Freescale MC908QB8CDWE M68hc08 microcontroller Datasheet

MC68HC908QB8
MC68HC908QB4
MC68HC908QY8
Data Sheet
M68HC08
Microcontrollers
MC68HC908QB8
Rev. 3
04/2010
freescale.com
MC68HC908QB8
MC68HC908QB4
MC68HC908QY8
Data Sheet
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MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
3
Revision History
The following revision history table summarizes changes contained in this document. For your
convenience, the page number designators have been linked to the appropriate location.
Revision History
Date
Revision
Level
September,
2005
1
April,
2007
April,
2010
2
3
Page
Number(s)
Description
Initial full release
N/A
Chapter 3 Analog-to-Digital Converter (ADC10) Module — Renamed ADCSC
register to ADSCR to be consistent with development tools.
37
Figure 4-1. Auto Wakeup Interrupt Request Generation Logic — Changed
BUSCLK4 to BUSCLK2 and removed reference to CGMXCLK
51
4.3 Functional Description — Reworked for clarity
52
4.6.4 Configuration Register 2 — Changed BUSCLK4 to BUSCLK2
55
4.6.5 Configuration Register 1 — Changed BUSCLK4 to BUSCLK2, added
bit description for SSREC, and removed SSREC from the note
56
Chapter 5 Configuration Register (CONFIG) — Changed CGMXCLK to
BUSCLKX4
57
Chapter 13 Enhanced Serial Communications Interface (ESCI) Module —
Changed SCIBDSRC to ESCIBDSRC, CGMXCLK to BUSCLKX4, and
BUS_CLK to BUS CLOCK
109
Table 13-5. ESCI LIN Control Bits — Corrected Functionality column
130
13.9.3 Bit Time Measurement — Corrected first sentence of listing number 1
136
Figure 17-18. Monitor Mode Entry Timing — Changed CGMXCLK to
BUSCLKX4
206
Clarify internal oscillator trim register information.
29, 36, 96,
101
MC68HC908QB8 Data Sheet, Rev. 3
4
Freescale Semiconductor
List of Chapters
Chapter 1
General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Chapter 2
Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Chapter 3
Analog-to-Digital Converter (ADC10) Module . . . . . . . . . . . . . . . . . . . . . . . . . 37
Chapter 4
Auto Wakeup Module (AWU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Chapter 5
Configuration Register (CONFIG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Chapter 6
Computer Operating Properly (COP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Chapter 7
Central Processor Unit (CPU). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Chapter 8
External Interrupt (IRQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Chapter 9
Keyboard Interrupt Module (KBI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .83
Chapter 10
Low-Voltage Inhibit (LVI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89
Chapter 11
Oscillator Module (OSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93
Chapter 12
Input/Output Ports (PORTS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Chapter 13
Enhanced Serial Communications Interface (ESCI) Module . . . . . . . . . . . . 109
Chapter 14
System Integration Module (SIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .139
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
5
List of Chapters
Chapter 15
Serial Peripheral Interface (SPI) Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155
Chapter 16
Timer Interface Module (TIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175
Chapter 17
Development Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
Chapter 18
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .207
Chapter 19
Ordering Information and Mechanical Specifications . . . . . . . . . . . . . . . . . 227
MC68HC908QB8 Data Sheet, Rev. 3
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Freescale Semiconductor
Table of Contents
Chapter 1
General Description
1.1
1.2
1.3
1.4
1.5
1.6
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MCU Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Function Priority. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17
17
19
20
20
22
Chapter 2
Memory
2.1
2.2
2.3
2.4
2.5
2.6
2.6.1
2.6.2
2.6.3
2.6.4
2.6.5
2.6.6
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Unimplemented Memory Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reserved Memory Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Direct Page Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Random-Access Memory (RAM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FLASH Memory (FLASH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FLASH Control Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FLASH Page Erase Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FLASH Mass Erase Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FLASH Program Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FLASH Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FLASH Block Protect Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
23
23
23
23
30
31
31
32
33
33
34
36
Chapter 3
Analog-to-Digital Converter (ADC10) Module
3.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.1
Clock Select and Divide Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.2
Input Select and Pin Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.3
Conversion Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.3.1
Initiating Conversions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.3.2
Completing Conversions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.3.3
Aborting Conversions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.3.4
Total Conversion Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.4
Sources of Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.4.1
Sampling Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
37
37
37
39
40
40
40
40
40
41
42
42
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
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Table of Contents
3.3.4.2
Pin Leakage Error. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.4.3
Noise-Induced Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.4.4
Code Width and Quantization Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.4.5
Linearity Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.4.6
Code Jitter, Non-Monotonicity and Missing Codes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.1
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.2
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6
ADC10 During Break Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7
I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.1
ADC10 Analog Power Pin (VDDA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.2
ADC10 Analog Ground Pin (VSSA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.3
ADC10 Voltage Reference High Pin (VREFH). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.4
ADC10 Voltage Reference Low Pin (VREFL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.5
ADC10 Channel Pins (ADn). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.1
ADC10 Status and Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.2
ADC10 Result High Register (ADRH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.3
ADC10 Result Low Register (ADRL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.4
ADC10 Clock Register (ADCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
42
42
43
43
43
44
44
44
44
44
45
45
45
45
45
46
46
46
48
48
49
Chapter 4
Auto Wakeup Module (AWU)
4.1
4.2
4.3
4.4
4.5
4.5.1
4.5.2
4.6
4.6.1
4.6.2
4.6.3
4.6.4
4.6.5
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Port A I/O Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Keyboard Status and Control Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Keyboard Interrupt Enable Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Configuration Register 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Configuration Register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
51
51
52
52
53
53
53
53
53
54
54
55
55
Chapter 5
Configuration Register (CONFIG)
5.1
5.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Chapter 6
Computer Operating Properly (COP)
MC68HC908QB8 Data Sheet, Rev. 3
8
Freescale Semiconductor
6.1
6.2
6.3
6.3.1
6.3.2
6.3.3
6.3.4
6.3.5
6.3.6
6.3.7
6.4
6.5
6.6
6.6.1
6.6.2
6.7
6.8
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BUSCLKX4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
STOP Instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
COPCTL Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power-On Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
COPD (COP Disable). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
COPRS (COP Rate Select) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Monitor Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
COP Module During Break Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
61
61
62
62
62
62
62
62
62
63
63
63
63
63
63
63
63
Chapter 7
Central Processor Unit (CPU)
7.1
7.2
7.3
7.3.1
7.3.2
7.3.3
7.3.4
7.3.5
7.4
7.5
7.5.1
7.5.2
7.6
7.7
7.8
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CPU Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Index Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stack Pointer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Program Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Condition Code Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Arithmetic/Logic Unit (ALU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CPU During Break Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Opcode Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
65
65
65
66
66
67
67
68
69
69
69
69
69
70
75
Chapter 8
External Interrupt (IRQ)
8.1
8.2
8.3
8.3.1
8.3.2
8.4
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MODE = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MODE = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
77
77
77
79
79
80
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
9
Table of Contents
8.5
8.5.1
8.5.2
8.6
8.7
8.7.1
8.8
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IRQ Module During Break Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IRQ Input Pins (IRQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
80
80
80
80
80
80
81
Chapter 9
Keyboard Interrupt Module (KBI)
9.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.2
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.3
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.3.1
Keyboard Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.3.1.1
MODEK = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.3.1.2
MODEK = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.3.2
Keyboard Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.4
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.5
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.5.1
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.5.2
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.6
KBI During Break Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.7
I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.7.1
KBI Input Pins (KBIx:KBI0). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.8
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.8.1
Keyboard Status and Control Register (KBSCR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.8.2
Keyboard Interrupt Enable Register (KBIER). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.8.3
Keyboard Interrupt Polarity Register (KBIPR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
83
83
83
83
84
85
86
86
86
86
86
86
87
87
87
87
88
88
Chapter 10
Low-Voltage Inhibit (LVI)
10.1
10.2
10.3
10.3.1
10.3.2
10.3.3
10.3.4
10.4
10.5
10.5.1
10.5.2
10.6
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Polled LVI Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Forced Reset Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LVI Hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LVI Trip Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LVI Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
89
89
89
90
90
90
90
91
91
91
91
91
MC68HC908QB8 Data Sheet, Rev. 3
10
Freescale Semiconductor
Chapter 11
Oscillator Module (OSC)
11.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
11.2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
11.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
11.3.1
Internal Signal Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
11.3.1.1
Oscillator Enable Signal (SIMOSCEN). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
11.3.1.2
XTAL Oscillator Clock (XTALCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
11.3.1.3
RC Oscillator Clock (RCCLK). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
11.3.1.4
Internal Oscillator Clock (INTCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
11.3.1.5
Bus Clock Times 4 (BUSCLKX4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
11.3.1.6
Bus Clock Times 2 (BUSCLKX2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
11.3.2
Internal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
11.3.2.1
Internal Oscillator Trimming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
11.3.2.2
Internal to External Clock Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
11.3.2.3
External to Internal Clock Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
11.3.3
External Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
11.3.4
XTAL Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
11.3.5
RC Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
11.4 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
11.5 Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
11.5.1
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
11.5.2
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
11.6 OSC During Break Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
11.7 I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
11.7.1
Oscillator Input Pin (OSC1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
11.7.2
Oscillator Output Pin (OSC2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
11.8 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
11.8.1
Oscillator Status and Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
11.8.2
Oscillator Trim Register (OSCTRIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Chapter 12
Input/Output Ports (PORTS)
12.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.2 Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.2.1
Port A Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.2.2
Data Direction Register A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.2.3
Port A Input Pullup Enable Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.2.4
Port A Summary Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.3 Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.3.1
Port B Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.3.2
Data Direction Register B. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.3.3
Port B Input Pullup Enable Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.3.4
Port B Summary Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
103
103
104
104
105
106
106
106
107
108
108
Chapter 13
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
11
Table of Contents
Enhanced Serial Communications Interface (ESCI) Module
13.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3.1
Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3.2
Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3.2.1
Character Length . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3.2.2
Character Transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3.2.3
Break Characters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3.2.4
Idle Characters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3.2.5
Inversion of Transmitted Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3.3
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3.3.1
Character Length . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3.3.2
Character Reception. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3.3.3
Data Sampling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3.3.4
Framing Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3.3.5
Baud Rate Tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3.3.6
Receiver Wakeup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.4 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.4.1
Transmitter Interrupts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.4.2
Receiver Interrupts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.4.3
Error Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.5 Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.5.1
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.5.2
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.6 ESCI During Break Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.7 I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.7.1
ESCI Transmit Data (TxD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.7.2
ESCI Receive Data (RxD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.8 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.8.1
ESCI Control Register 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.8.2
ESCI Control Register 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.8.3
ESCI Control Register 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.8.4
ESCI Status Register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.8.5
ESCI Status Register 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.8.6
ESCI Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.8.7
ESCI Baud Rate Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.8.8
ESCI Prescaler Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.9 ESCI Arbiter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.9.1
ESCI Arbiter Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.9.2
ESCI Arbiter Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.9.3
Bit Time Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.9.4
Arbitration Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
109
109
111
112
112
113
113
113
114
114
114
114
114
116
117
117
119
119
120
120
120
120
120
121
121
121
121
121
121
122
123
125
126
129
129
130
131
135
135
136
136
138
Chapter 14
System Integration Module (SIM)
MC68HC908QB8 Data Sheet, Rev. 3
12
Freescale Semiconductor
14.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.2 RST and IRQ Pins Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.3 SIM Bus Clock Control and Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.3.1
Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.3.2
Clock Start-Up from POR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.3.3
Clocks in Stop Mode and Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.4 Reset and System Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.4.1
External Pin Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.4.2
Active Resets from Internal Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.4.2.1
Power-On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.4.2.2
Computer Operating Properly (COP) Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.4.2.3
Illegal Opcode Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.4.2.4
Illegal Address Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.4.2.5
Low-Voltage Inhibit (LVI) Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.5 SIM Counter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.5.1
SIM Counter During Power-On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.5.2
SIM Counter During Stop Mode Recovery. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.5.3
SIM Counter and Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.6 Exception Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.6.1
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.6.1.1
Hardware Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.6.1.2
SWI Instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.6.2
Interrupt Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.6.2.1
Interrupt Status Register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.6.2.2
Interrupt Status Register 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.6.2.3
Interrupt Status Register 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.6.3
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.6.4
Break Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.6.5
Status Flag Protection in Break Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.7 Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.7.1
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.7.2
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.8 SIM Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.8.1
SIM Reset Status Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.8.2
Break Flag Control Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
139
139
140
141
141
141
141
141
142
143
143
143
144
144
144
144
144
144
145
145
145
148
148
149
149
149
150
150
150
150
150
151
152
152
153
Chapter 15
Serial Peripheral Interface (SPI) Module
15.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.3.1
Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.3.2
Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.3.3
Transmission Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.3.3.1
Clock Phase and Polarity Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.3.3.2
Transmission Format When CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
155
155
157
158
158
159
159
159
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
13
Table of Contents
15.3.3.3
Transmission Format When CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.3.3.4
Transmission Initiation Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.3.4
Queuing Transmission Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.3.5
Resetting the SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.3.6
Error Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.3.6.1
Overflow Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.3.6.2
Mode Fault Error. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.4 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.5 Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.5.1
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.5.2
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.6 SPI During Break Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.7 I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.7.1
MISO (Master In/Slave Out). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.7.2
MOSI (Master Out/Slave In). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.7.3
SPSCK (Serial Clock) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.7.4
SS (Slave Select) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.8 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.8.1
SPI Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.8.2
SPI Status and Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.8.3
SPI Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
160
161
163
164
164
164
166
167
168
168
168
168
169
169
169
169
169
170
171
172
174
Chapter 16
Timer Interface Module (TIM)
16.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.3.1
TIM Counter Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.3.2
Input Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.3.3
Output Compare. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.3.3.1
Unbuffered Output Compare . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.3.3.2
Buffered Output Compare . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.3.4
Pulse Width Modulation (PWM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.3.4.1
Unbuffered PWM Signal Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.3.4.2
Buffered PWM Signal Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.3.4.3
PWM Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.4 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.5 Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.5.1
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.5.2
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.6 TIM During Break Interrupts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.7 I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.7.1
TIM Channel I/O Pins (TCH3:TCH0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.7.2
TIM Clock Pin (TCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.8 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16.8.1
TIM Status and Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
175
175
175
175
176
177
178
178
179
179
180
181
182
182
182
182
182
183
183
183
183
183
MC68HC908QB8 Data Sheet, Rev. 3
14
Freescale Semiconductor
16.8.2
16.8.3
16.8.4
16.8.5
TIM Counter Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TIM Counter Modulo Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TIM Channel Status and Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TIM Channel Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
185
185
186
188
Chapter 17
Development Support
17.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.2 Break Module (BRK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.2.1
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.2.1.1
Flag Protection During Break Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.2.1.2
TIM During Break Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.2.1.3
COP During Break Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.2.2
Break Module Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.2.2.1
Break Status and Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.2.2.2
Break Address Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.2.2.3
Break Auxiliary Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.2.2.4
Break Status Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.2.2.5
Break Flag Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.2.3
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.3 Monitor Module (MON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.3.1
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.3.1.1
Normal Monitor Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.3.1.2
Forced Monitor Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.3.1.3
Monitor Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.3.1.4
Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.3.1.5
Break Signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.3.1.6
Baud Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.3.1.7
Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.3.2
Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
191
191
191
193
193
193
194
194
194
195
195
195
196
196
196
200
201
201
202
202
202
202
206
Chapter 18
Electrical Specifications
18.1
18.2
18.3
18.4
18.5
18.6
18.7
18.8
18.9
18.10
18.11
18.12
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5-V DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical 5-V Output Drive Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5-V Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-V DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical 3-V Output Drive Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-V Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Oscillator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply Current Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
207
207
208
208
209
210
211
212
213
214
215
217
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
15
Table of Contents
18.13
18.14
18.15
18.16
18.17
ADC10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.0-Volt SPI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.0-Volt SPI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Timer Interface Module Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
219
221
222
225
226
Chapter 19
Ordering Information and Mechanical Specifications
19.1
19.2
19.3
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
MC68HC908QB8 Data Sheet, Rev. 3
16
Freescale Semiconductor
Chapter 1
General Description
1.1 Introduction
The MC68HC908QB8 is a member of the low-cost, high-performance M68HC08 Family of 8-bit
microcontroller units (MCUs). All MCUs in the family use the enhanced M68HC08 central processor unit
(CPU08) and are available with a variety of modules, memory sizes and types, and package types.
0.4
Table 1-1. Summary of Device Variations
Device
FLASH/RAM
Memory Size
ADC
16-Bit Timer
Channels
ESCI
SPI
Pin
Count
MC68HC908QB8
8K/256 bytes
10 channel, 10 bit
4
Yes
Yes
16 pins
MC68HC908QB4
4K/128 bytes
10 channel, 10 bit
4
Yes
Yes
16 pins
MC68HC908QY8
8K/256 bytes
4 channel, 10 bit
2
No
No
16 pins
1.2 Features
Features include:
• High-performance M68HC08 CPU core
• Fully upward-compatible object code with M68HC05 Family
• 5-V and 3-V operating voltages (VDD)
• 8-MHz internal bus operation at 5 V, 4-MHz at 3 V
• Trimmable internal oscillator
– Software selectable 1 MHz, 2 MHz, or 3.2 MHz internal bus operation
– 8-bit trim capability
– ± 25% untrimmed
– Trimmable to approximately 0.4%(1)
• Software selectable crystal oscillator range, 32–100 kHz, 1–8 MHz, and 8–32 MHz
• Software configurable input clock from either internal or external source
• Auto wakeup from STOP capability using dedicated internal 32-kHz RC or bus clock source
• On-chip in-application programmable FLASH memory
– Internal program/erase voltage generation
– Monitor ROM containing user callable program/erase routines
– FLASH security(2)
1. See 18.11 Oscillator Characteristics for internal oscillator specifications
2. No security feature is absolutely secure. However, Freescale’s strategy is to make reading or copying the FLASH difficult for
unauthorized users.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
17
General Description
•
•
•
•
•
•
•
•
•
•
•
•
•
•
On-chip random-access memory (RAM)
Enhanced serial communications interface (ESCI) module
Serial peripheral interface (SPI) module
4-channel, 16-bit timer interface (TIM) module
10-channel, 10-bit analog-to-digital converter (ADC) with internal bandgap reference channel
(ADC10)
Up to 13 bidirectional input/output (I/O) lines and one input only:
– Six shared with KBI
– Ten shared with ADC
– Four shared with TIM
– Two shared with ESCI
– Four shared with SPI
– One input only shared with IRQ
– High current sink/source capability on all port pins
– Selectable pullups on all ports, selectable on an individual bit basis
– Three-state ability on all port pins
6-bit keyboard interrupt with wakeup feature (KBI)
– Programmable for rising/falling or high/low level detect
Low-voltage inhibit (LVI) module features:
– Software selectable trip point
System protection features:
– Computer operating properly (COP) watchdog
– Low-voltage detection with reset
– Illegal opcode detection with reset
– Illegal address detection with reset
External asynchronous interrupt pin with internal pullup (IRQ) shared with general-purpose input
pin
Master asynchronous reset pin with internal pullup (RST) shared with general-purpose input/output
(I/O) pin
Memory mapped I/O registers
Power saving stop and wait modes
MC68HC908QB8, MC68HC908QB4 and MC68HC908QY8 are available in these packages:
– 16-pin plastic dual in-line package (PDIP)
– 16-pin small outline integrated circuit (SOIC) package
– 16-pin thin shrink small outline packages (TSSOP)
Features of the CPU08 include the following:
• Enhanced HC05 programming model
• Extensive loop control functions
• 16 addressing modes (eight more than the HC05)
• 16-bit index register and stack pointer
• Memory-to-memory data transfers
• Fast 8 × 8 multiply instruction
• Fast 16/8 divide instruction
• Binary-coded decimal (BCD) instructions
• Optimization for controller applications
• Efficient C language support
MC68HC908QB8 Data Sheet, Rev. 3
18
Freescale Semiconductor
MCU Block Diagram
1.3 MCU Block Diagram
Figure 1-1 shows the structure of the MC68HC908QB8.
PTA0/TCH0/AD0/KBI0
CLOCK
GENERATOR
PTA3/RST/KBI3
PTA
PTA2/IRQ/KBI2/TCLK
DDRA
PTA1/TCH1/AD1/KBI1
KEYBOARD INTERRUPT
MODULE
PTA4/OSC2/AD2/KBI4
PTA5/OSC1/AD3/KBI5
SINGLE INTERRUPT
MODULE
AUTO WAKEUP
MODULE
DDRB
PTB0/SPSCK/AD4
PTB1/MOSI/AD5
PTB2/MISO/AD6
PTB3/SS/AD7
PTB4/RxD/AD8
PTB5/TxD/AD9
PTB6/TCH2
PTB7/TCH3
PTB
M68HC08 CPU
LOW-VOLTAGE
INHIBIT
4-CHANNEL 16-BIT
TIMER MODULE
MC68HC908QB8
MC68HC908QB8
256 BYTES
8192 BYTES
USER RAM
USER FLASH
10-CHANNEL
10-BIT ADC
ENHANCED SERIAL
COMMUNICATIONS
INTERFACE MODULE
VDD
POWER SUPPLY
COP
MODULE
VSS
SERIAL PERIPHERAL
INTERFACE
DEVELOPMENT SUPPORT
MONITOR ROM
BREAK MODULE
RST, IRQ: Pins have internal pull up device
All port pins have programmable pull up device
PTA[0:5]: Higher current sink and source capability
Figure 1-1. Block Diagram
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
19
General Description
1.4 Pin Assignments
The MC68HC908QB8, MC68HC908QB4, and MC68HC908QY8 are available in 16-pin packages.
Figure 1-2 shows the pin assignment for these packages.
VDD
1
16
VSS
PTB7
2
15
PTB0
PTB6
3
14
PTB1
PTA5/OSC1/AD3/KBI5
4
13
PTA0/TCH0/AD0/KBI0
PTA4/OSC2/AD2/KBI4
5
12
PTA1/TCH1/AD1/KBI1
PTB5
6
11
PTB2
PTB4
7
10
PTB3
PTA3/RST/KBI3
8
9
PTA2/IRQ/KBI2/TCLK
PTA0/TCH0/AD0/KBI0
PTB1
PTB0
VSS
VDD
PTB7
PTB6
PTA5/OSC1/AD3/KBI5
1
2
3
4
5
6
7
8
PTA1/TCH1/AD1/KBI1
PTB2
PTB3
PTA2/IRQ/KBI2/TCLK
PTA3/RST/KBI3
PTB4
PTB5
PTA4/OSC2/AD2/KBI4
16
15
14
13
12
11
10
9
16-PIN ASSIGNMENT
MC68HC908QY8 TSSOP
16-PIN ASSIGNMENT
MC68HC908QY8 PDIP/SOIC
VDD
1
16
VSS
PTB7/TCH3
2
15
PTB0/SCK/AD4
PTB6/TCH2
3
14
PTB1/MOSI/AD5
PTA5/OSC1/AD3/KBI5
4
13
PTA0/TCH0/AD0/KBI0
PTA4/OSC2/AD2/KBI4
5
12
PTA1/TCH1/AD1/KBI1
PTB5/Tx/AD9
6
11
PTB2/MISO/AD6
PTB4/Rx/AD8
7
10
PTB3/SS/AD7
PTA3/RST/KBI3
8
9
PTA2/IRQ/KBI2/TCLK
PTA1/TCH1/AD1/KBI1
16
PTB2/MISO/AD6
15
PTB3/SS/AD7
14
PTA2/IRQ/KBI2/TCLK
13
PTA3/RST/KBI3
12
PTB4//Rx/AD8
11
PTB5/Tx/AD9
10
PTA4/OSC2/AD2/KBI4
9
16-PIN ASSIGNMENT
MC68HC908QB8/MC68HC908QB4 TSSOP
PTA0/TCH0/AD0/KBI0
PTB1/MOSI/AD5
PTB0/SCK/AD4
VSS
VDD
PTB7/TCH3
PTB6/TCH2
PTA5/OSC1/AD3/KBI5
16-PIN ASSIGNMENT
MC68HC908QB8/MC68HC908QB4 PDIP/SOIC
1
2
3
4
5
6
7
8
Figure 1-2. MCU Pin Assignments
1.5 Pin Functions
Table 1-2 provides a description of the pin functions.
MC68HC908QB8 Data Sheet, Rev. 3
20
Freescale Semiconductor
Pin Functions
Table 1-2. Pin Functions
Pin
Name
Description
Input/Output
VDD
Power supply
Power
VSS
Power supply ground
Power
PTA0
PTA1
PTA2
PTA0 — General purpose I/O port
Input/Output
TCH0 — Timer Channel 0 I/O
Input/Output
AD0 — A/D channel 0 input
Input
KBI0 — Keyboard interrupt input 0
Input
PTA1 — General purpose I/O port
Input/Output
TCH1 — Timer Channel 1 I/O
Input/Output
AD1 — A/D channel 1 input
Input
KBI1 — Keyboard interrupt input 1
Input
PTA2 — General purpose input-only port
Input
IRQ — External interrupt with programmable pullup and Schmitt trigger input
Input
KBI2 — Keyboard interrupt input 2
Input
TCLK — Timer clock input
Input
PTA3 — General purpose I/O port
PTA3
PTA4
PTA5
PTB0
RST — Reset input, active low with internal pullup and Schmitt trigger
KBI3 — Keyboard interrupt input 3
Input
Input/Output
OSC2 —XTAL oscillator output (XTAL option only)
RC or internal oscillator output (OSC2EN = 1 in PTAPUE register)
Input
KBI4 — Keyboard interrupt input 4
Input
PTA5 — General purpose I/O port
Input/Output
OSC1 — XTAL, RC, or external oscillator input
Input
AD3 — A/D channel 3 input
Input
KBI5 — Keyboard interrupt input 5
Input
PTB0 — General-purpose I/O port
Input/Output
SPSCK — SPI serial clock
Input/Output
Input
PTB1 — General-purpose I/O port
Input/Output
MOSI — SPI Master out Slave in
Input/Output
Input
PTB2 — General-purpose I/O port
Input/Output
MISO — SPI Master in Slave out
Input/Output
AD6 — A/D channel 6 input
Input
PTB3 — General-purpose I/O port
PTB3
Output
Output
AD2 — A/D channel 2 input
AD5 — A/D channel 5 input
PTB2
Input
PTA4 — General purpose I/O port
AD4 — A/D channel 4 input
PTB1
Input/Output
Input/Output
SS — SPI slave select
Input
AD7 — A/D channel 7 input
Input
— Continued on next page
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
21
General Description
Table 1-2. Pin Functions (Continued)
Pin
Name
PTB4
Description
Input/Output
PTB4 — General-purpose I/O port
Input/Output
RxD — ESCI receive data I/O
Input/Output
AD8 — A/D channel 8 input
Input
PTB5 — General-purpose I/O port
PTB5
Input/Output
TxD — ESCI transmit data I/O
Output
AD9 — A/D channel 9 input
Input
PTB6 — General-purpose I/O port
PTB6
PTB7
Input/Output
TCH2 — Timer channel 2 I/O
Input/Output
PTB7 — General-purpose I/O port
Input/Output
TCH3 — Timer channel 3 I/O
Input/Output
1.6 Pin Function Priority
Table 1-3 is meant to resolve the priority if multiple functions are enabled on a single pin.
NOTE
Upon reset all pins come up as input ports regardless of the priority table.
Table 1-3. Function Priority in Shared Pins
Pin Name
Highest-to-Lowest Priority Sequence
PTA0(1)
AD0 → TCH0 → KBI0 → PTA0
PTA1(1)
AD1 → TCH1 → KBI1 → PTA1
PTA2
IRQ → TCLK → KBI2 → PTA2
PTA3
RST → KBI3 → PTA3
PTA4(1)
OSC2 → AD2 → KBI4 → PTA4
PTA5(1)
OSC1 → AD3 → KBI5 → PTA5
PTB0(1)
AD4 → SPSCK → PTB0
(1)
PTB1
AD5 → MOSI → PTB1
PTB2(1)
AD6 → MISO → PTB2
PTB3(1)
AD7 → SS → PTB3
(1)
PTB4
AD8 → RxD → PTB4
PTB5(1)
AD9 → TxD → PTB5
PTB6
TCH2 → PTB6
PTB7
TCH3 → PTB7
1. When a pin is to be used as an ADC pin, the I/O port function should be left as
an input and all other shared modules should be disabled. The ADC does not
override additional modules using the pin.
MC68HC908QB8 Data Sheet, Rev. 3
22
Freescale Semiconductor
Chapter 2
Memory
2.1 Introduction
The central processor unit (CPU08) can address 64 Kbytes of memory space. The memory map, shown
in Figure 2-1.
2.2 Unimplemented Memory Locations
Executing code from an unimplemented location will cause an illegal address reset. In Figure 2-1,
unimplemented locations are shaded.
2.3 Reserved Memory Locations
Accessing a reserved location can have unpredictable effects on MCU operation. In Figure 2-1, register
locations are marked with the word Reserved or with the letter R.
2.4 Direct Page Registers
Figure 2-2 shows the memory mapped registers of the MC68HC908QB8. Registers with addresses
between $0000 and $00FF are considered direct page registers and all instructions including those with
direct page addressing modes can access them. Registers between $0100 and $FFFF require non-direct
page addressing modes. See Chapter 7 Central Processor Unit (CPU) for more information on
addressing modes.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
23
Memory
$0000
↓
$003F
IDIRECT PAGE REGISTERS
64 BYTES
$0040
↓
$013F
RAM
256 BYTES
RESERVED
64 BYTES
$0040
↓
$007F
$0140
↓
$27FF
UNIMPLEMENTED
9920 BYTES
RAM
128 BYTES
$0080
↓
$00FF
$2800
↓
$2A1F
AUXILIARY ROM
544 BYTES
RESERVED
64 BYTES
$0100
↓
$013F
$2A20
↓
$2F7D
UNIMPLEMENTED
1374 BYTES
$2F7E
↓
$2FFF
AUXILIARY ROM
130 BYTES
$3000
↓
$DDFF
UNIMPLEMENTED
44,544 BYTES
$DE00
↓
$FDFF
FLASH MEMORY
8192 BYTES
RESERVED
4096 BYTES
$DE00
↓
$EDFF
$FE00
↓
$FE1F
MISCELLANEOUS REGISTERS
32 BYTES
FLASH MEMORY
4096 BYTES
$EE00
↓
$FDFF
$FE20
↓
$FF7D
MONITOR ROM
350 BYTES
$FF7E
↓
$FFAF
UNIMPLEMENTED
50BYTES
$FFB0
↓
$FFBD
FLASH
14 BYTES
$FFBE
↓
$FFC1
MISCELLANEOUS REGISTERS
4 BYTES
$FFC2
↓
$FFCF
FLASH
14 BYTES
$FFD0
↓
$FFFF
USER VECTORS
48 BYTES
MC68HC908QB8 and MC68HC908QY8
Memory Map
MC68HC908QB4
Memory Map
Figure 2-1. Memory Map
MC68HC908QB8 Data Sheet, Rev. 3
24
Freescale Semiconductor
Direct Page Registers
Addr.
$0000
$0001
$0002
↓
$0003
$0004
$0005
$0006
↓
$000A
$000B
$000C
$000D
$000E
$000F
$0010
$0011
$0012
$0013
Register Name
Port A Data Register Read:
(PTA) Write:
See page 104. Reset:
Port B Data Register Read:
(PTB) Write:
See page 106. Reset:
Bit 7
R
6
AWUL
5
4
3
PTA5
PTA4
PTA3
2
PTA2
1
Bit 0
PTA1
PTA0
PTB1
PTB0
DDRA1
DDRA0
Unaffected by reset
PTB7
PTB6
PTB5
PTB4
PTB3
PTB2
Unaffected by reset
Reserved
Data Direction Register A Read:
(DDRA) Write:
See page 104. Reset:
Data Direction Register B Read:
(DDRB) Write:
See page 107. Reset:
0
R
R
DDRA5
DDRA4
DDRA3
0
0
0
0
0
0
0
0
DDRB7
DDRB6
DDRB5
DDRB4
DDRB3
DDRB2
DDRB1
DDRB0
0
0
0
0
0
0
0
0
PTAPUE5
PTAPUE4
PTAPUE3
PTAPUE2
PTAPUE1
PTAPUE0
0
0
0
0
0
0
0
PTBPUE6
PTBPUE5
PTBPUE4
PTBPUE3
PTBPUE2
PTBPUE1
PTBPUE0
0
0
0
0
0
0
0
R
SPMSTR
CPOL
CPHA
SPWOM
SPE
SPTIE
0
1
OVRF
0
MODF
1
SPTE
0
0
0
MODFEN
SPR1
SPR0
0
R2
T2
0
R1
T1
0
R0
T0
Reserved
Port A Input Pullup Enable Read:
OSC2EN
Register (PTAPUE) Write:
See page 105. Reset:
0
Read:
Port B Input Pullup Enable
PTBPUE7
Register (PTBPUE) Write:
See page 108. Reset:
0
Read:
SPI Control Register
SPRIE
(SPCR) Write:
See page 171. Reset:
0
Read:
SPRF
SPI Status and Control
Register (SPSCR) Write:
See page 172. Reset:
0
Read:
R7
SPI Data Register
(SPDR) Write:
T7
See page 174. Reset:
ESCI Control Register 1 Read:
LOOPS
(SCC1) Write:
See page 122. Reset:
0
Read:
ESCI Control Register 2
SCTIE
(SCC2) Write:
See page 124. Reset:
0
Read:
R8
ESCI Control Register 3
(SCC3) Write:
See page 125. Reset:
U
Read:
SCTE
ESCI Status Register 1
(SCS1) Write:
See page 126. Reset:
1
0
ERRIE
0
R6
T6
0
R5
T5
ENSCI
TXINV
M
WAKE
ILTY
PEN
PTY
0
0
0
0
0
0
0
TCIE
SCRIE
ILIE
TE
RE
RWU
SBK
0
0
0
0
0
0
0
T8
R
R
ORIE
NEIE
FEIE
PEIE
0
TC
0
SCRF
0
IDLE
0
OR
0
NF
0
FE
0
PE
0
R
0
= Reserved
1
0
= Unimplemented
0
1
R4
R3
T4
T3
Unaffected by reset
0
0
U = Unaffected
0
Figure 2-2. Control, Status, and Data Registers (Sheet 1 of 5)
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
25
Memory
Addr.
$0014
$0015
$0016
$0017
$0018
$0019
$001A
$001B
$001C
$001D
$001E
$001F
$0020
$0021
Register Name
ESCI Status Register 2 Read:
(SCS2) Write:
See page 129. Reset:
ESCI Data Register Read:
(SCDR) Write:
See page 129. Reset:
ESCI Baud Rate Register Read:
(SCBR) Write:
See page 130. Reset:
ESCI Prescaler Register Read:
(SCPSC) Write:
See page 131. Reset:
ESCI Arbiter Control Read:
Register (SCIACTL) Write:
See page 135. Reset:
ESCI Arbiter Data Register Read:
(SCIADAT) Write:
See page 136. Reset:
Keyboard Status and Read:
Control Register (KBSCR) Write:
See page 87. Reset:
Keyboard Interrupt Read:
Enable Register (KBIER) Write:
See page 88. Reset:
Keyboard Interrupt Polarity Read:
Register (KBIPR) Write:
See page 88. Reset:
IRQ Status and Control Read:
Register (INTSCR) Write:
See page 81. Reset:
Configuration Register 2 Read:
(CONFIG2)(1) Write:
See page 57. Reset:
Configuration Register 1 Read:
(CONFIG1)(1) Write:
See page 58. Reset:
TIM Status and Control Read:
Register (TSC) Write:
See page 183. Reset:
TIM Counter Register High Read:
(TCNTH) Write:
See page 185. Reset:
Bit 7
0
6
0
5
0
0
R7
T7
0
R6
T6
0
R5
T5
LINT
LINR
SCP1
SCP0
0
0
0
PDS2
PDS1
0
0
ALOST
AM1
4
0
3
0
2
0
1
BKF
Bit 0
RPF
0
R2
T2
0
R1
T1
0
R0
T0
R
SCR2
SCR1
SCR0
0
0
0
0
0
PDS0
PSSB4
PSSB3
PSSB2
PSSB1
PSSB0
0
0
AM0
ACLK
0
AFIN
0
ARUN
0
AROVFL
0
ARD8
0
0
R4
R3
T4
T3
Unaffected by reset
0
ARD7
0
ARD6
0
ARD5
0
ARD4
0
ARD3
0
ARD2
0
ARD1
0
ARD0
0
0
0
0
0
0
0
0
0
KEYF
0
0
IMASKK
MODEK
0
0
0
0
0
0
0
0
ACKK
0
0
0
AWUIE
KBIE5
KBIE4
KBIE3
KBIE2
KBIE1
KBIE0
0
0
0
0
0
0
0
0
0
0
KBIP5
KBIP4
KBIP3
KBIP2
KBIP1
KBIP0
0
0
0
0
0
0
0
0
0
IRQF
0
0
IMASK
MODE
0
0
0
0
0
0
0
ACK
0
IRQPUD
IRQEN
R
R
R
0
0
0
0
1. One-time writable register after each reset.
2. RSTEN reset to 0 by a power-on reset (POR) only.
COPRS
LVISTOP
LVIRSTD
0
LVIPWRD
0
0
0
0
1. One-time writable register after each reset.
2. LVITRIP reset to 0 by a power-on reset (POR) only.
TOF
0
0
Bit 15
0
TOIE
TSTOP
0
Bit 14
1
Bit 13
0
0
= Unimplemented
0
OSCENINESCIBDSRC
STOP
0
0
0
RSTEN
0(2)
LVITRIP
SSREC
STOP
COPD
0(2)
0
0
0
PS2
PS1
PS0
0
Bit 10
0
Bit 9
0
Bit 8
0
TRST
0
Bit 12
0
0
Bit 11
0
R
0
= Reserved
0
0
U = Unaffected
0
Figure 2-2. Control, Status, and Data Registers (Sheet 2 of 5)
MC68HC908QB8 Data Sheet, Rev. 3
26
Freescale Semiconductor
Direct Page Registers
Addr.
$0022
$0023
$0024
$0025
$0026
$0027
$0028
$0029
$002A
$002B
↓
$002F
$0030
$0031
$0032
$0033
$0034
$0035
Register Name
TIM Counter Register Low Read:
(TCNTL) Write:
See page 185. Reset:
TIM Counter Modulo Read:
Register High (TMODH) Write:
See page 185. Reset:
TIM Counter Modulo Read:
Register Low (TMODL) Write:
See page 185. Reset:
TIM Channel 0 Status and Read:
Control Register (TSC0) Write:
See page 186. Reset:
TIM Channel 0 Read:
Register High (TCH0H) Write:
See page 189. Reset:
TIM Channel 0 Read:
Register Low (TCH0L) Write:
See page 189. Reset:
TIM Channel 1 Status and Read:
Control Register (TSC1) Write:
See page 186. Reset:
TIM Channel 1 Read:
Register High (TCH1H) Write:
See page 189. Reset:
TIM Channel 1 Read:
Register Low (TCH1L) Write:
See page 189. Reset:
Bit 7
Bit 7
6
Bit 6
5
Bit 5
4
Bit 4
3
Bit 3
2
Bit 2
1
Bit 1
Bit 0
Bit 0
0
0
0
0
0
0
0
0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
1
1
1
1
1
1
1
1
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
1
CH0F
0
0
1
1
1
1
1
1
1
CH0IE
MS0B
MS0A
ELS0B
ELS0A
TOV0
CH0MAX
0
0
0
0
0
0
0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 2
Bit 1
Bit 0
Indeterminate after reset
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Indeterminate after reset
CH1F
0
0
Bit 15
0
CH1IE
MS1A
ELS1B
ELS1A
TOV1
CH1MAX
0
0
0
0
0
0
0
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 2
Bit 1
Bit 0
Indeterminate after reset
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Indeterminate after reset
Reserved
TIM Channel 2 Status and Read:
Control Register (TSC2) Write:
See page 186. Reset:
TIM Channel 2 Read:
Register High (TCH2H) Write:
See page 189. Reset:
TIM Channel 2 Read:
Register Low (TCH2L) Write:
See page 189. Reset:
TIM Channel 3 Status and Read:
Control Register (TSC3) Write:
See page 186. Reset:
TIM Channel 3 Read:
Register High (TCH3H) Write:
See page 189. Reset:
TIM Channel 3 Read:
Register Low (TCH3L) Write:
See page 189. Reset:
CH2F
0
0
Bit 15
0
CH2IE
MS2A
ELS2B
ELS2A
TOV2
CH2MAX
0
0
0
0
0
0
0
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 2
Bit 1
Bit 0
Indeterminate after reset
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Indeterminate after reset
CH3F
0
0
Bit 15
0
CH3IE
MS3A
ELS3B
ELS3A
TOV3
CH3MAX
0
0
0
0
0
0
0
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 2
Bit 1
Bit 0
Indeterminate after reset
Bit 7
Bit 6
Bit 5
= Unimplemented
Bit 4
Bit 3
Indeterminate after reset
R
= Reserved
U = Unaffected
Figure 2-2. Control, Status, and Data Registers (Sheet 3 of 5)
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
27
Memory
Addr.
$0036
$0037
$0038
$0039
↓
$003B
$003C
$003D
$003E
$003F
$FE00
$FE01
$FE02
$FE03
$FE04
$FE05
$FE06
Register Name
Bit 7
6
Read:
Oscillator Status and
OSCOPT1 OSCOPT0
Control Register (OSCSC) Write:
See page 100. Reset:
0
0
5
4
3
2
1
Bit 0
ECGST
ICFS1
ICFS0
ECFS1
ECFS0
ECGON
0
0
0
0
0
0
Reserved
Oscillator Trim Register
(OSCTRIM)
See page 101.
Read:
Write:
TRIM7
TRIM6
TRIM5
TRIM4
TRIM3
TRIM2
TRIM1
TRIM0
Reset:
1
0
0
0
0
0
0
0
AIEN
ADCO
ADCH4
ADCH3
ADCH2
ADCH1
ADCH0
0
0
R
0
AD7
R
0
0
0
R
0
AD6
R
0
0
0
R
0
AD5
R
0
1
0
R
0
AD4
R
0
1
0
R
0
AD3
R
0
1
0
R
0
AD2
R
0
1
AD9
R
0
AD1
R
0
1
AD8
R
0
AD0
R
0
ADLPC
ADIV1
ADIV0
ADICLK
MODE1
MODE0
ADLSMP
ACLKEN
0
0
0
0
0
0
0
R
R
R
R
R
R
POR
PIN
COP
ILOP
ILAD
MODRST
0
SBSW
0
0
LVI
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
BCFE
R
R
R
R
R
R
R
IF3
R
0
IF11
R
0
IF19
R
0
R
IF2
R
0
IF10
R
0
IF18
R
0
= Reserved
Reserved
ADC10 Status and Control Read:
Register (ADSCR) Write:
See page 46. Reset:
ADC10 Data Register High Read:
(ADRH) Write:
See page 48. Reset:
ADC10 Data Register Low Read:
(ADRL) Write:
See page 48. Reset:
ADC10 Clock Register Read:
(ADCLK) Write:
See page 49. Reset:
Break Status Register Read:
(BSR) Write:
See page 195. Reset:
SIM Reset Status Register Read:
(SRSR) Write:
See page 152. POR:
Break Auxiliary Read:
Register (BRKAR) Write:
See page 195. Reset:
Break Flag Control Read:
Register (BFCR) Write:
See page 195. Reset:
Interrupt Status Register 1 Read:
(INT1) Write:
See page 149. Reset:
Interrupt Status Register 2 Read:
(INT2) Write:
See page 149. Reset:
Interrupt Status Register 3 Read:
(INT3) Write:
See page 149. Reset:
COCO
0
IF6
R
0
IF14
R
0
IF22
R
0
IF5
IF4
R
R
0
0
IF13
IF12
R
R
0
0
IF21
IF20
R
R
0
0
= Unimplemented
IF1
0
R
R
0
0
IF9
IF8
R
R
0
0
IF17
IF16
R
R
0
0
U = Unaffected
R
0
0
BDCOP
0
R
0
IF7
R
0
IF15
R
0
Figure 2-2. Control, Status, and Data Registers (Sheet 4 of 5)
MC68HC908QB8 Data Sheet, Rev. 3
28
Freescale Semiconductor
Direct Page Registers
Addr.
$FE07
$FE08
$FE09
$FE0A
$FE0B
$FE0C
$FE0D
↓
$FE0F
$FFBE
$FFBF
$FFC0
$FFC1
$FFFF
Register Name
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
HVEN
MASS
ERASE
PGM
0
0
0
0
0
0
0
0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
0
0
0
0
0
0
0
0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
BRKE
BRKA
0
0
0
0
0
0
0
0
0
0
0
0
0
LVIOUT
0
0
0
0
0
0
0
0
0
0
0
0
0
R
0
0
0
0
0
0
0
0
BPR7
BPR6
BPR5
BPR4
BPR3
BPR2
BPR1
BPR0
TRIM2
TRIM1
TRIM0
Reserved
FLASH Control Register Read:
(FLCR) Write:
See page 31. Reset:
Break Address High Read:
Register (BRKH) Write:
See page 194. Reset:
Break Address low Read:
Register (BRKL) Write:
See page 194. Reset:
Break Status and Control Read:
Register (BRKSCR) Write:
See page 194. Reset:
LVI Status Register Read:
(LVISR) Write:
See page 91. Reset:
Reserved
FLASH Block Protect Read:
Register (FLBPR) Write:
See page 36. Reset:
Unaffected by reset
Reserved
Internal Oscillator Trim Read:
(Factory Programmed, Write:
VDD = 3.0 V) Reset:
TRIM7
TRIM6
TRIM5
TRIM4
TRIM3
Resets to factory programmed value
Reserved
COP Control Register Read:
(COPCTL) Write:
See page 63. Reset:
LOW BYTE OF RESET VECTOR
WRITING CLEARS COP COUNTER (ANY VALUE)
Unaffected by reset
= Unimplemented
R
= Reserved
U = Unaffected
Figure 2-2. Control, Status, and Data Registers (Sheet 5 of 5)
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
29
Memory
Table 2-1. Vector Addresses
Vector Priority
Vector
Address
Lowest
IF22–
IF16
$FFD0–
$FFDC
Not used
IF15
$FFDE,F
ADC conversion complete vector
IF14
$FFE0,1
Keyboard vector
IF13
$FFE2,3
SPI transmit vector
IF12
$FFE4,5
SPI receive vector
IF11
$FFE6,7
ESCI transmit vector
IF10
$FFE8,9
ESCI receive vector
IF9
$FFEA,B
ESCI error vector
IF8
—
IF7
$FFEE,F
TIM1 Channel 3 vector
IF6
$FFF0,1
TIM1 Channel 2 vector
IF5
$FFF2,3
TIM1 overflow vector
IF4
$FFF4,5
TIM1 Channel 1 vector
IF3
$FFF6,7
TIM1 Channel 0 vector
IF2
—
IF1
$FFFA,B
IRQ vector
—
$FFFC,D
SWI vector
—
$FFFE,F
Reset vector
Highest
Vector
Not used
Not used
2.5 Random-Access Memory (RAM)
This MCU includes static RAM. The locations in RAM below $0100 can be accessed using the more
efficient direct addressing mode, and any single bit in this area can be accessed with the bit manipulation
instructions (BCLR, BSET, BRCLR, and BRSET). Locating the most frequently accessed program
variables in this area of RAM is preferred.
The RAM retains data when the MCU is in low-power wait or stop mode. At power-on, the contents of
RAM are uninitialized. RAM data is unaffected by any reset provided that the supply voltage does not drop
below the minimum value for RAM retention.
For compatibility with older M68HC05 MCUs, the HC08 resets the stack pointer to $00FF. In the devices
that have RAM above $00FF, it is usually best to reinitialize the stack pointer to the top of the RAM so the
direct page RAM can be used for frequently accessed RAM variables and bit-addressable program
variables. Include the following 2-instruction sequence in your reset initialization routine (where RamLast
is equated to the highest address of the RAM).
LDHX
TXS
#RamLast+1
;point one past RAM
;SP<-(H:X-1)
MC68HC908QB8 Data Sheet, Rev. 3
30
Freescale Semiconductor
FLASH Memory (FLASH)
2.6 FLASH Memory (FLASH)
The FLASH memory is intended primarily for program storage. In-circuit programming allows the
operating program to be loaded into the FLASH memory after final assembly of the application product.
It is possible to program the entire array through the single-wire monitor mode interface. Because no
special voltages are needed for FLASH erase and programming operations, in-application programming
is also possible through other software-controlled communication paths.
This subsection describes the operation of the embedded FLASH memory. The FLASH memory can be
read, programmed, and erased from the internal VDD supply. The program and erase operations are
enabled through the use of an internal charge pump.
The minimum size of FLASH memory that can be erased is 64 bytes; and the maximum size of FLASH
memory that can be programmed in a program cycle is 32 bytes (a row). Program and erase operations
are facilitated through control bits in the FLASH control register (FLCR). Details for these operations
appear later in this section.
NOTE
An erased bit reads as a 1 and a programmed bit reads as a 0. A security
feature prevents viewing of the FLASH contents.(1)
2.6.1 FLASH Control Register
The FLASH control register (FLCR) controls FLASH program and erase operations.
Read:
Bit 7
6
5
4
0
0
0
0
0
0
0
0
Write:
Reset:
3
2
1
Bit 0
HVEN
MASS
ERASE
PGM
0
0
0
0
= Unimplemented
Figure 2-3. FLASH Control Register (FLCR)
HVEN — High Voltage Enable Bit
This read/write bit enables high voltage from the charge pump to the memory for either program or
erase operation. It can only be set if either PGM =1 or ERASE =1 and the proper sequence for
program or erase is followed.
1 = High voltage enabled to array and charge pump on
0 = High voltage disabled to array and charge pump off
MASS — Mass Erase Control Bit
This read/write bit configures the memory for mass erase operation.
1 = Mass erase operation selected
0 = Mass erase operation unselected
1. No security feature is absolutely secure. However, Freescale’s strategy is to make reading or copying the FLASH difficult
for unauthorized users.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
31
Memory
ERASE — Erase Control Bit
This read/write bit configures the memory for erase operation. ERASE is interlocked with the PGM bit
such that both bits cannot be equal to 1 or set to 1 at the same time.
1 = Erase operation selected
0 = Erase operation unselected
PGM — Program Control Bit
This read/write bit configures the memory for program operation. PGM is interlocked with the ERASE
bit such that both bits cannot be equal to 1 or set to 1 at the same time.
1 = Program operation selected
0 = Program operation unselected
2.6.2 FLASH Page Erase Operation
Use the following procedure to erase a page of FLASH memory. A page consists of 64 consecutive bytes
starting from addresses $XX00, $XX40, $XX80, or $XXC0. The 48-byte user interrupt vectors area also
forms a page. Any FLASH memory page can be erased alone.
1. Set the ERASE bit and clear the MASS bit in the FLASH control register.
2. Read the FLASH block protect register.
3. Write any data to any FLASH location within the address range of the block to be erased.
4. Wait for a time, tNVS.
5. Set the HVEN bit.
6. Wait for a time, tErase.
7. Clear the ERASE bit.
8. Wait for a time, tNVH.
9. Clear the HVEN bit.
10. After time, tRCV, the memory can be accessed in read mode again.
NOTE
The COP register at location $FFFF should not be written between steps
5-9, when the HVEN bit is set. Since this register is located at a valid
FLASH address, unpredictable behavior may occur if this location is written
while HVEN is set.
NOTE
Programming and erasing of FLASH locations cannot be performed by
code being executed from the FLASH memory. While these operations
must be performed in the order as shown, other unrelated operations may
occur between the steps.
CAUTION
A page erase of the vector page will erase the internal oscillator trim value
at $FFC0.
MC68HC908QB8 Data Sheet, Rev. 3
32
Freescale Semiconductor
FLASH Memory (FLASH)
2.6.3 FLASH Mass Erase Operation
Use the following procedure to erase the entire FLASH memory to read as a 1:
1. Set both the ERASE bit and the MASS bit in the FLASH control register.
2. Read the FLASH block protect register.
3. Write any data to any FLASH address(1) within the FLASH memory address range.
4. Wait for a time, tNVS.
5. Set the HVEN bit.
6. Wait for a time, tMErase.
7. Clear the ERASE and MASS bits.
NOTE
Mass erase is disabled whenever any block is protected (FLBPR does not
equal $FF).
8. Wait for a time, tNVHL.
9. Clear the HVEN bit.
10. After time, tRCV, the memory can be accessed in read mode again.
NOTE
Programming and erasing of FLASH locations cannot be performed by
code being executed from the FLASH memory. While these operations
must be performed in the order as shown, other unrelated operations may
occur between the steps.
CAUTION
A mass erase will erase the internal oscillator trim value at $FFC0.
2.6.4 FLASH Program Operation
Programming of the FLASH memory is done on a row basis. A row consists of 32 consecutive bytes
starting from addresses $XX00, $XX20, $XX40, $XX60, $XX80, $XXA0, $XXC0, or $XXE0. Use the
following step-by-step procedure to program a row of FLASH memory
Figure 2-4 shows a flowchart of the programming algorithm.
NOTE
Do not program any byte in the FLASH more than once after a successful
erase operation. Reprogramming bits to a byte which is already
programmed is not allowed without first erasing the page in which the byte
resides or mass erasing the entire FLASH memory. Programming without
first erasing may disturb data stored in the FLASH.
1. Set the PGM bit. This configures the memory for program operation and enables the latching of
address and data for programming.
2. Read the FLASH block protect register.
3. Write any data to any FLASH location within the address range desired.
4. Wait for a time, tNVS.
5. Set the HVEN bit.
1. When in monitor mode, with security sequence failed (see 17.3.2 Security), write to the FLASH block protect register instead of any FLASH address.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
33
Memory
6.
7.
8.
9.
10.
11.
12.
13.
Wait for a time, tPGS.
Write data to the FLASH address being programmed(1).
Wait for time, tPROG.
Repeat step 7 and 8 until all desired bytes within the row are programmed.
Clear the PGM bit (1).
Wait for time, tNVH.
Clear the HVEN bit.
After time, tRCV, the memory can be accessed in read mode again.
NOTE
The COP register at location $FFFF should not be written between steps
5-12, when the HVEN bit is set. Since this register is located at a valid
FLASH address, unpredictable behavior may occur if this location is written
while HVEN is set.
This program sequence is repeated throughout the memory until all data is programmed.
NOTE
Programming and erasing of FLASH locations cannot be performed by
code being executed from the FLASH memory. While these operations
must be performed in the order shown, other unrelated operations may
occur between the steps. Do not exceed tPROG maximum, see 18.17
Memory Characteristics.
2.6.5 FLASH Protection
Due to the ability of the on-board charge pump to erase and program the FLASH memory in the target
application, provision is made to protect blocks of memory from unintentional erase or program operations
due to system malfunction. This protection is done by use of a FLASH block protect register (FLBPR).
The FLBPR determines the range of the FLASH memory which is to be protected. The range of the
protected area starts from a location defined by FLBPR and ends to the bottom of the FLASH memory
($FFFF). When the memory is protected, the HVEN bit cannot be set in either ERASE or PROGRAM
operations.
NOTE
In performing a program or erase operation, the FLASH block protect
register must be read after setting the PGM or ERASE bit and before
asserting the HVEN bit.
When the FLBPR is programmed with all 0 s, the entire memory is protected from being programmed and
erased. When all the bits are erased (all 1’s), the entire memory is accessible for program and erase.
When bits within the FLBPR are programmed, they lock a block of memory. The address ranges are
shown in 2.6.6 FLASH Block Protect Register. Once the FLBPR is programmed with a value other than
$FF, any erase or program of the FLBPR or the protected block of FLASH memory is prohibited. Mass
erase is disabled whenever any block is protected (FLBPR does not equal $FF). The FLBPR itself can be
erased or programmed only with an external voltage, VTST, present on the IRQ pin. This voltage also
allows entry from reset into the monitor mode.
1. The time between each FLASH address change, or the time between the last FLASH address programmed to clearing
PGM bit, must not exceed the maximum programming time, tPROG maximum.
MC68HC908QB8 Data Sheet, Rev. 3
34
Freescale Semiconductor
FLASH Memory (FLASH)
Algorithm for Programming
a Row (32 Bytes) of FLASH Memory
1
SET PGM BIT
2 READ THE FLASH BLOCK PROTECT REGISTER
3
WRITE ANY DATA TO ANY FLASH ADDRESS
WITHIN THE ROW ADDRESS RANGE DESIRED
4
WAIT FOR A TIME, tNVS
5
SET HVEN BIT
6
WAIT FOR A TIME, tPGS
7
WRITE DATA TO THE FLASH ADDRESS
TO BE PROGRAMMED
8
WAIT FOR A TIME, tPROG
9
COMPLETED
PROGRAMMING
THIS ROW?
Y
N
10
11
12
NOTES:
The time between each FLASH address change (step 7 to step 7 loop),
or the time between the last FLASH address programmed
to clearing PGM bit (step 7 to step 10)
must not exceed the maximum programming
time, tPROG max.
13
This row program algorithm assumes the row/s
to be programmed are initially erased.
CLEAR PGM BIT
WAIT FOR A TIME, tNVH
CLEAR HVEN BIT
WAIT FOR A TIME, tRCV
END OF PROGRAMMING
Figure 2-4. FLASH Programming Flowchart
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
35
Memory
2.6.6 FLASH Block Protect Register
The FLASH block protect register is implemented as a byte within the FLASH memory, and therefore can
only be written during a programming sequence of the FLASH memory. The value in this register
determines the starting address of the protected range within the FLASH memory.
Read:
Write:
Bit 7
6
5
4
3
2
1
Bit 0
BPR7
BPR6
BPR5
BPR4
BPR3
BPR2
BPR1
BPR0
Reset:
Unaffected by reset. Initial value from factory is 1.
Write to this register is by a programming sequence to the FLASH memory.
Figure 2-5. FLASH Block Protect Register (FLBPR)
BPR[7:0] — FLASH Protection Register Bits [7:0]
These eight bits in FLBPR represent bits [13:6] of a 16-bit memory address. Bits [15:14] are 1s and
bits [5:0] are 0s.
The resultant 16-bit address is used for specifying the start address of the FLASH memory for block
protection. The FLASH is protected from this start address to the end of FLASH memory, at $FFFF.
With this mechanism, the protect start address can be XX00, XX40, XX80, or XXC0 within the FLASH
memory. See Figure 2-6 and Table 2-2.
16-BIT MEMORY ADDRESS
START ADDRESS OF
FLASH BLOCK PROTECT
1
1
FLBPR VALUE
0
0
0
0
0
0
Figure 2-6. FLASH Block Protect Start Address
Table 2-2. Examples of Protect Start Address
BPR[7:0]
Start of Address of Protect Range
$00–$77
The entire FLASH memory is protected.
$78 (0111 1000)
$DE00 (1101 1110 0000 0000)
$79 (0111 1001)
$DE40 (1101 1110 0100 0000)
$7A (0111 1010)
$DE80 (1101 1110 1000 0000)
$7B (0111 1011)
$DFC0 (1101 1110 1100 0000)
and so on...
$DE (1101 1110)
$F780 (1111 0111 1000 0000)
$DF (1101 1111)
$F7C0 (1111 0111 1100 0000)
$FE (1111 1110)
$FF80 (1111 1111 1000 0000)
FLBPR, internal oscillator trim value, and vectors are
protected
$FF
The entire FLASH memory is not protected.
MC68HC908QB8 Data Sheet, Rev. 3
36
Freescale Semiconductor
Chapter 3
Analog-to-Digital Converter (ADC10) Module
3.1 Introduction
This section describes the 10-bit successive approximation analog-to-digital converter (ADC10).
The ADC10 module shares its pins with general-purpose input/output (I/O) port pins. See Figure 3-1 for
port location of these shared pins. The ADC10 on this MCU uses VDD and VSS as its supply and reference
pins. This MCU uses BUSCLKX4 as its alternate clock source for the ADC. This MCU does not have a
hardware conversion trigger.
3.2 Features
Features of the ADC10 module include:
• Linear successive approximation algorithm with 10-bit resolution
• Output formatted in 10- or 8-bit right-justified format
• Single or continuous conversion (automatic power-down in single conversion mode)
• Configurable sample time and conversion speed (to save power)
• Conversion complete flag and interrupt
• Input clock selectable from up to three sources
• Operation in wait and stop modes for lower noise operation
• Selectable asynchronous hardware conversion trigger
3.3 Functional Description
The ADC10 uses successive approximation to convert the input sample taken from ADVIN to a digital
representation. The approximation is taken and then rounded to the nearest 10- or 8-bit value to provide
greater accuracy and to provide a more robust mechanism for achieving the ideal code-transition voltage.
Figure 3-2 shows a block diagram of the ADC10
For proper conversion, the voltage on ADVIN must fall between VREFH and VREFL. If ADVIN is equal to
or exceeds VREFH, the converter circuit converts the signal to $3FF for a 10-bit representation or $FF for
a 8-bit representation. If ADVIN is equal to or less than VREFL, the converter circuit converts it to $000.
Input voltages between VREFH and VREFL are straight-line linear conversions.
NOTE
Input voltage must not exceed the analog supply voltages.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
37
Analog-to-Digital Converter (ADC10) Module
PTA0/TCH0/AD0/KBI0
CLOCK
GENERATOR
PTA3/RST/KBI3
DDRA
PTA2/IRQ/KBI2/TCLK
PTA
PTA1/TCH1/AD1/KBI1
KEYBOARD INTERRUPT
MODULE
PTA4/OSC2/AD2/KBI4
PTA5/OSC1/AD3/KBI5
EXTERNAL INTERRUPT
MODULE
AUTO WAKEUP
MODULE
DDRB
PTB0/SCK/AD4
PTB1/MOSI/AD5
PTB2/MISO/AD6
PTB3/SS/AD7
PTB4/RxD/AD8
PTB5/TxD/AD9
PTB6/TCH2
PTB7/TCH3
PTB
M68HC08 CPU
LOW-VOLTAGE
INHIBIT
4-CHANNEL 16-BIT
TIMER MODULE
MC68HC908QB8
MC68HC908QB8
256 BYTES
8192 BYTES
USER RAM
USER FLASH
10-CHANNEL
10-BIT ADC
ENHANCED SERIAL
COMMUNICATIONS
INTERFACE MODULE
VDD
POWER SUPPLY
COP
MODULE
VSS
SERIAL PERIPHERAL
INTERFACE
DEVELOPMENT SUPPORT
MONITOR ROM
BREAK MODULE
RST, IRQ: Pins have internal pull up device
All port pins have programmable pull up device
PTA[0:5]: Higher current sink and source capability
Figure 3-1. Block Diagram Highlighting ADC10 Block and Pins
MC68HC908QB8 Data Sheet, Rev. 3
38
Freescale Semiconductor
Functional Description
ADCK
MCU STOP
CONTROL SEQUENCER
ADHWT
ADICLK
ADIV
ADLPC
ADLSMP
MODE
COMPLETE
2
ADCLK
ADCO
AIEN
ADCH
1
COCO
ADSCR
ACLKEN
ASYNC
CLOCK
GENERATOR
ACLK
CLOCK
DIVIDE
BUS CLOCK
•••
ADVIN
ABORT
CONVERT
TRANSFER
AD0
SAMPLE
INITIALIZE
ALTERNATE CLOCK SOURCE
SAR CONVERTER
AIEN 1
COCO 2
INTERRUPT
ADn
VREFH
VREFL
DATA REGISTERS ADRH:ADRL
Figure 3-2. ADC10 Block Diagram
The ADC10 can perform an analog-to-digital conversion on one of the software selectable channels. The
output of the input multiplexer (ADVIN) is converted by a successive approximation algorithm into a 10-bit
digital result. When the conversion is completed, the result is placed in the data registers (ADRH and
ADRL). In 8-bit mode, the result is rounded to 8 bits and placed in ADRL. The conversion complete flag
is then set and an interrupt is generated if the interrupt has been enabled.
3.3.1 Clock Select and Divide Circuit
The clock select and divide circuit selects one of three clock sources and divides it by a configurable value
to generate the input clock to the converter (ADCK). The clock can be selected from one of the following
sources:
• The asynchronous clock source (ACLK) — This clock source is generated from a dedicated clock
source which is enabled when the ADC10 is converting and the clock source is selected by setting
the ACLKEN bit. When the ADLPC bit is clear, this clock operates from 1–2 MHz; when ADLPC is
set it operates at 0.5–1 MHz. This clock is not disabled in STOP and allows conversions in stop
mode for lower noise operation.
• Alternate Clock Source — This clock source is equal to the external oscillator clock or a four times
the bus clock. The alternate clock source is MCU specific, see 3.1 Introduction to determine source
and availability of this clock source option. This clock is selected when ADICLK and ACLKEN are
both low.
• The bus clock — This clock source is equal to the bus frequency. This clock is selected when
ADICLK is high and ACLKEN is low.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
39
Analog-to-Digital Converter (ADC10) Module
Whichever clock is selected, its frequency must fall within the acceptable frequency range for ADCK. If
the available clocks are too slow, the ADC10 will not perform according to specifications. If the available
clocks are too fast, then the clock must be divided to the appropriate frequency. This divider is specified
by the ADIV[1:0] bits and can be divide-by 1, 2, 4, or 8.
3.3.2 Input Select and Pin Control
Only one analog input may be used for conversion at any given time. The channel select bits in ADSCR
are used to select the input signal for conversion.
3.3.3 Conversion Control
Conversions can be performed in either 10-bit mode or 8-bit mode as determined by the MODE bits.
Conversions can be initiated by either a software or hardware trigger. In addition, the ADC10 module can
be configured for low power operation, long sample time, and continuous conversion.
3.3.3.1 Initiating Conversions
A conversion is initiated:
• Following a write to ADSCR (with ADCH bits not all 1s) if software triggered operation is selected.
• Following a hardware trigger event if hardware triggered operation is selected.
• Following the transfer of the result to the data registers when continuous conversion is enabled.
If continuous conversions are enabled a new conversion is automatically initiated after the completion of
the current conversion. In software triggered operation, continuous conversions begin after ADSCR is
written and continue until aborted. In hardware triggered operation, continuous conversions begin after a
hardware trigger event and continue until aborted.
3.3.3.2 Completing Conversions
A conversion is completed when the result of the conversion is transferred into the data result registers,
ADRH and ADRL. This is indicated by the setting of the COCO bit. An interrupt is generated if AIEN is
high at the time that COCO is set.
A blocking mechanism prevents a new result from overwriting previous data in ADRH and ADRL if the
previous data is in the process of being read while in 10-bit mode (ADRH has been read but ADRL has
not). In this case the data transfer is blocked, COCO is not set, and the new result is lost. When a data
transfer is blocked, another conversion is initiated regardless of the state of ADCO (single or continuous
conversions enabled). If single conversions are enabled, this could result in several discarded
conversions and excess power consumption. To avoid this issue, the data registers must not be read after
initiating a single conversion until the conversion completes.
3.3.3.3 Aborting Conversions
Any conversion in progress will be aborted when:
• A write to ADSCR occurs (the current conversion will be aborted and a new conversion will be
initiated, if ADCH are not all 1s).
• A write to ADCLK occurs.
• The MCU is reset.
• The MCU enters stop mode with ACLK not enabled.
MC68HC908QB8 Data Sheet, Rev. 3
40
Freescale Semiconductor
Functional Description
When a conversion is aborted, the contents of the data registers, ADRH and ADRL, are not altered but
continue to be the values transferred after the completion of the last successful conversion. In the case
that the conversion was aborted by a reset, ADRH and ADRL return to their reset states.
Upon reset or when a conversion is otherwise aborted, the ADC10 module will enter a low power, inactive
state. In this state, all internal clocks and references are disabled. This state is entered asynchronously
and immediately upon aborting of a conversion.
3.3.3.4 Total Conversion Time
The total conversion time depends on many factors such as sample time, bus frequency, whether
ACLKEN is set, and synchronization time. The total conversion time is summarized in Table 3-1.
Table 3-1. Total Conversion Time versus Control Conditions
Conversion Mode
ACLKEN
Maximum Conversion Time
8-Bit Mode (short sample — ADLSMP = 0):
Single or 1st continuous
Single or 1st continuous
Subsequent continuous (fBus ≥ fADCK)
0
1
X
18 ADCK + 3 bus clock
18 ADCK + 3 bus clock + 5 μs
16 ADCK
8-Bit Mode (long sample — ADLSMP = 1):
Single or 1st continuous
Single or 1st continuous
Subsequent continuous (fBus ≥ fADCK)
0
1
X
38 ADCK + 3 bus clock
38 ADCK + 3 bus clock + 5 μs
36 ADCK
10-Bit Mode (short sample — ADLSMP = 0):
Single or 1st continuous
Single or 1st continuous
Subsequent continuous (fBus ≥ fADCK)
0
1
X
21 ADCK + 3 bus clock
21 ADCK + 3 bus clock + 5 μs
19 ADCK
10-Bit Mode (long sample — ADLSMP = 1):
Single or 1st continuous
Single or 1st continuous
Subsequent continuous (fBus ≥ fADCK)
0
1
X
41 ADCK + 3 bus clock
41 ADCK + 3 bus clock + 5 μs
39 ADCK
The maximum total conversion time for a single conversion or the first conversion in continuous
conversion mode is determined by the clock source chosen and the divide ratio selected. The clock
source is selectable by the ADICLK and ACLKEN bits, and the divide ratio is specified by the ADIV bits.
For example, if the alternate clock source is 16 MHz and is selected as the input clock source, the input
clock divide-by-8 ratio is selected and the bus frequency is 4 MHz, then the conversion time for a single
10-bit conversion is:
Maximum Conversion time =
21 ADCK cycles
16 MHz/8
+
3 bus cycles
4 MHz
= 11.25 μs
Number of bus cycles = 11.25 μs x 4 MHz = 45 cycles
NOTE
The ADCK frequency must be between fADCK minimum and fADCK
maximum to meet A/D specifications.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
41
Analog-to-Digital Converter (ADC10) Module
3.3.4 Sources of Error
Several sources of error exist for ADC conversions. These are discussed in the following sections.
3.3.4.1 Sampling Error
For proper conversions, the input must be sampled long enough to achieve the proper accuracy. Given
the maximum input resistance of approximately 15 kΩ and input capacitance of approximately 10 pF,
sampling to within 1/4LSB (at 10-bit resolution) can be achieved within the minimum sample window
(3.5 cycles / 2 MHz maximum ADCK frequency) provided the resistance of the external analog source
(RAS) is kept below 10 kΩ. Higher source resistances or higher-accuracy sampling is possible by setting
ADLSMP (to increase the sample window to 23.5 cycles) or decreasing ADCK frequency to increase
sample time.
3.3.4.2 Pin Leakage Error
Leakage on the I/O pins can cause conversion error if the external analog source resistance (RAS) is high.
If this error cannot be tolerated by the application, keep RAS lower than VADVIN / (4096*ILeak) for less than
1/4LSB leakage error (at 10-bit resolution).
3.3.4.3 Noise-Induced Errors
System noise which occurs during the sample or conversion process can affect the accuracy of the
conversion. The ADC10 accuracy numbers are guaranteed as specified only if the following conditions
are met:
• There is a 0.1μF low-ESR capacitor from VREFH to VREFL (if available).
• There is a 0.1μF low-ESR capacitor from VDDA to VSSA (if available).
• If inductive isolation is used from the primary supply, an additional 1μF capacitor is placed from
VDDA to VSSA (if available).
• VSSA and VREFL (if available) is connected to VSS at a quiet point in the ground plane.
• The MCU is placed in wait mode immediately after initiating the conversion (next instruction after
write to ADSCR).
• There is no I/O switching, input or output, on the MCU during the conversion.
There are some situations where external system activity causes radiated or conducted noise emissions
or excessive VDD noise is coupled into the ADC10. In these cases, or when the MCU cannot be placed
in wait or I/O activity cannot be halted, the following recommendations may reduce the effect of noise on
the accuracy:
• Place a 0.01 μF capacitor on the selected input channel to VREFL or VSSA (if available). This will
improve noise issues but will affect sample rate based on the external analog source resistance.
• Operate the ADC10 in stop mode by setting ACLKEN, selecting the channel in ADSCR, and
executing a STOP instruction. This will reduce VDD noise but will increase effective conversion time
due to stop recovery.
• Average the input by converting the output many times in succession and dividing the sum of the
results. Four samples are required to eliminate the effect of a 1LSB, one-time error.
• Reduce the effect of synchronous noise by operating off the asynchronous clock (ACLKEN=1) and
averaging. Noise that is synchronous to the ADCK cannot be averaged out.
MC68HC908QB8 Data Sheet, Rev. 3
42
Freescale Semiconductor
Functional Description
3.3.4.4 Code Width and Quantization Error
The ADC10 quantizes the ideal straight-line transfer function into 1024 steps (in 10-bit mode). Each step
ideally has the same height (1 code) and width. The width is defined as the delta between the transition
points from one code to the next. The ideal code width for an N bit converter (in this case N can be 8 or
10), defined as 1LSB, is:
1LSB = (VREFH–VREFL) / 2N
Because of this quantization, there is an inherent quantization error. Because the converter performs a
conversion and then rounds to 8 or 10 bits, the code will transition when the voltage is at the midpoint
between the points where the straight line transfer function is exactly represented by the actual transfer
function. Therefore, the quantization error will be ± 1/2LSB in 8- or 10-bit mode. As a consequence,
however, the code width of the first ($000) conversion is only 1/2LSB and the code width of the last ($FF
or $3FF) is 1.5LSB.
3.3.4.5 Linearity Errors
The ADC10 may also exhibit non-linearity of several forms. Every effort has been made to reduce these
errors but the user should be aware of them because they affect overall accuracy. These errors are:
• Zero-Scale Error (EZS) (sometimes called offset) — This error is defined as the difference between
the actual code width of the first conversion and the ideal code width (1/2LSB). Note, if the first
conversion is $001, then the difference between the actual $001 code width and its ideal (1LSB) is
used.
• Full-Scale Error (EFS) — This error is defined as the difference between the actual code width of
the last conversion and the ideal code width (1.5LSB). Note, if the last conversion is $3FE, then the
difference between the actual $3FE code width and its ideal (1LSB) is used.
• Differential Non-Linearity (DNL) — This error is defined as the worst-case difference between the
actual code width and the ideal code width for all conversions.
• Integral Non-Linearity (INL) — This error is defined as the highest-value the (absolute value of the)
running sum of DNL achieves. More simply, this is the worst-case difference of the actual transition
voltage to a given code and its corresponding ideal transition voltage, for all codes.
• Total Unadjusted Error (TUE) — This error is defined as the difference between the actual transfer
function and the ideal straight-line transfer function, and therefore includes all forms of error.
3.3.4.6 Code Jitter, Non-Monotonicity and Missing Codes
Analog-to-digital converters are susceptible to three special forms of error. These are code jitter,
non-monotonicity, and missing codes.
• Code jitter is when, at certain points, a given input voltage converts to one of two values when
sampled repeatedly. Ideally, when the input voltage is infinitesimally smaller than the transition
voltage, the converter yields the lower code (and vice-versa). However, even very small amounts
of system noise can cause the converter to be indeterminate (between two codes) for a range of
input voltages around the transition voltage. This range is normally around ±1/2LSB but will
increase with noise.
• Non-monotonicity is defined as when, except for code jitter, the converter converts to a lower code
for a higher input voltage.
• Missing codes are those which are never converted for any input value. In 8-bit or 10-bit mode, the
ADC10 is guaranteed to be monotonic and to have no missing codes.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
43
Analog-to-Digital Converter (ADC10) Module
3.4 Interrupts
When AIEN is set, the ADC10 is capable of generating a CPU interrupt after each conversion. A CPU
interrupt is generated when the conversion completes (indicated by COCO being set). COCO will set at
the end of a conversion regardless of the state of AIEN.
3.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
3.5.1 Wait Mode
The ADC10 will continue the conversion process and will generate an interrupt following a conversion if
AIEN is set. If the ADC10 is not required to bring the MCU out of wait mode, ensure that the ADC10 is not
in continuous conversion mode by clearing ADCO in the ADC10 status and control register before
executing the WAIT instruction. In single conversion mode the ADC10 automatically enters a low-power
state when the conversion is complete. It is not necessary to set the channel select bits (ADCH[4:0]) to
all 1s to enter a low power state.
3.5.2 Stop Mode
If ACLKEN is clear, executing a STOP instruction will abort the current conversion and place the ADC10
in a low-power state. Upon return from stop mode, a write to ADSCR is required to resume conversions,
and the result stored in ADRH and ADRL will represent the last completed conversion until the new
conversion completes.
If ACLKEN is set, the ADC10 continues normal operation during stop mode. The ADC10 will continue the
conversion process and will generate an interrupt following a conversion if AIEN is set. If the ADC10 is
not required to bring the MCU out of stop mode, ensure that the ADC10 is not in continuous conversion
mode by clearing ADCO in the ADC10 status and control register before executing the STOP instruction.
In single conversion mode the ADC10 automatically enters a low-power state when the conversion is
complete. It is not necessary to set the channel select bits (ADCH[4:0]) to all 1s to enter a low-power state.
If ACLKEN is set, a conversion can be initiated while in stop using the external hardware trigger
ADEXTCO when in external convert mode. The ADC10 will operate in a low-power mode until the trigger
is asserted, at which point it will perform a conversion and assert the interrupt when complete (if AIEN is
set).
3.6 ADC10 During Break Interrupts
The system integration module (SIM) controls whether status bits in other modules can be cleared during
the break state. BCFE in the break flag control register (BFCR) enables software to clear status bits during
the break state. See BFCR in the SIM section of this data sheet.
To allow software to clear status bits during a break interrupt, write a 1 to BCFE. If a status bit is cleared
during the break state, it remains cleared when the MCU exits the break state.
To protect status bits during the break state, write a 0 to BCFE. With BCFE cleared (its default state),
software can read and write registers during the break state without affecting status bits. Some status bits
have a two-step read/write clearing procedure. If software does the first step on such a bit before the
MC68HC908QB8 Data Sheet, Rev. 3
44
Freescale Semiconductor
I/O Signals
break, the bit cannot change during the break state as long as BCFE is cleared. After the break, doing the
second step clears the status bit.
3.7 I/O Signals
The ADC10 module shares its pins with general-purpose input/output (I/O) port pins. See Figure 3-1 for
port location of these shared pins. The ADC10 on this MCU uses VDD and VSS as its supply and reference
pins. This MCU does not have an external trigger source.
3.7.1 ADC10 Analog Power Pin (VDDA)
The ADC10 analog portion uses VDDA as its power pin. In some packages, VDDA is connected internally
to VDD. If externally available, connect the VDDA pin to the same voltage potential as VDD. External filtering
may be necessary to ensure clean VDDA for good results.
NOTE
If externally available, route VDDA carefully for maximum noise immunity
and place bypass capacitors as near as possible to the package.
3.7.2 ADC10 Analog Ground Pin (VSSA)
The ADC10 analog portion uses VSSA as its ground pin. In some packages, VSSA is connected internally
to VSS. If externally available, connect the VSSA pin to the same voltage potential as VSS.
In cases where separate power supplies are used for analog and digital power, the ground connection
between these supplies should be at the VSSA pin. This should be the only ground connection between
these supplies if possible. The VSSA pin makes a good single point ground location.
3.7.3 ADC10 Voltage Reference High Pin (VREFH)
VREFH is the power supply for setting the high-reference voltage for the converter. In some packages,
VREFH is connected internally to VDDA. If externally available, VREFH may be connected to the same
potential as VDDA, or may be driven by an external source that is between the minimum VDDA spec and
the VDDA potential (VREFH must never exceed VDDA).
NOTE
Route VREFH carefully for maximum noise immunity and place bypass
capacitors as near as possible to the package.
AC current in the form of current spikes required to supply charge to the capacitor array at each
successive approximation step is drawn through the VREFH and VREFL loop. The best external component
to meet this current demand is a 0.1 μF capacitor with good high frequency characteristics. This capacitor
is connected between VREFH and VREFL and must be placed as close as possible to the package pins.
Resistance in the path is not recommended because the current will cause a voltage drop which could
result in conversion errors. Inductance in this path must be minimum (parasitic only).
3.7.4 ADC10 Voltage Reference Low Pin (VREFL)
VREFL is the power supply for setting the low-reference voltage for the converter. In some packages,
VREFL is connected internally to VSSA. If externally available, connect the VREFL pin to the same voltage
potential as VSSA. There will be a brief current associated with VREFL when the sampling capacitor is
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
45
Analog-to-Digital Converter (ADC10) Module
charging. If externally available, connect the VREFL pin to the same potential as VSSA at the single point
ground location.
3.7.5 ADC10 Channel Pins (ADn)
The ADC10 has multiple input channels. Empirical data shows that capacitors on the analog inputs
improve performance in the presence of noise or when the source impedance is high. 0.01 μF capacitors
with good high-frequency characteristics are sufficient. These capacitors are not necessary in all cases,
but when used they must be placed as close as possible to the package pins and be referenced to VSSA.
3.8 Registers
These registers control and monitor operation of the ADC10:
• ADC10 status and control register, ADSCR
• ADC10 data registers, ADRH and ADRL
• ADC10 clock register, ADCLK
3.8.1 ADC10 Status and Control Register
This section describes the function of the ADC10 status and control register (ADSCR). Writing ADSCR
aborts the current conversion and initiates a new conversion (if the ADCH[4:0] bits are equal to a value
other than all 1s).
Bit 7
Read:
COCO
Write:
Reset:
0
6
5
4
3
2
1
Bit 0
AIEN
ADCO
ADCH4
ADCH3
ADCH2
ADCH1
ADCH0
0
0
1
1
1
1
1
= Unimplemented
Figure 3-3. ADC10 Status and Control Register (ADSCR)
COCO — Conversion Complete Bit
COCO is a read-only bit which is set each time a conversion is completed. This bit is cleared whenever
the status and control register is written or whenever the data register (low) is read.
1 = Conversion completed
0 = Conversion not completed
AIEN — ADC10 Interrupt Enable Bit
When this bit is set, an interrupt is generated at the end of a conversion. The interrupt signal is cleared
when the data register is read or the status/control register is written.
1 = ADC10 interrupt enabled
0 = ADC10 interrupt disabled
ADCO — ADC10 Continuous Conversion Bit
When this bit is set, the ADC10 will begin to convert samples continuously (continuous conversion
mode) and update the result registers at the end of each conversion, provided the ADCH[4:0] bits do
not decode to all 1s. The ADC10 will continue to convert until the MCU enters reset, the MCU enters
stop mode (if ACLKEN is clear), ADCLK is written, or until ADSCR is written again. If stop is entered
MC68HC908QB8 Data Sheet, Rev. 3
46
Freescale Semiconductor
Registers
(with ACLKEN low), continuous conversions will cease and can be restarted only with a write to
ADSCR. Any write to ADSCR with ADCO set and the ADCH bits not all 1s will abort the current
conversion and begin continuous conversions.
If the bus frequency is less than the ADCK frequency, precise sample time for continuous conversions
cannot be guaranteed in short-sample mode (ADLSMP = 0). If the bus frequency is less than 1/11th
of the ADCK frequency, precise sample time for continuous conversions cannot be guaranteed in
long-sample mode (ADLSMP = 1).
When clear, the ADC10 will perform a single conversion (single conversion mode) each time ADSCR
is written (assuming the ADCH[4:0] bits do not decode all 1s).
1 = Continuous conversion following a write to ADSCR
0 = One conversion following a write to ADSCR
ADCH[4:0] — Channel Select Bits
The ADCH[4:0] bits form a 5-bit field that is used to select one of the input channels. The input
channels are detailed in Table 3-2. The successive approximation converter subsystem is turned off
when the channel select bits are all set to 1. This feature allows explicit disabling of the ADC10 and
isolation of the input channel from the I/O pad. Terminating continuous conversion mode this way will
prevent an additional, single conversion from being performed. It is not necessary to set the channel
select bits to all 1s to place the ADC10 in a low-power state, however, because the module is
automatically placed in a low-power state when a conversion completes.
Table 3-2. Input Channel Select
ADCH4
ADCH3
ADCH2
ADCH1
ADCH0
Input Select(1)
0
0
0
0
0
AD0
0
0
0
0
1
AD1
0
0
0
1
0
AD2
0
0
0
1
1
AD3
0
0
1
0
0
AD4
0
0
1
0
1
AD5
0
0
1
1
0
AD6
0
0
1
1
1
AD7
0
1
0
0
0
Unused
Continuing through
Unused
1
0
1
1
1
Unused
1
1
0
0
0
AD8
1
1
0
0
1
AD9
1
1
0
1
0
BANDGAP REF(2)
1
1
0
1
1
Reserved
1
1
1
0
0
Reserved
1
1
1
0
1
VREFH
1
1
1
1
0
VREFL
1
1
1
1
1
Low-power state
1. If any unused or reserved channels are selected, the resulting conversion will
be unknown.
2. Requires LVI to be powered (LVIPWRD =0, in CONFIG1)
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
47
Analog-to-Digital Converter (ADC10) Module
3.8.2 ADC10 Result High Register (ADRH)
This register holds the MSBs of the result and is updated each time a conversion completes. All other bits
read as 0s. Reading ADRH prevents the ADC10 from transferring subsequent conversion results into the
result registers until ADRL is read. If ADRL is not read until the after next conversion is completed, then
the intermediate conversion result will be lost. In 8-bit mode, this register contains no interlocking with
ADRL.
Read:
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Write:
Reset:
= Unimplemented
Figure 3-4. ADC10 Data Register High (ADRH), 8-Bit Mode
Read:
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
AD9
AD8
0
0
0
0
0
0
0
Write:
Reset:
0
= Unimplemented
Figure 3-5. ADC10 Data Register High (ADRH), 10-Bit Mode
3.8.3 ADC10 Result Low Register (ADRL)
This register holds the LSBs of the result. This register is updated each time a conversion completes.
Reading ADRH prevents the ADC10 from transferring subsequent conversion results into the result
registers until ADRL is read. If ADRL is not read until the after next conversion is completed, then the
intermediate conversion result will be lost. In 8-bit mode, there is no interlocking with ADRH.
Read:
Bit 7
6
5
4
3
2
1
Bit 0
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
0
0
0
0
0
0
0
Write:
Reset:
0
= Unimplemented
Figure 3-6. ADC10 Data Register Low (ADRL)
MC68HC908QB8 Data Sheet, Rev. 3
48
Freescale Semiconductor
Registers
3.8.4 ADC10 Clock Register (ADCLK)
This register selects the clock frequency for the ADC10 and the modes of operation.
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
ADLPC
ADIV1
ADIV0
ADICLK
MODE1
MODE0
ADLSMP
ACLKEN
0
0
0
0
0
0
0
0
Figure 3-7. ADC10 Clock Register (ADCLK)
ADLPC — ADC10 Low-Power Configuration Bit
ADLPC controls the speed and power configuration of the successive approximation converter. This
is used to optimize power consumption when higher sample rates are not required.
1 = Low-power configuration: The power is reduced at the expense of maximum clock speed.
0 = High-speed configuration
ADIV[1:0] — ADC10 Clock Divider Bits
ADIV1 and ADIV0 select the divide ratio used by the ADC10 to generate the internal clock ADCK.
Table 3-3 shows the available clock configurations.
Table 3-3. ADC10 Clock Divide Ratio
ADIV1
ADIV0
Divide Ratio (ADIV)
Clock Rate
0
0
1
Input clock ÷ 1
0
1
2
Input clock ÷ 2
1
0
4
Input clock ÷ 4
1
1
8
Input clock ÷ 8
ADICLK — Input Clock Select Bit
If ACLKEN is clear, ADICLK selects either the bus clock or an alternate clock source as the input clock
source to generate the internal clock ADCK. If the alternate clock source is less than the minimum
clock speed, use the internally-generated bus clock as the clock source. As long as the internal clock
ADCK, which is equal to the selected input clock divided by ADIV, is at a frequency (fADCK) between
the minimum and maximum clock speeds (considering ALPC), correct operation can be guaranteed.
1 = The internal bus clock is selected as the input clock source
0 = The alternate clock source IS SELECTED
MODE[1:0] — 10- or 8-Bit or Hardware Triggered Mode Selection
These bits select 10- or 8-bit operation. The successive approximation converter generates a result
that is rounded to 8- or 10-bit value based on the mode selection. This rounding process sets the
transfer function to transition at the midpoint between the ideal code voltages, causing a quantization
error of ± 1/2LSB.
Reset returns 8-bit mode.
00 = 8-bit, right-justified, ADSCR software triggered mode enabled
01 = 10-bit, right-justified, ADSCR software triggered mode enabled
10 = Reserved
11 = 10-bit, right-justified, hardware triggered mode enabled
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
49
Analog-to-Digital Converter (ADC10) Module
ADLSMP — Long Sample Time Configuration
This bit configures the sample time of the ADC10 to either 3.5 or 23.5 ADCK clock cycles. This adjusts
the sample period to allow higher impedance inputs to be accurately sampled or to maximize
conversion speed for lower impedance inputs. Longer sample times can also be used to lower overall
power consumption in continuous conversion mode if high conversion rates are not required.
1 = Long sample time (23.5 cycles)
0 = Short sample time (3.5 cycles)
ACLKEN — Asynchronous Clock Source Enable
This bit enables the asynchronous clock source as the input clock to generate the internal clock ADCK,
and allows operation in stop mode. The asynchronous clock source will operate between 1 MHz and
2 MHz if ADLPC is clear, and between 0.5 MHz and 1 MHz if ADLPC is set.
1 = The asynchronous clock is selected as the input clock source (the clock generator is only
enabled during the conversion)
0 = ADICLK specifies the input clock source and conversions will not continue in stop mode
MC68HC908QB8 Data Sheet, Rev. 3
50
Freescale Semiconductor
Chapter 4
Auto Wakeup Module (AWU)
4.1 Introduction
This section describes the auto wakeup module (AWU). The AWU generates a periodic interrupt during
stop mode to wake the part up without requiring an external signal. Figure 4-1 is a block diagram of the
AWU.
COPRS (FROM CONFIG1)
VDD
AUTOWUGEN
OSCENINSTOP (FROM CONFIG2)
BUSCLKX2
EN
32 kHz
TO PTA READ, BIT 6
1 = DIV 29
SHORT 0 = DIV 214
D
OVERFLOW
M
U
X
CLK
E
RST
AWUL
Q
AWUIREQ
R
TO KBI INTERRUPT LOGIC
(SEE Figure 9-2)
INT RC OSC
CLRLOGIC
RESET
CLEAR
BUSCLKX2
CLK
ACKK
RST
RESET
RESET
ISTOP
AWUIE
Figure 4-1. Auto Wakeup Interrupt Request Generation Logic
4.2 Features
Features of the auto wakeup module include:
• One internal interrupt with separate interrupt enable bit, sharing the same keyboard interrupt vector
and keyboard interrupt mask bit
• Exit from low-power stop mode without external signals
• Selectable timeout periods
• Dedicated low-power internal oscillator separate from the main system clock sources
• Option to allow bus clock source to run the AWU if enabled in STOP
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
51
Auto Wakeup Module (AWU)
4.3 Functional Description
The function of the auto wakeup logic is to generate periodic wakeup requests to bring the microcontroller
unit (MCU) out of stop mode. The wakeup requests are treated as regular keyboard interrupt requests,
with the difference that instead of a pin, the interrupt signal is generated by an internal logic.
Entering stop mode will enable the auto wakeup generation logic. Writing the AWUIE bit in the keyboard
interrupt enable register enables or disables the auto wakeup interrupt input (see Figure 4-1). A 1 applied
to the AWUIREQ input with auto wakeup interrupt request enabled, latches an auto wakeup interrupt
request.
Auto wakeup latch, AWUL, can be read directly from the bit 6 position of port A data register (PTA). This
is a read-only bit which is occupying an empty bit position on PTA. No PTA associated registers, such as
PTA6 data direction or PTA6 pullup exist for this bit.
There are two clock sources for the AWU. An internal RC oscillator (INTRCOSC, exclusive for the auto
wakeup feature) drives the wakeup request generator provided the OSCENINSTOP bit in the CONFIG2
register Figure 4-1 is cleared. More accurate wakeup periods are possible using the BUSCLKX2 signal
(from the oscillator module) which is selected by setting OSCENINSTOP.
Once the overflow count is reached in the generator counter, a wakeup request, AWUIREQ, is latched
and sent to the KBI logic. See Figure 4-1.
Wakeup interrupt requests will only be serviced if the associated interrupt enable bit, AWUIE, in KBIER
is set. The AWU shares the keyboard interrupt vector.
The overflow count can be selected from two options defined by the COPRS bit in CONFIG1. This bit was
“borrowed” from the computer operating properly (COP) using the fact that the COP feature is idle (no
MCU clock available) in stop mode. COPRS = 1 selects the short wakeup period while COPRS = 0 selects
the long wakeup period.
The auto wakeup RC oscillator is highly dependent on operating voltage and temperature. This feature is
not recommended for use as a time-keeping function.
The wakeup request is latched to allow the interrupt source identification. The latched value, AWUL, can
be read directly from the bit 6 position of PTA data register. This is a read-only bit which is occupying an
empty bit position on PTA. No PTA associated registers, such as PTA6 data, PTA6 direction, and PTA6
pullup exist for this bit. The latch can be cleared by writing to the ACKK bit in the KBSCR register. Reset
also clears the latch. AWUIE bit in KBI interrupt enable register (see Figure 4-1) has no effect on AWUL
reading.
The AWU oscillator and counters are inactive in normal operating mode and become active only upon
entering stop mode.
4.4 Interrupts
The AWU can generate an interrupt requests:.
AWU Latch (AWUL) — The AWUL bit is set when the AWU counter overflows. The auto wakeup interrupt
mask bit, AWUIE, is used to enable or disable AWU interrupt requests.
The AWU shares its interrupt with the KBI vector.
MC68HC908QB8 Data Sheet, Rev. 3
52
Freescale Semiconductor
Low-Power Modes
4.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
4.5.1 Wait Mode
The AWU module remains inactive in wait mode.
4.5.2 Stop Mode
When the AWU module is enabled (AWUIE = 1 in the keyboard interrupt enable register) it is activated
automatically upon entering stop mode. Clearing the IMASKK bit in the keyboard status and control
register enables keyboard interrupt requests to bring the MCU out of stop mode. The AWU counters start
from 0 each time stop mode is entered.
4.6 Registers
The AWU shares registers with the keyboard interrupt (KBI) module, the port A I/O module and
configuration register 2. The following I/O registers control and monitor operation of the AWU:
• Port A data register (PTA)
• Keyboard interrupt status and control register (KBSCR)
• Keyboard interrupt enable register (KBIER)
• Configuration register 1 (CONFIG1)
• Configuration register 2 (CONFIG2)
4.6.1 Port A I/O Register
The port A data register (PTA) contains a data latch for the state of the AWU interrupt request, in addition
to the data latches for port A.
Read:
Bit 7
6
0
AWUL
0
0
Write:
Reset:
5
4
3
PTA5
PTA4
PTA3
2
PTA2
1
Bit 0
PTA1
PTA0
Unaffected by reset
= Unimplemented
Figure 4-2. Port A Data Register (PTA)
AWUL — Auto Wakeup Latch
This is a read-only bit which has the value of the auto wakeup interrupt request latch. The wakeup
request signal is generated internally. There is no PTA6 port or any of the associated bits such as
PTA6 data direction or pullup bits.
1 = Auto wakeup interrupt request is pending
0 = Auto wakeup interrupt request is not pending
NOTE
PTA5–PTA0 bits are not used in conjuction with the auto wakeup feature.
To see a description of these bits, see 12.2.1 Port A Data Register.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
53
Auto Wakeup Module (AWU)
4.6.2 Keyboard Status and Control Register
The keyboard status and control register (KBSCR):
• Flags keyboard/auto wakeup interrupt requests
• Acknowledges keyboard/auto wakeup interrupt requests
• Masks keyboard/auto wakeup interrupt requests
Read:
Bit 7
6
5
4
3
0
0
0
0
KEYF
Write:
Reset:
2
0
ACKK
0
0
0
0
0
0
1
Bit 0
IMASKK
MODEK
0
0
= Unimplemented
Figure 4-3. Keyboard Status and Control Register (KBSCR)
Bits 7–4 — Not used
These read-only bits always read as 0s.
KEYF — Keyboard Flag Bit
This read-only bit is set when a keyboard interrupt is pending on port A or auto wakeup. Reset clears
the KEYF bit.
1 = Keyboard/auto wakeup interrupt pending
0 = No keyboard/auto wakeup interrupt pending
ACKK — Keyboard Acknowledge Bit
Writing a 1 to this write-only bit clears the keyboard/auto wakeup interrupt request on port A and auto
wakeup logic. ACKK always reads as 0. Reset clears ACKK.
IMASKK— Keyboard Interrupt Mask Bit
Writing a 1 to this read/write bit prevents the output of the keyboard interrupt mask from generating
interrupt requests on port A or auto wakeup. Reset clears the IMASKK bit.
1 = Keyboard/auto wakeup interrupt requests masked
0 = Keyboard/auto wakeup interrupt requests not masked
NOTE
MODEK is not used in conjuction with the auto wakeup feature. To see a
description of this bit, see 9.8.1 Keyboard Status and Control Register
(KBSCR).
4.6.3 Keyboard Interrupt Enable Register
The keyboard interrupt enable register (KBIER) enables or disables the auto wakeup to operate as a
keyboard/auto wakeup interrupt input.
Bit 7
Read:
0
Write:
Reset:
0
6
5
4
3
2
1
Bit 0
AWUIE
KBIE5
KBIE4
KBIE3
KBIE2
KBIE1
KBIE0
0
0
0
0
0
0
0
= Unimplemented
Figure 4-4. Keyboard Interrupt Enable Register (KBIER)
MC68HC908QB8 Data Sheet, Rev. 3
54
Freescale Semiconductor
Registers
AWUIE — Auto Wakeup Interrupt Enable Bit
This read/write bit enables the auto wakeup interrupt input to latch interrupt requests. Reset clears
AWUIE.
1 = Auto wakeup enabled as interrupt input
0 = Auto wakeup not enabled as interrupt input
NOTE
KBIE5–KBIE0 bits are not used in conjuction with the auto wakeup feature.
To see a description of these bits, see 9.8.2 Keyboard Interrupt Enable
Register (KBIER).
4.6.4 Configuration Register 2
The configuration register 2 (CONFIG2), is used to allow the bus clock source to run in STOP. In this case,
the clock, BUSCLKX2 will be used to drive the AWU request generator.
Read:
Write:
Reset:
Bit 7
6
5
4
3
IRQPUD
IRQEN
R
R
R
0
0
0
0
0
2
1
Bit 0
ESCI-BDSRC OSCENINSTOP
0
0
RSTEN
0
Figure 4-5. Configuration Register 2 (CONFIG2)
OSCENINSTOP — Oscillator Enable in Stop Mode Bit
OSCENINSTOP, when set, will allow the bus clock source (BUSCLKX2) to generate clocks for the
AWU in stop mode. See 11.8.1 Oscillator Status and Control Register for information on enabling the
external clock sources.
1 = Oscillator enabled to operate during stop mode
0 = Oscillator disabled during stop mode
NOTE
IRQPUD, IRQEN, ESCIBDSRC, and RSTEN bits are not used in conjuction
with the auto wakeup feature. To see a description of these bits, see
Chapter 5 Configuration Register (CONFIG).
4.6.5 Configuration Register 1
The configuration register 1 (CONFIG1), is used to select the period for the AWU. The timeout will be
based on the COPRS bit along with the clock source for the AWU.
Read:
Write:
Reset: POR:
Bit 7
6
5
4
3
2
1
Bit 0
COPRS
LVISTOP
LVIRSTD
LVIPWRD
LVITRIP
SSREC
STOP
COPD
0
0
0
0
0
0
0
0
U
0
0
0
0
0
0
0
U = Unaffected
Figure 4-6. Configuration Register 1 (CONFIG1)
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
55
Auto Wakeup Module (AWU)
COPRS (In Stop Mode) — Auto Wakeup Period Selection Bit, depends on OSCSTOPEN in
CONFIG2 and bus clock source (BUSCLKX2).
1 = Auto wakeup short cycle = 512 × (INTRCOSC or BUSCLKX2)
0 = Auto wakeup long cycle = 16,384 × (INTRCOSC or BUSCLKX2)
SSREC — Short Stop Recovery Bit
SSREC enables the CPU to exit stop mode with a delay of 32 BUSCLKX4 cycles instead of a 4096
BUSCLKX4 cycle delay.
1 = Stop mode recovery after 32 BUSCLKX4 cycles
0 = Stop mode recovery after 4096 BUSCLKX4 cycles
NOTE
LVISTOP, LVIRST, LVIPWRD, LVITRIP and COPD bits are not used in
conjuction with the auto wakeup feature. To see a description of these bits,
see Chapter 5 Configuration Register (CONFIG)
MC68HC908QB8 Data Sheet, Rev. 3
56
Freescale Semiconductor
Chapter 5
Configuration Register (CONFIG)
5.1 Introduction
This section describes the configuration registers (CONFIG1 and CONFIG2). The configuration registers
enable or disable the following options:
• Stop mode recovery time (32 × BUSCLKX4 cycles or 4096 × BUSCLKX4 cycles)
• STOP instruction
• Computer operating properly module (COP)
• COP reset period (COPRS): 8176 × BUSCLKX4 or 262,128 × BUSCLKX4
• Low-voltage inhibit (LVI) enable and trip voltage selection
• Auto wakeup timeout period
• Allow clock source to remain enabled in STOP
• Enable IRQ pin
• Disable IRQ pin pullup device
• Enable RST pin
• Clock source selection for the enhanced serial communication interface (ESCI) module
5.2 Functional Description
The configuration registers are used in the initialization of various options. The configuration registers can
be written once after each reset. Most of the configuration register bits are cleared during reset. Since the
various options affect the operation of the microcontroller unit (MCU) it is recommended that this register
be written immediately after reset. The configuration registers are located at $001E and $001F, and may
be read at anytime.
NOTE
The CONFIG registers are one-time writable by the user after each reset.
Upon a reset, the CONFIG registers default to predetermined settings as
shown in Figure 5-1 and Figure 5-2.
Bit 7
6
5
4
3
IRQPUD
IRQEN
R
R
R
Reset:
0
0
0
0
0
0
0
U
POR:
0
0
0
0
0
0
0
0
R
= Reserved
Read:
Write:
2
1
ESCIBDSRC OSCENINSTOP
Bit 0
RSTEN
U = Unaffected
Figure 5-1. Configuration Register 2 (CONFIG2)
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
57
Configuration Register (CONFIG)
IRQPUD — IRQ Pin Pullup Control Bit
1 = Internal pullup is disconnected
0 = Internal pullup is connected between IRQ pin and VDD
IRQEN — IRQ Pin Function Selection Bit
1 = Interrupt request function active in pin
0 = Interrupt request function inactive in pin
ESCIBDSRC — ESCI Baud Rate Clock Source Bit
ESCIBDSRC controls the clock source used for the ESCI. The setting of the bit affects the frequency
at which the ESCI operates.
1 = Internal data bus clock used as clock source for ESCI
0 = BUSCLKX4 used as clock source for ESCI
OSCENINSTOP— Oscillator Enable in Stop Mode Bit
OSCENINSTOP, when set, will allow the clock source to continue to generate clocks in stop mode.
This function can be used to keep the auto-wakeup running while the rest of the microcontroller stops.
When clear, the clock source is disabled when the microcontroller enters stop mode.
1 = Oscillator enabled to operate during stop mode
0 = Oscillator disabled during stop mode
RSTEN — RST Pin Function Selection
1 = Reset function active in pin
0 = Reset function inactive in pin
NOTE
The RSTEN bit is cleared by a power-on reset (POR) only. Other resets will
leave this bit unaffected.
Bit 7
6
5
4
3
2
1
Bit 0
COPRS
LVISTOP
LVIRSTD
LVIPWRD
LVITRIP
SSREC
STOP
COPD
Reset:
0
0
0
0
U
0
0
0
POR:
0
0
0
0
0
0
0
0
Read:
Write:
U = Unaffected
Figure 5-2. Configuration Register 1 (CONFIG1)
COPRS (Out of Stop Mode) — COP Reset Period Selection Bit
1 = COP reset short cycle = 8176 × BUSCLKX4
0 = COP reset long cycle = 262,128 × BUSCLKX4
COPRS (In Stop Mode) — Auto Wakeup Period Selection Bit, depends on OSCSTOPEN in
CONFIG2 and external clock source
1 = Auto wakeup short cycle = 512 × (INTRCOSC or BUSCLKX4)
0 = Auto wakeup long cycle = 16,384 × (INTRCOSC or BUSCLKX4)
LVISTOP — LVI Enable in Stop Mode Bit
When the LVIPWRD bit is clear, setting the LVISTOP bit enables the LVI to operate during stop mode.
Reset clears LVISTOP.
1 = LVI enabled during stop mode
0 = LVI disabled during stop mode
MC68HC908QB8 Data Sheet, Rev. 3
58
Freescale Semiconductor
Functional Description
LVIRSTD — LVI Reset Disable Bit
LVIRSTD disables the reset signal from the LVI module.
1 = LVI module resets disabled
0 = LVI module resets enabled
LVIPWRD — LVI Power Disable Bit
LVIPWRD disables the LVI module.
1 = LVI module power disabled
0 = LVI module power enabled
LVITRIP — LVI Trip Point Selection Bit
LVITRIP selects the voltage operating mode of the LVI module. The voltage mode selected for the LVI
should match the operating VDD for the LVI’s voltage trip points for each of the modes.
1 = LVI operates for a 5-V protection
0 = LVI operates for a 3-V protection
NOTE
The LVITRIP bit is cleared by a power-on reset (POR) only. Other resets
will leave this bit unaffected.
SSREC — Short Stop Recovery Bit
SSREC enables the CPU to exit stop mode with a delay of 32 BUSCLKX4 cycles instead of a 4096
BUSCLKX4 cycle delay.
1 = Stop mode recovery after 32 BUSCLKX4 cycles
0 = Stop mode recovery after 4096 BUSCLKX4 cycles
NOTE
Exiting stop mode by an LVI reset will result in the long stop recovery.
When using the LVI during normal operation but disabling during stop mode, the LVI will have an
enable time of tEN. The system stabilization time for power-on reset and long stop recovery (both 4096
BUSCLKX4 cycles) gives a delay longer than the LVI enable time for these startup scenarios. There
is no period where the MCU is not protected from a low-power condition. However, when using the
short stop recovery configuration option, the 32 BUSCLKX4 delay must be greater than the LVI’s turn
on time to avoid a period in startup where the LVI is not protecting the MCU.
STOP — STOP Instruction Enable Bit
STOP enables the STOP instruction.
1 = STOP instruction enabled
0 = STOP instruction treated as illegal opcode
COPD — COP Disable Bit
COPD disables the COP module.
1 = COP module disabled
0 = COP module enabled
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
59
Configuration Register (CONFIG)
MC68HC908QB8 Data Sheet, Rev. 3
60
Freescale Semiconductor
Chapter 6
Computer Operating Properly (COP)
6.1 Introduction
The computer operating properly (COP) module contains a free-running counter that generates a reset if
allowed to overflow. The COP module helps software recover from runaway code. Prevent a COP reset
by clearing the COP counter periodically. The COP module can be disabled through the COPD bit in the
configuration 1 (CONFIG1) register.
6.2 Functional Description
SIM MODULE
STOP INSTRUCTION
RESET STATUS REGISTER
COP TIMEOUT
CLEAR STAGES 5–12
CLEAR ALL STAGES
INTERNAL RESET SOURCES(1)
SIM RESET CIRCUIT
12-BIT SIM COUNTER
BUSCLKX4
COPCTL WRITE
COP CLOCK
COP MODULE
6-BIT COP COUNTER
COPEN (FROM SIM)
COPD (FROM CONFIG1)
RESET
CLEAR
COP COUNTER
COPCTL WRITE
COP RATE SELECT
(COPRS FROM CONFIG1)
1. See Chapter 14 System Integration Module (SIM) for more details.
Figure 6-1. COP Block Diagram
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
61
Computer Operating Properly (COP)
The COP counter is a free-running 6-bit counter preceded by the 12-bit system integration module (SIM)
counter. If not cleared by software, the COP counter overflows and generates an asynchronous reset after
8176 or 262,128 BUSCLKX4 cycles; depending on the state of the COP rate select bit, COPRS, in
configuration register 1. With a 262,128 BUSCLKX4 cycle overflow option, the internal 12.8-MHz
oscillator gives a COP timeout period of 20.48 ms. Writing any value to location $FFFF before an overflow
occurs prevents a COP reset by clearing the COP counter and stages 12–5 of the SIM counter.
NOTE
Service the COP immediately after reset and before entering or after exiting
stop mode to guarantee the maximum time before the first COP counter
overflow.
A COP reset pulls the RST pin low (if the RSTEN bit is set in the CONFIG1 register) for 32 × BUSCLKX4
cycles and sets the COP bit in the reset status register (RSR). See 14.8.1 SIM Reset Status Register.
NOTE
Place COP clearing instructions in the main program and not in an interrupt
subroutine. Such an interrupt subroutine could keep the COP from
generating a reset even while the main program is not working properly.
6.3 I/O Signals
The following paragraphs describe the signals shown in Figure 6-1.
6.3.1 BUSCLKX4
BUSCLKX4 is the oscillator output signal. BUSCLKX4 frequency is equal to the internal oscillator
frequency, the crystal frequency, or the RC-oscillator frequency.
6.3.2 STOP Instruction
The STOP instruction clears the SIM counter.
6.3.3 COPCTL Write
Writing any value to the COP control register (COPCTL) (see Figure 6-2) clears the COP counter and
clears stages 12–5 of the SIM counter. Reading the COP control register returns the low byte of the reset
vector.
6.3.4 Power-On Reset
The power-on reset (POR) circuit in the SIM clears the SIM counter 4096 × BUSCLKX4 cycles after power
up.
6.3.5 Internal Reset
An internal reset clears the SIM counter and the COP counter.
6.3.6 COPD (COP Disable)
The COPD signal reflects the state of the COP disable bit (COPD) in the configuration register (CONFIG).
See Chapter 5 Configuration Register (CONFIG).
MC68HC908QB8 Data Sheet, Rev. 3
62
Freescale Semiconductor
Interrupts
6.3.7 COPRS (COP Rate Select)
The COPRS signal reflects the state of the COP rate select bit (COPRS) in the configuration register 1
(CONFIG1). See Chapter 5 Configuration Register (CONFIG).
6.4 Interrupts
The COP does not generate CPU interrupt requests.
6.5 Monitor Mode
The COP is disabled in monitor mode when VTST is present on the IRQ pin.
6.6 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
6.6.1 Wait Mode
The COP continues to operate during wait mode. To prevent a COP reset during wait mode, periodically
clear the COP counter.
6.6.2 Stop Mode
Stop mode turns off the BUSCLKX4 input to the COP and clears the SIM counter. Service the COP
immediately before entering or after exiting stop mode to ensure a full COP timeout period after entering
or exiting stop mode.
6.7 COP Module During Break Mode
The COP is disabled during a break interrupt with monitor mode when BDCOP bit is set in break auxiliary
register (BRKAR).
6.8 Register
The COP control register (COPCTL) is located at address $FFFF and overlaps the reset vector. Writing
any value to $FFFF clears the COP counter and starts a new timeout period. Reading location $FFFF
returns the low byte of the reset vector.
Bit 7
6
5
4
3
Read:
LOW BYTE OF RESET VECTOR
Write:
CLEAR COP COUNTER
Reset:
Unaffected by reset
2
1
Bit 0
Figure 6-2. COP Control Register (COPCTL)
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
63
Computer Operating Properly (COP)
MC68HC908QB8 Data Sheet, Rev. 3
64
Freescale Semiconductor
Chapter 7
Central Processor Unit (CPU)
7.1 Introduction
The M68HC08 CPU (central processor unit) is an enhanced and fully object-code-compatible version of
the M68HC05 CPU. The CPU08 Reference Manual (document order number CPU08RM/AD) contains a
description of the CPU instruction set, addressing modes, and architecture.
7.2 Features
Features of the CPU include:
• Object code fully upward-compatible with M68HC05 Family
• 16-bit stack pointer with stack manipulation instructions
• 16-bit index register with x-register manipulation instructions
• 8-MHz CPU internal bus frequency
• 64-Kbyte program/data memory space
• 16 addressing modes
• Memory-to-memory data moves without using accumulator
• Fast 8-bit by 8-bit multiply and 16-bit by 8-bit divide instructions
• Enhanced binary-coded decimal (BCD) data handling
• Modular architecture with expandable internal bus definition for extension of addressing range
beyond 64 Kbytes
• Low-power stop and wait modes
7.3 CPU Registers
Figure 7-1 shows the five CPU registers. CPU registers are not part of the memory map.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
65
Central Processor Unit (CPU)
0
7
ACCUMULATOR (A)
0
15
H
X
INDEX REGISTER (H:X)
15
0
STACK POINTER (SP)
15
0
PROGRAM COUNTER (PC)
7
0
V 1 1 H I N Z C
CONDITION CODE REGISTER (CCR)
CARRY/BORROW FLAG
ZERO FLAG
NEGATIVE FLAG
INTERRUPT MASK
HALF-CARRY FLAG
TWO’S COMPLEMENT OVERFLOW FLAG
Figure 7-1. CPU Registers
7.3.1 Accumulator
The accumulator is a general-purpose 8-bit register. The CPU uses the accumulator to hold operands and
the results of arithmetic/logic operations.
Bit 7
6
5
4
3
2
1
Bit 0
Read:
Write:
Reset:
Unaffected by reset
Figure 7-2. Accumulator (A)
7.3.2 Index Register
The 16-bit index register allows indexed addressing of a 64-Kbyte memory space. H is the upper byte of
the index register, and X is the lower byte. H:X is the concatenated 16-bit index register.
In the indexed addressing modes, the CPU uses the contents of the index register to determine the
conditional address of the operand.
The index register can serve also as a temporary data storage location.
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Bit
0
0
0
0
0
0
0
0
0
X
X
X
X
X
X
X
X
Read:
Write:
Reset:
X = Indeterminate
Figure 7-3. Index Register (H:X)
MC68HC908QB8 Data Sheet, Rev. 3
66
Freescale Semiconductor
CPU Registers
7.3.3 Stack Pointer
The stack pointer is a 16-bit register that contains the address of the next location on the stack. During a
reset, the stack pointer is preset to $00FF. The reset stack pointer (RSP) instruction sets the least
significant byte to $FF and does not affect the most significant byte. The stack pointer decrements as data
is pushed onto the stack and increments as data is pulled from the stack.
In the stack pointer 8-bit offset and 16-bit offset addressing modes, the stack pointer can function as an
index register to access data on the stack. The CPU uses the contents of the stack pointer to determine
the conditional address of the operand.
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Bit
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
Read:
Write:
Reset:
Figure 7-4. Stack Pointer (SP)
NOTE
The location of the stack is arbitrary and may be relocated anywhere in
random-access memory (RAM). Moving the SP out of page 0 ($0000 to
$00FF) frees direct address (page 0) space. For correct operation, the
stack pointer must point only to RAM locations.
7.3.4 Program Counter
The program counter is a 16-bit register that contains the address of the next instruction or operand to be
fetched.
Normally, the program counter automatically increments to the next sequential memory location every
time an instruction or operand is fetched. Jump, branch, and interrupt operations load the program
counter with an address other than that of the next sequential location.
During reset, the program counter is loaded with the reset vector address located at $FFFE and $FFFF.
The vector address is the address of the first instruction to be executed after exiting the reset state.
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Bit
0
Read:
Write:
Reset:
Loaded with vector from $FFFE and $FFFF
Figure 7-5. Program Counter (PC)
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
67
Central Processor Unit (CPU)
7.3.5 Condition Code Register
The 8-bit condition code register contains the interrupt mask and five flags that indicate the results of the
instruction just executed. Bits 6 and 5 are set permanently to 1. The following paragraphs describe the
functions of the condition code register.
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
V
1
1
H
I
N
Z
C
X
1
1
X
1
X
X
X
X = Indeterminate
Figure 7-6. Condition Code Register (CCR)
V — Overflow Flag
The CPU sets the overflow flag when a two's complement overflow occurs. The signed branch
instructions BGT, BGE, BLE, and BLT use the overflow flag.
1 = Overflow
0 = No overflow
H — Half-Carry Flag
The CPU sets the half-carry flag when a carry occurs between accumulator bits 3 and 4 during an
add-without-carry (ADD) or add-with-carry (ADC) operation. The half-carry flag is required for
binary-coded decimal (BCD) arithmetic operations. The DAA instruction uses the states of the H and
C flags to determine the appropriate correction factor.
1 = Carry between bits 3 and 4
0 = No carry between bits 3 and 4
I — Interrupt Mask
When the interrupt mask is set, all maskable CPU interrupts are disabled. CPU interrupts are enabled
when the interrupt mask is cleared. When a CPU interrupt occurs, the interrupt mask is set
automatically after the CPU registers are saved on the stack, but before the interrupt vector is fetched.
1 = Interrupts disabled
0 = Interrupts enabled
NOTE
To maintain M6805 Family compatibility, the upper byte of the index
register (H) is not stacked automatically. If the interrupt service routine
modifies H, then the user must stack and unstack H using the PSHH and
PULH instructions.
After the I bit is cleared, the highest-priority interrupt request is serviced first.
A return-from-interrupt (RTI) instruction pulls the CPU registers from the stack and restores the
interrupt mask from the stack. After any reset, the interrupt mask is set and can be cleared only by the
clear interrupt mask software instruction (CLI).
N — Negative Flag
The CPU sets the negative flag when an arithmetic operation, logic operation, or data manipulation
produces a negative result, setting bit 7 of the result.
1 = Negative result
0 = Non-negative result
MC68HC908QB8 Data Sheet, Rev. 3
68
Freescale Semiconductor
Arithmetic/Logic Unit (ALU)
Z — Zero Flag
The CPU sets the zero flag when an arithmetic operation, logic operation, or data manipulation
produces a result of $00.
1 = Zero result
0 = Non-zero result
C — Carry/Borrow Flag
The CPU sets the carry/borrow flag when an addition operation produces a carry out of bit 7 of the
accumulator or when a subtraction operation requires a borrow. Some instructions — such as bit test
and branch, shift, and rotate — also clear or set the carry/borrow flag.
1 = Carry out of bit 7
0 = No carry out of bit 7
7.4 Arithmetic/Logic Unit (ALU)
The ALU performs the arithmetic and logic operations defined by the instruction set.
Refer to the CPU08 Reference Manual (document order number CPU08RM/AD) for a description of the
instructions and addressing modes and more detail about the architecture of the CPU.
7.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
7.5.1 Wait Mode
The WAIT instruction:
• Clears the interrupt mask (I bit) in the condition code register, enabling interrupts. After exit from
wait mode by interrupt, the I bit remains clear. After exit by reset, the I bit is set.
• Disables the CPU clock
7.5.2 Stop Mode
The STOP instruction:
• Clears the interrupt mask (I bit) in the condition code register, enabling external interrupts. After
exit from stop mode by external interrupt, the I bit remains clear. After exit by reset, the I bit is set.
• Disables the CPU clock
After exiting stop mode, the CPU clock begins running after the oscillator stabilization delay.
7.6 CPU During Break Interrupts
If a break module is present on the MCU, the CPU starts a break interrupt by:
• Loading the instruction register with the SWI instruction
• Loading the program counter with $FFFC:$FFFD or with $FEFC:$FEFD in monitor mode
The break interrupt begins after completion of the CPU instruction in progress. If the break address
register match occurs on the last cycle of a CPU instruction, the break interrupt begins immediately.
A return-from-interrupt instruction (RTI) in the break routine ends the break interrupt and returns the MCU
to normal operation if the break interrupt has been deasserted.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
69
Central Processor Unit (CPU)
7.7 Instruction Set Summary
Table 7-1 provides a summary of the M68HC08 instruction set.
ADC #opr
ADC opr
ADC opr
ADC opr,X
ADC opr,X
ADC ,X
ADC opr,SP
ADC opr,SP
ADD #opr
ADD opr
ADD opr
ADD opr,X
ADD opr,X
ADD ,X
ADD opr,SP
ADD opr,SP
V H I N Z C
A ← (A) + (M) + (C)
Add with Carry
A ← (A) + (M)
Add without Carry
IMM
DIR
EXT
IX2
– IX1
IX
SP1
SP2
A9
B9
C9
D9
E9
F9
9EE9
9ED9
ii
dd
hh ll
ee ff
ff
IMM
DIR
EXT
– IX2
IX1
IX
SP1
SP2
AB
BB
CB
DB
EB
FB
9EEB
9EDB
ii
dd
hh ll
ee ff
ff
ff
ee ff
ff
ee ff
Cycles
Effect
on CCR
Description
Operand
Operation
Opcode
Source
Form
Address
Mode
Table 7-1. Instruction Set Summary (Sheet 1 of 6)
2
3
4
4
3
2
4
5
2
3
4
4
3
2
4
5
AIS #opr
Add Immediate Value (Signed) to SP
SP ← (SP) + (16 « M)
– – – – – – IMM
A7
ii
2
AIX #opr
Add Immediate Value (Signed) to H:X
H:X ← (H:X) + (16 « M)
– – – – – – IMM
AF
ii
2
A ← (A) & (M)
IMM
DIR
EXT
IX2
0 – – – IX1
IX
SP1
SP2
A4
B4
C4
D4
E4
F4
9EE4
9ED4
ii
dd
hh ll
ee ff
ff
2
3
4
4
3
2
4
5
DIR
INH
INH
– – IX1
IX
SP1
38 dd
48
58
68 ff
78
9E68 ff
4
1
1
4
3
5
DIR
INH
– – INH
IX1
IX
SP1
– – – – – – REL
37
47
57
67
77
9E67
24
ff
rr
4
1
1
4
3
5
3
11
13
15
17
19
1B
1D
1F
dd
dd
dd
dd
dd
dd
dd
dd
4
4
4
4
4
4
4
4
AND #opr
AND opr
AND opr
AND opr,X
AND opr,X
AND ,X
AND opr,SP
AND opr,SP
ASL opr
ASLA
ASLX
ASL opr,X
ASL ,X
ASL opr,SP
Logical AND
Arithmetic Shift Left
(Same as LSL)
ASR opr
ASRA
ASRX
ASR opr,X
ASR opr,X
ASR opr,SP
Arithmetic Shift Right
BCC rel
Branch if Carry Bit Clear
C
0
b7
b0
C
b7
b0
PC ← (PC) + 2 + rel ? (C) = 0
Mn ← 0
DIR (b0)
DIR (b1)
DIR (b2)
– – – – – – DIR (b3)
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
ff
ee ff
dd
ff
BCLR n, opr
Clear Bit n in M
BCS rel
Branch if Carry Bit Set (Same as BLO)
PC ← (PC) + 2 + rel ? (C) = 1
– – – – – – REL
25
rr
3
BEQ rel
Branch if Equal
PC ← (PC) + 2 + rel ? (Z) = 1
– – – – – – REL
27
rr
3
Branch if Greater Than or Equal To
– – – – – – REL
PC ← (PC) + 2 + rel ? (N ⊕ V) = 0
(Signed Operands)
Branch if Greater Than (Signed
PC ← (PC) + 2 + rel ? (Z) | (N ⊕ V) = 0 – – – – – – REL
Operands)
90
rr
3
92
rr
3
BGE opr
BGT opr
BHCC rel
Branch if Half Carry Bit Clear
PC ← (PC) + 2 + rel ? (H) = 0
– – – – – – REL
28
rr
BHCS rel
Branch if Half Carry Bit Set
PC ← (PC) + 2 + rel ? (H) = 1
– – – – – – REL
29
rr
BHI rel
Branch if Higher
PC ← (PC) + 2 + rel ? (C) | (Z) = 0
– – – – – – REL
22
rr
3
3
3
MC68HC908QB8 Data Sheet, Rev. 3
70
Freescale Semiconductor
Instruction Set Summary
Effect
on CCR
V H I N Z C
Cycles
Description
Operand
Operation
Opcode
Source
Form
Address
Mode
Table 7-1. Instruction Set Summary (Sheet 2 of 6)
Branch if Higher or Same
(Same as BCC)
PC ← (PC) + 2 + rel ? (C) = 0
– – – – – – REL
BIH rel
Branch if IRQ Pin High
PC ← (PC) + 2 + rel ? IRQ = 1
– – – – – – REL
2F
rr
3
BIL rel
Branch if IRQ Pin Low
PC ← (PC) + 2 + rel ? IRQ = 0
– – – – – – REL
2E
rr
3
(A) & (M)
IMM
DIR
EXT
0 – – – IX2
IX1
IX
SP1
SP2
A5
B5
C5
D5
E5
F5
9EE5
9ED5
ii
dd
hh ll
ee ff
ff
ff
ee ff
2
3
4
4
3
2
4
5
rr
3
BHS rel
BIT #opr
BIT opr
BIT opr
BIT opr,X
BIT opr,X
BIT ,X
BIT opr,SP
BIT opr,SP
Bit Test
PC ← (PC) + 2 + rel ? (Z) | (N ⊕ V) = 1 – – – – – – REL
24
rr
3
BLO rel
Branch if Less Than or Equal To
(Signed Operands)
Branch if Lower (Same as BCS)
PC ← (PC) + 2 + rel ? (C) = 1
– – – – – – REL
25
rr
3
BLS rel
Branch if Lower or Same
PC ← (PC) + 2 + rel ? (C) | (Z) = 1
– – – – – – REL
23
rr
3
BLE opr
93
BLT opr
Branch if Less Than (Signed Operands)
PC ← (PC) + 2 + rel ? (N ⊕ V) =1
– – – – – – REL
91
rr
3
BMC rel
Branch if Interrupt Mask Clear
PC ← (PC) + 2 + rel ? (I) = 0
– – – – – – REL
2C
rr
3
BMI rel
Branch if Minus
PC ← (PC) + 2 + rel ? (N) = 1
– – – – – – REL
2B
rr
3
BMS rel
Branch if Interrupt Mask Set
PC ← (PC) + 2 + rel ? (I) = 1
– – – – – – REL
2D
rr
3
BNE rel
Branch if Not Equal
PC ← (PC) + 2 + rel ? (Z) = 0
– – – – – – REL
26
rr
3
BPL rel
Branch if Plus
PC ← (PC) + 2 + rel ? (N) = 0
– – – – – – REL
2A
rr
3
BRA rel
Branch Always
PC ← (PC) + 2 + rel
– – – – – – REL
20
rr
3
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
– – – – – DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
01
03
05
07
09
0B
0D
0F
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
5
5
5
5
5
5
5
5
– – – – – – REL
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
– – – – – DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
21
00
02
04
06
08
0A
0C
0E
rr
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
3
DIR (b0)
DIR (b1)
DIR (b2)
– – – – – – DIR (b3)
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
10
12
14
16
18
1A
1C
1E
dd
dd
dd
dd
dd
dd
dd
dd
4
4
4
4
4
4
4
4
PC ← (PC) + 2; push (PCL)
SP ← (SP) – 1; push (PCH)
SP ← (SP) – 1
PC ← (PC) + rel
– – – – – – REL
AD
rr
4
PC ← (PC) + 3 + rel ? (A) – (M) = $00
PC ← (PC) + 3 + rel ? (A) – (M) = $00
PC ← (PC) + 3 + rel ? (X) – (M) = $00
PC ← (PC) + 3 + rel ? (A) – (M) = $00
PC ← (PC) + 2 + rel ? (A) – (M) = $00
PC ← (PC) + 4 + rel ? (A) – (M) = $00
DIR
IMM
– – – – – – IMM
IX1+
IX+
SP1
31
41
51
61
71
9E61
dd rr
ii rr
ii rr
ff rr
rr
ff rr
5
4
4
5
4
6
C←0
– – – – – 0 INH
98
1
I←0
– – 0 – – – INH
9A
2
BRCLR n,opr,rel Branch if Bit n in M Clear
BRN rel
Branch Never
BRSET n,opr,rel Branch if Bit n in M Set
BSET n,opr
Set Bit n in M
BSR rel
Branch to Subroutine
CBEQ opr,rel
CBEQA #opr,rel
CBEQX #opr,rel Compare and Branch if Equal
CBEQ opr,X+,rel
CBEQ X+,rel
CBEQ opr,SP,rel
CLC
Clear Carry Bit
CLI
Clear Interrupt Mask
PC ← (PC) + 3 + rel ? (Mn) = 0
PC ← (PC) + 2
PC ← (PC) + 3 + rel ? (Mn) = 1
Mn ← 1
5
5
5
5
5
5
5
5
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
71
Central Processor Unit (CPU)
CLR opr
CLRA
CLRX
CLRH
CLR opr,X
CLR ,X
CLR opr,SP
CMP #opr
CMP opr
CMP opr
CMP opr,X
CMP opr,X
CMP ,X
CMP opr,SP
CMP opr,SP
COM opr
COMA
COMX
COM opr,X
COM ,X
COM opr,SP
CPHX #opr
CPHX opr
V H I N Z C
M ← $00
A ← $00
X ← $00
H ← $00
M ← $00
M ← $00
M ← $00
Clear
Compare A with M
Compare H:X with M
Compare X with M
DAA
Decimal Adjust A
Decrement
DIV
Divide
INC opr
INCA
INCX
INC opr,X
INC ,X
INC opr,SP
Exclusive OR M with A
Increment
3F dd
4F
5F
8C
6F ff
7F
9E6F ff
3
1
1
1
3
2
4
IMM
DIR
EXT
IX2
– – IX1
IX
SP1
SP2
DIR
INH
INH
0 – – 1
IX1
IX
SP1
A1
B1
C1
D1
E1
F1
9EE1
9ED1
33
43
53
63
73
9E63
ff
2
3
4
4
3
2
4
5
4
1
1
4
3
5
(H:X) – (M:M + 1)
IMM
– – DIR
65
75
ii ii+1
dd
3
4
(X) – (M)
IMM
DIR
EXT
IX2
– – IX1
IX
SP1
SP2
A3
B3
C3
D3
E3
F3
9EE3
9ED3
ii
dd
hh ll
ee ff
ff
2
3
4
4
3
2
4
5
U – – INH
72
M ← (M) = $FF – (M)
A ← (A) = $FF – (M)
X ← (X) = $FF – (M)
M ← (M) = $FF – (M)
M ← (M) = $FF – (M)
M ← (M) = $FF – (M)
(A)10
DBNZ opr,rel
DBNZA rel
DBNZX rel
Decrement and Branch if Not Zero
DBNZ opr,X,rel
DBNZ X,rel
DBNZ opr,SP,rel
DEC opr
DECA
DECX
DEC opr,X
DEC ,X
DEC opr,SP
DIR
INH
INH
0 – – 0 1 – INH
IX1
IX
SP1
(A) – (M)
Complement (One’s Complement)
CPX #opr
CPX opr
CPX opr
CPX ,X
CPX opr,X
CPX opr,X
CPX opr,SP
CPX opr,SP
EOR #opr
EOR opr
EOR opr
EOR opr,X
EOR opr,X
EOR ,X
EOR opr,SP
EOR opr,SP
Effect
on CCR
Cycles
Description
Operand
Operation
Opcode
Source
Form
Address
Mode
Table 7-1. Instruction Set Summary (Sheet 3 of 6)
A ← (A) – 1 or M ← (M) – 1 or X ← (X) – 1
PC ← (PC) + 3 + rel ? (result) ≠ 0
DIR
PC ← (PC) + 2 + rel ? (result) ≠ 0
INH
PC ← (PC) + 2 + rel ? (result) ≠ 0
– – – – – – INH
PC ← (PC) + 3 + rel ? (result) ≠ 0
IX1
PC ← (PC) + 2 + rel ? (result) ≠ 0
IX
PC ← (PC) + 4 + rel ? (result) ≠ 0
SP1
3B
4B
5B
6B
7B
9E6B
ii
dd
hh ll
ee ff
ff
ff
ee ff
dd
ff
ff
ee ff
2
dd rr
rr
rr
ff rr
rr
ff rr
M ← (M) – 1
A ← (A) – 1
X ← (X) – 1
M ← (M) – 1
M ← (M) – 1
M ← (M) – 1
DIR
INH
INH
– – –
IX1
IX
SP1
A ← (H:A)/(X)
H ← Remainder
– – – – INH
52
A ← (A ⊕ M)
IMM
DIR
EXT
0 – – – IX2
IX1
IX
SP1
SP2
A8
B8
C8
D8
E8
F8
9EE8
9ED8
DIR
INH
– – – INH
IX1
IX
SP1
3C dd
4C
5C
6C ff
7C
9E6C ff
M ← (M) + 1
A ← (A) + 1
X ← (X) + 1
M ← (M) + 1
M ← (M) + 1
M ← (M) + 1
3A dd
4A
5A
6A ff
7A
9E6A ff
5
3
3
5
4
6
4
1
1
4
3
5
7
ii
dd
hh ll
ee ff
ff
ff
ee ff
2
3
4
4
3
2
4
5
4
1
1
4
3
5
MC68HC908QB8 Data Sheet, Rev. 3
72
Freescale Semiconductor
Instruction Set Summary
JSR opr
JSR opr
JSR opr,X
JSR opr,X
JSR ,X
LDA #opr
LDA opr
LDA opr
LDA opr,X
LDA opr,X
LDA ,X
LDA opr,SP
LDA opr,SP
LDHX #opr
LDHX opr
LDX #opr
LDX opr
LDX opr
LDX opr,X
LDX opr,X
LDX ,X
LDX opr,SP
LDX opr,SP
LSL opr
LSLA
LSLX
LSL opr,X
LSL ,X
LSL opr,SP
LSR opr
LSRA
LSRX
LSR opr,X
LSR ,X
LSR opr,SP
MOV opr,opr
MOV opr,X+
MOV #opr,opr
MOV X+,opr
MUL
NEG opr
NEGA
NEGX
NEG opr,X
NEG ,X
NEG opr,SP
PC ← Jump Address
DIR
EXT
– – – – – – IX2
IX1
IX
BC
CC
DC
EC
FC
dd
hh ll
ee ff
ff
2
3
4
3
2
PC ← (PC) + n (n = 1, 2, or 3)
Push (PCL); SP ← (SP) – 1
Push (PCH); SP ← (SP) – 1
PC ← Unconditional Address
DIR
EXT
– – – – – – IX2
IX1
IX
BD
CD
DD
ED
FD
dd
hh ll
ee ff
ff
4
5
6
5
4
IMM
DIR
EXT
IX2
0 – – – IX1
IX
SP1
SP2
IMM
0 – – –
DIR
A6
B6
C6
D6
E6
F6
9EE6
9ED6
45
55
ii
dd
hh ll
ee ff
ff
2
3
4
4
3
2
4
5
3
4
IMM
DIR
EXT
IX2
0 – – – IX1
IX
SP1
SP2
AE
BE
CE
DE
EE
FE
9EEE
9EDE
DIR
INH
INH
– – IX1
IX
SP1
38 dd
48
58
68 ff
78
9E68 ff
H:X ← (H:X) + 1 (IX+D, DIX+)
DIR
INH
– – 0 INH
IX1
IX
SP1
DD
DIX+
0 – – – IMD
IX+D
34
44
54
64
74
9E64
4E
5E
6E
7E
X:A ← (X) × (A)
– 0 – – – 0 INH
M ← –(M) = $00 – (M)
A ← –(A) = $00 – (A)
X ← –(X) = $00 – (X)
M ← –(M) = $00 – (M)
M ← –(M) = $00 – (M)
DIR
INH
INH
– – IX1
IX
SP1
Effect
on CCR
Description
V H I N Z C
Jump
Jump to Subroutine
A ← (M)
Load A from M
H:X ← (M:M + 1)
Load H:X from M
X ← (M)
Load X from M
Logical Shift Left
(Same as ASL)
Logical Shift Right
C
0
b7
b0
0
C
b7
Move
Unsigned multiply
Negate (Two’s Complement)
b0
(M)Destination ← (M)Source
ff
ee ff
ii jj
dd
ii
dd
hh ll
ee ff
ff
ff
ee ff
Cycles
Operand
JMP opr
JMP opr
JMP opr,X
JMP opr,X
JMP ,X
Operation
Address
Mode
Source
Form
Opcode
Table 7-1. Instruction Set Summary (Sheet 4 of 6)
2
3
4
4
3
2
4
5
4
1
1
4
3
5
dd
4
1
1
ff
4
3
ff
5
dd dd 5
dd
4
ii dd
4
dd
4
42
5
30 dd
40
50
60 ff
70
9E60 ff
4
1
1
4
3
5
NOP
No Operation
None
– – – – – – INH
9D
1
NSA
Nibble Swap A
A ← (A[3:0]:A[7:4])
– – – – – – INH
62
3
A ← (A) | (M)
IMM
DIR
EXT
IX2
0 – – –
IX1
IX
SP1
SP2
ii
dd
hh ll
ee ff
ff
2
3
4
4
3
2
4
5
ORA #opr
ORA opr
ORA opr
ORA opr,X
ORA opr,X
ORA ,X
ORA opr,SP
ORA opr,SP
Inclusive OR A and M
PSHA
Push A onto Stack
Push (A); SP ← (SP) – 1
– – – – – – INH
AA
BA
CA
DA
EA
FA
9EEA
9EDA
87
PSHH
Push H onto Stack
Push (H); SP ← (SP) – 1
– – – – – – INH
8B
2
PSHX
Push X onto Stack
Push (X); SP ← (SP) – 1
– – – – – – INH
89
2
ff
ee ff
2
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
73
Central Processor Unit (CPU)
V H I N Z C
Cycles
Effect
on CCR
Description
Operand
Operation
Opcode
Source
Form
Address
Mode
Table 7-1. Instruction Set Summary (Sheet 5 of 6)
PULA
Pull A from Stack
SP ← (SP + 1); Pull (A)
– – – – – – INH
86
2
PULH
Pull H from Stack
SP ← (SP + 1); Pull (H)
– – – – – – INH
8A
2
PULX
Pull X from Stack
SP ← (SP + 1); Pull (X)
– – – – – – INH
88
2
C
DIR
INH
INH
– – IX1
IX
SP1
39 dd
49
59
69 ff
79
9E69 ff
4
1
1
4
3
5
DIR
INH
– – INH
IX1
IX
SP1
36 dd
46
56
66 ff
76
9E66 ff
4
1
1
4
3
5
ROL opr
ROLA
ROLX
ROL opr,X
ROL ,X
ROL opr,SP
Rotate Left through Carry
b7
b0
ROR opr
RORA
RORX
ROR opr,X
ROR ,X
ROR opr,SP
Rotate Right through Carry
RSP
Reset Stack Pointer
SP ← $FF
– – – – – – INH
9C
1
RTI
Return from Interrupt
SP ← (SP) + 1; Pull (CCR)
SP ← (SP) + 1; Pull (A)
SP ← (SP) + 1; Pull (X)
SP ← (SP) + 1; Pull (PCH)
SP ← (SP) + 1; Pull (PCL)
INH
80
7
RTS
Return from Subroutine
SP ← SP + 1; Pull (PCH)
SP ← SP + 1; Pull (PCL)
– – – – – – INH
81
4
A ← (A) – (M) – (C)
IMM
DIR
EXT
– – IX2
IX1
IX
SP1
SP2
A2
B2
C2
D2
E2
F2
9EE2
9ED2
C
b7
b0
SBC #opr
SBC opr
SBC opr
SBC opr,X
SBC opr,X
SBC ,X
SBC opr,SP
SBC opr,SP
Subtract with Carry
SEC
Set Carry Bit
C←1
– – – – – 1 INH
99
1
SEI
Set Interrupt Mask
I←1
– – 1 – – – INH
9B
2
(M:M + 1) ← (H:X)
DIR
EXT
IX2
0 – – – IX1
IX
SP1
SP2
0 – – – DIR
B7
C7
D7
E7
F7
9EE7
9ED7
35
I ← 0; Stop Processing
– – 0 – – – INH
8E
M ← (X)
DIR
EXT
IX2
0 – – – IX1
IX
SP1
SP2
BF
CF
DF
EF
FF
9EEF
9EDF
dd
hh ll
ee ff
ff
IMM
DIR
EXT
– – IX2
IX1
IX
SP1
SP2
A0
B0
C0
D0
E0
F0
9EE0
9ED0
ii
dd
hh ll
ee ff
ff
STA opr
STA opr
STA opr,X
STA opr,X
STA ,X
STA opr,SP
STA opr,SP
STHX opr
STOP
STX opr
STX opr
STX opr,X
STX opr,X
STX ,X
STX opr,SP
STX opr,SP
SUB #opr
SUB opr
SUB opr
SUB opr,X
SUB opr,X
SUB ,X
SUB opr,SP
SUB opr,SP
M ← (A)
Store A in M
Store H:X in M
Enable Interrupts, Stop Processing,
Refer to MCU Documentation
Store X in M
Subtract
A ← (A) – (M)
ii
dd
hh ll
ee ff
ff
ff
ee ff
dd
hh ll
ee ff
ff
ff
ee ff
dd
2
3
4
4
3
2
4
5
3
4
4
3
2
4
5
4
1
ff
ee ff
ff
ee ff
3
4
4
3
2
4
5
2
3
4
4
3
2
4
5
MC68HC908QB8 Data Sheet, Rev. 3
74
Freescale Semiconductor
Opcode Map
V H I N Z C
Cycles
Effect
on CCR
Description
Operand
Operation
Opcode
Source
Form
Address
Mode
Table 7-1. Instruction Set Summary (Sheet 6 of 6)
SWI
Software Interrupt
PC ← (PC) + 1; Push (PCL)
SP ← (SP) – 1; Push (PCH)
SP ← (SP) – 1; Push (X)
SP ← (SP) – 1; Push (A)
SP ← (SP) – 1; Push (CCR)
SP ← (SP) – 1; I ← 1
PCH ← Interrupt Vector High Byte
PCL ← Interrupt Vector Low Byte
TAP
Transfer A to CCR
CCR ← (A)
INH
84
2
TAX
Transfer A to X
X ← (A)
– – – – – – INH
97
1
TPA
Transfer CCR to A
A ← (CCR)
– – – – – – INH
85
(A) – $00 or (X) – $00 or (M) – $00
DIR
INH
INH
0 – – –
IX1
IX
SP1
H:X ← (SP) + 1
– – – – – – INH
95
2
A ← (X)
– – – – – – INH
9F
1
(SP) ← (H:X) – 1
– – – – – – INH
94
2
I bit ← 0; Inhibit CPU clocking
until interrupted
– – 0 – – – INH
8F
1
TST opr
TSTA
TSTX
TST opr,X
TST ,X
TST opr,SP
Test for Negative or Zero
TSX
Transfer SP to H:X
TXA
Transfer X to A
TXS
Transfer H:X to SP
WAIT
A
C
CCR
dd
dd rr
DD
DIR
DIX+
ee ff
EXT
ff
H
H
hh ll
I
ii
IMD
IMM
INH
IX
IX+
IX+D
IX1
IX1+
IX2
M
N
Enable Interrupts; Wait for Interrupt
Accumulator
Carry/borrow bit
Condition code register
Direct address of operand
Direct address of operand and relative offset of branch instruction
Direct to direct addressing mode
Direct addressing mode
Direct to indexed with post increment addressing mode
High and low bytes of offset in indexed, 16-bit offset addressing
Extended addressing mode
Offset byte in indexed, 8-bit offset addressing
Half-carry bit
Index register high byte
High and low bytes of operand address in extended addressing
Interrupt mask
Immediate operand byte
Immediate source to direct destination addressing mode
Immediate addressing mode
Inherent addressing mode
Indexed, no offset addressing mode
Indexed, no offset, post increment addressing mode
Indexed with post increment to direct addressing mode
Indexed, 8-bit offset addressing mode
Indexed, 8-bit offset, post increment addressing mode
Indexed, 16-bit offset addressing mode
Memory location
Negative bit
n
opr
PC
PCH
PCL
REL
rel
rr
SP1
SP2
SP
U
V
X
Z
&
|
⊕
()
–( )
#
«
←
?
:
—
– – 1 – – – INH
83
9
3D dd
4D
5D
6D ff
7D
9E6D ff
1
3
1
1
3
2
4
Any bit
Operand (one or two bytes)
Program counter
Program counter high byte
Program counter low byte
Relative addressing mode
Relative program counter offset byte
Relative program counter offset byte
Stack pointer, 8-bit offset addressing mode
Stack pointer 16-bit offset addressing mode
Stack pointer
Undefined
Overflow bit
Index register low byte
Zero bit
Logical AND
Logical OR
Logical EXCLUSIVE OR
Contents of
Negation (two’s complement)
Immediate value
Sign extend
Loaded with
If
Concatenated with
Set or cleared
Not affected
7.8 Opcode Map
See Table 7-2.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
75
MSB
Branch
REL
DIR
INH
3
4
0
1
2
5
BRSET0
3 DIR
5
BRCLR0
3 DIR
5
BRSET1
3 DIR
5
BRCLR1
3 DIR
5
BRSET2
3 DIR
5
BRCLR2
3 DIR
5
BRSET3
3 DIR
5
BRCLR3
3 DIR
5
BRSET4
3 DIR
5
BRCLR4
3 DIR
5
BRSET5
3 DIR
5
BRCLR5
3 DIR
5
BRSET6
3 DIR
5
BRCLR6
3 DIR
5
BRSET7
3 DIR
5
BRCLR7
3 DIR
4
BSET0
2 DIR
4
BCLR0
2 DIR
4
BSET1
2 DIR
4
BCLR1
2 DIR
4
BSET2
2 DIR
4
BCLR2
2 DIR
4
BSET3
2 DIR
4
BCLR3
2 DIR
4
BSET4
2 DIR
4
BCLR4
2 DIR
4
BSET5
2 DIR
4
BCLR5
2 DIR
4
BSET6
2 DIR
4
BCLR6
2 DIR
4
BSET7
2 DIR
4
BCLR7
2 DIR
3
BRA
2 REL
3
BRN
2 REL
3
BHI
2 REL
3
BLS
2 REL
3
BCC
2 REL
3
BCS
2 REL
3
BNE
2 REL
3
BEQ
2 REL
3
BHCC
2 REL
3
BHCS
2 REL
3
BPL
2 REL
3
BMI
2 REL
3
BMC
2 REL
3
BMS
2 REL
3
BIL
2 REL
3
BIH
2 REL
Read-Modify-Write
INH
IX1
5
6
1
NEGX
1 INH
4
CBEQX
3 IMM
7
DIV
1 INH
1
COMX
1 INH
1
LSRX
1 INH
4
LDHX
2 DIR
1
RORX
1 INH
1
ASRX
1 INH
1
LSLX
1 INH
1
ROLX
1 INH
1
DECX
1 INH
3
DBNZX
2 INH
1
INCX
1 INH
1
TSTX
1 INH
4
MOV
2 DIX+
1
CLRX
1 INH
4
NEG
2
IX1
5
CBEQ
3 IX1+
3
NSA
1 INH
4
COM
2 IX1
4
LSR
2 IX1
3
CPHX
3 IMM
4
ROR
2 IX1
4
ASR
2 IX1
4
LSL
2 IX1
4
ROL
2 IX1
4
DEC
2 IX1
5
DBNZ
3 IX1
4
INC
2 IX1
3
TST
2 IX1
4
MOV
3 IMD
3
CLR
2 IX1
SP1
IX
9E6
7
Control
INH
INH
8
9
Register/Memory
IX2
SP2
IMM
DIR
EXT
A
B
C
D
9ED
4
SUB
3 EXT
4
CMP
3 EXT
4
SBC
3 EXT
4
CPX
3 EXT
4
AND
3 EXT
4
BIT
3 EXT
4
LDA
3 EXT
4
STA
3 EXT
4
EOR
3 EXT
4
ADC
3 EXT
4
ORA
3 EXT
4
ADD
3 EXT
3
JMP
3 EXT
5
JSR
3 EXT
4
LDX
3 EXT
4
STX
3 EXT
4
SUB
3 IX2
4
CMP
3 IX2
4
SBC
3 IX2
4
CPX
3 IX2
4
AND
3 IX2
4
BIT
3 IX2
4
LDA
3 IX2
4
STA
3 IX2
4
EOR
3 IX2
4
ADC
3 IX2
4
ORA
3 IX2
4
ADD
3 IX2
4
JMP
3 IX2
6
JSR
3 IX2
4
LDX
3 IX2
4
STX
3 IX2
5
SUB
4 SP2
5
CMP
4 SP2
5
SBC
4 SP2
5
CPX
4 SP2
5
AND
4 SP2
5
BIT
4 SP2
5
LDA
4 SP2
5
STA
4 SP2
5
EOR
4 SP2
5
ADC
4 SP2
5
ORA
4 SP2
5
ADD
4 SP2
IX1
SP1
IX
E
9EE
F
LSB
0
1
2
3
4
MC68HC908QB8 Data Sheet, Rev. 3
5
6
7
8
9
A
B
C
D
E
Freescale Semiconductor
F
4
1
NEG
NEGA
2 DIR 1 INH
5
4
CBEQ CBEQA
3 DIR 3 IMM
5
MUL
1 INH
4
1
COM
COMA
2 DIR 1 INH
4
1
LSR
LSRA
2 DIR 1 INH
4
3
STHX
LDHX
2 DIR 3 IMM
4
1
ROR
RORA
2 DIR 1 INH
4
1
ASR
ASRA
2 DIR 1 INH
4
1
LSL
LSLA
2 DIR 1 INH
4
1
ROL
ROLA
2 DIR 1 INH
4
1
DEC
DECA
2 DIR 1 INH
5
3
DBNZ DBNZA
3 DIR 2 INH
4
1
INC
INCA
2 DIR 1 INH
3
1
TST
TSTA
2 DIR 1 INH
5
MOV
3 DD
3
1
CLR
CLRA
2 DIR 1 INH
INH Inherent
REL Relative
IMM Immediate
IX
Indexed, No Offset
DIR Direct
IX1 Indexed, 8-Bit Offset
EXT Extended
IX2 Indexed, 16-Bit Offset
DD Direct-Direct
IMD Immediate-Direct
IX+D Indexed-Direct DIX+ Direct-Indexed
*Pre-byte for stack pointer indexed instructions
5
3
NEG
NEG
3 SP1 1 IX
6
4
CBEQ
CBEQ
4 SP1 2 IX+
2
DAA
1 INH
5
3
COM
COM
3 SP1 1 IX
5
3
LSR
LSR
3 SP1 1 IX
4
CPHX
2 DIR
5
3
ROR
ROR
3 SP1 1 IX
5
3
ASR
ASR
3 SP1 1 IX
5
3
LSL
LSL
3 SP1 1 IX
5
3
ROL
ROL
3 SP1 1 IX
5
3
DEC
DEC
3 SP1 1 IX
6
4
DBNZ
DBNZ
4 SP1 2 IX
5
3
INC
INC
3 SP1 1 IX
4
2
TST
TST
3 SP1 1 IX
4
MOV
2 IX+D
4
2
CLR
CLR
3 SP1 1 IX
SP1 Stack Pointer, 8-Bit Offset
SP2 Stack Pointer, 16-Bit Offset
IX+ Indexed, No Offset with
Post Increment
IX1+ Indexed, 1-Byte Offset with
Post Increment
7
3
RTI
BGE
1 INH 2 REL
4
3
RTS
BLT
1 INH 2 REL
3
BGT
2 REL
9
3
SWI
BLE
1 INH 2 REL
2
2
TAP
TXS
1 INH 1 INH
1
2
TPA
TSX
1 INH 1 INH
2
PULA
1 INH
2
1
PSHA
TAX
1 INH 1 INH
2
1
PULX
CLC
1 INH 1 INH
2
1
PSHX
SEC
1 INH 1 INH
2
2
PULH
CLI
1 INH 1 INH
2
2
PSHH
SEI
1 INH 1 INH
1
1
CLRH
RSP
1 INH 1 INH
1
NOP
1 INH
1
STOP
*
1 INH
1
1
WAIT
TXA
1 INH 1 INH
2
SUB
2 IMM
2
CMP
2 IMM
2
SBC
2 IMM
2
CPX
2 IMM
2
AND
2 IMM
2
BIT
2 IMM
2
LDA
2 IMM
2
AIS
2 IMM
2
EOR
2 IMM
2
ADC
2 IMM
2
ORA
2 IMM
2
ADD
2 IMM
3
SUB
2 DIR
3
CMP
2 DIR
3
SBC
2 DIR
3
CPX
2 DIR
3
AND
2 DIR
3
BIT
2 DIR
3
LDA
2 DIR
3
STA
2 DIR
3
EOR
2 DIR
3
ADC
2 DIR
3
ORA
2 DIR
3
ADD
2 DIR
2
JMP
2 DIR
4
4
BSR
JSR
2 REL 2 DIR
2
3
LDX
LDX
2 IMM 2 DIR
2
3
AIX
STX
2 IMM 2 DIR
MSB
0
3
SUB
2 IX1
3
CMP
2 IX1
3
SBC
2 IX1
3
CPX
2 IX1
3
AND
2 IX1
3
BIT
2 IX1
3
LDA
2 IX1
3
STA
2 IX1
3
EOR
2 IX1
3
ADC
2 IX1
3
ORA
2 IX1
3
ADD
2 IX1
3
JMP
2 IX1
5
JSR
2 IX1
5
3
LDX
LDX
4 SP2 2 IX1
5
3
STX
STX
4 SP2 2 IX1
4
SUB
3 SP1
4
CMP
3 SP1
4
SBC
3 SP1
4
CPX
3 SP1
4
AND
3 SP1
4
BIT
3 SP1
4
LDA
3 SP1
4
STA
3 SP1
4
EOR
3 SP1
4
ADC
3 SP1
4
ORA
3 SP1
4
ADD
3 SP1
2
SUB
1 IX
2
CMP
1 IX
2
SBC
1 IX
2
CPX
1 IX
2
AND
1 IX
2
BIT
1 IX
2
LDA
1 IX
2
STA
1 IX
2
EOR
1 IX
2
ADC
1 IX
2
ORA
1 IX
2
ADD
1 IX
2
JMP
1 IX
4
JSR
1 IX
4
2
LDX
LDX
3 SP1 1 IX
4
2
STX
STX
3 SP1 1 IX
High Byte of Opcode in Hexadecimal
LSB
Low Byte of Opcode in Hexadecimal
0
5
Cycles
BRSET0 Opcode Mnemonic
3 DIR Number of Bytes / Addressing Mode
Central Processor Unit (CPU)
76
Table 7-2. Opcode Map
Bit Manipulation
DIR
DIR
Chapter 8
External Interrupt (IRQ)
8.1 Introduction
The IRQ (external interrupt) module provides a maskable interrupt input.
IRQ functionality is enabled by setting configuration register 2 (CONFIG2) IRQEN bit accordingly. A zero
disables the IRQ function and IRQ will assume the other shared functionalities. A one enables the IRQ
function. See Chapter 5 Configuration Register (CONFIG) for more information on enabling the IRQ pin.
The IRQ pin shares its pin with general-purpose input/output (I/O) port pins. See Figure 8-1 for port
location of this shared pin.
8.2 Features
Features of the IRQ module include:
• A dedicated external interrupt pin IRQ
• IRQ interrupt control bits
• Programmable edge-only or edge and level interrupt sensitivity
• Automatic interrupt acknowledge
• Internal pullup device
8.3 Functional Description
A low level applied to the external interrupt request (IRQ) pin can latch a CPU interrupt request. Figure 8-2
shows the structure of the IRQ module.
Interrupt signals on the IRQ pin are latched into the IRQ latch. The IRQ latch remains set until one of the
following actions occurs:
• IRQ vector fetch. An IRQ vector fetch automatically generates an interrupt acknowledge signal that
clears the latch that caused the vector fetch.
• Software clear. Software can clear the IRQ latch by writing a 1 to the ACK bit in the interrupt status
and control register (INTSCR).
• Reset. A reset automatically clears the IRQ latch.
The external IRQ pin is falling edge sensitive out of reset and is software-configurable to be either falling
edge or falling edge and low level sensitive. The MODE bit in INTSCR controls the triggering sensitivity
of the IRQ pin.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
77
External Interrupt (IRQ)
PTA0/TCH0/AD0/KBI0
CLOCK
GENERATOR
PTA
PTA2/IRQ/KBI2/TCLK
PTA3/RST/KBI3
DDRA
PTA1/TCH1/AD1/KBI1
KEYBOARD INTERRUPT
MODULE
PTA4/OSC2/AD2/KBI4
PTA5/OSC1/AD3/KBI5
M68HC08 CPU
AUTO WAKEUP
MODULE
DDRB
PTB
PTB0/SCK/AD4
PTB1/MOSI/AD5
PTB2/MISO/AD6
PTB3/SS/AD7
PTB4/RxD/AD8
PTB5/TxD/AD9
PTB6/TCH2
PTB7/TCH3
EXTERNAL INTERRUPT
MODULE
LOW-VOLTAGE
INHIBIT
4-CHANNEL 16-BIT
TIMER MODULE
MC68HC908QB8
MC68HC908QB8
256 BYTES
8192 BYTES
USER RAM
USER FLASH
10-CHANNEL
10-BIT ADC
ENHANCED SERIAL
COMMUNICATIONS
INTERFACE MODULE
VDD
POWER SUPPLY
COP
MODULE
VSS
SERIAL PERIPHERAL
INTERFACE
DEVELOPMENT SUPPORT
MONITOR ROM
BREAK MODULE
RST, IRQ: Pins have internal pull up device
All port pins have programmable pull up device
PTA[0:5]: Higher current sink and source capability
Figure 8-1. Block Diagram Highlighting IRQ Block and Pin
When set, the IMASK bit in INTSCR masks the IRQ interrupt request. A latched interrupt request is not
presented to the interrupt priority logic unless IMASK is clear.
NOTE
The interrupt mask (I) in the condition code register (CCR) masks all
interrupt requests, including the IRQ interrupt request.
A falling edge on the IRQ pin can latch an interrupt request into the IRQ latch. An IRQ vector fetch,
software clear, or reset clears the IRQ latch.
MC68HC908QB8 Data Sheet, Rev. 3
78
Freescale Semiconductor
Functional Description
RESET
ACK
TO CPU FOR
BIL/BIH
INSTRUCTIONS
INTERNAL ADDRESS BUS
IRQ VECTOR
FETCH
DECODER
VDD
INTERNAL
PULLUP
DEVICE
VDD
IRQF
D
CLR
Q
CK
IRQ
IRQ LATCH
SYNCHRONIZER
IRQ
INTERRUPT
REQUEST
IMASK
MODE
HIGH
VOLTAGE
DETECT
TO MODE
SELECT
LOGIC
Figure 8-2. IRQ Module Block Diagram
8.3.1 MODE = 1
If the MODE bit is set, the IRQ pin is both falling edge sensitive and low level sensitive. With MODE set,
both of the following actions must occur to clear the IRQ interrupt request:
• Return of the IRQ pin to a high level. As long as the IRQ pin is low, the IRQ request remains active.
• IRQ vector fetch or software clear. An IRQ vector fetch generates an interrupt acknowledge signal
to clear the IRQ latch. Software generates the interrupt acknowledge signal by writing a 1 to ACK
in INTSCR. The ACK bit is useful in applications that poll the IRQ pin and require software to clear
the IRQ latch. Writing to ACK prior to leaving an interrupt service routine can also prevent spurious
interrupts due to noise. Setting ACK does not affect subsequent transitions on the IRQ pin. A falling
edge that occurs after writing to ACK latches another interrupt request. If the IRQ mask bit, IMASK,
is clear, the CPU loads the program counter with the IRQ vector address.
The IRQ vector fetch or software clear and the return of the IRQ pin to a high level may occur in any order.
The interrupt request remains pending as long as the IRQ pin is low. A reset will clear the IRQ latch and
the MODE control bit, thereby clearing the interrupt even if the pin stays low.
Use the BIH or BIL instruction to read the logic level on the IRQ pin.
8.3.2 MODE = 0
If the MODE bit is clear, the IRQ pin is falling edge sensitive only. With MODE clear, an IRQ vector fetch
or software clear immediately clears the IRQ latch.
The IRQF bit in INTSCR can be read to check for pending interrupts. The IRQF bit is not affected by
IMASK, which makes it useful in applications where polling is preferred.
NOTE
When using the level-sensitive interrupt trigger, avoid false IRQ interrupts
by masking interrupt requests in the interrupt routine.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
79
External Interrupt (IRQ)
8.4 Interrupts
The following IRQ source can generate interrupt requests:
• Interrupt flag (IRQF) — The IRQF bit is set when the IRQ pin is asserted based on the IRQ mode..
The IRQ interrupt mask bit, IMASK, is used to enable or disable IRQ interrupt requests.
8.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
8.5.1 Wait Mode
The IRQ module remains active in wait mode. Clearing IMASK in INTSCR enables IRQ interrupt requests
to bring the MCU out of wait mode.
8.5.2 Stop Mode
The IRQ module remains active in stop mode. Clearing IMASK in INTSCR enables IRQ interrupt requests
to bring the MCU out of stop mode.
8.6 IRQ Module During Break Interrupts
The system integration module (SIM) controls whether status bits in other modules can be cleared during
the break state. The BCFE bit in the break flag control register (BFCR) enables software to clear status
bits during the break state. See BFCR in the SIM section of this data sheet.
To allow software to clear status bits during a break interrupt, write a 1 to BCFE. If a status bit is cleared
during the break state, it remains cleared when the MCU exits the break state.
To protect status bits during the break state, write a 0 to BCFE. With BCFE cleared (its default state),
software can read and write registers during the break state without affecting status bits. Some status bits
have a two-step read/write clearing procedure. If software does the first step on such a bit before the
break, the bit cannot change during the break state as long as BCFE is cleared. After the break, doing the
second step clears the status bit.
8.7 I/O Signals
The IRQ module does not share its pin with any module on this MCU.
8.7.1 IRQ Input Pins (IRQ)
The IRQ pin provides a maskable external interrupt source. The IRQ pin contains an internal pullup
device.
MC68HC908QB8 Data Sheet, Rev. 3
80
Freescale Semiconductor
Registers
8.8 Registers
The IRQ status and control register (INTSCR) controls and monitors operation of the IRQ module. The
INTSCR:
• Shows the state of the IRQ flag
• Clears the IRQ latch
• Masks the IRQ interrupt request
• Controls triggering sensitivity of the IRQ interrupt pin
Read:
Bit 7
6
5
4
3
2
0
0
0
0
IRQF
0
Write:
Reset:
ACK
0
0
0
0
0
1
Bit 0
IMASK
MODE
0
0
0
= Unimplemented
Figure 8-3. IRQ Status and Control Register (INTSCR)
IRQF — IRQ Flag Bit
This read-only status bit is set when the IRQ interrupt is pending.
1 = IRQ interrupt pending
0 = IRQ interrupt not pending
ACK — IRQ Interrupt Request Acknowledge Bit
Writing a 1 to this write-only bit clears the IRQ latch. ACK always reads 0.
IMASK — IRQ Interrupt Mask Bit
Writing a 1 to this read/write bit disables the IRQ interrupt request.
1 = IRQ interrupt request disabled
0 = IRQ interrupt request enabled
MODE — IRQ Edge/Level Select Bit
This read/write bit controls the triggering sensitivity of the IRQ pin.
1 = IRQ interrupt request on falling edges and low levels
0 = IRQ interrupt request on falling edges only
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
81
External Interrupt (IRQ)
MC68HC908QB8 Data Sheet, Rev. 3
82
Freescale Semiconductor
Chapter 9
Keyboard Interrupt Module (KBI)
9.1 Introduction
The keyboard interrupt module (KBI) provides independently maskable external interrupts.
The KBI shares its pins with general-purpose input/output (I/O) port pins. See Figure 9-1 for port location
of these shared pins.
9.2 Features
Features of the keyboard interrupt module include:
• Keyboard interrupt pins with separate keyboard interrupt enable bits and one keyboard interrupt
mask
• Programmable edge-only or edge and level interrupt sensitivity
• Edge sensitivity programmable for rising or falling edge
• Level sensitivity programmable for high or low level
• Pullup or pulldown device automatically enabled based on the polarity of edge or level detect
• Exit from low-power modes
9.3 Functional Description
The keyboard interrupt module controls the enabling/disabling of interrupt functions on the KBI pins.
These pins can be enabled/disabled independently of each other. See Figure 9-2.
9.3.1 Keyboard Operation
Writing to the KBIEx bits in the keyboard interrupt enable register (KBIER) independently enables or
disables each KBI pin. The polarity of the keyboard interrupt is controlled using the KBIPx bits in the
keyboard interrupt polarity register (KBIPR). Edge-only or edge and level sensitivity is controlled using the
MODEK bit in the keyboard status and control register (KBISCR).
Enabling a keyboard interrupt pin also enables its internal pullup or pulldown device based on the polarity
enabled. On falling edge or low level detection, a pullup device is configured. On rising edge or high level
detection, a pulldown device is configured.
The keyboard interrupt latch is set when one or more enabled keyboard interrupt inputs are asserted.
• If the keyboard interrupt sensitivity is edge-only, for KBIPx = 0, a falling (for KBIPx = 1, a rising)
edge on a keyboard interrupt input does not latch an interrupt request if another enabled keyboard
pin is already asserted. To prevent losing an interrupt request on one input because another input
remains asserted, software can disable the latter input while it is asserted.
• If the keyboard interrupt is edge and level sensitive, an interrupt request is present as long as any
enabled keyboard interrupt input is asserted.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
83
Keyboard Interrupt Module (KBI)
PTA0/TCH0/AD0/KBI0
CLOCK
GENERATOR
PTA3/RST/KBI3
DDRA
PTA2/IRQ/KBI2/TCLK
PTA
PTA1/TCH1/AD1/KBI1
KEYBOARD INTERRUPT
MODULE
PTA4/OSC2/AD2/KBI4
PTA5/OSC1/AD3/KBI5
EXTERNAL INTERRUPT
MODULE
AUTO WAKEUP
MODULE
DDRB
PTB0/SCK/AD4
PTB1/MOSI/AD5
PTB2/MISO/AD6
PTB3/SS/AD7
PTB4/RxD/AD8
PTB5/TxD/AD9
PTB6/TCH2
PTB7/TCH3
PTB
M68HC08 CPU
LOW-VOLTAGE
INHIBIT
4-CHANNEL 16-BIT
TIMER MODULE
MC68HC908QB8
MC68HC908QB8
256 BYTES
8192 BYTES
USER RAM
USER FLASH
10-CHANNEL
10-BIT ADC
ENHANCED SERIAL
COMMUNICATIONS
INTERFACE MODULE
VDD
POWER SUPPLY
COP
MODULE
VSS
SERIAL PERIPHERAL
INTERFACE
DEVELOPMENT SUPPORT
MONITOR ROM
BREAK MODULE
RST, IRQ: Pins have internal pull up device
All port pins have programmable pull up device
PTA[0:5]: Higher current sink and source capability
Figure 9-1. Block Diagram Highlighting KBI Block and Pins
9.3.1.1 MODEK = 1
If the MODEK bit is set, the keyboard interrupt inputs are both edge and level sensitive. The KBIPx bit will
determine whether a edge sensitive pin detects rising or falling edges and on level sensitive pins whether
the pin detects low or high levels. With MODEK set, both of the following actions must occur to clear a
keyboard interrupt request:
• Return of all enabled keyboard interrupt inputs to a deasserted level. As long as any enabled
keyboard interrupt pin is asserted, the keyboard interrupt remains active.
MC68HC908QB8 Data Sheet, Rev. 3
84
Freescale Semiconductor
Functional Description
INTERNAL BUS
VECTOR FETCH
DECODER
ACKK
RESET
1
KBI0
0 S
VDD
KBIE0
TO PULLUP/
PULLDOWN ENABLE
KBIP0
KEYF
D
CLR
Q
CK
1
KBIx
0
KBI LATCH
S
IMASKK
KBIEx
TO PULLUP/
PULLDOWN ENABLE
KBIPx
SYNCHRONIZER
MODEK
KEYBOARD
INTERRUPT
REQUEST
AWUIREQ
(SEE Figure 4-1)
Figure 9-2. Keyboard Interrupt Block Diagram
•
Vector fetch or software clear. A KBI vector fetch generates an interrupt acknowledge signal to
clear the KBI latch. Software generates the interrupt acknowledge signal by writing a 1 to ACKK in
KBSCR. The ACKK bit is useful in applications that poll the keyboard interrupt inputs and require
software to clear the KBI latch. Writing to ACKK prior to leaving an interrupt service routine can
also prevent spurious interrupts due to noise. Setting ACKK does not affect subsequent transitions
on the keyboard interrupt inputs. An edge detect that occurs after writing to ACKK latches another
interrupt request. If the keyboard interrupt mask bit, IMASKK, is clear, the CPU loads the program
counter with the KBI vector address.
The KBI vector fetch or software clear and the return of all enabled keyboard interrupt pins to a deasserted
level may occur in any order.
Reset clears the keyboard interrupt request and the MODEK bit, clearing the interrupt request even if a
keyboard interrupt input stays asserted.
9.3.1.2 MODEK = 0
If the MODEK bit is clear, the keyboard interrupt inputs are edge sensitive. The KBIPx bit will determine
whether an edge sensitive pin detects rising or falling edges. A KBI vector fetch or software clear
immediately clears the KBI latch.
The keyboard flag bit (KEYF) in KBSCR can be read to check for pending interrupts. The KEYF bit is not
affected by IMASKK, which makes it useful in applications where polling is preferred.
NOTE
Setting a keyboard interrupt enable bit (KBIEx) forces the corresponding
keyboard interrupt pin to be an input, overriding the data direction register.
However, the data direction register bit must be a 0 for software to read the
pin.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
85
Keyboard Interrupt Module (KBI)
9.3.2 Keyboard Initialization
When a keyboard interrupt pin is enabled, it takes time for the internal pullup or pulldown device to pull
the pin to its deasserted level. Therefore a false interrupt can occur as soon as the pin is enabled.
To prevent a false interrupt on keyboard initialization:
1. Mask keyboard interrupts by setting IMASKK in KBSCR.
2. Enable the KBI polarity by setting the appropriate KBIPx bits in KBIPR.
3. Enable the KBI pins by setting the appropriate KBIEx bits in KBIER.
4. Write to ACKK in KBSCR to clear any false interrupts.
5. Clear IMASKK.
An interrupt signal on an edge sensitive pin can be acknowledged immediately after enabling the pin. An
interrupt signal on an edge and level sensitive pin must be acknowledged after a delay that depends on
the external load.
9.4 Interrupts
The following KBI source can generate interrupt requests:
• Keyboard flag (KEYF) — The KEYF bit is set when any enabled KBI pin is asserted based on the
KBI mode and pin polarity. The keyboard interrupt mask bit, IMASKK, is used to enable or disable
KBI interrupt requests.
9.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
9.5.1 Wait Mode
The KBI module remains active in wait mode. Clearing IMASKK in KBSCR enables keyboard interrupt
requests to bring the MCU out of wait mode.
9.5.2 Stop Mode
The KBI module remains active in stop mode. Clearing IMASKK in KBSCR enables keyboard interrupt
requests to bring the MCU out of stop mode.
9.6 KBI During Break Interrupts
The system integration module (SIM) controls whether status bits in other modules can be cleared during
the break state. The BCFE bit in the break flag control register (BFCR) enables software to clear status
bits during the break state. See BFCR in the SIM section of this data sheet.
To allow software to clear status bits during a break interrupt, write a 1 to BCFE. If a status bit is cleared
during the break state, it remains cleared when the MCU exits the break state.
To protect status bits during the break state, write a 0 to BCFE. With BCFE cleared (its default state),
software can read and write registers during the break state without affecting status bits. Some status bits
have a two-step read/write clearing procedure. If software does the first step on such a bit before the
break, the bit cannot change during the break state as long as BCFE is cleared. After the break, doing the
second step clears the status bit.
MC68HC908QB8 Data Sheet, Rev. 3
86
Freescale Semiconductor
I/O Signals
9.7 I/O Signals
The KBI module can share its pins with the general-purpose I/O pins. See Figure 9-1 for the port pins that
are shared.
9.7.1 KBI Input Pins (KBIx:KBI0)
Each KBI pin is independently programmable as an external interrupt source. KBI pin polarity can be
controlled independently. Each KBI pin when enabled will automatically configure the appropriate
pullup/pulldown device based on polarity.
9.8 Registers
The following registers control and monitor operation of the KBI module:
• KBSCR (keyboard interrupt status and control register)
• KBIER (keyboard interrupt enable register)
• KBIPR (keyboard interrupt polarity register)
9.8.1 Keyboard Status and Control Register (KBSCR)
Features of the KBSCR:
• Flags keyboard interrupt requests
• Acknowledges keyboard interrupt requests
• Masks keyboard interrupt requests
• Controls keyboard interrupt triggering sensitivity
Read:
Bit 7
6
5
4
3
0
0
0
0
KEYF
Write:
2
0
ACKK
Reset:
0
0
0
0
0
0
1
Bit 0
IMASKK
MODEK
0
0
= Unimplemented
Figure 9-3. Keyboard Status and Control Register (KBSCR)
Bits 7–4 — Not used
KEYF — Keyboard Flag Bit
This read-only bit is set when a keyboard interrupt is pending.
1 = Keyboard interrupt pending
0 = No keyboard interrupt pending
ACKK — Keyboard Acknowledge Bit
Writing a 1 to this write-only bit clears the KBI request. ACKK always reads 0.
IMASKK— Keyboard Interrupt Mask Bit
Writing a 1 to this read/write bit prevents the output of the KBI latch from generating interrupt requests.
1 = Keyboard interrupt requests disabled
0 = Keyboard interrupt requests enabled
MODEK — Keyboard Triggering Sensitivity Bit
This read/write bit controls the triggering sensitivity of the keyboard interrupt pins.
1 = Keyboard interrupt requests on edge and level
0 = Keyboard interrupt requests on edge only
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
87
Keyboard Interrupt Module (KBI)
9.8.2 Keyboard Interrupt Enable Register (KBIER)
KBIER enables or disables each keyboard interrupt pin.
Bit 7
Read:
0
Write:
Reset:
0
6
5
4
3
2
1
Bit 0
AWUIE
KBIE5
KBIE4
KBIE3
KBIE2
KBIE1
KBIE0
0
0
0
0
0
0
0
= Unimplemented
Figure 9-4. Keyboard Interrupt Enable Register (KBIER)
KBIE5–KBIE0 — Keyboard Interrupt Enable Bits
Each of these read/write bits enables the corresponding keyboard interrupt pin to latch KBI interrupt
requests.
1 = KBIx pin enabled as keyboard interrupt pin
0 = KBIx pin not enabled as keyboard interrupt pin
NOTE
AWUIE bit is not used in conjunction with the keyboard interrupt feature. To
see a description of this bit, see Chapter 4 Auto Wakeup Module (AWU)
9.8.3 Keyboard Interrupt Polarity Register (KBIPR)
KBIPR determines the polarity of the enabled keyboard interrupt pin and enables the appropriate pullup
or pulldown device.
Read:
Bit 7
6
0
0
Write:
Reset:
0
0
5
4
3
2
1
Bit 0
KBIP5
KBIP4
KBIP3
KBIP2
KBIP1
KBIP0
0
0
0
0
0
0
= Unimplemented
Figure 9-5. Keyboard Interrupt Polarity Register (KBIPR)
KBIP5–KBIP0 — Keyboard Interrupt Polarity Bits
Each of these read/write bits enables the polarity of the keyboard interrupt detection.
1 = Keyboard polarity is high level and/or rising edge
0 = Keyboard polarity is low level and/or falling edge
MC68HC908QB8 Data Sheet, Rev. 3
88
Freescale Semiconductor
Chapter 10
Low-Voltage Inhibit (LVI)
10.1 Introduction
The low-voltage inhibit (LVI) module is provided as a system protection mechanism to prevent the MCU
from operating below a certain operating supply voltage level. The module has several configuration
options to allow functionality to be tailored to different system level demands.
The configuration registers (see Chapter 5 Configuration Register (CONFIG)) contain control bits for this
module.
10.2 Features
Features of the LVI module include:
• Programmable LVI reset
• Selectable LVI trip voltage
• Programmable stop mode operation
10.3 Functional Description
Figure 10-1 shows the structure of the LVI module. LVISTOP, LVIPWRD, LVITRIP, and LVIRSTD are
user selectable options found in the configuration register.
VDD
STOP INSTRUCTION
LVISTOP
FROM CONFIGURATION REGISTER
FROM CONFIGURATION REGISTER
LVIRSTD
LVIPWRD
FROM CONFIGURATION REGISTER
LOW VDD
DETECTOR
0 IF VDD > VTRIPR
LVI RESET
1 IF VDD ≤ VTRIPF
LVIOUT
LVITRIP
FROM CONFIGURATION REGISTER
Figure 10-1. LVI Module Block Diagram
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
89
Low-Voltage Inhibit (LVI)
The LVI module contains a bandgap reference circuit and comparator. When the LVITRIP bit is cleared,
the default state at power-on reset, VTRIPF is configured for the lower VDD operating range. The actual
trip points are specified in 18.5 5-V DC Electrical Characteristics and 18.8 3-V DC Electrical
Characteristics.
Because the default LVI trip point after power-on reset is configured for low voltage operation, a system
requiring high voltage LVI operation must set the LVITRIP bit during system initialization. VDD must be
above the LVI trip rising voltage, VTRIPR, for the high voltage operating range or the MCU will immediately
go into LVI reset.
After an LVI reset occurs, the MCU remains in reset until VDD rises above VTRIPR. See Chapter 14 System
Integration Module (SIM) for the reset recovery sequence.
The output of the comparator controls the state of the LVIOUT flag in the LVI status register (LVISR) and
can be used for polling LVI operation when the LVI reset is disabled.
The LVI is enabled out of reset. The following bits located in the configuration register can alter the default
conditions.
• Setting the LVI power disable bit, LVIPWRD, disables the LVI.
• Setting the LVI reset disable bit, LVIRSTD, prevents the LVI module from generating a reset.
• Setting the LVI enable in stop mode bit, LVISTOP, enables the LVI to operate in stop mode.
• Setting the LVI trip point bit, LVITRIP, configures the trip point voltage (VTRIPF) for the higher VDD
operating range.
10.3.1 Polled LVI Operation
In applications that can operate at VDD levels below the VTRIPF level, software can monitor VDD by polling
the LVIOUT bit. In the configuration register, LVIPWRD must be cleared to enable the LVI module, and
LVIRSTD must be set to disable LVI resets.
10.3.2 Forced Reset Operation
In applications that require VDD to remain above the VTRIPF level, enabling LVI resets allows the LVI
module to reset the MCU when VDD falls below the VTRIPF level. In the configuration register, LVIPWRD
and LVIRSTD must be cleared to enable the LVI module and to enable LVI resets.
10.3.3 LVI Hysteresis
The LVI has hysteresis to maintain a stable operating condition. After the LVI has triggered (by having
VDD fall below VTRIPF), the MCU will remain in reset until VDD rises above the rising trip point voltage,
VTRIPR. This prevents a condition in which the MCU is continually entering and exiting reset if VDD is
approximately equal to VTRIPF. VTRIPR is greater than VTRIPF by the typical hysteresis voltage, VHYS.
10.3.4 LVI Trip Selection
LVITRIP in the configuration register selects the LVI protection range. The default setting out of reset is
for the low voltage range. Because LVITRIP is in a write-once configuration register, the protection range
cannot be changed after initialization.
NOTE
The MCU is guaranteed to operate at a minimum supply voltage. The trip
point (VTRIPF) may be lower than this. See the Electrical Characteristics
section for the actual trip point voltages.
MC68HC908QB8 Data Sheet, Rev. 3
90
Freescale Semiconductor
LVI Interrupts
10.4 LVI Interrupts
The LVI module does not generate interrupt requests.
10.5 Low-Power Modes
The STOP and WAIT instructions put the MCU in low power-consumption standby modes.
10.5.1 Wait Mode
If enabled, the LVI module remains active in wait mode. If enabled to generate resets, the LVI module can
generate a reset and bring the MCU out of wait mode.
10.5.2 Stop Mode
If the LVIPWRD bit in the configuration register is cleared and the LVISTOP bit in the configuration
register is set, the LVI module remains active. If enabled to generate resets, the LVI module can generate
a reset and bring the MCU out of stop mode.
10.6 Registers
The LVI status register (LVISR) contains a status bit that is useful when the LVI is enabled and LVI reset
is disabled.
Read:
Bit 7
6
5
4
3
2
1
Bit 0
LVIOUT
0
0
0
0
0
0
R
0
0
0
0
0
0
0
0
R
= Reserved
Write:
Reset:
= Unimplemented
Figure 10-2. LVI Status Register (LVISR)
LVIOUT — LVI Output Bit
This read-only flag becomes set when the VDD voltage falls below the VTRIPF trip voltage and is cleared
when VDD voltage rises above VTRIPR. (See Table 10-1).
Table 10-1. LVIOUT Bit Indication
VDD
LVIOUT
VDD > VTRIPR
0
VDD < VTRIPF
1
VTRIPF < VDD < VTRIPR
Previous value
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
91
Low-Voltage Inhibit (LVI)
MC68HC908QB8 Data Sheet, Rev. 3
92
Freescale Semiconductor
Chapter 11
Oscillator Module (OSC)
11.1 Introduction
The oscillator (OSC) module is used to provide a stable clock source for the MCU system and bus.
The OSC shares its pins with general-purpose input/output (I/O) port pins. See Figure 11-1 for port
location of these shared pins. The OSC2EN bit is located in the port A pull enable register (PTAPUEN)
on this MCU. See Chapter 12 Input/Output Ports (PORTS) for information on PTAPUEN register.
11.2 Features
The bus clock frequency is one fourth of any of these clock source options:
1. Internal oscillator: An internally generated, fixed frequency clock, trimmable to ± 0.4%. There are
three choices for the internal oscillator,12.8 MHz, 8 MHz, or 4 MHz. The 4-MHz internal oscillator
is the default option out of reset.
2. External oscillator: An external clock that can be driven directly into OSC1.
3. External RC: A built-in oscillator module (RC oscillator) that requires an external R connection only.
The capacitor is internal to the chip.
4. External crystal: A built-in XTAL oscillator that requires an external crystal or ceramic-resonator.
There are three crystal frequency ranges supported, 8–32 MHz, 1–8 MHz, and 32–100 kHz.
11.3 Functional Description
The oscillator contains these major subsystems:
• Internal oscillator circuit
• Internal or external clock switch control
• External clock circuit
• External crystal circuit
• External RC clock circuit
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
93
Oscillator Module (OSC)
PTA0/TCH0/AD0/KBI0
CLOCK
GENERATOR
PTA3/RST/KBI3
DDRA
PTA2/IRQ/KBI2/TCLK
PTA
PTA1/TCH1/AD1/KBI1
KEYBOARD INTERRUPT
MODULE
PTA4/OSC2/AD2/KBI4
PTA5/OSC1/AD3/KBI5
EXTERNAL INTERRUPT
MODULE
AUTO WAKEUP
MODULE
DDRB
PTB0/SCK/AD4
PTB1/MOSI/AD5
PTB2/MISO/AD6
PTB3/SS/AD7
PTB4/RxD/AD8
PTB5/TxD/AD9
PTB6/TCH2
PTB7/TCH3
PTB
M68HC08 CPU
LOW-VOLTAGE
INHIBIT
4-CHANNEL 16-BIT
TIMER MODULE
MC68HC908QB8
256 BYTES
8192 BYTES
USER RAM
USER FLASH
10-CHANNEL
10-BIT ADC
ENHANCED SERIAL
COMMUNICATIONS
INTERFACE MODULE
VDD
POWER SUPPLY
COP
MODULE
MC68HC908QB8
VSS
SERIAL PERIPHERAL
INTERFACE
DEVELOPMENT SUPPORT
MONITOR ROM
BREAK MODULE
RST, IRQ: Pins have internal pull up device
All port pins have programmable pull up device
PTA[0:5]: Higher current sink and source capability
Figure 11-1. Block Diagram Highlighting OSC Block and Pins
MC68HC908QB8 Data Sheet, Rev. 3
94
Freescale Semiconductor
Functional Description
11.3.1 Internal Signal Definitions
The following signals and clocks are used in the functional description and figures of the OSC module.
11.3.1.1 Oscillator Enable Signal (SIMOSCEN)
The SIMOSCEN signal comes from the system integration module (SIM) and disables the XTAL oscillator
circuit, the RC oscillator, or the internal oscillator in stop mode. OSCENINSTOP in the configuration
register can be used to override this signal.
11.3.1.2 XTAL Oscillator Clock (XTALCLK)
XTALCLK is the XTAL oscillator output signal. It runs at the full speed of the crystal (fXCLK) and comes
directly from the crystal oscillator circuit. Figure 11-2 shows only the logical relation of XTALCLK to OSC1
and OSC2 and may not represent the actual circuitry. The duty cycle of XTALCLK is unknown and may
depend on the crystal and other external factors. The frequency of XTALCLK can be unstable at start up.
11.3.1.3 RC Oscillator Clock (RCCLK)
RCCLK is the RC oscillator output signal. Its frequency is directly proportional to the time constant of the
external R (REXT) and internal C. Figure 11-3 shows only the logical relation of RCCLK to OSC1 and may
not represent the actual circuitry.
11.3.1.4 Internal Oscillator Clock (INTCLK)
INTCLK is the internal oscillator output signal. INTCLK is software selectable to be nominally 12.8 MHz,
8.0 MHz, or 4.0 MHz. INTCLK can be digitally adjusted using the oscillator trimming feature of the
OSCTRIM register (see 11.3.2.1 Internal Oscillator Trimming).
11.3.1.5 Bus Clock Times 4 (BUSCLKX4)
BUSCLKX4 is the same frequency as the input clock (XTALCLK, RCCLK, or INTCLK). This signal is
driven to the SIM module and is used during recovery from reset and stop and is the clock source for the
COP module.
11.3.1.6 Bus Clock Times 2 (BUSCLKX2)
The frequency of this signal is equal to half of the BUSCLKX4. This signal is driven to the SIM for
generation of the bus clocks used by the CPU and other modules on the MCU. BUSCLKX2 will be divided
by two in the SIM. The internal bus frequency is one fourth of the XTALCLK, RCCLK, or INTCLK
frequency.
11.3.2 Internal Oscillator
The internal oscillator circuit is designed for use with no external components to provide a clock source
with a tolerance of less than ±25% untrimmed. An 8-bit register (OSCTRIM) allows the digital adjustment
to a tolerance of ACCINT. See the oscillator characteristics in the Electrical section of this data sheet.
The internal oscillator is capable of generating clocks of 12.8 MHz, 8.0 MHz, or 4.0 MHz (INTCLK)
resulting in a bus frequency (INTCLK divided by 4) of 3.2 MHz, 2.0 MHz, or 1.0 MHz respectively. The
bus clock is software selectable and defaults to the 1.0-MHz bus out of reset. Users can increase the bus
frequency based on the voltage range of their application.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
95
Oscillator Module (OSC)
Figure 11-3 shows how BUSCLKX4 is derived from INTCLK and OSC2 can output BUSCLKX4 by setting
OSC2EN.
11.3.2.1 Internal Oscillator Trimming
OSCTRIM allows a clock period adjustment of +127 and –128 steps. Increasing the OSCTRIM value
increases the clock period, which decreases the clock frequency. Trimming allows the internal clock
frequency to be fine tuned to the target frequency.
All devices are factory programmed with a trim value that is stored in FLASH memory at location $FFC0.
The trim value is not automatically loaded into the OSCTRIM register. User software must copy the trim
value from $FFC0 into OSCTRIM if needed. The factory trim value provides the accuracy required for
communication using forced monitor mode. Some production programmers erase the factory trim value,
so confirm with your programmer vendor that the trim value at $FFC0 is preserved, or is re-trimmed.
Trimming the device in the user application board will provide the most accurate trim value.
11.3.2.2 Internal to External Clock Switching
When external clock source (external OSC, RC, or XTAL) is desired, the user must perform the following
steps:
1. For external crystal circuits only, configure OSCOPT[1:0] to external crystal. To help precharge an
external crystal oscillator, momentarily configure OSC2 as an output and drive it high for several
cycles. This can help the crystal circuit start more robustly.
2. Configure OSCOPT[1:0] and ECFS[1:0] according to 11.8.1 Oscillator Status and Control Register.
The oscillator module control logic will then enable OSC1 as an external clock input and, if the
external crystal option is selected, OSC2 will also be enabled as the clock output. If RC oscillator
option is selected, enabling the OSC2 output may change the bus frequency.
3. Create a software delay to provide the stabilization time required for the selected clock source
(crystal, resonator, RC). A good rule of thumb for crystal oscillators is to wait 4096 cycles of the
crystal frequency; i.e., for a 4-MHz crystal, wait approximately 1 ms.
4. After the stabilization delay has elapsed, set ECGON.
After ECGON set is detected, the OSC module checks for oscillator activity by waiting two external clock
rising edges. The OSC module then switches to the external clock. Logic provides a coherent transition.
The OSC module first sets ECGST and then stops the internal oscillator.
11.3.2.3 External to Internal Clock Switching
After following the procedures to switch to an external clock source, it is possible to go back to the internal
source. By clearing the OSCOPT[1:0] bits and clearing the ECGON bit, the external circuit will be
disengaged. The bus clock will be derived from the selected internal clock source based on the ICFS[1:0]
bits.
11.3.3 External Oscillator
The external oscillator option is designed for use when a clock signal is available in the application to
provide a clock source to the MCU. The OSC1 pin is enabled as an input by the oscillator module. The
clock signal is used directly to create BUSCLKX4 and also divided by two to create BUSCLKX2.
In this configuration, the OSC2 pin cannot output BUSCLKX4. The OSC2EN bit will be forced clear to
enable alternative functions on the pin.
MC68HC908QB8 Data Sheet, Rev. 3
96
Freescale Semiconductor
Functional Description
11.3.4 XTAL Oscillator
The XTAL oscillator circuit is designed for use with an external crystal or ceramic resonator to provide an
accurate clock source. In this configuration, the OSC2 pin is dedicated to the external crystal circuit. The
OSC2EN bit has no effect when this clock mode is selected.
In its typical configuration, the XTAL oscillator is connected in a Pierce oscillator configuration, as shown
in Figure 11-2. This figure shows only the logical representation of the internal components and may not
represent actual circuitry.
The oscillator configuration uses five components:
• Crystal, X1
• Fixed capacitor, C1
• Tuning capacitor, C2 (can also be a fixed capacitor)
• Feedback resistor, RB
• Series resistor, RS (optional)
NOTE
The series resistor (RS) is included in the diagram to follow strict Pierce
oscillator guidelines and may not be required for all ranges of operation,
especially with high frequency crystals. Refer to the oscillator
characteristics table in the Electricals section for more information.
SIMOSCEN (INTERNAL SIGNAL) OR
OSCENINSTOP (BIT LOCATED IN
CONFIGURATION REGISTER)
BUSCLKX4
XTALCLK
BUSCLKX2
÷2
MCU
OSC1
OSC2
RB
RS
X1
C1
C2
See the electrical section for details.
Figure 11-2. XTAL Oscillator External Connections
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
97
Oscillator Module (OSC)
11.3.5 RC Oscillator
The RC oscillator circuit is designed for use with an external resistor (REXT) to provide a clock source with
a tolerance within 25% of the expected frequency. See Figure 11-3.
The capacitor (C) for the RC oscillator is internal to the MCU. The REXT value must have a tolerance of
1% or less to minimize its effect on the frequency.
In this configuration, the OSC2 pin can be used as general-purpose input/output (I/O) port pins or other
alternative pin function. The OSC2EN bit can be set to enable the OSC2 output function on the pin.
Enabling the OSC2 output can affect the external RC oscillator frequency, fRCCLK.
SIMOSCEN (INTERNAL SIGNAL) OR
OSCENINSTOP (BIT LOCATED IN
CONFIGURATION REGISTER)
OSCOPT = EXTERNAL RC SELECTED
INTCLK
BUSCLKX2
BUSCLKX4
0
1
EXTERNAL RC
OSCILLATOR
EN
RCCLK
÷2
1
0
ALTERNATIVE
PIN FUNTION
OSC2EN
MCU
OSC1
VDD
OSC2 — AVAILABLE FOR ALTERNATIVE PIN FUNCTION
REXT
See the electricals section for component value.
Figure 11-3. RC Oscillator External Connections
11.4 Interrupts
There are no interrupts associated with the OSC module.
11.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
11.5.1 Wait Mode
The OSC module remains active in wait mode.
11.5.2 Stop Mode
The OSC module can be configured to remain active in stop mode by setting OSCENINSTOP located in
a configuration register.
MC68HC908QB8 Data Sheet, Rev. 3
98
Freescale Semiconductor
OSC During Break Interrupts
11.6 OSC During Break Interrupts
There are no status flags associated with the OSC module.
The system integration module (SIM) controls whether status bits in other modules can be cleared during
the break state. The BCFE bit in the break flag control register (BFCR) enables software to clear status
bits during the break state. See BFCR in the SIM section of this data sheet.
To allow software to clear status bits during a break interrupt, write a 1 to BCFE. If a status bit is cleared
during the break state, it remains cleared when the MCU exits the break state.
To protect status bits during the break state, write a 0 to BCFE. With BCFE cleared (its default state),
software can read and write registers during the break state without affecting status bits. Some status bits
have a two-step read/write clearing procedure. If software does the first step on such a bit before the
break, the bit cannot change during the break state as long as BCFE is cleared. After the break, doing the
second step clears the status bit.
11.7 I/O Signals
The OSC shares its pins with general-purpose input/output (I/O) port pins. See Figure 11-1 for port
location of these shared pins.
11.7.1 Oscillator Input Pin (OSC1)
The OSC1 pin is an input to the crystal oscillator amplifier, an input to the RC oscillator circuit, or an input
from an external clock source.
When the OSC is configured for internal oscillator, the OSC1 pin can be used as a general-purpose
input/output (I/O) port pin or other alternative pin function.
11.7.2 Oscillator Output Pin (OSC2)
For the XTAL oscillator option, the OSC2 pin is the output of the crystal oscillator amplifier.
When the OSC is configured for internal oscillator, external clock, or RC, the OSC2 pin can be used as a
general-purpose I/O port pin or other alternative pin function. When the oscillator is configured for internal
or RC, the OSC2 pin can be used to output BUSCLKX4.
Table 11-1. OSC2 Pin Function
Option
OSC2 Pin Function
XTAL oscillator
Inverting OSC1
External clock
General-purpose I/O or alternative pin function
Internal oscillator
or
RC oscillator
Controlled by OSC2EN bit
OSC2EN = 0: General-purpose I/O or alternative pin function
OSC2EN = 1: BUSCLKX4 output
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
99
Oscillator Module (OSC)
11.8 Registers
The oscillator module contains two registers:
• Oscillator status and control register (OSCSC)
• Oscillator trim register (OSCTRIM)
11.8.1 Oscillator Status and Control Register
The oscillator status and control register (OSCSC) contains the bits for switching between internal and
external clock sources. If the application uses an external crystal, bits in this register are used to select
the crystal oscillator amplifier necessary for the desired crystal. While running off the internal clock source,
the user can use bits in this register to select the internal clock source frequency.
Bit 7
Read:
Write:
6
5
4
3
2
1
OSCOPT1
OSCOPT0
ICFS1
ICFS0
ECFS1
ECFS0
ECGON
0
0
0
0
0
0
0
Reset:
Bit 0
ECGST
0
= Unimplemented
Figure 11-4. Oscillator Status and Control Register (OSCSC)
OSCOPT1:OSCOPT0 — OSC Option Bits
These read/write bits allow the user to change the clock source for the MCU. The default reset
condition has the bus clock being derived from the internal oscillator. See 11.3.2.2 Internal to External
Clock Switching for information on changing clock sources.
OSCOPT1
OSCOPT0
Oscillator Modes
0
0
Internal oscillator (frequency selected using ICFSx bits)
0
1
External oscillator clock
1
0
External RC
1
1
External crystal (range selected using ECFSx bits)
ICFS1:ICFS0 — Internal Clock Frequency Select Bits
These read/write bits enable the frequency to be increased for applications requiring a faster bus clock
when running off the internal oscillator. The WAIT instruction has no effect on the oscillator logic.
BUSCLKX2 and BUSCLKX4 continue to drive to the SIM module.
ICFS1
ICFS0
Internal Clock Frequency
0
0
4.0 MHz — default reset condition
0
1
8.0 MHz
1
0
12.8 MHz
1
1
Reserved
MC68HC908QB8 Data Sheet, Rev. 3
100
Freescale Semiconductor
Registers
ECFS1:ECFS0 — External Crystal Frequency Select Bits
These read/write bits enable the specific amplifier for the crystal frequency range. Refer to oscillator
characteristics table in the Electricals section for information on maximum external clock frequency
versus supply voltage.
ECFS1
ECFS0
External Crystal Frequency
0
0
8 MHz – 32 MHz
0
1
1 MHz – 8 MHz
1
0
32 kHz – 100 kHz
1
1
Reserved
ECGON — External Clock Generator On Bit
This read/write bit enables the OSC1 pin as the clock input to the MCU, so that the switching process
can be initiated. This bit is cleared by reset. This bit is ignored in monitor mode with the internal
oscillator bypassed.
1 = External clock enabled
0 = External clock disabled
ECGST — External Clock Status Bit
This read-only bit indicates whether an external clock source is engaged to drive the system clock.
1 = An external clock source engaged
0 = An external clock source disengaged
11.8.2 Oscillator Trim Register (OSCTRIM)
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
TRIM7
TRIM6
TRIM5
TRIM4
TRIM3
TRIM2
TRIM1
TRIM0
1
0
0
0
0
0
0
0
Figure 11-5. Oscillator Trim Register (OSCTRIM)
TRIM7–TRIM0 — Internal Oscillator Trim Factor Bits
These read/write bits change the internal capacitance used by the internal oscillator. By measuring the
period of the internal clock and adjusting this factor accordingly, the frequency of the internal clock can
be fine tuned. Increasing (decreasing) this factor by one increases (decreases) the period by
approximately 0.2% of the untrimmed oscillator period. The oscillator period is based on the oscillator
frequency selected by the ICFS bits in OSCSC.
Applications using the internal oscillator should copy the internal oscillator trim value at location $FFC0
into this register to trim the clock source.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
101
Oscillator Module (OSC)
MC68HC908QB8 Data Sheet, Rev. 3
102
Freescale Semiconductor
Chapter 12
Input/Output Ports (PORTS)
12.1 Introduction
The MC68HC908QB8, MC68HC908QB4 and MC68HC908QY8 have thirteen bidirectional pins and one
input only pin.
NOTE
Connect any unused I/O pins to an appropriate logic level, either VDD or VSS.
Although the I/O ports do not require termination for proper operation,
termination reduces excess current consumption and the possibility of
electrostatic damage.
12.2 Port A
Port A is an 6-bit special function port that shares its pins with the keyboard interrupt (KBI) module
(see Chapter 9 Keyboard Interrupt Module (KBI), the 4-channel timer interface module (TIM) (see Chapter
16 Timer Interface Module (TIM)), the 10-bit ADC (see Chapter 3 Analog-to-Digital Converter (ADC10)
Module), the external interrupt (IRQ) pin (see Chapter 8 External Interrupt (IRQ)), the reset (RST) pin
enabled using a configuration register (see Chapter 5 Configuration Register (CONFIG)) and the
oscillator pins (see Chapter 11 Oscillator Module (OSC)).
Each port A pin also has a software configurable pullup device if the corresponding port pin is configured
as an input port.
NOTE
PTA2 is input only.
When the IRQ function is enabled in the configuration register 2
(CONFIG2), bit 2 of the port A data register (PTA) will always read a logic 0.
In this case, the BIH and BIL instructions can be used to read the logic level
on the PTA2 pin. When the IRQ function is disabled, these instructions will
behave as if the PTA2 pin is a logic 1. However, reading bit 2 of PTA will
read the actual logic level on the pin.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
103
Input/Output Ports (PORTS)
12.2.1 Port A Data Register
The port A data register (PTA) contains a data latch for each of the six port A pins.
Bit 7
Read:
Write:
R
6
AWUL
5
4
3
PTA5
PTA4
PTA3
Reset:
2
PTA2
1
Bit 0
PTA1
PTA0
Unaffected by reset
= Unimplemented
Figure 12-1. Port A Data Register (PTA)
PTA[5:0] — Port A Data Bits
These read/write bits are software programmable. Data direction of each port A pin is under the control
of the corresponding bit in data direction register A. Reset has no effect on port A data.
AWUL — Auto Wakeup Latch Data Bit
This is a read-only bit which has the value of the auto wakeup interrupt request latch. The wakeup
request signal is generated internally (see Chapter 4 Auto Wakeup Module (AWU)). There is no PTA6
port nor any of the associated bits such as PTA6 data register, pullup enable or direction. .
12.2.2 Data Direction Register A
Data direction register A (DDRA) determines whether each port A pin is an input or an output. Writing a 1
to a DDRA bit enables the output buffer for the corresponding port A pin; a 0 disables the output buffer.
Read:
Write:
Reset:
Bit 7
6
5
4
3
R
R
DDRA5
DDRA4
DDRA3
0
0
0
0
R
= Reserved
0
2
0
1
Bit 0
DDRA1
DDRA0
0
0
0
= Unimplemented
Figure 12-2. Data Direction Register A (DDRA)
DDRA[5:0] — Data Direction Register A Bits
These read/write bits control port A data direction. Reset clears DDRA[5:0], configuring all port A pins
as inputs.
1 = Corresponding port A pin configured as output
0 = Corresponding port A pin configured as input
NOTE
Avoid glitches on port A pins by writing to the port A data register before
changing data direction register A bits from 0 to 1.
Figure 12-3 shows the port A I/O logic.
MC68HC908QB8 Data Sheet, Rev. 3
104
Freescale Semiconductor
Port A
READ DDRA
PTAPUEx
INTERNAL DATA BUS
WRITE DDRA
DDRAx
RESET
WRITE PTA
PULLUP
PTAx
PTAx
READ PTA
Figure 12-3. Port A I/O Circuit
NOTE
Figure 12-3 does not apply to PTA2
When DDRAx is a 1, reading PTA reads the PTAx data latch. When DDRAx is a 0, reading PTA reads
the logic level on the PTAx pin. The data latch can always be written, regardless of the state of its data
direction bit.
12.2.3 Port A Input Pullup Enable Register
The port A input pullup enable register (PTAPUE) contains a software configurable pullup device for each
of the port A pins. Each bit is individually configurable and requires the corresponding data direction
register, DDRAx, to be configured as input. Each pullup device is automatically and dynamically disabled
when its corresponding DDRAx bit is configured as output.
Bit 7
Read:
Write:
6
OSC2EN
Reset:
0
0
5
4
3
2
1
Bit 0
PTAPUE5
PTAPUE4
PTAPUE3
PTAPUE2
PTAPUE1
PTAPUE0
0
0
0
0
0
0
= Unimplemented
Figure 12-4. Port A Input Pullup Enable Register (PTAPUE)
OSC2EN — Enable PTA4 on OSC2 Pin
This read/write bit configures the OSC2 pin function when internal oscillator or RC oscillator option is
selected. This bit has no effect for the XTAL or external oscillator options.
1 = OSC2 pin outputs the internal or RC oscillator clock (BUSCLKX4)
0 = OSC2 pin configured for PTA4 I/O, having all the interrupt and pullup functions
PTAPUE[5:0] — Port A Input Pullup Enable Bits
These read/write bits are software programmable to enable pullup devices on port A pins.
1 = Corresponding port A pin configured to have internal pullup if its DDRA bit is set to 0
0 = Pullup device is disconnected on the corresponding port A pin regardless of the state of its
DDRA bit
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
105
Input/Output Ports (PORTS)
12.2.4 Port A Summary Table
The following table summarizes the operation of the port A pins when used as a general-purpose
input/output pins.
Table 12-1. Port A Pin Functions
PTAPUE
Bit
DDRA
Bit
PTA
Bit
I/O Pin
Mode
Accesses to DDRA
Accesses to PTA
Read/Write
Read
Write
1
0
X(1)
Input, VDD(2)
DDRA5–DDRA0
Pin
PTA5–PTA0(3)
0
0
X
Input, Hi-Z(4)
DDRA5–DDRA0
Pin
PTA5–PTA0(3)
X
1
X
Output
DDRA5–DDRA0
PTA5–PTA0
PTA5–PTA0(5)
1. X = don’t care
2. I/O pin pulled to VDD by internal pullup.
3. Writing affects data register, but does not affect input.
4. Hi-Z = high impedance
5. Output does not apply to PTA2
12.3 Port B
Port B is an 8-bit special function port that shares its pins with the 4-channel timer interface module (TIM)
(see Chapter 16 Timer Interface Module (TIM)), the 10-bit ADC (see Chapter 3 Analog-to-Digital
Converter (ADC10) Module), the serial peripheral interface (SPI) module (see Chapter 15 Serial
Peripheral Interface (SPI) Module) and the enhanced serial communications interface (ESCI) module
(see Chapter 13 Enhanced Serial Communications Interface (ESCI) Module).
Each port B pin also has a software configurable pullup device if the corresponding port pin is configured
as an input port.
12.3.1 Port B Data Register
The port B data register (PTB) contains a data latch for each of the port B pins.
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
PTB7
PTB6
PTB5
PTB4
PTB3
PTB2
PTB1
PTB0
Unaffected by reset
Figure 12-5. Port B Data Register (PTB)
PTB[7:0] — Port B Data Bits
These read/write bits are software programmable. Data direction of each port B pin is under the control
of the corresponding bit in data direction register B. Reset has no effect on port B data.
MC68HC908QB8 Data Sheet, Rev. 3
106
Freescale Semiconductor
Port B
12.3.2 Data Direction Register B
Data direction register B (DDRB) determines whether each port B pin is an input or an output. Writing a 1
to a DDRB bit enables the output buffer for the corresponding port B pin; a 0 disables the output buffer.
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
DDRB7
DDRB6
DDRB5
DDRB4
DDRB3
DDRB2
DDRB1
DDRB0
0
0
0
0
0
0
0
0
Figure 12-6. Data Direction Register B (DDRB)
DDRB[7:0] — Data Direction Register B Bits
These read/write bits control port B data direction. Reset clears DDRB[7:0], configuring all port B pins
as inputs.
1 = Corresponding port B pin configured as output
0 = Corresponding port B pin configured as input
NOTE
Avoid glitches on port B pins by writing to the port B data register before
changing data direction register B bits from 0 to 1. Figure 12-7 shows the
port B I/O logic.
READ DDRB
PTBPUEx
INTERNAL DATA BUS
WRITE DDRB
RESET
WRITE PTB
DDRBx
PULLUP
PTBx
PTBx
READ PTB
Figure 12-7. Port B I/O Circuit
When DDRBx is a 1, reading PTB reads the PTBx data latch. When DDRBx is a 0, reading PTB reads
the logic level on the PTBx pin. The data latch can always be written, regardless of the state of its data
direction bit.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
107
Input/Output Ports (PORTS)
12.3.3 Port B Input Pullup Enable Register
The port B input pullup enable register (PTBPUE) contains a software configurable pullup device for each
of the eight port B pins. Each bit is individually configurable and requires the corresponding data direction
register, DDRBx, be configured as input. Each pullup device is automatically and dynamically disabled
when its corresponding DDRBx bit is configured as output.
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
PTBPUE7
PTBPUE6
PTBPUE5
PTBPUE4
PTBPUE3
PTBPUE2
PTBPUE2
PTBPUE0
0
0
0
0
0
0
0
0
Figure 12-8. Port B Input Pullup Enable Register (PTBPUE)
PTBPUE[7:0] — Port B Input Pullup Enable Bits
These read/write bits are software programmable to enable pullup devices on port B pins
1 = Corresponding port B pin configured to have internal pull if its DDRB bit is set to 0
0 = Pullup device is disconnected on the corresponding port B pin regardless of the state of its
DDRB bit.
12.3.4 Port B Summary Table
Table 12-2 summarizes the operation of the port A pins when used as a general-purpose input/output
pins.
Table 12-2. Port B Pin Functions
DDRB
Bit
PTB
Bit
I/O Pin
Mode
Accesses to DDRB
Accesses to PTB
Read/Write
Read
Write
0
X(1)
Input, Hi-Z(2)
DDRB7–DDRB0
Pin
PTB7–PTB0(3)
1
X
Output
DDRB7–DDRB0
Pin
PTB7–PTB0
1. X = don’t care
2. Hi-Z = high impedance
3. Writing affects data register, but does not affect the input.
MC68HC908QB8 Data Sheet, Rev. 3
108
Freescale Semiconductor
Chapter 13
Enhanced Serial Communications Interface (ESCI) Module
13.1 Introduction
The enhanced serial communications interface (ESCI) module allows asynchronous communications
with peripheral devices and other microcontroller units (MCU).
The ESCI module shares its pins with general-purpose input/output (I/O) port pins. See Figure 13-1 for
port location of these shared pins. The ESCI baud rate clock source is controlled by a bit (ESCIBDSRC)
located in the configuration register.
13.2 Features
Features include:
• Full-duplex operation
• Standard mark/space non-return-to-zero (NRZ) format
• Programmable baud rates
• Programmable 8-bit or 9-bit character length
• Separately enabled transmitter and receiver
• Separate receiver and transmitter interrupt requests
• Programmable transmitter output polarity
• Receiver wakeup methods
– Idle line
– Address mark
• Interrupt-driven operation with eight interrupt flags:
– Transmitter empty
– Transmission complete
– Receiver full
– Idle receiver input
– Receiver overrun
– Noise error
– Framing error
– Parity error
• Receiver framing error detection
• Hardware parity checking
• 1/16 bit-time noise detection
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
109
Enhanced Serial Communications Interface (ESCI) Module
PTA0/TCH0/AD0/KBI0
CLOCK
GENERATOR
PTA3/RST/KBI3
DDRA
PTA2/IRQ/KBI2/TCLK
PTA
PTA1/TCH1/AD1/KBI1
KEYBOARD INTERRUPT
MODULE
PTA4/OSC2/AD2/KBI4
PTA5/OSC1/AD3/KBI5
EXTERNAL INTERRUPT
MODULE
AUTO WAKEUP
MODULE
DDRB
PTB0/SCK/AD4
PTB1/MOSI/AD5
PTB2/MISO/AD6
PTB3/SS/AD7
PTB4/RxD/AD8
PTB5/TxD/AD9
PTB6/TCH2
PTB7/TCH3
PTB
M68HC08 CPU
LOW-VOLTAGE
INHIBIT
4-CHANNEL 16-BIT
TIMER MODULE
MC68HC908QB8
MC68HC908QB8
256 BYTES
8192 BYTES
USER RAM
USER FLASH
10-CHANNEL
10-BIT ADC
ENHANCED SERIAL
COMMUNICATIONS
INTERFACE MODULE
VDD
POWER SUPPLY
COP
MODULE
VSS
SERIAL PERIPHERAL
INTERFACE
DEVELOPMENT SUPPORT
MONITOR ROM
BREAK MODULE
RST, IRQ: Pins have internal pull up device
All port pins have programmable pull up device
PTA[0:5]: Higher current sink and source capability
Figure 13-1. Block Diagram Highlighting ESCI Block and Pins
MC68HC908QB8 Data Sheet, Rev. 3
110
Freescale Semiconductor
Functional Description
13.3 Functional Description
Figure 13-2 shows the structure of the ESCI module. The ESCI allows full-duplex, asynchronous, NRZ
serial communication between the MCU and remote devices, including other MCUs. The transmitter and
receiver of the ESCI operate independently, although they use the same baud rate generator.
INTERNAL BUS
SCI_TxD
SCTIE
BUS CLOCK
R8
TCIE
SL
T8
SCRIE
ILIE
TE
ACLK BIT
IN SCIACTL
SCTE
RE
TxD
TRANSMIT
SHIFT REGISTER
TXINV
LINR
RxD
ARBITER
RxD
ERROR
INTERRUPT
CONTROL
RECEIVE
SHIFT REGISTER
ESCI DATA
REGISTER
RECEIVER
INTERRUPT
CONTROL
TRANSMITTER
INTERRUPT
CONTROL
ESCI DATA
REGISTER
SBK
SCRF
OR
ORIE
IDLE
NF
NEIE
FE
FEIE
PE
PEIE
SCI_CLK
TC
RWU
LOOPS
LOOPS
RECEIVE
CONTROL
WAKEUP
CONTROL
BUS
CLOCK
BUSCLKX4
ENSCI
ENHANCED
PRESCALER
ESCIBDSRC
FROM
CONFIG
FEGISTER
SL
ENSCI
TRANSMIT
CONTROL
FLAG
CONTROL
BKF
M
RPF
WAKE
LINT
ILTY
÷4
PRESCALER
PEN
BAUD RATE
GENERATOR
÷ 16
PTY
DATA SELECTION
CONTROL
SL = 1 -> SCI_CLK = BUSCLK
SL = 0 -> SCI_CLK = BUSCLKX4
Figure 13-2. ESCI Module Block Diagram
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
111
Enhanced Serial Communications Interface (ESCI) Module
13.3.1 Data Format
The SCI uses the standard mark/space non-return-to-zero (NRZ) format illustrated in Figure 13-3.
START
BIT
START
BIT
PARITY
OR DATA
BIT
8-BIT DATA FORMAT
(BIT M IN SCC1 CLEAR)
BIT 0
BIT 1
BIT 2
BIT 3
BIT 4
BIT 5
BIT 6
BIT 7
BIT 1
BIT 2
BIT 3
BIT 4
BIT 5
STOP
BIT
PARITY
OR DATA
BIT
9-BIT DATA FORMAT
(BIT M IN SCC1 SET)
BIT 0
NEXT
START
BIT
BIT 6
BIT 7
BIT 8
NEXT
START
BIT
STOP
BIT
Figure 13-3. SCI Data Formats
13.3.2 Transmitter
Figure 13-4 shows the structure of the SCI transmitter.
INTERNAL BUS
÷4
PRESCALER
BAUD
DIVIDER
÷ 16
ESCI DATA REGISTER
SCP1
11-BIT
TRANSMIT
SHIFT REGISTER
SCP0
SCR2
STOP
SCR1
8
7
6
5
4
3
2
1
0
START
SCI_TxD
PRESCALER
TXINV
PARITY
GENERATION
PSSB4
PSSB3
T8
PSSB2
BREAK
(ALL ZEROS)
PTY
PREAMBLE
(ALL ONES)
PEN
PDS0
SHIFT ENABLE
PDS1
LOAD FROM SCDR
M
PDS2
BUSCLKX4
OR
BUS CLOCK
MSB
SCR0
TRANSMITTER
CONTROL LOGIC
PSSB1
PSSB0
TRANSMITTER
INTERRUPT REQUEST
SCTE
SCTE
SCTIE
TC
TCIE
SBK
LOOPS
SCTIE
ENSCI
TC
TE
TCIE
LINT
Figure 13-4. ESCI Transmitter
MC68HC908QB8 Data Sheet, Rev. 3
112
Freescale Semiconductor
Functional Description
13.3.2.1 Character Length
The transmitter can accommodate either 8-bit or 9-bit data. The state of the M bit in ESCI control
register 1 (SCC1) determines character length. When transmitting 9-bit data, bit T8 in ESCI control
register 3 (SCC3) is the ninth bit (bit 8).
13.3.2.2 Character Transmission
During an ESCI transmission, the transmit shift register shifts a character out to the TxD pin. The ESCI
data register (SCDR) is the write-only buffer between the internal data bus and the transmit shift register.
To initiate an ESCI transmission:
1. Enable the ESCI by writing a 1 to the enable ESCI bit (ENSCI) in ESCI control register 1 (SCC1).
2. Enable the transmitter by writing a 1 to the transmitter enable bit (TE) in ESCI control register 2
(SCC2).
3. Clear the ESCI transmitter empty bit (SCTE) by first reading ESCI status register 1 (SCS1) and
then writing to the SCDR. For 9-bit data, also write the T8 bit in SCC3.
4. Repeat step 3 for each subsequent transmission.
At the start of a transmission, transmitter control logic automatically loads the transmit shift register with
a preamble of 1s. After the preamble shifts out, control logic transfers the SCDR data into the transmit
shift register. A 0 start bit automatically goes into the least significant bit (LSB) position of the transmit shift
register. A 1 stop bit goes into the most significant bit (MSB) position.
The ESCI transmitter empty bit, SCTE, in SCS1 becomes set when the SCDR transfers a byte to the
transmit shift register. The SCTE bit indicates that the SCDR can accept new data from the internal data
bus. If the ESCI transmit interrupt enable bit, SCTIE, in SCC2 is also set, the SCTE bit generates a
transmitter interrupt request.
When the transmit shift register is not transmitting a character, the TxD pin goes to the idle condition, high.
If at any time software clears the ENSCI bit in ESCI control register 1 (SCC1), the transmitter and receiver
relinquish control of the port pins.
13.3.2.3 Break Characters
Writing a 1 to the send break bit, SBK, in SCC2 loads the transmit shift register with a break character.
For TXINV = 0 (output not inverted), a transmitted break character contains all 0s and has no start, stop,
or parity bit. Break character length depends on the M bit in SCC1 and the LINR bits in SCBR. As long as
SBK is set, transmitter logic continuously loads break characters into the transmit shift register. After
software clears the SBK bit, the shift register finishes transmitting the last break character and then
transmits at least one 1. The automatic 1 at the end of a break character guarantees the recognition of
the start bit of the next character.
When LINR is cleared in SCBR, the ESCI recognizes a break character when a start bit is followed by
eight or nine 0 data bits and a 0 where the stop bit should be, resulting in a total of 10 or 11 consecutive 0
data bits. When LINR is set in SCBR, the ESCI recognizes a break character when a start bit is followed
by 9 or 10 0 data bits and a 0 where the stop bit should be, resulting in a total of 11 or 12 consecutive 0
data bits.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
113
Enhanced Serial Communications Interface (ESCI) Module
Receiving a break character has these effects on ESCI registers:
• Sets the framing error bit (FE) in SCS1
• Sets the ESCI receiver full bit (SCRF) in SCS1
• Clears the ESCI data register (SCDR)
• Clears the R8 bit in SCC3
• Sets the break flag bit (BKF) in SCS2
• May set the overrun (OR), noise flag (NF), parity error (PE), or reception in progress flag (RPF) bits
13.3.2.4 Idle Characters
For TXINV = 0 (output not inverted), a transmitted idle character contains all 1s and has no start, stop, or
parity bit. Idle character length depends on the M bit in SCC1. The preamble is a synchronizing idle
character that begins every transmission.
If the TE bit is cleared during a transmission, the TxD pin becomes idle after completion of the
transmission in progress. Clearing and then setting the TE bit during a transmission queues an idle
character to be sent after the character currently being transmitted.
13.3.2.5 Inversion of Transmitted Output
The transmit inversion bit (TXINV) in ESCI control register 1 (SCC1) reverses the polarity of transmitted
data. All transmitted values including idle, break, start, and stop bits, are inverted when TXINV is set. See
13.8.1 ESCI Control Register 1.
13.3.3 Receiver
Figure 13-5 shows the structure of the ESCI receiver.
13.3.3.1 Character Length
The receiver can accommodate either 8-bit or 9-bit data. The state of the M bit in ESCI control register 1
(SCC1) determines character length. When receiving 9-bit data, bit R8 in ESCI control register 3 (SCC3)
is the ninth bit (bit 8). When receiving 8-bit data, bit R8 is a copy of the eighth bit (bit 7).
13.3.3.2 Character Reception
During an ESCI reception, the receive shift register shifts characters in from the RxD pin. The ESCI data
register (SCDR) is the read-only buffer between the internal data bus and the receive shift register.
After a complete character shifts into the receive shift register, the data portion of the character transfers
to the SCDR. The ESCI receiver full bit, SCRF, in ESCI status register 1 (SCS1) becomes set, indicating
that the received byte can be read. If the ESCI receive interrupt enable bit, SCRIE, in SCC2 is also set,
the SCRF bit generates a receiver interrupt request.
MC68HC908QB8 Data Sheet, Rev. 3
114
Freescale Semiconductor
Functional Description
INTERNAL BUS
SCP1
SCR1
SCP0
SCR0
DATA
RECOVERY
ALL ZEROS
PDS2
RPF
PDS1
PDS0
PSSB4
PSSB3
PSSB2
H
8
7
6
5
M
WAKE
ILTY
PSSB1
PEN
PSSB0
PTY
RECEIVER
INTERRUPT
REQUEST
11-BIT
RECEIVE SHIFT REGISTER
STOP
÷ 16
RxD
BKF
BUSCLKX4
OR
BUS CLOCK
BAUD
DIVIDER
ALL ONES
PRESCALER
PRESCALER
÷4
ESCI DATA REGISTER
4
3
SCRF
WAKEUP
LOGIC
PARITY
CHECKING
IDLE
ILIE
SCRF
SCRIE
OR
ORIE
NF
NEIE
ERROR
INTERRUPT
REQUEST
START
SCR2
2
1
0
L
MSB
LINR
FE
FEIE
PE
PEIE
RWU
IDLE
R8
ILIE
SCRIE
OR
ORIE
NF
NEIE
FE
FEIE
PE
PEIE
Figure 13-5. ESCI Receiver Block Diagram
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
115
Enhanced Serial Communications Interface (ESCI) Module
13.3.3.3 Data Sampling
The receiver samples the RxD pin at the RT clock rate. The RT clock is an internal signal with a frequency
16 times the baud rate. To adjust for baud rate mismatch, the RT clock is resynchronized at these times
(see Figure 13-6):
• After every start bit
• After the receiver detects a data bit change from 1 to 0 (after the majority of data bit samples at
RT8, RT9, and RT10 returns a valid 1 and the majority of the next RT8, RT9, and RT10 samples
returns a valid 0)
To locate the start bit, data recovery logic does an asynchronous search for a 0 preceded by three 1s.
When the falling edge of a possible start bit occurs, the RT clock begins to count to 16.
START BIT
RxD
SAMPLES
START BIT
QUALIFICATION
LSB
START BIT
DATA
VERIFICATION SAMPLING
RT CLOCK
STATE
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT2
RT3
RT4
RT5
RT6
RT7
RT8
RT9
RT10
RT11
RT12
RT13
RT14
RT15
RT16
RT1
RT2
RT3
RT4
RT
CLOCK
RT CLOCK
RESET
Figure 13-6. Receiver Data Sampling
To verify the start bit and to detect noise, data recovery logic takes samples at RT3, RT5, and RT7.
Table 13-1 summarizes the results of the start bit verification samples.
Table 13-1. Start Bit Verification
RT3, RT5, and RT7 Samples
Start Bit Verification
Noise Flag
000
Yes
0
001
Yes
1
010
Yes
1
011
No
0
100
Yes
1
101
No
0
110
No
0
111
No
0
If start bit verification is not successful, the RT clock is reset and a new search for a start bit begins.
To determine the value of a data bit and to detect noise, recovery logic takes samples at RT8, RT9, and
RT10. Table 13-2 summarizes the results of the data bit samples.
MC68HC908QB8 Data Sheet, Rev. 3
116
Freescale Semiconductor
Functional Description
Table 13-2. Data Bit Recovery
RT8, RT9, and RT10 Samples
Data Bit Determination
Noise Flag
000
0
0
001
0
1
010
0
1
011
1
1
100
0
1
101
1
1
110
1
1
111
1
0
NOTE
The RT8, RT9, and RT10 samples do not affect start bit verification. If any
or all of the RT8, RT9, and RT10 start bit samples are 1s following a
successful start bit verification, the noise flag (NF) is set and the receiver
assumes that the bit is a start bit.
To verify a stop bit and to detect noise, recovery logic takes samples at RT8, RT9, and RT10. Table 13-3
summarizes the results of the stop bit samples.
Table 13-3. Stop Bit Recovery
RT8, RT9, and RT10 Samples
Framing Error Flag
Noise Flag
000
1
0
001
1
1
010
1
1
011
0
1
100
1
1
101
0
1
110
0
1
111
0
0
13.3.3.4 Framing Errors
If the data recovery logic does not detect a 1 where the stop bit should be in an incoming character, it sets
the framing error bit, FE, in SCS1. A break character also sets the FE bit because a break character has
no stop bit. The FE bit is set at the same time that the SCRF bit is set.
13.3.3.5 Baud Rate Tolerance
A transmitting device may be operating at a baud rate below or above the receiver baud rate.
Accumulated bit time misalignment can cause one of the three stop bit data samples to fall outside the
actual stop bit. Then a noise error occurs. If more than one of the samples is outside the stop bit, a framing
error occurs. In most applications, the baud rate tolerance is much more than the degree of misalignment
that is likely to occur.
As the receiver samples an incoming character, it resynchronizes the RT clock on any valid falling edge
within the character. Resynchronization within characters corrects misalignments between transmitter bit
times and receiver bit times.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
117
Enhanced Serial Communications Interface (ESCI) Module
Slow Data Tolerance
Figure 13-7 shows how much a slow received character can be misaligned without causing a noise error
or a framing error. The slow stop bit begins at RT8 instead of RT1 but arrives in time for the stop bit data
samples at RT8, RT9, and RT10.
MSB
STOP
RT16
RT15
RT14
RT13
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
RT1
RECEIVER
RT CLOCK
DATA SAMPLES
Figure 13-7. Slow Data
For an 8-bit character, data sampling of the stop bit takes the receiver 9 bit times × 16 RT cycles
+ 10 RT cycles = 154 RT cycles.
With the misaligned character shown in Figure 13-7, the receiver counts 154 RT cycles at the point when
the count of the transmitting device is 9 bit times × 16 RT cycles + 3 RT cycles = 147 RT cycles.
The maximum percent difference between the receiver count and the transmitter count of a slow 8-bit
character with no errors is:
154 – 147 × 100 = 4.54%
-------------------------154
For a 9-bit character, data sampling of the stop bit takes the receiver 10 bit times × 16 RT cycles
+ 10 RT cycles = 170 RT cycles.
With the misaligned character shown in Figure 13-7, the receiver counts 170 RT cycles at the point when
the count of the transmitting device is 10 bit times × 16 RT cycles + 3 RT cycles = 163 RT cycles.
The maximum percent difference between the receiver count and the transmitter count of a slow 9-bit
character with no errors is:
170 – 163 × 100 = 4.12%
-------------------------170
Fast Data Tolerance
Figure 13-8 shows how much a fast received character can be misaligned without causing a noise error
or a framing error. The fast stop bit ends at RT10 instead of RT16 but is still there for the stop bit data
samples at RT8, RT9, and RT10.
STOP
IDLE OR NEXT CHARACTER
RT16
RT15
RT14
RT13
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
RT1
RECEIVER
RT CLOCK
DATA
SAMPLES
Figure 13-8. Fast Data
MC68HC908QB8 Data Sheet, Rev. 3
118
Freescale Semiconductor
Interrupts
For an 8-bit character, data sampling of the stop bit takes the receiver 9 bit times × 16 RT cycles
+ 10 RT cycles = 154 RT cycles.
With the misaligned character shown in Figure 13-8, the receiver counts 154 RT cycles at the point when
the count of the transmitting device is 10 bit times × 16 RT cycles = 160 RT cycles.
The maximum percent difference between the receiver count and the transmitter count of a fast 8-bit
character with no errors is
154 – 160 × 100 = 3.90%.
-------------------------154
For a 9-bit character, data sampling of the stop bit takes the receiver 10 bit times × 16 RT cycles
+ 10 RT cycles = 170 RT cycles.
With the misaligned character shown in Figure 13-8, the receiver counts 170 RT cycles at the point when
the count of the transmitting device is 11 bit times × 16 RT cycles = 176 RT cycles.
The maximum percent difference between the receiver count and the transmitter count of a fast 9-bit
character with no errors is:
170 – 176 × 100 = 3.53%.
-------------------------170
13.3.3.6 Receiver Wakeup
So that the MCU can ignore transmissions intended only for other receivers in multiple-receiver systems,
the receiver can be put into a standby state. Setting the receiver wakeup bit, RWU, in SCC2 puts the
receiver into a standby state during which receiver interrupts are disabled.
Depending on the state of the WAKE bit in SCC1, either of two conditions on the RxD pin can bring the
receiver out of the standby state:
1. Address mark — An address mark is a 1 in the MSB position of a received character. When the
WAKE bit is set, an address mark wakes the receiver from the standby state by clearing the RWU
bit. The address mark also sets the ESCI receiver full bit, SCRF. Software can then compare the
character containing the address mark to the user-defined address of the receiver. If they are the
same, the receiver remains awake and processes the characters that follow. If they are not the
same, software can set the RWU bit and put the receiver back into the standby state.
2. Idle input line condition — When the WAKE bit is clear, an idle character on the RxD pin wakes the
receiver from the standby state by clearing the RWU bit. The idle character that wakes the receiver
does not set the receiver idle bit, IDLE, or the ESCI receiver full bit, SCRF. The idle line type bit,
ILTY, determines whether the receiver begins counting 1s as idle character bits after the start bit
or after the stop bit.
NOTE
With the WAKE bit clear, setting the RWU bit after the RxD pin has been
idle will cause the receiver to wake up.
13.4 Interrupts
The following sources can generate ESCI interrupt requests.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
119
Enhanced Serial Communications Interface (ESCI) Module
13.4.1 Transmitter Interrupts
These conditions can generate interrupt requests from the ESCI transmitter:
• ESCI transmitter empty (SCTE) — The SCTE bit in SCS1 indicates that the SCDR has transferred
a character to the transmit shift register. SCTE can generate a transmitter interrupt request. Setting
the ESCI transmit interrupt enable bit, SCTIE, in SCC2 enables the SCTE bit to generate
transmitter interrupt requests.
• Transmission complete (TC) — The TC bit in SCS1 indicates that the transmit shift register and the
SCDR are empty and that no break or idle character has been generated. The transmission
complete interrupt enable bit, TCIE, in SCC2 enables the TC bit to generate transmitter interrupt
requests.
13.4.2 Receiver Interrupts
These sources can generate interrupt requests from the ESCI receiver:
• ESCI receiver full (SCRF) — The SCRF bit in SCS1 indicates that the receive shift register has
transferred a character to the SCDR. SCRF can generate a receiver interrupt request. Setting the
ESCI receive interrupt enable bit, SCRIE, in SCC2 enables the SCRF bit to generate receiver
interrupts.
• Idle input (IDLE) — The IDLE bit in SCS1 indicates that 10 or 11 consecutive 1s shifted in from the
RxD pin. The idle line interrupt enable bit, ILIE, in SCC2 enables the IDLE bit to generate interrupt
requests.
13.4.3 Error Interrupts
These receiver error flags in SCS1 can generate interrupt requests:
• Receiver overrun (OR) — The OR bit indicates that the receive shift register shifted in a new
character before the previous character was read from the SCDR. The previous character remains
in the SCDR, and the new character is lost. The overrun interrupt enable bit, ORIE, in SCC3
enables OR to generate ESCI error interrupt requests.
• Noise flag (NF) — The NF bit is set when the ESCI detects noise on incoming data or break
characters, including start, data, and stop bits. The noise error interrupt enable bit, NEIE, in SCC3
enables NF to generate ESCI error interrupt requests.
• Framing error (FE) — The FE bit in SCS1 is set when a 0 occurs where the receiver expects a stop
bit. The framing error interrupt enable bit, FEIE, in SCC3 enables FE to generate ESCI error
interrupt requests.
• Parity error (PE) — The PE bit in SCS1 is set when the ESCI detects a parity error in incoming
data. The parity error interrupt enable bit, PEIE, in SCC3 enables PE to generate ESCI error
interrupt requests.
13.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
13.5.1 Wait Mode
The ESCI module remains active in wait mode. Any enabled interrupt request from the ESCI module can
bring the MCU out of wait mode.
If ESCI module functions are not required during wait mode, reduce power consumption by disabling the
module before executing the WAIT instruction.
MC68HC908QB8 Data Sheet, Rev. 3
120
Freescale Semiconductor
ESCI During Break Interrupts
13.5.2 Stop Mode
The ESCI module is inactive in stop mode. The STOP instruction does not affect ESCI register states.
ESCI module operation resumes after the MCU exits stop mode.
Because the internal clock is inactive during stop mode, entering stop mode during an ESCI transmission
or reception results in invalid data.
13.6 ESCI During Break Interrupts
The system integration module (SIM) controls whether status bits in other modules can be cleared during
the break state. The BCFE bit in the break flag control register (BFCR) enables software to clear status
bits during the break state. See BFCR in the SIM section of this data sheet.
To allow software to clear status bits during a break interrupt, write a 1 to BCFE. If a status bit is cleared
during the break state, it remains cleared when the MCU exits the break state.
To protect status bits during the break state, write a 0 to BCFE. With BCFE cleared (its default state),
software can read and write registers during the break state without affecting status bits. Some status bits
have a two-step read/write clearing procedure. If software does the first step on such a bit before the
break, the bit cannot change during the break state as long as BCFE is cleared.After the break, doing the
second step clears the status bit.
13.7 I/O Signals
The ESCI module can share its pins with the general-purpose I/O pins. See Figure 13-1 for the port pins
that are shared.
13.7.1 ESCI Transmit Data (TxD)
The TxD pin is the serial data output from the ESCI transmitter. When the ESCI is enabled, the TxD pin
becomes an output.
13.7.2 ESCI Receive Data (RxD)
The RxD pin is the serial data input to the ESCI receiver. When the ESCI is enabled, the RxD pin becomes
an input.
13.8 Registers
The following registers control and monitor operation of the ESCI:
• ESCI control register 1, SCC1
• ESCI control register 2, SCC2
• ESCI control register 3, SCC3
• ESCI status register 1, SCS1
• ESCI status register 2, SCS2
• ESCI data register, SCDR
• ESCI baud rate register, SCBR
• ESCI prescaler register, SCPSC
• ESCI arbiter control register, SCIACTL
• ESCI arbiter data register, SCIADAT
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
121
Enhanced Serial Communications Interface (ESCI) Module
13.8.1 ESCI Control Register 1
ESCI control register 1 (SCC1):
• Enables loop mode operation
• Enables the ESCI
• Controls output polarity
• Controls character length
• Controls ESCI wakeup method
• Controls idle character detection
• Enables parity function
• Controls parity type
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
LOOPS
ENSCI
TXINV
M
WAKE
ILTY
PEN
PTY
0
0
0
0
0
0
0
0
Figure 13-9. ESCI Control Register 1 (SCC1)
LOOPS — Loop Mode Select Bit
This read/write bit enables loop mode operation. In loop mode the RxD pin is disconnected from the
ESCI, and the transmitter output goes into the receiver input. Both the transmitter and the receiver
must be enabled to use loop mode.
1 = Loop mode enabled
0 = Normal operation enabled
ENSCI — Enable ESCI Bit
This read/write bit enables the ESCI and the ESCI baud rate generator. Clearing ENSCI sets the SCTE
and TC bits in ESCI status register 1 and disables transmitter interrupts.
1 = ESCI enabled
0 = ESCI disabled
TXINV — Transmit Inversion Bit
This read/write bit reverses the polarity of transmitted data.
1 = Transmitter output inverted
0 = Transmitter output not inverted
NOTE
Setting the TXINV bit inverts all transmitted values including idle, break,
start, and stop bits.
M — Mode (Character Length) Bit
This read/write bit determines whether ESCI characters are eight or nine bits long (see
Table 13-4).The ninth bit can serve as a receiver wakeup signal or as a parity bit.
1 = 9-bit ESCI characters
0 = 8-bit ESCI characters
MC68HC908QB8 Data Sheet, Rev. 3
122
Freescale Semiconductor
Registers
Table 13-4. Character Format Selection
Control Bits
Character Format
M
PEN:PTY
Start Bits
Data Bits
Parity
Stop Bits
Character Length
0
0 X
1
8
None
1
10 bits
1
0 X
1
9
None
1
11 bits
0
1 0
1
7
Even
1
10 bits
0
1 1
1
7
Odd
1
10 bits
1
1 0
1
8
Even
1
11 bits
1
1 1
1
8
Odd
1
11 bits
WAKE — Wakeup Condition Bit
This read/write bit determines which condition wakes up the ESCI: a 1 (address mark) in the MSB
position of a received character or an idle condition on the RxD pin.
1 = Address mark wakeup
0 = Idle line wakeup
ILTY — Idle Line Type Bit
This read/write bit determines when the ESCI starts counting 1s as idle character bits. The counting
begins either after the start bit or after the stop bit. If the count begins after the start bit, then a string
of 1s preceding the stop bit may cause false recognition of an idle character. Beginning the count after
the stop bit avoids false idle character recognition, but requires properly synchronized transmissions.
1 = Idle character bit count begins after stop bit
0 = Idle character bit count begins after start bit
PEN — Parity Enable Bit
This read/write bit enables the ESCI parity function (see Table 13-4). When enabled, the parity
function inserts a parity bit in the MSB position (see Table 13-2).
1 = Parity function enabled
0 = Parity function disabled
PTY — Parity Bit
This read/write bit determines whether the ESCI generates and checks for odd parity or even parity
(see Table 13-4).
1 = Odd parity
0 = Even parity
NOTE
Changing the PTY bit in the middle of a transmission or reception can
generate a parity error.
13.8.2 ESCI Control Register 2
ESCI control register 2 (SCC2):
• Enables these interrupt requests:
– SCTE bit to generate transmitter interrupt requests
– TC bit to generate transmitter interrupt requests
– SCRF bit to generate receiver interrupt requests
– IDLE bit to generate receiver interrupt requests
• Enables the transmitter
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
123
Enhanced Serial Communications Interface (ESCI) Module
•
•
•
Enables the receiver
Enables ESCI wakeup
Transmits ESCI break characters
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
SCTIE
TCIE
SCRIE
ILIE
TE
RE
RWU
SBK
0
0
0
0
0
0
0
0
Figure 13-10. ESCI Control Register 2 (SCC2)
SCTIE — ESCI Transmit Interrupt Enable Bit
This read/write bit enables the SCTE bit to generate ESCI transmitter interrupt requests. Setting the
SCTIE bit in SCC2 enables the SCTE bit to generate interrupt requests.
1 = SCTE enabled to generate interrupt
0 = SCTE not enabled to generate interrupt
TCIE — Transmission Complete Interrupt Enable Bit
This read/write bit enables the TC bit to generate ESCI transmitter interrupt requests.
1 = TC enabled to generate interrupt requests
0 = TC not enabled to generate interrupt requests
SCRIE — ESCI Receive Interrupt Enable Bit
This read/write bit enables the SCRF bit to generate ESCI receiver interrupt requests. Setting the
SCRIE bit in SCC2 enables the SCRF bit to generate interrupt requests.
1 = SCRF enabled to generate interrupt
0 = SCRF not enabled to generate interrupt
ILIE — Idle Line Interrupt Enable Bit
This read/write bit enables the IDLE bit to generate ESCI receiver interrupt requests.
1 = IDLE enabled to generate interrupt requests
0 = IDLE not enabled to generate interrupt requests
TE — Transmitter Enable Bit
Setting this read/write bit begins the transmission by sending a preamble of 10 or 11 1s from the
transmit shift register to the TxD pin. If software clears the TE bit, the transmitter completes any
transmission in progress before the TxD returns to the idle condition (high). Clearing and then setting
TE during a transmission queues an idle character to be sent after the character currently being
transmitted.
1 = Transmitter enabled
0 = Transmitter disabled
NOTE
Writing to the TE bit is not allowed when the enable ESCI bit (ENSCI) is
clear. ENSCI is in ESCI control register 1.
RE — Receiver Enable Bit
Setting this read/write bit enables the receiver. Clearing the RE bit disables the receiver but does not
affect receiver interrupt flag bits.
1 = Receiver enabled
0 = Receiver disabled
MC68HC908QB8 Data Sheet, Rev. 3
124
Freescale Semiconductor
Registers
NOTE
Writing to the RE bit is not allowed when the enable ESCI bit (ENSCI) is
clear. ENSCI is in ESCI control register 1.
RWU — Receiver Wakeup Bit
This read/write bit puts the receiver in a standby state during which receiver interrupts are disabled.
The WAKE bit in SCC1 determines whether an idle input or an address mark brings the receiver out
of the standby state and clears the RWU bit.
1 = Standby state
0 = Normal operation
SBK — Send Break Bit
Setting and then clearing this read/write bit transmits a break character followed by a 1. The 1 after the
break character guarantees recognition of a valid start bit. If SBK remains set, the transmitter
continuously transmits break characters with no 1s between them.
1 = Transmit break characters
0 = No break characters being transmitted
NOTE
Do not toggle the SBK bit immediately after setting the SCTE bit. Toggling
SBK before the preamble begins causes the ESCI to send a break
character instead of a preamble.
13.8.3 ESCI Control Register 3
ESCI control register 3 (SCC3):
• Stores the ninth ESCI data bit received and the ninth ESCI data bit to be transmitted.
• Enables these interrupts:
– Receiver overrun
– Noise error
– Framing error
– Parity error
Bit 7
Read:
R8
Write:
Reset:
U
6
5
4
3
2
1
Bit 0
T8
R
R
ORIE
NEIE
FEIE
PEIE
0
0
0
0
0
= Unimplemented
0
0
R
= Reserved
U = Unaffected
Figure 13-11. ESCI Control Register 3 (SCC3)
R8 — Received Bit 8
When the ESCI is receiving 9-bit characters, R8 is the read-only ninth bit (bit 8) of the received
character. R8 is received at the same time that the SCDR receives the other 8 bits.
When the ESCI is receiving 8-bit characters, R8 is a copy of the eighth bit (bit 7).
T8 — Transmitted Bit 8
When the ESCI is transmitting 9-bit characters, T8 is the read/write ninth bit (bit 8) of the transmitted
character. T8 is loaded into the transmit shift register at the same time that the SCDR is loaded into
the transmit shift register.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
125
Enhanced Serial Communications Interface (ESCI) Module
ORIE — Receiver Overrun Interrupt Enable Bit
This read/write bit enables ESCI error interrupt requests generated by the receiver overrun bit, OR.
1 = ESCI error interrupt requests from OR bit enabled
0 = ESCI error interrupt requests from OR bit disabled
NEIE — Receiver Noise Error Interrupt Enable Bit
This read/write bit enables ESCI error interrupt requests generated by the noise error bit, NE.
1 = ESCI error interrupt requests from NE bit enabled
0 = ESCI error interrupt requests from NE bit disabled
FEIE — Receiver Framing Error Interrupt Enable Bit
This read/write bit enables ESCI error interrupt requests generated by the framing error bit, FE.
1 = ESCI error interrupt requests from FE bit enabled
0 = ESCI error interrupt requests from FE bit disabled
PEIE — Receiver Parity Error Interrupt Enable Bit
This read/write bit enables ESCI receiver interrupt requests generated by the parity error bit, PE.
1 = ESCI error interrupt requests from PE bit enabled
0 = ESCI error interrupt requests from PE bit disabled
13.8.4 ESCI Status Register 1
ESCI status register 1 (SCS1) contains flags to signal these conditions:
• Transfer of SCDR data to transmit shift register complete
• Transmission complete
• Transfer of receive shift register data to SCDR complete
• Receiver input idle
• Receiver overrun
• Noisy data
• Framing error
• Parity error
Read:
Bit 7
6
5
4
3
2
1
Bit 0
SCTE
TC
SCRF
IDLE
OR
NF
FE
PE
1
1
0
0
0
0
0
0
Write:
Reset:
= Unimplemented
Figure 13-12. ESCI Status Register 1 (SCS1)
SCTE — ESCI Transmitter Empty Bit
This clearable, read-only bit is set when the SCDR transfers a character to the transmit shift register.
SCTE can generate an ESCI transmitter interrupt request. When the SCTIE bit in SCC2 is set, SCTE
generates an ESCI transmitter interrupt request. In normal operation, clear the SCTE bit by reading
SCS1 with SCTE set and then writing to SCDR
1 = SCDR data transferred to transmit shift register
0 = SCDR data not transferred to transmit shift register
MC68HC908QB8 Data Sheet, Rev. 3
126
Freescale Semiconductor
Registers
TC — Transmission Complete Bit
This read-only bit is set when the SCTE bit is set, and no data, preamble, or break character is being
transmitted. TC generates an ESCI transmitter interrupt request if the TCIE bit in SCC2 is also set. TC
is cleared automatically when data, preamble, or break is queued and ready to be sent. There may be
up to 1.5 transmitter clocks of latency between queueing data, preamble, and break and the
transmission actually starting.
1 = No transmission in progress
0 = Transmission in progress
SCRF — ESCI Receiver Full Bit
This clearable, read-only bit is set when the data in the receive shift register transfers to the ESCI data
register. SCRF can generate an ESCI receiver interrupt request. When the SCRIE bit in SCC2 is set
the SCRF generates a interrupt request. In normal operation, clear the SCRF bit by reading SCS1 with
SCRF set and then reading the SCDR.
1 = Received data available in SCDR
0 = Data not available in SCDR
IDLE — Receiver Idle Bit
This clearable, read-only bit is set when 10 or 11 consecutive 1s appear on the receiver input. IDLE
generates an ESCI receiver interrupt request if the ILIE bit in SCC2 is also set. Clear the IDLE bit by
reading SCS1 with IDLE set and then reading the SCDR. After the receiver is enabled, it must receive
a valid character that sets the SCRF bit before an idle condition can set the IDLE bit. Also, after the
IDLE bit has been cleared, a valid character must again set the SCRF bit before an idle condition can
set the IDLE bit.
1 = Receiver input idle
0 = Receiver input active (or idle since the IDLE bit was cleared)
OR — Receiver Overrun Bit
This clearable, read-only bit is set when software fails to read the SCDR before the receive shift
register receives the next character. The OR bit generates an ESCI error interrupt request if the ORIE
bit in SCC3 is also set. The data in the shift register is lost, but the data already in the SCDR is not
affected. Clear the OR bit by reading SCS1 with OR set and then reading the SCDR.
1 = Receive shift register full and SCRF = 1
0 = No receiver overrun
Software latency may allow an overrun to occur between reads of SCS1 and SCDR in the flag-clearing
sequence. Figure 13-13 shows the normal flag-clearing sequence and an example of an overrun
caused by a delayed flag-clearing sequence. The delayed read of SCDR does not clear the OR bit
because OR was not set when SCS1 was read. Byte 2 caused the overrun and is lost. The next
flag-clearing sequence reads byte 3 in the SCDR instead of byte 2.
In applications that are subject to software latency or in which it is important to know which byte is lost
due to an overrun, the flag-clearing routine can check the OR bit in a second read of SCS1 after
reading the data register.
NF — Receiver Noise Flag Bit
This clearable, read-only bit is set when the ESCI detects noise on the RxD pin. NF generates an NF
interrupt request if the NEIE bit in SCC3 is also set. Clear the NF bit by reading SCS1 and then reading
the SCDR.
1 = Noise detected
0 = No noise detected
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
127
Enhanced Serial Communications Interface (ESCI) Module
BYTE 1
BYTE 2
BYTE 3
SCRF = 0
SCRF = 1
SCRF = 0
SCRF = 1
SCRF = 0
SCRF = 1
NORMAL FLAG CLEARING SEQUENCE
BYTE 4
READ SCS1
SCRF = 1
OR = 0
READ SCS1
SCRF = 1
OR = 0
READ SCS1
SCRF = 1
OR = 0
READ SCDR
BYTE 1
READ SCDR
BYTE 2
READ SCDR
BYTE 3
BYTE 1
BYTE 2
BYTE 3
SCRF = 0
OR = 0
SCRF = 1
OR = 1
SCRF = 0
OR = 1
SCRF = 1
SCRF = 1
OR = 1
DELAYED FLAG CLEARING SEQUENCE
BYTE 4
READ SCS1
SCRF = 1
OR = 0
READ SCS1
SCRF = 1
OR = 1
READ SCDR
BYTE 1
READ SCDR
BYTE 3
Figure 13-13. Flag Clearing Sequence
FE — Receiver Framing Error Bit
This clearable, read-only bit is set when a 0 is accepted as the stop bit. FE generates an ESCI error
interrupt request if the FEIE bit in SCC3 also is set. Clear the FE bit by reading SCS1 with FE set and
then reading the SCDR.
1 = Framing error detected
0 = No framing error detected
PE — Receiver Parity Error Bit
This clearable, read-only bit is set when the ESCI detects a parity error in incoming data. PE generates
a PE interrupt request if the PEIE bit in SCC3 is also set. Clear the PE bit by reading SCS1 with PE
set and then reading the SCDR.
1 = Parity error detected
0 = No parity error detected
MC68HC908QB8 Data Sheet, Rev. 3
128
Freescale Semiconductor
Registers
13.8.5 ESCI Status Register 2
ESCI status register 2 (SCS2) contains flags to signal these conditions:
• Break character detected
• Reception in progress
Read:
Write:
Reset:
Bit 7
0
0
6
0
5
0
4
0
3
0
2
0
1
BKF
Bit 0
RPF
0
0
= Unimplemented
0
0
0
0
0
Figure 13-14. ESCI Status Register 2 (SCS2)
BKF — Break Flag Bit
This clearable, read-only bit is set when the ESCI detects a break character on the RxD pin. In SCS1,
the FE and SCRF bits are also set. In 9-bit character transmissions, the R8 bit in SCC3 is cleared. BKF
does not generate a interrupt request. Clear BKF by reading SCS2 with BKF set and then reading the
SCDR. Once cleared, BKF can become set again only after 1s again appear on the RxD pin followed
by another break character.
1 = Break character detected
0 = No break character detected
RPF — Reception in Progress Flag Bit
This read-only bit is set when the receiver detects a 0 during the RT1 time period of the start bit search.
RPF does not generate an interrupt request. RPF is reset after the receiver detects false start bits
(usually from noise or a baud rate mismatch), or when the receiver detects an idle character. Polling
RPF before disabling the ESCI module or entering stop mode can show whether a reception is in
progress.
1 = Reception in progress
0 = No reception in progress
13.8.6 ESCI Data Register
The ESCI data register (SCDR) is the buffer between the internal data bus and the receive and transmit
shift registers. Reset has no effect on data in the ESCI data register.
Read:
Write:
Reset:
Bit 7
R7
T7
6
R6
T6
5
R5
T5
4
3
R4
R3
T4
T3
Unaffected by reset
2
R2
T2
1
R1
T1
Bit 0
R0
T0
Figure 13-15. ESCI Data Register (SCDR)
R7/T7:R0/T0 — Receive/Transmit Data Bits
Reading SCDR accesses the read-only received data bits, R7:R0.
Writing to SCDR writes the data to be transmitted, T7:T0.
NOTE
Do not use read-modify-write instructions on the ESCI data register.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
129
Enhanced Serial Communications Interface (ESCI) Module
13.8.7 ESCI Baud Rate Register
The ESCI baud rate register (SCBR) together with the ESCI prescaler register selects the baud rate for
both the receiver and the transmitter.
NOTE
There are two prescalers available to adjust the baud rate — one in the
ESCI baud rate register and one in the ESCI prescaler register.
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
LINT
LINR
SCP1
SCP0
R
SCR2
SCR1
SCR0
0
0
0
0
0
0
0
0
R
= Reserved
Figure 13-16. ESCI Baud Rate Register (SCBR)
LINT — LIN Transmit Enable
This read/write bit selects the enhanced ESCI features for the local interconnect network (LIN) protocol
as shown in Table 13-5.
LINR — LIN Receiver Bits
This read/write bit selects the enhanced ESCI features for the local interconnect network (LIN) protocol
as shown in Table 13-5.
Table 13-5. ESCI LIN Control Bits
LINT
LINR
M
Functionality
0
0
X
Normal ESCI functionality
0
1
0
11-bit break detect enabled for LIN receiver
0
1
1
12-bit break detect enabled for LIN receiver
1
0
0
13-bit generation enabled for LIN transmitter
1
0
1
14-bit generation enabled for LIN transmitter
1
1
0
11-bit break detect/13-bit generation enabled for LIN
1
1
1
12-bit break detect/14-bit generation enabled for LIN
In LIN (version 1.2 and later) systems, the master node transmits a break character which will appear
as 11.05–14.95 dominant bits to the slave node. A data character of 0x00 sent from the master might
appear as 7.65–10.35 dominant bit times. This is due to the oscillator tolerance requirement that the
slave node must be within ±15% of the master node's oscillator. Because a slave node cannot know
if it is running faster or slower than the master node (prior to synchronization), the LINR bit allows the
slave node to differentiate between a 0x00 character of 10.35 bits and a break character of 11.05 bits.
The break symbol length must be verified in software in any case, but the LINR bit serves as a filter,
preventing false detections of break characters that are really 0x00 data characters.
MC68HC908QB8 Data Sheet, Rev. 3
130
Freescale Semiconductor
Registers
SCP1 and SCP0 — ESCI Baud Rate Register Prescaler Bits
These read/write bits select the baud rate register prescaler divisor as shown in Table 13-6.
Table 13-6. ESCI Baud Rate Prescaling
SCP[1:0]
Baud Rate Register
Prescaler Divisor (BPD)
0 0
1
0 1
3
1 0
4
1 1
13
SCR2–SCR0 — ESCI Baud Rate Select Bits
These read/write bits select the ESCI baud rate divisor as shown in Table 13-7. Reset clears
SCR2–SCR0.
Table 13-7. ESCI Baud Rate Selection
SCR[2:1:0]
Baud Rate Divisor (BD)
0 0 0
1
0 0 1
2
0 1 0
4
0 1 1
8
1 0 0
16
1 0 1
32
1 1 0
64
1 1 1
128
13.8.8 ESCI Prescaler Register
The ESCI prescaler register (SCPSC) together with the ESCI baud rate register selects the baud rate for
both the receiver and the transmitter.
NOTE
There are two prescalers available to adjust the baud rate — one in the
ESCI baud rate register and one in the ESCI prescaler register.
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
PDS2
PDS1
PDS0
PSSB4
PSSB3
PSSB2
PSSB1
PSSB0
0
0
0
0
0
0
0
0
Figure 13-17. ESCI Prescaler Register (SCPSC)
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
131
Enhanced Serial Communications Interface (ESCI) Module
PDS2–PDS0 — Prescaler Divisor Select Bits
These read/write bits select the prescaler divisor as shown in Table 13-8.
NOTE
The setting of ‘000’ will bypass not only this prescaler but also the prescaler
divisor fine adjust (PDFA). It is not recommended to bypass the prescaler
while ENSCI is set, because the switching is not glitch free.
Table 13-8. ESCI Prescaler Division Ratio
PDS[2:1:0]
Prescaler Divisor (PD)
0 0 0
Bypass this prescaler
0 0 1
2
0 1 0
3
0 1 1
4
1 0 0
5
1 0 1
6
1 1 0
7
1 1 1
8
PSSB4–PSSB0 — Clock Insertion Select Bits
These read/write bits select the number of clocks inserted in each 32 output cycle frame to achieve
more timing resolution on the average prescaler frequency as shown in Table 13-9.
Table 13-9. ESCI Prescaler Divisor Fine Adjust
PSSB[4:3:2:1:0]
Prescaler Divisor Fine Adjust (PDFA)
0 0 0 0 0
0/32 = 0
0 0 0 0 1
1/32 = 0.03125
0 0 0 1 0
2/32 = 0.0625
0 0 0 1 1
3/32 = 0.09375
0 0 1 0 0
4/32 = 0.125
0 0 1 0 1
5/32 = 0.15625
0 0 1 1 0
6/32 = 0.1875
0 0 1 1 1
7/32 = 0.21875
0 1 0 0 0
8/32 = 0.25
0 1 0 0 1
9/32 = 0.28125
0 1 0 1 0
10/32 = 0.3125
0 1 0 1 1
11/32 = 0.34375
0 1 1 0 0
12/32 = 0.375
0 1 1 0 1
13/32 = 0.40625
0 1 1 1 0
14/32 = 0.4375
Continued on next page
MC68HC908QB8 Data Sheet, Rev. 3
132
Freescale Semiconductor
Registers
Table 13-9. ESCI Prescaler Divisor Fine Adjust (Continued)
PSSB[4:3:2:1:0]
Prescaler Divisor Fine Adjust (PDFA)
0 1 1 1 1
15/32 = 0.46875
1 0 0 0 0
16/32 = 0.5
1 0 0 0 1
17/32 = 0.53125
1 0 0 1 0
18/32 = 0.5625
1 0 0 1 1
19/32 = 0.59375
1 0 1 0 0
20/32 = 0.625
1 0 1 0 1
21/32 = 0.65625
1 0 1 1 0
22/32 = 0.6875
1 0 1 1 1
23/32 = 0.71875
1 1 0 0 0
24/32 = 0.75
1 1 0 0 1
25/32 = 0.78125
1 1 0 1 0
26/32 = 0.8125
1 1 0 1 1
27/32 = 0.84375
1 1 1 0 0
28/32 = 0.875
1 1 1 0 1
29/32 = 0.90625
1 1 1 1 0
30/32 = 0.9375
1 1 1 1 1
31/32 = 0.96875
Use the following formula to calculate the ESCI baud rate:
Baud rate =
Frequency of the SCI clock source
64 x BPD x BD x (PD + PDFA)
where:
SCI clock source = bus clock or BUSCLKX4 (selected by ESCIBDSRC in the configuration register)
BPD = Baud rate register prescaler divisor
BD = Baud rate divisor
PD = Prescaler divisor
PDFA = Prescaler divisor fine adjust
Table 13-10 shows the ESCI baud rates that can be generated with a 4.9152-MHz bus frequency.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
133
Enhanced Serial Communications Interface (ESCI) Module
Table 13-10. ESCI Baud Rate Selection Examples
PDS[2:1:0]
PSSB[4:3:2:1:0]
SCP[1:0]
Prescaler
Divisor
(BPD)
SCR[2:1:0]
0 0 0
X X X X X
0 0
1
0 0 0
Baud Rate
Divisor
(BD)
1
Baud Rate
(fBus= 4.9152 MHz)
76,800
1 1 1
0 0 0 0 0
0 0
1
0 0 0
1
9600
1 1 1
0 0 0 0 1
0 0
1
0 0 0
1
9562.65
1 1 1
0 0 0 1 0
0 0
1
0 0 0
1
9525.58
1 1 1
1 1 1 1 1
0 0
1
0 0 0
1
8563.07
0 0 0
X X X X X
0 0
1
0 0 1
2
38,400
0 0 0
X X X X X
0 0
1
0 1 0
4
19,200
0 0 0
X X X X X
0 0
1
0 1 1
8
9600
0 0 0
X X X X X
0 0
1
1 0 0
16
4800
0 0 0
X X X X X
0 0
1
1 0 1
32
2400
0 0 0
X X X X X
0 0
1
1 1 0
64
1200
0 0 0
X X X X X
0 0
1
1 1 1
128
600
0 0 0
X X X X X
0 1
3
0 0 0
1
25,600
0 0 0
X X X X X
0 1
3
0 0 1
2
12,800
0 0 0
X X X X X
0 1
3
0 1 0
4
6400
0 0 0
X X X X X
0 1
3
0 1 1
8
3200
0 0 0
X X X X X
0 1
3
1 0 0
16
1600
0 0 0
X X X X X
0 1
3
1 0 1
32
800
0 0 0
X X X X X
0 1
3
1 1 0
64
400
0 0 0
X X X X X
0 1
3
1 1 1
128
200
0 0 0
X X X X X
1 0
4
0 0 0
1
19,200
0 0 0
X X X X X
1 0
4
0 0 1
2
9600
0 0 0
X X X X X
1 0
4
0 1 0
4
4800
0 0 0
X X X X X
1 0
4
0 1 1
8
2400
0 0 0
X X X X X
1 0
4
1 0 0
16
1200
0 0 0
X X X X X
1 0
4
1 0 1
32
600
0 0 0
X X X X X
1 0
4
1 1 0
64
300
0 0 0
X X X X X
1 0
4
1 1 1
128
150
0 0 0
X X X X X
1 1
13
0 0 0
1
5908
0 0 0
X X X X X
1 1
13
0 0 1
2
2954
0 0 0
X X X X X
1 1
13
0 1 0
4
1477
0 0 0
X X X X X
1 1
13
0 1 1
8
739
0 0 0
X X X X X
1 1
13
1 0 0
16
369
0 0 0
X X X X X
1 1
13
1 0 1
32
185
0 0 0
X X X X X
1 1
13
1 1 0
64
92
0 0 0
X X X X X
1 1
13
1 1 1
128
46
MC68HC908QB8 Data Sheet, Rev. 3
134
Freescale Semiconductor
ESCI Arbiter
13.9 ESCI Arbiter
The ESCI module comprises an arbiter module designed to support software for communication tasks as
bus arbitration, baud rate recovery and break time detection. The arbiter module consists of an 9-bit
counter with 1-bit overflow and control logic. The can control operation mode via the ESCI arbiter control
register (SCIACTL).
13.9.1 ESCI Arbiter Control Register
Bit 7
Read:
Write:
Reset:
AM1
0
6
ALOST
0
5
4
AM0
ACLK
0
0
3
2
1
Bit 0
AFIN
ARUN
AROVFL
ARD8
0
0
0
0
= Unimplemented
Figure 13-18. ESCI Arbiter Control Register (SCIACTL)
AM1 and AM0 — Arbiter Mode Select Bits
These read/write bits select the mode of the arbiter module as shown in Table 13-11.
Table 13-11. ESCI Arbiter Selectable Modes
AM[1:0]
ESCI Arbiter Mode
0 0
Idle / counter reset
0 1
Bit time measurement
1 0
Bus arbitration
1 1
Reserved / do not use
ALOST — Arbitration Lost Flag
This read-only bit indicates loss of arbitration. Clear ALOST by writing a 0 to AM1.
ACLK — Arbiter Counter Clock Select Bit
This read/write bit selects the arbiter counter clock source.
1 = Arbiter counter is clocked with one half of the ESCI input clock generated by the ESCI prescaler
0 = Arbiter counter is clocked with the bus clock divided by four
NOTE
For ACLK = 1, the arbiter input clock is driven from the ESCI prescaler. The
prescaler can be clocked by either the bus clock or BUSCLKX4 depending
on the state of the ESCIBDSRC bit in configuration register.
AFIN— Arbiter Bit Time Measurement Finish Flag
This read-only bit indicates bit time measurement has finished. Clear AFIN by writing any value to
SCIACTL.
1 = Bit time measurement has finished
0 = Bit time measurement not yet finished
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
135
Enhanced Serial Communications Interface (ESCI) Module
ARUN— Arbiter Counter Running Flag
This read-only bit indicates the arbiter counter is running.
1 = Arbiter counter running
0 = Arbiter counter stopped
AROVFL— Arbiter Counter Overflow Bit
This read-only bit indicates an arbiter counter overflow. Clear AROVFL by writing any value to
SCIACTL. Writing 0s to AM1 and AM0 resets the counter keeps it in this idle state.
1 = Arbiter counter overflow has occurred
0 = No arbiter counter overflow has occurred
ARD8— Arbiter Counter MSB
This read-only bit is the MSB of the 9-bit arbiter counter. Clear ARD8 by writing any value to SCIACTL.
13.9.2 ESCI Arbiter Data Register
Read:
Bit 7
6
5
4
3
2
1
Bit 0
ARD7
ARD6
ARD5
ARD4
ARD3
ARD2
ARD1
ARD0
0
0
0
0
0
0
0
Write:
Reset:
0
= Unimplemented
Figure 13-19. ESCI Arbiter Data Register (SCIADAT)
ARD7–ARD0 — Arbiter Least Significant Counter Bits
These read-only bits are the eight LSBs of the 9-bit arbiter counter. Clear ARD7–ARD0 by writing any
value to SCIACTL. Writing 0s to AM1 and AM0 permanently resets the counter and keeps it in this idle
state.
13.9.3 Bit Time Measurement
Two bit time measurement modes, described here, are available according to the state of ACLK.
1. ACLK = 0 — The counter is clocked with one quarter of the bus clock. The counter is started when
a falling edge on the RxD pin is detected. The counter will be stopped on the next falling edge.
ARUN is set while the counter is running, AFIN is set on the second falling edge on RxD (for
instance, the counter is stopped). This mode is used to recover the received baud rate. See
Figure 13-20.
2. ACLK = 1 — The counter is clocked with one half of the ESCI input clock generated by the ESCI
prescaler. The counter is started when a 0 is detected on RxD (see Figure 13-21). A 0 on RxD on
enabling the bit time measurement with ACLK = 1 leads to immediate start of the counter (see
Figure 13-22). The counter will be stopped on the next rising edge of RxD. This mode is used to
measure the length of a received break.
MC68HC908QB8 Data Sheet, Rev. 3
136
Freescale Semiconductor
ESCI Arbiter
MEASURED TIME
READ RESULT
OUT OF SCIADAT
COUNTER STOPS,
AFIN = 1
COUNTER STARTS,
ARUN = 1
WRITE SCIACTL
WITH $20
RXD
Figure 13-20. Bit Time Measurement with ACLK = 0
MEASURED TIME
READ RESULT
OUT OF SCIADAT
COUNTER STOPS, AFIN = 1
WRITE SCIACTL WITH $30
COUNTER STARTS, ARUN = 1
RXD
Figure 13-21. Bit Time Measurement with ACLK = 1, Scenario A
MEASURED TIME
READ RESULT
OUT OF SCIADAT
COUNTER STOPS,
AFIN = 1
COUNTER STARTS,
ARUN = 1
WRITE SCIACTL
WITH $30
RXD
Figure 13-22. Bit Time Measurement with ACLK = 1, Scenario B
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
137
Enhanced Serial Communications Interface (ESCI) Module
13.9.4 Arbitration Mode
If AM[1:0] is set to 10, the arbiter module operates in arbitration mode. On every rising edge of SCI_TxD
(output of the transmit shift register, see Figure 13-2), the counter is started. When the counter reaches
$38 (ACLK = 0) or $08 (ACLK = 1), RxD is statically sensed. If in this case, RxD is sensed low (for
example, another bus is driving the bus dominant) ALOST is set. As long as ALOST is set, the TxD pin is
forced to 1, resulting in a seized transmission.
If SCI_TxD senses 0 without having sensed a 0 before on RxD, the counter will be reset, arbitration
operation will be restarted after the next rising edge of SCI_TxD.
MC68HC908QB8 Data Sheet, Rev. 3
138
Freescale Semiconductor
Chapter 14
System Integration Module (SIM)
14.1 Introduction
This section describes the system integration module (SIM), which supports up to 24 external and/or
internal interrupts. Together with the central processor unit (CPU), the SIM controls all microcontroller unit
(MCU) activities. A block diagram of the SIM is shown in Figure 14-1. The SIM is a system state controller
that coordinates CPU and exception timing.
The SIM is responsible for:
• Bus clock generation and control for CPU and peripherals
– Stop/wait/reset/break entry and recovery
– Internal clock control
• Master reset control, including power-on reset (POR) and computer operating properly (COP)
timeout
• Interrupt control:
– Acknowledge timing
– Arbitration control timing
– Vector address generation
• CPU enable/disable timing
Table 14-1. Signal Name Conventions
Signal Name
Description
BUSCLKX4
Buffered clock from the internal, RC or XTAL oscillator circuit.
BUSCLKX2
The BUSCLKX4 frequency divided by two. This signal is again
divided by two in the SIM to generate the internal bus clocks
(bus clock = BUSCLKX4 ÷ 4).
Address bus
Internal address bus
Data bus
Internal data bus
PORRST
Signal from the power-on reset module to the SIM
IRST
Internal reset signal
R/W
Read/write signal
14.2 RST and IRQ Pins Initialization
RST and IRQ pins come out of reset as PTA3 and PTA2 respectively. RST and IRQ functions can be
activated by programing CONFIG2 accordingly. Refer to Chapter 5 Configuration Register (CONFIG).
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
139
System Integration Module (SIM)
MODULE STOP
MODULE WAIT
CPU STOP (FROM CPU)
CPU WAIT (FROM CPU)
STOP/WAIT
CONTROL
SIMOSCEN (TO OSCILLATOR)
SIM
COUNTER
COP CLOCK
BUSCLKX4 (FROM OSCILLATOR)
BUSCLKX2 (FROM OSCILLATOR)
÷2
VDD
INTERNAL
PULL-UP
RESET
PIN LOGIC
CLOCK
CONTROL
INTERNAL CLOCKS
CLOCK GENERATORS
POR CONTROL
ILLEGAL OPCODE (FROM CPU)
ILLEGAL ADDRESS (FROM ADDRESS
MAP DECODERS)
COP TIMEOUT (FROM COP MODULE)
MASTER
RESET
CONTROL
RESET PIN CONTROL
LVI RESET (FROM LVI MODULE)
SIM RESET STATUS REGISTER
FORCED MON MODE ENTRY (FROM MENRST MODULE)
RESET
INTERRUPT SOURCES
INTERRUPT CONTROL
AND PRIORITY DECODE
CPU INTERFACE
Figure 14-1. SIM Block Diagram
14.3 SIM Bus Clock Control and Generation
The bus clock generator provides system clock signals for the CPU and peripherals on the MCU. The
system clocks are generated from an incoming clock, BUSCLKX2, as shown in Figure 14-2.
FROM
OSCILLATOR
BUSCLKX4
FROM
OSCILLATOR
BUSCLKX2
SIM COUNTER
BUS CLOCK
GENERATORS
÷2
SIM
Figure 14-2. SIM Clock Signals
MC68HC908QB8 Data Sheet, Rev. 3
140
Freescale Semiconductor
Reset and System Initialization
14.3.1 Bus Timing
In user mode, the internal bus frequency is the oscillator frequency (BUSCLKX4) divided by four.
14.3.2 Clock Start-Up from POR
When the power-on reset module generates a reset, the clocks to the CPU and peripherals are inactive
and held in an inactive phase until after the 4096 BUSCLKX4 cycle POR time out has completed. The
IBUS clocks start upon completion of the time out.
14.3.3 Clocks in Stop Mode and Wait Mode
Upon exit from stop mode by an interrupt or reset, the SIM allows BUSCLKX4 to clock the SIM counter.
The CPU and peripheral clocks do not become active until after the stop delay time out. This time out is
selectable as 4096 or 32 BUSCLKX4 cycles. See 14.7.2 Stop Mode.
In wait mode, the CPU clocks are inactive. The SIM also produces two sets of clocks for other modules.
Refer to the wait mode subsection of each module to see if the module is active or inactive in wait mode.
Some modules can be programmed to be active in wait mode.
14.4 Reset and System Initialization
The MCU has these reset sources:
• Power-on reset module (POR)
• External reset pin (RST)
• Computer operating properly module (COP)
• Low-voltage inhibit module (LVI)
• Illegal opcode
• Illegal address
All of these resets produce the vector $FFFE–FFFF ($FEFE–FEFF in monitor mode) and assert the
internal reset signal (IRST). IRST causes all registers to be returned to their default values and all
modules to be returned to their reset states.
An internal reset clears the SIM counter (see 14.5 SIM Counter), but an external reset does not. Each of
the resets sets a corresponding bit in the SIM reset status register (SRSR). See 14.8 SIM Registers.
14.4.1 External Pin Reset
The RST pin circuits include an internal pullup device. Pulling the asynchronous RST pin low halts all
processing. The PIN bit of the SIM reset status register (SRSR) is set as long as RST is held low for at
least the minimum tRL time. Figure 14-3 shows the relative timing. The RST pin function is only available
if the RSTEN bit is set in the CONFIG2 register.
BUSCLKX2
RST
ADDRESS BUS
PC
VECT H
VECT L
Figure 14-3. External Reset Timing
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
141
System Integration Module (SIM)
14.4.2 Active Resets from Internal Sources
The RST pin is initially setup as a general-purpose input after a POR. Setting the RSTEN bit in the
CONFIG2 register enables the pin for the reset function. This section assumes the RSTEN bit is set when
describing activity on the RST pin.
NOTE
For POR and LVI resets, the SIM cycles through 4096 BUSCLKX4 cycles.
The internal reset signal then follows the sequence from the falling edge of
RST shown in Figure 14-4.
The COP reset is asynchronous to the bus clock.
The active reset feature allows the part to issue a reset to peripherals and other chips within a system
built around the MCU.
All internal reset sources actively pull the RST pin low for 32 BUSCLKX4 cycles to allow resetting of
external peripherals. The internal reset signal IRST continues to be asserted for an additional 32 cycles
(see Figure 14-4). An internal reset can be caused by an illegal address, illegal opcode, COP time out,
LVI, or POR (see Figure 14-5).
IRST
RST
RST PULLED LOW BY MCU
32 CYCLES
32 CYCLES
BUSCLKX4
ADDRESS
BUS
VECTOR HIGH
Figure 14-4. Internal Reset Timing
ILLEGAL ADDRESS RST
ILLEGAL OPCODE RST
COPRST
POR
LVI
INTERNAL RESET
Figure 14-5. Sources of Internal Reset
Table 14-2. Reset Recovery Timing
Reset Recovery Type
Actual Number of Cycles
POR/LVI
4163 (4096 + 64 + 3)
All others
67 (64 + 3)
MC68HC908QB8 Data Sheet, Rev. 3
142
Freescale Semiconductor
Reset and System Initialization
14.4.2.1 Power-On Reset
When power is first applied to the MCU, the power-on reset module (POR) generates a pulse to indicate
that power on has occurred. The SIM counter counts out 4096 BUSCLKX4 cycles. Sixty-four BUSCLKX4
cycles later, the CPU and memories are released from reset to allow the reset vector sequence to occur.
At power on, the following events occur:
• A POR pulse is generated.
• The internal reset signal is asserted.
• The SIM enables the oscillator to drive BUSCLKX4.
• Internal clocks to the CPU and modules are held inactive for 4096 BUSCLKX4 cycles to allow
stabilization of the oscillator.
• The POR bit of the SIM reset status register (SRSR) is set.
See Figure 14-6.
OSC1
PORRST
4096
CYCLES
32
CYCLES
32
CYCLES
BUSCLKX4
BUSCLKX2
RST
(RST PIN IS A GENERAL-PURPOSE INPUT AFTER A POR)
ADDRESS BUS
$FFFE
$FFFF
Figure 14-6. POR Recovery
14.4.2.2 Computer Operating Properly (COP) Reset
An input to the SIM is reserved for the COP reset signal. The overflow of the COP counter causes an
internal reset and sets the COP bit in the SIM reset status register (SRSR). The SIM actively pulls down
the RST pin for all internal reset sources.
To prevent a COP module time out, write any value to location $FFFF. Writing to location $FFFF clears
the COP counter and stages 12–5 of the SIM counter. The SIM counter output, which occurs at least
every (212 – 24) BUSCLKX4 cycles, drives the COP counter. The COP should be serviced as soon as
possible out of reset to guarantee the maximum amount of time before the first time out.
The COP module is disabled during a break interrupt with monitor mode when BDCOP bit is set in break
auxiliary register (BRKAR).
14.4.2.3 Illegal Opcode Reset
The SIM decodes signals from the CPU to detect illegal instructions. An illegal instruction sets the ILOP
bit in the SIM reset status register (SRSR) and causes a reset.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
143
System Integration Module (SIM)
If the stop enable bit, STOP, in the mask option register is 0, the SIM treats the STOP instruction as an
illegal opcode and causes an illegal opcode reset. The SIM actively pulls down the RST pin for all internal
reset sources.
14.4.2.4 Illegal Address Reset
An opcode fetch from an unmapped address generates an illegal address reset. The SIM verifies that the
CPU is fetching an opcode prior to asserting the ILAD bit in the SIM reset status register (SRSR) and
resetting the MCU. A data fetch from an unmapped address does not generate a reset. The SIM actively
pulls down the RST pin for all internal reset sources. See Figure 2-1. Memory Map for memory ranges.
14.4.2.5 Low-Voltage Inhibit (LVI) Reset
The LVI asserts its output to the SIM when the VDD voltage falls to the LVI trip voltage VTRIPF. The LVI
bit in the SIM reset status register (SRSR) is set, and the external reset pin (RST) is held low while the
SIM counter counts out 4096 BUSCLKX4 cycles after VDD rises above VTRIPR. Sixty-four BUSCLKX4
cycles later, the CPU and memories are released from reset to allow the reset vector sequence to occur.
The SIM actively pulls down the (RST) pin for all internal reset sources.
14.5 SIM Counter
The SIM counter is used by the power-on reset module (POR) and in stop mode recovery to allow the
oscillator time to stabilize before enabling the internal bus (IBUS) clocks. The SIM counter also serves as
a prescaler for the computer operating properly module (COP). The SIM counter uses 12 stages for
counting, followed by a 13th stage that triggers a reset of SIM counters and supplies the clock for the COP
module. The SIM counter is clocked by the falling edge of BUSCLKX4.
14.5.1 SIM Counter During Power-On Reset
The power-on reset module (POR) detects power applied to the MCU. At power-on, the POR circuit
asserts the signal PORRST. Once the SIM is initialized, it enables the oscillator to drive the bus clock
state machine.
14.5.2 SIM Counter During Stop Mode Recovery
The SIM counter also is used for stop mode recovery. The STOP instruction clears the SIM counter. After
an interrupt, break, or reset, the SIM senses the state of the short stop recovery bit, SSREC, in the
configuration register 1 (CONFIG1). If the SSREC bit is a 1, then the stop recovery is reduced from the
normal delay of 4096 BUSCLKX4 cycles down to 32 BUSCLKX4 cycles. This is ideal for applications
using canned oscillators that do not require long start-up times from stop mode. External crystal
applications should use the full stop recovery time, that is, with SSREC cleared in the configuration
register 1 (CONFIG1).
14.5.3 SIM Counter and Reset States
External reset has no effect on the SIM counter (see 14.7.2 Stop Mode for details.) The SIM counter is
free-running after all reset states. See 14.4.2 Active Resets from Internal Sources for counter control and
internal reset recovery sequences.
MC68HC908QB8 Data Sheet, Rev. 3
144
Freescale Semiconductor
Exception Control
14.6 Exception Control
Normal sequential program execution can be changed in three different ways:
1. Interrupts
a. Maskable hardware CPU interrupts
b. Non-maskable software interrupt instruction (SWI)
2. Reset
3. Break interrupts
14.6.1 Interrupts
An interrupt temporarily changes the sequence of program execution to respond to a particular event.
Figure 14-7 flow charts the handling of system interrupts.
Interrupts are latched, and arbitration is performed in the SIM at the start of interrupt processing. The
arbitration result is a constant that the CPU uses to determine which vector to fetch. Once an interrupt is
latched by the SIM, no other interrupt can take precedence, regardless of priority, until the latched
interrupt is serviced (or the I bit is cleared).
At the beginning of an interrupt, the CPU saves the CPU register contents on the stack and sets the
interrupt mask (I bit) to prevent additional interrupts. At the end of an interrupt, the RTI instruction recovers
the CPU register contents from the stack so that normal processing can resume. Figure 14-8 shows
interrupt entry timing. Figure 14-9 shows interrupt recovery timing.
14.6.1.1 Hardware Interrupts
A hardware interrupt does not stop the current instruction. Processing of a hardware interrupt begins after
completion of the current instruction. When the current instruction is complete, the SIM checks all pending
hardware interrupts. If interrupts are not masked (I bit clear in the condition code register), and if the
corresponding interrupt enable bit is set, the SIM proceeds with interrupt processing; otherwise, the next
instruction is fetched and executed.
If more than one interrupt is pending at the end of an instruction execution, the highest priority interrupt is
serviced first. Figure 14-10 demonstrates what happens when two interrupts are pending. If an interrupt
is pending upon exit from the original interrupt service routine, the pending interrupt is serviced before the
LDA instruction is executed.
The LDA opcode is prefetched by both the INT1 and INT2 return-from-interrupt (RTI) instructions.
However, in the case of the INT1 RTI prefetch, this is a redundant operation.
NOTE
To maintain compatibility with the M6805 Family, the H register is not
pushed on the stack during interrupt entry. If the interrupt service routine
modifies the H register or uses the indexed addressing mode, software
should save the H register and then restore it prior to exiting the routine.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
145
System Integration Module (SIM)
FROM RESET
BREAK
INTERRUPT?
I BIT
SET?
YES
NO
YES
I BIT SET?
NO
IRQ
INTERRUPT?
YES
NO
TIMER
INTERRUPT?
YES
NO
STACK CPU REGISTERS
SET I BIT
LOAD PC WITH INTERRUPT VECTOR
(AS MANY INTERRUPTS AS EXIST ON CHIP)
FETCH NEXT
INSTRUCTION
SWI
INSTRUCTION?
YES
NO
RTI
INSTRUCTION?
YES
UNSTACK CPU REGISTERS
NO
EXECUTE INSTRUCTION
Figure 14-7. Interrupt Processing
MC68HC908QB8 Data Sheet, Rev. 3
146
Freescale Semiconductor
Exception Control
MODULE
INTERRUPT
I BIT
ADDRESS BUS
DUMMY
DATA BUS
SP
DUMMY
SP – 1
SP – 2
PC – 1[7:0] PC – 1[15:8]
SP – 3
X
SP – 4
A
VECT H
CCR
VECT L
V DATA H
START ADDR
V DATA L
OPCODE
R/W
Figure 14-8. Interrupt Entry
MODULE
INTERRUPT
I BIT
ADDRESS BUS
SP – 4
DATA BUS
SP – 3
CCR
SP – 2
A
SP – 1
X
SP
PC
PC + 1
PC – 1[7:0] PC – 1[15:8] OPCODE
OPERAND
R/W
Figure 14-9. Interrupt Recovery
CLI
LDA #$FF
INT1
BACKGROUND ROUTINE
PSHH
INT1 INTERRUPT SERVICE ROUTINE
PULH
RTI
INT2
PSHH
INT2 INTERRUPT SERVICE ROUTINE
PULH
RTI
Figure 14-10. Interrupt Recognition Example
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
147
System Integration Module (SIM)
14.6.1.2 SWI Instruction
The SWI instruction is a non-maskable instruction that causes an interrupt regardless of the state of the
interrupt mask (I bit) in the condition code register.
NOTE
A software interrupt pushes PC onto the stack. A software interrupt does
not push PC – 1, as a hardware interrupt does.
14.6.2 Interrupt Status Registers
The flags in the interrupt status registers identify maskable interrupt sources. Table 14-3 summarizes the
interrupt sources and the interrupt status register flags that they set. The interrupt status registers can be
useful for debugging.
Table 14-3. Interrupt Sources
Flag
Mask(1)
INT
Register
Flag
Vector
Address
Reset
—
—
—
$FFFE–$FFFF
SWI instruction
—
—
—
$FFFC–$FFFD
IRQ pin
IRQF
IMASK
IF1
$FFFA–$FFFB
Timer channel 0 interrupt
CH0F
CH0IE
IF3
$FFF6–$FFF7
Timer channel 1 interrupt
CH1F
CH1IE
IF4
$FFF4–$FFF5
TOF
TOIE
IF5
$FFF2–$FFF3
CH2F
CH2IE
IF6
$FFF0–$FFF1
Priority
Highest
Source
Timer overflow interrupt
TIM channel 2 vector
TIM channel 3 vector
CH3F
CH3IE
IF7
$FFEE–$FFEF
OR, HF,
FE, PE
ORIE, NEIE,
FEIE, PEIE
IF9
$FFEA–$FFEB
ESCI receive vector
SCRF
SCRIE
IF10
$FFE8–$FFE9
ESCI transmit vector
SCTE, TC
SCTIE, TCIE
IF11
$FFE6–$FFE7
SPI receive
SPRF,
OVRF,
MODF
SPRIE, ERRIE
IF12
$FFE4–$FFE5
SPI transmit
SPTE
SPTIE
IF13
$FFE2–$FFE3
Keyboard interrupt
KEYF
IMASKK
IF14
$FFE0–$FFE1
ADC conversion complete interrupt
COCO
AIEN
IF15
$FFDE–$FFDF
ESCI error vector
Lowest
1. The I bit in the condition code register is a global mask for all interrupt sources except the SWI instruction.
MC68HC908QB8 Data Sheet, Rev. 3
148
Freescale Semiconductor
Exception Control
14.6.2.1 Interrupt Status Register 1
Bit 7
6
5
4
3
2
Read:
IF6
IF5
IF4
Write:
R
R
R
Reset:
0
0
0
R
= Reserved
1
Bit 0
IF3
0
IF1
0
0
R
R
R
R
R
0
0
0
0
0
Figure 14-11. Interrupt Status Register 1 (INT1)
IF1 and IF3–IF6 — Interrupt Flags
These flags indicate the presence of interrupt requests from the sources shown in Table 14-3.
1 = Interrupt request present
0 = No interrupt request present
Bit 0, 1, and 3— Always read 0
14.6.2.2 Interrupt Status Register 2
Bit 7
6
5
4
3
2
1
Bit 0
Read:
IF14
IF13
IF12
IF11
IF10
IF9
IF8
IF7
Write:
R
R
R
R
R
R
R
R
0
0
0
0
0
0
0
0
R
= Reserved
Reset:
Figure 14-12. Interrupt Status Register 2 (INT2)
IF7–IF14 — Interrupt Flags
This flag indicates the presence of interrupt requests from the sources shown in Table 14-3.
1 = Interrupt request present
0 = No interrupt request present
14.6.2.3 Interrupt Status Register 3
Bit 7
6
5
4
3
2
1
Bit 0
Read:
IF22
IF21
IF20
IF19
IF18
IF17
IF16
IF15
Write:
R
R
R
R
R
R
R
R
Reset:
0
0
0
0
0
0
0
0
R
= Reserved
Figure 14-13. Interrupt Status Register 3 (INT3)
IF15–IF22 — Interrupt Flags
These flags indicate the presence of interrupt requests from the sources shown in Table 14-3.
1 = Interrupt request present
0 = No interrupt request present
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
149
System Integration Module (SIM)
14.6.3 Reset
All reset sources always have equal and highest priority and cannot be arbitrated.
14.6.4 Break Interrupts
The break module can stop normal program flow at a software programmable break point by asserting its
break interrupt output. (See Chapter 17 Development Support.) The SIM puts the CPU into the break
state by forcing it to the SWI vector location. Refer to the break interrupt subsection of each module to
see how each module is affected by the break state.
14.6.5 Status Flag Protection in Break Mode
The SIM controls whether status flags contained in other modules can be cleared during break mode. The
user can select whether flags are protected from being cleared by properly initializing the break clear flag
enable bit (BCFE) in the break flag control register (BFCR).
Protecting flags in break mode ensures that set flags will not be cleared while in break mode. This
protection allows registers to be freely read and written during break mode without losing status flag
information.
Setting the BCFE bit enables the clearing mechanisms. Once cleared in break mode, a flag remains
cleared even when break mode is exited. Status flags with a two-step clearing mechanism — for example,
a read of one register followed by the read or write of another — are protected, even when the first step
is accomplished prior to entering break mode. Upon leaving break mode, execution of the second step
will clear the flag as normal.
14.7 Low-Power Modes
Executing the WAIT or STOP instruction puts the MCU in a low power- consumption mode for standby
situations. The SIM holds the CPU in a non-clocked state. The operation of each of these modes is
described below. Both STOP and WAIT clear the interrupt mask (I) in the condition code register, allowing
interrupts to occur.
14.7.1 Wait Mode
In wait mode, the CPU clocks are inactive while the peripheral clocks continue to run. Figure 14-14 shows
the timing for wait mode entry.
ADDRESS BUS
DATA BUS
WAIT ADDR
WAIT ADDR + 1
PREVIOUS DATA
SAME
NEXT OPCODE
SAME
SAME
SAME
R/W
NOTE: Previous data can be operand data or the WAIT opcode, depending on the last instruction.
Figure 14-14. Wait Mode Entry Timing
A module that is active during wait mode can wake up the CPU with an interrupt if the interrupt is enabled.
Stacking for the interrupt begins one cycle after the WAIT instruction during which the interrupt occurred.
MC68HC908QB8 Data Sheet, Rev. 3
150
Freescale Semiconductor
Low-Power Modes
In wait mode, the CPU clocks are inactive. Refer to the wait mode subsection of each module to see if the
module is active or inactive in wait mode. Some modules can be programmed to be active in wait mode.
Wait mode can also be exited by a reset (or break in emulation mode). A break interrupt during wait mode
sets the SIM break stop/wait bit, SBSW, in the break status register (BSR). If the COP disable bit, COPD,
in the configuration register is 0, then the computer operating properly module (COP) is enabled and
remains active in wait mode.
Figure 14-15 and Figure 14-16 show the timing for wait recovery.
ADDRESS BUS
DATA BUS
$6E0B
$A6
$A6
$6E0C
$A6
$00FF
$01
$0B
$00FE
$00FD
$00FC
$6E
EXITSTOPWAIT
NOTE: EXITSTOPWAIT = RST pin OR CPU interrupt
Figure 14-15. Wait Recovery from Interrupt
32
CYCLES
ADDRESS BUS
DATA BUS
32
CYCLES
$6E0B
$A6
$A6
RSTVCT H
RSTVCT L
$A6
RST(1)
BUSCLKX4
1. RST is only available if the RSTEN bit in the CONFIG2 register is set.
Figure 14-16. Wait Recovery from Internal Reset
14.7.2 Stop Mode
In stop mode, the SIM counter is reset and the system clocks are disabled. An interrupt request from a
module can cause an exit from stop mode. Stacking for interrupts begins after the selected stop recovery
time has elapsed. Reset or break also causes an exit from stop mode.
The SIM disables the oscillator signals (BUSCLKX2 and BUSCLKX4) in stop mode, stopping the CPU
and peripherals. If OSCENINSTOP is set, BUSCLKX4 will remain running in STOP and can be used to
run the AWU. Stop recovery time is selectable using the SSREC bit in the configuration register 1
(CONFIG1). If SSREC is set, stop recovery is reduced from the normal delay of 4096 BUSCLKX4 cycles
down to 32. This is ideal for the internal oscillator, RC oscillator, and external oscillator options which do
not require long start-up times from stop mode.
NOTE
External crystal applications should use the full stop recovery time by
clearing the SSREC bit.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
151
System Integration Module (SIM)
The SIM counter is held in reset from the execution of the STOP instruction until the beginning of stop
recovery. It is then used to time the recovery period. Figure 14-17 shows stop mode entry timing and
Figure 14-18 shows the stop mode recovery time from interrupt or break
NOTE
To minimize stop current, all pins configured as inputs should be driven to
a logic 1 or logic 0.
CPUSTOP
ADDRESS BUS
STOP ADDR + 1
STOP ADDR
DATA BUS
PREVIOUS DATA
SAME
SAME
NEXT OPCODE
SAME
SAME
R/W
NOTE: Previous data can be operand data or the STOP opcode, depending on the last instruction.
Figure 14-17. Stop Mode Entry Timing
STOP RECOVERY PERIOD
BUSCLKX4
INTERRUPT
ADDRESS BUS
STOP + 2
STOP +1
STOP + 2
SP
SP – 1
SP – 2
SP – 3
Figure 14-18. Stop Mode Recovery from Interrupt
14.8 SIM Registers
The SIM has two memory mapped registers.
14.8.1 SIM Reset Status Register
The SRSR register contains flags that show the source of the last reset. The status register will
automatically clear after reading SRSR. A power-on reset sets the POR bit and clears all other bits in the
register. All other reset sources set the individual flag bits but do not clear the register. More than one
reset source can be flagged at any time depending on the conditions at the time of the internal or external
reset. For example, the POR and LVI bit can both be set if the power supply has a slow rise time.
Read:
Bit 7
6
5
4
3
2
1
Bit 0
POR
PIN
COP
ILOP
ILAD
MODRST
LVI
0
1
0
0
0
0
0
0
0
Write:
POR:
= Unimplemented
Figure 14-19. SIM Reset Status Register (SRSR)
MC68HC908QB8 Data Sheet, Rev. 3
152
Freescale Semiconductor
SIM Registers
POR — Power-On Reset Bit
1 = Last reset caused by POR circuit
0 = Read of SRSR
PIN — External Reset Bit
1 = Last reset caused by external reset pin (RST)
0 = POR or read of SRSR
COP — Computer Operating Properly Reset Bit
1 = Last reset caused by COP counter
0 = POR or read of SRSR
ILOP — Illegal Opcode Reset Bit
1 = Last reset caused by an illegal opcode
0 = POR or read of SRSR
ILAD — Illegal Address Reset Bit (illegal attempt to fetch an opcode from an unimplemented
address)
1 = Last reset caused by an opcode fetch from an illegal address
0 = POR or read of SRSR
MODRST — Monitor Mode Entry Module Reset Bit
1 = Last reset caused by monitor mode entry when vector locations $FFFE and $FFFF are $FF after
POR while IRQ ≠ VTST
0 = POR or read of SRSR
LVI — Low Voltage Inhibit Reset bit
1 = Last reset caused by LVI circuit
0 = POR or read of SRSR
14.8.2 Break Flag Control Register
The break control register (BFCR) contains a bit that enables software to clear status bits while the MCU
is in a break state.
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
BCFE
R
R
R
R
R
R
R
0
R
= Reserved
Figure 14-20. Break Flag Control Register (BFCR)
BCFE — Break Clear Flag Enable Bit
This read/write bit enables software to clear status bits by accessing status registers while the MCU is
in a break state. To clear status bits during the break state, the BCFE bit must be set.
1 = Status bits clearable during break
0 = Status bits not clearable during break
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
153
System Integration Module (SIM)
MC68HC908QB8 Data Sheet, Rev. 3
154
Freescale Semiconductor
Chapter 15
Serial Peripheral Interface (SPI) Module
15.1 Introduction
This section describes the serial peripheral interface (SPI) module, which allows full-duplex, synchronous,
serial communications with peripheral devices.
The SPI shares its pins with general-purpose input/output (I/O) port pins. See Figure 15-1 for port location
of these shared pins.
15.2 Features
Features of the SPI module include:
• Full-duplex operation
• Master and slave modes
• Double-buffered operation with separate transmit and receive registers
• Four master mode frequencies (maximum = bus frequency ÷ 2)
• Maximum slave mode frequency = bus frequency
• Serial clock with programmable polarity and phase
• Two separately enabled interrupts:
– SPRF (SPI receiver full)
– SPTE (SPI transmitter empty)
• Mode fault error flag with interrupt capability
• Overflow error flag with interrupt capability
• Programmable wired-OR mode
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
155
Serial Peripheral Interface (SPI) Module
PTA0/TCH0/AD0/KBI0
CLOCK
GENERATOR
PTA3/RST/KBI3
DDRA
PTA2/IRQ/KBI2/TCLK
PTA
PTA1/TCH1/AD1/KBI1
KEYBOARD INTERRUPT
MODULE
PTA4/OSC2/AD2/KBI4
PTA5/OSC1/AD3/KBI5
EXTERNAL INTERRUPT
MODULE
AUTO WAKEUP
MODULE
DDRB
PTB0/SCK/AD4
PTB1/MOSI/AD5
PTB2/MISO/AD6
PTB3/SS/AD7
PTB4/RxD/AD8
PTB5/TxD/AD9
PTB6/TCH2
PTB7/TCH3
PTB
M68HC08 CPU
LOW-VOLTAGE
INHIBIT
4-CHANNEL 16-BIT
TIMER MODULE
MC68HC908QB8
MC68HC908QB8
256 BYTES
8192 BYTES
USER RAM
USER FLASH
10-CHANNEL
10-BIT ADC
ENHANCED SERIAL
COMMUNICATIONS
INTERFACE MODULE
VDD
POWER SUPPLY
COP
MODULE
VSS
SERIAL PERIPHERAL
INTERFACE
DEVELOPMENT SUPPORT
MONITOR ROM
BREAK MODULE
RST, IRQ: Pins have internal pull up device
All port pins have programmable pull up device
PTA[0:5]: Higher current sink and source capability
Figure 15-1. Block Diagram Highlighting SPI Block and Pins
MC68HC908QB8 Data Sheet, Rev. 3
156
Freescale Semiconductor
Functional Description
15.3 Functional Description
The SPI module allows full-duplex, synchronous, serial communication between the MCU and peripheral
devices, including other MCUs. Software can poll the SPI status flags or SPI operation can be interrupt
driven.
The following paragraphs describe the operation of the SPI module.
INTERNAL BUS
TRANSMIT DATA REGISTER
SHIFT REGISTER
BUSCLK
7
6
5
4
3
2
1
MISO
0
÷2
MOSI
÷8
CLOCK
DIVIDER
RECEIVE DATA REGISTER
÷ 32
PIN
CONTROL
LOGIC
÷ 128
SPMSTR
SPE
CLOCK
SELECT
SPR1
SPSCK
M
CLOCK
LOGIC
S
SPR0
SPMSTR
CPHA
MODFEN
TRANSMITTER INTERRUPT REQUEST
RECEIVER/ERROR INTERRUPT REQUEST
SS
CPOL
SPWOM
ERRIE
SPI
CONTROL
SPTIE
SPRIE
SPE
SPRF
SPTE
OVRF
MODF
Figure 15-2. SPI Module Block Diagram
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
157
Serial Peripheral Interface (SPI) Module
15.3.1 Master Mode
The SPI operates in master mode when the SPI master bit, SPMSTR, is set.
NOTE
In a multi-SPI system, configure the SPI modules as master or slave before
enabling them. Enable the master SPI before enabling the slave SPI.
Disable the slave SPI before disabling the master SPI. See 15.8.1 SPI
Control Register.
Only a master SPI module can initiate transmissions. Software begins the transmission from a master SPI
module by writing to the transmit data register. If the shift register is empty, the byte immediately transfers
to the shift register, setting the SPI transmitter empty bit, SPTE. The byte begins shifting out on the MOSI
pin under the control of the serial clock. See Figure 15-3.
MASTER MCU
SHIFT REGISTER
SLAVE MCU
MISO
MISO
MOSI
MOSI
SPSCK
BAUD RATE
GENERATOR
SS
SHIFT REGISTER
SPSCK
VDD
SS
Figure 15-3. Full-Duplex Master-Slave Connections
The SPR1 and SPR0 bits control the baud rate generator and determine the speed of the shift register.
(See 15.8.2 SPI Status and Control Register.) Through the SPSCK pin, the baud rate generator of the
master also controls the shift register of the slave peripheral.
While the byte shifts out on the MOSI pin of the master, another byte shifts in from the slave on the
master’s MISO pin. The transmission ends when the receiver full bit, SPRF, becomes set. At the same
time that SPRF becomes set, the byte from the slave transfers to the receive data register. In normal
operation, SPRF signals the end of a transmission. Software clears SPRF by reading the SPI status and
control register (SPSCR) with SPRF set and then reading the SPI data register (SPDR). Writing to SPDR
clears SPTE.
15.3.2 Slave Mode
The SPI operates in slave mode when SPMSTR is clear. In slave mode, the SPSCK pin is the input for
the serial clock from the master MCU. Before a data transmission occurs, the SS pin of the slave SPI must
be low. SS must remain low until the transmission is complete. See 15.3.6.2 Mode Fault Error.
In a slave SPI module, data enters the shift register under the control of the serial clock from the master
SPI module. After a byte enters the shift register of a slave SPI, it transfers to the receive data register,
and the SPRF bit is set. To prevent an overflow condition, slave software then must read the receive data
register before another full byte enters the shift register.
The maximum frequency of the SPSCK for an SPI configured as a slave is the bus clock speed (which is
twice as fast as the fastest master SPSCK clock that can be generated). The frequency of the SPSCK for
an SPI configured as a slave does not have to correspond to any SPI baud rate. The baud rate only
MC68HC908QB8 Data Sheet, Rev. 3
158
Freescale Semiconductor
Functional Description
controls the speed of the SPSCK generated by an SPI configured as a master. Therefore, the frequency
of the SPSCK for an SPI configured as a slave can be any frequency less than or equal to the bus speed.
When the master SPI starts a transmission, the data in the slave shift register begins shifting out on the
MISO pin. The slave can load its shift register with a new byte for the next transmission by writing to its
transmit data register. The slave must write to its transmit data register at least one bus cycle before the
master starts the next transmission. Otherwise, the byte already in the slave shift register shifts out on the
MISO pin. Data written to the slave shift register during a transmission remains in a buffer until the end of
the transmission.
When the clock phase bit (CPHA) is set, the first edge of SPSCK starts a transmission. When CPHA is
clear, the falling edge of SS starts a transmission. See 15.3.3 Transmission Formats.
NOTE
SPSCK must be in the proper idle state before the slave is enabled to
prevent SPSCK from appearing as a clock edge.
15.3.3 Transmission Formats
During an SPI transmission, data is simultaneously transmitted (shifted out serially) and received (shifted
in serially). A serial clock synchronizes shifting and sampling on the two serial data lines. A slave select
line allows selection of an individual slave SPI device; slave devices that are not selected do not interfere
with SPI bus activities. On a master SPI device, the slave select line can optionally be used to indicate
multiple-master bus contention.
15.3.3.1 Clock Phase and Polarity Controls
Software can select any of four combinations of serial clock (SPSCK) phase and polarity using two bits
in the SPI control register (SPCR). The clock polarity is specified by the CPOL control bit, which selects
an active high or low clock and has no significant effect on the transmission format.
The clock phase (CPHA) control bit selects one of two fundamentally different transmission formats. The
clock phase and polarity should be identical for the master SPI device and the communicating slave
device. In some cases, the phase and polarity are changed between transmissions to allow a master
device to communicate with peripheral slaves having different requirements.
NOTE
Before writing to the CPOL bit or the CPHA bit, disable the SPI by clearing
the SPI enable bit (SPE).
15.3.3.2 Transmission Format When CPHA = 0
Figure 15-4 shows an SPI transmission in which CPHA = 0. The figure should not be used as a
replacement for data sheet parametric information.
When CPHA = 0 for a slave, the falling edge of SS indicates the beginning of the transmission. This
causes the SPI to leave its idle state and begin driving the MISO pin with the MSB of its data. After the
transmission begins, no new data is allowed into the shift register from the transmit data register.
Therefore, the SPI data register of the slave must be loaded with transmit data before the falling edge of
SS. Any data written after the falling edge is stored in the transmit data register and transferred to the shift
register after the current transmission.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
159
Serial Peripheral Interface (SPI) Module
SPSCK CYCLE #
FOR REFERENCE
1
2
3
4
5
6
7
8
MSB
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
LSB
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
LSB
SPSCK; CPOL = 0
SPSCK; CPOL =1
MOSI
FROM MASTER
MISO
FROM SLAVE
MSB
SS; TO SLAVE
CAPTURE STROBE
Figure 15-4. Transmission Format (CPHA = 0)
Two waveforms are shown for SPSCK: one for CPOL = 0 and another for CPOL = 1. The diagram may
be interpreted as a master or slave timing diagram because the serial clock (SPSCK), master in/slave out
(MISO), and master out/slave in (MOSI) pins are directly connected between the master and the slave.
The MISO signal is the output from the slave, and the MOSI signal is the output from the master. The SS
line is the slave select input to the slave. The slave SPI drives its MISO output only when its slave select
input (SS) is low, so that only the selected slave drives to the master. The SS pin of the master is not
shown but is assumed to be inactive. The SS pin of the master must be high or must be reconfigured as
general-purpose I/O not affecting the SPI. (See 15.3.6.2 Mode Fault Error.) When CPHA = 0, the first
SPSCK edge is the MSB capture strobe. Therefore, the slave must begin driving its data before the first
SPSCK edge, and a falling edge on the SS pin is used to start the slave data transmission. The slave’s
SS pin must be toggled back to high and then low again between each byte transmitted as shown in
Figure 15-5.
MISO/MOSI
BYTE 1
BYTE 2
BYTE 3
MASTER SS
SLAVE SS
CPHA = 0
SLAVE SS
CPHA = 1
Figure 15-5. CPHA/SS Timing
15.3.3.3 Transmission Format When CPHA = 1
Figure 15-6 shows an SPI transmission in which CPHA = 1. The figure should not be used as a
replacement for data sheet parametric information. Two waveforms are shown for SPSCK: one for
CPOL = 0 and another for CPOL = 1. The diagram may be interpreted as a master or slave timing
diagram because the serial clock (SPSCK), master in/slave out (MISO), and master out/slave in (MOSI)
pins are directly connected between the master and the slave. The MISO signal is the output from the
slave, and the MOSI signal is the output from the master. The SS line is the slave select input to the slave.
The slave SPI drives its MISO output only when its slave select input (SS) is low, so that only the selected
slave drives to the master. The SS pin of the master is not shown but is assumed to be inactive. The SS
pin of the master must be high or must be reconfigured as general-purpose I/O not affecting the SPI. (See
15.3.6.2 Mode Fault Error.) When CPHA = 1, the master begins driving its MOSI pin on the first SPSCK
edge. Therefore, the slave uses the first SPSCK edge as a start transmission signal. The SS pin can
MC68HC908QB8 Data Sheet, Rev. 3
160
Freescale Semiconductor
Functional Description
remain low between transmissions. This format may be preferable in systems having only one master and
only one slave driving the MISO data line.
SPSCK CYCLE #
FOR REFERENCE
1
2
3
4
5
6
7
8
MOSI
FROM MASTER
MSB
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
LSB
MISO
FROM SLAVE
MSB
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
SPSCK; CPOL = 0
SPSCK; CPOL =1
LSB
SS; TO SLAVE
CAPTURE STROBE
Figure 15-6. Transmission Format (CPHA = 1)
When CPHA = 1 for a slave, the first edge of the SPSCK indicates the beginning of the transmission. This
causes the SPI to leave its idle state and begin driving the MISO pin with the MSB of its data. After the
transmission begins, no new data is allowed into the shift register from the transmit data register.
Therefore, the SPI data register of the slave must be loaded with transmit data before the first edge of
SPSCK. Any data written after the first edge is stored in the transmit data register and transferred to the
shift register after the current transmission.
15.3.3.4 Transmission Initiation Latency
When the SPI is configured as a master (SPMSTR = 1), writing to the SPDR starts a transmission. CPHA
has no effect on the delay to the start of the transmission, but it does affect the initial state of the SPSCK
signal. When CPHA = 0, the SPSCK signal remains inactive for the first half of the first SPSCK cycle.
When CPHA = 1, the first SPSCK cycle begins with an edge on the SPSCK line from its inactive to its
active level. The SPI clock rate (selected by SPR1:SPR0) affects the delay from the write to SPDR and
the start of the SPI transmission. (See Figure 15-7.) The internal SPI clock in the master is a free-running
derivative of the internal MCU clock. To conserve power, it is enabled only when both the SPE and
SPMSTR bits are set. Because the SPI clock is free-running, it is uncertain where the write to the SPDR
occurs relative to the slower SPSCK. This uncertainty causes the variation in the initiation delay shown
in Figure 15-7. This delay is no longer than a single SPI bit time. That is, the maximum delay is two MCU
bus cycles for DIV2, eight MCU bus cycles for DIV8, 32 MCU bus cycles for DIV32, and 128 MCU bus
cycles for DIV128.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
161
Serial Peripheral Interface (SPI) Module
WRITE
TO SPDR
INITIATION DELAY
BUS
CLOCK
MOSI
MSB
BIT 6
BIT 5
SPSCK
CPHA = 1
SPSCK
CPHA = 0
SPSCK CYCLE
NUMBER
1
3
2
INITIATION DELAY FROM WRITE SPDR TO TRANSFER BEGIN
WRITE
TO SPDR
BUS
CLOCK
EARLIEST
BUS
CLOCK
LATEST
WRITE
TO SPDR
EARLIEST
BUS
CLOCK
WRITE
TO SPDR
EARLIEST
BUS
CLOCK
WRITE
TO SPDR
EARLIEST
SPSCK = BUS CLOCK ÷ 2;
2 POSSIBLE START POINTS
SPSCK = BUS CLOCK ÷ 8;
8 POSSIBLE START POINTS
LATEST
SPSCK = BUS CLOCK ÷ 32;
32 POSSIBLE START POINTS
LATEST
SPSCK = BUS CLOCK ÷ 128;
128 POSSIBLE START POINTS
LATEST
Figure 15-7. Transmission Start Delay (Master)
MC68HC908QB8 Data Sheet, Rev. 3
162
Freescale Semiconductor
Functional Description
15.3.4 Queuing Transmission Data
The double-buffered transmit data register allows a data byte to be queued and transmitted. For an SPI
configured as a master, a queued data byte is transmitted immediately after the previous transmission
has completed. The SPI transmitter empty flag (SPTE) indicates when the transmit data buffer is ready
to accept new data. Write to the transmit data register only when the SPTE bit is high. Figure 15-8
shows the timing associated with doing back-to-back transmissions with the SPI (SPSCK has
CPHA: CPOL = 1:0).
WRITE TO SPDR
SPTE
1
3
2
8
5
10
SPSCK
CPHA:CPOL = 1:0
MOSI
MSB BIT BIT BIT BIT BIT BIT LSB MSB BIT BIT BIT BIT BIT BIT LSB MSB BIT BIT BIT
6 5 4
6 5 4 3 2 1
6 5 4 3 2 1
BYTE 1
BYTE 2
BYTE 3
4
SPRF
9
6
READ SPSCR
11
7
READ SPDR
12
1 WRITE BYTE 1 TO SPDR, CLEARING SPTE BIT.
7 READ SPDR, CLEARING SPRF BIT.
2 BYTE 1 TRANSFERS FROM TRANSMIT DATA
REGISTER TO SHIFT REGISTER, SETTING SPTE BIT.
8 WRITE BYTE 3 TO SPDR, QUEUEING BYTE
3 AND CLEARING SPTE BIT.
9 SECOND INCOMING BYTE TRANSFERS FROM SHIFT
REGISTER TO RECEIVE DATA REGISTER, SETTING
SPRF BIT.
10 BYTE 3 TRANSFERS FROM TRANSMIT DATA
REGISTER TO SHIFT REGISTER, SETTING SPTE BIT.
11 READ SPSCR WITH SPRF BIT SET.
3 WRITE BYTE 2 TO SPDR, QUEUEING BYTE 2
AND CLEARING SPTE BIT.
FIRST INCOMING BYTE TRANSFERS FROM SHIFT
REGISTER TO RECEIVE DATA REGISTER, SETTING
SPRF BIT.
5 BYTE 2 TRANSFERS FROM TRANSMIT DATA
REGISTER TO SHIFT REGISTER, SETTING SPTE BIT.
6 READ SPSCR WITH SPRF BIT SET.
4
12 READ SPDR, CLEARING SPRF BIT.
Figure 15-8. SPRF/SPTE interrupt Timing
The transmit data buffer allows back-to-back transmissions without the slave precisely timing its writes
between transmissions as in a system with a single data buffer. Also, if no new data is written to the data
buffer, the last value contained in the shift register is the next data word to be transmitted.
For an idle master or idle slave that has no data loaded into its transmit buffer, the SPTE is set again no
more than two bus cycles after the transmit buffer empties into the shift register. This allows the user to
queue up a 16-bit value to send. For an already active slave, the load of the shift register cannot occur
until the transmission is completed. This implies that a back-to-back write to the transmit data register is
not possible. SPTE indicates when the next write can occur.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
163
Serial Peripheral Interface (SPI) Module
15.3.5 Resetting the SPI
Any system reset completely resets the SPI. Partial resets occur whenever the SPI enable bit (SPE) is 0.
Whenever SPE is 0, the following occurs:
• The SPTE flag is set.
• Any transmission currently in progress is aborted.
• The shift register is cleared.
• The SPI state counter is cleared, making it ready for a new complete transmission.
• All the SPI pins revert back to being general-purpose I/O.
These items are reset only by a system reset:
• All control bits in the SPCR register
• All control bits in the SPSCR register (MODFEN, ERRIE, SPR1, and SPR0)
• The status flags SPRF, OVRF, and MODF
By not resetting the control bits when SPE is low, the user can clear SPE between transmissions without
having to set all control bits again when SPE is set high for the next transmission.
By not resetting the SPRF, OVRF, and MODF flags, the user can still service these interrupts after the
SPI has been disabled. The user can disable the SPI by writing 0 to the SPE bit. The SPI can also be
disabled by a mode fault occurring in an SPI that was configured as a master with the MODFEN bit set.
15.3.6 Error Conditions
The following flags signal SPI error conditions:
• Overflow (OVRF) — Failing to read the SPI data register before the next full byte enters the shift
register sets the OVRF bit. The new byte does not transfer to the receive data register, and the
unread byte still can be read. OVRF is in the SPI status and control register.
• Mode fault error (MODF) — The MODF bit indicates that the voltage on the slave select pin (SS)
is inconsistent with the mode of the SPI. MODF is in the SPI status and control register.
15.3.6.1 Overflow Error
The overflow flag (OVRF) becomes set if the receive data register still has unread data from a previous
transmission when the capture strobe of bit 1 of the next transmission occurs. The bit 1 capture strobe
occurs in the middle of SPSCK cycle 7 (see Figure 15-4 and Figure 15-6.) If an overflow occurs, all data
received after the overflow and before the OVRF bit is cleared does not transfer to the receive data
register and does not set the SPI receiver full bit (SPRF). The unread data that transferred to the receive
data register before the overflow occurred can still be read. Therefore, an overflow error always indicates
the loss of data. Clear the overflow flag by reading the SPI status and control register and then reading
the SPI data register.
OVRF generates a receiver/error interrupt request if the error interrupt enable bit (ERRIE) is also set. The
SPRF, MODF, and OVRF interrupts share the same interrupt vector (see Figure 15-11.) It is not possible
to enable MODF or OVRF individually to generate a receiver/error interrupt request. However, leaving
MODFEN low prevents MODF from being set.
If the SPRF interrupt is enabled and the OVRF interrupt is not, watch for an overflow condition.
Figure 15-9 shows how it is possible to miss an overflow. The first part of Figure 15-9 shows how it is
possible to read the SPSCR and SPDR to clear the SPRF without problems. However, as illustrated by
the second transmission example, the OVRF bit can be set in between the time that SPSCR and SPDR
are read.
MC68HC908QB8 Data Sheet, Rev. 3
164
Freescale Semiconductor
Functional Description
In this case, an overflow can be missed easily. Because no more SPRF interrupts can be generated until
this OVRF is serviced, it is not obvious that bytes are being lost as more transmissions are completed. To
prevent this, either enable the OVRF interrupt or do another read of the SPSCR following the read of the
SPDR. This ensures that the OVRF was not set before the SPRF was cleared and that future
transmissions can set the SPRF bit. Figure 15-10 illustrates this process. Generally, to avoid this second
SPSCR read, enable OVRF by setting the ERRIE bit.
BYTE 1
BYTE 2
BYTE 3
BYTE 4
1
4
6
8
SPRF
OVRF
READ
SPSCR
2
5
READ
SPDR
3
7
1
BYTE 1 SETS SPRF BIT.
2
READ SPSCR WITH SPRF BIT SET
AND OVRF BIT CLEAR.
READ BYTE 1 IN SPDR,
CLEARING SPRF BIT.
BYTE 2 SETS SPRF BIT.
3
4
5
READ SPSCR WITH SPRF BIT SET
AND OVRF BIT CLEAR.
6
BYTE 3 SETS OVRF BIT. BYTE 3 IS LOST.
7
READ BYTE 2 IN SPDR, CLEARING SPRF BIT,
BUT NOT OVRF BIT.
8
BYTE 4 FAILS TO SET SPRF BIT BECAUSE
OVRF BIT IS NOT CLEARED. BYTE 4 IS LOST.
Figure 15-9. Missed Read of Overflow Condition
BYTE 1
SPI RECEIVE
COMPLETE
BYTE 2
5
1
BYTE 3
7
BYTE 4
11
SPRF
OVRF
READ
SPSCR
2
READ
SPDR
4
6
3
9
8
12
10
14
13
1
BYTE 1 SETS SPRF BIT.
5
BYTE 2 SETS SPRF BIT.
2
READ SPSCR WITH SPRF BIT SET
AND OVRF BIT CLEAR.
READ BYTE 1 IN SPDR,
CLEARING SPRF BIT.
6
READ SPSCR WITH SPRF BIT SET
AND OVRF BIT CLEAR.
7
BYTE 3 SETS OVRF BIT. BYTE 3 IS LOST.
12 READ SPSCR.
8
READ BYTE 2 IN SPDR,
CLEARING SPRF BIT.
13 READ BYTE 4 IN SPDR,
CLEARING SPRF BIT.
9
READ SPSCR AGAIN
TO CHECK OVRF BIT.
14 READ SPSCR AGAIN
TO CHECK OVRF BIT.
3
4
READ SPSCR AGAIN
TO CHECK OVRF BIT.
10 READ BYTE 2 SPDR,
CLEARING OVRF BIT.
11 BYTE 4 SETS SPRF BIT.
Figure 15-10. Clearing SPRF When OVRF Interrupt Is Not Enabled
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
165
Serial Peripheral Interface (SPI) Module
15.3.6.2 Mode Fault Error
Setting SPMSTR selects master mode and configures the SPSCK and MOSI pins as outputs and the
MISO pin as an input. Clearing SPMSTR selects slave mode and configures the SPSCK and MOSI pins
as inputs and the MISO pin as an output. The mode fault bit, MODF, becomes set any time the state of
the slave select pin, SS, is inconsistent with the mode selected by SPMSTR.
To prevent SPI pin contention and damage to the MCU, a mode fault error occurs if:
• The SS pin of a slave SPI goes high during a transmission
• The SS pin of a master SPI goes low at any time
For the MODF flag to be set, the mode fault error enable bit (MODFEN) must be set. Clearing the
MODFEN bit does not clear the MODF flag but does prevent MODF from being set again after MODF is
cleared.
MODF generates a receiver/error interrupt request if the error interrupt enable bit (ERRIE) is also set. The
SPRF, MODF, and OVRF interrupts share the same interrupt vector. (See Figure 15-11.) It is not possible
to enable MODF or OVRF individually to generate a receiver/error interrupt request. However, leaving
MODFEN low prevents MODF from being set.
In a master SPI with the mode fault enable bit (MODFEN) set, the mode fault flag (MODF) is set if SS
goes low. A mode fault in a master SPI causes the following events to occur:
• If ERRIE = 1, the SPI generates an SPI receiver/error interrupt request.
• The SPE bit is cleared.
• The SPTE bit is set.
• The SPI state counter is cleared.
• The data direction register of the shared I/O port regains control of port drivers.
NOTE
To prevent bus contention with another master SPI after a mode fault error,
clear all SPI bits of the data direction register of the shared I/O port before
enabling the SPI.
When configured as a slave (SPMSTR = 0), the MODF flag is set if SS goes high during a transmission.
When CPHA = 0, a transmission begins when SS goes low and ends after the incoming SPSCK goes to
its idle level following the shift of the eighth data bit. When CPHA = 1, the transmission begins when the
SPSCK leaves its idle level and SS is already low. The transmission continues until the SPSCK returns
to its idle level following the shift of the last data bit. See
15.3.3 Transmission Formats.
NOTE
Setting the MODF flag does not clear the SPMSTR bit. SPMSTR has no
function when SPE = 0. Reading SPMSTR when MODF = 1 shows the
difference between a MODF occurring when the SPI is a master and when
it is a slave.
When CPHA = 0, a MODF occurs if a slave is selected (SS is low) and later
unselected (SS is high) even if no SPSCK is sent to that slave. This
happens because SS low indicates the start of the transmission (MISO
driven out with the value of MSB) for CPHA = 0. When CPHA = 1, a slave
can be selected and then later unselected with no transmission occurring.
Therefore, MODF does not occur because a transmission was never
begun.
MC68HC908QB8 Data Sheet, Rev. 3
166
Freescale Semiconductor
Interrupts
In a slave SPI (MSTR = 0), MODF generates an SPI receiver/error interrupt request if the ERRIE bit is
set. The MODF bit does not clear the SPE bit or reset the SPI in any way. Software can abort the SPI
transmission by clearing the SPE bit of the slave.
NOTE
A high on the SS pin of a slave SPI puts the MISO pin in a high impedance
state. Also, the slave SPI ignores all incoming SPSCK clocks, even if it was
already in the middle of a transmission.
To clear the MODF flag, read the SPSCR with the MODF bit set and then write to the SPCR register. This
entire clearing mechanism must occur with no MODF condition existing or else the flag is not cleared.
15.4 Interrupts
Four SPI status flags can be enabled to generate interrupt requests. See Table 15-1.
Table 15-1. SPI Interrupts
Flag
Request
SPTE
Transmitter empty
SPI transmitter interrupt request
(SPTIE = 1, SPE = 1)
SPRF
Receiver full
SPI receiver interrupt request
(SPRIE = 1)
OVRF
Overflow
SPI receiver/error interrupt request
(ERRIE = 1)
MODF
Mode fault
SPI receiver/error interrupt request
(ERRIE = 1)
Reading the SPI status and control register with SPRF set and then reading the receive data register
clears SPRF. The clearing mechanism for the SPTE flag is requires only a write to the transmit data
register.
The SPI transmitter interrupt enable bit (SPTIE) enables the SPTE flag to generate transmitter interrupt
requests, provided that the SPI is enabled (SPE = 1).
The SPI receiver interrupt enable bit (SPRIE) enables SPRF to generate receiver interrupt requests,
regardless of the state of SPE. See Figure 15-11.
SPTE
SPTIE
SPE
SPI TRANSMITTER
INTERRUPT REQUEST
SPRIE
SPRF
SPI RECEIVER/ERROR
ERRIE
INTERRUPT REQUEST
MODF
OVRF
Figure 15-11. SPI Interrupt Request Generation
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
167
Serial Peripheral Interface (SPI) Module
The error interrupt enable bit (ERRIE) enables both the MODF and OVRF bits to generate a receiver/error
interrupt request.
The mode fault enable bit (MODFEN) can prevent the MODF flag from being set so that only the OVRF
bit is enabled by the ERRIE bit to generate receiver/error interrupt requests.
The following sources in the SPI status and control register can generate interrupt requests:
• SPI receiver full bit (SPRF) — SPRF becomes set every time a byte transfers from the shift register
to the receive data register. If the SPI receiver interrupt enable bit, SPRIE, is also set, SPRF
generates an SPI receiver/error interrupt request.
• SPI transmitter empty bit (SPTE) — SPTE becomes set every time a byte transfers from the
transmit data register to the shift register. If the SPI transmit interrupt enable bit, SPTIE, is also set,
SPTE generates an SPTE interrupt request.
15.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
15.5.1 Wait Mode
The SPI module remains active after the execution of a WAIT instruction. In wait mode the SPI module
registers are not accessible by the CPU. Any enabled interrupt request from the SPI module can bring the
MCU out of wait mode.
If SPI module functions are not required during wait mode, reduce power consumption by disabling the
SPI module before executing the WAIT instruction.
To exit wait mode when an overflow condition occurs, enable the OVRF bit to generate interrupt requests
by setting the error interrupt enable bit (ERRIE). See 15.4 Interrupts.
15.5.2 Stop Mode
The SPI module is inactive after the execution of a STOP instruction. The STOP instruction does not
affect register conditions. SPI operation resumes after an external interrupt. If stop mode is exited by
reset, any transfer in progress is aborted, and the SPI is reset.
15.6 SPI During Break Interrupts
The system integration module (SIM) controls whether status bits in other modules can be cleared during
the break state. The BCFE bit in the break flag control register (BFCR) enables software to clear status
bits during the break state. See BFCR in the SIM section of this data sheet.
To allow software to clear status bits during a break interrupt, write a 1 to BCFE. If a status bit is cleared
during the break state, it remains cleared when the MCU exits the break state.
To protect status bits during the break state, write a 0 to BCFE. With BCFE cleared (its default state),
software can read and write registers during the break state without affecting status bits. Some status bits
have a two-step read/write clearing procedure. If software does the first step on such a bit before the
break, the bit cannot change during the break state as long as BCFE is cleared. After the break, doing the
second step clears the status bit.
MC68HC908QB8 Data Sheet, Rev. 3
168
Freescale Semiconductor
I/O Signals
15.7 I/O Signals
The SPI module can share its pins with the general-purpose I/O pins. See Figure 15-1 for the port pins
that are shared.
The SPI module has four I/O pins:
• MISO — Master input/slave output
• MOSI — Master output/slave input
• SPSCK — Serial clock
• SS — Slave select
15.7.1 MISO (Master In/Slave Out)
MISO is one of the two SPI module pins that transmits serial data. In full duplex operation, the MISO pin
of the master SPI module is connected to the MISO pin of the slave SPI module. The master SPI
simultaneously receives data on its MISO pin and transmits data from its MOSI pin.
Slave output data on the MISO pin is enabled only when the SPI is configured as a slave. The SPI is
configured as a slave when its SPMSTR bit is 0 and its SS pin is low. To support a multiple-slave system,
a high on the SS pin puts the MISO pin in a high-impedance state.
When enabled, the SPI controls data direction of the MISO pin regardless of the state of the data direction
register of the shared I/O port.
15.7.2 MOSI (Master Out/Slave In)
MOSI is one of the two SPI module pins that transmits serial data. In full-duplex operation, the MOSI pin
of the master SPI module is connected to the MOSI pin of the slave SPI module. The master SPI
simultaneously transmits data from its MOSI pin and receives data on its MISO pin.
When enabled, the SPI controls data direction of the MOSI pin regardless of the state of the data direction
register of the shared I/O port.
15.7.3 SPSCK (Serial Clock)
The serial clock synchronizes data transmission between master and slave devices. In a master MCU,
the SPSCK pin is the clock output. In a slave MCU, the SPSCK pin is the clock input. In full-duplex
operation, the master and slave MCUs exchange a byte of data in eight serial clock cycles.
When enabled, the SPI controls data direction of the SPSCK pin regardless of the state of the data
direction register of the shared I/O port.
15.7.4 SS (Slave Select)
The SS pin has various functions depending on the current state of the SPI. For an SPI configured as a
slave, SS is used to select a slave. For CPHA = 0, the SS is used to define the start of a transmission.
(See 15.3.3 Transmission Formats.) Because it is used to indicate the start of a transmission, SS must
be toggled high and low between each byte transmitted for the CPHA = 0 format. However, it can remain
low between transmissions for the CPHA = 1 format. See Figure 15-12.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
169
Serial Peripheral Interface (SPI) Module
MISO/MOSI
BYTE 1
BYTE 2
BYTE 3
MASTER SS
SLAVE SS
CPHA = 0
SLAVE SS
CPHA = 1
Figure 15-12. CPHA/SS Timing
When an SPI is configured as a slave, the SS pin is always configured as an input. It cannot be used as
a general-purpose I/O regardless of the state of the MODFEN control bit. However, the MODFEN bit can
still prevent the state of SS from creating a MODF error. See 15.8.2 SPI Status and Control Register.
NOTE
A high on the SS pin of a slave SPI puts the MISO pin in a high-impedance
state. The slave SPI ignores all incoming SPSCK clocks, even if it was
already in the middle of a transmission.
When an SPI is configured as a master, the SS input can be used in conjunction with the MODF flag to
prevent multiple masters from driving MOSI and SPSCK. (See 15.3.6.2 Mode Fault Error.) For the state
of the SS pin to set the MODF flag, the MODFEN bit in the SPSCK register must be set. If the MODFEN
bit is 0 for an SPI master, the SS pin can be used as a general-purpose I/O under the control of the data
direction register of the shared I/O port. When MODFEN is 1, it is an input-only pin to the SPI regardless
of the state of the data direction register of the shared I/O port.
User software can read the state of the SS pin by configuring the appropriate pin as an input and reading
the port data register. See Table 15-2.
Table 15-2. SPI Configuration
SPE
SPMSTR
MODFEN
SPI Configuration
Function of SS Pin
0
X(1)
X
Not enabled
General-purpose I/O;
SS ignored by SPI
1
0
X
Slave
Input-only to SPI
1
1
0
Master without MODF
General-purpose I/O;
SS ignored by SPI
1
1
1
Master with MODF
Input-only to SPI
1. X = Don’t care
15.8 Registers
The following registers allow the user to control and monitor SPI operation:
• SPI control register (SPCR)
• SPI status and control register (SPSCR)
• SPI data register (SPDR)
MC68HC908QB8 Data Sheet, Rev. 3
170
Freescale Semiconductor
Registers
15.8.1 SPI Control Register
The SPI control register:
• Enables SPI module interrupt requests
• Configures the SPI module as master or slave
• Selects serial clock polarity and phase
• Configures the SPSCK, MOSI, and MISO pins as open-drain outputs
• Enables the SPI module
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
SPRIE
R
SPMSTR
CPOL
CPHA
SPWOM
SPE
SPTIE
0
0
1
0
1
0
0
0
R
= Reserved
Figure 15-13. SPI Control Register (SPCR)
SPRIE — SPI Receiver Interrupt Enable Bit
This read/write bit enables interrupt requests generated by the SPRF bit. The SPRF bit is set when a
byte transfers from the shift register to the receive data register.
1 = SPRF interrupt requests enabled
0 = SPRF interrupt requests disabled
SPMSTR — SPI Master Bit
This read/write bit selects master mode operation or slave mode operation.
1 = Master mode
0 = Slave mode
CPOL — Clock Polarity Bit
This read/write bit determines the logic state of the SPSCK pin between transmissions. (See
Figure 15-4 and Figure 15-6.) To transmit data between SPI modules, the SPI modules must have
identical CPOL values.
CPHA — Clock Phase Bit
This read/write bit controls the timing relationship between the serial clock and SPI data. (See
Figure 15-4 and Figure 15-6.) To transmit data between SPI modules, the SPI modules must have
identical CPHA values. When CPHA = 0, the SS pin of the slave SPI module must be high between
bytes. (See Figure 15-12.)
SPWOM — SPI Wired-OR Mode Bit
This read/write bit configures pins SPSCK, MOSI, and MISO so that these pins become open-drain
outputs.
1 = Wired-OR SPSCK, MOSI, and MISO pins
0 = Normal push-pull SPSCK, MOSI, and MISO pins
SPE — SPI Enable
This read/write bit enables the SPI module. Clearing SPE causes a partial reset of the SPI. (See 15.3.5
Resetting the SPI.)
1 = SPI module enabled
0 = SPI module disabled
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
171
Serial Peripheral Interface (SPI) Module
SPTIE— SPI Transmit Interrupt Enable
This read/write bit enables interrupt requests generated by the SPTE bit. SPTE is set when a byte
transfers from the transmit data register to the shift register.
1 = SPTE interrupt requests enabled
0 = SPTE interrupt requests disabled
15.8.2 SPI Status and Control Register
The SPI status and control register contains flags to signal these conditions:
• Receive data register full
• Failure to clear SPRF bit before next byte is received (overflow error)
• Inconsistent logic level on SS pin (mode fault error)
• Transmit data register empty
The SPI status and control register also contains bits that perform these functions:
• Enable error interrupts
• Enable mode fault error detection
• Select master SPI baud rate
Bit 7
Read:
SPRF
Write:
Reset:
0
6
ERRIE
0
5
4
3
OVRF
MODF
SPTE
0
0
1
2
1
Bit 0
MODFEN
SPR1
SPR0
0
0
0
= Unimplemented
Figure 15-14. SPI Status and Control Register (SPSCR)
SPRF — SPI Receiver Full Bit
This clearable, read-only flag is set each time a byte transfers from the shift register to the receive data
register. SPRF generates a interrupt request if the SPRIE bit in the SPI control register is set also.
During an SPRF interrupt, user software can clear SPRF by reading the SPI status and control register
with SPRF set followed by a read of the SPI data register.
1 = Receive data register full
0 = Receive data register not full
ERRIE — Error Interrupt Enable Bit
This read/write bit enables the MODF and OVRF bits to generate interrupt requests.
1 = MODF and OVRF can generate interrupt requests
0 = MODF and OVRF cannot generate interrupt requests
OVRF — Overflow Bit
This clearable, read-only flag is set if software does not read the byte in the receive data register before
the next full byte enters the shift register. In an overflow condition, the byte already in the receive data
register is unaffected, and the byte that shifted in last is lost. Clear the OVRF bit by reading the SPI
status and control register with OVRF set and then reading the receive data register.
1 = Overflow
0 = No overflow
MC68HC908QB8 Data Sheet, Rev. 3
172
Freescale Semiconductor
Registers
MODF — Mode Fault Bit
This clearable, read-only flag is set in a slave SPI if the SS pin goes high during a transmission with
MODFEN set. In a master SPI, the MODF flag is set if the SS pin goes low at any time with the
MODFEN bit set. Clear MODF by reading the SPI status and control register (SPSCR) with MODF set
and then writing to the SPI control register (SPCR).
1 = SS pin at inappropriate logic level
0 = SS pin at appropriate logic level
SPTE — SPI Transmitter Empty Bit
This clearable, read-only flag is set each time the transmit data register transfers a byte into the shift
register. SPTE generates an SPTE interrupt request if the SPTIE bit in the SPI control register is also
set.
NOTE
Do not write to the SPI data register unless SPTE is high.
During an SPTE interrupt, user software can clear SPTE by writing to the transmit data register.
1 = Transmit data register empty
0 = Transmit data register not empty
MODFEN — Mode Fault Enable Bit
This read/write bit, when set, allows the MODF flag to be set. If the MODF flag is set, clearing MODFEN
does not clear the MODF flag. If the SPI is enabled as a master and the MODFEN bit is 0, then the SS
pin is available as a general-purpose I/O.
If the MODFEN bit is 1, then this pin is not available as a general-purpose I/O. When the SPI is enabled
as a slave, the SS pin is not available as a general-purpose I/O regardless of the value of MODFEN.
See 15.7.4 SS (Slave Select).
If the MODFEN bit is 0, the level of the SS pin does not affect the operation of an enabled SPI
configured as a master. For an enabled SPI configured as a slave, having MODFEN low only prevents
the MODF flag from being set. It does not affect any other part of SPI operation. See 15.3.6.2 Mode
Fault Error.
SPR1 and SPR0 — SPI Baud Rate Select Bits
In master mode, these read/write bits select one of four baud rates as shown in Table 15-3. SPR1 and
SPR0 have no effect in slave mode.
Table 15-3. SPI Master Baud Rate Selection
SPR1 and SPR0
Baud Rate Divisor (BD)
00
2
01
8
10
32
11
128
Use this formula to calculate the SPI baud rate:
Baud rate =
BUSCLK
BD
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
173
Serial Peripheral Interface (SPI) Module
15.8.3 SPI Data Register
The SPI data register consists of the read-only receive data register and the write-only transmit data
register. Writing to the SPI data register writes data into the transmit data register. Reading the SPI data
register reads data from the receive data register. The transmit data and receive data registers are
separate registers that can contain different values. See Figure 15-2.
Bit 7
6
5
4
3
2
1
Bit 0
Read:
R7
R6
R5
R4
R3
R2
R1
R0
Write:
T7
T6
T5
T4
T3
T2
T1
T0
Reset:
Unaffected by reset
Figure 15-15. SPI Data Register (SPDR)
R7–R0/T7–T0 — Receive/Transmit Data Bits
NOTE
Do not use read-modify-write instructions on the SPI data register because
the register read is not the same as the register written.
MC68HC908QB8 Data Sheet, Rev. 3
174
Freescale Semiconductor
Chapter 16
Timer Interface Module (TIM)
16.1 Introduction
This section describes the timer interface module (TIM). The TIM module is a 4-channel timer that
provides a timing reference with input capture, output compare, and pulse-width-modulation functions.
The TIM module shares its pins with general-purpose input/output (I/O) port pins. See Figure 16-1 for port
location of these shared pins.
16.2 Features
Features include the following:
• Four input capture/output compare channels
– Rising-edge, falling-edge, or any-edge input capture trigger
– Set, clear, or toggle output compare action
• Buffered and unbuffered output compare pulse-width modulation (PWM) signal generation
• Programmable clock input
– 7-frequency internal bus clock prescaler selection
– External clock input pin if available, See Figure 16-1
• Free-running or modulo up-count operation
• Toggle any channel pin on overflow
• Counter stop and reset bits
16.3 Functional Description
Figure 16-2 shows the structure of the TIM. The central component of the TIM is the 16-bit counter that
can operate as a free-running counter or a modulo up-counter. The counter provides the timing reference
for the input capture and output compare functions. The TIM counter modulo registers, TMODH:TMODL,
control the modulo value of the counter. Software can read the counter value, TCNTH:TCNTL, at any time
without affecting the counting sequence.
The four TIM channels are programmable independently as input capture or output compare channels.
16.3.1 TIM Counter Prescaler
The TIM clock source is one of the seven prescaler outputs or the external clock input pin, TCLK if
available. The prescaler generates seven clock rates from the internal bus clock. The prescaler select
bits, PS[2:0], in the TIM status and control register (TSC) select the clock source.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
175
Timer Interface Module (TIM)
PTA0/TCH0/AD0/KBI0
CLOCK
GENERATOR
PTA3/RST/KBI3
DDRA
PTA2/IRQ/KBI2/TCLK
PTA
PTA1/TCH1/AD1/KBI1
KEYBOARD INTERRUPT
MODULE
PTA4/OSC2/AD2/KBI4
PTA5/OSC1/AD3/KBI5
EXTERNAL INTERRUPT
MODULE
AUTO WAKEUP
MODULE
DDRB
PTB0/SCK/AD4
PTB1/MOSI/AD5
PTB2/MISO/AD6
PTB3/SS/AD7
PTB4/RxD/AD8
PTB5/TxD/AD9
PTB6/TCH2
PTB7/TCH3
PTB
M68HC08 CPU
LOW-VOLTAGE
INHIBIT
4-CHANNEL 16-BIT
TIMER MODULE
MC68HC908QB8
MC68HC908QB8
256 BYTES
8192 BYTES
USER RAM
USER FLASH
10-CHANNEL
10-BIT ADC
ENHANCED SERIAL
COMMUNICATIONS
INTERFACE MODULE
VDD
POWER SUPPLY
COP
MODULE
VSS
SERIAL PERIPHERAL
INTERFACE
DEVELOPMENT SUPPORT
MONITOR ROM
BREAK MODULE
RST, IRQ: Pins have internal pull up device
All port pins have programmable pull up device
PTA[0:5]: Higher current sink and source capability
Figure 16-1. Block Diagram Highlighting TIM Block and Pins
16.3.2 Input Capture
With the input capture function, the TIM can capture the time at which an external event occurs. When an
active edge occurs on the pin of an input capture channel, the TIM latches the contents of the counter into
the TIM channel registers, TCHxH:TCHxL. The polarity of the active edge is programmable. Input
captures can be enabled to generate interrupt requests.
MC68HC908QB8 Data Sheet, Rev. 3
176
Freescale Semiconductor
Functional Description
TCLK
TCLK
(IF AVAILABLE)
PRESCALER SELECT
INTERNAL
BUS CLOCK
PRESCALER
TSTOP
PS2
TRST
PS1
PS0
16-BIT COUNTER
TOF
TCNTH:TCNTL
TOIE
INTERRUPT
LOGIC
16-BIT COMPARATOR
TMODH:TMODL
CHANNEL 0
TOV0
ELS0B
ELS0A
CH0MAX
16-BIT COMPARATOR
TCH0H:TCH0L
PORT
LOGIC
TCH0
CH0F
16-BIT LATCH
CH0IE
MS0A
INTERRUPT
LOGIC
MS0B
INTERNAL BUS
TOV1
CHANNEL 1
ELS1B
ELS1A
CH1MAX
16-BIT COMPARATOR
TCH1H:TCH1L
PORT
LOGIC
TCH1
CH1F
16-BIT LATCH
CH1IE
MS1A
INTERRUPT
LOGIC
TOV2
CHANNEL 2
ELS2B
ELS2A
CH2MAX
16-BIT COMPARATOR
TCH2H:TCH2L
PORT
LOGIC
TCH2
CH2F
16-BIT LATCH
CH2IE
MS2A
INTERRUPT
LOGIC
MS2B
TOV3
CHANNEL 3
ELS3B
ELS3A
CH3MAX
16-BIT COMPARATOR
TCH3H:TCH3L
PORT
LOGIC
TCH3
CH3F
16-BIT LATCH
MS3A
CH3IE
INTERRUPT
LOGIC
Figure 16-2. TIM Block Diagram
16.3.3 Output Compare
With the output compare function, the TIM can generate a periodic pulse with a programmable polarity,
duration, and frequency. When the counter reaches the value in the registers of an output compare
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
177
Timer Interface Module (TIM)
channel, the TIM can set, clear, or toggle the channel pin. Output compares can be enabled to generate
interrupt requests.
16.3.3.1 Unbuffered Output Compare
Any output compare channel can generate unbuffered output compare pulses as described in 16.3.3
Output Compare. The pulses are unbuffered because changing the output compare value requires writing
the new value over the old value currently in the TIM channel registers.
An unsynchronized write to the TIM channel registers to change an output compare value could cause
incorrect operation for up to two counter overflow periods. For example, writing a new value before the
counter reaches the old value but after the counter reaches the new value prevents any compare during
that counter overflow period. Also, using a TIM overflow interrupt routine to write a new, smaller output
compare value may cause the compare to be missed. The TIM may pass the new value before it is written.
Use the following methods to synchronize unbuffered changes in the output compare value on channel x:
• When changing to a smaller value, enable channel x output compare interrupts and write the new
value in the output compare interrupt routine. The output compare interrupt occurs at the end of
the current output compare pulse. The interrupt routine has until the end of the counter overflow
period to write the new value.
• When changing to a larger output compare value, enable TIM overflow interrupts and write the new
value in the TIM overflow interrupt routine. The TIM overflow interrupt occurs at the end of the
current counter overflow period. Writing a larger value in an output compare interrupt routine (at
the end of the current pulse) could cause two output compares to occur in the same counter
overflow period.
16.3.3.2 Buffered Output Compare
Channels 0 and 1 can be linked to form a buffered output compare channel whose output appears on the
TCH0 pin. The TIM channel registers of the linked pair alternately control the output.
Setting the MS0B bit in TIM channel 0 status and control register (TSC0) links channel 0 and channel 1.
The output compare value in the TIM channel 0 registers initially controls the output on the TCH0 pin.
Writing to the TIM channel 1 registers enables the TIM channel 1 registers to synchronously control the
output after the TIM overflows. At each subsequent overflow, the TIM channel registers (0 or 1) that
control the output are the ones written to last. TSC0 controls and monitors the buffered output compare
function, and TIM channel 1 status and control register (TSC1) is unused. While the MS0B bit is set, the
channel 1 pin, TCH1, is available as a general-purpose I/O pin.
Channels 2 and 3 can be linked to form a buffered output compare channel whose output appears on the
TCH2 pin. The TIM channel registers of the linked pair alternately control the output.
Setting the MS2B bit in TIM channel 2 status and control register (TSC2) links channel 2 and channel 3.
The output compare value in the TIM channel 2 registers initially controls the output on the TCH2 pin.
Writing to the TIM channel 3 registers enables the TIM channel 3 registers to synchronously control the
output after the TIM overflows. At each subsequent overflow, the TIM channel registers (2 or 3) that
control the output are the ones written to last. TSC2 controls and monitors the buffered output compare
function, and TIM channel 3 status and control register (TSC3) is unused. While the MS2B bit is set, the
channel 3 pin, TCH3, is available as a general-purpose I/O pin.
NOTE
In buffered output compare operation, do not write new output compare
values to the currently active channel registers. User software should track
MC68HC908QB8 Data Sheet, Rev. 3
178
Freescale Semiconductor
Functional Description
the currently active channel to prevent writing a new value to the active
channel. Writing to the active channel registers is the same as generating
unbuffered output compares.
16.3.4 Pulse Width Modulation (PWM)
By using the toggle-on-overflow feature with an output compare channel, the TIM can generate a PWM
signal. The value in the TIM counter modulo registers determines the period of the PWM signal. The
channel pin toggles when the counter reaches the value in the TIM counter modulo registers. The time
between overflows is the period of the PWM signal.
As Figure 16-3 shows, the output compare value in the TIM channel registers determines the pulse width
of the PWM signal. The time between overflow and output compare is the pulse width. Program the TIM
to clear the channel pin on output compare if the polarity of the PWM pulse is 1 (ELSxA = 0). Program the
TIM to set the pin if the polarity of the PWM pulse is 0 (ELSxA = 1).
The value in the TIM counter modulo registers and the selected prescaler output determines the
frequency of the PWM output The frequency of an 8-bit PWM signal is variable in 256 increments. Writing
$00FF (255) to the TIM counter modulo registers produces a PWM period of 256 times the internal bus
clock period if the prescaler select value is 000. See 16.8.1 TIM Status and Control Register.
The value in the TIM channel registers determines the pulse width of the PWM output. The pulse width of
an 8-bit PWM signal is variable in 256 increments. Writing $0080 (128) to the TIM channel registers
produces a duty cycle of 128/256 or 50%.
OVERFLOW
OVERFLOW
OVERFLOW
PERIOD
POLARITY = 1
(ELSxA = 0) TCHx
PULSE
WIDTH
POLARITY = 0 TCHx
(ELSxA = 1)
OUTPUT
COMPARE
OUTPUT
COMPARE
OUTPUT
COMPARE
Figure 16-3. PWM Period and Pulse Width
16.3.4.1 Unbuffered PWM Signal Generation
Any output compare channel can generate unbuffered PWM pulses as described in 16.3.4 Pulse Width
Modulation (PWM). The pulses are unbuffered because changing the pulse width requires writing the new
pulse width value over the old value currently in the TIM channel registers.
An unsynchronized write to the TIM channel registers to change a pulse width value could cause incorrect
operation for up to two PWM periods. For example, writing a new value before the counter reaches the
old value but after the counter reaches the new value prevents any compare during that PWM period.
Also, using a TIM overflow interrupt routine to write a new, smaller pulse width value may cause the
compare to be missed. The TIM may pass the new value before it is written to the timer channel
(TCHxH:TCHxL).
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
179
Timer Interface Module (TIM)
Use the following methods to synchronize unbuffered changes in the PWM pulse width on channel x:
• When changing to a shorter pulse width, enable channel x output compare interrupts and write the
new value in the output compare interrupt routine. The output compare interrupt occurs at the end
of the current pulse. The interrupt routine has until the end of the PWM period to write the new
value.
• When changing to a longer pulse width, enable TIM overflow interrupts and write the new value in
the TIM overflow interrupt routine. The TIM overflow interrupt occurs at the end of the current PWM
period. Writing a larger value in an output compare interrupt routine (at the end of the current pulse)
could cause two output compares to occur in the same PWM period.
NOTE
In PWM signal generation, do not program the PWM channel to toggle on
output compare. Toggling on output compare prevents reliable 0% duty
cycle generation and removes the ability of the channel to self-correct in the
event of software error or noise. Toggling on output compare also can
cause incorrect PWM signal generation when changing the PWM pulse
width to a new, much larger value.
16.3.4.2 Buffered PWM Signal Generation
Channels 0 and 1 can be linked to form a buffered PWM channel whose output appears on the TCH0 pin.
The TIM channel registers of the linked pair alternately control the output.
Setting the MS0B bit in TIM channel 0 status and control register (TSC0) links channel 0 and channel 1.
The TIM channel 0 registers initially control the pulse width on the TCH0 pin. Writing to the TIM channel 1
registers enables the TIM channel 1 registers to synchronously control the pulse width at the beginning
of the next PWM period. At each subsequent overflow, the TIM channel registers (0 or 1) that control the
pulse width are the ones written to last. TSC0 controls and monitors the buffered PWM function, and TIM
channel 1 status and control register (TSC1) is unused. While the MS0B bit is set, the channel 1 pin,
TCH1, is available as a general-purpose I/O pin.
Channels 2 and 3 can be linked to form a buffered PWM channel whose output appears on the TCH2 pin.
The TIM channel registers of the linked pair alternately control the output.
Setting the MS2B bit in TIM channel 2 status and control register (TSC2) links channel 2 and channel 3.
The TIM channel 2 registers initially control the pulse width on the TCH2 pin. Writing to the TIM channel
3 registers enables the TIM channel 3 registers to synchronously control the pulse width at the beginning
of the next PWM period. At each subsequent overflow, the TIM channel registers (2 or 3) that control the
pulse width are the ones written to last. TSC2 controls and monitors the buffered PWM function, and TIM
channel 3 status and control register (TSC3) is unused. While the MS2B bit is set, the channel 3 pin,
TCH3, is available as a general-purpose I/O pin.
NOTE
In buffered PWM signal generation, do not write new pulse width values to
the currently active channel registers. User software should track the
currently active channel to prevent writing a new value to the active
channel. Writing to the active channel registers is the same as generating
unbuffered PWM signals.
MC68HC908QB8 Data Sheet, Rev. 3
180
Freescale Semiconductor
Functional Description
16.3.4.3 PWM Initialization
To ensure correct operation when generating unbuffered or buffered PWM signals, use the following
initialization procedure:
1. In the TIM status and control register (TSC):
a. Stop the counter by setting the TIM stop bit, TSTOP.
b. Reset the counter and prescaler by setting the TIM reset bit, TRST.
2. In the TIM counter modulo registers (TMODH:TMODL), write the value for the required PWM
period.
3. In the TIM channel x registers (TCHxH:TCHxL), write the value for the required pulse width.
4. In TIM channel x status and control register (TSCx):
a. Write 0:1 (for unbuffered output compare or PWM signals) or 1:0 (for buffered output compare
or PWM signals) to the mode select bits, MSxB:MSxA. See Table 16-2.
b. Write 1 to the toggle-on-overflow bit, TOVx.
c. Write 1:0 (polarity 1 — to clear output on compare) or 1:1 (polarity 0 — to set output on
compare) to the edge/level select bits, ELSxB:ELSxA. The output action on compare must
force the output to the complement of the pulse width level. See Table 16-2.
NOTE
In PWM signal generation, do not program the PWM channel to toggle on
output compare. Toggling on output compare prevents reliable 0% duty
cycle generation and removes the ability of the channel to self-correct in the
event of software error or noise. Toggling on output compare can also
cause incorrect PWM signal generation when changing the PWM pulse
width to a new, much larger value.
5. In the TIM status control register (TSC), clear the TIM stop bit, TSTOP.
Setting MS0B links channels 0 and 1 and configures them for buffered PWM operation. The TIM
channel 0 registers (TCH0H:TCH0L) initially control the buffered PWM output. TIM status control
register 0 (TSC0) controls and monitors the PWM signal from the linked channels. MS0B takes priority
over MS0A.
Setting MS2B links channels 2 and 3 and configures them for buffered PWM operation. The TIM
channel 2 registers (TCH2H:TCH2L) initially control the buffered PWM output. TIM status control
register 2 (TSC2) controls and monitors the PWM signal from the linked channels. MS2B takes priority
over MS2A.
Clearing the toggle-on-overflow bit, TOVx, inhibits output toggles on TIM overflows. Subsequent output
compares try to force the output to a state it is already in and have no effect. The result is a 0% duty cycle
output.
Setting the channel x maximum duty cycle bit (CHxMAX) and setting the TOVx bit generates a 100% duty
cycle output. See 16.8.4 TIM Channel Status and Control Registers.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
181
Timer Interface Module (TIM)
16.4 Interrupts
The following TIM sources can generate interrupt requests:
• TIM overflow flag (TOF) — The TOF bit is set when the counter reaches the modulo value
programmed in the TIM counter modulo registers. The TIM overflow interrupt enable bit, TOIE,
enables TIM overflow interrupt requests. TOF and TOIE are in the TSC register.
• TIM channel flags (CH3F:CH0F) — The CHxF bit is set when an input capture or output compare
occurs on channel x. Channel x TIM interrupt requests are controlled by the channel x interrupt
enable bit, CHxIE. Channel x TIM interrupt requests are enabled when CHxIE =1. CHxF and
CHxIE are in the TSCx register.
16.5 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes.
16.5.1 Wait Mode
The TIM remains active after the execution of a WAIT instruction. In wait mode the TIM registers are not
accessible by the CPU. Any enabled interrupt request from the TIM can bring the MCU out of wait mode.
If TIM functions are not required during wait mode, reduce power consumption by stopping the TIM before
executing the WAIT instruction.
16.5.2 Stop Mode
The TIM module is inactive after the execution of a STOP instruction. The STOP instruction does not
affect register conditions. TIM operation resumes after an external interrupt. If stop mode is exited by
reset, the TIM is reset.
16.6 TIM During Break Interrupts
A break interrupt stops the counter.
The system integration module (SIM) controls whether status bits in other modules can be cleared during
the break state. The BCFE bit in the break flag control register (BFCR) enables software to clear status
bits during the break state. See BFCR in the SIM section of this data sheet.
To allow software to clear status bits during a break interrupt, write a 1 to BCFE. If a status bit is cleared
during the break state, it remains cleared when the MCU exits the break state.
To protect status bits during the break state, write a 0 to BCFE. With BCFE cleared (its default state),
software can read and write registers during the break state without affecting status bits. Some status bits
have a two-step read/write clearing procedure. If software does the first step on such a bit before the
break, the bit cannot change during the break state as long as BCFE is cleared. After the break, doing the
second step clears the status bit.
MC68HC908QB8 Data Sheet, Rev. 3
182
Freescale Semiconductor
I/O Signals
16.7 I/O Signals
The TIM module can share its pins with the general-purpose I/O pins. See Figure 16-1 for the port pins
that are shared.
16.7.1 TIM Channel I/O Pins (TCH3:TCH0)
Each channel I/O pin is programmable independently as an input capture pin or an output compare pin.
TCH0 and TCH2 can be configured as buffered output compare or buffered PWM pins.
16.7.2 TIM Clock Pin (TCLK)
TCLK is an external clock input that can be the clock source for the counter instead of the prescaled
internal bus clock. Select the TCLK input by writing 1s to the three prescaler select bits, PS[2:0].
(See 16.8.1 TIM Status and Control Register.) The minimum TCLK pulse width is specified in 18.16 Timer
Interface Module Characteristics. The maximum TCLK frequency is the least of 4 MHz or bus
frequency ÷ 2.
16.8 Registers
The following registers control and monitor operation of the TIM:
• TIM status and control register (TSC)
• TIM control registers (TCNTH:TCNTL)
• TIM counter modulo registers (TMODH:TMODL)
• TIM channel status and control registers (TSC0 through TSC3)
• TIM channel registers (TCH0H:TCH0L through TCH3H:TCH3L)
16.8.1 TIM Status and Control Register
The TIM status and control register (TSC) does the following:
• Enables TIM overflow interrupts
• Flags TIM overflows
• Stops the counter
• Resets the counter
• Prescales the counter clock
Bit 7
Read:
TOF
Write:
0
Reset:
0
6
5
TOIE
TSTOP
0
1
4
3
0
0
TRST
0
2
1
Bit 0
PS2
PS1
PS0
0
0
0
0
= Unimplemented
Figure 16-4. TIM Status and Control Register (TSC)
TOF — TIM Overflow Flag Bit
This read/write flag is set when the counter reaches the modulo value programmed in the TIM counter
modulo registers. Clear TOF by reading the TSC register when TOF is set and then writing a 0 to TOF.
If another TIM overflow occurs before the clearing sequence is complete, then writing 0 to TOF has no
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
183
Timer Interface Module (TIM)
effect. Therefore, a TOF interrupt request cannot be lost due to inadvertent clearing of TOF. Writing a
1 to TOF has no effect.
1 = Counter has reached modulo value
0 = Counter has not reached modulo value
TOIE — TIM Overflow Interrupt Enable Bit
This read/write bit enables TIM overflow interrupts when the TOF bit becomes set.
1 = TIM overflow interrupts enabled
0 = TIM overflow interrupts disabled
TSTOP — TIM Stop Bit
This read/write bit stops the counter. Counting resumes when TSTOP is cleared. Reset sets the
TSTOP bit, stopping the counter until software clears the TSTOP bit.
1 = Counter stopped
0 = Counter active
NOTE
Do not set the TSTOP bit before entering wait mode if the TIM is required
to exit wait mode. Also, when the TSTOP bit is set and the timer is
configured for input capture operation, input captures are inhibited until the
TSTOP bit is cleared.
When using TSTOP to stop the timer counter, see if any timer flags are set.
If a timer flag is set, it must be cleared by clearing TSTOP, then clearing the
flag, then setting TSTOP again.
TRST — TIM Reset Bit
Setting this write-only bit resets the counter and the TIM prescaler. Setting TRST has no effect on any
other timer registers. Counting resumes from $0000. TRST is cleared automatically after the counter
is reset and always reads as 0.
1 = Prescaler and counter cleared
0 = No effect
NOTE
Setting the TSTOP and TRST bits simultaneously stops the counter at a
value of $0000.
PS[2:0] — Prescaler Select Bits
These read/write bits select one of the seven prescaler outputs as the input to the counter as
Table 16-1 shows.
Table 16-1. Prescaler Selection
PS2
PS1
PS0
TIM Clock Source
0
0
0
Internal bus clock ÷ 1
0
0
1
Internal bus clock ÷ 2
0
1
0
Internal bus clock ÷ 4
0
1
1
Internal bus clock ÷ 8
1
0
0
Internal bus clock ÷ 16
1
0
1
Internal bus clock ÷ 32
1
1
0
Internal bus clock ÷ 64
1
1
1
TCLK (if available)
MC68HC908QB8 Data Sheet, Rev. 3
184
Freescale Semiconductor
Registers
16.8.2 TIM Counter Registers
The two read-only TIM counter registers contain the high and low bytes of the value in the counter.
Reading the high byte (TCNTH) latches the contents of the low byte (TCNTL) into a buffer. Subsequent
reads of TCNTH do not affect the latched TCNTL value until TCNTL is read. Reset clears the TIM counter
registers. Setting the TIM reset bit (TRST) also clears the TIM counter registers.
NOTE
If you read TCNTH during a break interrupt, be sure to unlatch TCNTL by
reading TCNTL before exiting the break interrupt. Otherwise, TCNTL
retains the value latched during the break.
Read:
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
0
0
0
0
0
0
0
Write:
Reset:
0
= Unimplemented
Figure 16-5. TIM Counter High Register (TCNTH)
Read:
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
Write:
Reset:
= Unimplemented
Figure 16-6. TIM Counter Low Register (TCNTL)
16.8.3 TIM Counter Modulo Registers
The read/write TIM modulo registers contain the modulo value for the counter. When the counter reaches
the modulo value, the overflow flag (TOF) becomes set, and the counter resumes counting from $0000
at the next timer clock. Writing to the high byte (TMODH) inhibits the TOF bit and overflow interrupts until
the low byte (TMODL) is written. Reset sets the TIM counter modulo registers.
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
1
1
1
1
1
1
1
1
Figure 16-7. TIM Counter Modulo High Register (TMODH)
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
1
1
1
1
1
1
1
1
Figure 16-8. TIM Counter Modulo Low Register (TMODL)
NOTE
Reset the counter before writing to the TIM counter modulo registers.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
185
Timer Interface Module (TIM)
16.8.4 TIM Channel Status and Control Registers
Each of the TIM channel status and control registers does the following:
• Flags input captures and output compares
• Enables input capture and output compare interrupts
• Selects input capture, output compare, or PWM operation
• Selects high, low, or toggling output on output compare
• Selects rising edge, falling edge, or any edge as the active input capture trigger
• Selects output toggling on TIM overflow
• Selects 0% and 100% PWM duty cycle
• Selects buffered or unbuffered output compare/PWM operation
Bit 7
Read:
CH0F
Write:
0
Reset:
0
6
5
4
3
2
1
Bit 0
CH0IE
MS0B
MS0A
ELS0B
ELS0A
TOV0
CH0MAX
0
0
0
0
0
0
0
Figure 16-9. TIM Channel 0 Status and Control Register (TSC0)
Bit 7
Read:
CH1F
Write:
0
Reset:
0
6
5
0
CH1IE
0
0
4
3
2
1
Bit 0
MS1A
ELS1B
ELS1A
TOV1
CH1MAX
0
0
0
0
0
Figure 16-10. TIM Channel 1 Status and Control Register (TSC1)
Bit 7
Read:
CH2F
Write:
0
Reset:
0
6
5
4
3
2
1
Bit 0
CH2IE
MS2B
MS2A
ELS2B
ELS2A
TOV2
CH2MAX
0
0
0
0
0
0
0
Figure 16-11. TIM Channel 2 Status and Control Register (TSC2)
Bit 7
Read:
CH3F
Write:
0
Reset:
0
6
5
0
CH3IE
0
0
4
3
2
1
Bit 0
MS3A
ELS3B
ELS3A
TOV3
CH3MAX
0
0
0
0
0
= Unimplemented
Figure 16-12. TIM Channel 3 Status and Control Register (TSC3)
CHxF — Channel x Flag Bit
When channel x is an input capture channel, this read/write bit is set when an active edge occurs on
the channel x pin. When channel x is an output compare channel, CHxF is set when the value in the
counter registers matches the value in the TIM channel x registers.
Clear CHxF by reading the TSCx register with CHxF set and then writing a 0 to CHxF. If another
interrupt request occurs before the clearing sequence is complete, then writing 0 to CHxF has no
effect. Therefore, an interrupt request cannot be lost due to inadvertent clearing of CHxF.
MC68HC908QB8 Data Sheet, Rev. 3
186
Freescale Semiconductor
Registers
Writing a 1 to CHxF has no effect.
1 = Input capture or output compare on channel x
0 = No input capture or output compare on channel x
CHxIE — Channel x Interrupt Enable Bit
This read/write bit enables TIM interrupt service requests on channel x.
1 = Channel x interrupt requests enabled
0 = Channel x interrupt requests disabled
MSxB — Mode Select Bit B
This read/write bit selects buffered output compare/PWM operation. MSxB exists only in the TSC0 and
TSC2 registers.
Setting MS0B causes the contents of TSC1 to be ignored by the TIM and reverts TCH1 to
general-purpose I/O.
Setting MS2B causes the contents of TSC3 to be ignored by the TIM and reverts TCH3 to
general-purpose I/O.
1 = Buffered output compare/PWM operation enabled
0 = Buffered output compare/PWM operation disabled
MSxA — Mode Select Bit A
When ELSxB:A ≠ 00, this read/write bit selects either input capture operation or unbuffered output
compare/PWM operation. See Table 16-2.
1 = Unbuffered output compare/PWM operation
0 = Input capture operation
When ELSxB:A = 00, this read/write bit selects the initial output level of the TCHx pin (see Table 16-2).
1 = Initial output level low
0 = Initial output level high
NOTE
Before changing a channel function by writing to the MSxB or MSxA bit, set
the TSTOP and TRST bits in the TIM status and control register (TSC).
Table 16-2. Mode, Edge, and Level Selection
MSxB
MSxA
ELSxB
ELSxA
X
0
0
0
Mode
Output preset
Configuration
Pin under port control; initial
output level high
Pin under port control; initial
output level low
X
1
0
0
0
0
0
1
0
0
1
0
0
0
1
1
Capture on rising or falling edge
0
1
0
0
Software compare only
0
1
0
1
0
1
1
0
0
1
1
1
1
X
0
1
1
X
1
0
1
X
1
1
Capture on rising edge only
Input capture
Output compare
or PWM
Capture on falling edge only
Toggle output on compare
Clear output on compare
Set output on compare
Buffered output
compare or
buffered PWM
Toggle output on compare
Clear output on compare
Set output on compare
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
187
Timer Interface Module (TIM)
ELSxB and ELSxA — Edge/Level Select Bits
When channel x is an input capture channel, these read/write bits control the active edge-sensing logic
on channel x.
When channel x is an output compare channel, ELSxB and ELSxA control the channel x output
behavior when an output compare occurs.
When ELSxB and ELSxA are both clear, channel x is not connected to an I/O port, and pin TCHx is
available as a general-purpose I/O pin. Table 16-2 shows how ELSxB and ELSxA work.
NOTE
After initially enabling a TIM channel register for input capture operation
and selecting the edge sensitivity, clear CHxF to ignore any erroneous
edge detection flags.
TOVx — Toggle-On-Overflow Bit
When channel x is an output compare channel, this read/write bit controls the behavior of the channel
x output when the counter overflows. When channel x is an input capture channel, TOVx has no effect.
1 = Channel x pin toggles on counter overflow.
0 = Channel x pin does not toggle on counter overflow.
NOTE
When TOVx is set, a counter overflow takes precedence over a channel x
output compare if both occur at the same time.
CHxMAX — Channel x Maximum Duty Cycle Bit
When the TOVx bit is at 1, setting the CHxMAX bit forces the duty cycle of buffered and unbuffered
PWM signals to 100%. As Figure 16-13 shows, the CHxMAX bit takes effect in the cycle after it is set
or cleared. The output stays at the 100% duty cycle level until the cycle after CHxMAX is cleared.
OVERFLOW
OVERFLOW
OVERFLOW
OVERFLOW
OVERFLOW
PERIOD
TCHx
OUTPUT
COMPARE
OUTPUT
COMPARE
OUTPUT
COMPARE
OUTPUT
COMPARE
CHxMAX
Figure 16-13. CHxMAX Latency
16.8.5 TIM Channel Registers
These read/write registers contain the captured counter value of the input capture function or the output
compare value of the output compare function. The state of the TIM channel registers after reset is
unknown.
In input capture mode (MSxB:MSxA = 0:0), reading the high byte of the TIM channel x registers (TCHxH)
inhibits input captures until the low byte (TCHxL) is read.
MC68HC908QB8 Data Sheet, Rev. 3
188
Freescale Semiconductor
Registers
In output compare mode (MSxB:MSxA ≠ 0:0), writing to the high byte of the TIM channel x registers
(TCHxH) inhibits output compares until the low byte (TCHxL) is written.
Read:
Write:
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset:
Indeterminate after reset
Figure 16-14. TIM Channel x Register High (TCHxH)
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Indeterminate after reset
Figure 16-15. TIM Channel x Register Low (TCHxL)
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
189
Timer Interface Module (TIM)
MC68HC908QB8 Data Sheet, Rev. 3
190
Freescale Semiconductor
Chapter 17
Development Support
17.1 Introduction
This section describes the break module, the monitor module (MON), and the monitor mode entry
methods.
17.2 Break Module (BRK)
The break module can generate a break interrupt that stops normal program flow at a defined address to
enter a background program.
Features include:
• Accessible input/output (I/O) registers during the break Interrupt
• Central processor unit (CPU) generated break interrupts
• Software-generated break interrupts
• Computer operating properly (COP) disabling during break interrupts
17.2.1 Functional Description
When the internal address bus matches the value written in the break address registers, the break module
issues a breakpoint signal (BKPT) to the system integration module (SIM). The SIM then causes the CPU
to load the instruction register with a software interrupt instruction (SWI). The program counter vectors to
$FFFC and $FFFD ($FEFC and $FEFD in monitor mode).
The following events can cause a break interrupt to occur:
• A CPU generated address (the address in the program counter) matches the contents of the break
address registers.
• Software writes a 1 to the BRKA bit in the break status and control register.
When a CPU generated address matches the contents of the break address registers, the break interrupt
is generated. A return-from-interrupt instruction (RTI) in the break routine ends the break interrupt and
returns the microcontroller unit (MCU) to normal operation.
Figure 17-2 shows the structure of the break module.
When the internal address bus matches the value written in the break address registers or when software
writes a 1 to the BRKA bit in the break status and control register, the CPU starts a break interrupt by:
• Loading the instruction register with the SWI instruction
• Loading the program counter with $FFFC and $FFFD ($FEFC and $FEFD in monitor mode)
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
191
Development Support
PTA0/TCH0/AD0/KBI0
CLOCK
GENERATOR
PTA3/RST/KBI3
DDRA
PTA2/IRQ/KBI2/TCLK
PTA
PTA1/TCH1/AD1/KBI1
KEYBOARD INTERRUPT
MODULE
PTA4/OSC2/AD2/KBI4
PTA5/OSC1/AD3/KBI5
SINGLE INTERRUPT
MODULE
AUTO WAKEUP
MODULE
DDRB
PTB0/SPSCK/AD4
PTB1/MOSI/AD5
PTB2/MISO/AD6
PTB3/SS/AD7
PTB4/RxD/AD8
PTB5/TxD/AD9
PTB6/TCH2
PTB7/TCH3
PTB
M68HC08 CPU
LOW-VOLTAGE
INHIBIT
4-CHANNEL 16-BIT
TIMER MODULE
MC68HC908QB8
MC68HC908QB8
256 BYTES
8192 BYTES
USER RAM
USER FLASH
10-CHANNEL
10-BIT ADC
ENHANCED SERIAL
COMMUNICATIONS
INTERFACE MODULE
VDD
POWER SUPPLY
COP
MODULE
VSS
SERIAL PERIPHERAL
INTERFACE
DEVELOPMENT SUPPORT
MONITOR ROM
BREAK MODULE
RST, IRQ: Pins have internal pull up device
All port pins have programmable pull up device
PTA[0:5]: Higher current sink and source capability
Figure 17-1. Block Diagram Highlighting BRK and MON Blocks
MC68HC908QB8 Data Sheet, Rev. 3
192
Freescale Semiconductor
Break Module (BRK)
ADDRESS BUS[15:8]
BREAK ADDRESS REGISTER HIGH
8-BIT COMPARATOR
ADDRESS BUS[15:0]
CONTROL
8-BIT COMPARATOR
BKPT
(TO SIM)
BREAK ADDRESS REGISTER LOW
ADDRESS BUS[7:0]
Figure 17-2. Break Module Block Diagram
The break interrupt timing is:
• When a break address is placed at the address of the instruction opcode, the instruction is not
executed until after completion of the break interrupt routine.
• When a break address is placed at an address of an instruction operand, the instruction is executed
before the break interrupt.
• When software writes a 1 to the BRKA bit, the break interrupt occurs just before the next instruction
is executed.
By updating a break address and clearing the BRKA bit in a break interrupt routine, a break interrupt can
be generated continuously.
CAUTION
A break address should be placed at the address of the instruction opcode.
When software does not change the break address and clears the BRKA
bit in the first break interrupt routine, the next break interrupt will not be
generated after exiting the interrupt routine even when the internal address
bus matches the value written in the break address registers.
17.2.1.1 Flag Protection During Break Interrupts
The system integration module (SIM) controls whether or not module status bits can be cleared during
the break state. The BCFE bit in the break flag control register (BFCR) enables software to clear status
bits during the break state. See 14.8.2 Break Flag Control Register and the Break Interrupts subsection
for each module.
17.2.1.2 TIM During Break Interrupts
A break interrupt stops the timer counter.
17.2.1.3 COP During Break Interrupts
The COP is disabled during a break interrupt in monitor mode when the BDCOP bit is set in the break
auxiliary register (BRKAR).
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
193
Development Support
17.2.2 Break Module Registers
These registers control and monitor operation of the break module:
• Break status and control register (BRKSCR)
• Break address register high (BRKH)
• Break address register low (BRKL)
• Break status register (BSR)
• Break flag control register (BFCR)
17.2.2.1 Break Status and Control Register
The break status and control register (BRKSCR) contains break module enable and status bits.
Read:
Write:
Reset:
Bit 7
6
BRKE
BRKA
0
0
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented
Figure 17-3. Break Status and Control Register (BRKSCR)
BRKE — Break Enable Bit
This read/write bit enables breaks on break address register matches. Clear BRKE by writing a 0 to
bit 7. Reset clears the BRKE bit.
1 = Breaks enabled on 16-bit address match
0 = Breaks disabled
BRKA — Break Active Bit
This read/write status and control bit is set when a break address match occurs. Writing a 1 to BRKA
generates a break interrupt. Clear BRKA by writing a 0 to it before exiting the break routine. Reset
clears the BRKA bit.
1 = Break address match
0 = No break address match
17.2.2.2 Break Address Registers
The break address registers (BRKH and BRKL) contain the high and low bytes of the desired breakpoint
address. Reset clears the break address registers.
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
0
0
0
0
0
0
0
0
Figure 17-4. Break Address Register High (BRKH)
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
Figure 17-5. Break Address Register Low (BRKL)
MC68HC908QB8 Data Sheet, Rev. 3
194
Freescale Semiconductor
Break Module (BRK)
17.2.2.3 Break Auxiliary Register
The break auxiliary register (BRKAR) contains a bit that enables software to disable the COP while the
MCU is in a state of break interrupt with monitor mode.
Read:
Bit 7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Write:
Reset:
Bit 0
BDCOP
0
= Unimplemented
Figure 17-6. Break Auxiliary Register (BRKAR)
BDCOP — Break Disable COP Bit
This read/write bit disables the COP during a break interrupt. Reset clears the BDCOP bit.
1 = COP disabled during break interrupt
0 = COP enabled during break interrupt
17.2.2.4 Break Status Register
The break status register (BSR) contains a flag to indicate that a break caused an exit from wait mode.
This register is only used in emulation mode.
Read:
Write:
Bit 7
6
5
4
3
2
R
R
R
R
R
R
Reset:
1
SBSW
Note(1)
Bit 0
R
0
R
= Reserved
1. Writing a 0 clears SBSW.
Figure 17-7. Break Status Register (BSR)
SBSW — SIM Break Stop/Wait
SBSW can be read within the break state SWI routine. The user can modify the return address on the
stack by subtracting one from it.
1 = Wait mode was exited by break interrupt
0 = Wait mode was not exited by break interrupt
17.2.2.5 Break Flag Control Register
The break control register (BFCR) contains a bit that enables software to clear status bits while the MCU
is in a break state.
Read:
Write:
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
BCFE
R
R
R
R
R
R
R
0
R
= Reserved
Figure 17-8. Break Flag Control Register (BFCR)
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
195
Development Support
BCFE — Break Clear Flag Enable Bit
This read/write bit enables software to clear status bits by accessing status registers while the MCU is
in a break state. To clear status bits during the break state, the BCFE bit must be set.
1 = Status bits clearable during break
0 = Status bits not clearable during break
17.2.3 Low-Power Modes
The WAIT and STOP instructions put the MCU in low power-consumption standby modes. If enabled, the
break module will remain enabled in wait and stop modes. However, since the internal address bus does
not increment in these modes, a break interrupt will never be triggered.
17.3 Monitor Module (MON)
The monitor module allows debugging and programming of the microcontroller unit (MCU) through a
single-wire interface with a host computer. Monitor mode entry can be achieved without use of the higher
test voltage, VTST, as long as vector addresses $FFFE and $FFFF are blank, thus reducing the hardware
requirements for in-circuit programming.
Features include:
• Normal user-mode pin functionality
• One pin dedicated to serial communication between MCU and host computer
• Standard non-return-to-zero (NRZ) communication with host computer
• Standard communication baud rate (7200 @ 2-MHz bus frequency)
• Execution of code in random-access memory (RAM) or FLASH
• FLASH memory security feature(1)
• FLASH memory programming interface
• Use of external 9.8304 MHz oscillator to generate internal frequency of 2.4576 MHz
• Simple internal oscillator mode of operation (no external clock or high voltage)
• Monitor mode entry without high voltage, VTST, if reset vector is blank ($FFFE and $FFFF contain
$FF)
• Normal monitor mode entry if VTST is applied to IRQ
17.3.1 Functional Description
Figure 17-9 shows a simplified diagram of monitor mode entry.
The monitor module receives and executes commands from a host computer. Figure 17-10, Figure 17-11,
and Figure 17-12 show example circuits used to enter monitor mode and communicate with a host
computer via a standard RS-232 interface.
Simple monitor commands can access any memory address. In monitor mode, the MCU can execute
code downloaded into RAM by a host computer while most MCU pins retain normal operating mode
functions. All communication between the host computer and the MCU is through the PTA0 pin. A
level-shifting and multiplexing interface is required between PTA0 and the host computer. PTA0 is used
in a wired-OR configuration and requires a pullup resistor.
1. No security feature is absolutely secure. However, Freescale’s strategy is to make reading or copying the FLASH difficult for
unauthorized users.
MC68HC908QB8 Data Sheet, Rev. 3
196
Freescale Semiconductor
Monitor Module (MON)
POR RESET
NO
CONDITIONS
FROM Table 17-1
PTA0 = 1,
RESET VECTOR
BLANK?
IRQ = VTST?
YES
PTA0 = 1,
PTA1 = 1, AND
PTA4 = 0?
NO
NO
YES
YES
FORCED
MONITOR MODE
NORMAL
USER MODE
NORMAL
MONITOR MODE
INVALID
USER MODE
HOST SENDS
8 SECURITY BYTES
IS RESET
POR?
YES
NO
YES
ARE ALL
SECURITY BYTES
CORRECT?
ENABLE FLASH
NO
DISABLE FLASH
MONITOR MODE ENTRY
DEBUGGING
AND FLASH
PROGRAMMING
(IF FLASH
IS ENABLED)
EXECUTE
MONITOR CODE
YES
DOES RESET
OCCUR?
NO
Figure 17-9. Simplified Monitor Mode Entry Flowchart
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
197
Development Support
VDD
VDD
10 kΩ*
VDD
RST (PTA3)
MAX232
1
1 μF
+
3
4
1 μF
+
VDD
16
C1+
+
1 kΩ
9.1 V
1 μF
10 kΩ
+
74HC125
3
2
9
8
PTA4
74HC125
5
6
10
10 kΩ*
PTA0
4
VSS
1
5
10 kΩ*
IRQ (PTA2)
VDD
V– 6
7
VDD
PTA1
DB9
3
1 μF
V+ 2
C2+
OSC1 (PTA5)
1 μF
15
C1–
0.1 μF
VTST
+
5 C2–
2
9.8304 MHz CLOCK
* Value not critical
Figure 17-10. Monitor Mode Circuit (External Clock, with High Voltage)
VDD
N.C.
1
1 μF
3
4
1 μF
+
C1+
C1–
C2+
5 C2–
VDD
16
+
9.8304 MHz CLOCK
1 μF
15
+
10 kΩ*
VDD
V– 6
1 μF
2
7
10
3
8
9
IRQ (PTA2)
10 kΩ
74HC125
5
6
+
2
OSC1 (PTA5)
1 μF
V+ 2
DB9
5
VDD
0.1 μF
MAX232
+
RST (PTA3)
74HC125
3
PTA1
N.C.
PTA4
N.C.
PTA0
4
VSS
1
* Value not critical
Figure 17-11. Monitor Mode Circuit (External Clock, No High Voltage)
MC68HC908QB8 Data Sheet, Rev. 3
198
Freescale Semiconductor
Monitor Module (MON)
VDD
N.C.
RST (PTA3)
VDD
0.1 μF
MAX232
1
1 μF
+
3
4
1 μF
+
C1+
C1–
C2+
5 C2–
VDD
+
3
1 μF
15
+
OSC1 (PTA5)
IRQ (PTA2)
1 μF
VDD
V– 6
1 μF
7
10
8
9
10 kΩ
74HC125
5
6
+
74HC125
3
2
PTA1
N.C.
PTA4
N.C.
10 kΩ*
V+ 2
DB9
2
N.C.
16
PTA0
VSS
4
1
5
* Value not critical
Figure 17-12. Monitor Mode Circuit (Internal Clock, No High Voltage)
The monitor code has been updated from previous versions of the monitor code to allow enabling the
internal oscillator to generate the internal clock. This addition, which is enabled when IRQ is held low out
of reset, is intended to support serial communication/programming at 9600 baud in monitor mode by using
the internal oscillator, and the internal oscillator user trim value OSCTRIM (FLASH location $FFC0, if
programmed) to generate the desired internal frequency (3.2 MHz). Since this feature is enabled only
when IRQ is held low out of reset, it cannot be used when the reset vector is programmed (i.e., the value
is not $FFFF) because entry into monitor mode in this case requires VTST on IRQ. The IRQ pin must
remain low during this monitor session in order to maintain communication.
Table 17-1 shows the pin conditions for entering monitor mode. As specified in the table, monitor mode
may be entered after a power-on reset (POR) and will allow communication at 9600 baud provided one
of the following sets of conditions is met:
• If $FFFE and $FFFF do not contain $FF (programmed state):
– The external clock is 9.8304 MHz
– IRQ = VTST
• If $FFFE and $FFFF contain $FF (erased state):
– The external clock is 9.8304 MHz
– IRQ = VDD (this can be implemented through the internal IRQ pullup)
• If $FFFE and $FFFF contain $FF (erased state):
– IRQ = VSS (internal oscillator is selected, no external clock required)
The rising edge of the internal RST signal latches the monitor mode. Once monitor mode is latched, the
values on PTA1 and PTA4 pins can be changed.
Once out of reset, the MCU waits for the host to send eight security bytes (see 17.3.2 Security). After the
security bytes, the MCU sends a break signal (10 consecutive 0s) to the host, indicating that it is ready to
receive a command.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
199
Development Support
Table 17-1. Monitor Mode Signal Requirements and Options
Mode
Serial
Mode
CommuniSelection
RST
Reset
IRQ
cation
(PTA2) (PTA3) Vector
PTA0
PTA1 PTA4
Communication
Speed
COP
External
Bus
Clock Frequency
Comments
Baud
Rate
VTST
VDD
X
1
1
0
Disabled
9.8304
MHz
2.4576
MHz
9600
Provide external
clock at OSC1.
VDD
X
$FFFF
(blank)
1
X
X
Disabled
9.8304
MHz
2.4576
MHz
9600
Provide external
clock at OSC1.
VSS
X
$FFFF
(blank)
1
X
X
Disabled
X
3.2 MHz
(Trimmed)
9600
Internal clock is
active.
User
X
X
Not
$FFFF
X
X
X
Enabled
X
X
X
MON08
Function
[Pin No.]
VTST
[6]
RST
[4]
—
COM
[8]
—
OSC1
[13]
—
—
Normal
Monitor
Forced
Monitor
MOD0 MOD1
[12]
[10]
1. PTA0 must have a pullup resistor to VDD in monitor mode.
2. Communication speed in the table is an example to obtain a baud rate of 9600. Baud rate using external oscillator is bus
frequency / 256 and baud rate using internal oscillator is bus frequency / 335.
3. External clock is a 9.8304 MHz oscillator on OSC1.
4. Lowering VTST once monitor mode is entered allows the clock source to be controlled by the OSCSC register.
5. X = don’t care
6. MON08 pin refers to P&E Microcomputer Systems’ MON08-Cyclone 2 by 8-pin connector.
NC
1
2
GND
NC
3
4
RST
NC
5
6
IRQ
NC
7
8
PTA0
NC
9
10
PTA4
NC
11
12
PTA1
OSC1
13
14
NC
VDD
15
16
NC
17.3.1.1 Normal Monitor Mode
RST and OSC1 functions will be active on the PTA3 and PTA5 pins respectively as long as VTST is
applied to the IRQ pin. If the IRQ pin is lowered (no longer VTST) then the chip will still be operating in
monitor mode, but the pin functions will be determined by the settings in the configuration registers (see
Chapter 5 Configuration Register (CONFIG)) when VTST was lowered. With VTST lowered, the BIH and
BIL instructions will read the IRQ pin state only if IRQEN is set in the CONFIG2 register.
If monitor mode was entered with VTST on IRQ, then the COP is disabled as long as VTST is applied to
IRQ.
MC68HC908QB8 Data Sheet, Rev. 3
200
Freescale Semiconductor
Monitor Module (MON)
17.3.1.2 Forced Monitor Mode
If entering monitor mode without high voltage on IRQ, then startup port pin requirements and conditions,
(PTA1/PTA4) are not in effect. This is to reduce circuit requirements when performing in-circuit
programming.
NOTE
If the reset vector is blank and monitor mode is entered, the chip will see an
additional reset cycle after the initial power-on reset (POR). Once the reset
vector has been programmed, the traditional method of applying a voltage,
VTST, to IRQ must be used to enter monitor mode.
If monitor mode was entered as a result of the reset vector being blank, the COP is always disabled
regardless of the state of IRQ.
If the voltage applied to the IRQ is less than VTST, the MCU will come out of reset in user mode. Internal
circuitry monitors the reset vector fetches and will assert an internal reset if it detects that the reset vectors
are erased ($FF). When the MCU comes out of reset, it is forced into monitor mode without requiring high
voltage on the IRQ pin. Once out of reset, the monitor code is initially executing with the internal clock at
its default frequency.
If IRQ is held high, all pins will default to regular input port functions except for PTA0 and PTA5 which will
operate as a serial communication port and OSC1 input respectively (refer to Figure 17-11). That will
allow the clock to be driven from an external source through OSC1 pin.
If IRQ is held low, all pins will default to regular input port function except for PTA0 which will operate as
serial communication port. Refer to Figure 17-12.
Regardless of the state of the IRQ pin, it will not function as a port input pin in monitor mode. Bit 2 of the
Port A data register will always read 0. The BIH and BIL instructions will behave as if the IRQ pin is
enabled, regardless of the settings in the configuration register. See Chapter 5 Configuration Register
(CONFIG).
The COP module is disabled in forced monitor mode. Any reset other than a power-on reset (POR) will
automatically force the MCU to come back to the forced monitor mode.
17.3.1.3 Monitor Vectors
In monitor mode, the MCU uses different vectors for reset, SWI (software interrupt), and break interrupt
than those for user mode. The alternate vectors are in the $FE page instead of the $FF page and allow
code execution from the internal monitor firmware instead of user code.
NOTE
Exiting monitor mode after it has been initiated by having a blank reset
vector requires a power-on reset (POR). Pulling RST (when RST pin
available) low will not exit monitor mode in this situation.
Table 17-2 summarizes the differences between user mode and monitor mode regarding vectors.
Table 17-2. Mode Difference
Functions
Modes
Reset
Vector High
Reset
Vector Low
Break
Vector High
Break
Vector Low
SWI
Vector High
SWI
Vector Low
User
$FFFE
$FFFF
$FFFC
$FFFD
$FFFC
$FFFD
Monitor
$FEFE
$FEFF
$FEFC
$FEFD
$FEFC
$FEFD
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
201
Development Support
17.3.1.4 Data Format
Communication with the monitor ROM is in standard non-return-to-zero (NRZ) mark/space data format.
Transmit and receive baud rates must be identical.
START
BIT
BIT 0
BIT 1
BIT 2
BIT 3
BIT 4
BIT 5
BIT 6
BIT 7
STOP
BIT
NEXT
START
BIT
Figure 17-13. Monitor Data Format
17.3.1.5 Break Signal
A start bit (logic 0) followed by nine logic 0 bits is a break signal. When the monitor receives a break signal,
it drives the PTA0 pin high for the duration of two bits and then echoes back the break signal.
MISSING STOP BIT
2-STOP BIT DELAY BEFORE ZERO ECHO
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
Figure 17-14. Break Transaction
17.3.1.6 Baud Rate
The monitor communication baud rate is controlled by the frequency of the external or internal oscillator
and the state of the appropriate pins as shown in Table 17-1.
Table 17-1 also lists the bus frequencies to achieve standard baud rates. The effective baud rate is the
bus frequency divided by 256 when using an external oscillator. When using the internal oscillator in
forced monitor mode, the effective baud rate is the bus frequency divided by 335.
17.3.1.7 Commands
The monitor ROM firmware uses these commands:
• READ (read memory)
• WRITE (write memory)
• IREAD (indexed read)
• IWRITE (indexed write)
• READSP (read stack pointer)
• RUN (run user program)
The monitor ROM firmware echoes each received byte back to the PTA0 pin for error checking. An 11-bit
delay at the end of each command allows the host to send a break character to cancel the command. A
delay of two bit times occurs before each echo and before READ, IREAD, or READSP data is returned.
The data returned by a read command appears after the echo of the last byte of the command.
NOTE
Wait one bit time after each echo before sending the next byte.
MC68HC908QB8 Data Sheet, Rev. 3
202
Freescale Semiconductor
Monitor Module (MON)
FROM
HOST
4
ADDRESS
HIGH
READ
READ
4
1
ADDRESS
HIGH
1
ADDRESS
LOW
DATA
1
4
ECHO
Notes:
1 = Echo delay, approximately 2 bit times
2 = Data return delay, approximately 2 bit times
ADDRESS
LOW
3, 2
4
RETURN
3 = Cancel command delay, 11 bit times
4 = Wait 1 bit time before sending next byte.
Figure 17-15. Read Transaction
FROM
HOST
3
ADDRESS
HIGH
WRITE
WRITE
3
1
ADDRESS
HIGH
1
ADDRESS
LOW
3
ADDRESS
LOW
1
DATA
3
DATA
1
2, 3
ECHO
Notes:
1 = Echo delay, approximately 2 bit times
2 = Cancel command delay, 11 bit times
3 = Wait 1 bit time before sending next byte.
Figure 17-16. Write Transaction
A brief description of each monitor mode command is given in Table 17-3 through Table 17-8.
Table 17-3. READ (Read Memory) Command
Description
Read byte from memory
Operand
2-byte address in high-byte:low-byte order
Data Returned
Returns contents of specified address
Opcode
$4A
Command Sequence
SENT TO MONITOR
READ
READ
ADDRESS ADDRESS ADDRESS
HIGH
HIGH
LOW
ADDRESS
LOW
ECHO
DATA
RETURN
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
203
Development Support
Table 17-4. WRITE (Write Memory) Command
Description
Operand
Data Returned
Opcode
Write byte to memory
2-byte address in high-byte:low-byte order; low byte followed by data byte
None
$49
Command Sequence
FROM HOST
WRITE
WRITE
ADDRESS
HIGH
ADDRESS
HIGH
ADDRESS
LOW
ADDRESS
LOW
DATA
DATA
ECHO
Table 17-5. IREAD (Indexed Read) Command
Description
Operand
Data Returned
Opcode
Read next 2 bytes in memory from last address accessed
None
Returns contents of next two addresses
$1A
Command Sequence
FROM HOST
IREAD
IREAD
DATA
DATA
ECHO
RETURN
Table 17-6. IWRITE (Indexed Write) Command
Description
Operand
Data Returned
Opcode
Write to last address accessed + 1
Single data byte
None
$19
Command Sequence
FROM HOST
IWRITE
IWRITE
DATA
DATA
ECHO
A sequence of IREAD or IWRITE commands can access a block of memory sequentially over the full
64-Kbyte memory map.
MC68HC908QB8 Data Sheet, Rev. 3
204
Freescale Semiconductor
Monitor Module (MON)
Table 17-7. READSP (Read Stack Pointer) Command
Description
Operand
Data Returned
Opcode
Reads stack pointer
None
Returns incremented stack pointer value (SP + 1) in high-byte:low-byte
order
$0C
Command Sequence
FROM HOST
READSP
SP
HIGH
READSP
SP
LOW
ECHO
RETURN
Table 17-8. RUN (Run User Program) Command
Description
Executes PULH and RTI instructions
Operand
None
Data Returned
None
Opcode
$28
Command Sequence
FROM HOST
RUN
RUN
ECHO
The MCU executes the SWI and PSHH instructions when it enters monitor mode. The RUN command
tells the MCU to execute the PULH and RTI instructions. Before sending the RUN command, the host can
modify the stacked CPU registers to prepare to run the host program. The READSP command returns
the incremented stack pointer value, SP + 1. The high and low bytes of the program counter are at
addresses SP + 5 and SP + 6.
SP
HIGH BYTE OF INDEX REGISTER
SP + 1
CONDITION CODE REGISTER
SP + 2
ACCUMULATOR
SP + 3
LOW BYTE OF INDEX REGISTER
SP + 4
HIGH BYTE OF PROGRAM COUNTER
SP + 5
LOW BYTE OF PROGRAM COUNTER
SP + 6
SP + 7
Figure 17-17. Stack Pointer at Monitor Mode Entry
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
205
Development Support
17.3.2 Security
A security feature discourages unauthorized reading of FLASH locations while in monitor mode. The host
can bypass the security feature at monitor mode entry by sending eight security bytes that match the
bytes at locations $FFF6–$FFFD. Locations $FFF6–$FFFD contain user-defined data.
NOTE
Do not leave locations $FFF6–$FFFD blank. For security reasons, program
locations $FFF6–$FFFD even if they are not used for vectors.
During monitor mode entry, the MCU waits after the power-on reset for the host to send the eight security
bytes on pin PTA0. If the received bytes match those at locations $FFF6–$FFFD, the host bypasses the
security feature and can read all FLASH locations and execute code from FLASH. Security remains
bypassed until a power-on reset occurs. If the reset was not a power-on reset, security remains bypassed
and security code entry is not required. See Figure 17-18.
Upon power-on reset, if the received bytes of the security code do not match the data at locations
$FFF6–$FFFD, the host fails to bypass the security feature. The MCU remains in monitor mode, but
reading a FLASH location returns an invalid value and trying to execute code from FLASH causes an
illegal address reset. After receiving the eight security bytes from the host, the MCU transmits a break
character, signifying that it is ready to receive a command.
NOTE
The MCU does not transmit a break character until after the host sends the
eight security bytes.
VDD
4096 + 32 BUSCLKX4 CYCLES
COMMAND
BYTE 8
BYTE 2
FROM HOST
BYTE 1
RST
PA0
3
BREAK
2
1
COMMAND ECHO
1
BYTE 8 ECHO
Notes:
1 = Echo delay, approximately 2 bit times
2 = Data return delay, approximately 2 bit times
3 = Wait 1 bit time before sending next byte
4 = Wait until clock is stable and monitor runs
1
BYTE 2 ECHO
FROM MCU
3
1
BYTE 1 ECHO
4
Figure 17-18. Monitor Mode Entry Timing
To determine whether the security code entered is correct, check to see if bit 6 of RAM address $80 is
set. If it is, then the correct security code has been entered and FLASH can be accessed.
If the security sequence fails, the device should be reset by a power-on reset and brought up in monitor
mode to attempt another entry. After failing the security sequence, the FLASH module can also be mass
erased by executing an erase routine that was downloaded into internal RAM. The mass erase operation
clears the security code locations so that all eight security bytes become $FF (blank).
MC68HC908QB8 Data Sheet, Rev. 3
206
Freescale Semiconductor
Chapter 18
Electrical Specifications
18.1 Introduction
This section contains electrical and timing specifications.
18.2 Absolute Maximum Ratings
Maximum ratings are the extreme limits to which the microcontroller unit (MCU) can be exposed without
permanently damaging it.
NOTE
This device is not guaranteed to operate properly at the maximum ratings.
Refer to 18.5 5-V DC Electrical Characteristics and 18.8 3-V DC Electrical
Characteristics for guaranteed operating conditions.
Characteristic(1)
Symbol
Value
Unit
Supply voltage
VDD
–0.3 to +6.0
V
Input voltage
VIN
VSS –0.3 to VDD +0.3
V
VTST
VSS –0.3 to +9.1
V
I
±15
mA
IPTA0—IPTA5
±25
mA
Storage temperature
TSTG
–55 to +150
°C
Maximum current out of VSS
IMVSS
100
mA
Maximum current into VDD
IMVDD
100
mA
Mode entry voltage, IRQ pin
Maximum current per pin excluding
PTA0–PTA5, VDD, and VSS
Maximum current for pins PTA0–PTA5
1. Voltages references to VSS.
NOTE
This device contains circuitry to protect the inputs against damage due to
high static voltages or electric fields; however, it is advised that normal
precautions be taken to avoid application of any voltage higher than
maximum-rated voltages to this high-impedance circuit. For proper
operation, it is recommended that VIN and VOUT be constrained to the
range VSS ≤ (VIN or VOUT) ≤ VDD. Reliability of operation is enhanced if
unused inputs are connected to an appropriate logic voltage level (for
example, either VSS or VDD.)
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
207
Electrical Specifications
18.3 Functional Operating Range
Characteristic
Operating temperature range
Operating voltage range
Symbol
Value
Unit
Temperature
Code
TA
(TL to TH)
– 40 to +125
– 40 to +105
– 40 to +85
°C
M
V
C
VDD
2.7 to 5.5
V
—
18.4 Thermal Characteristics
Characteristic
Symbol
Value
Unit
Thermal resistance
16-pin PDIP
16-pin SOIC
16-pin TSSOP
θJA
76
90
133
°C/W
I/O pin power dissipation
PI/O
User determined
W
Power dissipation(1)
PD
PD = (IDD x VDD)
+ PI/O = K/(TJ + 273°C)
W
Constant(2)
K
PD x (TA + 273°C)
+ PD2 x θJA
W/°C
Average junction temperature
TJ
TA + (PD x θJA)
°C
TJM
150
°C
Maximum junction temperature
1. Power dissipation is a function of temperature.
2. K constant unique to the device. K can be determined for a known TA and measured PD. With this value of K, PD and TJ
can be determined for any value of TA.
MC68HC908QB8 Data Sheet, Rev. 3
208
Freescale Semiconductor
5-V DC Electrical Characteristics
18.5 5-V DC Electrical Characteristics
Characteristic(1)
Symbol
Min
Typ(2)
Max
VDD –0.4
VDD –1.5
VDD –0.8
—
—
—
—
—
—
—
—
50
—
—
—
—
—
—
0.4
1.5
0.8
Unit
Output high voltage
ILoad = –2.0 mA, all I/O pins
ILoad = –10.0 mA, all I/O pins
ILoad = –15.0 mA, PTA0, PTA1, PTA3–PTA5 only
VOH
Maximum combined IOH (all I/O pins)
IOHT
Output low voltage
ILoad = 1.6 mA, all I/O pins
ILoad = 10.0 mA, all I/O pins
ILoad = 15.0 mA, PTA0, PTA1, PTA3–PTA5 only
VOL
Maximum combined IOL (all I/O pins)
IOHL
—
—
50
mA
Input high voltage
PTA0–PTA5, PTB0–PTB7
VIH
0.7 x VDD
—
VDD
V
Input low voltage
PTA0–PTA5, PTB0–PTB7
VIL
VSS
—
0.3 x VDD
V
VHYS
0.06 x VDD
—
—
V
IINJ
–2
—
+2
mA
IINJTOT
–25
—
+25
mA
Ports Hi-Z leakage current
IIL
–1
±0.1
+1
μA
Capacitance
Ports (as input)(3)
CIN
—
—
8
pF
VPOR
750
—
—
mV
RPOR
0.035
—
—
V/ms
VTST
VDD + 2.5
—
9.1
V
Pullup resistors
PTA0–PTA5, PTB0–PTB7
RPU
16
26
36
kΩ
Pulldown resistors(7)
PTA0–PTA5
RPD
16
26
36
kΩ
Low-voltage inhibit reset, trip falling voltage
VTRIPF
3.90
4.20
4.50
V
Low-voltage inhibit reset, trip rising voltage
VTRIPR
4.00
4.30
4.60
V
Low-voltage inhibit reset/recover hysteresis
VHYS
—
100
—
mV
Input hysteresis(3)
(4)
DC injection current, all ports
Total dc current injection (sum of all
I/O)(4)
POR rearm voltage
(3)(5)
POR rise time ramp rate
Monitor mode entry voltage
(3)
V
mA
V
(6)
1. VDD = 4.5 to 5.5 Vdc, VSS = 0 Vdc, TA = TL to TH, unless otherwise noted.
2. Typical values reflect average measurements at midpoint of voltage range, 25•C only. Typical values are for reference only
and are not tested in production.
3. Values are based on characterization results, not tested in production.
4. Guaranteed by design, not tested in production.
5. If minimum VDD is not reached before the internal POR reset is released, the LVI will hold the part in reset until minimum
VDD is reached.
6. RPU is measured at VDD = 5.0 V.
7. RPD is measured at VDD = 5.0 V, Pulldown resistors only available when KBIx is enabled with KBIxPOL =1.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
209
Electrical Specifications
18.6 Typical 5-V Output Drive Characteristics
1.6
1.4
VDD-VOH (V)
1.2
1.0
5V PTA
0.8
5V PTB
0.6
0.4
0.2
0.0
0
-5
-10
-15
-20
-25
-30
IOH (mA)
Figure 18-1. Typical 5-Volt Output High Voltage
versus Output High Current (25°C)
1.6
1.4
1.2
VOL (V)
1.0
5V PTA
0.8
5V PTB
0.6
0.4
0.2
0.0
0
5
10
15
20
25
30
IOL (mA)
Figure 18-2. Typical 5-Volt Output Low Voltage
versus Output Low Current (25°C)
MC68HC908QB8 Data Sheet, Rev. 3
210
Freescale Semiconductor
5-V Control Timing
18.7 5-V Control Timing
Characteristic(1)
Symbol
Min
Max
Unit
Internal operating frequency
fOP
(fBUS)
—
8
MHz
Internal clock period (1/fOP)
tcyc
125
—
ns
tRL
100
—
ns
tILIH
100
—
ns
—
tcyc
RST input pulse width low(2)
(2)
IRQ interrupt pulse width low (edge-triggered)
(2)
IRQ interrupt pulse period
tILIL
(3)
Note
1. VDD = 4.5 to 5.5 Vdc, VSS = 0 Vdc, TA = TL to TH; timing shown with respect to 20% VDD and 70% VSS, unless otherwise
noted.
2. Values are based on characterization results, not tested in production.
3. The minimum period is the number of cycles it takes to execute the interrupt service routine plus 1 tcyc.
tRL
RST
tILIL
tILIH
IRQ
Figure 18-3. RST and IRQ Timing
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
211
Electrical Specifications
18.8 3-V DC Electrical Characteristics
Characteristic(1)
Symbol
Min
Typ(2)
Max
VDD –0.3
VDD –1.0
VDD –0.8
—
—
—
—
—
—
—
—
50
—
—
—
—
—
—
0.3
1.0
0.8
Unit
Output high voltage
ILoad = –0.6 mA, all I/O pins
ILoad = –4.0 mA, all I/O pins
ILoad = –10.0 mA, PTA0, PTA1, PTA3–PTA5 only
VOH
Maximum combined IOH (all I/O pins)
IOHT
Output low voltage
ILoad = 0.5 mA, all I/O pins
ILoad = 6.0 mA, all I/O pins
ILoad = 10.0 mA, PTA0, PTA1, PTA3–PTA5 only
VOL
Maximum combined IOL (all I/O pins)
IOHL
—
—
50
mA
Input high voltage
PTA0–PTA5, PTB0–PTB7
VIH
0.7 x VDD
—
VDD
V
Input low voltage
PTA0–PTA5, PTB0–PTB7
VIL
VSS
—
0.3 x VDD
V
VHYS
0.06 x VDD
—
—
V
IINJ
–2
—
+2
mA
IINJTOT
–25
—
+25
mA
Ports Hi-Z leakage current
IIL
–1
±0.1
+1
μA
Capacitance
Ports (as input)(3)
CIN
—
—
8
pF
POR rearm voltage
VPOR
750
—
—
mV
POR rise time ramp rate(3)(5)
RPOR
0.035
—
—
V/ms
VTST
VDD + 2.5
—
VDD + 4.0
V
Pullup
PTA0–PTA5, PTB0–PTB7
RPU
16
26
36
kΩ
Pulldown resistors(7)
PTA0–PTA5
RPD
16
26
36
kΩ
VTRIPF
2.40
2.55
2.70
V
Low-voltage inhibit reset, trip rising voltage
VTRIPR
2.475
2.625
2.775
V
Low-voltage inhibit reset/recover hysteresis
VHYS
—
75
—
mV
Input hysteresis(3)
DC injection current, all ports(4)
(4)
Total dc current injection (sum of all I/O)
Monitor mode entry voltage
(3)
resistors(6)
Low-voltage inhibit reset, trip falling voltage
(6)
V
mA
V
1. VDD = 2.7 to 3.3 Vdc, VSS = 0 Vdc, TA = TL to TH, unless otherwise noted.
2. Typical values reflect average measurements at midpoint of voltage range, 25•C only. Typical values are for reference only
and are not tested in production.
3. Values are based on characterization results, not tested in production.
4. Guaranteed by design, not tested in production.
5. If minimum VDD is not reached before the internal POR reset is released, the LVI will hold the part in reset until minimum
VDD is reached.
6. RPU is measured at VDD = 3.0 V
7. RPD is measured at VDD = 3.0 V, Pulldown resistors only available when KBIx is enabled with KBIxPOL =1.
MC68HC908QB8 Data Sheet, Rev. 3
212
Freescale Semiconductor
Typical 3-V Output Drive Characteristics
18.9 Typical 3-V Output Drive Characteristics
1.2
1.0
VDD-VOH (V)
0.8
3V PTA
0.6
3V PTB
0.4
0.2
0.0
0
-5
-10
-15
-20
-25
IOH (mA)
Figure 18-4. Typical 3-Volt Output High Voltage
versus Output High Current (25°C)
1.2
1.0
0.8
VOL (V)
3V PTA
0.6
3V PTB
0.4
0.2
0.0
0
5
10
15
20
25
IOL (mA)
Figure 18-5. Typical 3-Volt Output Low Voltage
versus Output Low Current (25°C)
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
213
Electrical Specifications
18.10 3-V Control Timing
Characteristic(1)
Symbol
Min
Max
Unit
Internal operating frequency
fOP (fBus)
—
4
MHz
Internal clock period (1/fOP)
tcyc
250
—
ns
tRL
200
—
ns
tILIH
200
—
ns
—
tcyc
RST input pulse width low(2)
(2)
IRQ interrupt pulse width low (edge-triggered)
(2)
IRQ interrupt pulse period
tILIL
(3)
Note
1. VDD = 2.7 to 3.3 Vdc, VSS = 0 Vdc, TA = TL to TH; timing shown with respect to 20% VDD and 70% VDD, unless otherwise
noted.
2. Values are based on characterization results, not tested in production.
3. The minimum period is the number of cycles it takes to execute the interrupt service routine plus 1 tcyc.
tRL
RST
tILIL
tILIH
IRQ
Figure 18-6. RST and IRQ Timing
MC68HC908QB8 Data Sheet, Rev. 3
214
Freescale Semiconductor
Oscillator Characteristics
18.11 Oscillator Characteristics
Characteristic
Symbol
Min
Typ
Max
—
—
—
4
8
12.8
—
—
—
Unit
(1)
Internal oscillator frequency
ICFS1:ICFS0 = 00
ICFS1:ICFS0 = 01
ICFS1:ICFS0 = 10 (not allowed if VDD <2.7V)
fINTCLK
MHz
Trim accuracy(2)(3)
ΔTRIM_ACC
—
± 0.4
—
%
Deviation from trimmed Internal oscillator(3)(4)
4, 8, 12.8MHz, VDD ± 10%, 0 to 70°C
4, 8, 12.8MHz, VDD ± 10%, –40 to 125°C
ΔINT_TRIM
—
—
±2
—
—
±5
%
External RC oscillator frequency, RCCLK (1)(3)
fRCCLK
2
—
10
MHz
fOSCXCLK
dc
dc
—
32
16
MHz
External clock reference frequencyy(1)(5)(6)
VDD ≥ 4.5V
VDD < 4.5V
RC oscillator external resistor(3)
VDD = 5 V
VDD = 3 V
REXT
Crystal frequency, XTALCLK(1)(7)(8)
ECFS1:ECFS0 = 00 ( VDD ≥ 4.5 V)
ECFS1:ECFS0 = 00
ECFS1:ECFS0 = 01
ECFS1:ECFS0 = 10
fOSCXCLK
ECFS1:ECFS0 = 00 (9)
Feedback bias resistor
Crystal load capacitance(10)
Crystal capacitors(10)
RB
CL
C1,C2
See Figure 18-7
See Figure 18-8
8
8
1
30
—
—
32
16
8
100
MHz
MHz
MHz
kHz
—
—
—
1
20
(2 x CL) – 5pF
—
—
—
MΩ
pF
pF
20
10
0
5
18
(2 x CL) –10 pF
—
—
—
—
—
—
kΩ
kΩ
kΩ
MΩ
pF
pF
32
—
kHz
ECFS1:ECFS0 = 01(9)
Crystal series damping resistor
fOSCXCLK = 1 MHz
fOSCXCLK = 4 MHz
fOSCXCLK = 8 MHz
Feedback bias resistor
Crystal load capacitance(10)
Crystal capacitors(10)
RB
CL
C1,C2
—
—
—
—
—
—
AWU module internal RC oscillator frequency
fINTRC
—
RS
1. Bus frequency, fOP, is oscillator frequency divided by 4.
2. Factory trimmed to provided 12.8MHz accuracy requirement (± 5%, @25•C) for forced monitor mode communication. User
should trim in-circuit to obtain the most accurate internal oscillator frequency for his application.
3. Values are based on characterization results, not tested in production.
4. Deviation values assumes trimming in target application @25•C and midpoint of voltage range, for example 5.0 V for 5 V
± 10% operation.
5. No more than 10% duty cycle deviation from 50%.
6. When external oscillator clock is greater than 1MHz, ECFS1:ECFS0 must be 00 or 01
7. Use fundamental mode only, do not use overtone crystals or overtone ceramic resonators
8. Due to variations in electrical properties of external components such as, ESR and Load Capacitance, operation above
16 MHz is not guaranteed for all crystals or ceramic resonators. Operation above 16 MHz requires that a Negative Resistance Margin (NRM) characterization and component optimization be performed by the crystal or ceramic resonator vendor
for every different type of crystal or ceramic resonator which will be used. This characterization and optimization must be
performed at the extremes of voltage and temperature which will be applied to the microcontroller in the application. The
NRM must meet or exceed 10x the maximum ESR of the crystal or ceramic resonator for acceptable performance.
9. Do not use damping resistor when ECFS1:ECFS0 = 00 or 10
10. Consult crystal vendor data sheet.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
215
Electrical Specifications
12
5V 25 oC
RC FREQUENCY,RCCLK
f
(MHz)
10
8
6
4
2
0
0
10
20
30
40
50
60
Rext (k ohms)
Figure 18-7. RC versus Frequency (5 Volts @ 25°C)
12
3V 25 oC
RC FREQUENCY,RCCLK
f
(MHz)
10
8
6
4
2
0
0
10
20
30
40
50
60
Rext (k ohms)
Figure 18-8. RC versus Frequency (3 Volts @ 25°C)
MC68HC908QB8 Data Sheet, Rev. 3
216
Freescale Semiconductor
Supply Current Characteristics
18.12 Supply Current Characteristics
Voltage
Bus
Frequency
(MHz)
Symbol
Typ(2)
Max
Unit
Run mode VDD supply current(3)
5.0
3.0
3.2
3.2
RIDD
7.25
3.1
8.5
3.8
mA
Wait mode VDD supply current(4)
5.0
3.0
3.2
3.2
WIDD
1.0
0.67
2.0
1.2
mA
0.26
—
—
12
125
1.0
2.0
5.0
—
—
0.23
—
—
2
100
0.8
1.0
4.0
—
—
Characteristic(1)
Stop mode VDD supply current(5)
–40 to 85°C
–40 to 105°C
–40 to 125°C
25°C with auto wake-up enabled(6)
Incremental current with LVI enabled
Stop mode VDD supply current(4)
–40 to 85°C
–40 to 105°C
–40 to 125°C
25°C with auto wake-up enabled(6)
Incremental current with LVI enabled
5.0
SIDD
3.0
μA
μA
1. VSS = 0 Vdc, TA = TL to TH, unless otherwise noted.
2. Typical values reflect average measurements, 25•C only. Typical values are for reference only and are not tested in production.
3. Run (operating) IDD measured using trimmed internal oscillator, ADC off, all modules enabled. All pins configured as inputs
and tied to 0.2 V from rail.
4. Wait IDD measured using trimmed internal oscillator, ADC off, all modules enabled. All pins configured as inputs and tied
to 0.2 V from rail.
5. Stop IDD measured with all pins configured as inputs and tied to 0.2 V from rail.
6. Values are based on characterization results, not tested in production.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
217
Electrical Specifications
14
13
12
Internal OSC (No A/D, ESCI, SPI)
11
Internal OSC all Modules enabled
10
9
Crystal (No A/D)
IDD
8
Crystal All Modules Enabled
7
6
External Reference No A/D
5
External Reference All modules
enabled
4
3
2
1
0
0
1
2
3
4
5
6
7
8
9
BUS FREQUENCY (MHz)
Figure 18-9. Typical 5-Volt Run Current
versus Bus Frequency (25•C)
4.5
4
3.5
IDD (mA)
3
Internal OSC (No A/D, ESCI, SPI)
Internal OSC all Modules enabled
2.5
Crystal (No A/D)
Crystal All Modules Enabled
2
1.5
1
0.5
0
0
1
2
3
4
5
BUS FREQUENCY (MHz)
Figure 18-10. Typical 3-Volt Run Current
versus Bus Frequency (25•C)
MC68HC908QB8 Data Sheet, Rev. 3
218
Freescale Semiconductor
ADC10 Characteristics
18.13 ADC10 Characteristics
Characteristic
Conditions
Supply voltage
Absolute
Supply Current
ADLPC = 1
ADLSMP = 1
ADCO = 1
VDD < 3.3 V (3.0 V Typ)
Supply current
ADLPC = 1
ADLSMP = 0
ADCO = 1
VDD < 3.3 V (3.0 V Typ)
Supply current
ADLPC = 0
ADLSMP = 1
ADCO = 1
VDD < 3.3 V (3.0 V Typ)
Supply current
ADLPC = 0
ADLSMP = 0
ADCO = 1
VDD < 3.3 V (3.0 V Typ)
VDD < 5.5 V (5.0 V Typ)
VDD < 5.5 V (5.0 V Typ)
Symbol
Min
Typ(1)
Max
Unit
VDD
2.7
—
5.5
V
—
55
—
—
75
—
—
120
—
—
175
—
—
140
—
—
180
—
—
340
—
—
440
615
0.40(3)
—
2.00
0.40(3)
—
1.00
19
19
21
39
39
41
16
16
18
36
36
38
4
4
4
24
24
24
tADCK
cycles
IDD
(2)
IDD
(2)
IDD
VDD < 5.5 V (5.0 V Typ)
fADCK
Low power (ADLPC = 1)
Conversion time (4)
8-bit Mode
μA
Short sample (ADLSMP = 0)
Long sample (ADLSMP = 1)
tADC
Short sample (ADLSMP = 0)
Long sample (ADLSMP = 1)
tADC
Short sample (ADLSMP = 0)
Sample time
Long sample (ADLSMP = 1)
μA
μA
(2)
High speed (ADLPC = 0)
ADC internal clock
Conversion time (4)
10-bit Mode
μA
IDD(2)
VDD < 5.5 V (5.0 V Typ)
tADS
Comment
MHz
tADCK = 1/fADCK
tADCK
cycles
tADCK
cycles
Input voltage
VADIN
VSS
—
VDD
V
Input capacitance
CADIN
—
7
10
pF
Not tested
Input impedance
RADIN
—
5
15
kΩ
Not tested
RAS
—
—
10
kΩ
External to
MCU
1.758
5
5.371
mV
7.031
20
21.48
VREFH/2N
0
±1.5
±2.5
LSB
Includes
quantization
Analog source impedance
10-bit mode
Ideal resolution (1 LSB)
RES
8-bit mode
10-bit mode
Total unadjusted error
8-bit mode
ETUE
10-bit mode
0
±0.7
±1.0
0
±0.5
—
0
±0.3
—
DNL
Differential non-linearity
8-bit mode
LSB
Monotonicity and no-missing-codes guaranteed
— Continued on next page
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
219
Electrical Specifications
Characteristic
Conditions
Symbol
10-bit mode
Integral non-linearity
10-bit mode
Zero-scale error
8-bit mode
EZS
10-bit mode
Full-scale error
8-bit mode
EFS
10-bit mode
Quantization error
8-bit mode
EQ
10-bit mode
Input leakage error
8-bit mode
Bandgap voltage
Typ(1)
Max
0
±0.5
—
0
±0.3
—
0
±0.5
—
0
±0.3
—
0
±0.5
—
0
±0.3
—
—
—
±0.5
—
—
±0.5
0
±0.2
±5
INL
8-bit mode
(3)(6)
Min
EIL
VBG
Unit
Comment
LSB
0
±0.1
±1.2
1.17
1.245
1.32
LSB
VADIN = VSS
LSB
VADIN = VDD
LSB
8-bit mode is
not truncated
LSB
Pad leakage(5)
* RAS
V
1. Typical values assume VDD = 5.0 V, temperature = 25•C, fADCK = 1.0 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
2. Incremental IDD added to MCU mode current.
3. Values are based on characterization results, not tested in production.
4. Reference the ADC module specification for more information on calculating conversion times.
5. Based on typical input pad leakage current.
6. LVI must be enabled, (LVIPWRD = 0, in CONFIG1). Voltage input to ADCH4:0 = $1A, an ADC conversion on this channel
allows user to determine supply voltage.
MC68HC908QB8 Data Sheet, Rev. 3
220
Freescale Semiconductor
5.0-Volt SPI Characteristics
18.14 5.0-Volt SPI Characteristics
Diagram
Number(1)
Characteristic(2)
Symbol
Min
Max
Unit
Operating frequency
Master
Slave
fOP(M)
fOP(S)
fOP/128
dc
fOP/2
fOP
MHz
MHz
1
Cycle time
Master
Slave
tcyc(M)
tcyc(S)
2
1
128
—
tcyc
tcyc
2
Enable lead time
tLead(S)
1
—
tcyc
3
Enable lag time
tLag(S)
1
—
tcyc
4
Clock (SPSCK) high time
Master
Slave
tSCKH(M)
tSCKH(S)
tcyc –25
1/2 tcyc –25
64 tcyc
—
ns
ns
5
Clock (SPSCK) low time
Master
Slave
tSCKL(M)
tSCKL(S)
tcyc –25
1/2 tcyc –25
64 tcyc
—
ns
ns
6
Data setup time (inputs)
Master
Slave
tSU(M)
tSU(S)
30
30
—
—
ns
ns
7
Data hold time (inputs)
Master
Slave
tH(M)
tH(S)
30
30
—
—
ns
ns
8
Access time, slave(3)
CPHA = 0
CPHA = 1
tA(CP0)
tA(CP1)
0
0
40
40
ns
ns
9
Disable time, slave(4)
tDIS(S)
—
40
ns
10
Data valid time, after enable edge
Master
Slave(5)
tV(M)
tV(S)
—
—
50
50
ns
ns
11
Data hold time, outputs, after enable edge
Master
Slave
tHO(M)
tHO(S)
0
0
—
—
ns
ns
1. Numbers refer to dimensions in Figure 18-11 and Figure 18-12.
2. All timing is shown with respect to 20% VDD and 70% VDD, unless noted; 100 pF load on all SPI pins.
3. Time to data active from high-impedance state
4. Hold time to high-impedance state
5. With 100 pF on all SPI pins
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
221
Electrical Specifications
18.15 3.0-Volt SPI Characteristics
Diagram
Number(1)
Characteristic(2)
Symbol
Min
Max
Unit
Operating frequency
Master
Slave
fOP(M)
fOP(S)
fOP/128
DC
fOP/2
fOP
MHz
MHz
1
Cycle time
Master
Slave
tcyc(M)
tcyc(S)
2
1
128
—
tcyc
tcyc
2
Enable lead time
tLead(S)
1
—
tcyc
3
Enable lag time
tLag(S)
1
—
tcyc
4
Clock (SPSCK) high time
Master
Slave
tSCKH(M)
tSCKH(S)
tcyc –35
1/2 tcyc –35
64 tcyc
—
ns
ns
5
Clock (SPSCK) low time
Master
Slave
tSCKL(M)
tSCKL(S)
tcyc –35
1/2 tcyc –35
64 tcyc
—
ns
ns
6
Data setup time (inputs)
Master
Slave
tSU(M)
tSU(S)
40
40
—
—
ns
ns
7
Data hold time (inputs)
Master
Slave
tH(M)
tH(S)
40
40
—
—
ns
ns
8
Access time, slave(3)
CPHA = 0
CPHA = 1
tA(CP0)
tA(CP1)
0
0
50
50
ns
ns
9
Disable time, slave(4)
tDIS(S)
—
50
ns
10
Data valid time, after enable edge
Master
Slave(5)
tV(M)
tV(S)
—
—
60
60
ns
ns
11
Data hold time, outputs, after enable edge
Master
Slave
tHO(M)
tHO(S)
0
0
—
—
ns
ns
1. Numbers refer to dimensions in Figure 18-11 and Figure 18-12.
2. All timing is shown with respect to 20% VDD and 70% VDD, unless noted; 100 pF load on all SPI pins.
3. Time to data active from high-impedance state
4. Hold time to high-impedance state
5. With 100 pF on all SPI pins
MC68HC908QB8 Data Sheet, Rev. 3
222
Freescale Semiconductor
3.0-Volt SPI Characteristics
SS
INPUT
SS PIN OF MASTER HELD HIGH
1
SPSCK OUTPUT
CPOL = 0
NOTE
SPSCK OUTPUT
CPOL = 1
NOTE
5
4
5
4
6
MISO
INPUT
MSB IN
BITS 6–1
11
MOSI
OUTPUT
MASTER MSB OUT
7
LSB IN
10
11
BITS 6–1
MASTER LSB OUT
Note: This first clock edge is generated internally, but is not seen at the SPSCK pin.
a) SPI Master Timing (CPHA = 0)
SS
INPUT
SS PIN OF MASTER HELD HIGH
1
SPSCK OUTPUT
CPOL = 0
5
NOTE
4
SPSCK OUTPUT
CPOL = 1
5
NOTE
4
6
MISO
INPUT
MSB IN
10
MOSI
OUTPUT
BITS 6–1
11
MASTER MSB OUT
7
LSB IN
10
BITS 6–1
MASTER LSB OUT
Note: This last clock edge is generated internally, but is not seen at the SPSCK pin.
b) SPI Master Timing (CPHA = 1)
Figure 18-11. SPI Master Timing
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
223
Electrical Specifications
SS
INPUT
3
1
SPSCK INPUT
CPOL = 0
5
4
2
SPSCK INPUT
CPOL = 1
5
4
9
8
MISO
INPUT
SLAVE
MSB OUT
6
MOSI
OUTPUT
BITS 6–1
7
NOTE
11
11
10
MSB IN
SLAVE LSB OUT
BITS 6–1
LSB IN
Note: Not defined but normally MSB of character just received
a) SPI Slave Timing (CPHA = 0)
SS
INPUT
1
SPSCK INPUT
CPOL = 0
5
4
2
3
SPSCK INPUT
CPOL = 1
8
MISO
OUTPUT
MOSI
INPUT
5
4
10
NOTE
9
SLAVE
MSB OUT
6
7
BITS 6–1
11
10
MSB IN
SLAVE LSB OUT
BITS 6–1
LSB IN
Note: Not defined but normally LSB of character previously transmitted
b) SPI Slave Timing (CPHA = 1)
Figure 18-12. SPI Slave Timing
MC68HC908QB8 Data Sheet, Rev. 3
224
Freescale Semiconductor
Timer Interface Module Characteristics
18.16 Timer Interface Module Characteristics
Characteristic
Timer input capture pulse width
Symbol
Min
Max
Unit
tTH, tTL
2
—
tcyc
tTLTL
Note(2)
—
tcyc
tTCL, tTCH
tcyc + 5
—
ns
(1)
Timer input capture period
Timer input clock pulse width
(1)
1. Values are based on characterization results, not tested in production.
2. The minimum period is the number of cycles it takes to execute the interrupt service routine plus 1 tcyc.
tTLTL
tTH
INPUT CAPTURE
RISING EDGE
tTLTL
tTL
INPUT CAPTURE
FALLING EDGE
tTLTL
tTH
tTL
INPUT CAPTURE
BOTH EDGES
tTCH
TCLK
tTCL
Figure 18-13. Timer Input Timing
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
225
Electrical Specifications
18.17 Memory Characteristics
Symbol
Min
Typ(1)
Max
Unit
VRDR
1.3
—
—
V
—
1
—
—
MHz
VPGM/ERASE
2.7
—
5.5
V
fRead(3)
0
—
8M
Hz
FLASH page erase time
<1 K cycles
>1 K cycles
tErase
0.9
3.6
1
4
1.1
5.5
ms
FLASH mass erase time
tMErase
4
—
—
ms
FLASH PGM/ERASE to HVEN setup time
tNVS
10
—
—
μs
FLASH high-voltage hold time
tNVH
5
—
—
μs
FLASH high-voltage hold time (mass erase)
tNVHL
100
—
—
μs
FLASH program hold time
tPGS
5
—
—
μs
FLASH program time
tPROG
30
—
40
μs
FLASH return to read time
tRCV(4)
1
—
—
μs
FLASH cumulative program HV period
tHV(5)
—
—
4
ms
FLASH endurance(6)
—
10 k
100 k
—
Cycles
FLASH data retention time(7)
—
15
100
—
Years
Characteristic
RAM data retention voltage (2)
FLASH program bus clock frequency
FLASH PGM/ERASE supply voltage (VDD)
FLASH read bus clock frequency
1. Typical values are for reference only and are not tested in production.
2. Values are based on characterization results, not tested in production.
3. fRead is defined as the frequency range for which the FLASH memory can be read.
4. tRCV is defined as the time it needs before the FLASH can be read after turning off the high voltage charge pump, by clearing HVEN to 0.
5. tHV is defined as the cumulative high voltage programming time to the same row before next erase.
tHV must satisfy this condition: tNVS + tNVH + tPGS + (tPROG x 32) ≤ tHV maximum.
6. Typical endurance was evaluated for this product family. For additional information on how Freescale Semiconductor
defines Typical Endurance, please refer to Engineering Bulletin EB619.
7. Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated
to 25•C using the Arrhenius equation. For additional information on how Freescale Semiconductor defines Typical Data
Retention, please refer to Engineering Bulletin EB618.
MC68HC908QB8 Data Sheet, Rev. 3
226
Freescale Semiconductor
Chapter 19
Ordering Information and Mechanical Specifications
19.1 Introduction
This section contains order numbers for the MC68HC908QB8, MC68HC908QB4, and MC68HC908QY8.
Dimensions are given for:
• 16-pin PDIP
• 16-pin SOIC
• 16-pin thin shrink small outline packages (TSSOP)
19.2 MC Order Numbers
Table 19-1. MC Order Numbers
MC Order Number
Package
MC908QB8
16-pins
PDIP, SOIC, and TSSOP
MC908QB4
MC908QY8
Temperature and package designators:
C = –40•C to +85•C
V = –40•C to +105•C
M = –40•C to +125•C
P = Plastic dual in-line package (PDIP)
DW = Small outline integrated circuit package (SOIC)
DT = Thin shrink small outline package (TSSOP)
E = Lead free
MC908QB8 X XX E
FAMILY
INDICATES Pb-FREE PACKAGE
PACKAGE DESIGNATOR
TEMPERATURE RANGE
Figure 19-1. Device Numbering System
19.3 Package Dimensions
Refer to the following pages for detailed package dimensions.
MC68HC908QB8 Data Sheet, Rev. 3
Freescale Semiconductor
227
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MC68HC908QB8
Rev. 3, 04/2010
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