Icemos ICE20N170U N-channel enhancement mode mosfet Datasheet

Preliminary Data Sheet
ICE20N170U
Product Summary
ICE20N170U N-Channel
Enhancement Mode MOSFET
Features
• Low rDS(on)
• Ultra Low Gate Charge
• High dv/dt capability
• High Unclamped Inductive Switching (UIS) capability
• High peak current capability
• Increased transconductance performance
• Optimized design for high performance power systems
ID
TA=25oC
20A
Max
V(BR)DSS
ID=250uA
600V
Min
rDS(on)
VGS=10V
0.17Ω
Typ
Qg
VDS=480V
62nC
Typ
D
G
S
T0262
ICEMOS AND ITS SISTER COMPANY 3D SEMI OWN THE FUNDAMENTAL PATENTS
FOR SUPERJUNCTION MOSFETS. THE MAJORITY OF THESE PATENTS HAVE 17 to 20
YEARS OF REMAINING LIFE. THIS PORTFOLIO HAS GRANTED PATENTS ISSUED IN
USA, CHINA, KOREA, JAPAN, TAIWAN & EUROPE.
Maximum ratings b
Standard Metal
Heatsink
1=Gate, 2&4=Drain,
3=Source.
, at Tj=25oC, unless otherwise specified
Parameter
Symbol
Conditions
Value
Unit
Continuous drain current
ID
Tc=25oC
20
A
Pulsed drain current
ID, pulse
Tc=25oC
62
A
Avalanche energy, single pulse
E AS
ID=10A
520
mJ
Avalanche current, repetitive
I AR
limited by Tjmax
20
A
MOSFET dv/dt ruggedness
dv/dt
VDS=480V, ID=20A,
Tj=125oC
50
V/ns
Gate source voltage
VGS
Power dissipation
Ptot
Operating and storage temperature
Tj, Tstg
Static
±20
AC (f>1Hz)
±30
Tc=25oC
208
-55 to +150
V
W
o
C
a When mounted on 1inch square 2oz copper clad FR-4
b Preliminary Data Sheet – Specifications subject to change
SP-20N170U-000-2
05/15/2013
1
Preliminary Data Sheet
ICE20N170U
Parameter
Symbol
Conditions
Values
Min
Typ
Max
-
-
0.7
Unit
Thermal characteristics
Thermal resistance, junctioncase a
RthJC
o
Thermal resistance, junctionambient a
RthJA
leaded
-
-
62
Soldering temperature, wave
soldering only allowed at leads
T sold
1.6mm (0.063in.) from
case for 10 s
-
-
260
Electrical characteristics
Gate source leakage current
o
C
b , at T =25oC, unless otherwise specified
j
Static characteristics
Drain-source breakdown voltage V(BR)DSS
VGS(th)
Gate threshold voltage
Zero gate voltage drain current
C/W
IDSS
IGSS
Drain-source
on-state resistance
RDS (on)
Gate resistance
RG
VGS=0 V, ID=250µA
600
640
-
VDS=VGS, ID=250µA
VDS=600V, VGS=0V,
o
Tj=25 C
2.1
3
3.9
-
0.1
1
-
-
100
VGS=±20 V, VDS=0V
VGS=10V, ID=10A,
o
Tj=25 C
VGS=10V, ID=10A,
o
Tj=150 C
-
-
100
-
0.17
0.199
-
0.52
f=1 MHZ, open drain
-
4.3
-
2020
-
-
980
-
-
9
-
-
19
-
-
39
-
-
3.5
-
-
55
7
-
VDS=600V, VGS=0V,
o
Tj=150 C
V
µA
nA
Ω
-
Ω
Dynamic characteristics
Input capacitance
Ciss
Output capacitance
Reverse transfer capacitance
Coss
Transconductance
gfs
Turn-on delay time
Rise time
td(on)
Turn-off delay time
td(off)
Fall time
tf
SP-20N170U-000-2
05/15/2013
Crss
tr
VGS=0 V, VDS=25 V,
f=1 MHz
VDS>2*ID*RDS, ID=10A
VDS=380V, VGS=10V,
ID=20A, RG=4Ω (External)
-
pF
S
ns
-
2
Preliminary Data Sheet
ICE20N170U
Parameter
Symbol
Conditions
Values
Unit
Min
Typ
Max
-
13
-
-
23
-
-
62
-
-
5.8
-
V
-
0.9
1.2
V
-
407
-
ns
-
6.7
-
µC
-
32
-
A
Gate charge characteristics
Gate to source charge
Qgs
Gate to drain charge
Qgd
Gate charge total
Qg
Gate plateau voltage
Vplateau
VDS=480 V, ID=20A,
VGS=10 V
nC
Reverse Diode
Diode forward voltage
VSD
Reverse recovery time
trr
Reverse recovery charge
Qrr
Peak reverse recovery current
Irm
SP-20N170U-000-2
05/15/2013
VGS=0V, IS=IF
VRR=480V, IS=IF,
diFIdt=100 A/µS
3
Preliminary Data Sheet
ICE20N170U
Transfer Characteristics
Output Characteristics
VGS=10 to 7V
60
50
ID - Drain Current (A)
ID - Drain Current (A)
60
40
6V
30
20
50
40
30
20
5V
10
10
TJ = 150˚C
0
0
0
5
10
0
15
2
4
6
8
VGS - Gate-to-Source (V)
VDS - Drain-to-Source Voltage (V)
4.0
RDS(on) - On State Resistance
(Normalized)
RDS(on) - On-State Resistance (mΩ)
10
On Resistance vs Junction Temperature
On Resistance vs Drain Current
500
400
300
VGS = 10V
200
100
3.5
VGS = 10V
ID = 10A
3.0
2.5
2.0
1.5
1.0
0.5
0
0.0
0
10
20
30
40
ID - Drain current (A)
50
60
-50
9
1.3
VGS(th) - Gate Threshold Voltage
(Normalized)
1.4
VDS = 480V
7
0
25
50
75
100
125
150
Gate Threshold Voltage vs Junction Temperature
10
8
-25
TJ - Junction Temperature (˚C)
Gate Charge
VGS - Gate-to-Source Voltage (V)
25˚C
ID = 20A
6
5
4
3
2
1
1.2
1.1
ID = 250μA
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0
0
10
20
30
40
50
Qg - Total Gate Charge (nC)
SP-20N170U-000-2
05/15/2013
60
70
-50
-25
0
25
50
75
100
125
150
TJ - Junction Temperature (˚C)
4
Preliminary Data Sheet
ICE20N170U
Capacitance
Drain-to-Source Breakdown Voltage vs. Junction Temperature
1.2
V(BR)DSS - Drain-to-Source Breakdown Voltage
(Normalized)
10000
C-Capacitance (pF)
Ciss
1000
Coss
100
10
Crss
1
0
100
200
300
400
500
VDS - Drain-to-Source Voltage (V)
ID = 1mA
1.0
0.9
0.8
-50
600
-25
0
25
50
75
100
TJ - Junction Temperature (˚C)
125
150
Transient Thermal Response, Junction-to-Case
Maximum Rated Forward Biased Safe Operating Area
100
10us
10
100us
1ms
1
10ms
DC
0.1
RDS(on) Limit
Package Limit
Thermal Limit
0.01
r(t), Transient Thermal Resistance
(Normalized)
1.00
Single Pulse,
Tc = 25oC,
Tj=150oC,
VGS = 10V
ID - Drain Current (A)
1.1
0.5
0.2
0.1
0.10
0.05
0.02
0.01
Single Pulse
0.00
1
10
100
VDS - Drain-to-Source Voltage (V)
SP-20N170U-000-2
05/15/2013
1000
1.0E-06
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
t - Time (s)
5
Preliminary Data Sheet
ICE20N170U
SP-20N170U-000-2
05/15/2013
6
Preliminary Data Sheet
ICE20N170U
COMMON DIMENSIONS
MM
INCH
SYMBOL
MIN
NOM
MAX
MIN
NOM
MAX
A
4.45
4.57
4.70
0.175
0.180
0.185
A1
1.22
1.27
1.32
0.045
0.050
0.052
A2
2.29
2.67
2.92
0.090
0.105
0.115
b
0.71
0.813
0.97
0.028
0.032
0.038
b2
1.22
1.27
1.40
0.048
0.050
0.055
c
0.38
0.381
0.76
0.015
0.015
0.030
D
23.20
23.61
24.02
0.913
0.930
0.946
D1
8.38
8.70
8.89
0.330
0.343
0.350
E1
10.03
10.16
10.54
0.395
0.400
0.415
e
2.54BSC
0.100BSC
H2
-
-
1.31
-
-
0.052
L
13.34
13.73
14.10
0.525
0.541
0.555
L1
3.30
3.56
4.06
0.130
0.140
0.160
L2
1.49REF
0.059REF
L3
3.40REF
0.134REF
ØP1
1.07
1.20
1.32
0.042
0.047
0.052
θ1
-
7º
-
-
7º
-
θ2
-
3º
-
-
3º
-
θ3
-
-
12º
-
-
12º
θ4
-
-
3º
-
-
3º
DEP
0.10
0.18
0.25
0.004
0.007
0.010
SP-20N170U-000-2
05/15/2013
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Preliminary Data Sheet
ICE20N170U
ICEMOS SUPERJUNCTION PATENT PORTFOLIO
ICEMOS GRANTED PATENTS
US7,429,772
US7,439,178
US7,446,018
US7,579,607
US7,723,172
US7,795,045
US7,846,821
US7,944,018
US8,012,806
US8,030,133
3D SEMI PATENTS LICENSED TO ICEMOS
US7,041,560B2
US7,023,069B2
US7,364,994
US7,227,197B2
US7,304,944B2
US7,052,982B2
US7,339,252
US7,410,891
US7,439,583
US7,227,197B2
US6,635,906
US6,936,867
US7,015,104
US9,109,110
US7,271,067
US7,354,818
US7,052,982,
US7,199,006B2
Note: additional patents in China, Korea, Japan, Taiwan, Europe have also been granted to IceMOS and 3D Semi for
Superjunction MOSFETs with 70 additional Patent applications in process in the USA and the above listed countries.
SP-20N170U-000-2
05/15/2013
8
Preliminary Data Sheet
ICE20N170U
Marking Information
YY
= Last two digits of the year
WW = Work week calendar on Icemos
subcon assembly & test house
YYWW *
XXXX00
ICE20N170
*
= Initial for Icemos subcon
assembly and test house
XXXX = Wafer Lot ID
00
= may be used for wafer ID in a
special case.
= "00" is used unless specified.
ICE20N170 = ICE is Icemos logo and
20N170 is a designated device part
number
SP-20N170U-000-2
05/15/2013
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