Rohm BU2363FV Clock generator for audio/video equipment Datasheet

Datasheet
Clock Generator
for Audio/Video Equipment
BU2363FV
General Description
Key Specifications
BU2363FV is a clock generator IC capable of
generating three types of clocks - VIDEO, AUDIO and
SYSTEM clocks that are necessary for DVD player
systems. It is a single chip solution that uses PLL
technology. Particularly, the VIDEO clock is a
DVD-Audio reference and yet achieves high C/N
characteristics necessary to provide high definition
images.
Part Name
BU2363FV
Supply Voltage Range [V]
3.0 to 3.6
Reference Frequency [MHz]
36.8640
DVD VIDEO
Output
Frequency
[MHz]
Features
 Connecting a crystal oscillator generates multiple
clock signals from a built-in PLL circuit.
 The AUDIO clock provides switching selection outputs
 The VIDEO clock achieves high C/N characteristics.
 Single power supply of 3.3 V
DVD / CD
AUDIO
(Switching
Outputs)
54.0000
1
768fs
27.0000
36.8640
33.8688
18.4320
16.9344
33.8688
384fs
16.9344
768fs
384fs
SYSTEM
Applications
2
Jitter 1σ [psec]
50
C/N [dB]
-80
(VIDEO)
Operating Temperature Range [°C]
-10 to +70
DVD players
Package
W(Typ) x D(Typ) x H(Max)
SSOP-B16
5.00mm x 6.40mm x 1.35mm
Typical Application Circuit
1:VDD2
16:OE
OPEN:Enable
L
:Disable
2:VSS2
15:CLK33M
33.8688MHz
14:FSEL
OPEN:48.0kHz type
L
:44.1kHz type
16.9344MHz
0.1uF
0.1µF
3:CLK254M
27.0000MHz
4:CLK27M
5:AVDD
0.1uF
0.1µF
6:AVSS
BU2363FV
54.0000MHz
13:CLK16M
12:DVDD
0.1uF
0.1µF
11:DVSS
7:XTALIN
10:768FS1
8:XTALOUT
9:384FS2
36.8640MHz
or 33.8688MHz
18.4320MHz
or 16.9344MHz
(Note) We believe that this circuit is to be recommended. However, to use it, make further thorough check for the characteristics.
○Product structure：Silicon monolithic integrated circuit
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○This product has no designed protection against radioactive rays
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BU2363FV
Pin Configuration
TOP VIEW
1:VDD2
16:OE
2:VSS2
15:CLK33M
4:CLK27M
5:AVDD
6:AVSS
BU2363FV
3:CLK254M
14:FSEL
13:CLK16M
12:DVDD
11:DVSS
7:XTALIN
10:768FS1
8:XTALOUT
9:384FS2
FSEL
L
OPEN
CLK768FS
33.8688MHz
36.8640MHz
CLK384FS
16.9344MHz
18.4320MHz
Pin Descriptions
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
Pin Name
VDD2
VSS2
CLK54M
CLK27M
AVDD
AVSS
XTALIN
XTALOUT
384FS2
768FS1
DVSS
DVDD
CLK16M
14
FSEL
15
16
CLK33M
OE
Pin Function
27MHz, 54MHz power supply
27MHz, 54MHzGND
54.0000MHz output
27.0000MHz output
Analog power supply
Analog GND
Crystal input terminal
Crystal output terminal
FSEL=OPEN:18.4320MHz, FSEL=L:16.9344MHz
FSEL=OPEN:36.8640MHz, FSEL=L:33.8688MHz
Digital GND
Digital power supply
16.9344MHz output
PIN 9, 10 output selection(with pull-up)
OPEN:18.4320MHz(PIN 9), 36.8640MHz(PIN 10)
L:16.9344MHz(PIN 9), 33.8688MHz(PIN 10)
33.8688MHz output
Output enable (with pull-up), OPEN: enable, L: disable
(Note) Basically, mount ICs to the printed circuit board for use. (If the ICs are not mounted to the printed circuit board, the characteristics of ICs may not be fully
demonstrated.)
Mount 0.1µF capacitors in the vicinity of the IC PINs between PIN 1 (VDD2) and PIN 2 (VSS2), PIN 5 (AVDD) and PIN 6 (AVSS), PIN 11 (DVSS) and PIN 12
(DVDD), respectively.
Depending on the conditions of the printed circuit board, mount an additional electrolytic capacitor between the power supply and GND terminal.
For EMI protection, it is effective to put ferrite beads in the origin of power to be supplied to the BU2363FV from the board or to insert a capacitor (of not more
than 1), which bypasses high frequency desired, between the power supply and the GND.
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BU2363FV
Block Diagram
1/4
3:CLK54M
(54.0000MHz)
MULTI-PLL
Technology
1/8
4:CLK27M
(27.0000MHz)
PLL2
1/4
15:CLK33M
(33.8688MHz)
1/8
13:CLK16M
(16.9344MHz)
XTALIN=36.8640MHz
7:XTALIN
XTAL
OSC
8:XTALOUT
10:768FS1
(FSEL=OPEN:36.8640MHz
FSEL=L
:33.8688MHz)
1/2
9:384FS2
(FSEL=OPEN:18.4320MHz
FSEL=L
:16.9344MHz)
16:OE
14:FSEL
(FSEL=OPEN:48.0kHz type
FSEL=L
:44.1kHz type)
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
VDD
-0.5 to ＋7.0
V
Input Voltage
VIN
-0.5 to VDD＋0.5
V
Storage Temperature Range
Tstg
-30 to ＋125
°C
Pd
0.45 (Note 1)
W
Supply Voltage
Power Dissipation
(Note 1) In the case of exceeding at Ta = 25°C, 4.5mW should be reduced per 1°C
(Note) Operating is not guaranteed.
(Note) Power dissipation is measured when the IC is mounted to the printed circuit board.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Limit
Unit
Supply Voltage
VDD
3.0 to 3.6
V
Input H Voltage
VIH
0.8VDD to VDD
V
Input L Voltage
VIL
0.0 to 0.2VDD
V
Operating Temperature
Topr
-10 to ＋70
°C
Maximum Output Load
CL
15
pF
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BU2363FV
Electrical Characteristics
(VDD=3.3V, Ta=25°C, Crystal frequency 36.8640MHz, unless otherwise specified.)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Output L Voltage
VOL
－
－
0.4
V
IOL=4.0mA
Output H Voltage
VOH
2.4
－
－
V
IOH=-4.0mA
IDD
－
30
50
mA
At no load
CLK54M
CLK54M
－
54.0000
－
MHz
XTAL x 375 / 64 / 4
CLK27M
CLK27M
－
27.0000
－
MHz
XTAL x 375 / 64 / 8
CLK33M
CLK33M
－
33.8688
－
MHz
XTAL x 147 / 40 / 4
CLK16M
CLK16M
－
16.9344
－
MHz
CLK768_H
－
36.8640
－
MHz
CLK768_L
－
33.8688
－
MHz
CLK384_H
－
18.4320
－
MHz
CLK384_L
－
16.9344
－
MHz
XTAL x 147 / 40 / 8
At FSEL=OPEN,
XTAL output
At FSEL=L,
XTAL x 147 / 40 / 4
At FSEL=OPEN,
XTAL / 2 output
At FSEL=L,
XTAL x 147 / 40 / 8
Duty
45
50
55
%
P-J 1σ
－
50
－
psec
(Note 1)
P-J
MIN-MAX
－
300
－
psec
(Note 2)
Rise Time
tR
－
2.5
－
nsec
Fall Time
tF
－
2.5
－
nsec
tLOCK
－
－
1
msec
(Note 3)
C/N 54M
-65
-80
－
dB
(Note 4)
(At a maximum load)
-60
－
dB
(Note 4)
(At a maximum load)
Consumption Current
CLK768FS1
CLK384FS2
Duty
Period-Jitter 1σ
Period-Jitter
MIN-MAX
Output Lock-Time
C/N 54M
C/N 33M
C/N 33M
-50
Measured at a voltage of 1/2 VDD
Period of transition time required for
the clock output to reach 80% from
20% of VDD
Period of transition time required for
the clock output to reach 20% from
80% of VDD
(Note) The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to XTALIN.
If the input frequency is set to 36.8640MHz, the output frequency will be as listed above.
(Note 1) Period-Jitter 1σ
This parameter represents standard deviation (1 ) on cycle distribution data at the time when the output clock cycles are sampled 1000 times
consecutively with the TDS7104 Digital Phosphor Oscilloscope of Tektronix Japan, Ltd.
(Note 2) Period-Jitter MIN-MAX
This parameter represents a maximum distribution width on cycle distribution data at the time when the output clock cycles are sampled 1000 times
consecutively with the TDS7104 Digital Phosphor Oscilloscope of Tektronix Japan, Ltd.
(Note 3) Output Lock-Time
The Lock-Time represents elapsed time after power supply turns ON to reach a 3.0V voltage, after the system is switched from Power-Down state to
normal operation state, or after the output frequency is switched, until it is stabilized at a specified frequency, respectively.
(Note 4) Make measurements with settings of SPAN to 100kHz, RBW to 1kHz, and VBW to 100Hz taking the middle point between (54.0000MHz±20kHz) and
(33.8688MHz±20kHz) as a measurement point.
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Typical Performance Curves
1.0V/div
1.0V/div
(Basic Data)
500psec/div
3.0nsec/div
Figure 1. 54MHz Output Waveform
(VDD=3.3V, at CL=15pF)
Figure 2. 54MHz Period-Jitter
(VDD=3.3V, at CL=15pF)
10dB/div
1.0V/div
RBW=1KHz
VBW=100Hz
10KHz/div
5.0nsec/div
Figure 3. 54MHz Spectrum
(VDD=3.3V, at CL=15pF)
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Figure 4. 27MHz Output Waveform
(VDD=3.3V, at CL=15pF)
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BU2363FV
Typical Performance Curves – continued
10dB/div
1.0V/div
RBW=1KHz
VBW=100Hz
500psec/div
10KHz/div
Figure 5. 27MHz Period-Jitter
(VDD=3.3V, at CL=15pF)
1.0V/div
1.0V/div
Figure 6. 27MHz Spectrum
(VDD=3.3V, at CL=15pF)
500psec/div
5.0nsec/div
Figure 7. 33.9MHz Output Waveform
(VDD=3.3V, at CL=15pF)
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Figure 8. 33.9MHz Period-Jitter
(VDD=3.3V, at CL=15pF)
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BU2363FV
Typical Performance Curves – continued
10dB／div
1.0V/div
RBW=1KHz
VBW=100Hz
10KHz/div
10.0nsec/div
Figure 10. 16.9MHz Output Waveform
(VDD=3.3V, at CL=15pF)
Figure 9. 33.9MHz Spectrum
(VDD=3.3V, at CL=15pF)
10dB/div
1.0V/div
RBW=1KHz
VBW=100Hz
10KHz/div
500psec/div
Figure 12. 16.9MHz Spectrum
(VDD=3.3V, at CL=15pF)
Figure 11. 16.9MHz Period-Jitter
(VDD=3.3V, at CL=15pF)
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1.0V/div
1.0V/div
Typical Performance Curves – continued
5.0nsec/div
500psec/div
Figure 13. 36.9MHz Output Waveform
(VDD=3.3V, at CL=15pF)
Figure 14. 36.9MHz Period-Jitter
(VDD=3.3V, at CL=15pF)
10dB/div
1.0V/div
RBW=1KHz
VBW=100Hz
10KHz/div
10.0nsec/div
Figure 15. 36.9MHz Spectrum
(VDD=3.3V, at CL=15pF)
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Figure 16. 18.4MHz Output Waveform
(VDD=3.3V, at CL=15pF)
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BU2363FV
Typical Performance Curves – continued
10dB/div
1.0V/div
RBW=1KHz
VBW=100Hz
500psec／div
10KHz／div
Figure 18. 18.4MHz Spectrum
(VDD=3.3V, at CL=15pF)
Figure 17. 18.4MHz Period-Jitter
(VDD=3.3V, at CL=15pF)
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Typical Performance Curves – continued
(Temperature and Supply Voltage Variations Data)
55
100
VDD=3.7V
VDD=3.3V
VDD=2.9V
53
Duty：: Duty[%]
Duty [%]
Duty
P erio
J-1 σ[psec]
d-ji tte r11σσ：:PPJ-1σ
Period-Jitter
[psec]
54
52
51
50
49
48
47
46
45
90
80
VDD=3.7V
VDD=3.3V
VDD=2.9V
70
60
50
40
30
20
10
0
-25
0
25
50
75
100
-25
0
Temperature
: Ta [°C]
Temperature：T[℃]
50
75
100
Temperature : Ta [°C]
Temperature：T[℃]
Figure 20. Period-Jitter 1σ vs Temperature
(54MHz)
Figure 19. Duty vs Temperature
(54MHz)
55
600
54
500
53
VDD=2.9V
VDD=3.3V
VDD=3.7V
400
Duty
Duty：:Duty[%]
Duty [%]
：
P erio d-ji tte rMIN-MA X
Period-Jitter MIN-MAX
: PJ-MIN-MAX
P J-MIN-MA
X [p sec] [psec]
25
300
200
VDD=3.7V
VDD=3.3V
VDD=2.9V
52
51
50
49
48
47
100
46
45
0
-25
0
25
50
75
-25
100
25
50
75
100
Temperature : Ta [°C]
Temperature：T[℃]
Temperature : Ta [°C]
Temperature：T[℃]
Figure 22. Duty vs Temperature
(27MHz)
Figure 21. Period-Jitter MIN-MAX vs Temperature
(54MHz)
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：
P erio d-ji tte rMIN-MA X
Period-JitterPMIN-MAX
: PJ-MIN-MAX
[psec]
J-MIN-MA
X [p sec]
Typical Performance Curves – continued
P erio
J-1 σ[psec]
d-ji tte r11σ
σ： P
Period-Jitter
: PJ-1σ
[psec]
100
90
80
VDD=3.3V
VDD=2.9V
VDD=3.7V
70
60
50
40
30
20
10
0
-25
0
25
75
500
VDD=2.9V
VDD=3.3V
VDD=3.7V
400
300
200
100
0
100
-25
0
25
50
75
100
Temperature : Ta [°C]
Temperature：T[℃]
Temperature : Ta [°C]
Temperature：T[℃]
Figure 23. Period-Jitter 1σ vs Temperature
(27MHz)
Figure 24. Period-Jitter MIN-MAX vs Temperature
(27MHz)
100
54
90
： PJ-1σ
PPeriod-Jitter
erio d-ji tte r1
J-1 σ[psec]
1σσ: P
[psec]
55
53
Duty：:Duty[%
Duty [%] ]
Duty
50
600
VDD=3.7V
VDD=3.3V
VDD=2.9V
52
51
50
49
48
47
46
80
VDD=3.3V
VDD=3.7V
VDD=2.9V
70
60
50
40
30
20
10
0
45
-25
0
25
50
75
-25
100
25
50
75
100
Temperature : Ta [°C]
Temperature：T[℃]
Temperature : Ta [°C]
Temperature：T[℃]
Figure 26. Period-Jitter 1σ vs Temperature
(33.9MHz)
Figure 25. Duty vs Temperature
(33.9MHz)
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600
55
54
500
53
VDD=3.7V
VDD=3.3V
VDD=2.9V
400
Duty： :Duty[%]
Duty [%]
Duty
：
P erio d-ji tte rMIN-MA X
Period-JitterPMIN-MAX
: PJ-MIN-MAX
[psec]
J-MIN-MA
X [p sec]
Typical Performance Curves – continued
300
200
VDD=3.7V
VDD=3.3V
VDD=2.9V
52
51
50
49
48
47
100
46
0
45
-25
0
25
50
75
100
-25
0
Temperature : Ta [°C]
Temperature：T[℃]
90
VDD=3.7V
VDD=3.3V
VDD=2.9V
60
50
40
30
20
10
0
-25
0
25
50
75
100
100
600
500
VDD=3.7V
VDD=3.3V
VDD=2.9V
400
300
200
100
0
-25
Temperature : Ta [°C]
Temperature：T[℃]
0
25
50
75
100
Temperature : Ta [°C]
Temperature：T[℃]
Figure 29. Period-Jitter 1σ vs Temperature
(16.9MHz)
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75
Figure 28. Duty vs Temperature
(16.9MHz)
：
P erio d-ji tte rMIN-MA X
J-MIN-MA
X [p sec]
Period-JitterPMIN-MAX
: PJ-MIN-MAX
[psec]
P Period-Jitter
erio d-ji tte r11σσ：:PPJ-1σ
J-1 σ[psec]
[psec]
100
70
50
Temperature：T[℃]
Temperature
: Ta [°C]
Figure 27. Period-Jitter MIN-MAX vs Temperature
(33.9MHz)
80
25
Figure 30. Period-Jitter MIN-MAX vs Temperature
(16.9MHz)
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BU2363FV
Typical Performance Curves – continued
100
55
VDD=3.7V
VDD=3.3V
VDD=2.9V
53
： Duty[%]
Duty
: Duty [%]
Duty
P erio
J-1 σ[psec]
d-ji tte r11σ
σ： P
Period-Jitter
: PJ-1σ
[psec]
54
52
51
50
49
48
47
46
90
VDD=2.9V
VDD=3.3V
VDD=3.7V
80
70
60
50
40
30
20
10
0
45
-25
0
25
50
75
-25
100
0
50
75
100
Temperature : Ta [°C]
Temperature：T[℃]
Temperature : Ta [°C]
Temperature：T[℃]
Figure 32. Period-Jitter 1σ vs Temperature
(36.9MHz)
Figure 31. Duty vs Temperature
(36.9MHz)
600
55
54
VDD=3.3V
VDD=2.9V
VDD=3.7V
500
VDD=3.7V
VDD=3.3V
VDD=2.9V
53
400
Duty：:Duty[%]
Duty [%]
Duty
：
P erio d-ji tte rMIN-MA X
J-MIN-MA
X [p sec] [psec]
Period-Jitter P
: PJ-MIN-MAX
MIN-MAX
25
300
200
52
51
50
49
48
47
100
46
45
0
-25
0
25
50
75
-25
100
0
25
50
75
Temperature : Ta [°C]
Temperature：T[℃]
Temperature : Ta [°C]
Temperature：T[℃]
Figure 33. Period-Jitter MIN-MAX vs Temperature
(36.9MHz)
Figure 34. Duty vs Temperature
(18.4MHz)
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TSZ02201-0E3E0J500690-1-2
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BU2363FV
：
P erio d-ji tte rMIN-MA X
Period-JitterPMIN-MAX
: PJ-MIN-MAX
[psec]
J-MIN-MA
X [p sec]
Typical Performance Curves – continued
P erio
J-1 σ[psec]
d-ji tte r11σ
σ：:PPJ-1σ
Period-Jitter
[psec]
100
90
VDD=2.9V
VDD=3.3V
VDD=3.7V
80
70
60
50
40
30
20
10
0
-25
0
25
50
75
100
Temperature
: Ta [°C]
Temperature：T[℃]
600
500
VDD=3.3V
VDD=2.9V
VDD=3.7V
400
300
200
100
0
-25
0
25
50
75
100
Temperature : Ta [°C]
Temperature：T[℃]
Figure 35. Period-Jitter 1σ vs Temperature
(18.4MHz)
Figure 36. Period-Jitter MIN-MAX vs Temperature
(18.4MHz)
Circui
IDD[mA]
Circuitt Current
[mA]
Current : ：
IDD
50
40
30
20
VDD=3.7V
VDD=3.3V
VDD=2.9V
10
0
-25
0
25
50
75
100
Temperature : Ta [°C]
Temperature：T[℃]
Figure 37. Consumption Current vs Temperature
Consumption Current
(With Maximum Output Load)
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04.Nov.2015 Rev.001
BU2363FV
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/19
TSZ02201-0E3E0J500690-1-2
04.Nov.2015 Rev.001
BU2363FV
Operational Notes – continued
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/19
TSZ02201-0E3E0J500690-1-2
04.Nov.2015 Rev.001
BU2363FV
Ordering Information
B
U
2
3
6
3
Part Number
F
V
-
Package
FV: SSOP-B16
E2
Package and forming specification
E2: Reel-like emboss taping
Marking Diagram
SSOP-B16(TOP VIEW)
Part Number Marking
2363F
LOT Number
1PIN MARK
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
17/19
TSZ02201-0E3E0J500690-1-2
04.Nov.2015 Rev.001
BU2363FV
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
SSOP-B16
18/19
TSZ02201-0E3E0J500690-1-2
04.Nov.2015 Rev.001
BU2363FV
Revision History
Date
04.Nov.2015
Revision
001
Changes
New Release
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
19/19
TSZ02201-0E3E0J500690-1-2
04.Nov.2015 Rev.001
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BU2363FV - Web Page
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BU2363FV
SSOP-B16
2500
2500
Taping
inquiry
Yes