OP A8 27 OPA827 OPA2827 OP A2 827 SBOS376C – NOVEMBER 2006 – REVISED AUGUST 2007 Low-Noise, High-Precision, JFET-Input, OPERATIONAL AMPLIFIER FEATURES OFFSET: 250μV (max) DRIFT: 1μV/°C LOW NOISE: 4.5nV/√Hz at 1kHz BANDWIDTH: 18MHz SLEW RATE: 22V/μs BIAS CURRENT: 3pA QUIESCENT CURRENT: 4.5mA/Ch WIDE SUPPLY RANGE: ±4V to ±18V SINGLE PACKAGES: MSOP-8, SO-8 DUAL PACKAGES: SO-8 PowerPAD The OPA827 series of JFET operational amplifiers combines outstanding dc precision with excellent ac performance. It offers 100μV of offset, very low drift (1μV/°C) over temperature, low bias currents, and very low flicker noise of 400nVPP (0.1Hz to 10Hz). It operates over a very wide supply voltage range of ±4V to ±18V on a low 4.5mA supply current. A dual version is also available for the OPA827 family. Excellent ac characteristics, such as 18MHz gain bandwidth (GBW) and 22V/μs slew rate, and precision dc characteristics make the OPA827 series well-suited for a wide range of applications such as 16to 18-bit data acquisition systems, transimpedance (I/V-conversion) amplifiers, filters, precision ±10V front ends, and professional audio applications. APPLICATIONS • • • • • • • • • • PRECISION ±10V INPUT FRONT-ENDS TRANSIMPEDANCE AMPLIFIERS INTEGRATORS ACTIVE FILTERS A/D CONVERTER DRIVERS DAC OUTPUT BUFFERS HIGH-PERFORMANCE AUDIO PROCESS CONTROL TEST EQUIPMENT MEDICAL EQUIPMENT The single version (OPA827) is available in both MSOP-8 and standard SO-8 surface-mount packages. The dual version (OPA2827) is available in the SO-8 PowerPAD for increased power dissipation capability. All versions are specified from –40°C to +125°C. +15V 2.2mF 100nF 100pF 500W ADS8505 200W VIN 500W REF VIN 100pF OPA827 33.2kW 2.2mF AGND1 2.2mF CAP 100nF 2.2mF DGND AGND2 -15V Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2006–2007, Texas Instruments Incorporated PRODUCT PREVIEW • • • • • • • • • • DESCRIPTION OPA827 OPA2827 www.ti.com SBOS376C – NOVEMBER 2006 – REVISED AUGUST 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING Standard Grade OPA827A OPA2827A SO-8 D OPA827A MSOP-8 DGK TBD SO-8 PowerPAD DDA TBD High Grade OPA827I OPA2827I (1) SO-8 D OPA827 MSOP-8 DGK TBD SO-8 PowerPAD DDA TBD For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. PRODUCT PREVIEW ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted) Supply Voltage VALUE UNIT ±20 V Signal Input Terminals Voltage (2) (V–) –0.7 to (V+) +0.7 V Current (2) ±10 mA Differential Input Voltage TBD Output Short-Circuit (3) Operating Temperature –55 to +125 °C Storage Temperature –65 to +150 °C Junction Temperature +150 °C (1) (2) (3) 2 V Continuous Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.7V beyond the supply rails should be current-limited to 10mA or less. Short-circuit to ground, one amplifier per package. Submit Documentation Feedback OPA827 OPA2827 www.ti.com SBOS376C – NOVEMBER 2006 – REVISED AUGUST 2007 PIN ASSIGNMENTS OPA827 SO-8, MSOP-8 (TOP VIEW) NC (1) OPA2827 SO-8 PowerPAD (TOP VIEW) Out A 1 -In A 2 +In A 3 V- 4 (1) 1 8 NC -IN 2 7 V+ +IN 3 6 OUT V- 4 5 NC (1) Exposed Thermal Die Pad on Underside. (Must be connected to V-) 8 V+ 7 Out B 6 -In B 5 +In B Pad PRODUCT PREVIEW (1) NC denotes no internal connection. Submit Documentation Feedback 3 OPA827 OPA2827 www.ti.com SBOS376C – NOVEMBER 2006 – REVISED AUGUST 2007 ELECTRICAL CHARACTERISTICS: VS = ±4V to ±18V BOLDFACE limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted. Standard Grade OPA827A, OPA2827A PARAMETER CONDITIONS MIN TYP MAX TBD 1 High Grade OPA827I, OPA2827I (1) MIN TYP MAX UNIT 250 TBD TBD μV 3.5 TBD TBD OFFSET VOLTAGE Input Offset Voltage Drift VOS VCM = 0V, VS = ±15V dVOS/dT ±0.2 vs Time vs Power Supply PSRR VS = ±4V to ±18V, VCM = 0V ±0.2 TBD 10 VS = ±4V to ±18V, VCM = 0V Over Temperature TBD 30 Channel Separation, dc TBD μV/°C μV/month TBD μV/V TBD μV/V μV/V TBD INPUT BIAS CURRENT Input Bias Current Input Offset Current ±3 TBD ±3 TBD pA TBD TBD TBD TBD pA ±3 TBD ±3 TBD pA IB Over Temperature IOS NOISE Input Voltage Noise: en VS = ±18V, VCM = 0V 0.4 0.4 μVPP f = 1kHz en VS = ±18V, VCM = 0V 4.5 4.5 nV/√Hz f = 10kHz en VS = ±18V, VCM = 0V 4.5 4.5 nV/√Hz in VS = ±18V, VCM = 0V TBD TBD fA/√Hz PRODUCT PREVIEW f = 0.1Hz to 10Hz Input Voltage Noise Density: Input Current Noise Density: f = 1kHz INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio VCM CMRR (V–)+2.5 (V–)+2.5V < VCM < (V+)–2.5V (V+)–2.5 108 Over Temperature (V–)+2.5 (V+)–2.5 TBD V dB TBD TBD dB 1013 TBD 1013 TBD INPUT IMPEDANCE Differential 13 Common-Mode 10 1013 7 7 Ω pF Ω pF OPEN-LOOP GAIN Open-Loop Voltage Gain AOL Over Temperature FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate Settling Time, 0.1% 4 120 TBD TBD dB RL = 2kΩ, (V–)+2.75V <VO <(V+)–2.1V 108 TBD TBD TBD dB CL = 100pF SR tS Overload Recovery Time (1) 114 GBW 0.01% (16-bit) Total Harmonic Distortion + Noise RL = 2kΩ, (V–)+2.75V <VO <(V+)–2.1V THD+N 18 18 MHz G = +1 22 22 V/μs 4V Step, G = +1 TBD TBD ns 4V Step, G = +1 TBD TBD ns VIN • Gain > VS TBD TBD μs G = +1, f = 1kHz TBD TBD % Shaded cells indicate different specifications from low-grade version of device. Submit Documentation Feedback OPA827 OPA2827 www.ti.com SBOS376C – NOVEMBER 2006 – REVISED AUGUST 2007 ELECTRICAL CHARACTERISTICS: VS = ±4V to ±18V (continued) BOLDFACE limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted. Standard Grade OPA827A, OPA2827A PARAMETER CONDITIONS MIN RL = 2kΩ, AOL > 114dB RL = 2kΩ, AOL > 108dB TYP High Grade OPA827I, OPA2827I (1) MAX MIN (V–)+2.75 (V+)–2.1 (V–)+2.75 (V+)–2.1 TYP MAX UNIT (V–)+2.75 (V+)–2.1 V (V–)+2.75 (V+)–2.1 OUTPUT Voltage Output Swing from Rail Over Temperature Output Current Short-Circuit Current Capacitive Load Drive IOUT |VS – VOUT| < 1.5V 30 V 30 mA ISC ±40 ±40 mA CLOAD TBD TBD pF POWER SUPPLY Specified Voltage VS Quiescent Current (per amplifier) IQ ±4 IOUT = 0V ±18 4.5 Over Temperature ±4 TBD 4.5 TBD ±18 V TBD mA TBD mA Specified Rangex (1)x –40 +125 –40 +125 °C Operating Range –55 +125 –55 +125 °C Thermal Resistance (1) PRODUCT PREVIEW TEMPERATURE RANGE ΘJA SO-8, MSOP-8 150 150 °C/W SO-8 PowerPAD TBD TBD °C/W Shaded cells indicate different specifications from low-grade version of device. Submit Documentation Feedback 5 PACKAGE OPTION ADDENDUM www.ti.com 16-Jul-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty OPA827AID PREVIEW SOIC D 8 75 TBD Call TI Call TI POPA827AID PREVIEW SOIC D 8 1500 TBD Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. 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