Ultra Low Power/High Speed CMOS SRAM 1M X 8 bit BH62UV8001 Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC low operation voltage : 1.65V ~ 3.6V Ÿ Ultra low power consumption : VCC = 3.6V Operation current : 12mA (Max.)at 55ns 2mA (Max.) at 1MHz Standby current : 2.5uA (Typ.) at 3.0V/25OC VCC = 1.2V Data retention current : 1.2uA (Typ.) at 25OC Ÿ High speed access time : -55 55ns (Max.) at VCC=1.65~3.6V Ÿ Automatic power down when chip is deselected Ÿ Easy expansion with CE1, CE2 and OE options Ÿ Three state outputs and TTL compatible Ÿ Fully static operation, no clock, no refresh Ÿ Data retention supply voltage as low as 1.0V The BH62UV8001 is a high performance, ultra low power CMOS Static Random Access Memory organized as 1,048,576 by 8 bits and operates in a wide range of 1.65V to 3.6V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with typical operating current of 1.5mA at 1MHz at 3.6V/25OC and maximum access time of 55ns at 1.65V/85OC. Easy memory expansion is provided by an active LOW chip enable (CE1), an active HIGH chip enable (CE2) and active LOW output enable (OE) and three-state output drivers. The BH62UV8001 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BH62UV8001 is available in DICE form and 48-ball BGA package. n POWER CONSUMPTION POWER DISSIPATION PRODUCT FAMILY BH62UV8001DI BH62UV8001AI STANDBY OPERATING TEMPERATURE Operating (ICCSB1, Max) VCC=3.6V VCC=1.8V 15uA 12uA 1MHz fMax. 2mA 6mA 12mA 3 4 5 6 A NC OE A0 A1 A2 CE2 B NC NC A3 A4 CE1 NC C DQ0 NC A5 A6 NC DQ4 D VSS DQ1 A17 A7 DQ5 VCC NC A16 DQ6 DQ3 NC A14 A15 NC DQ7 G NC NC A12 A13 WE NC A18 A8 A9 A10 A11 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 5mA 8mA Address 1024 10 Input Row Buffer Decoder Memory Array 1024 x 8192 8192 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 VSS F H 1.5mA n BLOCK DIAGRAM 2 DQ2 fMax. BGA-48-0608 1 VCC 1MHz VCC=1.8V 10MHz DICE Industrial -40OC to +85OC n PIN CONFIGURATIONS E PKG TYPE (ICC, Max) VCC=3.6V 10MHz CE1 CE2 WE OE VCC GND A19 8 8 Data Input Buffer Data Output Buffer 8 Column I/O Write Driver Sense Amp 8 1024 Column Decoder 10 Control Address Input Buffer A19 A18 A17 A15 A14 A13 A16 A2 A1 A0 48-ball BGA top view Brilliance Semiconductor, Inc. reserves the right to change products and specifications without notice. Detailed product characteristic test report is available upon request and being accepted. R0201-BH62UV8001 1 Revision 1.1 May 2006 BH62UV8001 n PIN DESCRIPTIONS Name Function A0-A19 Address Input These 20 address inputs select one of the 1,048,576 x 8 bit in the RAM CE1 Chip Enable 1 Input CE2 Chip Enable 2 Input CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active when data read from or write to the device. If either chip enable is not active, the device is deselected and is in standby power mode. The DQ pins will be in the high impedance state when the device is deselected. WE Write Enable Input The write enable input is active LOW and controls read and write operations. With the chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location. OE Output Enable Input The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impendence state when OE is inactive. DQ0-DQ7 Data Input/Output Ports VCC 8 bi-directional ports are used to read data from or write data into the RAM. Power Supply VSS Ground n TRUTH TABLE MODE CE1 CE2 WE OE I/O OPERATION VCC CURRENT Chip De-selected (Power Down) H X X X X L X X High Z ICCSB, ICCSB1 Output Disabled L H H H High Z ICC Read L H H L DOUT ICC Write L H L X DIN ICC NOTES: H means VIH; L means VIL; X means don’t care (Must be VIH or VIL state) n ABSOLUTE MAXIMUM RATINGS SYMBOL VTERM TBIAS TSTG PARAMETER Terminal Voltage with Respect to GND Temperature Under Bias Storage Temperature (1) RATING (2) -0.5 to 4.6V n OPERATING RANGE UNITS RANG AMBIENT TEMPERATURE VCC V Industrial -40OC to + 85OC 1.65V ~ 3.6V -40 to +125 O C -60 to +150 O C PT Power Dissipation 1.0 W IOUT DC Output Current 20 mA n CAPACITANCE (1) O (TA = 25 C, f = 1.0MHz) SYMBOL PAMAMETER CONDITIONS MAX. UNITS CIN 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. –2.0V in case of AC pulse width less than 30 ns R0201-BH62UV8001 CIO Input Capacitance Input/Output Capacitance VIN = 0V 6 pF VI/O = 0V 8 pF 1. This parameter is guaranteed and not 100% tested. 2 Revision 1.1 May 2006 BH62UV8001 O O n DC ELECTRICAL CHARACTERISTICS (TA = -40 C to +85 C) PARAMETER NAME PARAMETER VCC Power Supply VIL Input Low Voltage TEST CONDITIONS VCC=1.8V MIN. TYP.(1) MAX. UNITS 1.65 -- 3.6 V -0.3(2) -- VCC=3.6V VIH Input High Voltage IIL Input Leakage Current ILO Output Leakage Current VOL Output Low Voltage VOH ICC ICC1 ICCSB ICCSB1 VCC=1.8V 1.4 VCC=3.6V 2.2 VIN = 0V to VCC, CE1 = VIH or CE2 = VIL VI/O = 0V to V CC, CE1 = VIH or CE2 = VIL or OE = VIH V -- -- 1 uA -- -- 1 uA -- -- VCC=1.8V VCC=3.6V V CC = Min, IOH = -0.1mA VCC=1.8V VCC-0.2 V CC = Min, IOH = -1.0mA VCC=3.6V 2.4 Operating Power Supply Current CE1 = VIL, CE2 = VIH, IDQ = 0mA, f = FMAX(4) VCC=1.8V Operating Power Supply Current CE1 = VIL and CE2 = VIH, IDQ = 0mA, f = 1MHz VCC=1.8V Standby Current – TTL CE1 = VIH, or CE2 = VIL, IDQ = 0mA VCC=1.8V -- -- VCC=3.6V -- VCC=3.6V -- CE1≧VCC-0.2V or CE2≦0.2V, VCC=1.8V VCC=3.6V 0.2 0.4 -8 8 12 1.0 1.5 1.5 2.0 -- V V 6 VCC=3.6V VIN≧V CC-0.2V or VIN≦0.2V V VCC+0.3(3) V CC = Max, IOL = 2.0mA Standby Current – CMOS 0.6 -- V CC = Max, IOL = 0.1mA Output High Voltage 0.4 mA 0.5 1.0 mA mA 2.0 12 2.5(5) 15 MIN. TYP. (1) MAX. UNITS 1.0 -- -- V -- 1.2 7.0 uA 0 -- -- ns tRC (2) -- -- ns -- uA 1. Typical characteristics are at TA=25OC and not 100% tested. 2. Undershoot: -1.0V in case of pulse width less than 20 ns. 3. Overshoot: VCC+1.0V in case of pulse width less than 20 ns. 4. FMAX=1/tRC. 5. VCC=3.0V O O n DATA RETENTION CHARACTERISTICS (TA = -40 C to +85 C) SYMBOL VDR (3) ICCDR tCDR tR PARAMETER VCC for Data Retention Data Retention Current Chip Deselect to Data Retention Time TEST CONDITIONS CE1≧VCC-0.2V or CE2≦0.2V, VIN≧VCC-0.2V or VIN≦0.2V CE1≧VCC-0.2V or CE2≦0.2V, VIN≧VCC-0.2V or VIN≦0.2V VCC=1.2V See Retention Waveform Operation Recovery Time 1. Typical characteristics are at TA=25OC and not 100% tested. 2. tRC = Read Cycle Time. n LOW VCC DATA RETENTION WAVEFORM (1) (CE1 Controlled) Data Retention Mode VCC VDR≧1.0V VCC tCDR CE1 R0201-BH62UV8001 VCC tR CE1≧VCC - 0.2V VIH 3 VIH Revision 1.1 May 2006 BH62UV8001 n LOW VCC DATA RETENTION WAVEFORM (2) (CE2 Controlled) Data Retention Mode VDR≧1.0V VCC VCC VCC tCDR tR CE2≦0.2V CE2 VIL VIL n AC TEST CONDITIONS n KEY TO SWITCHING WAVEFORMS (Test Load and Input/Output Reference) Input Pulse Levels VCC / 0V Input Rise and Fall Times 1V/ns Input and Output Timing Reference Level tCLZ1, tCLZ2, tOLZ, tCHZ1, tCHZ2, tOHZ, tWHZ, tOW Output Load Others WAVEFORM 0.5Vcc CL = 5pF+1TTL CL = 30pF+1TTL ALL INPUT PULSES 1 TTL Output CL(1) VCC GND 90% 90% 10% → ← Rise Time: 1V/ns 10% → ← Fall Time: 1V/ns INPUTS OUTPUTS MUST BE STEADY MUST BE STEADY MAY CHANGE FROM “H” TO “L” WILL BE CHANGE FROM “H” TO “L” MAY CHANGE FROM “L” TO “H” WILL BE CHANGE FROM “L” TO “H” DON’T CARE ANY CHANGE PERMITTED CHANGE : STATE UNKNOW DOES NOT APPLY CENTER LINE IS HIGH INPEDANCE “OFF” STATE 1. Including jig and scope capacitance. O O n AC ELECTRICAL CHARACTERISTICS (TA = -40 C to +85 C) READ CYCLE JEDEC PARAMETER NAME PARANETER NAME tAVAX tRC tAVQX tAA tE1LQV tACS1 Chip Select Access Time tE2LQV tACS2 Chip Select Access Time tGLQV tOE tE1LQX tCLZ1 Chip Select to Output Low Z tE2LQX tCLZ2 Chip Select to Output Low Z tGLQX tOLZ Output Enable to Output Low Z tE1HQZ tCHZ1 Chip Select to Output High Z tE2HQZ tCHZ2 Chip Select to Output High Z tGHQZ tOHZ tAVQX tOH R0201-BH62UV8001 CYCLE TIME : 55ns DESCRIPTION UNITS MIN. TYP. MAX. Read Cycle Time 55 -- -- ns Address Access Time -- -- 55 ns (CE1) -- -- 55 ns (CE2) -- -- 55 ns -- -- 30 ns (CE1) 10 -- -- ns (CE2) 10 -- -- ns 5 -- -- ns (CE1) -- -- 25 ns (CE2) -- -- 25 ns Output Enable to Output High Z -- -- 25 ns Data Hold from Address Change 10 -- -- ns Output Enable to Output Valid 4 Revision 1.1 May 2006 BH62UV8001 n SWITCHING WAVEFORMS (READ CYCLE) READ CYCLE 1 (1,2,4) tRC ADDRESS tAA tOH tOH DOUT READ CYCLE 2 (1,3,4) CE1 tACS1 CE2 tACS2 tCLZ tCHZ1, tCHZ2 (5) (5) DOUT READ CYCLE 3 (1, 4) tRC ADDRESS tAA OE tOH tOE tOLZ CE1 (5) tACS1 tCLZ1 CE2 tOHZ (5) tCHZ1 (1,5) tCHZ2 (2,5) tACS2 (5) tCLZ2 DOUT NOTES: 1. WE is high in read Cycle. 2. Device is continuously selected when CE1 = VIL and CE2= VIH. 3. Address valid prior to or coincident with CE1 transition low and/or CE2 transition high. 4. OE = VIL. 5. Transition is measured ± 500mV from steady state with CL = 5pF. The parameter is guaranteed but not 100% tested. R0201-BH62UV8001 5 Revision 1.1 May 2006 BH62UV8001 O O n AC ELECTRICAL CHARACTERISTICS (TA = -40 C to +85 C) WRITE CYCLE JEDEC PARAMETER NAME PARANETER NAME tAVAX tWC tAVWL CYCLE TIME : 55ns DESCRIPTION UNITS MIN. TYP. MAX. Write Cycle Time 55 -- -- ns tAS Address Set up Time 0 -- -- ns tAVWH tAW Address Valid to End of Write 45 -- -- ns tELWH tCW Chip Select to End of Write 45 -- -- ns tWLWH tWP Write Pulse Width 35 -- -- ns tWHAX tWR1 Write Recovery Time (CE1, WE) 0 -- -- ns tE2LAX tWR2 Write Recovery Time (CE2) 0 -- -- ns tWLQZ tWHZ Write to Output High Z -- -- 20 ns tDVWH tDW Data to Write Time Overlap 25 -- -- ns tWHDX tDH Data Hold from Write Time 0 -- -- ns tGHQZ tOHZ Output Disable to Output in High Z -- -- 25 ns tWHQX tOW End of Write to Output Active 5 -- -- ns n SWITCHING WAVEFORMS (WRITE CYCLE) WRITE CYCLE 1 (1) tWC ADDRESS tWR1 (3) tWR2 (3) OE CE1 (5) CE2 (5) tAW WE (11) tCW (11) tWP tAS tOHZ tCW (2) (4,10) DOUT tDH tDW DIN R0201-BH62UV8001 6 Revision 1.1 May 2006 BH62UV8001 WRITE CYCLE 2 (1,6) tWC ADDRESS (5) CE1 CE2 tCW (11) tCW (11) (5) tAW tWP WE tAS tWHZ tWR2 (2) (3) (4,10) tOW (7) (8) DOUT tDW tDH (8,9) DIN NOTES: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE1 and CE2 active and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. tWR is measured from the earlier of CE1 or WE going high or CE2 going low at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE1 is low and CE2 is high during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. Transition is measured ± 500mV from steady state with CL = 5pF. The parameter is guaranteed but not 100% tested. 11. tCW is measured from the later of CE1 going low or CE2 going high to the end of write. R0201-BH62UV8001 7 Revision 1.1 May 2006 BH62UV8001 n ORDERING INFORMATION BH62UV8001 X X Z YY SPEED 55: 55ns PKG MATERIAL -: Normal G: Green, RoHS Compliant GRADE I: -40oC ~ +85oC PACKAGE D: DICE A: BGA-48-0608 Note: Brilliance Semiconductor Inc. (BSI) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support systems and critical medical instruments. n PACKAGE DIMENSIONS NOTES: 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 1.2 Max. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS. BALL PITCH e = 0.75 D E N D1 E1 8.0 6.0 48 5.25 3.75 E1 e D1 VIEW A 48 mini-BGA (6 x 8) R0201-BH62UV8001 8 Revision 1.1 May 2006 BH62UV8001 n Revision History Revision No. History Draft Date Remark 1.0 Initial Production Version May 10,2006 Initial 1.1 Change I-grade operation temperature range - from –25OC to –40OC May. 25, 2006 R0201-BH62UV8001 9 Revision 1.1 May 2006