Stepping Motor Driver Series Low Voltage Stepping Motor Drivers BD6382EFV No.12009EAT02 ●Description This series can drive the bipolar stepping motor used for paper feed carriages. It is a low power consumption bipolar PWM constant current-drive driver. It is suitable for the mobile devices of a battery drive by power save function. It contributes also to reduction of mounting area by ultra-thin and high heat-radiation (exposed metal type) HTSSOP package. ●Feature 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) 11) 12) 13) Low ON resistance DMOS output PWM constant current control (self oscillation) Built-in spike noise cancel function (external noise filter is unnecessary) Power save function Built-in logic input pull-down resistor Power-on reset function Thermal shutdown circuit (TSD) Over current protection circuit (OCP) Under voltage lock out circuit (UVLO) Malfunction prevention at the time of no applied power supply (Ghost Supply Prevention) Electrostatic discharge: 4kV (HBM specification) Adjacent pins short protection Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP package ●Application Mini printer, Handy printer, Monitoring camera, WEB camera, Scanner, Toy, and Robot etc. ●Absolute maximum ratings(Ta=25℃) Item Symbol Ratings Unit Supply voltage VCC VCC -0.2～+7.0 V Supply voltage VM VM -0.2～+15.0 V ※1 W ※2 W 1.1 Power dissipation Pd Input voltage for control pin VIN -0.2～(VCC +0.3) V VRNF 0.5 V RNF maximum voltage 4.0 ※3 Maximum output current IOUT 0.8 A/ch Operating temperature range Topr -40～+85 ℃ Storage temperature range Tstg -55～+150 ℃ Junction temperature Tjmax 150 ℃ ※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 8.8mW/℃ for operating above Ta=25℃. ※2 4-layer recommended board. Derating in done at 32.0mW/℃ for operating above Ta=25℃. ※3 Do not exceed Pd, ASO and Tjmax=150℃. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 1/8 2012.02 - Rev.A Technical Note BD6382EFV ●Operating conditions (Ta=-25～+75℃) Item Symbol Ratings Unit VCC 3.0～5.5 V Supply voltage VM VM 4.0～13.5 V Input voltage for control pin VIN 0～VCC V Output current (DC) IOUT 0.5※4 A/ch Supply voltage VCC ※4 Do not exceed Pd, ASO ●Electrical characteristics Applicable to BD6382EFV(Unless otherwise specified Ta=25℃, VCC=3.3V, VM=6.0V) Item Symbol Limit Min. Typ. Max. ICCST - 0 10 Unit Conditions Whole VCC current at standby VCC current VM current at standby VM current μA PS=L ICC - 1.6 3.0 mA PS=H, VLIMX=0.5V IVMST - 0 10 μA PS=L IVM - 0.08 0.50 mA PS=H, VLIMX=0.5V 2.0 - 3.3 V Control input (PS, IN1A, IN1B, IN2A, IN2B) H level input voltage VINH L level input voltage VINL 0 - 0.8 V H level input current IINH 15 30 60 μA VIN =3V L level input current IINL -10 0 - μA VIN =0V Output (OUT1A, OUT1B, OUT2A, OUT2B) Output ON resistance RON - 1.2 1.5 Ω Output leak current ILEAK - - 10 μA IRNF -40 -20 - μA I OUT =±0.3A, V M =6V Sum of upper and lower Current control RNFX input current SENSEX input current RNFX=0V ISENSE -2.0 -0.1 - μA SENSEX=0V VLIMX input current IVLIM -2.0 -0.1 - μA VLIMX=0V VLIMX input voltage range VVLIM 0 - 0.5 V Comparator offset voltage VOFS -10 - 10 mV tn 0.3 0.7 1.2 μs VVREF 0.97 1.00 1.03 V Noise cancel time VREF voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 2/8 R=39kΩ, C=1000pF IVREF=0~1mA 2012.02 - Rev.A Technical Note BD6382EFV ●Terminal function･Block diagram･Application circuit diagram 1) BD6382EFV Pin Pin name Function No. Ground terminal Pin No. Pin name 13 RNF2 Function 1 GND 2 PS 3 VLIM1 Output current limit setting terminal 14 OUT2B H bridge output terminal 4 SENSE1 Input terminal of current limit comp. 15 OUT2A H bridge output terminal 5 CR1 Connection terminal of CR for setting PWM frequency 16 VM2 17 NC 6 IN1A Logic input terminal 18 IN2B Logic input terminal 7 IN1B Logic input terminal 19 IN2A Logic input terminal 8 NC 9 VM1 20 CR2 Connection terminal of CR for setting PWM frequency 10 OUT1A H bridge output terminal 21 SENSE2 Input terminal of current limit comp. 11 OUT1B H bridge output terminal 22 VLIM2 Output current limit setting terminal 12 RNF1 Connection terminal of resistor for output current detection 23 VREF Reference voltage output terminal 24 VCC Power supply terminal Power save terminal Non connection Power supply terminal for motor You can devide the reference voltage by external resistor, and use it for output current limit setting. Refer to P.7 Connection terminal of resistor for output current detection Power supply terminal for motor Non connection Bypass capacitor. Setting range is 4.7uF～47uF(electrolytic) 0.01uF～0.1uF(multilayer ceramic etc.) Refer to P.6 4.7uF VCC VREF VLIM1 Set the PWM frequency. Setting range is C:470pF～4700pF R:10kΩ～100kΩ Refer to P.7 24 VREF 23 Current Limit Comp. 3 9 Predriver CR1 39kΩ 1000pF 10 11 12 5 CR Timer 4 PS 2 Resistor for current. detecting. Setting range is 0.1Ω～1.0Ω Refer to P.7 VM1 OUT1A OUT1B RNF1 0.3Ω SENSE1 UVLO IN1A 6 IN1B 7 IN2A 19 IN2B Set the PWM frequency. Setting range is C:470pF～4700pF R:10kΩ～100kΩ Refer to P.7 0.1uF Logic 47uF TSD OCP Bypass capacitor. Setting range is 10uF～470uF(electrolytic) 0.01uF～0.1uF (multilayer ceramic etc.) Refer to P.6 18 CR2 39kΩ 1000pF VLIM2 20 0.1uF 16 CR Timer Predriver 15 14 13 VM2 OUT2A OUT2B RNF2 0.3Ω 22 Current Limit Comp. GND 21 SENSE2 Resistor for current. detecting. Setting range is 0.1Ω～1.0Ω Refer to P.7 1 Fig.1 Block diagram & Application circuit diagram of BD6382EFV www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 3/8 2012.02 - Rev.A Technical Note BD6382EFV ●Points to notice for terminal description ○PS／Power save terminal PS can make circuit standby state and make motor output OPEN. Please be careful because there is a delay of 40μ s(max.) before it is returned from standby state to normal state and the motor output becomes ACTIVE at PS=L→H. If you don't use power save mode, you may short PS terminal to VCC. PS State L H Standby state (RESET) ACTIVE ○IN1A,IN1B,IN2A,IN2B／Logic input terminal These pins decide output state. Input Output IN1A IN1B OUT1A OUT1B PS IN2A IN2B OUT2A OUT2B L X X OPEN OPEN H L H H H OPEN Standby state (RESET) L OPEN Standby H L H L Forward L H L H Reverse H H L L Brake X: H or L ●Protection Circuits ○Thermal Shutdown (TSD) This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above 175℃ (typ.), the motor output becomes OPEN. Also, when the temperature returns to under 150℃ (typ.), it automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added externally, heat overdrive can lead to destruction. ○Over current Protection (OCP) This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted each other or VCC-output or motor output-GND is shorted. This circuit latches the motor output to OPEN condition when the regulated threshold current flows for 4μs (typ.). It returns with VCC power reactivation or a reset of the PS terminal. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to take into account this circuit’s functions. After OCP operating, if irregular situations continues and the return by power reactivation or a reset of the PS terminal is carried out repeatly, then OCP operates repeatly and the IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, after the over current has flowed and the output terminal voltage jumps up and the absolute maximum values may be exceeded and as a result, there is a possibility of destruction. Also, when current which is over the output current rating and under the OCP detection current flows, the IC can heat up to over Tjmax=150℃ and can deteriorate, so current which exceeds the output rating should not be applied. ○Under voltage lock out (UVLO) This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply under voltage. When the applied voltage to the VCC terminal goes under 1.95V (typ.), the motor output is set to OPEN. This switching voltage has a 0.25V (typ.) hysteresis to prevent false operation by noise etc. Please be aware that this circuit does not operate during power save mode. ○False operation prevention function in no power supply (Ghost Supply Prevention) If a logic control signal is input when there is no power supplied to this IC, there is a function which prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from the logic control input terminal to the VCC, to this IC or to another IC’s power supply. Therefore, there is no chance of malfunction of the circuit even when voltage is supplied to the logic control input terminal while there is no power supply. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 4/8 2012.02 - Rev.A Technical Note BD6382EFV ●Power dissipation ○HTSSOP-B24 Package HTSSOP-B24 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation efficiency. 4.0 Power Dissipation : Pd[W] 3.0 2.0 4.0W 2.8W Measurement machine：TH156（Kuwano Electric） Measurement condition：ROHM board 3 Board size：70*70*1.6mm (With through holes on the board) The exposed metal of the backside is connected to the board with solder. 2 Board①：1-layer board(Copper foil on the back 0mm ) 2 Board②：2-layer board(Copper foil on the back 15*15mm ) 2 Board③：2-layer board(Copper foil on the back 70*70mm ) 2 Board④：4-layer board(Copper foil on the back 70*70mm ) 4 3 1.7W 2 1.1W 1 Board①：θja=113.6℃/W Board②：θja =73.5℃/W Board③：θja =44.6℃/W Board④：θja =31.3℃/W 1.0 0 100 125 Ambient Temperature : Ta[℃] Fig.2 HTSSOP-B24 Derating curve www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 5/8 2012.02 - Rev.A Technical Note BD6382EFV ●Usage Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. (3) Power supply Lines Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. (4) GND Potential The potential of GND pin must be minimum potential in all operating conditions. (5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. Users should be aware that BD6382EFV have been designed to expose their frames at the back of the package, and should be used with suitable heat dissipation treatment in this area to improve dissipation. As large a dissipation pattern should be taken as possible, not only on the front of the baseboard but also on the back surface. (6) Inter-pin shorts and mounting errors When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be caused by foreign matter entering between outputs or an output and the power supply or GND. (7) Operation in a strong electric field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. (8) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (9) Thermal shutdown circuit The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃, and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment. TSD ON Temperature [℃] (typ.) Hysteresis Temperature [℃] (typ.) 175 25 (10) Inspection of the application board During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power supply should first be turned off and then removed before the inspection. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 6/8 2012.02 - Rev.A Technical Note BD6382EFV (11) Input terminal of IC This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate. This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up. For example, when the resistance and transistor are connected to the terminal as shown in figure 3, ○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN), the P-N junction operates as a parasitic diode. ○Also, when GND＞(Terminal B) at the transistor (NPN) The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned parasitic diode. Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction. Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage that is lower than the GND (P substrate) to the input terminal. Resistor Transistor (NPN) Pin A Pin B C Pin A N P+ N P P+ N Pin B B E N Parasitic element P+ N P GND P+ B N E P substrate P substrate Parasitic element C Parasitic element GND GND GND Parasitic element Other adjacent elements Fig.3 Pattern Diagram of Parasitic Element (12) Ground Wiring Patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern potential of any external components, either. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 7/8 2012.02 - Rev.A Technical Note BD6382EFV ●Ordering part number B D 6 3 8 E 2 F V パッケージ EFV=HTSSOP-B24 形名 - E2 包装、フォーミング仕様 E2: リール状エンボステーピング HTSSOP-B24 <Tape and Reel information> 7.8±0.1 (MAX 8.15 include BURR) (5.0) 1.0±0.2 0.53±0.15 (3.4) 1 0.325 Tape Embossed carrier tape (with dry pack) Quantity 2000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 12 1PIN MARK +0.05 0.17 -0.03 S 0.08±0.05 0.85±0.05 1.0MAX +6° 4° −4° 13 5.6±0.1 7.6±0.2 24 0.65 0.08 S +0.05 0.24 -0.04 0.08 1pin M Reel (Unit : mm) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 8/8 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2012.02 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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