5.0
10
15
−
−
−
1000
400
300
2000
750
565
5.0
10
15
−
−
−
500
250
180
800
400
300
tWH
5.0
10
15
500
165
125
200
60
40
−
−
−
ns
Reset Pulse Width
tWH
5.0
10
15
600
350
260
375
200
150
−
−
−
ns
Reset Removal Time
trem
5.0
10
15
625
190
145
250
75
50
−
−
−
ns
tTLH, tTHL
5.0
10
15
−
−
−
−
−
−
1.0
8.0
200
s
ms
ms
fcl
5.0
10
15
−
−
−
2.5
8.0
12
1.0
3.0
4.0
MHz
Clock Input Rise and Fall Time
Input Pulse Frequency
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
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4
MC14024B
VDD
VOL = Vout
VOH = Vout
VDD
VDD
C Qn
R
COUNT Qn TO A
LOGIC 1" LEVEL.
C Qn
IOH
VSS
IOL
R
EXTERNAL
POWER
SUPPLY
VSS
Figure 1. Typical Output Source
Characteristics Test Circuit
Figure 2. Typical Output Sink
Characteristics Test Circuit
VDD
500 mF
PULSE
GENERATOR
EXTERNAL
POWER
SUPPLY
0.01 mF
CERAMIC
ID
f
C Q1
Q2
Q3
Q4
Q5
Q6
R Q7
VSS
CL
CL
CL
CL
CL
CL
CL
Figure 3. Power Dissipation Test Circuit
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5
6
Figure 4. Functional Waveforms
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Q7 (3)
Q6 (4)
Q5 (5)
Q4 (6)
Q3 (9)
Q2 (11)
Q1 (12)
RESET (2)
CLOCK (1)
t rem
1
t WH
t TLH
t PLH1
t WL
2
t PLH3
t TLH
10%
90%
50%
t PHL1
4
8
t TLH
t PLH4
50%
t PHL2
Input t TLH and t THL = 20 ns
t PLH2
t TLH
10%
90%
50%
t PLH5
t TLH
50%
t PHL3
16
t TLH
t PLH6
50%
t PHL4
32
t PHL6
t TLH
t PLH7
50%
t PHL5
64
t THL
t PHL7
50%
t THL
t THL
t THL
t THL
t THL
128
t THL
10%
90%
255
t R7
t R6
t R5
t R4
t R3
t R2
t R1
50%
VOL
VOH
VOL
VOH
VOL
VOH
VOL
VOH
VOL
VOH
VOL
VOH
VOL
VOH
VSS
VDD
VSS
VDD
MC14024B
MC14024B
PACKAGE DIMENSIONS
PDIP−14
CASE 646−06
ISSUE P
14
8
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
A
F
L
N
C
−T−
SEATING
PLANE
H
G
D 14 PL
J
K
0.13 (0.005)
M
M
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7
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.290
0.310
−−−
10 _
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.37
7.87
−−−
10 _
0.38
1.01
MC14024B
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
14
8
−B−
P 7 PL
0.25 (0.010)
M
7
1
G
−T−
D 14 PL
0.25 (0.010)
T B
S
A
DIM
A
B
C
D
F
G
J
K
M
P
R
J
M
K
M
F
R X 45 _
C
SEATING
PLANE
B
M
S
SOLDERING FOOTPRINT*
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0_
7_
0.228 0.244
0.010 0.019
MC14024B
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965−01
ISSUE A
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
8
Q1
E HE
M_
L
7
1
DETAIL P
Z
D
VIEW P
A
e
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
0.50
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
1.42
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.004
0.008
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−− 0.056
ON Semiconductor and
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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MC14024B/D
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