NTTFS4943N Power MOSFET 30 V, 41 A, Single N−Channel, m8FL Features • • • • Low RDS(on) to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant http://onsemi.com V(BR)DSS RDS(on) MAX Applications • • • • 7.2 mW @ 10 V 30 V DC−DC Converters Power Load Switch Notebook Battery Management Motor Control N−Channel MOSFET Parameter Symbol D (5−8) Value Unit Drain−to−Source Voltage VDSS 30 V Gate−to−Source Voltage VGS ±20 V ID 12.7 A Continuous Drain Current RqJA (Note 1) TA = 25°C Power Dissipation RqJA (Note 1) TA = 25°C PD 2.17 W Continuous Drain Current RqJA ≤ 10 s (Note 1) TA = 25°C ID 18 A Continuous Drain Current RqJA (Note 2) TA = 85°C G (4) S (1,2,3) 9.2 TA = 85°C Steady State 41 A 11 mW @ 4.5 V MAXIMUM RATINGS (TJ = 25°C unless otherwise stated) Power Dissipation RqJA ≤ 10 s (Note 1) ID MAX MARKING DIAGRAM 13 TA = 25°C PD 4.35 W TA = 25°C ID 8.0 A TA = 85°C 5.7 1 S S S G 1 WDFN8 (m8FL) CASE 511AB 4943 A Y WW G 4943 AYWWG G D D D D = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package Power Dissipation RqJA (Note 2) TA = 25°C PD 0.84 W Continuous Drain Current RqJC (Note 1) TC = 25°C ID 41 A Power Dissipation RqJC (Note 1) TC = 25°C PD 22.3 W TA = 25°C, tp = 10 ms IDM 125 A TA = 25°C IDmaxPkg 65 A Device TJ, Tstg −55 to +150 °C NTTFS4943NTAG WDFN8 1500/Tape & Reel (Pb−Free) IS 25 A NTTFS4943NTWG Drain to Source DV/DT dV/dt 6.0 V/ns WDFN8 5000/Tape & Reel (Pb−Free) Single Pulse Drain−to−Source Avalanche Energy (TJ = 25°C, VDD = 50 V, VGS = 10 V, IL = 25 Apk, L = 0.1 mH, RG = 25 W) EAS 31 mJ TL 260 °C Pulsed Drain Current TC = 85°C Current Limited by Pkg. Operating Junction and Storage Temperature Source Current (Body Diode) Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) 29 (Note: Microdot may be in either location) ORDERING INFORMATION Package Shipping† †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu. 2. Surface−mounted on FR4 board using the minimum recommended pad size. © Semiconductor Components Industries, LLC, 2009 October, 2009 − Rev. 0 1 Publication Order Number: NTTFS4943N/D NTTFS4943N THERMAL RESISTANCE MAXIMUM RATINGS Symbol Value Unit Junction−to−Case (Drain) Parameter RqJC 5.6 °C/W Junction−to−Ambient – Steady State (Note 3) RqJA 57.5 Junction−to−Ambient – Steady State (Note 4) RqJA 149.2 Junction−to−Ambient – (t ≤ 10 s) (Note 3) RqJA 28.7 3. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu. 4. Surface−mounted on FR4 board using the minimum recommended pad size (40 mm2, 1 oz. Cu). ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter Symbol Test Condition Min Drain−to−Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 250 mA 30 Drain−to−Source Breakdown Voltage Temperature Coefficient V(BR)DSS/TJ Typ Max Unit OFF CHARACTERISTICS Zero Gate Voltage Drain Current IDSS Gate−to−Source Leakage Current V 15 VGS = 0 V, VDS = 24 V mV/°C TJ = 25°C 1.0 TJ = 125°C 10 IGSS VDS = 0 V, VGS = ±20 V VGS(TH) VGS = VDS, ID = 250 mA mA ±100 nA 2.2 V ON CHARACTERISTICS (Note 5) Gate Threshold Voltage Negative Threshold Temperature Coefficient VGS(TH)/TJ Drain−to−Source On Resistance RDS(on) 4.0 VGS = 10 V VGS = 4.5 V Forward Transconductance gFS 1.2 ID = 20 A 5.1 ID = 10 A 5.1 ID = 20 A 7.6 ID = 10 A 7.5 VDS = 1.5 V, ID = 15 A mV/°C 7.2 mW 11 29.3 S 1386 pF CHARGES AND CAPACITANCES Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss 23 Total Gate Charge QG(TOT) 9.2 Threshold Gate Charge QG(TH) Gate−to−Source Charge QGS Gate−to−Drain Charge QGD Total Gate Charge QG(TOT) VGS = 0 V, f = 1.0 MHz, VDS = 15 V VGS = 4.5 V, VDS = 15 V, ID = 20 A 440 nC 2.3 4.5 1.35 VGS = 10 V, VDS = 15 V, ID = 20 A 20.4 nC 10.6 ns SWITCHING CHARACTERISTICS (Note 6) Turn−On Delay Time Rise Time Turn−Off Delay Time Fall Time td(on) tr td(off) VGS = 4.5 V, VDS = 15 V, ID = 15 A, RG = 3.0 W tf 21 17.7 2.96 5. Pulse Test: pulse width = 300 ms, duty cycle v 2%. 6. Switching characteristics are independent of operating junction temperatures. http://onsemi.com 2 NTTFS4943N ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter Symbol Test Condition Min Typ Max Unit SWITCHING CHARACTERISTICS (Note 6) Turn−On Delay Time Rise Time Turn−Off Delay Time Fall Time td(on) tr td(off) ns 7.6 VGS = 10 V, VDS = 15 V, ID = 15 A, RG = 3.0 W tf 19.5 22 2.6 DRAIN−SOURCE DIODE CHARACTERISTICS Forward Diode Voltage Reverse Recovery Time VSD TJ = 25°C 0.88 TJ = 125°C 0.78 tRR Charge Time ta Discharge Time tb Reverse Recovery Charge VGS = 0 V, IS = 20 A 1.2 ns 26.2 VGS = 0 V, dIS/dt = 100 A/ms, IS = 20 A V 13.2 13 QRR 17 nC Source Inductance LS 0.38 nH Drain Inductance LD Gate Inductance LG Gate Resistance RG PACKAGE PARASITIC VALUES TA = 25°C 0.054 1.3 1.1 5. Pulse Test: pulse width = 300 ms, duty cycle v 2%. 6. Switching characteristics are independent of operating junction temperatures. http://onsemi.com 3 2.0 W NTTFS4943N TYPICAL CHARACTERISTICS 70 4.5 V 4.0 V 10 V 3.4 V 40 3.2 V 30 3.0 V 20 2.8 V 10 RDS(on), DRAIN−TO−SOURCE RESISTANCE (W) 0 45 40 35 30 25 1 2 4 3 15 10 5 0 1.0 5 2.5 2.0 3.0 3.5 Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics 0.050 0.040 0.030 0.020 0.010 3 4 5 6 7 8 9 VGS, GATE−TO−SOURCE VOLTAGE (V) 10 TJ = 25°C 0.009 0.008 VGS = 4.5 V 0.007 0.006 VGS = 10 V 0.005 0.004 10 20 30 40 50 60 70 80 90 100 ID, DRAIN CURRENT (A) Figure 4. On−Resistance vs. Drain Current and Gate Voltage 10,000 IDSS, LEAKAGE (nA) 1.9 1.8 ID = 20 A 1.7 VGS = 10 V 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 −50 −25 0 4.0 0.010 Figure 3. On−Resistance vs. VGS RDS(on), DRAIN−TO−SOURCE RESISTANCE (NORMALIZED) 1.5 TJ = −55°C VGS, GATE−TO−SOURCE VOLTAGE (V) ID = 20 A TJ = 25°C 2 TJ = 125°C VDS, DRAIN−TO−SOURCE VOLTAGE (V) 0.060 0.000 TJ = 25°C 20 2.6 V 2.4 V 0 VDS ≥ 10 V 50 ID, DRAIN CURRENT (A) 3.6 V 50 RDS(on), DRAIN−TO−SOURCE RESISTANCE (W) ID, DRAIN CURRENT (A) 60 60 55 TJ = 25°C VGS = 0 V TJ = 150°C 1000 TJ = 125°C 100 TJ = 85°C 25 50 75 100 125 150 10 5 10 15 20 25 TJ, JUNCTION TEMPERATURE (°C) VDS, DRAIN−TO−SOURCE VOLTAGE (V) Figure 5. On−Resistance Variation with Temperature Figure 6. Drain−to−Source Leakage Current vs. Voltage http://onsemi.com 4 30 NTTFS4943N TYPICAL CHARACTERISTICS 1600 C, CAPACITANCE (pF) VGS = 0 V TJ = 25°C Ciss 1400 VGS, GATE−TO−SOURCE VOLTAGE (V) 1800 1200 1000 800 Coss 600 400 200 0 Crss 0 5 10 15 20 25 30 8 TJ = 25°C 7 6 5 Qgd 4 Qgs 3 VDD = 15 V VGS = 10 V ID = 20 A 2 1 0 0 2 4 8 6 10 12 14 16 18 Figure 7. Capacitance Variation Figure 8. Gate−to−Source and Drain−to−Source Voltage vs. Total Charge 20 30 IS, SOURCE CURRENT (A) VGS = 0 V td(off) 100 t, TIME (ns) 9 Qg, TOTAL GATE CHARGE (nC) VDD = 15 V ID = 15 A VGS = 10 V tf tr td(on) 10 1 10 15 10 5 TJ = 25°C 0.5 0.6 0.7 0.8 0.9 1.0 Figure 9. Resistive Switching Time Variation vs. Gate Resistance Figure 10. Diode Forward Voltage vs. Current 10 ms 100 ms 1 ms 10 ms VGS = 20 V Single Pulse TC = 25°C dc RDS(on) Limit Thermal Limit Package Limit 0.1 1 10 EAS, SINGLE PULSE DRAIN−TO− SOURCE AVALANCHE ENERGY (mJ) 0.01 0.01 TJ = 125°C VSD, SOURCE−TO−DRAIN VOLTAGE (V) 10 0.1 20 RG, GATE RESISTANCE (W) 100 1 25 0 0.4 100 1000 ID, DRAIN CURRENT (A) QT VDS, DRAIN−TO−SOURCE VOLTAGE (V) 1000 1 11 10 100 40 ID = 25 A 30 20 10 0 25 50 75 100 125 VDS, DRAIN−TO−SOURCE VOLTAGE (V) TJ, STARTING JUNCTION TEMPERATURE (°C) Figure 11. Maximum Rated Forward Biased Safe Operating Area Figure 12. Maximum Avalanche Energy vs. Starting Junction Temperature http://onsemi.com 5 150 NTTFS4943N TYPICAL CHARACTERISTICS 100 Duty Cycle = 50% R(t) (°C/W) 10 20% 10% 5% 1 2% 1% 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 0.001 0.1 0.01 PULSE TIME (sec) Figure 13. Thermal Response http://onsemi.com 6 1 10 100 1000 NTTFS4943N PACKAGE DIMENSIONS WDFN8 3.3x3.3, 0.65P CASE 511AB−01 ISSUE B 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS. 0.20 C D A D1 B 2X DIM A A1 b c D D1 D2 E E1 E2 e G K L L1 M q 0.20 C 8 7 6 5 4X E1 E 1 2 3 4 q c TOP VIEW A1 0.10 C A 0.10 C e SIDE VIEW 0.10 8X b C A B 0.05 c L C 6X DETAIL A SEATING PLANE DETAIL A INCHES NOM 0.030 −−− 0.012 0.008 0.130 BSC 0.116 0.120 0.078 0.083 0.130 BSC 0.116 0.120 0.058 0.063 0.026 BSC 0.012 0.016 0.025 −−− 0.012 0.017 0.002 0.005 0.055 0.059 0_ −−− MIN 0.028 0.000 0.009 0.006 MAX 0.031 0.002 0.016 0.010 0.124 0.088 0.124 0.068 0.020 −−− 0.022 0.008 0.063 12 _ SOLDERING FOOTPRINT* 8X 0.42 e/2 1 4 E2 0.65 PITCH PACKAGE OUTLINE K 4X 0.66 M 5 8 G MILLIMETERS MIN NOM MAX 0.70 0.75 0.80 0.00 −−− 0.05 0.23 0.30 0.40 0.15 0.20 0.25 3.30 BSC 2.95 3.05 3.15 1.98 2.11 2.24 3.30 BSC 2.95 3.05 3.15 1.47 1.60 1.73 0.65 BSC 0.30 0.41 0.51 0.64 −−− −−− 0.30 0.43 0.56 0.06 0.13 0.20 1.40 1.50 1.60 0_ −−− 12 _ D2 L1 3.60 BOTTOM VIEW 0.75 2.30 0.57 0.47 2.37 3.46 DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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