Renesas HD74LS273 Octal d-type positive-edge-triggered flip-flops (with clear) Datasheet

HD74LS273
Octal D-type Positive-edge-triggered Flip-Flops (with Clear)
REJ03D0473–0300
Rev.3.00
Jul.15.2005
The HD74LS273, positive-edge-triggered flip-flops utilize LS TTL circuitry to implement D-type flip-flop logic with a
direct clear input.
Information at the D inputs meeting the setup time requirements is transferred to the Q outputs on the positive-going
edge of the clock pulse.
When the clock input is at either the high or low level, the D input signal has no effect at the output.
Features
• Ordering Information
Part Name
Package Type
Package Code
(Previous Code)
Package
Abbreviation
Taping Abbreviation
(Quantity)
HD74LS273P
DILP-20 pin
PRDP0020AC-B
(DP-20NEV)
P
—
HD74LS273FPEL
SOP-20 pin (JEITA)
PRSP0020DD-B
(FP-20DAV)
FP
EL (2,000 pcs/reel)
PRSP0020DC-A
RP
(FP-20DBV)
Note: Please consult the sales office for the above package availability.
HD74LS273RPEL
SOP-20 pin (JEDEC)
EL (1,000 pcs/reel)
Pin Arrangement
Clear
1
1Q
2
1D
3
Clear
D CK
2D
4
D
2Q
5
Q
3Q
6
Q
3D
7
Clear
D CK
4D
8
D
4Q
9
Q
GND
10
Q
CK
Clear
CK
Clear
20
VCC
Q
Clear
CK D
19
8Q
18
8D
CK D
Clear
Q
17
7D
16
7Q
Q
Clear
CK D
15
6Q
14
6D
CK D
Clear
Q
13
5D
12
5Q
11
Clock
(Top view)
Rev.3.00, Jul.15.2005, page 1 of 6
HD74LS273
Function Table
Inputs
Clock
X
↑
↑
L
Clear
L
H
H
H
Output
Q
L
H
L
Q0
D
X
H
L
X
Notes: H; high level, L; low level, X; irrelevant
↑; transition from low to high level
Q0; level of Q before the indicated steady-state input conditions were established.
Block Diagram
1D
2D
3D
4D
5D
6D
7D
8D
Clock (1)
D Q
CK
Clear
D Q
CK
Clear
D Q
CK
Clear
D Q
CK
Clear
D Q
CK
Clear
D Q
CK
Clear
D Q
CK
Clear
D Q
CK
Clear
Clear (2)
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
Absolute Maximum Ratings
Item
Symbol
Ratings
Unit
Supply voltage
VCC
7
V
Input voltage
VIN
7
V
PT
400
mW
Tstg
–65 to +150
°C
Power dissipation
Storage temperature
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.
Recommended Operating Conditions
Item
Supply voltage
Output current
Symbol
Min
Typ
Max
Unit
VCC
4.75
5.00
5.25
V
IOH
—
—
–400
µA
mA
IOL
—
—
8
Operating temperature
Topr
–20
25
75
°C
Clock frequency
ƒclock
0
—
30
MHz
tw (clock)
20
—
—
ns
Clock pulse width
Clear pulse width
tw (clear)
20
—
—
ns
Data setup time
tsu (data)
20↑
—
—
ns
Clear (inactive-state) setup time
tsu (clear)
25↑
—
—
ns
Data hold time
th (data)
5↑
—
—
ns
Rev.3.00, Jul.15.2005, page 2 of 6
HD74LS273
Electrical Characteristics
(Ta = –20 to +75 °C)
Item
Input voltage
Symbol
VIH
VIL
min.
2.0
—
typ.*
—
—
max.
—
0.8
Unit
V
V
VOH
2.7
—
—
V
—
—
—
—
—
–20
—
—
—
—
0.5
0.4
20
–0.4
0.1
–100
27
–1.5
Output voltage
VOL
IIH
IIL
Input current
V
µA
mA
mA
mA
mA
V
Condition
VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V,
IOH = –400 µA
IOL = 8 mA VCC = 4.75 V, VIH = 2 V,
IOL = 4 mA VIL = 0.8 V
VCC = 5.25 V, VI = 2.7 V
VCC = 5.25 V, VI = 0.4 V
VCC = 5.25 V, VI = 7 V
VCC = 5.25 V
VCC = 5.25 V
VCC = 4.75 V, IIN = –18 mA
II
Short-circuit output current
IOS
—
Supply current
ICC**
17
Input clamp voltage
VIK
—
Notes: * VCC = 5 V, Ta = 25°C
** With all outputs open and 4.5 V applied to all data and clear inputs, ICC is measured after a momentary
ground, then 4.5 V is applied to clock.
Switching Characteristics
(VCC = 5 V, Ta = 25°C)
Item
Maximum clock frequency
Propagation delay time
Symbol
ƒmax
tPHL
tPLH
tPHL
Inputs
Clock
Clear
min.
30
—
—
—
Clock
typ.
40
18
17
18
max.
—
27
27
27
Testing Method
Test Circuit
VCC
Input 4.5V
P.G.
Zout = 50Ω
Output
Input
P.G.
Zout = 50Ω
D
1. CL includes probe and jig capacitance.
2. All diodes are 1S2074(H).
Rev.3.00, Jul.15.2005, page 3 of 6
Q
Clock
Clear
Notes:
RL
CL
Unit
MHz
ns
Condition
CL = 15 pF, RL = 2 kΩ
HD74LS273
Waveforms 1
tTLH
Data
tTHL
90%
1.3 V
3V
90%
1.3 V
1.3 V
10%
10%
tsu
0V
tsu
th
tTLH
th
tTHL
3V
90% 90%
1.3 V
1.3 V
10%
Clock
1.3 V
10%
tw
0V
tw
tPHL
tPLH
VOH
Q
1.3 V
1.3 V
VOL
Notes: Input pulse; tTLH ≤ 15 ns, tTHL ≤ 6 ns,
Clock input; PRR = 1 MHz, duty cycle 50%
Data input; PRR = 500 kHz, duty cycle 50%
Waveforms 2
tTLH
tTHL
Clear
90%
1.3V
3V
90%
1.3V
10%
10%
tw
0V
tw
Clock
tTHL
tTLH
90%
1.3V
90%
1.3V
10%
10%
3V
0V
tPHL
tw
Q
1.3V
tPLH
VOH
1.3V
VOL
Note:
Input pulse: tTLH ≤ 15 ns, tTHL ≤ 6 ns, PRR = 1 MHz.
Rev.3.00, Jul.15.2005, page 4 of 6
HD74LS273
Package Dimensions
JEITA Package Code
P-DIP20-6.3x24.5-2.54
RENESAS Code
PRDP0020AC-B
Previous Code
DP-20NEV
MASS[Typ.]
1.26g
D
11
E
20
1
10
b3
0.89
Z
Dimension in Millimeters
Min
Nom
Max
A
Reference
Symbol
A1
e
D
24.50
E
6.30
L
θ
c
e1
A1
0.51
b
p
0.40
b
3
JEITA Package Code
P-SOP20-5.5x12.6-1.27
RENESAS Code
PRSP0020DD-B
*1
Previous Code
FP-20DAV
0.48
0.56
c
0.19
θ
0°
e
2.29
0.25
0.31
2.54
2.79
15°
1.27
L
2.54
MASS[Typ.]
0.31g
D
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
F
20
7.00
1.30
Z
( Ni/Pd/Au plating )
25.40
5.08
A
bp
e
7.62
1
11
c
HE
*2
E
bp
Index mark
Reference
Symbol
Terminal cross section
( Ni/Pd/Au plating )
Z
e
*3
bp
Nom
Max
D
12.60
13.0
E
5.50
A2
10
1
A1
x
Dimension in Millimeters
Min
M
0.00
0.10
0.20
0.34
0.40
0.46
0.15
0.20
0.25
7.80
8.00
2.20
A
L1
bp
b1
c
A
c
1
θ
0°
HE
A1
θ
y
L
Detail F
e
8°
1.27
x
0.12
y
0.15
0.80
Z
0.50
L
L
Rev.3.00, Jul.15.2005, page 5 of 6
7.50
1
0.70
1.15
0.90
HD74LS273
JEITA Package Code
P-SOP20-7.5x12.8-1.27
RENESAS Code
PRSP0020DC-A
*1
Previous Code
FP-20DBV
MASS[Typ.]
0.52g
D
F
20
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
@ DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
@ INCLUDE TRIM OFFSET.
11
HE
c
*2
E
bp
Index mark
Reference
Symbol
Terminal cross section
( Ni/Pd/Au plating )
Dimension in Millimeters
Min
Nom
Max
D
12.80
13.2
E
7.50
A2
10
1
Z
e
*3
bp
x
A1
M
0.10
0.20
0.30
0.34
0.40
0.46
0.20
0.25
0.30
10.40
10.65
A
L1
2.65
bp
b1
c
A
c
A1
θ
L
y
1
θ
0°
HE
10.00
8°
1.27
e
x
0.12
y
0.15
0.935
Z
Detail F
L
L
Rev.3.00, Jul.15.2005, page 6 of 6
0.40
1
0.70
1.45
1.27
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
Renesas Technology Malaysia Sdn. Bhd.
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0
Similar pages