TI1 MSP-STK430B320 Mixed signal microcontroller Datasheet

MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
D
D
D
D
D
D
D
D
D
D
Low Supply Voltage Range, 2.7 V – 5.5 V
Low Operation Current, 3 mA at 1 MHz,
3V
Ultralow Power Consumption (Standby
Mode Down to 0.1 mA)
Five Power-Saving Modes
Wakeup From Standby Mode in 6 ms
16-Bit RISC Architecture, 300 ns Instruction
Cycle Time
Single Common 32 kHz Crystal, Internal
System Clock up to 3.3 MHz
Integrated LCD Driver for up to 84
Segments
D
D
D
D
Integrated 12+2 Bit A/D Converter
Family Members Include:
– MSP430P325, 16KB OTP, 512 Byte RAM
EPROM Version Available for Prototyping:
PMS430E325
Serial Onboard Programming
Programmable Code Protection by Security
Fuse
Avaliable in 64 Pin Quad Flatpack (QFP),
68 Pin Plastic J-Leaded Chip Carrier
(PLCC), 68 Pin J-Leaded Ceramic Chip
Carrier (JLCC) Package (EPROM Version)
description
The Texas Instruments MSP430 is an ultralow-power mixed-signal microcontroller family consisting of several
devices which feature different sets of modules targeted to various applications. The microcontroller is designed
to be battery operated for an extended application lifetime. With 16-bit RISC architecture, 16-bit integrated
registers on the CPU, and a constant generator, the MSP430 achieves maximum code efficiency. The digitallycontrolled oscillator, together with the frequency-locked-loop (FLL), provides a wakeup from a low-power mode
to active mode in less than 6 ms.
DVSS
AVSS
A1
A0
XBUF
RST/NMI
TCK
TMS
TDI/VPP
TDO/TDI
COM3
COM2
COM1
PG Package
(TOP VIEW)
64 63 6261 60 59 58 57 56 55 54 5352
AVCC
DVCC
SVCC
Rext
A2
A3
A4
A5
Xin
Xout/TCLK
CIN
TP0.0
TP0.1
TP0.2
TP0.3
TP0.4
TP0.5
P0.0
P0.1/RXD
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
COM0
S20/O20/CMPI
S19/O19
S18/O18
S17/O17
S16/O16
S15/O15
S14/O14
S13/O13
S12/O12
S11/O11
S10/O10
S9/O9
S8/O8
S7/O7
S6/O6
S5/O5
S4/O4
S3/O3
P0.2/TXD
P0.3
P0.4
P0.5
P0.6
P0.7
R33
R23
R13
R03
S0
S1
S2/O2
20 2122 23 2425 26 272829 30 31 32
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
description (continued)
Typical applications include sensor systems that capture analog signals, convert them to digital values, and then
process the data and display them or transmit them to a host system. The MSP430x32x offers an integrated
12+2 bit A/D converter with six multiplexed inputs.
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
PLASTIC
64-PIN QFP
(PG)
PLASTIC
64-PIN QFP
(PM)
PLASTIC
68-PIN PLCC
(FN)
CERAMIC
68-PIN JLCC
(FZ)
– 40°C to 85°C
MSP430P325IPG
MSP430P325IPM
MSP430P325IFN
—
25°C
—
—
—
PMS430E325FZ
functional block diagram
XIN Xout/TCLK
Oscillator
FLL
System Clock
RST/NMI
XBUF
ACLK
MCLK
8/16 kB ROM
16 kB OTP
256/512 B
Power-on-
RAM
Reset
8 b Timer/
Counter
P0.7
I/O Port
TXD
Serial Protocol
’C’: ROM
’P’: OTP
TDI/VPP
P0.0
Support
8 I/O’s, All With
Interr. Cap.
3 Int. Vectors
RXD
TDO/TDI
MAB, 16 Bit
CPU
Test
Incl. 16 Reg.
JTAG
MAB, 4 Bit
MCB
MDB, 16 Bit
MDB, 8 Bit
Bus
Conv
TMS
TCK
ADC
12 + 2 Bit
6 Channels
Current S.
Watchdog
Timer
Applications:
Timer/Port
15/16 Bit
A/D Conv.
Timer, O/P
Basic
Timer1
f LCD
LCD
84 Segments
1, 2, 3, 4 MUX
CMPI
6
6
A0–5
SVCC
Rext
2
POST OFFICE BOX 655303
TP0.0–5
CIN
• DALLAS, TEXAS 75265
R33
R23
R13
R03
Com0–3
S0–19/O2–19
S20/O20CMPI
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
Terminal Functions
TERMINAL
NAME
NO.
I/O
AVCC
AVSS
63
A0
61
I
Analog-to-digital converter input port 0 or digital input port 0
A1
62
I
Analog-to-digital converter input port 1 or digital input port 1
A2–A5
5–8
I
Analog-to-digital converter inputs ports 2–5 or digital inputs ports 2–5
11
I
Input used as enable of counter TPCNT1 – Timer/Port
51–54
O
Common outputs, used for LCD backplanes – LCD
CIN
COM0–3
1
DESCRIPTION
Positive analog supply voltage
Analog ground reference
DVCC
2
Positive digital supply voltage
DVSS
64
P0.0
18
I/O
General-purpose digital I/O
P0.1/RXD
19
I/O
General-purpose digital I/O, receive digital input port, 8-Bit Timer/Counter
P0.2/TXD
20
I/O
General-purpose digital I/O, transmit data output port, 8-Bit Timer/Counter
P0.3–P0.7
21–25
I/O
Five general-purpose digital I/Os, bit 3 to bit 7
Rext
4
I
Programming resistor input of internal current source
RST/NMI
59
I
Reset input or non-maskable interrupt input
R03
29
I
Input of fourth positive analog LCD level (V4) – LCD
R13
28
I
Input of third positive analog LCD level (V3) – LCD
R23
27
I
Input of second positive analog LCD level (V2) – LCD
R33
26
O
Output of first positive analog LCD level (V1) – LCD
SVCC
S0
3
30
O
Segment line S0 – LCD
S1
31
O
Segment line S1 – LCD
S2–S5/O2–O5
32–35
O
Segment lines S2 to S5 or digital output ports O2–O5, group 1 – LCD
S20/O20/CMPI
50
I/O
Segment line S20 can be used as comparator input port CMPI – Timer/Port
S6–S9/O6–O9
36–39
O
Segment lines S6 to S9 or digital output ports O6–O9, group 2 – LCD
S10–S13/O10–O13
40–43
O
Segment lines S10 to S13 or digital output ports O10–O13, group 3 – LCD
S14–S17/O14–O17
44–47
O
Segment lines S14 to S17 or digital output ports O14 to O17, group 4 – LCD
S18-S19/O18-O19
48, 49
O
Segment lines S18 and S19 or digital output port O18 and O19, group 5 – LCD
TCK
58
I
Test clock, clock input terminal for device programming and test
TDO/TDI
55
I/O
TDI/VPP
56
I
Test data input, data input terminal or input of programming voltage
TMS
57
I
Test mode select, input terminal for device programming and test
TP0.0
12
O
General-purpose 3-state digital output port, bit 0 – Timer/Port
TP0.1
13
O
General-purpose 3-state digital output port, bit 1 – Timer/Port
TP0.2
14
O
General-purpose 3-state digital output port, bit 2 – Timer/Port
TP0.3
15
O
General-purpose 3-state digital output port, bit 3 – Timer/Port
TP0.4
16
O
General-purpose 3-state digital output port, bit 4 – Timer/Port
TP0.5
17
I/O
General-purpose digital input/output port, bit 5 – Timer/Port
XBUF
60
O
Clock signal output of system clock MCLK or crystal clock ACLK
Xin
9
I
Input terminal of crystal oscillator
Xout/TCLK
10
I/O
Digital ground reference
Switched AVCC to analog-to-digital converter
Test data output, data output terminal or data input during programming
Output terminal of crystal oscillator or test clock input
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
short-form description
processing unit
The processing unit is based on a consistent and orthogonally-designed CPU and instruction set. This design
structure results in a RISC-like architecture, highly transparent to the application development, and it is
distinguished by ease of programming. All operations other than program-flow instructions are consequently
performed as register operations in conjunction with seven addressing modes for source and four modes for
destination operand.
Program Counter
PC/R0
Stack Pointer
SP/R1
CPU
Sixteen registers are located inside the CPU,
providing reduced instruction execution time. This
reduces a register-register operation execution
time to one cycle of the processor frequency.
Status Register
Constant Generator
Four of the registers are reserved for special
use as a program counter, a stack pointer, a status
register, and a constant generator. The remaining
registers are available as general-purpose
registers.
Peripherals are connected to the CPU using a
data address and control bus and can be handled
easily with all instructions for memory
manipulation.
SR/CG1/R2
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R14
General-Purpose Register
R15
instruction set
The instruction set for this register-register architecture provides a powerful and easy-to-use assembler
language. The instruction set consists of 51 instructions with three formats and seven addressing modes.
Table 1 provides a summation and example of the three types of instruction formats; the addressing modes are
listed in Table 2.
Table 1. Instruction Word Formats
Dual operands, source-destination
e.g. ADD R4, R5
R4 + R5 → R5
Single operands, destination only
e.g. CALL R8
PC → (TOS), R8 → PC
Relative jump, un-/conditional
e.g. JNE
Jump-on equal bit = 0
Each instruction that operates on word and byte data is identified by the suffix B.
Examples:
4
Instructions for word operation
Instructions for byte operation
MOV
EDE, TONI
MOV.B
EDE, TONI
ADD
#235h, &MEM
ADD.B
#35h, &MEM
PUSH
R5
PUSH.B
R5
SWPB
R5
—
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
Table 2. Address Mode Descriptions
ADDRESS MODE
s
d
Register
√
√
MOV Rs, Rd
MOV R10, R11
R10 → R11
Indexed
√
√
MOV X(Rn), Y(Rm)
MOV 2(R5), 5(R6)
M(2 + R5) → M(6 + R6)
Symbolic (PC relative)
√
√
MOV EDE, TONI
Absolute
√
√
MOV &MEM, &TCDAT
Indirect
√
MOV @Rn, Y(Rm)
MOV @R10, Tab(R6)
M(R10) → M(Tab + R6)
Indirect autoincrement
√
MOV @Rn+, RM
MOV @R10+, R11
M(R10) → R11, R10 + 2 → R10
Immediate
√
MOV #X, TONI
MOV #45, TONI
#45 → M(TONI)
NOTE: s = source
SYNTAX
EXAMPLE
OPERATION
M(EDE) → M(TONI)
M(MEM) → M(TCDAT)
d = destination
Computed branches (BR) and subroutine calls (CALL) instructions use the same addressing modes as the other
instructions. These addressing modes provide indirect addressing, ideally suited for computed branches and
calls. The full use of this programming capability permits a program structure different from conventional 8- and
16-bit controllers. For example, numerous routines can easily be designed to deal with pointers and stacks
instead of using flag type programs for flow control.
operation modes and interrupts
The MSP430 operating modes support various advanced requirements for ultralow power and ultralow energy
consumption. This is achieved by the intelligent management of the operations during the different module
operation modes and CPU states. The requirements are fully supported during interrupt event handling. An
interrupt event awakens the system from each of the various operating modes and returns with the RETI
instruction to the mode that was selected before the interrupt event. The clocks used are ACLK and MCLK.
ACLK is the crystal frequency and MCLK is a multiple of ACLK and is used as the system clock.
The software can configure five operating modes:
D
D
D
D
D
D
Active mode (AM). The CPU is enabled with different combinations of active peripheral modules.
Low power mode 0 (LPM0). The CPU is disabled, peripheral operation continues, ACLK and MCLK signals
are active, and loop control for MCLK is active.
Low power mode 1 (LPM1). The CPU is disabled, peripheral operation continues, ACLK and MCLK signals
are active, and loop control for MCLK is inactive.
Low power mode 2 (LPM2). The CPU is disabled, peripheral operation continues, ACLK signal is active,
and MCLK and loop control for MCLK are inactive.
Low power mode 3 (LPM3). The CPU is disabled, peripheral operation continues, ACLK signal is active,
MCLK and loop control for MCLK are inactive, and the dc generator for the digital controlled oscillator (DCO)
( MCLK generator) is switched off.
³
Low power mode 4 (LPM4). The CPU is disabled, peripheral operation continues, ACLK signal is inactive
(crystal oscillator stopped), MCLK and loop control for MCLK are inactive, and the dc generator for the DCO
is switched off.
The special function registers (SFR) include module-enable bits that stop or enable the operation of the specific
peripheral module. All registers of the peripherals may be accessed if the operational function is stopped or
enabled. However, some peripheral current-saving functions are accessed through the state of local register
bits. An example is the enable/disable of the analog voltage generator in the LCD peripheral, which is turned
on or off using one register bit.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
operation modes and interrupts (continued)
The most general bits that influence current consumption and support fast turnon from low-power operating
modes are located in the status register (SR). Four of these bits control the CPU and the system clock generator:
SCG1, SCG0, OscOff, and CPUOff.
15
9
Reserved For Future
Enhancements
8
V
7
0
SCG1
SCG0
OscOff
CPUOff
GIE
N
Z
C
rw-0
interrupt vector addresses
The interrupt vectors and the power-up starting address are located in the ROM with an address range of
0FFFFh-0FFE0h. The vector contains the 16-bit address of the appropriate interrupt handler instruction
sequence.
INTERRUPT SOURCE
SYSTEM INTERRUPT
WORD ADDRESS
PRIORITY
WDTIFG (see Note1)
Reset
0FFFEh
15, highest
NMI, oscillator fault
NMIIFG (see Notes 1 and 3)
OFIFG (see Notes 1 and 4)
Non-maskable,
(Non)-maskable
0FFFCh
14
Dedicated I/O P0.0
P0.0IFG
Maskable
0FFFAh
13
Dedicated I/O P0.1 or 8-Bit Timer/Counter
RXD
P0.1IFG
Maskable
0FFF8h
12
Watchdog Timer
WDTIFG
Maskable
Power-up, external reset, watchdog
ADC
Timer/Port
Basic Timer1
I/O port 0, P0.2–7
NOTES: 1.
2.
3.
4.
6
INTERRUPT FLAG
0FFF6h
11
0FFF4h
10
0FFF2h
9
0FFF0h
8
0FFEEh
7
0FFECh
6
ADCIFG
Maskable
0FFEAh
5
RC1FG, RC2FG, EN1FG
(see Note 2)
Maskable
0FFE8h
4
0FFE6h
3
0FFE4h
2
BTIFG
Maskable
0FFE2h
1
P0.27IFG (see Note 1)
Maskable
0FFE0h
0, lowest
Multiple source flags
Timer/Port interrupt flags are located in the T/P registers
Non-maskable: neither the individual nor the general interrupt enable bit will disable an interrupt event.
(Non)-maskable: the individual interrupt enable bit can disable on interrupt event, but the general interrupt enable bit cannot.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
operation modes and interrupts (continued)
special function registers
Most interrupt and module enable bits are collected into the lowest address space. Special function register bits
that are not allocated to a functional purpose are not physically present in the device. Simple SW access is
provided with this arrangement.
interrupt enable 1 and 2
7
Address
6
5
4
0h
3
2
1
P0IE.1
P0IE.0
OFIE
rw-0
WDTIE:
OFIE:
P0IE.0:
P0IE.1:
rw-0
rw-0
0
WDTIE
rw-0
Watchdog Timer enable signal
Oscillator fault enable signal
Dedicated I/O P0.0
P0.1 or 8-Bit Timer/Counter, RXD
7
Address
01h
6
5
4
BTIE
rw-0
3
2
TPIE
ADIE
rw-0
ADIE:
TPIE:
BTIE:
1
0
rw-0
A/D converter enable signal
Timer/Port enable signal
Basic Timer1 enable signal
interrupt flag register 1 and 2
7
Address
6
5
02h
4
3
2
1
NMIIFG
P0IFG.1
P0IFG.0
OFIFG
rw-0
WDTIFG:
rw-0
rw-0
rw-0
Set on overflow or security key violation
or
Reset on VCC power on or reset condition at RST/NMI-pin
Flag set on oscillator fault
Dedicated I/O P0.0
P0.1 or 8-Bit Timer/Counter, RXD
Signal at RST/NMI-pin
OFIFG:
P0.0IFG:
P0.1IFG:
NMIIFG:
7
Address
03h
6
5
4
3
BTIFG
2
1
0
ADIFG
rw
BTIFG
ADFIG
rw-1
0
WDTIFG
rw-0
Basic Timer1 flag
Analog-to-digital converter flag
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
operation modes and interrupts (continued)
module enable register 1 and 2
Address
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
04h
Address
05h
Legend
rw:
rw-0:
Bit can be read and written.
Bit can be read and written. It is reset by PUC.
SFR bit not present in device.
memory organization
MSP430P325
PMS430E325
FFFFh
FFE0h
FFDFh
Int. Vector
16 kB OTP
or
EPROM
C000h
03FFh
0200h
512B RAM
01FFh
0100h
00FFh
0010h
000Fh
0000h
8
POST OFFICE BOX 655303
16b Per.
8b Per.
SFR
• DALLAS, TEXAS 75265
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
peripherals
Peripherals connect to the CPU through data, address, and control busses and can be handled easily with all
instructions for memory manipulation.
peripheral file map
PERIPHERALS WITH WORD ACCESS
Watchdog
Watchdog Timer control
WDTCTL
0120h
ADC
Data register
Reserved
Control register
Input enable register
Input register
ADAT
ACTL
AEN
AIN
0118h
0116h
0114h
o112h
0110h
PERIPHERALS WITH BYTE ACCESS
EPROM
EPROM control
EPCTL
054h
Crystal buffer
Crystal buffer control
CBCTL
053h
System clock
SCG frequency control
SCG frequency integrator
SCG frequency integrator
SCFQCTL
SCFI1
SCFI0
052h
051h
050h
Timer/Port
Timer/Port enable
Timer/Port data
Timer/Port counter2
Timer/Port counter1
Timer/Port control
TPE
TPD
TPCNT2
TPCNT1
TPCTL
04Fh
04Eh
04Dh
04Ch
04Bh
8-Bit Timer/Counter
8-Bit Timer/Counter data
8-Bit Timer/Counter preload
8-Bit Timer/Counter control
TCDAT
TCPLD
TCCTL
044h
043h
042h
Basic Timer1
Basic Timer counter2
Basic Timer counter1
Basic Timer control
BTCNT2
BTCNT1
BTCTL
047h
046h
040h
LCD
LCD memory 15
:
LCD memory 1
LCD control & mode
LCDM15
:
LCDM1
LCDCTL
03Fh
:
031h
030h
Port P0
Port P0 interrupt enable
Port P0 interrupt edge select
Port P0 interrupt flag
Port P0 direction
Port P0 output
Port P0 input
P0IE
P0IES
P0IFG
P0DIR
P0OUT
P0IN
015h
014h
013h
012h
011h
010h
Special function
SFR interrupt flag2
SFR interrupt flag1
SFR interrupt enable2
SFR interrupt enable1
IFG2
IFG1
IE2
IE1
003h
002h
001h
000h
oscillator and system clock
Two clocks are used in the system, the system (master) clock (MCLK) and the auxiliary clock (ACLK). The MCLK
is a multiple of the ACLK. The ACLK runs with the crystal oscillator frequency. The special design of the oscillator
supports the feature of low current consumption and the use of a 32 768 Hz crystal. The crystal is connected
across two terminals without any other external components being required.
The oscillator starts after applying VCC, due to a reset of the control bit (OscOff) in the status register (SR). It
can be stopped by setting the OscOff bit to a 1. The enabled clock signals ACLK, ACLK/2, ACLK/4, or MCLK
are accessible for use by external devices at output terminal XBUF.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
oscillator and system clock (continued)
The controller system clock has to operate with different requirements according to the application and system
conditions. Requirements include:
D
D
D
D
High frequency in order to react quickly to system hardware requests or events
Low frequency in order to minimize current consumption, EMI, etc.
Stable frequency for timer applications e.g. real-time clock (RTC)
Enable start-stop operation with a minimum of delay
These requirements cannot all be met with fast frequency high-Q crystals or with RC-type low-Q oscillators. The
compromise selected for the MSP430 uses a low-crystal frequency, which is multiplied to achieve the desired
nominal operating range:
f(system) = (N+1) × f(crystal)
The crystal frequency multiplication is achieved with a frequency locked loop (FLL) technique. The factor N is
set to 31 after a power-up clear condition. The FLL technique, in combination with a digital controlled oscillator
(DCO) provides immediate start-up capability together with long term crystal stability. The frequency variation
of the DCO with the FLL inactive is typically 330 ppm, which means that with a cycle time of 1 µs the maximum
possible variation is 0.33 ns. For more precise timing, the FLL can be used forcing longer cycle times, if the
previous cycle time was shorter than the selected one. This switching of cycle times makes it possible to meet
the chosen system frequency over a long period of time.
The start-up operation of the system clock depends on the previous machine state. During a power-up clear
(PUC), the DCO is reset to its lowest possible frequency. The control logic starts operation immediately after
recognition of PUC. Connect operation of the FLL control logic requires the presence of a stable crystal
oscillator.
digital I/O
One 8-Bit I/O port (Port0) is implemented. Six control registers give maximum flexibility of digital input/output
to the application:
D
D
D
D
All individual I/O bits are programmable independently.
Any combination of input, output, and interrupt conditions is possible.
Interrupt processing of external events is fully implemented for all eight bits of port P0.
Provides read/write access to all registers with all instructions
The six registers are:
D
D
D
D
D
D
Input register
Contains information at the pins
Output register
Contains output information
Direction register
Controls direction
Interrupt flags
Indicates if interrupt(s) are pending
Interrupt edge select
Contains input signal change necessary for interrupt
Interrupt enable
Contains interrupt enable pins
All six registers contain eight bits except for the interrupt flag register and the interrupt enable register. The two
LSBs of the interrupt flag and interrupt enable registers are located in the special functions register (SFR). Three
interrupt vectors are implemented, one for Port0.0, one for Port0.1, and one commonly used for any interrupt
event on Port0.2 to Port0.7. The Port0.1 and Port0.2 pin function is shared with the 8-Bit Timer/Counter.
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
LCD drive
Liquid crystal displays (LCDs) for static, 2-, 3- and 4-MUX operations can be driven directly. The controller LCD
logic operation is defined by software using memory-bit manipulation. LCD memory is part of the LCD module,
not part of data memory. Eight mode and control bits define the operation and current consumption of the LCD
drive. The information for the individual digits can be easily obtained using table programming techniques
combined with the correct addressing mode. The segment information is stored in LCD memory using
instructions for memory manipulation.
The drive capability is mainly defined by the external resistor divider that supports the analog levels for 2-, 3and 4-MUX operation. Groups of the LCD segment lines can be selected for digital output signals. The
MSP430x32x configuration has four common signal lines and 21 segment lines.
A/D converter
The analog-to-digital converter (ADC) is a cascaded converter type that converts analog signals from VCC to
GND. It is a 12+2 bit converter with a software or automatically-controlled range select. Five inputs can be
selected for analog or digital function. A ratiometric current source can be used on four of the analog pins. The
current is adjusted by an external resistor and is enabled/disabled by bits located in the control registers. The
conversion is started by setting the start-of-conversion bit (SOC) in the control register and the
end-of-conversions sets the interrupt flag. The analog input signal is sampled starting with SOC during the next
twelve MCLK clock pulses. The power-down bit in the control register controls the operating mode of the ADC
peripheral. The current consumption and operation is stopped when it is set. The system reset PUC sets the
power-down bit.
Basic Timer1
The Basic Timer1 (BT1) divides the frequency of MCLK or ACLK, as selected with the SSEL bit, to provide low
frequency control signals. This is done within the system by one central divider, the Basic Timer1, to support
low current applications. The BTCTL control register contains the flags which control or select the different
operational functions. When the supply voltage is applied or when a reset of the device (RST/NMI pin), a
watchdog overflow or a watchdog security key violation occurs, and all bits in the register hold undefined or
unchanged status. The user software usually configures the operational conditions on the BT1 during
initialization.
The Basic Timer1 has two 8-Bit timers which can be cascaded to a 16-bit timer. Both timers can be read and
written by software. Two bits in the SFR address range handle the system control interaction according to the
function implemented in the Basic Timer1. These two bits are the Basic Timer1 interrupt flag (BTIFG) and the
Basic Timer1 interrupt enable (BTIE) bit.
Watchdog Timer
The primary function of the Watchdog Timer (WDT) module is to perform a controlled system restart after a
software upset has occurred. If the selected time interval expires, a system reset is generated. If this watchdog
function is not needed in an application, the module can work as an interval timer, which generates an interrupt
after the selected time interval.
The Watchdog Timer counter (WDTCNT) is a 15/16-bit up-counter which is not directly accessible by software.
The WDTCNT is controlled using the Watchdog Timer control register (WDTCTL), which is an 8-Bit read/write
register. Writing to WDTCTL, in both operating modes (watchdog or timer) is only possible by using the correct
password in the high-byte. The low-byte stores data written to the WDTCTL. The high-byte password is 05Ah.
If any value other than 05Ah is written to the high-byte of the WDTCTL, a system reset PUC is generated. When
the password is read its value is 069h. This minimizes accidental write operations to the WDTCTL register. In
addition to the Watchdog Timer control bits, two bits included in the WDTCTL configure the NMI pin.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
8-Bit Timer/Counter
The 8-Bit interval timer supports three major functions for the application:
D
D
D
Serial communication or data exchange
Pulse counting or pulse accumulation
Timer
The 8-Bit Timer/Counter peripheral includes the following major blocks: an 8-Bit up-counter with preload
register, an 8-Bit control register, an input clock selector, an edge detection (e.g. Start bit detection for
asynchronous protocols), and an input and output data latch, triggered by the carry-out-signal from the 8-Bit
counter.
The 8-Bit counter counts up with an input clock which is selected by two control bits from the control register.
The four possible clock sources are MCLK, ACLK, the external signal from terminal P0.1, and the signal from
the logical AND of MCLK and terminal P0.1.
Two counter inputs (load, enable) control the counter operation. The load input controls load operations. A
write-access to the counter results in loading the content of the preload register into the counter. The software
writes or reads the preload register with all instructions. The preload register acts as a buffer and can be written
immediately after the load of the counter is completed. The enable input enables the count operation. When
the enable signal is set to high, the counter will count-up each time a positive clock edge is applied to the clock
input of the counter.
Serial protocols, like UART protocol, need start-bit edge-detection to determine, at the receiver, the start of a
data transmission. When this function is activated, the counter starts counting after the start-bit condition is
detected. The first signal level is sampled into the RXD input data-latch after completing the first timing interval,
which is programmed into the counter. Two latches are used for input and output data (RXD_FF and TXD_FF)
are clocked by the counter after the programmed timing interval has elapsed.
UART
The serial communication uses software and the 8-Bit Timer/Counter hardware. The hardware supports the
output of the serial data stream, bit-by-bit, with the timing determined by the counter. The software/hardware
interface connects the mixed signal controller to external devices, systems, or networks.
Timer/Port
The Timer/Port module has two 8-Bit counters, an input that triggers one counter, and six 3-state digital outputs.
Both counters have an independent clock-selector for selecting an external signal or one of the internal clocks
(ACLK or MCLK). One of the counters has an extended control capability to halt, count continuously, or gate
the counter by selecting one of two external signals. This gate signal sets the interrupt flag, if an external signal
is selected, and the gate stops the counter.
Both timers can be read from and written to by software. The two 8-Bit counters can be cascaded to a 16-bit
counter. A common interrupt vector is implemented. The interrupt flag can be set from three events in the 8-Bit
counter mode (gate signal, overflow from the counters) or from two events in the 16-bit counter mode (gate
signal, overflow from the MSB of the cascaded counter).
12
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
absolute maximum ratings†
Voltage applied at VCC to VSS (see Note 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 6 V
Voltage applied to any pin (referenced to VSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VCC + 0.3 V
Diode current at any device terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 2 mA
Storage temperature, Tstg (unprogrammed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 150°C
Tstg (programmed device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 85°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 5: All voltage values relative to VSS.
recommended operating conditions
MIN
Supply voltage, VCC (MSP430P/E325)
NOM
2.7
Supply voltage, during programming OTP/EPROM
(AVCC = DVCC = VCC)
MSP430P325, PMS430E325
2.7
MSP430P325
–40
5
Supply voltage, VSS
MAX
V
5.5
V
0
Operating free-air
free air temperature range,
range TA
V
85
PMS430E325
25
XTAL frequency, f(XTAL)
32 768
VCC = 3 V
VCC = 5 V
MCLK) f((system)
Processor frequency (signal MCLK),
t )
Low-level input voltage, VIL (excluding Xin, Xout)
High-level input voltage, VIH (excluding Xin, Xout)
VCC = 3 V/5 V
Low-level input voltage, VIL(Xin, Xout)
f(system) – Maximum Processor
Frequency – MHz
High-level input voltage, VIH(Xin, Xout)
UNIT
5.5
°C
Hz
DC
2.2
DC
3.3
VSS
0.7 VCC
VSS+0.8
VCC
V
VSS
0.8×VCC
0.2×VCC
VCC
V
MHz
f(MHz)
3.3
2.2
1.5
Minimum
2.7
3
5
5.5
VCC (V)
VCC – Supply Voltage – V
NOTE: Minimum processor frequency is defined by system clock.
Figure 1. Processor Frequency vs Supply Voltage
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
supply current into AVCC+DVCC excluding external current, fsystem = 1 MHz
PARAMETER
I(AM)
Active mode,, A/D conversion in
power-down
I(CPUOff)
Low power mode,
mode (LPM0,
(LPM0 LPM1)
I(LPM2)
Low power mode,
mode (LPM2)
I(LPM3)
TYP
MAX
P325
TA = –40°C to 85°C,
TA = –40°C to 85°C,
TEST CONDITIONS
VCC = 3 V
VCC = 5 V
MIN
3000
5000
10000
12000
P325
TA = –40°C to 85°C,
TA = –40°C to 85°C,
VCC = 3 V
VCC = 5 V
70
110
150
200
TA = –40°C to 85°C,
TA = –40°C to 85°C,
VCC = 3 V
VCC = 5 V
6
12
15
25
TA = –40°C
TA = 25°C
1.5
2.4
VCC = 3 V
1.3
2
1.6
2.8
5.2
7
4.2
6.5
TA = 85°C
TA = –40°C
Low power mode,
mode (LPM3)
TA = 25°C
TA = 85°C
VCC = 5 V
TA = –40°C
TA = 25°C
4
7
0.1
0.8
UNIT
µA
µA
µA
µA
VCC = 3 V/5 V
µA
0.1
0.8
TA = 85°C
0.4
1.3
NOTE: All inputs are tied to 0 V or VCC. Outputs do not source or sink any current. The current consumption in LPM2, LPM3 and LPM4 are
measured with active Basic Timer1 (ACLK selected) and LCD module (f(LCD)=1024 Hz, 4 MUX).
I((LPM4))
Low power mode, (LPM4)
current consumption of active mode versus system frequency
IAM = IAM[1 MHz] × fsystem [MHz]
current consumption of active mode versus supply voltage
IAM = IAM[3 V] + 200 µA/V × (VCC–3 V)
Schmitt-trigger inputs Port 0, P0.x Timer/Port, CIN, TP 0.5
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
Positive going input threshold voltage
Positive-going
VCC = 3 V
VCC = 5 V
1.2
2.3
3.4
VIT
IT–
Negative going input threshold voltage
Negative-going
VCC = 3 V
VCC = 5 V
0.5
1.35
1.4
2.3
Vh
hys
Hysteresis (VIT+
VIT
IT –V
IT–)
VCC = 3 V
VCC = 5 V
0.3
1
0.6
1.4
VIT
IT+
14
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
2.1
V
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
outputs – Port 0: P0.x; Timer/Port: TP0.0...5; LCD: Sxx/Oxx; XBUF, (see Note 6)
PARAMETER
VOH
VOL
High level output current
High-level
Low-level out
output
ut voltage
TEST CONDITIONS
MIN
IOH = –1.2 mA,
IOH = –3.5 mA,
VCC = 3 V,
VCC = 3 V,
See Note 6
IOH = –1.5 mA,
IOH = –4.5 mA,
VCC = 5 V,
VCC = 5 V,
See Note 6
IOL = 1.2 mA,
IOL = 3.5 mA,
VCC = 3 V,
VCC = 3 V,
See Note 6
IOL = 1.5 mA,
IOL = 4.5 mA,
VCC = 5 V,
VCC = 5 V,
See Note 6
See Note 7
See Note 7
TYP
MAX
VCC–0.4
VCC–1
VCC
VCC
VCC–0.4
VCC–1
VCC
VCC
VSS
VSS
VSS+0.4
VSS+1
VSS
VSS
VSS+0.4
VSS+1
See Note 7
See Note 7
UNIT
V
V
NOTES: 6. The maximum total current, IOHmax and IOLmax, for all outputs combined, should not exceed ±9.6 mA to satisfy the maximum
voltage drop specified.
7. The maximum total current, IOHmax and IOLmax, for all outputs combined, should not exceed ±20 mA to satisfy the maximum voltage
drop specified.
leakage current (see Note 8)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Ilkg(TP)
Leakage current, Timer/Port
Timer/Port: V(TP0.x,CIN)
(see Note 9)
±50
nA
Ilkg(P0x)
Leakage current, port 0
Port 0: V(P0.x)
(see Note 10)
±50
nA
Ilkg(S20)
Leakage current, S20
±50
nA
Ilkg(Ax)
Leakage current, ADC
±30
nA
V(S20) = VSS to VCC
ADC: Ax, x= 0 to 5
(see Note 11)
VCC = 3 V/5 V
Ilkg(RST/NMI) Leakage current, RST/NMI
±50
nA
NOTES: 8. The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
9. All Timer/Port pins TP0.0 to TP0.5 are Hi-Z. Pins CIN and TP.0 to TP0.5 are connected together during leakage current
measurement. In the leakage measurement the input CIN is included. The input voltage is VSS or VCC.
10. The port pin must be selected for input and there must be no optional pullup or pulldown resistor.
11. The input voltage is V(IN) = VSS to VCC , the current source is off, AEN.x bit is normally reset to stop throughput current flowing from
VCC to VSS terminal.
input frequency – Port 0: P0.1; Timer/Port: CIN, TP0.5
PARAMETER
f(IN)
t(H) or t(L)
TEST CONDITIONS
Input frequency
MIN
TYP
DC
P0.x, CIN, TP.5
High level or low level time
MAX
UNIT
f(system)
MHz
3V
300
ns
5V
125
ns
output frequency
PARAMETER
fXBUF
tXdc
TEST CONDITIONS
XBUF,
Duty cycle of O/P frequency
XBUF, CL = 20 pF,
XBUF
pF
VCC = 3 V/5 V
POST OFFICE BOX 655303
MIN
TYP
CL = 20 pF
fMCLK = 1.1 MHz
fXBUF = fACLK
fXBUF = fACLK/n
• DALLAS, TEXAS 75265
40%
35%
MAX
UNIT
f(system)
60%
MHz
65%
50%
15
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
external interrupt timing
PARAMETER
TEST CONDITIONS
Port P0: External trigger signal for the
interrupt flag (see Notes 12 and 13)
t(int)
MIN
TYP
MAX
1.5
UNIT
cycle
NOTES: 12. The external signal sets the interrupt flag every time t(int) is met. It may be set even with trigger signals shorter than t(int). The
conditions to set the flag must be met independently of this timing constraint. Input frequency (t(int)) is defined in MCLK cycles.
13. The external signal needs additionally a timing resulting from the maximum input frequency constraint.
RAM
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VRAMh
CPU halted (see Note 14)
1.8
V
NOTE 14: This parameter defines the minimum supply voltage when the data in the program memory RAM remains unchanged. No program
execution should take place during this supply voltage condition.
DCO
PARAMETER
f(NOM)
DCO
TEST CONDITIONS
NDCO = 1A0h, FN_4=FN_3=FN_2=0
MIN
VCC = 3 V/5 V
VCC = 3 V
TYP
MAX
1
MHz
0.15
0.6
VCC = 5 V
VCC = 3 V
0.18
0.62
1.25
4.7
VCC = 5 V
1.45
5.5
NDCO = 00 0110 0000,
0000 FN
FN_4=FN_3=0,
4=FN 3=0 FN_2=1
FN 2=1
VCC = 3 V
VCC = 5 V
0.36
1.05
0.39
1.2
fDC26
0000 FN
4=FN 3=0 FN_2=1
FN 2=1
NDCO = 11 0100 0000,
FN_4=FN_3=0,
VCC = 3 V
VCC = 5 V
2.5
8.1
3
9.9
fDCO3
NDCO = 00 0110 0000
0000, FN
FN_4=0,
4=0 FN
FN_3=
3= 1
1, FN
FN_2=X
2=X
VCC = 3 V
VCC = 5 V
0.5
1.5
0.6
1.8
fDCO26
NDCO = 11 0100 0000
0000, FN
FN_4=
4= 0
0, FN
FN_3=1,
3=1 FN
FN_2=X
2=X
VCC = 3 V
VCC = 5 V
3.7
11
4.5
13.8
fDCO3
4 =1,
=1 FN_3=FN_2=X
FN 3=FN 2=X
NDCO = 00 0110 0000 FN
FN_4
VCC = 3 V
VCC = 5 V
0.7
1.85
0.8
2.4
NDCO = 11 0100 0000,
0000 FN
FN_4=1,
4=1 FN_3=FN_2=X
FN 3=FN 2=X
VCC = 3 V
VCC = 5 V
4.8
13.3
6
17.7
NDCO
fMCLK = fNOM , FN_4=FN_3=FN_2=0
VCC = 3 V/5 V
A0h
S
fNDCO+1 = S × fNDCO
VCC = 3 V/5 V
1.07
fDCO3
NDCO = 00 0110 0000,
0000 FN_4=FN_3=FN_2=0
FN 4=FN 3=FN 2=0
f(NOM)
fDCO26
fDCO3
NDCO = 11 0100 0000 FN
FN_4=FN_3=FN_2=0
4=FN 3=FN 2=0
2xf(NOM)
3xf(NOM)
4xf(NOM)
fDCO26
16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1A0h
UNIT
340h
1.13
MHz
MHz
MHz
MHz
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
f(DCO26)
4xfNOM
f(DCO26)
f(DCO3)
3xfNOM
f(DCO26)
f(DCO3)
2xfNOM
Legend
Tolerance at Tap 26
f(DCO26)
DCO Frequency
Adjusted by Bits
2∧9–2∧5 in SCFI1
f(DCO3)
fNOM
Tolerance at Tap 3
f(DCO3)
FN_2 = 0
FN_3 = 0
FN_4 = 0
FN_2 = 1
FN_3 = 0
FN_4 = 0
FN_2 = X
FN_3 = 1
FN_4 = 0
FN_2 = X
FN_3 = X
FN_4 = 1
Figure 2
crystal oscillator
PARAMETER
C(Xin)
Integrated capacitance at input
C(Xout)
Integrated capacitance at output
TEST CONDITIONS
MIN
VCC = 3 V/5 V
VCC = 3 V/5 V
NOM
MAX
UNIT
12
pF
12
pF
PUC/POR
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
150
250
µs
1.5
2.4
V
1.2
2.1
V
0.9
1.8
V
0
0.4
t(POR_delay)
V(POR)
(
)
TA = –40°C
TA = 25°C
POR
VCC = 3 V/5 V
TA = 85°C
V(min)
t(reset)
PUC/POR
Reset is accepted internally
V
µs
2
V
VCC
V(POR)
V(min)
POR
No POR
POR
t
Figure 3. Power-On Reset (POR) vs Supply Voltage
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
17
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
3
2.4
2.5
2.1
1.8
MAX
V POR [V]
2
1.5
1.5
1
MIN
0.9
1.2
0.5
25°C
0
–40
–20
0
20
40
60
80
Temperature [°C]
Figure 4. V(POR) vs Temperature
LCD
PARAMETER
VO(HLCD)
VO(LLCD)
TEST CONDITIONS
Output 1 (HLCD)
Output 0 (LLCD)
I(HLCD) <= 10 nA
I(LLCD) <= 10 nA
MIN
MAX
UNIT
VCC
VSS+0.125
V
VCC = 3 V/5 V
±20
nA
VCC = 3 V/5 V
50
kΩ
TYP
MAX
UNIT
250
350
450
600
0.25×VCC
5
0.26×VCC
37
10
42
VCC = 3 V/5 V
TYP
VCC–0.125
VSS
R03 = VSS,
No load at all seg and com pins
II(R03)
Input leakage
II(R13)
R13 = VCC/ 3,
No load at all seg and com pins
R23 = 2 VCC/ 3,
No load at all seg and com pins
II(R23)
ro(Rx3 to Sxx)
I(SXX) = –3 µA,
Resistance
comparator (Timer/Port)
PARAMETER
TEST CONDITIONS
I(com)
(
)
Comparator (Timer/Port)
CPON = 1
Vref(com)
Internal reference voltage at (–) terminal
CPON = 1
Vhys(com)
Input
In
ut hysteresis (comparator)
(com arator)
CPON = 1
MIN
VCC = 3 V
VCC = 5 V
VCC = 3 V/5 V
VCC = 3 V
0.23×VCC
VCC =5 V
µA
V
mV
wake-up LPM3
PARAMETER
t((LPM3))
18
TEST CONDITIONS
Delay time
POST OFFICE BOX 655303
MIN
TYP
MAX
f = 1 MHz
VCC = 3 V
VCC = 5 V
6
f = 2 MHz
VCC = 3 V
VCC = 5 V
6
f = 3 MHz
VCC = 5 V
6
• DALLAS, TEXAS 75265
UNIT
µs
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
ADC supply current (f(ADCLK) = 1 MHz)
PARAMETER
I(ADC)
I(ADC)
ADC current
TEST CONDITIONS
SVCC on, current source off,
SVCC on, current source off,
MIN
NOM
MAX
UNIT
VCC = 3 V
200
400
µA
VCC = 5 V
300
740
µA
NOM
MAX
UNIT
VCC
±0.1
µA
100
kΩ
SVCC (switched AVCC)
PARAMETER
V(SVCC)
I(SVCC)
Z(SVCC)
Input impedance
TEST CONDITIONS
MIN
SVCC on,
SVCC off,
I(SVCC) = –8 mA,
VCC = 2.5 V
SVCC = 0 V,
VCC = 5 V
SVCC off,
VCC = 3 V/5 V
VCC–0.2 V
40
V
current source (ADC)
PARAMETER
V(Rext)
Voltage, (Rext)
R(ext)
External resistor
TEST CONDITIONS
V(Rext) = V(SVCC) – V(RI),
I(RI) = 6 mA,
VA0..A3 = 0 .. 0.4 × V(SVCC), IS =
V(Rext)/R(ext) = 1 mA
∆IS
Load compliance
MIN
TYP
MAX
VCC = 3 V/5 V,
0.246 ×
V(SVCC)
0.249 ×
V(SVCC)
0.252 ×
V(SVCC)
UNIT
V
VCC = 3 V/5 V
VCC = 3 V,
95
1600
Ω
–1
1
µA
VA0..A3 = 0 .. 0.4 × V(SVCC),
IS = V(Rext)/R(ext) = 6 mA
VCC = 3 V,
–3.2
3.2
µA
VA0..A3 = 0 .. 0.5 × V(SVCC)
IS = V(Rext)/R(ext)= 1 mA
VCC = 5 V,
–1.5
1.5
µA
VA0..A3 = 0 .. 0.5 × V(SVCC)
IS = V(Rext)/R(ext)= 6 mA
VCC = 5 V,
–3.2
3.2
µA
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
19
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
A/D converter (f(ADCLK) = 1 MHz)
PARAMETER
TEST CONDITIONS
MIN
Resolution
f((con))
Conversion frequency
f((con)) = f(ADCLK)
f((concyc))
Conversion cycles
f(ADCLK) = f(MCLK)/N
12-bit conversion
12+2-bit conversion
12-bit conversion
12+2-bit conversion
LSB Voltage
INL1
INL2
INL3
INL4
MAX
128 ≤ DDV ≤ 255
1.5
0.14
1.5
96
VCC = 3 V/5 V
VCC = 3 V/5 V
VCC = 3 V/5 V
0 ≤ DDV ≤ 127
Integral
g nonlinearityy
(see Note 15)
VCC = 3 V/5 V
0.000061×VSVCC
V
–2
2
LSB
VCC = 3 V/5 V
VCC = 3 V/5 V
–3
3
LSB
256 ≤ DDV ≤ 2047
–7
7
LSB
2048 ≤ DDV ≤ 4095
VCC = 3 V/5 V
–10
10
LSB
VCC = 3 V/5 V
–1
1
LSB
dN/dT
Temperature stability
V(Rext)/R(ext) = 6mA, Range A
Range B
dN/dV(SVCC)
V(SVCC)rejection ratio
Range A, B, V(Rext)/R(ext) = 1 mA,
SVCC ±10%
VCC = 3 V/5 V
Range A
VCC = 3 V/5 V
–1.2
Range B
VCC = 3 V/5 V
Range C
Conversion offset 14 bit analog input to
digital value (see Note 17)
MHz
cycles
y
of
ADCLK
132
DNL
g input to
Conversion offset 12 bit analog
digital value (see Note 17)
UNIT
bits
0.1
Differential nonlinearity
(see Note 16)
0.008
VCC = 3 V/5 V
LSB/°C
0.015
1.25
LSB/V
–0.49
0.24
% FSRA
(see Note 18)
–1.7
–0.6
0.49
% FSRB
(see Note 18)
VCC = 3 V/5 V
–1.8
–0.6
0.6
% FSRC
(see Note 18)
Range D
VCC = 3 V/5 V
–1.7
0.6
0.49
% FSRD
(see Note 18)
Range ABCD
VCC = 3 V/5 V
–0.27
–0.06
0.13
%FSRABCD
(see Note 18)
VCC = 3 V/5 V
VCC = 3 V/5 V
0.9925
1
1.0075
0.9982
1
1.0018
40
45
Slope 12 bit
Slope 14 bit
C(IN)
R(SIN)
TYP
12 + 2
Input capacitance
VCC = 3 V/5 V
VCC = 3 V/5 V
Serial input resistance
2
pF
kΩ
NOTES: 15. DDV is short form of delta digital value. The DDV is a span of conversion results. It is assumed that the conversion is of 12 bit not
12+2 bit.
16. DNL is valid for all 12-bit ranges and the 14-bit (12+2) range.
17. Offset referred to full scale 12/14 bit
18. FSRx: full scale range, separate for the four 12-bit ranges and the 14-bit (12+2) range.
20
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
JTAG
PARAMETER
TEST CONDITIONS
MIN
TCK frequency
VCC = 3 V
VCC = 5 V
R(TEST)
Pullup resistors on TMS, TCK, TDI
(see Note 19)
VCC = 3 V/ 5 V
25
V(FB)
Fuse blow voltage, E/P versions
(see Note 21)
VCC = 3 V/ 5 V
11
f(TCK)
JTAG/test
I(FB)
t(FB)
JTAG/f
JTAG/fuse
(
(see
N t 20)
Note
10
60
11
11.5
Current from programming voltage source
EPROM ((E)) and OTP(P)
( )–
versions only
Pn
t(erase)
5
DC
Supply current on TDI to blow fuse
Programming voltage, applied to TDI/VPP
Programming time, single pulse
y
EPROM ((E)) versions only
MHz
kΩ
12
V
100
mA
1
ms
13
V
70
mA
ms
µs
100
4
UNIT
90
5
Programming time, fast algorithm
Number of pulses for successful programming
MAX
DC
Time to blow the fuse
V(PP)
I(PP)
t(pps)
t(ppf)
TYP
100
Pulses
Data retention TJ < 55°C
10
year
Erase time wave length 2537 Å at 15 Ws/cm2
(UV lamp of 12 mW/ cm2)
30
min
Write/Erase cycles
1000
cycles
NOTES: 19. The TMS and TCK pullup resistors are implemented in all C-, P-, and E-versions.
20. Once the JTAG fuse is blown, no further access to the MSP430 JTAG/test feature is possible. The JTAG block switches to by-pass
mode.
21. The voltage supply to blow the JTAG fuse is applied to TDI/VPP pin when fuse blowing is desired.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
21
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
DIGITAL CONTROLLED OSCILLATOR FREQUENCY
vs
SUPPLY VOLTAGE
1.8
1.2
1.5
1
f (DCO) / f (DCO@ 3 V)
f (DCO) / f (DCO@ 25°C )
DIGITAL CONTROLLED OSCILLATOR FREQUENCY
vs
OPERATING FREE-AIR TEMPERATURE
1.2
0.9
0.6
0.3
0
–40
0.8
0.6
0.4
0.2
0
–20
0
20
40
60
80
T – Operating Free-Air Temperature – °C
90
0
Figure 5
22
4
2
VCC – Supply Voltage – V
Figure 6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
6
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
typical input/output schematics
VCC
VCC
(see Note A)
(see Note A)
(see Note B)
(see Note B)
(see Note B)
(see Note B)
(see Note A)
(see Note A)
GND
GND
CMOS SCHMITT-TRIGGER INPUT (CIN)
CMOS INPUT (RST/NMI)
VCC
(see Note A)
(see Note B)
(see Note B)
(see Note A)
GND
I/O WITH SCHMITT-TRIGGER INPUT (P0.x, TP5)
CMOS 3-STATE OUTPUT (TP0–4, XBUF)
TDO_Internal
VCC
60 k TYP
TDO_Control
TDI_Control
TDI_Internal
MSP430P/E325: TMS, TCK
MSP430P/E325: TDO/TDI
NOTES: A. Optional selection of pullup or pulldown resistors with ROM (masked) versions. Anti-parallel diodes are connected between AVSS
and DVSS.
B. Fuses for the optional pullup and pulldown resistors can only be programmed at the factory.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
23
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
typical input/output schematics
VC
COM 0–3
VD
Control COM0–3
VA
S0, S1
VB
Segment control
VA
S2/O2–Sn/On
VB
Segment control
LCDCTL (LCDM5,6,7)
Data (LCD RAM bits 0–3
or bits 4–7)
LCD OUTPUT (COM0–4, Sn, Sn/On)
NOTE: The signals VA, VB, VC, and VD come from the LCD module analog voltage generator.
VPP_ Internal
TDI_ Internal
TDI/VPP
JTAG
Fuse
TDO/TDI_Control
TDO/TDI
TMS
TDO_ Internal
JTAG Fuse
Blow
Control
From/To JTAG_CBT_SIG_REG
NOTES: A. During programming activity and when blowing the JTAG enable fuse, the TDI/VPP terminal is used to apply the correct voltage
source. The TDO/TDI terminal is used to apply the test input data for JTAG circuitry.
B. The TDI/VPP terminal of the ’P325 and ’E325 does not have an internal pullup resistor. An external pulldown resistor is
recommended to avoid a floating node which could increase the current consumption of the device.
C. The TDO/TDI terminal is in a high-impedance state after POR. The ’P325 and ’E325 needs a pullup or a pulldown resistor to avoid
floating a node which could increase the current consumption of the device.
Figure 7. MSP430P325/E325: TDI/VPP, TDO/TDI
24
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
TYPICAL CHARACTERISTICS
JTAG fuse check mode
MSP430 devices that have the fuse on the TDI/VPP terminal have a fuse check mode that tests the continuity
of the fuse the first time the JTAG port is accessed after a power-on reset (POR). When activated, a fuse check
current, ITF , of 1 mA at 3 V, 2.5 mA at 5 V can flow from the TDI/VPP pin to ground if the fuse is not burned.
Care must be taken to avoid accidentally activating the fuse check mode and increasing overall system power
consumption.
Activation of the fuze check mode occurs with the first negative edge on the TMS pin after power-up or if TMS
is being held low during power-up. The second positive edge on the TMS pin deactivates the fuse check mode.
After deactivation, the fuse check mode remains inactive until another POR occurs. After each POR the fuse
check mode has the potential to be activated.
Time TMS Goes Low After POR
TMS
ITDI
ITF
Figure 8. Fuse Check Mode Current, MSP430P/E325
Care must be taken to avoid accidentally activating the fuse check mode, including guarding against EMI/ESD
spikes that could cause signal edges on the TMS pin.
Configuration of TMS, TCK, TDI/VPP and TDO/TDI pins in applications.
P/E3xx
TDI
68k, pulldown
TDO
68k, pulldown
TMS
Open
TCK
Open
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
25
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
MECHANICAL DATA
PG (R-PQFP-G64)
PLASTIC QUAD FLATPACK
0,45
0,25
1,00
51
0,20 M
33
52
32
12,00 TYP
64
14,20
13,80
18,00
17,20
20
1
19
0,15 NOM
18,00 TYP
20,20
19,80
24,40
23,60
Gage Plane
0,25
0,10 MIN
2,70 TYP
0°– 10°
1,10
0,70
Seating Plane
3,10 MAX
0,10
4040101 / B 03/95
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Contact field sales office to determine if a tighter coplanarity requirement is available for this package.
26
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
MECHANICAL DATA
MSP430P325 (PM package)
1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
33
16
1718 19 20 21 22 23 24 25 26 27 28 29 30 31 32
S19/O19
S18/O18
S17/O17
S16/O16
S15/O15
S14/O14
S13/O13
S12/O12
S11/O11
S10/O10
S9/O9
S8/O8
S7/O7
S6/O6
S5/O5
S4/O4
P0.0
P0.1/RXD
P0.2/TXD
P0.3
P0.4
P0.5
P0.6
P0.7
R33
R32
R13
R03
S0
S1
S2/O2
S3/O3
DVCC
SVCC
Rext
A2
A3
A4
A5
Xin
Xout/TCLK
CIN
TP0.0
TP0.1
TP0.2
TP0.3
TP0.4
TP0.5
COM0
S20/O20/CMPI
AVCC
DVSS
AVSS
A1
A0
XBUF
RST/NMI
TCK
TMS
TDI/V PP
TDO/TDI
COM3
COM2
COM1
PM PACKAGE
(TOP VIEW)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
27
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
MECHANICAL DATA
PM (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
0,08 M
33
48
49
32
64
17
0,13 NOM
1
16
7,50 TYP
10,20
SQ
9,80
12,20
SQ
11,80
Gage Plane
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040152 / C 11/96
NOTES: A.
B.
C.
D.
28
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Falls within JEDEC MS-026
May also be thermally enhanced plastic with leads connected to the die pads.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
MECHANICAL DATA
MSP430P325 (FN package)
AVCC
NC
DVSS
AVSS
A1
A0
XBUF
RST/NMI
TCK
TMS
TDI/VPP
TDO/TDI
COM3
COM2
COM1
COM0
NC
FN PACKAGE
(TOP VIEW)
9
10
8 7
6
5 4 3 2
1 68 67 66 65 64 63 62 61
60
11
59
12
58
13
57
14
56
15
55
16
54
17
53
18
52
19
51
20
50
21
49
22
48
23
47
24
46
25
45
44
26
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
S20/O20/CMPI
S19/O19
S18/O18
S17/O17
S16/O16
S15/O15
S14/O14
S13/O13
S12/O12
S11/O11
S10/O10
S9/O9
S8/O8
S7/O7
S6/O6
S5/O5
S4/O4
NC
P0.1/RXD
P0.2/TXD
P0.3
P0.4
P0.5
P0.6
P0.7
R33
R23
R13
R03
S0
S1
S2/O2
S3/O3
NC
DVCC
SVCC
Rext
A2
A3
A4
A5
Xin
Xout/TCLK
CIN
TP0.0
TP0.1
TP0.2
TP0.3
TP0.4
TP0.5
P0.0
NC – No internal connection
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
29
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
MECHANICAL DATA
FN (S-PQCC-J**)
PLASTIC J-LEADED CHIP CARRIER
20 PIN SHOWN
Seating Plane
0.004 (0,10)
0.180 (4,57) MAX
0.120 (3,05)
0.090 (2,29)
D
D1
0.020 (0,51) MIN
3
1
19
0.032 (0,81)
0.026 (0,66)
4
E
18
D2 / E2
E1
D2 / E2
8
14
0.021 (0,53)
0.013 (0,33)
0.007 (0,18) M
0.050 (1,27)
9
13
0.008 (0,20) NOM
D/E
D2 / E2
D1 / E1
NO. OF
PINS
**
MIN
MAX
MIN
MAX
MIN
MAX
20
0.385 (9,78)
0.395 (10,03)
0.350 (8,89)
0.356 (9,04)
0.141 (3,58)
0.169 (4,29)
28
0.485 (12,32)
0.495 (12,57)
0.450 (11,43)
0.456 (11,58)
0.191 (4,85)
0.219 (5,56)
44
0.685 (17,40)
0.695 (17,65)
0.650 (16,51)
0.656 (16,66)
0.291 (7,39)
0.319 (8,10)
52
0.785 (19,94)
0.795 (20,19)
0.750 (19,05)
0.756 (19,20)
0.341 (8,66)
0.369 (9,37)
68
0.985 (25,02)
0.995 (25,27)
0.950 (24,13)
0.958 (24,33)
0.441 (11,20)
0.469 (11,91)
84
1.185 (30,10)
1.195 (30,35)
1.150 (29,21)
1.158 (29,41)
0.541 (13,74)
0.569 (14,45)
4040005 / B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
30
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
PMS430E325 (FZ package)
AVCC
NC
DVSS
AVSS
A1
A0
XBUF
RST/NMI
TCK
TMS
TDI/ Vpp
TDO/TDI
COM3
COM2
COM1
COM0
NC
FZ PACKAGE
(TOP VIEW)
10
9
8 7
6
5 4 3 2
1 68 67 66 65 64 63 62 61
60
11
59
12
58
13
57
14
56
15
55
16
54
17
53
18
52
19
51
20
50
21
49
22
48
23
47
24
46
25
45
44
26
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
S20/O20/CMPI
S19/O19
S18/O18
S17/O17
S16/O16
S15/O15
S14/O14
S13/O13
S12/O12
S11/O11
S10/O10
S9/O9
S8/O8
S7/O7
S6/O6
S5/O5
S4/O4
NC
P0.1/RXD
P0.2/TXD
P0.3
P0.4
P0.5
P0.6
P0.7
R33
R23
R13
R03
S0
S1
S2/O2
S3/O3
NC
DVCC
SVCC
rext
A2
A3
A4
A5
Xin
Xout/TCLK
CIN
TP0.0
TP0.1
TP0.2
TP0.3
TP0.4
TP0.5
P0.0
NC – No internal connection
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
31
MSP430P325
MIXED SIGNAL MICROCONTROLLER
SLAS164A – FEBRUARY 1998 – REVISED MARCH 2000
MECHANICAL DATA
FZ (S-CQCC-J**)
J-LEADED CERAMIC CHIP CARRIER
28 LEAD SHOWN
0.040 (1,02)
45°
Seating Plane
0.180 (4,57)
A
0.155 (3,94)
0.140 (3,55)
B
4
0.120 (3,05)
1
26
25
5
A
B
0.050 (1,27)
C
(at Seating
Plane)
0.032 (0,81)
0.026 (0,66)
0.020 (0,51)
0.014 (0,36)
19
11
18
12
0.025 (0,64) R TYP
0.040 (1,02) MIN
0.120 (3,05)
0.090 (2,29)
A
B
C
JEDEC
NO. OF
OUTLINE
PINS**
MIN
MAX
MIN
MAX
MIN
MAX
MO-087AA
28
0.485
(12,32)
0.495
(12,57)
0.430
(10,92)
0.455
(11,56)
0.410
(10,41)
0.430
(10,92)
MO-087AB
44
0.685
(17,40)
0.695
(17,65)
0.630
(16,00)
0.655
(16,64)
0.610
(15,49)
0.630
(16,00)
MO-087AC
52
0.785
(19,94)
0.795
(20,19)
0.730
(18,54)
0.765
(19,43)
0.680
(17,28)
0.740
(18,79)
MO-087AD
68
0.985
(25,02)
0.995
(25,27)
0.930
(23,62)
0.955
(24,26)
0.910
(23,11)
0.930
(23,62)
4040219 / B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
32
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
2-Nov-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
MSP-EVK430A320
OBSOLETE
0
TBD
Call TI
Call TI
MSP-EVK430B320
OBSOLETE
0
TBD
Call TI
Call TI
MSP-STK430A320
OBSOLETE
0
TBD
Call TI
Call TI
MSP-STK430B320
OBSOLETE
0
TBD
Call TI
Call TI
Op Temp (°C)
Device Marking
(4/5)
MSP430P325IFN
OBSOLETE
PLCC
FN
68
TBD
Call TI
Call TI
-40 to 85
M430P325
MSP430P325IPG
OBSOLETE
QFP
PG
64
TBD
Call TI
Call TI
-40 to 85
M430P325
MSP430P325IPM
OBSOLETE
LQFP
PM
64
TBD
Call TI
Call TI
-40 to 85
M430P325
MSP430P325IPMR
OBSOLETE
LQFP
PM
64
TBD
Call TI
Call TI
-40 to 85
M430P325
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
2-Nov-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPLC004A – OCTOBER 1994
FN (S-PQCC-J**)
PLASTIC J-LEADED CHIP CARRIER
20 PIN SHOWN
Seating Plane
0.004 (0,10)
0.180 (4,57) MAX
0.120 (3,05)
0.090 (2,29)
D
D1
0.020 (0,51) MIN
3
1
19
0.032 (0,81)
0.026 (0,66)
4
E
18
D2 / E2
E1
D2 / E2
8
14
0.021 (0,53)
0.013 (0,33)
0.007 (0,18) M
0.050 (1,27)
9
13
0.008 (0,20) NOM
D/E
D2 / E2
D1 / E1
NO. OF
PINS
**
MIN
MAX
MIN
MAX
MIN
MAX
20
0.385 (9,78)
0.395 (10,03)
0.350 (8,89)
0.356 (9,04)
0.141 (3,58)
0.169 (4,29)
28
0.485 (12,32)
0.495 (12,57)
0.450 (11,43)
0.456 (11,58)
0.191 (4,85)
0.219 (5,56)
44
0.685 (17,40)
0.695 (17,65)
0.650 (16,51)
0.656 (16,66)
0.291 (7,39)
0.319 (8,10)
52
0.785 (19,94)
0.795 (20,19)
0.750 (19,05)
0.756 (19,20)
0.341 (8,66)
0.369 (9,37)
68
0.985 (25,02)
0.995 (25,27)
0.950 (24,13)
0.958 (24,33)
0.441 (11,20)
0.469 (11,91)
84
1.185 (30,10)
1.195 (30,35)
1.150 (29,21)
1.158 (29,41)
0.541 (13,74)
0.569 (14,45)
4040005 / B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MECHANICAL DATA
MQFP008 – JULY 1998
PG (R-PQFP-G64)
PLASTIC QUAD FLATPACK
0,45
0,25
1,00
51
0,20 M
33
52
32
12,00 TYP
64
14,20
13,80
18,00
17,20
20
1
19
0,15 NOM
18,00 TYP
20,20
19,80
24,00
23,20
Gage Plane
0,25
0,10 MIN
2,70 TYP
0°– 10°
1,10
0,70
Seating Plane
3,10 MAX
0,10
4040101 / B 03/95
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Contact field sales office to determine if a tighter coplanarity requirement is available for this package.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MECHANICAL DATA
MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996
PM (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
0,08 M
33
48
49
32
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
12,20
SQ
11,80
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040152 / C 11/96
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Falls within JEDEC MS-026
May also be thermally enhanced plastic with leads connected to the die pads.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated