LMV611, LMV612, LMV614 www.ti.com SNOSC69B – APRIL 2012 – REVISED MARCH 2013 LMV611 Single/LMV612 Dual/LMV614 Quad 1.4 MHz, Low Power General Purpose, 1.8V Operational Amplifiers Check for Samples: LMV611, LMV612, LMV614 FEATURES DESCRIPTION • The LMV611/LMV612/LMV614 are single, dual, and quad low voltage, low power Operational Amplifiers. They are designed specifically for low voltage general purpose applications. Other important product characteristics are, rail to-rail input/output, low supply voltage of 1.8V and wide temperature range. The LMV611/LMV612/LMV614 input common mode extends 200mV beyond the supplies and the output can swing rail-to-rail unloaded and within 30mV with 2kohm load at 1.8V supply. The LMV611/2/4 achieves a gain bandwidth of 1.4MHz while drawing 100 uA (typ) quiescent current. 1 2 • • • • • • • (Typical 1.8V Supply Values; Unless Otherwise Noted) Ensured 1.8V, 2.7V and 5V Specifications Output Swing – w/600Ω Load 80mV from Rail – w/2kΩ Load 30mV from Rail VCM 200mV Beyond Rails Supply Current (Per Channel) 100μA Gain Bandwidth Product 1.4MHz Maximum VOS 4.0mV Temperature Range −40°C to 125°C APPLICATIONS • • • • • • • Consumer Communication Consumer Computing PDAs Audio Pre-Amp Portable/Battery-Powered Electronic Equipment Supply Current Monitoring Battery Monitoring The industrial-plus temperature range of −40°C to 125°C allows the LMV611/LMV612/LMV614 to accommodate a broad range of extended environment applications. The LMV611 is offered in the tiny 5-Pin SC70 package, the LMV612 in space saving 8-Pin VSSOP and SOIC, and the LMV614 in 14-Pin TSSOP and SOIC. These small package amplifiers offer an ideal solution for applications requiring minimum PCB footprint. Applications with area constrained PC board requirements include portable and battery operated electronics. Typical Application 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012–2013, Texas Instruments Incorporated LMV611, LMV612, LMV614 SNOSC69B – APRIL 2012 – REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Machine Model ESD Tolerance (3) 200V Human Body Model 2000V Supply Voltage (V+–V −) 6V Differential Input Voltage ± Supply Voltage Voltage at Input/Output Pins V++0.3V, V--0.3V Storage Temperature Range −65°C to 150°C Junction Temperature (4) 150°C For soldering specifications see product folder at www.ti.com and SNOA549 (1) (2) (3) (4) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. Operating Ratings (1) Supply Voltage Range 1.8V to 5.5V −40°C to 125°C Temperature Range Thermal Resistance (θJA) (1) 2 5-Pin SC70 414°C/W 5-Pin SOT-23 265°C/W 8-Pin VSSOP 235°C/W 8-Pin SOIC 175°C/W 14-Pin TSSOP 155°C/W 14-Pin SOIC 127°C/W Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 LMV611, LMV612, LMV614 www.ti.com SNOSC69B – APRIL 2012 – REVISED MARCH 2013 1.8V DC Electrical Characteristics Unless otherwise specified, all limits ensured for TJ = 25°C. V+ = 1.8V, V − = 0V, VCM = V+/2, VO = V+/2 and RL > 1 MΩ. Boldface limits apply at the temperature extremes. See (1) Symbol VOS Typ (3) Max (2) Units LMV611 (Single) 1 4 mV LMV612 (Dual) LMV614 (Quad) 1 5.5 Parameter Input Offset Voltage Condition Min (2) TCVOS Input Offset Voltage Average Drift 5.5 IB Input Bias Current 15 IOS Input Offset Current 13 IS Supply Current (per channel) 103 CMRR Common Mode Rejection Ratio PSRR CMVR AV VO IO (1) (2) (3) (4) (5) Power Supply Rejection Ratio Input Common-Mode Voltage Range Large Signal Voltage Gain LMV611 (Single) LMV611, 0 ≤ VCM ≤ 0.6V 1.4V ≤ VCM ≤ 1.8V (4) 60 78 LMV612 and LMV614 0 ≤ VCM ≤ 0.6V 1.4V ≤ VCM ≤ 1.8V (4) 55 76 −0.2V ≤ VCM ≤ 0V 1.8V ≤ VCM ≤ 2.0V 50 μV/°C nA nA 185 μA dB 1.8V ≤ V+ ≤ 5V 72 100 − −0.2 to 2.1 dB + For CMRR Range TA = 25°C ≥ 50dB TA −40°C to 85°C V −0.2 V− V+ TA = 125°C V− +0.2 V+ −0.2 RL = 600Ω to 0.9V, VO = 0.2V to 1.6V, VCM = 0.5V 77 101 RL = 2kΩ to 0.9V, VO = 0.2V to 1.6V, VCM = 0.5V 80 105 Large Signal Voltage Gain LMV612 (Dual) LMV614 (Quad) RL = 600Ω to 0.9V, VO = 0.2V to 1.6V, VCM = 0.5V 75 90 RL = 2kΩ to 0.9V, VO = 0.2V to 1.6V, VCM = 0.5V 78 100 Output Swing RL = 600Ω to 0.9V VIN = ±100mV 1.65 RL = 2kΩ to 0.9V VIN = ±100mV 1.75 Output Short Circuit Current (5) mV V +0.2 V dB dB 1.72 0.077 0.105 1.77 0.024 Sourcing, VO = 0V VIN = 100mV 8 Sinking, VO = 1.8V VIN = −100mV 9 V 0.035 mA Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No assurance of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. See Applications section for information of temperature derating of the device. Absolute Maximum Ratings indicated junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. All limits are specified by testing or statistical analysis. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. For specified temperature ranges, see Input Common-Mode Voltage Range specifications. Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of 45mA over long term may adversely affect reliability. Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 Submit Documentation Feedback 3 LMV611, LMV612, LMV614 SNOSC69B – APRIL 2012 – REVISED MARCH 2013 www.ti.com 1.8V AC Electrical Characteristics Unless otherwise specified, all limits ensured for TJ = 25°C. V+ = 1.8V, V − = 0V, VCM = V+/2, VO = V+/2 and RL > 1 MΩ. Boldface limits apply at the temperature extremes. See (1) Symbol Parameter SR Slew Rate GBW Φm Conditions Typ (3) Max (2) Units 0.35 V/μs Gain-Bandwidth Product 1.4 MHz Phase Margin 67 deg Gm Gain Margin 7 dB en Input-Referred Voltage Noise f = 10 kHz, VCM = 0.5V 60 nV/√Hz in Input-Referred Current Noise f = 10 kHz 0.08 pA/√Hz THD Total Harmonic Distortion f = 1kHz, AV = +1 RL = 600Ω, VIN = 1 VPP 0.023 Amp-to-Amp Isolation See (5) (1) (2) (3) (4) (5) See Min (2) (4) % 123 dB Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No assurance of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. See Applications section for information of temperature derating of the device. Absolute Maximum Ratings indicated junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. All limits are specified by testing or statistical analysis. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. Connected as voltage follower with input step from V− to V+. Number specified is the slower of the positive and negative slew rates. Input referred, RL = 100kΩ connected to V+/2. Each amp excited in turn with 1kHz to produce VO = 3VPP (For Supply Voltages <3V, VO = V+). 2.7V DC Electrical Characteristics Unless otherwise specified, all limits ensured for TJ = 25°C. V+ = 2.7V, V − = 0V, VCM = V+/2, VO = V+/2 and RL > 1 MΩ. Boldface limits apply at the temperature extremes. See (1) Symbol VOS Parameter Input Offset Voltage Typ (3) Max (2) Units LMV611 (Single) 1 4 mV LMV612 (Dual) LMV614 (Quad) 1 5.5 Condition Min (2) TCVOS Input Offset Voltage Average Drift 5.5 IB Input Bias Current 15 IOS Input Offset Current 8 IS Supply Current (per channel) CMRR Common Mode Rejection Ratio PSRR (1) (2) (3) (4) 4 Power Supply Rejection Ratio 105 LMV611, 0 ≤ VCM ≤ 1.5V 2.3V ≤ VCM ≤ 2.7V (4) 60 81 LMV612 and LMV614 0 ≤ VCM ≤ 1.5V 2.3V ≤ VCM ≤ 2.7V (4) 55 80 −0.2V ≤ VCM ≤ 0V 2.7V ≤ VCM ≤ 2.9V 50 mV μV/°C nA nA 190 μA dB 1.8V ≤ V+ ≤ 5V VCM = 0.5V 74 100 dB Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No assurance of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. See Applications section for information of temperature derating of the device. Absolute Maximum Ratings indicated junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. All limits are specified by testing or statistical analysis. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. For specified temperature ranges, see Input Common-Mode Voltage Range specifications. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 LMV611, LMV612, LMV614 www.ti.com SNOSC69B – APRIL 2012 – REVISED MARCH 2013 2.7V DC Electrical Characteristics (continued) Unless otherwise specified, all limits ensured for TJ = 25°C. V+ = 2.7V, V − = 0V, VCM = V+/2, VO = V+/2 and RL > 1 MΩ. Boldface limits apply at the temperature extremes. See(1) Symbol VCM Parameter Input Common-Mode Voltage Range Condition For CMRR Range ≥ 50dB TA = 25°C Large Signal Voltage Gain LMV611 (Single) VO (5) V −0.2 Typ (3) Max (2) −0.2 to 3.0 V+ +0.2 V− Units V+ − V + V −0.2 V +0.2 RL = 600Ω to 1.35V, VO = 0.2V to 2.5V 87 104 RL = 2kΩ to 1.35V, VO = 0.2V to 2.5V 92 110 Large Signal Voltage Gain LMV612 (Dual) LMV614 (Quad) RL = 600Ω to 1.35V, VO = 0.2V to 2.5V 78 90 RL = 2kΩ to 1.35V, VO = 0.2V to 2.5V 81 100 Output Swing RL = 600Ω to 1.35V VIN = ±100mV 2.55 RL = 2kΩ to 1.35V VIN = ±100mV 2.65 Output Short Circuit Current (5) IO − TA = −40°C to 85°C TA = 125°C AV Min (2) dB dB 2.62 0.083 0.110 V 2.675 0.025 Sourcing, VO = 0V VIN = 100mV 30 Sinking, VO = 0V VIN = −100mV 25 0.04 mA Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of 45mA over long term may adversely affect reliability. 2.7V AC Electrical Characteristics Unless otherwise specified, all limits ensured for TJ = 25°C. V+ = 2.7V, V − = 0V, VCM = 1.0V, VO = 1.35V and RL > 1 MΩ. Boldface limits apply at the temperature extremes. See (1) Symbol Parameter Conditions SR Slew Rate GBW Gain-Bandwidth Product Φm Gm en Input-Referred Voltage Noise f = 10 kHz, VCM = 0.5V in Input-Referred Current Noise THD Total Harmonic Distortion Amp-to-Amp Isolation See (5) (1) (2) (3) (4) (5) See Min (2) (4) Typ (3) Max (2) Units 0.4 V/µs 1.4 MHz Phase Margin 70 deg Gain Margin 7.5 dB 57 nV/√Hz f = 10 kHz 0.08 pA/√Hz f = 1kHz, AV = +1 RL = 600Ω, VIN = 1VPP 0.022 % 123 dB Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No assurance of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. See Applications section for information of temperature derating of the device. Absolute Maximum Ratings indicated junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. All limits are specified by testing or statistical analysis. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. Connected as voltage follower with input step from V− to V+. Number specified is the slower of the positive and negative slew rates. Input referred, RL = 100kΩ connected to V+/2. Each amp excited in turn with 1kHz to produce VO = 3VPP (For Supply Voltages <3V, VO = V+). Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 Submit Documentation Feedback 5 LMV611, LMV612, LMV614 SNOSC69B – APRIL 2012 – REVISED MARCH 2013 www.ti.com 5V DC Electrical Characteristics Unless otherwise specified, all limits ensured for TJ = 25°C. V+ = 5V, V − = 0V, VCM = V+/2, VO = V+/2 and RL > 1 MΩ. Boldface limits apply at the temperature extremes. See (1) Symbol VOS Parameter Typ (3) Max (2) Units LMV611 (Single) 1 4 mV LMV612 (Dual) LMV614 (Quad) 1 5.5 Condition Input Offset Voltage Min (2) TCVOS Input Offset Voltage Average Drift 5.5 IB Input Bias Current 14 IOS Input Offset Current 9 IS Supply Current (per channel) CMRR Common Mode Rejection Ratio PSRR CMVR Power Supply Rejection Ratio Input Common-Mode Voltage Range 116 0 ≤ VCM ≤ 3.8V 4.6V ≤ VCM ≤ 5.0V (4) 60 86 −0.2V ≤ VCM ≤ 0V 5.0V ≤ VCM ≤ 5.2V 50 78 1.8V ≤ V+ ≤ 5V VCM = 0.5V For CMRR Range TA = 25°C ≥ 50dB TA = −40°C to 85°C TA = 125°C AV VO IO (1) (2) (3) (4) (5) 6 Large Signal Voltage Gain LMV611 (Single) V −0.2 −0.2 to 5.3 nA 210 μA nA dB dB + V +0.2 V+ V − V + V −0.3 V +0.3 88 102 RL = 2kΩ to 2.5V, VO = 0.2V to 4.8V 94 113 Large Signal Voltage Gain LMV612 (Dual) LMV614 (Quad) RL = 600Ω to 2.5V, VO = 0.2V to 4.8V 81 90 RL = 2kΩ to 2.5V, VO = 0.2V to 4.8V 85 100 Output Swing RL = 600Ω to 2.5V VIN = ±100mV 4.855 4.890 RL = 2kΩ to 2.5V VIN = ±100mV 4.945 Output Short Circuit Current 35 − RL = 600Ω to 2.5V, VO = 0.2V to 4.8V (5) μV/°C 100 − mV 0.120 dB dB 0.160 4.967 0.037 LMV611, Sourcing, VO = 0V VIN = 100mV 100 Sinking, VO = 5V VIN = −100mV 65 V 0.065 mA Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No assurance of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. See Applications section for information of temperature derating of the device. Absolute Maximum Ratings indicated junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. All limits are specified by testing or statistical analysis. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. For specified temperature ranges, see Input Common-Mode Voltage Range specifications. Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of 45mA over long term may adversely affect reliability. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 LMV611, LMV612, LMV614 www.ti.com SNOSC69B – APRIL 2012 – REVISED MARCH 2013 5V AC Electrical Characteristics Unless otherwise specified, all limits ensured for TJ = 25°C. V+ = 5V, V − = 0V, VCM = V+/2, VO = 2.5V and R L > 1 MΩ. Boldface limits apply at the temperature extremes. See (1) Symbol Parameter SR Slew Rate GBW Φm Min (2) Conditions (4) Max (2) Units 0.42 V/µs Gain-Bandwidth Product 1.5 MHz Phase Margin 71 deg Gm Gain Margin 8 dB en Input-Referred Voltage Noise f = 10 kHz, VCM = 1V 50 nV/√Hz in Input-Referred Current Noise f = 10 kHz 0.08 pA/√Hz THD Total Harmonic Distortion f = 1kHz, AV = +1 RL = 600Ω, VO = 1V PP 0.022 Amp-to-Amp Isolation See (5) (1) (2) (3) (4) (5) See Typ (3) % 123 dB Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No assurance of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. See Applications section for information of temperature derating of the device. Absolute Maximum Ratings indicated junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. All limits are specified by testing or statistical analysis. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. Connected as voltage follower with input step from V− to V+. Number specified is the slower of the positive and negative slew rates. Input referred, RL = 100kΩ connected to V+/2. Each amp excited in turn with 1kHz to produce VO = 3VPP (For Supply Voltages <3V, VO = V+). Connection Diagrams Top View Top View 1 Top View 8 + V OUT A A 2 - + 7 -IN A OUT B 3 6 +IN A + V Figure 1. 5-Pin SC70/SOT-23 (LMV611) See Package Numbers DCK and DBV - -IN B B 4 5 +IN B Figure 2. 8-Pin VSSOP/SOIC (LMV612) See Package Numbers DGK and D Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 Figure 3. 14-Pin TSSOP/SOIC (LMV614) See Package Numbers PW and D Submit Documentation Feedback 7 LMV611, LMV612, LMV614 SNOSC69B – APRIL 2012 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics Unless otherwise specified, VS = +5V, single supply, TA = 25°C. 160 Supply Current vs. Supply Voltage (LMV611) 100 125°C 140 SUPPLY CURRENT (éA) Sourcing Current vs. Output Voltage VS = 5V 85°C 120 ISOURCE (mA) 10 100 25°C 80 -40°C 60 VS = 2.7V 1 VS = 1.8V 40 0.1 20 0 0 1 2 3 4 5 6 0.01 0.001 10 Output Voltage Swing vs. Supply Voltage VS = 2.7V 1 VS = 1.8V 0.1 0.01 0.1 10 1 OUTPUT VOLTAGE PROXIMITY TO SUPPLY VOLTAGE (mV ABSOLUTE VALUE) Sinking Current vs. Output Voltage 10 ISINK (mA) 1 Figure 5. VS = 5V 140 RL = 600: 130 NEGATIVE SWING 120 110 100 90 80 POSITIVE SWING 70 60 0 OUTPUT VOLTAGE REF TO GND (V) OUTPUT VOLTAGE PROXIMITY TO SUPPLY VOLTAGE (mV ABSOLUTE VALUE) 0.1 Figure 4. 100 0.01 0.001 0.01 OUTPUT VOLTAGE REFERENCED TO V+ (V) SUPPLY VOLTAGE (V) 1 4 2 3 SUPPLY VOLTAGE (V) Figure 6. Figure 7. Output Voltage Swing vs. Supply Voltage Gain and Phase vs. Frequency 5 6 45 RL = 2k: 40 NEGATIVE SWING 35 30 25 POSITIVE SWING 20 0 1 2 3 5 4 6 SUPPLY VOLTAGE (V) Figure 8. 8 Submit Documentation Feedback Figure 9. Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 LMV611, LMV612, LMV614 www.ti.com SNOSC69B – APRIL 2012 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Unless otherwise specified, VS = +5V, single supply, TA = 25°C. Gain and Phase vs. Frequency Gain and Phase vs. Frequency Figure 10. Figure 11. Gain and Phase vs. Frequency CMRR vs. Frequency 90 VS = 5V 85 CMRR (dB) 80 VS = 2.7V 75 VS = 1.8V 70 65 60 10 100 Figure 12. Figure 13. PSRR vs. Frequency Input Voltage Noise vs. Frequency 1000 INPUT VOLTAGE NOISE (nV/ Hz) 90 80 PSRR (dB) 10k VS = 5V +PSRR 70 -PSRR 60 50 40 30 10 1k 100 FREQUENCY (Hz) 100 1k FREQUENCY (Hz) 10k 100 10 10 100 1k 10k 100k FREQUENCY (Hz) Figure 14. Figure 15. Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 Submit Documentation Feedback 9 LMV611, LMV612, LMV614 SNOSC69B – APRIL 2012 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, VS = +5V, single supply, TA = 25°C. Input Current Noise vs. Frequency THD vs. Frequency 10 1 INPUT CURRENT NOISE (pA/ Hz) RL = 600: AV = +1 THD (%) 1 0.1 1.8V 0.1 2.7V 5V 0.01 10 100 1k 10k 0.01 10 100k 10 10k 1k 100 100k FREQUENCY (Hz) FREQUENCY (Hz) Figure 16. Figure 17. THD vs. Frequency Slew Rate vs. Supply Voltage 0.5 RL = 600: AV = +10 SLEW RATE (V/Ps) 0.45 THD (%) 1 5V 0.1 FALLING EDGE 0.4 RISING EDGE 0.35 RL = 2k: 0.3 1.8V AV = +1 2.7V 0.01 10 VIN = 1VPP 0.25 100 1k 10k 0 100k 1 3 4 5 6 Figure 19. Small Signal Non-Inverting Response Small Signal Non-Inverting Response VS = 1.8V OUTPUT SIGNAL RL = 2 k: VS = 2.7V RL = 2 k: (50 mV/DIV) INPUT SIGNAL Figure 18. INPUT SIGNAL OUTPUT SIGNAL (50 mV/DIV) 10 2 SUPPLY VOLTAGE (V) FREQUENCY (Hz) TIME (2.5 Ps/DIV) TIME (2.5 Ps/DIV) Figure 20. Figure 21. Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 LMV611, LMV612, LMV614 www.ti.com SNOSC69B – APRIL 2012 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Unless otherwise specified, VS = +5V, single supply, TA = 25°C. Small Signal Non-Inverting Response Large Signal Non-Inverting Response VIN INPUT SIGNAL VS = 5V OUTPUT SIGNAL (50 mV/DIV) (900 mV/div) RL = 2 k: VOUT VS = 1.8V RL = 2k: AV = +1 TIME (10 Ps/div) TIME (2.5 Ps/DIV) Figure 22. Figure 23. Large Signal Non-Inverting Response Large Signal Non-Inverting Response VIN (2.5 V/div) (1.35V/DIV) VIN VOUT VOUT VS = 2.7V VS = 5.0V RL = 2 k: RL = 2k: AV = +1 AV = +1 TIME (10 Ps/div) TIME (10 Ps/DIV) Figure 24. Figure 25. Short Circuit Current vs. Temperature (Sinking) Short Circuit Current vs. Temperature (Sourcing) 90 90 SHORT CIRCUIT CURRENT (mA) SHORT CIRCUIT CURRENT (mA) 5V 80 5V 70 60 50 40 2.7V 30 20 1.8V 10 0 -40 10 60 TEMPERATURE (°C) 110 80 70 60 50 40 2.7V 30 20 1.8V 10 0 -40 Figure 26. 10 60 TEMPERATURE (°C) 110 Figure 27. Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 Submit Documentation Feedback 11 LMV611, LMV612, LMV614 SNOSC69B – APRIL 2012 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, VS = +5V, single supply, TA = 25°C. Offset Voltage vs. Common Mode Range Offset Voltage vs. Common Mode Range 3 3 VS = 1.8V VS = 2.7V 2.5 2.5 2 2 1 0.5 -40°C 25°C -40°C 1.5 VOS (mV) VOS (mV) 25°C 1.5 1 0.5 85°C 85°C 125°C 125°C 0 0 -0.5 -0.5 -1 -0.4 0 0.4 0.8 1.2 1.6 2 -1 -0.4 2.4 VCM (V) 0.1 0.6 1.1 1.6 2.1 2.6 3.1 VCM (V) Figure 28. Figure 29. Offset Voltage vs. Common Mode Range 3 VS = 5V 2.5 2 VOS (mV) -40°C 1.5 1 0.5 25°C 125°C 85°C 0 -0.5 -1 -0.4 0.6 1.6 2.6 3.6 4.6 5.6 VCM (V) Figure 30. 12 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 LMV611, LMV612, LMV614 www.ti.com SNOSC69B – APRIL 2012 – REVISED MARCH 2013 APPLICATION NOTE INPUT AND OUTPUT STAGE The rail-to-rail input stage of this family provides more flexibility for the designer. The LMV611/LMV612/LMV614 use a complimentary PNP and NPN input stage in which the PNP stage senses common mode voltage near V− and the NPN stage senses common mode voltage near V+. The transition from the PNP stage to NPN stage occurs 1V below V+. Since both input stages have their own offset voltage, the offset of the amplifier becomes a function of the input common mode voltage and has a crossover point at 1V below V+. This VOS crossover point can create problems for both DC and AC coupled signals if proper care is not taken. Large input signals that include the VOS crossover point will cause distortion in the output signal. One way to avoid such distortion is to keep the signal away from the crossover. For example, in a unity gain buffer configuration and with VS = 5V, a 5V peak-to-peak signal will contain input-crossover distortion while a 3V peakto-peak signal centered at 1.5V will not contain input-crossover distortion as it avoids the crossover point. Another way to avoid large signal distortion is to use a gain of −1 circuit which avoids any voltage excursions at the input terminals of the amplifier. In that circuit, the common mode DC voltage can be set at a level away from the VOS cross-over point. For small signals, this transition in VOS shows up as a VCM dependent spurious signal in series with the input signal and can effectively degrade small signal parameters such as gain and common mode rejection ratio. To resolve this problem, the small signal should be placed such that it avoids the VOS crossover point. In addition to the rail-to-rail performance, the output stage can provide enough output current to drive 600Ω loads. Because of the high current capability, care should be taken not to exceed the 150°C maximum junction temperature specification. INPUT BIAS CURRENT CONSIDERATION The LMV611/LMV612/LMV614 family has a complementary bipolar input stage. The typical input bias current (IB) is 15nA. The input bias current can develop a significant offset voltage. This offset is primarily due to IB flowing through the negative feedback resistor, RF. For example, if IB is 50nA and RF is 100kΩ, then an offset voltage of 5mV will develop (VOS = IB x RF). Using a compensation resistor (RC), as shown in Figure 31, cancels this effect. But the input offset current (IOS) will still contribute to an offset voltage in the same manner. Figure 31. Canceling the Offset Voltage due to Input Bias Current Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 Submit Documentation Feedback 13 LMV611, LMV612, LMV614 SNOSC69B – APRIL 2012 – REVISED MARCH 2013 www.ti.com Typical Applications HIGH SIDE CURRENT SENSING The high side current sensing circuit (Figure 32) is commonly used in a battery charger to monitor charging current to prevent over charging. A sense resistor RSENSE is connected to the battery directly. This system requires an op amp with rail-to-rail input. The LMV611/LMV612/LMV614 are ideal for this application because its common mode input range goes up to the rail. Figure 32. High Side Current Sensing HALF-WAVE RECTIFIER WITH RAIL-TO-GROUND OUTPUT SWING Since the LMV611/LMV612/LMV614 input common mode range includes both positive and negative supply rails and the output can also swing to either supply, achieving half-wave rectifier functions in either direction is an easy task. All that is needed are two external resistors; there is no need for diodes or matched resistors. The half wave rectifier can have either positive or negative going outputs, depending on the way the circuit is arranged. In Figure 33 the circuit is referenced to ground, while in Figure 34 the circuit is biased to the positive supply. These configurations implement the half wave rectifier since the LMV611/LMV612/LMV614 can not respond to one-half of the incoming waveform. It can not respond to one-half of the incoming because the amplifier can not swing the output beyond either rail therefore the output disengages during this half cycle. During the other half cycle, however, the amplifier achieves a half wave that can have a peak equal to the total supply voltage. RI should be large enough not to load the LMV611/LMV612/LMV614. Figure 33. Half-Wave Rectifier with Rail-To-Ground Output Swing Referenced to Ground Figure 34. Half-Wave Rectifier with Negative-Going Output Referenced to VCC 14 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 LMV611, LMV612, LMV614 www.ti.com SNOSC69B – APRIL 2012 – REVISED MARCH 2013 INSTRUMENTATION AMPLIFIER WITH RAIL-TO-RAIL INPUT AND OUTPUT Some manufactures make a non-“rail-to-rail”-op amp rail-to-rail by using a resistive divider on the inputs. The resistors divide the input voltage to get a rail-to-rail input range. The problem with this method is that it also divides the signal, so in order to get the obtained gain, the amplifier must have a higher closed loop gain. This raises the noise and drift by the internal gain factor and lowers the input impedance. Any mismatch in these precision resistors reduces the CMRR as well. The LMV611/LMV612/LMV614 is rail-to-rail and therefore doesn’t have these disadvantages. Using three of the LMV611/LMV612/LMV614 amplifiers, an instrumentation amplifier with rail-to-rail inputs and outputs can be made as shown in Figure 35. In this example, amplifiers on the left side act as buffers to the differential stage. These buffers assure that the input impedance is very high and require no precision matched resistors in the input stage. They also assure that the difference amp is driven from a voltage source. This is necessary to maintain the CMRR set by the matching R1-R2 with R3-R4. The gain is set by the ratio of R2/R1 and R3 should equal R1 and R4 equal R2. With both rail-torail input and output ranges, the input and output are only limited by the supply voltages. Remember that even with rail-to-rail outputs, the output can not swing past the supplies so the combined common mode voltages plus the signal should not be greater that the supplies or limiting will occur. For additional applications, see the following TI application reports: • AN-29 Application Report (SNOA624) • AN-31 Application Report (SNLA140) • AN-71 Application Report (SNOA652) • AN-127 Application Report (SNVA516) Figure 35. Rail-to-rail Instrumentation Amplifier Simplified Schematic Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 Submit Documentation Feedback 15 LMV611, LMV612, LMV614 SNOSC69B – APRIL 2012 – REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision A (March 2013) to Revision B • 16 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 15 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: LMV611 LMV612 LMV614 PACKAGE OPTION ADDENDUM www.ti.com 30-Jun-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMV611MF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM AE9A LMV611MFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM AE9A LMV611MG/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM AVA LMV611MGX/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM AVA LMV612MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LMV6 12MA LMV612MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LMV6 12MA LMV612MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM & no Sb/Br) AD9A LMV612MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS CU NIPDAUAG | CU SN Level-1-260C-UNLIM & no Sb/Br) AD9A LMV614MA/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LMV614MA LMV614MAX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LMV614MA LMV614MT/NOPB ACTIVE TSSOP PW 14 94 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM LMV61 4MT LMV614MTX/NOPB ACTIVE TSSOP PW 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM LMV61 4MT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 30-Jun-2015 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 6-Nov-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ LMV611MF/NOPB SOT-23 LMV611MFX/NOPB LMV611MG/NOPB Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 1.4 4.0 8.0 Q3 DBV 5 1000 178.0 8.4 SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 SC70 DCK 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LMV611MGX/NOPB SC70 DCK 5 3000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LMV612MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMV612MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV612MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV612MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV614MAX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 LMV614MTX/NOPB TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1 LMV614MTX/NOPB TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 6-Nov-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMV611MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LMV611MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LMV611MG/NOPB SC70 DCK 5 1000 210.0 185.0 35.0 LMV611MGX/NOPB SC70 DCK 5 3000 210.0 185.0 35.0 LMV612MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMV612MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LMV612MMX/NOPB VSSOP DGK 8 3500 364.0 364.0 27.0 LMV612MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LMV614MAX/NOPB SOIC D 14 2500 367.0 367.0 35.0 LMV614MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0 LMV614MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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