ISSI IS24C02A-2ZI 1k-bit/2k-bit/4k-bit/8k-bit/16k-bit 2-wire serial cmos eeprom Datasheet

IS24C02A IS24C04A
IS24C08A IS24C16A
ISSI
1K-bit/2K-bit/4K-bit/8K-bit/16K-bit
2-WIRE SERIAL CMOS EEPROM
®
JANUARY 2006
FEATURES
DESCRIPTION
• Two-Wire Serial Interface, I2CTM Compatible
–Bi-directional data transfer protocol
• Wide Voltage Operation
–Vcc = 1.8V to 5.5V
• 400 KHz (2.5V) and 1 MHz (5.0V) Compatible
• Low Power CMOS Technology
–Standby Current less than 6 µA (5.0V)
–Read Current less than 2 mA (5.0V)
–Write Current less than 3 mA (5.0V)
• Hardware Data Protection
–Write Protect Pin
• Sequential Read Feature
• Filtered Inputs for Noise Suppression
• Self time write cycle with auto clear
5 ms max @ 2.5V
• Organization:
–IS24C02A, 256x8 (one block of 256 bytes)
–IS24C04A, 512x8 (two blocks of 256 bytes)
–IS24C08A, 1024x8 (four blocks of 256 bytes)
–IS24C16A, 2048x8 (eight blocks of 256 bytes)
• 16 Byte Page Write Buffer
• High Reliability
–Endurance: 1,000,000 Cycles
–Data Retention: 100 Years
• Commercial, Industrial and Automotive temperature ranges
• 8-pin PDIP, 8-pin SOIC, 8-pad DFN, 8-pin
TSSOP, and 8-pin MSOP packages
• Lead-free available
The IS24C02A, IS24C04A, IS24C08A, and
IS24C16A are electrically erasable PROM
devices that use the standard 2-wire interface for
communications. The IS24C02A, IS24C04A,
IS24C08A, and IS24C16A contain a memory array
of 2K-bits (256 x 8), 4K-bits (512 x 8), 8K-bits
(1,024 x 8), and 16K-bits (2,048 x 8), respectively.
Each device is organized into 16 byte pages for
page write mode.
This EEPROM operates in a wide voltage range of
1.8V to 5.5V to be compatible with most application
voltages. ISSI designed this device family to be a
practical, low-power 2-wire EEPROM solution. The
devices are available in 8-pin PDIP, 8-pin SOIC, 8pad DFN, 8-pin MSOP, and 8-pin TSSOP packages.
The IS24C02A/04A/08A/16A maintains compatibility with the popular 2-wire bus protocol, so it is
easy to use in applications implementing this bus
type. The simple bus consists of the Serial Clock
wire (SCL) and the Serial Data wire (SDA). Using
the bus, a Master device such as a microcontroller
is usually connected to one or more Slave devices
such as this device. The bit stream over the SDA
line includes a series of bytes, which identifies a
particular Slave device, an instruction, an address
within that Slave device, and a series of data, if
appropriate. The IS24C02A/04A/08A/16A has a
Write Protect pin (WP) to allow blocking of any
write instruction transmitted over the bus.
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
01/09/06
1
IS24C02A
IS24C04A
IS24C08A
ISSI
IS24C16A
®
FUNCTIONAL BLOCK DIAGRAM
HIGH VOLTAGE
GENERATOR,
TIMING & CONTROL
Vcc 8
SCL 6
CONTROL
LOGIC
WP 7
SLAVE ADDRESS
REGISTER &
COMPARATOR
A0 1
X
DECODER
SDA 5
EEPROM
ARRAY
WORD ADDRESS
COUNTER
A1 2
Y
DECODER
A2 3
ACK
GND 4
nMOS
2
Clock
DI/O
>
DATA
REGISTER
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
01/09/06
IS24C02A
IS24C04A
IS24C08A
ISSI
IS24C16A
PIN CONFIGURATION
PIN CONFIGURATION
8-Pin DIP, SOIC, DFN, TSSOP, MSOP
8-pad DFN
A0
1
8
VCC
A0 1
8 VCC
A1 2
7 WP
A1
2
7
WP
A2 3
6 SCL
A2
3
6
SCL
GND 4
5 SDA
GND
4
5
SDA
®
(Top View)
PIN DESCRIPTIONS
A0-A2
Address Inputs
SDA
Serial Address/Data I/O
SCL
Serial Clock Input
WP
Write Protect Input
Vcc
Power Supply
GND
Ground
SCL
This input clock pin is used to synchronize the data
transfer to and from the device.
SDA
The SDA is a Bi-directional pin used to transfer addresses and data
into and out of the device. The SDA pin is an open drain output and
can be wire-Or'ed with other open drain or open collector
outputs. The SDA bus requires a pullup resistor to Vcc.
The IS24C04A uses A1 and A2 pins for hardwire addressing
and a total of four devices may be addressed on a single bus
system. The A0 pin is a no connect in the IS24C04A. When
the A1 or A2 input is left floating, the input internally defaults
to zero.
The IS24C08A only uses the A2 input for hardwire addressing
and a total of two devices may be addressed on a single bus
system. The A0 and A1 pins are no connects in the
IS24C08A. When the A2 input is left floating, the input
internally defaults to zero.
These pins are not used by IS24C16A . The A0, A1, and A2 pins
are no connects in the IS24C16A.
WP
WP is the Write Protect pin. If the WP pin is tied to VCC on
the IS24C02A, IS24C04A, IS24C08A and IS24C016A, the
entire array becomes Write Protected (Read only). When WP
is tied to GND or left floating normal read/write operations are
allowed to the device.
A0, A1, A2
The A0, A1 and A2 are the device address inputs. The
IS24C02A uses the A0, A1, and A2 for hardware addressing
and a total of 8 devices may be used on a single bus system.
When the A0, A1, or A2 inputs are left floating, the input
internally defaults to zero.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
01/09/06
3
IS24C02A
IS24C04A
IS24C08A
IS24C16A
DEVICE OPERATION
IS24C02A/04A/08A/16A features serial communication and
supports a bi-directional 2-wire bus transmission protocol
called I2CTM.
2-WIRE BUS
The two-wire bus is defined as a Serial Data line (SDA), and
a Serial Clock line (SCL). The protocol defines any device that
sends data onto the SDA bus as a transmitter, and the
receiving devices as receivers. The bus is controlled by
Master device that generates the SCL, controls the bus
access, and generates the Stop and Start conditions. The
IS24C02A/04A/08A/16A is the Slave device on the bus.
The Bus Protocol:
– Data transfer may be initiated only when the bus is not busy
– During a data transfer, the SDA line must remain stable
whenever the SCL line is high. Any changes in the SDA
line while the SCL line is high will be interpreted as a Start
or Stop condition.
The state of the SDA line represents valid data after a Start
condition. The SDA line must be stable for the duration of the
High period of the clock signal. The data on the SDA line may
be changed during the Low period of the clock signal. There
is one clock pulse per bit of data. Each data transfer is
initiated with a Start condition and terminated with a Stop
condition.
Start Condition
ISSI
®
The EEPROM monitors the SDA and SCL lines and will
not respond until the Start condition is met.
Stop Condition
The Stop condition is defined as a Low to High transition
of SDA when SCL is High. All operations must end with
a Stop condition.
Acknowledge (ACK)
After a successful data transfer, each receiving device is
required to generate an ACK. The Acknowledging device
pulls down the SDA line.
Reset
The IS24C02A/04A/08A/16A contains a reset function
in case the 2-wire bus transmission is accidentally
interrupted (eg. a power loss), or needs to be
terminated mid-stream. The reset is caused when the
Master device creates a Start condition. To do this, it
may be necessary for the Master device to monitor the
SDA line while cycling the SCL up to nine times. (For
each clock signal transition to High, the Master checks
for a High level on SDA.)
Standby Mode
Power consumption is reduced in standby mode. The
IS24C02A/04A/08A/16A will enter standby mode: a) At
Power-up, and remain in it until SCL or SDA toggles; b)
Following the Stop signal if a no write operation is
initiated; or c) Following any internal write operation.
The Start condition precedes all commands to the device and
is defined as a High to Low transition of SDA when SCL is High.
4
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
01/09/06
IS24C02A
IS24C04A
IS24C08A
IS24C16A
DEVICE ADDRESSING
WRITE OPERATION
The Master begins a transmission by sending a Start
condition. The Master then sends the address of the
particular Slave devices it is requesting. The Slave device
(Fig. 5) address is 8 bits.
Byte Write
The four most significant bits of the Slave address are fixed
as 1010 for the IS2402A/04A/08A/16A.
The next three bits of the Slave address are specific for
each of the EEPROM. The bit values enable access to
multiple memory blocks or multiple devices.
The IS24C02A uses the three bits A0, A1, and A2 in a
comparison with the hard-wired input values on the A0, A1,
and A2 pins. Up to eight IS24C02A units may share the 2wire bus.
The IS24C04A uses the bit B0 to address either the upper
or the lower 256 byte block in the device. Also, the bits A1
and A2 are used in a comparison with the hard-wired input
values on the A1 and A2 pins. Up to four IS24C04A units
may share the 2-wire bus.
The IS24C08A uses the bits B0 and B1 to address one of
the four 256 byte blocks in the device. Also, the bit A2 is
used in a comparison with the hard-wired input value on the
A2 pin. Up to two IS24C08A units may share the 2-wire
bus.
The IS24C16A uses the bits B0, B1, and B2 to address one
of the eight 256 byte blocks in the device.
The last bit of the Slave address specifies whether a Read
or Write operation is to be performed. When this bit is set
to 1, a Read operation is selected, and when set to 0, a Write
operation is selected.
After the Master transmits the Start condition and Slave
address byte (Fig. 5), the appropriate 2-wire Slave
(eg.IS24C02A/04A/08A/16A) will respond with ACK on the
SDA line. The Slave will pull down the SDA on the ninth
clock cycle, signaling that it received the eight bits of data.
The selected EEPROM then prepares for a Read or Write
operation by monitoring the bus.
In the Byte Write mode, the Master device sends the Start
condition and the Slave address information (with the R/W
set to Zero) to the Slave device. After the Slave generates
an ACK, the Master sends the byte address that is to be
written into the address pointer of the IS24C02A/04A/08A/
16A. After receiving another ACK from the Slave, the
Master device transmits the data byte to be written into the
address memory location. The IS24C02A/04A/08A/16A
acknowledges once more and the Master generates the
Stop condition, at which time the device begins its internal
programming cycle. While this internal cycle is in progress,
the device will not respond to any request from the Master
device.
Page Write
The IS24C02A/04A/08A/16A is capable of 16-byte PageWrite operation. A Page-Write is initiated in the same manner
as a Byte Write, but instead of terminating the internal Write
cycle after the first data word is transferred, the Master
device can transmit up to 15 more bytes. After the receipt of
each data word, the EEPROM responds immediately with an
ACK on SDA line, and the four lower order data word address
bits are internally incremented by one, while the higher order
bits of the data word address remain constant. If a byte
address is incremented from the last byte of a page, it
returns to the first byte of that page. If the Master device
should transmit more than 16 bytes prior to issuing the Stop
condition, the address counter will “roll over,” and the previously
written data will be overwritten. Once all 16 bytes are
received and the Stop condition has been sent by the Master,
the internal programming cycle begins. At this point, all
received data is written to the IS24C02A/04A/08A/16A in a
single Write cycle. All inputs are disabled until completion of
the internal Write cycle.
Acknowledge (ACK) Polling
The disabling of the inputs can be used to take advantage of
the typical Write cycle time. Once the Stop condition is
issued to indicate the end of the host's Write operation, the
IS24C02A/04A/08A/16A initiates the internal Write cycle.
ACK polling can be initiated immediately. This involves
issuing the Start condition followed by the Slave address for
a Write operation. If the EEPROM is still busy with the Write
operation, no ACK will be returned. If the IS24C02A/04A/
08A/16A has completed the Write operation, an ACK will be
returned and the host can then proceed with the next Read
or Write operation.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
01/09/06
ISSI
®
5
IS24C02A
IS24C04A
IS24C08A
IS24C16A
ISSI
®
READ OPERATION
Random Address Read
Read operations are initiated in the same manner as Write
operations, except that the (R/W) bit of the Slave address is
set to “1”. There are three Read operation options: current
address read, random address read and sequential read.
Selective Read operations allow the Master device to
select at random any memory location for a Read
operation. The Master device first performs a 'dummy'
Write operation by sending the Start condition, Slave
address and byte address of the location it wishes to
read. After the IS24C02A/04A/08A/16A acknowledges
the byte address, the Master device resends the Start
condition and the Slave address, this time with the R/W
bit set to one. The EEPROM then responds with its ACK
and sends the data requested. The Master device does
not send an ACK but will generate a Stop condition. (Refer
to Figure 9. Random Address Read Diagram.)
Current Address Read
The IS24C02A/04A/08A/16A contains an internal address
counter which maintains the address of the last byte accessed,
incremented by one. For example, if the previous operation is
either a Read or Write operation addressed to the address
location n, the internal address counter would increment to
address location n+1. When the EEPROM receives the
Slave Addressing Byte with a Read operation (R/W bit set to
“1”), it will respond an ACK and transmit the 8-bit data byte
stored at address location n+1. The Master should not
acknowledge the transfer but should generate a Stop condition
so the IS24C02A/04A/08A/16A discontinues transmission. If
'n' is the last byte of the memory, the data from location '0' will
be transmitted. (Refer to Figure 8. Current Address Read
Diagram.)
Sequential Read
Sequential Reads can be initiated as either a Current
Address Read or Random Address Read. After the
IS24C02A/04A/08A/16A sends the initial byte sequence,
the Master device now responds with an ACK indicating
it requires additional data from the IS24C02A/04A/08A/
16A. The EEPROM continues to output data for each
ACK received. The Master device terminates the
sequential Read operation by pulling SDA High (no ACK)
indicating the last data word to be read, followed by a Stop
condition.
The data output is sequential, with the data from address
n followed by the data from address n+1,n+2 ... etc. The
address counter increments by one automatically, allowing
the entire memory contents to be serially read during
sequential Read operation. When the memory address
boundary of 255, 511, 1023, or 2047 (depending on the
device) is reached, the address counter “rolls over” to
address 0, and the device continues to output data.
(Refer to Figure 10. Sequential Read Diagram).
6
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
01/09/06
IS24C02A
IS24C04A
IS24C08A
ISSI
IS24C16A
®
FIGURE 1. TYPICAL SYSTEM BUS CONFIGURATION
Vcc
SDA
SCL
Master
Transmitter/
Receiver
IS24Cxx
FIGURE 2. OUTPUT ACKNOWLEDGE
SCL from
Master
1
8
9
Data Output
from
Transmitter
tAA
Data Output
from
Receiver
tAA
ACK
STOP
Condition
SCL
START
Condition
FIGURE 3. START AND STOP CONDITIONS
SDA
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Rev. F
01/09/06
7
IS24C02A
IS24C04A
IS24C08A
ISSI
IS24C16A
®
FIGURE 4. DATA VALIDITY PROTOCOL
Data Change
SCL
Data Stable
Data Stable
SDA
FIGURE 5. SLAVE ADDRESS
BIT
BIT
BIT
BIT
7
6
5
4
3
2
1
0
1
0
1
0
A2
A1
A0
R/W
7
6
5
4
3
2
1
0
1
0
1
0
A2
A1
B0
R/W
7
6
5
4
3
2
1
0
1
0
1
0
A2
B1
B0
R/W
7
6
5
4
3
2
1
0
1
0
1
0
B2
B1
B0
R/W
IS24C02A
IS24C04A
IS24C08A
IS24C16A
LSB
MSB
FIGURE 6. BYTE WRITE
SDA
Bus
Activity
S
T
A
R
T
Device
Address
S
T
O
P
Data
Byte Address
A
C
K
M
S
B
8
W
R
I
T
E
A
C
K
A
C
K
L
M
S
S
B
B
R/W
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
01/09/06
IS24C02A
IS24C04A
IS24C08A
ISSI
IS24C16A
®
FIGURE 7. PAGE WRITE
SDA
Bus
Activity
S
T
A
R
T
W
R
I
T
E
Device
Address
M
S
B
Data (n)
Byte Address (n)
A
C
K
Data (n+1)
A
C
K
A
C
K
S
T
O
P
Data (n+15)
A
C
K
A
C
K
L
S
B
R/W
FIGURE 8. CURRENT ADDRESS READ
S
T
A
R
T
R
E
A
D
Device
Address
SDA
Bus
Activity
S
T
O
P
Data
A
C
K
M
S
B
L
S
B
N
O
A
C
K
R/W
FIGURE 9. RANDOM ADDRESS READ
S
T
A
R
T
Device
Address
SDA
Bus
Activity
W
R
I
T
E
Byte
Address (n)
A
C
K
M
S
B
S
T
A
R
T
Device
Address
A
C
K
L
S
B
R/W
R
E
A
D
S
T
O
P
Data n
A
C
K
N
O
A
C
K
DUMMY WRITE
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Rev. F
01/09/06
9
IS24C02A
IS24C04A
IS24C08A
ISSI
IS24C16A
®
FIGURE 10. SEQUENTIAL READ
Device
Address
SDA
Bus
Activity
R
E
A
D
Data Byte n
A
C
K
Data Byte n+1
A
C
K
Data Byte n+2
A
C
K
S
T
O
P
Data Byte n+X
A
C
K
N
O
R/W
10
A
C
K
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
01/09/06
IS24C02A
IS24C04A
IS24C08A
ISSI
IS24C16A
®
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
VS
VP
TBIAS
TSTG
IOUT
Parameter
Supply Voltage
Voltage on Any Pin
Temperature Under Bias
Storage Temperature
Output Current
Value
–0.5 to +6.5
–0.5 to Vcc + 0.5
–55 to +125
–65 to +150
5
Unit
V
V
°C
°C
mA
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
OPERATING RANGE
(IS24C02A-2, IS24C04A -2, IS24C08A -2, & IS24C16A -2)
Range
Commercial
Industrial
Ambient Temperature
0°C to +70°C
–40°C to +85°C
VCC
1.8V to 5.5V
1.8V to 5.5V
OPERATING RANGE
(IS24C02A-3, IS24C04A -3, IS24C08A -3, & IS24C16A -3)
Range
Commercial
Industrial
Ambient Temperature
0°C to +70°C
–40°C to +85°C
VCC
2.5V to 5.5V
2.5V to 5.5V
Automotive
–40°C to +125°C
2.5V to 5.5V
CAPACITANCE(1,2)
Symbol
CIN
COUT
Parameter
Input Capacitance
Output Capacitance
Conditions
VIN = 0V
VOUT = 0V
Max.
6
8
Unit
pF
pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: TA = 25°C, f = 1 MHz, Vcc = 5.0V.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
01/09/06
11
IS24C02A
IS24C04A
IS24C08A
ISSI
IS24C16A
®
AC WAVEFORMS
Figure 11. Bus Timing
tR
tF
tHIGH
tLOW
tSU:STO
SCL
tSU:STA
tBUF
tHD:DAT
tHD:STA
tSU:DAT
SDAIN
tAA
tDH
SDAOUT
tSU:WP
tHD:WP
WP
Figure 12. Write Cycle Timing
SCL
SDA
8th BIT
ACK
tWR
WORD n
STOP
Condition
12
START
Condition
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
01/09/06
IS24C02A
IS24C04A
IS24C08A
ISSI
IS24C16A
®
DC ELECTRICAL CHARACTERISTICS
Commercial (TA = 0oC to +70oC), Industrial (TA = -40oC to +85oC), Automotive (TA = -40oC to +125oC)
Symbol
VOL1
VOL2
VIH
V IL
I LI
ILO
Parameter
Output Low Voltage
Output Low Voltage
Input High Voltage
Input Low Voltage
Input Leakage Current
Output Leakage Current
Test Conditions
VCC = 1.8V, IOL = 0.15 mA
VCC = 2.5V, IOL = 3 mA
Min.
Max.
—
0.2
—
0.4
VCC X 0.7 VCC + 0.5
–1.0
VCC X 0.3
—
3
—
3
VIN = VCC max.
Unit
V
V
V
V
µA
µA
Notes: VIL min and VIH max are reference only and are not tested.
POWER SUPPLY CHARACTERISTICS
Commercial (TA = 0oC to +70oC), Industrial (TA = -40oC to +85oC), Automotive (TA = -40oC to +125oC)
Symbol
ICC1
ICC2
ISB1
ISB2
Parameter
Vcc Operating Current
Vcc Operating Current
Standby Current
Standby Current
Test Conditions
Read at 400 KHz (Vcc = 5V)
Write at 400 KHz (Vcc = 5V)
Vcc = 1.8V
Vcc = 2.5V
ISB3
Standby Current
Vcc = 5.0V
Min.
—
—
—
—
Max.
2.0
3.0
1
2
Unit
mA
mA
µA
µA
—
6
µA
AC ELECTRICAL CHARACTERISTICS
Commercial (TA = 0oC to +70oC) Industrial (TA = -40oC to +85oC)
1.8V ≤ Vcc < 2.5V
Symbol
fSCL
T
tLow
tHigh
tBUF
tSU:STA
tSU:STO
tHD:STA
tHD:STO
tSU:DAT
tHD:DAT
tSU:WP
tHD:WP
tDH
tAA
tR
tF
tWR
Parameter
SCL Clock Frequency
Noise Suppression Time(1)
Clock Low Period
Clock High Period
Bus Free Time Before New Transmission(1)
Start Condition Setup Time
Stop Condition Setup Time
Start Condition Hold Time
Stop Condition Hold Time
Data In Setup Time
Data In Hold Time
WP pin Setup Time
WP pin Hold Time
Data Out Hold Time (SCL Low to SDA Data Out Change)
Clock to Output (SCL Low to SDA Data Out Valid)
SCL and SDA Rise Time(1)
SCL and SDA Fall Time(1)
Write Cycle Time
Min.
0
—
4.7
4
4.7
4
4
4
4
100
0
4
4.7
100
100
—
—
—
Max.
100
100
—
—
—
—
—
—
—
—
—
—
—
—
3500
1000
300
5
2.5V ≤ Vcc < 4.5V 4.5V ≤ Vcc ≤ 5.5V(1)
Min.
0
—
1.2
0.6
1.2
0.6
0.6
0.6
0.6
100
0
0.6
1.2
50
50
—
—
—
Max.
400
50
—
—
—
—
—
—
—
—
—
—
—
—
900
300
300
5
Min.
0
—
0.6
0.4
0.5
0.25
0.25
0.25
0.25
100
0
0.6
1.2
50
50
—
—
—
Max.
1000
50
—
—
—
—
—
—
—
—
—
—
—
—
400
300
100
5
Unit
KHz
ns
µs
µs
µs
µs
µs
µs
µs
ns
ns
µs
µs
ns
ns
ns
ns
ms
Note: 1. This parameter is characterized but not 100% tested.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
01/09/06
13
IS24C02A
IS24C04A
IS24C08A
ISSI
IS24C16A
®
AC ELECTRICAL CHARACTERISTICS
Automotive (TA = -40oC to +125oC)
2.5V ≤ Vcc < 4.5V
Symbol
Parameter
fSCL
T
4.5V ≤ Vcc ≤ 5.5V(1)
Min.
Max.
Min.
Max.
Unit
SCL Clock Frequency
0
Noise Suppression Time(1)
—
400
0
1000
KHz
50
—
50
ns
tLow
Clock Low Period
1.2
—
0.6
—
µs
tHigh
Clock High Period
tBUF
Bus Free Time Before New Transmission(1)
0.6
—
0.4
—
µs
1.2
—
0.5
—
µs
tSU:STA
Start Condition Setup Time
0.6
—
0.25
—
µs
tSU:STO
Stop Condition Setup Time
0.6
—
0.25
—
µs
tHD:STA
Start Condition Hold Time
0.6
—
0.25
—
µs
tHD:STO
Stop Condition Hold Time
0.6
—
0.25
—
µs
tSU:DAT
Data In Setup Time
100
—
100
—
ns
tHD:DAT
Data In Hold Time
0
—
0
—
ns
tSU:WP
WP pin Setup Time
0.6
—
0.6
—
µs
tHD:WP
WP pin Hold Time
1.2
—
1.2
—
µs
tDH
Data Out Hold Time (SCL Low to SDA Data Out Change)
50
—
50
—
ns
tAA
Clock to Output (SCL Low to SDA Data Out Valid)
50
900
50
550
ns
tR
SCL and SDA Rise Time(1)
—
300
—
300
ns
tF
SCL and SDA Fall Time(1)
—
300
—
100
ns
tWR
Write Cycle Time
—
10
—
5
ms
Note:
1. This parameter is characterized but not 100% tested.
14
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
01/09/06
IS24C02A
IS24C04A
IS24C08A
IS24C16A
ISSI
®
ORDERING INFORMATION
Commercial Range: 0°C to +70°C
Voltage
Range
Part Number
Package
1.8V
to 5.5V
IS24C08A-2P
IS24C08A-2G
IS24C08A-2Z
300-mil Plastic DIP
Small Outline (JEDEC STD)
TSSOP
1.8V
to 5.5V
IS24C16A-2P
IS24C16A-2G
300-mil Plastic DIP
Small Outline (JEDEC STD)
2.5V
to 5.5V
IS24C04A-3P
IS24C04A-3G
300-mil Plastic DIP
Small Outline (JEDEC STD)
2.5V
to 5.5V
IS24C08A-3P
IS24C08A-3G
IS24C08A-3Z
300-mil Plastic DIP
Small Outline (JEDEC STD)
TSSOP
2.5V
to 5.5V
IS24C16A-3P
IS24C16A-3G
300-mil Plastic DIP
Small Outline (JEDEC STD)
Note:
Above Commercial grade options are not recommended for new designs.
ORDERING INFORMATION
Industrial Range: –40°C to +85°C
Voltage
Range
Part Number
Package
1.8V
to 5.5V
IS24C02A-2PI
IS24C02A-2GI
IS24C02A-2SI
IS24C02A-2ZI
300-mil Plastic DIP
Small Outline (JEDEC STD)
MSOP
TSSOP
1.8V
to 5.5V
IS24C04A-2PI
IS24C04A-2GI
IS24C04A-2ZI
300-mil Plastic DIP
Small Outline (JEDEC STD)
TSSOP
1.8V
to 5.5V
IS24C08A-2PI
IS24C08A-2GI
IS24C08A-2ZI
300-mil Plastic DIP
Small Outline (JEDEC STD)
TSSOP
1.8V
to 5.5V
IS24C16A-2PI
IS24C16A-2GI
IS24C16A-2ZI
300-mil Plastic DIP
Small Outline (JEDEC STD)
TSSOP
2.5V
to 5.5V
IS24C04A-3PI
IS24C04A-3GI
300-mil Plastic DIP
Small Outline (JEDEC STD)
2.5V
to 5.5V
IS24C08A-3PI
IS24C08A-3GI
IS24C08A-3ZI
300-mil Plastic DIP
Small Outline (JEDEC STD)
TSSOP
2.5V
to 5.5V
IS24C16A-3PI
IS24C16A-3GI
300-mil Plastic DIP
Small Outline (JEDEC STD)
Note:
Above -3GI, -3PI, -3ZI options are not recommended for new designs.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
01/09/06
15
IS24C02A
IS24C04A
IS24C08A
IS24C16A
ISSI
®
ORDERING INFORMATION
Industrial Range: –40°C to +85°C, Lead-free
Voltage
Range
Part Number
Package
1.8V
to 5.5V
IS24C02A-2PLI
IS24C02A-2GLI
IS24C02A-2SLI
IS24C02A-2ZLI
IS24C02A-2DLI
300-mil Plastic DIP
Small Outline (JEDEC STD)
MSOP
TSSOP
DFN
1.8V
to 5.5V
IS24C04A-2PLI
IS24C04A-2GLI
IS24C04A-2ZLI
IS24C04A-2DLI
300-mil Plastic DIP
Small Outline (JEDEC STD)
TSSOP
DFN
1.8V
to 5.5V
IS24C08A-2PLI
IS24C08A-2GLI
IS24C08A-2ZLI
IS24C08A-2DLI
300-mil Plastic DIP
Small Outline (JEDEC STD)
TSSOP
DFN
1.8V
to 5.5V
IS24C16A-2PLI
IS24C16A-2GLI
IS24C16A-2ZLI
IS24C16A-2DLI
300-mil Plastic DIP
Small Outline (JEDEC STD)
TSSOP
DFN
ORDERING INFORMATION
Automotive Range: –40°C to +125°C, Lead-free
Voltage
Range
Part Number
Package
2.5V
to 5.5V
IS24C02A-3PLA3
IS24C02A-3GLA3
IS24C02A-3SLA3
IS24C02A-3ZLA3
300-mil Plastic DIP
Small Outline (JEDEC STD)
MSOP
TSSOP
2.5V
to 5.5V
IS24C04A-3PLA3
IS24C04A-3GLA3
IS24C04A-3ZLA3
300-mil Plastic DIP
Small Outline (JEDEC STD)
TSSOP
2.5V
to 5.5V
IS24C08A-3PLA3
IS24C08A-3GLA3
IS24C08A-3ZLA3
300-mil Plastic DIP
Small Outline (JEDEC STD)
TSSOP
2.5V
to 5.5V
IS24C16A-3PLA3
IS24C16A-3GLA3
IS24C16A-3ZLA3
300-mil Plastic DIP
Small Outline (JEDEC STD)
TSSOP
16
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
01/09/06
PACKAGING
ISSI
INFORMATION
PlasticMSOP
Package Code: S
N
E1
E
1
D
SEATING PLANE
A
A1
e
L
α
C
B
Ref. Std.
No. Leads
Plastic MSOP (S)
JEDEC MO 187
8 (120 mil)
Inches
Symbol Min Max
A
0.038 0.043
A1
0.002 0.006
B
0.010 0.016
C
0.005 0.009
D
0.114 0.122
E
0.193 BSC
E1
0.114 0.122
e
0.0256BSC
L
— 0.022
α
—
7°
Millimeters
Min Max
0.97 1.10
0.05 0.15
0.25 0.40
0.13 0.23
2.90 3.10
4.90BSC
2.90 3.10
0.65BSC
—
0.55
—
7°
Notes:
1. Controlling dimension: inches, unless
otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold
flash protrusions and should be measured
from the bottom of the package.
4. Formed leads shall be planar with respect to
one another within 0.004 inches at the
seating plane.
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may
appear in this publication. © Copyright 2002, Integrated Silicon Solution, Inc.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. D 02/01/02
®
ISSI
PACKAGING INFORMATION
®
300-mil Plastic DIP
Package Code: N,P
N
E1
1
D
S
S
SEATING PLANE
B1
E
A
L
C
A1
FOR
32-PIN ONLY
e
MILLIMETERS
Sym.
Min.
INCHES
Max.
Min.
Max.
4.57
9.53
8.26
0.145
0.015
0.014
0.045
0.032
0.008
0.359
0.300
0.180
E
3.68
0.38
0.36
1.14
0.81
0.20
9.12
7.62
E1
6.20
6.60
0.244
0.260
eA
e
8.13
9.65
0.320
0.380
L
3.18
—
0.125
—
S
0.64
0.762
0.025
0.030
N0.
Leads
A
A1
B
B1
B2
C
D
B2
B
eA
Notes:
1. Controlling dimension: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should
be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within 0.004
inches at the seating plane.
8
—
0.56
1.52
1.17
0.33
2.54 BSC
—
0.022
0.060
0.046
0.013
0.375
0.325
0.100 BSC
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. D
02/14/03
ISSI
PACKAGING INFORMATION
150-mil Plastic SOP
Package Code: G, GR
®
N
E
H
1
D
SEATING PLANE
A
A1
e
L
α
C
B
Symbol
Ref. Std.
No. Leads
A
A1
B
C
D
E
H
e
L
150-mil Plastic SOP (G, GR)
Min
Max
Min
Max
Inches
mm
8
8
—
0.068
—
1.73
0.004
0.009
0.1
0.23
0.013
0.020
0.33
0.51
0.007
0.010
0.18
0.25
0.189
0.197
4.8
5
0.150
0.157
3.81
3.99
0.228
0.245
5.79
6.22
0.050 BSC
1.27 BSC
0.020
0.035
0.51
0.89
Notes:
1. Controlling dimension: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be
measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within 0.004 inches at the
seating plane.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. C
10/03/01
2
ISSI
PACKAGING INFORMATION
®
Dual Flat No-Lead
Package Code: D (8-pad)
D2
E
tie bars(3)
b
(8X)
E2
A
Pad 1 ID
L (8X)
D
A2
A1
e (6X)
1.50 REF.
A3
Pad 1 index area
DFN
MILLIMETERS
Sym.
Min. Nom. Max.
N0.
Pad
8
D
2.00 BSC
E
3.00 BSC
D2
1.50
—
1.75
E2
1.60
—
1.90
A
0.70
0.75
0.80
A1
0.0
0.02
0.05
A2
—
—
0.75
A3
L
0.20 REF
0.30
e
b
Notes:
1. Refer to JEDEC Drawing MO-229.
2. This is the metallized terminal and
is measured between 0.18 mm
and 0.30 mm from the terminal tip.
The terminal may have a straight
end instead of rounded.
3. Package may have exposed tie
bars, ending flush with package
edge.
0.40
0.50
0.50 BSC
0.18
0.25
0.30
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. B
02/13/06
ISSI
PACKAGING INFORMATION
Thin Shrink Small Outline TSSOP
Package Code: Z (8 pin, 14 pin)
N
E1
1
E
α
N/2
A1
D
A2
A
L
C
e
B
TSSOP (Z)
Ref. Std.
JEDEC MO-153
No. Leads
8
Millimeters
Inches
Symbol Min Max
Min Max
A
—
1.20
— 0.047
A1
0.05 0.15
0.002 0.006
A2
0.80 1.05
0.032 0.041
B
0.19 0.30
0.007 0.012
C
0.09 0.20
0.004 0.008
D
2.90 3.10
0.114 0.122
E1
4.30 4.50
0.169 0.177
E
6.40 BSC
0.252 BSC
e
0.65 BSC
0.026 BSC
L
0.45 0.75
0.018 0.030
α
—
8°
—
8°
TSSOP (Z)
Ref. Std.
JEDEC MO-153
No. Leads
14
Millimeters
Inches
Symbol Min Max
Min
Max
A
—
1.20
—
0.047
A1
0.05 0.15
0.002 0.006
A2
0.80 1.05
0.031 0.041
B
0.19 0.30
0.007 0.012
C
0.09 0.20
0.0035 0.008
D
4.90 5.10
0.193 0.201
E1
4.30 4.50
0.170 0.177
E
6.40 BSC
0.252 BSC
e
0.65 BSC
0.026 BSC
L
0.45 0.75
0.0177 0.0295
α
—
8°
—
8°
SSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may
appear in this publication. © Copyright 2002, Integrated Silicon Solution, Inc.
Integrated Silicon Solution, Inc.
Rev B 02/01/02
®