MICREL SY89208VMITR

Precision Edge™
3.3V/5V 3GHz PECL/ECL
2:1 MULTIPLEXER
Micrel
Precision Edge™
SY89208V
SY89208V
FEATURES
■ 2:1 PECL/ECL multiplexer
■ Guaranteed AC-performance over temperature/
voltage
• >3GHz fMAX (toggle)
• <200ps rise/fall time
• <420ps propagation delay (D-to-Q)
■ Low jitter performance
• <1ps(rms) random jitter
• <15ps(pk-pk) deterministic jitter
• <10ps(pk-pk) total jitter (clock)
■ Flexible supply voltage: 3V to 5.5V
100k ECL/PECL compatible output
■ Wide operating temperature range: –40°C to +85°C
■ Available in ultra-small 8-pin MLF™ (2mm x 2mm)
package
Precision Edge™
DESCRIPTION
The SY89208V is a 3.3V/5V precision high-speed 2:1
multiplexer. It is functionally equivalent to the SY100EP58V
but in an ultra-small 8-lead MLF™ package that features a
70% smaller footprint. The signal-path inputs (Da and Db)
are single-ended PECL/ECL compatible, and can accept a
signal swing as low as 150mV. All I/O pins are 10k/100k EP
ECL/PECL compatible.
AC-performance is guaranteed over the industrial –40°C
to +85°C temperature range and 3.0V to 5.5V supply voltage
range. Maximum throughput (fMAX) is guaranteed to be 3GHz
with a differential output swing ≥400mV. In addition, these
multiplexers are optimized for low-jitter applications. The
SY89208V is designed to operate in either ECL/PECL or
PECL/LVPECL mode. The SY89208V is internally
temperature compensated, thus is 100k EP ECL/PECL
compatible—I/O logic levels remain constant over
temperature.
The SY89208V is part of Micrel’s high-speed, Precision
Edge™ timing and distribution family. For applications that
require a differential I/O combination, consult the Micrel
website at www.micrel.com , and choose from a
comprehensive product line of high-speed, low skew fanout
buffers, translators, and clock dividers.
APPLICATIONS
■
■
■
■
SONET
Gig Ethernet
Fibre Channel
Transponders
TYPICAL PERFORMANCE
Single-Ended PECL Da
1
Q
Single-Ended PECL Db
0
/Q
Output Swing
(60mV/div.)
FUNCTIONAL BLOCK DIAGRAM
SEL
(PECL/ECL)
TIME (50ps/div.)
2.7Gbps, 223 – 1PRBS
Precision Edge is a trademark of Micrel, Inc.
MicroLeadFrame and MLF are trademarks of Amkor Technology, Inc.
Rev.: A
1
Amendment: /0
Issue Date: June 2003
Precision Edge™
SY89208V
Micrel
PACKAGE/ORDERING INFORMATION
Ordering Information
NC
1
8
VCC
Part Number
DA
2
7
Q
SY89208VMITR*
DB
3
6
/Q
SEL
4
5
VEE
Package
Type
Operating
Range
Package
Marking
MLF-8
Industrial
208
*Tape and Reel
8-Pin MLF™
Ultra-Small Outline (2mm x 2mm)
PIN DESCRIPTION
Pin Number
Pin Name
Type
2, 3
DA, DB
100k
ECL Input
Pin Function
Single-ended PECL/ECL Inputs: The signal inputs include internal 75kΩ
pull-down resistors. Default condition is LOW when left floating. The input
signal should be terminated externally.
4
SEL
100k
ECL Input
Single-ended PECL/ECL Input: PECL/ECL compatible 2:1 mux select. See
Truth Table. Includes internal 75kΩ pull-down resistor. Default condition is
LOW when left floating.
5
VEE
Exposed Pad
Negative Power
Supply
6, 7
/Q, Q
100k ECL Output
8
VCC
Power
1
NC
Negative Power Supply: VEE and Exposed pad must be tied to most
negative supply. For PECL/LVPECL connect to ground.
Differential PECL/LVPECL Output: 100k ECL/ output defaults to LOW if D
inputs left open. See “Output Interface Applications” section for
recommendations on terminations.
Positive Power Supply: Bypass with 0.1µF//0.01µF low ESR capacitors.
Not connected.
MUX SELECT TRUTH TABLE
SEL
DATA OUT (Q, /Q)
L
DB Input Selected
H
DA Input Selected
2
Precision Edge™
SY89208V
Micrel
Absolute Maximum Ratings(Note 1)
Operating Ratings(Note 2)
Supply Voltage (VCC) ................................. –0.5V to + 6.0V
Input Voltage (VIN) ......................................... –0.5V to VCC
LVPECL Output Current (IOUT)
Continuous ............................................................. 50mA
Surge .................................................................... 100mA
Input Current
Source or sink current on D, /D ............................ ±50mA
Lead Temperature (soldering, 10 sec.) ................... +220°C
Storage Temperature (TS) ....................... –65°C to +150°C
Supply Voltage (|VCC–VEE|) .. LVPECL/LVECL 3.0V to 3.6V
.............................................. PECL/ECL 4.5V to 5.5V
Ambient Temperature (TA) ......................... –40°C to +85°C
Package Thermal Resistance Note 3
MLF™ (θJA)
Still-Air ................................................................. 93°C/W
500lfpm ............................................................... 87°C/W
MLF™ (ΨJB),
Junction-to-Board ................................................ 60°C/W
DC ELECTRICAL CHARACTERISTICS(Note 4)
Symbol
Parameter
VCC
Power Supply Voltage
IEE
Supply Current
IIH
Input HIGH Current
IIL
Input LOW Current
CIN
Input Capacitance
Condition
Min
Typ
Max
Units
4.5
3.0
–5.5
–3.6
5.0
—
–5.0
–3.3
5.5
3.6
–4.5
–3.0
V
V
V
V
No load
—
35
50
mA
VIN = VIH
—
—
80
µA
VIN = VIL
0.5
—
—
µA
—
1.0
—
pF
(PECL)
(LVPECL)
(ECL)
(LVECL)
All Inputs
PECL/ECL (100K) DC ELECTRICAL CHARACTERISTICS(Note 4)
VCC = +3.3V±10% or +5V±10% and VEE = 0V; VCC = 0V and VEE = –3.3V±10% or –5V±10%; TA = –40°C to +85°C unless otherwise noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VOH
Output HIGH Voltage
Note 5
VCC–1.145
—
VCC–0.895
V
VOL
Output LOW Voltage
Note 5
VCC–1.945
—
VCC–1.695
V
VIH
Input HIGH Voltage
VCC–1.225
—
VCC–0.88
V
VIL
Input LOW Voltage
VCC–1.945
—
VCC–1.625
V
VIHCMR
Input HIGH Voltage
Common Mode Range
VEE+2.0
—
VCC
V
VBB
Bias Voltage
Note 6
VCC–1.525 VCC–1.425 VCC–1.325
3
V
Precision Edge™
SY89208V
Micrel
AC ELECTRICAL CHARACTERISTICS
VCC = +3.3V±10% or +5V±10% and VEE = 0V; VCC = 0V and VEE = –3.3V±10% or –5V±10%; TA = –40°C to +85°C unless otherwise noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
fMAX
Max. Toggle Frequency
Note 7
3
—
—
GHz
tpd
Propagation Delay (Differential)
SEL to Q, /Q; D to Q, /Q
170
230
420
ps
tSKEW
Part-to-Part Skew
Note 8
—
—
200
ps
tJITTER
Cycle-to-Cycle Jitter (rms)
Note 9
—
—
1
ps(rms)
Random Jitter
Note 10
—
—
1
ps(rms)
Deterministic Jitter
@1.25Gbps
@2.5Gbps
Note 11
Note 10
—
—
7
10
—
—
ps(pk-pk)
ps(pk-pk)
Total Jitter
Note 12
—
—
10
ps(pk-pk)
VIN
Differential Input Voltage Range
150
800
1200
mV
tr, tf
Output Rise/Fall Time
(20% to 80%)
90
140
200
ps
Q, /Q
Note 1.
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation
is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM
RATlNG conditions for extended periods may affect device reliability.
Note 2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
Note 3.
Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
Note 4.
The device is guaranteed to meet the DC specifications, shown in the table above, after thermal equilibrium has been established.
Note 5.
Output loaded with 50Ω to VCC–2V.
Note 6.
Note 7.
Note 8.
VIHCMR(min) varies 1:1 with VEE, (max) varies 1:1 with VCC.
Measured with 750mV input signal, 50% duty cycle. Output swing ≥ 400mV. All loading with a 50Ω to VCC –2.0V.
Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays are
measured from the cross point of the inputs to the cross point of the outputs.
Note 9. The variation in period between adjacent cycles over a random sample of adjacent cycle pairs. tJITTER_CC = tn– tn + 1, where t is the time between
rising edges of the output signal.
Note 10. Random jitter is measured with a K28.7 comma detect character pattern, measured at 1.25Gbps and 2.5Gbps.
Note 11. Deterministic jitter is measured at 1.25Gbps and 2.5Gbps, with both K28.5 and 223–1 PRBS pattern.
Note 12. Total Jitter definition with an ideal clock input, no more than 1 output edge in 1012 output edges will deviate by more than specified peak-to-peak
jitter value.
4
Precision Edge™
SY89208V
Micrel
TYPICAL OPERATING CHARACTERISTICS
VCC = 3.3V, VEE = GND, TA = 25°C, unless otherwise stated.
Output Amplitude
vs. Frequency
Propagation Delay
vs. Temperature
PROPAGATION DELAY (ps)
OUTPUT AMPLITUDE (mV)
1000
900
800
700
VIN = 800mV
600
500
400
100 600 1100 1600 2100 2600 3100
FREQUENCY (MHz)
300
290
280
270
VIN = 800mV
260
250
240
230
220
210
200
-40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
1.5GHz Output
500MHz Output
VIN = 800mV
/Q
Output Swing
(200mV/div.)
Output Swing
(200mV/div.)
VIN = 800mV
Q
/Q
Q
TIME (300ps/div.)
TIME (100ps/div.)
2.5GHz Output
3.0GHz Output
VIN = 800mV
Output Swing
(200mV/div.)
Output Swing
(200mV/div.)
VIN = 800mV
/Q
Q
TIME (60ps/div.)
/Q
Q
TIME (55ps/div.)
5
Precision Edge™
SY89208V
Micrel
LVPECL OUTPUT INTERFACE APPLICATIONS
VCC
VCC
R1
R1
VCC
VCC
ZO = 50Ω
VCC
ZO = 50Ω
ZO = 50Ω
ZO = 50Ω
50Ω
VCC —2V R2
50Ω
R2
VCC = 3.3V; Rpd = 50Ω
VCC = 5V; Rpd = 100Ω
VCC = 3.3V; R1 = 130Ω, R2 = 82Ω
VCC = 5V; R1 = 83Ω, R2 = 125Ω
VCC —2V
Figure 1b. Three Resistor
“Y Termination”
Figure 1a. Parallel Thevenin-Equivalent
Termination
VCC
VCC
VCC
R1
R3
R1
VCC
ZO = 50Ω
R2
VCC —2V
Rpd
R4
R2
VCC —1.3V
VCC = 3.3V; R1 = 130Ω, R2 = 82Ω, R3 = 1kΩ, R4 = 1.6kΩ,
VCC = 5V; R1 = 83Ω, R2 = 125Ω, R3 = 1kΩ, R4 = 2.8kΩ,
Figure 1c. Terminating Unused I/O
6
C (Optional)
0.01µF
Precision Edge™
SY89208V
Micrel
8 LEAD ULTRA-SMALL EPAD-MicroLeadFrame™ (MLF-8)
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heat Dissipation
VEE
Heavy Copper Plane
VEE
Heavy Copper Plane
PCB Thermal Consideration for 8-Pin MLF™ Package
Package Notes:
Note 1. Package meets Level 2 qualification.
Note 2. All parts are dry-packaged before shipment.
Note 3. Exposed pads must be soldered to the most negative supply plane, equivalent to VEE for proper
thermal management.
MICREL, INC.
TEL
1849 FORTUNE DRIVE SAN JOSE, CA 95131
+ 1 (408) 944-0800
FAX
+ 1 (408) 944-0970
WEB
USA
http://www.micrel.com
The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2003 Micrel, Incorporated.
7