FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 1. PART NO. EXPRESSION : A 4 K 3 0 0 - R E - □□ (a) Series code (e) R : Reel (a)(b)(c) (d) (b) Dimension code (f) Current code : E = 500mA (c) Material code (g) 10: Standard (e)(f) (g) 11 ~ 99 : Internal control number (d) Impedance code : 300 = 30Ω 2. CONFIGURATION & DIMENSIONS : A L G D2 J C I H PCB Pattern P D1 B Unit:m/m A 3.20± 0.20 B C D1 D2 1.60± 0.20 0.90± 0.20 0.40± 0.15 0.30± 0.10 P G H I J L 0.80± 0.10 0.80 Ref. 0.40 Ref. 0.80 Ref. 2.80 Ref. 2.20~2.60 3. SCHEMATIC : 4. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) (a) Body : Ferrite (b) Termination : Ag/Ni/Sn 5. GENERAL SPECIFICATION : a) Operating temp. : -40° C to +125° C ( including self-temperature. rise ) b) Storage condition (component in its packaging) i) Temperature : -10 to 40° C ii) Humidity : 60% NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 6. ELECTRICAL CHARACTERISTICS : Part Number Impedance (Ω) Test Frequency ( MHz ) DC Resistance (Ω) Max. Rated Current ( mA ) Max. A4K300-RE-10 30 ± 25% 100 0.20 500 A4K600-RD-10 60 ± 25% 100 0.25 400 A4K121-RD-10 120 ± 25% 100 0.30 350 A4K301-RC-10 300 ± 25% 100 0.40 250 A4K601-RB-10 600 ± 25% 100 0.50 200 A4K102-RB-10 1000 ± 25% 100 0.75 150 NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 7. IMPEDANCE VS. FREQUENCY CURVES : A4K300-RE-10 A4K121-RD-10 A4K601-RB-10 A4K600-RD-10 A4K301-RC-10 A4K102-RB-10 NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 8. SOLDERING AND MOUNTING : 8-1. Recommended PC Board Pattern PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 0.8 2.2 - 2.6 2.8 0.8 0.4 8-2. Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk 8-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C) 8-2.2 Soldering Iron : Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150° C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350° C tip temperature for Ferrite chip bead (max) f) Limit soldering time to 4-5 secs. c) Never contact the ceramic with the iron tip Soldering Natural cooling 20~40s TP(26 0° C/40 s max.) 217 200 150 60~150s 60~180s 4 80s max. 25 Preheating TEMPERATURE ° C TEMPERATURE ° C Preheating Time(sec.) Soldering Natural cooling 350 150 G rad ual Cooling O ve r 60s. Figure 1. Re-flow Soldering:3 times max Within4 ~5s Figure 2. Wave Soldering:1 times max NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 8-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3. Minimum fillet height = soldering thickness + 25% product height Upper limit t Recommendable Figure 3 NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 9. PACKAGING INFORMATION : 9-1. Reel Dimension C(mm) D(mm) Type A(mm) B(mm) 7" x 8mm 9.0± 0.5 60.0± 2.0 13.5± 0.5 178.0± 2.0 7" x 12mm 13.5± 0.5 60.0± 2.0 13.5± 0.5 178.0± 2.0 C D B A 2± 0.5 7" x 8mm 13.5± 0.5 7" x 12mm R10.5 R1.9 R0.5 120° 9-2.1 Tape Dimension / 8mm Material of taping is paper D:1.5+0.1/-0.0 Bo P W:8.0± 0.3 t F:3.5± 0.05 E:1.75± 0.1 Po:4± 0.1 Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) 0 0.68± 0.05 0.38± 0.05 0.50max 2.0± 0.05 0.50max Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) 1 1.12± 0.03 0.62± 0.03 0.60± 0.03 2.0± 0.10 0.60± 0.03 2 1.85± 0.05 1.05± 0.05 0.95± 0.05 4.0± 0.10 0.95± 0.05 3(09) 2.30± 0.05 1.50± 0.05 0.95± 0.05 4.0± 0.10 0.95± 0.05 Ko Ao Po:4± 0.1 +0.1 -0.05 t Bo Ko Ao P W:8.0± 0.1 D:1.56 F:3.5± 0.1 E:1.75± 0.1 P2:2± 0.1 Material of taping is plastic Po:4± 0.1 D:1.5+0.1 t Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 2(08) 1.95± 0.10 1.05± 0.10 1.05± 0.10 4.0± 0.10 0.23± 0.05 none 3(09) 2.25± 0.10 1.42± 0.10 1.04± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10 3(12) 2.35± 0.10 1.50± 0.10 1.45± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10 4(11) 3.50± 0.10 1.88± 0.10 1.27± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10 5 3.42± 0.10 2.77± 0.10 1.55± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10 4(09) 3.40± 0.10 1.77± 0.10 1.04± 0.10 4.0± 0.10 0.22± 0.05 1.0± 0.10 P A D1:1± 0.1 Ao Bo W:8.0± 0.1 A F:3.5± 0.05 E:1.75± 0.1 P2:2± 0.05 Ko Section A-A NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 9-2.2 Tape Dimension / 12mm Po:4± 0.1 P2:2± 0.05 t A P A Ao Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 6 4.95± 0.1 1.93± 0.1 1.93± 0.1 4.0± 0.1 0.24± 0.05 1.5± 0.1 7 4.95± 0.1 3.66± 0.1 1.85± 0.1 8.0± 0.1 0.24± 0.05 1.5± 0.1 Z/L Bo W:12.0± 0.1 Series F:5.5± 0.05 E:1.75± 0.1 D:1.5+0.1 Ko Section A-A D1:1.5± 0.1 9-3. Packaging Quantity Chip Size 7 6 5 4(11) 4(09) 3(12) 3(09) 2 1 0 Chip / Reel 1000 2000 2500 3000 3000 2000 4000 4000 10000 15000 Inner Box 4000 8000 12500 15000 15000 10000 20000 20000 50000 75000 Middle Box 20000 40000 62500 75000 75000 50000 100000 100000 250000 375000 Carton 40000 80000 125000 150000 150000 100000 200000 200000 500000 750000 9-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. F 165° C to 180° C Top cover tape Room Temp. (° C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Recommended products should be used within 12 months from the time of delivery. b) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 28.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7