C o ntrol In t eg ra t ed P Owe r Sys te m (C IPOS™) I KCM 20R 6 0GD Datasheet For Power Management Application 1 Ver. 1.0, 2015-06-01 CIPOS™ IKCM20R60GD Table of Contents CIPOS™ Control Integrated POwer System ........................................................................................................ 3 Features .............................................................................................................................................................. 3 Target Applications ........................................................................................................................................... 3 Description ......................................................................................................................................................... 3 System Configuration ....................................................................................................................................... 3 Pin Configuration .................................................................................................................................................... 4 Internal Electrical Schematic ................................................................................................................................. 4 Pin Assignment ....................................................................................................................................................... 5 Pin Description .................................................................................................................................................. 5 HIN(A, B) and LIN(A, B) (IGBT control pins, Pin 7 - 10) ................................................................................... 5 VFO (Fault-output, Pin 12) ................................................................................................................................ 6 ITRIP (Over current detection function, Pin 13) ................................................................................................ 6 VDD, VSS (Low side control supply and reference, Pin 11, 14) ....................................................................... 6 VB(A, B) and VS(A, B) (High side supplies, Pin 3 - 6) ...................................................................................... 6 NL (IGBT emitter, Pin 17) .................................................................................................................................. 6 NH (Diode anode, Pin 18) ................................................................................................................................. 6 P (Positive bus input voltage, Pin 23)................................................................................................................ 6 Absolute Maximum Ratings................................................................................................................................... 7 Module Section .................................................................................................................................................. 7 Inverter Section.................................................................................................................................................. 7 Control Section .................................................................................................................................................. 7 Recommended Operation Conditions .................................................................................................................. 8 Dynamic Parameters ............................................................................................................................................ 10 Bootstrap Parameters .......................................................................................................................................... 10 Thermistor ............................................................................................................................................................. 11 Mechanical Characteristics and Ratings............................................................................................................ 11 Circuit of a Typical Application ........................................................................................................................... 12 Switching Times Definition .................................................................................................................................. 12 Electrical characteristic ....................................................................................................................................... 13 Package Outline .................................................................................................................................................... 14 Datasheet 2 Ver. 1.0, 2015-06-01 CIPOS™ IKCM20R60GD CIPOS™ Control Integrated POwer System Dual In-Line Intelligent Power Module Two Phase Switched Reluctance Drives 600V / 20A Features Description Dual In-Line molded module The CIPOS™ module family offers the chance for integrating various power and control components to increase reliability, optimize PCB size and system costs. • TrenchStop® IGBTs • Rugged SOI gate driver technology with stability against transient and negative voltage • Allowable negative VS potential up to -11V for signal transmission at VBS=15V • Integrated bootstrap functionality • Over current shutdown • Under-voltage lockout at all channels • All of 4 switches turn off during protection • Lead-free terminal plating; RoHS compliant • Very low thermal resistance due to DCB • Temperature monitor It is designed to control two phase switched reluctance motors in variable speed drives for applications like a vacuum cleaner. The package concept is specially adapted to power applications, which need good thermal conduction and electrical isolation, but also EMI-save control and overload protection. ® TrenchStop IGBTs and anti parallel diodes are combined with an optimized SOI gate driver for excellent electrical performance. System Configuration • Two phase switched reluctance drive with TrenchStop® IGBTs Target Applications • Two Phase Switched Reluctance Drive • SOI gate driver • Thermistor • Pin-to-heatsink creepage distance typ. 1.6mm Datasheet 3 Ver. 1.0, 2015-06-01 CIPOS™ IKCM20R60GD Pin Configuration Bottom View (24) NC (1) NC (2) NC (23) P (3) VS(A) (4) VB(A) (22) HA (5) VS(B) (6) VB(B) (21) HB (7) HIN(A) (8) HIN(B) (9) LIN(A) (10) LIN(B) (11) VDD (12) VFO (13) ITRIP (14) VSS (15) NTC (20) LA (19) LB (18) NH (16) NC (17) NL Figure 1: Pin configuration Internal Electrical Schematic NC (24) (1) NC (2) NC P (23) VB1 HOA RBS1 HA (22) VSA (3) VS(A) (4) VB(A) VB2 RBS2 HOB HB (21) VSB (5) VS(B) (6) VB(B) LA (20) (7) HIN(A) HINA (8) HIN(B) HINB (9) LIN(A) (10) LIN(B) LINA (11) VDD VDD (12) VFO VFO (13) ITRIP ITRIP (14) VSS VSS (15) NTC LINB LB (19) LOA NH (18) LOB (16) NC NL (17) Figure 2: Internal schematic Datasheet 4 Ver. 1.0, 2015-06-01 CIPOS™ IKCM20R60GD Pin Assignment Pin Number Pin Name Pin Description 1 NC No Connection 2 NC No Connection 3 VS(A) A-phase high side floating IC supply offset voltage 4 VB(A) A-phase high side floating IC supply voltage 5 VS(B) B-phase high side floating IC supply offset voltage 6 VB(B) B-phase high side floating IC supply voltage 7 HIN(A) A phase high side gate driver input 8 HIN(B) B phase high side gate driver input 9 LIN(A) A phase low side gate driver input 10 LIN(B) B phase low side gate driver input 11 VDD Low side control supply 12 VFO Fault output 13 ITRIP Over current shutdown input 14 VSS Low side control negative supply 15 NTC Temperature monitor 16 NC No Connection 17 NL LA, LB IGBT emitter 18 NH HA, HB diode anode 19 LB LB phase output 20 LA LA phase output 21 HB HB phase output 22 HA HA phase output 23 P Positive bus input voltage 24 NC No Connection Pin Description CIPOS HIN(A, B) and LIN(A, B) (IGBT control pins, Pin 7 - 10) These pins are positive logic and they are responsible for the control of the integrated IGBT. The Schmitt-trigger input thresholds of them are such to guarantee LSTTL and CMOS compatibility down to 3.3V controller outputs. Pull-down resistor of about 5kΩ is internally provided to pre-bias inputs during supply start-up and a zener clamp is provided for pin protection purposes. Input Schmitttrigger and noise filter provide beneficial noise rejection to short input pulses. Figure 3: Input pin structure The noise filter suppresses control pulses which are below the filter time tFILIN. The filter acts according to Figure 4. Figure 4: Input filter timing diagram Datasheet Schmitt-Trigger HINx LINx ≈ 5kΩ UZ=10.5V VSS a) 5 tFILIN INPUT NOISE FILTER SWITCH LEVEL VIH; VIL b) tFILIN HIN LIN HIN LIN HO LO HO LO high low Ver. 1.0, 2015-06-01 CIPOS™ IKCM20R60GD VS(A, B) provide a high robustness against negative voltage in respect of VSS of -50V transiently. This ensures very stable designs even under rough conditions. It is recommended for proper work of CIPOS™ not to provide input pulse-width lower than 1us. VFO (Fault-output, Pin 12) The VFO pin indicates a module failure in case of under voltage at pin VDD or in case of triggered over current detection at ITRIP. CIPOS VDD VFO VSS NL (IGBT emitter, Pin 17) The low side IGBT emitters are available for current measurements. It is recommended to keep the connection to pin VSS as short as possible in order to avoid unnecessary inductive voltage drops. RON,FLT From ITRIP - Latch NH (Diode anode, Pin 18) The low side anodes of the integrated diodes are connected. 1 From UV detection P (Positive bus input voltage, Pin 23) The high sides of IGBT are connected to the bus voltage. It is noted that the bus voltage does not exceed 450 V. Figure 5: Internal circuit at pin VFO ITRIP (Over current detection function, Pin 13) CIPOS™ provides an over current detection function by connecting the ITRIP input with the motor current feedback. The ITRIP comparator threshold (typ. 0.47V) is referenced to VSS ground. A input noise filter (typ: tITRIPMIN = 530ns) prevents the driver to detect false over-current events. Over current detection generates a shut down of all outputs of the gate driver after the shutdown propagation delay of typically 1000ns. The fault-clear time is set to typical 65us. VDD, VSS (Low side control supply and reference, Pin 11, 14) VDD is the low side supply and it provides power both to input logic and to low side output power stage. Input logic is referenced to VSS ground. The under-voltage circuit enables the device to operate at power on when a supply voltage of at least a typical voltage of VDDUV+ = 12.1V is present. The IC shuts down all the gate drivers’ outputs, when the VDD supply voltage is VDDUV- = 10.4V. This prevents the external switches from critically low gate voltage during on-state and therefore from excessive dissipation. power below power levels power VB(A, B) and VS(A, B) (High side supplies, Pin 3 - 6) VB to VS is the high side supply voltage. The high side circuit can float with respect to VSS following the external high side power device emitter voltage. Due to the low power consumption, the floating driver stage is supplied by integrated bootstrap circuit. The under-voltage detection operates with a rising supply threshold of typical VBSUV+ = 12.1V and a falling threshold of VBSUV- = 10.4V. Datasheet 6 Ver. 1.0, 2015-06-01 CIPOS™ IKCM20R60GD Absolute Maximum Ratings (VDD = 15V and TJ = 25°C, if not stated otherwise) Module Section Description Condition Storage temperature range Insulation test voltage RMS, f=60Hz, t =1min Operating case temperature range Refer to Figure 6 Symbol Value Unit min max Tstg -40 125 °C VISOL 2000 - V TC -40 100 °C Inverter Section Description Condition Symbol Value min max Unit Max. blocking voltage IC=250µA VCES 600 - V DC link supply voltage of P-N Applied between P-N VPN - 450 V DC link supply voltage (surge) of P-N Applied between P-N VPN(surge) - 500 V Output current TC = 25°C, TJ ≤ 150°C IC -20 20 A Maximum peak output current TC = 25°C, less than 1 ms IC -40 40 A Short circuit withstand time 1 VDC ≤ 400V, TJ ≤ 150°C tSC - 5 µs Power dissipation per IGBT Ptot - 73.0 W Operating junction temperature range TJ -40 150 °C Single IGBT thermal resistance, junction-case RthJC - 1.71 K/W Single diode thermal resistance, junction-case RthJCD - 3.32 K/W Control Section Description Condition Value min max Unit Module supply voltage VDD -1 20 V High side floating supply voltage (VB vs. VS) VBS -1 20 V VIN, VITRIP -1 10 V fPWM - 20 kHz Input voltage LIN, HIN, ITRIP Switching frequency 1 Symbol Allowed number of short circuits: <1000; time between short circuits: >1s. Datasheet 7 Ver. 1.0, 2015-06-01 CIPOS™ IKCM20R60GD Recommended Operation Conditions All voltages are absolute voltages referenced to VSS -potential unless otherwise specified. Description Symbol Value min typ max Unit DC link supply voltage of P-N VPN 0 - 400 V High side floating supply voltage (VB vs. VS) VBS 13.5 - 18.5 V Low side supply voltage VDD 14.5 16 18.5 V Control supply variation ΔVBS ΔVDD -1 -1 - 1 1 V/µs Logic input voltages LIN,HIN,ITRIP VIN VITRIP 0 0 - 5 5 V Between VSS - N (including surge) VSS -5 - 5 V Figure 6: TC measurement point 1 1 Any measurement except for the specified point in figure 6 is not relevant for the temperature verification and brings wrong or different information. Datasheet 8 Ver. 1.0, 2015-06-01 CIPOS™ IKCM20R60GD Static Parameters (VDD = 15V and TJ = 25°C, if not stated otherwise) Description Condition Symbol Value Unit min typ max VCE(sat) - 1.55 1.85 2.1 - V VF - 1.75 1.8 2.45 - V ICES - - 1 mA Logic "1" input voltage (LIN,HIN) VIH - 2.1 2.5 V Logic "0" input voltage (LIN,HIN) VIL 0.7 0.9 - V ITRIP positive going threshold VIT,TH+ 400 470 540 mV ITRIP input hysteresis VIT,HYS 40 70 - mV VDD and VBS supply under voltage positive going threshold VDDUV+ VBSUV+ 10.8 12.1 13.0 V VDD and VBS supply under voltage negative going threshold VDDUVVBSUV- 9.5 10.4 11.2 V VDD and VBS supply under voltage lockout hysteresis VDDUVH VBSUVH 1.0 1.7 - V Collector-Emitter saturation voltage Emitter-Collector forward voltage Collector-Emitter leakage current IC = 15A, Tj = 25°C 150°C IC= -15A, Tj = 25°C 150°C VCE = 600V Input clamp voltage (HIN, LIN, ITRIP) Iin=4mA VINCLAMP 9.0 10.1 12.5 V Quiescent VBx supply current (VBx only) HIN = 0V IQBS - 300 500 µA Quiescent VDD supply current (VDD only) LIN = 0V, HINX=5V IQDD - 370 900 µA Input bias current VIN = 5V IIN+ - 1 1.5 mA Input bias current VIN = 0V IIN- - 2 - µA ITRIP input bias current VITRIP = 5V IITRIP+ - 65 150 µA VFO input bias current VFO = 5V, VITRIP = 0V IFO - 2 - nA VFO output voltage IFO = 10mA, VITRIP = 1V VFO - 0.5 - V Datasheet 9 Ver. 1.0, 2015-06-01 CIPOS™ IKCM20R60GD Dynamic Parameters (VDD = 15V and TJ = 25°C, if not stated otherwise) Condition Description Symbol typ max ton - 620 - ns tr - 30 - ns tc(on) - 200 - ns trr - 130 - ns toff - 910 - ns tf - 75 - ns tc(off) - 120 - ns tSCP - 1200 - ns tITRIPmin - 530 - ns tFILIN - 290 - ns tFLTCLR 40 - - µs Eon - 470 610 - µJ Eoff - 270 360 - µJ Erec - 55 105 - µJ VLIN,HIN = 5V, Iout = 15A, VDC = 300V Turn-on switching time Reverse recovery time Turn-off propagation delay time Turn-off fall time Turn-off switching time VLIN,HIN = 0V, Iout = 15A, VDC = 300V Short circuit propagation delay time From VIT,TH+ to 10% ISC Input filter time ITRIP VITRIP = 1V Input filter time at LIN, HIN for turn on and off VLIN,HIN = 0V & 5V Fault clear time after ITRIP-fault VITRIP = 1V IGBT turn-on energy (includes reverse recovery of diode) VDC = 300V, VDC = 300V, IGBT turn-off energy Tj = 25°C IC = 15A 150°C Tj = 25°C IC = 15A VDC = 300V, Diode recovery energy 150°C Tj = 25°C IC = 15A Unit min Turn-on propagation delay time Turn-on rise time Value 150°C Bootstrap Parameters (TJ = 25°C, if not stated otherwise) Description Condition Symbol Repetitive peak reverse voltage 1 Value min VRRM 600 - Bootstrap resistance of U-phase 1 VS2 or VS3 = 300V, TJ = 25°C VS2 and VS3 = 0V, TJ = 25°C VS2 or VS3 = 300V, TJ = 125°C VS2 and VS3 = 0V, TJ = 125°C RBS1 Reverse recovery time IF = 0.6A, di/dt = 80A/µs Forward voltage drop IF = 20mA, VS2 and VS3 = 0V typ max Unit V 35 40 50 65 - Ω trr_BS 50 - ns VF_BS 2.6 - V RBS2 and RBS3 have same values to RBS1. Datasheet 10 Ver. 1.0, 2015-06-01 CIPOS™ IKCM20R60GD Thermistor Condition Description Resistor Unit min typ max RNTC - 85 - kΩ B(25/100) - 4092 - K TNTC = 25°C B-constant of NTC (Negative temperature coefficient) Value Symbol 35 3000 2500 2000 1500 Min. Typ. Max. 30 Thermistor resistance [kΩ ] Thermistor resistance [kΩ ] 3500 1000 25 20 15 10 5 0 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 125 130 Thermistor temperature [℃] 500 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Thermistor temperature [℃] Figure 7: Thermistor resistance – temperature curve and table (For more information, please refer to the application note ‘AN CIPOS mini-1 Technical Description’) Mechanical Characteristics and Ratings Description Condition Value min typ max Unit Mounting torque M3 screw and washer 0.49 - 0.78 Nm Flatness Refer to Figure 8 -50 - 100 µm - 6.84 - g Weight Figure 8: Flatness measurement position Datasheet 11 Ver. 1.0, 2015-06-01 CIPOS™ IKCM20R60GD Circuit of a Typical Application NC (24) P (23) (1) NC VB1 (2) NC RBS1 (3) VS(A) (4) VB(A) VB2 RBS2 HOA VSA HA (22) HOB VSB HB (21) 2phase SR Motor (5) VS(B) (6) VB(B) LA (20) (7) HIN(A) Micro Controller HINA (8) HIN(B) HINB (9) LIN(A) LINA (10) LIN(B) VDD line 5 or 3.3V line LOA (11) VDD VDD (12) VFO NH (18) VFO (13) ITRIP ITRIP (14) VSS VSS (15) NTC LOB (16) NC Signal for over-circuit protection LB (19) LINB NL (17) Current sensing Current sensing Temperature monitor Figure 9: Application circuit Switching Times Definition HINx LINx 2.1V 0.9V trr toff ton 10% iCx 90% 90% tf vCEx 10% tr 10% 10% 10% tc(on) tc(off) Figure 10: Switching times definition Datasheet 12 Ver. 1.0, 2015-06-01 CIPOS™ IKCM20R60GD Electrical characteristic 40 TJ=25℃ 20 VDD=15V VDD=20V 15 10 5 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 VCE(sat), Collector - Emitter voltage [V] VDC=300V VDD=15V High side @TJ=25℃dd High side @TJ=150℃d Low side @TJ=25℃dd Low side @TJ=150℃d 2.5 2.0 1.5 1.0 0.5 0.0 0 5 10 15 20 25 30 Ic, Collector current [A] 35 720 1.5 2.0 2.5 3.0 660 630 600 0.8 0.7 0.6 0.5 0.4 0.3 0.2 VDC=300V VDD=15V 0.1 0 5 10 15 20 25 30 Ic, Collector current [A] 35 15 20 25 30 35 High side @TJ=25℃dd High side @TJ=150℃d Low side @TJ=25℃dd Low side @TJ=150℃d 600 500 400 300 200 0 40 0 Typ. Turn on propagation delay time trr, Reverse recovery time [ns] High side @TJ=25℃ High side @TJ=150℃ Low side @TJ=25℃ Low side @TJ=150℃ 300 250 200 150 100 50 10 15 20 25 30 Ic, Collector current [A] 35 5 10 15 20 25 30 Ic, Collector current [A] Typ. Turn off switching time Datasheet 35 40 500 High side @TJ=25℃dd 450 High side @TJ=150℃d 400 Low side @TJ=25℃dd 350 Low side @TJ=150℃d 2.0 2.5 3.0 3.5 VDC=300V VDD=15V 220 200 High side @TJ=25℃dd High side @TJ=150℃d Low side @TJ=25℃dd Low side @TJ=150℃d 180 160 140 d 120 100 80 60 40 20 0 5 10 15 20 25 30 35 Ic, Collector current [A] 40 VDC=300V VDD=15V High side @TJ=25℃ High side @TJ=150℃ Low side @TJ=25℃ Low side @TJ=150℃ 1300 1200 1100 1000 900 800 700 0 5 10 15 20 25 30 35 Ic, Collector current [A] 40 1 0.1 0.01 300 250 1E-3 200 150 100 0 1.5 Typ. Turn off propagation delay time 1E-4 50 0 1.0 VF, Emitter - Collector voltage [V] 1400 40 VDC=300V VDD=15V 550 350 0.5 10 600 VDC=300V VDD=15V 400 5 240 0 Typ. Turn on switching time 450 5 1500 VDC=300V VDD=15V 700 TJ=25℃ TJ=150℃ 10 Typ. Emitter – Collector forward voltage ZthJC, IGBT transient thermal resistance [K/W] 10 15 Typ. Reverse recovery energy loss 100 Ic, Collector current [A] 20 0 0.0 40 570 5 25 3.5 High side @TJ=25℃dd High side @TJ=150℃d Low side @TJ=25℃dd Low side @TJ=150℃d 0.9 800 690 0 tc(off), Turn off switching time [ns] 1.0 30 1.0 0.0 tc(on), Turn on switching time [ns] ton, Turn on propagation delay time [ns] 750 0.5 VCE(sat), Collector - Emitter voltage [V] Typ. Turn off switching energy loss High side @TJ=25℃dd High side @TJ=150℃d Low side @TJ=25℃dd Low side @TJ=150℃d 780 5 Typ. Collector – Emitter saturation voltage 40 VDC=300V VDD=15V 810 TJ=25℃ TJ=150℃ 0 0.0 Typ. Turn on switching energy loss 840 15 Eoff, Turn off switching energy loss [mJ] Eon, Turn on switching energy loss [mJ] 4.0 3.0 20 3.5 Typ. Collector – Emitter saturation voltage 3.5 25 10 35 IF, Emitter - Collector current [A] 25 30 Erec, Reverse recovery energy loss [uJ] 30 40 VDD=15V 35 toff, Turn off propagation delay time [ns] 35 Ic, Collector - Emitter current [A] Ic, Collector - Emitter current [A] 40 0 5 10 15 20 25 30 Ic, Collector current [A] Typ. Reverse recovery time 13 35 40 D : duty ratio D=50% D=20% D=10% D=5% D=2% Single pulse 1E-5 1E-7 1E-6 1E-5 1E-4 1E-3 0.01 0.1 tP, Pulse width [sec.] 1 10 100 IGBT transient thermal resistance at all six IGBTs operation Ver. 1.0, 2015-06-01 CIPOS™ IKCM20R60GD Package Outline Datasheet 14 Ver. 1.0, 2015-06-01 CIPOS™ IKCM20R60GD Revision History Major changes since the last revision Page or Reference Datasheet Description of change 15 Ver. 1.0, 2015-06-01 Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolGaN™, CoolMOS™, CoolSET™, CoolSiC™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, DrBLADE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, IsoPACK™, i-Wafer™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OPTIGA™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, ReverSave™, SatRIC™, SIEGET™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, SPOC™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. ANSI™ of American National Standards Institute. AUTOSAR™ of AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. HYPERTERMINAL™ of Hilgraeve Incorporated. MCS™ of Intel Corp. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ of Openwave Systems Inc. RED HAT™ of Red Hat, Inc. RFMD™ of RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex. Last Trademarks Update 2014-07-17 www.Infineon.com Edition 2014-06-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2015. All Rights Reserved. IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). 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