NCN7201 2:1 Gigabit Ethernet LAN Switch with Power-down Feature The NCN7201 is an 8−channel, bidirectional Ethernet switch featuring a power shutdown feature with minimal current consumption. The NCN7201 is an upgraded version of the NCN7200, offering improved performance on the data lines while still maintaining backwards compatibility. This switch is compatible with 10/100/1000 Base−T Ethernet standards, providing high bandwidth and low return loss. Three additional lines are provided for status indicator LEDs that switch. ESD protection is built into the switch. This device can be used to route signals between a single Ethernet transceiver and an RJ45 connector and a docking station. The NCN7201 comes in a 42−pin WQFN package (3.5 mm x 9 mm, 0.5 mm pitch). Features • • • • • • • 2:1 Multiplexer/ Demultiplexer LAN Switch Three Additional Channels for LED Switching Fully Specified for Power Supply Range: 3 V to 3.6 V Power−down Feature Conserves Energy Insertion loss of −2.7 dB at 1 GHz ESD Performance: ±8 kV Human Body Model (JEDEC) ±8 kV Contact Discharge (IEC61000−4−2) This is a Pb−Free Device • Signal Routing for 10/100/1000 Mbps Ethernet May, 2013 − Rev. 2 MARKING DIAGRAM NCN7201 AWLYYWWG 1 WQFN42 CASE 510AP A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION Device Package Shipping† NCN7201MTTWG WQFN42 2000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Typical Applications © Semiconductor Components Industries, LLC, 2013 http://onsemi.com 1 Publication Order Number: NCN7201/D NCN7201 Figure 1. Block Diagram TRUTH TABLE PD SEL Function 0 0 AX to BX; LEDAX to LEDBX 0 1 AX to CX; LEDAX to LEDCX 1 X Hi−Z http://onsemi.com 2 NCN7201 PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1, 4, 8, 14, 30, 39 VDD Power Supply Pin. It is recommended that a bypass capacitor of at least 0.1mF is placed as close as possible to each VDD pin. 5 PD Power Down Pin. When PD is logic high, the device enters Power Down mode. All switch paths are high impedance. There is no internal pull−up or pull−down resistor; therefore, this pin cannot be floated. 13 SEL Channel Select Pin. When PD is logic low, the SEL pin controls whether the AX pins are connected to BX or CX. There is no internal pull−up or pull−down resistor; therefore, this pin cannot be floated. 2, 3, 6, 7, 9, 10, 11, 12 AX+, AX* Data Port A. This is the common side of the data switch. 24, 25, 28, 29, 33, 34, 37, 38 BX+, BX* Data Port B. This is a switchable port of the data switch. 22, 23, 26, 27, 31, 32, 35, 36 CX+, CX* Data Port C. This is a switchable port of the data switch. 15, 16, 42 LEDAX LED Port A. This is the common side of the LED switch. 17, 18, 41 LEDBX LED Port B. This is a switchable port of the LED switch. 19, 20, 40 LEDCX LED Port C. This is a switchable port of the LED switch. Exposed Pad on Underside GND Ground Supply. The exposed pad provides ground reference to the device. http://onsemi.com 3 NCN7201 Figure 2. Pin Description (Top View) http://onsemi.com 4 NCN7201 ABSOLUTE MAXIMUM RATINGS (Note 1) Rating Symbol Value Unit Maximum Supply Voltage Range VDD −0.5 to 4.0 V Maximum Analog Signal Voltage Range VIS −0.5 to VDD+0.5 V Maximum Voltage Range on Control Pins VIN −0.5 to 6.0 V Continuous Switch Current IIS 120 mA TJ(max) 150 °C TSTG −65 to 150 °C Pd 0.5 W ESDHBM ESDMM ESDCDM 8000 400 2000 V ILU 150 mA MSL Level 1 Maximum Junction Temperature Storage Temperature Range Power Dissipation ESD Capability (Note 2) Human Body Model Machine Model Charged Device Model Latch−up Current (Note 2) Moisture Sensitivity Level (Note 3) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (JEDEC standard: JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (JEDEC standard: JESD22−A115) ESD Charged Device Model tested per AEC−Q1000−005 (JEDEC standard: JESD22−C101E) Latch−up Current tested per JEDEC standard: JESD78 3. Moisture Sensitivity Level tested per IPC/JEDEC standard: J*STD*020A OPERATING RANGES Symbol Min Max Unit Supply Voltage Rating VDD 3.0 3.6 V Analog Signal Voltage VIS 0 VDD V Control Input Voltage on PD and SEL VIN 0 VDD V Ambient Temperature TA −40 85 °C http://onsemi.com 5 NCN7201 ELECTRICAL CHARACTERISTICS Typical values are referenced to TA = 25°C and VDD = 3.3 V, unless otherwise noted. Min/max values apply from TA = −40°C to 85°C, unless otherwise noted. (Notes 4 and 5) Parameter Test Conditions Symbol Min Typ Max Unit CURRENT CONSUMPTION Quiescent Supply Current VDD = 3.6 V, VIN = 0 V or VDD IDD−Q 380 450 mA Power Down Supply Current VDD = 3.6 V, VPD = VDD IDD−PD 130 160 mA Active Power Supply Current VDD = 3.6 V, VSEL = 0 V or VDD IDD−ACTIVE 1 1.5 mA Power Off Leakage Current VDD = 0 V, VIN = 0 V or VDD IOFF −0.1 0.1 mA High Voltage Input Threshold VDD = 3.2 V to 3.6 V VIH 2 Low Voltage Input Threshold VDD = 3.2 V to 3.6 V VIL Clamp Diode Voltage VDD = 3.6 V, IIN = −18mA VIK −1.4 Control Input Leakage – Logic High VDD = 3.6 V, VSEL = 3.6 V VDD = 3.6 V, VPD = 3.6 V IIN −0.1 −1.2 0.1 1.2 mA Control Input Leakage – Logic Low VDD = 3.6 V, VIN = 0 V IIN −0.1 0.1 mA Control Input Capacitance f = 1 MHz CIN 2.5 RON 2.9 4.2 RON−FLAT 0.1 1.2 W DRON 0.6 0.7 W CONTROL LOGIC (SEL and PD Pins) V 0.8 −0.9 V V pF DATA SWITCH DC CHARACTERISTICS (AX, BX, and CX Pins) On Resistance VDD = 3.0 V, IIS = 40 mA, VIS = 1.5 V VIS = VDD On Resistance Flatness VDD = 3.0 V, IIS = 40 mA, VIS = 0 to 2 V VIS = 2 V to VDD On Resistance Matching VDD = 3.0 V, IIS = 40 mA, VIS = 1.5 V VIS = VDD Switch Off Leakage VDD = 3.6 V, VIS = 0 to 3.6 V ISW_OFF −0.1 0.1 mA Switch On Leakage VDD = 3.6 V, VIS = 0 to 3.6 V ISW_ON −0.1 0.1 mA 6 6 W DATA SWITCH AC CHARACTERISTICS (AX, BX, and CX Pins) On Capacitance f = 1 MHz CON 3.5 pF Off Capacitance f = 1 MHz COFF 2.0 pF DBW 1.1 GHz Differential Bandwidth Differential Insertion Loss f = 250 MHz f = 500 MHz f = 1 GHz DIL −1.0 −0.9 −2.7 dB Differential Return Loss f = 40 MHz f = 100 MHz DRL −24 −16 dB Differential Crosstalk, Adjacent Channel f = 250 MHz f = 500 MHz f = 1 GHz DCTK −46 −39 −30 dB Differential Off Isolation f = 250 MHz f = 500 MHz f = 1 GHz DISO −35 −28 −22 dB 4. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 5. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25°C. 6. Guaranteed by design. http://onsemi.com 6 NCN7201 ELECTRICAL CHARACTERISTICS Typical values are referenced to TA = 25°C and VDD = 3.3 V, unless otherwise noted. Min/max values apply from TA = −40°C to 85°C, unless otherwise noted. (Notes 4 and 5) Parameter Test Conditions Symbol Min Typ Max Unit 25 25 W LED SWITCH DC CHARACTERISTICS (LEDAX, LEDBX, and LEDCX Pins) On Resistance VDD = 3.0 V, IIS = 40 mA, VIS = 1.5 V VIS = VDD RON 17 12 On Resistance Flatness VDD = 3.0 V, IIS = 40 mA, VIS = 0 to VDD RON−FLAT 8.4 W On Resistance Matching VDD = 3.0 V, IIS = 40 mA VIS = 1.5 V VIS = VDD DRON 1.4 1.2 W Switch Off Leakage VDD = 3.6 V, VIS = 0 to 3.6 V ISW_OFF −0.1 0.1 mA Switch On Leakage VDD = 3.6 V, VIS = 0 to 3.6 V ISW_ON −0.1 0.1 mA LED SWITCH AC CHARACTERISTICS (LEDAX, LEDBX, and LEDCX Pins) On Capacitance f = 1 MHz CON 4.5 pF Off Capacitance f = 1 MHz COFF 1.5 pF BW 750 MHz Bandwidth Adjacent Channel Crosstalk f = 250 MHz CTK −29 dB Off Isolation f = 250 MHz ISO −31 dB Propagation Delay (Note 6) tPD 0.25 ns Line Enable Time CL = 10 pF, RL = 50 W tPZH, tPZL 30 ns Line Disable Time CL = 10 pF, RL = 50 W tPHZ, tPLZ 6 ns Bit−to−Bit Skew CL = 10 pF, RL = 50 W tB−B 0.1 ns Channel−to−Channel Skew CL = 10 pF, RL = 50 W tCH−CH 0.1 ns DATA SWITCH TIMING CHARACTERISTICS 4. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 5. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25°C. 6. Guaranteed by design. http://onsemi.com 7 NCN7201 5 20 4.5 18 4 16 ON RESISTANCE (W) ON RESISTANCE (W) TYPICAL OPERATING CHARACTERISTICS 3.5 3 2.5 2 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 10 8 6 4 0 3 0 0.5 1 1.5 2 2.5 3 SIGNAL VOLTAGE (V) SIGNAL VOLTAGE (V) Figure 3. Data Path On Resistance at VCC = 3 V Figure 4. LED Path On Resistance at VCC = 3 V 0 −1 −5 −2 −3 MAGNITUDE (dB) MAGNITUDE (dB) 12 2 0 −4 −5 −6 −7 −8 −10 −15 −20 −25 −30 −9 −10 1.E+07 1.E+08 −35 1.E+07 1.E+09 1.E+08 FREQUENCY (Hz) FREQUENCY (Hz) Figure 5. Data Switch Differential Insertion Loss Figure 6. Data Switch Return Loss 0 0 −10 −10 −20 MAGNITUDE (dB) MAGNITUDE (dB) 14 −30 −40 −50 −60 1.E+09 −20 −30 −40 −50 −60 −70 −80 1.E+07 1.E+08 −70 1.E+07 1.E+09 1.E+08 1.E+09 FREQUENCY (Hz) FREQUENCY (Hz) Figure 7. Data Switch Differential Crosstalk on Adjacent Channels Figure 8. Data Switch Differential Off Isolation http://onsemi.com 8 NCN7201 PARAMETER MEASUREMENT INFORMATION Figure 9. Differential Insertion Loss and Return Loss Figure 10. Differential Off Isolation tB−B = |tPHL−tPLH| tCH−CH = |tPHL1−tPHL2| or |tPLH1−tPLH2| Figure 11. Differential Crosstalk Figure 12. Bit−to−Bit and Channel−to−Channel Skew Figure 13. Line Enable and Disable Times Figure 14. Off State Leakage Figure 15. On State Leakage http://onsemi.com 9 NCN7201 PACKAGE DIMENSIONS WQFN42 3.5x9, 0.5P CASE 510AP ISSUE O PIN ONE REFERENCE ÇÇ ÇÇ ÇÇ ÇÇ ÇÇ L L L1 DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS 0.15 C 0.15 C MOLD CMPD DETAIL B TOP VIEW ALTERNATE CONSTRUCTION A 0.10 C A3 DETAIL B A1 SIDE VIEW C SEATING PLANE 17 42X 9.30 42X 0.63 0.10 C A B D2 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.20 0.30 3.50 BSC 1.95 2.15 9.00 BSC 7.45 7.65 0.50 BSC 0.20 −−− 0.30 0.50 0.00 0.15 RECOMMENDED MOUNTING FOOTPRINT* 0.08 C DETAIL A DIM A A1 A3 b D D2 E E2 e K L L1 ÉÉ ÉÉ EXPOSED Cu NOTE 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D 0.50 PITCH 3.80 2.16 K 22 1 42X L 0.35 PACKAGE OUTLINE DIMENSIONS: MILLIMETERS 42X b 0.10 C A B 0.05 C *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. E2 NOTE 3 1 38 0.10 C A B e e/2 BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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