TI1 ADC12081 12-bit, 5 mhz self-calibrating, pipelined a/d converter with internal sample & hold Datasheet

ADC12081
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ADC12081 12-Bit, 5 MHz Self-Calibrating, Pipelined A/D Converter with Internal Sample &
Hold
Check for Samples: ADC12081
FEATURES
DESCRIPTION
•
•
•
•
•
The ADC12081 is a monolithic CMOS analog-todigital converter capable of converting analog input
signals into 12-bit digital words at 5 megasamples per
second (MSPS). The ADC12081 utilizes an
innovative pipeline architecture to minimize die size
and power consumption. The ADC12081 uses selfcalibration and error correction to maintain accuracy
and performance over temperature.
1
2
Single 5V Power Supply
Simple Analog Input Interface
Internal Sample-and-Hold
Internal Reference Buffer Amplifier
Low Power Consumption
APPLICATIONS
•
•
•
•
•
Image Processing Front End
PC-Based Data Acquisition
Scanners
Fax Machines
Waveform Digitizer
The ADC12081 converter operates on a 5V power
supply and can digitize analog input signals in the
range of 0 to 2V. A single convert clock controls the
conversion operation. All digital I/O is TTL
compatible.
The ADC12081 is designed to minimize external
components necessary for the analog input interface.
An internal sample-and-hold circuit samples the
analog input and an internal amplifier buffers the
reference voltage input.
The ADC12081 is available in the 32-lead LQFP
package and is designed to operate over the
extended commercial temperature range of -40°C to
+85°C.
Table 1. Key Specifications
VALUE
UNIT
Resolution
12
Bits
Conversion Rate
5
Msps (min)
DNL
±0.35
LSB (typ)
SNR
68
dB (typ)
ENOB
10.9
Bits (typ)
Analog Input Range
2
Vpp (min)
Supply Voltage
+5 ±5%
V
Power Consumption, 5 MHz
105
mW (typ)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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Connection Diagram
Simplified Block Diagram
2
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PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS #2
No.
Symbol
2
VIN
Equivalent Circuit
Description
Analog signal input. With a 2.0V reference voltage, input
signal voltages in the range of 0 to 2.0 Volts will be
converted. See Analog Inputs.
Reference voltage input. This pin should be driven from an
accurate, stable reference source in the range of 1.8 to 2.2V
and bypassed to a low-noise analog ground with a monolithic
ceramic capacitor, nominally 0.01µF. See Reference Input.
1
VREF
32
VRP
Positive reference bypass pin. Bypass with a 0.1µF
capacitor. Do not connect anything else to this pin. See
Reference Output Voltages
31
VRM
Reference midpoint bypass pin. Bypass with a 0.1µF
capacitor. Do not connect anything else to this pin. See
Reference Output Voltages
30
VRN
Negative reverence bypass pin. Bypass with a 0.1µF
capacitor. Do not connect anything else to this pin.
SeeReference Output Voltages
10
CLOCK
8
CAL
Calibration request, active High. Calibration cycle starts
when CAL returns to logic low. CAL is ignored during powerdown mode. See CAL.
7
PD
Power-down, active High, ignored during calibration cycle.
See PD Pin
11
OE
Output enable control, active low. When this pin is high the
data outputs are in Tri-state (high-impedance) mode.
28
OR
Over range indicator. This pin is at a logic High for VIN < 0 or
for VIN > VREF.
29
READY
Device ready indicator, active High. This pin is at a logic Low
during a calibration cycle and while the device is in the
power down mode.
Sample Clock input, TTL compatible. Maximum amplitude
should not exceed 3V.
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PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS #2 (continued)
No.
Symbol
14-19,
22-27
D0 - D11
3
VIN
com
Equivalent Circuit
Description
Digital output word, CMOS compatible. D0 (pin 14) is LSB,
D11 (pin 27) is MSB. Load with no more than 50pF.
Analog input common. Connect to a quiet point in analog
ground near the driving device. See Layout and Grounding.
5
VA
Positive analog supply pin. Connect to a clean, quiet voltage
source of +5V. VA and VD should have a common supply
and be separately bypassed with a 5µF to 10µF capacitor
and a 0.1µF chip capacitor.
4, 6
AGND
The ground return for the analog supply. AGND and DGND
should be connected together close to the ADC12081
package. See Layout and Grounding.
13
VD
Positive analog supply pin. Connect to a clean, quiet voltage
source of +5V. VA and VD should have a common supply
and be separately bypassed with a 5µF to 10µF capacitor
and a 0.1 µF chip capacitor.
9, 12
DGND
The ground return for the analog supply. AGND and DGND
should be connected together close to the ADC12081
package. See Layout and Grounding
21
VD I/O
The digital output driver supply pin. This pin can be operated
from a supply voltage of 3V to 5V, but the voltage on this pin
should never exceed the VD supply pin voltage.
20
DGND I/O
The ground return for the output drivers. This pin should be
returned to a point in the digital ground that is removed from
the other ground pins of the ADC12081.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
4
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Absolute Maximum Ratings (1) (2) (3)
Supply Voltage
6.5V
−0.3V to V+ +0.3V
Voltage on Any Output
Input Current at Any Pin (4)
±25mA
Package Input Current (4)
±50mA
See (5)
Package Dissipation
ESD Susceptibility
(6)
Human Body Model
1500V
Machine Model
Soldering Temp., Infrared, 10 sec.
150V
(7)
300°C
−65°C to +150°C
Storage Temp.
Maximum Junction Temp.
(1)
(2)
(3)
(4)
(5)
(6)
(7)
150°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA, VD or VD I/O), the current at that pin
should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the
power supplies with an input current of 25 mA to two.
The absolute maximum junction temperatures (TJmax) for this device is 150°C. The maximum allowable power consumption is dictated
by TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature, (TA), and can be calculated using the formula
PDMAX = (TJmax - TA )/θJA. In the 32-pin TQFP, θJA is 74°C/W, so PDMAX = 1,689 mW at 25°C and 1,013 mW at the maximum
operating ambient temperature of 75°C. Note that the power consumption of this device under normal operation will typically be about
125 mW (typical power consumption + 20 mW TTL output loading). The values for maximum power consumption listed above will be
reached only when the ADC12081 is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power
supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.
Human body model is 100 pF capacitor discharged through a 1.5kΩ resistor. Machine model is 220 pf discharged through ZERO Ohms.
See AN450, "Surface Mounting Methods and Their Effect on Product Reliability", or the section entitled "Surface Mount" found in any
post 1986 Texas Instruments Linear Data Book, for other methods of soldering surface mount devices.
Operating Ratings
−40°C ≤ TA ≤ +85°C
Operating Temp. Range
Supply Voltage
+4.75V to +5.25V
VD I/O
+2.7V to VD
VREF Input
1.8V to 2.2V
−0.05V to VD + 0.05V
CLOCK, CAL, PD, OE
|AGND −DGND|
≤100mV
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Converter Electrical Characteristics
The following specifications apply for AGND = DGND = DGND I/O = 0V, VA = VD = VD I/O = +5V, PD = +5V, VREF = +2.0V,
fCLK = 5MHz, CL = 50 pF/pin. After Auto-Cal at Temperature. Boldface limits apply for TA = TJ to TMIN to TMAX: all other
limits TA = TJ = 25°C (1) (2) (3)
Symbol
Parameter
Conditions
Typical (4)
Limits (5)
Units
(Limits)
Static Converter Characteristics
12
Bits(min)
INL
Resolution with No Missing Codes
Integral Non Linearity (6)
±0.6
±1.7
LSB( max)
DNL
Differential Non Linearity
±0.35
±0.75
LSB( max)
Full-Scale Error
±0.05
±0.1
%FS(max)
Zero Error
±0.15
±0.24
%FS(max)
Dynamic Converter Characteristics
BW
Full Power Bandwidth
100
MHz
SNR
Signal-to-Noise Ratio
fin = 2.5 MHz, VIN = 2.0VP-P
68
65
SINAD
Signal-to-Noise & Distortion
fin = 2.5 MHz, VIN = 2.0VP-P
67.6
64.5
dB
ENOB
Effective Number of Bits
fin = 2.5 MHz, VIN = 2.0VP-P
10.9
10.4
Bits
THD
Total Hamonic Distortion
fin = 2.5 MHz, VIN = 2.0VP-P
79
dB
SFDR
Spurious Free Dynamic Range
fin = 2.5 MHz, VIN = 2.0VP-P
79
dB
dB
Reference and Analog Input Characteristics
VIN
Input Voltage Range
VREF = 2.0V
CIN
VIN Input Capacitance
VIN = 1.0Vdc + 0.7Vrms
VREF
Reference Voltage (7)
0
VREF
V(min)
V(max)
(CLK LOW)
10
pF
(CLK HIGH)
15
pF
2.00
1.8
V(min)
2.2
V(max)
Reference Input Leakage Current
10
µA
Reference Input Resistance
1
MΩ(min)
(1)
The inputs are protected as shown below. Input voltage magnitudes up to 5V above VA or to 5V below GND will not damage this device,
provided current is limited per Note 3. However, errors in the A/D conversion can occur if the input goes above VA or below GND by
more than 100 mV. As an example, if VA is 4.75V, the full-scale input voltage must be ≤4.85V to ensure accurate conversions.
(2)
(3)
(4)
(5)
(6)
To guarantee accuracy, it is required that |VA - VD| ≤ 100mV and separate bypassed capacitors are used at each power supply pin.
With the test condition for VREF = +2.0V, the 12-bit LSB is 488µV.
Typical figures are at TA = TJ = 25°C, and represent most likely parametric norms.
Tested limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
Integral Non Linearity is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through
positive full-scall and zero.
Optimum SNR performance will be obtained by keeping the reference input in the 1.8V to 2.2V range. The LM4041CIM3-ADJ (SOT-23
package), the LM4041CIZ-ADJ (TO-92 package), or the LM4041CIM-ADJ (SOT-8 package) bandgap voltage reference is
recommended for this application.
(7)
6
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DC and Logic Electrical Characteristics
The following specifications apply for AGND = DGND = DGND I/O = 0V, VA = VD = VD I/O = +5V, PD = +5V, VREF = +2.0V,
fCLK = 50MHz, CL = 50 pF/pin. After Auto-Cal at Temperature. Boldface limits apply for TA = TMIN to TMAX; all other limits TA
= TJ = 25°C (1) (2) (3)
Symbol
Parameter
Conditions
Typical (4)
Limits (5)
Units
(Limits)
CLK, OE Digital Input Characteristics
VIH
Logical "1" Input Voltage
V+ = 5.25V
2.0
V(min)
VIL
Logical "0" Input Voltage
V+ = 4.75V
0.8
V(min)
IIH
Logical "1" Input Current
VIN = 5.0V
5
µA
IIL
Logical "0" Input Current
VIN = 0V
−5
µA
CIN
VIN Input Capacitance
8
pF
D0 - D11 Digital Output Characteristics (6)
VOH
Logical "1" Output Voltage
IOUT = −1mA
VOL
Logical "0" Output Voltage
IOUT = 1.6mA
IOZ
TRI-STATE Output Current
VOUT = 3V or 5V
10
µA
VOUT = 0V
−10
µA
4
V (min)
0.4
V (max)
+ISC
Output Short Circuit Source Current
VDDO= 3V, VOUT = 0V
−14
mA(min)
−ISC
Output Short Circuit Sink Current
VDDO= 3V, VOUT = VO
16
mA(min)
Power Supply Characteristics
IA
Analog Supply Current
PD = VDDO
PD = DGND
2.5
20
4
26
mA(max)
mA(max)
ID
Digital Supply Current
PD = VDDO
PD = DGND
0.5
1
2
2
mA(max)
mA(max)
Total Power Consumption
PD = VDDO
PD = DGND
15
105
30
140
mW(max)
mW(max)
(1)
The inputs are protected as shown below. Input voltage magnitudes up to 5V above VA or to 5V below GND will not damage this device,
provided current is limited per Note 3. However, errors in the A/D conversion can occur if the input goes above VA or below GND by
more than 100 mV. As an example, if VA is 4.75V, the full-scale input voltage must be ≤4.85V to ensure accurate conversions.
(2)
(3)
(4)
(5)
(6)
To guarantee accuracy, it is required that |VA - VD| ≤ 100mV and separate bypassed capacitors are used at each power supply pin.
With the test condition for VREF = +2.0V, the 12-bit LSB is 488µV.
Typical figures are at TA = TJ = 25°C, and represent most likely parametric norms.
Tested limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
Timing specifications are tested at the TTL logic levels, VIL = 0.4V for a falling edge and VIH = 2.4V for a rising edge. TRI-STATE output
voltage is forced to 1.4V.
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AC Electrical Characteristics
The following specifications apply for AGND = DGND = DGND I/O = 0V, VA = VD = VD I/O = +5V, PD = +5V, VREF = +2.0V,
fCLK = 5 MHz, CL = 50 pF/pin. After Auto-Cal at Temperature. Boldface limits apply for TA = TMIN to TMAX; all other limits TA
= TJ = 25°C (1) (2) (3)
Symbol
fCLK
Parameter
Conditions
Typical (3)
Limits (4)
0.5
Clock Frequency
MHz(min)
5
Clock Duty Cycle
Units
(Limits)
MHz(max)
50
%
tCONV
Conversion Latency
10.25
Clock Cycles
tAD
Aperture Delay Time
3.5
ns
tOD
Data output delay after rising clk edge
VD I/O = 3V
44
VD I/O = 5V
40
ns
tDIS
Data outputs into Tristate mode
21
nA (max)
tEN
Data outputs active after Tristate
21
tWCAL
Calibration request pulse width
3
Tclk(min)
tRDYC
Ready Low after CAL request
3
Tclk
tCAL
Calibration cycle
tWPD
Power-down pulse width
tRDYPD
tPD
ns (max)
4000
Tclk
3
Tclk(min)
Ready Low after PD request
3
Tclk
Power down mode exit cycle
4000
Tclk
(1)
The inputs are protected as shown below. Input voltage magnitudes up to 5V above VA or to 5V below GND will not damage this device,
provided current is limited per Note 3. However, errors in the A/D conversion can occur if the input goes above VA or below GND by
more than 100 mV. As an example, if VA is 4.75V, the full-scale input voltage must be ≤4.85V to ensure accurate conversions.
(2)
(3)
(4)
To guarantee accuracy, it is required that |VA - VD| ≤ 100mV and separate bypassed capacitors are used at each power supply pin.
Typical figures are at TA = TJ = 25°C, and represent most likely parametric norms.
Tested limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
8
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Transfer Characteristic
Figure 1. Transfer Characteristic
Figure 2. Errors Minimized by the Auto-Cal Cycle
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Typical Performance Characteristics
INL vs Temperature
DNL vs Temperature
Figure 3.
Figure 4.
SNR vs Temperature
SINAD vs Temperature
Figure 5.
Figure 6.
THD vs Temperature
Figure 7.
10
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Specification Definitions
APERTURE JITTER is the variation in aperture delay from sample to sample. Aperture jitter shows up as input
noise.
APERTURE DELAY See Sampling Delay.
CLOCK DUTY CYCLE is the ratio of the time that the clock waveform is high to the total time for one clock cycle.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1
LSB.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise
and Distortion Ratio, or SINAD. ENOB is defined as (SINAD - 1.76) / 6.02 and says that the converter is
equivalent to a perfect ADC of this (ENOB) number of bits.
FULL POWER BANDWIDTH is the frequency at which the reconstructed output fundamental drops 3 dB below
its low frequency value for a full scale input.
FULL SCALE ERROR is the difference between the input voltage just causing a transition to positive full scale
and VREF -1.5 LSB.
INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from
negative full scale (½ LSB below the first code transition) through positive full scale (1½ LSB above the last code
transition). The deviation of any given code from this straight line is measured from the center of that code value.
The end point test method is used. INL is commonly measured at rated clock frequency with a ramp input.
INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two
sinusoidal frequencies being applied to the ADC input at the same time. It is defined as the ratio of the power in
the intermodulation products to the total power in the original frequencies. IMD is usually expressed in dB.
PIPELINE DELAY (LATENCY) is the number of clock cycles between initiation of conversion and the availability
of that conversion result at the output. New data is available at every clock cycle, but the data lags the
conversion by the pipeline delay plus the Output Delay.
SAMPLING (APERTURE) DELAY is the time after the edge of the clock to when the input signal is acquired or
held for conversion.
SIGNAL TO NOISE PLUS DISTORTION (S/(N+D) or SINAD) is the ratio expressed in dB, of the rms value of
the input signal to the rms value of all of the other spectral components below half the clock frequency, including
harmonics but excluding dc.
SIGNAL TO NOISE RATIO (SNR) is the ratio of the rms value of the input signal to the rms value of the other
spectral components below one-half the sampling frequency, not including harmonics or dc.
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the
input signal and the peak spurious signal, where a spurious signal is any signal present in the output spectrum
that is not present at the input.
TOTAL HARMONIC DISTORTION (THD) is the ratio of the rms total of the first six harmonic components, to the
rms value of the input signal.
ZERO SCALE OFFSET ERROR is the difference between the ideal input voltage (½ LSB) and the actual input
voltage that just causes a transition from an output code of zero to an output code of one.
ZERO ERROR see Zero Scale Offset Error.
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TEST CIRCUIT DIAGRAMS
Timing Diagrams
Figure 8. Data Output Timing
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Figure 9. Reset and Calibration Timing
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FUNCTIONAL DESCRIPTION
The ADC12081 is a monolithic CMOS analog-to-digital converter capable of converting analog input signals into
12-bit digital words at 5 megasamples per second (MSPS). This device utilizes a proprietary pipeline architecture
and algorithm to minimize die size and power consumption. The ADC12081 uses self-calibration and digital error
correction to maintain accuracy and performance over temperature. The ADC12081 has an input sample-andhold amplifier and internal reference buffer. The analog input and the reference voltage are converted to
differential signals for internal use. Using differential signals in the analog conversion core reduces crosstalk and
noise pickup from the digital section and power supply.
The pipeline conversion core has 15 sequential signal processing stages. Each stage receives an analog signal
from the previous stage (called “residue” ) and produces a 1-bit digital output that is sent to the digital correction
module. At each stage the analog signal received from the previous stage is compared to an internally generated
reference level. It is then amplified by a factor of 2, and, depending on the output of the comparator, the internal
reference signal may be subtracted from the amplifier output. This produces the residue that is passed to the
next stage.
The calibration module is activated at power-on or by user request. During calibration the conversion core is put
into a special mode of operation in order to determine inherent errors in the analog conversion blocks and to
determine correction coefficients for each digital output bit from the conversion core and stores these coefficients
in RAM. The digital correction module uses the coefficients in RAM to convert the raw data bits from the
conversion core into the 12-bit digital output code.
Applications Information
ANALOG INPUTS
The ADC12081 has two single-ended analog inputs. VREF is the reference input and VIN is the signal input.
Reference Input
The VREF input must be driven from an accurate, stable reference voltage source. of 1.8V to 2.2V, and bypassed
to a clean, quiet point in analog ground.
Analog Signal Input
The VIN input must be driven with a low impedance signal source that does not add any distortion to the input
signal. The ground reference for the VIN input is the VINCOM pin. The VINCOM pin must be connected to a clean,
quiet point in analog ground.
DIGITAL INPUTS
The ADC12081 has four digital inputs. They are CLOCK, CAL, OE and PD.
CLOCK
The CLOCK signal drives an internal phase delay loop to create timing for the ADC. The clock input should be
driven with a stable, low phase jitter TTL level clock signal in the range of 0.5 to 5 MHz. The trace carrying the
clock signal should be as short as possible. This trace should not cross any other signal line, analog or digital,
not even at 90°. A 100 Ohm resistor should be placed in series with the CLOCK pin, as close to the pin as
possible.
CAL
The level sensitive CAL input must be pulsed high for at least three clock cycles to begin ADC calibration. For
best performance, calibration should be performed about ten seconds after power up, after resetting the ADC,
and after the temperature has changed by more than 50°C since the last calibration was performed.
Calibration should be performed at the same clock frequency that the ADC12081 will be used for conversions to
minimize offset errors. Calibration takes 4000 clock cycles. Irrelevant data may appear during CAL.
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OE Pin
The OE pin is used to control the state of the outputs. When the OE pin is low, the output buffers go into the
active state. When the OE input is high, the output buffers are in the high impedance state.
PD Pin
The PD pin, when high, holds the ADC12081 in a power-down mode where power consumption is typically less
than 15 mW to conserve power when the converter is not being used. The ADC12081 will begin normal
operation within tPD after this pin is brought low, provided a valid CLOCK input is present. The data in the
pipeline is corrupted while in the power down mode. The ADC12081 should be re-calibrated after a power-down
cycle to ensure optimum performance.
OUTPUTS
The ADC12081 has three analog outputs: reference output voltages VRN, VRM , and VRP. There are 14 digital
outputs: 12 Data Output pins, Ready and OR (Out of range).
Reference Output Voltages
The reference output voltages are made available only for the purpose of bypassing with capacitors to a clean
analog ground. The recommended bypass capacitors are 0.1µF ceramic chip capacitors. Do not load these pins.
Ready Output
The Ready output goes high to indicate that the converter is ready for operation. This signal will go low when the
converter is Calibration or Power Down made.
OR (Out of Range) Output
The OR output goes high when the analog input is below GND or above VREF. This output is low when the input
signal is in the valid range of operation (0V ≤ VIN ≤ VREF).
Data Outputs
The Data Outputs are TTL/CMOS compatible. The output data format is 12 bits straight binary.
Minimizing the digital output currents will help to minimize noise due to output switching. This can be done by
connecting buffers between the ADC outputs and any other circuitry. Only one buffer input should be connected
to each output. Additionally, inserting series resistors of 47 to 56 Ohms right at the digital outputs, close to the
ADC pins, will isolate the outputs from other circuitry and limit output currents.
POWER SUPPLY CONSIDERATIONS
Each power pin should be bypassed with a parallel combination of a 10µF capacitor and a 0.1µF ceramic chip
capacitor. The chip capacitors should be within 1/2 centimeter of the power pins. Leadless chip capacitors are
preferred because they provide low lead inductance.
The converter's digital logic supply (VD) should be well isolated from the supply that is used for other digital
circuitry on the board. A common power supply should be used for both VA (analog supply) and VD (digital
supply), and each of these supply pins should be separately bypassed with a 0.1µF ceramic capacitor and a low
ESR 10µF electrolytic capacitor. A ferrite bead or inductor should be used between VA and VD to prevent noise
coupling from the digital supply into the analog circuit.
VD I/O is the power pin for the output driver. This pin may be supplied with a potential between 2.7V and VD. This
makes it easy to interface the ADC12081 with 3V or 5V logic families. Powering the VD I/O from 3 Volts will also
reduce power consumption and noise generation due to output switching. DO NOT operate the VD I/O at a
voltage higher than VD or VA! All power supplies connected to the device should be applied simultaneously.
As is the case with all high speed converters, the ADC12081 is sensitive to power supply noise. Accordingly, the
noise on the analog supply pin should be minimized, keeping it below 100mV P-P.
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Figure 10. Basic Connections Diagram
LAYOUT AND GROUNDING
Proper grounding and routing of all signals is essential to ensure accurate conversion. Separate analog and
digital ground planes that are connected beneath the ADC12081 are required to achieve specified performance.
The analog and digital grounds may be in the same layer, but should be separated from each other and should
never overlap each other. Separation should be at least 1/8 inch, where possible.
The ground return for the output buffer digital supply (DGND I/O) carries the ground current for the output
drivers. This pin should be connected to the system digital ground. The current on this pin can exhibit high
transients that could add noise to the conversion process. To prevent this from happening, the DGND I/O pin
should NOT be connected in close proximity to any of the ADC12081's other ground pins. See Figure 11.
Capacitive coupling between the typically noisy digital ground plane and the sensitive analog circuitry can lead to
poor performance that may seem impossible to isolate and remedy. The solution is to keep the analog circuitry
separated from the digital circuitry and from the digital ground plane.
Digital circuits create substantial supply and ground current transients. The logic noise thus generated could
have significant impact upon system noise performance. The best logic family to use in systems with A/D
converters is one which employs non-saturating transistor designs, or has low noise characteristics, such as the
74LS, 74HC(T) and 74 AC(T)Q families. The worst noise generators are logic families that draw the largest
supply current transients during clock or signal edges, like the 74F and the 74AC(T) families.
Since digital switching transients are composed largely of high frequency components, total ground plane copper
weight will have little effect upon the logic-generated noise. This is because of the skin effect. Total surface area
is more important than is total ground plane volume.
16
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An effective way to control ground noise is by connecting the analog and digital ground planes together beneath
the ADC with a copper trace that is very narrow compared with the rest of the ground plane. This narrowing
beneath the converter provides a fairly high impedance to the high frequency components of the digital switching
currents, directing them away from the analog pins. The relatively lower frequency analog ground currents do not
create a significant voltage drop across the impedance of this narrow ground connection.
To maximize accuracy in high speed, high resolution systems, avoid crossing analog and digital signal traces. It
is important to keep any clock lines isolated from ALL other lines. Even the generally accepted 90 degree
crossing should be avoided as even a little coupling can cause problems at high frequencies. This is because
other lines can introduce phase noise (jitter) into the clock line, which can lead to degradation of SNR.
Best performance at high frequencies and at high resolution is obtained with a straight signal path. That is, the
signal path through all components should form a straight line wherever possible.
Be especially careful with the layout of inductors. Mutual inductance can change the characteristics of the circuit
in which they are used. Inductors should not be placed side by side, even with just a small part of their bodies
beside each other.
The analog input should be isolated from noisy signal traces to avoid coupling of spurious signals into the input.
Any external component (e.g., a filter capacitor) connected between the converter's input and ground should be
connected to a very clean point in the analog ground plane.
Figure 11. Layout example
Figure 11 gives an example of a suitable layout. All analog circuitry (input amplifiers, filters, reference
components, etc.) should be placed on or over the analog ground plane. All digital circuitry and I/O lines should
be placed over the digital ground plane.
All ground connections should have a low inductance path to ground.
LAYOUT AND GROUNDING
The ADC12081 can achieve impressive dynamic performance. To achieve the best dynamic performance with
the ADC12081, the clock source driving the CLK input must be free of jitter. For best ac performance, isolating
the ADC clock from any digital circuitry should be done with adequate buffers, as with a clock tree. See
Figure 12.
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Figure 12. Isolating the ADC clock from other circuitry with a clock tree.
It is good practice to keep the ADC clock line as short as possible and to keep it well away from any other
signals. Other signals can introduce phase noise (jitter) into the clock signal, which can lead to increased
distortion. Even lines with 90° crossings have capacitive coupling, so try to avoid even these 90° crossings of the
clock line.
COMMON APPLICATION PITFALLS
Driving the inputs (analog or digital) beyond the power supply rails. For proper operation, all inputs should
not go more than 300mV beyond the supply rails (more than 300mV below the ground pins or 300mV above the
supply pins). Exceeding these limits on even a transient basis may cause faulty or erratic operation. It is not
uncommon for high speed digital circuits (e.g., 74F and 74AC devices) to exhibit undershoot that goes more than
a volt below ground above the power supply. A resistor of about 50 to 100Ω in series with the offending digital
input will eliminate the problem.
Care should be taken not to overdrive the inputs of the ADC12081 with a device that is powered from supplies
outside the range of the ADC12081 supply. Such practice may lead to conversion inaccuracies and even to
device damage.
Attempting to drive a high capacitance digital data bus. Capacitive loading on the digital outputs causes
instantaneous digital currents to flow from the VD I/O supply into the DGND I/O ground plane. These large
charging current spikes can couple into the analog section, degrading dynamic performance. Adequate
bypassing and maintaining separate analog and digital ground planes will reduce this problem. The digital data
outputs should be buffered (with 74ACQ541, for example). Dynamic performance can also be improved by
adding series resistors at each digital output, close to the ADC12081, reducing the energy coupled back into the
converter output pins by limiting the output slew rate. A reasonable value for these resistors is 47Ω.
Using an inadequate amplifier to drive the analog input. The analog input circuits of the ADC12081 place a
switched capacitor load on the input signal source. Therefore the amplifier used to drive the ADC12081 must
have a low impedance output and adequate bandwidth to avoid distortion of the input signal.
Operating with the reference pins outside of the specified range. As mentioned in Analog Inputs, VREF
should be in the range of 1.8V ≤ VREF ≤ 2.2V. Operating outside of these limits could lead to signal distortion.
Using a clock source with excessive jitter, using excessively long clock signal trace, or having other
signals coupled to the clock signal trace. This will cause the sampling interval to vary, causing excessive
output noise and a reduction in SNR performance.
18
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REVISION HISTORY
Changes from Revision C (March 2013) to Revision D
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 18
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
ADC12081CIVT/NOPB
ACTIVE
LQFP
NEY
32
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-20 to 75
ADC12081
CIVT
ADC12081CIVTX/NOPB
ACTIVE
LQFP
NEY
32
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-20 to 75
ADC12081
CIVT
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Nov-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
ADC12081CIVTX/NOPB
Package Package Pins
Type Drawing
LQFP
NEY
32
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
16.4
Pack Materials-Page 1
9.3
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
9.3
2.2
12.0
16.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Nov-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADC12081CIVTX/NOPB
LQFP
NEY
32
1000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
NEY0032A
VF0032A
TYPICAL
VBE32A (Rev F)
www.ti.com
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