Microchip MCP6272T-E/SL 170 î¼a, 2 mhz rail-to-rail op amp Datasheet

MCP6271/1R/2/3/4/5
170 µA, 2 MHz Rail-to-Rail Op Amp
Features
Description
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The Microchip Technology Inc. MCP6271/1R/2/3/4/5
family of operational amplifiers (op amps) provide wide
bandwidth for the current. This family has a 2 MHz
Gain Bandwidth Product (GBWP) and a 65° Phase
Margin. This family also operates from a single supply
voltage as low as 2.0V, while drawing 170 µA (typical)
quiescent current. The MCP6271/1R/2/3/4/5 supports
rail-to-rail input and output swing, with a common mode
input voltage range of VDD + 300 mV to VSS – 300 mV.
This family of op amps is designed with Microchip’s
advanced CMOS process.
Gain Bandwidth Product: 2 MHz (typical)
Supply Current: IQ = 170 µA (typical)
Supply Voltage: 2.0V to 6.0V
Rail-to-Rail Input/Output
Extended Temperature Range: –40°C to +125°C
Available in Single, Dual and Quad Packages
Parts with Chip Select (CS)
- Single (MCP6273)
- Dual (MCP6275)
Applications
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The MCP6275 has a Chip Select input (CS) for dual op
amps in an 8-pin package and is manufactured by
cascading two op amps (the output of op amp A
connected to the non-inverting input of op amp B). The
CS input puts the device in low power mode.
Automotive
Portable Equipment
Photodiode Amplifier
Analog Filters
Notebooks and PDAs
Battery Powered Systems
The MCP6271/1R/2/3/4/5 family operates over the
Extended Temperature Range of –40°C to +125°C,
with a power supply range of 2.0V to 6.0V.
Available Tools
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SPICE Macro Models
FilterLab® Software
Mindi™ Circuit Designer & Simulator
MAPS (Microchip Advanced Part Selector)
Analog Demonstration and Evaluation Boards
Application Notes
Package Types
MCP6271
PDIP, SOIC, MSOP
NC 1
7 VDD
VSS 2
6 VOUT
VIN+ 3
NC 1
VDD 2
4 VIN–
8 CS
+
7 VDD
MCP6273
SOT-23-6
VOUT 1
VIN+ 3
5 VSS
VOUTA 1
VINA– 2
4 VIN–
VSS 2
6 VOUT VIN+ 3
5 NC
MCP6274
PDIP, SOIC, TSSOP
6 VDD VOUTA 1
+
VSS 4
VOUT 1
MCP6272
PDIP, SOIC, MSOP
8 VDD
7 VOUTB
- +
VINA+ 3
+ -
-
5 CS
VINA– 2
4 VIN– VINA+ 3
VDD 4
© 2008 Microchip Technology Inc.
11 VSS
VINB+ 5
10 VINC+
VINB– 6
-+ +- 9 V –
INC
VOUTB 7
MCP6275
PDIP, SOIC, MSOP
14 VOUTD VOUTA/VINB+ 1
- + + - 13 VIND–
12 VIND+
6 VINB–
5 VINB+
VSS 4
MCP6273
PDIP, SOIC, MSOP
VIN– 2
5 VDD
5 NC
VSS 4
VIN+ 3
MCP6271R
SOT-23-5
+
VIN+ 3
VOUT 1
8 NC
+
+
VIN– 2
MCP6271
SOT-23-5
VINA– 2
VINA+ 3
VSS 4
8 VDD
7 VOUTB
- +
+ -
6 VINB–
5 CS
8 VOUTC
DS21810F-page 1
MCP6271/1R/2/3/4/5
1.0
ELECTRICAL
CHARACTERISTICS
VDD – VSS ........................................................................7.0V
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification is not
implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
Current at Input Pins ....................................................±2 mA
†† See Section 4.1.2 “Input Voltage and Current Limits”.
Absolute Maximum Ratings †
Analog Inputs (VIN+ and VIN–) †† .. VSS – 1.0V to VDD + 1.0V
All other Inputs and Outputs .......... VSS – 0.3V to VDD + 0.3V
Difference Input Voltage ...................................... |VDD – VSS|
Output Short Circuit Current .................................Continuous
Current at Output and Supply Pins ............................±30 mA
Storage Temperature....................................–65°C to +150°C
Junction Temperature (TJ) . .........................................+150°C
ESD Protection On All Pins (HBM/MM) ................ ≥ 4 kV/400V
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +2.0V to +5.5V, VSS = GND, VCM = VDD/2,
VOUT ≈ VDD/2, VL = VDD/2, RL = 10 kΩ to VL and CS is tied low. (Refer to Figure 1-2 and Figure 1-3).
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Offset Voltage
VOS
–3.0
—
+3.0
mV
VCM = VSS
Input Offset Voltage
(Extended Temperature)
VOS
–5.0
—
+5.0
mV
TA = –40°C to +125°C, VCM = VSS
Input Offset (Note 1)
Input Offset Temperature Drift
ΔVOS/ΔTA
—
±1.7
—
Power Supply Rejection Ratio
PSRR
70
90
—
IB
—
±1.0
—
pA
Note 2
IB
—
50
200
pA
TA= +85°C (Note 2)
IB
—
2
5
nA
TA= +125°C (Note 2)
IOS
—
±1.0
—
pA
Note 3
13
µV/°C TA = –40°C to +125°C, VCM = VSS
dB
VCM = VSS
Input Bias Current and Impedance
Input Bias Current
At Temperature
At Temperature
Input Offset Current
Common Mode Input Impedance
ZCM
—
10 ||6
—
Ω||pF Note 3
Differential Input Impedance
ZDIFF
—
1013||3
—
Ω||pF Note 3
Common Mode Input Voltage Range
VCMR
VSS − 0.15
—
VDD + 0.15
VCMR
VSS − 0.30
—
VDD + 0.30
V
VDD = 5.5V (Note 5)
Common Mode Rejection Ratio
CMRR
70
85
—
dB
VCM = –0.3V to 2.5V, VDD = 5V
(Note 6)
Common Mode Rejection Ratio
CMRR
65
80
—
dB
VCM = –0.3V to 5.3V, VDD = 5V
(Note 6)
AOL
90
110
—
dB
VOUT = 0.2V to VDD – 0.2V,
VCM = VSS (Note 1)
Common Mode (Note 4)
V
VDD = 2.0V (Note 5)
Open-Loop Gain
DC Open-Loop Gain (Large Signal)
Note 1:
2:
3:
4:
5:
6:
7:
The MCP6275’s VCM for op amp B (pins VOUTA/VINB+ and VINB–) is VSS + 100 mV.
The current at the MCP6275’s VINB– pin is specified by IB only.
This specification does not apply to the MCP6275’s VOUTA/VINB+ pin.
The MCP6275’s VINB– pin (op amp B) has a common mode input voltage range (VCMR) of VSS + 100 mV to
VDD – 100 mV. CMRR is not measured for op amp B of the MCP6275. The MCP6275’s VOUTA/VINB+ pin (op amp B)
has a voltage range specified by VOH and VOL.
Set by design and characterization.
Does not apply to op amp B of the MCP6275.
All parts with date codes November 2007 and later have been screened to ensure operation at VDD = 6.0V. However,
the other minimum and maximum specifications are measured at 2.0V and 5.5V.
DS21810F-page 2
© 2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +2.0V to +5.5V, VSS = GND, VCM = VDD/2,
VOUT ≈ VDD/2, VL = VDD/2, RL = 10 kΩ to VL and CS is tied low. (Refer to Figure 1-2 and Figure 1-3).
Parameters
Sym
Min
Typ
Max
Units
VOL, VOH
VSS + 15
—
VDD − 15
mV
ISC
—
±25
—
mA
Conditions
Output
Maximum Output Voltage Swing
Output Short Circuit Current
0.5V input overdrive (Note 4)
Power Supply
Supply Voltage
Quiescent Current per Amplifier
Note 1:
2:
3:
4:
VDD
2.0
—
6.0
V
IQ
100
170
240
µA
IO = 0
The MCP6275’s VCM for op amp B (pins VOUTA/VINB+ and VINB–) is VSS + 100 mV.
The current at the MCP6275’s VINB– pin is specified by IB only.
This specification does not apply to the MCP6275’s VOUTA/VINB+ pin.
The MCP6275’s VINB– pin (op amp B) has a common mode input voltage range (VCMR) of VSS + 100 mV to
VDD – 100 mV. CMRR is not measured for op amp B of the MCP6275. The MCP6275’s VOUTA/VINB+ pin (op amp B)
has a voltage range specified by VOH and VOL.
Set by design and characterization.
Does not apply to op amp B of the MCP6275.
All parts with date codes November 2007 and later have been screened to ensure operation at VDD = 6.0V. However,
the other minimum and maximum specifications are measured at 2.0V and 5.5V.
5:
6:
7:
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +2.0V to +5.5V, VSS = GND, VCM = VDD/2,
VOUT ≈ VDD/2, VL = VDD/2, RL = 10 kΩ to VL, CL = 60 pF and CS is tied low. (Refer to Figure 1-2 and Figure 1-3).
Parameters
Sym
Min
Typ
Max
Units
Conditions
GBWP
—
2.0
—
MHz
Phase Margin
PM
—
65
—
°
Slew Rate
SR
—
0.9
—
V/µs
Input Noise Voltage
Eni
—
4.6
—
µVP-P
Input Noise Voltage Density
eni
—
20
—
nV/√Hz
f = 1 kHz
Input Noise Current Density
ini
—
3
—
fA/√Hz
f = 1 kHz
AC Response
Gain Bandwidth Product
G = +1 V/V
Noise
CS
VIL
VIH
tOFF
tON
VOUT
ISS
0.7 µA
(typical)
ICS
High-Z
High-Z
-0.7 µA
(typical)
f = 0.1 Hz to 10 Hz
-170 µA
(typical)
10 nA
(typical)
-0.7 µA
(typical)
0.7 µA
(typical)
FIGURE 1-1:
Timing Diagram for the Chip
Select (CS) pin on the MCP6273 and MCP6275.
© 2008 Microchip Technology Inc.
DS21810F-page 3
MCP6271/1R/2/3/4/5
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VDD = +2.0V to +5.5V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range
TA
–40
—
+125
°C
Operating Temperature Range
TA
–40
—
+125
°C
Storage Temperature Range
TA
–65
—
+150
°C
Thermal Resistance, 5L-SOT-23
θJA
—
256
—
°C/W
Thermal Resistance, 6L-SOT-23
θJA
—
230
—
°C/W
Thermal Resistance, 8L-PDIP
θJA
—
85
—
°C/W
Thermal Resistance, 8L-SOIC
θJA
—
163
—
°C/W
Thermal Resistance, 8L-MSOP
θJA
—
206
—
°C/W
Thermal Resistance, 14L-PDIP
θJA
—
70
—
°C/W
Thermal Resistance, 14L-SOIC
θJA
—
120
—
°C/W
Thermal Resistance, 14L-TSSOP
θJA
—
100
—
°C/W
Conditions
Temperature Ranges
Note
Thermal Package Resistances
The Junction Temperature (TJ) must not exceed the Absolute Maximum specification of +150°C.
Note:
MCP6273/MCP6275 CHIP SELECT SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +2.0V to +5.5V, VSS = GND,
VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 10 kΩ to VDD/2, CL = 60 pF and CS is tied low.
Parameters
Sym
Min
Typ
Max
Units
Conditions
CS Logic Threshold, Low
VIL
VSS
—
0.2VDD
V
CS Input Current, Low
ICSL
—
0.01
—
µA
CS Logic Threshold, High
VIH
0.8VDD
—
VDD
V
CS Input Current, High
ICSH
—
0.7
2
µA
CS = VDD
GND Current per Amplifier
ISS
—
–0.7
—
µA
CS = VDD
Amplifier Output Leakage
—
—
0.01
—
µA
CS = VDD
CS Low to Valid Amplifier
Output, Turn on Time
tON
—
4
10
µs
CS Low ≤ 0.2 VDD, G = +1 V/V,
VIN = VDD/2, VOUT = 0.9 VDD/2,
VDD = 5.0V
CS High to Amplifier Output
High-Z
tOFF
—
0.01
—
µs
CS High ≥ 0.8 VDD, G = +1 V/V,
VIN = VDD/2, VOUT = 0.1 VDD/2
VHYST
—
0.6
—
V
VDD = 5V
CS Low Specifications
CS = VSS
CS High Specifications
Dynamic Specifications (Note 1)
Hysteresis
Note 1:
The input condition (VIN) specified applies to both op amp A and B of the MCP6275. The dynamic
specification is tested at the output of op amp B (VOUTB).
DS21810F-page 4
© 2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
1.1
Test Circuits
The test circuits used for the DC and AC tests are
shown in Figure 1-2 and Figure 1-3. The bypass
capacitors are laid out according to the rules discussed
in Section 4.7 “Supply Bypass”.
VDD
VIN
RN
0.1 µF 1 µF
VOUT
MCP627X
CL
VDD/2 RG
RL
RF
VL
FIGURE 1-2:
AC and DC Test Circuit for
Most Non-Inverting Gain Conditions.
VDD
VDD/2
RN
0.1 µF 1 µF
VOUT
MCP627X
CL
VIN
RG
RL
RF
VL
FIGURE 1-3:
AC and DC Test Circuit for
Most Inverting Gain Conditions.
© 2008 Microchip Technology Inc.
DS21810F-page 5
MCP6271/1R/2/3/4/5
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25°C, VDD = +2.0V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
18%
14%
2%
Input Offset Voltage (mV)
Common Mode Input Voltage (V)
FIGURE 2-3:
Input Offset Voltage vs.
Common Mode Input Voltage, with VDD = 2.0V.
10
8
3.0
TA = +125°C
100
50
TA = +85°C
TA = +25°C
TA = -40°C
0
-50
5.0
4.5
4.0
-100
3.5
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-100
150
3.0
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
200
2.5
100
Input Bias Current at
VDD = 5.5V
250
-0.5
150
DS21810F-page 6
6.0
Input Offset Voltage (µV)
Input Offset Voltage (µV)
200
-50
2.8
300
VDD = 2.0V
0
5.5
FIGURE 2-5:
TA = +125°C.
Input Bias Current at
50
2.6
Input Bias Current (nA)
300
250
2.4
90 100
2.0
FIGURE 2-2:
TA = +85°C.
30 40 50 60 70 80
Input Bias Current (pA)
1.5
20
1.0
10
0.5
0
2.2
0%
2.0
4%
1.8
8%
1.6
12%
1.4
16%
1.2
20%
422 Samples
TA = +125°C
1.0
24%
22%
20%
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
Input Offset Voltage Drift.
0.8
422 Samples
TA = 85°C
0.6
28%
FIGURE 2-4:
Input Offset Voltage.
Percentage of Occurrences
Percentage of Occurrences
32%
Input Offset Voltage Drift (µV/°C)
0.0
FIGURE 2-1:
6
0%
4
3.0
2.4
1.8
1.2
0.6
0.0
-0.6
-1.2
-1.8
-2.4
0%
4%
2
2%
0
4%
6%
-2
6%
8%
-4
8%
-6
10%
10%
-8
12%
832 Samples
VCM = VSS
TA = -40°C to +125°C
12%
-10
14%
Percentage of Occurrences
832 Samples
VCM = VSS
16%
-3.0
Percentage of Occurrences
VL = VDD/2, RL = 10 kΩ to VL, CL = 60 pF and CS is tied low.
Common Mode Input Voltage (V)
FIGURE 2-6:
Input Offset Voltage vs.
Common Mode Input Voltage, with VDD = 5.5V.
© 2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
Note: Unless otherwise indicated, TA = +25°C, VDD = +2.0V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
-0.35
-0.40
-0.45
-0.50
Common Mode Input Voltage
Range Limit (V)
Common Mode Input Voltage
Range Limit (V)
VL = VDD/2, RL = 10 kΩ to VL, CL = 60 pF and CS is tied low.
Typical lower (VCM – VSS) limit
VDD = 2.0V
VDD = 5.5V
-50
-25
0
25
50
75
100
Ambient Temperature (°C)
125
FIGURE 2-7:
Common Mode Input
Voltage Range Lower Limit vs. Temperature.
200
150
100
50
0
VDD = 2.0V
VDD = 5.5V
-50
-100
Input Offset Voltage vs.
70
PSRR–
PSRR+
40
PSRR, CMRR (dB)
CMRR, PSRR (dB)
125
1,000
VCM = VDD
VDD = 5.5V
Input Bias Current
100
10
Input Offset Current
1
55
65 75 85 95 105 115 125
Ambient Temperature (°C)
120
80
50
0
25
50
75
100
Ambient Temperature (°C)
FIGURE 2-11:
Input Bias, Input Offset
Currents vs. Temperature.
CMRR
90
60
-25
45
110
100
Typical upper (VCM – VDD) limit
10,000
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Output Voltage (V)
FIGURE 2-8:
Output Voltage.
VDD = 2.0V
FIGURE 2-10:
Common Mode Input
Voltage Range Upper Limit vs. Temperature.
Input Bias, Offset Currents
(pA)
Input Offset Voltage (µV)
VCM = VSS
Representative Part
VDD = 5.5V
-50
300
250
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
110
100
CMRR
90
PSRR
(VCM = VSS)
80
70
30
20
1
10 1.E+02
100 1.E+03
1k
10k 1.E+05
100k 1.E+06
1M
1.E+00
1.E+01
1.E+04
Frequency (Hz)
FIGURE 2-9:
Frequency.
CMRR, PSRR vs.
© 2008 Microchip Technology Inc.
60
-50
-25
0
25
50
75
100
125
Ambient Temperature (°C)
FIGURE 2-12:
Temperature.
CMRR, PSRR vs.
DS21810F-page 7
MCP6271/1R/2/3/4/5
Note: Unless otherwise indicated, TA = +25°C, VDD = +2.0V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
VL = VDD/2, RL = 10 kΩ to VL, CL = 60 pF and CS is tied low.
2.5
Input Bias, Offset Currents
(nA)
45
Input Bias Current
35
25
15
5
Input Offset Current
-5
TA = 85°C
VDD = 5.5V
-15
-25
2.0
1.5
0.5
0.0
-1.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Common Mode Input Voltage (V)
FIGURE 2-16:
Input Bias, Offset Currents
vs. Common Mode Input Voltage, with
TA = +125°C.
Ouput Voltage Headroom
(mV)
Quiescent Current
(µA/amplifier)
Input Offset Current
1000
250
200
150
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
100
50
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Power Supply Voltage (V)
Quiescent Current vs.
0
100
-30
Gain
80
60
-60
-90
Phase
40
-120
20
-150
0
-180
1.E+08
1.E+07
1.E+06
1.E+05
1.E+04
1.E+03
1.E+02
1
1.E+01
0.1
1.E+00
-210
1.E-01
-20
10 100 1k 10k 100k 1M 10M 100M
FIGURE 2-15:
Frequency.
DS21810F-page 8
Frequency (Hz)
VOL – VSS
VDD – VOH
0.1
1
Output Current Magnitude (mA)
3.0
Open-Loop Gain, Phase vs.
Gain Bandwidth Product
(MHz)
120
10
10
FIGURE 2-17:
Output Voltage Headroom
vs. Output Current Magnitude.
Open-Loop Phase (°)
FIGURE 2-14:
Supply Voltage.
100
1
0.01
0
Open-Loop Gain (dB)
TA = 125°C
VDD = 5.5V
-0.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Common Mode Input Voltage (V)
FIGURE 2-13:
Input Bias, Offset Currents
vs. Common Mode Input Voltage, with
TA = +85°C.
Input Bias Current
1.0
80
2.5
75
GBWP, VDD = 5.5V
VDD = 2.0V
2.0
1.5
70
65
1.0
PM, VDD = 5.5V
VDD = 2.0V
0.5
0.0
-50
-25
0
25
50
75 100
Ambient Temperature (°C)
60
Phase Margin (°)
Input Bias, Offset Currents
(pA)
55
55
50
125
FIGURE 2-18:
Gain Bandwidth Product,
Phase Margin vs. Temperature.
© 2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
Note: Unless otherwise indicated, TA = +25°C, VDD = +2.0V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
VL = VDD/2, RL = 10 kΩ to VL, CL = 60 pF and CS is tied low.
1.8
1.6
VDD = 5.5V
Slew Rate (V/µs)
VDD = 2.0V
1
Frequency (Hz)
1M
1.E+07
100k
1.E+06
10k
1.E+05
1.2
1.0
0.8
VDD = 2.0V
0.6
Rising Edge
0.4
0.0
10M
FIGURE 2-19:
Maximum Output Voltage
Swing vs. Frequency.
-50
FIGURE 2-22:
Input Noise Voltage Density
(nV/¥Hz)
Input Noise Voltage Density
20
15
10
5
f = 1 kHz
VDD = 5.0V
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
Common Mode Input Voltage (V)
FIGURE 2-23:
Input Noise Voltage Density
vs. Common Mode Input Voltage, with f = 1 kHz.
140
30
25
20
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
Channel-to-Channel
Separation (dB)
35
5
125
0
10
0.1
1
10
100 1k
10k 100k 1M
1.E- 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 1.E+
01
00
01 Frequency
02
03(Hz) 04
05
06
10
100
Slew Rate vs. Temperature.
0.5
100
15
0
25
50
75
Ambient Temperature (°C)
25
1,000
FIGURE 2-20:
vs. Frequency.
-25
0.0
1.E+04
1.E+03
1k
Input Noise Voltage Density
(nV/Hz)
Falling Edge
0.2
0.1
Ouptut Short-Circuit Current
(mA)
VDD = 5.5V
1.4
-0.5
Maximum Output Voltage
Swing (V P-P )
10
130
120
110
100
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Power Supply Voltage (V)
FIGURE 2-21:
Output Short Circuit Current
vs. Supply Voltage.
© 2008 Microchip Technology Inc.
1
10
Frequency (kHz)
100
FIGURE 2-24:
Channel-to-Channel
Separation vs. Frequency (MCP6272 and
MCP6274).
DS21810F-page 9
MCP6271/1R/2/3/4/5
Note: Unless otherwise indicated, TA = +25°C, VDD = +2.0V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
VL = VDD/2, RL = 10 kΩ to VL, CL = 60 pF and CS is tied low.
700
250
Op Amp turns Off
Op Amp turns On
150
Hysteresis
100
50
CS swept
High-to-Low
CS swept
Low-to-High
VDD = 5.5V
600
Hysteresis
500
CS swept
Low-to-High
400
CS swept
High-to-Low
200
Quiescent Current
(µA/amplifier)
Quiescent Current
(µA/amplifier)
VDD = 2.0V
300
200
100
0
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Chip Select Voltage (V)
Chip Select Voltage (V)
FIGURE 2-25:
Quiescent Current vs. Chip
Select (CS) Voltage, with VDD = 2.0V (MCP6273
and MCP6275 only).
FIGURE 2-28:
Quiescent Current vs. Chip
Select (CS) Voltage, with VDD = 5.5V (MCP6273
and MCP6275 only).
5.0
5.0
G = +1 V/V
VDD = 5.0V
4.5
4.0
4.5
Output Voltage (V)
Output Voltage (V)
Op Amp
turns
On/Off
3.5
3.0
2.5
2.0
1.5
1.0
0.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.0
Time (5 µs/div)
Time (5 µs/div)
FIGURE 2-26:
Pulse Response.
Large Signal Non-inverting
FIGURE 2-29:
Response.
Output Voltage (10 mV/div)
Output Voltage (10 mV/div)
Time (2 µs/div)
Time (2 µs/div)
DS21810F-page 10
Large Signal Inverting Pulse
G = -1 V/V
G = +1 V/V
FIGURE 2-27:
Pulse Response.
G = -1 V/V
VDD = 5.0V
Small Signal Non-inverting
FIGURE 2-30:
Response.
Small Signal Inverting Pulse
© 2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
Note: Unless otherwise indicated, TA = +25°C, VDD = +2.0V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
VL = VDD/2, RL = 10 kΩ to VL, CL = 60 pF and CS is tied low.
2.0
CS
VDD = 2.0V
G = +1 V/V
VIN = VSS
1.5
Output On
VOUT
1.0
0.5
Output High-Z
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Chip Select, Output Voltages
(V)
Chip Select, Output Voltages
(V)
2.5
0.0
Time (5 µs/div)
FIGURE 2-31:
Chip Select (CS) to
Amplifier Output Response Time, with
VDD = 2.0V (MCP6273 and MCP6275 only).
Output High-Z
Output On
FIGURE 2-33:
Chip Select (CS) to
Amplifier Output Response Time, with
VDD = 5,5V (MCP6273 and MCP6275 only).
6
+125°C
+85°C
+25°C
-40°C
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0
Input Voltage (V)
FIGURE 2-32:
Voltage.
VOUT
Time (5 µs/div)
Input Current vs. Input
© 2008 Microchip Technology Inc.
Input, Output Voltage (V)
Input Current Magnitude (A)
1.E-02
10m
1.E-03
1m
1.E-04
100µ
1.E-05
10µ
1.E-06
1µ
100n
1.E-07
10n
1.E-08
1n
1.E-09
100p
1.E-10
10p
1.E-11
1p
1.E-12
VDD = 5.5V
G = +1 V/V
VIN = VSS
CS
VDD = 5.0V
G = +2 V/V
5
4
3
2
1
VIN
VOUT
0
-1
Time (1 ms/div)
FIGURE 2-34:
The MCP6271/1R/2/3/4/5
Show no Phase Reversal.
DS21810F-page 11
MCP6271/1R/2/3/4/5
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1 (single op amps) and Table 3-2 (dual and quad op amps).
TABLE 3-1:
PIN FUNCTION TABLE FOR SINGLE OP AMPS
MCP6271
MCP6271R
MCP6273
Symbol
Description
PDIP, SOIC,
MSOP
SOT-23-5
SOT-23-5
PDIP, SOIC,
MSOP
SOT-23-6
2
4
4
2
4
VIN–
3
3
3
3
3
VIN+
Non-inverting Input
4
2
5
4
2
VSS
Negative Power Supply
6
1
1
6
1
VOUT
Analog Output
7
5
2
7
6
VDD
Positive Power Supply
Inverting Input
—
—
—
8
5
CS
Chip Select
1,5,8
—
—
1,5
—
NC
No Internal Connection
TABLE 3-2:
PIN FUNCTION TABLE FOR DUAL AND QUAD OP AMPS
MCP6272
MCP6274
MCP6275
Symbol
1
1
—
VOUTA
Analog Output (op amp A)
2
2
2
VINA–
Inverting Input (op amp A)
3
3
3
VINA+
Non-inverting Input (op amp A)
8
4
8
VDD
5
5
—
VINB+
Non-inverting Input (op amp B)
6
6
6
VINB–
Inverting Input (op amp B)
7
7
7
VOUTB
Analog Output (op amp B)
—
8
—
VOUTC
Analog Output (op amp C)
—
9
—
VINC–
Inverting Input (op amp C)
—
10
—
VINC+
4
11
4
VSS
3.1
Description
Positive Power Supply
Non-inverting Input (op amp C)
Negative Power Supply
—
12
—
VIND+
Non-inverting Input (op amp D)
—
13
—
VIND–
Inverting Input (op amp D)
—
14
—
VOUTD
—
—
1
VOUTA / VINB+
—
—
5
CS
Analog Output (op amp D)
Analog Output (op amp A)/Non-inverting Input (op amp B)
Chip Select
Analog Outputs
The output pins are low impedance voltage sources.
3.2
Chip Select Digital Input
This is a CMOS, Schmitt triggered input that places the
part into a low power mode of operation.
Analog Inputs
The non-inverting and inverting inputs are high
impedance CMOS inputs with low bias currents.
3.3
3.4
MCP6275’s VOUTA/VINB+ Pin
For the MCP6275 only, the output of op amp A is
connected directly to the non-inverting input of op amp
B; this is the VOUTA/VINB+ pin. This connection makes
it possible to provide a CS pin for duals in 8-pin
packages.
DS21810F-page 12
3.5
Power Supply Pins
The positive power supply (VDD) is 2.0V to 6.0V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
© 2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
4.0
APPLICATION INFORMATION
The MCP6271/1R/2/3/4/5 family of op amps is
manufactured using Microchip’s state of the art CMOS
process, specifically designed for low cost, low power
and general purpose applications. The low supply
voltage, low quiescent current and wide bandwidth
make the MCP6271/1R/2/3/4/5 ideal for battery
powered applications.
dump any currents onto VDD. When implemented as
shown, resistors R1 and R2 also limit the current
through D1 and D2.
VDD
D1
V1
4.1
Rail-to-Rail Inputs
4.1.1
R1
R2
The input devices are designed to not exhibit phase
inversion when the input pins exceed the supply
voltages. Figure 2-34 shows an input voltage
exceeding both supplies with no phase inversion.
R3
VSS – (minimum expected V1)
2 mA
VSS – (minimum expected V2)
R2 >
2 mA
R1 >
INPUT VOLTAGE AND CURRENT
LIMITS
The ESD protection on the inputs can be depicted as
shown in Figure 4-1. This structure was chosen to
protect the input transistors, and to minimize input bias
current (IB). The input ESD diodes clamp the inputs
when they try to go more than one diode drop below
VSS. They also clamp any voltages that go too far
above VDD; their breakdown voltage is high enough to
allow normal operation, and low enough to bypass
quick ESD events within the specified limits.
VDD Bond
Pad
VIN+ Bond
Pad
VSS
Input
Stage
Bond V –
IN
Pad
Bond
Pad
FIGURE 4-1:
Structures.
Simplified Analog Input ESD
In order to prevent damage and/or improper operation
of these amplifiers, the circuit must limit the currents
(and voltages) at the input pins (see Absolute Maximum Ratings † at the beginning of Section 1.0 “Electrical Characteristics”). Figure 4-2 shows the
recommended approach to protecting these inputs.
The internal ESD diodes prevent the input pins (VIN+
and VIN–) from going too far below ground, and the
resistors R1 and R2 limit the possible current drawn out
of the input pins. Diodes D1 and D2 prevent the input
pins (VIN+ and VIN–) from going too far above VDD, and
© 2008 Microchip Technology Inc.
VOUT
MCP627X
V2
PHASE REVERSAL
4.1.2
D2
FIGURE 4-2:
Inputs.
Protecting the Analog
It is also possible to connect the diodes to the left of the
resistor R1 and R2. In this case, the currents through
the diodes D1 and D2 need to be limited by some other
mechanism. The resistors then serve as in-rush current
limiters; the DC current into the input pins (VIN+ and
VIN–) should be very small.
A significant amount of current can flow out of the
inputs (through the ESD diodes) when the common
mode voltage (VCM) is below ground (VSS); see
Figure 2-32. Applications that are high impedance may
need to limit the usable voltage range.
4.1.3
NORMAL OPERATIONS
The input stage of the MCP6271/1R/2/3/4/5 op amps
uses two differential CMOS input stages in parallel.
One operates at low common mode input voltage (VCM
and the other at high VCM. With this topology, the input
operates with VCM up to 0.3V past either supply rail
(see Figure 2-7 and Figure 2-10). The input offset voltage (VOS) is measured at VCM = VSS – 0.3V and
VDD + 0.3V to ensure proper operation.
The transition between the two input stage occurs
when VCM ≈ VDD – 1.1V (see Figure 2-3 and Figure 26). For the best distortion and gain linearity, with noninverting gains, avoid this region of operation.
4.2
Rail-to-Rail Output
The output voltage range of the MCP6271/1R/2/3/4/5
op amps is VDD – 15 mV (minimum) and VSS + 15 mV
(maximum) when RL = 10 kΩ is connected to VDD/2
and VDD = 5.5V. Refer to Figure 2-17 for more information.
DS21810F-page 13
MCP6271/1R/2/3/4/5
4.3
Capacitive Loads
4.4
Driving large capacitive loads can cause stability
problems for voltage feedback op amps. As the load
capacitance increases, the feedback loop’s phase
margin decreases and the closed-loop bandwidth is
reduced. This produces gain peaking in the frequency
response, with overshoot and ringing in the step
response. A unity gain buffer (G = +1) is the most
sensitive to capacitive loads, though all gains show the
same general behavior.
When driving large capacitive loads with these op
amps (e.g., > 100 pF when G = +1), a small series
resistor at the output (RISO in Figure 4-3) improves the
feedback loop’s phase margin (stability) by making the
output load resistive at higher frequencies. The
bandwidth will be generally lower than the bandwidth
with no capacitive load.
–
RISO
MCP627X
+
VIN
VOUT
CL
MCP6273/5 Chip Select
The MCP6273 and MCP6275 are single and dual op
amps with Chip Select (CS), respectively. When CS is
pulled high, the supply current drops to 0.7 µA (typical)
and flows through the CS pin to VSS. When this
happens, the amplifier output is put into a high
impedance state. By pulling CS low, the amplifier is
enabled. The CS pin has an internal 5 MΩ (typical) pulldown resistor connected to VSS, so it will go low if the
CS pin is left floating. Figure 1-1 shows the output voltage and supply current response to a CS pulse.
4.5
Cascaded Dual Op Amps
(MCP6275)
The MCP6275 is a dual op amp with Chip Select (CS).
The Chip Select input is available on what would be the
non-inverting input of a standard dual op amp (pin 5).
This pin is available because the output of op amp A
connects to the non-inverting input of op amp B, as
shown in Figure 4-5. The Chip Select input, which can
be connected to a microcontroller I/O line, puts the
device in low power mode. Refer to Section 4.4
“MCP6273/5 Chip Select (CS)”.
Figure 4-4 gives recommended RISO values for
different capacitive loads and gains. The x-axis is the
normalized load capacitance (CL/GN), where GN is the
circuit's noise gain. For non-inverting gains, GN and the
Signal Gain are equal. For inverting gains, GN is
1+|Signal Gain| (e.g., –1 V/V gives GN = +2 V/V).
VINB–
VOUTA/VINB+
FIGURE 4-3:
Output Resistor, RISO
stabilizes large capacitive loads.
1
VINA–
VINA+
6
2
B
3
7
VOUTB
A
MCP6275
5
CS
Recommended RISO (:)
1,000
FIGURE 4-5:
The output of op amp A is loaded by the input
impedance of op amp B, which is typically
1013Ω⎟⎟6 pF, as specified in the DC specification table
(Refer to Section 4.3 “Capacitive Loads” for further
details regarding capacitive loads).
100
GN = 1 V/V
GN = 2 V/V
GN t 4 V/V
10
10
100
1,000
Cascaded Gain Amplifier.
10,000
Normalized Load Capacitance; CL / GN (pF)
FIGURE 4-4:
Recommended RISO Values
for Capacitive Loads.
The common mode input range of these op amps is
specified in the data sheet as VSS – 300 mV and
VDD + 300 mV. However, since the output of op amp A
is limited to VOL and VOH (20 mV from the rails with a
10 kΩ load), the non-inverting input range of op amp B
is limited to the common mode input range of
VSS + 20 mV and VDD – 20 mV.
After selecting RISO for your circuit, double check the
resulting frequency response peaking and step
response overshoot. Modify RISO's value until the
response is reasonable. Bench evaluation and
simulations with the MCP6271/1R/2/3/4/5 SPICE
macro model are helpful.
DS21810F-page 14
© 2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
4.6
Unused Amplifiers
VIN–
An unused op amp in a quad package (MCP6274)
should be configured as shown in Figure 4-6. These
circuits prevent the output from toggling and causing
crosstalk. In Circuit A, R1 and R2 produce a voltage
within its output voltage range (VOH, VOL). The op amp
buffers this voltage, which can be used elsewhere in
the circuit. Circuit B uses the minimum number of
components and operates as a comparator.
VIN+
VSS
Guard Ring
¼ MCP6274 (A)
¼ MCP6274 (B)
VDD
VDD
FIGURE 4-7:
for Inverting Gain.
1.
R1
VDD
VREF
R2
R2
V REF = V DD ⋅ -----------------R1 + R2
FIGURE 4-6:
4.7
Unused Op Amps.
Supply Bypass
With this family of operational amplifiers, the power
supply pin (VDD for single supply) should have a local
bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm
for good, high frequency performance. It also needs a
bulk capacitor (i.e., 1 µF or larger) within 100 mm to
provide large, slow currents. This bulk capacitor can be
shared with nearby analog parts.
4.8
2.
Example Guard Ring Layout
For Inverting Gain and Transimpedance
Amplifiers (convert current to voltage, such as
photo detectors):
a) Connect the guard ring to the non-inverting
input pin (VIN+). This biases the guard ring
to the same reference voltage as the op
amp (e.g., VDD/2 or ground).
b) Connect the inverting pin (VIN–) to the input
with a wire that does not touch the PCB
surface.
Non-inverting Gain and Unity Gain Buffer:
a) Connect the non-inverting pin (VIN+) to the
input with a wire that does not touch the
PCB surface.
b) Connect the guard ring to the inverting input
pin (VIN–). This biases the guard ring to the
common mode input voltage.
PCB Surface Leakage
In applications where low input bias current is critical,
Printed Circuit Board (PCB) surface leakage effects
need to be considered. Surface leakage is caused by
humidity, dust or other contamination on the board.
Under low humidity conditions, a typical resistance
between nearby traces is 1012Ω. A 5V difference would
cause 5 pA of current to flow. This is greater than the
MCP6271/1R/2/3/4/5 family’s bias current at 25°C
(1 pA, typical).
The easiest way to reduce surface leakage is to use a
guard ring around sensitive pins (or traces). The guard
ring is biased at the same voltage as the sensitive pin.
An example of this type of layout is illustrated in
Figure 4-7.
© 2008 Microchip Technology Inc.
DS21810F-page 15
MCP6271/1R/2/3/4/5
4.9
Application Circuits
4.9.1
4.9.2
ACTIVE FULL-WAVE RECTIFIER
The MCP6271/1R/2/3/4/5 family of amplifiers can be
used in applications such as an Active Full-Wave
Rectifier or an Absolute Value circuit, as shown in
Figure 4-8. The amplifier and feedback loops in this
active voltage rectifier circuit eliminate the diode drop
problem that exists in a passive voltage rectifier. This
circuit behaves as a follower (the output follows the
input) as long as the input signal is more positive than
the reference voltage. If the input signal is more
negative than the reference voltage, however, the
circuit behaves as an inverting amplifier. Therefore, the
output voltage will always be above the reference
voltage, regardless of the input signal.
LOSSY NON-INVERTING
INTEGRATOR
The non-inverting integrator shown in Figure 4-9 is
easy to build. It saves one op amp over the typical
Miller integrator plus inverting amplifier configuration.
The phase accuracy of this integrator depends on the
matching of the input and feedback resistor-capacitor
time constants. RF makes this a lossy integrator (it has
finite gain at DC), and makes this integrator stable by
itself.
R1
VIN
+
C1
MCP6271
_
VOUT
RF
R2
C2
R1
VIN
–
R3
Op Amp B
VOUT
+
1/2
MCP6272
R5
R4
VREF
RF ≈ R2
R2
R 1 C 1 = ( R 2 ||R F )C 2
V OUT
1 ------------- ≈ ------------------,
V IN
s ( R1 C1 )
1
f ≈ --------------------------------------------------2πR 1 C 1 ( 1 + R F ⁄ R 2 )
D1
D2
FIGURE 4-9:
R1 = R2 = R3
–
VREF
Non-Inverting Integrator.
Op Amp A
+
1/2
MCP6272
V D1
R 4 < R 3 ⎛ 1 – ---------------------------⎞
⎝
V REF – V SS⎠
R2 R4
R 5 = -----------2R 3
Input
Output
VREF
VREF
time
FIGURE 4-8:
time
Active Full-wave Rectifier.
The design equations give a gain of ±1 from VIN to
VOUT, and produce rail-to-rail outputs.
DS21810F-page 16
© 2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
4.9.3
CASCADED OP AMP
APPLICATIONS
R4
The MCP6275 provides the flexibility of Low power
mode for dual op amps in an 8-pin package. The
MCP6275 eliminates the added cost and space in a
battery powered application by using two single op
amps with Chip Select (CS) lines or a 10-pin device
with one CS line for both op amps. Since the two op
amps are internally cascaded, this device cannot be
used in circuits that require active or passive elements
between the two op amps. However, there are several
applications where this op amp configuration with a CS
line becomes suitable. The circuits below show
possible applications for this device.
4.9.3.1
R3
With the cascaded op amp configuration, op amp B can
be used to isolate the load from op amp A. In
applications where op amp A is driving capacitive or
low resistive loads in the feedback loop (such as an
integrator or filter circuit) the op amp may not have
sufficient source current to drive the load. In this case,
op amp B can be used as a buffer.
R1
VOUT
B
A
VIN
MCP6275
CS
FIGURE 4-11:
Configuration.
4.9.3.3
Load Isolation
R2
Cascaded Gain Circuit
Difference Amplifier
Figure 4-12 shows op amp A configured as a difference
amplifier with Chip Select. In this configuration, it is
recommended that well matched resistors (e.g., 0.1%)
be used to increase the Common Mode Rejection Ratio
(CMRR). Op amp B can be used to provide additional
gain and isolate the load from the difference amplifier.
R2
R1
R2
A
R4
R3
VIN2
VOUTB
B
B
A
MCP6275
Load
VIN1
VOUT
MCP6275
R1
CS
FIGURE 4-10:
Buffer.
4.9.3.2
Isolating the Load with a
Cascaded Gain
Figure 4-11 shows a cascaded gain circuit configuration with Chip Select. Op amps A and B are configured
in a non-inverting amplifier configuration. In this
configuration, it is important to note that the input offset
voltage of op amp A is amplified by the gain of op amp
A and B, as shown below:
V OUT = V IN G A G B + V OSA G A G B + V OSB G B
Where:
GA
=
op amp A gain
GB
=
op amp B gain
VOSA
=
op amp A input offset voltage
VOSB
=
op amp B input offset voltage
CS
FIGURE 4-12:
4.9.3.4
Inverting Integrator with Active
Compensation and Chip Select
Figure 4-13 uses an active compensator (op amp B) to
compensate for the non-ideal op amp characteristics
introduced at higher frequencies. This circuit uses
op amp B as a unity gain buffer to isolate the
integration capacitor C1 from op amp A and drives the
capacitor with a low impedance source. Since both op
amps are matched very well, they provide a high quality
integrator.
C1
R1
B
VIN
VOUT
A
MCP6275
Therefore, it is recommended that you set most of the
gain with op amp A and use op amp B with relatively
small gain (e.g., a unity gain buffer).
CS
FIGURE 4-13:
Compensation.
© 2008 Microchip Technology Inc.
Difference Amplifier Circuit.
Integrator Circuit with Active
DS21810F-page 17
MCP6271/1R/2/3/4/5
4.9.3.5
Second Order MFB with an Extra
Pole-Zero Pair
Figure 4-14 is a second order multiple feedback lowpass filter with Chip Select. Use the FilterLab® software
from Microchip Technology Inc. to determine the R and
C values for op amp A’s second order filter. Op amp B
can be used to add a pole-zero pair using C3, R6 and
R7.
C3
R6
R7
R1
R3
R2
C1
R5
A
VOUT
B
VIN
4.9.3.7
Capacitorless Second Order
Low-Pass filter with Chip Select
The low-pass filter shown in Figure 4-16 does not
require external capacitors and uses only three
external resistors; the op amp’s GBWP sets the corner
frequency. R1 and R2 are used to set the circuit gain. R3
is used to set the Q. To avoid gain peaking in the
frequency response, Q needs to be low (lower values
need to be selected for R3). Note that the amplifier
bandwidth varies greatly over temperature and
process. This configuration, however, provides a low
cost solution for applications with high bandwidth
requirements.
R1
R2
VIN
R3
VDD
A
MCP6275
B
MCP6275
CS
FIGURE 4-14:
Second Order Multiple
Feedback Low-Pass Filter with an Extra PoleZero Pair.
4.9.3.6
VOUT
VREF
R4
Second Order Sallen-Key with an
Extra Pole-Zero Pair
CS
FIGURE 4-16:
Capacitorless Second Order
Low-Pass Filter with Chip Select.
Figure 4-15 is a second order Sallen-Key low-pass
filter with Chip Select. Use the Filterlab® software from
Microchip to determine the R and C values for
op amp A’s second order filter. Op amp B can be used
to add a pole-zero pair using C3, R5 and R6.
R5
R2
C3
R6
R1
B
VIN R4
R3
VOUT
A
MCP6275
C2
C1
CS
FIGURE 4-15:
Second Order Sallen-Key
Low-Pass Filter with an Extra Pole-Zero Pair and
Chip Select.
DS21810F-page 18
© 2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
5.0
DESIGN TOOLS
Microchip provides the basic design tools needed for
the MCP6271/1R/2/3/4/5 family of op amps.
5.1
SPICE Macro Model
The latest SPICE macro model for the MCP6271/1R/2/
3/4/5 op amps is available on the Microchip web site at
www.microchip.com. This model is intended to be an
initial design tool that works well in the op amp’s linear
region of operation over the temperature range. See
the model file for information on its capabilities.
Bench testing is a very important part of any design and
cannot be replaced with simulations. Also, simulation
results using this macro model need to be validated by
comparing them to the data sheet specifications and
characteristic curves.
5.2
FilterLab® Software
Microchip’s FilterLab® software is an innovative
software tool that simplifies analog active filter (using
op amps) design. Available at no cost from the
Microchip web site at www.microchip.com/filterlab, the
FilterLab design tool provides full schematic diagrams
of the filter circuit with component values. It also
outputs the filter circuit in SPICE format, which can be
used with the macro model to simulate actual filter
performance.
5.3
Mindi™ Circuit Designer &
Simulator
Microchip’s Mindi™ Circuit Designer & Simulator aids
in the design of various circuits useful for active filter,
amplifier and power-management applications. It is a
free online circuit designer & simulator available from
the Microchip web site at www.microchip.com/mindi.
This interactive circuit designer & simulator enables
designers to quickly generate circuit diagrams,
simulate circuits. Circuits developed using the Mindi
Circuit Designer & Simulator can be downloaded to a
personal computer or workstation.
5.4
5.5
Analog Demonstration and
Evaluation Boards
Microchip offers a broad spectrum of Analog
Demonstration and Evaluation Boards that are
designed to help you achieve faster time to market. For
a complete listing of these boards and their
corresponding user’s guides and technical information,
visit the Microchip web site at www.microchip.com/
analogtools.
Two of our boards that are especially useful are:
• P/N SOIC8EV: 8-Pin SOIC/MSOP/TSSOP/DIP
Evaluation Board
• P/N SOIC14EV: 14-Pin SOIC/TSSOP/DIP Evaluation Board
5.6
Application Notes
The following Microchip Application Notes are available on the Microchip web site at www.microchip. com/
appnotes and are recommended as supplemental reference resources.
ADN003: “Select the Right Operational Amplifier for
your Filtering Circuits”, DS21821
AN722: “Operational Amplifier Topologies and DC
Specifications”, DS00722
AN723: “Operational Amplifier AC Specifications and
Applications”, DS00723
AN884: “Driving Capacitive Loads With Op Amps”,
DS00884
AN990: “Analog Sensor Conditioning Circuits – An
Overview”, DS00990
These application notes and others are listed in the
design guide:
“Signal Chain Design Guide”, DS21825
MAPS (Microchip Advanced Part
Selector)
MAPS is a software tool that helps semiconductor
professionals efficiently identify Microchip devices that
fit a particular design requirement. Available at no cost
from the Microchip web site at www.microchip.com/
maps, the MAPS is an overall selection tool for
Microchip’s product portfolio that includes Analog,
Memory, MCUs and DSCs. Using this tool you can
define a filter to sort features for a parametric search of
devices and export side-by-side technical comparison
reports. Helpful links are also provided for Data sheets,
Purchase, and Sampling of Microchip parts.
© 2008 Microchip Technology Inc.
DS21810F-page 19
MCP6271/1R/2/3/4/5
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Example:
5-Lead SOT-23 (MCP6271 and MCP6271R)
Device
XXNN
Code
MCP6271
CGNN
MCP6271R
ETNN
CG25
Note: Applies to 5-Lead SOT-23
Example:
6-Lead SOT-23 (MCP6273)
XXNN
CK25
8-Lead MSOP
Example:
XXXXXX
6271E
YWWNNN
644256
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
Example:
MCP6271
E/P256
0437
OR
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
NNN
e3
*
Note:
DS21810F-page 20
Example:
MCP6271
E/SN0437
256
Legend: XX...X
Y
YY
WW
NNN
MCP6271
e3
E/P^^256
0644
OR
MCP6271E
e3
SN^^0644
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
Package Marking Information (Continued)
14-Lead PDIP (300 mil) (MCP6274)
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
Example:
MCP6274-E/P
0437256
OR
MCP6274
e3
E/P^^
0644256
14-Lead SOIC (150 mil) (MCP6274)
Example:
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
MCP6274ESL
0437256
OR
MCP6274
e3
E/SL^^
0644256
14-Lead TSSOP (MCP6274)
XXXXXX
YYWW
NNN
© 2008 Microchip Technology Inc.
Example:
6274EST
0437
256
DS21810F-page 21
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DS21810F-page 23
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DS21810F-page 26
© 2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
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© 2008 Microchip Technology Inc.
DS21810F-page 27
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DS21810F-page 30
© 2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
APPENDIX A:
REVISION HISTORY
• Undocumented Changes
Revision F (March 2008)
Revision B (October 2003)
The following is the list of modifications:
1.
2.
3.
4.
Increased maximum operating VDD.
Updated Section 5.0 “Design Tools”
Various cleanups thoughout document.
Updated package outline drawings
Section 6.0 “Packaging Information”
Revision C (June 2004)
• Undocumented Changes
Revision A (June 2003)
in
• Original data sheet release.
Revision E (December 2006)
The following is the list of modifications:
1.
2.
3.
4.
Updated specifications (Section 1.0 “Electrical
Characteristics”):
a) Clarified Absolute Maximum Analog Input
Voltage and Current specifications.
b) Clarified VCMR, VOL, VOH, and PM
specifications.
c) Corrected the typical Eni.
Added plots on Common Mode Input Range
behavior vs. temperature and supply voltage
(Section 2.0 “Typical Performance Curves”).
Added applications writeup on unused op amps
and corrected description of floating CS pin
behavior (Section 4.0 “Application Information”).
Updated package information (Section 6.0
“Packaging Information”):
a) Corrected package markings.
b) Added disclaimer to package outline
drawings.
Revision D (December 2004)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
Added SOT-23-5 packages for the MCP6271
and MCP6271R single op amps.
Added SOT-23-6 packages for the MCP6273
single op amp.
Added Section 3.0 “Pin Descriptions”.
Corrected application circuits
(Section 4.9 “Application Circuits”).
Added SOT-23-5 and SOT-23-6 packages and
corrected
package
marking
information
(Section 6.0 “Packaging Information”).
Added Appendix A: Revision History.
© 2008 Microchip Technology Inc.
DS21810F-page 31
MCP6271/1R/2/3/4/5
NOTES:
DS21810F-page 32
© 2008 Microchip Technology Inc.
MCP6271/1R/2/3/4/5
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
–
X
/XX
Temperature
Range
Package
Device:
MCP6271:
MCP6271T:
MCP6271RT:
MCP6272:
MCP6272T:
MCP6273:
MCP6273T:
MCP6274:
MCP6274T:
MCP6275:
MCP6275T:
Single Op Amp
Single Op Amp
(Tape and Reel)
(SOIC, MSOP, SOT-23-5)
Single Op Amp
(Tape and Reel) (SOT-23-5)
Dual Op Amp
Dual Op Amp
(Tape and Reel) (SOIC, MSOP)
Single Op Amp with Chip Select
Single Op Amp with Chip Select
(Tape and Reel)
(SOIC, MSOP, SOT-23-6)
Quad Op Amp
Quad Op Amp
(Tape and Reel) (SOIC, TSSOP)
Dual Op Amp with Chip Select
Dual Op Amp with Chip Select
(Tape and Reel) (SOIC, MSOP)
Temperature Range:
E
= -40°C to +125°C
Package:
OT = Plastic Small Outline Transistor (SOT-23), 5-lead
(MCP6271, MCP6271R)
CH = Plastic Small Outline Transistor (SOT-23), 6-lead
(MCP6273)
MS = Plastic MSOP, 8-lead
P
= Plastic DIP (300 mil Body), 8-lead, 14-lead
SN = Plastic SOIC, (150 mil Body), 8-lead
SL = Plastic SOIC (150 mil Body), 14-lead
ST = Plastic TSSOP (4.4 mm Body), 14-lead
Examples:
a)
MCP6271-E/SN:
b)
MCP6271-E/MS:
c)
MCP6271-E/P:
d)
MCP6271T-E/OT:
a)
MCP6271RT-E/OT: Tape and Reel,
Extended Temperature,
5LD SOT-23 package.
a)
MCP6272-E/SN:
b)
MCP6272-E/MS:
c)
MCP6272-E/P:
d)
MCP6272T-E/SN:
a)
MCP6273-E/SN:
b)
c)
© 2008 Microchip Technology Inc.
d)
Extended Temperature,
8LD SOIC package.
Extended Temperature,
8LD MSOP package.
Extended Temperature,
8LD PDIP package.
Tape and Reel,
Extended Temperature,
5LD SOT-23 package.
Extended Temperature,
8LD SOIC package.
Extended Temperature,
8LD MSOP package.
Extended Temperature,
8LD PDIP package.
Tape and Reel,
Extended Temperature,
8LD SOIC package.
Extended Temperature,
8LD SOIC package.
MCP6273-E/MS:
Extended Temperature,
8LD MSOP package.
MCP6273-E/P:
Extended Temperature,
8LD PDIP package.
MCP6273T-E/CH: Extended Temperature,
6LD SOT-23 package.
a)
MCP6274-E/P:
b)
MCP6274T-E/SL:
c)
MCP6274-E/SL:
d)
MCP6274-E/ST:
a)
MCP6275-E/SN:
b)
MCP6275-E/MS:
c)
MCP6275-E/P:
d)
MCP6275T-E/SN:
Extended Temperature,
14LD PDIP package.
Tape and Reel,
Extended Temperature,
14LD SOIC package.
Extended Temperature,
14LD SOIC package.
Extended Temperature,
14LD TSSOP package.
Extended Temperature,
8LD SOIC package.
Extended Temperature,
8LD MSOP package.
Extended Temperature,
8LD PDIP package.
Tape and Reel,
Extended Temperature,
8LD SOIC package.
DS21810F-page 33
MCP6271/1R/2/3/4/5
NOTES:
DS21810F-page 34
© 2008 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, rfPIC and SmartShunt are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2008 Microchip Technology Inc.
DS21810F-page 35
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
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Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
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Tel: 91-80-4182-8400
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India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
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Taiwan - Kaohsiung
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China - Xiamen
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Taiwan - Taipei
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Thailand - Bangkok
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Fax: 66-2-694-1350
Italy - Milan
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Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
01/02/08
DS21810F-page 36
© 2008 Microchip Technology Inc.

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