TI DAC0802 Dac0800/dac0802 8-bit digital-to-analog converter Datasheet

DAC0800, DAC0802
www.ti.com
SNAS538C – JUNE 1999 – REVISED FEBRUARY 2013
DAC0800/DAC0802 8-Bit Digital-to-Analog Converters
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FEATURES
DESCRIPTION
•
•
•
•
•
•
•
The DAC0800 series are monolithic 8-bit high-speed
current-output digital-to-analog converters (DAC)
featuring typical settling times of 100 ns. When used
as a multiplying DAC, monotonic performance over a
40 to 1 reference current range is possible. The
DAC0800 series also features high compliance
complementary current outputs to allow differential
output voltages of 20 Vp-p with simple resistor loads.
The reference-to-full-scale current matching of better
than ±1 LSB eliminates the need for full-scale trims in
most applications, while the nonlinearities of better
than ±0.1% over temperature minimizes system error
accumulations.
1
2
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•
Fast Settling Output Current: 100 ns
Full Scale Error: ±1 LSB
Nonlinearity Over Temperature: ±0.1%
Full Scale Current Drift: ±10 ppm/°C
High Output Compliance: −10V to +18V
Complementary Current Outputs
Interface Directly with TTL, CMOS, PMOS and
Others
2 Quadrant Wide Range Multiplying Capability
Wide Power Supply Range: ±4.5V to ±18V
Low Power Consumption: 33 mW at ±5V
Low Cost
The noise immune inputs will accept a variety of logic
levels. The performance and characteristics of the
device are essentially unchanged over the ±4.5V to
±18V power supply range and power consumption at
only 33 mW with ±5V supplies is independent of logic
input levels.
The
DAC0800,
DAC0802,
DAC0800C
and
DAC0802C are a direct replacement for the DAC-08,
DAC-08A, DAC-08C, and DAC-08H, respectively. For
single supply operation, refer to AN-1525.
Typical Application
Pin numbers represent the PDIP package. The SOIC package pin numbers differ from that of the PDIP package.
Figure 1. ±20 VP-P Output Digital-to-Analog Converter
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
DAC0800, DAC0802
SNAS538C – JUNE 1999 – REVISED FEBRUARY 2013
Absolute Maximum Ratings
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(1)
Supply Voltage (V+ − V−)
Power Dissipation
±18V or 36V
(2)
500 mW
Reference Input Differential Voltage
V− to V+
(V14 to V15)
Reference Input Common-Mode
V− to V+
Range (V14, V15)
Reference Input Current
5 mA
−
Logic Inputs
−
V to V plus 36V
Analog Current Outputs
(VS− = −15V)
4.25 mA
(3)
TBD V
Storage Temperature
−65°C to +150°C
ESD Susceptibility
Lead Temp. (Soldering, 10 seconds)
PDIP Package (plastic)
260°C
CDIP Package (ceramic)
300°C
Surface Mount Package
(1)
Vapor Phase (60 seconds)
215°C
Infrared (15 seconds)
220°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its specified operating conditions.
The maximum junction temperature of the DAC0800 and DAC0802 is 125°C. For operating at elevated temperatures, devices in the
CDIP package must be derated based on a thermal resistance of 100°C/W, junction-to-ambient, 175°C/W for the molded PDIP package
and 100°C/W for the SOIC package.
Human body model, 100 pF discharged through a 1.5 kΩ resistor.
(2)
(3)
Operating Conditions (1)
Min
Max
Units
Temperature (TA)
−55
+125
°C
DAC0800LC
0
+70
°C
DAC0802LC
0
+70
°C
DAC0800L
−
+
−
V
(V ) + 10
(V ) + 30
V−
−15
−5
V
IREF (V− = −5V)
1
2
mA
IREF (V− = −15V)
1
4
mA
(1)
2
V
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its specified operating conditions.
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Electrical Characteristics
The following specifications apply for VS = ±15V, IREF = 2 mA and TMIN ≤ TA ≤ TMAX unless otherwise specified. Output
characteristics refer to both IOUT and IOUT.
Parameter
Typ
Max
Min
Typ
Max
Resolution
8
8
8
8
8
8
Monotonicity
8
8
8
8
8
8
Bits
±0.19
%FS
±0.1
To ±½ LSB, All Bits Switched “ON”
or “OFF”, TA=25°C
ts
Settling Time
tPLH,
Propagation Delay
TCIFS
100
Bits
135
ns
DAC0800L
100
135
ns
DAC0800LC
100
150
ns
TA=25°C
Each Bit
35
60
35
60
ns
All Bits Switched
35
60
35
60
ns
±10
±50
±10
±50
ppm/°C
18
V
1.99
2.04
mA
±1
±8.0
μA
0.2
2.0
μA
2.0
2.0
2.1
4.2
mA
0.8
V
Full Scale Tempco
VOC
Output Voltage Compliance
Full Scale Current Change <½
LSB, ROUT>20 MΩ, Typical
IFS4
Full Scale Current
VREF = 10.000V,
R14 = R15 = 5.000 kΩ,
TA=25°C
IFSS
Full Scale Symmetry
IFS4−IFS2
IZS
Zero Scale Current
IFSR
Units
Min
Nonlinearity
tPHL
DAC0800L/
DAC0800LC
DAC0802LC
Test Conditions
Output Current Range
V− = −5V
V− = −8V to −18V
Logic Input Levels
VLC = 0V
VIL
Logic “0”
VIH
Logic “1”
Logic Input Current
−10
1.984
0
0
18
−10
1.992
2.00
1.94
±0.5
±4.0
0.1
1.0
2.0
2.0
2.1
4.2
0
0
0.8
2.0
2.0
V
VLC = 0V
IIL
Logic “0”
−10V ≤ VIN ≤ +0.8V
−2.0
−10
−2.0
−10
μA
IIH
Logic “1”
2V ≤ VIN ≤ +18V
0.002
10
0.002
10
μA
18
V
VIS
Logic Input Swing
V− = −15V
−10
VTHR
Logic Threshold Range
VS = ±15V
−10
I15
Reference Bias Current
dl/dt
Reference Input Slew Rate
(Figure 26)
PSSIFS+
Positive Power Supply
Sensitivity
4.5V ≤ V+ ≤ 18V
0.0001
0.01
0.0001
0.01
%/%
PSSIFS−
Negative Power Supply
Sensitivity
−4.5V ≤ V− ≤ 18V, IREF = 1mA
0.0001
0.01
0.0001
0.01
%/%
Power Supply Current
VS = ±5V, IREF = 1 mA
I+
I−
I+
I−
I+
I−
PD
Power Supply Current
Power Supply Current
Power Consumption
−1.0
4.0
18
−10
13.5
−10
−3.0
8.0
−1.0
4.0
13.5
V
−3.0
μA
8.0
mA/μs
2.3
3.8
2.3
3.8
mA
−4.3
−5.8
−4.3
−5.8
mA
2.4
3.8
2.4
3.8
mA
−6.4
−7.8
−6.4
−7.8
mA
2.5
3.8
2.5
3.8
mA
−6.5
−7.8
−6.5
−7.8
mA
±5V, IREF = 1 mA
33
48
33
48
mW
+5V, −15V, IREF = 2 mA
108
136
108
136
mW
±15V, IREF = 2 mA
135
174
135
174
mW
VS = +5V, −15V, IREF = 2 mA
VS = ±15V, IREF = 2 mA
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Connection Diagrams
Figure 2. PDIP, CDIP Packages - Top View
(See Package Number NFG0016E or NFE0016A)
Figure 3. SOIC Package - Top View
(See Package Number D0016A)
Block Diagram
Pin numbers represent the PDIP package. The SOIC package pin numbers differ from that of the PDIP package.
Figure 4.
4
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Typical Performance Characteristics
Full Scale Current
vs.
Reference Current
LSB Propagation Delay
vs.
IFS
Figure 5.
Figure 6.
Reference Input
Frequency Response
Reference Amp
Common-Mode Range
Curve 1: CC=15 pF, VIN=2 Vp-p centered at 1V.
Curve 2: CC=15 pF, VIN=50 mVp-p centered at 200 mV.
Curve 3: CC=0 pF, VIN=100 mVp-p centered at 0V and applied
through 50Ω connected to pin 14.2V applied to R14.
Figure 7.
Note. Positive common-mode range is always (V+) − 1.5V.
Figure 8.
Logic Input Current vs.
Input Voltage
VTH — VLC
vs.
Temperature
Figure 9.
Figure 10.
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Typical Performance Characteristics (continued)
Output Current
vs.
Output
Voltage (Output Voltage
Compliance)
Output Voltage Compliance vs.
Temperature
Figure 11.
Figure 12.
Bit Transfer
Characteristics
Power Supply Current
vs. +V
Note. B1–B8 have identical transfer characteristics. Bits are fully
switched with less than ½ LSB error, at less than ±100 mV from actual
threshold. These switching points are guaranteed to lie between 0.8
and 2V over the operating temperature range (VLC = 0V).
Figure 13.
6
Figure 14.
Power Supply Current
vs. −V
Power Supply Current
vs. Temperature
Figure 15.
Figure 16.
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EQUIVALENT CIRCUIT
Figure 17. Equivalent Circuit
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TYPICAL APPLICATIONS
Pin numbers represent the PDIP package. The SOIC package pin numbers differ from that of the PDIP package.
IO + IO = IFS for all logic states
For fixed reference, TTL operation, typical values are:
VREF = 10.000V
RREF = 5.000k
R15 ≈ RREF
CC = 0.01 μF
VLC = 0V (Ground)
Figure 18. Basic Positive Reference Operation
Figure 19. Recommended Full Scale Adjustment
Circuit
Figure 20. Basic Negative Reference Operation
Pin numbers represent the PDIP package. The SOIC package pin numbers differ from that of the PDIP package.
8
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Pin numbers represent the PDIP package. The SOIC package pin numbers differ from that of the PDIP package.
Figure 21. Basic Unipolar Negative Operation
Table 1. Basic Unipolar Negative Operation
B1
B2
B3
B4
B5
B6
B7
B8
IO mA
IOmA
EO
EO
Full Scale
1
1
1
1
1
1
1
1
1.992
0.000
−9.960
0.000
Full Scale−LSB
1
1
1
1
1
1
1
0
1.984
0.008
−9.920
−0.040
Half Scale+LSB
1
0
0
0
0
0
0
1
1.008
0.984
−5.040
−4.920
Half Scale
1
0
0
0
0
0
0
0
1.000
0.992
−5.000
−4.960
Half Scale−LSB
0
1
1
1
1
1
1
1
0.992
1.000
−4.960
−5.000
Zero Scale+LSB
0
0
0
0
0
0
0
1
0.008
1.984
−0.040
−9.920
Zero Scale
0
0
0
0
0
0
0
0
0.000
1.992
0.000
−9.960
Pin numbers represent the PDIP package. The SOIC package pin numbers differ from that of the PDIP package.
Figure 22. Basic Bipolar Output Operation
Table 2. Basic Bipolar Output Operation
B1
B2
B3
B4
B5
B6
B7
B8
EO
EO
Pos. Full Scale
1
1
1
1
1
1
1
1
−9.920
+10.000
Pos. Full Scale−LSB
1
1
1
1
1
1
1
0
−9.840
+9.920
Zero Scale+LSB
1
0
0
0
0
0
0
1
−0.080
+0.160
Zero Scale
1
0
0
0
0
0
0
0
0.000
+0.080
Zero Scale−LSB
0
1
1
1
1
1
1
1
+0.080
0.000
Neg. Full Scale+LSB
0
0
0
0
0
0
0
1
+9.920
−9.840
Neg. Full Scale
0
0
0
0
0
0
0
0
+10.000
−9.920
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(1)
Pin numbers represent the PDIP package. The SOIC package pin numbers differ from that of the PDIP package.
(2)
If RL = RL within ±0.05%, output is symmetrical about ground.
Figure 23. Symmetrical Offset Binary Operation
Table 3. Symmetrical Offset Binary Operation
B1
B2
B3
B4
B5
B6
B7
B8
EO
Pos. Full Scale
1
1
1
1
1
1
1
1
+9.960
Pos. Full Scale−LSB
1
1
1
1
1
1
1
0
+9.880
(+)Zero Scale
1
0
0
0
0
0
0
0
+0.040
(−)Zero Scale
0
1
1
1
1
1
1
1
−0.040
Neg. Full Scale+LSB
0
0
0
0
0
0
0
1
−9.880
Neg. Full Scale
0
0
0
0
0
0
0
0
−9.960
(1)
Pin numbers represent the PDIP package. The SOIC package pin numbers differ from that of the PDIP package.
(2)
For complementary output (operation as negative logic DAC), connect inverting input of op amp to IO (pin 2), connect
IO (pin 4) to ground.
Figure 24. Positive Low Impedance Output Operation
(1)
Pin numbers represent the PDIP package. The SOIC package pin numbers differ from that of the PDIP package.
(2)
For complementary output (operation as a negative logic DAC) connect non-inverting input of op am to IO (pin 2);
connect IO (pin 4) to ground.
Figure 25. Negative Low Impedance Output Operation
10
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Typical values: RIN=5k,+VIN=10V
Pin numbers represent the PDIP package. The SOIC package pin numbers differ from that of the PDIP package.
Figure 26. Pulsed Reference Operation
VTH = VLC + 1.4V
15V CMOS, HTL, HNIL
VTH = 7.6V
Note. Do not exceed negative logic input range of DAC.
Figure 27. Interfacing with Various Logic Families
(a) IREF ≥ peak negative swing of IIN
(b) +VREF must be above peak positive swing of VIN
Pin numbers represent the PDIP package. The SOIC package pin numbers differ from that of the PDIP package.
Figure 28. Accommodating Bipolar References
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Pin numbers represent the PDIP package. The SOIC package pin numbers differ from that of the PDIP package.
Figure 29. Settling Time Measurement
(1)
For 1 μs conversion time with 8-bit resolution and 7-bit accuracy, an LM361 comparator replaces the LM319 and the
reference current is doubled by reducing R1, R2 and R3 to 2.5 kΩ and R4 to 2 MΩ.
(2)
Pin numbers represent the PDIP package. The SOIC package pin numbers differ from that of the PDIP package.
Figure 30. A Complete 2 μs Conversion Time, 8-Bit A/D Converter
12
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REVISION HISTORY
Changes from Revision B (February 2013) to Revision C
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 12
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PACKAGE OPTION ADDENDUM
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11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
(3)
Top-Side Markings
(4)
DAC-08EP
ACTIVE
PDIP
NFG
16
25
TBD
Call TI
Call TI
0 to 70
DAC0800LCN
DAC-08EP
DAC0800LCM
ACTIVE
SOIC
D
16
48
TBD
Call TI
Call TI
0 to 70
DAC0800LCM
DAC0800LCM/NOPB
ACTIVE
SOIC
D
16
48
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
DAC0800LCM
DAC0800LCMX
ACTIVE
SOIC
D
16
2500
TBD
Call TI
Call TI
0 to 70
DAC0800LCM
DAC0800LCMX/NOPB
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
DAC0800LCM
DAC0800LCN
ACTIVE
PDIP
NFG
16
25
TBD
Call TI
Call TI
0 to 70
DAC0800LCN
DAC-08EP
DAC0800LCN/NOPB
ACTIVE
PDIP
NFG
16
25
Pb-Free
(RoHS)
SN
Level-1-NA-UNLIM
0 to 70
DAC0800LCN
DAC-08EP
DAC0802LCMX
ACTIVE
SOIC
D
16
2500
TBD
Call TI
Call TI
0 to 70
DAC0802LCM
DAC0802LCMX/NOPB
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
DAC0802LCM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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11-Apr-2013
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
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26-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DAC0800LCMX
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.3
8.0
16.0
Q1
DAC0800LCMX/NOPB
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.3
8.0
16.0
Q1
DAC0802LCMX
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.3
8.0
16.0
Q1
DAC0802LCMX/NOPB
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.3
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC0800LCMX
SOIC
D
16
2500
367.0
367.0
35.0
DAC0800LCMX/NOPB
SOIC
D
16
2500
367.0
367.0
35.0
DAC0802LCMX
SOIC
D
16
2500
367.0
367.0
35.0
DAC0802LCMX/NOPB
SOIC
D
16
2500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NFG0016E
N0016E
N16E (Rev G)
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Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
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dsp.ti.com
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www.ti.com/energy
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Logic
logic.ti.com
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www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
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RFID
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www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
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