Superworld A4K600-RD-10 Ferrite chip beads 4 line array Datasheet

FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
1. PART NO. EXPRESSION :
A 4 K 3 0 0 - R E - □□
(a) Series code
(e) R : Reel
(a)(b)(c) (d)
(b) Dimension code
(f) Current code : E = 500mA
(c) Material code
(g) 10: Standard
(e)(f)
(g)
11 ~ 99 : Internal control number
(d) Impedance code : 300 = 30Ω
2. CONFIGURATION & DIMENSIONS :
A
L
G
D2
J
C
I
H
PCB Pattern
P
D1
B
Unit:m/m
A
3.20± 0.20
B
C
D1
D2
1.60± 0.20 0.90± 0.20 0.40± 0.15 0.30± 0.10
P
G
H
I
J
L
0.80± 0.10
0.80 Ref.
0.40 Ref.
0.80 Ref.
2.80 Ref.
2.20~2.60
3. SCHEMATIC :
4. MATERIALS :
b
a
Ag(100%)
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(a) Body : Ferrite
(b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION :
a) Operating temp. : -40° C to +125° C ( including self-temperature. rise )
b) Storage condition (component in its packaging)
i) Temperature : -10 to 40° C
ii) Humidity : 60%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
28.01.2015
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PG. 1
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
6. ELECTRICAL CHARACTERISTICS :
Part Number
Impedance
(Ω)
Test
Frequency
( MHz )
DC Resistance
(Ω)
Max.
Rated Current
( mA )
Max.
A4K300-RE-10
30 ± 25%
100
0.20
500
A4K600-RD-10
60 ± 25%
100
0.25
400
A4K121-RD-10
120 ± 25%
100
0.30
350
A4K301-RC-10
300 ± 25%
100
0.40
250
A4K601-RB-10
600 ± 25%
100
0.50
200
A4K102-RB-10
1000 ± 25%
100
0.75
150
NOTE : Specifications subject to change without notice. Please check our website for latest information.
28.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
7. IMPEDANCE VS. FREQUENCY CURVES :
A4K300-RE-10
A4K121-RD-10
A4K601-RB-10
A4K600-RD-10
A4K301-RC-10
A4K102-RB-10
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
0.8
2.2 - 2.6
2.8
0.8
0.4
8-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
8-2.2 Soldering Iron :
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a
soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
Note :
d) 1.0mm tip diameter (max)
a) Preheat circuit and products to 150° C.
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
b) 350° C tip temperature for Ferrite chip bead (max)
f) Limit soldering time to 4-5 secs.
c) Never contact the ceramic with the iron tip
Soldering
Natural
cooling
20~40s
TP(26 0° C/40 s max.)
217
200
150
60~150s
60~180s
4 80s max.
25
Preheating
TEMPERATURE ° C
TEMPERATURE ° C
Preheating
Time(sec.)
Soldering
Natural
cooling
350
150
G rad ual
Cooling
O ve r 60s.
Figure 1. Re-flow Soldering:3 times max
Within4 ~5s
Figure 2. Wave Soldering:1 times max
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
8-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3.
Minimum fillet height = soldering thickness + 25% product height
Upper limit
t
Recommendable
Figure 3
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
9. PACKAGING INFORMATION :
9-1. Reel Dimension
C(mm)
D(mm)
Type
A(mm)
B(mm)
7" x 8mm
9.0± 0.5
60.0± 2.0
13.5± 0.5 178.0± 2.0
7" x 12mm
13.5± 0.5
60.0± 2.0
13.5± 0.5 178.0± 2.0
C
D
B
A
2± 0.5
7" x 8mm
13.5± 0.5
7" x 12mm
R10.5
R1.9
R0.5
120°
9-2.1 Tape Dimension / 8mm
Material of taping is paper
D:1.5+0.1/-0.0
Bo
P
W:8.0± 0.3
t
F:3.5± 0.05
E:1.75± 0.1
Po:4± 0.1
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
0
0.68± 0.05
0.38± 0.05
0.50max
2.0± 0.05
0.50max
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
1
1.12± 0.03
0.62± 0.03
0.60± 0.03
2.0± 0.10
0.60± 0.03
2
1.85± 0.05
1.05± 0.05
0.95± 0.05
4.0± 0.10
0.95± 0.05
3(09)
2.30± 0.05
1.50± 0.05
0.95± 0.05
4.0± 0.10
0.95± 0.05
Ko
Ao
Po:4± 0.1
+0.1
-0.05
t
Bo
Ko
Ao
P
W:8.0± 0.1
D:1.56
F:3.5± 0.1
E:1.75± 0.1
P2:2± 0.1
Material of taping is plastic
Po:4± 0.1
D:1.5+0.1
t
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
2(08)
1.95± 0.10
1.05± 0.10
1.05± 0.10
4.0± 0.10
0.23± 0.05
none
3(09)
2.25± 0.10
1.42± 0.10
1.04± 0.10
4.0± 0.10
0.22± 0.05
1.0± 0.10
3(12)
2.35± 0.10
1.50± 0.10
1.45± 0.10
4.0± 0.10
0.22± 0.05
1.0± 0.10
4(11)
3.50± 0.10
1.88± 0.10
1.27± 0.10
4.0± 0.10
0.22± 0.05
1.0± 0.10
5
3.42± 0.10
2.77± 0.10
1.55± 0.10
4.0± 0.10
0.22± 0.05
1.0± 0.10
4(09)
3.40± 0.10
1.77± 0.10
1.04± 0.10
4.0± 0.10
0.22± 0.05
1.0± 0.10
P
A
D1:1± 0.1
Ao
Bo
W:8.0± 0.1
A
F:3.5± 0.05
E:1.75± 0.1
P2:2± 0.05
Ko
Section A-A
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 6
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
9-2.2 Tape Dimension / 12mm
Po:4± 0.1
P2:2± 0.05
t
A
P
A
Ao
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
D1(mm)
6
4.95± 0.1
1.93± 0.1
1.93± 0.1
4.0± 0.1
0.24± 0.05
1.5± 0.1
7
4.95± 0.1
3.66± 0.1
1.85± 0.1
8.0± 0.1
0.24± 0.05
1.5± 0.1
Z/L
Bo
W:12.0± 0.1
Series
F:5.5± 0.05
E:1.75± 0.1
D:1.5+0.1
Ko
Section A-A
D1:1.5± 0.1
9-3. Packaging Quantity
Chip Size
7
6
5
4(11)
4(09)
3(12)
3(09)
2
1
0
Chip / Reel
1000
2000
2500
3000
3000
2000
4000
4000
10000
15000
Inner Box
4000
8000
12500
15000
15000
10000
20000
20000
50000
75000
Middle Box
20000
40000
62500
75000
75000
50000
100000
100000
250000
375000
Carton
40000
80000
125000
150000
150000
100000
200000
200000
500000
750000
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° C to 180° C
Top cover tape
Room Temp.
(° C)
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Recommended products should be used within 12 months from the time of delivery.
b) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
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