HLMP-Cxxx T-13/4 (5 mm) Extra Bright Precision Optical Performance InGaN LED Lamps Data Sheet HLMP-CB11, HLMP-CB12, HLMP-CM11, HLMP-CM12, HLMP-CE11, HLMP-CE12, HLMP-CB26, HLMP-CB27, HLMP-CM26, HLMP-CM27, HLMP-CE26, HLMP-CE27, HLMP-CB36, HLMP-CB37, HLMP-CM36, HLMP-CM37, HLMP-CE36, HLMP-CE37 Description Features These high intensity blue, green, and cyan LEDs are based on the most efficient and cost effective InGaN material technology. The 470 nm typical dominant wavelength for blue and 525 nm typical wavelength for green is well suited to color mixing in full color signs. The 505 nm typical dominant wavelength for cyan is suitable for traffic signal application. • • • • • • These LED lamps are untinted, non-diffused, T-13/4 packages incorporating second generation optics which produce well-defined spatial radiation patterns at specific viewing cone angles. These lamps are made with an advanced optical grade epoxy, offering superior temperature and moisture resistance in outdoor signal and sign applications. The high maximum LED junction temperature limit of +110°C enables high temperature operation in bright sunlight conditions. Well defined spatial radiation pattern High luminous output Available in blue, green, and cyan color Viewing angle: 15°, 23° and 30° Standoff or non-standoff leads Superior resistance to moisture Applications • Traffic signals • Commercial outdoor advertising • Front panel backlighting • Front panel indicator CAUTION: Devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions Package A 2.35 (0.093) MAX. 1.14 ± 0.20 (0.045 ± 0.008) ∅ 5.80 ± 0.20 (0.228 ± 0.008) 0.70 (0.028) MAX. 4.90 ± 0.20 (0.193 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) CATHODE LEAD 8.61 ± 0.20 (0.339 ± 0.008) CATHODE FLAT 31.60 MIN. (1.244) Package B ∅ 5.80 ± 0.20 (0.228 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 1.50 ± 0.15 (0.059 ± 0.006) 0.70 (0.028) MAX. 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 4.90 ± 0.20 NOTE 1 (0.192 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) CATHODE LEAD 8.61 ± 0.20 (0.339 ± 0.008) 1.00 MIN. (0.039) DIMENSION H 31.60 MIN. (1.244) DIMENSION H: 15° = 10.80 ± 0.25 mm (0.425 ± 0.01 INCH) 23° = 10.00 ± 0.25 mm (0.394 ± 0.01 INCH) 30° = 11.27 ± 0.25 mm (0.444 ± 0.01 INCH) NOTES: 1. MEASURED JUST ABOVE FLANGE. 2. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 3. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. 4. IF HEAT SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE. CATHODE FLAT Device Selection Guide Part Number HLMP-CB11-TW0xx HLMP-CB11-UVBxx HLMP-CB12-TW0xx HLMP-CM11-Y20xx HLMP-CM11-Z1Cxx HLMP-CM12-Y20xx HLMP-CE11-X10xx HLMP-CE12-X10xx HLMP-CB26-SV0xx HLMP-CB26-TUDxx HLMP-CB27-SV0xx HLMP-CM26-X10xx HLMP-CM26-YZCxx HLMP-CM27-X10xx HLMP-CE26-WZ0xx HLMP-CE27-WZ0xx HLMP-CB36-QT0xx HLMP-CB36-RSBxx HLMP-CB37-RU0xx HLMP-CB37-RSDxx HLMP-CM36-X10xx HLMP-CM36-XYCxx HLMP-CM37-X10xx HLMP-CM37-XYCxx HLMP-CM37-XYDxx HLMP-CE36-WZ0xx HLMP-CE37-WZ0xx Color Blue Blue Blue Green Green Green Cyan Cyan Blue Blue Blue Green Green Green Cyan Cyan Blue Blue Blue Blue Green Green Green Green Green Cyan Cyan Typical Viewing Angle, 2q1/2 (Degree) 15 15 15 15 15 15 15 15 23 23 23 23 23 23 23 23 30 30 30 30 30 30 30 30 30 30 30 Intensity (cd) at 20 mA Min. 2.5 3.2 2.5 9.3 12.0 9.3 7.2 7.2 1.9 2.5 1.9 7.2 9.3 7.2 5.5 5.5 1.15 1.5 1.5 1.5 7.2 7.2 7.2 7.2 7.2 5.5 5.5 Max. 7.2 5.5 7.2 27.0 21.0 27.0 21.0 21.0 5.5 4.2 5.5 21.0 16.0 21.0 16.0 16.0 3.2 2.5 4.2 2.5 21.0 12.0 21.0 12.0 12.0 16.0 16.0 Standoff No No Yes No No Yes No Yes No No Yes No No Yes No Yes No No Yes Yes No No Yes Yes Yes No Yes Package Dimension A A B A A B A B A A B A A B A B A A B B A A B B B A B Lens Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Notes: 1. Tolerance for luminous intensity measurement is ±15%. 2. The luminous intensity is measured on the mechanical axis of the lamp package. 3. The optical axis is closely aligned with the package mechanical axis. 4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper safety equipment. 5. 2q1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity. Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk DD: Ammo Pack Color Bin Options 0: Full Color Bin Distribution B: Color Bin 2 and 3 C: Color Bin 3 and 4 D: Color Bin 4 and 5 Maximum Intensity Bin 0: No Maximum Intensity Bin Limitation Others: Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Viewing Intensity Bin 11: 15° Without Standoff 12: 15° With Standoff 26: 23° Without Standoff 27: 23° With Standoff 36: 30° Without standoff 37: 30° With Standoff Color B: Blue 470 nm M: Green 525 nm E: Cyan 505 nm Package C: T-13/4 (5 mm) Round Lamp Absolute Maximum Rating at TA = 25°C Parameters DC Forward Current [1] Peak Pulsed Forward Current[2] Power Dissipation LED Junction Temperature Operating Temperature Range Storage Temperature Range Value 30 100 116 130 –40 to +85 –40 to +100 Unit mA mA mW °C °C °C Notes: 1. Derate linearly as shown in Figure 2. 2. Duty factor 10%, frequency 1 KHz. Electrical/Optical Characteristics TA = 25oC Parameters Forward Voltage Reverse Voltage[1] Thermal Resistance Symbol VF VR RqJ-PIN Blue Min. Typ. Max. 3.2 3.85 5.0 240 Dominant Wavelength[2] Peak Wavelength ld 460 lPEAK 464 516 501 Spectral Half Width Dl1/2 23 32 30 Luminous Efficacy[3] hv 74 484 319 470 480 Green Min. Typ. Max. 3.3 3.85 5.0 240 Cyan Min. Typ. Max. 3.2 3.85 5.0 240 Units V V oC/W 520 490 505 508 nm nm 525 540 Test Condition IF = 20 mA IR = 10 µA LED Junction to Anode Lead IF = 20 mA Peak of Wavelength of Spectral Distribution at IF = 20 mA nm Wavelength Width at Spectral Distribution Power Point at IF = 20 mA lm/W Emitted Luminous Power/Emitted Radiant Power Notes: 1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA. 2. The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp. 3. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. CYAN RELATIVE INTENSITY 0.8 GREEN BLUE 0.6 0.4 0.2 0 380 430 480 530 580 630 680 IF MAX. – MAXIMUM FORWARD CURRENT – mA 1.0 35 30 25 RθJ-A = 780 °C/W 20 15 10 5 0 0 10 WAVELENGTH – nm RELATIVE DOMINANT WAVELENGTH FORWARD CURRENT – mA 50 60 70 80 90 1.035 30 25 20 15 10 5 0 1.0 2.0 3.0 1.4 1.2 1.0 0.8 0.6 0.4 0.2 5 10 15 20 1.020 GREEN 1.015 1.010 1.005 BLUE 1.000 0.995 0 5 10 15 20 25 30 Figure 4. Relative dominant wavelength vs. DC forward current 1.6 0 CYAN 1.025 DC FORWARD CURRENT – mA Figure 3. Forward current vs. forward voltage 0 1.030 0.990 4.0 FORWARD VOLTAGE – V RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 40 Figure 2. Forward current vs. ambient temperature 35 25 DC FORWARD CURRENT – mA Figure 5. Relative intensity vs. DC forward current 30 TA – AMBIENT TEMPERATURE – °C Figure 1. Relative intensity vs. wavelength 0 20 30 NORMALIZED INTENSITY 1 0.5 0 -90 -60 -30 0 30 60 90 60 90 60 90 ANGULAR DISPLACEMENT – DEGREES Figure 6. Spatial radiation pattern for Cx11 and Cx12 NORMALIZED INTENSITY 1 0.5 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT – DEGREES Figure 7. Spatial radiation pattern for Cx26 and Cx27 NORMALIZED INTENSITY 1 0.5 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT – DEGREES Figure 8. Spatial radiation pattern for Cx36 and Cx37 Intensity Bin Limit Table Bin N P Q R S T U V W X Y Z 1 Intensity (mcd) at 20 mA Min Max 680 880 880 1150 1150 1500 1500 1900 1900 2500 2500 3200 3200 4200 4200 5500 5500 7200 7200 9300 9300 12000 12000 16000 16000 21000 Tolerance for each bin limit is ±15%. Blue Color Bin Table Bin 1 Min Dom 460.0 Max Dom 464.0 2 464.0 468.0 3 468.0 472.0 4 472.0 476.0 5 476.0 480.0 Xmin 0.1440 0.1818 0.1374 0.1766 0.1291 0.1699 0.1187 0.1616 0.1063 0.1517 Ymin 0.0297 0.0904 0.0374 0.0966 0.0495 0.1062 0.0671 0.1209 0.0945 0.1423 Xmax 0.1766 0.1374 0.1699 0.1291 0.1616 0.1187 0.1517 0.1063 0.1397 0.0913 Ymax 0.0966 0.0374 0.1062 0.0495 0.1209 0.0671 0.1423 0.0945 0.1728 0.1327 Xmin 0.0743 0.1650 0.1060 0.1856 0.1387 0.2068 0.1702 0.2273 0.2003 0.2469 Ymin 0.8338 0.6586 0.8292 0.6556 0.8148 0.6463 0.7965 0.6344 0.7764 0.6213 Xmax 0.1856 0.1060 0.2068 0.1387 0.2273 0.1702 0.2469 0.2003 0.2659 0.2296 Ymax 0.6556 0.8292 0.6463 0.8148 0.6344 0.7965 0.6213 0.7764 0.6070 0.7543 Xmin 0.0454 0.1318 0.0345 0.1164 0.0082 0.1057 0.0039 0.1027 0.0132 0.1092 0.0040 0.1028 Ymin 0.2945 0.306 0.4127 0.3889 0.5384 0.4769 0.6548 0.5584 0.4882 0.4417 0.6104 0.5273 Xmax 0.1164 0.0235 0.1057 0.0082 0.1027 0.0039 0.1097 0.0139 0.1028 0.0040 0.1056 0.0080 Ymax 0.3889 0.4127 0.4769 0.5384 0.5584 0.6548 0.6251 0.7502 0.5273 0.6104 0.6007 0.7153 Tolerance for each bin limit is ±0.5 nm. Green Color Bin Table Bin 1 Min Dom 520.0 Max Dom 524.0 2 524.0 528.0 3 528.0 532.0 4 532.0 536.0 5 536.0 540.0 Tolerance for each bin limit is ±0.5 nm. Cyan Color Bin Table Bin 1 Min Dom 490.0 Max Dom 495.0 2 495.0 500.0 3 500.0 505.0 4 505.0 510.0 7 498.0 503.0 8 503.0 508.0 Tolerance for each bin limit is ±0.5 nm. Avago Technologies LED Configuration Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced into the LED package. Otherwise, cut the leads to applicable length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress, due to lead cutting, from traveling to the LED chip die attach and wirebond. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. ANODE InGaN Device Note: Electrical connection between bottom surface of LED die and the lead frame material through conductive paste of solder. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED closer than 1.59 mm might damage the LED. 1.59 mm • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, PCB must be allowed to cool down to room temperature prior to handling, which includes removal of jigs, fixtures or pallet. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended soldering conditions: Wave Soldering Pre-heat Temperature 105 °C Max. Pre-heat Time 30 sec Max. Peak Temperature 250 °C Max. Dwell Time 3 sec Max. Manual Solder Dipping – – 260 °C Max. 5 sec Max. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to daily check on the soldering profile to ensure the soldering profile is always conforming to recommended soldering condition. Notes: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if samewave soldering setting is used. So, it is recommended to recalibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LEDs use a high efficiency LED die with single wire bond, as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. • Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) • Over sizing of plated through hole can lead to twisting or improper LED placement during auto insertion. Under sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching. Note: Refer to application note AN1027 for more information on soldering LED components. Recommended Wave Soldering Profile TEMPERATURE – °C LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C ± 5°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA LEAD-FREE SOLDER: 96.5% Sn; 3% Ag; 0.5% Cu 150 FLUXING 100 50 30 PREHEAT 0 10 20 30 40 50 60 70 80 90 100 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. TIME – SECONDS Ammo Packs Drawing 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) CATHODE 20.50 ± 1.00 (0.807 ± 0.039) 9.125 ± 0.625 (0.3593 ± 0.0246) 18.00 ± 0.50 (0.7087 ± 0.0197) A 12.70 ± 0.30 (0.50 ± 0.0118) 0.70 ± 0.20 (0.0276 ± 0.0079) A ∅ 4.00 ± 0.20 TYP. (0.1575 ± 0.008) VIEW A–A ALL DIMENSIONS IN MILLIMETERS (INCHES). NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF. 10 Packaging Box for Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A + O AG ES AV LOGI DE NO HO – CH AT DE O AN TE C ANODE LEAD LEAVES THE BOX FIRST. C ER TH MO L BE LA NOTE: FOR InGaN DEVICE, THE AMMO PACK PACKAGING BOX CONTAINS ESD LOGO. DISCLAIMER AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4115EN AV02-0367EN March 6, 2008