BC856 Rev.F Apr.-2017 描述 / DATA SHEET Descriptions SOT-23 塑封封装 PNP 半导体三极管。Silicon PNP transistor in a SOT-23 Plastic Package. 特征 / Features 低电流，低电压，小封装。 Low current ,Low voltage ,S-mini package. 用途 / Applications 用于一般放大 General power amplifier application. 内部等效电路 引脚排列 / Equivalent Circuit / Pinning 3 1 2 PIN1：Base 放大及印章代码 PIN 2：Emitter PIN 3：Collector / hFE Classifications & Marking hFE Classifications Symbol hFE Range Marking http://www.fsbrec.com A B 125～250 220～475 H3A H3B 1/6 BC856 Rev.F Apr.-2017 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Collector to Base Voltage VCBO -80 V Collector to Emitter Voltage VCEO -65 V Emitter to Base Voltage VEBO -5.0 V Collector Current - Continuous IC -100 mA Collector Power Dissipation PC 350 mW Junction Temperature Tj 150 ℃ Tstg -55～150 ℃ Storage Temperature Range 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter Collector Cut-Off Current 符号 Symbol ICBO 测试条件 Test Conditions VCB=-30 V IE=0 最小值 Min 典型值 Typ 最大值 单位 Max Unit -0.015 μA VCE=-5.0V IC=-2.0mA VCE(sat)(1) IC=-10mA IB=-0.5mA -0.09 -0.3 V VCE(sat)(2) IC=-100mA IB=-5.0mA -0.25 -0.65 V Base to Emitter Saturation Voltage VBE(sat)(1) IC=-10mA IB=-0.5mA -0.7 V VBE(sat)(2) IC=-100mA IB=-5.0mA -0.9 V Base to Emitter Voltage VBE(ON)1 VCE=-5.0V IC=-2.0mA Base to Emitter Voltage VBE(ON)2 VCE=-5.0V IC=-10mA VCE=-5.0V f=100MHz VCB=-10V f=1.0MHz VCE=-6.0V Rg=2KΩ IC=10mA DC Current Gain Collector to Emitter Saturation Voltage Transition Frequency hFE fT Collector Output Capacitance Cob Noise Figure NF http://www.fsbrec.com IE=0 IC=-0.1mA f=1.0KHz 125 -0.6 475 -0.65 -0.75 V -0.82 V 150 MHz 4.5 pF 2.0 10 dB 2/6 BC856 Rev.F Apr.-2017 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 3/6 BC856 Rev.F Apr.-2017 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 BC856 Rev.F Apr.-2017 印章说明 / DATA SHEET Marking Instructions H3A 说明： H： 为公司代码 3A： 为型号代码 Note: H: Company Code. 3A: Product Type Code http://www.fsbrec.com 5/6 BC856 Rev.F Apr.-2017 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Time:10±1 sec / REEL Package Type 封装形式 使用说明 Temp.:260±5℃ / Packaging SPEC. 卷盘包装 SOT-23 时间：10±1 sec. Units 包装数量 Dimension Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 3,000 10 30,000 6 180,000 包装尺寸 3 (unit：mm ) Reel Inner Box 盒 Outer Box 箱 7〞×8 180×120×180 390×385×205 / Notices http://www.fsbrec.com 6/6