Material Content Data Sheet Sales Product Name IPB60R099C6 MA# MA000974308 Package PG-TO263-3-2 Issued 29. August 2013 Weight* 1565.61 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 15.501 0.99 0.304 0.02 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.99 9901 9901 194 0.091 0.01 304.026 19.42 19.45 194191 58 194443 2.681 0.17 0.17 1712 1712 10.133 0.65 6472 111.466 7.12 553.954 35.38 43.15 353828 431497 9.657 0.62 0.62 6168 6168 0.228 0.01 0.001 0.00 0.230 0.01 0.184 0.01 8.772 0.56 0.165 0.01 0.548 0.04 547.666 34.98 71197 146 0.01 0 117 0.58 5603 2. 3. 350 35.03 349811 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5867 105 Important Remarks: 1. 146 147 350266 1000000