OPA355 OPA2355 OPA3355 OPA 355 OPA2 355 OPA 335 5 ® OPA 33 5 5 SBOS195D – MARCH 2001 – REVISED JANUARY 2004 200MHz, CMOS OPERATIONAL AMPLIFIER WITH SHUTDOWN FEATURES DESCRIPTION ● ● ● ● ● The OPA355 series high-speed, voltage-feedback CMOS operational amplifiers are designed for video and other applications requiring wide bandwidth. The OPA355 is unitygain stable and can drive large output currents. In addition, the OPA355 has a digital shutdown (Enable) function. This feature provides power savings during idle periods and places the output in a high-impedance state to support output multiplexing. Differential gain is 0.02% and differential phase is 0.05°. Quiescent current is only 8.3mA per channel. ● ● ● ● ● ● ● ● UNITY-GAIN BANDWIDTH: 450MHz WIDE BANDWIDTH: 200MHz GBW HIGH SLEW RATE: 360V/µs LOW NOISE: 5.8nV/√Hz EXCELLENT VIDEO PERFORMANCE: DIFF GAIN: 0.02%, DIFF PHASE: 0.05° 0.1dB GAIN FLATNESS: 75MHz INPUT RANGE INCLUDES GROUND RAIL-TO-RAIL OUTPUT (within 100mV) LOW INPUT BIAS CURRENT: 3pA LOW SHUTDOWN CURRENT: 3.4µA ENABLE/DISABLE TIME: 100ns/30ns THERMAL SHUTDOWN SINGLE-SUPPLY OPERATING RANGE: 2.5V to 5.5V MicroSIZE PACKAGES APPLICATIONS ● ● ● ● ● ● ● VIDEO PROCESSING ULTRASOUND OPTICAL NETWORKING, TUNABLE LASERS PHOTODIODE TRANSIMPEDANCE AMPS ACTIVE FILTERS HIGH-SPEED INTEGRATORS ANALOG-TO-DIGITAL (A/D) CONVERTER INPUT BUFFERS ● DIGITAL-TO-ANALOG (D/A) CONVERTER OUTPUT AMPLIFIERS ● BARCODE SCANNERS ● COMMUNICATIONS The OPA355 is optimized for operation on single or dual supplies as low as 2.5V (±1.25V) and up to 5.5V (±2.75V). Common-mode input range for the OPA355 extends 100mV below ground and up to 1.5V from V+. The output swing is within 100mV of the rails, supporting wide dynamic range. The OPA355 series is available in single (SOT23-6 and SO-8), dual (MSOP-10), and triple (TSSOP-14 and SO-14) versions. Multichannel versions feature completely independent circuitry for lowest crosstalk and freedom from interaction. All are specified over the extended –40°C to +125°C range. OPA355 RELATED PRODUCTS FEATURES PRODUCT 200MHz, Rail-to-Rail Output, CMOS, No Shutdown 38MHz, Rail-to-Rail Input/Output, CMOS 75MHz, Rail-to-Rail Output 150MHz, Rail-to-Rail Output Differential Input/Output, 3.3V Supply OPA356 OPAx350 OPAx631 OPAx634 THS412x V+ –VIN OPA355 Out +VIN V– Enable Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright © 2001-2004, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage, V+ to V– ................................................................... 7.5V Signal Input Terminals, Voltage(2) .................... (V–) – 0.5V to (V+) + 0.5V Current(2) ..................................................... 10mA Enable Input ...................................................... (V–) – 0.5V to (V+) + 0.5V Output Short-Circuit(3) .............................................................. Continuous Operating Temperature .................................................. –55°C to +150°C Storage Temperature ...................................................... –65°C to +150°C Junction Temperature .................................................................... +160°C Lead Temperature (soldering, 10s) ............................................... +300°C NOTES: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground, one amplifier per package. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PRODUCT OPA355 PACKAGE-LEAD PACKAGE MARKING SOT23-6 C55 " OPA355 " OPA2355 " SO-8 OPA355UA " " MSOP-10 D55 " " TSSOP-14 OPA3355EA " OPA3355 " " OPA3355 " " " SO-14 OPA3355UA " " NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. PIN CONFIGURATIONS Top View OPA355 OPA355 C55 6 V+ V– 2 5 +In 3 4 Out 1 NC(2) 1 8 Enable Enable –In 2 7 V+ –In +In 3 6 Out V– 4 5 NC(2) SOT23-6(1) NOTES: (1) Pin 1 of the SOT23-6 is determined by orienting the package marking as indicated in the diagram. (2) NC indicates no internal connection. SO-8 OPA3355 OPA2355 Out A 1 –In A 2 10 V+ 9 Out B Enable A 1 Enable B 2 Out C 13 –In C C A +In A 14 3 8 –In B Enable C 3 12 +In C V+ 4 11 V– +In A 5 10 +In B B V– 4 7 +In B Enable A 5 6 Enable B A MSOP-10 B –In A 6 9 –In B Out A 7 8 Out B SO-14 TSSOP-14 2 OPA355, 2355, 3355 www.ti.com SBOS195D ELECTRICAL CHARACTERISTICS: VS = +2.7V to +5.5V Single-Supply Boldface limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C, RF = 604Ω, RL = 150Ω, and connected to VS/2, unless otherwise noted. PARAMETER CONDITION OFFSET VOLTAGE Input Offset Voltage VOS vs Temperature vs Power Supply MIN OPA355 OPA2355 OPA3355 TYP ±2 UNITS ±9 ±7 ±80 ±350 mV mV µV/°C µV/V IB 3 ±50 pA IOS ±1 ±50 pA dVOS/dT PSRR VS = +5V Specified Temperature Range Specified Temperature Range VS = +2.7V to +5.5V, VCM = VS/2 – 0.15V MAX ±15 INPUT BIAS CURRENT Input Bias Current Input Offset Current NOISE Input Noise Voltage Density Current Noise Density en f = 1MHz 5.8 in f = 1MHz 50 nV/ √Hz fA/ √Hz INPUT VOLTAGE RANGE Common-Mode Voltage Range VCM Common-Mode Rejection Ratio CMRR (V–) – 0.1 VS = +5.5V, –0.1V < VCM < +4.0V 66 Specified Temperature Range 66 (V+) – 1.5 80 V dB dB INPUT IMPEDANCE Differential 1013 || 1.5 Ω || pF Common-Mode 1013 || 1.5 Ω || pF VS = +5V, 0.3V < VO < 4.7V 84 OPA355 VS = +5V, 0.3V < VO < 4.7V 80 dB OPA2355, OPA3355 VS = +5V, 0.4V < VO < 4.6V 80 dB OPEN-LOOP GAIN 92 dB FREQUENCY RESPONSE Small-Signal Bandwidth f–3dB G = +1, VO = 100mVp-p, RF = 0Ω 450 MHz f–3dB G = +2, VO = 100mVp-p, RL = 50Ω 100 MHz f–3dB G = +2, VO = 100mVp-p, RL = 150Ω 170 MHz f–3dB G = +2, VO = 100mVp-p, RL = 1kΩ 200 MHz Gain-Bandwidth Product GBW G = +10, RL = 1kΩ 200 MHz Bandwidth for 0.1dB Gain Flatness f0.1dB G = +2, VO = 100mVp-p, RF = 560Ω 75 MHz V/µs Slew Rate SR Rise-and-Fall Time Settling Time, 0.1% VS = +5V, G = +2, 4V Output Step 300/–360 G = +2, VO = 200mVp-p, 10% to 90% 2.4 ns G = +2, VO = 2Vp-p, 10% to 90% 8 ns VS = +5V, G = +2, 2V Output Step 30 ns VS = +5V, G = +2, 2V Output Step 120 ns VIN • Gain = VS 8 ns 2nd-Harmonic G = +2, f = 1MHz, VO = 2Vp-p, RL = 200Ω –81 dBc 3rd-Harmonic G = +2, f = 1MHz, VO = 2Vp-p, RL = 200Ω –93 dBc Differential Gain Error NTSC, RL = 150Ω 0.02 % Differential Phase Error NTSC, RL = 150Ω 0.05 degrees OPA2355 f = 5MHz –90 dB OPA3355 f = 5MHz –70 dB 0.01% Overload Recovery Time Harmonic Distortion Channel-to-Channel Crosstalk OUTPUT Voltage Output Swing from Rail VS = +5V, RL = 150Ω, AOL > 84dB 0.2 Voltage Output Swing from Rail VS = +5V, RL = 1kΩ 0.1 V ±60 mA 0.3 V Output Current, Continuous(1) IO Output Current, Peak(1) IO VS = +5V ±100 mA Output Current, Peak(1) IO VS = +3V ±80 mA f < 100kHz 0.02 Ω Closed-Loop Output Impedance POWER SUPPLY Specified Voltage Range 2.7 VS Operating Voltage Range Quiescent Current (per amplifier) 5.5 V 11 mA 14 mA 2.5 to 5.5 IQ VS = +5V, Enabled, IO = 0 Specified Temperature Range 8.3 V NOTES: (1) See typical characteristic Output Voltage Swing vs Output Current. (2) Logic LOW and HIGH levels are CMOS logic compatible. They are referenced to V–. OPA355, 2355, 3355 SBOS195D www.ti.com 3 ELECTRICAL CHARACTERISTICS: VS = +2.7V to +5.5V Single-Supply (Cont.) Boldface limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C, RF = 604Ω, RL = 150Ω, and connected to VS/2, unless otherwise noted. PARAMETER CONDITION MIN OPA355 OPA2355 OPA3355 TYP MAX UNITS 0.8 V SHUTDOWN Disabled (Logic-LOW Threshold)(2) Enabled (Logic-HIGH Threshold)(2) 2 Enable Time V 100 Disable Time ns 30 Shutdown Current (per amplifier) VS = +5V, Disabled 3.4 ns 6 µA THERMAL SHUTDOWN Junction Temperature Shutdown 160 °C Reset from Shutdown 140 °C TEMPERATURE RANGE Specified Range –40 125 °C Operating Range –55 150 °C –65 150 Storage Range Thermal Resistance θJA °C °C/W SOT-23-6, MSOP-10 150 °C/W SO-8 125 °C/W SO-14, TSSOP-14 100 °C/W NOTES: (1) See typical characteristic Output Voltage Swing vs Output Current. (2) Logic LOW and HIGH levels are CMOS logic compatible. They are referenced to V–. 4 OPA355, 2355, 3355 www.ti.com SBOS195D TYPICAL CHARACTERISTICS At TA = +25°C, VS = 5V, G = +2, RF = 604Ω, and RL = 150Ω connected to VS/2, unless otherwise noted. NONINVERTING SMALL-SIGNAL FREQUENCY RESPONSE INVERTING SMALL-SIGNAL FREQUENCY RESPONSE 6 3 VO = 0.1Vp-p 0 Normalized Gain (dB) 3 Normalized Gain (dB) VO = 0.1Vp-p G = +1 RF = 0 0 –3 G = +2 –6 G = +5 –9 G = +10 1M 10M Frequency (Hz) –3 G = –5 –6 G = –10 –9 100M –15 100k 1G NON-INVERTING SMALL-SIGNAL STEP RESPONSE 0.1dB GAIN FLATNESS FOR VARIOUS RF 0.5 4.5 2.5 1.5 Normalized Gain (dB) 3.5 VO = 0.1Vp-p CL = 0pF 0.4 Disable Voltage (V) Output Voltage (500mV/div) 1G Time (20ns/div) LARGE-SIGNAL DISABLE/ENABLE RESPONSE Disabled 100M G = +2 Time (20ns/div) fIN = 5MHz 10M Frequency (Hz) Output Voltage (500mV/div) Output Voltage (50mV/div) 1M NONINVERTING LARGE-SIGNAL STEP RESPONSE G = +2 Enabled G = –2 –12 –12 –15 100k G = –1 RF = 604Ω 0.3 0.2 0.1 0 –0.1 RF = 560Ω –0.2 –0.3 VOUT 0.5 RF = 500Ω –0.4 –0.5 Time (200ns/div) 1 OPA355, 2355, 3355 SBOS195D www.ti.com 10 Frequency (MHz) 100 5 TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = 5V, G = +2, RF = 604Ω, and RL = 150Ω connected to VS/2, unless otherwise noted. HARMONIC DISTORTION vs OUTPUT VOLTAGE HARMONIC DISTORTION vs NONINVERTING GAIN –50 f = 1MHz RL = 200Ω –60 Harmonic Distortion (dBc) Harmonic Distortion (dBc) –50 –70 2nd Harmonic –80 3rd Harmonic –90 –100 VO = 2Vp-p f = 1MHz RL = 200Ω –60 –70 2nd-Harmonic –80 3rd-Harmonic –90 –100 0 1 2 Output Voltage (Vp-p) 3 4 1 10 Gain (V/V) HARMONIC DISTORTION vs INVERTING GAIN HARMONIC DISTORTION vs FREQUENCY –50 VO = 2Vp-p f = 1MHz RL = 200Ω –60 Harmonic Distortion (dBc) Harmonic Distortion (dBc) –50 –70 2nd-Harmonic –80 3rd-Harmonic –90 –100 –80 3rd-Harmonic –90 1M Frequency (Hz) HARMONIC DISTORTION vs LOAD RESISTANCE INPUT VOLTAGE AND CURRENT NOISE SPECTRAL DENSITY vs FREQUENCY VO = 2Vp-p f = 1MHz Harmonic Distortion (dBc) –70 Gain (V/V) –50 –60 –70 –80 2nd-Harmonic –90 3rd-Harmonic –100 100 1k RL (Ω) 6 2nd-Harmonic –100 100k 10 Voltage Noise (nV/√Hz), Current Noise (fA/√Hz) 1 –60 VO = 2Vp-p RL = 200Ω 10M 10k 1k Voltage Noise Current Noise 100 10 1 10 100 1k 10k 100k 1M 10M 100M Frequency (Hz) OPA355, 2355, 3355 www.ti.com SBOS195D TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = 5V, G = +2, RF = 604Ω, and RL = 150Ω connected to VS/2, unless otherwise noted. FREQUENCY RESPONSE FOR VARIOUS RL FREQUENCY RESPONSE FOR VARIOUS CL 3 9 RL = 10kΩ 6 Normalized Gain (dB) Normalized Gain (dB) 0 CL = 0pF VO = 0.1Vp-p –3 RL = 50Ω –6 RL = 150Ω –9 RL = 1kΩ –12 0 –3 CL = 5.6pF –6 –9 1M 10M Frequency (Hz) 100M –15 100k 1G RECOMMENDED RS vs CAPACITIVE LOAD 100 0 Normalized Gain (dB) 3 80 60 VIN RS VO OPA355 40 CL 1kΩ 604Ω 20 10M Frequency (Hz) 100M 1G G = +2 VO = 0.1Vp-p –3 –6 0 CL = 5.6pF RS = 80Ω CL = 100pF RS = 24Ω VIN RS VO OPA355 CL –9 CL = 47pF RS = 36Ω 1kΩ 604Ω –12 (1kΩ is Optional) 604Ω 1M FREQUENCY RESPONSE vs CAPACITIVE LOAD 120 RS (Ω) CL = 47pF 3 –12 –15 100k (1kΩ is Optional) 604Ω –15 1 10 Capacitive Load (pF) 100 1M 10M 100M Frequency (Hz) COMMON-MODE REJECTION RATIO AND POWER-SUPPLY REJECTION RATIO vs FREQUENCY 1G OPEN-LOOP GAIN AND PHASE 180 100 160 90 Open-Loop Phase (degrees) Open-Loop Gain (dB) –PSRR 80 CMRR, PSRR (dB) CL = 100pF RS = 0Ω VO = 0.1Vp-p +PSRR 70 60 CMRR 50 40 30 20 140 120 Phase 100 80 60 Gain 40 20 RL = 1kΩ RL = 150kΩ 0 10 –20 0 10k 100k 1M 10M Frequency (Hz) 100M 1k 1G OPA355, 2355, 3355 SBOS195D www.ti.com 10k 100k 1M 10M Frequency (Hz) 100M 1G 7 TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = 5V, G = +2, RF = 604Ω, and RL = 150Ω connected to VS/2, unless otherwise noted. COMPOSITE VIDEO DIFFERENTIAL GAIN AND PHASE INPUT BIAS CURRENT vs TEMPERATURE 0.40 10n Input Bias Current (pA) dG/dP (%/degrees) 0.35 0.30 0.25 0.20 dP 0.15 0.10 1n 100 10 dG 0.05 0 1 1 2 3 Number of 150Ω Loads 4 –55 –35 OUTPUT VOLTAGE SWING vs OUTPUT CURRENT FOR VS = 3V 85 105 125 135 12 Supply Current (mA) –55°C Output Voltage (V) 25 45 65 Temperature (°C) 14 25°C 2 125°C Continuous currents above 60mA are not recommended. 125°C 1 VS = 5.5V 10 8 6 VS = 2.5V VS = 3V 4 VS = 5V –55°C 25°C 2 0 0 0 30 60 90 Output Current (mA) 120 150 –55 OUTPUT VOLTAGE SWING vs OUTPUT CURRENT FOR VS = 5V –35 –15 5 25 45 65 Temperature (°C) 25°C Shutdown Current (µA) 125°C Continuous currents above 60mA are not recommended. 2 125°C 1 –55°C 25°C 105 125 135 VS = 5.5V 4.0 –55°C 4 3 85 SHUTDOWN CURRENT vs TEMPERATURE 4.5 5 Output Voltage (V) 5 SUPPLY CURRENT vs TEMPERATURE 3 3.5 VS = 5V 3.0 2.5 2.0 1.5 VS = 3V 1.0 VS = 2.5V 0.5 0 0 0 8 –15 50 100 150 Output Current (mA) 200 –55 250 –35 –15 5 25 45 65 Temperature (°C) 85 105 125 135 OPA355, 2355, 3355 www.ti.com SBOS195D TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = 5V, G = +2, RF = 604Ω, and RL = 150Ω connected to VS/2, unless otherwise noted. CLOSED-LOOP OUTPUT IMPEDANCE vs FREQUENCY MAXIMUM OUTPUT VOLTAGE vs FREQUENCY 100 6 10 5 Output Voltage (Vp-p) Output Impedance (Ω) VS = 5.5V 1 OPA355 0.1 ZO 604Ω 0.01 Maximum Output Voltage without Slew-Rate Induced Distortion 4 3 VS = 2.7V 2 1 604Ω 0.001 0 10k 100k 1M 10M Frequency (Hz) 100M 1G 1 10 Frequency (MHz) OPEN-LOOP GAIN vs TEMPERATURE OUTPUT SETTLING TIME TO 0.1% 110 0.2 VO = 2Vp-p RL = 1kΩ 100 Open-Loop Gain (dB) Output Error (%) 0.1 0 –0.1 –0.2 90 RL = 150Ω 80 70 –0.3 60 –0.4 0 5 10 15 20 25 30 Time (ns) 35 40 45 –55 50 –35 –15 5 25 45 65 Temperature (°C) 85 105 125 135 COMMON-MODE REJECTION RATIO AND POWER-SUPPLY REJECTION RATIO vs TEMPERATURE OFFSET VOLTAGE PRODUCTION DISTRIBUTION 100 20 18 Power-Supply Rejection Ratio 90 16 CMRR, PSRR (dB) Percent of Amplifiers (%) 100 14 12 10 8 6 80 Common-Mode Rejection Ratio 70 60 4 2 50 0 –55 –9 –8 –7 –6 –5 –4 –3 –2 –1 0 1 2 3 4 5 6 7 8 9 Offset Voltage (mV) OPA355, 2355, 3355 SBOS195D www.ti.com –35 –15 5 25 45 65 Temperature (°C) 85 105 125 135 9 TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = 5V, G = +2, RF = 604Ω, and RL = 150Ω connected to VS/2, unless otherwise noted. CHANNEL-TO-CHANNEL CROSSTALK Crosstalk, Input-Referred (dB) 0 –20 –40 OPA3355 (triple) –60 –80 OPA2355 (dual) –100 –120 100k 1M 10M 100M Frequency (Hz) APPLICATIONS INFORMATION The OPA355 series is a CMOS, high-speed, voltage-feedback, operational amplifier designed for video and other general-purpose applications. It is available as a single, dual, or triple op amp. The amplifier features a 200MHz gain bandwidth and 360V/µs slew rate, but it is unity-gain stable and can be operated as a +1V/V voltage follower. Its input common-mode voltage range includes ground, allowing the OPA355 to be used in virtually any single-supply application up to a supply voltage of +5.5V. PCB LAYOUT Good high-frequency PC board layout techniques should be employed for the OPA355. Generous use of ground planes, short direct signal traces, and a suitable bypass capacitor located at the V+ pin will assure clean, stable operation. Large areas of copper also provide a means of dissipating heat that is generated within the amplifier in normal operation. Sockets are definitely not recommended for use with any high-speed amplifier. A 10nF ceramic bypass capacitor is the minimum recommended value; adding a 1µF or larger tantalum capacitor in 10 parallel can be beneficial when driving a low-resistance load. Providing adequate bypass capacitance is essential to achieving very low harmonic and intermodulation distortion. OPERATING VOLTAGE The OPA355 is specified over a power-supply range of +2.7V to +5.5V (±1.35V to ±2.75V). However, the supply voltage may range from +2.5V to +5.5V (±1.25V to ±2.75V). Supply voltages higher than 7.5V (absolute maximum) can permanently damage the amplifier. Parameters that vary significantly over supply voltage or temperature are shown in the Typical Characteristics section of this data sheet. ENABLE FUNCTION The OPA355 can be enabled by applying a TTL HIGH voltage level to the Enable pin. Conversely, a TTL LOW voltage level will disable the amplifier, reducing its supply current from 8.3mA to only 3.4µA per amplifier. This pin voltage is referenced to single-supply ground. When using a split-supply, such as ±2.5V, the enable/disable voltage levels will be referenced to V–. Independent Enable pins are available for each channel, providing maximum design flexibility. For portable battery-operated applications, this feature can be used to greatly reduce the average current and thereby extend battery life. OPA355, 2355, 3355 www.ti.com SBOS195D The Enable input can be modeled as a CMOS input gate with a 100kΩ pull-up resistor to V+. Left open, the Enable pin will assume a logic HIGH, and the amplifier will be on. driver. A properly back-terminated 75Ω cable does not appear as capacitance; it presents only a 150Ω resistive load to the OPA355 output. The Enable time is 100ns and the disable time is only 30ns. This allows the OPA355 to be operated as a “gated” amplifier, or to have its output multiplexed onto a common output bus. When disabled, the output assumes a high-impedance state. The OPA355 can be used as an amplifier for RGB graphic signals, which have a voltage of zero at the video black level, by offsetting and AC-coupling the signal, as shown in Figure 1. OUTPUT DRIVE WIDEBAND VIDEO MULTIPLEXING The output stage can supply high short-circuit current (typically over 200mA). Therefore, an on-chip thermal shutdown circuit is provided to protect the OPA355 from dangerously high junction temperatures. At 160°C, the protection circuit will shut down the amplifier. Normal operation will resume when the junction temperature cools to below 140°C. One common application for video speed amplifiers which include an enable pin is to wire multiple amplifier outputs together, then select which one of several possible video inputs to source onto a single line. This simple Wired-OR Video Multiplexer can be easily implemented using the OPA357; see Figure 2. NOTE: it is not recommended to run a continuous DC current in excess of ±60mA. Refer to the Typical Characteristics, Output Voltage Swing vs Output Current. INPUT AND ESD PROTECTION VIDEO The OPA355 output stage is capable of driving a standard back-terminated 75Ω video cable. By back-terminating a transmission line, it does not exhibit a capacitive load to its All OPA355 pins are static protected with internal ESD protection diodes tied to the supplies; see Figure 3. These diodes will provide overdrive protection if the current is externally limited to 10mA by the source or by a resistor. 604Ω +3V + V+ 1µF 10nF 604Ω 220µF 1/3 OPA355 R1 75Ω Red(1) Red 75Ω R2 604Ω V+ 604Ω 220µF 1/3 OPA355 R1 75Ω Green(1) Green 75Ω R2 604Ω V+ 604Ω R1 220µF 1/3 OPA355 Blue(1) 75Ω Blue 75Ω R2 NOTE: (1) Source video signal offset 300mV above ground to accommodate op amp swing-to-ground capability. FIGURE 1. RGB Cable Driver. OPA355, 2355, 3355 SBOS195D www.ti.com 11 +2.5V + 49.9Ω Signal #1 1µF 10nF 1µF 10nF A OPA355 + –2.5V 1kΩ 49.9Ω VOUT 1kΩ 49.9Ω +2.5V + 49.9Ω Signal #2 1µF 10nF 1µF 10nF B OPA355 + –2.5V 1kΩ 1kΩ HCO4 BON Select AON FIGURE 2. Multiplexed Output. +V CC External Pin Internal Circuitry –V CC FIGURE 3. Internal ESD Protection. 12 OPA355, 2355, 3355 www.ti.com SBOS195D PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) OPA2355DGSA/250 ACTIVE VSSOP DGS 10 250 Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR & no Sb/Br) -40 to 125 D55 OPA2355DGSA/250G4 ACTIVE VSSOP DGS 10 250 Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR & no Sb/Br) -40 to 125 D55 OPA3355EA/250 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 3355EA OPA3355EA/250G4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 3355EA OPA3355EA/2K5 ACTIVE TSSOP PW 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 3355EA OPA3355EA/2K5G4 ACTIVE TSSOP PW 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 3355EA OPA3355UA ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA3355UA OPA3355UAG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA3355UA OPA355NA/250 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 C55 OPA355NA/250G4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 C55 OPA355NA/3K ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 C55 OPA355NA/3KG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 C55 OPA355UA ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 355UA OPA355UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 355UA OPA355UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 355UA OPA355UAG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 355UA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Nov-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing OPA2355DGSA/250 VSSOP DGS 10 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA3355EA/250 TSSOP PW 14 250 180.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 OPA3355EA/2K5 TSSOP PW 14 2500 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 OPA355UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Nov-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA2355DGSA/250 VSSOP DGS 10 250 210.0 185.0 35.0 OPA3355EA/250 TSSOP PW 14 250 210.0 185.0 35.0 OPA3355EA/2K5 TSSOP PW 14 2500 367.0 367.0 35.0 OPA355UA/2K5 SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated