Hynix GM76C256CL 32k x8 bit 5.0v low power cmos slow sram Datasheet

GM76C256C Series
32Kx8bit CMOS SRAM
Document Title
32K x8 bit 5.0V Low Power CMOS slow SRAM
Revision History
Revision No
History
Draft Date
00
Revision History Insert
Revised
- Datasheet format change
- PDIP package type insert
- Pin configuration change
Jul.07.2000
01
Revised
- tWP Value Change @55ns : 45ns -> 40ns
Nov.28.2000
Final
02
Marking Information Add
Revised
- AC Test Condition Add : 5pF Test Load
- tCLZ Value Change : 5ns - > 10ns
Dec.04.2000
Final
03
Changed Logo
- HYUNDAI -> hynix
Apr.30.2001
Final
This document is a general product description and is subject to change without notice. Hynix
responsibility for use of circuits described. No patent licenses are implied.
Rev 03 / Apr. 2001
Electronics does not
Remark
Final
assume any
Hynix Semiconductor
GM76C256C Series
DESCRIPTION
FEATURES
The GM76C256C is a high-speed, low power and
32,786 X 8-bits CMOS Static Random Access
Memory fabricated using
Hynix's high
performance CMOS process technology. It is
suitable for use in low voltage operation and
battery back-up application. This device has a
data retention mode that guarantees data to
remain valid at the minimum power supply
voltage of 2.0 volt.
•
•
•
•
Product
Voltage
Speed
No.
(V)
(ns)
GM76C256C
5.0
55/70/85
GM76C256CE
5.0
55/70/85
Note 1. Current value is max.
Fully static operation and Tri-state output
TTL compatible inputs and outputs
Low power consumption
Battery backup(L/LL-part)
- 2.0V(min.) data retention
• Standard pin configuration
- 28 pin 600mil PDIP
- 28 pin 330mil SOP
- 28 pin 8x13.4 mm TSOP-I
(Standard)
Operation
Current(mA)
10
10
Standby Current(uA)
L
LL
40
20
60
30
Temperature
(°C)
0~70(Normal)
-25~85(Extended)
PIN CONNECTION
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
SOP
Vcc
/WE
A13
A8
A9
A11
/OE
A10
/CS
I/O8
I/O7
I/O6
I/O5
I/O4
/OE
A11
A9
A8
A13
/WE
Vcc
A14
A12
A7
A6
A5
A4
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
TSOP-I(Standard)
PIN DESCRIPTION
Pin Function
Chip Select
Write Enable
Output Enable
Address Inputs
Data Input/Output
Power(+5.0V)
Ground
BLOCK DIAGRAM
A14
/CS
/OE
/WE
Rev 03 / Apr. 2000
ROW DECODER
A0
ADD INPUT BUFFER
Pin Name
/CS
/WE
/OE
A0 ~ A14
I/O1 ~ I/O8
Vcc
Vss
A10
/CS
I/O8
I/O7
I/O6
I/O5
I/O4
Vss
I/O3
I/O2
I/O1
A0
A1
A2
MEMORY ARRAY
512x512
I/O1
OUTPUT BUFFER
PDIP
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O1
I/O2
I/O3
Vss
SENSE AMP
Vcc
/WE
A13
A8
A9
A11
/OE
A10
/CS
I/O8
I/O7
I/O6
I/O5
I/O4
WRITE DRIVER
28
27
26
25
24
23
22
21
20
19
18
17
16
15
COLUMN DECODER
1
2
3
4
5
6
7
8
9
10
11
12
13
14
I/O8
CONTROL
LOGIC
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O1
I/O2
I/O3
Vss
2
GM76C256C Series
ORDERING INFORMATION
Part No.
GM76C256CL
GM76C256CLL
GM76C256CLE
GM76C256CLLE
GM76C256CLFW
GM76C256CLLFW
GM76C256CLEFW
GM76C256CLLEFW
GM76C256CLT
GM76C256CLLT
GM76C256CLET
GM76C256CLLET
Speed
55/70/85
55/70/85
55/70/85
55/70/85
55/70/85
55/70/85
55/70/85
55/70/85
55/70/85
55/70/85
55/70/85
55/70/85
Power
L-part
LL-part
L-part
LL-part
L-part
LL-part
L-part
LL-part
L-part
LL-part
L-part
LL-part
Temp
0 to 70°C
0 to 70°C
-25 to 85°C
-25 to 85°C
0 to 70°C
0 to 70°C
-25 to 85°C
-25 to 85°C
0 to 70°C
0 to 70°C
-25 to 85°C
-25 to 85°C
Package
PDIP
PDIP
PDIP
PDIP
SOP
SOP
SOP
SOP
TSOP-I Standard
TSOP-I Standard
TSOP-I Standard
TSOP-I Standard
ABSOLUTE MAXIMUM RATING (1)
Symbol
Vcc, VIN, VOUT
TA
Parameter
Power Supply, Input/Output Voltage
Operating Temperature
GM76C256C
GM76C256CE
Storage Temperature
Power Dissipation
Data Output Current
Lead Soldering Temperature & Time
Rating
-0.3 to 7.0
0 to 70
-25 to 85
-65 to 150
1.0
50
260 •10
Unit
V
°C
°C
°C
W
mA
°C•sec
TSTG
PD
IOUT
TSOLDER
Note
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent
damage to the device. This is stress rating only and the functional operation of the device under these or
any other conditions above those indicated in the operation of this specification is not implied.
Exposure to the absolute maximum rating conditions for extended period may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS
Symbol
Parameter
Min.
Vcc
Power Supply Voltage
4.5
Vss
Ground
0
VIH
Input High Voltage
2.2
VIL
Input Low Voltage
-0.3(1)
Note
1. VIL = -3.0V for pulse width less than 50ns
Typ.
5.0
0
-
Max.
5.5
0
Vcc+0.3
0.8
Unit
V
V
V
V
TRUTH TABLE
/CS
/WE /OE
Mode
H
X
X
Standby
L
H
H
Output Disabled
L
H
L
Read
L
L
X
Write
Note
1. H=VIH, L=VIL, X=Don't Care
Rev 03 / Apr. 2000
I/O Operation
High-Z
High-Z
Data Out
Data In
2
GM76C256C Series
DC CHARACTERISTICS
Vcc = 5V ±10%, TA = 0°C to 70°C (Normal)/-25°C to 85°C (Extended), unless otherwise specified.
Parameter
Test Condition
Min. Typ. Max.
Symbol
ILI
Input Leakage Current
Vss < VIN < Vcc
-1
1
ILO
Output Leakage Current
Vss < VOUT < Vcc, /CS = VIH or
-1
1
/OE = VIH or /WE = VIL
Icc
Operating Power Supply
/CS = VIL, VIN = VIH or VIL,
10
Current
VIN = VIH or VIL, II/O = 0mA
ICC1
Average Operating Current
/CS = VIL, VIN = VIH or VIL,
70
Min. Duty Cycle = 100%, II/O = 0mA
ISB
TTL Standby Current
/CS= VIH
1
(TTL Inputs)
VIN = VIH or VIL
ISB1
CMOS Standby Current
/CS > Vcc - 0.2V,
L
40
(CMOS Inputs)
VIN > Vcc - 0.2V or
LL
20
VIN < Vss + 0.2V
LE
60
LLE
30
VOL
Output Low Voltage
IOL = 2.1mA
0.4
VOH
Output High Voltage
IOH = -1.0mA
2.4
-
Unit
uA
uA
mA
mA
mA
uA
uA
uA
uA
V
V
Note : Typical values are at Vcc =5.0V, TA = 25°C
AC CHARACTERISTICS(I)
Vcc = 5V ±10%, TA = 0°C to 70°C (Normal) / -25°C to 85°C (Extended) unless otherwise specified.
-55
-70
-85
# Symbol
Parameter
Min.
Max. Min.
Max. Min
Max.
READ CYCLE
1
tRC
Read Cycle Time
55
70
85
2
tAA
Address Access Time
55
70
85
3
tACS
Chip Select Access Time
55
70
85
4
tOE
Output Enable to Output Valid
30
35
45
5
tCLZ
Chip Select to Output in Low Z
10
10
10
6
tOLZ
Output Enable to Output in Low Z
5
5
5
7
tCHZ
Chip Disable to Output in High Z
0
20
0
30
0
30
8
tOHZ
Out Disable to Output in High Z
0
20
0
30
0
30
9
tOH
Output Hold from Address Change
5
5
5
WRITE CYCLE
10 tWC
Write Cycle Time
55
70
85
11 tCW
Chip Selection to End of Write
50
65
75
12 tAW
Address Valid to End of Write
50
65
75
13 tAS
Address Set-up Time
0
0
0
14 tWP
Write Pulse Width
40
50
60
15 tWR
Write Recovery Time
0
0
0
16 tWHZ
Write to Output in High Z
0
20
0
25
0
30
17 tDW
Data to Write Time Overlap
25
30
40
18 tDH
Data Hold from Write Time
0
0
0
19 tOW
Output Active from End of Write
5
5
5
-
Rev 03 / Apr. 2000
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
3
GM76C256C Series
AC TEST CONDITIONS
TA = 0°C to 70°C (Normal) / -25°C to 85°C (Extended) unless otherwise specified.
Parameter
Value
Input Pulse Level
0.8V to 2.4V
Input Rise and Fall Time
5ns
Input and Output Timing Reference Level
1.5V
Output Load
tCLZ,tOLZ,tCHZ,tOHZ,tWHZ,tOW
CL = 5pF + 1TTL Load
Others
CL = 100pF + 1TTL Load
AC TEST LOADS
TTL
CL(1)
Note : Including jig and scope capacitance
CAPACITANCE
TA = 25°C, f = 1.0MHz
Symbol
Parameter
CIN
Input Capacitance
CI/O
Input /Output Capacitance
Condition
VIN = 0V
VI/O = 0V
Max.
6
8
Unit
pF
pF
Note : These parameters are sampled and not 100% tested
Rev 03 / Apr. 2000
4
GM76C256C Series
TIMING DIAGRAM
READ CYCLE 1
tRC
ADDR
tAA
OE
tOE
tOH
tOLZ
CS
tACS
tOHZ
tCHZ
tCLZ
Data
Out
High-Z
Data Valid
Note(READ CYCLE):
1. tCHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and arenot
referenced to output voltage levels.
2. At any given temperature and voltage condition, tCHZ max. is less than tCLZ min. both for a given device
and from device to device.
3. /WE is high for the read cycle.
READ CYCLE 2
tRC
ADDR
tAA
tOH
tOH
Data
Out
Previous Data
Data Valid
Note(READ CYCLE):
1. /WE is high for the read cycle.
2. Device is continuously selected /CS= VIL.
3. /OE =VIL.
Rev 03 / Apr. 2000
5
GM76C256C Series
WRITE CYCLE 1(/OE Clocked)
tWC
ADDR
OE
tAW
tCW
CS
tAS
tWR
tWP
WE
tDW
Data In
tDH
Data Valid
tOHZ
Data
Out
WRITE CYCLE 2 (/OE Low Fixed)
tWC
ADDR
tAW
tCW
tWR
CS
tAS
tWP
WE
tDW
Data In
tDH
Data Valid
tWHZ
tOW
(7)
(8)
Data
Out
Rev 03 / Apr. 2000
6
GM76C256C Series
Notes(WRITE CYCLE):
1. A write occurs during the overlap of a low /CS and a low /WE. A write begins at the latest transition
among /CS going low and /WE going low: A write ends at the earliest transition among /CS going high
and /WE going high. tWP is measured from the beginning of write to the end of write.
2. tCW is measured from the later of /CS going low to the end of write .
3. tAS is measured from the address valid to the beginning of write.
4. tWR is measured from the end of write to the address change. tWR is applied in case a write ends as /CS,
or /WE going high.
5. If /OE and /WE are in the read mode during this period, and the I/O pins are in the output low-Z state,
input of opposite phase of the output must not be applied because bus contention can occur.
6. If /CS goes low simultaneously with /WE going low, or after /WE going low, the outputs remain in high
impedance state.
7. DOUT is the same phase of the latest written data in this write cycle.
8. DOUT is the read data of the new address.
DATA RETENTION CHARACTERISTIC
TA = 0°C to 70°C (Normal) / -25°C to 85°C (Extended) unless otherwise specified.
Symbol
Parameter
Test Condition
Min
VDR
Vcc for Data Retention
CS>Vcc-0.2V,
2.0
VIN > Vcc - 0.2V or VIN < Vss + 0.2V
ICCDR
Data Retention Current
Vcc=3.0V,
L
/CS>Vcc - 0.2V,
LL
VIN > Vcc - 0.2V or
LE
VIN < Vss + 0.2V
LLE
tCDR
Chip Deselect to Data
See Data Retention
0
Retention Time
tR
Operating Recovery Time
Timing Diagram
tRC(2)
Notes
1. Typical values are under the condition of TA = 25 °C.
2. tRC is read cycle time.
Typ
-
Max
-
Unit
V
1
0.5
1
0.5
-
15
7
20
10
-
uA
uA
uA
uA
ns
-
-
ns
DATA RETENTION TIMING DIAGRAM
DATA RETENTION MODE
VCC
4.5V
tCDR
tR
2.2V
VDR
CS>VCC-0.2V
CS
VSS
Rev 03 / Apr. 2000
7
GM76C256C Series
PACKAGE INFORMATION
28pin 600mil Dual In-Line Package(Blank)
•
UNIT : INCH(mm)
MAX.
MIN.
1.467(37.262)
1.447(36.754)
0.600(15.240)BSC
0.090(2.286)
0.065(1.650)
0.070(1.778)
0.050(1.270)
0.550(13.970)
0.155(3.937)
0.530(13.462)
0.145(3.683)
0.035(0.889)
0.020(0.508)
0.140(3.556)
0.021(0.533)
0.100(2.54)BSC
3 deg
11 deg
0.120(3.048)
0.014(0.356)
0.008(0.200)
0.015(0.381)
28pin 330mil Small O utline Package(FW)
0.346(8.788)
UNIT : INCH(mm)
MAX
.MIN.
0.338(8.585)
0.480(12.192)
0.460(11.684)
0.110(2.794)
0.728(18.491)
0.720(18.288)
0.094(2.388)
0.012(0.305)
0.014(0.356)
0.002(0.051)
0.050(1.270)BSC
Rev 03 / Apr. 2000
0.020(0.508)
0.014(0.356)
0.008(0.203)
0.050(1.270)
0.030(0.762)
8
GM76C256C Series
28pin 8x13.4mm Thin Small Outline Package Standard(T)
UNIT : INCH(mm)
MAX.
MIN.
0.468(11.9)
0.460(11.7)
0.536(13.6)
0.520(13.2)
0.319(8.1)
0.311(7.9)
0.027(0.7)
0.012(0.3)
Rev 03 / Apr. 2000
0.008(0.2)
0.004(0.1)
0.040(1.02)
0.036(0.91)
0.008(0.20)
0.002(0.05)
0.022(0.55 BSC)
9
GM76C256C Series
MARKING INFORMATION
Package
PDIP
SOP
TSOP-I
Marking Example
H
Y
U
N
D
A
I
G
M
7
6
C
2
5
y
y
w
w
H
Y
U
N
D
A
I
G
M
7
6
C
2
5
6
C
c
y
y
w
w
K
O
R
E
A
H
Y
U
N
D
A
I
G
M
7
6
C
2
5
6
C
c
y
y
w
w
K
O
R
E
A
6
C
c
c
-
s
s
t
K
O
R
E
A
c
F W
s
s
c
T
s
t
s
t
Index
• HYUNDAI
• KOREA
• GM76C256C
• cc
• yy
• ww
: Hynix Logo
: Origin Country
: Part Name
: Power Consumption
-L
: Low Power
- LL
: Low Low Power
: Package Type
- Blank
: DIP
- FW
: SOP
-T
: TSOP-I
: Speed
- 55
: 55ns
- 70
: 70ns
: Temperature
- Blank
: Commercial ( 0 ~ 70 °C )
-E
: Extended ( -25 ~ 85 °C )
: Year ( ex : 00 = year 2000, 01 = year 2001 )
: Work Week ( ex : 12 = ww12 )
Note
- Capital Letter
- Small Letter
: Fixed Item
: Non-fixed Item
• Blank / FW / T
• ss
•t
Rev 03 / Apr. 2000
10
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