Pressure Freescale Semiconductor Data Sheet: Technical Data MPX2053 Rev 9, 10/2012 50 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors MPX2053 Series 0 to 50 kPa (0 to 7.25 psi) 40 mV Full Scale (Typical) The MPX2053 series devices are silicon piezoresistive pressure sensors that provide a highly accurate and linear voltage output directly proportional to the applied pressure. A single, monolithic silicon diaphragm with the strain gauge and an integrated thin-film resistor network. Precise span and offset calibration with temperature compensation are achieved by laser trimming. Application Examples Features • • • • • • • • • • • • Temperature Compensated Over 0C to +85C Easy-to-Use Chip Carrier Package Options Ratiometric to Supply Voltage Gauge Ported and Non Ported Options Available in Easy-to-Use Tape & Reel Differential and Gauge Pressure Options Pump/Motor Control Robotics Level Detectors Medical Diagnostics Pressure Switching Blood Pressure Measurement ORDERING INFORMATION Device Name Case No. None # of Ports Single Small Outline Package (MPXV2053G Series) MPXV2053GP 1369 MPXV2053DP 1351 Unibody Package (MPX2053 Series) MPX2053D 344 • MPX2053DP 344C MPX2053GP 344B MPAK Package (MPXM2053 Series) MPXM2053D 1320 • MPXM2053DT1 1320 • MPXM2053GS 1320A MPXM2053GST1 1320A Dual • Gauge Pressure Type Differential • Absolute Device Marking MPXV2053GP MPXV2053DP • • • • • MPX2053D MPX2053DP MPX2053GP • • MPXM2053D MPXM2053D MPXM2053GS MPXM2053GS • • • © 2005-2009, 2012 Freescale Semiconductor Inc. All rights reserved. • • • Pressure UNIBODY PACKAGES MPX2053D CASE 344-15 MPX2053GP CASE 344B-01 MPX2053DP CASE 344C-01 SMALL OUTLINE PACKAGES MPXV2053GP CASE 1369-01 MPXV2053DP CASE 1351-01 MPAK PACKAGES MPXM2053D/DT1 CASE 1320-02 MPXM2053GS/GST1 CASE 1320A-02 MPX2053 Sensors Freescale Semiconductor, Inc. 2 Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units POP 0 — 50 kPa VS — 10 16 VDC IO — 6.0 — mAdc VFS 38.5 40 41.5 mV Offset(4) — –1.0 — 1.0 mV Sensitivity — V/P — 0.8 — Non-Linearity — –0.6 — 0.4 %VFS Pressure Hysteresis (0 to 50 kPa) — — 0.1 — %VFS Temperature Hysteresis (-40° to 125°C) — — 0.5 — %VFS Temperature Coefficient of Full Scale TCVFS –2.0 — 2.0 %VFS Temperature Coefficient of Offset TCVOFF –1.0 — 1.0 mV ZIN 1000 — 2500 ZOUT 1400 — 3000 Response Time(5) (10% to 90%) tR — 1.0 — ms Warm-Up Time — — 20 — ms Offset Stability(6) — — 0.5 — %VFS Pressure Range(1) (2) Supply Voltage Supply Current Full Scale Span (3) Input Impedance Output Impedance 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Maximum Ratings Table 2. Maximum Ratings(1) Rating Max Value Unit Supply Voltage 16 V Pressure (P1 > P2) 200 kPa Storage Temperature –40 to +125 C Operating Temperature Range –40 to +125 C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPX2053 3 Sensors Freescale Semiconductor, Inc. Pressure Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 3 Thin Film Temperature Compensation and Calibration X-ducer Sensing Element 2 4 Vout+ Vout- 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic Voltage Output versus Applied Differential Pressure The differential voltage output of the sensor is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side relative to the vacuum side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum side relative to the pressure side. On-Chip Temperature Compensation and Calibration Figure 2 shows the minimum, maximum and typical output characteristics of the MPX2053 series at 25C. The output is directly proportional to the differential pressure and is essentially a straight line. 40 VS = 10 Vdc TA = 25C 35 Output (mVdc) A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. TYP 30 25 20 SPAN RANGE (TYP) MAX 15 10 MIN 5 kPa PSI 0 -5 0 12.5 1.8 25 3.6 37.5 5.4 50 7.25 OFFSET (TYP) Figure 2. Output vs. Pressure Differential MPX2053 Sensors Freescale Semiconductor, Inc. 4 Pressure LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 3) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. The specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Least Square Deviation Least Squares Fit Exaggerated Performance Relative Voltage Output Straight Line End Point Straight Line Fit OFFSET 0 50 100 Pressure (% Full scale) Figure 3. Linearity Specification Comparison Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2053 series pressure sensor operating characteristics and internal reliability and qualification tests Silicone Die Coat are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Refer to application note AN3728, for more information regarding media compatibility. Stainless Steel Metal Cover Die P1 Wire Bond Lead Frame P2 Epoxy Case RTV Die Bond Figure 4. Unibody Package — Cross-Sectional Diagram (Not to Scale) MPX2053 5 Sensors Freescale Semiconductor, Inc. PACKAGE DIMENSIONS C R M 1 B 2 -A- 3 Z 4 DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. Y M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 3: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -A- -T- U L R H N PORT #1 POSITIVE PRESSURE (P1) -Q- B 1 2 3 4 PIN 1 K -P0.25 (0.010) J M T Q S S F C G D 4 PL 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2053 6 Sensors Freescale Semiconductor, Inc. PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) N -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- -T- 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE MPX2053 Sensors Freescale Semiconductor, Inc. 7 PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2053 Sensors Freescale Semiconductor, Inc. 8 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2053 9 Sensors Freescale Semiconductor, Inc. PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE D SMALL OUTLINE PACKAGE MPX2053 Sensors Freescale Semiconductor, Inc. 10 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE D SMALL OUTLINE PACKAGE MPX2053 Sensors Freescale Semiconductor, Inc. 11 PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1320-02 ISSUE B MPX2053 Sensors Freescale Semiconductor, Inc. 12 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1320-02 ISSUE B MPX2053 Sensors Freescale Semiconductor, Inc. 13 Pressure PACKAGE DIMENSIONS PIN 4 PIN 1 PAGE 1 OF 2 CASE 1320A-02 ISSUE A MPX2053 Sensors Freescale Semiconductor, Inc. 14 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1320A-02 ISSUE A MPX2053 15 Sensors Freescale Semiconductor, Inc. Pressure Table 3. Revision History Revision number Revision date 9 10/2012 Description of changes • Deleted references to device number MPXV2053GVP throughout the document MPX2053 Sensors Freescale Semiconductor, Inc. 16 How to Reach Us: Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright Home Page: freescale.com Web Support: freescale.com/support licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. 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