NOIV1SN025KA VITA 25K Image Sensor Features • • • • • • • • • • • • • • • 5120 x 5120 Active Pixels 4.5 mm x 4.5 mm Square Pixels 35 mm Optical Format Monochrome (SN) or Color (SE) 53 Frames per Second (fps) at Full Resolution On-chip 10-bit Analog-to-Digital Converter (ADC) 32 Low-voltage Differential Signaling (LVDS) High-speed Serial Outputs Random Programmable Region of Interest (ROI) Readout Pipelined and Triggered Global Shutter, Rolling Shutter On-chip Fixed Pattern Noise (FPN) Correction Serial Peripheral Interface (SPI) Operational Range: −40°C to +85°C 355-pin mPGA Package 3.4 W Power Dissipation These Devices are Pb−Free and are RoHS Compliant www.onsemi.com Applications • • • • • • Machine Vision Motion Monitoring Intelligent Traffic Systems (ITS) Pick and Place Machines Inspection Metrology Figure 1. VITA 25K Photograph Description The VITA 25K is a 5120 x 5120 CMOS image sensor delivering high resolution images at frame rates up to 53 frames per second. The high sensitivity 4.5 mm x 4.5 mm pixels support pipelined and triggered global shutter readout modes and can also be operated in a low noise rolling shutter mode. In rolling shutter mode, the sensor supports correlated double sampling readout, reducing noise and increasing the dynamic range. The sensor has on-chip programmable gain amplifiers and 10-bit A/D converters. The image’s black level is either calibrated automatically or can be adjusted by adding a user programmable offset. A high level of programmability using a four wire serial peripheral interface enables the user to read out specific regions of interest. Up to 32 regions can be programmed, achieving even higher frame rates. The image data interface consists of 32 LVDS lanes. Each channel runs at 620 Mbps. A separate synchronization channel containing payload information is provided to facilitate the image reconstruction at the receive end. The VITA 25K is packaged in a ceramic 355-pin mPGA package and is available in a monochrome, color and windowless versions. Contact your local ON Semiconductor office for more information. ORDERING INFORMATION Part Number Description NOIV1SN025KA-GDC Mono micro lens NOIV1SE025KA-GDC Color micro lens NOIV1SN025KA-GWC Mono micro lens windowless © Semiconductor Components Industries, LLC, 2014 December, 2016 − Rev. 10 Package 355−mPGA 1 Publication Order Number: NOIV1SN025KA/D NOIV1SN025KA ORDERING CODE DEFINITION Package Mark Following is the VITA 25K production package mark: Side 1 near Pin 1: NOIV1S * 025KA−GDC, where N = mono micro lens, E = color micro lens Side 2: AWLYYWW, NNNN where AWLYYWW is the lot traceability, and NNNN is the serial number Windowless Devices windowless devices are tested according to the Standard Acceptance Criteria and are electro optically identical to production devices WITH GLASS LID. Please note the RMA policy on Page NO TAG for windowless devices. Please contact your local sales office for entering a windowless order. The windowless devices are assembled in the same package as the windowed devices with the exception that the windowless devices are delivered with the glass lid (referenced in Figure 37 and Figure 39), taped on to the package. The glass lid is taped to the package in a clean room environment, soon after the wire bonding process, to maintain silicon integrity and wire dressing. The www.onsemi.com 2 NOIV1SN025KA CONTENTS Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering Code Definition . . . . . . . . . . . . . . . . . . . . . . 2 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Sensor Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Image Sensor Timing and Readout . . . . . . . . . . . . . . Additional Features . . . . . . . . . . . . . . . . . . . . . . . . . . . Data Output Format . . . . . . . . . . . . . . . . . . . . . . . . . . Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . Silicon Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Specifications and Useful References . . . . . . . . . . . . . Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . www.onsemi.com 3 24 27 33 43 60 73 73 74 75 NOIV1SN025KA SPECIFICATIONS Key Specifications Table 2. ELECTRO−OPTICAL SPECIFICATIONS [1] Table 1. GENERAL SPECIFICATIONS Parameter Specification Parameter Specification Active pixels 5120 (H) x 5120 (V) Frame rate 53 fps at full resolution Pixel size 4.5 mm x 4.5 mm Optical format 35 mm Pixel type Global shutter pixel architecture Conversion gain 0.0644 LSB10/e- , 81.5 mV/e- Shutter type Pipelined and triggered global shutter, rolling shutter Dark noise 2.13 LSB10, 34e- in global shutter 1.42 LSB10, 23e- in rolling shutter Master clock 310 MHz (10-bit) 248 MHz (8-bit) Responsivity at 550 nm 18 LSB10 /nJ/cm2, 3.4 V/lux.s Windowing features 32 Randomly programmable windows. Normal, sub-sampled and binned readout modes Parasitic Light Sensitivity (PLS) <1/900 at 550 nm Full well charge 22000 e- ADC resolution 10-bit, 8-bit 50% at 550 nm Number of LVDS outputs 32 data + 1 sync + 1 clock Quantum efficiency (QE) x FF Data rate 32 x 620 Mbps (10-bit) 32 x 496 Mbps (8-bit) Pixel FPN 0.5% of RMS of maximum swing Power dissipation 3.4 W Row FPN rolling & global shutter: 0.2 LSB10 Package type 355 mPGA Column FPN rolling & global shutter: 1.0 LSB10 Color RGB color, mono Dynamic range 56.2 dB in global shutter mode 59.6 dB in rolling shutter mode Signal-to-Noise Ratio (SNR) 43.4 dB in global and rolling shutter mode Dark signal 14 e-/s, 0.9 LSB10/s at +30°C rolling shutter: 1.0 LSB10 global shutter: 2.0 LSB10 Table 3. RECOMMENDED OPERATING RATINGS (Note 2) Symbol TJ Description Operating temperature range Min Max Units −40 +85 °C Table 4. ABSOLUTE MAXIMUM RATINGS (Note 3) Symbol Min Max Units ABS rating for 1.0 V supply –0.5 1.2 V ABS (1.8 V supply group) ABS rating for 1.8 V supply group –0.5 2.2 V ABS (3.3 V supply group) ABS (1.0 V supply) Parameter ABS rating for 3.3 V supply group –0.5 4.3 V ABS (4.2 V supply) ABS rating for 4.2 V supply –0.5 4.6 V ABS (4.5 V supply) ABS rating for 4.5 V supply –0.5 5.0 V TS (Notes 3 and 4) ABS storage temperature range 0 150 °C 85 %RH ABS storage humidity range at 85°C Electrostatic discharge (ESD) (Notes 2 and 3) LU Human Body Model (HBM): JS−001−2010 2000 Charged Device Model (CDM): JESD22−C101 500 Latch-up: JESD−78 140 V mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The ADC is 11-bit, down-scaled to 10-bit. The VITA 25K uses a larger word-length internally to provide 10-bit on the output. 2. Operating ratings are conditions in which operation of the device is intended to be functional. 3. ON Semiconductor recommends that customers become familiar with, and follow the procedures in JEDEC Standard JESD625−A. Refer to Application Note AN52561. Long term exposure toward the maximum storage temperature will accelerate color filter degradation. 4. Caution needs to be taken to avoid dried stains on the underside of the glass due to condensation. The glass lid glue is permeable and can absorb moisture if the sensor is placed in a high % RH environment. www.onsemi.com 4 NOIV1SN025KA Electrical Specifications Power Supply Ratings Table 5. POWER SUPPLY RATINGS Limits in bold apply for for TJ = TMIN to TMAX, all other limits TJ = +30°C [5], [6], [7], [8] Parameter Description Min Typ Max Units 3 3.3 3.6 V 675 725 775 mA Power Supply Parameters vdda_33 Analog supply - 3.3 V domain. gnda_33 is connected to substrate Idda_33 Current consumption from analog supply vddd_33 Digital supply - 3.3 V domain. gndd_33 is connected to substrate 3 3.3 3.6 V Iddd_33 Current consumption from 3.3 V digital supply 65 85 105 mA vdd_18 Digital supply - 1.8 V domain. gndd_18 is connected to substrate 1.6 1.8 2 V Idd_18 Current consumption 1.8 V digital supply 240 310 380 mA vdd_pix Pixel array supply 3 3.3 3.6 V Idd_pix Current consumption from pixel supply 25 35 45 mA vdd_resfd Floating diffusion reset supply 3.3 4.5 4.6 V gnd_resfd Floating diffusion reset ground. Not connected to substrate 0 0 1.0 V vdd_respd Photo diode reset supply 3.3 4.2 4.6 V gnd_respd Photo diode reset ground. Not connected to substrate. Note This is a sinking power supply with 200 mA range. 0 0 1.0 V vdd_trans Pixel transfer supply 3.3 4.2 4.6 V gnd_trans Pixel transfer ground. Not connected to substrate 0 0 1.0 V vdd_sel Pixel select supply 3.0 3.3 3.6 V gnd_sel Pixel select ground. Not connected to substrate. 0 0 0 V vdd_casc Cascode supply 0.9 1.0 1.1 V vref_colmux [8] Column multiplexer reference supply – 1.0 – V gnd_colbias Column biasing ground. Dedicated ground signal for pixel biasing. Connected to substrate – 0 – V gnd_colpc Column precharge ground. Dedicated ground signal for pixel biasing. Not connected to substrate – 0 – V Ptot Total power consumption 3000 3400 3800 mW Pstby Power consumption in standby mode – 50 mW Popt Power consumption at lower pixel rates – Configurable I/O - LVDS (EIA/TIA-644): Conforming to standard/additional specifications and deviations listed fserdata Data rate on data channels in 10-bit mode DDR signaling - 32 data channels, 1 synchronization channel 620 Mbps fserdata Data rate on data channels in 8-bit mode DDR signaling - 32 data channels, 1 synchronization channel 496 Mbps fserclock Clock rate of output clock in 10-bit mode Clock output for mesochronous signaling 310 MHz fserclock Clock rate of output clock in 8-bit mode Clock output for mesochronous signaling 248 MHz Vicm LVDS input common mode level 2.2 V Tccsk Channel to channel skew (training pattern allows per-channel skew correction) 50 ps 0.3 1.25 LVDS Electrical/Interface fin Input clock rate for 10-bit mode 310 MHz fin Input clock rate for 8-bit mode 248 MHz www.onsemi.com 5 NOIV1SN025KA Table 5. POWER SUPPLY RATINGS Limits in bold apply for for TJ = TMIN to TMAX, all other limits TJ = +30°C [5], [6], [7], [8] Parameter Description Min Typ Max Units 40 50 60 % tidc Input clock duty cycle tj Input clock jitter fspi SPI clock rate ratspi 10-bit: ratio: Fin/fspi 30 8-bit: ratio: Fin/fspi 24 20 ps 10 MHz Sensor Requirements fps Frame rate at full resolution (global shutter) 53 fps fps_roi1 Xres x Yres = 1920 x 1080 440 fps fps_roi2 Xres x Yres = 1024 x 1024 590 fps fps_roi3 Xres x Yres = 640 x 480 1380 fps fps_roi4 Xres x Yres = 512 x 512 1360 fps fps_roi5 Xres x Yres = 256 x 256 2750 fps FOT Frame overhead time 50 ms ROT Row overhead time 1 ms fpix Pixel rate (32 channels at 62 Mpix/s) 1984 Mpix/s 5. All parameters are characterized for DC conditions after thermal equilibrium is established. 6. This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields. However, it is recommended that normal precautions be taken to avoid application of any voltages higher than the maximum rated voltages to this high−impedance circuit. 7. Minimum and maximum limits are guaranteed through test and design. 8. Vref_colmux supply should be able to source and sink current Disclaimer: Image sensor products and specifications are subject to change without notice. Products are warranted to meet the production data sheet and acceptance criteria specifications only. www.onsemi.com 6 NOIV1SN025KA Power Distribution Network VITA 25K power management. Please refer to the AN65466 for recommended linear regulator selection, decoupling capacitor network and BOM for the power distribution network. A power distribution network (PDN) is designed to ensure proper power management to the VITA 25K sensor. Table 6 provides the recommended power supplies for the Table 6. RECOMMENDED POWER SUPPLIES FOR VITA 25K Category Digital Analog Power Supply Source/Sink Stage Min Rating (V) Typ Rating (V) Max Rating (V) Max DC Current (mA) Peak Currents at Allowable pk−pk Ripples VDDD_18 Sourcing 1.6 1.8 2 380 2 A at 200 mV VDDD_33 Sourcing 3 3.3 3.6 105 0.6 A at 200 mV VDD_sel Sourcing 3 3.3 3.6 0 1 mA at 20 mV VDDA_33 Sourcing 3 3.3 3.6 775 1.5 A at 50 mV VDD_pix Sourcing 3 3.3 3.6 45 700 mA at 100 mV VDD_respd Sourcing 3.3 4.2 4.6 7 300 mA at 20 mV VDD_trans Sourcing 3.3 4.2 4.6 7 VDD_resfd Sourcing 3.3 4.5 4.6 7 VDD_casc Sourcing 0.9 1 1.1 0 6 mA at 300 mV Vref_colmux Sourcing & Sinking 0 0.35 A at 0.5 mV gnd_respd Sinking 30 mA sinking at 0.4 V 200 mA at 20 mV 1 0 0 1 9. Combining power supplies: • VDD_sel can be combined with either VDDD_33 or VDDA_33 • VDD_respd and VDD_trans can be grouped together as VDD_42 • gnd_respd is be designed to be a 7 mA sinking supply, but can be tied to ground with no impact to image quality Color Filter Array The VITA 25K color sensor is processed with a Bayer RGB color pattern as shown in Figure 2. Pixel (0,0) has a red filter situated to the bottom left. Green1 and green2 have a slightly different spectral response due to (optical) cross talk from neighboring pixels. Green1 pixels are located on a green-red row, green2 pixels are located on a blue-green row. Figure 3 depicts the spectral response for the mono and color devices. Figure 4 shows the photovoltaic response for the VITA 25K. Y pixel (0;0) X Figure 2. Color Filter Array for the Pixel Array www.onsemi.com 7 NOIV1SN025KA Figure 3. Mono and Color Spectral Response with Micro Lens Note that green pixels on a Green−Red (Green 1) and Green−Blue (Green 2) row have similar responsivity to wavelength trend as is depicted by the legend “Green”. Figure 4. Typical Photovoltaic Response www.onsemi.com 8 NOIV1SN025KA OVERVIEW Depending on the operating mode, eight or ten bits are fed into the data formatting block. This block adds synchronization information to the data stream based on the frame timing. The data then goes to the low voltage serial (LVDS) interface block that sends the data out through the I/O ring. On-chip programmability is controlled through the Serial Peripheral Interface (SPI). See Register Map on page 43 for register details. A bias block generates bias currents and voltages for all analog blocks on the chip. By controlling the bias current, the speed-versus-power of each block can be tuned. All biasing programmability is contained in the bias block. Figure 5 gives an overview of all functional blocks in the image sensor. The system clock is received by the LVDS clock receiver block and distributed to other blocks. The sequencer defines the sensor timing and controls the image core. The sequencer is started either autonomously (master mode) or on assertion of an external trigger (slave mode). The image core contains all pixels and readout circuits. The column structure selects pixels for readout and performs correlated double sampling (CDS) or double sampling (DS). The data comes out sequentially and is fed into the analog front end (AFE) block. The programmable gain amplifier (PGA) of the AFE adds the offset and gain. The output is a fully differential analog signal that goes to the ADC, where the analog signal is converted to a 10-bit data stream. Image Core Row Decoder Image Core Bias Pixel Array (5120 x 5120) Column Structure 64 Analog Channels Analog Front End (AFE) 64 x 10 bit Digital Channels Control and Registers Biasing and Bandgap External Resistor Data Formatting 32 x 10-bit Digital Channels LVDS Clock Receiver SPI Reset Interface Serializers & LVDS Interface 32 LVDS Channels 1 LVDS Sync Channel 1 LVDS Clock Channel LVDS Outputs/Parallel Outputs Figure 5. Block Diagram Image Core • • • The pixel array contains 5120 x 5120 readable pixels with a pixel pitch of 4.5 mm. Four dummy pixel rows and columns are placed at every side of the pixel array to eliminate possible edge effects. The sensor uses a 5T pixel architecture, which makes it possible to read out the pixel The image core consists of: Pixel array Address decoders and row drivers Pixel biasing www.onsemi.com 9 NOIV1SN025KA Analog Front End array in global shutter mode with DS, or rolling shutter mode with CDS. The function of the row drivers is to access the image array line by line, or all lines together, to reset or read the pixel data. The row drivers are controlled by the on-chip sequencer and can access the pixel array in global and rolling shutter modes. The pixel biasing block guarantees that the data on a pixel is transferred properly to the column multiplexer when the row drivers select a pixel line for readout. The AFE contains 64 channels, each containing a PGA and a 10-bit ADC. The PGA can be programmed to apply a gain of 1x, 1.39x, 1.94x, and 2.72x to the image signal. Together with the gain applied in the column multiplexer, a total signal gain of 10x can be achieved. For each of the 64 channels, a pipelined 10-bit ADC is used to convert the analog image data into a digital signal, which is delivered to the data formatting block. A black calibration loop is implemented to ensure that the black level is mapped to match the correct ADC input level. Pixel Biasing Data Formatting The data block receives data from two ADCs and multiplexes this data to one LVDS block. A cyclic redundancy check (CRC) code is calculated on the passing data. For each LVDS output channel, one data block is instantiated. An extra data block is foreseen to transmit synchronization codes such as frame start, line start, frame end, and line end indications. The data block calculates a CRC once per line for every channel. This CRC code can be used for error detection at the receiving end. Pixel Array 5120 (X) x 5120 (Y) +pixel(0;0) 4 Dummy columns 4 Dummy columns Address Decode + Row Drives 4 Dummy rows Serializer and LVDS Interface 4 Dummy rows The serializer and LVDS interface block receives the formatted (10-bit or 8-bit) data from the data formatting block. This data is serialized and transmitted by the LVDS output driver. In 10-bit mode, the maximum output data bit rate is 620 Mbps per channel. In 8-bit mode, the maximum output data bit rate is 496 Mbps per channel. In addition to the 32 LVDS data outputs, two extra LVDS outputs are available. One of these outputs carries the output clock, which is skew aligned to the output data channels. The second LVDS output contains frame format synchronization codes to serve system-level image reconstruction. Figure 6. Image Core Diagram LVDS Clock Receiver The LVDS clock receiver receives an LVDS clock signal and distributes the required clocks to the sensor. Typical input clock frequency is 310 MHz in 10-bit mode and 248 MHz in 8-bit mode. The clock input needs to be terminated with a 100 W resistor. Column Multiplexer The 5120 pixels of one image row are stored in 5120 column sample-and-hold (S/H) stages. These stages store both the reset and integrated signal levels. The data stored in the column S/H stages is read out through 64 parallel differential outputs operating at a frequency of 31 MHz. At this stage, the reset signal and integrated signal values are transferred into an FPN-corrected differential signal. A programmable gain of 1x, 2x, or 4x can be applied to the signal at this stage. The column multiplexer also supports a subsampled readout mode (read-1-skip-1 for mono and read-2-skip-2 for color version). Enabling this mode can speed up the frame rate, with a decrease in resolution. Sequencer • • • • Bias Generator • The bias generator generates all required reference voltages and bias currents that the on-chip blocks use. An external resistor of 47 kW, connected between the pins ibias_master and gnda_33 is required for the bias generator to operate properly. The sequencer is responsible for the following tasks: Controls the image core. Starts and stops integration in rolling and global shutter modes and control pixel readout. Operates the sensor in master or slave mode. Applies the window settings. Organizes readouts so that only the configured windows are read. Controls the column multiplexer and analog core. Applies gain settings and subsampling modes at the correct time, without corrupting image data. Starts up the sensor correctly when leaving standby mode. www.onsemi.com 10 NOIV1SN025KA OPERATING MODES a frame overhead time (FOT), during which the analog value on the pixel diode is transferred to the pixel memory element. After the FOT, the sensor is read out line by line and the readout of each line is preceded by the row overhead time (ROT). This sensor supports multiple operation modes. The following list provides an overview. • Global Shutter mode ♦ Pipelined global shutter mode - Master mode - Slave mode ♦ Triggered global shutter - Master mode - Slave mode • Rolling shutter mode • Multiple windowing readout ♦ Flexible window configuration ♦ Processing multiple windows in Global Shutter mode • Subsampling and binning ♦ Pixel binning ♦ Subsampling Global Shutter Mode In a global shutter mode, light integration takes place on all pixels in sync, although subsequent readout is sequential, as shown in Figure 7. Figure 8 shows the integration and readout sequence for the global shutter. All pixels are light sensitive at the same time. The whole pixel core is reset simultaneously and, after the integration time, all pixel values are sampled together on the storage node inside each pixel. The pixel core is read out line by line after integration. The integration and readout can occur in parallel or sequentially. The integration starts at a certain period, relative to the frame start. Figure 7. Global Shutter Operation Master Mode In this operation mode, the integration time is set through the register interface and the sensor integrates and reads out the images autonomously. The sensor acquires images without any user interaction. Slave Mode The slave mode adds more manual control to the sensor. The integration time registers are ignored in this mode and the integration time is instead controlled by an external pin. As soon as the control pin is asserted, the pixel array goes out of reset and integration starts. The integration continues until the user or system deasserts the external pin. Upon a falling edge of the trigger input, the image is sampled and the readout begins. Pipelined Global Shutter Mode In pipelined shutter mode, the integration and readout are done in parallel. Images are continuously read and integration of frame N is ongoing during readout of the previous frame N–1. The readout of every frame starts with Reset N Integration Time Handling Readout Handling FOT Exposure Time N FOT Readout Frame N-1 Reset N+1 FOT Exposure Time N+1 Readout Frame N FOT FOT ÉÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉÉ ÉÉÉ ÉÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉÉ ÉÉÉ ÉÉÉ É ÉÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉÉ ÉÉÉ ÉÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉÉ ÉÉÉ ÉÉÉ É ROT Line Readout Figure 8. Integration and Readout for Pipelined Shutter www.onsemi.com 11 NOIV1SN025KA External Trigger Integration Time Handling Readout Handling Reset N FOT Exposure Time N FOT Readout N−1 Reset N+1 FOT Exposure T im e N+1 Readout N FOT FOT ÉÉ É ÉÉ É ÉÉ É ÉÉ É ÉÉ É ÉÉ É ÉÉ É É ÉÉ É É ÉÉ É ÉÉ É ÉÉ É ÉÉ É ÉÉ É ÉÉ É ÉÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉ ROT Line Readout Figure 9. Pipelined Shutter Operated in Slave Mode Master Mode Triggered Global Shutter In this mode, manual intervention is required to control both the integration time and the start of readout. After the integration time, indicated by a user controlled pin, the image core is read out. After this sequence, the sensor goes to an idle mode until a new user action is detected. The three main differences from the pipelined shutter master mode are: • Upon user action, a single image is read. • Normally, integration and readout are done sequentially. However, the user can control the sensor in such a way that two consecutive batches are overlapping, that is, having concurrent integration and readout. • Integration and readout is user-controlled through an external pin. As shown in Figure 10, in the master mode a rising edge on the synchronization pin is used to trigger the start of integration and readout. The integration time is defined by a register setting. The sensor autonomously integrates during this predefined time, after which the FOT starts and the image array is read out sequentially. A falling edge on the synchronization pin does not have any impact on the readout or integration and subsequent frames are started again for each rising edge. Slave Mode Integration time control is identical to the pipelined shutter slave mode, in which both integration time and readout requests are controlled by an external trigger. An external synchronization pin controls the start of integration. The moment it is deasserted, the FOT starts. At this time, the analog value on the pixel diode is transferred to the pixel memory element and the image readout can start. A request for a new frame is started when the synchronization pin is asserted again. The triggered global mode can also be controlled in a master or in a slave mode. No effect on falling edge External Trigger Integration Time Handling Reset N Exposure Time N FOT Reset N+1 Exposure Time N+1 FOT Register Controlled Readout Handling ÉÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉÉ ÉÉÉ ÉÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉÉ ÉÉÉ É ÉÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉÉ ÉÉÉ ÉÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉÉ ÉÉÉ É FOT ROT Readout N-1 FOT Readout N Line Readout Figure 10. Triggered Shutter Operated in Master Mode www.onsemi.com 12 FOT NOIV1SN025KA Rolling Shutter Mode In rolling shutter mode, a second pointer indicates the rows that need to be reset for the rolling shutter mechanism. The distance between the reset pointer and the readout pointer determines the integration time. The VITA 25K supports dynamic exposure time updates without artifacts or interrupting the image data stream. The sensor also supports the rolling shutter mode. The shutter mechanism is an electronic rolling shutter and the sensor operates in streaming mode similar to a video. This mechanism is controlled by the on-chip sequencer logic. There are two Y pointers, as indicated in Figure 11. One of them points to the row that is to be reset for rolling shutter operation and the other points to the row to be read out. Functionally, a row is reset first and selected for readout later. The time elapsed between these two operations is the exposure time. Figure 11 schematically indicates the relative shift of the integration times of different lines during rolling shutter operation. Each row is read and reset sequentially, as described in the previous paragraph. Each row in a particular frame is integrated for the same time, but all lines in a frame ‘see’ a different stare time. Therefore, fast horizontal moving objects in the field of view give rise to motion artifacts in the image; this is an unavoidable property of a rolling shutter. Figure 11. Rolling Shutter Operation www.onsemi.com 13 NOIV1SN025KA SENSOR OPERATION Operation Flowchart The states above are ordered by power dissipation. Clearly, in ‘power-off’ state the power dissipation will be minimal; in ‘running’ state the power dissipation will be maximal. On the other hand, the lower the power consumption, the more actions (and time) are required to put the sensor in ‘running’ state and grabbing images. This flowchart provides the trade-offs between power saving and enabling time of the sensor. Next to the ‘states’ a set of ‘user actions’, indicated by arrows, are included in the flow chart diagram. These user actions make it possible to move from one state to another. Figure 12 shows the flow chart diagram of the sensor operation. The sensor can be in five different ‘states’. Every state is indicated with the oval circle. These states are: • Power-Off • Standby (1) • Standby (2) • Idle • Running Figure 12. VITA 25K Sensor Operation Flow www.onsemi.com 14 NOIV1SN025KA The sensor can be in five different states: LVDS clock Power-off In this state, the sensor is inactive. All power supplies are down and the power dissipation is zero. reset_n vddd_18 Standby (1) The registers below address 40 can be configured. vddd_33 vdda_33 Standby (2) In this standby state all SPI registers are active, meaning that all SPI registers can be accessed for read and write operations. All other blocks are disabled. Note: An Intermediate Standby state is traversed after a hard reset. In this state the sensor contains the default configurations. Uploads of reserved registers are required to traverse to the Standby (2) state vdd_casc other supplies > 10us > 10us > 10us > 10us > 10us > 10us Figure 13. Power−up Procedure NOTE: vdd_casc should come up prior to vdd_respd, vdd_resfd, and vdd_trans. The required input clock frequency depends on the word depth mode of the sensor. This is possible in the following mode: • 8-bit • 10-bit Idle In the idle state, all sensor clocks are running and all blocks are enabled, except the sequencer block. The sensor is ready to start grabbing images as soon as the sequencer block is enabled. Running In running state, the sensor is enabled and grabbing images. The sensor can be operated in different rolling/global master/slave modes. The input clock frequencies to achieve a frame rate of 53 frames/s are listed in Table 7. Table 7. CLOCK FREQUENCY OVERVIEW User Actions: Functional Mode to Power Up Sequences To ‘travel’ between the five possible states, a set of actions is defined. Except for the power-up and power-down sequences, all actions consist of a set of SPI uploads. The “Sensor reconfiguration actions” indicated in Figure 12 are used to reconfigure the operation modes of the sensor. The sensor state itself is not altered. Parameter 8−bit Mode 10−bit Mode Input Clock Frequency 248 MHz 310 MHz Enable Clock Management The next step consists of SPI uploads which configures the internal clock distribution. The required uploads are listed in Table 8. It is important to follow the upload sequence as listed. Power-up Sequence Figure 13 shows the power-up timing of the sensor. Apply all power supplies in the order shown in the figure. It is important to comply with the described sequence. Any othyer supply ramping sequence may lead to high current peaks and, as consequence, a failure of the sensor power up When all the supplies are stable, enable the sensor clock signal; then deassert the reset_n signal. After leaving the hard-reset mode, the sensor enters the standby (1) state. To go to the standby (2) mode, the sensor requires the reconfiguration of some registers. This reconfiguration can be applied 10 ms after the hard reset is released. Table 8. ENABLE CLOCK MANAGEMENT UPLOAD No. Address Data 1 2 0x0000 NOIV1SN025KA 0x0001 NOIV1SE025KA 2 32 0x2002 Configure Clock Management 3 34 0x0001 Enable Logic Blocks www.onsemi.com 15 Description NOIV1SN025KA Required Register Uploads In this phase the ’reserved’ register settings are uploaded through the SPI register. Different settings are not allowed and may cause the sensor to malfunction. The required uploads are listed in Table 9. Table 11. ENABLE SEQUENCER REGISTER UPLOADS No. Address Data Description 1 192[0] 0x1 Set ‘reg_seq_enable’ to ‘1’. All other configuration bits of register 192 should remain unchanged. Table 9. REQUIRED REGISTER UPLOADS No. Address Data Description 1 65 0x008B General Biasing 2 66 0x53C6 AFE Biasing 3 67 0x0844 Mux Biasing 4 68 0x0086 LVDS Biasing 5 128 0x4520 Set desired output level to code 32 for 10-bit mode, code 8 for 8-bit mode. Set number of samples for black calibration to 25. 6 204 0x09E5 Configure unity gain 7 224 0x3E04 Dummy rows upon integration start 8 225 0x6733 Configure internal latency 9 129[13] 0x0 10-bit Mode 0x1 8-bit Mode 10 447 0x0BF1 Configure sequencer 11 448 0x0BC3 Configure sequencer User Actions: Functional Mode to Power Down Sequences Disable Sequencer During the ‘Disable Sequencer’-action, the frame grabbing sequencer is stopped. The sensor will stop grabbing images and returns to the idle mode. The ‘Disable Sequencer’ action consists of a set op register uploads. The required uploads are listed in Table 12. Table 12. DISABLE SEQUENCER REGISTER UPLOADS Data 1 32 0x2003 Enable Analog Clock Distribution 2 64 0x0001 Enable Biasing Block 3 40 0x0003 Enable Column Multiplexer 4 48 0x0001 Enable Analog Front-End (AFE) 5 112 0x0007 Enable LVDS Transmitters Data 1 192[0] 0x0 Description Disable of Sequencer. NOTE: This address contains other configuration bits to select the operation mode. Table 13. SOFT POWER DOWN REGISTER UPLOADS Table 10. SOFT POWER UP REGISTER UPLOADS Address Address Soft Power Down During the soft power-down action, the internal blocks are disabled and the sensor is put in standby state in order to reduce the current dissipation. This action exists of a set of register uploads. The soft power-down uploads are listed in Table 13. Soft Power Up During the soft power-up action, the internal blocks are enabled and prepared to start processing the image data stream. This action exists of a set of SPI uploads. The soft power-up uploads are listed in Table 10. No. No. Description No. Address Data Description 1 112 0x0000 Disable LVDS Transmitters 2 48 0x0000 Disable Analog Front-End (AFE) 3 40 0x0000 Disable Column Multiplexer 4 64 0x0000 Disable Biasing Block 5 32 0x2002 Disable Analog Clock Distribution Disable Clock Management The ‘Disable Clock Management’-action stops the internal clocking in order to further decrease the power dissipation. This action exists of a set of register uploads as listed in Table 14. Enable Sequencer During the ‘Enable Sequencer’-action, the frame grabbing sequencer is enabled. The sensor will start grabbing images in the configured operation mode. Refer to Operating Modes on page 11 for an overview of the possible operation modes. The ‘Enable Sequencer’ action consists of a set op register uploads. The required uploads are listed in Table 11. Table 14. DISABLE CLOCK MANAGEMENT UPLOADS No. Address Data 1 34 0x0000 www.onsemi.com 16 Description Disable Logic Blocks NOIV1SN025KA Power-down Sequence The timing diagram of the advised power-down sequence is given in Figure 14. Any other sequence might cause high peak currents. NOTE: vdd_casc should be powered down after vdd_respd, vdd_resfd, and vdd_trans. Table 15. SHUTTER/OPERATION MODE CONFIGURATION REGISTERS Address Default Value 192 [1] 0x0 Shutter type selection 0: Global shutter 1: Rolling shutter 192 [4] 0x0 Triggered mode selection (global shutter only) 0: Normal mode 1: Triggered mode 192 [5] 0x0 Master/Slave selection (global shutter only) 0: Master mode 1: Slave mode 192 [7] 0x0 Subsampling mode selection 0: Subsampling disabled 1: Subsampling enabled 192 [8] 0x0 Binning mode selection 0: Binning disabled 1: Binning enabled LVDS clock reset_n vddd_18 vddd_33 vdda_33 vdd_casc other supplies > 10u s > 1 0us > 10us > 10 us > 10us > 10us Figure 14. Power−down Sequence Shutter and Operation Mode Reconfiguration The VITA 25K sensor operates in two shutter modes: global shutter and rolling shutter. The global shutter mode can be combined with a set of operation modes, as described Operation Modes on page 11. These modes can be combined with subsampling and binning modes. The shutter and operation modes are controlled by register 192, when the sensor is in standby or idle mode. Table 15 gives an overview of the available register settings to control the shutter and operation modes. During this action, only the fields listed in Table 15 are affected. All other settings encapsulated in register 192 must remain unchanged. Description Windowing Reconfiguration The windowing settings can be configured during standby, idle, and running mode. The required regions of interest (ROI) can be programmed in the roi_configuration registers (addresses 256 up to 351). Registers roi_active0 and roi_active1 are used to activate the desired ROIs. Default window configuration (after sensor reset) is one window, full frame (window #0). Exposure/Gain Reconfiguration The exposure time and gain settings can be configured during standby, idle, and running mode. Refer to Signal Gain Path on page 29 for more information. www.onsemi.com 17 NOIV1SN025KA Sensor Configuration Static Readout Parameters Some registers are only modified when the sensor is not acquiring images. Reconfiguration of these registers while images are acquired can cause corrupted frames or even interrupt the image acquisition. Therefore, it is recommended to modify these static configurations while the sequencer is disabled (register 192[0] = 0). The registers shown in Table 16. Table 16 should not be reconfigured during image acquisition. A specific configuration sequence applies for these registers. Refer to the operation flow and startup description. This device contains multiple configuration registers. Some of these registers can only be configured while the sensor is not acquiring images (while register 192[0] = 0), while others can be configured while the sensor is acquiring images. For the latter category of registers, it is possible to distinguish the register set that can cause corrupted images (limited number of images containing visible artifacts) from the set of registers that are not causing corrupted images. These three categories are described here. Table 16. STATIC READOUT PARAMETERS Group Addresses Description Clock generator 32 Configure according to recommendation Image core 40 Configure according to recommendation AFE 48 Configure according to recommendation Bias 64–71 Configure according to recommendation LVDS 112 Configure according to recommendation Sequencer mode selection 192 • • • • All reserved registers Rolling shutter enable triggered_mode slave_mode nzrot_xsm_delay_enable Keep reserved registers to their default state, unless otherwise described in the recommendation during and after the reconfiguration. A corrupted image is an image containing visible artifacts. A typical example of a corrupted image is an image which is not uniformly exposed The effect is transient in nature and the new configuration is applied after the transient effect. Dynamic Configuration Potentially Causing Image Artifacts The category of registers as shown in Table 17 consists of configurations that do not interrupt the image acquisition process, but may lead to one or more corrupted images Table 17. DYNAMIC CONFIGURATION POTENTIALLY CAUSING IMAGE ARTIFACTS Group Addresses Description Black level configuration 128–129 197[8] Reconfiguration of these registers may have an impact on the black-level calibration algorithm. The effect is a transient number of images with incorrect black level compensation. Sync codes 129[13] 130–135 Incorrect sync codes may be generated during the frame in which these registers are modified. Datablock test configurations 144–150 Modification of these registers may generate incorrect test patterns during a transient frame. Some reconfiguration may lead to one frame being blanked. This happens when the modification requires more than one frame to settle. The image is blanked out and training patterns are transmitted on the data and sync channels. Dynamic Readout Parameters It is possible to reconfigure the sensor while it is acquiring images. Frame-related parameters are internally resynchronized to frame boundaries, such that the modified parameter does not affect a frame that has already started. However, there can be restrictions to some registers as shown in Table 18. www.onsemi.com 18 NOIV1SN025KA Table 18. DYNAMIC READOUT PARAMETERS Group Addresses Subsampling/binning 192[7] 192[8] Description Subsampling or binning is synchronized to a new frame start. Black lines 197 Reconfiguration of these parameters causes one frame to be blanked out in rolling shutter operation mode, as the reset pointers need to be recalculated for the new frame timing. No blanking in global shutter mode Dummy lines 198 Reconfiguration of these parameters causes one frame to be blanked out in rolling shutter operation mode, as the reset pointers need to be recalculated for the new frame timing. N/A for global shutter mode. ROI configuration 195-196 256–351 Optionally, it is possible to blank out one frame after reconfiguration of the active ROIs in rolling shutter mode. Therefore, register 206[8] must be asserted (blank_roi_switch configuration). An ROI switch is only detected when a new window is selected as the active window (reconfiguration of registers 195, 196, or both). Reconfiguration of the ROI dimension of the active window does not lead to a frame blank and can cause a corrupted image. Exposure reconfiguration 199-201 Exposure reconfiguration does not cause artifact. However, a latency of one frame is observed unless reg_seq_exposure_sync_mode is set to ‘1’ in triggered global mode (master). 204 Gains are synchronized at the start of a new frame. Optionally, one frame latency can be incorporated to align the gain updates to the exposure updates (refer to register 204[13] gain_lat_comp). Gain reconfiguration Figure 15 shows a reconfiguration that does not use the sync_configuration option. As depicted, new SPI configurations are synchronized to frame boundaries. With sync_configuration = ‘1’. Configurations are synchronized to the frame boundaries (The registers exposure, fr_length, and mult_timer are not used in this mode) Figure 16 shows the usage of the sync_configuration settings. Before uploading a set of registers, the corresponding sync_configuration is deasserted. After the upload is completed, the sync_configuration is asserted again and the sensor resynchronizes its set of registers to the coming frame boundaries. As seen in the figure, this ensures that the uploads performed at the end of frame N+2 and the start of frame N+3 become active in the same frame (frame N+4). Freezing Active Configurations Though the readout parameters are synchronized to frame boundaries, an update of multiple registers can still lead to a transient effect in the subsequent images, as some configurations require multiple register uploads. For example, to reconfigure the exposure time in master global mode, both the fr_length and exposure registers need to be updated. Internally, the sensor synchronizes these configurations to frame boundaries, but it is still possible that the reconfiguration of multiple registers spans over two or even more frames. To avoid inconsistent combinations, freeze the active settings while altering the SPI registers by disabling synchronization for the corresponding functionality before reconfiguration. When all registers are uploaded, re-enable the synchronization. The sensor’s sequencer then updates its active set of registers and uses them for the coming frames. The freezing of the active set of registers can be programmed in the sync_configuration registers, which can be found at the SPI address 206. Time Line Frame NFrame N+1 Frame N+2 Frame N+3 Frame N+4 SPI Registers Active Registers Figure 15. Frame Synchronization of Configurations (no freezing) www.onsemi.com 19 NOIV1SN025KA Frame NFrame N+1 Frame N+2 Frame N+3 Frame N+4 Time Line sync_configuration This configuration is not taken into account as sync_register is inactive. SPI Registers Active Registers Figure 16. Reconfiguration Using Sync_configuration NOTE: SPI updates are not taken into account while sync_configuration is inactive. The active configuration is frozen for the sensor. Table 19 lists the several sync_configuration possibilities along with the respective registers being frozen. Table 19. ALTERNATE SYNC CONFIGURATIONS Group Affected Registers Description sync_rs_x_length rs_x_length Update of x-length configuration (rolling shutter only) is not synchronized at start of frame when ‘0’. The sensor continues with its previous configurations. sync_black_lines black_lines Update of black line configuration is not synchronized at start of frame when ‘0’. The sensor continues with its previous configurations. sync_dummy_lines sync_exposure sync_gain sync_roi dummy_lines Update of dummy line configuration is not synchronized at start of frame when ‘0’. The sensor continues with its previous configurations. mult_timer fr_length exposure Update of exposure configurations is not synchronized at start of frame when ‘0’. The sensor continues with its previous configurations. mux_gainsw afe_gain Update of gain configurations is not synchronized at start of frame when ‘0’. The sensor continues with its previous configurations. roi_active0[15:0] roi_active1[15:0] subsampling binning Update of active ROI configurations is not synchronized at start of frame when ‘0’. The sensor continues with its previous configurations. Note: The window configurations themselves are not frozen. Re-configuration of active windows is not gated by this setting. Window Configuration different windows might result in a corrupted frame. This is inherent in the rolling shutter mechanism, where each line must be reset sequentially before being read out. This corrupted window can be blanked out by setting register 206[8]. In this case, a dead time is noted on the LVDS interface when the window-switch occurs in the sensor. During this blank out, training patterns are sent out on the data and sync channels for the duration of one frame. Global Shutter Mode Up to 32 windows can be defined in global shutter mode (pipelined or triggered). The windows are defined by registers 256 to 351. Each window can be activated or deactivated separately using registers 195 and 196. It is possible to reconfigure the inactive windows while acquiring images. Switching between prederfined windows is achieved by activation of the respective windows. This way a minimum number of registers need to be uploaded when it is necessary to switch between two or more sets of windows. As an example of this, scanning the scene at higher frame rates using multiple windows and switching to full frame capture when the object is tracked. Switching between the two modes only requires an upload of one (if the total number of windows is smaller than 17) or two (if more than 16 windows are defined) registers. Black Calibration The sensor automatically calibrates the black level for each frame. Therefore, the device generates a configurable number of electrical black lines at the start of each frame. The desired black level in the resulting output interface can be configured and is not necessarily targeted to ‘0’. Configuring the target to a higher level yields some information on the left side of the black level distribution, while the other end of the distribution tail is clipped to ‘0’ when setting the black level target to ‘0’. The black level is calibrated for the 64 columns contained in one kernel. This implies 64 black level offsets are generated and applied to the corresponding columns. Configurable parameters for the black-level algorithm are listed in Table 20. Rolling Shutter Mode In rolling shutter mode it is not possible to read multiple windows. Do not activate more than one window (registers 205–206). However, it is possible to configure more than one window and dynamically switch between the different window configurations. Note that switching between two www.onsemi.com 20 NOIV1SN025KA Table 20. CONFIGURABLE PARAMETERS FOR BLACK LEVEL ALGORITHM Group Addresses Description black_lines This register configures the number of black lines that are generated at the start of a frame. At least one black line must be generated. The maximum number is 255. Note: When the automatic black-level calibration algorithm is enabled, make sure that this register is configured properly to produce sufficient black pixels for the black-level filtering. The number of black pixels generated per line is dependent on the operation mode and window configurations: Global Shutter - Each black line contains 80 kernels. Rolling Shutter - As the line length is fundamental for rolling shutter operation, the length of a black line is defined by the active window. gate_first_line When asserting this configuration, the first black line of the frame is blanked out and is not used for black calibration. It is recommended to enable this functionality, because the first line can have a different behavior caused by boundary effects. When enabling, the number of black lines must be set to at least two in order to have valid black samples for the calibration algorithm. auto_blackcal_enable Internal black-level calibration functionality is enabled when set to ‘1’. Required black level offset compensation is calculated on the black samples and applied to all image pixels. When set to ‘0’, the automatic black-level calibration functionality is disabled. It is possible to apply an offset compensation to the image pixels, which is defined by the registers 129[10:1]. Note: Black sample pixels are not compensated; the raw data is sent out to provide external statistics and, optionally, calibrations. 129[9:1] blackcal_offset Black calibration offset that is added or subtracted to each regular pixel value when auto_blackcal_enable is set to ‘0’. The sign of the offset is determined by register 129[10] (blackcal_offset_dec). Note: All channels use the same offset compensation when automatic black calibration is disabled. The calculated black calibration factors are frozen when this register is set to 0x1FF (all−‘1’) in auto calibration mode. Any value different from 0x1FF re−enables the black calibration algorithm. This freezing option can be used to prevent eventual frame to frame jitter on the black level as the correction factors are recalculated every frame. It is recommended to enable the black calibration regularly to compensate for temperature changes. 129[10] blackcal_offset_dec Sign of blackcal_offset. If set to ‘0’, the black calibration offset is added to each pixel. If set to ‘1’, the black calibration offset is subtracted from each pixel. This register is not used when auto_blackcal_enable is set to ‘1’. black_samples The black samples are low-pass filtered before being used for black level calculation. The more samples are taken into account, the more accurate the calibration, but more samples require more black lines, which in turn affects the frame rate. The effective number of samples taken into account for filtering is 2black_samples. Note: An error is reported by the device if more samples than available are requested (refer to registers 136 to 139). Black Line Generation 197[7:0] 197[8] Black Value Filtering 129[0] 128[10:8] Black Level Filtering Monitoring 136 137 138 139 blackcal_error0 blackcal_error1 blackcal_error2 blackcal_error3 An error is reported by the device if there are requests for more samples than are available (each bit corresponding to one data path). The black level is not compensated correctly if one of the channels indicates an error. There are three possible methods to overcome this situation and to perform a correct offset compensation: • Increase the number of black lines such that enough samples are generated at the cost of increasing frame time (refer to register 197). • Relax the black calibration filtering at the cost of less accurate black level determination (refer to register 128). • Disable automatic black level calibration and provide the offset via SPI register upload. Note that the black level can drift in function of the temperature. It is thus recommended to perform the offset calibration periodically to avoid this drift. NOTE: The maximum number of samples taken into account for black level statistics is half the number of kernels. www.onsemi.com 21 NOIV1SN025KA Serial Peripheral Interface significant bit first. The sck clock is passed through to the sensor as indicated in Figure 17. The sensor samples this data on a rising edge of the sck clock (mosi needs to be driven by the system on the falling edge of the sck clock) 3. The tenth bit sent by the master indicates the type of transfer: high for a write command, low for a read command. 4. Data transmission: - For write commands, the master continues sending the 16-bit data, most significant bit first. - For read commands, the sensor returns the requested address on the miso pin, most significant bit first. The miso pin must be sampled by the system on the falling edge of sck (assuming nominal system clock frequency and maximum 10 MHz SPI frequency). 5. When data transmission is complete, the system deselects the sensor one clock period after the last bit transmission by pulling ss_n high. Maximum frequency for the SPI is 1/30th (in 10-bit mode) and 1/24th (in 8-bit mode) of the LVDS input clock frequency. For nominal input frequency (310 MHz / 248 MHz), this is 10 MHz. Bursts of SPI commands can be issued by leaving at least two SPI clock periods between two register uploads. Deselect the chip between the SPI uploads by pulling the ss_n pin high. The sensor configuration registers are accessed through an SPI. The SPI consists of four wires: • sck: Serial Clock • ss_n: Active Low Slave Select • mosi: Master Out, Slave In, or Serial Data In • miso: Master In, Slave Out, or Serial Data Out The SPI is synchronous to the clock provided by the master (sck) and asynchronous to the sensor’s system clock. When the master wants to write or read a sensor’s register, it selects the chip by pulling down the Slave Select line (ss_n). When selected, data is sent serially and synchronous to the SPI clock (sck). Figure 17 shows the communication protocol for read and write accesses of the SPI registers. The VITA 25K sensor uses 9-bit addresses and 16-bit data words Data driven by the system is colored blue in Figure 17, while data driven by the sensor is colored yellow. The data in grey indicates high-Z periods on the miso interface. Red markers indicate sampling points for the sensor (mosi sampling); green markers indicate sampling points for the system (miso sampling during read operations). The access sequence is: 1. Select the sensor for read or write by pulling down the ss_n line. 2. One SPI clock cycle (100 ns) after selecting the sensor, the 9-bit address is transferred, most SP I − W R ITE ss_n t_sssck t_sc ks s ts ck sck ts _mos i mo si A8 th_mosi A7 .. .. .. A1 A0 `1' D15 D14 .. .. .. .. D1 D0 miso SPI − REA D ss_n t_sssck t_sc ks s ts ck sck ts_mosi mo si A8 th_mosi A7 .. .. .. A1 A0 `0' ts _mi so miso D15 th_mi so D14 .. .. Figure 17. SPI Read and Write Timing Diagram www.onsemi.com 22 .. .. D1 D0 NOIV1SN025KA Table 21. SPI TIMING REQUIREMENTS Group Addresses Description Units 100 (*) ns ss_n low to sck rising edge tsck ns tsckss sck falling edge to ss_n high tsck ns ts_mosi Required setup time for mosi 20 ns th_mosi Required hold time for mosi 20 ns ts_miso Setup time for miso tsck/2-10 ns th_miso Hold time for miso tsck/2-20 ns tspi Minimal time between two consecutive SPI accesses (not shown in figure) 2 x tsck ns tsck sck clock period tsssck *Value indicated is for nominal operation. The maximum SPI clock frequency depends on the sensor configuration (operation mode, input clock). tsck is defined as 1/fSPI. See text for more information on SPI clock frequency restrictions. www.onsemi.com 23 NOIV1SN025KA IMAGE SENSOR TIMING AND READOUT Global Shutter Mode exposure time. The length of the exposure time is defined by the registers exposure and mult_timer. NOTES: • The start of the exposure time is synchronized to the start of a new line (during ROT) if the exposure period starts during a frame readout. Therefore, the effective time during which the image core is in a reset state is extended to the start of a new line. • Make sure that the sum of the reset time and exposure time exceeds the time required to read out all lines. If this is not the case, the exposure time is extended until all (active) lines are read out. Pipelined Global Mode (Master) The sensor timing in master global shutter mode is controlled by the user by means of configuration registers. One can distinguish three parameters for the frame timing in global shutter mode: • Image Array Reset Length • Integration Time • Frame Length The relation between these parameters is: Frame Length = Reset Length + Integration Time The FOT time needs to be added to the frame length parameter to determine the total frame Time Total Frame Time = FOT Time + Frame Length Frame and integration time configuration can be controlled in two ways: 1. fr_mode = 0x0 The reset length and integration time is configured by the user. The sensor shall calculate the frame length as the sum of both parameters. 2. fr_mode = 0x1 The frame length and integration time is configured by the user. The reset time during which the pixels are reset, is calculated by the sensor as being the difference between the frame length and the desired integration time. The configuration registers are exposure[15:0] and fr_length[15:0]. The latter configuration registers is either used as Reset Length configuration (fr_mode = 0x0) or as Frame Length (fr_mode = 0x’1). The granularity of both registers is defined by the mult_timer[15:0] register and is expressed in number of 62 MHz cycles (16.129 ns nominal). Frame Length and Integration Time as Parameters When fr_mode is configured to 0x1, one configures the frame time and exposure. The reset_length is determined by the sequencer. This configuration mode is depicted in Figure 2. The frame length is configured in register fr_length, while the integration time is configured in register exposure. The mult_timer register defines granularity of both settings. Note that the FOT needs to be added to the configured fr_length to calculate the total frame time. Triggered Global Shutter (Master) In master triggered global mode, the start of integration time is controlled by a rising edge on the trigger pin. The exposure or integration time is defined by the registers exposure and mult_timer, similar to the master pipelined global mode. The fr_length configuration is not used. This operation is graphically shown in Figure 20. NOTES: • The falling edge on the trigger pin does not have any impact. However, the trigger must be asserted for at least 100 ns. • The start of the exposure time is synchronized to the start of a new line (during ROT) if the exposure period starts during a frame readout. Therefore, the effective time during which the image core is in reset state is extended to the start of a new line. • The trigger pin needs to be kept low during the FOT. The monitor pins can be used as a feedback to the FPGA/controller (eg. use monitor0, indicating the very first line when monitor_select = 0x5 − a new trigger can be initiated after a rising edge on monitor0). Reset Length and Integration Time as Parameters The reset time for the pixel array is controlled by the registers fr_length[15:0] and exposure[15:0]. The mult_timer configuration defines the granularity of the registers fr_length and exposure and is to be read as the number of 62 MHz cycles (16.129 ns nominal). The exposure control for pipelined global master mode is depicted in Figure 18. The pixel values are transferred to the storage node during the FOT, after which all photo diodes are reset. The reset state remains active for a certain time, defined by the fr_length and mult_timer registers, as shown in the figure. Meanwhile, the image array is read out line by line. After this reset period, the global photodiode reset condition is abandoned. This indicates the start of the integration or If the exposure timer expires before the end of readout, the exposure time is extended until the end of the last active line. www.onsemi.com 24 NOIV1SN025KA Frame N Exposure State FOT Readout FOT Reset Frame N+1 Integrating FOT Reset Integrating FOT FOT FOT Image Array Global Reset fr_length exposure = ROT = Readout Figure 18. Integration Control for Pipelined Global Shutter Mode (Master, fr_mode = 0x0) Frame N Exposure State FOT Readout FOT Reset Frame N+1 Integrating FOT Reset Integrating FOT FOT FOT Image Array Global Reset exposure x mult_timer fr_length x mult_timer = ROT = Readout Figure 19. Integration Control for Pipelined Global Shutter Mode (Master, fr_mode = 0x1) Frame N Exposure State FOT Reset Integrating FOT Reset Integrating FOT (No effect on falling edge ) trigger0 Readout Frame N+1 FOT FOT FOT Image Array Global Reset exposure x mult_timer = ROT = Readout Figure 20. Exposure Time Control in Triggered Global Mode (Master) Triggered Global Shutter (Slave) Exposure or integration time is fully controlled by means of the trigger pin in slave mode. The register’s fr_length, exposure, and mult_timer are ignored by the sensor. A rising edge on the trigger pin indicates the start of the exposure time, while a falling edge initiates the transfer and readout of the image array. In other words, the high time of the trigger pin indicates the integration time, the period of the trigger pin indicates the frame time. The use of the trigger during slave mode is shown in Figure 21. NOTES: • The start of the exposure time is synchronized to the start of a new line (during ROT) if the exposure period • • starts during a frame readout. Therefore, the effective time during which the image core is in a reset state is extended to the start of a new line. If the trigger is deasserted before the end of readout, the exposure time is extended until the end of the last active line. Consequently the FOT and start of frame readout is postponed accordingly. The trigger pin needs to be kept low during the FOT. The monitor pins can be used as a feedback to the FPGA/controller (eg. use monitor0, indicating the very first line when monitor_select = 0x5 − a new trigger can be initiated after a rising edge on monitor0). www.onsemi.com 25 NOIV1SN025KA Frame N Exposure State FOT Reset Frame N+1 Integrating FOT Reset Integrating FOT trigger Readout FOT FOT FOT Image Array Global Reset = ROT = Readout Figure 21. Exposure Time Control in Global−Slave Mode Rolling Shutter Mode The rolling shutter exposure mechanism is graphically shown in Figure 22. The duration of one line is the sum of ROT and the time required to read out one line (depending on the number of active kernels in the window). Optionally, this readout time can be extended by the configuration rs_x_length. This register, expressed in number of periods of the logic clock (16.129 ns nominal), determines the length of the x-readout. However, the minimum length is governed by the window size (x-size). The exposure time during rolling shutter mode is always an integer multiple of line-times. The exposure time is defined by the register exposure and expressed in number of lines. The register fr_length and mult_timer are not used in this mode. The maximum exposure time is limited by the frame time. It is possible to increase the exposure time at the cost of the frame rate by adding so called dummy lines. A dummy line lasts for the same time as a regular line, but no pixel data is transferred to the system. The number of dummy lines is controlled by the register dummy_lines. ÉÉÉ ÉÉÉ Frame N Readout reset line y-start Frame N+1 reset line y-start+1 reset line y-start+2 ... exposure (#lines) exposure (#lines) = ROT ÉÉ = Readout = Readout Dummy Line (blanked) NOTE: This figure illustrates a short frame with a few dummy lines. Figure 22. Integration Control in Rolling Shutter Mode www.onsemi.com 26 ÉÉ ÉÉ NOIV1SN025KA ADDITIONAL FEATURES Multiple Window Readout 5120 pixels The sequencer supports multiple window readout. This means that small ROIs, which are read out sequentially, can be defined in the full image array. Therefore, the sequencer scans all requested kernels line by line. y1_end ROI 1 y0_end 5120 pixels Window Configuration y1_start 5120 pixels ROI 0 y-end y0_start 5120 pixels ROI 0 y-start x0_start x0_end x1_start x1_end Figure 24. Overlapping Multiple Window Configuration For each line to be scanned, the sequencer control block analyzes which windows must be read out, from left to right. The following restrictions apply to the window configurations (they must be valid for each line): • For each line, the windows are ordered from left to right, based on their x-start address: x_start_roi(i) £ x_start_roi(j) where j > i • Overlapping in the x-direction is restricted to simple window overlapping schemes. When a new window is started, it needs to continue at least until the end of the previous window. In other words, it is not possible to start a window M, overlap with a window M+1, and at the end of window M+1, re-enter window M. The end of window M+1 must coincide or be larger than the end of window M: x_end_roi(i) £ x_end_roi(j) where j > i • For subsampling and binning modes, the start addresses are restricted to even addresses; the end addresses are restricted to even addresses for subsampling and odd addresses for binning. Erroneous start and end addresses are corrected by the sensor logic. • There are no restrictions on the y-start and y-end addresses for normal readout. x-start x-end Figure 23. Region of Interest Configuration Figure 23 shows the four parameters defining a region of interest (ROI). These parameters are explained here. • x-start[6:0] x-start defines the x-starting point of the desired window. The sensor reads out 64 pixels in a single clock cycle. Therefore, the granularity for configuring the x-start position is also 64 pixels. To find the corresponding column in the pixel array, multiply the value in the x-start register by 64. • x-end[6:0] This register defines the window end point on the x-axis. As for x-start, the granularity for this configuration is one kernel. x-end must be larger than x-start. The minimal window width is two kernels. • y-start[12:0] This is the start line of the readout window. The granularity of this setting is one line. • y-end[12:0] This is the end line of the readout window. y-end must be configured larger than y-start. This setting has the same granularity as the y-start configuration. Processing Multiple Windows Global Shutter The multiple windowing mechanism described in this section is only valid for the global shutter operation mode. The sequencer control block houses two sets of counters to construct the image frame. As previously described, the y-counter indicates the line that needs to be read out and is incremented at the end of each line. For the start of the frame, the y-counter is initialized to the y-start address of the first window. It runs until the y-end address of the last window The configuration width of the required settings is mentioned between brackets. Seven bits are required for the x boundaries, 13 bits for the y boundaries. Up to 32 windows can be defined, possibly (partially) overlapping. Figure 24 illustrates the use of overlapping windows. Note that pixel (0,0) is located in the left bottom corner. www.onsemi.com 27 NOIV1SN025KA to be read out. Note that the last window is configured by the configuration registers and is not necessarily window #31. The x-counter starts counting from the x-start address of the window with the lowest ID that is active on the addressed line. Only windows in which the current y-address is enclosed are taken into account for scanning. Other windows are skipped. • Rolling Shutter Multiple windowing is not supported in rolling shutter mode. Only single-window readout is possible. The active window can be selected among the 32 windows in the configuration. Dynamic window reconfiguration (or dynamic selection of a different window configuration) is supported. Eventual corrupted images due to transients are blanked out in the sensor. ROI 2 ys ROI 3 line addressed. This window is not necessarily window #0. The x-pointer is not necessarily incremented by one each cycle. At the end of a window it can jump to the start of the next window. ROI 4 ROI 1 Subsampling and Binning Pixel binning and subsampling methods are used as way of decimating the image. The number of pixel samples is reduced by a factor of four, while the optical area is maintained. ROI 0 Pixel Binning Pixel binning is a technique in which different pixels belonging to a rectangular bin are averaged in the analog domain. Two-by-two pixel binning is implemented in the VITA 25K sensor. This implies that two adjacent pixels are averaged both in column and row. Binning is configurable using a register setting. Pixel binning is not supported on VITA 25K color option. Note: register 194[9] needs to be configured to 0x1 for 2x2 pixel binning. When configuring to 0x0, 2x1 binning is obtained (binning in x only). Figure 25. Scanning the Image Array with Five Subwindows Figure 25 illustrates a practical example of a configuration with five windows. The current position of the read pointer (ys) is indicated by a red line crossing the image array. For this position, three windows need to be read out. The initial start position for the x-kernel pointer is the x-start configuration of ROI1. Kernels are scanned up to the ROI3 x-end position. From there, the x-pointer jumps to the next window, which is ROI4 in this illustration. When reaching ROI4’s x-end position, the read pointer is incremented to the next line and xs is reinitialized to the starting position of ROI1. NOTES: • The initial starting point for the readout pointer at the start of a frame is the y-start position of the first active window. • The read pointer is not necessarily incremented by one, but depending on the configuration, it can jump in y-direction. For Figure 25, this is the case when reaching the end of ROI0 where the read pointer jumps to the y-start position of ROI1. • The x-pointer starting position is equal to the x-start configuration of the first active window on the current Subsampling Subsampling is obtained by adapting the readout sequence. In subsampling mode, both lines and pixels are read in a read-N-skip-N mode. This reduces the number of lines in a frame and the number of pixels in a line. Overall frame time is reduced by a factor 4. The monochrome sensor is read out in a read-one-skip-one pattern for both the rows and the columns, while the color version supports a read-two-skip-two subsampling scheme. This mode is selectable through register configuration. Figure 26 shows which pixels are read and which ones are skipped for monochrome and color sensors respectively. Readout direction is indicated as an x and y arrow. www.onsemi.com 28 NOIV1SN025KA Figure 26. Subsampling Scheme for VITA 25K Signal Gain Path Table 23. GAIN CONFIGURATION REGISTERS Table 22 and Table 23 show the available registers (fields) to program the desired exposure time and gain settings. Settings 199[1:0] and 199[15:14] should remain unchanged. Table 22. EXPOSURE TIME CONFIGURATION REGISTERS Address Default Value 201 0x0000 Address Unity Gain Configuration 204 [4:0] 0x05 Column gain setting 0x07: column gain = 2/3x 0x05: column gain = 1x 0x09: column gain = 2x 0x11: column gain = 4x Other settings are not supported. 204 [12:5] 0x4F AFE gain setting 0x4F: AFE gain = 1.00x 0x33: AFE gain = 1.39x 0x36: AFE gain = 1.94x 0x66: AFE gain = 2.72x Other settings are not supported. Description Exposure time Rolling shutter: granularity = lines Global shutter: granularity defined by ’Mult Timer’ (register 199). 199 0x0001 Mult Timer (global shutter only) Defines granularity of exposure and reset length. unit = 1/62 MHz for normal ROT mode 200 0x0000 Reset length or Frame Length (global shutter only) Granularity defined by ’Mult Timer’ (register 199) 204 [13] 205[11:0] www.onsemi.com 29 Description Postpone gain update by one frame when ‘1’ to compensate for exposure time updates latency. 0x080 Digital Gain, 5.7 unsigned representation (5 bits before decimal point, 7 bits for fractional part). Maximum gain is 31.992 NOIV1SN025KA Mode Changes and Frame Blanking summarized in the following table for the sensor’s image related modes. NOTE: Major mode switching (i.e. switching between rolling and global shutter modes, master, triggered, slave modes) must be performed while the sequencer is disabled (reg_seq_enable = 0x0). Dynamically reconfiguring the sensor may lead to corrupted or non-uniformilly exposed frames. For some reconfigurations, the sensor automatically blanks out the image data during one frame. Frame blanking is Table 24. DYNAMIC SENSOR RECONFIGURATION AND FRAME BLANKING Global Shutter Configuration Corrupted Frame Rolling Shutter Blanked Out Frame Corrupted Frame Notes Blanked Out Frame Shutter Mode and Operation rolling_shutter_enable Do not reconfigure while the sensor is acquiring images. Disable image acquisition by setting reg_seq_enable = 0x0. triggered_mode Do not reconfigure while the sensor is acquiring images. Disable image acquisition by setting reg_seq_enable = 0x0. slave_mode Do not reconfigure while the sensor is acquiring images. Disable image acquisition by setting reg_seq_enable = 0x0. subsampling Enabling: No Disabling: Yes Configurable No Yes For global shutter mode: configurable with blank_subsampling_ss register. For rolling shutter mode: frame is always blanked out. binning No Configurable No Yes For global shutter mode: configurable with blank_subsampling_ss register For rolling shutter mode: frame is always blanked out. rs_x_length No No No No black_lines No No No No dummy_lines N/A N/A No No mult_timer No No N/A N/A Latency is 1 frame fr_length No No N/A N/A Latency is 1 frame exposure No No No No Latency is 1 frame mux_gainsw No No No No Latency configurable by means of gain_lat_comp register afe_gain No No No No Latency configurable by means of gain_lat_comp register. db_gain No No No No Latency configurable by means of gain_lat_comp register. See Note No No Configurable For Global shutter mode: Windows containing lines previously not read out may lead to corrupted frames. For Rolling shutter mode: Frame blanking when blank_roi_switch is asserted (recommended). Frame Timing Exposure Control Gain Window/ROI roi_active www.onsemi.com 30 NOIV1SN025KA Table 24. DYNAMIC SENSOR RECONFIGURATION AND FRAME BLANKING Global Shutter Configuration Corrupted Frame roi*_configuration* Rolling Shutter Blanked Out Frame Corrupted Frame Notes Blanked Out Frame See Note No Yes No Reconfiguring the windows by means of roi*_configuration* may lead to corrupted frames when configured close to frame boundaries. It is recommended to (re)configure an inactive window and switch the roi_active register. See Notes on roi_active. black_samples No No No No If configured within range of configured black lines auto_blackal_enable See Note No See Note No Manual correction factors become instantly active when auto_blackcal_enable is deasserted during operation. blackcal_offset See Note No See Note No Manual blackcal_offset updates are instantly active. No No No No Impacts the transmitted CRC bl No No No No Impacts the Sync channel information, not the Data channels. img No No No No Impacts the Sync channel information, not the Data channels. crc No No No No Impacts the Sync channel information, not the Data channels. tr No No No No Impacts the Sync channel information, not the Data channels. Black Calibration CRC Calculation crc_seed Sync Channel Sensor Status Monitor Pins The currently used exposure and gain parameters are reported by the sensor in registers 208 to 214. These status registers are updated at the start of the frame in which these parameters become active. The sensor features three logic monitor output pins. These pins can provide internal state and synchronization information to the outside system. These status pins can be used during system setup or for system frame synchronization. The pins are named monitor0, monitor1, and monitor2. The information provided on these pins is configured with the register monitor_select (register 192[13:11]). NOTE: Monitor indications are generated in the sequencer. These signals lead the image and synchronization data on the LVDS channels. Temperature Diode The temperature diode allows the monitoring of the sensor die temperature during operation. The diode can be connected through the pins td_anode and td_cathode. The die temperature (Tdie), as a function of the measured forward threshold voltage of the diode, with a known bias current (Vdiode at bias 40 mA), is determined according to the following formula: Tdie = (0.77–Vdiode at bias 40 mA)/0.00158°C www.onsemi.com 31 NOIV1SN025KA Table 25. MONITOR SELECT Monitor Select 0x0 Monitor Output Description No information is provided on the output pins. All outputs are driven to logic ‘0’ monitor0: ‘0’ monitor1: ‘0’ monitor2: ‘0’ 0x1 0x2 0x3 0x4 0x5 0x6 0x7 monitor0: Integration time indication High during integration monitor1: ROT indication High when ROT is active, low outside ROT monitor2: Dummy line indication High during dummy lines, low during all other lines monitor0: Integration time indication High during integration monitor1: N/A N/A monitor2: N/A N/A monitor0: Start of X-readout Pulse indicating the start of x-readout monitor1: Black line indication High during black lines, low during all other lines monitor2: Dummy line indication High during dummy lines, low during all other lines monitor0: Frame start Pulse indicating the start of a new frame monitor1: Start of ROT Pulse indicating the start of ROT monitor2: Start of X-readout Pulse indicating the start of x-readout monitor0: First line indication High during the first line of each frame, low for all others monitor1: Start of ROT indication Pulse indicating the start of ROT monitor2: End of ROT indication Pulse indicating the end of ROT monitor0: ROT indication High when ROT is active, low outside ROT monitor1: Start of X-readout Pulse indicating the start of x-readout monitor2: End of X-readout Pulse indicating the end of x-readout monitor0: Start of X-readout for black lines Pulse indicating the start of x-readout for black lines monitor1: Start of X-readout for image lines Pulse indicating the start of x-readout for image lines monitor2: Start of X-readout for dummy lines Pulse indicating the start of x-readout for dummy lines www.onsemi.com 32 NOIV1SN025KA DATA OUTPUT FORMAT LVDS Output Channels Serial Link Interface Operation The image data output occurs through 32 LVDS data channels, operating at 620 Mbps in 10-bit mode and 496 Mbps in 8-bit mode. A synchronization LVDS channel and an LVDS output clock signal synchronizes the data. The 32 data channels are used to output the image data only. The sync channel transmits information about data sent over these data channels (includes codes indicating black pixels, normal pixels, and CRC). To perform word synchronization on the output data stream, a predefined training pattern is sent after startup of the sensor and during idle times (during FOT, ROT, and in between frames and lines). This data is used to perform word alignment on the receiving side. To decrease the data bit rate at the outputs (and reduce the power consumption), the sensor can operate in 8-bit mode. In 10-bit mode, the words on data and sync channels have a 10-bit length. The words are serialized most significant bit first. The output data rate is 620 Mbps. In 8-bit mode, the words on data and sync channels have an 8-bit length. The words are serialized most significant bit first. The output data rate is 496 Mbps. This decreases the data bit rate on the LVDS data channels. Power consumption is reduced by reconfiguring the internal bias currents. LVDS channels run at 248 MHz (DDR) in 8-bit mode. This sensor’s serial link interface is based on a mesochronous clocking system. This means that all data and control links operate at the same frequency, but their phase may be different due to skew. The host provides an LVDS clock as input to the sensor. To compensate for possible large on-chip delays, the sensor retransmits this clock with the same delay as that seen by the data (32 data channels) and control path (one sync channel). The receiver end (generally an FPGA-based system) performs per-interface skew compensation. The data on high-speed serial links can drift due to various reasons such as skew, jitter, PCB trace delays, process, voltage, and temperature variations. The receiver performs per-LVDS interface skew compensation using bit and word alignment techniques. To support per-interface skew compensation, the sensor provides a training mode that allows the system to perform bit and word alignment on all interfaces. During idle moments (when the sensor is not capturing images or during frame and line overhead), the image sensor transmits training patterns. These patterns are configurable by means of a register upload and should be chosen such that these can easily be detected by reducing the risk of mimicking in the regular data stream. Bit Alignment Bit alignment procedures position the sampling edge of the clock at the center of the data eye window by adding delay to the data path (using delay taps). Table 26. LVDS OUTPUT CHANNELS CONFIGURATION Configuration (pin) 8-bit_mode (register) Description Output Data Rate Channel [Mbps] 0 0 10-bit mode 620 1 1 8-bit mode 496 0 1 Not supported N/A 1 0 Not supported N/A adc_mode Word Alignment Word alignment procedures ensure that the reconstructed parallel data bits are in correct order at the output of the deserializer. Word alignment is done by looking for well known training patterns. All major FPGA vendors provide bit and word alignment methods for their FPGAs. Refer to the FPGA vendor’s application for more information on the use of these functionalities. When the host succeeds in a lock for bit and word alignment procedures, the system enables the sensor for image acquisition. Specific frame alignment patterns are transmitted for image frame synchronization purposes. The 8-bit mode is selected using the adc_mode pin. The datablock sync channel is configured accordingly (8-bit_mode configuration). In 8-bit mode, the eight most significant bits of the ADC data words are transmitted over the data channels. Sync channel encoding is similar to the 10-bit mode. The two least significant bits of the (configured) sync codes are omitted and the window ID is transmitted after each frame synchronization word (the two LSBs are to be ignored). NOTE: The 8-bit mode can only be used to reduce the data rate at the cost of image data resolution. Operating the sensor in 8-bit mode at a higher clock frequency to achieve higher frame rates is not supported. Frame Format The frame format is explained by example of the readout of two (overlapping) windows, as shown in Figure 27 (a). The readout of a frame occurs on a line-by-line basis. In this representation, the read pointer goes from left to right, bottom to top. Figure 27 indicates that, after the FOT is complete, a number of lines which only include information of ‘ROI 0’ www.onsemi.com 33 NOIV1SN025KA start of the first line is replaced by a frame start; the line end of the last line is replaced with a frame end indication. Each such frame synchronization code is followed by a window ID (range 0 to 31). The data channels contain valid pixel data during FS/FE/LS/LE and window ID synchronization codes. NOTE: For overlapping windows, the line synchronization codes of the overlapping windows with lower IDs are not sent out. As shown in the illustration, no LE is transmitted for the overlapping part of window 0. Black lines are read out at the start of a frame. These lines are enclosed by LS and LE indications (no frame start/end). The window ID for the black lines must be ignored. are sent out, starting at position y0_start. When the line at position y1_start is reached, a number of lines containing data of ‘ROI 0’ and ‘ROI 1’ are sent out, until the line position of y0_end is reached. From there on, only data of ‘ROI 1’ appears on the data output channels until line position y1_end is reached. NOTE: Only frame start and frame end sync words are indicated in (b). CRC codes are also omitted from Figure 27. During readout of image data over the data channels, the sync channel sends out frame synchronization codes, which provide information related to the image data being sent over the 32 data output channels. Each line of a window starts with a line start (LS) indication and ends with a line end (LE) indication. The line y1_end ROI 1 y0_end y1_start ROI 0 y0_start x0_start x0_end x1_start x1_end (a) Integration Time Handling Readout Handling FOT ÉÉ FS0 B L Reset N Exposure Time N Readout Frame N-1 ROI 1 ROI 0 FS1 Reset N+1 FOT FOT FE1 É É B L Exposure Time N+1 FOT Readout Frame N ROI 1 ROI 0 FS0 FS1 FOT FE1 (b) Figure 27. Frame Sync Codes Figure 28 and Figure 29 show the details of the readout of a number of lines for single window readout, at the beginning of the frame. Figure 30 shows the details of the readout of a number of lines for two overlapping windows. www.onsemi.com 34 NOIV1SN025KA Sequencer Internal State FOT ROT ROT black ROT line Ys ROT line Ys+1 line Ye data channels sync channel data channels sync channel Training Training TR LS 0 BL timeslot 0 BL BL timeslot 1 BL BL timeslot 77 BL LE timeslot 78 0 timeslot 79 TR CRC CRC timeslot Figure 28. Timeline Showing Readout of Black Line for Global Shutter NOTE: For rolling shutter, the number of black pixels on one line is reduced to the selected window’s length. The sequence shown is repeated if more than one black line is generated. Sequencer Internal State FOT ROT ROT black ROT line Ys ROT line Ys+1 line Ye data channels sync channel Training data channels TR sync channel Training FS IMG ID timeslot Xstart IMG IMG timeslot Xstart + 1 IMG timeslot Xend - 2 IMG IMG timeslot Xend - 1 LE ID CRC timeslot Xend TR CRC timeslot Figure 29. Timeline for Single Window Readout NOTE: In the figure, the second image line is shown in more detail. The LS code is replaced by FS for the first line and the LE code is replaced by FE for the last line in the window. Sequencer Internal State FOT black ROT ROT line Ys ROT line Ys+1 ROT line Ye data channels sync channel data channels sync channel Training Training TR LS IDM timeslot XstartM IMG IMG LS timeslot XstartM +1 IDN IMG timeslot XstartN IMG IMG timeslot XstartN -1 LE IDN timeslot XendN CRC CRC timeslot Figure 30. Timeline Showing Readout of Two Overlapping Windows www.onsemi.com 35 TR NOIV1SN025KA Frame Format in 8−bit Mode The frame format is identical to the 10-bit mode. Sync and data word depth is reduced to eight bits. Synchronization Words Frame Synchronization for 10-Bit Mode Table 27 shows the structure of the frame synchronization code. Note that the table shows the default data word (configurable) for 10-bit mode. If more than one window is active at the same time, the sync channel transmits the frame synchronization codes of the window with highest index only. Table 27. FRAME SYNCHRONIZATION CODE DETAILS FOR 10-BIT MODE Sync Word Bit Position Register Address Default Value 9:7 N/A 0x5 Frame start indication 9:7 N/A 0x6 Frame end indication 9:7 N/A 0x1 Line start indication 9:7 N/A 0x2 Line end indication 6:0 131[6:0] 0x2A Description These bits indicate that the received sync word is a frame synchronization code. The value is programmable by a register setting Window Identification Frame synchronization codes are always followed by a 5-bit window identification (bits 4:0). This is an integer number, ranging from 0 to 31, indicating the active window. If more than one window is active for the current cycle, the highest window ID is transmitted. Data Classification Codes For the remaining cycles, the sync channel indicates the type of data sent through the data links: black pixel data (BL), image data (IMG), or training pattern (TR). These codes are programmable by a register setting. The default values are listed in Table 28. Table 28. SYNCHRONIZATION CHANNEL DEFAULT IDENTIFICATION CODE VALUES FOR 10-BIT MODE Sync Word Bit Position Register Address Default Value 9:0 132 [9:0] 0x015 Black pixel data (BL). This data is not part of the image. The black pixel data is used internally to correct channel offsets. 9:0 133 [9:0] 0x035 Valid pixel data (IMG). The data on the data output channels is valid pixel data (part of the image). 9:0 134 [9:0] 0x059 CRC value. The data on the data output channels is the CRC code of the finished image data line. 9:0 135 [9:0] 0x3A6 Training pattern (TR). The sync channel sends out the training pattern which can be programmed by a register setting. Description and not sent out. Table 29 shows the structure of the frame synchronization code, together with the default value, as specified in SPI registers. The same restriction for overlapping windows applies in 8-bit mode. Frame Synchronization in 8-bit Mode The frame synchronization words are configured using the same registers as in 10-bit mode. The two least significant bits of these configuration registers are ignored Table 29. FRAME SYNCHRONIZATION CODE DETAILS FOR 8-BIT MODE Sync Word Bit Position Register Address Default Value 7:5 N/A 0x5 Frame start (FS) indication 7:5 N/A 0x6 Frame end (FE) indication 7:5 N/A 0x1 Line start (LS) indication 7:5 N/A 0x2 Line end (LE) indication 4:0 [6:2] 0x0A Description These bits indicate that the received sync word is a frame synchronization code. The value is programmable by a register setting. www.onsemi.com 36 NOIV1SN025KA Window Identification Similar to 10-bit operation mode, the frame synchronization codes are followed by a window identification. The window ID is located in bits 6:2 (all other bit positions are ‘0’). The same restriction for overlapping windows applies in 8-bit mode. Data Classification Codes BL, IMG, CRC, and TR codes are defined by the same registers as in 10-bit mode. Bits 9:2 of the respective configuration registers are used as classification code. The default values are listed in Table 30. Table 30. SYNCHRONIZATION CHANNEL DEFAULT IDENTIFICATION CODE VALUES FOR 8-BIT MODE Sync Word Bit Position Register Address Default Value 7:0 132 [9:2] 0x05 Black pixel data (BL). This data is not part of the image. The black pixel data is used internally to correct channel offsets. 7:0 133 [9:2] 0x0D Valid pixel data (IMG). The data on the data output channels is valid pixel data (part of the image). 7:0 134 [9:2] 0x16 CRC value. The data on the data output channels is the CRC code of the finished image data line. 7:0 135 [9:2] 0xE9 Training Pattern (TR). The sync channel sends out the training pattern which can be programmed by a register setting. Description Training Patterns on Data Channels independent of the training code on the sync channel as shown in Table 31. In 8-bit mode, the training pattern for the data channels is defined by the same register as in 8-bit mode, where the lower two bits are omitted; see Table 32. In 10-bit mode, during idle periods, the data channels transmit training patterns, indicated on the sync channel by a TR code. These training patterns are configurable Table 31. TRAINING CODE ON SYNC CHANNEL IN 10-BIT MODE Sync Word Bit Position Register Address Default Value [9:0] 130 [9:0] 0x3A6 Description Data channel training pattern. The data output channels send out the training pattern, which can be programmed by a register setting. The default value of the training pattern is 0x3A6, which is identical to the training pattern indication code on the sync channel. Table 32. TRAINING PATTERN ON DATA CHANNEL IN 8-BIT MODE Data Word Bit Position Register Address Default Value [7:0] 130 [9:2] 0xE9 Description Data Channel Training Pattern (Training pattern). Cyclic Redundancy Code Black Reference At the end of each line, a CRC code is calculated to allow error detection at the receiving end. Each data channel transmits a CRC code to protect the data words sent during the previous cycles. Idle and training patterns are not included in the calculation. The sync channel is not protected. A special character (CRC indication) is transmitted whenever the data channels send their respective CRC code. The polynomial in 10-bit operation mode is x10+x9+x6+x3+x2+x+1. The CRC encoder is seeded at the start of a new line and updated for every (valid) data word received. The CRC seed is configurable usign the crc_seed register. When ‘0’, the CRC is seeded by all-‘0’; when ‘1’ it is seeded with all-‘1’. In 8-bit mode, the plynomial is x8+x6+x3+x2+1. The CRC seed is configured by means of the crc_seed register. NOTE: Note The CRC is calculated for every line. This implies that the CRC code can protect lines from multiple windows. The sensor reads out one or more black lines at the start of every new frame. The number of black lines to be generated is programmable and is at a minimum, equal to 1. The length of the black lines depends on the operation mode. For rolling shutter mode, it is equal to the line length configured in the active window. For global shutter mode, the sensor always reads out the entire line (80 kernels), independent of window configurations. The black references are used to perform black calibration and offset compensation in the data channels. The raw black pixel data is transmitted over the usual LVDS channels, while the regular image data is compensated (can be bypassed). On the output interface, black lines can be seen as a separate window, without frame start and ends (only line start and ends). The window ID is to be ignored and data is indicated by a BL code. In 8-bit mode, the configuration of the black level calibration block automatically scales to 8-bit mode. No reconfiguration is required. www.onsemi.com 37 NOIV1SN025KA Example Using Multiple Windowing Figure 31 shows an example of the synchronization codes sent when reading out multiple windows. LS+0+IMGx(x_size0-4)+FE+0+CRC LS+0+IMGx(x_size0-4)+LE+0+CRC ROI0 FS+0+IMGx(x_size0-4)+LE+0+CRC LS+DC+BLx156+LE+DC+CRC where x_size0 = x_end0 - x_start0 + 1 DC = “Don't Care" LS+0+IMGx(x_size0-4)+FE+0+CRC LS+0+IMGx(x_size0-4)+LE+0+CRC LS+0+IMGx(x_size0-4)+LE+0+LS+1+IMGx(x_size1-4)+FE+1+CRC ROI1 LS+0+IMGx(x_size0-4)+LE+0+LS+1+IMGx(x_size1-4)+LE+1+CRC ROI0 LS+0+IMGx(x_size0-4)+LE+0+FS+1+IMGx(x_size1-4)+LE+1+CRC LS+0+IMGx(x_size0-4)+LE+0+CRC FS+0+IMGx(x_size0-4)+LE+0+CRC LS+DC+BLx156+LE+DC+CRC where x_size0 = x_end0 - x_start0 + 1 x_size1 = x_end1 - x_start1 + 1 DC = “Don't Care" LS+0+IMGx(x_size0-4)+FE+0+CRC LS+0+IMGx(x_size0-4)+LE+0+CRC LS+0+IMGx(x_size0-4)+LE+0+LS+1+IMGx(x_size1)+FE+1+CRC ROI1 LS+0+IMGx(x_size0-4)+LE+0+LS+1+IMGx(x_size1-4)+LE+1+CRC ROI0 LS+0+IMGx(x_size0-4)+LE+0+FS+1+IMGx(x_size1-4)+LE+1+CRC LS+0+IMGx(x_size0-4)+LE+0+CRC FS+0+IMGx(x_size0-4)+LE+0+CRC LS+DC+BLx156+LE+DC+CRC where x_size0 = x_end0 - x_start0 + 1 x_size1 = x_end1 - x_start1 + 1 DC = “Don't Care" LS+1+IMGx(x_size1-4)+FE+1+CRC LS+1+IMGx(x_size1-4)+LE+1+CRC LS+0+IMGx(x_size0-overlap1_0-2)+LS+1+IMGx(x_size1-4)+LE+1+CRC ROI1 LS+0+IMGx(x_size0-overlap1_0-2)+LS+1+IMGx(x_size1-4)+LE+1+CRC ROI0 LS+0+IMGx(x_size0-overlap1_0-2)+FS+1+IMGx(x_size1-4)+LE+1+CRC LS+0+IMGx(x_size0-4)+LE+0+CRC FS+0+IMGx(x_size0-4)+LE+0+CRC LS+DC+BLx156+LE+DC+CRC where x_size0 = x_end0 - x_start0 + 1 x_size1 = x_end1 - x_start1 + 1 overlap1_0 = x_end0 - x_start1 +1 DC = “Don't Care" Figure 31. Synchronization Codes for Multiple Windows (applicable for Global Shutter only) www.onsemi.com 38 NOIV1SN025KA Data Order The data order in 8-bit mode is identical to the 10-bit mode. Figure 32 indicates how the kernels are organized. The data order of this image data on the data output channels depends on the subsampling mode. To read out the image data through the output channels, the pixel array is organized in kernels. The kernel size is 64 pixels in x-direction by one pixel in y-direction. kernel (79,5119) pixel array ROI kernel (x_start,y_start) kernel (0,0) 0 1 2 3 61 62 63 Figure 32. Kernel Organization in Pixel Array • No Subsampling Figure 33 shows how a kernel is read out over the 32 output channels. For even positioned kernels, the kernels are read out ascending, and for odd positioned kernels the data order is reversed (descending). The image data is read out in kernels of 64 pixels in x-direction by one pixel in y-direction. One data channel output delivers two pixel values of one kernel sequentially. kernel N kernel N+1 MSB LSB 63 63 62 61 60 3 2 1 0 channel #31 62 channel #30 61 channel #0 60 channel#31 3 channel #30 2 channel #1 1 channel #0 0 kernel N+3 pixel # (odd kernel) channel #1 pixel # (even kernel) kernel N+2 MSB LSB Note: The bit order is always MSB first, regardless the kernel number 10-bit/8-bit10-bit/8-bit Figure 33. Data Output Order when Subsampling is Disabled • Subsampling on monochrome sensor at the even pixel positions inside that kernel are read out. Figure 34 shows the data order. Note that there is no difference in data order for even and odd kernel numbers. This is opposed to the ‘no-subsampling’ readout described earlier. During subsampling, every other pixel is read out and the lines are read in a read-1-skip-1 manner. To read out the image data with subsampling enabled, two neighboring kernels are combined to a single kernel of 128 pixels in the x-direction and one pixel in the y-direction. Only the pixels www.onsemi.com 39 NOIV1SN025KA 6 120 56 70 58 68 60 66 62 64 channel#31 122 channel#30 4 channel #1 124 channel#29 2 kernel N+1 channel#28 126 kernel N channel#2 0 channel #0 pixel # kernel N-1 channel#3 kernel N-2 Figure 34. Data Output Order in Subsampling Mode on a Monochrome Sensor single kernel of 128 pixels in the x-direction and 1 pixel in the y-direction. Only the pixels 0, 1, 4, 5, 8, 9, 12, 13 to 124, and 125 are read out. Figure 35 shows the data order. There is no difference in data order for even/odd kernel numbers, as opposed to the ‘no-subsampling’ readout described in section. MSB LSB 4 channel #1 124 MSB LSB 5 121 120 69 68 60 61 65 64 channel #31 125 kernel N+1 channel #30 1 kernel N channel #3 0 channel #0 pixel # kernel N-1 channel #2 kernel N-2 channel #29 Binning Mode The output order in binning mode is identical to the subsampled mode. • Subsampling on color sensor To read out the image data with subsampling enabled on a color sensor, two neighboring kernels are combined to a Note: The bit order is always MSB first, regardless the kernel number 10-bit / 8-bit 10-bit / 8-bit Figure 35. Data Output Order in Subsampling Mode on a Color Sensor Frame Rate Subsampling Mode The frame time for subsampled readout is shown by the following formula: Frame Time = tFOT + (y-resolution / 2) x (tROT + treadout / 2), where tROT represents the equivalent ROT time for a normal readout of the same frame. Analogous readout represents the equivalent readout time for normal readout. The maximum frame rate in subsampled readout of the full resolution of the sensor is ~160 fps. Frame rate for subsampling and binning mode is compared to the normal mode. Assume the y-resolution is the programmed number of lines to read out. Normal Readout The frame time in normal readout mode is shown by the following formula: Frame Time = tFOT + (y-resolution) x (tROT + treadout) The frame rate is equal to 1/FrameTime. Nominal frame rate for full frame readout is 53 fps. www.onsemi.com 40 NOIV1SN025KA In 8-bit mode, test patterns are generated as in 10-bit mode, however the two least significant bits of the resulting data are not transmitted. The test pattern modes are summarized in Table 33. Note that these modes only exist for the data channel. The sync and clock channels do not provide this functionality. For each test mode, the user can select whether the generated data is framed. When the register frame_testpattern is asserted, the test data simply replaces the ADC data. This means that the test data is only sent between frame/line start and frame/line end indications. Outside these windows, regular training patterns are sent, as during normal operation. CRC is calculated and inserted as for normal data for the fixed and incrementing test pattern generation. Binning Mode The frame time for subsampled readout is given by the following formula: Frame Time = tFOT + (y-resolution / 2) x (tROT x 2+ treadout / 2), where tROT represents the equivalent ROT time for a normal readout of the same frame. Analogous readout represents the equivalent readout time for normal readout. In binning mode, the maximum frame rate in subsampled readout of the full resolution of the sensor is ~110 fps. Test Pattern Generation The data block provides several test pattern generation capabilities. Figure 36 shows the functional diagram for the data channels. It is possible to inject synthesized test patterns at various points. Refer to the Register Map on page 43 for the test mode configuration registers (registers 144 to 150). Table 33. TEST MODE SUMMARY Register Configuration prbs_en testpattern_en testpattern 0 0 X Normal operation mode 0 1 0 Fixed pattern generation. Pattern is defined by testpattern register 0 1 1 Incrementing pattern generation. Initial value is determined by testpattern. 1 X X PRBS data generation. The testpattern register determines the seed for the PRBS generator. Description When frame_testpattern is deasserted, the output is constantly replaced by the generated test data. No training patterns are generated. adc_db_data_0 adc_db_data_1 Black Level Calibration CRC Calculation Black Level Calibration `0' `1' `0' `1' `1' `1' Test Pattern Generation `0' `1' `0' `0' testpattern_er PRBS Generator prbs_en training pattern (testpattern_en and not frame_testpattern) insert CRC bypass Figure 36. Functional Block Diagrams for the Data Channels NOTE: In the figure, register configurations are indicated in red. The sync channel continues to send regular frame timing information when the sequencer is enabled (independently of the test pattern configurations). The synthesized test patterns are injected directly into the data channels. Therefore, no data demultiplexing is required at the receiving end (as opposed to regular image data capture). www.onsemi.com 41 NOIV1SN025KA Pseudo Random Bit Sequence Generation In this test mode, the output channels are sourced with pseudo random bit sequence (PRBS) pattern. The PRBS seed can be configured for each data channel using the testpattern register. For the other test pattern generation mode, the datastream is not interrupted when frame_testpattern is deasserted. NOTES: • The CRC generator is not functional in this mode, and no real CRC can be calculated. Instead, the CRC slot is used to send one more PRBS word. • A PRBS generator does not generate random data when the seed is all zero. Therefore, it is advisable to configure the testpattern registers to a value different from ‘0’. Using different seeds for each channel results in different sequences for each data channel. Fixed Pattern A configured word can be continuously repeated on the output. This word is configurable for each data channel separately (testpattern). The testpattern is inserted when testpattern_en is asserted. Incrementing Test Pattern In each cycle, the test pattern word is incremented by one, when inc_testpattern is asserted. After reaching the maximum value, the incrementer is reset to its start value (testpattern). When the testdata is framed, the incrementer is also reset to the testpattern value at each line start. To enable this mode, enable the digital testpattern mode (assert testpattern_en) and assert inc_testpattern. www.onsemi.com 42 NOIV1SN025KA REGISTER MAP Each functional entity has a dedicated address space, starting at a block offset. The register address is obtained by adding the address offset to the block offset. This address must be used to perform SPI uploads and is shown in the Address column of the register map table. Table 34. REGISTER MAP Address Offset Address Default Hex Default chip_id 0x56FA 22266 id 0x56FA 22266 revision 0x0001 1 0x1 1 0x0000 0 color 0x0 0 config 0x0004 4 enable 0x0 0 Enable analogue clocks ‘0’ = disabled, ‘1’ = enabled reserved 0x0002 2 Reserved config 0x0000 0 enable 0x0 0 0x0000 0 Bit Field Register Name Description Access Chip ID [Block Offset: 0] 0 0 [15:0] 1 1 [3:0] 2 2 rev chip_configuration [0] RO ON Semiconductor Chip ID RO Chip Revision Numbering Note: Refer to ES1 data sheet if 0x0. RW Configure according to part number: NOIV1SN025KA-GDC: 0x0 NOIV1SE025KA-GDC: 0x1 Clock Generator [Block Offset: 32] 0 32 [0] [14:1] RW General Logic [Block Offset: 34] 0 34 [0] RW Logic General Enable Configuration ‘0’ = Disable ‘1’ = Enable Image Core [Block Offset: 40] 0 1 40 image_core_config RW [0] reserved 0x0 0 Reserved [1] mux_pwd_n 0x0 0 Column Multiplexer Power Down ‘0’ = powered down, ‘1’ = powered up [2] reserved 0x0 0 Reserved image_core_config 0x0B5A 2906 reserved 0xB5A 2906 41 [12:0] RW Reserved [13] testpattern 0x0 0 Testpattern generation in the columns [14] injectlevel 0x0 0 Inject level for testpattern generation [15] reserved 0x0 0 Reserved 0x0000 0 AFE [Block Offset: 48] 0 48 power_down www.onsemi.com 43 RW NOIV1SN025KA Table 34. REGISTER MAP Address Offset Address Bit Field [0] Register Name pwd_n Default Hex Default 0x0 0 0x0000 0 0x0 0 0x888B 34955 Description Access Power down for AFE’s (64 columns) ‘0’ = powered down, ‘1’ = powered up Bias Generator [Block Offset: 64] 0 64 power_down [0] 1 65 configuration 3 6 RW extres 0x1 1 External Resistor Selection ‘0’ = internal resistor, ‘1’ = external resistor [3:1] bgrtrim 0x5 5 Bandgap Trim [7:4] imc_colpc_ibias 0x8 8 Column Precharge ibias Configuration [11:8] imc_colbias_ibias 0x8 8 Column Bias ibias Configuration reserved 0x8 8 Reserved 66 afe_bias 0x53C8 21448 [3:0] afe_ibias 0x8 8 AFE ibias Configuration [7:4] afe_adc_iref 0xC 12 ADC iref Configuration [14:8] afe_pga_iref 0x53 83 PGA iref Configuration 0x8888 34952 67 mux_bias RW RW [3:0] mux_25u_stage1 0x8 8 Column Multiplexer Stage 1 Bias Configuration [7:4] mux_25u_stage2 0x8 8 Column Multiplexer Stage 2 Bias Configuration [11:8] mux_25u_delay 0x8 8 Column Multiplexer Delay Bias Configuration mux_25u_vcmbuff 0x8 8 Column Multiplexer Vcm Bias Configuration lvds_bias 0x0088 136 [3:0] lvds_ibias 0x8 8 LVDS Ibias [7:4] lvds_iref 0x8 8 LVDS Iref reserved 0x8888 34952 reserved 0x8888 34952 reserved 0x0000 0 reserved 0x0 0 reserved 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 reserved 0x0 0 reserved 0x0000 0 [15:12] 4 RW Power down bandgap ‘0’ = powered down, ‘1’ = powered up [0] [15:12] 2 pwd_n 68 70 [15:0] RW RW Reserved Test [Block Offset: 80] 0 80 1 81 [9:0] [15:0] 16 96 [5:0] 17 97 www.onsemi.com 44 RW Reserved RW Reserved RW Reserved RO NOIV1SN025KA Table 34. REGISTER MAP Address Offset Address Bit Field [7:0] Register Name reserved Default Hex Default 0x00 0 0x0000 0 Description Access Reserved Ser/lvds/io [Block Offset: 112] 0 112 power_down RW [0] clock_out_pwd_n 0x0 0 Power down for Clock Output. ‘0’ =powered down, ‘1’ = powered up [1] sync_pwd_n 0x0 0 Power down for Sync channel ‘0’ = powered down, ‘1’ = powered up [2] data_pwd_n 0x0 0 Power down for data channels (4 channels) ‘0’ = powered down, ‘1’ = powered up 0x4008 16392 Data Block [Block Offset: 128] 0 1 128 blackcal [7:0] black_offset 0x08 8 Desired black level at output [10:8] black_samples 0x0 0 Black pixels taken into account for black calibration. Total samples = 2**black_samples [14:11] reserved 0x8 8 Reserved [15] crc_seed 0x0 0 CRC Seed ‘0’ = All-0 ‘1’ = All-1 general_configuration 0xC001 49153 auto_blackcal_enable 0x1 1 Automatic blackcalibration is enabled when 1, bypassed when 0 [9:1] blackcal_offset 0x00 0 Black Calibration offset used when auto_black_cal_en = ‘0’. [10] blackcal_offset_dec 0x0 0 blackcal_offset is added when 0, subtracted when 1 [11] reserved 0x0 0 Reserved [12] reserved 0x0 0 Reserved [13] 8bit_mode 0x0 0 Shifts window ID indications by 4 cycles. ‘0’ = 10 bit mode, ‘1’ = 8 bit mode reserved 0x3 3 Reserved trainingpattern 0x03A6 934 [9:0] trainingpattern 0x3A6 934 [10] reserved 0x0 0 0x002A 42 129 [0] [15:14] 2 3 130 131 RW sync_code0 www.onsemi.com 45 RW RW Training pattern sent on Data channels during idle mode. This data is used to perform word alignment on the LVDS data channels. Reserved RW NOIV1SN025KA Table 34. REGISTER MAP Address Offset Address [6:0] 4 132 [9:0] 5 133 [9:0] 6 134 [9:0] 7 135 [9:0] 8 136 [15:0] 9 137 [15:0] 10 138 [15:0] 11 139 [15:0] 12 140 [15:0] 13 Default Hex Default Description frame_sync 0x02A 42 Frame Sync LSBs Note: The three MSBs of the resulting 10-bit Frame sync word is not configurable. The tenth bit indicates frame/line sync code, ninth bit indicates start, eighth bit indicates end. sync_code1 0x0015 21 bl 0x015 21 sync_code2 0x0035 53 img 0x035 53 sync_code3 0x0059 89 crc 0x059 89 sync_code4 0x03A6 934 tr 0x3A6 934 blackcal_error0 0x0000 0 blackcal_error[15:0] 0x0000 0 blackcal_error1 0x0000 0 blackcal_error[31:16] 0x0000 0 blackcal_error2 0x0000 0 blackcal_error[47:32] 0x0000 0 blackcal_error3 0x0000 0 blackcal_error[63:48] 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 reserved 0xFFFF 65535 reserved 0xFFFF 65535 test_configuration 0x0000 0 0x0 0 Bit Field 141 [15:0] Register Name Access RW Black Pixel Identification Sync Code RW Valid Pixel Identification Sync Code RW CRC Value Identification Sync Code RW Training Value Identification Sync Code RO Black Calibration Error. This flag is set when not enough black samples are availlable. Black Calibration shall not be valid. Channels 0-15 RO Black Calibration Error. This flag is set when not enough black samples are availlable. Black Calibration shall not be valid. Channels 16-31 RO Black Calibration Error. This flag is set when not enough black samples are availlable. Black Calibration shall not be valid. Channels 32-47 RO Black Calibration Error. This flag is set when not enough black samples are availlable. Black Calibration shall not be valid. Channels 48-63 RW Reserved RW Reserved (Datablock - Test) 16 144 [0] testpattern_en www.onsemi.com 46 RW Insert synthesized testpattern when ‘1’, normal operation when ‘0’. NOIV1SN025KA Table 34. REGISTER MAP Address Offset 17 Address Bit Field 19 20 21 Default Hex Default Description [1] inc_testpattern 0x0 0 Incrementing testpattern when ‘1’, constant testpattern when ‘0’ [2] prbs_en 0x0 0 Incrementing tstpattern when ‘1’. constant testpattern when ‘0’. Lower bound is defined by testpattern*, upper bound is 1023. After reaching 1023, the counter is reloaded with configured start data. [3] frame_testpattern 0x0 0 Frame test patterns when ’1’, unframed testpatterns when ’0’ [4] reserved 0x0 0 Reserved reserved 0x0000 0 145 [15:0] 18 Register Name 146 reserved 0 test_configuration0 RW Reserved 0x0100 256 [7:0] testpattern0_lsb 0x00 0 Testpattern (LSBs) used on datapath #0, #8, #16, #24 when testpattern_en = ‘1’. Note: Most significant bits are configured in register 150. [15:8] testpattern1_lsb 0x01 1 Testpattern (LSBs) used on datapath #1, #9, #17, # 25 when testpattern_en = ‘1’. Note: Most significant bits are configured in register 150. 0x0302 770 147 test_configuration1 RW RW [7:0] testpattern2_lsb 0x02 2 Testpattern (LSBs) used on datapath #2, #10, #18, #26 when testpattern_en = ‘1’. Note: Most significant bits are configured in register 150. [15:8] testpattern3_lsb 0x03 3 Testpattern (LSBs) used on datapath #3, #11, #19, #27 when testpattern_en = ‘1’. Note: Most significant bits are configured in register 150. 0x0504 1284 148 test_configuration2 RW [7:0] testpattern4_lsb 0x04 4 Testpattern (LSBs) used on datapath #4, #12, #20, #28 when testpattern_en = ‘1’. Note: Most significant bits are configured in register 150. [15:8] testpattern5_lsb 0x05 5 Testpattern (LSBs) used on datapath #5, #13, #21, #29 when testpattern_en = ‘1’. Note: Most significant bits are configured in register 150. 0x0706 1798 0x06 6 149 test_configuration3 [7:0] testpattern6_lsb www.onsemi.com 47 Access RW Testpattern (LSBs) used on datapath #6, #14, #22, #30 when testpattern_en = ‘1’. Note: Most significant bits are configured in register 150. NOIV1SN025KA Table 34. REGISTER MAP Address Offset Address Bit Field [15:8] 22 150 26 154 27 155 191 Description 0x07 7 Testpattern (LSBs) used on datapath #7, #15, #23, #31 when testpattern_en = ‘1’. Note: Most significant bits are configured in register 150. 0x0000 0 0 Testpattern (LSBs) used on datapath #0, #8, #16, #24 when testpattern_en = ‘1’. Note: Least significant bits are configured in register 146. [3:2] testpattern1_msb 0x0 0 Testpattern (MSBs) used on datapath #1, #9, #17, # 25 when testpattern_en = ‘1’. Note: Least significant bits are configured in register 146. [5:4] testpattern2_msb 0x0 0 Testpattern (MSBs) used on datapath #2, #10, #18, #26 when testpattern_en = ‘1’. Note: Least significant bits are configured in register 147. [7:6] testpattern3_msb 0x0 0 Testpattern (MSBs) used on datapath #3, #11, #19, #27 when testpattern_en = ‘1’. Note: Least significant bits are configured in register 147. [9:8] testpattern4_msb 0x0 0 Testpattern (MSBs) used on datapath #4, #12, #20, #28 when testpattern_en = ‘1’. Note: Least significant bits are configured in register 148. [11:10] testpattern5_msb 0x0 0 Testpattern (MSBs) used on datapath #5, #13, #21, #29 when testpattern_en = ‘1’. Note: Least significant bits are configured in register 148. [13:12] testpattern6_msb 0x0 0 Testpattern (MSBs) used on datapath #6, #14, #22, #30 when testpattern_en = ‘1’. Note: Least significant bits are configured in register 149. [15:14] testpattern7_msb 0x0 0 Testpattern (MSBs) used on datapath #7, #15, #23, #31 when testpattern_en = ‘1’. Note: Least significant bits are configured in register 149. reserved 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 RW Reserved RW Reserved reserved … Access RW 0x0 [15:0] 31 Default testpattern0_msb 160 … Default Hex [1:0] [15:0] … testpattern7_lsb test_configuration16 [15:0] 0 Register Name RW reserved Reserved … … reserved RW www.onsemi.com 48 NOIV1SN025KA Table 34. REGISTER MAP Address Offset Address Bit Field [15:0] Register Name Default Hex Default reserved Description Access Reserved Sequencer [Block Offset: 192] 0 192 general_configuration 3 0x0 0 Enable sequencer ‘0’ = Idle, ‘1’ = enabled [1] rolling_shutter_enable 0x0 0 Operation Selection ‘0’ = Global Shutter, ‘1’ = Rolling Shutter [2] reserved 0x0 0 Reserved [3] reserved 0x0 0 Reserved [4] triggered_mode 0x0 0 Triggered Mode Selection (Global Shutter only) ‘0’ = Normal Mode, ‘1’ = Triggered Mode [5] slave_mode 0x0 0 Master/Slave Selection (Global Shutter only) ‘0’ = master, ‘1’ = slave [6] reserved 0x0 0 Reserved [7] subsampling 0x0 0 Subsampling mode selection ‘0’ = no subsampling, ‘1’ = subsampling [8] binning 0x0 0 Binning mode selection ‘0’ = no binning, ‘1’ = binning [9] reserved 0x0 0 Reserved [10] reserved 0x0 0 Reserved monitor_select 0x0 0 Control of the monitor pins Reserved 193 reserved delay_configuration [7:0] rs_x_length [15:8] reserved 194 195 RW enable [14] 2 0 [0] [13:11] 1 0x0000 integration_control 0x0 0 0x0000 0 0x00 0 X-Readout duration in rolling shutter mode (extends lines with dummy pixels). Reserved 0x00 0 0x0004 4 RW RW [1:0] reserved 0x0 0 Reserved [2] fr_mode 0x1 1 Representation of fr_length. ‘0’: reset length ‘1’: frame length [3] reserved 0x0 0 Reserved [5:4] reserved 0x0 0 Reserved [8] reserved 0x0 0 Reserved [9] reserved 0x0 0 Reserved [10] reserved 0x0 0 Reserved 0x0001 1 roi_active0 www.onsemi.com 49 RW NOIV1SN025KA Table 34. REGISTER MAP Address Offset 4 Address Bit Field Register Name Default Hex Default Description [0] roi_active0 0x1 1 Selection of ROI 0 ‘0’ = inactive, ‘1’ = active [1] roi_active1 0x0 0 Selection of ROI 1 ‘0’ = inactive, ‘1’ = active [2] roi_active2 0x0 0 Selection of ROI 2 ‘0’ = inactive, ‘1’ = active [3] roi_active3 0x0 0 Selection of ROI 3 ‘0’ = inactive, ‘1’ = active [4] roi_active4 0x0 0 Selection of ROI 4 ‘0’ = inactive, ‘1’ = active [5] roi_active5 0x0 0 Selection of ROI 5 ‘0’ = inactive, ‘1’ = active [6] roi_active6 0x0 0 Selection of ROI 6 ‘0’ = inactive, ‘1’ = active [7] roi_active7 0x0 0 Selection of ROI 7 ‘0’ = inactive, ‘1’ = active [8] roi_active8 0x0 0 Selection of ROI 8 ‘0’ = inactive, ‘1’ = active [9] roi_active9 0x0 0 Selection of ROI 9 ‘0’ = inactive, ‘1’ = active [10] roi_active10 0x0 0 Selection of ROI 10 ‘0’ = inactive, ‘1’ = active [11] roi_active11 0x0 0 Selection of ROI 11 ‘0’ = inactive, ‘1’ = active [12] roi_active12 0x0 0 Selection of ROI 12 ‘0’ = inactive, ‘1’ = active [13] roi_active13 0x0 0 Selection of ROI 13 ‘0’ = inactive, ‘1’ = active [14] roi_active14 0x0 0 Selection of ROI 14 ‘0’ = inactive, ‘1’ = active [15] roi_active15 0x0 0 Selection of ROI 15 ‘0’ = inactive, ‘1’ = active roi_active1 0x0000 0 [0] roi_active16 0x0 0 Selection of ROI 16 ‘0’ = inactive, ‘1’ = active [1] roi_active17 0x0 0 Selection of ROI 17 ‘0’ = inactive, ‘1’ = active [2] roi_active18 0x0 0 Selection of ROI 18 ‘0’ = inactive, ‘1’ = active [3] roi_active19 0x0 0 Selection of ROI 19 ‘0’ = inactive, ‘1’ = active [4] roi_active20 0x0 0 Selection of ROI 20 ‘0’ = inactive, ‘1’ = active [5] roi_active21 0x0 0 Selection of ROI 21 ‘0’ = inactive, ‘1’ = active [6] roi_active22 0x0 0 Selection of ROI 22 ‘0’ = inactive, ‘1’ = active 196 www.onsemi.com 50 Access RW NOIV1SN025KA Table 34. REGISTER MAP Address Offset 5 Address Bit Field 0 Selection of ROI 23 ‘0’ = inactive, ‘1’ = active [8] roi_active24 0x0 0 Selection of ROI 24 ‘0’ = inactive, ‘1’ = active [9] roi_active25 0x0 0 Selection of ROI 25 ‘0’ = inactive, ‘1’ = active [10] roi_active26 0x0 0 Selection of ROI 26 ‘0’ = inactive, ‘1’ = active [11] roi_active27 0x0 0 Selection of ROI 27 ‘0’ = inactive, ‘1’ = active [12] roi_active28 0x0 0 Selection of ROI 28 ‘0’ = inactive, ‘1’ = active [13] roi_active29 0x0 0 Selection of ROI 29 ‘0’ = inactive, ‘1’ = active [14] roi_active30 0x0 0 Selection of ROI 30 ‘0’ = inactive, ‘1’ = active [15] roi_active31 0x0 0 Selection of ROI 31 ‘0’ = inactive, ‘1’ = active black_lines 0x0102 258 black_lines 0x02 2 Number of black lines. Range 1-255 gate_first_line 0x1 1 Blank out first line ‘0’: No blank-out ‘1’: Blank-out dummy_lines 0x0000 0 dummy_lines 0x000 0 mult_timer 0x0001 1 mult_timer 0x0001 1 fr_length 0x0000 0 fr_length 0x0000 0 exposure 0x0000 0 exposure 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 197 198 199 [15:0] 200 [15:0] 9 201 [15:0] 10 Description 0x0 [11:0] 8 Default roi_active23 [8] 7 Default Hex [7] [7:0] 6 Register Name 202 [15:0] www.onsemi.com 51 Access RW RW Number of Dummy lines (Rolling Shutter only) Range 0-4095 RW Mult Timer (Global Shutter only) Defines granularity (unit = 1/62MHz) of exposure and reset_length RW Frame/Reset length (Global Shutter only) Reset length when fr_mode = ‘0’, Frame Length when fr_mode = ‘1’ Granularity defined by mult_timer RW Exposure Time Rolling Shutter: granularity lines Global Shutter: granularity defined by mult_timer RW Reserved NOIV1SN025KA Table 34. REGISTER MAP Address Offset Address 11 203 Bit Field [15:0] 12 204 reserved 0x0000 0 reserved 0x0000 0 gain_configuration 0x01E2 482 Description Reserved RW mux_gainsw 0x02 2 Column Gain Setting afe_gain 0x0F 15 AFE Programmable Gain Setting 0x0 0 Postpone gain update by 1 frame when ‘1’ to compensate for exposure time update latency. Gain is applied at start of next frame if ‘0’ digital_gain_configuration 0x0080 128 db_gain 0x080 128 sync_configuration 0x033F 831 [0] sync_rs_x_length 0x1 1 Update of rs_x_length will not be sync’ed at start of frame when ‘0’ [1] sync_black_lines 0x1 1 Update of black_lines will not be sync’ed at start of frame when ‘0’ [2] sync_dummy_lines 0x1 1 Update of dummy_lines will not be sync’ed at start of frame when ‘0’ [3] sync_exposure 0x1 1 Update of exposure parameters will not be sync’ed at start of frame when ‘0’ [4] sync_gain 0x1 1 Update of gain parameters (gain_sw, afe_gain) will not be sync’ed at start of frame when ‘0’ [5] sync_roi 0x1 1 Update of roi updates (active_roi) will not be sync’ed at start of frame when ‘0’ [8] blank_roi_switch 0x1 1 Blank first frame after ROI switching [9] blank_subsampling_ss 0x1 1 Blank first frame after subsampling/binning mode switching in Global shutter mode (always blanked out in rolling shutter mode) [10] exposure_sync_mode 0x0 0 When ‘0’, exposure parameters are sync’ed at the start of FOT. When ‘1’, exposure parameters sync is disabled (continuously syncing). This mode is only relevant for Triggered Global - master mode, where the exposure parameters are sync’ed at the start of exposure rather than the start of FOT. For all other modes it should be set to ‘0’. Note: Sync is still postponed if sync_exposure=‘0’. 205 206 gain_lat_comp www.onsemi.com 52 Access RW [4:0] [11:0] 14 Default [12:5] [13] 13 Default Hex Register Name RW Digital Gain 5.7 unsigned format RW NOIV1SN025KA Table 34. REGISTER MAP Address Offset Address 16 208 [15:0] 17 209 [15:0] 18 210 [15:0] 19 211 [15:0] 20 212 [15:0] 21 22 24 25 26 27 28 29 213 0 mult_timer 0x0000 0 reset_length_status 0x0000 0 reset_length 0x0000 0 exposure_status 0x0000 0 exposure 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 Mult Timer Status (Master Global Shutter only) RO Current Reset Length (not in Slave mode) RO Current Exposure Time (not in Slave mode) RO Reserved RO Reserved 0 0x00 0 Current Column Gain Setting [12:5] afe_gain 0x00 0 Current AFE Programmable Gain digital_gain_status 0x0000 0 [11:0] db_gain 0x000 0 Current Digital Gain [13:12] reserved 0x0 0 Reserved reserved 0x7F00 32512 [6:0] reserved 0x00 0 Reserved [14:8] reserved 0x7F 127 Reserved reserved 0x261E 9758 [6:0] reserved 0x1E 30 Reserved [14:8] reserved 0x26 38 Reserved reserved 0x160E 5646 [6:0] reserved 0xE 14 Reserved [14:8] reserved 0x16 22 Reserved reserved 0x3E2E 15918 [6:0] reserved 0x2E 46 Reserved [14:8] reserved 0x3E 62 Reserved reserved 0x6750 26448 [6:0] reserved 0x50 80 Reserved [14:8] reserved 0x67 103 Reserved reserved 0.0008 8 reserved 0x08 8 219 220 221 [6:0] … RO RO RW RW RW RW RW RW Reserved … reserved [13:0] Access RO 0x0000 218 255 0x0000 mux_gainsw 217 63 mult_timer_status Description gain_status 216 … Default Register Name [4:0] 214 … Default Hex Bit Field RW reserved Reserved Sequencer ROI [Block Offset: 256] 0 256 roi0_configuration0 0x4F00 www.onsemi.com 53 20224 RW NOIV1SN025KA Table 34. REGISTER MAP Address Offset Address 1 257 2 258 Bit Field 0 ROI 0 X Start Configuration [15:8] x_end 0x4F 79 ROI 0 X End Configuration 0x0000 0 roi0_configuration1 259 7 10 13 RW roi1_configuration1 0x0000 0 y_start 0x0000 0 roi1_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi2_configuration0 0x4F00 20224 0x00 0 ROI 2 X Start Configuration ROI 2 X End Configuration [7:0] x_start [15:8] x_end 264 265 0x4F 79 roi2_configuration1 0x0000 0 y_start 0x0000 0 roi2_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi3_configuration0 0x4F00 20224 RW ROI 1 Y Start Configuration RW ROI 1 Y End Configuration RW RW ROI 2 Y Start Configuration RW ROI 2 Y End Configuration RW [7:0] x_start 0x00 0 ROI 3 X Start Configuration [15:8] x_end 0x4F 79 ROI 3 X End Configuration roi3_configuration1 0x0000 0 y_start 0x0000 0 roi3_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi4_configuration0 266 267 268 RW ROI 3 Y Start Configuration RW ROI 3 Y End Configuration 0x4F00 20224 [7:0] x_start 0x00 0 ROI 4 X Start Configuration [15:8] x_end 0x4F 79 ROI 4 X End Configuration roi4_configuration1 0x0000 0 y_start 0x0000 0 roi4_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi5_configuration0 0x4F00 20224 269 [12:0] RW RW ROI 4 Y Start Configuration RW ROI 4 Y End Configuration RW [7:0] x_start 0x00 0 ROI 5 X Start Configuration [15:8] x_end 0x4F 79 ROI 5 X End Configuration roi5_configuration1 0x0000 0 y_start 0x0000 0 roi5_configuration2 0x13FF 5119 y_end 0x13FF 5119 272 [12:0] 17 20224 ROI 1 X End Configuration [12:0] 16 0x4F00 79 263 271 roi1_configuration0 ROI 0 Y End Configuration 0x4F 262 15 5119 x_end 261 270 0x13FF RW [15:8] 260 14 y_end ROI 0 Y Start Configuration ROI 1 X Start Configuration [12:0] 12 5119 0 [12:0] 11 0 0x13FF 0x00 [12:0] 9 0x0000 roi0_configuration2 x_start [12:0] 8 y_start 273 [12:0] www.onsemi.com 54 Access RW [7:0] [12:0] 6 Description 0x00 [12:0] 5 Default x_start [12:0] 4 Default Hex [7:0] [12:0] 3 Register Name RW ROI 5 Y Start Configuration RW ROI 5 Y End Configuration NOIV1SN025KA Table 34. REGISTER MAP Address Offset Address 18 274 19 Bit Field 22 25 x_end 0x4F 79 ROI 6 X End Configuration roi6_configuration1 0x0000 0 y_start 0x0000 0 roi6_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi7_configuration0 0x4F00 20224 0x00 0 ROI 7 X Start Configuration ROI 7 X End Configuration 275 276 277 [7:0] x_start [15:8] x_end 278 279 280 28 5119 roi8_configuration0 0x4F00 20224 ROI 7 Y End Configuration RW roi8_configuration1 0x0000 0 y_start 0x0000 0 roi8_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi9_configuration0 RW ROI 8 Y Start Configuration RW ROI 8 Y End Configuration 0x4F00 20224 [7:0] x_start 0x00 0 ROI 9 X Start Configuration [15:8] x_end 0x4F 79 ROI 9 X End Configuration roi9_configuration1 0x0000 0 y_start 0x0000 0 roi9_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi10_configuration0 0x4F00 20224 RW RW ROI 9 Y Start Configuration RW ROI 9 Y End Configuration RW [7:0] x_start 0x00 0 ROI 10 X Start Configuration [15:8] x_end 0x4F 79 ROI 10 X End Configuration roi10_configuration1 0x0000 0 y_start 0x0000 0 roi10_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi11_configuration0 0x4F00 20224 289 291 0x13FF ROI 8 X End Configuration [12:0] 35 y_end RW ROI 8 X Start Configuration 288 290 5119 0 287 34 0x13FF 79 [12:0] 33 roi7_configuration2 ROI 7 Y Start Configuration 0x00 [12:0] 32 0 RW 0x4F [12:0] 31 0x0000 RW x_end 284 286 y_start ROI 6 Y End Configuration x_start 283 30 0 RW [7:0] 282 285 79 0x0000 RW ROI 6 Y Start Configuration [15:8] 281 29 0x4F roi7_configuration1 RW ROI 10 Y Start Configuration RW ROI 10 Y End Configuration RW [7:0] x_start 0x00 0 ROI 11 X Start Configuration [15:8] x_end 0x4F 79 ROI 11 X End Configuration 0x0000 0 roi11_configuration1 [12:0] y_start 0x0000 0 roi11_configuration2 0x13FF 5119 www.onsemi.com 55 Access RW [15:8] [12:0] 27 20224 ROI 6 X Start Configuration [12:0] 26 0x4F00 0 [12:0] 24 roi6_configuration0 Description 0x00 [12:0] 23 Default x_start [12:0] 21 Default Hex [7:0] [12:0] 20 Register Name RW ROI 11 Y Start Configuration RW NOIV1SN025KA Table 34. REGISTER MAP Address Offset Address Bit Field [12:0] 36 37 292 40 43 294 295 roi12_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi13_configuration0 0x4F00 20224 ROI 12 Y Start Configuration RW ROI 12 Y End Configuration RW 0 y_start 0x0000 0 roi13_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi14_configuration0 RW ROI 13 Y Start Configuration RW ROI 13 Y End Configuration 0x4F00 20224 [7:0] x_start 0x00 0 ROI 14 X Start Configuration [15:8] x_end 0x4F 79 ROI 14 X End Configuration roi14_configuration1 0x0000 0 y_start 0x0000 0 roi14_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi15_configuration0 0x4F00 20224 RW RW ROI 14 Y Start Configuration RW ROI 14 Y End Configuration RW [7:0] x_start 0x00 0 ROI 15 X Start Configuration [15:8] x_end 0x4F 79 ROI 15 X End Configuration roi15_configuration1 0x0000 0 y_start 0x0000 0 roi15_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi16_configuration0 0x4F00 20224 RW ROI 15 Y Start Configuration RW ROI 15 Y End Configuration RW [7:0] x_start 0x00 0 ROI 16 X Start Configuration [15:8] x_end 0x4F 79 ROI 16 X End Configuration 0x0000 0 roi16_configuration1 [12:0] 52 0 0x0000 [12:0] 51 0x0000 roi13_configuration1 304 306 y_start RW ROI 13 X End Configuration [12:0] 50 0 ROI 13 X Start Configuration 303 305 79 0x0000 0 302 49 ROI 12 X End Configuration 0x4F roi12_configuration1 79 [12:0] 48 ROI 12 X Start Configuration 0x00 [12:0] 47 0 0x4F [12:0] 46 0x00 RW x_end 299 301 20224 x_start 298 45 0x4F00 307 y_start 0x0000 0 roi16_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi17_configuration0 0x4F00 20224 RW ROI 16 Y Start Configuration RW ROI 16 Y End Configuration RW [7:0] x_start 0x00 0 ROI 17 X Start Configuration [15:8] x_end 0x4F 79 ROI 17 X End Configuration roi17_configuration1 0x0000 0 y_start 0x0000 0 308 [12:0] www.onsemi.com 56 Access ROI 11 Y End Configuration [7:0] 297 300 roi12_configuration0 Description [15:8] 296 44 5119 x_end [12:0] 42 0x13FF [15:8] 293 [12:0] 41 y_end x_start [12:0] 39 Default [7:0] [12:0] 38 Default Hex Register Name RW ROI 17 Y Start Configuration NOIV1SN025KA Table 34. REGISTER MAP Address Offset Address 53 309 Bit Field [12:0] 54 55 310 58 0x0000 0 y_start 0x0000 0 roi18_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi19_configuration0 20224 0 ROI 19 X Start Configuration [15:8] x_end 0x4F 79 ROI 19 X End Configuration roi19_configuration1 0x0000 0 y_start 0x0000 0 roi19_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi20_configuration0 0x4F00 20224 70 ROI 19 Y Start Configuration RW ROI 19 Y End Configuration RW 0x00 0 ROI 20 X Start Configuration [15:8] x_end 0x4F 79 ROI 20 X End Configuration roi20_configuration1 0x0000 0 y_start 0x0000 0 roi20_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi21_configuration0 0x4F00 20224 RW ROI 20 Y Start Configuration RW ROI 20 Y End Configuration RW [7:0] x_start 0x00 0 ROI 21 X Start Configuration [15:8] x_end 0x4F 79 ROI 21 X End Configuration 0x0000 0 roi21_configuration1 322 y_start 0x0000 0 roi21_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi22_configuration0 0x4F00 20224 RW ROI 21 Y Start Configuration RW ROI 21 Y End Configuration RW [7:0] x_start 0x00 0 ROI 22 X Start Configuration [15:8] x_end 0x4F 79 ROI 22 X End Configuration roi22_configuration1 0x0000 0 y_start 0x0000 0 roi22_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi23_configuration0 0x4F00 20224 0x00 0 ROI 23 X Start Configuration 0x4F 79 ROI 23 X End Configuration 0x0000 0 323 324 325 326 RW x_start [12:0] 69 RW [7:0] [12:0] 68 ROI 18 Y End Configuration 0x00 [12:0] 67 RW 0x4F00 [12:0] 66 ROI 18 Y Start Configuration x_start 319 321 RW [7:0] [12:0] 65 RW roi18_configuration1 318 320 20224 ROI 18 X End Configuration 317 64 0x4F00 ROI 18 X Start Configuration [12:0] 63 roi18_configuration0 ROI 17 Y End Configuration 0 [12:0] 62 5119 79 [12:0] 61 0x13FF 0x00 314 316 y_end [7:0] x_start [15:8] x_end roi23_configuration1 www.onsemi.com 57 Access RW 0x4F 313 60 5119 x_end 312 315 0x13FF x_start 311 59 roi17_configuration2 Description [7:0] [12:0] 57 Default [15:8] [12:0] 56 Default Hex Register Name RW ROI 22 Y Start Configuration RW ROI 22 Y End Configuration RW RW NOIV1SN025KA Table 34. REGISTER MAP Address Offset Address Bit Field [12:0] 71 327 [12:0] 72 73 328 75 331 336 ROI 24 X End Configuration roi24_configuration1 0x0000 0 y_start 0x0000 0 roi24_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi25_configuration0 0x4F00 20224 85 ROI 24 Y Start Configuration RW ROI 24 Y End Configuration RW 0x00 0 ROI 25 X Start Configuration [15:8] x_end 0x4F 79 ROI 25 X End Configuration roi25_configuration1 0x0000 0 y_start 0x0000 0 roi25_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi26_configuration0 0x4F00 20224 RW ROI 25 Y Start Configuration RW ROI 25 Y End Configuration RW [7:0] x_start 0x00 0 ROI 26 X Start Configuration [15:8] x_end 0x4F 79 ROI 26 X End Configuration 0x0000 0 roi26_configuration1 337 y_start 0x0000 0 roi26_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi27_configuration0 0x4F00 20224 RW ROI 26 Y Start Configuration RW ROI 26Y End Configuration RW [7:0] x_start 0x00 0 ROI 27 X Start Configuration [15:8] x_end 0x4F 79 ROI 27 X End Configuration roi27_configuration1 0x0000 0 y_start 0x0000 0 roi27_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi28_configuration0 0x4F00 20224 0x00 0 ROI 28 X Start Configuration ROI 28 X End Configuration 338 339 340 [7:0] x_start [15:8] x_end 341 342 [12:0] 87 RW x_start [12:0] 86 RW [7:0] [12:0] 84 roi24_configuration0 ROI 23 Y End Configuration 79 [12:0] 83 5119 0x4F [12:0] 82 0x13FF x_end [12:0] 81 y_end RW [15:8] 334 80 5119 ROI 24 X Start Configuration 333 335 0x13FF 0 332 79 roi23_configuration2 343 0x4F 79 roi28_configuration1 0x0000 0 y_start 0x0000 0 roi28_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi29_configuration0 0x4F00 20224 RW ROI 27 Y Start Configuration RW ROI 27 Y End Configuration RW RW ROI 28 Y Start Configuration RW ROI 28 Y End Configuration RW [7:0] x_start 0x00 0 ROI 29 X Start Configuration [15:8] x_end 0x4F 79 ROI 29 X End Configuration www.onsemi.com 58 Access ROI 23 Y Start Configuration 20224 [12:0] 78 0 0x00 [12:0] 77 0x0000 0x4F00 [12:0] 76 y_start Description x_start [12:0] 330 Default [7:0] 329 74 Default Hex Register Name NOIV1SN025KA Table 34. REGISTER MAP Address Offset Address 88 344 [12:0] 89 345 90 346 [12:0] 91 351 y_start 0x0000 0 roi29_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi30_configuration0 0x4F00 20224 ROI 29 Y Start Configuration RW ROI 29 Y End Configuration RW [15:8] x_end 0x4F 79 ROI 30 X End Configuration roi30_configuration1 0x0000 0 y_start 0x0000 0 roi30_configuration2 0x13FF 5119 y_end 0x13FF 5119 roi31_configuration0 0x4F00 20224 RW ROI 30 Y Start Configuration RW ROI 30 Y End Configuration RW [7:0] x_start 0x00 0 ROI 31 X Start Configuration [15:8] x_end 0x4F 79 ROI 31 X End Configuration 0x0000 0 roi31_configuration1 [12:0] [12:0] y_start 0x0000 0 roi31_configuration2 0x13FF 5119 y_end 0x13FF 5119 Access RW ROI 30 X Start Configuration 349 95 0 0 348 350 0x0000 0x00 347 94 roi29_configuration1 Description x_start [12:0] 93 Default Register Name [7:0] [12:0] 92 Default Hex Bit Field RW ROI 31 Y Start Configuration RW ROI 31 Y End Configuration Sequencer Program [Block Offset: 384] 0 384 reserved [15:0] reserved Reserved … … … … 127 511 reserved [15:0] RW RW reserved Reserved NOTE: applicable to Production silicon only and is not backward compatible with “ES1” silicon www.onsemi.com 59 NOIV1SN025KA PACKAGE INFORMATION Pin Description Refer to Electrical Specifications on page 5 for power supplies and references. The CMOS outputs follow the JEDEC Standard (JEDEC−JESD8C−01). Table 35. PIN DESCRIPTION Pin No. Name Type Direction Description A01 vddd_18 Supply Digital supply - 1.8 V domain A02 mbs2_out Analog Out For test purposes only. Do not connect A03 adc_dout1 CMOS Out For test purposes only. Do not connect A04 gnd_colbias Ground Column biasing ground - Connect to ground A05 gnd_colbias Ground Column biasing ground - Connect to ground A06 vdda_33 Supply Analog supply - 3.3 V domain A07 vdda_33 Supply Analog supply - 3.3 V domain A08 vdda_33 Supply Analog supply - 3.3 V domain A09 vdda_33 Supply Analog supply - 3.3 V domain A10 vdda_33 Supply Analog supply - 3.3 V domain A11 vdda_33 Supply Analog supply - 3.3 V domain A12 vdda_33 Supply Analog supply - 3.3 V domain A13 vdda_33 Supply Analog supply - 3.3 V domain A14 vdda_33 Supply Analog supply - 3.3 V domain A15 vdda_33 Supply Analog supply - 3.3 V domain A16 vdda_33 Supply Analog supply - 3.3 V domain A17 vdda_33 Supply Analog supply - 3.3 V domain A18 vdda_33 Supply Analog supply - 3.3 V domain A19 vdda_33 Supply Analog supply - 3.3 V domain A20 vdda_33 Supply Analog supply - 3.3 V domain A21 vdda_33 Supply Analog supply - 3.3 V domain A22 vdda_33 Supply Analog supply - 3.3 V domain A23 vdda_33 Supply Analog supply - 3.3 V domain A24 vddd_18 Supply Digital supply - 1.8 V domain A25 vddd_18 Supply Digital supply - 1.8 V domain B01 vddd_33 Supply Digital supply - 3.3 V domain B02 ibias_master Analog In/Out B03 adc_dout2 CMOS Out B04 gnd_colbias Ground B05 doutn30 LVDS Out LVDS data out negative - Channel 30 B06 doutp28 LVDS Out LVDS data out positive - Channel 28 B07 doutn27 LVDS Out LVDS data out negative - Channel 27 B08 doutn25 LVDS Out LVDS data out negative - Channel 25 B09 doutn23 LVDS Out LVDS data out negative - Channel 23 B10 doutn21 LVDS Out LVDS data out negative - Channel 21 B11 doutn19 LVDS Out LVDS data out negative - Channel 19 B12 doutp17 LVDS Out LVDS data out positive - Channel 17 B13 doutn16 LVDS Out LVDS data out negative - Channel 16 Bias reference - Connect with 47 kW to ground For test purposes only. Do not connect Column biasing ground - Connect to ground www.onsemi.com 60 NOIV1SN025KA Table 35. PIN DESCRIPTION Pin No. Name Type Direction Description B14 doutn14 LVDS Out LVDS data out negative - Channel 14 B15 doutp12 LVDS Out LVDS data out positive - Channel 12 B16 doutp10 LVDS Out LVDS data out positive - Channel 10 B17 doutp8 LVDS Out LVDS data out positive - Channel 8 B18 doutp6 LVDS Out LVDS data out positive - Channel 6 B19 doutp4 LVDS Out LVDS data out positive - Channel 4 B20 doutn3 LVDS Out LVDS data out negative - Channel 3 B21 doutp1 LVDS Out LVDS data out positive - Channel 1 B22 gnd_colbias B23 clock_inp LVDS In LVDS clock in positive B24 clock_inn LVDS In LVDS clock in negative Ground Column biasing ground - Connect to ground B25 vddd_33 Supply Digital supply - 3.3 V domain C01 vddd_33 Supply Digital supply - 3.3 V domain C02 ibias_out Analog Not connected C03 adc_dout9 CMOS C04 gnd_colbias Ground C05 doutp30 LVDS Out LVDS data out positive - Channel 30 C06 doutn28 LVDS Out LVDS data out negative - Channel 28 C07 doutp27 LVDS Out LVDS data out positive - Channel 27 C08 doutp25 LVDS Out LVDS data out positive - Channel 25 C09 doutp23 LVDS Out LVDS data out positive - Channel 23 C10 doutp21 LVDS Out LVDS data out positive - Channel 21 C11 doutp19 LVDS Out LVDS data out positive - Channel 19 C12 doutn17 LVDS Out LVDS data out negative - Channel 17 C13 doutp16 LVDS Out LVDS data out positive - Channel 16 C14 doutp14 LVDS Out LVDS data out positive - Channel 14 C15 doutn12 LVDS Out LVDS data out negative - Channel 12 C16 doutn10 LVDS Out LVDS data out negative - Channel 10 C17 doutn8 LVDS Out LVDS data out negative - Channel 8 C18 doutn6 LVDS Out LVDS data out negative - Channel 6 C19 doutn4 LVDS Out LVDS data out negative - Channel 4 C20 doutp3 LVDS Out LVDS data out positive - Channel 3 C21 doutn1 LVDS Out LVDS data out negative - Channel 1 C22 gnd_colbias Ground Column biasing ground - Connect to ground C23 gnd_colbias Ground Column biasing ground - Connect to ground C24 gnd_colbias Ground Column biasing ground - Connect to ground C25 vddd_33 Supply Digital supply - 3.3 V domain D01 mbs1_out Analog Out For test purposes only. Do not connect D02 adc_dout5 CMOS Out For test purposes only. Do not connect D03 adc_dout10 CMOS Out For test purposes only. Do not connect D04 gnd_colbias Ground D05 clock_outp LVDS Out For test purposes only. Do not connect Column biasing ground - Connect to ground Column biasing ground - Connect to ground Out www.onsemi.com 61 LVDS clock out positive NOIV1SN025KA Table 35. PIN DESCRIPTION Pin No. Name Type Direction Description D06 doutn31 LVDS Out LVDS data out negative - Channel 31 D07 doutn29 LVDS Out LVDS data out negative - Channel 29 D08 doutn26 LVDS Out LVDS data out negative - Channel 26 D09 doutn24 LVDS Out LVDS data out negative - Channel 24 D10 doutn22 LVDS Out LVDS data out negative - Channel 22 D11 doutn20 LVDS Out LVDS data out negative - Channel 20 D12 doutn18 LVDS Out LVDS data out negative - Channel 18 D13 doutp15 LVDS Out LVDS data out positive - Channel 15 D14 doutp13 LVDS Out LVDS data out positive - Channel 13 D15 doutp11 LVDS Out LVDS data out positive - Channel 11 D16 doutp9 LVDS Out LVDS data out positive - Channel 9 D17 doutp7 LVDS Out LVDS data out positive - Channel 7 D18 doutp5 LVDS Out LVDS data out positive - Channel 5 D19 doutp2 LVDS Out LVDS data out positive - Channel 2 D20 doutp0 LVDS Out LVDS data out positive - Channel 0 D21 syncp LVDS Out LVDS sync positive D22 gnd_colbias Ground D23 miso CMOS Out SPI master in -slave out D24 mosi CMOS In SPI master out - slave in D25 ss_n CMOS In SPI slave select (active low) E01 adc_dout0 CMOS Out For test purposes only. Do not connect E02 adc_dout4 CMOS Out For test purposes only. Do not connect E03 srd2_n Analog E04 gnd_colbias Ground E05 clock_outn LVDS Out LVDS clock out negative E06 doutp31 LVDS Out LVDS data out positive - Channel 31 E07 doutp29 LVDS Out LVDS data out positive - Channel 29 E08 doutp26 LVDS Out LVDS data out positive - Channel 26 E09 doutp24 LVDS Out LVDS data out positive - Channel 24 E10 doutp22 LVDS Out LVDS data out positive - Channel 22 E11 doutp20 LVDS Out LVDS data out positive - Channel 20 E12 doutp18 LVDS Out LVDS data out positive - Channel 18 E13 doutn15 LVDS Out LVDS data out negative - Channel 15 E14 doutn13 LVDS Out LVDS data out negative - Channel 13 E15 doutn11 LVDS Out LVDS data out negative - Channel 11 E16 doutn9 LVDS Out LVDS data out negative - Channel 9 E17 doutn7 LVDS Out LVDS data out negative - Channel 7 E18 doutn5 LVDS Out LVDS data out negative - Channel 5 E19 doutn2 LVDS Out LVDS data out negative - Channel 2 E20 doutn0 LVDS Out LVDS data out negative - Channel 0 E21 syncn LVDS Out LVDS sync negative E22 gnd_colbias Column biasing ground - Connect to ground Not connected Column biasing ground - Connect to ground Ground Column biasing ground - Connect to ground www.onsemi.com 62 NOIV1SN025KA Table 35. PIN DESCRIPTION Pin No. Name Type Direction Description E23 trigger CMOS In Trigger E24 sclk CMOS In SPI clock E25 reset_n CMOS In Active low system reset F01 adc_dout3 CMOS Out For test purposes only. Do not connect F02 adc_dout6 CMOS Out For test purposes only. Do not connect F03 srd2_nguard Analog Not connected F04 gnd_colbias Ground Column biasing ground - Connect to ground F05 gnd_colbias Ground Column biasing ground - Connect to ground F06 gnd_colbias Ground Column biasing ground - Connect to ground F07 gnd_colbias Ground Column biasing ground - Connect to ground F08 gnd_colbias Ground Column biasing ground - Connect to ground F09 gnd_colbias Ground Column biasing ground - Connect to ground F10 gnd_colbias Ground Column biasing ground - Connect to ground F11 gnd_colbias Ground Column biasing ground - Connect to ground F12 gnd_colbias Ground Column biasing ground - Connect to ground F13 gnd_colbias Ground Column biasing ground - Connect to ground F14 gnd_colbias Ground Column biasing ground - Connect to ground F15 gnd_colbias Ground Column biasing ground - Connect to ground F16 gnd_colbias Ground Column biasing ground - Connect to ground F17 gnd_colbias Ground Column biasing ground - Connect to ground F18 gnd_colbias Ground Column biasing ground - Connect to ground F19 gnd_colbias Ground Column biasing ground - Connect to ground F20 gnd_colbias Ground Column biasing ground - Connect to ground F21 gnd_colbias Ground Column biasing ground - Connect to ground F22 gnd_colbias Ground Column biasing ground - Connect to ground F23 scan_in2 CMOS In Scan chain input #2 - Connect to ground F24 scan_in1 CMOS In Scan chain input #1 - Connect to ground F25 scan_in0 CMOS In Scan chain input #0 - Connect to ground G01 adc_dout8 CMOS Out For test purposes only. Do not connect G02 adc_dout7 CMOS Out For test purposes only. Do not connect G03 afe_clk CMOS Out For test purposes only. Do not connect G04 srd1_nguard Analog Not connected G05 srd1_n Analog Not connected G06 td_anode Analog In/Out Temperature diode - Anode G07 td_cathode Analog In/Out Temperature diode - Cathode G08 mbs3_in Analog In Analog test input - Connect to ground G09 mbs4_in Analog In Analog test input - Connect to ground G10 spare_ana Analog Out For test purposes only. Do not connect G11 spare_ana Analog Out For test purposes only. Do not connect G12 spare_dig_in CMOS In Digital test input - Connect to ground G13 spare_dig_in CMOS In Digital test input - Connect to ground G14 spare_dig_in CMOS In Digital test input - Connect to ground www.onsemi.com 63 NOIV1SN025KA Table 35. PIN DESCRIPTION Pin No. Name Type Direction Description G15 gnd_colbias Ground Column biasing ground - Connect to ground G16 gnd_colbias Ground Column biasing ground - Connect to ground G17 gnd_colbias Ground Column biasing ground - Connect to ground G18 gnd_colbias Ground Column biasing ground - Connect to ground G19 gnd_colbias Ground Column biasing ground - Connect to ground G20 gnd_colbias Ground Column biasing ground - Connect to ground G21 gnd_colbias Ground Column biasing ground - Connect to ground G22 scan_clk CMOS In G23 monitor2 CMOS Out Monitor output #2 G24 monitor1 CMOS Out Monitor output #1 G25 monitor0 CMOS Out Monitor output #0 H21 test_enable CMOS In Test enable - Connect to ground H22 adc_mode CMOS In ADC mode selection Connect to Gndd_33 (‘0’) for 10-bit mode operation, Connect to vddd_33 (‘1’) for 8-bit mode operation H23 spare_dig_out CMOS Not connected H24 spare_dig_out CMOS Not connected H25 spare_dig_out CMOS Not connected J01 spare_vref6t_hv Analog Not connected J02 spare_vref6t_hv Analog Not connected J03 spare_vref6t_hv Analog Not connected J04 spare_vref6t_hv Analog Not connected J05 gndd_33 Ground Digital ground - 3.3 V domain J06 gndd_33 Ground Digital ground - 3.3 V domain J07 gndd_33 Ground Digital ground - 3.3 V domain J08 gndd_33 Ground Digital ground - 3.3 V domain J09 gndd_33 Ground Digital ground - 3.3 V domain J10 gndd_33 Ground Digital ground - 3.3 V domain J11 gndd_33 Ground Digital ground - 3.3 V domain J12 gndd_33 Ground Digital ground - 3.3 V domain J13 gndd_18 Ground Digital ground - 1.8 V domain J14 gndd_18 Ground Digital ground - 1.8 V domain J15 gndd_18 Ground Digital ground - 1.8 V domain J16 gndd_18 Ground Digital ground - 1.8 V domain J17 gndd_18 Ground Digital ground - 1.8 V domain J18 gndd_18 Ground Digital ground - 1.8 V domain J19 gndd_18 Ground Digital ground - 1.8 V domain J20 gndd_18 Ground Digital ground - 1.8 V domain J21 gndd_18 Ground Digital ground - 1.8 V domain J22 gnd_trans Ground Pixel transfer ground - Connect to ground J23 gnd_respd Supply Photo diode reset ground - sinking supply J24 gnd_resfd Ground Floating diffusion reset ground - Connect to ground www.onsemi.com 64 Scan chain clock - Connect to ground NOIV1SN025KA Table 35. PIN DESCRIPTION Pin No. Name Type Direction Description J25 gnd_resfd Ground Floating diffusion reset ground - Connect to ground K01 spare_vref6t Analog Not connected K02 spare_vref6t Analog Not connected K03 spare_vref6t Analog Not connected K04 spare_vref6t Analog Not connected K05 spare_vref6t Analog Not connected K06 spare_vref6t Analog Not connected K07 spare_vref6t Analog Not connected K08 spare_vref6t Analog Not connected K9 vdd_pix Supply Pixel array supply K10 vdd_pix Supply Pixel array supply K11 vdd_pix Supply Pixel array supply K12 vdd_pix Supply Pixel array supply K13 vdd_pix Supply Pixel array supply K14 vdd_pix Supply Pixel array supply K15 vdd_pix Supply Pixel array supply K16 vdd_pix Supply Pixel array supply K17 gnd_sel Ground Pixel select ground - Connect to ground K18 gnd_sel Ground Pixel select ground - Connect to ground K19 gnd_sel Ground Pixel select ground - Connect to ground K20 gnd_sel Ground Pixel select ground - Connect to ground K21 vdd_trans Supply Pixel transfer supply K22 gnd_trans Ground Pixel transfer ground - Connect to ground K23 gnd_respd Supply Photo diode reset ground - sinking supply K24 gnd_resfd Ground Floating diffusion reset ground - Connect to ground K25 gnd_resfd Ground Floating diffusion reset ground - Connect to ground L01 vref_colmux Supply Column multiplexer reference supply L02 vdd_pix Supply Pixel array supply L03 vdd_pix Supply Pixel array supply L04 vdd_pix Supply Pixel array supply L05 vdd_pix Supply Pixel array supply L06 vdd_pix Supply Pixel array supply L07 vdd_pix Supply Pixel array supply L08 vdd_pix Supply Pixel array supply L09 vdd_pix Supply Pixel array supply L10 vdd_pix Supply Pixel array supply L11 vdd_pix Supply Pixel array supply L12 vdd_pix Supply Pixel array supply L13 vdd_pix Supply Pixel array supply L14 vdd_pix Supply Pixel array supply L15 vdd_pix Supply Pixel array supply L16 vdd_pix Supply Pixel array supply www.onsemi.com 65 NOIV1SN025KA Table 35. PIN DESCRIPTION Pin No. Name Type Direction Description L17 vdd_casc Supply Cascode supply L18 vdd_casc Supply Cascode supply L19 vdd_sel Supply Pixel select supply L20 vdd_sel Supply Pixel select supply L21 vdd_trans Supply Pixel transfer supply L22 gnd_trans Ground Pixel transfer ground - Connect to ground L23 gnd_respd Supply Photo diode reset ground - sinking supply L24 vdd_resfd Supply Floating diffusion reset supply L25 vref_colmux Supply Column multiplexer reference supply M01 vref_colmux Supply Column multiplexer reference supply M02 vdd_pix Supply Pixel array supply M03 vdd_pix Supply Pixel array supply M04 vdd_pix Supply Pixel array supply M05 vdd_pix Supply Pixel array supply M06 vdd_pix Supply Pixel array supply M07 vdd_pix Supply Pixel array supply M08 vdd_pix Supply Pixel array supply M09 vdd_pix Supply Pixel array supply M10 vdd_pix Supply Pixel array supply M11 vdd_pix Supply Pixel array supply M12 vdd_pix Supply Pixel array supply M13 vdd_pix Supply Pixel array supply M14 vdd_pix Supply Pixel array supply M15 vdd_pix Supply Pixel array supply M16 vdd_pix Supply Pixel array supply M17 vdd_casc Supply Cascode supply M18 vdd_casc Supply Cascode supply M19 vdd_sel Supply Pixel select supply M20 vdd_sel Supply Pixel select supply M21 vdd_trans Supply Pixel transfer supply M22 gnd_trans Ground Pixel transfer ground - Connect to ground M23 gnd_respd Supply Photo diode reset ground - sinking supply M24 vdd_resfd Supply Floating diffusion reset supply M25 vref_colmux Supply Column multiplexer reference supply N01 vddd_33 Supply Digital supply - 3.3-V domain N02 vdd_pix Supply Pixel array supply N03 gnd_colpc Ground Column precharge ground - Connect to ground N04 gnd_colpc Ground Column precharge ground - Connect to ground N05 gnd_colpc Ground Column precharge ground - Connect to ground N06 gnd_colpc Ground Column precharge ground - Connect to ground N07 gnd_colpc Ground Column precharge ground - Connect to ground N08 gnd_colpc Ground Column precharge ground - Connect to ground www.onsemi.com 66 NOIV1SN025KA Table 35. PIN DESCRIPTION Pin No. Name Type Direction Description N09 gnd_colpc Ground Column precharge ground - Connect to ground N10 gnd_colpc Ground Column precharge ground - Connect to ground N11 gnd_colpc Ground Column precharge ground - Connect to ground N12 gnd_colpc Ground Column precharge ground - Connect to ground N13 gnd_colpc Ground Column precharge ground - Connect to ground N14 gnd_colpc Ground Column precharge ground - Connect to ground N15 gnd_colpc Ground Column precharge ground - Connect to ground N16 gnd_colpc Ground Column precharge ground - Connect to ground N17 gnd_colpc Ground Column precharge ground - Connect to ground N18 gnd_colpc Ground Column precharge ground - Connect to ground N19 gnd_colpc Ground Column precharge ground - Connect to ground N20 gnd_colpc Ground Column precharge ground - Connect to ground N21 vdd_trans Supply Pixel transfer supply N22 vdd_respd Supply Photo diode reset supply N23 vdd_respd Supply Photo diode reset supply N24 vdd_resfd Supply Floating diffusion reset supply N25 vddd_33 Supply Digital supply - 3.3 V domain P01 vddd_33 Supply Digital supply - 3.3 V domain P02 vdd_pix Supply Pixel array supply P03 gnd_colpc Ground Column precharge ground - Connect to ground P04 gnd_colpc Ground Column precharge ground - Connect to ground P05 gnd_colpc Ground Column precharge ground - Connect to ground P06 gnd_colpc Ground Column precharge ground - Connect to ground P07 gnd_colpc Ground Column precharge ground - Connect to ground P08 gnd_colpc Ground Column precharge ground - Connect to ground P09 gnd_colpc Ground Column precharge ground - Connect to ground P10 gnd_colpc Ground Column precharge ground - Connect to ground P11 gnd_colpc Ground Column precharge ground - Connect to ground P12 gnd_colpc Ground Column precharge ground - Connect to ground P13 gnd_colpc Ground Column precharge ground - Connect to ground P14 gnd_colpc Ground Column precharge ground - Connect to ground P15 gnd_colpc Ground Column precharge ground - Connect to ground P16 gnd_colpc Ground Column precharge ground - Connect to ground P17 gnd_colpc Ground Column precharge ground - Connect to ground P18 gnd_colpc Ground Column precharge ground - Connect to ground P19 gnd_colpc Ground Column precharge ground - Connect to ground P20 gnd_colpc Ground Column precharge ground - Connect to ground P21 gnd_colpc Ground Column precharge ground - Connect to ground P22 vdd_respd Supply Photo diode reset supply P23 vdd_respd Supply Photo diode reset supply P24 vdd_resfd Supply Floating diffusion reset supply P25 vddd_33 Supply Digital supply - 3.3 V domain www.onsemi.com 67 NOIV1SN025KA Table 35. PIN DESCRIPTION Pin No. Name Type Direction Description R01 vddd_18 Supply Digital supply - 1.8 V domain R02 vddd_18 Supply Digital supply - 1.8 V domain R03 vddd_18 Supply Digital supply - 1.8 V domain R04 gnd_colpc Ground Column precharge ground - Connect to ground R05 gnda_33 Ground Analog ground - 3.3 V domain R06 gnda_33 Ground Analog ground - 3.3 V domain R07 gnda_33 Ground Analog ground - 3.3 V domain R08 gnda_33 Ground Analog ground - 3.3 V domain R09 gnda_33 Ground Analog ground - 3.3 V domain R10 gnda_33 Ground Analog ground - 3.3 V domain R11 gnda_33 Ground Analog ground - 3.3 V domain R12 gnda_33 Ground Analog ground - 3.3 V domain R13 gnda_33 Ground Analog ground - 3.3 V domain R14 gnda_33 Ground Analog ground - 3.3 V domain R15 gnda_33 Ground Analog ground - 3.3 V domain R16 gnda_33 Ground Analog ground - 3.3 V domain R17 gnda_33 Ground Analog ground - 3.3 V domain R18 gnda_33 Ground Analog ground - 3.3 V domain R19 gnda_33 Ground Analog ground - 3.3 V domain R20 gnda_33 Ground Analog ground - 3.3 V domain R21 gnda_33 Ground Analog ground - 3.3 V domain R22 gnda_33 Ground Analog ground - 3.3 V domain R23 vddd_18 Supply Digital supply - 1.8 V domain R24 vddd_18 Supply Digital supply - 1.8 V domain R25 vddd_18 Supply Digital supply - 1.8 V domain www.onsemi.com 68 NOIV1SN025KA Mechanical Specifications Table 36. MECHANICAL SPECIFICATIONS Parameter Die (Refer to Figure 38 with Pin A1 bottom right) Glass Lid Specification Description Min Typ Die thickness Max Units 0.75 mm Die center, X offset to the center of package -50 0 50 mm Die center, Y offset to the center of the package -50 0 50 mm Die position, tilt to the die attach pad plane -1 0 1 deg Die rotation accuracy between die scribe and lead fingers of package on all four sides -1 0 1 deg Optical center referenced from the package center with Pin1 located bottom right (X-dir) -50.2 -0.2 49.8 mm Optical center referenced from the package center with Pin1 located bottom right (Y-dir) 3552 3602 3652 mm Distance from bottom of the package to top of the die surface 1.75 mm Distance from top of the die surface to top of the glass lid 1.45 mm XY size (-10%) Thickness 32.47 x 39.4 (+10%) mm2 0.7 Spectral range for glass window 400 Transmission of the Glass lid (refer to Figure 44) Mechanical Shock JESD22-B104C; Condition G Vibration JESD22-B103B; Condition 1 Mounting Profile Pb−free wave soldering profile for pin grid array package Recommended Socket Andon Electronics Corporation (www.andonelectronics.com) 20 69 1000 nm 92 % 2000 G 2000 Hz 10−31−13A−355−400T4−R27−L14 NOTE: Optical center min/max tolerance is calculated on X/Y package tolerances with Pin 1 as a reference. www.onsemi.com mm NOIV1SN025KA Package Drawing All dimensions are in mm, unless specified otherwise. Figure 37. VITA 25K Package Diagram www.onsemi.com 70 NOIV1SN025KA • Active Area outer dimensions Optical Center Information The center of the die (CD) is the center of the cavity The center of the die (CD) is exactly at 50% between the outsides of the two outer seal rings The center of the cavity is exactly at 50% between the insides of the finger pads. • Die outer dimensions: ♦ B4 is the reference for the Die (0,0) in mm ♦ B1 is at (0,32500) mm ♦ B2 is at (25500,32500) mm ♦ B3 is at (25500,0) mm A1 is the at (1214.1, 31387.8) mm A2 is at (24285.6, 31387.8) mm ♦ A3 is at (24285.6, 8316.3) mm ♦ A4 is at (1214.1, 8316.3) mm Center of the Active Area ♦ AA is at (12749.8, 19852) mm Center of the Die ♦ CD is at (12750, 16250) mm ♦ ♦ • • Figure 38. Graphical Representation of the Optical Center www.onsemi.com 71 NOIV1SN025KA Glass Lid As seen in Figure 39, the sensor does not have an infrared attenuating filter glass. A filter must be provided in the optical path when color devices are used (source: http://www.pgo-online.com). The VITA 25K image sensor uses a glass lid without any coatings. Figure 39 shows the transmission characteristics of the glass lid. Figure 39. Transmission Characteristics of Glass Lid SILICON ERRATA VITA 25K Qualification Status This section describes the erratum for the VITA 25K family. Details include erratum trigger conditions, scope of impact, available workaround, and silicon revision applicability. Items [1]. Higher Standby current than rated in data sheet Production Silicon VITA 25K Errata Summary This table defines how the errata applies to the VITA 25K. Part Number Silicon revision VITA 25K family Production Silicon • WORKAROUND Higher Standby Current • PROBLEM DEFINITION Fix Status Silicon fix planned Maintain the device in ‘power-off’, ‘idle’ or ‘running’ modes. • FIX STATUS The cause of this problem and its solution have been identified. Silicon fix is planned to correct the deficiency. • COMPLETION DATE Production silicon with Stand-by current fix is planned. In all states except for ‘idle’ and ‘running’ (including ‘reset’) there can be abnormal high power consumption on vdd_33. • PARAMETERS AFFECTED Power • TRIGGER CONDITION(S) Entering an affected state (reset, standby(1), standby(2)). • SCOPE OF IMPACT High power consumption, not influencing performance when grabbing images. www.onsemi.com 72 NOIV1SN025KA ADDITIONAL REFERENCES AND RESOURCES Application Notes and other resources can be found linked to the product web page at www.onsemi.com. Additional information on this device may also be available in the Image Sensor Portal, accessible within the MyON section of www.onsemi.com. A signed NDA is required to access the Image Sensor Portal – please see your ON Semiconductor sales representative for more information. For quality and reliability information, please download the Quality & Reliability Handbook (HBD851/D) from www.onsemi.com. For information on Standard terms and Conditions of Sale, please download Terms and Conditions document from www.onsemi.com. For information on Return Material Authorization procedures, please refer to the RMA Policy Procedure document from www.onsemi.com. The Product Acceptance Criteria document, which lists criteria to which this device is tested prior to shipment, is available upon request. For information on ESD and cover glass care and cleanliness, please download the Application Note Image Sensor Handling and Best Practices (AN52561/D) from www.onsemi.com. www.onsemi.com 73 NOIV1SN025KA ACRONYMS Acronym Description Acronym Description ADC Analog-to-Digital Converter LE Line End AFE Analog Front End LS Line Start BL Black pixel data LSB least significant bit CDM Charged Device Model LVDS Low-Voltage Differential Signaling CDS Correlated Double Sampling MSB most significant bit CMOS Complementary Metal Oxide Semiconductor PGA Programmable Gain Amplifier CRC Cyclic Redundancy Check PLS Parasitic Light Sensitivity DAC Digital-to-Analog Converter PRBS Pseudo-Random Binary Sequence DDR Double Data Rate PRNU Photo Response Non-Uniformity DNL Differential Non-Llinearity QE Quantum Efficiency DS Double Sampling RGB Red-Green-Blue EIA Electronic Industries Alliance RMA Return Material Authorization ESD Electrostatic Discharge RMS Root Mean Square FE Frame End ROI Region of Interest FOT Frame Overhead Time ROT Row Overhead Time FPGA Field Programmable Gate Array S/H Sample and Hold FPN Fixed Pattern Noise SNR Signal-to-Noise Ratio FPS Frame per Second SPI Serial Peripheral Interface FS Frame Start TIA Telecommunications Industry Association HBM Human Body Model TJ Junction temperature IMG Image data (regular pixel data) TR Training pattern INL Integral Non-Linearity % RH Percent Relative Humidity IP Intellectual Property www.onsemi.com 74 NOIV1SN025KA GLOSSARY conversion gain A constant that converts the number of electrons collected by a pixel into the voltage swing of the pixel. Conversion gain = q/C where q is the charge of an electron (1.602E 19 Coulomb) and C is the capacitance of the photodiode or sense node. CDS Correlated double sampling. This is a method for sampling a pixel where the pixel voltage after reset is sampled and subtracted from the voltage after exposure to light. CFA Color filter array. The materials deposited on top of pixels that selectively transmit color. DNL Differential non-linearity (for ADCs) DSNU Dark signal non-uniformity. This parameter characterizes the degree of non-uniformity in dark leakage currents, which can be a major source of fixed pattern noise. fill-factor A parameter that characterizes the optically active percentage of a pixel. In theory, it is the ratio of the actual QE of a pixel divided by the QE of a photodiode of equal area. In practice, it is never measured. INL Integral nonlinearity (for ADCs) IR Infrared. IR light has wavelengths in the approximate range 750 nm to 1 mm. Lux Photometric unit of luminance (at 550 nm, 1lux = 1 lumen/m2 = 1/683 W/m2) pixel noise Variation of pixel signals within a region of interest (ROI). The ROI typically is a rectangular portion of the pixel array and may be limited to a single color plane. photometric units Units for light measurement that take into account human physiology. PLS Parasitic light sensitivity. Parasitic discharge of sampled information in pixels that have storage nodes. PRNU Photo-response non-uniformity. This parameter characterizes the spread in response of pixels, which is a source of FPN under illumination. QE Quantum efficiency. This parameter characterizes the effectiveness of a pixel in capturing photons and converting them into electrons. It is photon wavelength and pixel color dependent. read noise Noise associated with all circuitry that measures and converts the voltage on a sense node or photodiode into an output signal. reset The process by which a pixel photodiode or sense node is cleared of electrons. ”Soft” reset occurs when the reset transistor is operated below the threshold. ”Hard” reset occurs when the reset transistor is operated above threshold. reset noise Noise due to variation in the reset level of a pixel. In 3T pixel designs, this noise has a component (in units of volts) proportionality constant depending on how the pixel is reset (such as hard and soft). In 4T pixel designs, reset noise can be removed with CDS. responsivity The standard measure of photodiode performance (regardless of whether it is in an imager or not). Units are typically A/W and are dependent on the incident light wavelength. Note that responsivity and sensitivity are used interchangeably in image sensor characterization literature so it is best to check the units. ROI Region of interest. The area within a pixel array chosen to characterize noise, signal, crosstalk, and so on. The ROI can be the entire array or a small subsection; it can be confined to a single color plane. sense node In 4T pixel designs, a capacitor used to convert charge into voltage. In 3T pixel designs it is the photodiode itself. sensitivity A measure of pixel performance that characterizes the rise of the photodiode or sense node signal in Volts upon illumination with light. Units are typically V/(W/m2)/sec and are dependent on the incident light wavelength. Sensitivity measurements are often taken with 550 nm incident light. At this wavelength, 1 683 lux is equal to 1 W/m2; the units of sensitivity are quoted in V/lux/sec. Note that responsivity and sensitivity are used interchangeably in image sensor characterization literature so it is best to check the units. spectral response The photon wavelength dependence of sensitivity or responsivity. SNR Signal-to-noise ratio. This number characterizes the ratio of the fundamental signal to the noise spectrum up to half the Nyquist frequency. temporal noise Noise that varies from frame to frame. In a video stream, temporal noise is visible as twinkling pixels. www.onsemi.com 75 NOIV1SN025KA ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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