AVAGO HLMP-CM26-X1000 T-13/4 (5 mm) extra bright precision optical performance ingan led lamp Datasheet

HLMP-Cxxx
T-13/4 (5 mm) Extra Bright Precision Optical
Performance InGaN LED Lamps
Data Sheet
HLMP-CB11, HLMP-CB12, HLMP-CM11,
HLMP-CM12, HLMP-CE11, HLMP-CE12,
HLMP-CB26, HLMP-CB27, HLMP-CM26,
HLMP-CM27, HLMP-CE26, HLMP-CE27,
HLMP-CB36, HLMP-CB37, HLMP-CM36,
HLMP-CM37, HLMP-CE36, HLMP-CE37
Description
Features
These high intensity blue, green, and cyan LEDs are
based on the most efficient and cost effective InGaN
material technology. The 470 nm typical dominant
wavelength for blue and 525 nm typical wavelength for
green is well suited to color mixing in full color signs.
The 505 nm typical dominant wavelength for cyan is
suitable for traffic signal application.
•
•
•
•
•
•
These LED lamps are untinted, non-diffused, T-13/4
packages incorporating second generation optics which
produce well-defined spatial radiation patterns at specific
viewing cone angles.
These lamps are made with an advanced optical grade
epoxy, offering superior temperature and moisture
resistance in outdoor signal and sign applications. The
high maximum LED junction temperature limit of +110°C
enables high temperature operation in bright sunlight
conditions.
Well defined spatial radiation pattern
High luminous output
Available in blue, green, and cyan color
Viewing angle: 15°, 23° and 30°
Standoff or non-standoff leads
Superior resistance to moisture
Applications
• Traffic signals
• Commercial outdoor advertising
• Front panel backlighting
• Front panel indicator
CAUTION: Devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling and
processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
Package A
2.35 (0.093)
MAX.
1.14 ± 0.20
(0.045 ± 0.008)
∅ 5.80 ± 0.20
(0.228 ± 0.008)
0.70 (0.028)
MAX.
4.90 ± 0.20
(0.193 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
CATHODE
LEAD
8.61 ± 0.20
(0.339 ± 0.008)
CATHODE
FLAT
31.60 MIN.
(1.244)
Package B
∅ 5.80 ± 0.20
(0.228 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
1.50 ± 0.15
(0.059 ± 0.006)
0.70 (0.028)
MAX.
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
4.90 ± 0.20
NOTE 1
(0.192 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
CATHODE
LEAD
8.61 ± 0.20
(0.339 ± 0.008)
1.00 MIN.
(0.039)
DIMENSION H
31.60 MIN.
(1.244)
DIMENSION H:
15° = 10.80 ± 0.25 mm (0.425 ± 0.01 INCH)
23° = 10.00 ± 0.25 mm (0.394 ± 0.01 INCH)
30° = 11.27 ± 0.25 mm (0.444 ± 0.01 INCH)
NOTES:
1. MEASURED JUST ABOVE FLANGE.
2. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
3. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS.
4. IF HEAT SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE.
CATHODE
FLAT
Device Selection Guide
Part Number
HLMP-CB11-TW0xx
HLMP-CB11-UVBxx
HLMP-CB12-TW0xx
HLMP-CM11-Y20xx
HLMP-CM11-Z1Cxx
HLMP-CM12-Y20xx
HLMP-CE11-X10xx
HLMP-CE12-X10xx
HLMP-CB26-SV0xx
HLMP-CB26-TUDxx
HLMP-CB27-SV0xx
HLMP-CM26-X10xx
HLMP-CM26-YZCxx
HLMP-CM27-X10xx
HLMP-CE26-WZ0xx
HLMP-CE27-WZ0xx
HLMP-CB36-QT0xx
HLMP-CB36-RSBxx
HLMP-CB37-RU0xx
HLMP-CB37-RSDxx
HLMP-CM36-X10xx
HLMP-CM36-XYCxx
HLMP-CM37-X10xx
HLMP-CM37-XYCxx
HLMP-CM37-XYDxx
HLMP-CE36-WZ0xx
HLMP-CE37-WZ0xx
Color
Blue
Blue
Blue
Green
Green
Green
Cyan
Cyan
Blue
Blue
Blue
Green
Green
Green
Cyan
Cyan
Blue
Blue
Blue
Blue
Green
Green
Green
Green
Green
Cyan
Cyan
Typical
Viewing Angle,
2q1/2 (Degree)
15
15
15
15
15
15
15
15
23
23
23
23
23
23
23
23
30
30
30
30
30
30
30
30
30
30
30
Intensity (cd) at 20 mA
Min.
2.5
3.2
2.5
9.3
12.0
9.3
7.2
7.2
1.9
2.5
1.9
7.2
9.3
7.2
5.5
5.5
1.15
1.5
1.5
1.5
7.2
7.2
7.2
7.2
7.2
5.5
5.5
Max.
7.2
5.5
7.2
27.0
21.0
27.0
21.0
21.0
5.5
4.2
5.5
21.0
16.0
21.0
16.0
16.0
3.2
2.5
4.2
2.5
21.0
12.0
21.0
12.0
12.0
16.0
16.0
Standoff
No
No
Yes
No
No
Yes
No
Yes
No
No
Yes
No
No
Yes
No
Yes
No
No
Yes
Yes
No
No
Yes
Yes
Yes
No
Yes
Package
Dimension
A
A
B
A
A
B
A
B
A
A
B
A
A
B
A
B
A
A
B
B
A
A
B
B
B
A
B
Lens
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Clear
Notes:
1. Tolerance for luminous intensity measurement is ±15%.
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper safety
equipment.
5. 2q1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity.
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk
DD: Ammo Pack
Color Bin Options
0: Full Color Bin Distribution
B: Color Bin 2 and 3
C: Color Bin 3 and 4
D: Color Bin 4 and 5
Maximum Intensity Bin
0: No Maximum Intensity Bin Limitation
Others: Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Intensity Bin
11: 15° Without Standoff
12: 15° With Standoff
26: 23° Without Standoff
27: 23° With Standoff
36: 30° Without standoff
37: 30° With Standoff
Color
B: Blue 470 nm
M: Green 525 nm
E: Cyan 505 nm
Package
C: T-13/4 (5 mm) Round Lamp
Absolute Maximum Rating at TA = 25°C
Parameters
DC Forward Current [1]
Peak Pulsed Forward Current[2]
Power Dissipation
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Value
30
100
116
130
–40 to +85
–40 to +100
Unit
mA
mA
mW
°C
°C
°C
Notes:
1. Derate linearly as shown in Figure 2.
2. Duty factor 10%, frequency 1 KHz.
Electrical/Optical Characteristics
TA = 25oC
Parameters
Forward Voltage
Reverse Voltage[1]
Thermal Resistance
Symbol
VF
VR
RqJ-PIN
Blue
Min. Typ. Max.
3.2 3.85
5.0
240
Dominant
Wavelength[2]
Peak Wavelength
ld
460
lPEAK
464
516
501
Spectral Half Width
Dl1/2
23
32
30
Luminous Efficacy[3]
hv
74
484
319
470 480
Green
Min. Typ. Max.
3.3 3.85
5.0
240
Cyan
Min. Typ. Max.
3.2 3.85
5.0
240
Units
V
V
oC/W
520
490 505 508
nm
nm
525 540
Test Condition
IF = 20 mA
IR = 10 µA
LED Junction to
Anode Lead
IF = 20 mA
Peak of Wavelength
of Spectral Distribution at IF = 20 mA
nm
Wavelength Width
at Spectral Distribution Power Point
at IF = 20 mA
lm/W Emitted Luminous
Power/Emitted
Radiant Power
Notes:
1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA.
2. The dominant wavelength, ld, is derived from the Chromaticity Diagram and represents the color of the lamp.
3. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt.
CYAN
RELATIVE INTENSITY
0.8
GREEN
BLUE
0.6
0.4
0.2
0
380
430
480
530
580
630
680
IF MAX. – MAXIMUM FORWARD CURRENT – mA
1.0
35
30
25
RθJ-A = 780 °C/W
20
15
10
5
0
0
10
WAVELENGTH – nm
RELATIVE DOMINANT WAVELENGTH
FORWARD CURRENT – mA
50
60
70
80
90
1.035
30
25
20
15
10
5
0
1.0
2.0
3.0
1.4
1.2
1.0
0.8
0.6
0.4
0.2
5
10
15
20
1.020
GREEN
1.015
1.010
1.005
BLUE
1.000
0.995
0
5
10
15
20
25
30
Figure 4. Relative dominant wavelength vs. DC forward current
1.6
0
CYAN
1.025
DC FORWARD CURRENT – mA
Figure 3. Forward current vs. forward voltage
0
1.030
0.990
4.0
FORWARD VOLTAGE – V
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
40
Figure 2. Forward current vs. ambient temperature
35
25
DC FORWARD CURRENT – mA
Figure 5. Relative intensity vs. DC forward current
30
TA – AMBIENT TEMPERATURE – °C
Figure 1. Relative intensity vs. wavelength
0
20
30
NORMALIZED INTENSITY
1
0.5
0
-90
-60
-30
0
30
60
90
60
90
60
90
ANGULAR DISPLACEMENT – DEGREES
Figure 6. Spatial radiation pattern for Cx11 and Cx12
NORMALIZED INTENSITY
1
0.5
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT – DEGREES
Figure 7. Spatial radiation pattern for Cx26 and Cx27
NORMALIZED INTENSITY
1
0.5
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT – DEGREES
Figure 8. Spatial radiation pattern for Cx36 and Cx37
Intensity Bin Limit Table
Bin
N
P
Q
R
S
T
U
V
W
X
Y
Z
1
Intensity (mcd) at 20 mA
Min
Max
680
880
880
1150
1150
1500
1500
1900
1900
2500
2500
3200
3200
4200
4200
5500
5500
7200
7200
9300
9300
12000
12000
16000
16000
21000
Tolerance for each bin limit is ±15%.
Blue Color Bin Table
Bin
1
Min Dom
460.0
Max Dom
464.0
2
464.0
468.0
3
468.0
472.0
4
472.0
476.0
5
476.0
480.0
Xmin
0.1440
0.1818
0.1374
0.1766
0.1291
0.1699
0.1187
0.1616
0.1063
0.1517
Ymin
0.0297
0.0904
0.0374
0.0966
0.0495
0.1062
0.0671
0.1209
0.0945
0.1423
Xmax
0.1766
0.1374
0.1699
0.1291
0.1616
0.1187
0.1517
0.1063
0.1397
0.0913
Ymax
0.0966
0.0374
0.1062
0.0495
0.1209
0.0671
0.1423
0.0945
0.1728
0.1327
Xmin
0.0743
0.1650
0.1060
0.1856
0.1387
0.2068
0.1702
0.2273
0.2003
0.2469
Ymin
0.8338
0.6586
0.8292
0.6556
0.8148
0.6463
0.7965
0.6344
0.7764
0.6213
Xmax
0.1856
0.1060
0.2068
0.1387
0.2273
0.1702
0.2469
0.2003
0.2659
0.2296
Ymax
0.6556
0.8292
0.6463
0.8148
0.6344
0.7965
0.6213
0.7764
0.6070
0.7543
Xmin
0.0454
0.1318
0.0345
0.1164
0.0082
0.1057
0.0039
0.1027
0.0132
0.1092
0.0040
0.1028
Ymin
0.2945
0.306
0.4127
0.3889
0.5384
0.4769
0.6548
0.5584
0.4882
0.4417
0.6104
0.5273
Xmax
0.1164
0.0235
0.1057
0.0082
0.1027
0.0039
0.1097
0.0139
0.1028
0.0040
0.1056
0.0080
Ymax
0.3889
0.4127
0.4769
0.5384
0.5584
0.6548
0.6251
0.7502
0.5273
0.6104
0.6007
0.7153
Tolerance for each bin limit is ±0.5 nm.
Green Color Bin Table
Bin
1
Min Dom
520.0
Max Dom
524.0
2
524.0
528.0
3
528.0
532.0
4
532.0
536.0
5
536.0
540.0
Tolerance for each bin limit is ±0.5 nm.
Cyan Color Bin Table
Bin
1
Min Dom
490.0
Max Dom
495.0
2
495.0
500.0
3
500.0
505.0
4
505.0
510.0
7
498.0
503.0
8
503.0
508.0
Tolerance for each bin limit is ±0.5 nm.
Avago Technologies LED Configuration
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress induced into the LED package. Otherwise, cut the leads
to applicable length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress, due to lead cutting, from traveling
to the LED chip die attach and wirebond.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
ANODE
InGaN Device
Note: Electrical connection between bottom surface of LED die and the lead frame material
through conductive paste of solder.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59 mm. Soldering the LED closer than 1.59 mm might
damage the LED.
1.59 mm
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• At elevated temperature, the LED is more susceptible
to mechanical stress. Therefore, PCB must be allowed
to cool down to room temperature prior to handling,
which includes removal of jigs, fixtures or pallet.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended soldering conditions:
Wave Soldering
Pre-heat Temperature 105 °C Max.
Pre-heat Time
30 sec Max.
Peak Temperature
250 °C Max.
Dwell Time
3 sec Max.
Manual Solder
Dipping
–
–
260 °C Max.
5 sec Max.
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to daily
check on the soldering profile to ensure the soldering
profile is always conforming to recommended
soldering condition.
Notes:
1. PCB with different size and design (component density) will have different heat
mass (heat capacity). This might cause a change in temperature experienced by the
board if samewave soldering setting is used. So, it is recommended to recalibrate
the soldering profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LEDs use a high efficiency LED die with single
wire bond, as shown below. Customer is advised to take extra precaution during
wave soldering to ensure that the maximum wave temperature does not exceed 250°C.
Over-stressing the LED during soldering process might cause premature failure to the
LED due to delamination.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
• Over sizing of plated through hole can lead to
twisting or improper LED placement during auto
insertion. Under sizing plated through hole can lead to
mechanical stress on the epoxy lens during clinching.
Note: Refer to application note AN1027 for more information on soldering LED
components.
Recommended Wave Soldering Profile
TEMPERATURE – °C
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
200
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C ± 5°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5% Sn; 3% Ag; 0.5% Cu
150
FLUXING
100
50
30
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
TIME – SECONDS
Ammo Packs Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
20.50 ± 1.00
(0.807 ± 0.039)
9.125 ± 0.625
(0.3593 ± 0.0246)
18.00 ± 0.50
(0.7087 ± 0.0197)
A
12.70 ± 0.30
(0.50 ± 0.0118)
0.70 ± 0.20
(0.0276 ± 0.0079)
A
∅
4.00 ± 0.20 TYP.
(0.1575 ± 0.008)
VIEW A–A
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
10
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
A
+
O
AG ES
AV LOGI
DE
NO
HO –
CH
AT
DE
O
AN
TE
C
ANODE LEAD LEAVES
THE BOX FIRST.
C
ER
TH
MO
L
BE
LA
NOTE:
FOR InGaN DEVICE, THE AMMO PACK PACKAGING BOX CONTAINS ESD LOGO.
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT
OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY
RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS
DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4115EN
AV02-0367EN March 6, 2008
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