PD - 95335D
IRF7413ZPbF
HEXFET® Power MOSFET
Applications
l Control FET for Notebook Processor
Power
l Control and Synchronous Rectifier
MOSFET for Graphics Cards and POL
Converters in Computing, Networking
and Telecommunication Systems
Benefits
l Ultra-Low Gate Impedance
l Very Low RDS(on)
l Fully Characterized Avalanche Voltage
and Current
l 100% Tested for RG
l Lead-Free
VDSS
RDS(on) max
ID
30V
10m @VGS = 10V
13A
:
A
A
D
S
1
8
S
2
7
D
S
3
6
D
G
4
5
D
SO-8
Top View
Absolute Maximum Ratings
Max.
Units
VDS
Drain-to-Source Voltage
Parameter
30
V
VGS
Gate-to-Source Voltage
± 20
ID @ TA = 25°C
Continuous Drain Current, VGS @ 10V
13
ID @ TA = 70°C
Continuous Drain Current, VGS @ 10V
10
IDM
Pulsed Drain Current
100
PD @TA = 25°C
Power Dissipation
PD @TA = 70°C
Power Dissipation
TJ
Linear Derating Factor
Operating Junction and
TSTG
Storage Temperature Range
c
A
W
2.5
1.6
W/°C
°C
0.02
-55 to + 150
Thermal Resistance
Parameter
RθJL
RθJA
Junction-to-Drain Lead
Junction-to-Ambient
f
Typ.
Max.
Units
–––
20
°C/W
–––
50
Notes through are on page 10
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1
05/08/08
IRF7413ZPbF
Static @ TJ = 25°C (unless otherwise specified)
Parameter
BVDSS
∆ΒVDSS/∆TJ
Min. Typ. Max. Units
30
–––
–––
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
–––
–––
0.025
8.0
–––
10
V/°C Reference to 25°C, ID = 1mA
mΩ VGS = 10V, ID = 13A
Gate Threshold Voltage
–––
1.35
10.5
1.80
13
2.25
VGS = 4.5V, ID = 10A
VDS = VGS, ID = 25µA
IDSS
Gate Threshold Voltage Coefficient
Drain-to-Source Leakage Current
–––
–––
-5.0
–––
–––
1.0
IGSS
Gate-to-Source Forward Leakage
–––
–––
–––
–––
150
100
nA
Gate-to-Source Reverse Leakage
Forward Transconductance
–––
62
–––
–––
-100
–––
S
Total Gate Charge
Pre-Vth Gate-to-Source Charge
–––
–––
9.5
3.0
14
–––
Post-Vth Gate-to-Source Charge
Gate-to-Drain Charge
–––
–––
1.0
3.0
–––
–––
Qgodr
Qsw
Gate Charge Overdrive
Switch Charge (Qgs2 + Qgd)
–––
–––
2.5
4.0
–––
–––
Qoss
Output Charge
–––
5.6
–––
nC
RG
td(on)
tr
Gate Resistance
Turn-On Delay Time
Rise Time
–––
–––
–––
2.3
8.7
6.3
4.5
–––
–––
Ω
td(off)
tf
Turn-Off Delay Time
Fall Time
–––
–––
11
3.8
–––
–––
ns
Clamped Inductive Load
Ciss
Coss
Input Capacitance
Output Capacitance
–––
–––
1210
270
–––
–––
pF
VGS = 0V
VDS = 15V
Crss
Reverse Transfer Capacitance
–––
140
–––
RDS(on)
VGS(th)
∆VGS(th)/∆TJ
gfs
Qg
Qgs1
Qgs2
Qgd
V
Conditions
Drain-to-Source Breakdown Voltage
V
VGS = 0V, ID = 250µA
e
e
mV/°C
µA VDS = 24V, VGS = 0V
VDS = 24V, VGS = 0V, TJ = 125°C
VGS = 20V
VGS = -20V
VDS = 15V, ID = 10A
VDS = 15V
nC
VGS = 4.5V
ID = 10A
See Fig. 16
VDS = 15V, VGS = 0V
VDD = 16V, VGS = 4.5V
ID = 10A
ƒ = 1.0MHz
Avalanche Characteristics
EAS
Parameter
Single Pulse Avalanche Energy
IAR
Avalanche Current
c
d
Typ.
–––
Max.
32
Units
mJ
–––
10
A
Diode Characteristics
Parameter
Min. Typ. Max. Units
Conditions
IS
Continuous Source Current
–––
–––
3.1
ISM
(Body Diode)
Pulsed Source Current
–––
–––
100
VSD
(Body Diode)
Diode Forward Voltage
–––
–––
1.0
V
p-n junction diode.
TJ = 25°C, IS = 10A, VGS = 0V
trr
Qrr
Reverse Recovery Time
Reverse Recovery Charge
–––
–––
24
16
36
24
ns
nC
TJ = 25°C, IF = 10A, VDD = 15V
di/dt = 100A/µs
ton
Forward Turn-On Time
2
c
MOSFET symbol
A
showing the
integral reverse
e
e
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
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IRF7413ZPbF
1000
1000
100
BOTTOM
VGS
10V
8.0V
4.5V
4.0V
3.5V
3.0V
2.8V
2.5V
TOP
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
TOP
VGS
10V
8.0V
4.5V
4.0V
3.5V
3.0V
2.8V
2.5V
10
2.5V
1
100
BOTTOM
10
2.5V
20µs PULSE WIDTH
Tj = 150°C
20µs PULSE WIDTH
Tj = 25°C
1
0.1
0.1
1
0.1
10
10
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
1000
2.0
100
T J = 150°C
10
T J = 25°C
VDS = 10V
20µs PULSE WIDTH
1
ID = 13A
VGS = 10V
1.5
(Normalized)
RDS(on) , Drain-to-Source On Resistance
ID, Drain-to-Source Current (Α)
1
VDS, Drain-to-Source Voltage (V)
VDS, Drain-to-Source Voltage (V)
1.0
0.5
2
3
4
5
VGS, Gate-to-Source Voltage (V)
Fig 3. Typical Transfer Characteristics
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6
-60 -40 -20
0
20
40
60
80 100 120 140 160
T J , Junction Temperature (°C)
Fig 4. Normalized On-Resistance
vs. Temperature
3
IRF7413ZPbF
10000
12.0
VGS = 0V,
f = 1 MHZ
C iss = C gs + C gd, C ds SHORTED
C rss = C gd
VGS , Gate-to-Source Voltage (V)
ID= 10A
C, Capacitance(pF)
C oss = C ds + C gd
Ciss
1000
Coss
Crss
VDS= 24V
VDS= 15V
10.0
8.0
6.0
4.0
2.0
0.0
100
1
10
100
0
VDS, Drain-to-Source Voltage (V)
12
16
1000
ID, Drain-to-Source Current (A)
1000.00
ISD, Reverse Drain Current (A)
8
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 5. Typical Capacitance vs.
Drain-to-Source Voltage
100.00
OPERATION IN THIS AREA
LIMITED BY R DS(on)
100
T J = 150°C
10.00
T J = 25°C
1.00
VGS = 0V
0.10
0.2
0.4
0.6
0.8
1.0
1.2
VSD, Source-to-Drain Voltage (V)
Fig 7. Typical Source-Drain Diode
Forward Voltage
4
4
Q G Total Gate Charge (nC)
1.4
10
100µsec
1msec
1
T A = 25°C
10msec
Tj = 150°C
Single Pulse
0.1
0
1
10
100
1000
VDS, Drain-to-Source Voltage (V)
Fig 8. Maximum Safe Operating Area
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IRF7413ZPbF
14
VGS(th) Gate threshold Voltage (V)
2.5
ID, Drain Current (A)
12
10
8
6
4
2
2.0
ID = 250µA
1.5
1.0
0.5
0
25
50
75
100
125
-75
150
-50
-25
0
25
50
75
100
125
150
T J , Temperature ( °C )
T A , Ambient Temperature (°C)
Fig 9. Maximum Drain Current vs.
Ambient Temperature
Fig 10. Threshold Voltage vs. Temperature
100
Thermal Response ( Z thJA )
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
τJ
0.1
R1
R1
τJ
τ1
R2
R2
R3
R3
R4
R4
τC
τ
τ2
τ1
τ3
τ2
τ3
τ4
τ4
Ci= τi/Ri
Ci i/Ri
τi (sec)
1.8556
0.000337
2.4927
0.012752
25.570
0.691000
20.340
21.90000
P DM
SINGLE PULSE
( THERMAL RESPONSE )
0.01
Ri (°C/W)
t1
t2
Notes:
1. Duty factor D =
t1/ t 2
2. Peak T
J = P DM x Z thJA
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
+T A
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
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5
IRF7413ZPbF
D.U.T
RG
VGS
20V
DRIVER
L
VDS
+
V
- DD
IAS
A
0.01Ω
tp
Fig 12a. Unclamped Inductive Test Circuit
V(BR)DSS
tp
EAS , Single Pulse Avalanche Energy (mJ)
140
15V
ID
TOP
120
BOTTOM
3.1A
3.9A
10A
100
80
60
40
20
0
25
50
75
100
125
150
Starting T J , Junction Temperature (°C)
Fig 12c. Maximum Avalanche Energy
vs. Drain Current
LD
I AS
VDS
Fig 12b. Unclamped Inductive Waveforms
+
VDD D.U.T
Current Regulator
Same Type as D.U.T.
VGS
Pulse Width < 1µs
Duty Factor < 0.1%
50KΩ
12V
.2µF
Fig 14a. Switching Time Test Circuit
.3µF
D.U.T.
+
V
- DS
VDS
90%
VGS
3mA
10%
IG
ID
VGS
Current Sampling Resistors
td(on)
Fig 13. Gate Charge Test Circuit
6
tr
td(off)
tf
Fig 14b. Switching Time Waveforms
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IRF7413ZPbF
D.U.T
Driver Gate Drive
+
-
-
*
D.U.T. ISD Waveform
Reverse
Recovery
Current
+
RG
•
•
•
•
dv/dt controlled by RG
Driver same type as D.U.T.
I SD controlled by Duty Factor "D"
D.U.T. - Device Under Test
V DD
P.W.
Period
VGS=10V
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
D=
Period
P.W.
+
+
-
Body Diode Forward
Current
di/dt
D.U.T. VDS Waveform
Diode Recovery
dv/dt
Re-Applied
Voltage
Body Diode
VDD
Forward Drop
Inductor Curent
ISD
Ripple ≤ 5%
* VGS = 5V for Logic Level Devices
Fig 15. Peak Diode Recovery dv/dt Test Circuit for N-Channel
HEXFET® Power MOSFETs
Id
Vds
Vgs
Vgs(th)
Qgs1 Qgs2
Qgd
Qgodr
Fig 16. Gate Charge Waveform
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7
IRF7413ZPbF
Power MOSFET Selection for Non-Isolated DC/DC Converters
Control FET
Synchronous FET
Special attention has been given to the power losses
in the switching elements of the circuit - Q1 and Q2.
Power losses in the high side switch Q1, also called
the Control FET, are impacted by the Rds(on) of the
MOSFET, but these conduction losses are only about
one half of the total losses.
The power loss equation for Q2 is approximated
by;
*
Ploss = Pconduction + Pdrive + Poutput
(
2
Ploss = Irms × Rds(on)
)
Power losses in the control switch Q1 are given
by;
+ (Qg × Vg × f )
Ploss = Pconduction+ Pswitching+ Pdrive+ Poutput
⎛Q
⎞
+ ⎜ oss × Vin × f + (Qrr × Vin × f )
⎝ 2
⎠
This can be expanded and approximated by;
Ploss = (Irms 2 × Rds(on ) )
⎛
Qgs 2
Qgd
⎞ ⎛
⎞
+⎜I ×
× Vin × f ⎟ + ⎜ I ×
× Vin × f ⎟
ig
ig
⎝
⎠ ⎝
⎠
+ (Qg × Vg × f )
+
⎛ Qoss
× Vin × f ⎞
⎝ 2
⎠
This simplified loss equation includes the terms Qgs2
and Qoss which are new to Power MOSFET data sheets.
Qgs2 is a sub element of traditional gate-source
charge that is included in all MOSFET data sheets.
The importance of splitting this gate-source charge
into two sub elements, Qgs1 and Qgs2, can be seen from
Fig 16.
Qgs2 indicates the charge that must be supplied by
the gate driver between the time that the threshold
voltage has been reached and the time the drain current rises to Idmax at which time the drain voltage begins to change. Minimizing Qgs2 is a critical factor in
reducing switching losses in Q1.
Qoss is the charge that must be supplied to the output capacitance of the MOSFET during every switching cycle. Figure A shows how Qoss is formed by the
parallel combination of the voltage dependant (nonlinear) capacitances Cds and Cdg when multiplied by
the power supply input buss voltage.
8
*dissipated primarily in Q1.
For the synchronous MOSFET Q2, Rds(on) is an important characteristic; however, once again the importance of gate charge must not be overlooked since
it impacts three critical areas. Under light load the
MOSFET must still be turned on and off by the control IC so the gate drive losses become much more
significant. Secondly, the output charge Qoss and reverse recovery charge Qrr both generate losses that
are transfered to Q1 and increase the dissipation in
that device. Thirdly, gate charge will impact the
MOSFETs’ susceptibility to Cdv/dt turn on.
The drain of Q2 is connected to the switching node
of the converter and therefore sees transitions between ground and Vin. As Q1 turns on and off there is
a rate of change of drain voltage dV/dt which is capacitively coupled to the gate of Q2 and can induce
a voltage spike on the gate that is sufficient to turn
the MOSFET on, resulting in shoot-through current .
The ratio of Qgd/Qgs1 must be minimized to reduce the
potential for Cdv/dt turn on.
Figure A: Qoss Characteristic
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IRF7413ZPbF
SO-8 Package Details
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Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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9
IRF7413ZPbF
SO-8 Tape and Reel
Dimensions are shown in millimeters (inches)
TERMINAL NUMBER 1
12.3 ( .484 )
11.7 ( .461 )
8.1 ( .318 )
7.9 ( .312 )
FEED DIRECTION
NOTES:
1. CONTROLLING DIMENSION : MILLIMETER.
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.
330.00
(12.992)
MAX.
14.40 ( .566 )
12.40 ( .488 )
NOTES :
1. CONTROLLING DIMENSION : MILLIMETER.
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.
Notes:
Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 0.62mH, RG = 25Ω, IAS = 10A.
Pulse width ≤ 400µs; duty cycle ≤ 2%.
When mounted on 1 inch square copper board.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
Data and specifications subject to change without notice.
This product has been designed and qualified for the Consumer market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information. 05/2008
10
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