BAV23A/C/S Rev.F Mar.-2016 描述 / DATA SHEET Descriptions SOT-23 塑封封装 硅半导体二极管。Silicon Diode in a SOT-23 Plastic Package. 特征 / Features 小信号二极管。 Small signal diode. 用途 / Applications 开关速度快，开关应用通用，高电导率。 Switching speed, general-purpose switching applications, high conductivity. 内部等效电路 引脚排列 / Equivalent Circuit / Pinning 3 1 2 PIN: See Equivalent Circuit. 放大及印章代码 / hFE Classifications & Marking Model Marking http://www.fsbrec.com BAV23A BAV23C BAV23S HT7 HT6 HT5 1/6 BAV23A/C/S Rev.F Mar.-2016 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit VRRM 250 V 200 V 141 V IFM 400 mA IFSM(1)(pulse width=1.0 uS ) 9.0 A IFSM(2)(pulse width=100uS) 3.0 A IFSM(3)(pulse width=10ms) 1.7 A Repetitive Peak Forward Surge Current IFRM 625 mA Power Dissipation PD 350 mW Thermal Resistance, Junction to Ambient RθJA 357 ℃/W Junction and Storage Temperature Range Tj, Tstg -65～150 ℃ Repetitive Reverse Voltage Reverse Voltage Working Peak Reverse Voltage RMS Reverse Voltage VR VRWM VR(RMS) Average Rectified Forward Current Non-repetitive Peak Forward Surge Current 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter 符号 Symbol 测试条件 Test Conditions Breakdown Voltage VR Forward Voltage VF Instantaneous Reverse Current IR Total Capacitance CT VR=0 f=1.0MHz Reverse Recovery Time trr IF=IR=30mA IRR=0.1x IR RL=100Ω http://www.fsbrec.com IR=100μA 最小值 典型值 最大值 单位 Min Typ Max Unit 250 V IF=100mA 1.0 V IF=200mA 1.25 V TJ=25℃ 100 nA TJ=150℃ 100 μA 5.0 pF 50 ns 2/6 BAV23A/C/S Rev.F Mar.-2016 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 3/6 BAV23A/C/S Rev.F Mar.-2016 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 BAV23A/C/S Rev.F Mar.-2016 印章说明 / DATA SHEET Marking Instructions HT7 说明： H： 为公司代码 T7： 为型号代码 Note: H: Company Code. T7: Product Type. http://www.fsbrec.com 5/6 BAV23A/C/S Rev.F Mar.-2016 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Time:10±1 sec / REEL Package Type 封装形式 使用说明 Temp.:260±5℃ / Packaging SPEC. 卷盘包装 SOT-23 时间：10±1 sec. Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 3,000 10 30,000 8 240,000 7〞×8 180×120×180 385×257×392 / Notices http://www.fsbrec.com 6/6