GMT G570SA Dual-slot pcmcia/cardbus power controller Datasheet

G570
Global Mixed-mode Technology Inc.
Dual-Slot PCMCIA/CardBus Power Controller
Features
Description
„Fully Integrated VCC and Vpp Switching for Dual
The G570 PC Card power-interface switch provides an
integrated power-management solution for two PC
Cards. All of the discrete power MOSFETs, a logic
section, current limiting, and thermal protection for PC
Card control are combined on a single integrated circuit (IC). The circuit allows the distribution of 3.3V, 5V,
and/or 12V card power by means of the Serial interface. The current-limiting feature eliminates the need
for fuses, which reduces component count and improves reliability.
Slot PC CardTM Interface
„3-Lead Serial Interface Compatible With
CardBusTM Controllers
„3.3V Low Voltage Mode
„Meets PC Card Standards
„RESET for System Initialization of PC Cards
„12V Supply Can Be Disabled Except During
12V Flash Programming
„Short Circuit and Thermal Protection
„28 Pin and 30 Pin SSOP
„Compatible With 3.3V, 5V and 12V PC Cards
„Low RDS(on) (225-mΩ
Ω 5V VCC Switch;
200 mΩ
Ω 3.3V VCC Switch)
„Break-Before-Make Switching
„Internal power-On Reset
The G570 features a 3.3V low voltage mode that allows
for 3.3V switching without the need for 5V supply. This
facilitates low power system designs such as sleep
mode and pager mode where only 3.3V is available.
The G570 incorporates a reset function, selectable by
one of two inputs, to help alleviate system errors. The
reset function enables PC card initialization concurrent
with host platform initialization, allowing a system reset.
Reset is accomplished by grounding the VCC and VPP
(flash-memory programming voltage) outputs, which
discharges residual card voltage.
Application
„Notebook PC
„Electronic Dictionary
„Personal Digital Assistance
„Digital still Camera
End equipment for the G570 includes notebook computers, desktop computers, personal digital assistants
(PDAs), digital cameras and bar-code scanners.
Ordering Information
PART NUMBER
TEMP. RANGE
G570S4
-40°C to +85°C
PACKAGE
28 SSOP
G570SA
-40°C to +85°C
30 SSOP
Pin Information
G570
G570
5V
1
28
DATA
2
27
CLOCK
3
4
26
25
LATCH
RESET
12V
24
23
5
6
5V
5V
NC
NC
NC
12V
22
BVPP
AVCC
7
8
21
BVCC
AVCC
9
20
BVCC
AVCC
19
BVCC
GND
10
11
18
NC
NC
12
17
OC
RESET
3.3V
13
16
3.3V
3.3V
AVPP
14
15
5V
5V
1
30
5V
DATA
2
29
NC
28
NC
CLOCK
3
4
27
LATCH
5
NC
NC
RESET
6
26
25
12V
24
23
12V
AVPP
7
8
AVCC
9
22
BVCC
AVCC
10
11
21
BVCC
20
12
19
BVCC
NC
AVCC
GND
NC
BVPP
NC
13
18
RESET
14
17
OC
3.3V
3.3V
15
16
3.3V
28Pin SSOP
30Pin SSOP
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G570
Global Mixed-mode Technology Inc.
Absolute maximum ratings over operating
free-air temperature (unless otherwise noted)*
Output current (each card):
IO (xVCC)……………………..……...…..internally limited
IO(xVPP)...............................…........... internally limited
Operating virtual junction temperature range, TJ
……………………………………………….-40°C to 150°C
Operating free-air temperature range, TA
...…………………….……..……………….-40°C to 85°C
Storage temperature range, TSTG….…...-55°C to 150°C
Input voltage range for card power:
VI(3.3V).................................………………-0.3V to 7V
VI(5V)........................………..…...………..-0.3V to 7V
VI(12V) ...................………..…………….. -0.3V to 14V
Logic input voltage...................................…-0.3V to 7V
*Stresses beyond those listed under "absolute maximum ratings”may cause permanent damage to the device. These are stress rating
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions”is not implied. Exposure to absolute–maximum-rated conditions for extended periods may affect device reliability.
Recommended Operating Conditions
Input voltage range, VI
Output current
Min
Max
VI (5V)
0
5.25
V
VI (3.3V)
VI (12V)
IO (xVCC) at 25°C
IO (xVPP) at 25°C
0
0
5.25
13.5
1
150
V
V
A
mA
0
-40
2.5
125
MHz
°C
Clock frequency
Operating virtual junction temperature, TJ
Unit
Typical PC Card Power-Distribution Application
G570
Power Supply
12V
12V
5V
3.3V
AVPP
VPP1
VPP2
5V
AVCC
VCC
3.3V
AVCC
VCC
PC Card A
AVCC
RESET
Supervisor
RESET
BVPP
3
VPP2
Serial Interface
PCMCIA
Controller
OC
VPP1
BVCC
VCC
BVCC
VCC
PC Card B
BVCC
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G570
Global Mixed-mode Technology Inc.
Terminal Functions
28 Pin
TERMINAL
NAME
NO.
I/O
DESCRIPTION
3.3V
5V
14,15,16
1,27,28
I
I
3.3V VCC input for card power
5V VCC input for card power and/or chip power
12V
AVCC
AVPP
BVCC
6,23
8,9,10
7
19,20,21
I
O
O
O
12V VPP input for card power
Switched output that delivers 0V,3.3V,5V or high impedance to card
Switched output that delivers 0V,3.3V,5V,12V or high impedance to card
Switched output that delivers 0V, 3.3V, 5V or high impedance
BVPP
CLOCK
DATA
GND
22
3
2
11
O
I
I
Switch output that delivers 0V, 3.3V, 5V, 12V or high impedance
Logic-level clock for serial data word
Logic-level serial data word
Ground
LATCH
NC
4
12,18,24,25,26
I
Logic level latch for serial data word
No internal connection
OC
17
O
RESET
5
RESET
13
I
I
Logic-level overcurrent. OC reports output that goes low when an overcurrent condition
exists
Logic-level RESET input active high. Do not connect if terminal 13 is used.
Logic-level RESET input active low. Do not connect if terminal 5 is used.
30 Pin
TERMINAL
NAME
NO.
I/O
DESCRIPTION
3.3V
5V
12V
15,16,17
1,2,30
7,24
I
I
I
3.3V VCC input for card power
5V VCC input for card power and/or chip power
12V VPP input for card power
AVCC
AVPP
BVCC
BVPP
9,10,11
8
20,21,22
23
O
O
O
O
Switched output that delivers 0V,3.3V,5V or high impedance to card
Switched output that delivers 0V,3.3V,5V,12V or high impedance to card
Switched output that delivers 0V, 3.3V, 5V or high impedance
Switch output that delivers 0V, 3.3V, 5V, 12V or high impedance
4
3
12
5
I
I
Logic level clock for serial data word
Logic level serial data word
Ground
Logic level latch for serial data word
CLOCK
DATA
GND
LATCH
I
NC
13,19,25,26,
27,28,29
OC
18
O
RESET
6
I
exists
Logic-level RESET input active high. Do not connect if terminal 14 is used.
RESET
14
I
Logic-level RESET input active low. Do not connect if terminal 6 is used.
No internal connection
Logic-level overcurrent. OC reports output that goes low when an overcurrent condition
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G570
Global Mixed-mode Technology Inc.
Electrical Characteristics (TA = 25°C, VI(5V) = 5V; unless otherwise noted)
DC Characteristics
PARAMETER
TEST CONDITIONS
MIN
TYP
5V to x VCC
Switch resistance*
3.3V to x VCC
3.3V to x VCC
5V to x VPP
3.3V to x VPP
VI(5V) = 5V, VI(3.3V) =3.3V
VI(5V) = 0V, VI(3.3V) =3.3V
MAX UNIT
170
225
140
150
200
200
6
6
12V to x VPP
VO(xVPP) Clamp low voltage
VO(xVCC) Clamp low voltage
IIKG Leakage current
II
Input current
IOS Short-circuit
Output current Limit
1
1
10
115
150
131
150
µA
2.2
400
A
mA
V
V
µA
2
Output powered up into a short to
GND
IO(xVCC)
IO(xVPP)
Ω
6
0.8
0.8
10
IPP at 10mA
ICC at 10mA
IPP high impedance State TA = 25°C
ICC high-impedance State TA = 25°C
VI(5V) = 5V
VO(AVCC) = VO(BVCC) = 5V
VO(AVPP) = VO(BVPP) = 12V
VO(AVCC) = VO(BVCC) = 3.3V
VI(5V) = 0V
VI(3.3V) = 3.3V
VO(AVPP) = VO(BVPP) = 0V
Shutdown mode
VO(BVCC) = VO(AVCC)
=VO(AVPP) = VO(BVPP) = Hi-Z
mΩ
0.8
120
*Pulse-testing techniques are used to maintain junction temperature close to ambient temperatures; thermal effects must be taken into account
separately.
Logic Section
PARAMETER
TEST CONDITION
MIN
Logic input current
Logic input high level
MAX
UNIT
1
µA
0.8
V
2
V
Logic input low level
VI(5V) = 5V, IO = 1mA
VI(5V)-0.4
Logic output high level
VI(5V) = 0V, IO = 1mA
VI(3.3V)= 3.3V
VI(3.3V)-0.4
Logic output low level
IO = 1mA
V
0.4
V
Switching Characteristics *, **
PARAMETER
tr
Output rise time
tf
Output fall time
TEST CONDITION
LATCH↑to VO(xVPP)
tpd
Propagation delay (see
Figure 1)
MIN
VO (xVCC)
VO (xVPP)
VO (xVCC)
VO (xVPP)
LATCH↑to VO(xVCC) (3.3V), VI(5V) = 5V
LATCH↑to VO(xVCC) (5V)
LATCH↑to VO(xVCC) (3.3V), VI(5V) = 0V
TYP
MAX
UNIT
2
10
16
45
ms
ton
toff
ton
toff
7
30
5
16
ms
ms
ms
ms
ton
toff
ton
toff
3.2
25
6
21
ms
ms
ms
ms
* Refer to Parameter Measurement Information
**Switching Characteristics are with CL = 147µF
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Global Mixed-mode Technology Inc.
Parameter Measurement Information
VPP
VCC
CL
CL
LOAD CIRCUIT
LOAD CIRCUIT
VDD
VDD
50%
50%
LATCH
LATCH
GND
GND
toff
toff
ton
VO(xVPP)
ton
VI(12V)
VI(5V)
VO(xVCC)
90%
10%
90%
10%
GND
VOLTAGE WAVEFORMS
GND
VOLTAGE WAVEFORMS
Figure 1. Test Circuits and Voltage Waveforms
Table of Timing Diagrams
DATA
D8
D7
D6
D5
D4
D3
D2
D1
D0
LATCH
CLOCK
Note:Data is clocked in on the positive leading edge of the clock. The latch should occur before the next
positive leading edge of the clock. For definition of D0 to D8, see the control logic table.
Figure 2. Serial-Interface Timing
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G570
Switching Characteristics
Switching Characteristics
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Global Mixed-mode Technology Inc.
G570
Switching Characteristics
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Global Mixed-mode Technology Inc.
Application Information
G570
resistance of the switch and thus produce no additional voltage losses. Second, when an overcurrent
condition is detected, the G570 asserts a signal at
OC that can be monitored by the microprocessor to
initiate diagnostics and/or send the user a warning
message. In the event that an overcurrent condition
persists, causing the IC to exceed its maximum
junction temperature, thermal-protection circuitry
activates, shutting down all power outputs until the
device cools to within a safe operating region.
Overview
PC Cards were initially introduced as a means to add
EEPROM (flash memory) to portable computers with
limited on-board memory. The idea of add-in cards
quickly took hold; modems, wireless LANs, Global
Positioning Satellite (GPS), multimedia, and hard-disk
versions were soon available. As the number of PC
Card applications grew, the engineering community
quickly recognized the need for a standard to ensure
compatibility across platforms. To this end, the
PCMCIA was established, comprised of members
from leading computer, software, PC Card, and
semiconductor manufactures. One key goal was to
realize the “plug-and play” concept. Cards and hosts
from different vendors should be compatible—able to
communicate with one another transparently.
12V Supply Not Required
Most PC Card switches use the externally supplied
12V VPP power for switch-gate drive and other chip
functions, which requires that power be present at all
times. The G570 offers considerable power savings by
using an internal charge pump to generate the required higher voltages from 5V or 3.3V input; therefore,
the external 12V supply can be disable except when
needed for flash-memory functions, thereby extending
battery lifetime. Do not ground the 12V input if the 12V
input is not used. Additional power savings are realized by the G570 during a software shutdown in which
quiescent current drops to a typical of 2µA.
PC Card Power Specification
System compatibility also means power compatibility.
The most current set of specifications (PC Card Standard) set forth by the PCMCIA committee states that
power is to be transferred between the host and the
card through eight of the 68 terminals of the PC Card
connector. This power interface consists of two VCC,
two VPP, and four ground terminals. Multiple VCC and
ground terminals minimize connector-terminal and line
resistance. The two VPP terminals were originally
specified as separate signals but are commonly tied
together in the host to form a single node to minimize
voltage losses. Card primary power is supplied
through the VCC terminals; flash-memory programming
and erase voltage is supplied through the VPP terminals.
3.3V Low Voltage Mode
The G570 operates in 3.3V low voltage mode when
3.3V is the only available input voltage (VI(5V)=0).This
allows host and PC Cards to be operated in low power
3.3V only modes such as sleep modes or pager
modes. Note that in this operation mode, the G570
derives its bias current from the 3.3V input pin and
only 3.3V can be delivered to the Card. The 3.3V
switch resistance increases, but the added switch resistance should not be critical, because only a small
amount of current is delivered in this mode.
Overcurrent and Over-Temperature Protection
PC Cards are inherently subject to damage that can
result from mishandling. Host systems require protection against short-circuited cards that could lead to
power supply or PCB-trace damage. Even systems
robust enough to withstand a short circuit would still
undergo rapid battery discharge into the damaged PC
Card, resulting in the rather sudden and unacceptable
loss of system power. Most hosts include fuses for
protection. However, the reliability of fused systems is
poor, as blown fuses require troubleshooting and repair, usually by the manufacturer.
Voltage Transitioning Requirement
PC Cards, like portables, are migrating from 5V to
3.3V to minimize power consumption, optimize board
space, and increase logic speeds. The G570 is designed to meet all combinations of power delivery as
currently defined in the PCMCIA standard. The latest
protocol accommodates mixed 3.3V/5V systems by
first powering the card with 5V, then polling it to determine its 3.3V compatibility. The PCMCIA specification requires that the capacitors on 3.3V compatible
cards be discharged to below 0.8 V before applying
3.3V power. This ensures that sensitive 3.3V circuitry
is not subjected to any residual 5V charge and functions as a power reset. The G570 offer a selectable
VCC and VPP ground state, in accordance with PCMCIA
3.3V/5V switching specifications, to fully discharge the
card capacitors while switching between VCC voltage.
The G570 takes a two-pronged approach to overcurrent protection. First, instead of fuses, sense FETs
monitor each of the power outputs. Excessive current
generates an error signal that linearly limits the output
current, preventing host damage or failure. Sense
FETs, unlike sense resistors or polyfuses, have an
added advantage in that they do not add to the series
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Output Ground Switches
Several PCMCIA power distribution switches on the
market do not have an active grounding FET switch.
These devices do not meet the PC Card specification
requiring a discharge of VCC within 100ms. PC Card
resistance can not be relied on to provide a discharge
path for voltages stored on PC Card capacitance because of possible high impedance isolation by power
management schemes. A method commonly shown to
alleviate this problem is to add to the switch output an
external 100kΩ resistor in parallel with the PC Card.
Considering that this is the only discharge path to
ground, a timing analysis show that the RC time constant delays the required discharge time to more than
2 seconds. The only way to ensure timing compatibility
with PC Card standards is to use a power-distribution
switch that has an internal ground switch, like that of
the G570, or add an external ground FET to each of
the output lines with the control logic necessary to select it.
G570
RESET or RESET Inputs
To ensure that cards are in a known state after power
brownouts or system initialization, the PC Cards
should be reset at the same time as the host by applying a low impedance to the VCC and VPP terminals.
A low impedance output state allows discharging of
residual voltage remaining on PC Card filter capacitance, permitting the system (host and PC Cards) to
be powered up concurrently. The RESET or RESET
input closes internal switches S1, S4, S7, and S10
with all other switches left open (see G570 control
logic table). The G570 remains in the low impedance
output state until the signal is deasserted and further
data is clocked in and latched. RESET or RESET is
provided for direct compatibility with systems that use
either an active-low or active-high reset voltage supervisor. The unused pin is internally pulled up or down
and should be left unconnected.
Overcurrent and Thermal Protection
The G570 uses sense FETs to check for overcurrent
conditions in each of the VCC and VPP outputs. Unlike
sense resistors or polyfuses, these FETs do not add to
the series resistance of the switch; therefore, voltage
and power losses are reduced. Overcurrent sensing is
applied to each output separately. When an overcurrent condition is detected, only the power output affected is limited; all other power outputs continue to
function normally. The OC indicator, normally a logic
high, is a logic low when any overcurrent condition is
detected, providing for initiation of system diagnostics
and/or sending a warning message to the user.
In summary, the G570 is a complete single-chip
dual-slot PC Card power interface. It meets all currently defined PCMCIA specifications for power delivery in 5V, 3.3V, and mixed systems, and offers a serial
control interface. The G570 offers functionality, power
savings, overcurrent and thermal protection, and fault
reporting in one 30 pin SSOP surface-mount package
for maximum value added to new portable designs.
Power Supply Considerations
The G570 has multiple pins for each of its 3.3V, 5V,
and 12V power inputs and for switched VCC outputs.
Any individual pin can conduct the rated input or output current. Unless all pins are connected in parallel,
the series resistance is significantly higher than that
specified, resulting in increased voltage drops and lost
power. Both 12V inputs must be connected for proper
VPP switching; it is recommended that all input and
output power pins be paralleled for optimum operation.
During power up, the G570 controls the rise time of
the VCC and VPP outputs and limits the current into a
faulty card or connector. If a short circuit is applied
after power is established (e.g., hot insertion of a bad
card), current is initially limited only by the impedance
between the short and the power supply. In extreme
cases, as much as 10A to 15A may flow into the short
before the current limiting of the G570 engages. If the
VCC or VPP outputs are driven below ground, the G570
may latch nondestructively in an off state. Cycling
power will reestablish normal operation.
Although the G570 is fairly immune to power input
fluctuations and noise, it is generally considered good
design practice to bypass power supplies typically with
a 1µF electrolytic or tantalum capacitor paralleled by a
0.047µF to 0.1µF ceramic capacitor. It is strongly recommended that the switched VCC and VPP outputs be
bypassed with a 0.1µF or larger capacitor; doing so
improves the immunity of the G570 to electrostatic
discharge (ESD). Care should be taken to minimize
the inductance of PCB traces between the G570 and
the load. High switching currents can produce large
negative-voltage transients, which forward biases
substrate diodes, resulting in unpredictable performance. Similarly, no pin should be taken below –0.3V.
Overcurrent limiting for the VCC outputs is designed to
activate, if powered up, into a short in the range of
0.8A to 2.2A. The VPP outputs limit from 120mA to
400mA. The protection circuitry acts by linearly limiting
the current passing through the switch rather than initiating a full shutdown of the supply. Shutdown occurs
only during thermal limiting.
Thermal limiting prevents destruction of the IC from
overheating if the package power-dissipation ratings are
exceeded. Thermal limiting disables all power outputs
(both A and B slots) until the device has cooled.
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Global Mixed-mode Technology Inc.
Logic Input and Outputs
The serial interface consists of DATA, CLOCK, and
LATCH leads. The data is clocked in on the positive
leading edge of the clock (see Figure 2). The 9-bit (D0
through D8) serial data word is loaded during the positive
edge of the latch signal. The latch signal should occur
before the next positive leading edge of the block.
escent current to 2µA to conserve battery power.
The G570 serial interface is designed to be compatible
with serial-interface PCMCIA controllers and current
PCMCIA and Japan Electronic Industry Development
Association (JEIDA) standards.
An overcurrent output ( OC ) is provided to indicate an
overcurrent condition in any of the VCC or VPP outputs as
previously discussed.
The shutdown bit of the data word places all VCC and VPP
outputs in a high-impedance state and reduces chip qui-
G570
Card A
S7
VPP1
S8
VPP2
S9
S1
S2
3.3V
VCC
S3
cs
3.3V
3.3V
VCC
See Note A
cs
Card B
S4
cs
VCC
S5
5V
VCC
S6
S10
5V
S11
5V
S12
cs
VPP1
VPP2
12V
See Note A
12V
Internal
Current Monitor
Supervisor
RESET
RESET
Controller
DATA
CLOCK
LATCH
CPU
} Serial
Interface
Thermal
GND
OC
NOTE:MOSFET switches S9 and S12 have a back-gate diode from the source to the drain.
Unused switch inputs should never be grounded.
Figure 3 Internal Switching Matrix
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Global Mixed-mode Technology Inc.
G570 control logic
AVPP
CONTROL SIGNALS
INTERNAL SWITCH SETTING
OUTPUT
D8 SHDN
D0 A_VPP_PGM
D1 A_VPP_VCC
S7
S8
S9
VAVPP
1
1
0
0
0
1
CLOSED
OPEN
OPEN
CLOSED
OPEN
OPEN
0V
VCC*
1
1
0
1
1
×
0
1
×
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
CLOSED
OPEN
OPEN
VPP(12 V)
Hi-Z
Hi-Z
BVPP
CONTROL SIGNALS
INTERNAL SWITCH SETTING
OUTPUT
D8 SHDN
D4 B_VPP_PGM
D5 B_VPP_VCC
S10
S11
S12
VBVPP
1
1
1
0
0
1
0
1
0
CLOSED
OPEN
OPEN
OPEN
CLOSED
OPEN
OPEN
OPEN
CLOSED
0V
VCC**
VPP(12V)
1
0
1
×
1
×
OPEN
OPEN
OPEN
OPEN
OPEN
OPEN
Hi-Z
Hi-Z
AVCC
CONTROL SIGNALS
INTERNAL SWITCH SETTING
S2
S3
OUTPUT
D8 SHDN
D3 A _ BCC3
D2 A _ VCC5
S1
VAVCC
1
0
0
CLOSED
OPEN
OPEN
0V
1
1
1
0
0
1
1
×
1
0
1
×
OPEN
OPEN
CLOSED
OPEN
CLOSED
OPEN
OPEN
OPEN
OPEN
CLOSED
OPEN
OPEN
3.3V
5V
0V
Hi-Z
BVCC
CONTROL SIGNALS
INTERNAL SWITCH SETTING
OUTPUT
D8 SHDN
D6 B _ VCC3
D7 B _ VCC5
S4
S5
S6
VBVCC
1
1
1
0
0
1
0
1
0
CLOSED
OPEN
OPEN
OPEN
CLOSED
OPEN
OPEN
OPEN
CLOSED
0V
3.3V
5V
1
0
1
×
1
×
CLOSED
OPEN
OPEN
OPEN
OPEN
OPEN
0V
Hi-Z
*Output depends on AVCC
**Output depends on BVCC
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11
G570
Global Mixed-mode Technology Inc.
puts can be exposed to potentially higher discharges
from the external environment through the PC Card
connector. Bypassing the outputs with 0.1µF capacitors protects the devices from discharges up to 10 kV.
ESD Protection
All
G570
inputs
and
outputs
incorporate
ESD-protection circuitry designed to withstand a 2kV
human-body-model
discharge
as
defined
in
MIL-STD-883C, Method 3015. The VCC and VPP out-
AVCC
AVCC
12V
12V
0.1µF
VCC
AVCC
VPP1
PC Card
Connector A
VPP2
1µF
BVCC
12V
(Ceramic)
VCC
0.1µF
BVCC
VCC
BVCC
0.1µF
5V
5V
0.1µF
1µF
G570
0.1µF
0.1µF
BVPP
3.3V
PC Card
Connector B
BVPP
5V
(Ceramic)
AVPP
AVPP
5V
VCC
VPP1
VPP2
3.3V
0.1µF
(Ceramic)
1µF
3.3V
DATA
CLOCK
3.3V
DATA
CLOCK
LATCH
LATCH
System Voltage
Supervisor
or
PCI Bus Reset
RESET
RESET
OC
PCMCIA
Controller
To CPU
GND
CS
Shutdown Signal
From CPU
Figure 4. Detailed Interconnections and Capacitor Recommendations
Ver 1.0
Nov 09, 2000
TEL: 886-3-5788833
http://www.gmt.com.tw
12
G570
Global Mixed-mode Technology Inc.
G570 28Pin Package
C
L
E1 E
h x 45°
θ
D
A2
A
A1
0.004 C
SEATING PLANE
b
e
SYMBOL
MIN.
DIMENSION IN MM
NOM.
A
MAX.
MIN.
DIMENSION IN INCH
NOM.
2.0
MAX.
0.079
A1
0.05
A2
1.65
1.75
1.85
0.065
0.069
0.073
b
0.22
0.30
0.33
0.009
0.012
0.013
c
0.09
0.15
0.21
0.004
0.006
0.008
e
0.002
0.65 BASIC
0.026 BASIC
D
9.90
10.20
10.50
0.390
0.402
E
7.40
7.80
8.20
0.291
0.307
0.323
E1
5.00
5.30
5.60
0.197
0.209
0.220
L
θ
0.55
0.75
0.95
0.022
0.030
0.038
0
4
8
0
4
8
JEDEC
0.413
MO-150 (AH)
Ver 1.0
Nov 09, 2000
TEL: 886-3-5788833
http://www.gmt.com.tw
13
G570
Global Mixed-mode Technology Inc.
G570 30Pin Package
c
D
L1
E1
L
E
1.15
3.6
θ
A1
e
b
A
A2
Note:
1. Dimensional tolerance ±0.10mm
2. Plating thickness 5~15µm
3. Dimensions “D” does not include burrs, however dimension including protrusions or gate burrs
Shall be MAX. 0.20mm
4. Dimension “E1” does not include inter-lead flash or protrusion. Inter-lead flash or protrusion small not exceeds
0.25 per side.
SYMBOL
A
A1
A2
b
C
D
E
E1
L1
L
e
θ
MIN.
1.80
0.05
1.75
0.25
0.10
10.10
7.50
5.20
0.53
1.10
1°
DIMENSION IN MM
NOM.
1.90
0.10
1.80
0.30
0.15
10.15
----5.25
0.68
1.20
0.65 BSC
4°
MAX.
MIN.
2.00
0.15
1.85
0.35
0.20
10.20
7.90
5.30
0.83
1.30
0.071
0.002
0.069
0.010
0.004
0.398
0.295
0.205
0.021
0.043
7°
1º
Ver 1.0
Nov 09, 2000
DIMENSION IN INCH
NOM.
0.075
0.004
0.071
0.012
0.006
0.400
----0.207
0.027
0.047
0.026BSC
4°
MAX.
0.079
.006
0.073
0.014
0.008
.402
0.311
0.209
0.033
0.051
7º
TEL: 886-3-5788833
http://www.gmt.com.tw
14
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