MCC MCL4148-TP 500mw 100 volt silicon epitaxial diode Datasheet

MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
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$ % !"#
MCL4148
Features
•
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Silicon epitaxial planar diode
Fast Switching Speed
This diode is also available in the DO-35 case with the type
designation 1N4148, in the Mini-MELF case with the type
designation DL4148
•
•
•
500mW 100 Volt
Silicon Epitaxial Diode
Maximum Ratings
•
•
•
•
•
MICROMELF
Operating Temperature: -55OC to +150 OC
Storage Temperature: -55OC to +150 OC
Maximum Thermal Resistance; 3500C/W Junction To Ambient
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Cathode Mark
Electrical Characteristics @ 25OC Unless Otherwise Specified
Reverse Voltage
Peak Reverse
Voltage
Maximum Average
Rectified Current
Power Dissipation
Junction Temperature
Surge Forward
Current
Maximum Forward
Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
Typical Junction
Capacitance
Reverse Recovery
Time
VR
75V
VRM
100V
IO
200mA
PTOT
TJ
500mW1)
150OC
IFSM
C
B
Resistive Load
f > 50Hz
TA=25OC
2A
t=1us, TJ=25OC
1.0V
IFM = 50mA;
TJ = 25OC*
VR=20V
TJ=25OC VR=75V,
TJ=150 OC VR=20V
A
DIMENSIONS
VF
IR
25nA
5.0uA
50uA
CJ
4.0pF
Trr
4.0nS
Measured at
VR=VF=0V
IF=10mA,
VR = 6.0V
RL=100OHMS
DIM
A
B
C
INCHES
MIN
.071
.004
.047
MM
MIN
1.8
.10
1.20
MAX
.079
.008
.051
MAX
2.0
.20
1.30
NOTE
∅
SUGGESTED SOLDER
PAD LAYOUT
0.039
0.055”
*Pulse test: Pulse width 300 usec, Duty cycle 2%
1) Valid provided that leads at a distance of 8mm from case are kept
at ambient temperature(DO-35)
Note: 1. Lead in Glass Exemption Applied, see EU Directive Annex 5.
0.030”
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Revision: A
2011/01/01
MCC
MCL4148
TM
Micro Commercial Components
Figure 1
Typical Forward Characteristics
20
Figure 2
Forward Derating Curve
10
600
6
4
500
2
400
MilliAmps 1
.6
300
MilliWatts
.4
200
.2
25OC
100
.1
Single Phase, Half Wave
60Hz Resistive or Inductive Load
.06
0
.04
0
50
75
100
125
150
175
O
C
.02
.01
.4
.6
Admissable Power Dissipation - MilliWatts versus
Ambient Temperature - OC
.8
1.4
1.0
1.2
Volts
Instantaneous Forward Current - Amperes versus
Instantaneous Forward Voltage - Volts
Figure 3
Junction Capacitance
10
6
4
2
pF
TJ =25OC
1
.6
.4
.2
.1
.1
.2
.4
1
Volts
2
4
10
20
40
100 200
400
1000
Junction Capacitance - pF versus
Reverse Voltage - Volts
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Revision: A
2011/01/01
MCC
MCL4148
TM
Micro Commercial Components
Figure 4
Typical Reverse Characteristics
1000
600
Figure 5
Peak Forward Surge Current
400
600
200
500
100
400
60
300
40
TA=25°C
MilliAmps
20
200
100
10
NanoAmps
6
0
4
1
2
4
6 8 10 20
40
60 80 100
Cycles
Peak Forward Surge Current - Amperes versus
Number Of Cycles At 60Hz - Cycles
2
1
.6
.4
.2
.1
20
40
60
80
100
120
140
TJ
Instantaneous Reverse Leakage Current - NanoAmperes
versus
Junction Temperature - °C
www.mccsemi.com
Revision: A
2011/01/01
MCC
TM
Micro Commercial Components
Ordering Information :
Device
Packing
Part Number-TP
Tape&Reel: 2.5Kpcs/Reel
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2011/01/01
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