BAV756DW QUAD SURFACE MOUNT SWITCHING DIODE ARRAY Please click here to visit our online spice models database. Features • • • • • • • • Mechanical Data • • Fast Switching Speed Ultra-Small Surface Mount Package For General Purpose Switching Applications High Conductance One BAV70 Circuit and One BAW56 Circuit In One Package Easily Connected As Full Wave Bridge Lead Free/RoHS Compliant (Note 3) "Green" Device (Notes 4 and 5) Case: SOT-363 Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminals: Solderable per MIL-STD-202, Method 208 Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). Polarity: See Diagram Marking Information: See Page 2 Ordering Information: See Page 2 Weight: 0.006 grams (approximate) • • • • • • • SOT-363 TOP VIEW Maximum Ratings C1 A1 C2 A1 C2 A2 TOP VIEW Internal Schematic @TA = 25°C unless otherwise specified Characteristic Non-Repetitive Peak Reverse Voltage Symbol VRM VRRM VRWM VR VR(RMS) IFM IO Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Notes 1 and 2) Average Rectified Output Current (Notes 1 and 2) Non-Repetitive Peak Forward Surge Current @ t = 1.0μs @ t = 1.0s Value 100 Unit V 75 V V mA mA IFSM 53 300 150 2.0 1.0 Symbol PD PD RθJA RθJS TJ, TSTG Value 200 300 625 275 -65 to +150 Unit mW mW °C/W °C/W °C A Thermal Characteristics Characteristic Power Dissipation (Notes 1 and 2) Power Dissipation TS = 60°C (Note 2) Thermal Resistance Junction to Ambient Air (Notes 1 and 2) Thermal Resistance Junction to Soldering Point (Note 2) Operating and Storage Temperature Range Electrical Characteristics Characteristic Reverse Breakdown Voltage (Note 6) @TA = 25°C unless otherwise specified Symbol V(BR)R Min 75 Max ⎯ Unit V V Forward Voltage VF ⎯ 0.715 0.855 1.0 1.25 Reverse Current (Note 6) IR ⎯ 2.5 50 30 25 Total Capacitance CT ⎯ 2.0 μA μA μA nA pF Reverse Recovery Time trr ⎯ 4.0 ns Notes: Test Condition IR = 2.5μA IF = 1.0mA IF = 10mA IF = 50mA IF = 150mA VR = 75V VR = 75V, TJ = 150°C VR = 25V, TJ = 150°C VR = 20V VR = 0, f = 1.0MHz IF = IR = 10mA, Irr = 0.1 x IR, RL = 100Ω 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. One or more diodes loaded. 3. No purposefully added lead. 4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 6. Short duration pulse test used to minimize self-heating effect. BAV756DW Document number: DS30148 Rev. 9 - 2 1 of 3 www.diodes.com April 2008 © Diodes Incorporated BAV756DW 250 Note 1 200 150 100 50 0 0 0.01 0.5 1.0 1.5 0 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics, Per Element 2.0 f = 1.0MHz 1.8 1,000 CT, TOTAL CAPACITANCE (pF) IR, INSTANTANEOUS REVERSE CURRENT (nA) 0.1 0.001 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Derating Curve, Total Package 10,000 100 10 1 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.1 0.0 20 40 60 80 100 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics, Per Element 0 Ordering Information 10 30 40 20 VR, DC REVERSE VOLTAGE (V) Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element 0 (Notes 5 & 7) Part Number BAV756DW-7-F Notes: 1 IF, INSTANTANEOUS FORWARD CURRENT (A) PD, POWER DISSIPATION (mW) 300 Case SOT-363 Packaging 3000/Tape & Reel 7. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information Date Code Key Year Code YM KCA KCA = Product Type Marking Code YM = Date Code Marking Y = Year ex: N = 2002 M = Month ex: 9 = September 2001 M 2002 N 2003 P 2004 R 2005 S 2006 T 2007 U 2008 V 2009 W 2010 X 2111 Y 2012 Z Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D BAV756DW Document number: DS30148 Rev. 9 - 2 2 of 3 www.diodes.com April 2008 © Diodes Incorporated BAV756DW Package Outline Dimensions A SOT-363 Dim Min Max A 0.10 0.30 B 1.15 1.35 C 2.00 2.20 D 0.65 Nominal F 0.30 0.40 H 1.80 2.20 J 0.10 ⎯ K 0.90 1.00 L 0.25 0.40 M 0.10 0.25 0° 8° α All Dimensions in mm B C H K M J D L F Suggested Pad Layout E E Dimensions Value (in mm) Z Z C G Y 2.5 G 1.3 X 0.42 Y 0.6 C 1.9 E 0.65 X IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated. BAV756DW Document number: DS30148 Rev. 9 - 2 3 of 3 www.diodes.com April 2008 © Diodes Incorporated